JP2023095035A - Light-emitting device, light-emitting module, and method for manufacturing light-emitting device - Google Patents

Abstract

To provide a light-emitting device, a light-emitting module, and a method of manufacturing a light-emitting device capable of eliminating a need for identification of a terminal to facilitate mounting.SOLUTION: A light-emitting device comprises: a base material; a pair of first wires on a first surface of the base material; a first light-emission part and a second light-emission part on the pair of first wires; a pair of second wires on a second surface of the base material; a third light-emission part and a fourth light-emission part on the pair of second wires; a first connection member electrically connecting between one of the pair of first wires and one of the pair of second wires; a second connection member electrically connecting between the other of the pair of first wires and the other of the pair of second wires; a first terminal arranged on the first surface and electrically connected with the first connection member; and a second terminal arranged on the second surface and electrically connected with the second connection member. The first and second light-emission parts are connected in anti-parallel. The third and fourth light-emission parts are connected in anti-parallel.SELECTED DRAWING: Figure 1

Description

Embodiments relate to a light-emitting device, a light-emitting module, and a method for manufacturing a light-emitting device.

There is a light emitting device capable of emitting light from both sides. In such a double-sided light-emitting device, similarly to a single-sided light-emitting device, when a voltage higher than that applied to the cathode terminal is applied to the anode terminal, a current flows through the light-emitting device to emit light (for example, , Patent Document 1, etc.).

When mounting such a light-emitting device, it is necessary to distinguish between the anode terminal and the cathode terminal. Due to the miniaturization of light-emitting devices, it may become difficult to identify the terminals, which may make it difficult to mount the light-emitting devices.

There is a demand for facilitating mounting by eliminating the need to identify the terminals of a light-emitting device that emits light from both sides.

WO2013/115379

An object of the embodiments is to provide a light-emitting device that does not require terminal identification and is easy to mount, a light-emitting module using the light-emitting device, and a method for manufacturing the light-emitting device.

A light emitting device according to an embodiment includes a substrate having a first surface and a second surface opposite to the first surface, a pair of first wirings arranged on the first surface, and a pair of first wirings. a first light-emitting portion and a second light-emitting portion arranged on one wiring; a pair of second wires arranged on the second surface; a third light-emitting portion arranged on the pair of second wires; a fourth light emitting portion; a first connecting member electrically connecting one of the pair of first wirings and one of the pair of second wirings; the other of the pair of first wirings and the pair of second wirings; a second connection member electrically connecting the other of the wirings; a first terminal arranged on the first surface and electrically connected to the first connection member; and a second terminal electrically connected to the second connection member. The first light emitting section includes a first anode electrode electrically connected to one of the pair of first wirings and a first cathode electrode electrically connected to the other of the pair of first wirings. include. The second light emitting section includes a second cathode electrode electrically connected to one of the pair of first wirings and a second anode electrode electrically connected to the other of the pair of first wirings. include. The third light-emitting portion includes a third anode electrode electrically connected to one of the pair of second wirings and a third cathode electrode electrically connected to the other of the pair of second wirings. include. The fourth light emitting section includes a fourth cathode electrode electrically connected to one of the pair of second wirings and a fourth anode electrode electrically connected to the other of the pair of second wirings. include.

A method for manufacturing a light-emitting device according to an embodiment includes steps of preparing a substrate having a first surface and a second surface opposite to the first surface, and forming a pair of first wirings on the first surface. connecting a first light emitting element to the pair of first wirings; forming a pair of second wirings on the second surface; and connecting a second light emitting element to the pair of second wirings. forming a first connecting member electrically connecting one of the pair of first wirings and one of the pair of second wirings; and forming a second connection member for electrically connecting the other of the two wirings. The first light emitting element includes a first light emitting section, a first anode electrode for the first light emitting section electrically connected to one of the pair of first wirings, and a pair of first wirings. a first cathode electrode for the first light-emitting portion electrically connected to the other, the second light-emitting portion, and the second light-emitting electrically connected to one of the pair of first wirings; and a second anode electrode for the second light-emitting portion electrically connected to the other of the pair of first wirings. The second light emitting element includes a third light emitting section, a third anode electrically connected to one of the pair of second wirings for the third light emitting section, and the other of the pair of second wirings. a third cathode for the third light-emitting unit electrically connected to a fourth light-emitting unit; and a fourth light-emitting unit electrically connected to one of the pair of second wirings. and a fourth anode for the fourth light emitting section electrically connected to the other of the pair of second wirings.

According to this embodiment, it is possible to provide a light-emitting device that does not require terminal identification and is easy to mount, a light-emitting module using the light-emitting device, and a method for manufacturing the light-emitting device.

