JP2516415Y2 - Substrate backup device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a substrate backup device for holding a substrate horizontally by pushing up a substrate supported by a transfer chute from below.

(B) Conventional Technology As a conventional technology, there is JP-A-59-29492.

In this, the substrate supported by the transfer chute was backed up horizontally by the backup pins that were set up on the XY table.

Also, in order to handle boards with different board thicknesses, they had to be replaced with backup pins of different lengths.

Therefore, it was necessary to prepare several types of backup pins, which made management difficult.

(C) Problems to be Solved by the Invention Therefore, the present invention aims to deal with substrates of various thicknesses by using only backup pins of the same length.

(D) Means for Solving the Problems Accordingly, the present invention is a substrate backup device that pushes up a substrate supported by a transfer chute from below and holds the substrate horizontally. A chute support table having a through hole, a table arranged vertically below the chute support table, a backup pin penetrating the through hole of the chute support table and mounted on the table upper surface, and the backup An elevating device for vertically moving a table on which pins are erected according to the substrate thickness is provided.

(E) Operation With the above configuration, the vertical movement distance of the table is adjusted according to the substrate thickness of the substrate to be handled, and the table is lifted by the lifting device. Then, the substrate is backed up by the backup pin placed on the upper surface of the table through the through hole of the chute support.

(F) Embodiment Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

(1) and (2) are transfer chutes installed at opposite positions of the chute support (3), and support both ends of the substrate (4) with the grooves (5) and (6) while not transferring them. To be transported. A large number of through holes (7) are formed in the chute support (3).

Reference numeral (8) is a backup base arranged below the chute support (3), and a screw shaft (rotated by a drive motor (9) via pulleys (10), (11) and a belt (12) ( By the rotation of (13), it is moved up and down via the guide rods (14) and (15).

Reference numeral (16) is a backup pin penetrating through the through hole (7) of the chute support (3) and erected on the upper surface of the backup base (8). Ascending, it contacts the back surface of the substrate (4) and backs up.

Reference numeral (17) is a suction nozzle that is movable in the X and Y directions in the horizontal plane and is also movable in the vertical direction (Z direction).

(19) is a CPU, which is a central processing unit that controls based on various data, and includes a RAM (20) as a storage device for storing setting data, a ROM (21) as a storage device for storing control programs, and an interface (22), input operation section (23) and monitor TV (24) are connected,
The input operation section (23) includes various keys such as numeric keys (25), cursor instruction keys (26), set keys (27), monitor TV (24) screen selection keys (28) and start keys (29). It consists of operation keys.

The board thickness data setting operation for each board will be described below.

First, the screen selection key (28) is operated to display the board thickness data (PCB1 to N) for each type (No. 1 to N) of the board (4) to be handled as shown in FIG. ), The thickness of each substrate (4) is set for each type by using the cursor instruction key (26) and the number keys (25) and stored in the RAM (20).

Further, the type of the substrate (4) to be processed is selected by designating "No." with the cursor instruction key (26) and pressing the set key (27).

 The operation will be described below.

First, when the start key (29) is pressed, the operation is started, and the substrate (4) is carried in by the transfer (not shown) along the grooves (5) and (6) of the transfer chutes (1) and (2) to a predetermined position. Stopped in position.

Then, the CPU (19) reads the board thickness data stored in the RAM (20) and calculates the movement distance data in the Z direction based on the board thickness data. This movement distance data is the distance from the tip of the backup pin (16) at the standby position (lower limit position) of the backup base (8) to the contact surfaces (1A) and (2A) of the transfer chutes (1) and (2). Is the value obtained by subtracting the substrate thickness from.

Then, based on the Z-direction movement distance data calculated in this way, a movement command is output to the drive motor (9) via the interface (22), and the drive motor (9) is output.
The rotation of the screw shaft (13) causes the backup base (8) to rise, as shown in FIG.
Are backed up by the backup pin (16).
The backup base (8) may be adjusted once according to the substrate thickness, and then the backup base (8) may be further moved by a certain amount.

In this way, when the substrate (4) is backed up by the backup pin (16), the suction nozzle (17) that has sucked the component (18) is moved by a predetermined amount in the X, Y, Z directions, and then on the substrate (4). The component (18) is mounted at a predetermined position of.

