JP2506067Y2 - Structure of optical transmitter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a device used for optical communication, and more particularly to a structure of a transmission board used for optical transmission.

[Conventional technology]

Conventionally, in this type of optical transmission board, an optical module electric-optical conversion circuit, an amplification circuit, a power supply circuit, etc. are mounted on a main board as shown in FIG.

[Problems to be solved by the invention]

However, in the conventional optical transmission board, as shown in FIG. 3, the optical module 31 is housed in the shield case 33 together with the sub-board 32 of the electro-optical conversion circuit, and is mounted on the sub-board 32 on the main board 35. The terminals 36 are connected by soldering or the like. In addition, since the optical module 31 is a heavy object in consideration of heat dissipation, it is directly fixed to the main board 35 by the screw 34, but warp is generated due to heat during the solder dipping work of the main board 35. The LD module 21 follows the warp of the main board 35 and is deformed, leading to a reduction in optical power, or a gap between the optical module 31 and the main board 35 is generated, and heat dissipation characteristics are deteriorated.

Therefore, in view of the above drawbacks, an object of the present invention is to provide a structure of an optical transmission board which prevents warpage of the main board and has a high heat dissipation efficiency.

[Means for solving problems]

According to the present invention, in a structure of an optical transmission board for mounting an optical module having an optical semiconductor element housed in a housing and an optical fiber optically coupled to the optical semiconductor element, the housing of the optical module is a side surface. Is provided with an electric terminal, and the electric terminal is connected to a sub-board having a first electric circuit arranged on the heat dissipation plate so as to have a height substantially equal to the height of the electric terminal. The bottom surface of the housing is fixed so as to be in contact with the heat dissipation plate, the main board having the second electric circuit is arranged so as to face the heat dissipation plate, and is electrically connected to the first electric circuit. A structure of an optical transmitter board is obtained, which is characterized in that it is connected to.

[Embodiment] FIG. 1 is a perspective view of the present invention. The optical module 1 is fixed to the heat sink 3 with screws 4. Further, the electro-optical conversion circuit is configured as the sub-board 2, and the sub-board 2
The main board 5 and the main board 5 are electrically connected to each other by the connection terminal 8, and the heat sink 3 and the main board 5 are mechanically fixed by the collar 6 so as to face each other with the screw 7.

[Effect of device]

As described above, the structure of the optical transmission of the present invention eliminates the problem of the main board warpage that causes the decrease in optical power, which has been a defect in the related art, and allows the optical module to be directly mounted on the heat sink. Since this is possible, the heat generated from the LD module can be efficiently dissipated.
In addition, by using a plug or the like for the connection terminal connecting the main board and the sub board rather than the soldered terminal, there is an effect that the assembly workability is further improved. Furthermore, since the main board and heat sink are mounted facing each other, a chimney effect occurs between them, and a more cooling effect can be expected.

[Brief description of drawings]

FIG. 1 is a perspective view of each part of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a perspective view of a conventional broken state. 1,31 …… Optical module, 2,32 …… Sub board, 3 …… Heat sink, 4,34 …… Screw for fixing module, 5,35 …… Main board, 6 …… Color, 7 …… Heat sink Fixing screw, 8,36 …… Connection terminal.

Claims (1)

(57) [Scope of utility model registration request] 1. A structure of an optical transmitter board for mounting an optical semiconductor device housed in a casing of an optical module and an optical module having an optical fiber optically coupled to the optical semiconductor device, the casing of the optical module. The body is provided with an electric terminal on a side surface, a bottom surface of the housing of the optical module is fixed so as to be in contact with a heat dissipation plate, and a sub-board having a first electric circuit including an electro-optical conversion circuit is provided with the electric terminal. The sub-board is fixed to the main board, which is fixed to the heat-dissipating plate and is electrically connected to the electric terminals at a constant interval so as to be located at substantially the same height, and which has a second electric circuit. The main board is arranged so as to face the heat sink and not to contact the optical module, and the main board is electrically connected to the sub-board through a connection terminal that can be separated during solder dipping work. Structure of an optical transmission board that features that are.