1 is a schematic perspective view illustrating a light emitting device according to a first embodiment; FIG. 1 is a schematic side view illustrating a light emitting device according to a first embodiment; FIG. 1 is a schematic top view illustrating a light emitting device according to a first embodiment; FIG. 1 is a schematic bottom view illustrating a light emitting device according to a first embodiment; FIG. FIG. 3B is a schematic cross-sectional view taken along line IVA-IVA of FIG. 3A. FIG. 3B is a schematic cross-sectional view taken along line IVB-IVB of FIG. 3A. FIG. 3B is a schematic cross-sectional view taken along line IVC-IVC of FIG. 3A. FIG. 4 is a schematic cross-sectional view illustrating part of a light-emitting device according to Modification 1 of the first embodiment; FIG. 4 is a schematic cross-sectional view illustrating part of a light-emitting device according to Modification 1 of the first embodiment; FIG. 7 is a schematic top view illustrating a part of a light-emitting device according to Modification 2 of the first embodiment; FIG. 10 is a schematic side view illustrating part of a light emitting device according to Modification 2 of the first embodiment; FIG. 11 is a schematic top view illustrating a part of a light emitting device according to Modification 3 of the first embodiment; FIG. 11 is a schematic side view illustrating a part of a light emitting device according to Modification 3 of the first embodiment; 4 is a schematic exploded perspective view for explaining the operation of the light emitting device according to the first embodiment; FIG. FIG. 4 is a schematic top view for explaining the operation of the light emitting device according to the first embodiment; FIG. 3 is a schematic cross-sectional view for explaining the operation of the light emitting device according to the first embodiment, and is a cross-sectional view taken along the line VIIC-VIIC in FIG. 2; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the first embodiment; FIG. 5 is a schematic perspective view illustrating a light emitting device according to a second embodiment; FIG. 10 is a schematic side view illustrating a light emitting device according to a second embodiment; FIG. 11 is a schematic side view of the light emitting device according to the second embodiment, viewed from another side; FIG. 10 is a schematic top view illustrating a light emitting device according to a second embodiment; FIG. 10 is a schematic bottom view illustrating a light emitting device according to a second embodiment; 14B is a schematic cross-sectional view taken along line XVA-XVA of FIG. 14A. FIG. 14B is a schematic cross-sectional view taken along line XVB-XVB of FIG. 14A. FIG. 14B is a schematic cross-sectional view for explaining the operation of the light-emitting device according to the second embodiment, and is a cross-sectional view taken along line XVIA-XVIA in FIG. 14A. FIG. 14B is a schematic cross-sectional view for explaining the operation of the light-emitting device according to the second embodiment, and is a cross-sectional view taken along line XVIB-XVIB in FIG. 14A. FIG. FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; 18B is a schematic cross-sectional view of the XVIIIB portion of FIG. 18A; FIG. FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; 19B is a schematic cross-sectional view of the XIXB portion of FIG. 19A; FIG. FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; 8A to 8D are schematic side views illustrating the method for manufacturing the light emitting device according to the second embodiment; FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; FIG. 10 is a schematic perspective view illustrating the method for manufacturing the light emitting device according to the second embodiment; FIG. 11 is a schematic side view illustrating a light emitting module according to a third embodiment; FIG. 11 is a schematic top view illustrating a light-emitting module according to a third embodiment; FIG. 11 is a schematic side view illustrating a light emitting module according to a fourth embodiment; FIG. 11 is a schematic top view illustrating a light-emitting module according to a fourth embodiment; FIG. 11 is a schematic side view illustrating a light emitting module according to a fifth embodiment; FIG. 11 is a schematic top view illustrating a light-emitting module according to a fifth embodiment; FIG. 11 is a schematic side view illustrating a light emitting module according to a sixth embodiment;

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Note that the drawings are schematic or conceptual, and the relationship between the thickness and width of each portion, the size ratio between portions, and the like are not necessarily the same as the actual ones. Also, even when the same parts are shown, the dimensions and ratios may be different depending on the drawing.
In addition, in this specification and each figure, the same code|symbol may be attached|subjected to the element similar to the thing which was mentioned above regarding the existing drawing, and detailed description may be abbreviate|omitted.
In addition, the drawing may show an end surface as a cross section.

(First embodiment)
FIG. 1 is a schematic perspective view illustrating a light emitting device according to this embodiment.
FIG. 2 is a schematic side view illustrating the light emitting device according to this embodiment.
FIG. 3A is a schematic top view illustrating the light emitting device according to this embodiment.
FIG. 3B is a schematic bottom view illustrating the light emitting device according to this embodiment.
As shown in FIGS. 1, 2, 3A, and 3B, the light-emitting device 1 of this embodiment includes a substrate 10, a pair of first wirings 20, a first light-emitting element 40a, and a pair of second wirings. 30 , a second light emitting element 40 b , a first connection member 51 , a second connection member 52 , a first terminal 61 , and a second terminal 62 . The light-emitting device 1 of this embodiment further includes a first translucent member 71 and a second translucent member 72 .

In the following description of this embodiment, three-dimensional coordinates may be used. The substrate 10 has a first surface 11a and a second surface 11b. The second surface 11b is a surface located on the opposite side of the first surface 11a. It is assumed that the first surface 11a is provided parallel to the XY plane. The second surface 11b is a plane parallel to the first surface 11a. Therefore, the second surface 11b is also a surface parallel to the XY plane. The X-axis is parallel to a straight line connecting the center of the first anode electrode A1 and the center of the first cathode electrode K1 of the first light-emitting portion 41 in XY plan view. The Z-axis is perpendicular to the XY plane, and the positive direction is the direction from the second surface 11b to the first surface 11a. In this specification, the term “parallel” includes a range of 0° to ±5° between two straight lines, sides, surfaces, and the like.

The positive direction of the Z-axis is sometimes called "up" or "upper", and the negative direction of the Z-axis is sometimes called "down" or "downward". However, the direction along the Z-axis is not necessarily the direction in which gravity is applied. In the light emitting device of this embodiment and a second embodiment described later, when describing the configuration of the first surface side, the positive direction of the Z axis is also referred to as “up” or “upward”, and the positive direction of the Z axis is also referred to as “upward” or “upward”. When describing the configuration, the negative direction of the Z-axis is sometimes referred to as "up" or "upward", such as "on the second surface". These are also for facilitating understanding of the explanation, and are not limited to the actual "above" or "above".

As shown in FIGS. 1 and 2, in the light emitting device 1, the first translucent member 71 is arranged on the first surface 11a side of the substrate. The surface of the first translucent member 71 opposite to the surface facing the first surface 11a is the light extraction surface S1. Further, in the light emitting device 1, the second translucent member 72 is arranged on the second surface 11b side of the base material. The surface of the second translucent member 72 opposite to the surface facing the second surface 11b is the light extraction surface S2. Therefore, the light-emitting device 1 is a double-sided light-emitting device having a light extraction surface S1 and a light extraction surface S2 located on the opposite side of the light extraction surface S1. For convenience of explanation, the surface of the first translucent member 71 opposite to the surface facing the first surface 11a is referred to as a light extraction surface S1. However, the light extracted from the first translucent member 71 is not limited to be extracted from the light extraction surface S1. It is also taken out from the side located between Similarly, the surface of the second translucent member 72 opposite to the surface facing the second surface 11b is a light extraction surface S2. However, the light extracted from the second translucent member 72 is not limited to be extracted from the light extraction surface S2. It is also taken out from the side located between The same applies to a first translucent member 271 and a second translucent member 272 which will be described later.

