JP2024053414A - Sensing terminal and sensing method - Google Patents

Abstract

To provide a sensing terminal and a sensing method that can reduce power consumption.SOLUTION: A sensing terminal 500 includes a detection sensor 511, a control unit 520, a battery 550, and an acceleration sensor 512. The detection sensor 511 detects the environment inside a substrate processing device 100. The control unit 520 can transition between an active state of executing a predetermined operation on the basis of the detection result of the detection sensor 511, and a sleep state in which power consumption is lower than that in the active state. The battery 550 supplies power to the control unit 520. The acceleration sensor 512 detects acceleration. The control unit 520 transitions between the active state and the sleep state, on the basis of the detection result of the acceleration sensor 512.SELECTED DRAWING: Figure 3

Description

The present invention relates to a sensing terminal and a sensing method.

Conventionally, semiconductor manufacturing equipment such as substrate processing equipment that processes substrates is known. In semiconductor manufacturing equipment, it is required to measure the environment inside the equipment, such as the surface temperature of the substrate being processed and the temperature of the processing liquid, in order to grasp the processing state in the processing step. Therefore, a sensing terminal for detecting the environment inside the semiconductor manufacturing equipment is known (see, for example, Patent Document 1). Patent Document 1 describes a process condition measuring device (hereinafter, referred to as the measuring device) having a wafer shape. The measuring device includes a substrate made of a silicon wafer or the like, a plurality of sensors arranged on the substrate, a microprocessor, a memory unit, a battery, and the like. The plurality of sensors makes it possible to detect the environment inside the semiconductor manufacturing equipment. In addition, the measuring device operates using power stored in a battery.

JP 2007-536726 A

Incidentally, in a sensing terminal that operates on power supplied from a battery, it is necessary to reduce power consumption so that detection operations can be performed over a long period of time. The measuring device described in Patent Document 1 aims to reduce power consumption by increasing the set interval between data storage operations and compressing the data stored in the storage unit.

However, for example, there may be cases where environmental data is required when the sensing terminal is in a specified position, or when the semiconductor manufacturing equipment is performing a specified process. In these cases, if the control unit acquires environmental data and performs a specified operation when the sensing terminal is not in a specified position or when the semiconductor manufacturing equipment is not performing a specified process, there is a problem in that extra power is consumed.

The present invention was made in consideration of the above problems, and its purpose is to provide a sensing terminal and a sensing method that can reduce power consumption.

According to one aspect of the present invention, a sensing terminal includes a detection sensor, a control unit, a battery, and an acceleration sensor. The detection sensor detects the environment inside the manufacturing device. The control unit can transition between an active state in which a predetermined operation is performed based on the detection result of the detection sensor, and a sleep state in which power consumption is lower than that of the active state. The battery supplies power to the control unit. The acceleration sensor detects acceleration. The control unit transitions between the active state and the sleep state based on the detection result of the acceleration sensor.

In one embodiment, the control unit may transition between the active state and the sleep state based on at least one of a pattern of time-series data generated based on the detection results of the acceleration sensor and a position calculated based on the detection results of the acceleration sensor.

In one embodiment, the control unit may determine whether the sensing terminal is placed at a predetermined position based on at least one of the pattern and the position. When the control unit determines that the sensing terminal is placed at the predetermined position, the control unit may transition from the sleep state to the active state.

In one embodiment, the control unit may determine whether the sensing terminal has been moved from the predetermined position based on the detection result of the acceleration sensor. When the control unit determines that the sensing terminal has been moved from the predetermined position, the control unit may transition from the active state to the sleep state.

In one embodiment, the control unit may compare the detection result of the acceleration sensor with a predetermined threshold value. The control unit may transition between the active state and the sleep state based on the result of the comparison.

In one embodiment, the control unit may determine whether the detection result of the acceleration sensor is equal to or greater than the predetermined threshold. When the detection result is equal to or greater than the predetermined threshold, the control unit may transition from the sleep state to the active state.

In one embodiment, the manufacturing equipment may be a semiconductor manufacturing equipment that manufactures semiconductor devices.

According to another aspect of the present invention, a sensing method uses a sensing terminal including a detection sensor for detecting an environment inside a manufacturing device, an acceleration sensor, a control unit, and a battery for supplying power to the control unit. The control unit is capable of transitioning between an active state in which a predetermined operation is performed based on the detection result of the detection sensor, and a sleep state in which power consumption is lower than that of the active state. The sensing method includes a step in which the acceleration sensor detects acceleration, and a step in which the control unit transitions between the active state and the sleep state based on the detection result of the acceleration sensor.

The present invention provides a sensing terminal and a sensing method that can reduce power consumption.

2 is a schematic plan view of a substrate processing apparatus sensed by a sensing terminal of the first embodiment; FIG. 2 is a schematic diagram of a substrate processing unit in the substrate processing apparatus; FIG. FIG. 2 is a block diagram illustrating a schematic configuration of a sensing terminal. 10A and 10B are diagrams illustrating an example of a pattern of time-series data regarding acceleration generated based on the detection result of an acceleration sensor. 10A and 10B are diagrams illustrating an example of a pattern of time-series data regarding speed generated based on the detection result of an acceleration sensor. 5 is a flowchart showing an example of a substrate processing method using the substrate processing apparatus. 11 is a flowchart showing an example of a sensing method performed by the sensing terminal. 13 is a schematic diagram showing a state in which a sensing terminal according to a second embodiment is attached to a substrate holding part of a substrate processing apparatus. FIG. 10 is a flowchart illustrating an example of a sensing method performed by the sensing terminal of the second embodiment.