Next, even when handling a substrate (4A) having a different substrate thickness, the substrate (4A) is backed up as described above. That is, first, the screen selection key (28) is operated to display the substrate thickness data on the monitor TV (24), the cursor instruction key (16) is used to specify "No.", and the next substrate (4A) to be handled.
Select

Then, when the substrate (4A) is loaded into the transfer chute (1), (2) at a predetermined position, the CPU (19) moves in the Z direction based on the substrate thickness data of the selected substrate (4A). Moving distance data is calculated, and the backup base (8) is raised via the drive motor (9) based on the calculated data,
The substrate (4A) is backed up as shown in FIG.

Next, another embodiment will be described with reference to FIGS. 6 to 8. The same numbers are given to those having the same structure.

Reference numeral (31) is a base, which is movable in the X direction via a slider (33) by a drive motor (34) along a first guide rail (32) fixed on the base (31). It is possible to move in the Y direction via the slider (37) by the drive motor (38) along the direction moving table (35) and the second guide rail (36) fixed on the X direction moving table (35). An XY table (40) is configured with the Y-direction moving table (39).

A substrate support table (41) is installed on the XY table (40), and the substrate support table (41) can be vertically moved up and down by a lifting device (43) via a guide shaft (42). The elevating device (43) pushes the pressure contact lever (45) in the vertical direction and rotates the pressure contact lever (45) in the vertical direction about the support shaft (44). Drive cylinder (46) and the pressure contact lever (45)
Of the substrate support table (4
It consists of a pressure contact shaft (47) that is pressed against the lower part of 1).

As a result, the substrate (4) is transferred to the transfer chute (1)
When it is carried into the predetermined position of (2), the CPU (19) calculates the movement distance data in the Z direction based on the substrate thickness data of the selected substrate (4) described above, and based on the calculated data. The backup base (8) is raised via the drive motor (9) to back up the substrate (4).

Then, as shown in FIG. 7, the substrate supporting table (41) is lowered to a predetermined position by the descending operation of the elevating device (43), and then the substrate (4) supported by the transfer chutes (1) and (2). ) On the XY table (40) suction nozzle (17A)
After the XY movement so that the mounting position on the board (4) comes down, the suction nozzle (17A) comes down and the part (18)
Attach.

Also, when handling substrates (4A) having different substrate thicknesses, the substrates (4A) are backed up as shown in FIG. 8 as described above. After that, the substrate support table (41) is lowered to a predetermined position by the elevating device (43) to move the substrate (4A) to XY position.
After the table (40) is driven to move in the XY direction, the suction nozzle (17A) comes down to mount the component (18) at a predetermined position on the substrate (4A).

By the way, in this embodiment, the backup base (8) is raised to back up the substrate (4), but the transfer chutes (1), (2) supporting the substrate (4) are used.
May be lowered or may be moved relative to each other.

The backup pin (16) may be detachably attached to the backup base (8).

Further, in this embodiment, the push-up backup of the board used in the electronic component automatic mounting apparatus has been described as an example, but of course various modifications can be made without changing the gist of the present invention, such as an adhesive on the board. The present invention can also be applied to a coating device that coats the above coating agent.

(G) Effect of the Invention As described above, according to the present invention, it becomes possible to back up boards of various thicknesses only with backup pins of the same length, and it becomes easy to manage the backup pins. , Stable backup can be done by changing the position of multiple backup pins according to the board.

[Brief description of drawings]

1 and 2 are a side view and a configuration circuit diagram of a substrate backup device to which the present invention is applied, FIG. 3 is a screen view of a monitor television displaying substrate thickness data, and FIGS. 4 and 5 are substrates. The operation diagram of the backup device, and FIGS. 6 to 8 are views showing another embodiment. (1), (2) …… Conveying chute, (4), (4A) ……
Substrate, (7) ... through hole, (8) ... backup base, (9) ... drive motor, (16) ... backup pin.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A 1-155699 (JP, A) JP-A 1-160099 (JP, A) JP-A 2-145000 (JP, A)

Claims (1)

(57) [Scope of utility model registration request] 1. A substrate backup device for holding a substrate horizontally by pushing up a substrate supported by a transfer chute from below, and a chute support base disposed vertically below the substrate and having a number of through holes formed therein. A table arranged vertically below the chute support, a backup pin penetrating through the through hole of the chute support and placed on the upper surface of the table, and a table on which the backup pin is erected. A substrate backup device, which is provided with an elevating device for adjusting vertical movement according to the above.