In this example, the base material 10 is a plate-like member having a substantially square shape when viewed from the XY plane. The base material 10 is not limited to a square, but may be a plate-like member having a rectangular shape in an XY plan view, or a plate-like member having a polygonal shape other than squares and rectangles. good. The substrate 10 includes a first substrate 10a and a second substrate 10b in this example. The first base material 10a and the second base material 10b are, for example, plate-like members having the same shape and thickness when viewed in the XY plane. The first base material 10a is attached to the second base material 10b with, for example, a translucent adhesive. At this time, the surface of the first substrate 10a opposite to the first surface 11a faces the surface of the second substrate 10b opposite to the second surface 11b.

The base material 10a and the base material 10b may be made of a non-translucent material or a translucent material. Non-translucent materials include, for example, silicon nitride or resins containing pigments or reflective fillers. Examples of translucent materials include glass and resin. The base material 10a and the base material 10b may be the same material or different materials. Below, the base material 10 is demonstrated as what contains the base material 10a, 10b. However, the base material 10 may be composed of one member.

As shown in FIGS. 2 and 3A, the pair of first wirings 20 are arranged on the first surface 11a. The pair of first wirings 20 includes a first conductor (one of the pair of first wirings) 21 and a second conductor (the other of the pair of first wirings) 22 . The first conductor 21 and the second conductor 22 are arranged on the first surface 11a with a gap G1 interposed therebetween. The gap G1 is provided along the Y-axis direction substantially at the center of the X-axis direction on the first surface 11a. A gap G1 separates the pair of first wirings 20 into a first conductor 21 and a second conductor 22 . The length of the gap G1 in the X-axis direction is set to be slightly shorter than the distance between the anode electrode and the cathode electrode of each of the first light emitting section 41 and the second light emitting section .

As shown in FIGS. 2 and 3B, the pair of second wirings 30 are arranged on the second surface 11b. The pair of second wirings 30 includes a third conductor (the other of the pair of second wirings) 33 and a fourth conductor (one of the pair of second wirings) 34 . The third conductor 33 and the fourth conductor 34 are arranged on the second surface 11b via the gap G2. The gap G2 is provided along the Y-axis direction substantially at the center of the second surface 11b in the X-axis direction. A gap G2 separates the pair of second wirings 30 into a third conductor 33 and a fourth conductor . The length of the gap G2 in the X-axis direction is set to be slightly shorter than the distance between the anode electrode and the cathode electrode of each of the third light emitting section 43 and the fourth light emitting section 44, unlike the case of the gap G1. It is the same.

The first conductor 21, the second conductor 22, the third conductor 33, and the fourth conductor 34 may be, for example, copper (Cu), aluminum (Al), or a conductive film such as an alloy containing these, or Ag paste. Alternatively, a translucent conductive film such as indium tin oxide (ITO) or zinc oxide (ZnO) may be used. When the first conductor 21, the second conductor 22, the third conductor 33, and the fourth conductor 34 are translucent conductive films, the amount of light on one side is added to the amount of light on the other side. It becomes possible to increase the overall luminous efficiency of the device.

As shown in FIGS. 2 and 3A, the first light emitting element 40a includes a first light emitting section 41 and a second light emitting section . In this example, the first light emitting section 41 and the second light emitting section 42 are separated via a space. The first light emitting section 41 and the second light emitting section 42 are arranged on the pair of first wirings 20 . The first light-emitting portion 41 and the second light-emitting portion 42 are arranged such that straight lines connecting the respective anode electrodes and cathode electrodes are parallel to the X-axis.

The first light emitting section 41 has a first anode electrode A1 and a first cathode electrode K1. The second light emitting section 42 has a second anode electrode A2 and a second cathode electrode K2. In FIG. 3A, the first anode electrode A1 and the second anode electrode A2 are indicated by a "+" symbol, and the first cathode electrode K1 and the second cathode electrode K2 are indicated by a "-" symbol. there is

In the first light emitting section 41 , the first anode electrode A1 is connected to the first conductor 21 and the first cathode electrode K1 is connected to the second conductor 22 . In the second light emitting section 42 , the second anode electrode A2 is connected to the second conductor 22 and the second cathode electrode K2 is connected to the first conductor 21 . The first anode electrode A1 and the second cathode electrode K2 are electrically connected to each other via the first conductor 21 . The first cathode electrode K1 and the second anode electrode A2 are electrically connected to each other via the second conductor 22 . That is, the first light emitting section 41 and the second light emitting section 42 are connected in inverse parallel with each other by the pair of first wirings 20 .

In the first light emitting unit 41, a current flows by applying a voltage higher than the voltage applied to the first cathode electrode A1 to the first anode electrode A1, and the first light emitting unit 41 has a brightness corresponding to the flowing current. to emit light. Similarly, in the second light emitting section 42, by applying a voltage higher than the voltage applied to the second cathode electrode K2 to the second anode electrode A2, a current flows, and the second light emitting section 42 responds to the flowing current. It emits light with the corresponding brightness.

Therefore, even when a voltage higher than the voltage applied to the second conductor 22 is applied to the first conductor 21, the voltage higher than the voltage applied to the first conductor 21 is applied to the second conductor 22. Even in this case, either the first light emitting section 41 or the second light emitting section 42 emits light.

As shown in FIGS. 2 and 3B, the second light emitting element 40b includes a third light emitting section 43 and a fourth light emitting section 44. As shown in FIGS. In this example, the third light emitting section 43 and the fourth light emitting section 44 are separated by a space. The third light emitting portion 43 and the fourth light emitting portion 44 are arranged on the pair of second wirings 30 . The third light-emitting portion 43 and the fourth light-emitting portion 44 are arranged such that straight lines connecting respective anode electrodes and cathode electrodes are parallel to the X-axis.

The third light emitting section 43 has a third anode electrode A3 and a third cathode electrode K3. The fourth light emitting section 44 has a fourth anode electrode A4 and a fourth cathode electrode K4. In FIG. 3B, the third anode electrode A3 and the fourth anode electrode A4 are denoted by a "+" symbol, and the third cathode electrode K3 and the fourth cathode electrode K4 are denoted by a "-" symbol. there is

In the third light emitting section 43, the third anode electrode A3 is connected to the third conductor 33 and the third cathode electrode K3 is connected to the fourth conductor . In the fourth light emitting section 44 , the fourth anode electrode A4 is connected to the fourth conductor 34 and the fourth cathode electrode K4 is connected to the third conductor 33 . The third anode electrode A3 and the fourth cathode electrode K4 are electrically connected to each other through the third conductor 33. As shown in FIG. The third cathode electrode K3 and the fourth anode electrode A4 are electrically connected to each other through the fourth conductor 34. As shown in FIG. That is, the third light emitting section 43 and the fourth light emitting section 44 are connected in inverse parallel with each other by the pair of second wirings 30 .

