JP2023153472A - Manufacturing method of thermal print head and thermal print head - Google Patents

Abstract

To provide a manufacturing method of a thermal print head which can form a surface of a graze layer to be flatter and the thermal print head which can be obtained by the manufacturing method.SOLUTION: A manufacturing method of a thermal print head includes: a process for forming a graze layer on a main surface 811 directed to a first direction in a base material 81 having the main surface 811; a process for forming a resistor layer including a plurality of heating sections arrayed along a second direction orthogonal to the first direction on the graze layer; a process for forming a wiring layer conducting with the plurality of heating sections to be in contact with the resistor layer. The main surface 811 includes a first region 811A and a second region 811B. In the process for forming the graze layer, a graze material 82 is sintered after the graze material 82 being fluid is individually supplied to the first region 811A and the second region 811B.SELECTED DRAWING: Figure 11

Description

The present disclosure relates to a method for manufacturing a thermal print head and a thermal print head obtained by the method.

A thermal print head is a main component of a thermal printer that prints on a recording medium such as thermal paper. Patent Document 1 discloses an example of a thermal print head. The thermal print head includes a substrate, a common electrode and a plurality of individual electrodes disposed on the substrate, and a heating resistor electrically connected to the common electrode and the plurality of individual electrodes. Dots are printed on the recording medium by selectively generating heat in the heating resistor as a result of electricity passing through the common electrode and the plurality of individual electrodes.

The thermal print head disclosed in Patent Document 1 further includes a glaze layer. The heating resistor is placed on the glaze layer. When forming the common electrode and the plurality of individual electrodes adjacent to the heating resistor, the glaze layer prevents defects from occurring in these electrodes due to surface roughness of the substrate. Here, the glaze layer is formed by supplying a glaze material containing amorphous glass onto the substrate by screen printing, and then firing the glaze material.

In the above case, when the glaze material is supplied over a wider area onto the substrate, surface tension due to the emulsion or the like located around the glaze material acts on the glaze material. This causes the surface of the glaze material to become concave. Furthermore, due to the coffee ring effect acting on the glaze material, the thickness of the center of the glaze material is significantly thinner than the thickness of the periphery of the glaze material. These phenomena cause the flatness of the surface of the glaze layer to be impaired.

Japanese Patent Application Publication No. 2011-240641

In view of the above-mentioned circumstances, an object of the present disclosure is to provide a method for manufacturing a thermal print head that allows the surface of a glaze layer to be formed more flatly, and a thermal print head obtained by the manufacturing method. .

A method for manufacturing a thermal print head provided by a first aspect of the present disclosure includes, in a base material having a main surface facing in a first direction, forming a glaze layer on the main surface; forming a resistor layer including a plurality of heat generating parts arranged along a second direction perpendicular to the glaze layer; and forming a wiring layer electrically connected to the plurality of heat generating parts on the resistor layer. the main surface includes a first region and a second region, and in the step of forming the glaze layer, a fluid glaze material is applied to the first region and the second region. After being applied individually over the areas, the glaze material is fired.

A thermal print head provided by a second aspect of the present disclosure includes a substrate having a main surface facing in a first direction, a glaze layer covering a part of the main surface, and a reference to the glaze layer in the first direction. a resistor layer including a plurality of heat generating parts located on the opposite side of the substrate; and a wiring layer electrically connected to the plurality of heat generating parts and disposed in contact with the resistor layer; The heat generating parts are arranged along a second direction perpendicular to the first direction, and when viewed in the first direction, at least a part of the edge of the glaze layer is located at the periphery of the main surface. away from

According to the configuration of the method for manufacturing a thermal print head according to the present disclosure, it is possible to form the surface of the glaze layer evenly.

Other features and advantages of the present disclosure will become more apparent from the detailed description given below in conjunction with the accompanying drawings.

FIG. 1 is a plan view of a thermal print head according to a first embodiment of the present disclosure. FIG. 2 is a sectional view taken along line II-II in FIG. FIG. 3 is a partially enlarged view of FIG. 1. FIG. 4 is a partially enlarged view of FIG. 3. FIG. 5 is a sectional view taken along line VV in FIG. 4. FIG. 6 is a sectional view taken along line VI-VI in FIG. 4. FIG. 7 is a partially enlarged view of FIG. 5. FIG. 8 is a plan view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. 1. FIG. 9 is a plan view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. 1. FIG. 10 is a cross-sectional view taken along line XX in FIG. FIG. 11 is a plan view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. 1. FIG. 12 is a sectional view taken along line XII-XII in FIG. 11. FIG. 13 is a cross-sectional view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. 1. FIG. 14 is a cross-sectional view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. FIG. 15 is a cross-sectional view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. FIG. 16 is a plan view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. 1. FIG. 17 is a cross-sectional view illustrating the manufacturing process (first embodiment) of the thermal print head shown in FIG. 1. FIG. 18 is a plan view illustrating the manufacturing process (second embodiment) of the thermal print head shown in FIG. 1. FIG. 19 is a plan view illustrating the manufacturing process (second embodiment) of the thermal print head shown in FIG. 1. FIG. 20 is a cross-sectional view illustrating the manufacturing process (second embodiment) of the thermal print head shown in FIG. FIG. 21 is a cross-sectional view of a thermal print head according to a modification of the first embodiment of the present disclosure. FIG. 22 is a plan view of a thermal print head according to a second embodiment of the present disclosure. FIG. 23 is a plan view illustrating the manufacturing process of the thermal print head shown in FIG. 22. FIG. 24 is a plan view illustrating the manufacturing process of the thermal print head shown in FIG. 22.

