JP2023510587A - temperature indicator - Google Patents

Abstract

A temperature indicator includes a housing having a temperature sensing assembly, a switch circuit, and a radio frequency identification (RFID) module coupled to the switch circuit. When the temperature sensing assembly is exposed to a temperature above the threshold, the switch circuit responds to the change in the malleable material to cause a change in the value output by the RFID module upon activation.

Description

Many types of objects need to be monitored or tracked due to their temperature sensitivity or fragility during manufacture, storage, transportation or use. For example, certain types of objects may be susceptible to damage when exposed to a certain temperature, or need to be maintained above or below a certain temperature, or (eg, medical, food and pharmaceutical products requiring sterilization). Therefore, it is desirable to determine and/or verify the environmental conditions to which objects have been exposed for quality control and/or general monitoring of shipping conditions.

According to one embodiment of the present disclosure, a temperature indicator includes a housing having a temperature detection assembly, a switch circuit, and a radio frequency identification (RFID) module coupled to the switch circuit. When the temperature sensing assembly is exposed to a temperature above the threshold, the switch circuit responds to the change in the malleable material and upon activation causes a change in the value output by the RFID module.

According to another embodiment of the present disclosure, a temperature indicator includes a housing having a support member including a non-conductive malleable material, a communication module, and at least partially disposed within the malleable material. a switch circuit having a switch element spaced from the conductive element. When the temperature indicator is exposed to a temperature above the threshold, a portion migrates within the malleable material and contacts the conductive element. The communication module is configured to indicate an activation state of the temperature indicator when a portion contacts the conductive element.

According to yet another embodiment of the present disclosure, a temperature indicator comprises a housing having a temperature sensing assembly, a release element configured to maintain the temperature sensing assembly in an unreleased state, a switch circuit, and a switch. a radio frequency identification (RFID) module coupled to the circuit. When the release element is removed from the temperature indicator, the temperature sensing assembly is in the release state. When the temperature sensing assembly is exposed to a temperature exceeding the threshold after being in a disarmed state, the switch circuit changes the value output by the RFID module upon activation.

For a more complete understanding of the present application, its objects and advantages, reference is made to the following description taken in conjunction with the accompanying drawings.

[0014] Fig. 4 illustrates an application of an embodiment of a temperature indicator in accordance with the present disclosure; FIG. 2 is a block diagram illustrating an embodiment of a temperature indicator in accordance with the present disclosure; [0014] Fig. 4 illustrates an embodiment of a temperature indicator according to the present disclosure in a non-activated state; 3B illustrates the temperature indicator of FIG. 3A in accordance with the present disclosure in a disarmed and non-activated state; FIG. FIG. 3C illustrates the temperature indicator of FIGS. 3A and 3B in accordance with the present disclosure in an activated state;

Embodiments of the present disclosure provide devices and techniques for temperature sensing and display. According to one embodiment, the temperature indicator includes a housing having a support member including a non-conductive malleable material, a communication module, and a conductive element disposed at least partially within the malleable material. a switch circuit having spaced apart switch elements. When the temperature indicator is exposed to a temperature above the threshold, a portion migrates within the malleable material and contacts the conductive element. The communication module is configured to indicate an activation state of the temperature indicator when a portion contacts the conductive element. Certain embodiments of the present disclosure enable detection of temperature events without the use of internal power supplies. For example, a temperature sensing assembly or mechanism changes the state of a switch circuit (eg, changes from an open circuit state to a closed circuit state) in response to detection of a particular temperature event.

The RFID module can detect the state of the switch circuit and send or output a specific value based on whether the switch circuit is closed or open. Thus, for example, an RFID reader can be used to activate the RFID module and determine the activation status of the temperature indicator device. Embodiments of the present disclosure provide temperature indicators that can be easily secured to containers, merchandise, etc. to provide at least an indication when a particular container or component has been exposed to a particular ambient temperature. Embodiments of the present disclosure further provide a temperature indicator that is an irreversible "go no go" device for indicating that the temperature indicator has received a predetermined temperature.

