JP2023148113A - Abrasives for vitrified tools and vitrified tools - Google Patents

Abstract

To provide a vitrified tool which is hard to generate a deep flaw and can realize a high processing rate, a high processing retainability, and a high abrasion resistance.SOLUTION: A polishing material 1 of this invention consists of secondary particles in which abrasive grains 3 that are innumerable primary particles are bonded with a first bond material 5 into a granular form having a larger diameter than each of abrasive grains 3. The first bond material 5 is vitreous. The polishing material 2 of this invention constitutes a structure in which innumerable secondary particles are bonded with a fourth bond material with one another while abrasive grains 3 that are innumerable primary particles constitute the secondary particles bonded with a third bond material into a granular form having a larger diameter than each of the abrasive grains 3 that are innumerable primary particles. The third bond material and the fourth bond material are vitreous.SELECTED DRAWING: Figure 3

Description

The present invention relates to an abrasive material for vitrified tools and to vitrified tools.

As disclosed in Patent Document 1, a vitrified tool includes a base material and a bond material made of glass that holds abrasive grains. When using a countless number of abrasive grains, there are two cases in which a bond material holding a countless number of abrasive grains is manufactured as a chip and the chip is fixed on a base material, and another case in which a bond material holding a countless number of abrasive grains is manufactured as a chip and the chip is fixed on a base material. In some cases, it is directly attached to the

This vitrified tool is embodied as a polishing tool or a grinding tool, and is used for polishing or grinding.

JP2021-79458A

It is conceivable that the vitrified tool described above may be used for rough machining and finishing machining in lapping processing of wafers such as SiC. In this case, compared to the conventional free abrasive polishing method in which a wafer is polished using a polishing liquid containing abrasive particles and a polishing pad not containing abrasive particles, a fixed abrasive method in which the abrasive material is fixed is used. Therefore, wafers can be lapped using only a polishing liquid that does not contain abrasive particles, such as water, so there is no need to use large amounts of expensive polishing liquid, and industrial waste can be significantly reduced. become. Therefore, it is possible to reduce the manufacturing cost of wafers and reduce the environmental load.

However, when a wafer is lapped using the vitrified tool, there is a problem that the processing rate is unstable. One possible cause of this is that the tip of the abrasive material of the vitrified tool wears out during processing and becomes flat. Therefore, the machining performance of the vitrified tool gradually deteriorates.

In addition, a high processing rate is required as a performance required for a tool that performs wafer lapping processing. For this reason, if abrasive grains with a large particle size are used, the machining rate will certainly increase, but deep scratches will easily occur on the surface to be polished. A workpiece with deep scratches requires a lot of time to remove the scratches in a post-process, making it difficult to apply the process.

For these reasons, it has become a challenge for vitrified tools to achieve high machining rates, high machining maintainability, and high wear resistance while being less likely to cause deep scratches.

The present invention has been made in view of the above-mentioned conventional circumstances, and provides a vitrified tool that does not easily cause deep scratches and can realize a high machining rate, high machining maintainability, and high wear resistance. This is an issue that must be solved.

The vitrified tool abrasive of the first teaching consists of secondary particles in which countless abrasive grains, which are primary particles, are bonded by a first bonding material into grains having a larger diameter than each of the abrasive grains,
The first bonding material is characterized in that it is made of glass.

The vitrified tool of the second teaching is a vitrified tool comprising a base material and a granular abrasive material provided on the base material,
The abrasive material is composed of secondary particles in which countless abrasive grains, which are primary particles, are bonded by a first bonding material into particles having a larger diameter than each of the abrasive grains,
the abrasive material is provided on the base material by a second bond material,
The first bond material and the second bond material are made of glass.

When machining is performed using the vitrified tool of the second teaching, abrasion occurs at the tip of the abrasive material in the first bond material, which is glassy, and new abrasive grains of primary particles appear. For this reason, machining performance is unlikely to deteriorate, and high machining maintainability and high wear resistance are exhibited.

Furthermore, since the abrasive material contains a countless number of abrasive grains that are primary particles, it is possible to achieve a high machining rate similar to that of abrasive grains with a large particle size. On the other hand, the individual abrasive grains are only bound together by the first bond material, which is glassy, and if they receive a large reaction force from the workpiece, they will fall off from the first bond material and cause deep scratches on the polished surface. It's difficult to enter.