Below, an embodiment of a sensing terminal and a sensing method according to the present invention will be described with reference to the drawings. Note that in the drawings, the same or corresponding parts are given the same reference symbols and the description will not be repeated. In this specification, to facilitate understanding of the invention, an X-axis, a Y-axis, and a Z-axis that are perpendicular to each other may be described. In this embodiment, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

First Embodiment
The sensing terminal 500 according to the first embodiment of the present invention is a device that senses the environment inside a manufacturing device. The type of manufacturing device sensed by the sensing terminal 500 is not particularly limited, but in this embodiment, it is a semiconductor manufacturing device. The semiconductor manufacturing device is a device for manufacturing semiconductor devices. In addition, in this embodiment, the semiconductor manufacturing device sensed by the sensing terminal 500 is a substrate processing device 100 that processes substrates. That is, the sensing terminal 500 senses the environment inside the substrate processing device 100. The substrate processing device 100 is an example of the "manufacturing device" and "semiconductor manufacturing device" of the present invention. In addition, the sensing terminal 500 may sense the environment inside a panel manufacturing device that manufactures panels, or the environment inside a printing machine that prints on a printing medium to manufacture printed matter.

For ease of understanding, before describing the sensing terminal 500 of the first embodiment of the present invention, the substrate processing apparatus 100 will first be described with reference to Figures 1 and 2. Figure 1 is a schematic plan view of the substrate processing apparatus 100 sensed by the sensing terminal 500 of the first embodiment.

The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of the following on the substrate W: etching, surface treatment, imparting properties, forming a treatment film, removing at least a portion of a film, and cleaning.

The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. Here, the substrate processing apparatus 100 processes the substrates W one by one.

As shown in FIG. 1, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid cabinet 110, a processing liquid box 120, a plurality of load ports 130, an indexer robot 140, a center robot 150, and a control device 101. The control device 101 controls the load ports 130, the indexer robot 140, and the center robot 150. The control device 101 includes a control unit 102 and a memory unit 104.

Each of the load ports 130 accommodates a stack of substrates W. The indexer robot 140 transports substrates W between the load ports 130 and the center robot 150. The center robot 150 transports substrates W between the indexer robot 140 and the substrate processing units 10. Each of the substrate processing units 10 processes the substrate W by discharging a processing liquid onto the substrate W. The processing liquid includes, for example, a chemical liquid, a cleaning liquid, a removal liquid, and/or a water repellent. The processing liquid cabinet 110 accommodates the processing liquid. The processing liquid cabinet 110 may accommodate a gas.

Specifically, the substrate processing units 10 form a plurality of towers 160 (four towers 160 in FIG. 1) arranged to surround the center robot 150 in a plan view. Each tower 160 includes a plurality of substrate processing units 10 (three substrate processing units 10 in FIG. 1) stacked vertically. Each processing liquid box 120 corresponds to a plurality of towers 160. The liquid in the processing liquid cabinet 110 is supplied to all substrate processing units 10 included in the tower 160 corresponding to the processing liquid box 120 through one of the processing liquid boxes 120. In addition, the gas in the processing liquid cabinet 110 is supplied to all substrate processing units 10 included in the tower 160 corresponding to the processing liquid box 120 through one of the processing liquid boxes 120.

In the substrate processing apparatus 100, a boundary wall 170 is disposed between the area in which the center robot 150 and the substrate processing units 10 are installed and the area in which the processing liquid cabinet 110 is installed. The processing liquid cabinet 110 defines a portion of the space in the area of the substrate processing apparatus 100 outside the boundary wall 170.

Typically, the processing liquid cabinet 110 has a preparation tank (tank) for preparing the processing liquid. The processing liquid cabinet 110 may have a preparation tank for one type of processing liquid, or may have preparation tanks for multiple types of processing liquid. The processing liquid cabinet 110 also has a pump, nozzle, and/or filter for circulating the processing liquid.

Here, the processing liquid cabinet 110 has a first processing liquid cabinet 1101 and a second processing liquid cabinet 1102. The first processing liquid cabinet 1101 and the second processing liquid cabinet 1102 are arranged opposite each other.

The control device 101 controls various operations of the substrate processing device 100.

The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computing unit.

The memory unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes specifies the processing content and processing procedure for the substrate W.

The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and/or a hard disk drive. The storage unit 104 may include removable media. The control unit 102 executes a computer program stored in the storage unit 104 to perform substrate processing operations.

Next, the substrate processing unit 10 in the substrate processing apparatus 100 will be described with reference to FIG. 2. FIG. 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.

The substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30.

The chamber 11 is generally box-shaped with an internal space. The chamber 11 accommodates the substrate W. Here, the substrate processing apparatus 100 is a single-wafer type that processes the substrate W one by one, and the chamber 11 accommodates the substrate W one by one. The substrate W is accommodated in the chamber 11 and is processed in the chamber 11. The chamber 11 accommodates at least a part of each of the substrate holder 20 and the processing liquid supply unit 30.

The substrate holding unit 20 holds the substrate W. The substrate holding unit 20 holds the substrate W horizontally so that the top surface (front surface) Wa of the substrate W faces upward and the back surface (bottom surface) Wb of the substrate W faces vertically downward. The substrate holding unit 20 also rotates the substrate W while holding it. For example, the top surface Wa of the substrate W has a layered structure in which a recess is formed. The substrate holding unit 20 rotates the substrate W while holding it.

For example, the substrate holding unit 20 may be of a clamping type that clamps the edge of the substrate W. Alternatively, the substrate holding unit 20 may have any mechanism that holds the substrate W from the back surface Wb. For example, the substrate holding unit 20 may be of a vacuum type. In this case, the substrate holding unit 20 holds the substrate W horizontally by adsorbing the central portion of the back surface Wb of the substrate W, which is the non-device formation surface, to its upper surface. Alternatively, the substrate holding unit 20 may combine a clamping type that brings multiple chuck pins into contact with the peripheral edge surface of the substrate W, with a vacuum type.

For example, the substrate holding unit 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 chucks the substrate W. Typically, the spin base 21 is provided with a plurality of chuck members 22.

The shaft 23 is a hollow shaft. The shaft 23 extends vertically along the rotation axis Ax. The spin base 21 is connected to the upper end of the shaft 23. The substrate W is placed above the spin base 21.

