JP2024169087A - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

To provide a resin molding device for sliding a mold in a slide direction crossing a clamping direction, which can reduce wear generated by sliding the mold.SOLUTION: A resin molding device includes: a clamping mechanism 10 that clamps molds 51, 52 through base members 2 to 4; a mold slide mechanism 20 that slides the molds 51, 52 between a clamping position Q where the molds are clamped, and a projecting position R positioned outside the base members 2 to 4 in a slide direction crossing a clamping direction; and an interval change mechanism 30 that changes intervals between mutual opposite surfaces of the base members 2 to 4 and the molds 51, 52, when the molds 51, 52 are slid by the mold slide mechanism 20 between the clamping position Q and the projecting position R.SELECTED DRAWING: Figure 11

Description

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

As shown in Patent Document 1, a conventional compression molding device has been proposed in which a fixed mold (lower mold) supported by a fixed platen is movable between a mold clamping position and a removal position outside the mold. Specifically, a guide plate with guide rails and guide grooves is provided on the fixed platen, and a slide plate supporting the fixed mold (lower mold) slides along the guide rails and guide grooves of the guide plate.

JP 2003-165134 A

However, when the fixed mold (lower mold) is moved between the mold clamping position and the removal position outside the mold, wear occurs on the sliding surfaces of the slide plate and guide plate.

The present invention was made to solve the above problems, and its main objective is to reduce wear caused by the sliding of a molding die in a resin molding device that slides the molding die in a sliding direction that intersects with the clamping direction.

That is, the resin molding device according to the present invention is characterized by comprising a mold clamping mechanism that clamps the mold via a base member, a mold slide mechanism that slides the mold between a mold clamping position where the mold is clamped and an ejection position that is located outside the base member in a sliding direction that intersects the mold clamping direction, and a distance change mechanism that changes the distance between the opposing surfaces of the base member and the mold when the mold slide mechanism slides the mold between the mold clamping position and the ejection position.

The present invention, configured in this way, can reduce wear caused by the sliding of a molding die in a resin molding device in which the molding die slides in a sliding direction that intersects with the clamping direction.

1 is a plan view illustrating a schematic configuration of a resin molding apparatus according to a first embodiment of the present invention. 1 is a front view showing a schematic configuration of a resin molding apparatus according to a first embodiment; 1 is a side view showing a schematic configuration of a resin molding apparatus according to a first embodiment; FIG. 2 is a diagram showing a schematic configuration of a molding die according to the first embodiment; FIG. 4 is an enlarged cross-sectional view illustrating a schematic view of a peripheral structure of a side wall member according to the first embodiment. FIG. 2 is an enlarged view illustrating a pantograph mechanism according to the first embodiment. FIG. 4 is an enlarged cross-sectional view illustrating a schematic view of a peripheral structure of an elastic member according to the first embodiment. 5A to 5C are cross-sectional views illustrating the operation of the elastic member of the first embodiment. FIG. 2 is a side view mainly showing a forming die sliding mechanism and a gap changing mechanism of the first embodiment. 3A is a plan view mainly showing a molding die slide mechanism for an upper mold, and FIG. 3B is a plan view mainly showing a molding die slide mechanism for a lower mold in the first embodiment. FIG. 4 is a side view showing a state in which the upper die has been moved to an ejection position in the first embodiment. FIG. 4 is a side view showing a state in which the lower die has been moved to a protruding position in the first embodiment. 5A is a side view showing a change in the distance between an upper die and a base member, and FIG. 5B is a side view showing a change in the distance between a lower die and a base member in the first embodiment. 4 is a flowchart of a method for manufacturing a resin molded product in the first embodiment. 5 is a flowchart showing an operation of a substrate transport mechanism and a sliding operation of an upper die in the first embodiment. 5A to 5C are schematic diagrams showing various states of operation of a substrate transport mechanism and a sliding operation of an upper mold in the first embodiment. 5 is a flowchart showing an operation of a resin material transport mechanism and a sliding operation of a lower die in the first embodiment. 5A to 5C are schematic diagrams showing various states of operation of a resin material transport mechanism and a sliding operation of a lower die in the first embodiment. FIG. 11 is a front view illustrating a schematic configuration of a resin molding apparatus according to a second embodiment. FIG. 13 is a side view illustrating a schematic configuration of a resin molding apparatus according to a second embodiment. 13A to 13C are a side view, a cross-sectional view, and a front view showing a peripheral structure of an elastic member according to a modified embodiment. FIG. 13 is a front view showing a schematic configuration of a resin molding apparatus according to a modified embodiment.

Next, the technology according to the present invention will be described in more detail using examples. However, the present invention is not limited to the following technology.

The resin molding device of technique 1 according to the present invention is characterized by comprising a mold clamping mechanism that clamps the mold via a base member, a mold slide mechanism that slides the mold between a mold clamping position where the mold is clamped and an ejection position that is located outside the base member in a sliding direction that intersects the mold clamping direction, and a distance change mechanism that changes the distance between the opposing surfaces of the base member and the mold when the mold slide mechanism slides the mold between the mold clamping position and the ejection position.

With this resin molding device, when the mold slide mechanism slides the mold between the mold clamping position and the ejection position, the distance between the opposing surfaces of the base member and the mold is changed, so the opposing surfaces of the base member and the mold can be separated when sliding. As a result, wear caused by the sliding of the mold can be reduced. In addition, by moving the mold to the ejection position, the transport object can be transported to the mold at the ejection position. As a result, there is no need to increase the distance between the molds when the molds are opened, and the resin molding device can be made low-profile.

In addition to the configuration of the above-mentioned Technology 1, the resin molding apparatus of Technology 2 according to the present invention is preferably such that the molding die has an upper die and a lower die, the molding die slide mechanism is provided corresponding to each of the upper die and the lower die, and the spacing change mechanism is provided corresponding to each of the upper die and the lower die.
With this configuration, the upper and lower dies can be moved to the protruding position independently of each other, and the objects to be transported can be transported to the upper and lower dies, respectively. In addition, wear caused by the sliding of the upper and lower dies during this process can be reduced.

In the resin molding apparatus according to a third aspect of the present invention, in addition to the configuration of the first or second aspect described above, it is preferable that the mold slide mechanism and the distance change mechanism are configured using a common drive actuator.
With this configuration, the configuration of the resin molding device having the mold slide mechanism and the distance changing mechanism can be simplified.

As a specific embodiment in which the mold slide mechanism and the gap change mechanism are configured using a common drive actuator, the resin molding apparatus of Technology 4 according to the present invention, in addition to the configuration of Technology 1 or 2 above, has the mold slide mechanism including a support frame that supports the mold and a drive actuator that moves the support frame in the sliding direction, and the gap change mechanism includes a cam mechanism interposed between the mold and the base member, and it is preferable that the cam mechanism changes the gap between the opposing surfaces of the mold and the base member as the support frame is moved by the drive actuator.
With this configuration, the cam mechanism of the gap change mechanism can be operated by the drive actuator of the mold slide mechanism.

In addition to the configuration of any one of the above-mentioned techniques 1 to 4, the resin molding apparatus of Technology 5 according to the present invention is preferably such that the spacing change mechanism maintains a gap between the opposing surfaces of the molding die and the base member at the mold clamping position without causing them to come into contact with each other, and that the opposing surfaces of the molding die and the base member come into contact with each other when the mold clamping mechanism clamps the mold.
With this configuration, it is possible to further reduce wear caused by sliding between the mold clamping position and the ejection position.

In the resin molding apparatus of Technology 6 according to the present invention, in addition to the configuration of any one of Technologies 1 to 5 described above, it is desirable that the mold slide mechanism has a positioning portion that contacts the mold moving toward the mold clamping position and positions the mold at the mold clamping position.
With this configuration, the molding die is positioned at the die clamping position by the positioning portion, so that the repeatability of the die clamping position can be improved, and the quality of the resin molded product can be improved.

A resin molding apparatus according to a seventh aspect of the present invention may be configured such that, in addition to the configuration of any one of the first to sixth aspects, the base member has a fixed platen, a movable platen that can be raised and lowered by a clamping mechanism, and an intermediate plate that is disposed between the fixed platen and the movable platen, and the molding die has an upper die and a lower die that are disposed between the fixed platen and the intermediate plate, and between the intermediate plate and the movable platen, respectively. In other words, the molding die has a configuration having a plurality of sets of upper dies and lower dies.
The resin molding apparatus of Technology 7 further includes a pair of side wall members arranged on both lateral sides of the movable platen and the intermediate plate, a lifting slide mechanism for sliding the intermediate plate in the up and down direction relative to the pair of side wall members, and a lifting interlocking mechanism for interlocking the lifting and lowering of the intermediate plate with the lifting and lowering of the movable platen, and it is desirable that the lifting and lowering interlocking mechanism has a pantograph mechanism having one end fixed to the side wall members and the other end moving together with the movable platen and extending and contracting as the movable platen is lifted and lowered, and a connecting mechanism connecting the cross link portion of the pantograph mechanism and the intermediate plate.
With this configuration, the number of molding dies can be increased, improving the productivity of resin molded products. In addition, since the intermediate plates are linked to the elevation of the movable platen by a pantograph mechanism, even if a molding die is provided between each of the intermediate plates, it is possible to prevent each component from becoming large, and also to suppress an increase in the size of the entire device, and it is also possible to eliminate the need for highly rigid components.