The vitrified tool abrasive material of the first teaching is made up of secondary particles in which a countless number of abrasive grains, which are primary particles, are bonded by a first bonding material into grains with a larger diameter than each abrasive grain, so it can be obtained in various shapes. . The vitrified tool of the second teaching is produced by applying the vitrified tool abrasive of the first teaching to a substrate with a second bonding material.

Note that the abrasive material of the first teaching can not only be used for manufacturing vitrified tools, but also be dispersed in a polishing liquid or used for manufacturing polishing bodies other than vitrified tools.

In the vitrified tool abrasive material of the third teaching, innumerable abrasive grains as primary particles constitute secondary particles having a larger diameter than each abrasive grain by a third bonding material, and The secondary particles have a structure in which they are connected to each other by a fourth bond material,
The third bond material and the fourth bond material are made of glass.

The vitrified tool of the fourth teaching is a vitrified tool comprising a base material and an abrasive material of a predetermined shape provided on the base material,
In the abrasive material, innumerable abrasive grains, which are primary particles, constitute secondary particles that are bonded by a third bonding material into grains having a larger diameter than each of the abrasive grains, and the innumerable secondary particles are bonded together by a fourth bond. It has a structure connected to each other by materials,
The abrasive material is provided on the base material by a fifth bond material,
Among the third bond material, the fourth bond material, and the fifth bond material, the third bond material and the fourth bond material are made of glass.

When machining is performed using the vitrified tool of the fourth teaching, abrasion occurs at the tip of the abrasive material in the glassy third bond material or fourth bond material, thereby causing new abrasive grains of primary particles to appear. For this reason, machining performance is unlikely to deteriorate, and high machining maintainability and high wear resistance are exhibited.

Furthermore, since the abrasive material contains countless abrasive grains which are primary particles, the machining rate becomes high as in the case of abrasive grains having a large particle size. On the other hand, the individual abrasive grains are only bonded together by the glassy third bond material or fourth bond material, and if they receive a large reaction force from the workpiece, the third or fourth bond material It is difficult to fall off and cause deep scratches on the polished surface.

The vitrified tool abrasive material of the third teaching has a large number of primary particles, which are abrasive grains, which are bonded to form secondary particles having a larger diameter than each abrasive grain by a third bonding material. Since they have a structure in which they are connected to each other by the fourth bond material, they can be obtained in various shapes. The vitrified tool of the fourth teaching is manufactured by providing the vitrified tool abrasive material of the predetermined shape of the third teaching on a base material using the fifth bonding material.

Note that the abrasive material of the third teaching can be used not only for manufacturing vitrified tools but also for manufacturing abrasive bodies other than vitrified tools.

According to the abrasive material for vitrified tools of the present invention, it is possible to produce a vitrified tool that does not easily cause deep scratches and can achieve a high machining rate, high machining maintainability, and high wear resistance. The vitrified tool of the present invention is less likely to cause deep scratches and can achieve a high machining rate, high machining maintainability, and high wear resistance.

FIG. 1 is a SEM photograph of the vitrified tool abrasive of Example A1 at a magnification of 1000 times. FIG. 2 is a SEM photograph of the vitrified tool abrasive of Example A2 at a magnification of 1000 times. FIG. 3 is an enlarged schematic diagram of the abrasive materials for vitrified tools of Examples A1 and A2. FIG. 4 is a perspective view of a polishing tool that is an example of a vitrified tool using the vitrified tool abrasives of Examples A1 and A2. FIG. 5 is a schematic diagram of the abrasive material for vitrified tools used in Examples B1 to B5. FIG. 6 is a SEM photograph of the abrasive material for vitrified tools of Example B2 at a magnification of 200 times. FIG. 7 is a SEM photograph of the vitrified tool abrasive of Example B3 at a magnification of 200 times. FIG. 8 is an image-processed SEM photograph of the vitrified tool abrasive of Example B2 at a magnification of 200 times. FIG. 9 is an explanatory diagram of the abrasive material for vitrified tools of Example B2. FIG. 10 is a perspective view of a polishing tool which is an example of the vitrified tool of Examples B6 to B10.