The third light emitting section 43 and the fourth light emitting section 44 have the same configuration as the first light emitting section 41 and the second light emitting section 42, and operate similarly. That is, in the third light emitting section 43, a current is applied to the third anode electrode A3 to emit light by applying a higher voltage than the voltage applied to the third cathode electrode K3. The third light emitting unit 43 emits light with luminance according to the flowing current. In the fourth light emitting section 44, a current is applied to the fourth anode electrode A4 to emit light by applying a higher voltage than the voltage applied to the fourth cathode electrode K4. The fourth light emitting section 44 emits light with a brightness corresponding to the flowing current.

Therefore, even when a voltage higher than the voltage applied to the fourth conductor 34 is applied to the third conductor 33, the voltage higher than the voltage applied to the third conductor 33 is applied to the fourth conductor 34. Even in this case, either the third light emitting section 43 or the fourth light emitting section 44 emits light.

The first light-emitting portion 41, the second light-emitting portion 42, the third light-emitting portion 43, and the fourth light-emitting portion 44 each include, in addition to the above-described anode electrode and cathode electrode, for example, a substrate for semiconductor growth and a semiconductor lamination structure. there is In each of the light emitting units 41 to 44, the anode electrode and the cathode electrode are arranged on the surface of the semiconductor laminated structure facing the first base material 10a, and the semiconductor growth substrate is arranged on the side opposite to the first base material 10a side of the semiconductor laminated structure. is placed on the face located at The semiconductor laminate structure includes In _x Al _y Ga _1-x-y N (0≦x, 0≦y, x+y≦1) layers and emits, for example, blue light. Blue light is light with a peak wavelength in the range of 420 nm or more and 490 nm or less, for example, light of about 467 nm.

As shown in FIGS. 2, 3A, and 3B, the first connecting member 51 is arranged to penetrate from the first surface 11a of the base material 10 to the second surface 11b. One end of the first connection member 51 is connected to the first conductor 21 on the first surface 11a side. The other end of the first connection member 51 is connected to the fourth conductor 34 on the second surface 11b side. The second connection member 52 is arranged to penetrate from the first surface 11a to the second surface 11b of the base material 10 . One end of the second connection member 52 is connected to the second conductor 22 on the first surface 11a side. The other end of the second connection member 52 is connected to the third conductor 33 on the second surface 11b side.

The first conductor 21 and the fourth conductor 34 are electrically connected via the first connection member 51 . The second conductor 22 and the third conductor 33 are electrically connected via the second connection member 52 .

For the first connection member 51 and the second connection member 52, for example, copper (Cu), aluminum (Al), or an alloy containing these may be used, or Ag paste may be used. The first connection member 51 and the second connection member 52 are arranged to penetrate through the base material 10 respectively. In this example, the first connection member 51 and the second connection member 52 fill all the through holes provided in the base material 10 . However, not limited to this example, the first connection member 51 and the second connection member 52 are arranged in layers along inner walls 51W and 52W that define a through-hole penetrating from the first surface 11a to the second surface 11b. good too.

The first terminal 61 is arranged on the first connection member 51 and connected to the first connection member 51 . The first connection member 51 is connected to the first conductor 21 and the fourth conductor 34 . Therefore, the first terminal 61 is electrically connected to the first conductor 21 and the fourth conductor 34 via the first connection member 51 . The second terminal 62 is arranged on the second connection member 52 and connected to the second connection member 52 . The second connection member 52 is connected to the second conductor 22 and the third conductor 33 . Therefore, the second terminal 62 is electrically connected to the second conductor 22 and the third conductor 33 via the second connection member 52 .

In this example, the first terminal 61 and the second terminal 62 are square in XY plan view. The shape of the first terminal 61 and the second terminal 62 in the XY plan view is not limited to square, and may be circular. As in this example, when the area of the first terminal 61 is larger than the area of the first connection member 51 in the XY plan view, the first terminal 61 is also connected to the first conductor 21 . Therefore, the area of the first terminal 61 is preferably larger than the area of the first connection member 51 in the XY plan view from the viewpoint of more efficiently supplying the current from the external power supply to the first connection member 51 . Similarly, the dimension of the shape of the second terminal 62 is preferably larger than the dimension of the shape of the second connection member 52 in the XY plan view.

Also, in this example, the surface of the first terminal 61 parallel to the XY plane is arranged to be flush with the light extraction surface S1. Further, the surface of the second terminal 62 parallel to the XY plane is arranged so as to be flush with the light extraction surface S2.

One node of the anti-parallel circuit of the first light emitting unit 41 and the second light emitting unit 42 is connected to the third light emitting unit 43 and the fourth light emitting unit via the first conductor 21, the first connecting member 51 and the fourth conductor 34. It is electrically connected to one node of 44 anti-parallel circuits. The other node of the anti-parallel circuit of the first light emitting unit 41 and the second light emitting unit 42 is connected to the third light emitting unit 43 and the fourth light emitting unit via the second conductor 22, the second connection member 52 and the third conductor 33. 44 is electrically connected to the other node of the anti-parallel circuit.

The voltage difference between the first terminal 61 and the second terminal 62, regardless of its positive or negative polarity, causes a current to flow through one of the light-emitting portions of the anti-parallel circuit on the first surface 11a side to cause light to be emitted. A current is passed through one of the light emitting portions of the anti-parallel circuit on the side of the surface 11b to emit light. Since the first light-emitting portion 41 and the second light-emitting portion 42 are arranged to face the third light-emitting portion 43 and the fourth light-emitting portion 44 with the substrate 10 interposed therebetween, the first surface 11a of the substrate 10 and the Both surfaces on the second surface 11b side emit light.

The first terminal 61 is arranged on the first connection member 51 on the first surface 11a side, and the second terminal 62 is arranged on the second connection member 52 on the second surface 11b side. Therefore, by connecting the positive electrode and the negative electrode of an external power supply for causing the light emitting device to emit light to the first terminal arranged on the first surface 11a side and the second terminal arranged on the second surface side, both electrodes are connected. can be electrically connected.

