JP2024142073A - Film forming apparatus, foreign matter removing apparatus, molding apparatus, film forming method, foreign matter removing method, molding method, and article manufacturing method - Google Patents

Abstract

To provide a technique advantageous for reducing the protrusion of a composition from an outer edge of a member while a plate is being pressed to the composition on the member.SOLUTION: A film formation device which performs processing for forming a hardened film of a composition between a plate and a member comprises a light irradiation unit which irradiates the member with light which hardens the composition and a control unit which controls the processing. The processing includes a pressing step of pressing the plate to the liquid-state composition supplied onto a first face of the member and a hardening step of hardening the composition which passes the pressing step and is disposed between the plate and the member. The light irradiation unit includes a first light irradiation section which irradiates the first face with light and a second light irradiation section which irradiates at least a peripheral edge of a second face at an opposite side of the first face in the member with light. The control unit performs the pressing step in a state where the second face is irradiated with the light in such a manner that a part of the light from the second light irradiation section passes outside of the member.SELECTED DRAWING: Figure 4

Description

The present invention relates to a film forming device, a foreign matter removal device, a molding device, a film forming method, a foreign matter removal method, a molding method, and an article manufacturing method.

Recently, with the progress of miniaturization of patterns in the manufacture of semiconductor devices, etc., it is desired to remove even very small particles (e.g., tens of nm or less) from semiconductor substrates and other components when cleaning the components. As a method for cleaning substrates, a method of removing particles from components using an imprint method without using chemicals or the like is attracting attention. As an example, Patent Document 1 describes a method of removing particles from a template by pressing a template against a resin applied to a dummy wafer, hardening the resin, and then separating the template from the resin to remove particles from the template. Patent Document 2 describes a method of removing particles by contacting a planarizing member with a resin applied to a mold from which particles are to be removed to form a resin film, hardening the resin film, peeling the planarizing member from the resin film, and then peeling the resin film from the mold.

Patent No. 5121549 Patent No. 5982996 Patent No. 5535164

In such a foreign matter removal method using an imprinting method, in order to remove foreign matter adhering to the edge of a component, it is required to spread a composition such as a resin to the outer periphery (edge) of the component and form a cured film of the composition to the outer periphery of the component. Also, in a molding device (imprinting device, planarizing device) that molds the composition on the component, it may be required to form a cured film of the composition to the outer periphery of the component. However, if the composition overflows from the outer periphery of the component when spreading the composition to the outer periphery of the component, the composition may adhere to the back surface of the component or the holding mechanism that holds the component. In other words, the back surface of the component and the holding mechanism will be contaminated by the composition.

Patent Document 3 describes a method for preventing resin from spreading outside a light irradiation area in an imprinting apparatus by irradiating light to the light irradiation area including the boundary between the outermost peripheral area of a substrate and a pattern formation area. However, this method can make it difficult to spread the composition (resin) to the part of the member (substrate) outside the light irradiation area and form a cured film of the composition in that part.

The present invention aims to provide an advantageous technique for reducing the overflow of the composition from the outer edge of a component when a plate is pressed against the composition on the component.

In order to achieve the above object, the film forming apparatus according to one aspect of the present invention is a film forming apparatus that performs a process of forming a cured film of a composition between a plate and a member, and includes a light irradiation unit that irradiates the member with light that cures the composition, and a control unit that controls the process. The process includes a pressing process of pressing the plate against the liquid composition supplied onto a first surface of the member, and a curing process of curing the composition disposed between the plate and the member after the pressing process. The light irradiation unit includes a first light irradiation unit that irradiates light onto the first surface, and a second light irradiation unit that irradiates light onto at least the periphery of a second surface of the member opposite the first surface. The control unit performs the pressing process in a state in which the second light irradiation unit irradiates light onto the second surface so that a portion of the light from the second light irradiation unit passes outside the member, and performs the curing process by irradiating the light from the first light irradiation unit onto the composition on the first surface.

Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments thereof with reference to the accompanying drawings.

The present invention can provide an advantageous technique for reducing overflow of a composition from the outer edge of a component when, for example, a plate is pressed against the composition on the component.

1 is a flowchart showing a foreign matter removal process according to a first embodiment; FIG. 2 is a schematic diagram for explaining the foreign matter removal process of the first embodiment in chronological order; Diagram to explain the issues in the pressing process FIG. 1 is a schematic diagram showing a configuration example of a foreign matter removal device according to a first embodiment; FIG. 1 is a diagram showing an example of the configuration of a first light irradiation unit and a second light irradiation unit in a first embodiment; FIG. 13 is a diagram showing an example of the configuration of a first light irradiation unit and a second light irradiation unit in a second embodiment; FIG. 13 is a diagram showing an example of the configuration of a first light irradiation unit and a second light irradiation unit in the third embodiment; A diagram for explaining a method for manufacturing an article

The following embodiments are described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe multiple features, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicate explanations are omitted.

In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the direction parallel to the upper surface (first surface) of the member on which the cured film of the composition is formed is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, the Y direction, and the Z direction, respectively, and the rotation around the X-axis, the Y axis, and the Z axis are θX, θY, and θZ, respectively. Control and drive (movement) about the X-axis, Y-axis, and Z-axis respectively refer to control or drive (movement) about the direction parallel to the X-axis, the direction parallel to the Y axis, and the direction parallel to the Z axis. In addition, control or drive about the θX-axis, θY-axis, and θZ-axis respectively refer to control or drive about the rotation around the axis parallel to the X-axis, the axis parallel to the Y axis, and the axis parallel to the Z axis.

First Embodiment
A film forming method according to a first embodiment of the present invention will be described. The film forming method is a method for forming a cured film of a composition between a plate and a member. In this embodiment, an example of applying the film forming method to a foreign matter removal method for removing foreign matter on a member using a plate will be described.

[Foreign matter removal method]
The foreign matter removal method of this embodiment will be described below with reference to Figs. 1 and 2. In the foreign matter removal method of this embodiment, a foreign matter removal process is carried out to remove foreign matter on a member using a plate. The foreign matter removal process includes a film formation process to form a cured film of a composition between the plate and the member. Fig. 1 is a flowchart showing the foreign matter removal process of this embodiment. Fig. 2 is a schematic diagram for explaining the foreign matter removal process of this embodiment in chronological order. Note that the examples shown in Figs. 1 and 2 are merely representative examples, and the present invention is not limited to the examples shown in Figs. 1 and 2.

First, in step S11 (preparation process), a target member 1 from which foreign matter is to be removed is prepared. Hereinafter, the target member 1 from which foreign matter is to be removed may be referred to as the "target member 1." The preparation process may be understood as a process of carrying the target member 1 into a foreign matter removal device that removes foreign matter on the target member 1. An example of the configuration of the foreign matter removal device will be described later.

The target member 1 may be, for example, a substrate on which a pattern is formed by a lithography process for manufacturing a semiconductor device or a flat panel display. Examples of the substrate include a semiconductor wafer or MEMS wafer on which a pattern is formed, a power semiconductor wafer, a glass substrate (glass plate) for a display, and a bioelement. In this embodiment, an example in which a substrate is used as the target member 1 is described, but the target member 1 may also be an original plate used to form a pattern on a substrate in a lithography process. Examples of the original plate include an EUV exposure mask, a semiconductor exposure mask, a semiconductor imprint mold (template), a MEMS exposure mask, a power semiconductor exposure mask, and a display exposure mask. Note that MEMS is an abbreviation for Micro Electro Mechanical System, and EUV is an abbreviation for Extreme Ultraviolet.