Referring to the drawings, and in particular FIG. 1, there is shown an exemplary illustration of a temperature indicator according to the present disclosure used in sterilization processes. For example, sterilization chambers and sterilization pouches can be used to sterilize medical devices and certain industrial devices. Examples of sterilization processes are steam heat, non-steam heat, ethylene oxide and hydrogen peroxide. In some of these sterilization processes, sterilization indicators are attached to containers/pouches or merchandise to ensure that the sterilization chamber is valid (ie, has reached the desired temperature). FIG. 1 shows sterilization chamber 300 with door 350 open. As such, it is possible to see the sterilization pouch 400 inside the sterilization chamber 300 . Since the sterilization chamber 300 of FIG. 1 is a temperature dependent chamber, the sterilization pouch 400 has a temperature indicator 10 according to the present disclosure to ensure that the sterilization chamber 300 is effective. Temperature indicator 10 may further be used for a variety of different end uses in addition to sterilization, such as vaccine monitoring, food monitoring, and monitoring of other temperature sensitive products during manufacture, storage, or transportation. Temperature indicator 10 may be a passive radio frequency identification (RFID) enabled indicator that may be read by an RFID reader in some embodiments. In some embodiments, another temperature indicator 20 visually readable by color change may be used in conjunction with chamber 300 . An example of a visually readable temperature indicator 20 is the WarmMark® product from SpotSee, Inc. of Dallas, Texas.

In the embodiment shown in FIG. 1, the temperature indicator 10 is a portable device configured to be secured to or placed in a sterilization pouch 400 (or any other item or packaging for which temperature monitoring is desired). is. Sterilization pouch 400 contains objects whose associated temperature events are monitored to determine the effectiveness of the sterilization process. Embodiments of temperature indicator 10 according to the present disclosure monitor whether an object has been exposed to a particular temperature or environment during manufacture, storage and/or transportation of the object. In some embodiments, the temperature indicator 10 may be secured to the shipping container, pouch, or item itself using, for example, adhesives, permanent or temporary fasteners, or various different types of attachment devices. The shipping container/pouch may comprise a container in which the surveillance object is loosely placed, or may comprise a container for the surveillance object itself. It should be appreciated that FIG. 1 is merely exemplary and is not intended to assert or imply any limitation with respect to the environments in which various embodiments may be implemented.

In the embodiment shown in FIG. 1, temperature indicator 10 comprises housing 12 in which temperature sensing, temperature sensitive and/or temperature sensing assembly 14 is disposed. In the illustrated embodiment, temperature sensing assembly 14 is configured to detect and respond to temperature events associated with temperature indicator 10 (e.g., temperature indicator 10 (and correspondingly temperature indicator 10 is associated with configured to detect when a container in which it is placed) has been exposed to a specific environmental temperature or temperature event).

FIG. 2 is a block diagram that represents and illustrates an embodiment of a temperature indicator 10 according to the present disclosure. In some embodiments, temperature indicator 10 closes or opens an electronic switch in response to receiving and/or detecting a temperature condition of sufficient magnitude and/or exceeding one or more specified thresholds to enable such The temperature indicator 10 may be part of the printed circuit board and/or fixed (permanently or removably) to the printed circuit board so as to provide an electronic signal/indication of a temperature event, and /or may alternatively be permanently or removably connected to electronic circuitry (eg, in a removable cartridge).