As shown in FIGS. 1 and 2 , the first translucent member 71 covers the first light emitting section 41 and the second light emitting section 42 . The first translucent member 71 further covers the first conductor 21 and the second conductor 22 in this example, and is also arranged within the gap G1. The first translucent member 71 partially covers the side surface of the first terminal 61 . The second translucent member 72 is arranged so as to cover the third light emitting section 43 and the fourth light emitting section 44 . The second translucent member 72 further covers the third conductor 33 and the fourth conductor 34 in this example, and is also arranged within the gap G2. The second translucent member 72 is arranged to partially cover the side surface of the second terminal 62 .

The first translucent member 71 and the second translucent member 72 are composed of the first conductor 21, the second conductor 22, the third conductor 33, the fourth conductor 34, the first light emitting section 41, the second light emitting section 42, the It is arranged for the purpose of shielding the third light-emitting portion 43 and the fourth light-emitting portion 44 from the atmosphere of the external environment and protecting the light emitting device 1 from intrusion of dust, moisture, and the like. The material of the first translucent member 71 and the second translucent member 72 is resin, for example. The first translucent member 71 and the second translucent member 72 may or may not include a wavelength conversion member such as phosphor. The phosphor may be, for example, a KSF-based phosphor, a KSAF-based phosphor, or a fluoride-based phosphor such as an MGF-based phosphor, a nitride phosphor, a quantum dot phosphor, a YAG phosphor, a β-sialon phosphor, or the like. can be done.

The surface parallel to the XY plane of the first translucent member 71 may be in the same plane as the surface parallel to the XY plane of the first terminal 61, or may be in a different plane. The surface parallel to the XY plane of the second translucent member 72 may be in the same plane as the surface parallel to the XY plane of the second terminal 62, or may be in a different plane.

The arrangement of the first light emitting section 41, the second light emitting section 42, the third light emitting section 43 and the fourth light emitting section 44 will be described.
FIG. 4A is a schematic cross-sectional view taken along line IVA-IVA in FIG. 3A.
FIG. 4B is a schematic cross-sectional view taken along line IVB-IVB of FIG. 3A.
FIG. 4C is a schematic cross-sectional view taken along line IVC-IVC in FIG. 3A.
As shown in FIGS. 4A and 4B, the first light emitting portion 41 has a light extraction surface 41S located on the side opposite to the surface on which the electrodes are arranged. The second light emitting section 42 has a light extraction surface 42S positioned opposite to the surface on which the electrodes are arranged. The third light emitting portion 43 has a light extraction surface 43S located on the side opposite to the surface on which the electrodes are arranged. The fourth light emitting section 44 has a light extraction surface 44S positioned opposite to the surface on which the electrodes are arranged. Note that the light extracted from the first light emitting portion 41 is not limited to being extracted from the light extraction surface 41S, and is located between the surface of the first light emitting portion 41 on which the electrodes are arranged and the light extraction surface. It is also taken out from the side that does. The same is true for the second light emitting section 42, the third light emitting section 43, and the fourth light emitting section, so the description is omitted.

In the light-emitting device 1 of this embodiment, the first light-emitting section 41 and the second light-emitting section 42 are arranged to face the third light-emitting section 43 and the fourth light-emitting section 44 with the substrate 10 interposed therebetween. The first light emitting portion 41 and the second light emitting portion 42 are arranged such that the light extraction surfaces 41S and 42S face the positive direction of the Z axis. The third light emitting portion 43 and the fourth light emitting portion 44 are arranged such that the light extraction surfaces 43S and 44S face the negative direction of the Z axis. Light emitted from the light extraction surfaces 41S and 42S of the first light emitting portion 41 and the second light emitting portion 42 is emitted from the light extraction surface S1 of the first translucent member 71 on the first surface 11a side. The light emitted from the light extraction surfaces 43S and 44S of the third light emitting portion 43 and the fourth light emitting portion 44 is emitted from the light extraction surface S2 of the second translucent member 72 on the second surface 11b side. As described above, the light emitted from the light emitting section is also emitted from the side surface of the first translucent member 71 and the side surface of the second translucent member 72 .

As already explained, the first light emitting portion 41 and the second light emitting portion 42 are connected in inverse parallel on the first surface 11a side, and the third light emitting portion 43 and the fourth light emitting portion 44 are connected on the second surface 11b side. are connected in anti-parallel. As shown in FIGS. 4A to 4C, the antiparallel circuit on the side of the first surface 11a is connected in parallel to the antiparallel circuit on the side of the second surface 11b by the first connecting member 51 and the second connecting member 52. . Therefore, by applying a voltage higher than the voltage applied to the second terminal 62 to the first terminal 61, the first light emitting section 41 emits light on the first surface 11a side, and the second surface 11b side emits light. A current flows through the fourth light emitting section 44 and the fourth light emitting section 44 emits light.

In this example, the first light emitting unit 41 and the third light emitting unit 43 are arranged so that the outer circumference of the first light emitting unit 41 substantially overlaps the outer circumference of the third light emitting unit 43 in XY plan view. The second light emitting section 42 and the fourth light emitting section 44 are arranged such that the outer periphery of the second light emitting section 42 substantially overlaps the outer periphery of the fourth light emitting section 44 in XY plan view. In this example, when viewed from the XY plane, one of the light-emitting portions whose peripheries overlap each other emits light, and the other does not emit light.

Since the light-emitting portion emits light when a current flows, it generates heat according to the magnitude of the flowing current. Heat generated by the light emitting unit is dissipated through the first conductor 21 and the second conductor 22 . In the case of the light-emitting device 1 shown in FIGS. 4A to 4C, in the first conductor 21 and the second conductor 22, the heat-generating locations on the first surface 11a side differ from the heat-generating locations on the second surface 11b side. , the heat-generating portions are dispersed, so that the heat generated by the light-emitting portion is dissipated more efficiently.