As shown in FIG. 2(a), the target member 1 has a central portion 1a (pattern portion) having an uneven pattern 3 with recesses and protrusions, and a peripheral portion 1b surrounding the central portion 1a. The peripheral portion 1b may be a portion where bevel processing (e.g., chamfering processing) is performed. Foreign matter 2 of various sizes is attached to the uneven pattern 3 (the upper surface of the protrusions and the inside of the recesses) formed in the central portion 1a of the target member 1 and to the peripheral portion 1b of the target member 1. In particular, it is difficult to remove extremely small foreign matter having a particle diameter of 30 nm or less and foreign matter attached to the recesses of the uneven pattern 3 by conventional cleaning methods such as megasonic cleaning and two-fluid cleaning. Hereinafter, the surface of the target member 1 on which the uneven pattern 3 is formed, i.e., the surface 1c (first surface) on which the foreign matter removal process is performed, may be referred to as the "front surface 1c", and the surface 1d (second surface) opposite to the surface 1c (first surface) may be referred to as the "rear surface 1d".

Next, in step S12 (supply step), as shown in FIG. 2(b), a composition 4 for capturing and encapsulating foreign matter 2 on the target member 1 is supplied onto the surface 1c (first surface) of the target member 1. The composition 4 is supplied onto the target member 1 in a fluid state (i.e., in a liquid state). From the viewpoint of avoiding the composition 4 spilling out of the target member 1 (peripheral portion 1b), it is preferable that the composition 4 is not supplied onto the peripheral portion 1b of the target member 1, that is, is supplied only to the central portion 1a (pattern portion) of the target member 1, i.e., to the portion other than the peripheral portion 1b.

As the composition 4, a photocurable composition that is cured by irradiation with curing light is used. The photocurable composition contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The polymerizable compound is a compound that reacts with a polymerization factor (radical, etc.) generated from the photopolymerization initiator to form a film made of a polymer compound by a chain reaction (polymerization reaction). For example, a radical polymerizable compound is an example of such a polymerizable compound, and it is preferably a compound having one or more acryloyl groups or methacryloyl groups, that is, a (meth)acrylic compound. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The viscosity of the composition 4 (viscosity at 25°C) is, for example, 1 mPa·S or more and 100 mPa·S or less.

In this embodiment, the composition 4 can be supplied (applied) onto the target member 1 using a device that ejects the composition 4 by an inkjet method. However, the method of supplying (applying) the composition 4 onto the target member 1 is not limited to the inkjet method, and any method can be used as long as it can control the amount of the composition 4 supplied onto the target member 1 (for example, the coating film thickness of the composition 4). For example, the composition 4 may be supplied onto the target member 1 using dispenser application, spin application, various printing methods such as screen, gravure, and offset printing, dipping application, etc.

The amount of composition 4 supplied onto the target member 1 may be determined based on the size of the foreign matter 2 adhering to the target member 1 so that the film thickness of the composition 4 formed on the target member 1 through the subsequent pressing process is thicker than the size of the foreign matter 2. The size of the foreign matter 2 may be a measured value obtained by measuring the size of the foreign matter 2 adhering to the target member 1 in advance, or may be a predicted value obtained from calculations based on past experience.

Here, it is preferable that the surface 1c of the target member 1 has as high wettability as possible so that air bubbles are not trapped between the target member 1 and the composition 4, and so that the composition 4 can easily spread over the target member 1. In other words, it is preferable to make the contact angle between the target member 1 and the composition 4 as small as possible. The allowable range of the contact angle is preferably 2 degrees or less, and more preferably 1 degree or less.

Therefore, before the supplying step (step S12), a process (lyophilic process) for making the surface 1c of the target member 1 lyophilic to the composition 4 may be performed on the target member 1. The lyophilic process includes a process for removing organic contaminants on the target member 1. Examples of the lyophilic process include baking, plasma ashing, atmospheric pressure plasma process, and alkaline or ozone water cleaning. In this embodiment, atmospheric pressure plasma process, which can be realized with a simple device configuration, can be used as the lyophilic process. If the target member 1 is sufficiently lyophilic, the lyophilic process can be omitted. When performing the lyophilic process, it is preferable to select the amount of etching so as to remove the contaminants of the extreme surface layer without damaging the surface layer of the target member 1. In this way, by supplying the composition 4 onto the target member 1 after making the surface 1c of the target member 1 lyophilic in advance, the composition 4 can be easily penetrated by capillary force into the narrow channel (gap) between the target member 1 and the foreign matter 2 adhering thereto. The lyophilic treatment may be performed by an external device of the foreign matter removal device before the preparation step (step S11), for example, before the target member 1 is carried into the foreign matter removal device. Also, a separation layer (e.g., fluorine-based) may be formed on the target member 1 before the supply step (step S12) to facilitate separation (peeling) of the target member 1 and the composition 4 in the subsequent separation step (step S15).

Next, in step S13 (pressing step), a plate 5 (template) is pressed against the liquid composition 4 supplied onto the surface 1c of the target member 1 so that the composition 4 spreads over the target range of the target member 1. Specifically, in the pressing step, as shown in FIG. 2(c), the plate 5 is brought into contact with the composition 4 supplied onto the target member 1 in the supplying step, and then, as shown in FIG. 2(d), the plate 5 presses the composition 4 on the target member 1 so that the composition 4 spreads over the target range of the target member 1 and the foreign matter 2 within the target range is taken into the composition 4. The pressing step can be performed by a driving mechanism (driving unit) that drives the target member 1 and the plate 5 relatively.

2(c)-(d), the pressing step of this embodiment is performed in a state in which light 6 for hardening the composition 4 is irradiated to at least the peripheral portion 1b of the back surface 1d of the target member 1 so that part of the light 6 passes outside the outer edge of the target member 1. That is, in the pressing step of this embodiment, the light 6 is irradiated to the target member 1 (peripheral portion 1b) from the back surface 1d side so that part of the light 6 passes outside the target member 1. This makes it possible to harden the composition 4 that exceeds the outer edge of the target member 1 by the light 6 passing outside the target member 1, and to prevent the composition 4 from spilling out from the outer edge of the target member 1. In other words, it is possible to reduce the possibility that the composition 4 that spills out from the outer edge of the target member 1 will adhere to the back surface 1d of the target member 1 or the holding mechanism (stage) that holds the target member 1, thereby contaminating them.

The target member 1 can also be made of a material that does not transmit the light that hardens the composition 4. Therefore, the light 6 irradiated to the back surface 1d of the target member 1 is blocked by the target member 1 and is not irradiated to the composition 4 on the front surface 1c of the target member 1. In other words, the light 6 does not harden the composition 4 on the front surface 1c of the target member 1 in the pressing process, and does not prevent the composition 4 from spreading over the target range of the target member 1 (i.e., to the outer edge of the target member 1).

The target area of the target member 1 is the area where foreign matter should be removed, and may include at least a part of the peripheral area 1b in addition to the central area 1a (pattern area). In this embodiment, the target area is set to an area including the entire peripheral area 1b, that is, the entire surface 1c of the target member 1. The plate 5 is a member (second member) that acts as a handle for spreading the composition 4 supplied onto the target member 1 in the supplying step on the target member 1, and for separating the composition 4 hardened from the target member 1 in the hardening step described below. The plate 5 is preferably configured to be larger than the target area of the target member 1 in order to effectively remove (clean) foreign matter from the outer edge and the entire peripheral area 1b of the target member 1.

In the pressing step, as shown in FIG. 3(a), if the plate 5 is pressed against the composition 4 on the target member 1 while the plate 5 and the target member 1 are tilted relative to each other, it may be difficult to spread the composition 4 over the entire target area of the target member 1. As a result, as shown in FIG. 3(b), foreign matter 2 may remain on the target member 1 (e.g., peripheral portion 1b) even after the separation step described below.

Therefore, in the pressing process of this embodiment, the parallelism between the plate 5 and the target member 1 and the pressing force of the plate 5 against the composition 4 on the target member 1 can be controlled so that the composition 4 spreads over the entire target range of the target member 1. For example, the parallelism between the plate 5 and the target member 1 can be controlled by adjusting the relative attitude (relative inclination) between the plate 5 and the target member 1 so that the pressing surface 5a of the plate 5 and the upper surface of the target member 1 are parallel. The pressing surface 5a of the plate 5 is the surface (e.g., the lower surface) that is pressed against the composition 4 on the target member 1. The parallelism and the pressing force can be controlled by a drive mechanism (drive unit) that drives the target member 1 and the plate 5 relatively.