Embodiments for carrying out the present disclosure will be described based on the accompanying drawings.

[First embodiment]
A thermal print head A10 according to a first embodiment of the present disclosure will be described based on FIGS. 1 to 7. The thermal print head A10 includes a substrate 1, a glaze layer 2, a resistor layer 3, a wiring layer 4, and a protective layer 5. Furthermore, the thermal print head A10 includes a heat dissipation member 72, a plurality of driving elements 73, a plurality of first wires 74, a plurality of second wires 75, a sealing resin 76, and a connector 77. Here, in FIGS. 1, 3, and 4, illustration of the protective layer 5 is omitted for convenience of understanding.

The thermal print head A10 shown in these figures is an electronic device that prints on a recording medium such as thermal paper by selectively generating heat from a plurality of heat generating parts 31 (details will be described later) included in the resistor layer 3. be. The resistor layer 3 and the wiring layer 4 are formed by screen printing and baking. Therefore, the thermal print head A10 is called a so-called thick film type.

Here, for convenience of explanation, the normal direction of the main surface 11 of the substrate 1, which will be described later, will be referred to as a "first direction z." A direction perpendicular to the first direction z is called a "second direction x." The second direction x corresponds to the main scanning direction of the thermal print head A10. A direction perpendicular to both the first direction z and the second direction x is referred to as a "third direction y." The third direction y corresponds to the sub-scanning direction of the thermal print head A10.

The substrate 1 extends in the second direction x, as shown in FIG. The composition of the substrate 1 includes alumina (Al ₂ O ₃ ). The substrate 1 is a ceramic made of a material containing alumina, a resin binder, and the like. In addition to these materials, the material of the substrate 1 may also include a light-shielding material. The light-shielding material is carbon (C), for example.

As shown in FIG. 2, the substrate 1 has a main surface 11 and a back surface 12. The main surface 11 and the back surface 12 face opposite to each other in the first direction z. As shown in FIGS. 5 and 6, main surface 11 faces glaze layer 2. As shown in FIGS. As shown in FIG. 1 , main surface 11 includes a peripheral edge 111 . The peripheral edge 111 corresponds to the outer edge of the main surface 11.

Glaze layer 2 covers a portion of main surface 11 of substrate 1, as shown in FIGS. 5 and 6. Glaze layer 2 is made of a material containing amorphous glass. The amorphous glass is, for example, SiO ₂ --BaO--Al ₂ O ₃ --SnO--ZnO glass. Therefore, the glaze layer 2 is transparent or white. The glass transition point of the glaze layer 2 is approximately 680°C.

As shown in FIG. 1, the glaze layer 2 has an edge 21 when viewed in the first direction z. The edge 21 corresponds to the outer edge of the glaze layer 2. The edge 21 includes a first edge 211 , a second edge 212 , a third edge 213 , and a fourth edge 214 . The first edge 211 and the second edge 212 extend in the second direction x. The first edge 211 and the second edge 212 are separated from each other in the second direction x. The first edge 211 is located closer to the resistor layer 3 than the second edge 212 . The third edge 213 and the fourth edge 214 extend in the third direction y. The third edge 213 and the fourth edge 214 are separated from each other in the second direction x.

As shown in FIG. 1, at least a portion of the edge 21 is separated from the periphery 111 of the main surface 11 of the substrate 1 when viewed in the first direction z. In the thermal print head A10, when viewed in the first direction z, the entire edge 21 including the first edge 211, second edge 212, third edge 213, and fourth edge 214 extends from the peripheral edge 111. is seperated.

As shown in FIGS. 5 and 6, glaze layer 2 has a first end surface 22. As shown in FIGS. The first end surface 22 includes a region facing in the third direction y. The first end surface 22 includes a first edge 211 of the edge 21 . When viewed in the first direction z, the first end surface 22 is separated from the periphery 111 of the main surface 11 of the substrate 1 .

As shown in FIG. 7, the first end surface 22 is inclined with respect to the main surface 11 at an inclination angle α. The inclination angle α corresponds to the angle between the principal surface 11 and the tangent T at the first edge 211 in a cross section whose in-plane directions are the first direction z and the third direction y. When viewed in the second direction x, the first end surface 22 includes a convex region.

The wiring layer 4 is in contact with the resistor layer 3, as shown in FIGS. 4 and 5. The wiring layer 4 constitutes a conductive path for supplying electricity to the resistor layer 3. In the thermal print head A10, the wiring layer 4 is in contact with the glaze layer 2. The wiring layer 4 includes a common wiring 41 and a plurality of individual wirings 42. The common wiring 41 is electrically connected to the plurality of heat generating parts 31. The plurality of individual wirings 42 are electrically connected to the plurality of heat generating parts 31 individually. In the thermal print head A<b>10 , current flows from the common wiring 41 to the plurality of individual wirings 42 via the plurality of heat generating parts 31 . Therefore, the common wiring 41 is a positive electrode, and the plurality of individual wirings 42 are negative electrodes. The composition of the wiring layer 4 includes, for example, gold (Au). An example of the thickness range of the wiring layer 4 is 0.6 μm or more and 1.2 μm or less.

As shown in FIG. 3, the common wiring 41 has a base 411 and a plurality of extensions 412. The base portion 411 is located on one side of the third direction y with the resistor layer 3 as a reference. The base 411 extends in the second direction x and is away from the third direction y.