The abrasive grains that are the primary particles that make up the vitrified tool abrasive (hereinafter simply referred to as the abrasive) include diamond, cubic boron nitride, boron carbide, silicon carbide, silica, alumina, zirconia, titania, ceria, and manganese. It is possible to employ oxides, barium carbonate, chromium oxide, iron oxide, etc. The grain size of the abrasive grains is variously set depending on the use of the vitrified tool. According to the inventors' understanding, the particle size of the abrasive grains is preferably 10 μm or less.

As the first to fourth bond materials, first to fourth compositions that contain a frit such as borosilicate glass and become glassy when melted can be used (the composition constituting the first bond material is (The composition constituting the second bond material is referred to as a second composition, and the same shall apply hereinafter.) The compositions of the first to fourth compositions are variously set depending on the use of the vitrified tool. The first to fourth bond materials may have the same composition or different compositions, but the yield points of the first to fourth compositions are the melting point of the abrasive grains that are the primary particles. must be lower than In order to prevent the abrasive grains, which are primary particles, from being oxidized, the first to fourth compositions are melted in a reducing atmosphere. The fifth bonding material may be an epoxy adhesive or the like since it does not affect the processing action.

The mixing ratio (volume) of the first to fourth compositions is selected depending on the desired characteristics of the abrasive. In order to adjust the porosity of the first to fourth bond materials, a pore forming material such as resin beads, starch powder, carbon powder, etc. may be added to the first to fourth compositions. According to the inventors' understanding, the volume ratio of the abrasive grains to the first bond material in the abrasive material of the first teaching, and the volume ratio of the abrasive grains to the third and fourth bond materials in the abrasive material of the third teaching. are both preferably 20 to 80% by volume.

The base material may be a rigid base material or a flexible base material that does not deform the abrasive material. As the rigid base material, ceramics such as alumina, silicon nitride, silicon carbide, zirconia, and mullite, metals such as iron, SUS, and copper, glass having a strain point of 600° C. or more, and the like can be used. Examples of flexible base materials include sheets made of woven or nonwoven fabrics made of fibers such as natural fibers, synthetic fibers, and carbon fibers, polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), and polyimide ( Single-layer or multi-layer films made of synthetic resins such as PI), polyethylene naphthalate (PEN), and aramid, and metals such as aluminum and copper can be employed.

The abrasive material of the first teaching can be manufactured by the following steps. (1) First, as a first step, a slurry containing abrasive grains as primary particles, a first composition, a binder, and water is prepared. (2) Next, as a second step, the slurry is subjected to a spray drying treatment to obtain granules. (3) Thereafter, in the third step, the obtained granules are heated at a temperature at which the first composition melts to obtain an abrasive material. As a result, the first composition is vitrified together with the abrasive grains which are primary particles, and secondary particles bonded together into particles having a larger diameter than each abrasive grain are obtained. In this abrasive material, abrasive grains, which are primary particles, are bonded by a vitrified first bonding material. If the first composition can be melted by spray drying, it is possible to perform the second step and the third step simultaneously. A water-soluble or emulsion type material can be used as the binder. A surfactant such as a dispersant may be added to the slurry. The particle size of the abrasive material of the first teaching is variously set depending on the use of the vitrified tool. According to the understanding of the inventors, it is preferable that the abrasive of the first teaching has an average particle size of 10 to 100 μm.

By providing the abrasive material of the first teaching together with the second composition on the base material and melting and solidifying the second composition, the vitrified tool of the second teaching is obtained. When the second bond material has the same composition as the first bond material, the vitrified tool of the second teaching can be formed by providing an abrasive material on the base material and remelting and solidifying the glassy material of the abrasive material. can get. The abrasive material may be molded into a predetermined shape. According to the inventors' understanding, the porosity of the abrasive material in the vitrified tool of the second teaching is preferably 25 to 80%.