In addition, in the pressing step of this embodiment, as shown in FIG. 2(d), pressing of the plate 5 against the composition 4 on the target member 1 (for example, parallelism and/or pressing force) may be controlled while observing the spread of the composition 4 on the target member 1 by the photographing unit 16. The photographing unit 16 may include, for example, a camera 16a and an observation optical system 16b, and may be configured so that the entire target range of the target member 1 fits within the photographing field of view. This allows the pressing of the plate 5 against the composition 4 of the target member 1 to be controlled so that the composition 4 spreads over the target range of the target member 1. In addition, as with the pressing of the plate 5, the irradiation position, intensity, and irradiation start timing of the light 6 may be controlled according to the spreading state of the composition 4 on the target member 1. For example, when the composition 4 reaches the peripheral portion 1b of the target member 1, irradiation of the light 6 against the target member 1 may be started. Note that the pressing step is not limited to the observation result by the photographing unit 16, and may be controlled by time management.

Next, in step S14 (curing step), as shown in FIG. 2(e), the composition 4 on the target member 1 is irradiated (applied) with light 7 while the composition 4 and the plate 5 are in contact with each other, thereby curing the composition 4. That is, the composition 4 that has been placed between the target member 1 and the plate 5 through the above-mentioned pressing step is irradiated with light 7 through the plate 5, thereby curing the composition 4. As a result, a cured film of the composition 4 that has incorporated the foreign matter 2 on the target member 1 can be formed between the plate 5 and the target member 1. Here, the plate 5 is made of a material that can transmit light (ultraviolet light), such as quartz. In addition, the composition 4 is not limited to a material that is cured by irradiation with ultraviolet light, but may be a material that is cured by polymerization reaction caused by irradiation with other light such as X-rays or visible light. In this embodiment, the composition 4 is a photocurable composition that has the property of being cured by irradiation with light (ultraviolet light). The light 7 is light that cures the composition 4, and may be light of the same wavelength as the light 6 irradiated to the back surface 1d of the target member 1 in the pressing step.

The above pressing step (step S13) and curing step (step S14) are included in the film formation process for forming a cured film of the composition 4 between the plate 5 and the target member 1. The film formation process may also include the supplying step (step S12) and even the preparation step (step S11).

Next, in step S15 (separation process), as shown in FIG. 2(f), the gap between the plate 5 and the target member 1 is widened to separate (peel) the plate 5 from the target member 1 while the composition 4 cured in the curing process is still attached to the plate 5. In other words, while the cured film of the composition 4 containing the foreign matter 2 is still attached to the plate 5, the plate 5 is separated from the target member 1 together with the cured film of the composition 4. By using such a separation process, the foreign matter 2 on the target member 1 can be removed, i.e., the target member 1 can be cleaned efficiently and simply.

Here, in order to perform the above separation step, the adhesion between the plate 5 and the composition 4 needs to be higher than that between the target member 1 and the composition 4. Therefore, it is preferable to perform a pretreatment on the plate 5 to improve the adhesion between the plate 5 and the composition 4 before the pressing step (step S13). The pretreatment may include a process of forming an adhesive film (adhesive layer) that adheres to the composition 4 on the pressing surface 5a of the plate 5. The pretreatment may be performed by a general thin film formation method such as a spray method, vapor deposition, or spin coating. The pretreatment may be performed by an external device of the foreign matter removal device before the plate 5 is carried into the foreign matter removal device.

In addition, it is preferable that the pressing surface 5a of the plate 5 has as high wettability as possible so that air bubbles are not caught between the plate 5 and the composition 4 in the pressing process and so that the composition 4 can easily spread on the plate 5. In other words, it is preferable to make the contact angle between the plate 5 and the composition 4 on the target member 1 as small as possible in the pressing process. The allowable range of the contact angle between the plate 5 and the composition 4 is preferably 2 degrees or less, more preferably 1 degree or less, and it is preferable that it is about 0.5 to 1 degree smaller than the contact angle between the target member 1 and the composition 4. For example, when a fluorine-based separation layer is formed on the target member 1, the contact angle between the target member 1 and the composition 4 does not satisfy the above-mentioned allowable range, so it is preferable to set the contact angle between the plate 5 and the composition 4 to 1 degree or less to increase the spreading speed of the composition 4 on the plate 5.

Therefore, before the pressing step (step S13), a process (lyophilic process) for making the pressing surface 5a of the plate 5 lyophilic to the composition 4 may be performed on the plate 5. The lyophilic process includes a process for removing organic contaminants on the pressing surface 5a of the plate 5. Examples of the lyophilic process include baking, atmospheric pressure plasma process, ashing process, and alkaline or ozone water cleaning. In this embodiment, atmospheric pressure plasma process, which can be realized with a simple device configuration, can be used as the removal process. By making the pressing surface 5a of the plate 5 lyophilic in this way, the contact angle between the plate 5 and the composition 4 in the pressing step can be reduced, and the composition 4 can be easily spread on the plate 5. The lyophilic process may be performed by an external device of the foreign matter removal device before the plate 5 is carried into the foreign matter removal device.

[Configuration of Foreign Matter Removal Device]
The foreign matter removal device 10 of this embodiment will be described below. FIG. 4 is a schematic diagram showing a configuration example of the foreign matter removal device 10 of this embodiment. The foreign matter removal device 10 of this embodiment is a device that removes foreign matter on a target member 1 by performing the foreign matter removal process described above with reference to FIGS. 1 and 2. The foreign matter removal device 10 may include, for example, a stage 11, a holding unit 12, a supply unit 13, a first processing unit 14, a second processing unit 15, an imaging unit 16, a first light irradiation unit 17, a second light irradiation unit 18, and a control unit 19. The first light irradiation unit 17 and the second light irradiation unit 18 constitute a light irradiation unit that irradiates the target member 1 with light that hardens the composition 4.

The stage 11 is configured to hold the target member 1 from which foreign matter is to be removed by sucking the back surface 1d of the target member 1 with a vacuum force or electrostatic force, and to be movable in the XY direction on the base plate BP. In other words, the stage 11 is a mechanism for holding the target member 1 and driving it in the XY direction. The stage 11 in this embodiment is configured to hold the center (pattern portion 1a) of the back surface 1d of the target member 1 so that the peripheral portion 1b of the back surface 1d of the target member 1 is exposed. With this configuration, the second light irradiation unit 18 can irradiate light 6 to at least the peripheral portion 1b of the back surface c of the target member 1. In this embodiment, the stage 11 is configured to drive the target member 1 only in the XY direction, but may also be configured to drive the target member 1 in the Z direction or in the rotation direction of each axis.

The holding unit 12 is a mechanism that holds the plate 5 by vacuum force or electrostatic force and drives the plate 5 in the Z direction. In this embodiment, the holding unit 12 is configured to drive the plate 5 only in the Z direction, but it may also be configured to drive the plate 5 in the XY direction or the rotational direction of each axis. Here, the stage 11 and the holding unit 12 can form a drive mechanism (drive unit) that drives the target member 1 and the plate 5 relatively.

The supply unit 13 is a mechanism for supplying the liquid composition 4 onto the surface 1c of the target member 1. When the supply unit 13 supplies the composition 4 onto the target member 1, the target member 1 is positioned below the supply unit 13 by the stage 11. The first processing unit 14 is a mechanism for performing a lyophilic treatment on the target member 1. When the first processing unit 14 performs a lyophilic treatment on the target member 1, the stage 11 positions the target member 1 below the first processing unit 14. The second processing unit 15 is a mechanism for performing a pretreatment and a lyophilic treatment on the plate 5. In this embodiment, the second processing unit 15 is supported by a moving mechanism 20 that can move in the XY directions on the base plate BP. When the second processing unit 15 performs a pretreatment and a lyophilic treatment on the plate 5, the moving mechanism 20 positions the second processing unit 15 below the plate 5.