As shown in FIGS. 3 and 4, the plurality of extensions 412 extend from the base 411 toward the resistor layer 3 in the third direction y. The plurality of extension parts 412 are arranged at equal intervals along the second direction x.

As shown in FIG. 3, each of the plurality of individual wirings 42 has a base portion 421 and an extension portion 422. The plurality of individual wirings 42 are arranged on the substrate 1 in a bundle corresponding to each of the plurality of drive elements 73. The plurality of individual wirings 42 apply voltages to the plurality of heat generating parts 31 individually.

As shown in FIG. 3, the base 421 is located on the opposite side of the common wiring 41 from the base 411 with respect to the resistor layer 3 in the third direction y. The base portions 421 of each of the plurality of individual wirings 42 form two rows separated from each other in the third direction y. Each of the two columns is arranged along the second direction x. In the row located closest to the resistor layer 3 among the two rows, the extension portion 422 is located between two adjacent base portions 421 .

As shown in FIG. 3, the extending portion 422 is connected to the base portion 421. Further, the extending portion 422 includes a first portion 422A, a second portion 422B, and a third portion 422C.

As shown in FIGS. 3 and 4, the first portion 422A extends in the third direction y. The first portions 422A are arranged at equal intervals along the second direction x. Among the plurality of extension parts 412 of the common wiring 41, the first part 422A is located between two extension parts 412 adjacent to each other in the second direction x.

As shown in FIGS. 3 and 4, the second portion 422B is connected to the first portion 422A. Most of the second portion 422B of the extending portion 422 of each of the plurality of individual wirings 42 is inclined with respect to the third direction y.

As shown in FIGS. 3 and 4, the third portion 422C is located on the opposite side of the first portion 422A with respect to the second portion 422B in the third direction y. The third portion 422C is connected to the second portion 422B and the base 411. The third portion 422C extends in the third direction y.

As shown in FIG. 3, in one bundle of the plurality of individual wirings 42 corresponding to each of the plurality of drive elements 73, the boundary position between the second part 422B and the third part 422C is on the tower side in the second direction x. When compared with , a deviation ΔL in the third direction y has occurred.

The resistor layer 3 extends in the second direction x, as shown in FIGS. 1 and 3. As shown in FIGS. 4 and 5, the resistor layer 3 is in contact with the glaze layer 2. As shown in FIGS. The resistor layer 3 crosses the plurality of extensions 412 of the common wiring 41 and the first portion 422A of each extension 422 of the plurality of individual wirings 42. The resistor layer 3 partially covers each of the plurality of extensions 412 and the first portion 422A of each of the extensions 422 of the plurality of individual wirings 42. In the thermal print head A10, the resistor layer 3 straddles the plurality of extensions 412 and the first portion 422A of each of the extensions 422 of the plurality of individual wirings 42.

A portion of the resistor layer 3 that covers any one of the plurality of extension portions 412, and a portion that covers any one of the first portions 422A of the plurality of individual wirings 42 located next to the portion in the second direction x. The area sandwiched between the two is defined as one of the plurality of heat generating parts 31. As shown in FIG. 3, the plurality of heat generating parts 31 are arranged along the second direction x. The plurality of heat generating parts 31 are located on the opposite side of the substrate 1 with respect to the glaze layer 2 in the first direction z. By being selectively energized by the wiring layer 4, the plurality of heat generating parts 31 selectively generate heat. As a result, dot printing is performed on the recording medium shown in FIG. 2. As the material for the resistor layer 3, a material having higher electrical resistivity than the wiring layer 4 is selected. An example of the material of the resistor layer 3 is a conductive paste containing ruthenium oxide (RuO ₂ ) particles and glass frit. The maximum thickness of the resistor layer 3 is 6 μm or more and 10 μm or less.

The protective layer 5 is in contact with the glaze layer 2, as shown in FIGS. 5 and 6. The protective layer 5 covers the plurality of heat generating parts 31. Furthermore, the protective layer 5 covers a part of the wiring layer 4. In the thermal print head A10, the wiring layer 4 except for a part of the common wiring 41 connected to the base 411 and the base 421 of each of the plurality of individual wirings 42 is covered with the protective layer 5. The protective layer 5 is made of a material containing amorphous glass. The amorphous glass has properties equivalent to those of the amorphous glass included in the glaze layer 2.

As shown in FIG. 7, the protective layer 5 has a second end surface 51 facing in the third direction y. The second end surface 51 is located closest to the first edge 211 of the edge 21 of the glaze layer 2 in the third direction y. In the thermal print head A10, the second end surface 51 overlaps the peripheral edge 111 of the main surface 11 of the substrate 1 when viewed in the first direction z.

As shown in FIG. 2, the heat dissipation member 72 is located on the opposite side of the glaze layer 2 with respect to the substrate 1 in the first direction z. The back surface 12 of the substrate 1 is bonded to a heat dissipating member 72 via a bonding material (not shown). The composition of the heat radiating member 72 includes, for example, aluminum (Al).