The abrasive material of the third teaching can be manufactured by the following steps. (1) First, as a first step, a slurry containing abrasive grains as primary particles, a third composition, a binder, and water is prepared. (2) Next, as a second step, the slurry is subjected to a spray drying treatment to obtain granules. (3) Thereafter, in the third step, the obtained granules are heated at a temperature at which the third composition melts to obtain secondary particles. As a result, the third composition is vitrified together with the abrasive grains that are the primary particles, and secondary particles bonded into particles having a diameter larger than each abrasive grain are obtained. In the secondary particles, abrasive grains, which are primary particles, are bonded by a vitrified third bonding material. If the third composition can be melted by spray drying, the second step and the third step can be performed simultaneously. Up to this point, it is the same as the abrasive material of the first teaching. (4) Furthermore, as a fourth step, the secondary particles are formed into a molded body of a predetermined shape together with a fourth composition of a fourth bond material. (5) Then, as a fifth step, the molded body is heat-treated at a temperature at which the fourth composition melts to obtain an abrasive material. As a result, the fourth composition vitrifies together with the secondary particles, forming a structure in which they are interconnected. This abrasive material can have a three-dimensional network shape by bonding the secondary particles with a vitrified fourth bonding material. If a pore-forming material is included in the fourth step, the pore-forming material disappears in the fifth step, making it easy to form a three-dimensional network. When the fourth bonding material has the same composition as the third bonding material, there is no need to mix the fourth composition into the molded body in the fourth step, and the vitreous nature of the secondary particles is regenerated in the fifth step. An abrasive material is obtained by melting and solidifying the material. The particle diameter or size of the abrasive material of the third teaching is variously set depending on the use of the vitrified tool. According to the inventors' knowledge, the abrasive material of the third teaching defines the thickness W of the connecting portion of the secondary particles and the maximum width d perpendicular to the connecting portion of the connected secondary particles, It is preferable that the coefficient a determined by the formula a=W/d is 0.1 to 0.9.

The abrasive material is fixed on the base material by the fifth bonding material, and the vitrified tool of the fourth teaching is obtained. It is also possible for the fifth bond material to be made of the same composition as the first to fourth bond materials. According to the inventors' understanding, the porosity of the abrasive in the vitrified tool of the fourth teaching is preferably 25 to 80%.

(Test 1)
In Test 1, an abrasive material according to the first teaching is manufactured. First, prepare the following materials.
Diamond particles (average particle size 5μm)
Compositions C1 to C4 shown in Table 1
Binder: Water-soluble acrylic binder “Kyoeisha Chemical Oricox #5001”
water

As a first step, these were put into a ball mill in the mass % shown in Table 2, and the ball mill was rotated to mix them sufficiently to obtain a slurry. Next, as a second step, the obtained slurry was spray-dried at 120°C to obtain granules. Thereafter, in the third step, the obtained granules were heated at 570°C in the air or nitrogen atmosphere to obtain abrasive material 1, which is the secondary particles of Examples A1 and A2.

A SEM photograph of the abrasive material 1 of Example A1 at 1000 times magnification is shown in FIG. 1, and a SEM photograph of the abrasive material 1 of Example A2 at 1000 times magnification is shown in FIG. Further, an enlarged schematic diagram of the obtained abrasive material 1 is shown in FIG.

As is clear from FIGS. 1 to 3, in the abrasive material 1, the composition C2 which is the first composition is vitrified to become the glassy first bond material 5, and the diamond abrasive grains 3 which are countless primary particles are the first bond material 5. The diamond abrasive grains are made up of secondary particles bonded by a bonding material 5 into particles having a diameter larger than that of each diamond abrasive grain 3. The average particle size of the abrasive material 1 is 40 μm.

(Test 2)
In Test 2, a vitrified tool of the second teaching is manufactured using the abrasive materials 1 of Examples A1 and A2 obtained in Test 1.

As shown in FIG. 4, a base material 7 made of an alumina substrate was prepared, and a slurry 9 made of a composition C1 as a second composition and water was applied onto the base material 7. One grain of each of the abrasives 1 of Examples A1 and A2 obtained in Test 1 was placed on the slurry 9. After drying these at 60°C for 30 minutes, they were fired at 550°C for 2 hours in the air. The composition C1 is vitrified to become a glassy second bond material 11. In this way, vitrified tools of Examples A1 and A2 were obtained.

