JP2024022435A - スピーカ及び電子機器 - Google Patents
スピーカ及び電子機器 Download PDFInfo
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- JP2024022435A JP2024022435A JP2022209322A JP2022209322A JP2024022435A JP 2024022435 A JP2024022435 A JP 2024022435A JP 2022209322 A JP2022209322 A JP 2022209322A JP 2022209322 A JP2022209322 A JP 2022209322A JP 2024022435 A JP2024022435 A JP 2024022435A
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- speaker
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- loudspeaker
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- 238000013016 damping Methods 0.000 claims description 6
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- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 description 14
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- 230000004308 accommodation Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000013017 mechanical damping Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
- H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
- H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/283—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm
- H04R1/2834—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Description
スピーカハウジング、スピーカ本体及び共振器を含み、
前記スピーカ本体は、前記スピーカハウジング内に設けられ、前記スピーカ本体は、振動発音するために用いられ、前記スピーカ本体は、前記スピーカハウジングを前音響チャンバ及び後音響チャンバに仕切り、前記スピーカハウジングには、拡声孔が開設され、前記前音響チャンバは、前記拡声孔を介して前記スピーカハウジングの外部と連通し、
前記共振器は、前記スピーカハウジングに設けられ、前記共振器は、一方側が前記前音響チャンバに対応して設けられ、他方側が前記スピーカハウジングの外部に露出する。
10 スピーカハウジング
101 前音響チャンバ
102 後音響チャンバ
103 拡声孔
11 スピーカ本体
12 共振器
121 ベース
122 複合膜
2 電子機器
21 ハウジング
22 音出し孔
L1 第1方向
L2 第2方向
Claims (10)
- スピーカであって、
スピーカハウジング、スピーカ本体及び共振器を含み、
前記スピーカ本体は、前記スピーカハウジング内に設けられ、前記スピーカ本体は、振動発音するために用いられ、前記スピーカ本体は、前記スピーカハウジングを前音響チャンバ及び後音響チャンバに仕切り、前記スピーカハウジングには、拡声孔が開設され、前記前音響チャンバは、前記拡声孔を介して前記スピーカハウジングの外部と連通し、
前記共振器は、前記スピーカハウジングに設けられ、前記共振器は、一方側が前記前音響チャンバに対応して設けられ、他方側が前記スピーカハウジングの外部に露出することを特徴とするスピーカ。 - 前記拡声孔は、前記スピーカ本体の振動方向の法線方向に位置し、前記共振器は、前記スピーカ本体に近接しつつ、前記拡声孔から離れるように設けられていることを特徴とする請求項1に記載のスピーカ。
- 前記共振器は、前記スピーカ本体の振動方向の法線方向に位置し、前記拡声孔と前記共振器とは、前記スピーカハウジングの対向する両側に設けられていることを特徴とする請求項2に記載のスピーカ。
- 前記スピーカ本体の振動方向の法線方向において、前記スピーカハウジングでの前記拡声孔の正投影は、前記スピーカハウジングでの前記共振器の正投影内に完全に含まれることを特徴とする請求項3に記載のスピーカ。
- 前記共振器は、前記スピーカ本体の振動方向に位置し、且つ前記スピーカ本体と対向する位置に設けられていることを特徴とする請求項2に記載のスピーカ。
- 前記共振器の延在方向は、前記スピーカ本体の振動方向と所定の夾角を形成することを特徴とする請求項2に記載のスピーカ。
- 前記共振器は、複数設けられていることを特徴とする請求項1に記載のスピーカ。
- 前記スピーカ内には、吸音材料が設けられていることを特徴とする請求項1に記載のスピーカ。
- 前記共振器は、アダプタを介して前記スピーカハウジングに固定設置され、前記共振器は、前記スピーカハウジングに一体成形されるか又は前記共振器は、音響ダンピングを有するメッシュにより保護されることを特徴とする請求項1に記載のスピーカ。
- 電子機器であって、ハウジングと、前記ハウジング内に取り付けられた請求項1~9のいずれか一項に記載のスピーカとを含み、前記ハウジングには、音出し孔が開設され、前記音出し孔は、前記拡声孔と対向し且つ連通することを特徴とする電子機器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/881,662 US12133047B2 (en) | 2022-08-05 | 2022-08-05 | Speaker and electronic device |