In addition to the configuration of any one of the above-mentioned techniques 1 to 7, it is desirable that the resin molding device of technique 8 according to the present invention further includes a transport mechanism for transporting an object to be transported to the molding die in the ejection position.

In addition to the configuration of the above-mentioned technology 8, the resin molding device of technology 9 according to the present invention desirably has a molding object transport mechanism that transports the molding object to the molding die in the ejection position, and a resin material transport mechanism that transports the resin material to the molding die in the ejection position.

In addition to the configuration of the above-mentioned technology 9, the resin molding device of technology 10 according to the present invention desirably has a molding object supply section that supplies the molding object to the mold in the ejection position, and a molding object receiving section that receives the resin-molded molding object from the mold in the ejection position.

In addition to the configuration of the above-mentioned technology 9 or 10, the resin molding device of technology 11 according to the present invention preferably has a resin material conveying mechanism that includes a resin material supplying section that supplies the resin material to the mold in the ejection position, and a film recovery section that recovers used release film from the mold in the ejection position.

The present invention also provides a method for producing a resin molded product using any one of the resin molding devices described above in techniques 1 to 11, the method including a transport step of transporting a molding object to the mold located at the ejection position, a resin molding step of clamping the mold located at the mold clamping position to perform resin molding on the molding object, and a removal step of removing the resin-molded molding object from the mold located at the ejection position.

1. First embodiment of the present invention
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings.
In addition, in any of the drawings shown below, for the purpose of easy understanding, some parts are omitted or exaggerated in schematic form as appropriate. The same components are denoted by the same reference numerals and the description thereof is omitted as appropriate.

<1-1. Overall configuration of resin molding device>
The resin molding apparatus 100 of the first embodiment manufactures a resin molded product P by resin-sealing an electronic component Wx fixed to a substrate W, which is an object to be molded, with a resin material J through resin molding.

The substrate W may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, or the like. Alternatively, the substrate W may be a carrier that is not provided with wiring. The resin material J may be, for example, a powdered or granular resin (including a granular resin), a liquid resin, or the like. The electronic component Wx may be, for example, an electronic element such as a semiconductor chip, a resistor element, or a capacitor element, or an electronic component in which at least one of these electronic elements is sealed with resin.

As shown in FIG. 1, this resin molding device 100 comprises, as its components, a substrate supply/storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable with respect to the other components.

The substrate supply/storage module A has a substrate receiving section 11 that receives pre-molded substrates W from outside, a substrate storage section 12 that stores molded substrates W (resin molded products P), a substrate transport mechanism 13 that transports the pre-molded substrates W and the resin molded products P, and a transfer mechanism 14, such as a transport robot, that transports, i.e., transfers, the pre-molded substrates W and the resin molded products P to the substrate transport mechanism 13.

The substrate transport mechanism 13 transports the pre-molded substrate W from the substrate supply/storage module A to the resin molding module B, and supplies the pre-molded substrate W to the molding dies 5a, 5b in the resin molding module B. After the pre-molded substrate W has been resin molded, the substrate transport mechanism 13 receives a resin molded product P, which is the molded substrate W after resin molding, from the molding dies 5a, 5b in the resin molding module B, and transports it to the substrate supply/storage module A. The transfer mechanism 14 also transfers the pre-molded substrate W from the substrate receiving section 11 to the substrate transport mechanism 13, and transfers the resin molded product P from the substrate transport mechanism 13 to the substrate storage section 12.

Each resin molding module B has an upper mold 51, which is a first mold that holds the substrate W, and a lower mold 52, which is a second mold in which a cavity 52C is formed. By clamping these molds together, the electronic components Wx fixed to the substrate W are resin-sealed by resin molding using a resin material J. The specific configuration of the resin molding module B will be described later.

The resin material supply module C has a moving table 15, a resin material storage section 16 placed on the moving table 15, a resin material supply mechanism 17 that measures and supplies resin material J to the resin material storage section 16, and a resin material transport mechanism 18 that transports the resin material storage section 16 and supplies resin material J to the cavity 52C of the lower mold 52. Here, the resin material storage section 16 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 17 onto the release film F held by the holding frame.

The moving table 15 moves within the resin material supply module C between a resin input position by the resin material input mechanism 17 and a transport position for handing over the resin material storage section 16 to the resin material transport mechanism 18. The resin material transport mechanism 18 also transports the resin material storage section 16 containing the resin material J from the resin material supply module C to the resin molding module B, where it supplies the release film F and the resin material J to the molding dies 5a, 5b. The resin material transport mechanism 18 then transports the resin material storage section 16 after the resin material J has been supplied from the resin molding module B to the resin material supply module C.

1-2. Specific configuration of resin molded module B
As shown in Figures 2 and 3, the resin molding module B includes a fixed platen 2, a movable platen 3 that can be raised and lowered by a mold clamping mechanism 10, an intermediate plate 4 arranged between the fixed platen 2 and the movable platen 3, a first molding die 5a and a second molding die 5b including an upper die 51 and a lower die 52 provided between the fixed platen 2 and the intermediate plate 4, and between the intermediate plate 4 and the movable platen 3, respectively, a pair of side wall members 61, 62 arranged on both lateral sides (here, both the left and right sides) of the movable platen 3 and the intermediate plate 4, a lifting and lowering slide mechanism 7 that slides the intermediate plate 4 in the vertical direction relative to the pair of side wall members 61, 62, and a lifting and lowering interlocking mechanism 8 that interlocks the lifting and lowering of the intermediate plate 4 with the lifting and lowering of the movable platen 3.

The upper mold 51 of the first mold 5a is provided on the lower surface of the stationary platen 2 directly or via another member. A pair of sidewall members 61, 62 are connected to both the left and right sides of the stationary platen 2. The pair of sidewall members 61, 62 may be formed integrally with the stationary platen 2. The stationary platen 2 in this embodiment has a generally rectangular flat plate shape in a plan view.

The lower mold 52 of the second molding die 5b is provided on the upper surface of the movable platen 3 directly or via another member. The movable platen 3 is raised and lowered by a clamping mechanism 10 provided below the movable platen 3. The movable platen 3 in this embodiment has a roughly rectangular flat plate shape in a plan view. A fixing member 31 is connected to the movable platen 3, and the lower end (lower end link portion 813) of the pantograph mechanism 81 described later is fixed to the fixing member 31.

The mold clamping mechanism 10 of this embodiment is a linear motion type that uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement to raise and lower the movable platen, but it may also be a link type that transmits the power source of a servo motor or the like to the movable platen using a link mechanism such as a toggle link.

The lower die 52 of the first mold 5a is provided on the upper surface of the intermediate plate 4 directly or via another member. The upper die 51 of the second mold 5b is provided on the lower surface of the intermediate plate 4 directly or via another member. The intermediate plate 4 in this embodiment has a generally rectangular flat plate shape in a plan view.

Here, the first molding die 5a and the second molding die 5b will be described with reference to FIG.
The upper mold 51 of each of the forming molds 5a and 5b is adapted to suction and hold the rear surface of the substrate W. A suction port (not shown) is formed in the lower surface of the upper mold 51, and a suction flow path (not shown) connected to the suction port is formed inside the upper mold 51. This suction flow path is connected to an external suction device (not shown).

The lower mold 52 of each of the molding dies 5a and 5b has a cavity 52C that accommodates the electronic component Wx and the resin material J fixed to the substrate W. Specifically, the lower mold 52 has a bottom member 521 that forms the bottom surface of the cavity 52C, and a side member 522 that surrounds the bottom member 521. The upper surface of the bottom member 521 and the inner peripheral surface of the side member 522 form the cavity 52C. The side member 522 is provided so as to be movable up and down relative to the bottom member 521. Specifically, the side member 522 is supported by a plurality of elastic members 524 such as coil springs on the base plate 523 of the lower mold 52. Furthermore, the lower mold 52 of this embodiment is covered with a release film F to improve the releasability of the resin molded product P. In addition, an air vent (not shown) for discharging air or gas may be provided on the upper surface of the side member 522 (the contact surface between the side member 522 and the substrate W). Additionally, around the upper die 51 and the lower die 52, there is provided a sealing structure 50 (not shown in Figures 2 and 5) consisting of side walls and sealing members such as O-rings for drawing a vacuum around the molding dies 5a and 5b during resin molding.

As shown in Figs. 2 and 3, the pair of sidewall members 61, 62 fix the fixed platen 2 at a predetermined height relative to the base 101 and slidably support the intermediate plate 4. Here, the upper end of each sidewall member 61, 62 is connected to the fixed platen 2, and the lower end of the sidewall member 61, 62 is connected to the base 101. In this embodiment, each sidewall member 61, 62 has a vertically elongated flat plate shape extending in the vertical direction.

The lifting and sliding mechanism 7 moves the intermediate plate 4 linearly in the vertical direction relative to the pair of side wall members 61, 62. Specifically, the lifting and sliding mechanism 7 has a linear rail 71 that extends in a straight line, and a linear block 72 that slides on the linear rail 71.

In this embodiment, flat side plates 41 are connected to both the left and right sides of the intermediate plate 4, linear motion blocks 72 are provided on the side plates 41, and linear motion rails 71 are provided on the inner surfaces of the side wall members 61, 62 along the up-down direction (vertical direction).