The photographing unit 16 is a mechanism for observing the spread of the composition 4 on the target member 1 during the pressing process. The photographing unit 16 may include, for example, a camera 16a and an observation optical system 16b. In the example of FIG. 4, the photographing unit 16 is configured to photograph the spread of the composition 4 on the target member 1 via the mirror MR and the plate 5.

The first light irradiation unit 17 is a mechanism for irradiating the composition 4 on the surface 1c of the target member 1 with light 7 in the curing process to cure the composition 4. In this embodiment, the first light irradiation unit 17 may include a light source 17a (first light source) that emits light 7 to cure the composition 4, and an optical system 17b that guides the light 7 emitted from the light source 17a to the surface 1c of the target member 1. In the example of FIG. 4, the first light irradiation unit 17 cures the composition 4 by irradiating the composition 4 on the surface 1c of the target member 1 with energy (light 7) via the mirror MR and the plate 5. The mirror MR may be understood as a component of the first light irradiation unit 17.

The second light irradiation unit 18 is a mechanism for irradiating light 6 for hardening the composition 4 to at least the peripheral portion 1b of the back surface 1d of the target member 1 in the pressing step, so that a portion of the light 6 passes outside the target member 1. In this embodiment, the second light irradiation unit 18 may include a light source 18a (second light source) that emits light 6 for hardening the composition 4, and an optical system 18b that guides the light 6 emitted from the light source 18a to the back surface 1d of the target member 1.

The control unit 19 is configured by a computer having a processor such as a CPU or MPU, a logic circuit, and a storage unit such as a memory, and controls each part of the foreign matter removal device 10 to control the foreign matter removal process that removes foreign matter from the target member 1. The control unit 19 may also have a communication unit for communicating with an external device. Note that CPU is an abbreviation for Central Processing Unit, and MPU is an abbreviation for Micro Processing Unit.

[Operation of the Foreign Matter Removal Device]
An example of the operation of the foreign matter removal device 10 of this embodiment will be described below. A series of operations of the foreign matter removal device 10 is executed by the control unit 19 sending signals to each unit.

First, the target member 1 is transported onto the stage 11 by a transport mechanism (not shown), and the target member 1 is held by the stage 11 (preparation step). The target member 1 is then driven by the stage 11 to be positioned below the first processing unit 14, after which the first processing unit 14 performs a lyophilic treatment on the target member 1. The first processing unit 14 can perform a lyophilic treatment that is appropriately selected from baking, plasma ashing, atmospheric pressure plasma treatment, alkaline or ozone water cleaning, etc., which can remove organic contaminants from the target member 1.

Next, the target member 1 is placed below the supply unit 13 by driving the target member 1 with the stage 11, and then the liquid composition 4 is supplied onto the surface 1c of the target member 1 by the supply unit 13 (supply process). The supply unit 13 can supply the composition 4 onto the target member 1 by a method appropriately selected from an inkjet method, a dispenser method, a printing method, etc. In the example of FIG. 4, the first processing unit 14 and the supply unit 13 are provided as components of the foreign matter removal device 10, but the first processing unit 14 and/or the supply unit 13 may be provided as external elements of the foreign matter removal device 10. In this case, the target member 1 that has been subjected to a lyophilic treatment and/or a supply of the composition 4 outside the foreign matter removal device 10 can be carried into the foreign matter removal device 10.

Here, the amount of composition 4 supplied by the supply unit 13 onto the target member 1 will be described. The control unit 19 acquires information indicating the size of the foreign matter adhering to the target member 1 (hereinafter, this may be referred to as foreign matter information). The foreign matter information may include information indicating the representative size of the foreign matter obtained by measuring the size of the foreign matter on the target member 1 using an external inspection device. The representative size of the foreign matter may be, for example, the maximum size or average size of the foreign matter adhering to the target member 1. When there are multiple target members 1, the representative size may be obtained for each target member 1, but from the viewpoint of throughput, the representative size may be obtained from several target members 1 extracted as samples (representatives) from the multiple target members 1. In this case, the maximum size or average size of the foreign matter on the extracted several target members 1 may be used as the representative size.

The control unit 19 also acquires information (hereinafter sometimes referred to as pattern information) indicating the height of the uneven pattern 3 formed on the target member 1. The height of the uneven pattern 3 refers to the height of the convex portions in the uneven pattern 3 (i.e., the depth of the concave portions). The pattern information may be information indicating the measurement results of the height of the uneven pattern 3 of the target member 1, or may be design information for the uneven pattern 3 of the target member 1.

Then, based on the foreign matter information and pattern information, the control unit 19 determines the amount of composition 4 to be supplied so that the thickness (film thickness T) of the liquid film of composition 4 formed between the target member 1 and the plate 5 through the above-mentioned pressing step satisfies the following formula (1). "α" in formula (1) can be set appropriately between 1 and 100, but in this embodiment, α is set to 1.5 in consideration of the curing shrinkage of composition 4 in the curing step and the measurement accuracy of the size of the foreign matter. The control unit 19 controls the supply unit 13 by sending an instruction signal according to the determined amount of composition 4 to be supplied.
T = (maximum size of foreign matter + height of uneven pattern) × α, α > 1 (1)

The plate 5 is transported onto the holding unit 12 by a transport mechanism (not shown) and held by the holding unit 12. Then, after the second processing unit 15 is positioned below the plate 5 by the moving mechanism 20, the plate 5 is pre-processed by the second processing unit 15. The pre-processing is a process for forming an adhesive film (adhesive layer) on the pressing surface 5a of the plate 5 to improve the adhesion between the plate 5 and the composition 4, and may include surface treatments such as silane coupling treatment, silazane treatment, and formation of an organic thin film. When such an adhesive film is formed on the pressing surface 5a of the plate 5, the plate 5 and the composition 4 are brought into close contact in the separation process, and the plate 5 can be efficiently separated from the target member 1 together with the composition 4. In other words, it is possible to efficiently and reliably remove foreign matter from the target member 1. Note that, depending on the components of the composition 4 and the configuration and material of the plate 5, the formation of the adhesive film may be omitted.

The second processing unit 15 can perform a lyophilic treatment on the plate 5. The second processing unit 15 can perform a lyophilic treatment that is appropriately selected from baking, plasma ashing, atmospheric plasma treatment, alkaline or ozone water cleaning, etc., which can remove organic contaminants on the plate 5. If the above-mentioned adhesion layer surface is sufficiently lyophilic, the lyophilic treatment can be omitted. When performing the lyophilic treatment, it is preferable to select the amount of etching so as to remove the contaminants on the extreme surface layer without damaging the adhesion layer. In the example of FIG. 4, the second processing unit 15 is provided as a component of the foreign matter removal device 10, but the second processing unit 15 may be provided as an external element of the foreign matter removal device 10. In this case, the plate 5 that has been subjected to pretreatment and/or lyophilic treatment outside the foreign matter removal device 10 can be carried into the foreign matter removal device 10.

Next, the target member 1 is positioned below the plate 5 by driving the target member 1 with the stage 11, and then the plate 5 is lowered by the holding unit 12 and pressed against the composition 4 on the surface 1c of the target member 1 (pressing process). The time of the pressing process, i.e., the time during which the composition 4 is spread on the target member 1, can be set appropriately according to the material and properties of the composition 4 so that the composition 4 can fully encapsulate the foreign matter within the target area of the target member 1.

In the imprinting process, the pressing (e.g., parallelism and/or pressing force) of the plate 5 against the composition 4 on the surface 1c of the target member 1 can be controlled while observing the uniformity of the spread of the composition 4 on the surface 1c of the target member 1 by the photographing unit 16. For example, the control unit 19 performs known image processing on the image acquired from the photographing unit 16 to detect the outer periphery of the composition 4 and the outer edge (edge) of the target member 1, thereby observing the uniformity of the spread of the composition 4 on the surface 1c of the target member 1. When the control unit 19 detects non-uniformity in the spread of the composition 4, it controls the relative attitude of the plate 5 and the target member 1 and/or the pressing force of the plate 5 by the stage 11 and the holding unit 12 so as to correct the non-uniformity. This makes it possible to uniformly spread the composition 4 over the target range of the target member 1 and to reliably remove foreign matter on the peripheral portion 1b included in the target range.