As shown in FIGS. 1 and 2, the plurality of driving elements 73 are located on the other side of the resistor layer 3 in the third direction y. The drive element 73 is mounted on the substrate 1. A plurality of electrodes (not shown) are provided on the upper surface of the drive element 73. A plurality of first wires 74, which are electrically conductively bonded to the base portions 421 of the plurality of individual wirings 42 corresponding to the drive elements 73, are electrically bonded to some of the plurality of electrodes. Thereby, the driving element 73 is electrically connected to the plurality of individual wirings 42 corresponding thereto. Furthermore, a plurality of second wires 75, which are conductively bonded to wiring arranged on the substrate 1, are conductively bonded to some of the plurality of electrodes. The drive element 73 selectively energizes the plurality of individual wirings 42 via the plurality of first wires 74 . Thereby, the plurality of heat generating parts 31 selectively generate heat. Alternatively, the driving element 73 may be configured to be separated from the substrate 1 in the third direction y and mounted on a wiring board supported by the heat dissipation member 72. The wiring board is, for example, a PCB (Printed Circuit Board).

The sealing resin 76 covers the plurality of drive elements 73, the plurality of first wires 74, and the plurality of second wires 75, as shown in FIG. In addition to these, the sealing resin 76 further covers some regions of the plurality of individual wirings 42 (such as the plurality of base portions 421) that are not covered by the protective layer 5. The sealing resin 76 is, for example, a black, soft synthetic resin used for underfill. In addition, the sealing resin 76 may be a black and hard synthetic resin.

As shown in FIGS. 1 and 2, the connector 77 is located on the opposite side of the resistor layer 3 with respect to the plurality of drive elements 73 in the third direction y. In the thermal print head A10, the connector 77 is attached to the end of the substrate 1 in the third direction y. Connector 77 is connected to a thermal printer. Connector 77 has multiple pins (not shown). Some of the plurality of pins are electrically connected to wiring (not shown) to which a plurality of second wires 75 are electrically conductively connected on the substrate 1 . Further, another part of the plurality of pins is electrically connected to a wiring (not shown) that is electrically connected to the base 411 of the common wiring 41 on the substrate 1. As a result, a constant voltage is applied to the common wiring 41 from the outside via the connector 77.

Next, the operation of the thermal print head A10 will be explained.

As shown in FIG. 2, the plurality of heat generating parts 31 of the thermal print head A10 are opposed to a platen roller 79 incorporated in the thermal printer with the protective layer 5 interposed therebetween. The platen roller 79 is a roller-like mechanism for feeding the recording medium. A recording medium is sandwiched between a region of the protective layer 5 covering the plurality of heat generating parts 31 and a platen roller 79. When the thermal printer is in operation, the platen roller 79 rotates, so that the recording medium is sent out at a constant speed in the third direction y. At this time, when the plurality of heat generating parts 31 selectively generate heat, the heat is transmitted to the recording medium via the protective layer 5, thereby printing is performed on the recording medium. At the same time, the heat generated from the plurality of heat generating parts 31 is also transmitted to the glaze layer 2. A part of the heat transmitted to the glaze layer 2 is stored in the glaze layer 2. Other heat is radiated to the outside of the thermal print head A10 via the substrate 1 and the heat radiating member 72.

Next, a first example of a method for manufacturing the thermal print head A10 will be described based on FIGS. 8 to 17.

First, as shown in FIGS. 9 and 11, glaze layer 2 is formed on main surface 811 of base material 81. The main surface 811 faces in the first direction z. The base material 81 is made up of a plurality of substrates 1 connected in a direction perpendicular to the first direction z.

In forming glaze layer 2, first, as shown in FIGS. 9 and 10, mask 88 is placed on main surface 811. The mask 88 is provided with a plurality of openings 881 penetrating in the first direction z. Mask 88 is made of metal. Therefore, the composition of mask 88 includes a metal element.

Here, as shown in FIG. 8, the main surface 811 of the base material 81 includes a plurality of first regions 811A and a plurality of second regions 811B. Each of the plurality of first regions 811A and second regions 811B has a rectangular shape with a long side in the second direction x. The shape and size of each of the plurality of second regions 811B are equal to the shape and size of each of the plurality of first regions 811A. The plurality of first regions 811A are arranged apart from each other along the third direction y. The plurality of second regions 811B are located next to and corresponding to the plurality of first regions 811A in the second direction x.

As shown in FIG. 9, when viewed in the first direction z, the plurality of openings 881 of the mask 88 individually overlap the plurality of first regions 811A and the plurality of second regions 811B. Thereby, each of the plurality of first regions 811A and the plurality of second regions 811B is exposed to the outside through any one of the plurality of openings 881 (see FIG. 10).

Next, as shown in FIGS. 11 and 12, the glaze material 82, which is a fluid, is individually supplied onto the plurality of first regions 811A and the plurality of second regions 811B, and then the glaze material 82 is fired. The fired product of the glaze material 82 becomes the glaze layer 2. Glaze material 82 includes amorphous glass. As a result, the plurality of first regions 811A and the plurality of second regions 811B are individually covered with the glaze layer 2.

As shown in FIG. 11, in the step of forming the glaze layer 2 according to this embodiment, the glaze material 82 is individually supplied to the plurality of openings 881 of the mask 88. A dispenser is used to supply the glaze material 82. In this case, as shown in FIG. 12, the entire glaze material 82 is accommodated in the plurality of openings 881. Therefore, in the step of forming the glaze layer 2, the glaze materials 82 individually supplied onto the plurality of first regions 811A and the plurality of second regions 811B are separated from each other.

Next, as shown in FIG. 13, a wiring layer 4 is formed on the glaze layer 2. In forming the wiring layer 4, a conductor layer is formed by screen printing a resinate paste containing gold as a main component on the glaze layer 2, and then firing the resinate paste. Thereafter, photolithography patterning and etching are performed on the conductor layer. Through the above steps, the wiring layer 4 is formed.