In detail, as shown in FIG. 5, two linear rails 71 are provided in parallel in the front and rear on the inner surface of each side wall member 61, 62, and two rows of linear blocks 72 are provided in the front and rear of each side plate 41 corresponding to the two linear rails 71. Here, the row of linear blocks 72 provided on each side plate 41 is composed of two linear blocks 72 (see FIG. 2). In other words, a total of four linear blocks 72 are provided on each side plate 41.

In detail, as shown in FIG. 2 and FIG. 5, two linear rails 71 are provided on the inner surface of each side wall member 61, 62. Here, the two linear rails 71 extend in the up-down direction (vertical direction). The two linear rails 71 are arranged side by side in the front-rear direction. Meanwhile, linear blocks 72 are provided on each side plate 41. Here, the linear blocks 72 are arranged in two rows in the front-rear direction on each side plate 41 so as to correspond to the two linear rails 71. Two linear blocks 72 are arranged in each row in the up-down direction (vertical direction) on each side plate 41. In other words, a total of four linear blocks 72 are provided on each side plate 41. For example, in FIG. 2, one linear block 72 may be added to each side plate 41 in the part hidden by the connecting member 822 described later, for a total of six linear blocks 72.

As shown in Figures 2, 3, and 5 to 7, the lifting and lowering interlocking mechanism 8 synchronizes the clamping and opening of the first molding die 5a and the second molding die 5b by linking the lifting and lowering of the intermediate plate 4 with the lifting and lowering of the movable platen 3. In other words, the lifting and lowering interlocking mechanism 8 makes the clamping speed of the first molding die 5a and the clamping speed of the second molding die 5b the same, allowing them to be clamped simultaneously.

Specifically, the lifting/lowering interlocking mechanism 8 includes a pantograph mechanism 81 that expands and contracts as the movable platen 3 rises and falls, and a connecting mechanism 82 that connects the cross link portion 811 of the pantograph mechanism 81 to the intermediate plate 4.

As shown in FIG. 2, the pantograph mechanisms 81 are provided on the left and right outer sides of the pair of side wall members 61, 62. In other words, the movable platen 3 and the intermediate plate 4 are raised and lowered in conjunction with each other by the two left and right pantograph mechanisms 81. The left and right pantograph mechanisms 81 have the same configuration.

Specifically, as shown in Figures 3 and 6, each pantograph mechanism 81 is composed of one cross link portion 811, an upper end link portion 812, and a lower end link portion 813. The cross link portion 811 is formed by crossing the first link 81a and the second link 81b at their center portions, and rotatably connecting the crossing portions by a rotation shaft 81c. The upper end link portion 812 is formed by rotatably connecting the lower ends of the third link 81d and the fourth link 81e to the upper ends of the first link 81a and the second link 81b by a rotation shaft 81f, and rotatably connecting the upper ends of the third link 81d and the fourth link 81e to each other by a rotation shaft 81g. Furthermore, the lower link portion 813 is configured such that the upper ends of the fifth link 81h and the sixth link 81i are rotatably connected to the lower ends of the first link 81a and the second link 81b by a rotation shaft 81j, and the lower ends of the fifth link 81h and the sixth link 81i are rotatably connected to each other by a rotation shaft 81k.

The upper end (upper end link portion 812) of the pantograph mechanism 81 is fixed to the upper ends of the sidewall members 61 and 62, and the lower end (lower end link portion 813) of the pantograph mechanism 81 is fixed to the fixing member 31 that moves together with the movable platen 3. Therefore, the lower end (lower end link portion 813) of the pantograph mechanism 81 is connected to the movable platen 3 via the fixing member 31 and moves together with the movement of the movable platen 3. In this embodiment, as shown in FIG. 6, the rotation shaft 81c of the cross link portion 811 of the pantograph mechanism 81, the rotation shaft 81g of the upper end link portion 812, and the rotation shaft 81k of the lower end link portion 813 are arranged in the up-down direction (vertical direction) and are arranged so as to be located in the center of the width direction of the sidewall members 61 and 62 in a side view.

As shown in Figures 2, 3, 5 and 7, the connecting mechanism 82 connects the cross link portion 811 of the pantograph mechanism 81 and the intermediate plate 4. Specifically, the connecting mechanism 82 has a connection member 821 connected to the cross link portion 811, a connecting member 822 that connects the connecting member 821 to the intermediate plate 4, and elastic members 823a and 823b interposed between the connecting member 821 and the connecting member 822. The left and right connecting mechanisms 82 have the same configuration.

As shown in Figures 3, 5, and 6, the connection member 821 is connected to the cross link section 811 without impeding the expansion and contraction of the pantograph mechanism 81. Specifically, the connection member 821 is a long rectangular member, and its center is connected to the rotation shaft 81c of the cross link section 811. This connection member 821 is provided to extend in the front-rear direction (horizontal direction).

The connecting members 822 connect the connecting members 821 to the intermediate plate 4, and in this embodiment, are connected to each of the side plates 41 connected to both sides (here, both the left and right sides) of the intermediate plate 4 (see FIG. 2). The connecting members 822 extend outward from the front and rear of the side wall members 61, 62 (see FIG. 5).

The elastic members 823a and 823b are provided to absorb variations in thickness, etc. of the substrate W, and are interposed between the coupling member 822 and the connecting member 821. The elastic members 823a and 823b are provided on the outside of the sidewall members 61 and 62.

Specifically, as shown in Figures 2, 3, 5, and 7, the elastic members 823a and 823b include an upper elastic member 823a that absorbs upward displacement of the intermediate plate 4 relative to the connecting member 821, and a lower elastic member 823b that absorbs downward displacement. As shown in Figure 7, these elastic members 823a and 823b constitute the displacement absorption mechanisms 83a and 83b provided on the connecting member 822.

The displacement absorbing mechanisms 83a and 83b are provided on the upper and lower sides of the connecting member 821 in the connecting member 822. The upper displacement absorbing mechanism 83a has an upper contact portion 831 that contacts the upper surface of the connecting member 821, an upper elastic member 823a that applies (biases) the upper contact portion 831 toward the upper surface of the connecting member 821, and an upper support portion 832 that supports the upper contact portion 831 so that it can move upward. The lower displacement absorbing mechanism 83b has a lower contact portion 833 that contacts the lower surface of the connecting member 821, a lower elastic member 823b that applies (biases) the lower contact portion 833 toward the lower surface of the connecting member 821, and a lower support portion 834 that supports the lower contact portion 833 so that it can move downward. The upper support portion 832 and the lower support portion 834 are fixed to the connecting member 822.

Here, the upper contact portion 831 is formed with an upper stopper 831a that protrudes around the periphery and limits downward movement so as to be able to contact the upper surface of the upper support portion 832. The lower contact portion 833 is formed with a lower stopper 833a that protrudes around the periphery and limits upward movement so as to be able to contact the lower surface of the lower support portion 834.

The connecting member 822 has an upper protrusion 822a that protrudes to form an opposing surface above the upper end surface of the upper contact portion 831, and a lower protrusion 822b that protrudes to form an opposing surface below the lower end surface of the lower contact portion 833. Between the upper end surface of the upper contact portion 831 and the lower surface of the upper protrusion 822a of the connecting member 822 (the opposing surface of the upper end surface of the upper contact portion 831), a gap is provided that does not contact due to the operation of the displacement absorbing mechanisms 83a and 83b described below. In addition, between the lower end surface of the lower contact portion 833 and the upper surface of the lower protrusion 822b of the connecting member 822 (the opposing surface of the lower end surface of the lower contact portion 833), a gap is provided that does not contact due to the operation of the displacement absorbing mechanisms 83a and 83b.

Next, the basic operation of the displacement absorbing mechanisms 83a and 83b will be described.
In the initial state of the displacement absorbing mechanisms 83a and 83b (see FIG. 7), the upper end of the elastic member 823a contacts the lower surface of the upper protrusion 822a of the connecting member 822 (the surface facing the upper end surface of the upper contact portion 831), and the lower end contacts the upper surface of the upper stopper 831a of the upper contact portion 831, so that the elastic member 823a is in a non-stretched state. Also, in the initial state of the displacement absorbing mechanisms 83a and 83b, the upper end of the elastic member 823b contacts the lower surface of the lower stopper 833a of the lower contact portion 833, and the lower end contacts the upper surface of the lower protrusion 822b of the connecting member 822 (the surface facing the lower end surface of the lower contact portion 833), so that the elastic member 823b is in a non-stretched state.

When the intermediate plate 4 is displaced downward relative to the connection member 821, as shown in FIG. 8(a), the linking member 822 connected to the intermediate plate 4 is displaced downward relative to the connection member 821. Then, with the connection member 821 and the upper contact portion 831 stationary, the upper support portion 832 and the upper protrusion 822a of the linking member 822 are also displaced downward relatively, so that the upper elastic member 823a contracts. In other words, the connection member 821 and the upper contact portion 831 move upward relative to the upper protrusion 822a of the linking member 822, and the upper elastic member 823a contracts. This absorbs the downward relative displacement of the intermediate plate 4 with respect to the connection member 821.

On the other hand, when the intermediate plate 4 is displaced upward relative to the connection member 821, as shown in FIG. 8B, the linking member 822 connected to the intermediate plate 4 is displaced upward relative to the connection member 821. Then, with the connection member 821 and the lower contact portion 833 stationary, the lower support portion 834 and the lower protrusion 822b of the linking member 822 are also displaced upward relatively, and the lower elastic member 823b contracts. In other words, the connection member 821 and the lower contact portion 833 move downward relative to the lower protrusion 822b of the linking member 822, and the lower elastic member 823b contracts. This absorbs the relative upward displacement of the intermediate plate 4 with respect to the connection member 821.

