JP2025081088A - Connectors and Connector Units - Google Patents

Abstract

To provide a connector which can be downsized and suppresses incidence of noise of an external space to a conductor layer of the connector and emission of noise from the conductor layer of the connector to the external space, and provide a connector unit.SOLUTION: A connector 100 includes a metal support layer 10, a first insulation layer 20 and a conductor layer 30 and is used for connection with the other connection component. The conductor layer 30 includes a plurality of terminal parts 32 and a plurality of wiring parts 31 formed to respectively extend from the plurality of terminal parts 32 and is formed on one face of the insulation layer 20. The metal support layer 10 includes a plurality of bending parts and is formed on the other face of the insulation layer 20. The metal support layer 10 is bent long the plurality of bending parts, thereby forming a connection region for the connection with the other connection component. In the first insulation layer 20, an opening 21 is formed in a portion of a region overlapping with the conductor layer 30 in a lamination direction of the first insulation layer 20 and the metal support layer 10.SELECTED DRAWING: Figure 1

Description

The present invention relates to a connector and a connector unit.

Connectors are used to connect circuit boards in electronic devices. The connector includes multiple conductive contacts and is mounted on one circuit board by soldering or other methods. The multiple contacts of the connector mounted on one circuit board are brought into contact with the multiple contacts of the connector mounted on the other circuit board, respectively. This establishes an electrical connection between the circuit boards.

Patent document 1 describes a connector in which a number of contacts are arranged in a row. The contacts are formed by stamping or pressing a conductive sheet metal material and are inserted into a number of slots arranged in a row. Here, each slot includes a central connecting portion and two legs at both ends. Each contact can be selectively inserted into either the central connecting portion or the legs of the slot. This allows the pitch between adjacent contacts to be changed between a first pitch and a second pitch smaller than the first pitch.

JP 2004-185871 A

In recent years, as electronic devices such as mobile devices have become smaller, there is a demand to miniaturize the circuit boards mounted on the electronic devices as well as the connectors used to connect the circuit boards. This requires reducing the width of the multiple contacts of the connector and reducing the pitch between the multiple contacts.

However, in Patent Document 1, due to limitations in the processing accuracy of thin metal plate material, it is difficult to reduce the width of the contacts. Also, in the circuit board, the lands for mounting the contacts are arranged at a relatively large distance apart to prevent short circuits caused by solder contact. In this case, the multiple contacts are also arranged at a relatively large distance apart, and the pitch between the multiple contacts cannot be reduced.

However, when a connector is in use, noise is generated in response to the signals passing through the connector. It is undesirable for the noise generated from the connector to be radiated toward other electronic devices. Furthermore, if noise enters the inside of the connector from the external space when the connector is in use, the reliability of the signals passing through the connector decreases. As a countermeasure against such noise, a configuration in which a shield plate is provided to surround multiple contacts in the connector described in Patent Document 1 is considered. However, such a configuration makes it difficult to miniaturize the connector.

The object of the present invention is to provide a connector and connector unit that can be miniaturized and that suppresses noise from the external space from entering the conductor layer of the connector and noise from being emitted from the conductor layer of the connector into the external space.

A connector according to one aspect of the present invention is a connector used for connection to other connection components, and includes an insulating layer, a conductor layer having a mounting portion and formed on one side of the insulating layer, and a metal support layer having a bent portion and formed on the other side of the insulating layer, the metal support layer being bent along the bent portion to form a connection region for connection to the other connection component, and an opening is formed in a portion of the insulating layer in a region that overlaps with the conductor layer in the stacking direction of the insulating layer and the metal support layer.

A connector unit according to another aspect of the present invention includes a first connector, which is the connector described above, and a second connector that is connected to the connection area of the first connector.

According to the present invention, it is possible to miniaturize the connector and connector unit, and to prevent noise from the external space from entering the conductor layer of the connector and from being emitted from the conductor layer of the connector into the external space.

1 is a perspective view showing a configuration of a connector unit according to a first embodiment; FIG. 2 is a plan view showing the configuration of the connector before bending. FIG. 2 is a diagram showing the configuration of one of the connectors. 13A and 13B are diagrams showing the configuration of the other connector. FIG. 2 is a perspective view showing a connector assembly sheet. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. 11A to 11C are diagrams for explaining an example of a manufacturing method for a connector. FIG. 13 is a plan view illustrating a configuration example of a connector according to a second embodiment. FIG. 21 is a bottom view of the connector of FIG. 20 . 21 is a cross-sectional view of the connector of FIG. 20 along line BB. 13 is a plan view of a connector for illustrating a first modified example of an opening portion. FIG. 13 is a plan view of the connector for illustrating a second modified example of the opening. FIG. 13 is a plan view of a connector illustrating a third modified example of an opening portion. FIG. 13 is a plan view of a connector illustrating a fourth modified example of an opening portion. FIG. 13 is a plan view of a connector illustrating a fifth modified example of an opening. FIG. FIG. 13 is a plan view of a connector according to another embodiment.

The following describes a connector and connector unit according to one embodiment of the present invention with reference to the drawings.

1. First embodiment <1> Configuration of connector FIG. 1 is a perspective view showing the configuration of a connector unit according to a first embodiment. As shown in FIG. 1, the connector unit 1 includes two connectors 100. Each connector 100 is manufactured by bending a laminate including a metal support layer 10, a first insulating layer 20, a conductor layer 30, and a second insulating layer 40 into a predetermined shape. In FIG. 1, in order to facilitate understanding of the structure, a hatched pattern is applied to the metal support layer 10, and a dot pattern is applied to the first insulating layer 20. Furthermore, in FIG. 1 and certain figures from FIG. 2 onwards, which will be described later, only the outline of the second insulating layer 40 is shown by a thick two-dot chain line so that the structure of the portion covered by the second insulating layer 40 can be easily understood.

In the following description, when distinguishing between the two connectors 100, the two connectors 100 are referred to as connectors 100A and 100B, respectively. Connector 100A is a plug-type connector and has a convex portion 101 formed by bending. Connector 100B is a receptacle-type connector and has a concave portion 102 formed by bending. When convex portion 101 of connector 100A and concave portion 102 of connector 100B are fitted together, their conductor layers 30 come into contact with each other. This electrically connects connectors 100A and 100B.