The spin base 21 is disk-shaped and supports the substrate W horizontally. The shaft 23 extends downward from the center of the spin base 21. The electric motor 24 provides rotational force to the shaft 23. The electric motor 24 rotates the shaft 23 in a rotational direction, thereby rotating the substrate W and the spin base 21 around the rotation axis Ax. The housing 25 surrounds the shaft 23 and the electric motor 24.

The processing liquid supply unit 30 supplies processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is accommodated within the chamber 11.

The processing liquid supply unit 30 supplies a processing liquid to the upper surface Wa of the substrate W. The processing liquid may include a so-called chemical liquid. The chemical liquid includes, for example, hydrofluoric acid. For example, the hydrofluoric acid may be heated to 40° C. or higher and 70° C. or lower, or to 50° C. or higher and 60° C. or lower. However, the hydrofluoric acid does not have to be heated. The chemical liquid may also include water or phosphoric acid.

The chemical solution may further include hydrogen peroxide. The chemical solution may also include SC1 (ammonia hydrogen peroxide mixture), SC2 (hydrochloric acid hydrogen peroxide mixture), or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).

Alternatively, the processing liquid may include a so-called cleaning liquid (rinsing liquid). For example, the cleaning liquid may include any of deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a dilute concentration (e.g., about 10 ppm to 100 ppm), or reduced water (hydrogen water).

The processing liquid supply unit 30 includes a pipe 32, a nozzle 34, and a valve 36. The nozzle 34 ejects processing liquid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the pipe 32. Processing liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes the flow path in the pipe 32. It is preferable that the nozzle 34 is configured to be movable relative to the substrate W.

The valve 36 opens and closes the flow path in the pipe 32. The valve 36 adjusts the opening of the pipe 32 to adjust the flow rate of the processing liquid supplied to the pipe 32. Specifically, the valve 36 includes a valve body (not shown) with a valve seat provided therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position.

The nozzle 34 may be movable. In this embodiment, the nozzle 34 is configured to be movable. Specifically, the processing liquid supply unit 30 further includes a movement mechanism 38. The movement mechanism 38 moves the nozzle 34. The nozzle 34 can move in the horizontal direction and/or the vertical direction according to the movement mechanism 38 controlled by the control unit 102.

In detail, the moving mechanism 38 includes an arm 381, a rotating shaft 382, and a driving mechanism 383. The arm 381 extends in a substantially horizontal direction. The nozzle 34 is fixed to one end of the arm 381. The rotating shaft 382 is fixed to the other end of the arm 381. The rotating shaft 382 extends in a substantially vertical direction. The driving mechanism 383 rotates the rotating shaft 382 around the central axis of the rotating shaft 382. This causes the arm 381 and the nozzle 34 to rotate around the rotating shaft 382. Note that the driving mechanism 383 may move the rotating shaft 382 in a substantially vertical direction. In this case, the arm 381 and the nozzle 34 move in a substantially vertical direction.

The substrate processing unit 10 further includes a cup 80. The cup 80 collects the processing liquid that has splashed from the substrate W. The cup 80 rises and falls. For example, the cup 80 rises vertically upward to the side of the substrate W during the period during which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid that splashes from the substrate W due to the rotation of the substrate W. In addition, the cup 80 descends vertically downward from the side of the substrate W when the period during which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends.

As described above, the control device 101 includes the control unit 102 and the memory unit 104. The control unit 102 controls the substrate holder 20, the processing liquid supply unit 30, and/or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36, and/or the cup 80.

The substrate processing apparatus 100 of this embodiment is suitable for use in the manufacture of semiconductor devices having semiconductors. Typically, in semiconductor devices, a conductive layer and an insulating layer are stacked on a substrate. The substrate processing apparatus 100 is suitable for use in cleaning and/or processing (e.g., etching, changing characteristics, etc.) the conductive layer and/or insulating layer during the manufacture of semiconductor devices.

In the substrate processing unit 10 shown in FIG. 2, the processing liquid supply section 30 is capable of supplying one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply section 30 may supply multiple types of processing liquid. For example, the processing liquid supply section 30 may be capable of sequentially supplying multiple types of processing liquid with different uses to the substrate W. Alternatively, the processing liquid supply section 30 may be capable of simultaneously supplying multiple types of processing liquid with different uses to the substrate W.

Next, the sensing terminal 500 of this embodiment will be described with reference to FIG. 3. FIG. 3 is a block diagram that shows a schematic configuration of the sensing terminal 500. As shown in FIG. 3, the sensing terminal 500 includes a sensor unit 510, a control unit 520, a storage unit 530, a communication unit 540, and a battery 550. The control unit 520 is an example of the "control unit" of the present invention.

The sensor unit 510 has a detection sensor 511 and an acceleration sensor 512. The detection sensor 511 detects the environment inside the manufacturing device. In this embodiment, the detection sensor 511 detects the environment inside the substrate processing device 100.

The environment detected by the detection sensor 511 is not particularly limited, and may be, for example, temperature, air pressure, liquid pressure, flow rate of fluid such as gas or liquid, fluid components, voltage value, current value, etching rate, and thickness of a film on the substrate W. The number of environments detected by the detection sensor 511 is not particularly limited, and the detection sensor 511 may detect one or more environments. In this embodiment, the detection sensor 511 detects one environment. Furthermore, the number of detection sensors 511 is not particularly limited, and may be one or more. In this embodiment, the number of detection sensors 511 is one.

The detection sensor 511 is a sensor other than an acceleration sensor. In this embodiment, the detection sensor 511 is a temperature sensor that detects temperature. The type of the detection sensor 511 is not particularly limited, but in this embodiment, the detection sensor 511 includes, for example, a thermocouple or a thermistor. Note that the detection sensor 511 may be a contact type sensor or a non-contact type sensor.

The detection sensor 511 detects the environment inside the substrate processing apparatus 100 at regular intervals. The detection sensor 511 transmits the detection result to the control unit 520. Specifically, the detection sensor 511 transmits a signal indicating the detection result to the control unit 520.