(Modification 1)
5A and 5B are schematic cross-sectional views illustrating part of a light-emitting device according to Modification 1 of the present embodiment.
As shown in FIGS. 5A and 5B, in the light-emitting device 101, the first light-emitting portion 41 is arranged at a position facing the fourth light-emitting portion 44 with the base material 10 interposed therebetween, and the second light-emitting portion 42 is arranged on the base material. It is arranged at a position facing the third light emitting portion 43 through 10 . That is, in Modification 1, the arrangement of the third light emitting section 43 and the fourth light emitting section 44 is different from the example described with reference to FIGS. 4A to 4C.

FIG. 5A is a schematic cross-sectional view taken along line IVA-IVA in FIG. 3A when the arrangement of the third light-emitting portion 43 and the fourth light-emitting portion 44 is as described above.
FIG. 5B is a schematic cross-sectional view taken along line IVB-IVB in FIG. 3A when the arrangement of the third light-emitting portion 43 and the fourth light-emitting portion 44 is as described above.

In Modification 1, the arrangement of the light emitting portions 43 and 44 is different from that described with reference to FIGS. 4A to 4C. However, the electrical connections of the first to fourth light emitting units 41 to 44 are the same as those described with reference to FIGS. 4A to 4C. By applying a voltage higher than the voltage applied to the second terminal 62 to the first terminal 61, the first light emitting portion 41 emits light on the first surface 11a side, and the fourth light emitting portion 41 emits light on the second surface 11b side. The light emitting part 44 emits light. By applying a voltage higher than the voltage applied to the first terminal 61 to the second terminal 62, a current flows through the second light emitting section 42 on the first surface 11a side and the second light emitting section 42 emits light. , on the second surface 11b side, a current flows through the third light emitting portion 43, and the third light emitting portion 43 emits light.

In the light-emitting device 101 of Modification 1, the overlapping light-emitting portions emit light when viewed in the XY plane, so the light-emitting device 101 appears to emit light at one point when viewed in the XY plane. Therefore, part of the light quantity for the other surface is added to the quantity of light emitted from the light extraction surface S1 on the first surface 11a side and the light extraction surface S2 on the second surface 11b side, and the luminous efficiency of the light emitting device 101 increases. can be increased.

In the example described with reference to FIGS. 4A to 5B, the light-emitting portion on the first surface 11a side is arranged to face the light-emitting portion on the second surface 11b side in the XY plan view. The light-emitting portion on the first surface 11a side does not necessarily have to be arranged to face the light-emitting portion on the second surface 11b side. Also, the two light emitting portions on the first surface 11a side and the second surface 11b side need not be arranged in parallel. Furthermore, the direction of arrangement of the two light emitting units on the first surface 11a side may be different from the direction of arrangement of the two light emitting units on the side of the second surface 11b.

(Modification 2)
FIG. 6A is a schematic plan view illustrating part of a light-emitting device according to Modification 2 of the present embodiment.
FIG. 6B is a schematic right side view illustrating part of the light emitting device according to Modification 2 of the present embodiment.
In Modified Example 2, the light-emitting element 120 has a configuration in which the first light-emitting portion 41 and the second light-emitting portion 42 are connected via the substrate 121 .

As shown in FIGS. 6A and 6B, the light-emitting device 120 includes a first light-emitting portion 41, a second light-emitting portion 42, and a substrate 121. FIG. The first light emitting portion 41 includes a light extraction surface 41S, a first anode electrode A1, and a first cathode electrode K1. The first anode electrode A1 and the first cathode electrode K1 are arranged on the surface side opposite to the light extraction surface 41S. The second light emitting portion 42 includes a light extraction surface 42S, a second anode electrode A2, and a second cathode electrode K2. The second anode electrode A2 and the second cathode electrode K2 are arranged on the surface side opposite to the light extraction surface 42S.

The substrate 121 has a light extraction surface 121S and a light emitting unit installation surface 121R. 121 R of light emission part installation surfaces are surfaces located in the opposite side to the light extraction surface 121S. The first light emitting unit 41 and the second light emitting unit 42 are arranged on the light emitting unit installation surface 121</b>R of the substrate 121 . Substrate 121 is, for example, silicon (Si), sapphire, or glass. The substrate 121 has translucency in order to extract light from the light extraction surface 121S.

The first light emitting section 41 and the second light emitting section 42 are arranged in parallel. The first light emitting portion 41 and the second light emitting portion 42 are arranged such that the electrodes are electrically connected to each other via the first conductor 21 and the second conductor 22, as shown in FIG. 3A and the like. . The first light emitting unit 41 is arranged on the light emitting unit installation surface 121R so that the light extraction surface 41S faces the light emitting unit installation surface 121R. The second light emitting unit 42 is arranged on the light emitting unit installation surface 121R so that the light extraction surface 42S faces the light emitting unit installation surface 121R.

By using the light-emitting element 120 in which two light-emitting portions are connected, the manufacturing process of the light-emitting device 1 is shortened and simplified.

In the light-emitting element 120 shown in FIGS. 6A and 6B, the first light-emitting portion 41 and the second light-emitting portion 42 are connected via the first substrate 121 . However, the light emitting element is not limited to this, and may be formed by stacking a semiconductor multilayer structure on a semiconductor growth substrate and dividing the semiconductor multilayer structure so as not to divide the growth substrate. In this configuration, two semiconductor laminated structures are provided on the growth substrate, and light can be emitted from each of the two semiconductor laminated structures.
(Modification 3)
FIG. 6C is a schematic plan view illustrating part of a light-emitting device according to Modification 3 of the present embodiment.
FIG. 6D is a schematic right side view illustrating part of the light emitting device according to Modification 3 of the present embodiment.
Modification 3 is the same as Modification 2 in that the first light emitting section 41 and the second light emitting section 42 are connected via the substrate 122 in the light emitting element 120a. The light emission modification 3 is different from the modification 2 in the connection between the substrate 122 and the light emitting section. That is, in Modification 2, the light extraction surface 41 S of the first light emitting portion 41 and the light extraction surface 42 S of the second light emitting portion 42 are connected to the substrate 121 . On the other hand, in Modification 3, the surface orthogonal to the light extraction surface of the first light emitting portion 41 and the surface orthogonal to the light extraction surface 42S of the second light emitting portion 42 are connected to the substrate 122 . The same applies to the third light emitting section 43 and the fourth light emitting section 44 .