Figure 2 is a plan view showing the configuration of the connector 100A before bending. As shown in Figure 2, before bending, the metal support layer 10 has a substantially rectangular shape extending in one direction. The longitudinal direction of the metal support layer 10 is called the first direction, and the width direction (short direction) of the metal support layer 10 is called the second direction. The metal support layer 10 is formed, for example, from a material having spring characteristics. In this example, the metal support layer 10 is formed from stainless steel. The first insulating layer 20 includes, for example, a resin material, and is formed on the entire surface of the metal support layer 10. In this example, the first insulating layer 20 includes polyimide. The thickness of the first insulating layer 20 is, for example, 3 μm or more and 30 μm or less.

The conductor layer 30 is mainly made of copper and is formed on the first insulating layer 20. The conductor layer 30 has a plurality of terminal portions 31 (six in this example) and a plurality of wiring portions 32 (six in this example). The plurality of terminal portions 31 are arranged so as to be lined up at equal intervals in the second direction near one end of the first insulating layer 20 in the first direction. The plurality of wiring portions 32 are arranged on the first insulating layer 20 so as to extend from the plurality of terminal portions 31 in the first direction and to be lined up in the second direction. In this embodiment, the terminal portion of the connector 100 refers to a portion of the connector 100 on which solder is placed when the connector 100 is mounted on a circuit board or the like using solder. More specifically, it refers to a portion of the conductor layer 30 with which the solder comes into contact when the connector 100 is mounted.

The width (length in the second direction) of each wiring portion 32 is, for example, 10 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 50 μm or more and 150 μm or less. The widths of the multiple wiring portions 32 may be the same, or the widths of some of the multiple wiring portions 32 may be different from the widths of the other wiring portions 32.

The pitch of the wiring parts 32 (the distance between adjacent wiring parts 32) is, for example, 50 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 0.2 mm (200 μm) or less. In this case, the connector 100A can be easily miniaturized. The multiple terminal parts 31 are respectively connected to multiple land parts of a circuit board (not shown) by solder. In this way, the connector 100A is mounted on the circuit board. The pitch of the multiple wiring parts 32 may be set to a common value, or some pitches may be set to different values from other pitches.

In the conductor layer 30, the boundaries between the multiple terminal portions 31 and the multiple wiring portions 32 are set at a common position in the first direction. In FIG. 2, an imaginary straight line VL1 extending in the second direction is shown by a dashed line. This imaginary straight line VL1 is a straight line that passes through the multiple boundaries between the multiple terminal portions 31 and the multiple wiring portions 32.

The dimension D1 in the first direction of each terminal portion 31 is 30 μm or more and 750 μm or less. The dimension D2 in the second direction of each terminal portion 31 is equal to the width of the wiring portion 32 connected to the terminal portion 31, and is, for example, 10 μm or more and 400 μm or less, preferably 10 μm or more and 250 μm or less, and more preferably 10 μm or more and 100 μm or less.

The dimension D1 in the first direction of the multiple terminals 31 may be the same, or the dimension D1 in the first direction of some of the terminals 31 may be different from the dimension D1 in the first direction of the other terminals 31. In addition, the dimension D2 in the second direction of the multiple terminals 31 may be the same, or the dimension D2 in the second direction of some of the terminals 31 may be different from the dimension D2 in the second direction of the other terminals 31.

Here, the multiple wiring parts 32 include two power lines used to supply power to the electronic device and multiple signal lines used to transmit electrical signals. In the following description, when the multiple wiring parts 32 are distinguished based on their uses, the two wiring parts used as power lines are called the ground side power line 32A and the non-ground side power line 32B, respectively. Also, each of the multiple (four in this example) wiring parts used as signal lines is called a signal line 32C. Furthermore, in the following description, when the multiple terminal parts 31 are distinguished, the terminal part connected to the ground side power line 32A is called the first terminal part 31A. Also, the terminal part connected to the non-ground side power line 32B is called the second terminal part 31B, and each of the multiple terminal parts connected to the multiple signal lines 32C is called the third terminal part 31C.

In the connector 100A according to this embodiment, the grounded power line 32A and the non-grounded power line 32B are arranged to sandwich the multiple signal lines 32C in the second direction. The width of the grounded power line 32A and the width of the non-grounded power line 32B are equal to each other. On the other hand, it is preferable that the width of each of the grounded power line 32A and the non-grounded power line 32B is larger than the width of each of the multiple signal lines 32C.

As shown by the dotted lines in Figs. 1 and 2, in the stacking direction of the connector 100 (the stacking direction of the metal support layer 10 and the first insulating layer 20), one opening 21 is formed in the portion of the first insulating layer 20 that overlaps with the ground side power line 32A. The opening 21 in this embodiment has a circular shape when viewed in the stacking direction of the connector 100. The opening 21 is filled with a part of the conductor that constitutes the ground side power line 32A (plating layer 30B in Fig. 16 described later). As a result, the ground side power line 32A and the metal support layer 10 are electrically connected through the opening 21.

The second insulating layer 40 contains, for example, a resin material, and is formed on the first insulating layer 20 so as to cover a portion of the conductor layer 30. Specifically, the second insulating layer 40 is formed on the first insulating layer 20 so as to cover a portion of the plurality of wiring portions 32 from the position of the virtual straight line VL1 of the conductor layer 30. In this example, the second insulating layer 40 contains polyimide. The thickness of the second insulating layer 40 is, for example, 5 μm or more and 30 μm or less. In the example of FIG. 2, a portion of the second insulating layer 40 is formed between the plurality of wiring portions 32. In this case, the thickness of the second insulating layer 40 is preferably 20 μm or more and 30 μm or less.

The configuration of connector 100B is basically the same as that of connector 100A in FIG. 2, in which the configuration of first insulating layer 20 and conductor layer 30 is inverted with respect to a straight line extending in the first direction (inverted in the second direction). The configurations of connectors 100A and 100B have been described using FIG. 2, so further features of each of connectors 100A and 100B will be described below.

Figure 3 is a diagram showing the configuration of one connector 100A. The left part of Figure 3 shows a plan view of the connector 100A before bending, and the right part of Figure 3 shows a perspective view of the connector 100A after bending. As shown in the left part of Figure 3, the metal support layer 10 of the connector 100A extends in the second direction and has three bent parts A1, A2, and A3 arranged in this order in the first direction.