When the pressing process is started, or when even a part of the composition 4 being spread during the pressing process reaches the peripheral portion 1b of the target member 1, the control unit 19 transmits a light irradiation instruction signal to the second light irradiation unit 18. The spreading state of the composition 4 is detected by the photographing unit 16. In response to receiving the signal, the second light irradiation unit 18 emits light 6 for hardening the composition 4 from the light source 18a as shown in FIG. 5(a). A part of the light 6 emitted from the second light irradiation unit 18 (light source 18a) is irradiated to the peripheral portion 1b of the back surface 1c of the target member 1, and the remainder passes outside the target member 1. This makes it possible to harden the composition 4 that has spread beyond the target range (outer edge) of the target member 1 due to the pressing of the plate 5, and to prevent the composition 4 from spilling out from the outer edge of the target member 1. In other words, it is possible to reduce the possibility that the composition 4 that has spilled out from the outer edge of the target member 1 will adhere to the back surface 1d of the target member 1 or the stage 11 and contaminate them.

Furthermore, in the pressing step, a gas may be introduced from a gas supply nozzle (not shown) provided on the holding part 12 in order to promote the disappearance of bubbles trapped between the plate 5 and the target member 1 and to avoid poor curing of the composition 4 due to oxygen inhibition. Examples of such gas include He, _H2, and mixed gases thereof. However, even if bubbles are trapped between the plate 5 and the composition 4, if there is no problem with the adhesion between the plate 5 and the composition 4, it is not necessary to introduce the gas from the gas supply nozzle.

When the composition 4 spreads over the target area of the target member 1 by the pressing process, a signal instructing the composition 4 to be cured is sent from the control unit 19 to the first light irradiation unit 17. In response to receiving the signal, the first light irradiation unit 17 emits light 7 for curing the composition 4 from the light source 17a, as shown in FIG. 5(b), and irradiates the light 7 onto the composition 4 via the optical system 17b, the mirror MR, and the plate 5 (curing process). This makes it possible to cure the composition 4 that is disposed between the plate 5 and the target member 1 through the pressing process. In other words, a cured film of the composition 4 can be formed between the plate 5 and the target member 1.

The light 7 emitted from the light source 17a of the first light irradiation unit 17 is transmitted through the plate 5 and irradiated onto the composition 4 on the surface 1c of the target member 1. On the other hand, the light 6 emitted from the light source 18a of the second light irradiation unit 18 is blocked by the target member 1 and is not irradiated onto the composition on the surface 1c of the target member 1. In addition, for each of the light sources 17a and 18a, a combination of a material and a wavelength capable of hardening the composition 4 can be appropriately selected. In this embodiment, the plate 5 is made of quartz, the target member 1 is made of silicon (Si), and ultraviolet light with a wavelength of 365 nm is used as the energy emitted from the light sources 17a and 18a. Note that the energy emitted from the light sources 17a and 18a is not limited to ultraviolet light with a wavelength of 365 nm, and visible light, ultraviolet light with a wavelength other than 365 nm, infrared light, X-rays, radiation, electron beams, etc. may be used depending on the material of the plate 5, the composition 4, and the target member 1.

Here, in the curing process, the light intensity and irradiation time of the composition 4 can be appropriately set so that the composition 4 can be sufficiently cured, i.e., so that the composition 4 can be cured to the target hardness. Since the curing speed of the composition 4 can vary depending on the amount of oxygen in the surrounding atmosphere, the amount of oxygen in the surrounding atmosphere can be detected by a sensor or the like, and the light intensity and/or irradiation time can be set based on the detection result.

By the above process, the composition 4 on the target member 1 spreads over the target area of the target member 1 due to capillary force and wettability, absorbing any foreign matter in the target area, and shrinks when hardened, making it separable from the target member 1.

Next, the plate 5 is raised by the holding part 12, and the plate 5 is separated from the target member 1 (separation process). At this time, the plate 5 and the cured film of the composition 4 are in a state of being attached to each other, so that the cured film of the composition 4 is separated from the target member 1 together with the plate 5. The speed at which the plate 5 and the target member 1 are separated can be set so as not to damage the pattern of the target member 1. By separating the plate 5 together with the cured film of the composition 4 from the target member 1 in this way, foreign matter on the target member 1 can be removed efficiently and with a simple process, which can be advantageous in terms of throughput.

Here, when the plate 5 and composition 4 are separated from the target member 1, the target member 1 may become charged (called peeling electrification) and may attract surrounding foreign matter by electrostatic force. For this reason, it is advisable to carry out the separation process while de-electrifying the plate 5, composition 4 and/or target member 1 using an ionizer (not shown). Note that since a cured film of the composition 4 is attached to the plate 5 after the separation process has been carried out, when carrying out the foreign matter removal process on a new target member 1, the plate 5 may be replaced or cleaned.

When the separation process is completed, the target member 1 is separated from the stage 11 and carried out by a transport mechanism (not shown). Also, the plate 5 is separated from the holder 12 and carried out by a transport mechanism (not shown). Here, when separating the target member 1 from the stage 11 and/or separating the plate 5 from the holder 12, it is advisable to use an ionizer (not shown) to eliminate static electricity.

As described above, in the foreign matter removal method of this embodiment, the pressing step is performed in a state in which the light 6 that hardens the composition 4 is irradiated onto at least the peripheral portion 1b of the back surface 1d of the target member 1 so that a portion of the light 6 passes outside the target member 1. This allows the light 6 that passes outside the target member 1 to harden the composition 4 that extends beyond the outer edge of the target member 1, preventing the composition 4 from spilling out from the outer edge of the target member 1. In other words, it is possible to reduce the possibility that the composition 4 that spills out from the outer edge of the target member 1 will adhere to the back surface 1d of the target member 1 or the stage 11 and contaminate them.

Second Embodiment
A second embodiment of the present invention will be described. This embodiment basically follows the first embodiment, and can follow the first embodiment except for the matters described below.

Figure 6 is a schematic diagram showing an example of the configuration of the foreign matter removal device 10 (first light irradiation unit 17, second light irradiation unit 18) of this embodiment. In Figure 6, the supply unit 13, the first processing unit 14, the second processing unit 15, the photographing unit 16, and the control unit 19 are omitted. In the foreign matter removal device 10 of this embodiment, compared to the first embodiment, a light shielding member 22 (light shielding plate) is provided between the target member 1 (surface 1c) and the first light irradiation unit 17. In this embodiment, the light shielding member 22 is disposed between the holding unit 12 and the first light irradiation unit 17 (specifically, the mirror MR). In addition, in the second light irradiation unit 18, a reflecting member 18c (reflecting plate) is provided on the stage 11 instead of the light source 18a and the optical system 18b. The reflecting member 18c is configured to reflect the light 7 from the light source 17a of the first light irradiation unit 17 and irradiate it to at least the peripheral portion 1b of the back surface 1d of the target member 1. In addition, the reflecting member 18c is configured (positioned) so that a portion of the reflected light is irradiated onto the peripheral portion 1 of the back surface 1c of the target member 1, and the remainder passes outside the target member 1.

The light-shielding member 22 is a member that blocks the light 7 from the first light irradiation unit 17 so that the light 7 is not irradiated onto the composition 4 on the surface 1c of the target member 1, and may include a light-shielding portion (light-shielding film) 22a and a holding portion 22b that holds the light-shielding portion 22a. The light-shielding portion 22a is made of a material that blocks the light (wavelength) emitted from the first light irradiation unit 17. The holding portion 22b is made of a material that transmits at least the light (wavelength) emitted from the first light irradiation unit 17. In addition, it is preferable that the light-shielding portion 22a and the holding portion 22b are each made of a material that transmits the light (wavelength) detected by the imaging unit 16. The light-shielding member 22 is driven by the driving mechanism 23 so as to be inserted and removed between the target member 1 and the first light irradiation unit 17. Specifically, the light blocking member 22 is configured to be movable between a light blocking position between the target member 1 and the first light irradiation unit 17 and a retracted position retracted from between the target member 1 and the first light irradiation unit 17. The drive mechanism 23 can operate based on instructions from the control unit 19.