In addition, as shown in Figures 2, 5, and 7, the resin molding device 100 of this embodiment further includes a guide mechanism 84 interposed between the connection member 821 and the coupling member 822. This guide mechanism 84 guides the movement of the connection member 821 and the coupling member 822 when they move relative to each other.

The guide mechanism 84 guides the movement of the connection member 821 in the vertical direction, and is provided between the opposing surfaces of the connection member 821 and the linking member 822. Specifically, the guide mechanism 84 has a linear rail 841 provided on one of the connection member 821 or the linking member 822, and a linear block 842 provided on the other of the connection member 821 or the linking member 822. In this embodiment, the linear rail 841 is provided on the linking member 822, and the linear block 842 is provided on the connection member 821.

1-3. Specific configuration of resin molding apparatus 100
9 to 13, the resin molding apparatus 100 of this embodiment further includes a mold slide mechanism 20 that slides the opened molding dies 5a, 5b in a slide direction intersecting the mold clamping direction, and a distance change mechanism 30 that changes the distance between the opposing surfaces of the base member and the molding dies 5a, 5b (surfaces that face each other in the mold clamping direction) when the molding dies 5a, 5b are slid by the mold slide mechanism 20. Note that the mold slide mechanism 20 and the distance change mechanism 30 are omitted from illustration in FIGS. 1 to 4 and 6.

Here, the mold clamping direction is the up-down direction (vertical direction), and the sliding direction is the front-rear direction (direction perpendicular to the up-down direction and the left-right direction). In addition, the base members in this embodiment are the fixed platen 2, the movable platen 3, and the intermediate plate 4.

As shown in Figures 9 to 12, the mold slide mechanism 20 is provided in the molds 5a, 5b corresponding to the upper mold 51 and the lower mold 52, respectively. The mold slide mechanism 20 slides the upper mold 51 and the lower mold 52 between the mold clamping position Q where the mold is clamped and the protruding position R located outside the base members 2 to 4 in the sliding direction.

Specifically, the mold slide mechanism 20 includes a support frame 201 that supports the upper mold 51 or the lower mold 52, a guide portion 202 that guides the movement of the support frame 201 along the sliding direction relative to the base members 2 to 4, and a drive actuator 203 that moves the support frame 201 along the sliding direction.

As shown in Figs. 9 to 12, the support frame 201 has an upper mold support frame 201a that supports the upper mold 51, and a lower mold support frame 201b that supports the lower mold 52. As shown in Fig. 10, each support frame 201a, 201b has a rectangular frame shape in a plan view, and is configured to support the upper mold 51 or the lower mold 52 at its opening.

The upper die support frame 201a supports the upper die 51 so that it can move in the die clamping direction, and has stopper portions 204 on which the edge of the upper die 51 rests. These stopper portions 204 are provided to correspond to the four corners of the upper die 51 (see FIG. 10). The lower die support frame 201b supports the lower die 52 so that it can move in the die clamping direction, and has elastic bodies 205 that support the edge of the lower die 52. These elastic bodies 205 are provided to correspond to the four corners of the lower die 52 (see FIG. 10), and support the lower die 52 via contact portions 206 that come into contact with the lower die 52. The contact portions 206 are provided on the lower die support frame 201b so that they can move up and down.

As shown in Figures 9 to 12, the guide section 202 is provided between the fixed member 40, which is fixed to the base members 2 to 4, and the support frame 201. Specifically, the guide section 202 is configured using a linear guide, and has a linear rail 202a that is provided on either the fixed member 40 or the support frame 201 and extends in a straight line along the sliding direction, and a moving linear block 202b that is provided on the other of the fixed member 40 or the support frame 201 and slides on the linear rail 202a.

As shown in Figs. 9 to 12, the drive actuator 203 is provided corresponding to each support frame 201, and moves the support frame 201 along the guide portion 202. The drive actuator 203 moves the upper die 51 and the lower die 52 between the die clamping position Q and the ejection position R. The drive actuator 203 in this embodiment has a rack gear 203a provided on the support frame 201, a pinion gear 203b meshed with the rack gear 203a, and a motor 203c, such as a servo motor, that rotates the pinion gear 203b. The drive actuator 203 is not limited to the above-mentioned rack and pinion configuration, and may be one that uses a ball screw mechanism or an air cylinder, etc.

In this embodiment, the upper mold 51 of the first mold 5a provided on the lower surface of the stationary platen 2 is configured to slide by the upper mold support frame 201a via the fixed member 40 fixed to the stationary platen 2. The lower mold 52 of the first mold 5a provided on the upper surface of the intermediate plate 4 is configured to slide by the lower mold support frame 201b via the fixed member 40 fixed to the intermediate plate 4. The upper mold 51 of the second mold 5b provided on the lower surface of the intermediate plate 4 is configured to slide by the upper mold support frame 201a via the fixed member 40 fixed to the intermediate plate 4. In other words, the lower mold support frame 201b of the lower mold 52 of the first mold 5a and the upper mold support frame 201a of the upper mold 51 of the second mold 5b are configured to slide via a common fixed member 40. Furthermore, the lower mold 52 of the second mold 5b provided on the upper surface of the movable platen 3 is configured to slide by the lower mold support frame 201b via the fixed member 40 fixed to the movable platen 3.

As shown in Figures 9, 11 to 13, the mold slide mechanism 20 has a positioning portion 207 that contacts the side surfaces of the upper mold 51 and the lower mold 52 that move to the mold clamping position Q, and positions the upper mold 51 and the lower mold 52 at the mold clamping position Q. This positioning portion 207 positions the upper mold 51 and the lower mold 52 in the horizontal direction (front-back and left-right directions) relative to the base members 2 to 4.

The mold slide mechanism 20 may not have the positioning unit 207, and may be configured to position the upper mold 51 and the lower mold 52 at the mold clamping position Q by position control using the drive actuator 203 in addition to the positioning unit 207.

As shown in Figures 9 to 13, the spacing change mechanism 30 is provided in the molds 5a, 5b in correspondence with the upper mold 51 and the lower mold 52, respectively, in the same manner as the mold slide mechanism 20. The spacing change mechanism 30 changes the spacing between the opposing surfaces of the base members 2 to 4 and the upper mold 51 and the lower mold 52 when the mold slide mechanism 20 slides the upper mold 51 and the lower mold 52 between the mold clamping position Q and the ejection position R.

The gap change mechanism 30 provided corresponding to the upper die 51 of the first mold 5a changes the gap between the lower surface of the fixed platen 2 on which the upper die 51 is attached and the upper surface of the upper die 51 of the first mold 5a attached to the fixed platen 2. The gap change mechanism 30 provided corresponding to the lower die 52 of the first mold 5a changes the gap between the upper surface of the intermediate plate 4 on which the lower die 52 is attached and the lower surface of the lower die 52 of the first mold 5a attached to the intermediate plate 4. The gap change mechanism 30 provided corresponding to the upper die 51 of the second mold 5b changes the gap between the lower surface of the intermediate plate 4 on which the upper die 51 is attached and the upper surface of the upper die 51 of the second mold 5b attached to the intermediate plate 4. The gap change mechanism 30 provided corresponding to the lower die 52 of the second mold 5b changes the gap between the upper surface of the movable platen 3 on which the lower die 52 is attached and the lower surface of the lower die 52 of the second mold 5b attached to the movable platen 3.

Specifically, the spacing change mechanism 30 is configured using the drive actuator 203 of the mold slide mechanism 20. The spacing change mechanism 30 also has a cam mechanism 301 interposed between the upper and lower dies 51 and 52 and the base members 2 to 4. In this spacing change mechanism 30, as the drive actuator 203 moves the support frame 201, the cam mechanism 301 changes the spacing between the opposing surfaces of the upper and lower dies 51 and 52 and the base members 2 to 4.

The cam mechanism 301 of this embodiment includes a first cam portion 302 having a contact surface provided on the upper mold 51 and the lower mold 52, and a second cam portion 303 fixed to the base members 2 to 4 and contacting the contact surface of the first cam portion 302. Here, as shown in "Configuration of the first cam portion" in FIG. 9, the contact surface has an inclined surface 302a for shortening or widening the gap between the opposing surfaces of the upper mold 51 and the lower mold 52 and the base members 2 to 4, and a flat surface 302b for maintaining the shortened gap. The first cam portion 302 is provided at two locations on each side of the upper mold 51 and the lower mold 52, and the second cam portion 303 is provided at two locations on each side of the base members 2 to 4 corresponding to the first cam portion 302. The second cam portion 303 can be configured by a roller member, a rolling element (bearing), a bush, or the like.

<1-3-1. Mechanism for changing the gap between the upper die 51 and the base members 2, 4>
Specifically, the cam mechanism 301 corresponding to the upper mold support frame 201a is configured to lift the upper mold 51 placed on the stopper portion 204 of the upper mold support frame 201a from the stopper portion 204, and the inclined surface 302a of the first cam portion 302 is a downward surface having an upward slope from the ejection position R toward the mold clamping position Q, as shown in "Configuration (a) of the first cam portion" in Figure 9.