In this example, the region of connector 100A including bent portions A2 and A3 becomes connection region 50 for connection to connector 100B. That is, the portion of wiring portion 32 in connection region 50 becomes contact portion 51 for contacting wiring portion 32 of connector 100B. Therefore, contact portion 51 is provided so as to straddle bent portions A2 and A3. In the left part of FIG. 3, contact portion 51 in each wiring portion 32 is shown by a hatched pattern. Contact portion 51 may be nickel-plated or gold-plated. In this case, the electrical connectivity of contact portion 51 is improved.

The connector 100A is bent along the bends A1-A3 so that the metal support layer 10 is on the inside and the conductor layer 30 is on the outside. In this example, the bending angle of the connector 100A at each of the bends A1-A3 is approximately 90 degrees. In other words, the connector 100A is bent so that the angle between the two areas of the metal support layer 10 that sandwich each of the bends A1-A3 is approximately 90 degrees.

By bending the connector 100A, the connection area 50 becomes convex, as shown in the right part of FIG. 3. This forms a convex portion 101 on the connector 100A. After bending, the dimensions of the connector 100A in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example on the right part of FIG. 3, the up-down direction is the height direction, and the direction perpendicular to the width direction and height direction is the depth direction.

Figure 4 is a diagram showing the configuration of the other connector 100B. The left part of Figure 4 shows a plan view of the connector 100B before bending, and the right part of Figure 4 shows a perspective view of the connector 100B after bending. As shown in the left part of Figure 4, the metal support layer 10 of the connector 100B extends in the second direction and has six bent portions B1 to B6 arranged in this order in the first direction.

In this example, the region of connector 100B including bent portions B4 and B5 becomes connection region 50 for connection to connector 100A. That is, the portion of wiring portion 32 in connection region 50 becomes contact portion 51 for contacting wiring portion 32 of connector 100A. Therefore, contact portion 51 is provided so as to straddle bent portions B4 and B5. In the left part of FIG. 4, contact portions 51 in each wiring portion 32 are shown by a hatched pattern. As with connector 100A, contact portion 51 may be nickel-plated or gold-plated.

The connector 100B is bent along the bends B1 to B6 so that the metal support layer 10 is on the inside and the conductor layer 30 is on the outside. In this example, the bending angle of the connector 100B at each of the bends B1 to B6 is approximately 90 degrees. In other words, the connector 100B is bent so that the angle between the two regions of the metal support layer 10 that sandwich each of the bends B1 to B6 is approximately 90 degrees.

By bending the connector 100B, the connection area 50 becomes concave, as shown in the right part of FIG. 4. This forms a recess 102 in the connector 100B. After bending, the dimensions of the connector 100B in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example on the right part of FIG. 4, the up-down direction is the height direction, and the direction perpendicular to the width direction and height direction is the depth direction.

<2> Manufacturing method of the connector Fig. 5 is a perspective view showing a connector assembly sheet. As shown in Fig. 5, in this embodiment, a plurality of connectors 100 are formed in an aligned state on a connector assembly sheet 2 by a roll-to-roll method. The connectors 100A and 100B may be formed on separate connector assembly sheets 2.

The manufacturing method of the connector 100A will be described below with reference to a cross section of one connector 100A formed on the connector assembly sheet 2. Figures 6 to 19 are diagrams for explaining an example of a manufacturing method of the connector 100A. Figures 6 to 19 correspond to the cross section of the connector 100A taken along line A-A in Figure 2. Note that Figures 6 to 19 explain the manufacturing method of the connector 100A. The manufacturing method of the connector 100B is basically the same as the manufacturing method of the connector 100A, except that in Figures 6 to 19, instead of the bent portions A1 to A3, bent portions B1 to B6 are formed in the metal support layer 10, and the configurations of the first insulating layer 20 and the conductor layer 30 are inverted in the second direction.

First, as shown in FIG. 6, a metal sheet 2A made of, for example, stainless steel is prepared. The thickness of the metal sheet 2A is, for example, 35 μm to 100 μm, and preferably 50 μm to 100 μm. The material of the metal sheet 2A is not limited to stainless steel, and may be other metals such as aluminum. Next, as shown in FIG. 7, a mask 110 is formed on a specific portion of the metal sheet 2A. The mask 110 may be formed, for example, by exposing and developing a photosensitive dry film resist.

Then, an etching solution is used to etch the portion of the metal sheet 2A exposed from the mask 110. The etching solution may be, for example, a ferric chloride solution. As a result, as shown in FIG. 8, the portion of the metal sheet 2A exposed from the mask 110 is removed, and the metal support layer 10 is formed. Thereafter, as shown in FIG. 9, the mask 110 is removed from the metal support layer 10.

Next, as shown in FIG. 10, a mask 120 having multiple (three in this example) linear slits 121 is formed on the metal support layer 10. The method for forming the mask 120 is the same as the method for forming the mask 110. Then, the portions of the metal support layer 10 exposed from the slits 121 of the mask 120 are etched for a relatively short time using an etching solution. The etching solution may be the same as the etching solution used in the steps of FIG. 7 and FIG. 8. As a result, multiple (three in this example) linear shallow grooves a1, a2, a3 are formed in the metal support layer 10 as shown in FIG. 11.

Then, as shown in FIG. 12, the mask 120 is removed from the metal support layer 10. The portions of the metal support layer 10 where the grooves a1 to a3 are formed become the bent portions A1 to A3 of the metal support layer 10, respectively. The region including the bent portions A2 and A3 becomes the connection region 50 of the connector 100. Note that the steps in FIGS. 10 to 12 may be performed before the steps in FIGS. 7 to 9. Also, instead of the steps in FIGS. 10 to 12, the grooves a1 to a3 may be formed by laser processing using, for example, a YAG (yttrium aluminum garnet) laser.

13, a first insulating layer 20 is formed on the upper surface of the metal support layer 10. An opening 21 is formed in a part (one place in this example) of the first insulating layer 20 in the area where the ground side power line 32A is to be laminated in a later process. The opening 21 is a through hole that penetrates the first insulating layer 20 in the vertical direction. The first insulating layer 20 may be formed by applying a photosensitive resin precursor to the entire upper surface of the metal support layer 10 and exposing the photosensitive resin precursor to ultraviolet light. In this case, the first insulating layer 20 and the opening 21 can be formed simultaneously by appropriately setting the exposed and non-exposed parts of the photosensitive resin precursor. For example, when a negative photosensitive resin precursor is used, ultraviolet light is irradiated to the area except for the part where the opening 21 is to be formed, and a development process is performed. This makes it possible to easily form the first insulating layer 20 having the opening 21. In this example, the material of the first insulating layer 20 is polyimide, but it may be other resins such as epoxy.