Next, an example of the operation of the foreign matter removal device 10 in this embodiment will be described. The example of the operation of the foreign matter removal device 10 in this embodiment differs from the first embodiment in the pressing process (step S13) and the hardening process (step S14), but the other processes are the same as those in the first embodiment. Therefore, the pressing process and the hardening process will be described below, and the description of the other processes will be omitted.

In the pressing step (step S13) of this embodiment, the control unit 19 moves the light-shielding member 22 to the light-shielding position by the drive mechanism 23 as shown in FIG. 6 (a). Thereafter, the control unit 19 transmits a signal to the first light irradiation unit 17 to emit light 7 that hardens the composition 4, and causes the light source 17a of the first light irradiation unit 17 to emit light 7. That is, in the pressing step of this embodiment, the light source 17a of the first light irradiation unit 17 emits light 7 with the light-shielding member 22 disposed between the surface 1c of the target member 1 and the first light irradiation unit 17. A portion of the light 7 emitted from the first light irradiation unit 17 is blocked by the light-shielding member 22 (light-shielding unit 22a), and the remainder that passes outside the light-shielding member 22a is reflected by the reflecting member 18c of the second light irradiation unit 18. Then, the light 6 that is reflected by the reflecting member 18c and passes outside the target member 1 hardens the composition 4 that has spread beyond the target range (outer edge) of the target member 1 by pressing the plate 5 against the composition 4 on the target member 1. This prevents the composition 4 from spilling out from the outer edge of the target member 1, and reduces the possibility that the composition 4 that has spilled out from the outer edge of the target member 1 will adhere to the back surface 1d of the target member 1 or the stage 11 and contaminate them.

In the curing step (step S14) of this embodiment, the control unit 19 moves the light shielding member 22 to a retracted position by the drive mechanism 23 as shown in FIG. 6(b). Thereafter, the control unit 19 transmits a signal to the first light irradiation unit 17 to emit light 7 for curing the composition 4, and causes the light source 17a of the first light irradiation unit 17 to emit light 7. That is, in the curing step of this embodiment, the light shielding member 22 is removed from between the surface 1c of the target member 1 and the first light irradiation unit 17, and the light source 17a of the first light irradiation unit 17 emits light 7. As a result, the light 7 from the first light irradiation unit 17 is irradiated to the composition 4 on the surface 1c of the target member 1 to cure the composition 4, and a cured film of the composition 4 can be formed between the plate 5 and the target member 1.

Third Embodiment
A third embodiment of the present invention will be described. This embodiment basically follows the first embodiment, and can follow the first embodiment except for the matters described below.

Figure 7 is a schematic diagram showing an example of the configuration of the foreign matter removal device 10 (first light irradiation unit 17, second light irradiation unit 18) of this embodiment. In Figure 7, the supply unit 13, the first processing unit 14, the second processing unit 15, the photographing unit 16, and the control unit 19 are omitted. In the foreign matter removal device 10 of this embodiment, compared to the first embodiment, a light shielding member 24 (light shielding plate) is provided between the target member 1 (surface 1c) and the first light irradiation unit 17. In this embodiment, the light shielding member 24 is disposed between the holding unit 12 and the first light irradiation unit 17. In addition, in the first light irradiation unit 17, a reflecting member 17c (reflecting plate) is provided instead of the light source 17a and the optical system 17b. The reflecting member 17c is configured to reflect the light 6 from the light source 18a of the second light irradiation unit 18 and irradiate it on the surface 1c of the target member 1. In this embodiment, the reflecting member 17c is configured by a concave mirror. In addition, in the foreign matter removal device 10 of this embodiment, the photographing unit 16 (not shown in FIG. 7) is disposed above the reflecting member 17c, and the reflecting member 17c has a shape with an opening (hole) formed in the center so that the photographing unit 16 can photograph (observe) the target member 1.

The light shielding member 24 is a member that blocks the light 6 from the second light irradiation unit 18 (specifically, the light emitted from the second irradiation unit 8 and passing outside the target member 1) so that the light 6 is not reflected by the reflecting member 17c and irradiated to the composition 4 on the surface 1c of the target member 1. The light shielding member 24 is made of a material that blocks and absorbs the light 6 (wavelength) from the second light irradiation unit 18. The light shielding member 24 can be configured to block the light 6 from the second light irradiation unit 18 from being irradiated to the reflecting member 17c of the first light irradiation unit 17, but may also be configured to block the light reflected by the reflecting member 17c from being irradiated to the surface 1c of the target member 1. In addition, it is preferable that the light shielding member 24 is made of a material that transmits the light (wavelength) detected by the imaging unit 16. The light shielding member 24 is driven by the driving mechanism 25 so as to be inserted and removed between the target member 1 and the first light irradiation unit 17 (reflecting member 17c). Specifically, the light blocking member 24 is configured to be movable between a light blocking position between the target member 1 and the first light irradiation unit 17 and a retracted position retracted from between the target member 1 and the first light irradiation unit 17. The drive mechanism 25 can operate based on instructions from the control unit 19.

Next, an example of the operation of the foreign matter removal device 10 in this embodiment will be described. The example of the operation of the foreign matter removal device 10 in this embodiment differs from the first embodiment in the pressing process (step S13) and the hardening process (step S14), but the other processes are the same as those in the first embodiment. Therefore, the pressing process and the hardening process will be described below, and the description of the other processes will be omitted.

In the pressing step (step S13) of this embodiment, the control unit 19 moves the light-shielding member 24 to the light-shielding position by the drive mechanism 25 as shown in FIG. 7(a). After that, the control unit 19 transmits a signal to the second light irradiation unit 18 to emit light 6 for hardening the composition 4, and causes the light source 18a of the second light irradiation unit 18 to emit light 6. That is, in the pressing step of this embodiment, the light source 18a of the second light irradiation unit 18 emits light 6 with the light-shielding member 24 disposed between the surface 1c of the target member 1 and the first light irradiation unit 17 (reflection member 17c). A part of the light 6 emitted from the second light irradiation unit 18 is irradiated to the peripheral portion 1b of the back surface 1c of the target member 1, and the rest passes outside the target member 1. The light that passes outside the target member 1 hardens the composition 4 that has spread beyond the target range (outer edge) of the target member 1 by pressing the plate 5 against the composition 4 on the target member 1. This prevents the composition 4 from spilling out from the outer edge of the target member 1, and reduces the risk of the composition 4 spilling out from the outer edge of the target member 1 adhering to the back surface 1d of the target member 1 or the stage 11 and contaminating them.

In the curing step (step S14) of this embodiment, the control unit 19 moves the light shielding member 24 to a retracted position by the drive mechanism 25 as shown in FIG. 7(b). Thereafter, the control unit 19 transmits a signal to the second light irradiation unit 18 to emit light 6 for curing the composition 4, and causes the light source 18a of the second light irradiation unit 18 to emit the light 6. That is, in the curing step of this embodiment, the light source 18a of the second light irradiation unit 18 emits the light 6 with the light shielding member 24 removed from between the surface 1c of the target member 1 and the first light irradiation unit 17. The light 6 from the second light irradiation unit 18 is reflected by the reflecting member 17c of the first light irradiation unit 17, and the reflected light 7 is irradiated onto the composition 4 on the surface 1c of the target member 1. This allows the composition 4 to be cured, and a cured film of the composition 4 to be formed between the plate 5 and the target member 1.