In FIG. 2 , indicator 10 includes release element 79 , switch circuit 81 , wireless communication module 83 coupled to switch circuit 81 , and temperature sensing assembly 14 coupled to switch circuit 81 . Release element 79 is configured to maintain indicator 10 in the non-released state until the released state of indicator 10 is desired. For example, in the non-disarmed state, the indicator 10 is configured to remain in the non-activated state even though it may undergo a temperature event exceeding the threshold. Accordingly, in the cleared state, indicator 10 is configured to provide an indication that a temperature event has been received in response to a temperature event exceeding the threshold. Switch circuit 81 may include one or more switch elements, contacts and/or circuits configured to respond to changes in temperature sensing assembly 14 . The wireless communication module 83 is configured to wirelessly communicate information related to the state of the switch circuit 81 indicating the activation state of the indicator 10 (eg, based on the open circuit state or the closed circuit state of the switch circuit 81). For example, in one embodiment, wireless communication module 83 includes RFID module 84 . In one embodiment, the RFID module 84 is a passive RFID module 84 having an RFID integrated circuit or RFID circuit 86 (eg, located on or as part of a printed circuit board) and a memory 87 along with an antenna 91. have. As a passive RFID module 84, indicator 10 does not have a battery (eg, powered by RFID reader 100). For example, when RFID module 84 receives radio waves from RFID reader 100 , antenna 91 forms a magnetic field and supplies power to RFID module 84 to energize RFID circuit 86 . When energized/activated, RFID module 84 may output/transmit encoded information in memory 87 . However, in some embodiments, the RFID module 84 may be configured to transmit or transmit certain information continuously, intermittently, and/or in response to program or event triggers powered by a power source (e.g., battery ). The wireless communication module 83 is capable of handling other types of wireless communication types, modes, protocols and/or formats (e.g., Short Message Service (SMS), wireless data using General Packet Radio Service (GPRS)/3G/4G, Wi-Fi, etc.). Wireless data over public internet over Fi or Wi-Fi, Z-Wave, ZigBee, Bluetooth®, Bluetooth® Low Energy (BLE), LoRA, NB-IoT, SigFox, Digital Enhanced Cordless It should further be appreciated that other wireless communication protocol standards such as Telecommunications (DECT) or wireless data using other common techniques locally). As further described below, the temperature indicator 10 is such that the conductive member opens or closes an electronic switch (eg, switch circuit 81) in response to a particular temperature (eg, a temperature above a threshold). Functions as a thermal fuse. This configuration allows temperature indicator 10 to be used as a passive temperature sensor/indicator that can be used as part of an electronic signal or circuit. In some embodiments, the temperature sensing capabilities/functions of the temperature indicator 10 of the present disclosure do not require power during the monitoring state. When activated, the temperature indicator 10 completes or opens an electrical path in the circuit and can thus be integrated into most electronic monitoring systems.

In the illustrated embodiment, memory 87 contains at least two different stored and/or encoded values 92 and 94 . For example, value 92 may correspond to a value output/sent by RFID module 84 when switch circuit 81 is in an open circuit condition or state, and value 94 may correspond to a value output/transmitted by switch circuit 81 in a closed circuit condition or state. It may correspond to a value output/sent by the RFID module 84 at a given time. As an example, value 94 may represent an RFID tag identification (ID) number for which temperature switch circuit 81 has not been activated, where the RFID tag's ID number has an additional character (e.g., "0") at the end. good too. The value 92 may represent the RFID identification (ID) number that the temperature switch circuit 81 is activating, with the ID number of the RFID tag suffixed with an additional character that differs from the additional character of the value 94 (e.g., "1 ”). In the illustrated embodiment, RFID module 84 (eg, circuit 86) is coupled to switch circuit 81 and is capable of detecting whether switch circuit 81 is in an open circuit or closed circuit condition or state. is. Thus, for example, switch circuit 81 may initially be in an open circuit condition or state. Thus, RFID module 84 transmits value 94 to reader 100 when energized/activated by reader 100 . When indicator 10 is exposed to a temperature event (eg, environmental temperature exceeding a certain threshold), temperature sensing assembly 14 causes a change in switch circuit 81, which enters a closed circuit state or state. Thus, when energized/activated by reader 100 (eg, after a temperature event), RFID module 84 will instead transmit value 92 to reader 100 . Thus, although indicator 10 does not include or require any internal power source (e.g., battery), according to embodiments of the present invention, indicator 10 can be triggered by temperature conditions using an electronic indicator (e.g., RFID reader). It becomes possible to monitor delicate products/objects to which the indicator is attached for potential damage.