Next, as shown in FIG. 14, a seed layer 30A is formed so as to cover the upper surface of the first insulating layer 20, the inner peripheral surface of the opening 21, and the bottom surface of the opening 21. Here, the bottom surface of the opening 21 refers to the upper surface portion of the metal support layer 10 exposed upward through the opening 21. In FIGS. 14 to 19, the seed layer 30A is indicated by a thick solid line. The seed layer 30A is formed, for example, by sputtering. Examples of materials for the seed layer 30A include chromium, copper, nickel, titanium, or alloys thereof.

Then, as shown in FIG. 15, a mask 130 having a predetermined pattern of openings 131 is formed on the upper surface of the seed layer 30A. The pattern of the openings 131 is the inverse of the pattern of the conductor layer 30 in FIG. 2. The method of forming the mask 130 is the same as the method of forming the mask 110.

Next, as shown in FIG. 16, a plating layer 30B is formed on the upper surface of the seed layer 30A through the opening 131 of the mask 130 by, for example, copper plating. At this time, the inside of the opening 21 is filled with the plating layer 30B. Then, as shown in FIG. 17, the mask 130 and the exposed parts of the seed layer 30A are sequentially removed. This forms a conductor layer 30 having a laminated structure of the seed layer 30A and the plating layer 30B. In each part of the conductor layer 30, a terminal part 31 and a wiring part 32 are set so as to be adjacent to each other across a predetermined boundary on the first insulating layer 20. In FIG. 17, the boundary part between the terminal part 31 and the wiring part 32 is indicated by a hollow arrow. The part of the wiring part 32 located on the connection region 50 becomes the contact part 51.

Next, as shown in FIG. 18, a second insulating layer 40 is formed on the upper surface of the first insulating layer 20 so as to cover a portion of each wiring portion 32 of the conductor layer 30. Here, a portion of each wiring portion 32 includes a portion of a predetermined length in the first direction from the boundary between the corresponding terminal portion 31 and the wiring portion 32. The predetermined length is, for example, 3250 μm or more and 3970 μm or less, and is preferably set so that the second insulating layer 40 does not overlap any of the bent portions A1, A2, and A3.

The second insulating layer 40 may be formed by applying a photosensitive resin precursor to the entire upper surface of the first insulating layer 20 and exposing the photosensitive resin precursor in a predetermined area to ultraviolet light. In this example, the material of the second insulating layer 40 is polyimide, but it may also be other resins such as epoxy.

By forming the second insulating layer 40, the connector assembly sheet 2 of FIG. 5 is completed, in which multiple connectors 100A are formed before folding. In this example, a first metal coating layer MC1 and a second metal coating layer MC2 are further formed on the surfaces (top and side surfaces) of the terminal portions 31, as shown in FIG. 19.

The first metal coating layer MC1 is, for example, nickel, and the second metal coating layer MC2 is, for example, gold. In this case, the first metal coating layer MC1 improves adhesion between the plating layer 30B (FIG. 17) made of copper and the second metal coating layer MC2. In addition, the second metal coating layer MC2 protects the plating layer 30B and prevents corrosion of the plating layer 30B.

In Figures 14 to 17, the conductor layer 30 is formed by a semi-additive method, but the embodiment is not limited to this. The conductor layer 30 may be formed by an additive method or a subtractive method.

Then, the connector 100A is collected from the connector assembly sheet 2. Finally, the collected connector 100A is folded along the folding portions A1 to A3. This completes the connector 100A shown on the right side of FIG. 3. According to the above manufacturing method, there is no need to use an adhesive layer in the manufacture of the connector 100. Therefore, the heat resistance of the connector 100 can be improved.

<3> Effects (a) In the connector 100 according to the first embodiment, a conductor layer 30 having a plurality of terminal portions 31 and a plurality of wiring portions 32 is formed on one surface of a first insulating layer 20. In addition, a metal support layer 10 having bent portions A1 to A3 or bent portions B1 to B6 is formed on the other surface of the first insulating layer 20. The metal support layer 10 is bent along the bent portions A1 to A3 or bent portions B1 to B6 to form a connection region 50.

According to this configuration, it is possible to manufacture the connector 100 using manufacturing techniques for wired circuit boards. Therefore, the connection area 50 can be formed small. Furthermore, since the pattern of the conductor layer 30 can be formed arbitrarily using manufacturing techniques for wired circuit boards, the degree of freedom in arranging the multiple terminal portions 31 is improved. Therefore, even if the connection area 50 is formed small, the multiple terminal portions 31 can be arranged so that a short circuit does not occur when the connector 100 is mounted on a circuit board or the like by soldering. As a result, the connector 100 can be made small.

Specifically, in the connection region 50, a plurality of contact portions 51 that come into contact with other connectors 100 are provided so as to extend in a first direction and to be aligned in a second direction that intersects the first direction. In this case, the connector 100 can be used to transmit various electrical signals. Furthermore, by using manufacturing techniques for wired circuit boards, it is possible to reduce the width of each contact portion 51 in the second direction and to reduce the pitch between the plurality of contact portions 51. Therefore, even when a plurality of contact portions 51 are aligned in the second direction, the connector 100 can be made smaller.

In the above connector 100, the ground side power line 32A and the non-ground side power line 32B are formed on the first insulating layer 20 as part of the conductor layer 30. This makes it possible to supply power to an electronic device connected to the connector 100 by applying a voltage between the first terminal portion 31A connected to the ground side power line 32A and the second terminal portion 31B connected to the non-ground side power line 32B. In addition, multiple signal lines 32C are formed on the first insulating layer 20 as another part of the conductor layer 30. This makes it possible to transmit an electrical signal to an electronic device connected to the connector 100 through the multiple signal lines 32C. In addition, it is possible to receive an electrical signal from an electronic device connected to the connector 100 through the multiple signal lines 32C.

Furthermore, an opening 21 is formed in the first insulating layer 20, and the ground side power line 32A and the metal support layer 10 are electrically connected through the opening 21. Therefore, the metal support layer 10 can be grounded via the ground side power line 32A. The metal support layer 10 functions as a shielding layer that blocks noise by being adjusted to the ground potential. The ground side power line 32A, the non-ground side power line 32B, and the multiple signal lines 32C are located on the metal support layer 10. This suppresses the incidence of noise from the external space of the connector 100 to the multiple terminal parts 31 and the multiple wiring parts 32. Also, even if noise occurs in the multiple terminal parts 31 and the multiple wiring parts 32, the noise is suppressed from being released to the outside of the connector 100.