With this configuration, when the upper die 51 slides from the ejection position R to the clamping position Q, as shown in FIG. 13(a), the inclined surface 302a of the first cam portion 302 comes into contact with and rides up the corresponding second cam portion 303, the upper die 51 is lifted from the stopper portion 204, and the upper surface of the upper die 51 approaches the lower surfaces of the base members 2 and 4, reducing the distance between them. Note that at the clamping position Q, the flat surface 302b of the first cam portion 302 is in contact with the second cam portion 303.

On the other hand, when the upper die 51 slides from the clamping position Q to the ejection position R, the first cam portion 302 of the upper die 51 separates from the corresponding second cam portion 303, the upper die 51 moves under its own weight and is placed on the stopper portion 204, and the upper surface of the upper die 51 separates from the lower surfaces of the base members 2 and 4, increasing the distance between them.

<1-3-2. Mechanism for Changing the Distance Between the Lower Die 52 and the Base Members 3, 4>
Specifically, the cam mechanism 301 corresponding to the lower mold support frame 201b is configured to push the lower mold 52 supported by the elastic body 205 and contact portion 206 of the lower mold support frame 201b toward the elastic body 205 (base members 2 to 4), and the inclined surface 302a of the first cam portion 302 is an upward surface having a downward slope from the ejection position R toward the mold clamping position Q, as shown in "Configuration (b) of the first cam portion" in Figure 9.

With this configuration, when the lower die 52 slides from the protruding position R to the clamping position Q, as shown in FIG. 13(b), the inclined surface 302a of the first cam portion 302 of the lower die 52 comes into contact with the corresponding second cam portion 303, and the lower die 52 is pressed toward the elastic body 205, and the lower surface of the lower die 52 approaches the upper surfaces of the base members 3 and 4, reducing the distance between them. Note that at the clamping position Q, the flat surface 302b of the first cam portion 302 is in contact with the second cam portion 303.

On the other hand, when the lower die 52 slides from the clamping position Q to the protruding position R, the first cam portion 302 of the lower die 52 separates from the corresponding second cam portion 303, and the lower die 52 moves upward due to the force applied by the elastic body 205, and the lower surface of the lower die 52 separates from the upper surfaces of the base members 3 and 4, increasing the distance between them.

Here, the cam mechanism 301 of the distance change mechanism 30 keeps the opposing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4 in a state of being slightly spaced apart at the clamping position Q without contacting each other. Then, when the clamping mechanism 10 clamps the forming dies 5a and 5b, the opposing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4 come into contact with each other. At this time, the upper die 51 and the lower die 52 come into close contact with the base members 2 to 4, so that the first cam portion 302 and the second cam portion 303 provided on the upper die 51 and the lower die 52 are separated, and the cam mechanism 301 is not damaged by clamping. Note that the cam mechanism 301 may be configured to bring the opposing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4 into contact with each other at the clamping position Q.

1-4. Specific configurations of the transport mechanisms 13 and 18
Next, specific configurations of the substrate transport mechanism 13 and the resin material transport mechanism 18 of this embodiment will be described.

The substrate transport mechanism 13 transports the substrate W and the resin molded product P, which are the objects to be transported, to the upper mold 51 at the ejection position R. As shown in FIG. 11, the substrate transport mechanism 13 moves to a transport position X1 where the substrate W and the resin molded product P are transported to the upper mold 51 at the ejection position R. Here, the transport position X1 is a position where the substrate transport mechanism 13 is located below the upper mold 51 at the ejection position R, and transports, i.e., delivers, the substrate W and the resin molded product P. When the substrate transport mechanism 13 transports the substrate W and the resin molded product P to the upper mold 51, the lower mold 52 is at the mold clamping position Q so as not to interfere with the transport of the substrate W and the resin molded product P to the upper mold 51. The substrate transport mechanism 13 is configured to move left and right between the transport position X1 and a retreat position (not shown). Here, the transport position X1 can also be described as a transfer position where the substrate W, which is the object to be transported, is handed over between the upper mold 51, which is a molding mold located at the ejection position R, and the substrate transport mechanism 13.

Specifically, as shown in FIG. 1, the substrate transport mechanism 13 has a substrate supply section 131 that supplies a substrate W to the upper mold 51 at the ejection position R, and a substrate receiving section 132 that receives a resin molded product P from the upper mold 51 at the ejection position R. The substrate supply section 131 and the substrate receiving section 132 are provided corresponding to each upper mold 51, and are provided side by side in the left-right direction.

Then, the substrate transport mechanism 13 moves left and right at the transport position X1 to successively perform the receiving operation of the substrate receiving section 132 and the supplying operation of the substrate supplying section 131. When the substrate receiving section 132 performs the receiving operation, the substrate receiving section 132 is located below the upper mold 51 at the protruding position R, and when the substrate supplying section 131 performs the supplying operation, the substrate supplying section 131 is located below the upper mold 51 at the protruding position R.

The resin material transport mechanism 18 transports the resin material J and release film F, which are the transport objects, to the lower mold 52 at the ejection position R. As shown in FIG. 12, the resin material transport mechanism 18 moves to a transport position X2 where the resin material J and release film F are transported to the lower mold 52 at the ejection position R. Here, the transport position X2 is a position where the resin material transport mechanism 18 is located above the lower mold 52 at the ejection position R and transports, i.e., delivers, the resin material J and release film F. When the resin material transport mechanism 18 transports the resin material J and release film F to the lower mold 52, the upper mold 51 is at the mold clamping position Q so as not to interfere with the transport of the resin material J and release film F to the lower mold 52. The resin material transport mechanism 18 is configured to move left and right between the transport position X2 and a retreat position (not shown). Here, the transport position X2 can also be described as a transfer position where the resin material J, which is the object to be transported, is handed over between the lower mold 52, which is the molding mold located at the ejection position R, and the resin material transport mechanism 18.

Specifically, as shown in FIG. 1, the resin material transport mechanism 18 has a resin material supply section 181 that supplies resin material J and an unused release film F to the lower mold 52 at the ejection position R, and a film recovery section 182 that recovers used release film F from the lower mold 52 at the ejection position R. The resin material supply section 181 and the film recovery section 182 are provided corresponding to each lower mold 52, and are provided side by side in the left-right direction.

The resin material transport mechanism 18 then moves left and right at the transport position X2 to continuously perform the recovery operation of the film recovery section 182 and the supply operation of the resin material supply section 181. When the film recovery section 182 is performing the recovery operation, the film recovery section 182 is located above the lower mold 52 at the protruding position R, and when the resin material supply section 181 is performing the supply operation, the resin material supply section 181 is located above the lower mold 52 at the protruding position R.

<1-5. Example of Operation of Resin Molding Apparatus 100>
Next, an example of the operation of the resin molding apparatus 100 will be described with reference to Figures 1, 2, 4, and 8. The operation described below is performed by, for example, a control unit COM provided in the substrate supply/storage module A controlling each part of the resin molding apparatus 100. The control unit COM is a dedicated or general-purpose computer having a CPU, internal memory, an input/output interface, an AD converter, etc.

<1-5-1. Overall operation>
First, in a state where each of the molding dies 5a, 5b is opened by the lifting and lowering interlocking mechanism 8 (see FIG. 2), the substrate W is transported to and held by the upper die 51 of each of the molding dies 5a, 5b by the substrate supplying and storing module A shown in FIG. 1. In addition, a release film F and a resin material J are stored in the cavity 52C of the lower die 52 of each of the molding dies 5a, 5b by the resin material supplying module C. In this way, the substrate W, which is the object to be molded, the release film F and the resin material J are supplied to each of the molding dies 5a, 5b.

Next, the movable platen 3 is raised by the mold clamping mechanism 10. As the movable platen 3 rises, the pantograph mechanism 81 contracts, and the intermediate plate 4 connected to the rotation shaft 81c of the cross link portion 811 of the pantograph mechanism 81 rises. As the movable platen 3 rises, the surroundings of the molds 5a, 5b are sealed by the sealing structure 50 shown in FIG. 5, and a vacuum is drawn around the molds 5a, 5b by a vacuum pump (not shown).

Then, the upper surface of the lower die 52 of each molding die 5a, 5b (specifically, the upper surface of the side member 522, or the release film F if there is one) comes into contact with the substrate W adsorbed and held by the upper die 51. At this time, if the timing at which the lower die 52 of the first molding die 5a and the second molding die 5b come into contact with the upper die 51 differs, the upper elastic member 823a or the lower elastic member 823b deforms before the elastic member 524 of the lower die 52. In other words, the spring constant of the upper elastic member 823a and the lower elastic member 823b is smaller than the spring constant of the elastic member 524 of the lower die 52.

For example, when the lower die 52 on the intermediate plate 4 (the lower die 52 of the first molding die 5a) comes into contact with the substrate W held by suction on the corresponding upper die 51 before the lower die 52 on the movable platen 3 (the lower die 52 of the second molding die 5b), the intermediate plate 4 is displaced downward relative to the connecting member 821 and the upper elastic member 823a contracts (see FIG. 8(a)).

On the other hand, when the lower die 52 on the movable platen 3 (the lower die 52 of the second molding die 5b) comes into contact with the substrate W held by suction on the corresponding upper die 51 before the lower die 52 on the intermediate plate 4 (the lower die 52 of the first molding die 5a), the intermediate plate 4 is displaced upward relative to the connecting member 821, and the lower elastic member 823b contracts (see FIG. 7(b)).