The present invention may be implemented by a computer into any technically possible level of detailed integration (eg, as described in computer-readable storage medium(s) (eg, memory 87)) for a processor to carry out aspects of the invention. It may contain program instructions. The computer readable program instructions described herein may be downloaded to respective computing/processing devices (eg, wireless communication module 83 and/or RFID module 84). Computer readable program instructions for carrying out the operations of the present invention include assembler instructions, Instruction Set Architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state setting data, configuration data for integrated circuits. , or source or object code written in any combination of one or more programming languages. In some embodiments, an electronic circuit (eg, circuit 86) including, for example, a programmable logic circuit, field programmable gate array (FPGA), or programmable logic array (PLA) can be customized to carry out aspects of the invention. The state information of the computer readable program instructions may be used to execute the computer readable program instructions. Aspects of the present invention are described herein with reference to illustrations and/or block diagrams of methods and/or apparatus according to embodiments of the invention. Each block of the illustrations and/or block diagrams, and combinations of blocks in the illustrations and/or block diagrams, may represent a module, segment, or portion of code that can be executed by computer-readable program instructions. is understood. Computer readable program instructions executed via a processor so as to provide means for performing the functions/acts specified in one or more blocks of the illustrations and/or block diagrams. may be provided to a processor or other programmable data processing device to produce the Computing device, programmable data such that a computer readable storage medium on which the instructions are stored comprises an article of manufacture that includes instructions for performing aspects of the functions/operations specified in one or more blocks of the illustrations and/or block diagrams. These computer readable program instructions, which may direct a processor and/or other device to function in a particular manner, may also be stored on a computer readable storage medium. Switch circuit 81, wireless communication module 83, and/or RFID module 84 may be implemented in any suitable manner using known technology, which may be hardware-based, software-based, or some combination of both. good too. For example, the switch circuit 81, the wireless communication module 83, and/or the RFID module 84 may reside in a processor or other type of logic chip (eg, as software and/or algorithms running on a processor unit) or may be in one integrated circuit. or as hardware logic distributed in different chips of a data processing system) to perform the various functions described above. good. As will be appreciated by those skilled in the art, aspects of the disclosure may be embodied as a system, method or computer program product. Aspects of the present disclosure may thus be described as either a hardware embodiment, a software embodiment (including firmware, resident software, microcode, etc.), or generally referred to herein as a "circuit," "module," or "system." Embodiments may take the form of a combination of what may be termed software and hardware aspects.

FIG. 3A illustrates an embodiment of an indicator 10 according to the present disclosure in an undisarmed state and prior to activation (eg, prior to detecting a particular temperature or time-temperature event and before indicator 10 is disarmed in the field). is. 3B illustrates an embodiment of indicator 10 according to the present disclosure after indicator 10 has been placed in a released state by removing release element 79, but before indicator 10 is activated by a temperature event. FIG. 3C illustrates an embodiment of indicator 10 after indicator 10 has been deactivated and activated (eg, after detecting a particular temperature or time-temperature event). In the embodiment shown in FIGS. 3A and 3B, switch circuit 81 is in an open circuit state until indicator 10 is exposed to a temperature above the threshold.

In the illustrated embodiment, detection assembly 14 includes support member 200 . In one embodiment, support member 200 is a printed circuit board (PCB) having vias 204 formed with an inner conductive contact surface 202 . For example, in the illustrated embodiment, vias 204 extend through support member 200 and are coated on inner walls 202 with a conductive material. In at least one embodiment, sensing assembly 14 includes a non-conductive malleable material 206 contained in (fully or partially filled) via 204 . Malleable material 206 is configured to soften when exposed to temperatures above a certain threshold. In the illustrated embodiment, RFID module 84 is coupled to support member 200 . However, it should be understood that RFID module 84 may be arranged in other manners.

In the embodiment shown in FIGS. 3A-3C, switch circuit 81 includes switch element 210 and switch element 212 . Switch element 212 is coupled to RFID module 84 and contacts 202 (e.g., one end of switch element 212 is coupled to RFID module 84 and another end of switch element 212 is coupled to contact 202 in via 204). connected and/or engaged). In the illustrated embodiment, the end of switch element 212 coupled to contact surface 202 is positioned within via 204 . However, the switch element 212 may be placed in contact with the contact surface 202 without the switch element 212 entering the via 204 (e.g., a portion of the contact surface 202 may be a support with which the switch element 212 may engage). extending to surface 222 of member 200). Switch elements 210, 212 and contacts 202 may comprise conductive wires, traces, pads, terminals, coatings and/or other types of conductive electronic components.