As a result, it is possible to miniaturize the connector 100 while suppressing noise from the external space from entering the conductor layer 30 of the connector 100 and noise from being emitted from the conductor layer 30 of the connector 100 into the external space.

(b) In the first insulating layer 20, the opening 21 is formed at a position that does not overlap any of the multiple bends A1-A3, B1-B6 in the stacking direction of the connector 100. As a result, the portion of the first insulating layer 20 where the opening 21 is formed is not bent. This prevents a decrease in the reliability of the electrical connection between the ground side power line 32A and the metal support layer 10 due to the bending process of the metal support layer 10.

(c) Since the connector unit 1 includes connectors 100A and 100B that are connected to each other, it is possible to miniaturize the connector unit 1. This allows the connector unit 1 to be mounted on small electronic devices such as mobile devices. In addition, a decrease in the reliability of the connector unit 1 caused by noise entering the inside of the connector 100 and noise being emitted from the connector 100 to the external space is suppressed.

2. Second embodiment <1> Connector configuration The connector according to the second embodiment will be described with respect to differences from the connector 100 according to the first embodiment. Fig. 20 is a plan view showing one configuration example of the connector according to the second embodiment, Fig. 21 is a bottom view of the connector 100 in Fig. 20, and Fig. 22 is a cross-sectional view of the connector 100 in Fig. 20 taken along line B-B. The plan view in Fig. 20 corresponds to the plan view in Fig. 2 described in the first embodiment. Figs. 20 to 22 show the connector 100 before bending.

As shown in FIG. 20, in the connector 100 according to this embodiment, two openings 21 are formed in the first insulating layer 20. The two openings 21 have a common circular shape when viewed in the stacking direction of the connector 100. One of the two openings 21 is formed in a portion of the first insulating layer 20 that overlaps the ground side power line 32A in the stacking direction of the connector 100, similar to the opening 21 in the first embodiment. On the other hand, the other of the two openings 21 is formed in a portion of the first insulating layer 20 that overlaps the non-ground side power line 32B in the stacking direction of the connector 100. In the following description, when distinguishing between these two openings 21, the opening 21 that overlaps the ground side power line 32A is called the first opening 21A, and the opening 21 that overlaps the non-ground side power line 32B is called the second opening 21B.

The first opening 21A is filled with a portion of the conductor constituting the grounded power line 32A, as in the example of the opening 21 according to the first embodiment. As a result, the grounded power line 32A and the metal support layer 10 are electrically connected through the first opening 21A. The second opening 21B is also filled with a portion of the conductor constituting the non-grounded power line 32B. As a result, the non-grounded power line 32B and the metal support layer 10 are electrically connected through the second opening 21B.

In the connector 100 according to this embodiment, as shown in Figs. 20 to 22, a separation groove 11 is formed in a part of the metal support layer 10. The separation groove 11 extends linearly from one end of the metal support layer 10 in the first direction to the other end. This causes the metal support layer 10 to have two support parts that are electrically separated from each other. In the example of Figs. 20 to 22, the separation groove 11 is located between the multiple third terminal parts 31C and multiple signal lines 32C and the multiple second terminal parts 31B and non-grounded power lines 32B when viewed in the stacking direction of the connector 100.

In the following description, the support portion of the metal support layer 10 that overlaps the first terminal portion 31A, the ground side power line 32A, the multiple third terminal portions 31C, and the multiple signal lines 32C when viewed in the stacking direction of the connector 100 is referred to as the first support portion 10A. On the other hand, the support portion of the metal support layer 10 that overlaps the second terminal portion 31B and the non-ground side power line 32B when viewed in the stacking direction of the connector 100 is referred to as the second support portion 10B.

<2> Effects (a) In the connector 100 according to the second embodiment, the ground side power line 32A and the first support portion 10A of the metal support layer 10 are connected through the first opening 21A of the first insulating layer 20. Also, the non-ground side power line 32B and the second support portion 10B of the metal support layer 10 are connected through the second opening 21B of the first insulating layer 20. The first support portion 10A and the second support portion 10B of the metal support layer 10 are electrically separated by the separation groove 11. Therefore, a short circuit is prevented from occurring between the ground side power line 32A and the non-ground side power line 32B via the metal support layer 10.

According to the above configuration, since the ground side power line 32A and the first support part 10A are connected, when a current flows through the ground side power line 32A, heat generated in the ground side power line 32A is transferred to the first support part 10A and dissipated from the first support part 10A. Also, since the non-ground side power line 32B and the second support part 10B are connected, when a current flows through the non-ground side power line 32B, heat generated in the non-ground side power line 32B is transferred to the second support part 10B and dissipated from the second support part 10B.

Furthermore, the heat capacity of the grounded power line 32A is greater than when the grounded power line 32A and the first support portion 10A are not connected. Also, the heat capacity of the non-grounded power line 32B is greater than when the non-grounded power line 32B and the second support portion 10B are not connected.

Therefore, the degree of temperature rise of each power line (32A, 32B) when a current flows through each power line (32A, 32B) is reduced compared to when each power line (32A, 32B) is not connected to the metal support layer 10. As a result, it is possible to increase the amount of current that can be supplied to each power line while suppressing the increase in size of each cross section of the ground side power line 32A and the non-ground side power line 32B (the cross section of the power line perpendicular to the direction in which each power line extends).

(b) In the connector 100 according to the second embodiment, the third terminals 31C and the signal lines 32C overlap the first support 10A of the metal support layer 10 when viewed in the stacking direction of the connector 100. The first support 10A is connected to the ground power line 32A. Therefore, the first support 10A is grounded and functions as a shielding layer, so that the incidence of noise from the external space of the connector 100 to the third terminals 31C and the signal lines 32C is sufficiently suppressed. In addition, the emission of noise from the third terminals 31C and the signal lines 32C to the external space of the connector 100 is sufficiently suppressed.