The acceleration sensor 512 detects acceleration. The type of acceleration sensor 512 is not particularly limited, but for example, a capacitance type sensor or a piezo-resistance type sensor can be used.

The sensing terminal 500 is fixed to, for example, a movable member or device (hereinafter, sometimes referred to as a member, etc.) inside the manufacturing device. The acceleration sensor 512 detects its own acceleration. In other words, the acceleration sensor 512 detects the acceleration of the detection sensor 511, the acceleration of the sensing terminal 500, and the acceleration of the member, etc. to which the sensing terminal 500 is fixed. The acceleration sensor 512 detects the acceleration at regular intervals. The intervals of detection by the acceleration sensor 512 may be longer than the intervals of detection by the detection sensor 511. The acceleration sensor 512 transmits the detection result to the control unit 520. Specifically, the acceleration sensor 512 transmits a signal indicating the detection result to the control unit 520. Note that, as described later, the control unit 520 can calculate at least one of the speed, the moving distance, and the position based on the acceleration, which is the detection result of the acceleration sensor 512.

The control unit 520 includes, for example, a microcomputer (also called a microcontroller). The microcomputer has, for example, a microprocessor and a memory. The control unit 520 performs various processes by executing programs stored in the memory. Note that the control unit 520 may be a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit).

For example, the control unit 520 generates time series data of the detection value based on the detection result of the detection sensor 511. Specifically, the control unit 520 converts the signal from the detection sensor 511 into a detection value. The control unit 520 also generates time series data of the detection value using the converted detection value. The control unit 520 also compresses the generated time series data and stores it in the storage unit 530, for example.

The storage unit 530 stores data. The storage unit 530 stores, for example, the detection result of the detection sensor 511. Specifically, the storage unit 530 stores, for example, time series data of the detection value of the detection sensor 511. The storage unit 530 may further store, for example, the detection result of the acceleration sensor 512. The storage unit 530 may further store, for example, the time series data of the detection value of the acceleration sensor 512. In this case, the control unit 520 may convert the signal from the acceleration sensor 512 into a detection value to generate time series data of the detection value, compress the generated time series data, and store it in the storage unit 530. The storage unit 530 may further store various programs.

The storage unit 530 includes, for example, a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and/or a hard disk drive. The storage unit 104 may include removable media.

The communication unit 540 is a communication device. The communication unit 540 transmits data to a device other than the sensing terminal 500 by wire or wirelessly. The communication unit 540 includes, for example, an interface. The communication unit 540 may include an antenna. The data stored in the memory unit 530 is transmitted to a device other than the sensing terminal 500 (hereinafter, sometimes referred to as a receiving device) via the communication unit 540. The data stored in the memory unit 530 (for example, the detection result of the detection sensor 511 or time series data) is transmitted to the receiving device via the communication unit 540, for example, when the sensing terminal 500 is not performing sensing.

The battery 550 supplies power to the control unit 520. The sensing terminal 500 performs sensing using the power stored in the battery 550. The battery 550 is not particularly limited, but is, for example, a lithium-ion battery. Note that the battery 550 may be a battery other than a lithium-ion battery.

The battery 550 is charged by an external power source when the sensing terminal 500 is not performing sensing. For example, the battery 550 is charged by an external power source when the sensing terminal 500 is placed in a retreat position described below. The battery 550 may also be charged by an external power source when removed from the sensing terminal 500.

The control unit 520 will now be described. The control unit 520 can transition between an active state and a sleep state. The active state is a state in which the control unit 520 executes a predetermined operation based on the detection result of the detection sensor 511. The predetermined operation includes, for example, converting a signal from the detection sensor 511 into a detection value. The predetermined operation also includes, for example, generating time series data of the detection value based on the signal from the detection sensor 511. The predetermined operation also includes, for example, compressing the time series data and storing it in the memory unit 530.

The sleep state is a state in which less power is consumed than the active state. The sleep state includes, for example, a state in which the control unit 520 does not convert a signal from the detection sensor 511 into a detection value. The sleep state also includes, for example, a state in which the control unit 520 does not generate time series data of the detection value. The sleep state also includes, for example, a state in which the control unit 520 does not compress the time series data or store it in the storage unit 530. The sleep state may also include, for example, a state in which the control unit 520 does not supply power to the detection sensor 511 for detecting the environment.

The mounting position of the sensing terminal 500 is not particularly limited, but in this embodiment, as shown in FIG. 2, the sensing terminal 500 is mounted, for example, on the nozzle 34. Also, in this embodiment, the sensing terminal 500 detects the temperature of the processing liquid passing through the nozzle 34 or the temperature of the nozzle 34. The sensing terminal 500 detects the temperature of the processing liquid or the temperature of the nozzle 34 when the nozzle 34 is placed at a predetermined position (for example, above the substrate W).

The control unit 520 transitions between an active state and a sleep state based on the detection result of the acceleration sensor 512. Therefore, for example, the control unit 520 can execute a predetermined operation only when the sensing terminal 500 is in a predetermined position or only when the substrate processing apparatus 100 is performing a predetermined process. Therefore, the control unit 520 can be prevented from executing a predetermined operation when the sensing terminal 500 is not in a predetermined position or when the substrate processing apparatus 100 is not performing a predetermined process. As a result, the power consumption of the sensing terminal 500 can be reduced. In this embodiment, for example, the power consumption of the sensing terminal 500 can be reduced when the nozzle 34 is not in a predetermined position above the substrate W.