A switch element 210 is further coupled to RFID module 84 . In the embodiment shown in FIG. 3A (eg, the non-disarmed and non-activated state of indicator 10), switch element 210 extends around support member 200 and extends into via 204. In the embodiment shown in FIG. In the illustrated embodiment, switch element 212 engages contact 202 from a side or surface 222 of support member 200 . Retaining members 230 and 232 are provided on opposite sides or surfaces 224 of support member 200 (eg, opposite side 222). Retaining members 230 and 232 may be tape strips, mounted PCB elements, straps, fasteners, or portions of switch element 210 adjacent and/or near side 224 of support member 200. Any other material suitable for holding may be used. As shown in FIG. 3A, the switch elements 210, 212 face each other on the support member 200 such that a portion 240 of the switch element 210 is held adjacent the support member 200 by the retaining members 230, 232. Via 204 is entered from sides 224,222. However, it should be understood that the connection between switch element 210 and RFID module 84 may be made in other ways.

Tip 250 of switch element 210 is inserted into via 204 and malleable material 206, as shown in FIG. 3A. Tip 250 is configured to be in a biased state (eg, mechanical memory or stiffness) while positioned within via 204 . For example, in the embodiment shown in FIG. 3A, without an intervening force or blocking element (e.g., malleable material 206), tip 250 rotates counterclockwise (indicated by arrow 852 in FIG. 3A). The tip 250 is placed in the offset position and held in the offset position by the malleable material 206 so as to move toward the contact surface 202 immediately. Thus, in the deflected state or position of tip 250 , tip 250 is positioned away from contact surface 202 . Further, in the embodiment shown in FIG. 3A, the release element 79 is positioned between the tip 250 of the switch element 210 and the contact surface 202. As shown in FIG. Thus, in the non-disengaged state of indicator 10, even though indicator 10 may be exposed to temperatures above the threshold to soften malleable material 206 and thereby cause tip 250 to move in direction 852, the tip 250 may move in direction 852. Portion 250 is prevented from contacting contact surface 202 by release element 79 .

In the embodiment shown in FIG. 3B, indicator 10 is in the released state upon removal of release element 79 (eg, release element 79 is removed and not shown in FIG. 3B). In the embodiment shown in FIG. 3B, the indicator 10 has not yet been exposed to the specified temperature threshold after being disarmed and thus has not been activated. In the illustrated embodiment, the malleable material 206 causes the tip 250 to move to a deviated position (i.e., away from the contact surface 202) for a minimum period of time before the indicator 10 is subjected to a specified temperature threshold (i.e., time/temperature threshold). away). Until this time/temperature threshold is reached, malleable material 206 will not contact contact surface 202 at tip 250, even though release element 79 is removed while indicator 10 is released in the field. remains rigid enough to prevent In at least one embodiment, malleable material 206 will have greater malleability at higher temperatures, but malleable material 206 remains substantially within vias 204 (i.e., at least completely Care should be taken to maintain sufficient viscosity so that it does not exit via 204). Non-conductive waxes are examples of compounds that can be used as the malleable material 206 .

Thus, during operation, in a de-energized but non-activated state (eg, prior to the time-temperature parameter that softens the malleable material 206), the malleable material 206 is brought into contact with the tip 250 of the switch element 210. Switch element 210 does not contact contact surface 202 because it is or remains rigid enough to prevent contact with surface 202, and switch circuit 81 is in an open circuit condition or condition. In this state, the RFID module 84, when queried, will transmit a value 94 indicating an open circuit condition, thereby indicating that the indicator 10 still needs to be exposed to the time-temperature parameters that activate the indicator 10.