(c) Furthermore, in the connector 100 according to this embodiment, the separation groove 11 is formed in the metal support layer 10, so that the metal support layer 10, which is made of a single layer, is separated into the first support portion 10A and the second support portion 10B. As described above, the first support portion 10A functions as a shielding layer and also functions as a layer that dissipates heat. On the other hand, the second support portion 10B functions as a layer that dissipates heat. In this way, multiple support portions that realize different functions are formed in a single layer. Therefore, a configuration in which multiple metal support layers having multiple functions are stacked via an insulating layer is not necessary, and an increase in the thickness of the stacked structure is suppressed. This also makes processing (bending) during the manufacture of the connector 100 easier.

<3> Modification of the opening 21 formed in the first insulating layer 20 In the connector 100 according to the second embodiment, a first opening 21A having a circular shape is formed in a portion of the first insulating layer 20 overlapping the ground side power line 32A. Also, a second opening 21B having a circular shape is formed in a portion of the first insulating layer 20 overlapping the non-ground side power line 32B. However, the shape and number of the openings 21 formed in the first insulating layer 20 so as to overlap each power line (32A, 32B) are not limited to the above example.

Figure 23 is a plan view of the connector 100 to explain a first modified example of the opening 21. In the connector 100 of Figure 23, one rectangular opening 21 is formed in a part of the area of the first insulating layer 20 that overlaps each power line (32A, 32B). In this way, one opening 21 that overlaps each power line (32A, 32B) when viewed in the stacking direction of the connector 100 may be formed in a rectangular shape.

In this case, it is preferable that the opening 21 is formed so as to extend along the power lines (32A, 32B). By forming the opening 21 so as to extend along the power lines (32A, 32B), the opening area of the opening 21 is increased, and the contact area between each power line (32A, 32B) and the metal support layer 10 can be increased.

Therefore, heat generated in the ground side power line 32A is smoothly transferred to the first support portion 10A of the metal support layer 10 and dissipated from the first support portion 10A. Also, heat generated in the non-ground side power line 32B is smoothly transferred to the second support portion 10B of the metal support layer 10 and dissipated from the second support portion 10B. As a result, the amount of current that can be supplied to each power line (32A, 32B) can be increased while suppressing the increase in the size of the cross section of each power line (32A, 32B).

Figure 24 is a plan view of the connector 100 to explain a second modified example of the opening 21. In the connector 100 of Figure 24, the opening 21 formed in the first insulating layer 20 so as to overlap a portion of each power line (32A, 32B) is formed so as to extend to an area that does not overlap each power line (32A, 32B). In other words, each opening 21 according to the second modified example is formed so as to cross the power line in the second direction when viewed in the stacking direction of the connector 100.

Figure 25 is a plan view of the connector 100 to explain a third modified example of the opening 21. In the connector 100 of Figure 25, the opening 21 is formed so as to overlap the entirety of each power line (32A, 32B) in the first insulating layer 20. In this case, a sufficiently large contact area is ensured between each power line (32A, 32B) and the metal support layer 10. Therefore, the amount of current that can be supplied to each power line (32A, 32B) can be further increased while suppressing the increase in the cross section of each power line (32A, 32B).

26 is a plan view of the connector 100 for explaining a fourth modified example of the opening 21. In the connector 100 of FIG. 26, two openings 21 are formed in a part of the area of the first insulating layer 20 that overlaps with each power line (32A, 32B). Each opening 21 is formed so as to extend continuously from one end to the other end of the corresponding power line. In this configuration, as in the example of FIG. 25, a sufficiently large contact area is ensured between each power line (32A, 32B) and the metal support layer 10. Therefore, the amount of current that can be supplied to each power line (32A, 32B) can be further increased while suppressing the enlargement of the cross section of each power line (32A, 32B). In this modified example, the number of openings 21 formed in the area of the metal support layer 10 that overlaps with each power line (32A, 32B) may be one or may be three or more.

27 is a plan view of the connector 100 for explaining a fifth modified example of the opening 21. In the connector 100 of FIG. 27, a large number of openings 21 (13 in this example) are formed in a part of the area of the first insulating layer 20 that overlaps with each power line (32A, 32B). The large number of openings 21 are arranged at equal intervals from one end to the other end of the corresponding power line. In other words, in this modified example, the openings 21 are formed so as to extend intermittently from one end to the other end of the corresponding power line. In this configuration, as in the example of FIG. 25, a sufficiently large contact area is ensured between each power line (32A, 32B) and the metal support layer 10. Therefore, the amount of current that can be supplied to each power line (32A, 32B) can be further increased while suppressing the enlargement of the cross section of each power line (32A, 32B).

3. Other embodiments (a) In the connector 100 according to the second embodiment, the separation grooves 11 formed in the metal support layer 10 are located between the third terminal portions 31C and the signal lines 32C and the second terminal portions 31B and the non-grounded power lines 32B when viewed in the stacking direction of the connector 100, but the present invention is not limited to this example.

28 is a plan view of a connector 100 according to another embodiment. As shown by the hollow arrow AA and the dashed line in FIG. 28, the separation groove 11 may be formed to be located between the first terminal portion 31A and the ground side power line 32A and the multiple third terminal portions 31C and the multiple signal lines 32C when viewed in the stacking direction of the connector 100. Alternatively, as shown by the hollow arrow AB and the dotted line in FIG. 28, the separation groove 11 may be formed to pass between two adjacent third terminal portions 31C and between two adjacent signal lines 32C when viewed in the stacking direction of the connector 100.

Even in these cases, at least the first support portion 10A connected to the ground side power line 32A functions as a shielding layer, thereby suppressing deterioration in the reliability of the connector 100 caused by noise.

(b) In the connector 100 according to the first embodiment, a single circular opening 21 is formed in the portion of the first insulating layer 20 that overlaps the ground power line 32A, but the present invention is not limited to this.

In the connector 100 according to the first embodiment, one or more openings 21 having a shape other than a circle, for example an ellipse or a rectangle, may be formed in the portion of the first insulating layer 20 overlapping the ground power line 32A. Alternatively, in the connector 100 according to the first embodiment, one or more openings 21 according to the first to fifth modified examples of the second embodiment (FIGS. 23 to 24) may be formed in the portion of the first insulating layer 20 overlapping the ground power line 32A.

(c) In the connector 100A of FIG. 2 according to the first embodiment, the opening 21 is formed to overlap the ground side power line 32A, but the present invention is not limited to this. The opening 21 may be formed to overlap the first terminal portion 31A.

(d) In the connector 100 of FIG. 20 according to the second embodiment, the two openings 21 are formed to overlap the grounded power line 32A and the non-grounded power line 32B, respectively, but the present invention is not limited to this. The two openings 21 may be formed to overlap the first terminal portion 31A and the second terminal portion 31B, respectively.