In this embodiment, the control unit 520 transitions between an active state and a sleep state based on at least one of the pattern of time-series data generated based on the detection result of the acceleration sensor 512 and the position calculated based on the detection result of the acceleration sensor 512. Therefore, for example, the control unit 520 can easily transition between an active state and a sleep state based on whether the sensing terminal 500 is in a predetermined position or whether the substrate processing apparatus 100 is performing a predetermined process. Therefore, when the sensing terminal 500 is not in a predetermined position or when the substrate processing apparatus 100 is not performing a predetermined process, the control unit 520 can easily be prevented from performing a predetermined operation. Furthermore, since the execution of a predetermined operation by the control unit 520 can be prevented, the amount of data stored in the memory unit 530 can be reduced. Therefore, it is also possible to reduce the size of the memory unit 530.

Specifically, the control unit 520 generates time series data based on, for example, the detection result of the acceleration sensor 512. Also, the control unit 520 generates a pattern of time series data based on, for example, the detection result of the acceleration sensor 512. FIG. 4 is a diagram showing an example of a pattern of time series data related to acceleration generated based on the detection result of the acceleration sensor 512. FIG. 5 is a diagram showing an example of a pattern of time series data related to speed generated based on the detection result of the acceleration sensor 512. The pattern of the time series data may be a pattern of time series data related to acceleration (see FIG. 4). Also, the pattern of the time series data may be a pattern of time series data related to speed (see FIG. 5). Also, the pattern of the time series data may be a pattern of time series data related to position (not shown). In this way, the pattern of the time series data is, for example, acceleration, speed, or position on the vertical axis and time on the horizontal axis. When the substrate processing apparatus 100 performs the same process, for example, the pattern of the time series data of the member (here, the nozzle 34) to which the acceleration sensor 512 is attached will be approximately the same pattern.

More specifically, the control unit 520 calculates the position of the sensing terminal 500 based on, for example, the detection result of the acceleration sensor 512. In other words, the control unit 520 calculates, for example, the position of the acceleration sensor 512, the position of the detection sensor 511, or the position of a member to which the sensing terminal 500 is fixed, based on, for example, the detection result of the acceleration sensor 512. For example, the position of the sensing terminal 500 is calculated by integrating the movement direction and movement distance of the sensing terminal 500 with respect to the position of the sensing terminal 500 at the evacuation position (for example, the home position). The movement direction and movement distance of the sensing terminal 500 can be calculated, for example, by integrating the detection value of the acceleration sensor 512 twice.

In addition, in this embodiment, the control unit 520 determines whether the detection sensor 511 is placed at a predetermined position based on at least one of the pattern of the time series data (see Figures 4 and 5) and the calculated position of the sensing terminal 500. Therefore, it is possible to easily determine whether the sensing terminal 500 is at a predetermined position or whether the substrate processing apparatus 100 is performing a predetermined process based on at least one of the pattern of the time series data and the calculated position. Then, when the control unit 520 determines that the sensing terminal 500 is placed at the predetermined position, it transitions from a sleep state to an active state. Therefore, it is possible to easily prevent the control unit 520 from performing a predetermined operation when the sensing terminal 500 is not at the predetermined position or when the substrate processing apparatus 100 is not performing the predetermined process.

In addition, in this embodiment, the control unit 520 determines whether the sensing terminal 500 has been moved from the predetermined position based on the detection result of the acceleration sensor 512, and transitions from an active state to a sleep state if it is determined that the sensing terminal 500 has been moved from the predetermined position. Therefore, based on at least one of the pattern of the time series data and the calculated position, it can be easily determined whether the sensing terminal 500 is at a predetermined position or whether the substrate processing apparatus 100 is performing a predetermined process. Therefore, when the sensing terminal 500 is not at a predetermined position or when the substrate processing apparatus 100 is not performing a predetermined process, the control unit 520 can be easily prevented from performing a predetermined operation.

Next, for ease of understanding, before describing the sensing method using the sensing terminal 500, an example of a substrate processing method using the substrate processing apparatus 100 will be described with reference to FIG. 6. FIG. 6 is a flow chart showing an example of a substrate processing method using the substrate processing apparatus 100.

An example of a substrate processing method using the substrate processing apparatus 100 of this embodiment includes steps S1 to S6. Steps S1 to S6 are executed by the control unit 102.

As shown in FIG. 6, in step S1, the control unit 520 moves the nozzle 34 to the discharge position. Specifically, the control unit 520 moves the nozzle 34 from the retracted position to the discharge position by the drive mechanism 383. For example, the retracted position is a position moved horizontally from above the substrate W. In other words, the retracted position is a position other than above the substrate W. The discharge position is a position above the substrate W. The discharge position is a position where the nozzle 34 is positioned when the processing liquid is discharged from the nozzle 34.

Next, in step S2, the control unit 520 rotates the substrate W using the substrate holding unit 20. Specifically, the control unit 520 rotates the spin base 21 using the electric motor 24, thereby rotating the substrate W. Note that in this embodiment, the nozzle 34 is moved to the discharge position and then the rotation of the substrate W is started, but the nozzle 34 may be moved to the discharge position after the rotation of the substrate W is started, or the movement of the nozzle 34 to the discharge position and the start of the rotation of the substrate W may be performed in parallel.

Next, in step S3, the control unit 520 ejects the processing liquid from the nozzle 34. The processing liquid is ejected from the nozzle 34 onto the substrate W while being heated to a predetermined temperature by a heater (not shown). This causes the substrate W to undergo a predetermined process (etching, etc.).

Next, in step S4, the control unit 520 stops the ejection of the treatment liquid from the nozzle 34. Specifically, when a predetermined time has elapsed since the ejection of the treatment liquid was started in step S3, the control unit 520 stops the ejection of the treatment liquid.

Next, in step S5, the control unit 520 stops the rotation of the substrate W. Specifically, the control unit 520 stops the rotation of the spin base 21 by the electric motor 24, thereby stopping the rotation of the substrate W.

Next, in step S6, the control unit 520 moves the nozzle 34 to the retracted position. Specifically, the control unit 520 moves the nozzle 34 from the discharge position to the retracted position by the drive mechanism 383. Note that in this embodiment, the nozzle 34 is moved to the retracted position after the rotation of the substrate W is stopped, but the rotation of the substrate W may be stopped after the nozzle 34 is moved to the retracted position, or the rotation of the substrate W may be stopped and the nozzle 34 may be moved to the retracted position in parallel.