Fourth Embodiment
A fourth embodiment of the present invention will be described. In this embodiment, an example in which the film formation method is applied to a molding method will be described. In the molding method of this embodiment, a molding process is performed in which a composition on a member 1 is molded using a plate 5. The molding process includes a film formation process in which a cured film of the composition 4 is formed between the plate 5 and the member 1. The film formation process includes the pressing process (step S13) and the curing process (step S14) described in the first to third embodiments. The film formation process may further include a supplying process (step S12). In addition, the molding process further includes a separating process (step S15).

Examples of molding methods (molding processes) include the imprinting method and the planarization method. The imprinting method is a method in which a mold having a concave-convex pattern is used as a plate 5, and the mold is pressed against a composition 4 (imprinting material) on a member 1 to form (transfer) a pattern in the composition. The planarization method is a method in which a mold (template) having a flat surface is used as a plate 5, and the mold is pressed against the composition 4 on the member 1 to planarize the surface of the composition.

In the molding method, the separation step (step S15) is different from the foreign matter removal method described in the first to third embodiments, but the other steps (steps S11 to S14) are the same. However, the amount of composition 4 supplied onto the target member 1 in the supply step (step S12) can be set according to the pattern shape of the cured film of the composition 4 to be formed within the target range of the target member 1. The target range in this embodiment is the range in which a pattern is formed on the target member 1, and is set to the entire surface 1c of the target member 1. Also, in the pressing step (step S14), a pattern having a shape in which the concaves and convexes are reversed to the concaves and convexes of the pattern of the cured film of the composition 4 to be formed on the surface 1 of the target member 1 is formed on the pressing surface 5a of the plate 5 (mold) used in the imprinting method. By pressing this plate 5 against the composition 4 on the target member 1, the shape of the pressing surface 5a of the plate 5 can be transferred to the composition 4. On the other hand, the pressing surface 5a of the plate 5 (mold) used in the planarization method is formed as a flat surface. By pressing this plate 5 against the composition 4 on the target member 1, the surface of the composition 4 can be flattened.

In the separation step of the molding method, the plate 5 is separated from the cured film of composition 4 while the cured film of composition 4 cured in the curing step is attached to the target member 1 by widening the gap between the plate 5 and the target member 1. This allows the composition 4 on the target member 1 to be molded. In other words, in the imprint method, a cured film of composition 4 to which the concave-convex pattern of the plate 5 is transferred can be formed on the target member 1. In addition, in the planarization method, a cured film of composition 4 with the surface planarized by the plate 5 can be formed on the target member 1.

Here, the molding device (imprinting device, flattening device) for performing the molding method can be configured in the same manner as the foreign matter removal device 10 described in the first to third embodiments. Therefore, a detailed description of the molding device will be omitted. In the molding device, the second processing unit 15 and the moving mechanism 20 may not be provided, unlike the foreign matter removal device 10 described in the first to third embodiments. Also, in the imprinting device, a mold having a concave-convex pattern on the pressing surface 5a is held by the holding unit 12 as the plate 5. On the other hand, in the flattening device, a mold (template) having a flat pressing surface 5a is held by the holding unit 12 as the plate 5.

<Embodiments of a method for manufacturing an article>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of the present embodiment includes a foreign matter removal step of removing foreign matter on a member by the foreign matter removal method described above, a processing step of processing the member that has undergone the foreign matter removal step, and a manufacturing step of manufacturing an article from the member that has undergone the processing step. The processing step may include a step of forming a pattern on the member that has undergone the foreign matter removal step, or a step of forming a planarizing film on the member that has undergone the foreign matter removal step. The article manufacturing method of the present embodiment also includes a molding step of molding a composition on a member by the above molding method, a processing step of processing the member that has undergone the molding step, and a manufacturing step of manufacturing an article from the member that has undergone the processing step. Furthermore, such a manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

When the imprinting method is used as the molding method, the pattern of the cured product formed by the imprinting method is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles are electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

The pattern of the cured material is used as it is, as at least a part of the component of the article, or is used temporarily as a resist mask. After etching or ion implantation is performed in the substrate processing step, the resist mask is removed.

Next, a specific method for manufacturing an article will be described. Here, an example of a method for manufacturing an article using an imprinting method will be described. As shown in FIG. 8(a), a substrate 1z such as a silicon wafer is prepared on whose surface a workpiece 2z such as an insulator is formed, and then an imprinting material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, the state in which the imprinting material 3z in the form of multiple droplets is applied onto the substrate is shown.

As shown in FIG. 8(b), the imprinting mold 4z is placed with the side on which the concave-convex pattern is formed facing the imprinting material 3z on the substrate. As shown in FIG. 8(c), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as hardening energy, the imprinting material 3z hardens.

As shown in FIG. 8(d), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In this cured product pattern, the concave portions of the mold correspond to the convex portions of the cured product, and the convex portions of the mold correspond to the concave portions of the cured product, i.e., the concave-convex pattern of the mold 4z is transferred to the imprint material 3z. Note that an RLT portion (Residual Layer Thickness, sometimes called the residual film thickness) of about several tens of nanometers (not shown) remains in the concave portions of the cured product.

As shown in FIG. 8(e), when etching is performed including the RLT portion using the cured material pattern as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains is removed, forming a groove 5z. As shown in FIG. 8(f), when the cured material pattern is removed, an article is obtained in which a groove 5z is formed on the surface of the workpiece 2z. Here, the cured material pattern is removed, but it may be used as an interlayer insulating film included in a semiconductor element, or as a component of an article, without being removed after processing.