Further, one single crystal or polycrystalline diamond particle (particle size: 50 μm) was provided on the slurry 9 of the base material 7. Drying and firing were performed in the same manner. In this way, vitrified tools of Comparative Examples A1 and A2 were obtained.

A vitrified tool using the abrasive material 1 of Example A1 is referred to as Example A1, a vitrified tool using the abrasive material 1 of Example A2 is referred to as Example A2, and a vitrified tool using single crystal diamond particles is referred to as Comparative Example A1. A vitrified tool using polycrystalline diamond particles was designated as Comparative Example A2.

SiC wafers processed into strips with a width of 5 mm were prepared, and these vitrified tools and each SiC wafer were installed in a single-grain evaluation test device to evaluate whether or not SiC processing was possible, working efficiency, and service life. The results are shown in Table 3.

The feasibility of SiC processing was determined by checking whether processing marks could be confirmed on the SiC wafer during single grain processing. If there are processing marks, it is marked as ○, and if there are no processing marks, it is marked as ×.

The working efficiency was evaluated based on the machining depth (μm), assuming that the grain size of the abrasive 1 in the vitrified tools of Examples A1 and A2 or the grain size of the diamond particles in Comparative Examples A1 and A2 was 1 μm. If the machining depth is 0.03 μm or more, it is marked ◎, if the machining depth is 0.02 μm or more and less than 0.03 μm, it is ○, and if the machining depth is less than 0.02 μm, it is marked ×.

The lifespan was evaluated based on the distance that the SiC wafer was processed. If it was possible to process 400 mm or more, it was marked ◎, if it was possible to process 300 mm or more but less than 400 mm, it was marked ○, and if it could only be processed less than 300 mm, it was marked ×.

As is clear from Table 3, the vitrified tools of Examples A1 and A2 can process SiC, and exhibit excellent working efficiency and long life. It is surmised that this is because when processing SiC with these vitrified tools, abrasion occurs at the tip of the abrasive material 1 in the first bond material 5, which is glassy, and new diamond particles 3 appear as a result. For this reason, machining performance is unlikely to deteriorate, and high machining maintainability and high wear resistance are exhibited.

In addition, in the vitrified tools of Examples A1 and A2, since the abrasive material 1 contains countless diamond particles 3, it is possible to achieve a high machining rate similar to that of the large-diameter diamond particles in the vitrified tools of Comparative Examples A1 and A1. . On the other hand, in the vitrified tools of Examples A1 and A2, the individual diamond particles 3 are only bonded by the first bond material 5 which is glassy, and if a large reaction force is received from SiC, the first bond material 5 I guess it will fall off. For this reason, it can be inferred that the vitrified tools of Examples A1 and A2 are difficult to make deep scratches in SiC.

On the other hand, although the vitrified tools of Comparative Examples A1 and A2 can process SiC, their working efficiency and lifespan are insufficient. It is inferred that this is because the vitrified tools of Comparative Examples A1 and A2 wear out the tips of the diamond particles during processing and become flat. Moreover, in the vitrified tools of Comparative Examples A1 and A2, although the machining rate is high because the tools are polished with diamond particles, it is presumed that deep scratches are likely to occur in the SiC. Therefore, there are concerns about machining maintainability and wear resistance of these materials.

From Tests 1 and 2, it was found that according to the abrasive material 1 of the first teaching, it was possible to manufacture a vitrified tool that was less likely to cause deep scratches and could achieve a high machining rate, high machining maintainability, and high wear resistance. Recognize. Furthermore, it can be seen that the vitrified tool of the second teaching is less likely to cause deep scratches and can achieve a high machining rate, high machining maintainability, and high wear resistance.

(Test 3)
In Test 3, an abrasive material according to the third teaching is manufactured. First, in the same manner as in the first to third steps of Test 1, slurries were obtained at the volume percentages shown in Table 4, and then abrasive materials 1 of Examples B1 to B5 and Comparative Examples B1 to B3 were manufactured. That is, compositions C1 to C4 are used as the third bonding materials.

Next, as a fourth step, a pore-forming material was mixed with each abrasive material 1 to form a mixture, and this mixture was press-molded to form a pellet-shaped molded body. Acrylic resin beads ("Techpolymer" manufactured by Sekisui Plastics Co., Ltd.) were used as the pore-forming material. The pore-forming material is not limited to this, as long as it is a material that can be burned through by heat treatment.

