JP2510161Y2 - Electronic device cooling device - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a large-capacity IC, L that constitutes an electronic circuit of a computer.
The present invention relates to a cooling device for an electronic device, which is intended for SI and the like, and injects a low boiling point, electrically insulating refrigerant liquid through a nozzle onto the surface of a semiconductor chip to cool the electronic device.

[Conventional technology]

As a cooling device for the electronic device mentioned above, a wiring board on which semiconductor chips such as IC and LSI are mounted is housed in a cooling container filled with a low boiling point, electrically insulating refrigerant, for example, a fluorocarbon liquid (boiling point 56 ° C.), Here, a cooling device for an electric device, in which a coolant liquid is pressurized and jetted through a nozzle toward the surface of a semiconductor chip to cool, has already been proposed and known.
(See Japanese Utility Model Laid-Open No. 61-13949) FIG. 3 shows the configuration of such a cooling device. In the figure, 1 is a cooling container, 2 is a refrigerant such as a fluorocarbon liquid filling the cooling container 1, and 3 is a cooling container. Is an electronic device in which a semiconductor chip 5 (for example, an LSI, a VLSI chip or the like) is surface-mounted on the wiring board 4 by a face-down bonding method, and 6 is a connector component that holds the wiring board 4 of the electronic device 3 in an upright posture. The coolant injection nozzle 7 is provided on the inner partition wall 1a of the cooling container 1 facing the surface of the semiconductor chip 5
It is provided so as to have a one-to-one correspondence with. In addition, 8 is a refrigerant pump, and 9 is a heat exchanger employing a refrigerator or the like.

With such a configuration, when the semiconductor chip 5 generates heat during the energization operation of the electronic device 3, the generated heat is transferred to the refrigerant 2 in contact with the surface of the semiconductor chip 5 to locally boil the refrigerant and to be cooled by the latent heat of vaporization. . On the other hand, in this state, the refrigerant 2 pressurized by the pump 8 is jetted toward the surface of the semiconductor chip 5 through the nozzle 7, whereby the refrigerant 2 becomes a collision jet and boiling bubbles of the refrigerant (the bubbles turn into liquid) from the chip surface. (The heat conductivity is lower than that of the semiconductor chip)), and the jet of the refrigerant liquid directly flushes the chip surface to forcibly cool the semiconductor chip 5.

The boiling bubbles of the refrigerant removed from the surface of the semiconductor chip 5 float in the refrigerant liquid, then flow out from the cooling container 1 together with the refrigerant 2, are condensed and liquefied by the heat exchanger 9, and are then boosted by the pump 8 again. It is circulated and sent back to the cooling container 1.

With such a cooling system, 50 to 100 W / cm ² at the experimental level
It has been confirmed that a cooling capacity that can cope with a heat generation density of a certain degree can be obtained.

[Problems to be solved by the device]

By the way, as semiconductor chips have become more highly integrated and packaging density has increased in recent years, the amount of heat generated per unit area of the chip has also tended to increase, so it is necessary to further enhance the cooling capacity of the cooling device. Is an important issue.

On the other hand, according to the knowledge obtained through the experiments and consideration of the cooling device, the jet of the refrigerant liquid ejected from the single circular nozzle is an axisymmetrical flow with respect to the center of the jet, and the semiconductor chip and the refrigerant jet The heat transfer between the two depends on the jet speed of the refrigerant, the nozzle diameter, the distance between the nozzle and the tip, etc.
It has been revealed that the heat transfer is maximum at the center of the refrigerant jet and becomes smaller toward the outer circumference.

Therefore, in order to enhance the cooling effect on the semiconductor chip, in addition to increasing the coolant jet speed from the nozzle, a plurality of nozzles may be arranged to face one semiconductor chip so as to share the cooling region. Will be needed.

However, for electronic devices such as ICs and LSIs, which have semiconductor chips with small external dimensions mounted on a wiring board, it is limited space to place multiple nozzles facing each other in a limited space. It is extremely difficult to realize because it is restricted by space inside.

The present invention has been made in view of the above points, and for the cooling device of the refrigerant jet type described above, by improving the structure of the nozzle, it is possible to significantly improve the cooling efficiency. An object is to provide a cooling device for equipment.

[Means for solving the problem]

In order to solve the above problems, the cooling device of the present invention is configured to disperse and perforate a plurality of small-diameter coolant injection holes in the end surface of a nozzle that ejects a coolant liquid toward a semiconductor chip of an electronic device.

[Action]

With the above configuration, the refrigerant jets ejected toward the chip surface of the semiconductor chip through the nozzle are divided into a plurality of collision jets from the end surface of the nozzle.

As a result, compared with the conventional single nozzle that injects a single-flow refrigerant jet having the same refrigerant flow rate from the nozzle, the jet velocity from each refrigerant injection hole is high and each refrigerant jet is In addition, the semiconductor chip is divided into small regions to share the cooling, and as a result, higher cooling capacity can be obtained. Moreover, since a plurality of coolant injection holes are formed in one nozzle so as to face the chip of the semiconductor element in a one-to-one manner, the nozzle is installed in a limited space with almost no space restriction. it can.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. The same parts corresponding to those in FIG. 3 are designated by the same reference numerals.

In FIG. 1 and FIG. 2, the semiconductor chip 5 is mounted in the nozzle port opened in the internal partition wall 1a of the cooling container (not shown) facing the chip surface of the semiconductor chip 5 mounted on the wiring board 4. Corresponding nozzles 7 are attached one-to-one. Here, the nozzle 7 has a structure having a circular cross section, a cap surface 7a at the tip, and small-diameter refrigerant injection holes 7b dispersedly formed in the cap surface 7a at a plurality of locations.

With such a configuration, when the refrigerant 2 pressurized by a pump (not shown) is sent to the nozzle 7 from the nozzle port, the refrigerant 2 is shunted into a plurality of refrigerant jets 2a through the above-mentioned refrigerant injection holes 7b to be divided and ejected. A group of impinging jets is formed toward the surface of the tip 5. As a result, the coolant jet 2a eliminates the boiling bubbles of the coolant covering the chip surface, and each coolant jet 2a individually shares the chip surface area and directly flushes the semiconductor chip 5 forcibly.

In addition, the coolant jets 2a thus jetted from the tip of the nozzle 7 with a small diameter jetted out have a high jet velocity, and the respective coolant jets 2a are dispersed and washed individually in the surface area of the semiconductor chip 5. Therefore, a higher cooling effect can be obtained. In addition, since the nozzle 7 having the plurality of coolant injection holes 7b is arranged in a one-to-one correspondence with the semiconductor chip 5, the nozzle 7 is provided in a limited space with almost no spatial restriction.
Can be arranged.

[Effect of device]

Since the cooling device of the present invention is configured as described above, the cooling effect can be significantly improved as compared with the conventional single nozzle with a limited installation space and a refrigerant flow rate.

[Brief description of drawings]

FIG. 1 is a sectional view of the essential structure of an embodiment of the present invention, FIG. 2 is an end view of the nozzle in FIG. 1, and FIG. 3 is an overall configuration diagram of a conventional electronic device cooling device. In the figure, 2: refrigerant, 2a: refrigerant jet, 3: electronic device, 4: wiring board, 5: semiconductor chip, 7: nozzle, 7b: refrigerant injection hole.

Claims (1)

(57) [Scope of utility model registration request] 1. A cooling device for an electric device, which cools an object such as an IC or LSI by cooling a low boiling point, electrically insulating refrigerant liquid through a nozzle toward a semiconductor chip of the cooling device. A cooling device for electric equipment, characterized in that a perforated nozzle cap is provided.