Summary of the embodiment
The disclosure of this specification includes at least the following film forming apparatus, foreign matter removing apparatus, molding apparatus, film forming method, foreign matter removing method, molding method, and article manufacturing method.
(Item 1)
A film-forming apparatus for performing a process of forming a cured film of a composition between a plate and a member,
a light irradiation unit that irradiates the member with light that cures the composition;
A control unit for controlling the processing;
Equipped with
The treatment includes a pressing step of pressing the plate against the liquid composition supplied onto the first surface of the member, and a curing step of curing the composition disposed between the plate and the member through the pressing step,
the light irradiation unit includes a first light irradiation unit that irradiates the first surface with light, and a second light irradiation unit that irradiates at least a peripheral portion of a second surface of the member opposite to the first surface with light,
The control unit performs the pressing process while irradiating light from the second light irradiation unit to the second surface so that a portion of the light from the second light irradiation unit passes outside the member, and performs the curing process by irradiating light from the first light irradiation unit to the composition on the first surface.
(Item 2)
The first light irradiation unit includes a first light source, and the second light irradiation unit includes a second light source,
2. The film forming apparatus according to item 1, wherein the control unit causes the second light source to emit light in the pressing step and causes the first light source to emit light in the curing step.
(Item 3)
Further comprising a stage for holding the member,
3. The film forming apparatus according to item 2, wherein the second light source is provided on the stage.
(Item 4)
The light-shielding member is further provided between the first surface of the member and the first light irradiation unit,
The first light irradiation unit includes a light source,
the second light irradiation unit includes a reflecting member that reflects the light from the light source and irradiates the light onto the second surface of the member,
The control unit is
In the pressing step, the light source is caused to emit light in a state in which the light blocking member is disposed between the first surface of the member and the first light irradiating unit,
2. The film forming apparatus according to item 1, characterized in that, in the curing step, the light source is caused to emit light in a state in which the light blocking member is removed from between the first surface of the member and the first light irradiation unit.
(Item 5)
Further comprising a stage for holding the member,
5. The film forming apparatus according to claim 4, wherein the reflecting member is provided on the stage.
(Item 6)
The light-shielding member is further provided between the first surface of the member and the first light irradiation unit,
The second light irradiation unit includes a light source,
the first light irradiating unit includes a reflecting member that reflects light from the light source and irradiates the light onto the first surface of the member,
The control unit is
In the pressing step, the light source is caused to emit light in a state in which the light blocking member is disposed between the first surface of the member and the first light irradiating unit,
2. The film forming apparatus according to item 1, characterized in that, in the curing step, the light source is caused to emit light in a state in which the light blocking member is removed from between the first surface of the member and the first light irradiation unit.
(Item 7)
Further comprising a stage for holding the member,
7. The film forming apparatus according to item 6, wherein the light source is provided on the stage.
(Item 8)
8. The film forming apparatus according to any one of items 1 to 7, further comprising a stage that holds the member so that the peripheral portion of the second surface is exposed.
(Item 9)
9. The film forming apparatus according to any one of items 1 to 8, wherein the member is made of a material that does not transmit the light from the second light irradiation unit.
(Item 10)
A foreign matter removal device for removing foreign matter on a member using a plate,
10. The film forming apparatus according to any one of items 1 to 9, which performs a process of forming a cured film of the composition between the plate and the member,
a foreign matter removing apparatus comprising: a film forming apparatus for forming a foreign matter on a substrate; a plate having a cured film attached thereto, the plate being separated from the member after the treatment is performed in the film forming apparatus;
(Item 11)
A molding apparatus for molding a composition on a member using a plate, comprising:
10. The film forming apparatus according to any one of items 1 to 9, which performs a process of forming a cured film of the composition between the plate and the member,
A molding apparatus, comprising: a film forming apparatus for forming a film on a surface of the member; a plate for separating the plate from the cured film on the member;
(Item 12)
A film forming method for forming a cured film of a composition between a plate and a member, comprising the steps of:
a step of applying the composition in liquid form onto a first surface of the member;
a pressing step of pressing the plate against the composition supplied onto the first surface in the supplying step;
a curing step of curing the composition disposed between the plate and the member through the pressing step;
Including,
The pressing step is carried out in a state in which light for curing the composition is irradiated to at least a peripheral portion of a second surface of the member opposite the first surface, so that a portion of the light passes outside the member.
(Item 13)
A method for removing foreign matter on a member using a plate, comprising the steps of:
A film forming process of forming a cured film of a composition incorporating foreign matter on the member between the plate and the member by the film forming method according to item 12;
a separation step of separating the plate from the member with the cured film attached to the plate after the film forming step;
A method for removing foreign matter, comprising:
(Item 14)
A foreign matter removal step of removing foreign matter on a member by the foreign matter removal method according to item 13;
a processing step of processing the member that has been subjected to the foreign matter removal step;
a manufacturing process for manufacturing an article from the member that has been subjected to the processing process;
A method for manufacturing an article, comprising:
(Item 15)
A molding method for molding a composition on a member using a plate, comprising the steps of:
A film forming process of forming a cured film of a composition incorporating foreign matter on the member between the plate and the member by the film forming method according to item 12;
a separation step of separating the plate from the cured film on the member after the film forming step;
A molding method comprising the steps of:
(Item 16)
A molding step of molding the composition on a member by the molding method according to item 15;
a processing step of processing the member that has been subjected to the molding step;
a manufacturing process for manufacturing an article from the member that has been subjected to the processing process;
A method for manufacturing an article, comprising:

The invention is not limited to the above-described embodiment, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the following claims are appended to disclose the scope of the invention.

1: Target material, 4: Composition, 5: Plate, 10: Foreign matter removal device (molding device), 11: Stage, 12: Holding unit, 13: Supply unit, 17: First light irradiation unit, 18: Second light irradiation unit, 19: Control unit

Claims (16)

A film-forming apparatus for performing a process of forming a cured film of a composition between a plate and a member,
a light irradiation unit that irradiates the member with light that cures the composition;
A control unit for controlling the processing;
Equipped with
The treatment includes a pressing step of pressing the plate against the liquid composition supplied onto the first surface of the member, and a curing step of curing the composition disposed between the plate and the member through the pressing step,
the light irradiation unit includes a first light irradiation unit that irradiates the first surface with light, and a second light irradiation unit that irradiates at least a peripheral portion of a second surface of the member opposite to the first surface with light,
The control unit performs the pressing process while irradiating the second surface with light from the second light irradiation unit so that a portion of the light from the second light irradiation unit passes outside the member, and performs the curing process by irradiating the composition on the first surface with light from the first light irradiation unit. The first light irradiation unit includes a first light source, and the second light irradiation unit includes a second light source,
The film forming apparatus according to claim 1 , wherein the control unit causes the second light source to emit light in the pressing step and causes the first light source to emit light in the curing step. Further comprising a stage for holding the member,
The film forming apparatus according to claim 2 , wherein the second light source is provided on the stage. The light-shielding member is further provided between the first surface of the member and the first light irradiation unit,
The first light irradiation unit includes a light source,
the second light irradiation unit includes a reflecting member that reflects the light from the light source and irradiates the light onto the second surface of the member,
The control unit is
In the pressing step, the light source is caused to emit light in a state in which the light blocking member is disposed between the first surface of the member and the first light irradiating unit,
2. The film forming apparatus according to claim 1, wherein in the curing step, the light source is caused to emit light in a state in which the light blocking member is removed from between the first surface of the member and the first light irradiation unit. Further comprising a stage for holding the member,
The film forming apparatus according to claim 4 , wherein the reflecting member is provided on the stage. The light-shielding member is further provided between the first surface of the member and the first light irradiation unit,
The second light irradiation unit includes a light source,
the first light irradiating unit includes a reflecting member that reflects light from the light source and irradiates the light onto the first surface of the member,
The control unit is
In the pressing step, the light source is caused to emit light in a state in which the light blocking member is disposed between the first surface of the member and the first light irradiating unit,
2. The film forming apparatus according to claim 1, wherein in the curing step, the light source is caused to emit light in a state in which the light blocking member is removed from between the first surface of the member and the first light irradiation unit. Further comprising a stage for holding the member,
7. The film forming apparatus according to claim 6, wherein the light source is provided on the stage. The film forming apparatus according to claim 1, further comprising a stage for holding the member so that the peripheral portion of the second surface is exposed. The film forming device according to claim 1, characterized in that the member is made of a material that does not transmit light from the second light irradiation unit. A foreign matter removal device for removing foreign matter on a member using a plate,
The film forming apparatus according to claim 1 , further comprising:
a foreign matter removing apparatus comprising: a film forming apparatus for forming a foreign matter on a substrate; a plate having a cured film attached thereto, the plate being separated from the member after the treatment is performed in the film forming apparatus; A molding apparatus for molding a composition on a member using a plate, comprising:
The film forming apparatus according to claim 1 , further comprising:
A molding apparatus, comprising: a film forming apparatus for forming a film on a surface of the member; a plate for separating the plate from the cured film on the member; A film forming method for forming a cured film of a composition between a plate and a member, comprising the steps of:
a step of applying the composition in liquid form onto a first surface of the member;
a pressing step of pressing the plate against the composition supplied onto the first surface in the supplying step;
a curing step of curing the composition disposed between the plate and the member through the pressing step;
Including,
The pressing step is carried out in a state in which light for curing the composition is irradiated to at least a peripheral portion of a second surface of the member opposite the first surface, so that a portion of the light passes outside the member. A method for removing foreign matter on a member using a plate, comprising the steps of:
a film forming step of forming a cured film of a composition containing foreign matter on the member between the plate and the member by the film forming method according to claim 12;
a separation step of separating the plate from the member with the cured film attached to the plate after the film forming step;
A method for removing foreign matter, comprising: a foreign matter removing step of removing foreign matter on a member by the foreign matter removing method according to claim 13;
a processing step of processing the member that has been subjected to the foreign matter removal step;
a manufacturing process for manufacturing an article from the member that has been subjected to the processing process;
A method for manufacturing an article, comprising: A molding method for molding a composition on a member using a plate, comprising the steps of:
a film forming step of forming a cured film of a composition containing foreign matter on the member between the plate and the member by the film forming method according to claim 12;
a separation step of separating the plate from the cured film on the member after the film forming step;
A molding method comprising the steps of: A molding step of molding the composition on a member by the molding method according to claim 15;
a processing step of processing the member that has been subjected to the molding step;
a manufacturing process for manufacturing an article from the member that has been subjected to the processing process;
A method for manufacturing an article, comprising:

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