Next, as shown in FIG. 14, a resistor layer 3 including a plurality of heat generating parts 31 electrically connected to the wiring layer 4 is formed on the glaze layer 2. In forming the resistor layer 3, a conductive paste is screen printed in a strip shape extending in the x direction. The conductive paste includes ruthenium oxide particles and glass frit. When screen printing the conductive paste, the conductive paste is brought into contact with the glaze layer 2 and the wiring layer 4. After that, the conductive paste is fired. Finally, the fired product of the conductive paste is appropriately trimmed to adjust the resistance value. Through the above steps, the resistor layer 3 is formed.

The order of the process of forming the wiring layer 4 shown in FIG. 13 and the process of forming the resistor layer 3 shown in FIG. 14 is not limited to this example. Therefore, the wiring layer 4 may be formed after the resistor layer 3 is formed.

Next, as shown in FIG. 15, a protective layer 5 is formed that is in contact with the glaze layer 2 and covers the plurality of heat generating parts 31 of the resistor layer 3 and a part of the wiring layer 4. The protective layer 5 is formed by screen printing a paste containing amorphous glass on the glaze layer 2, the resistor layer 3, and a portion of the wiring layer 4, and then firing the paste.

Next, a plurality of driving elements 73 are mounted on the glaze layer 2 by die bonding. Next, a plurality of first wires 74 and a plurality of second wires 75 are formed by wire bonding. Next, a sealing resin 76 is formed to cover the drive element 73, the plurality of first wires 74, and the plurality of second wires 75.

Next, the base material 81 is divided into a plurality of pieces. In the step of dividing the base material 81, as shown in FIG. 16, a plurality of cutting lines 83 extending in a direction perpendicular to the first direction z are set on the base material 81. The multiple cutting lines 83 include multiple first cutting lines 831 and multiple second cutting lines 832. The plurality of first cutting lines 831 extend in the second direction x. The plurality of second cutting lines 832 extend in the third direction y. The plurality of first cutting lines 831 and the plurality of second cutting lines 832 form a lattice shape.

In the step of dividing the base material 81, as shown in FIGS. 16 and 17, at least one of the plurality of cutting lines 83 separates from the glaze layer 2 when viewed in the first direction z. In this embodiment, all of the plurality of cutting lines 83 are separated from the glaze layer 2 when viewed in the first direction z. As shown in FIG. 17, a plurality of individual pieces are obtained by dividing the base material 81 along a plurality of cutting lines 83. Each of the plural pieces includes a substrate 1, a glaze layer 2, a resistor layer 3, a wiring layer 4, a protective layer 5, a plurality of driving elements 73, a plurality of first wires 74, a plurality of second wires 75, and a sealing layer. A stopper resin 76 is provided.

Finally, after attaching the connector 77 to the board 1, the board 1 is joined to the heat dissipating member 72. The thermal print head A10 is obtained through the above steps.

Next, a second embodiment of the method for manufacturing the thermal print head A10 will be described based on FIGS. 18 to 20.

This embodiment differs from the first embodiment of the method for manufacturing the thermal print head A10 described above only in the step of forming the glaze layer 2. Therefore, in the description of this embodiment, only the step of forming the glaze layer 2 will be covered, and description of other steps will be omitted.

As shown in FIGS. 18 to 20, in the step of forming the glaze layer 2 according to this embodiment, the glaze material 82 is discharged from a nozzle 89 that moves in a direction perpendicular to the first direction z. Thereby, the glaze material 82 is individually supplied onto the plurality of first regions 811A and the plurality of second regions 811B of the base material 81. Thereafter, the glaze layer 2 is formed by firing the glaze material 82.

In the step of forming the glaze layer 2, the nozzle 89 discharges the glaze material 82 while moving in the second direction x. Above each of the plurality of first regions 811A and the plurality of second regions 811B, the nozzle 89 moves in the direction of each arrow shown in FIGS. 18 and 19. As shown in FIG. 20, the nozzle 89 has a discharge port 891 through which the glaze material 82 is discharged. As shown in FIGS. 18 and 19, the dimension of the discharge port 891 in the third direction y is smaller than the dimension of each of the plurality of first regions 811A and the plurality of second regions 811B in the third direction y. Further, the discharge port 891 has a rectangular shape whose long side is in the third direction y.

<Modified example>
Based on FIG. 21, a thermal print head A11 that is a modification of the thermal print head A10 will be described. The structure of the protective layer 5 in the thermal print head A11 is different from that of the thermal print head A10.

As shown in FIG. 21, the second end surface 51 of the protective layer 5 is located away from the periphery 111 of the main surface 11 of the substrate 1 when viewed in the first direction z. Therefore, in the thermal print head A11, a region of the main surface 11 located between the peripheral edge 111 and the second end surface 51 in the third direction y is exposed to the outside.

Next, a method for manufacturing the thermal print head A10 and the effects of the thermal print head A10 will be described.

The method for manufacturing the thermal print head A10 includes a step of forming the glaze layer 2 on the main surface 811 of the base material 81. Main surface 811 includes a first region 811A and a second region 811B. In the step of forming the glaze layer 2, the glaze material 82 is separately supplied onto the first region 811A and the second region 811B, and then the glaze material 82 is fired. By adopting this configuration, when viewed in the first direction z, the area of the glaze material 82 supplied onto the main surface 811 is made smaller than the area when the glaze material 82 is supplied over the entire main surface 811. Can be set smaller. This reduces the coffee ring effect acting on the glaze material 82, so that the surface of the glaze material 82 supplied onto the main surface 811 becomes flatter. Therefore, according to the method of manufacturing the thermal print head A10 having this configuration, it is possible to form the surface of the glaze layer 2 to be more flat.