Then, as a fifth step, each molded body was heated at 550 to 700°C in the air or under a nitrogen atmosphere. When heating at a temperature exceeding 600°C, heating was performed under a nitrogen atmosphere. In this way, as shown in FIG. 5, pellet-shaped abrasive materials 2 of Examples B1 to B5 and Comparative Examples B1 to B3 were obtained. That is, compositions C1 to C4 are used as the fourth bonding material.

In the abrasive material 2, countless abrasive materials 1 are connected to each other by third and fourth bond materials. In other words, in the abrasive material 2, countless diamond particles, which are primary particles, constitute secondary particles that are bonded by the third bonding material into particles with a larger diameter than each diamond particle, and countless secondary particles form the fourth bonding material. are connected to each other by materials.

Table 5 shows the volume % of diamond particles, the volume % of glassy material due to the third bond material and the fourth bond material, and the porosity (volume %) in these polishing bodies 2. The porosity was measured by the Archimedes method.

FIG. 6 shows an SEM photograph of the abrasive material 2 of Example B2 at 200 times magnification, and FIG. 7 shows a SEM photograph of the abrasive material 2 of Example B3 at 200 times magnification. As is clear from FIGS. 6 and 7, it can be seen that these abrasive materials 2 are bonded by the fourth bonding material in which the secondary particles are vitrified, forming a three-dimensional network.

FIG. 8 shows an image processed SEM photograph of the abrasive material 2 of Example B2 at a magnification of 200 times. The image processing software recognizes the abrasive materials 1 connected to each other by the fourth bond material from the diagram of FIG. 8, as shown in FIG. After obtaining the maximum width d of the abrasive material 1, the coefficient a is calculated using the formula a=W/d. Table 5 also shows the coefficient a for abrasive material 2.

These vitrified tools and each SiC wafer were installed in an evaluation test apparatus, and the machining rate, machining maintainability, and wear resistance of SiC machining were evaluated. The results are shown in Table 6.

The processing rate was measured with a processing surface pressure of 20 kPa on a SiC wafer. ◎ if processing was possible at 0.05 μm/min or more; ○ if processing was possible at 0.01 μm/min or more but less than 0.05 μm/min; and ○ if processing was possible at less than 0.01 μm/min. was evaluated as ×.

Processing maintainability was determined by processing a SiC wafer at a processing surface pressure of 20 kPa, and calculating the processing rate after 60 minutes/initial processing rate. If the process maintainability was 0.5 or more, it was evaluated as ◎, if the process maintainability was 0.1 or more and less than 0.5, it was evaluated as ○, and if the process maintainability was less than 0.1, it was evaluated as ×.

Wear resistance was determined by processing a SiC wafer at a processing surface pressure of 20 kPa and determining the wear rate of the abrasive during processing. If the wear rate is 0.01 μm/min or less, mark it as ◎. If the wear rate is 0.01 μm/min or more and 0.5 μm/min or less, mark it as ○. If the wear rate is 0.5 μm/min or more, mark it as ◎. It was evaluated as ×.

As is clear from Table 6, the abrasive materials 2 of Examples B1 to B5 are capable of processing SiC at a high processing rate, high processing maintainability, and high wear characteristics. On the other hand, the abrasives of Comparative Examples B1 and B2 have high abrasion characteristics compared to SiC, but are insufficient in machining rate and machining maintainability. Further, although the abrasive material of Comparative Example B3 can process SiC at a high processing rate and high processing maintainability, its wear characteristics are insufficient.

(Test 4)
In Test 4, a vitrified tool according to the fourth teaching is manufactured using the abrasive material 10 obtained in the same manner as in Test 3. First, as in Test 3, disc-shaped abrasive materials 10 of Examples B6 to B10 and Comparative Examples B4 and B5 were obtained. At this time, the amount of pore-forming material added was adjusted to change the porosity.

Table 7 shows the volume % of diamond particles, the volume % of glassy material due to the third bond material and the fourth bond material, and the porosity (volume %) in each polishing body 10. Further, the coefficient a of the abrasive material 10 is also shown in Table 7.