This completes the processing of the substrate W.

Next, a sensing method using the sensing terminal 500 of this embodiment will be described. FIG. 7 is a flowchart showing an example of a sensing method using the sensing terminal 500.

The sensing method by the sensing terminal 500 of this embodiment includes steps S101 to S105. Steps S101 to S105 are executed by the control unit 520. Note that steps S101 and S104 are an example of a "step in which the acceleration sensor detects acceleration" in the present invention. Also, steps S102 and S105 are an example of a "step in which a transition is made between an active state and a sleep state" in the present invention.

As shown in FIG. 7, in step S101, the control unit 520 determines whether the sensing terminal 500 is placed in a predetermined position. Note that in step S101, the control unit 520 is in a sleep state.

Specifically, when the nozzle 34 moves from the retracted position to the discharge position in step S1, the acceleration sensor 512 detects a change in acceleration. More specifically, the acceleration sensor 512 detects that the horizontal acceleration is increasing. The control unit 520 generates a time series data pattern (see FIG. 4 and FIG. 5) based on the detection result of the acceleration sensor 512, and determines whether the sensing terminal 500 is placed at a predetermined position based on the pattern of the time series data. Alternatively, the control unit 520 calculates the position of the sensing terminal 500 based on the detection result of the acceleration sensor 512, and determines whether the sensing terminal 500 is placed at a predetermined position based on the calculated position. Note that the control unit 520 may determine whether the sensing terminal 500 is placed at a predetermined position based on both the pattern of the time series data and the calculated position.

For example, the control unit 520 compares the pattern of the generated time series data with a reference pattern previously stored in the storage unit 530. For example, the control unit 520 determines whether the sensing terminal 500 is placed at a predetermined position based on whether the degree of match between the pattern of the generated time series data and the reference pattern previously stored in the storage unit 530 is equal to or greater than a threshold value.

Alternatively, for example, the control unit 520 compares the calculated position with a target position previously stored in the storage unit 530. For example, the control unit 520 determines whether the sensing terminal 500 is placed at a predetermined position based on whether the degree of agreement between the calculated position and the target position previously stored in the storage unit 530 is equal to or greater than a threshold value.

If the control unit 520 determines in step S101 that the sensing terminal 500 is not placed in the predetermined position, the process repeats step S101. Specifically, the process repeats step S101 until the nozzle 34 is placed in the ejection position in step S1.

On the other hand, if the control unit 520 determines in step S101 that the sensing terminal 500 is placed in a predetermined position, the process proceeds to step S102. Specifically, when the nozzle 34 is placed in the ejection position in step S1, the process proceeds to step S102.

Next, in step S102, the control unit 520 transitions from the sleep state to the active state.

Next, in step S103, the control unit 520 executes sensing. That is, sensing is executed by the sensing terminal 500. Specifically, the control unit 520 converts the signal from the detection sensor 511 into a detection value. The control unit 520 also uses the converted detection value to generate time series data of the detection value. The control unit 520 also compresses the generated time series data and stores it in the storage unit 530.

Next, in step S104, the control unit 520 determines whether the sensing terminal 500 has been moved from a predetermined position. Specifically, when the nozzle 34 moves from the ejection position to the retracted position in step S6 above, the acceleration sensor 512 detects a change in acceleration.

For example, similar to step S101, the control unit 520 determines whether the sensing terminal 500 has been moved from a predetermined position based on whether the degree of match between the pattern of the generated time series data and a reference pattern previously stored in the storage unit 530 is equal to or greater than a threshold value.

Alternatively, for example, the control unit 520 may determine whether the sensing terminal 500 has been moved from a predetermined position based on whether the degree of coincidence between the calculated position and the evacuation position previously stored in the memory unit 530 is equal to or greater than a threshold value, in a manner similar to step S101.

If the control unit 520 determines in step S104 that the sensing terminal 500 has not been moved from the predetermined position, the process returns to step S103. Specifically, the process repeats steps S103 and S104 until the nozzle 34 starts moving from the discharge position toward the retracted position in step S6 above. Alternatively, the process may repeat steps S103 and S104 until the nozzle 34 reaches the retracted position in step S6 above.

On the other hand, if the control unit 520 determines in step S104 that the sensing terminal 500 has been moved from the predetermined position, the process proceeds to step S105. Specifically, when the nozzle 34 starts to move from the discharge position toward the retracted position in step S6, the process proceeds to step S105. Alternatively, when the nozzle 34 reaches the retracted position in step S6, the process may proceed to step S105.

Next, in step S105, the control unit 520 transitions from the active state to the sleep state. This causes the control unit 520 to stop sensing. In other words, sensing by the sensing terminal 500 is stopped. Specifically, the control unit 520, for example, does not convert the signal from the detection sensor 511 into a detection value. Alternatively, the control unit 520 may not generate time series data using the converted detection value. Alternatively, the control unit 520 may not compress the time series data or store it in the storage unit 530. Alternatively, by transitioning to the sleep state, the control unit 520 may not receive the detection result from the detection sensor 511, or may not supply a voltage to the detection sensor 511 for detecting the environment.

In this way, sensing by the sensing terminal 500 is completed.

The first embodiment of the present invention has been described above with reference to Figures 1 to 7. In this embodiment, as described above, for example, the controller 520 can execute a predetermined operation only when the sensing terminal 500 is in a predetermined position or when the substrate processing apparatus 100 is performing a predetermined process. Therefore, the controller 520 can be prevented from executing a predetermined operation when the sensing terminal 500 is not in a predetermined position or when the substrate processing apparatus 100 is not performing a predetermined process. As a result, the power consumption of the sensing terminal 500 can be reduced. In this embodiment, for example, the power consumption of the sensing terminal 500 can be reduced when the nozzle 34 is not in a discharge position above the substrate W.