In the step of forming the glaze layer 2 according to the first example of the method for manufacturing the thermal print head A10, a mask 88 in which a plurality of openings 881 are provided is placed on the main surface 811 of the base material 81. When viewed in the first direction z, the plurality of openings 881 individually overlap the first region 811A and the second region 811B. In the step of forming the glaze layer 2 according to this embodiment, the glaze material 82 is individually supplied to the plurality of openings 881. By adopting this configuration, even when the area of the glaze material 82 supplied onto the main surface 811 is reduced as much as possible when viewed in the first direction z, the area of the glaze material 82 can be easily adjusted. .

In the step of forming the glaze layer 2 according to the first embodiment, the entire glaze material 82 is accommodated in the plurality of openings 881 of the mask 88 . With this configuration, the smaller the dimension of the mask 88 in the first direction z is, the smaller the dimension of the glaze layer 2 in the first direction z can be made. This reduces the surface tension that acts on the glaze material 82 with respect to the inner peripheral surface of the mask 88 that defines each of the plurality of openings 881. As a result, the surface of the glaze material 82 supplied onto the main surface 811 becomes even more flat.

In the step of forming the glaze layer 2 according to the second embodiment of the method for manufacturing the thermal print head A10, the glaze material 82 is discharged from a nozzle 89 movable in a direction perpendicular to the first direction z. Thereby, the glaze material 82 is separately supplied onto the first region 811A and the second region 811B. In the step of forming the glaze layer 2 according to this embodiment, the nozzle 89 discharges the glaze material 82 while moving in the second direction x. Here, the first region 811A and the second region 811B have a rectangular shape with a long side extending in the second direction x, which is the direction in which the plurality of heat generating parts 31 of the resistor layer 3 are arranged. Therefore, by adopting this configuration, the number of repeated movements of the nozzle 89 is reduced, so that the supply efficiency of the glaze material 82 can be improved.

In the step of forming the glaze layer 2 according to the second embodiment, the dimension in the third direction y of the ejection opening 891 of the nozzle 89 that ejects the glaze material 82 is determined by the size of each of the first region 811A and the second region 811B. It is smaller than the dimension in three directions y. By adopting this configuration, the coffee ring effect acting on the glaze material 82 in the third direction y is further reduced, so that the surface of the glaze material 82 supplied onto the main surface 811 becomes even more flat.

The method for manufacturing the thermal print head A10 further includes a step of dividing the base material 81 into a plurality of pieces after the step of forming the wiring layer 4. In the step of dividing the base material 81, a plurality of cutting lines 83 extending in a direction orthogonal to the first direction z are set on the base material 81. At least one of the plurality of cutting lines 83 is separated from the glaze layer 2 when viewed in the first direction z. By adopting this configuration, it is possible to suppress defects at the edge 21 of the glaze layer 2 and its vicinity due to cutting of the base material 81. This configuration is obtained by separating the glaze materials 82 separately supplied to the first region 811A and the second region 811B from each other.

The thermal print head A10 further includes a protective layer 5 that covers the plurality of heat generating parts 31 of the resistor layer 3. By adopting this configuration, the frictional resistance of the recording medium against the thermal print head A10 can be further reduced.

The thermal print head A10 further includes a heat dissipation member 72 located on the opposite side of the glaze layer 2 with respect to the substrate 1 in the first direction z. The substrate 1 is joined to a heat dissipating member 72. By adopting this configuration, excessive heat accumulation in the glaze layer 2 is suppressed. This prevents deterioration in print quality.

[Second embodiment]
Based on FIG. 22, a thermal print head A20 according to a second embodiment of the present disclosure will be described. In these figures, elements that are the same or similar to those of the thermal print head A10 described above are given the same reference numerals, and redundant explanation will be omitted. Here, in FIG. 22, illustration of the protective layer 5 is omitted for convenience of understanding.

In the thermal print head A20, the configuration of the glaze layer 2 is different from that of the thermal print head A10.

As shown in FIG. 22, when viewed in the first direction z, the third edge 213 and fourth edge 214 of the edge 21 of the glaze layer 2 overlap the peripheral edge 111 of the main surface 11 of the substrate 1. In the thermal print head A20, among the edges 21, the first edge 211 and the second edge 212 are separated from the peripheral edge 111.

Next, an example of a method for manufacturing the thermal print head A20 will be described based on FIGS. 23 and 24.

In this embodiment, the step of forming the glaze layer 2 and the step of dividing the base material 81 are different from the previously described second embodiment of the method for manufacturing the thermal print head A10. Therefore, in the description of this example, the process of forming the glaze layer 2 and the process of dividing the base material 81 will be covered, and description of the other processes will be omitted.

In the step of forming the glaze layer 2 according to this embodiment, as shown in FIG. 23, the glaze material 82 is discharged from a nozzle 89 movable in a direction perpendicular to the first direction z. Thereby, the glaze material 82 is individually supplied onto the first region 811A, second region 811B, and third region 811C of the base material 81. The third region 811C is included in the main surface 811 of the base material 81 like the first region 811A and the second region 811B. The first region 811A, the second region 811B, and the third region 811C are arranged along the third direction y. The dimension in the second direction x of each of the first region 811A, the second region 811B, and the third region 811C is larger than the dimension in the second direction x of each of the plurality of first regions 811A involved in manufacturing the thermal print head A10. big.