US17/881,662 | 2022-08-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2024022435A true JP2024022435A (ja) | 2024-02-16 |
JP7523519B2 JP7523519B2 (ja) | 2024-07-26 |
Family
ID=83867199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022209322A Active JP7523519B2 (ja) | 2022-08-05 | 2022-12-27 | スピーカ及び電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US12133047B2 (ja) |
JP (1) | JP7523519B2 (ja) |
CN (1) | CN115314816A (ja) |
WO (1) | WO2024026989A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12133047B2 (en) * | 2022-08-05 | 2024-10-29 | Aac Microtech (Changzhou) Co., Ltd. | Speaker and electronic device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2811215A (en) * | 1955-03-07 | 1957-10-29 | Rudd Edward Company | Sound reproducing apparatus |
WO1991019406A1 (en) * | 1990-05-25 | 1991-12-12 | Mitsubishi Denki Kabushiki Kaisha | Speaker system |
CN1443021A (zh) * | 2002-03-01 | 2003-09-17 | 阿尔卑斯电气株式会社 | 音响装置 |
US8731223B2 (en) * | 2011-12-13 | 2014-05-20 | Bujeon Co., Ltd. | Microspeaker with inner resonance chamber |
CN107333216A (zh) * | 2017-07-04 | 2017-11-07 | 瑞声科技(新加坡)有限公司 | 扬声器箱 |
CN108337598B (zh) * | 2018-03-06 | 2024-08-16 | 东莞市扎克电子科技有限公司 | 一种设有谐振器的音箱及其谐振器 |
US10397693B1 (en) * | 2018-03-09 | 2019-08-27 | Apple Inc. | Acoustic chambers damped with plural resonant chambers, and related systems and methods |
CN208638636U (zh) * | 2018-08-02 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | 扬声器箱 |
CN108882126B (zh) * | 2018-08-02 | 2020-07-14 | 瑞声科技(新加坡)有限公司 | 扬声器箱 |
KR102706683B1 (ko) * | 2018-11-23 | 2024-09-13 | 삼성전자 주식회사 | 스피커 자성 차폐 구조 및 이를 포함하는 전자 장치 |
CN209659616U (zh) * | 2019-06-21 | 2019-11-19 | 歌尔科技有限公司 | 扬声器模组 |
WO2021038552A1 (en) * | 2019-08-28 | 2021-03-04 | Sonicedge Ltd. | A system and method for generating an audio signal |
CN112399313B (zh) * | 2020-10-30 | 2022-09-16 | 歌尔股份有限公司 | 发声器件 |
EP4282641A4 (en) * | 2021-01-28 | 2024-10-16 | SSI New Material (Zhenjiang) Co., Ltd. | ACOUSTIC REINFORCEMENT MATERIAL BLOCK AND ITS APPLICATION, MICRO SPEAKER AND ELECTRONIC DEVICE |
CN114745631B (zh) * | 2022-03-31 | 2025-04-01 | 歌尔股份有限公司 | 发声器模组及智能头戴设备 |
US12133047B2 (en) * | 2022-08-05 | 2024-10-29 | Aac Microtech (Changzhou) Co., Ltd. | Speaker and electronic device |
-
2022
- 2022-08-05 US US17/881,662 patent/US12133047B2/en active Active
- 2022-09-08 CN CN202211097679.1A patent/CN115314816A/zh active Pending
- 2022-09-16 WO PCT/CN2022/119195 patent/WO2024026989A1/zh unknown
- 2022-12-27 JP JP2022209322A patent/JP7523519B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20240048898A1 (en) | 2024-02-08 |
WO2024026989A1 (zh) | 2024-02-08 |
US12133047B2 (en) | 2024-10-29 |
JP7523519B2 (ja) | 2024-07-26 |
CN115314816A (zh) | 2022-11-08 |
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