As a result, the mold clamping operation is performed while eliminating the difference in timing at which the lower mold 52 of the first molding mold 5a and the second molding mold 5b contact the upper mold 51. Furthermore, the upper elastic member 823a and the lower elastic member 823b absorb not only the variation in thickness of the substrate W, but also the variation in the amount of resin material J contained in the cavity 52C, the variation in the volume of the electronic component Wx fixed to the substrate W, etc.

Then, the clamping mechanism 10 further raises the movable platen 3, completing clamping of the first molding die 5a and the second molding die 5b, and maintaining this state for a predetermined time (for example, the curing time of the resin material J) completes the resin molding. In this way, the molding dies 5a, 5b are clamped using the lifting and lowering interlocking mechanism 8, and resin molding is performed. Then, the clamping mechanism 10 lowers the movable platen 3, and the molding dies 5a, 5b are opened. Then, the resin molded product P is stored in the substrate storage section 12 by the substrate supply and storage module A (see FIG. 1). In this way, the molding dies 5a, 5b are opened using the lifting and lowering interlocking mechanism 8, and the substrate W (resin molded product P), which is the resin molded object, is removed from the molding dies 5a, 5b and stored in the substrate storage section 12, to manufacture the resin molded product P.

<1-5-2. Details of the transport process before (after) the resin molding process>
Next, the details of the conveying step before (after) the resin molding step will be described with reference to FIGS.

(Resin molded product receiving step: S1 (see FIG. 14))
With the molding dies 5a, 5b in an open state (see FIG. 2), as shown in FIG. 11, the upper dies 51 of the molding dies 5a, 5b are moved simultaneously from the clamping position Q to the ejection position R by the molding die slide mechanism 20 (first upper die slide step). In addition, the substrate transport mechanism 13 moves to the transport position X1. In the first upper die slide step, as shown in FIG. 13(a), the distance between the opposing surfaces of the base members 2, 4 and the upper die 51 is increased by the distance change mechanism 30. Then, the substrate receiving portion 132 of the substrate transport mechanism 13 simultaneously receives the resin molded product P from the upper die 51 at the ejection position R.

(Pre-molded substrate supply step: S2 (see FIG. 14))
Next, the substrate supply unit 131 of the substrate transport mechanism 13 simultaneously supplies the pre-molding substrates W to the upper mold 51 at the ejection position R and holds them (substrate transport step). Thereafter, the mold slide mechanism 20 simultaneously moves the upper molds 51 holding the pre-molding substrates W from the ejection position R to the mold clamping position Q (second upper mold slide step). The substrate transport mechanism 13 also moves to the retracted position. In the second upper mold slide step, as shown in FIG. 13(a), the distance between the opposing surfaces of the base members 2, 4 and the upper mold 51 is reduced by the distance change mechanism 30.

(Used film recovery step: S3 (see FIG. 14))
As shown in Fig. 12, the mold slide mechanism 20 moves the lower molds 52 of the molds 5a, 5b all at once from the mold clamping position Q to the ejection position R (first lower mold slide step). The resin material transport mechanism 18 is also moved to the transport position X2. In the first lower mold slide step, the gap between the opposing surfaces of the base members 3, 4 and the lower molds 52 is increased by the gap change mechanism 30 as shown in Fig. 13(b). Then, the film recovery section 182 of the resin material transport mechanism 18 simultaneously recovers the used release film F from the lower molds 52 at the ejection position R.

(Resin material supply step: S4 (see FIG. 14))
Next, the resin material supplying section 181 of the resin material transport mechanism 18 supplies the release film F and resin material J before use to the lower mold 52 (resin material transporting step). Thereafter, the mold sliding mechanism 20 simultaneously moves the lower molds 52 to which the release film F and resin material J have been supplied from the protruding position R to the mold clamping position Q (second lower mold sliding step). The resin material transport mechanism 18 also moves to the retracted position. In the second lower mold sliding step, as shown in FIG. 13(b), the gap between the opposing surfaces of the base members 3, 4 and the lower mold 52 is reduced by the gap changing mechanism 30.

Then, the next resin molding process is carried out. The resin molded product P received by the substrate transport mechanism 13 is stored in the substrate storage section 12 (see FIG. 1). Furthermore, the used release film F collected by the resin material transport mechanism 18 is disposed of in a disposal box (not shown).

<1-5-3. Sliding Operation of Upper Die 51 and Moving Operation of Substrate Transport Mechanism 13>
In this embodiment, the first movement operation of the substrate transport mechanism 13 to the transport position X1, where the substrate W is handed over, i.e., transported, to the upper mold 51 at the ejection position R, is started before the first sliding operation of the upper mold 51 to the ejection position R by the mold slide mechanism 20, or the first sliding operation is performed so as to overlap with at least a portion of the period of the first movement operation.

Performing the first sliding motion so as to overlap at least a portion of the period of the first moving motion means that the first moving motion and the first sliding motion are performed simultaneously for at least a portion of the period, or that there is a period during which the first moving motion and the first sliding motion are performed simultaneously.

Specifically, as shown in the first operation pattern (a) of FIG. 15 and FIG. 16, it is possible to perform the first sliding operation after the first moving operation is completed. That is, after the substrate transport mechanism 13 moves to the transport position X1 (see FIG. 16(a)), the mold slide mechanism 20 starts sliding the upper mold 51 and moves it to the ejection position R (see FIG. 16(b)). Then, the substrate receiving portion 132 of the substrate transport mechanism 13 receives the resin molded product P from the upper mold 51 at the ejection position R (see FIG. 16(c)). In addition, the substrate supply portion 131 of the substrate transport mechanism 13 supplies the pre-molding substrate W to the upper mold 51 at the ejection position R (see FIG. 16(d)). After the pre-molding substrate W is supplied from the substrate transport mechanism 13 to the upper mold 51, the mold slide mechanism 20 starts sliding the upper mold 51 and moves it to the mold clamping position Q (see FIG. 16(e)). After the upper die 51 moves to the clamping position Q, the substrate transport mechanism 13 retreats from the transport position X1 to the retreat position. By moving the substrate transport mechanism 13 to the transport position X1 in advance in this way, the time that the upper die 51 remains at the protruding position R can be shortened, a drop in the temperature of the upper die 51 can be prevented, and contamination of the upper die 51 or the resin molded product P (for example, adhesion or inclusion of foreign matter) can be prevented.

It is also possible to complete the first moving operation and the first sliding operation simultaneously or within a predetermined time. In this case, as shown in the second operation pattern (b) of FIG. 15, the time for the substrate transport mechanism 13 to move from the retreat position to the transport position X1 is calculated. This movement time may be calculated in advance and stored in the memory. The movement time for the upper mold 51 to move from the clamping position Q to the ejection position R is calculated in advance. Then, the slide operation of the upper mold 51 is performed in accordance with the time when the substrate transport mechanism 13 reaches the transport position X1. As a result, the upper mold 51 reaches the ejection position R at the same time as the substrate transport mechanism 13 reaches the transport position X1. In addition, after the substrate W is supplied from the substrate transport mechanism 13, the slide operation of the upper mold 51 from the ejection position R to the clamping position Q and the operation of the substrate transport mechanism 13 from the transport position X1 to the retreat position are started simultaneously or at a predetermined timing. In this way, by completing the first movement operation of the substrate transport mechanism 13 and the first sliding operation of the upper mold 51 simultaneously or within a specified time, the takt time of the resin molding apparatus 100 can be shortened, and the productivity of the resin molding apparatus 100 can be improved.

As another example of a mode in which the first sliding operation is performed so as to overlap at least a portion of the period of the first moving operation, the sliding movement of the upper mold 51 may be started before the substrate transport mechanism 13 reaches the transport position X1, and the substrate transport mechanism 13 may reach the transport position X1 before the upper mold 51 reaches the ejection position R. In other words, the substrate transport mechanism 13 may reach the transport position X1 while the upper mold 51 is moving from the mold clamping position Q to the ejection position R. Even with this configuration, the time that the upper mold 51 remains at the ejection position R can be shortened, a decrease in the temperature of the upper mold 51 can be prevented, and contamination of the upper mold 51 or the resin molded product P (such as adhesion or inclusion of foreign matter) can be prevented.

Alternatively, the upper die 51 may start sliding before the substrate transport mechanism 13 reaches the transport position X1, and the substrate transport mechanism 13 may reach the transport position X1 after the upper die 51 reaches the ejection position R.

<1-5-4. Sliding Operation of the Lower Die 52 and Moving Operation of the Resin Material Conveying Mechanism 18>
The second movement operation of the resin material transport mechanism 18 to the transport position X2 where the release film F and the resin material J are transferred, i.e., transported, to the lower mold 52 at the ejection position R is started prior to the second sliding operation of the mold slide mechanism 20 to the ejection position R of the lower mold 52, or the second sliding operation is performed so as to overlap with at least a portion of the period of the second movement operation.

Performing the second sliding motion so as to overlap at least a portion of the period of the second moving motion means that the second moving motion and the second sliding motion are performed simultaneously for at least a portion of the period, or that there is a period during which the second moving motion and the second sliding motion are performed simultaneously.