As shown in FIGS. 6C and 6D, the light-emitting element 120a includes a first light-emitting portion 41, a second light-emitting portion 42, and a substrate 122. As shown in FIGS. The substrate 122 is arranged between the first light emitting section 41 and the second light emitting section 42 . The substrate 122 is arranged to connect the first light emitting section 41 to the second light emitting section 42 to form one light emitting element 120a. The substrate 122 may be made of the same material as that of the substrate 121, or may be an adhesive that connects the light emitting portions.

According to Modification 3, the manufacturing process of the light emitting device 1 is simplified, and since the substrate 121 in the case of Modification 2 is not provided, the light emitting device 1 can be made thinner.

The operation of the light emitting device 1 of this embodiment will be described.
FIG. 7A is a schematic exploded perspective view for explaining the operation of the light emitting device according to this embodiment.
FIG. 7B is a schematic plan view for explaining the operation of the light emitting device according to this embodiment.
7C is a schematic cross-sectional view for explaining the operation of the light-emitting device according to this embodiment, and is a cross-sectional view taken along the line VIIC-VIIC in FIG. 2. FIG.
7A to 7C schematically show the operation when the power supply I0 is connected to the first terminal 61 and the second terminal 62. FIG. In this example, one output of power supply I0 is connected to terminal 61 and the other output is connected to terminal 62. FIG. The power supply I0 is connected to the first terminal 61 so as to apply a higher voltage than the voltage applied to the second terminal 62 to cause a current to flow into the first terminal 61 and a current to flow out of the second terminal 62. ing.

As indicated by the thick arrow in FIG. 7A , the light emitting device 1 causes the current that has flowed in from the first terminal 61 to flow out from the second terminal 62 . More specifically, the current supplied to the light emitting device 1 flows through the following routes.

As indicated by arrows in FIG. 7B , the current flowing from the first terminal 61 flows through the first conductor 21 and reaches the first anode electrode A1 of the first light emitting section 41 . Current flows into the first anode electrode A1 and out of the first cathode electrode K1. The current flowing out from the first cathode electrode K1 flows through the second conductor 22 and reaches the second terminal 62 via the second connection member 52 and the third conductor 33 . In this way, on the first surface 11a side of the substrate 10 shown in FIG. 7A, a current flows through the first light emitting section 41 and the first light emitting section 41 emits light.

As indicated by arrows in FIG. 7C , the current flowing from the first terminal 61 branches to the first connection member 51 , flows through the fourth conductor 34 , and reaches the fourth anode electrode A4 of the fourth light emitting section 44 . Current flows into the fourth anode electrode A4 and out of the fourth cathode electrode K4. The current flowing out from the fourth cathode electrode flows through the third conductor 33 and flows out from the second terminal 62 . In this way, on the second surface 11b side of the base material 10 shown in FIG. 7A, current flows through the fourth light emitting section 44, and the fourth light emitting section 44 emits light.

When the power supply is connected so that a voltage higher than the voltage applied to the first terminal 61 is applied to the second terminal 62, current flows into the second terminal 62, and current flows out from the first terminal 61. Although the operation is not shown, it will be explained in the same way. That is, on the first surface 11a side, the current flowing from the second terminal 62 reaches the second anode electrode A2 of the second light emitting section 42 via the second connection member 52 and the second conductor 22 . Current flows into the second anode electrode A2 and out of the second cathode electrode K2. The flowing current reaches the first terminal 61 via the first conductor. In this way, on the first surface 11a side of the substrate 10, current flows through the second light emitting section 42, and the second light emitting section 42 emits light.

On the second surface 11 b of the base material 10 , the current flowing from the second terminal 62 reaches the third anode electrode A3 of the third light emitting section 43 via the third conductor 33 . The current flowing into the third anode electrode A3 flows out from the third cathode electrode K3 and reaches the first terminal 61 via the fourth conductor 34, the first connection member 51 and the first conductor 21. In this way, on the second surface 11b side of the substrate 10, current flows through the third light-emitting portion 43, and the third light-emitting portion 43 emits light.

A method for manufacturing the light emitting device 1 of this embodiment will be described.
8A to 10C are schematic perspective views illustrating the method for manufacturing the light emitting device 1 according to this embodiment.
8A to 10A are diagrams explaining the steps for each of the substrates. Elements related to the first substrate 10a are denoted by reference numerals, and elements related to the second substrate 10b are shown in parentheses. Elements that do not need to be distinguished are given the same reference numerals in the first base material 10a and the second base material 10b.
As shown in FIG. 8A, a first substrate 10a and a second substrate 10b are respectively prepared. The first base material 10a has a first surface 11a. The first base material 10a is provided with two through holes 1012a and 1012b penetrating from the first surface 11a to the opposite surface. The through holes 1012a and 1012b are circular in XY plan view. The through-holes 1012a and 1012b are not limited to circular in XY plan view, and may be square. The second base material 10b has a second surface 11b. The second base material 10b is provided with two through holes 1012a and 1012b penetrating from the second surface 11b to the opposite surface.

In this example, the first base material 10a and the second base material 10b have the same shape and the same dimensions, and are made of the same material. In the manufacturing method of this example, conductors are respectively formed in the same process on two substrates 10a and 10b having the same shape and the like, and the light emitting portions are placed and connected.

As shown in FIG. 8B, a conductive seed layer 1020 is formed on the first surface 11a. A conductive seed layer 1030 is formed on the second surface 11b. Seed layer 1020 and seed layer 1030 are formed by sputtering or the like on the entire surface of first surface 11a and the entire surface of second surface 11b, respectively. The seed layers 1020 and 1030 may be a single metal layer such as copper (Cu) or titanium (Ti), or may be a stack of multiple metal layers. Through holes 1012c and 1012d are formed in the seed layer 1020 and the seed layer 1030 in this step. The shape of through-hole 1012c and through-hole 1012d in XY plan view is substantially the same as the shape of two through-holes 1012a and 1012b shown in FIG. 8A in XY plan view.

A resist layer 1002 is formed over the seed layer 1020, as shown in FIG. 8C. A resist layer 1002 is also formed on the seed layer 1030 . A resist layer 1002 is applied onto the seed layers 1020 and 1030 by, for example, a spin coater.