As shown in FIG. 10, each abrasive material 10 was fixed onto the base material 4 with an epoxy adhesive as a fifth bonding material to obtain vitrified tools of Examples B6 to B10. A vitrified tool using the abrasive material 10 of Example B6 is referred to as Example B6, a vitrified tool using the abrasive material 10 of Example B7 is referred to as Example B7, and the same applies hereinafter.

These vitrified tools and each SiC wafer were installed in an evaluation test apparatus, and the machining rate, machining maintainability, and wear resistance of SiC machining were evaluated. The results are shown in Table 8.

As is clear from Table 8, the abrasive materials 10 of Examples B6 to B10 can also process SiC at a high processing rate, high processing maintainability, and high wear characteristics. On the other hand, the abrasive material of Comparative Example B4 has insufficient processing maintainability, and the abrasive material of Comparative Example B5 has insufficient wear characteristics.

From Tests 3 and 4, it was found that according to the abrasive material 2 of the third teaching, it was possible to manufacture a vitrified tool that was less likely to cause deep scratches and was capable of achieving a high machining rate, high machining maintainability, and high wear resistance. Recognize. Furthermore, it can be seen that the vitrified tool of the fourth teaching is less likely to cause deep scratches and can achieve a high machining rate, high machining maintainability, and high wear resistance. The operation of the abrasive material 2 of the third teaching and the vitrified tool of the fourth teaching is similar to that of the abrasive material 1 of the first teaching and the vitrified tool of the second teaching.

Further, it can be seen that in the abrasive material 2 of the third teaching and the vitrified tool of the fourth teaching, the coefficient a is preferably 0.15 to 0.9. When the coefficient a is less than 0.15, the abrasive materials 1 are connected thickly, so that wear does not progress appropriately, the sharpness of the abrasive material 2 decreases, and the machining rate becomes unstable. Furthermore, if the coefficient a exceeds 0.9, the strength of the abrasive material 2 decreases and the abrasive material 1 is likely to fall off because the abrasive materials 1 are connected in a thin manner. If the coefficient a is 0.15 to 0.9, the degree of connection between the abrasives 1 is appropriate, and the workpiece can be stably processed.

In the above, the present invention has been explained based on Tests 1 to 4, but it goes without saying that the present invention is not limited to Tests 1 to 4, and can be applied with appropriate changes without departing from the spirit thereof. Nor.

The present invention can be used for polishing tools, grinding tools, etc.

1, 2, 10... Abrasive material 3... Abrasive grain 5... 1st, 3, 4 bond material 7, 4... Base material 9, 11... 2nd bond material (slurry)
6, 8...Fifth bond material (slurry)

Claims (4)

Consisting of secondary particles in which countless abrasive grains, which are primary particles, are bonded by a first bonding material into particles having a larger diameter than each of the abrasive grains,
An abrasive material for a vitrified tool, wherein the first bonding material is made of glass. A vitrified tool comprising a base material and a granular abrasive material provided on the base material,
The abrasive material is composed of secondary particles in which countless abrasive grains, which are primary particles, are bonded by a first bonding material into particles having a larger diameter than each of the abrasive grains,
the abrasive material is provided on the base material by a second bond material,
A vitrified tool, wherein the first bond material and the second bond material are made of glass. A countless number of abrasive grains, which are primary particles, are bound by a third bonding material to form secondary particles having a larger diameter than each of the abrasive grains, and the countless number of secondary particles are connected to each other by a fourth bonding material. It has a structure that
An abrasive material for a vitrified tool, wherein the third bond material and the fourth bond material are made of glass. A vitrified tool comprising a base material and an abrasive material of a predetermined shape provided on the base material,
In the abrasive material, innumerable abrasive grains, which are primary particles, constitute secondary particles that are bonded by a third bonding material into grains having a larger diameter than each of the abrasive grains, and the innumerable secondary particles are bonded together by a fourth bond. It has a structure connected to each other by materials,
The abrasive material is provided on the base material by a fifth bond material,
A vitrified tool, wherein among the third bond material, the fourth bond material, and the fifth bond material, the third bond material and the fourth bond material are made of glass.

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