Specifically, as shown in the first operation pattern (a) of FIG. 17 and FIG. 18, it is possible to perform the second sliding operation after the second moving operation is completed. That is, after the resin material transport mechanism 18 moves to the transport position X2 (see FIG. 18(a)), the mold slide mechanism 20 starts sliding the lower mold 52 and moves it to the ejection position R (see FIG. 18(b)). In addition, the film recovery unit 182 of the resin material transport mechanism 18 recovers the used release film F from the lower mold 52 at the ejection position R (see FIG. 18(c)). In addition, the resin material supply unit 181 of the resin material transport mechanism 18 supplies the release film F and resin material J before use to the lower mold 52 at the ejection position R (see FIG. 18(d)). After the release film F and resin material J before use are supplied from the resin material transport mechanism 18 to the lower mold 52, the mold slide mechanism 20 starts sliding the lower mold 52 and moves it to the mold clamping position Q (see FIG. 18(e)). After the lower mold 52 moves to the mold clamping position Q, the resin material transport mechanism 18 retreats from the transport position X2 to the retreat position. By moving the resin material transport mechanism 18 to the transport position X2 in advance in this way, the time that the lower mold 52 remains at the protruding position R can be shortened, a drop in the temperature of the lower mold 52 can be prevented, and contamination of the lower mold 52 (such as the adhesion or inclusion of foreign matter) can be prevented.

It is also possible to complete the second moving operation and the second sliding operation simultaneously or within a predetermined time. In this case, as shown in the second operation pattern (b) of FIG. 17, the time for the resin material conveying mechanism 18 to move from the retreat position to the conveying position X2 is calculated. This moving time may be calculated in advance and stored in the memory. The moving time for the lower die 52 to move from the clamping position Q to the ejection position R is calculated in advance. Then, the sliding operation of the lower die 52 is performed in accordance with the time when the resin material conveying mechanism 18 reaches the conveying position X2. As a result, the lower die 52 reaches the ejection position R at the same time as the resin material conveying mechanism 18 reaches the conveying position X2. In addition, after the release film F and the resin material J are supplied from the resin material conveying mechanism 18, the sliding operation of the lower die 52 from the ejection position R to the clamping position Q and the operation of the resin material conveying mechanism 18 from the conveying position X2 to the retreat position are started or at a predetermined timing. In this way, by completing the second movement operation of the resin material transport mechanism 18 and the second sliding operation of the lower die 52 simultaneously or within a specified time, the takt time of the resin molding device 100 can be shortened, and the productivity of the resin molding device 100 can be improved.

As another example of a mode in which the second sliding operation is performed so as to overlap at least a portion of the period of the second moving operation, the lower mold 52 may start sliding before the resin material conveying mechanism 18 reaches the conveying position X2, and the resin material conveying mechanism 18 may reach the conveying position X2 before the lower mold 52 reaches the ejection position R. In other words, the resin material conveying mechanism 18 may reach the conveying position X2 while the lower mold 52 is moving from the mold clamping position Q to the ejection position R. Even with this configuration, the time that the lower mold 52 remains at the ejection position R can be shortened, a decrease in the temperature of the lower mold 52 can be prevented, and contamination of the lower mold 52 (such as adhesion or inclusion of foreign matter) can be prevented.

Alternatively, the resin material transport mechanism 18 may start sliding the lower die 52 before it reaches the transport position X2, and the resin material transport mechanism 18 may reach the transport position X2 after the lower die 52 reaches the ejection position R.

<1-6. Effects of the first embodiment>
According to the resin molding apparatus 100 of the present embodiment, the first movement operation of the substrate transport mechanism 13 to the transport position X1 where the pre-molding substrate W and the resin molded product P are transported to the upper mold 51 at the ejection position R is started before the first slide operation to the ejection position R by the mold slide mechanism 20, or the first slide operation is performed so as to overlap with at least a part of the period of the first movement operation, so that the time during which the upper mold 51 remains at the ejection position R can be shortened. As a result, the temperature drop of the upper mold 51 at the ejection position R can be prevented, and the temperature of the upper mold 51 can be easily maintained. In addition, the contamination of the upper mold 51 can be reduced, or the tact time can be shortened. Therefore, the resin molded product P can be manufactured while satisfying conditions such as maintaining the temperature of the upper mold 51, reducing the contamination of the upper mold 51, or shortening the tact time.

In addition, the second movement operation of the resin material conveying mechanism 18 to the conveying position X2 where the release film F and the resin material J are conveyed to the lower die 52 at the ejection position R is started before the second sliding operation to the ejection position R by the mold slide mechanism 20, or the second sliding operation is performed so as to overlap with at least a portion of the period of the second movement operation, so that the time during which the lower die 52 remains at the ejection position R can be shortened. As a result, a decrease in the temperature of the lower die 52 at the ejection position R can be prevented, and the temperature of the lower die 52 can be easily maintained. In addition, contamination of the lower die 52 can be reduced, or the takt time can be shortened. Therefore, the resin molded product P can be manufactured while satisfying conditions such as maintaining the temperature of the lower die 52, reducing contamination of the lower die 52, or shortening the takt time.

Furthermore, when the mold slide mechanism 20 slides the molds 5a, 5b between the mold clamping position Q and the ejection position R, the distance between the opposing surfaces of the base members 2-4 and the molds 5a, 5b is changed, so that the opposing surfaces of the base members 2-4 and the molds 5a, 5b can be separated when sliding. As a result, wear caused by the sliding of the molds 5a, 5b can be reduced. In addition, by moving the molds 5a, 5b to the ejection position R, the objects to be transported (pre-molding substrate W, resin molded product P, release film F, and resin material J) can be transported to the molds 5a, 5b at the ejection position R. As a result, there is no need to increase the distance between the molds 5a, 5b when the molds are opened, and the resin molding device 100 can be made low-profile.

The connecting mechanism 82 that connects the cross link portion 811 of the pantograph mechanism 81 and the intermediate plate 4 has a connecting member 821 connected to the cross link portion 811, a connecting member 822 that connects the connecting member 821 to the intermediate plate 4, and elastic members 823a, 823b interposed between the connecting member 821 and the connecting member 822, so that it is possible to absorb variations in the thickness, etc. of the substrate W in each molding die 5a, 5b.

For example, even if there is variation in the thickness of the pre-molded substrate W held by the upper die 51 of the first molding die 5a and the thickness of the pre-molded substrate W held by the upper die 51 of the second molding die 5b, the elastic members 823a, 823b can elastically deform and clamp the mold while absorbing the variation in the thickness, etc., of the pre-molded substrate W. As a result, in the resin molding device 100 that clamps multiple molding dies 5a, 5b, it is possible to perform resin molding by absorbing the variation in the thickness, etc. of the pre-molded substrate W in each molding die 5a, 5b while synchronizing the clamping of the multiple molding dies 5a, 5b.

In addition, the pantograph mechanism 81 is used to link the elevation of the movable platen 3 with the elevation of the intermediate plate 4, which prevents each component from becoming larger and keeps the entire device from becoming larger, and also makes highly rigid components unnecessary.

2. Second embodiment of the present invention
Next, a second embodiment of the present invention will be described. Note that, in the following, only the parts different from the first embodiment will be described, and the same members will be denoted by the same reference numerals.

Unlike the first embodiment (which has two sets of molding dies using one intermediate plate 4), the resin molding apparatus 100 of the second embodiment has multiple sets of molding dies using multiple intermediate plates 4. For example, it may have three sets of molding dies using two intermediate plates 4, four sets of molding dies using three intermediate plates 4, five sets of molding dies using four intermediate plates 4, or six or more sets of molding dies using five or more intermediate plates 4.

Specifically, as shown in FIG. 19, the resin molding device 100 has multiple intermediate plates 4 arranged vertically between a fixed platen 2 and a movable platen 3. In addition, molding dies 5b, 5c including an upper die 51 and a lower die 52 are provided between each of the multiple intermediate plates 4. Note that FIG. 19 illustrates the configuration from the fixed platen 2 to the three intermediate plates 4, and the portion below that is omitted.

As in the first embodiment, each of the multiple intermediate plates 4 is connected to each of the multiple cross link portions 811 of the pantograph mechanism 81 via a connecting mechanism 82. As a result, the multiple intermediate plates 4 rise and fall in conjunction with the rise and fall of the movable platen 3.

Here, as shown in FIG. 20, the pantograph mechanism 81 is composed of a number of cross link parts 811 corresponding to the number of intermediate plates 4, an upper end link part 812, and a lower end link part 813. The multiple cross link parts 811 are connected in series. Specifically, in adjacent cross link parts 811, the upper end part of the first link 81a of one cross link part 811 is rotatably connected to the upper end part of the second link 81b of the other cross link part 811 by a rotating shaft 81l, and the upper end part of the second link 81b of one cross link part 811 is rotatably connected to the upper end part of the first link 81a of the other cross link part 811 by a rotating shaft 81m. The configurations of the upper end link part 812 and the lower end link part 813 are the same as those in the first embodiment.

The side plates 41 connected to each of the multiple intermediate plates 4 are arranged so as to be shifted horizontally so as not to interfere with each other. Specifically, as shown in FIG. 19, the side plates 41 of adjacent intermediate plates 4 in the vertical direction are arranged so as to be shifted left and right (horizontally) and alternate.