In the step of dividing the base material 81 according to the present example, as shown in FIG. overlaps with

Next, the effects of the thermal print head A20 will be explained.

The method for manufacturing the thermal print head A20 includes a step of forming the glaze layer 2 on the main surface 811 of the base material 81. Main surface 811 includes a first region 811A and a second region 811B. In the step of forming the glaze layer 2, the glaze material 82 is separately supplied onto the first region 811A and the second region 811B, and then the glaze material 82 is fired. Therefore, also by the method of manufacturing the thermal print head A20 having this configuration, it is possible to form the surface of the glaze layer 2 to be more flat.

In the step of forming the glaze layer 2 of the thermal print head A20, the dimensions of each of the first region 811A and the second region 811B in the second direction larger than the dimensions of Furthermore, in the step of dividing the base material 81 according to the method for manufacturing the thermal print head A20, the plurality of second cutting lines 832 are set to overlap the glaze layer 2 when viewed in the first direction z. By adopting this configuration, it is possible to form the surface of the glaze layer 2 to be more flat and to improve the manufacturing efficiency of the thermal print head A20.

The thermal print head A20 has the same configuration as the thermal print head A10, and thus has the same effects as the thermal print head A10.

The present disclosure is not limited to the embodiments described above. The specific configuration of each part of the present disclosure can be modified in various ways.

The present disclosure includes the embodiments described in the appendix below.
[Additional note 1]
In a base material having a main surface facing in a first direction, forming a glaze layer on the main surface;
forming on the glaze layer a resistor layer including a plurality of heat generating parts arranged along a second direction perpendicular to the first direction;
forming a wiring layer conductive to the plurality of heat generating parts in contact with the resistor layer,
The main surface includes a first region and a second region,
In the step of forming the glaze layer, the glaze material, which is a fluid, is separately supplied onto the first region and the second region, and then the glaze material is fired.
[Additional note 2]
The method of manufacturing a thermal print head according to appendix 1, wherein in the step of forming the glaze layer, the glaze materials separately supplied onto the first region and the second region are separated from each other.
[Additional note 3]
After the step of forming the wiring layer, further comprising the step of dividing the base material into a plurality of pieces,
In the step of dividing the base material, a plurality of cutting lines extending in a direction perpendicular to the first direction are set on the base material,
The method for manufacturing a thermal print head according to appendix 2, wherein at least one of the plurality of cutting lines is separated from the glaze layer when viewed in the first direction.
[Additional note 4]
The method for manufacturing a thermal print head according to appendix 2 or 3, further comprising a step of forming a protective layer covering the plurality of heat generating parts after the step of forming the wiring layer.
[Additional note 5]
In the step of forming the glaze layer, before individually supplying the glaze material onto the first region and the second region, a mask is placed on the main surface,
The mask is provided with a plurality of openings penetrating in the first direction,
When viewed in the first direction, the plurality of openings individually overlap the first region and the second region,
The method for manufacturing a thermal print head according to appendix 2 or 3, wherein in the step of forming the glaze layer, the glaze material is individually supplied to the plurality of openings.
[Additional note 6]
The method for manufacturing a thermal print head according to appendix 5, wherein in the step of forming the glaze layer, the entire glaze material is accommodated in the plurality of openings.
[Additional note 7]
In the step of forming the glaze layer, the glaze material is individually applied onto the first region and the second region by discharging the glaze material from a nozzle that moves in a direction perpendicular to the first direction. A method for manufacturing a thermal print head according to appendix 2 or 3, wherein the method is supplied to a thermal print head according to appendix 2 or 3.
[Additional note 8]
The method of manufacturing a thermal print head according to appendix 7, wherein in the step of forming the glaze layer, the nozzle discharges the glaze material while moving in the second direction.
[Additional note 9]
The nozzle has a discharge port through which the glaze material is discharged,
According to appendix 8, a dimension of the discharge port in a third direction perpendicular to the first direction and the second direction is smaller than a dimension of each of the first region and the second region in the third direction. A method of manufacturing the described thermal print head.
[Additional note 10]
The method for manufacturing a thermal print head according to appendix 9, wherein the ejection port has a rectangular shape with a long side in the third direction.
[Additional note 11]
a substrate having a main surface facing in a first direction;
a glaze layer covering a part of the main surface;
a resistor layer including a plurality of heat generating parts located on the opposite side of the substrate with respect to the glaze layer in the first direction;
a wiring layer electrically connected to the plurality of heat generating parts and disposed in contact with the resistor layer,
The plurality of heat generating parts are arranged along a second direction orthogonal to the first direction,
The thermal print head, wherein at least a portion of an edge of the glaze layer is separated from a peripheral edge of the main surface when viewed in the first direction.
[Additional note 12]
The thermal print head according to attachment 11, wherein the entire edge of the glaze layer is separated from the peripheral edge of the main surface when viewed in the first direction.
[Additional note 13]
The glaze layer has an end surface including a region facing in a third direction perpendicular to the first direction and the second direction,
When viewed in the first direction, the end surface is separated from the peripheral edge of the main surface,
The thermal print head according to appendix 11 or 12, wherein the end surface is inclined with respect to the main surface.
[Additional note 14]
The thermal print head according to attachment 13, wherein the end surface includes a convex region when viewed in the second direction.
[Additional note 15]
The thermal print head according to appendix 11 or 12, further comprising a protective layer that covers the plurality of heat generating parts.
[Additional note 16]
The wiring layer includes a common wiring and a plurality of individual wirings,
The common wiring is electrically connected to the plurality of heat generating parts,
The thermal print head according to appendix 15, wherein the plurality of individual wirings are individually electrically connected to the plurality of heat generating parts.
[Additional note 17]
further comprising a heat dissipation member located on the opposite side of the glaze layer with respect to the substrate in the first direction,
The thermal print head according to appendix 16, wherein the substrate is joined to the heat dissipation member.