As described above, in step S104, the nozzle 34 starts to move from the discharge position toward the retracted position, and the process proceeds to step S105. Therefore, the active state transitions to the sleep state at an earlier timing than when the process proceeds to step S105 after the nozzle 34 reaches the retracted position. This makes it possible to further reduce the power consumption of the sensing terminal 500.

Second Embodiment
Next, a sensing terminal 500 according to a second embodiment of the present invention will be described with reference to Fig. 8. In the second embodiment, unlike the first embodiment, an example will be described in which the sensing terminal 500 is attached to the substrate holding unit 20. Fig. 8 is a schematic diagram showing a state in which the sensing terminal 500 of this embodiment is attached to the substrate holding unit 20 of the substrate processing apparatus 100.

As shown in FIG. 8, the sensing terminal 500 is attached to the substrate holding unit 20. In this embodiment, the sensing terminal 500 is attached to the spin base 21 of the substrate holding unit 20. The sensing terminal 500 detects, for example, the temperature of the spin base 21 or the temperature of the substrate W placed on the spin base 21. In this embodiment, the sensing terminal 500 detects the temperature of the spin base 21 or the temperature of the substrate W while the spin base 21 is rotating.

In this embodiment, the control unit 520 compares the detection result of the acceleration sensor 512 with a predetermined threshold value, and transitions between an active state and a sleep state based on the comparison result. Therefore, for example, it is not necessary to generate a pattern of time series data of the detection value of the acceleration sensor 512 or calculate the position of the sensing terminal 500. Therefore, the control unit 520 can easily transition between an active state and a sleep state. In this embodiment, for example, it is possible to reduce the power consumption of the sensing terminal 500 when the substrate W is not rotating.

Specifically, the control unit 520 determines whether the detection result of the acceleration sensor 512 is equal to or greater than a predetermined threshold (hereinafter, sometimes referred to as a first threshold). The predetermined threshold is a predetermined value, and is stored, for example, in the memory unit 530. The predetermined threshold is, for example, a value greater than zero and less than the acceleration when the substrate W is being processed. Then, when the detection result of the acceleration sensor 512 is equal to or greater than the predetermined threshold, the control unit 520 transitions from a sleep state to an active state. Therefore, for example, the control unit 520 can easily perform a predetermined operation only when the substrate processing apparatus 100 is performing a predetermined process. Therefore, the control unit 520 can easily be prevented from performing a predetermined operation when the substrate processing apparatus 100 is not performing a predetermined process.

The control unit 520 also determines whether the detection result of the acceleration sensor 512 is less than a predetermined threshold (hereinafter, sometimes referred to as the second threshold). When the detection result of the acceleration sensor 512 is less than the predetermined threshold, the control unit 520 transitions from the active state to the sleep state. Note that the second threshold may be the same as the first threshold, or may be different from the first threshold.

Next, a sensing method using the sensing terminal 500 of this embodiment will be described. FIG. 9 is a flowchart showing an example of a sensing method using the sensing terminal 500.

The sensing method by the sensing terminal 500 of this embodiment includes steps S201 to S205. Steps S201 to S205 are executed by the control unit 520. Note that steps S201 and S204 are an example of a "step in which the acceleration sensor detects acceleration" in the present invention. Also, steps S202 and S205 are an example of a "step in which the sensor transitions between an active state and a sleep state" in the present invention.

As shown in FIG. 9, in step S201, the control unit 520 determines whether the detection result of the acceleration sensor 512 is equal to or greater than a predetermined threshold value (first threshold value). Note that in step S201, the control unit 520 is in a sleep state.

Specifically, when the spin base 21 of the substrate holding unit 20 starts to rotate in step S2, the acceleration sensor 512 detects a change in acceleration. More specifically, the acceleration sensor 512 detects an increase in radial acceleration around the rotation axis Ax. The control unit 520 determines whether the detection result of the acceleration sensor 512 is equal to or greater than a predetermined threshold. Note that when the spin base 21 is not rotating, the detection result of the acceleration sensor 512 is, for example, zero. Also, as the rotation speed of the spin base 21 increases, the detection result of the acceleration sensor 512 also increases.

If the control unit 520 determines in step S201 that the detection result of the acceleration sensor 512 is not equal to or greater than the predetermined threshold, the process repeats step S201. Specifically, the process repeats step S201 until the rotation speed of the spin base 21 becomes equal to or greater than the predetermined value in step S2 above.

On the other hand, if the control unit 520 determines in step S201 that the detection result of the acceleration sensor 512 is equal to or greater than a predetermined threshold, the process proceeds to step S202. Specifically, if the rotation speed of the spin base 21 is equal to or greater than a predetermined value in step S2, the process proceeds to step S202.

Next, in step S202, the control unit 520 transitions from the sleep state to the active state.

Next, in step S203, the control unit 520 executes sensing. That is, sensing is executed by the sensing terminal 500. Specifically, the control unit 520 converts the signal from the detection sensor 511 into a detection value. The control unit 520 also uses the converted detection value to generate time series data of the detection value. The control unit 520 also compresses the generated time series data and stores it in the storage unit 530.

Next, in step S204, the control unit 520 determines whether the detection result of the acceleration sensor 512 is less than a predetermined threshold (second threshold). Specifically, when the rotation of the spin base 21 is stopped in step S5 above, the rotation speed of the spin base 21 becomes less than the predetermined value and then becomes zero.

If the control unit 520 determines in step S204 that the detection result of the acceleration sensor 512 is not below the predetermined threshold, the process returns to step S203. Specifically, the process repeats steps S203 and S204 until the rotation speed of the spin base 21 becomes less than the predetermined value in step S5 above.

On the other hand, if the control unit 520 determines in step S204 that the detection result of the acceleration sensor 512 is below the predetermined threshold, the process proceeds to step S205. Specifically, if the rotation speed of the spin base 21 is below the predetermined value in step S5, the process proceeds to step S205.