FIG. 3C shows an embodiment of indicator 10 in an activated state after indicator 10 has been exposed to certain time-temperature parameters. The time-temperature parameters cause material 206 to become more malleable, and the deflection (i.e., mechanical memory or stiffness) of tip 250 causes tip 250 to move in direction 852 toward contact surface 202 . Move through the material 206 . For example, when material 206 is exposed to high temperatures and becomes more malleable/soft, tip 250 moves in direction 852 and contacts contact surface 202 . Moreover, the process described above is irreversible because the mechanical memory of tip 250 allows tip 250 to maintain contact with contact surface 202 even as material 206 cools and later hardens. Since tip 250 contacts contact surface 202 and indicator 10 is activated, switch circuit 81 changes from an open circuit state to a closed circuit state. In a closed-circuit condition, RFID module 84, when interrogated (eg, by reader 100), transmits a value 92 indicative of a closed-circuit condition, thereby exposing indicator 10 to the time-temperature parameters that activate indicator 10. indicates that Embodiments of the present invention therefore provide a non-reversible time-temperature indicator 10 .

In the embodiment shown in FIGS. 3A-3C, switch circuit 81 is configured to be in an open circuit condition or condition in the non-activated state of indicator 10, such that indicator 10 is subjected to a particular time/temperature threshold. Thus, after activation of the indicator 10, the closed circuit state or status changes. However, indicator 10 may be configured in other manners (eg, to change from a closed circuit state or state when indicator 10 is not activated to an open circuit state or state after activation of indicator 10). For example, in one embodiment, tip 250 may be biased into contact with contact surface 202 (or may be biased into contact with a portion of switch element 212) in a non-activated state and It may be held in place by malleable material 206 . Thus, in this embodiment, when material 206 is exposed to high temperatures and becomes more malleable/soft, tip 250 disengages from contact surface 202 (or part of switch element 212) and switches. Put the circuit into an open circuit condition.

Accordingly, embodiments of the present disclosure provide temperature and/or time readings using a small footprint temperature indicator using a temperature sensing assembly having a passive RFID tag that provides different readings depending on the state of a temperature switch circuit. - Enable temperature event detection. Since RFID tags are passive, temperature indicators do not require batteries or other external power sources. Additionally, the configuration of the temperature indicator may allow the temperature indicator to become irreversible upon activation (or exposure to sufficient magnitude and/or duration of the temperature event). Further, the temperature indicators of the present disclosure may be configured to be coupled with or configured in addition to visual indicator 20 to provide extra or additional visual indication of activation. may be

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include plural forms as well, unless the context clearly dictates otherwise. The terms "comprises" and/or "comprising", as used herein, designate the presence of the recited features, integers, steps, acts, elements and/or parts. However, it is further understood that it does not exclude the presence or addition of one or more other features, integers, steps, acts, elements, parts and/or groups thereof.

The corresponding structures, materials, acts and equivalents of all means or steps in the following claims, and functional elements, perform their functions in combination with other claimed elements as specifically claimed. is intended to include any structure, material or act for The description of the present disclosure has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the disclosure in the form disclosed. Many adjustments and modifications will be apparent to those skilled in the art without departing from the scope and spirit of this disclosure. The present embodiments are provided to best illustrate the principles and practicalities of the present disclosure, and those skilled in the art may appreciate the disclosure of the various embodiments with various adjustments to suit the particular applications contemplated. selected for and described.

Claims (20)