(e) The connector 100 according to the first and second embodiments has four signal lines 32C as part of the multiple wiring sections 32. This is not limited to these examples, and the connector 100 may have five or more multiple signal lines 32C.

(f) In the example of FIG. 19, a first metal coating layer MC1 and a second metal coating layer MC2 are formed on the surface of the terminal portion 31, but the embodiment is not limited to this. The first metal coating layer MC1 and the second metal coating layer MC2 do not have to be formed on the surface of the terminal portion 31. Alternatively, only one of the first metal coating layer MC1 and the second metal coating layer MC2 may be formed on the surface of the terminal portion 31.

(g) In the above embodiment, the connection region 50 has a convex or concave shape. Therefore, the metal support layer 10 has two or more bent portions A1-A3 or B1-B6. In this case, the connector 100 makes more reliable contact with other connecting components. This can improve the reliability of the connection of the connector 100.

However, the embodiment is not limited to this. As long as the connector 100 contacts other connecting parts with sufficient reliability, the metal support layer 10 only needs to have one bent portion, and the connection area 50 does not need to have a convex or concave shape. For example, in the connector unit 1, two or more metal support layers 10 that are connected to each other may have the same shape.

(h) In the above embodiment, the bends A1-A3 or B1-B6 are formed by forming grooves at predetermined positions on the metal support layer 10, but this is not limited to the above. The bends A1-A3 or B1-B6 may be formed by forming linear marks or the like on the metal support layer 10. Alternatively, nothing in particular may be formed on the metal support layer 10 as long as the metal support layer 10 can be bent at the bends A1-A3 or B1-B6.

(i) In the above embodiment, the connector 100 is distributed in a folded state, but the embodiment is not limited to this. The connector 100 may be distributed in an unfolded state.

Even in this case, in the connector 100, a conductor layer 30 having a plurality of terminal portions 31 and a plurality of wiring portions 32 is formed on one surface of the first insulating layer 20. Also, a metal support layer 10 having bend portions A1-A3 or bend portions B1-B6 is formed on the other surface of the first insulating layer 20. The metal support layer 10 can be bent along the bend portions A1-A3 or bend portions B1-B6, and the contact portion 51 is provided so as to straddle the bend portions A1-A3 or bend portions B1-B6.

With this configuration, the connector 100 is distributed in an unfolded state. After the connector 100 is distributed, a user of the connector 100 can fold the metal support layer 10 along the fold portions A1-A3 or B1-B6 to form a connection region 50 for connecting to other connection components.

4. Correspondence between each component of the claims and each part of the embodiment Below, examples of correspondence between each component of the claims and each part of the embodiment are described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

In the above embodiment, the connectors 100, 100A, and 100B are examples of connectors, one of the connectors 100A and 100B is another example of a connector, the other of the connectors 100A and 100B is an example of another connecting part, the first insulating layer 20 is an example of an insulating layer, the terminal portion 31, the first terminal portion 31A, the second terminal portion 31B, and the third terminal portion 31C are examples of mounting portions, and the conductor layer 30 is an example of a conductor layer.

Furthermore, bent portions A1 to A3 and B1 to B6 are examples of bent portions, metal support layer 10 is an example of a metal support layer, connection region 50 is an example of a connection region, opening 21 is an example of an opening, first terminal portion 31A is an example of a first mounting portion, second terminal portion 31B is an example of a second mounting portion, and third terminal portion 31C is an example of a third mounting portion.

Furthermore, the grounded power line 32A is an example of a grounded power line, the non-grounded power line 32B is an example of a non-grounded power line, the signal line 32C is an example of a signal line, the first opening 21A is an example of a first opening, the second opening 21B is an example of a second opening, the first support portion 10A is an example of a first support portion, the second support portion 10B is an example of a second support portion, and the separation groove 11 is an example of a separation groove.

In addition, one of the connectors 100A and 100B is an example of a first connector, the other of the connectors 100A and 100B is an example of a second connector, and the connector unit 1 is an example of a connector unit.

5. Summary of the embodiment (1) The connector according to the first embodiment is
A connector used for connecting to other connection components,
An insulating layer;
a conductor layer having a mounting portion and formed on one surface of the insulating layer;
a metal support layer having a bent portion and formed on the other surface of the insulating layer;
The metal support layer is folded along the folding portion to form a connection region for connecting to the other connection component,
An opening is formed in a part of a region of the insulating layer that overlaps with the conductor layer in a stacking direction of the insulating layer and the metal supporting layer.

In this connector, a conductor layer having a mounting portion is formed on one side of a first insulating layer, and a metal support layer having a bent portion is formed on the other side of the first insulating layer. The metal support layer is bent along the bent portion to form a connection area.

According to this configuration, it is possible to manufacture the connector using the manufacturing technology for wired circuit boards. Therefore, the connection area can be formed small. In addition, the manufacturing technology for wired circuit boards allows the pattern of the conductor layer to be formed arbitrarily, improving the degree of freedom in arranging the mounting part. Therefore, even if the connection area is formed small, the mounting part can be arranged so that a short circuit does not occur when the mounting part is mounted on a circuit board or the like by soldering.

An opening is formed in a portion of the insulating layer that overlaps with the conductor layer in the stacking direction. In this case, a portion of the conductor layer and the metal support layer are connected through the opening in the insulating layer. Therefore, the metal support layer can be grounded via a portion of the conductor layer. The metal support layer functions as a shielding layer that blocks noise by being adjusted to a ground potential. This suppresses the incidence of noise from the external space of the connector to other portions of the conductor layer. In addition, the emission of noise from other portions of the conductor layer to the external space of the connector is suppressed.

As a result, it is possible to miniaturize the connector while preventing noise from the external space from entering the conductor layer of the connector and preventing noise from being emitted from the conductor layer of the connector into the external space.

(2) In the connector according to the above (1),
the mounting portion includes a first mounting portion, a second mounting portion, and a third mounting portion;
The conductor layer is
a ground side power line extending from the first mounting portion;
a non-grounded power line extending from the second mounting portion;
a signal line extending from the third mounting portion,
The opening may include a first opening formed in a portion of the insulating layer that overlaps with the ground power line or the first mounting portion in the stacking direction.