A10, A20: Thermal print head 1: Substrate 11: Main surface 111: Periphery 12: Back surface 2: Glaze layer 21: Edge 211: First edge 212: Second edge 213: Third edge 214: Fourth Edge 22: First end surface 3: Resistor layer 31: Heat generating part 4: Wiring layer 41: Common wiring 411: Base 412: Extension part 42: Individual wiring 421: Base 422: Extension part 422A: First part 422B : Second part 422C: Third part 5: Protective layer 51: Second end surface 72: Heat radiation member 73: Drive element 74: First wire 75: Second wire 76: Sealing resin 77: Connector 79: Platen roller 81: Base material 811: Principal surface 811A: First region 811B: Second region 811C: Third region 82: Glaze material 83: Cutting line 831: First cutting line 832: Second cutting line 88: Mask 881: Opening 89: Nozzle 891: Discharge port z: First direction x: Second direction y: Third direction

Claims (17)

In a base material having a main surface facing in a first direction, forming a glaze layer on the main surface;
forming on the glaze layer a resistor layer including a plurality of heat generating parts arranged along a second direction perpendicular to the first direction;
forming a wiring layer conductive to the plurality of heat generating parts in contact with the resistor layer,
The main surface includes a first region and a second region,
In the step of forming the glaze layer, the glaze material, which is a fluid, is separately supplied onto the first region and the second region, and then the glaze material is fired. 2. The method of manufacturing a thermal print head according to claim 1, wherein in the step of forming the glaze layer, the glaze materials separately supplied onto the first region and the second region are separated from each other. After the step of forming the wiring layer, further comprising the step of dividing the base material into a plurality of pieces,
In the step of dividing the base material, a plurality of cutting lines extending in a direction perpendicular to the first direction are set on the base material,
The method for manufacturing a thermal print head according to claim 2, wherein at least one of the plurality of cutting lines is separated from the glaze layer when viewed in the first direction. 4. The method for manufacturing a thermal print head according to claim 2, further comprising a step of forming a protective layer covering the plurality of heat generating parts after the step of forming the wiring layer. In the step of forming the glaze layer, before individually supplying the glaze material onto the first region and the second region, a mask is placed on the main surface,
The mask is provided with a plurality of openings penetrating in the first direction,
When viewed in the first direction, the plurality of openings individually overlap the first region and the second region,
4. The method of manufacturing a thermal print head according to claim 2, wherein in the step of forming the glaze layer, the glaze material is individually supplied to the plurality of openings. 6. The method of manufacturing a thermal print head according to claim 5, wherein in the step of forming the glaze layer, the entire glaze material is accommodated in the plurality of openings. In the step of forming the glaze layer, the glaze material is individually applied onto the first region and the second region by discharging the glaze material from a nozzle that moves in a direction perpendicular to the first direction. The method for manufacturing a thermal print head according to claim 2 or 3, wherein the method is supplied to a thermal print head according to claim 2 or 3. 8. The method of manufacturing a thermal print head according to claim 7, wherein in the step of forming the glaze layer, the nozzle discharges the glaze material while moving in the second direction. The nozzle has a discharge port through which the glaze material is discharged,
9. A dimension of the discharge port in a third direction perpendicular to the first direction and the second direction is smaller than a dimension of each of the first region and the second region in the third direction. The method for manufacturing a thermal print head described in . 10. The method for manufacturing a thermal print head according to claim 9, wherein the ejection port has a rectangular shape with a long side in the third direction. a substrate having a main surface facing in a first direction;
a glaze layer covering a part of the main surface;
a resistor layer including a plurality of heat generating parts located on the opposite side of the substrate with respect to the glaze layer in the first direction;
a wiring layer electrically connected to the plurality of heat generating parts and disposed in contact with the resistor layer,
The plurality of heat generating parts are arranged along a second direction orthogonal to the first direction,
The thermal print head, wherein at least a portion of an edge of the glaze layer is separated from a peripheral edge of the main surface when viewed in the first direction. The thermal print head according to claim 11, wherein the entire edge of the glaze layer is separated from the peripheral edge of the main surface when viewed in the first direction. The glaze layer has an end surface including a region facing in a third direction perpendicular to the first direction and the second direction,
When viewed in the first direction, the end surface is separated from the peripheral edge of the main surface,
The thermal print head according to claim 11 or 12, wherein the end surface is inclined with respect to the main surface. The thermal print head according to claim 13, wherein the end surface includes a convex region when viewed in the second direction. The thermal print head according to claim 11 or 12, further comprising a protective layer that covers the plurality of heat generating parts. The wiring layer includes a common wiring and a plurality of individual wirings,
The common wiring is electrically connected to the plurality of heat generating parts,
The thermal print head according to claim 15, wherein the plurality of individual wirings are individually electrically connected to the plurality of heat generating parts. further comprising a heat dissipation member located on the opposite side of the glaze layer with respect to the substrate in the first direction,
The thermal print head according to claim 16, wherein the substrate is joined to the heat dissipation member.

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