a housing having a temperature sensing assembly;
a switch circuit;
a radio frequency identification (RFID) module coupled to the switch circuit;
A temperature indicator, wherein the switch circuit responds to a change in the malleable material and upon activation causes a change in the value output by the RFID module when the temperature sensing assembly is exposed to a temperature exceeding a threshold. the malleable material is configured to soften in response to a temperature exceeding the threshold;
2. The temperature indicator of claim 1, wherein the state of the switch circuit changes in response to softening of the malleable material. the temperature sensing assembly having a support member including the malleable material;
2. The temperature indicator of claim 1, wherein said switch circuit comprises a switch element at least partially disposed within said malleable material. The switch circuit is configured to be in either a closed circuit state or an open circuit state,
2. The temperature indicator of claim 1, wherein the state changes when the temperature sensing assembly is exposed to a temperature above the threshold. The temperature sensing assembly comprises:
a support member including a via formed with a conductive surface;
a malleable material disposed within the via;
the switch circuit having a switch element at least partially disposed within the malleable material and spaced apart from the conductive surface;
2. The temperature indicator of claim 1, wherein the switch element moves into contact with the conductive surface when the temperature sensing assembly is exposed to a temperature above the threshold. 2. The temperature indicator of claim 1, wherein said RFID module comprises a passive RFID module. The switch circuit includes a switch element disposed at least partially within the malleable material and biased towards a conductive element, the malleable material being biased toward the switch element in a non-activated state. holding a portion of the at a distance from the conductive element;
2. The temperature of claim 1, wherein a portion of the switch element moves over the resistance of the malleable material and contacts the electrically conductive element when the temperature sensing assembly is exposed to a temperature above the threshold. indicator. a temperature indicator,
a housing having a support member comprising a non-conductive malleable material;
a communication module;
a switch circuit having a switch element at least partially disposed within the malleable material and spaced apart from the electrically conductive element;
when the temperature indicator is exposed to a temperature exceeding a threshold, the portion migrates within the malleable material and contacts the electrically conductive element;
A temperature indicator, wherein the communication module is configured to indicate an activation state of the temperature indicator when the portion contacts the conductive element. 9. The temperature indicator of claim 8, wherein said communication module comprises a passive radio frequency identification (RFID) module. 9. The temperature indicator of Claim 8, wherein said portion deviates toward said conductive element. 9. When said temperature indicator is exposed to a temperature above said threshold, said malleable material softens, said softening causing said portion to move within said malleable material and contact said electrically conductive element. temperature indicator as described in . 9. The temperature indicator of Claim 8, wherein the switch circuit is configured to change from an open circuit to a closed circuit when the portion contacts the conductive element. a temperature indicator,
a housing having a temperature sensing assembly;
a release element configured to maintain the temperature sensing assembly in an unreleased state;
a switch circuit;
a radio frequency identification (RFID) module coupled to the switch circuit;
removing the release element from the temperature indicator places the temperature sensing assembly in a release state;
A temperature indicator, wherein the switch circuit activates to cause a change in the value output by the RFID module when the temperature sensing assembly is exposed to a temperature above a threshold after being in the disarmed state. 14. The temperature indicator of claim 13, wherein the switch circuit includes a switch element disposed at least partially within a malleable material and biased towards the conductive element. the switch circuit having a switch element disposed at least partially within the malleable material and biased toward the conductive element;
14. The temperature indicator of claim 13, wherein the release element is positioned between the portion and the conductive element in the non-released state. The temperature sensing assembly comprises:
a support member including a via formed with a conductive surface;
a non-conductive malleable material disposed within the via;
the switch circuit having a switch element at least partially disposed within the malleable material and spaced apart from the conductive surface;
14. The temperature indicator of claim 13, wherein the switch element moves into contact with the conductive surface when the temperature sensing assembly is exposed to a temperature above the threshold. 14. The temperature indicator of claim 13, wherein said RFID module comprises a passive RFID module. the temperature sensing assembly includes a malleable material configured to soften in response to a temperature exceeding the threshold;
14. The temperature indicator of claim 13, wherein the switch circuit state changes in response to softening of the malleable material. The switch circuit is configured to be in either a closed circuit state or an open circuit state,
14. The temperature indicator of claim 13, wherein the state changes when the temperature sensing assembly is exposed to a temperature above the threshold. The switch circuit has a switch element disposed at least partially within a malleable material and biased towards a conductive element, the malleable material being in a disengaged and non-activated state for the switch. holding a portion of an element spaced apart from the conductive element;
14. The temperature of claim 13, wherein a portion of the switch element moves over the resistance of the malleable material and contacts the electrically conductive element when the temperature sensing assembly is exposed to a temperature above the threshold. indicator.

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