In this case, by applying a voltage between the first mounting portion and the second mounting portion, it is possible to supply power to the other connected components. Also, it is possible to transmit various signals to the other connected components through the signal line, and receive various signals from the other connected components through the signal line.

In addition, according to the above configuration, the ground side power line or the first mounting portion is electrically connected to the metal support layer through the first opening of the insulating layer. This allows the metal support layer to be grounded via the ground side power line. The metal support layer functions as a shield layer by being adjusted to the ground potential. This suppresses the incidence of noise from the external space of the connector to the signal line. Also, the emission of noise from the signal line to the external space of the connector is suppressed.

(3) In the connector according to the above (2),
The opening further includes a second opening;
the first opening is formed in a portion of the insulating layer that overlaps with the ground-side power line in the stacking direction,
the second opening is formed in a portion of the insulating layer that overlaps the non-grounded power line in the stacking direction,
The metal support layer may have a separation groove formed therein that blocks electrical conduction between a first support portion that overlaps the first opening in the stacking direction and a second support portion that overlaps the second opening in the stacking direction.

In this case, the grounded power line and the first support part of the metal support layer are connected through a first opening in the insulating layer. Also, the non-grounded power line and the second support part of the metal support layer are connected through a second opening in the insulating layer. In this state, the first support part and the second support part of the metal support layer are electrically separated by the separation groove. Therefore, a short circuit is prevented from occurring between the grounded power line and the non-grounded power line in the metal support layer.

In the above configuration, since the ground side power line and the first support part are connected, the heat capacity of the ground side power line is larger than when the ground side power line and the first support part are not connected. Also, since the non-ground side power line and the second support part are connected, the heat capacity of the non-ground side power line is larger than when the non-ground side power line and the second support part are not connected. This makes it possible to increase the amount of current that can be supplied to each power line while suppressing the increase in size of each cross section of the ground side power line and the non-ground side power line (the cross section of the power line perpendicular to the direction in which each power line extends).

(4) In the connector according to the third aspect,
the first opening is formed to extend continuously or intermittently in a direction in which the ground-side power line extends,
The second opening may be formed to extend continuously or intermittently in a direction in which the non-grounded power line extends.

In this case, a large contact area can be secured between the ground side power line and the first support part of the metal support layer. As a result, heat generated in the ground side power line is smoothly transferred to the first support part of the metal support layer and dissipated from the first support part. Also, a large contact area can be secured between the non-ground side power line and the second support part of the metal support layer. As a result, heat generated in the non-ground side power line is smoothly transferred to the second support part of the metal support layer and dissipated from the second support part. As a result, the amount of current that can be supplied to each power line can be increased while suppressing the enlargement of the cross section of each of the ground side power line and the non-ground side power line.

(5) In the connector according to the third or fourth aspect,
the signal line is disposed on the one surface of the insulating layer between the grounded power line and the non-grounded power line,
The separation groove may be located between the signal line and the non-ground power line as viewed in the stacking direction.

In this case, the signal line of the conductor layer overlaps the first support portion of the metal support layer when viewed in the stacking direction. The first support portion is connected to the ground side power line. Therefore, the first support portion functions as a shielding layer, sufficiently suppressing the incidence of noise from the external space of the connector to the signal line. Also, the emission of noise from the signal line to the external space of the connector is sufficiently suppressed.

(6) The connector unit according to the 6th paragraph is
A first connector which is the connector according to any one of claims 1 to 5;
and a second connector connected to the connection region of the first connector.

In this case, the connector unit can be miniaturized, so that it can be mounted on small electronic devices such as mobile devices. In addition, deterioration in the reliability of the connector unit caused by noise from the external space being incident on the conductor layer of the first connector and noise being emitted from the conductor layer of the first connector to the external space is suppressed.

1...connector unit, 2...connector assembly sheet, 2A...metal sheet, 10...metal support layer, 10A...first support portion, 10B...second support portion, 11...separation groove, 20...first insulating layer, 21...opening, 21A...first opening, 21B...second opening, 30...conductor layer, 30A...seed layer, 30B...plating layer, 31...terminal portion, 31A...first terminal portion, 31B...second terminal portion, 31C...third terminal portion, 32...wiring portion, 32A...ground side power line , 32B...non-grounded power line, 32C...signal line, 40...second insulating layer, 50...connection area, 51...contact portion, 100, 100A, 100B...connector, 101...projection, 102...recess, 110, 120, 130...mask, 121...slit, 131...opening, A1, A2, A3...folded portion, B1, B2, B3, B4, B5, B6...folded portion, MC1...first metal coating layer, MC2...second metal coating layer, VL1...virtual straight line, a1, a2, a3...groove portion

Claims (6)

A connector used for connecting to other connection components,
An insulating layer;
a conductor layer having a mounting portion and formed on one surface of the insulating layer;
a metal support layer having a bent portion and formed on the other surface of the insulating layer;
The metal support layer is folded along the folding portion to form a connection region for connecting to the other connection component,
A connector, wherein an opening is formed in a portion of the insulating layer that overlaps with the conductor layer in a stacking direction of the insulating layer and the metal support layer. the mounting portion includes a first mounting portion, a second mounting portion, and a third mounting portion;
The conductor layer is
a ground side power line extending from the first mounting portion;
a non-grounded power line extending from the second mounting portion;
a signal line extending from the third mounting portion,
The connector according to claim 1 , wherein the opening includes a first opening formed in a portion of the insulating layer that overlaps the ground side power line or the first mounting portion in the stacking direction. The opening further includes a second opening;
the first opening is formed in a portion of the insulating layer that overlaps with the ground-side power line in the stacking direction,
the second opening is formed in a portion of the insulating layer that overlaps the non-grounded power line in the stacking direction,
3. A connector as described in claim 2, wherein the metal support layer has a separation groove formed therein that blocks electrical conduction between a first support portion that overlaps the first opening in the stacking direction and a second support portion that overlaps the second opening in the stacking direction. the first opening is formed to extend continuously or intermittently in a direction in which the ground-side power line extends,
4. The connector according to claim 3, wherein the second opening is formed so as to extend continuously or intermittently in a direction in which the non-grounded power line extends. the signal line is disposed on the one surface of the insulating layer between the grounded power line and the non-grounded power line,
5. The connector according to claim 3, wherein the separation groove is located between the signal line and the non-grounded power line when viewed in the stacking direction. A first connector which is the connector according to any one of claims 1 to 4;
a second connector connected to the connection region of the first connector.

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