For example, the side plate 41a of the first intermediate plate 4 from the top is positioned on the inside, and the side plate 41b of the second intermediate plate 4 from the top is positioned on the outside. The side plate 41b of the second intermediate plate 4 from the top is positioned on the outside, and the side plate 41c of the third intermediate plate 4 from the top is positioned on the inside. Here, the side plate 41b of the second intermediate plate 4 from the top has a through hole or cutout portion (not shown) formed over the movement range of the linear motion block 842 so as not to impede the movement of the linear motion block 842 arranged on the inner side plates 41a and 41c (first and third from the top).

2-1. Effects of the Second Embodiment
According to the resin molding apparatus 100 of this embodiment, in addition to the effects of the first embodiment, three or more molding dies 5a to 5c can be used for resin molding, improving the productivity of the resin molded products P. Furthermore, since the side plates 41 of the multiple intermediate plates 4 are shifted in the horizontal direction so as not to interfere with each other, the height dimension of the resin molding apparatus 100 can be reduced.

3. Other Modified Embodiments
The present invention is not limited to the above-described embodiment.

For example, in the configurations of Figures 2 and 3, a separate base member may be provided between the fixed platen 2 and the upper die 51 of the mold 5a, between the intermediate plate 4 and the lower die 52 of the mold 5a, between the intermediate plate 4 and the upper die 51 of the mold 5b, or between the movable platen 3 and the lower die 52 of the mold 5b.

In addition, in the above embodiment, the connecting member 822 extends outward from the front and rear of the side wall members 61 and 62. However, as shown in FIG. 21, the connecting member 822 and the connecting member 821 may be connected through a through-hole 6H formed in the side wall members 61 and 62.

Specifically, a through-hole 6H is formed in the side wall members 61, 62 at a portion corresponding to the cross link portion 811. Here, the through-hole 6H is formed so as not to interfere with the movement of the connecting member 822, taking into consideration the amount of movement of the intermediate plate 4. The connecting member 822 is connected to the side plate 41 of the intermediate plate 4, and extends to the outside of the side wall members 61, 62 through the through-hole 6H of the side wall members 61, 62, and supports elastic members 823a, 823b (displacement absorbing mechanisms 83a, 83b) on the outside of the side wall members 61, 62. The connecting member 822 is connected to the connecting member 821 by the elastic members 823a, 823b (displacement absorbing mechanisms 83a, 83b).

A guide mechanism 84 is provided between the connection member 821 and the coupling member 822. Specifically, the guide mechanism 84 has a linear rail 841 provided on one of the connection member 821 or the coupling member 822, and a linear block 842 provided on the other of the connection member 821 or the coupling member 822.

The multiple molding dies used in the first and second embodiments may be the same as each other, or may be different from each other. Here, when the multiple molding dies are different from each other, it may be that the upper dies are different from each other, or the lower dies are different from each other.

In the above embodiment, the linear rail 71 of the lifting slide mechanism 7 is provided on the side wall members 61 and 62, and the linear block 72 is provided on the side plate 41. However, the linear rail 71 of the lifting slide mechanism 7 may be provided on the side plate 41, and the linear block 72 may be provided on the side wall members 61 and 62.

In the above embodiment, the multiple forming dies 5a, 5b are linked using a pantograph mechanism 81, but other types of lifting and lowering linkage mechanisms 8 using lever mechanisms (Patent Publication No. 2019-77144), rack and pinion mechanisms (Patent Publication No. 2010-094931), etc. may also be used.

For example, as shown in FIG. 22(a), the lifting and lowering interlocking mechanism 8 using a lever mechanism has an arm 60 that rotates around one end of the arm 60a, and the movable platen 3 and intermediate plate 4 are connected to different positions of the arm 60 via connecting members 70a and 70b. When the movable platen 3 is driven by the mold clamping mechanism 10, the arm 60 rotates around the fulcrum 60a, and the intermediate plate 4 connected to the arm 60 moves up and down in conjunction with the movable platen 3.

As shown in FIG. 22(b), the lifting interlocking mechanism 8 using a rack and pinion mechanism has a pair of rack gears 80a, 80b and a pinion gear 80c that meshes with the rack gears 80a, 80b, with one rack gear 80a provided on the side wall members 61, 62 and the other rack gear 80b provided on the movable platen 3 side. The pinion gear 80c that meshes with the pair of rack gears 80a, 80b is provided on the intermediate plate 4 side. By rotating the pinion gear 80c forward or backward by a motor (not shown), the movable platen 3 and intermediate plate 4 move up and down in an interlocking manner.

The mold in the above embodiment has multiple sets of upper dies 51 and lower dies 52, but it may have a single set of upper dies 51 and lower dies 52. In this case, the base members are the fixed platen 2 and the movable platen 3. The upper die 51 slides in a sliding direction that intersects with the mold clamping direction relative to the fixed platen 2 by the mold slide mechanism 20. The lower die 52 slides in a sliding direction that intersects with the mold clamping direction relative to the movable platen 3 by the mold slide mechanism 20.

It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the invention.

100: Resin molding apparatus W: Molding object P: Resin molded product (molding object molded from resin)
J: Resin material F: Release film 2: Fixed platen (base member)
3... Movable platen (base member)
4... Intermediate plate (base member)
5a, 5b, 5c...Mold 51...Upper mold 52...Lower mold 61, 62...Pair of side wall members 7...Lifting slide mechanism 81...Pantograph mechanism 82...Connecting mechanism 10...Mold clamping mechanism 13...Substrate transport mechanism (molding object transport mechanism)
X1: Transport position 131: Substrate supply section (molding object supply section)
132: Substrate receiving section (molding object receiving section)
18: Resin material transport mechanism X2: Transport position 181: Resin material supply section 182: Film recovery section 20: Mold slide mechanism 201 (201a, 201b): Support frame Q: Mold clamping position R: Ejection position 203: Drive actuator 207: Positioning section 30: Distance change mechanism 301: Cam mechanism

Claims (12)

a mold clamping mechanism that clamps the molding die via the base member;
a mold slide mechanism that slides the mold between a mold clamping position where the mold is clamped and a protruding position that is located outside the base member in a slide direction that intersects with the mold clamping direction;
a gap change mechanism that changes the gap between the opposing surfaces of the base member and the mold when the mold is slid between the mold clamping position and the ejection position by the mold slide mechanism. The mold has an upper mold and a lower mold,
the mold slide mechanism is provided corresponding to each of the upper mold and the lower mold,
The resin molding apparatus according to claim 1 , wherein the gap changing mechanism is provided corresponding to each of the upper mold and the lower mold. The resin molding device according to claim 1 or 2, wherein the mold slide mechanism and the gap change mechanism are configured using a common drive actuator. The mold slide mechanism includes:
A support frame for supporting the mold;
a drive actuator that moves the support frame in the sliding direction,
The interval change mechanism includes:
a cam mechanism interposed between the mold and the base member,
3. The resin molding apparatus according to claim 1, wherein the cam mechanism changes a distance between the opposing surfaces of the molding die and the base member in response to movement of the support frame by the drive actuator. the gap change mechanism keeps the opposing surfaces of the molding die and the base member in a gap state without contacting each other at the mold clamping position,
The resin molding apparatus according to claim 1 , wherein the mold clamping mechanism clamps the mold so that opposing surfaces of the molding die and the base member come into contact with each other. The resin molding device according to any one of claims 1 to 5, wherein the mold slide mechanism has a positioning part that contacts the mold moving toward the mold clamping position and positions the mold at the mold clamping position. The base member is
A fixed platen;
a movable platen that can be raised and lowered by the mold clamping mechanism;
an intermediate plate disposed between the fixed platen and the movable platen;
the mold has an upper mold and a lower mold provided between the fixed platen and the intermediate plate, and between the intermediate plate and the movable platen, respectively;
The resin molding device includes:
a pair of sidewall members disposed on both sides of the movable platen and the intermediate plate;
a lifting and lowering slide mechanism that slides the intermediate plate in a vertical direction relative to the pair of side wall members;
a lifting/lowering interlocking mechanism that links the lifting/lowering of the intermediate plate with the lifting/lowering of the movable platen,
The lifting and lowering interlocking mechanism is
a pantograph mechanism having one end fixed to the side wall member and another end moving together with the movable platen and extending and contracting in response to the elevation and lowering of the movable platen;
The resin molding apparatus according to claim 1 , further comprising a connecting mechanism that connects the cross link portion of the pantograph mechanism and the intermediate plate. The resin molding device according to any one of claims 1 to 7, further comprising a transport mechanism for transporting an object to be transported to the mold in the ejection position. The transport mechanism includes:
a molding object transport mechanism that transports a molding object to the molding mold at the ejection position;
The resin molding apparatus according to claim 8 , further comprising a resin material transport mechanism that transports the resin material to the molding die in the ejection position. The molding object transport mechanism includes:
a molding object supply unit that supplies the molding object to the molding die at the ejection position;
The resin molding apparatus according to claim 9 , further comprising a molding object receiving section that receives the resin-molded object from the molding die in the ejection position. The resin material conveying mechanism includes:
a resin material supplying section that supplies the resin material to the molding die at the ejection position;
The resin molding apparatus according to claim 9 or 10, further comprising a film recovery section that recovers a used release film from the molding mold in the ejection position. A method for manufacturing a resin molded product, comprising the steps of:
a conveying step of conveying an object to be molded to the mold at the ejection position;
a resin molding process in which the molding die is clamped at the mold clamping position to perform resin molding on the molding object;
and removing the resin-molded object from the mold at the ejection position.