Next, in step S205, the control unit 520 transitions from the active state to the sleep state. This causes the control unit 520 to stop sensing. In other words, sensing by the sensing terminal 500 stops.

In this way, sensing by the sensing terminal 500 is completed.

The rest of the configuration and sensing method of the second embodiment are the same as those of the first embodiment.

The second embodiment of the present invention has been described above with reference to Figures 8 and 9. In this embodiment, as described above, the control unit 520 compares the detection result of the acceleration sensor 512 with a predetermined threshold value, and transitions between an active state and a sleep state based on the comparison result. Therefore, the control unit 520 does not need to generate a pattern of time-series data of the detection value of the acceleration sensor 512 or calculate the position of the sensing terminal 500, for example. Therefore, the control unit 520 can easily transition between an active state and a sleep state. In this embodiment, for example, the power consumption of the sensing terminal 500 when the substrate W is not rotating can be easily suppressed.

The other effects of the second embodiment are the same as those of the first embodiment.

Above, the embodiments of the present invention have been described with reference to the drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist of the present invention. In addition, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be deleted from all components shown in the embodiments. Furthermore, components across different embodiments may be appropriately combined. The drawings are mainly shown schematically for ease of understanding, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of drawing. In addition, the material, shape, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited, and various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

For example, in the above embodiment, an example has been described in which the data stored in the storage unit 530 is transmitted to the receiving device when the sensing terminal 500 is not performing sensing, but the present invention is not limited to this. The data stored in the storage unit 530 may be transmitted to the receiving device when the sensing terminal 500 is performing sensing. With this configuration, the amount of data stored in the storage unit 530 can be reduced, and the storage unit 530 can be made smaller.

In the above embodiment, an example was described in which the sensing terminal 500 was attached to the nozzle 34 or the spin base 21, but the present invention is not limited to this. For example, the sensing terminal 500 may be a terminal having a wafer shape. If configured in this way, it is possible to easily detect, for example, the temperature of the substrate W during processing, or the temperature of the chemical liquid discharged onto the substrate W during processing.

In the above embodiment, an example of detecting the environment during processing of the substrate W has been described, but the present invention is not limited to this. For example, the environment during transport of the substrate W by the indexer robot 140 or the center robot 150 may be detected.

In addition, for example, in the first embodiment, an example has been described in which the control unit 520 transitions from a sleep state to an active state when the sensing terminal 500 is placed in a predetermined position, but the present invention is not limited to this. For example, the control unit 520 may transition from an active state to a sleep state when the sensing terminal 500 is placed in a predetermined position.

In addition, for example, in the first embodiment, an example has been described in which the control unit 520 transitions from an active state to a sleep state when the detection sensor 511 is moved from a predetermined position, but the present invention is not limited to this. For example, the control unit 520 may transition from a sleep state to an active state when the detection sensor 511 is moved from a predetermined position.

In addition, for example, in the second embodiment, an example is described in which the state transitions from the sleep state to the active state when the detection result of the acceleration sensor 512 becomes equal to or greater than a predetermined threshold, but the present invention is not limited to this. For example, the state transitions from the active state to the sleep state when the detection result of the acceleration sensor 512 becomes equal to or greater than a predetermined threshold.

In addition, for example, in the second embodiment, an example is described in which the active state transitions to the sleep state when the detection result of the acceleration sensor 512 falls below a predetermined threshold, but the present invention is not limited to this. For example, the active state may transition from the sleep state when the detection result of the acceleration sensor 512 falls below a predetermined threshold.

The present invention is suitable for use in sensing terminals and sensing methods.

100: Substrate processing apparatus (manufacturing apparatus, semiconductor manufacturing apparatus)
500: sensing terminal 511: detection sensor 512: acceleration sensor 520: control unit 550: battery

Claims (8)

A detection sensor for detecting an environment inside the manufacturing device;
a control unit capable of transitioning between an active state in which a predetermined operation is performed based on a detection result of the detection sensor and a sleep state in which power consumption is lower than that of the active state;
A battery that supplies power to the control unit;
An acceleration sensor for detecting acceleration,
The control unit transitions between the active state and the sleep state based on a detection result of the acceleration sensor. The sensing terminal according to claim 1, wherein the control unit transitions between the active state and the sleep state based on at least one of a pattern of time-series data generated based on the detection results of the acceleration sensor and a position calculated based on the detection results of the acceleration sensor. The control unit is
determining whether the sensing terminal is placed at a predetermined position based on at least one of the pattern and the position;
The sensing terminal according to claim 2 , wherein when it is determined that the sensing terminal has been placed at the predetermined position, the sensing terminal transitions from the sleep state to the active state. The control unit is
determining whether the sensing terminal has been moved from the predetermined position based on a detection result of the acceleration sensor;
The sensing terminal according to claim 3 , wherein when it is determined that the sensing terminal has been moved from the predetermined position, the sensing terminal transitions from the active state to the sleep state. The control unit is
A detection result of the acceleration sensor is compared with a predetermined threshold value;
The sensing terminal according to claim 1 , wherein the sensing terminal transitions between the active state and the sleep state based on a result of the comparison. The control unit is
determining whether the detection result of the acceleration sensor is equal to or greater than the predetermined threshold;
The sensing terminal according to claim 5 , wherein when the predetermined threshold is reached or exceeded, the sensing terminal transitions from the sleep state to the active state. The sensing terminal according to any one of claims 1 to 6, wherein the manufacturing equipment is a semiconductor manufacturing equipment that manufactures semiconductor devices. A sensing method using a sensing terminal including a detection sensor for detecting an environment inside a manufacturing device, an acceleration sensor, a control unit, and a battery for supplying power to the control unit,
the control unit is capable of transitioning between an active state in which a predetermined operation is performed based on a detection result of the detection sensor and a sleep state in which power consumption is lower than that of the active state;
The sensing method includes:
detecting an acceleration by the acceleration sensor;
and the control unit transitions between the active state and the sleep state based on a detection result of the acceleration sensor.

Images