As shown in FIG. 9A, a resist layer 1002 is exposed to form a resist pattern (resist) 1003 on the first base material 10a. Likewise, the resist layer 1002 of the second base material 10b is exposed to form a resist pattern 1003. Next, as shown in FIG. The resist pattern 1003 is formed linearly along the Y-axis direction at substantially the center of the X-axis direction on the seed layers 1020 and 1030 . Seed layers 1020 and 1030 are exposed at locations where the resist layer 1002 has been removed, leaving the resist pattern 1003 . The length WG of the resist pattern 1003 in the X-axis direction is approximately equal to the distance between the first conductor 21 and the second conductor 22 . The same is true for the second surface 11b, and the length WG is approximately equal to the separation distance between the third conductor 33 and the fourth conductor .

The first light emitting portion 41 and the second light emitting portion 42 are placed on the resist pattern 1003 respectively. The first light-emitting portion 41 is arranged such that a straight line connecting the first anode electrode A1 and the first cathode electrode K1 is parallel to the X-axis. At this time, the first anode electrode A1 is positioned in the positive direction of the X-axis from the first cathode electrode K1. The first light emitting portion 41 is arranged such that the resist pattern 1003 is positioned between the first anode electrode A1 and the first cathode electrode K1. The second light emitting section 42 is arranged such that the second anode electrode A2 and the second cathode electrode K2 are parallel to the X-axis. The second cathode electrode K2 is arranged so as to be positioned in the positive direction of the X-axis relative to the second anode electrode A2. The second light emitting portion 42 is arranged such that the resist pattern 1003 is positioned between the second cathode electrode K2 and the second anode electrode A2.

Similarly, for the second base material 10b, the third light emitting section 43 and the fourth light emitting section 44 are placed on the resist pattern 1003, respectively. The third light-emitting portion 43 is arranged such that a straight line connecting the third anode electrode A3 and the third cathode electrode K3 is parallel to the X-axis. At this time, the third anode electrode A1 is positioned in the positive direction of the X-axis from the third cathode electrode K1. The third light emitting portion 43 is arranged such that the resist pattern 1003 is between the third anode electrode A3 and the third cathode electrode K3. The fourth light emitting section 44 is arranged such that the fourth anode electrode A4 and the fourth cathode electrode K4 are parallel to the X-axis. At this time, the fourth cathode electrode K4 is positioned in the positive direction of the X-axis relative to the fourth anode electrode A4. The fourth light emitting section 44 is arranged such that the resist pattern 1003 is between the fourth cathode electrode K4 and the fourth anode electrode A4.

The first light-emitting portion 41, the second light-emitting portion 42, the third light-emitting portion 43, and the fourth light-emitting portion 44 are adhered onto the resist pattern 1003 with an adhesive or the like when placed on the resist pattern 1003. . Alternatively, the first light emitting unit 41, the second light emitting unit 42, the third light emitting unit 43, and the fourth light emitting unit 44 may be placed directly on the resist pattern 1003 using an adhesive resist.

As shown in FIG. 9B, plating layers 1021a and 1022a are formed on the first surface 11a using the seed layer 1020 shown in FIG. 9A as a seed. The plating layers 1021a and 1022a are separated by the resist pattern 1003 along the Y-axis direction at approximately the center in the X-axis direction. By forming the plating layer 1021a, the first anode electrode A1 and the second cathode electrode are joined to the plating layer 1021a by plating. By forming the plating layer 1022a, the first cathode electrode K1 and the second anode electrode A2 are joined to the plating layer 1022a by plating. On the second surface 11b, plating layers 1033a and 1034a are formed using the seed layer 1030 shown in FIG. 9A as a seed. The plating layers 1033a and 1034a are divided along the Y-axis direction by the resist pattern 1003 at approximately the center in the X-axis direction. By forming the plating layer 1033a, the third anode electrode A3 and the fourth cathode electrode K4 are joined to the plating layer 1033a by plating. By forming the plating layer 1034a, the third cathode electrode K3 and the fourth anode electrode A4 are plated and joined to the plating layer 1034a.

On the first surface 11a, through holes 12a are formed through the plating layer 1021a, the seed layer 1020 and the base material 10a, and through holes 12b are formed through the plating layer 1022a, the seed layer and the base material 10a. On the second surface 11b, through holes 12a are formed through the plating layer 1033a, the seed layer 1030 and the base material 10b, and through holes 12b are formed through the plating layer 1034a, the seed layer 1030 and the base material 10b.

The resist pattern 1003 is removed to expose the seed layer 1020 from the resist pattern 1003, as shown in FIG. 9C. A known technique is used to remove the resist pattern 1003 . For example, the resist pattern 1003 is formed on the first base material 10a with a mixed solution containing sulfuric acid, an organic solvent, etc., together with the plating layer 1020a, the first light emitting unit 41, and the second light emitting unit 42. It is exfoliated by soaking. The same applies to the removal of the resist pattern 1003 formed on the second base material 10b.

As shown in FIG. 9D, seed layer 1020 (exposed portion of seed layer 1020) exposed from resist pattern 1003 by removing resist pattern 1003 shown in FIG. 9A is removed, for example, by etching. A gap G1 is formed by removing the seed layer 1020, and seed layers 1021 and 1022 separated by the gap G1 are formed. The seed layer 1021 and the plating layer 1021a may be collectively referred to as the "first conductor 21". The seed layer 1022 and the plating layer 1022a may be collectively referred to as the "second conductor 22". Similarly, seed layer 1030 exposed on the second surface 11b side is also removed by etching, for example, to form gap G2. Gap G2 is formed by removing seed layer 1030, and seed layers 1033 and 1034 separated by gap G2 are formed. The seed layer 1033 and the plating layer 1033a may be collectively referred to as the "third conductor 33". The seed layer 1034 and the plating layer 1034a may be collectively referred to as the "fourth conductor 34". Thus, a pair of first wirings 20 including a first conductor 21 and a second conductor 22 are formed, and a pair of second wirings 30 including a third conductor 33 and a fourth conductor 34 are formed.

In FIGS. 10A to 10C, to avoid complication of notation, the plating layer and the seed layer are omitted and indicated as the first conductor 21 to the fourth conductor .
As shown in FIG. 10A, the first translucent member 71 is formed to cover the first conductor 21, the second conductor 22, the first light emitting section 41 and the second light emitting section . At this time, the first translucent member 71 is formed so as not to cover the through hole 12a and its periphery. Similarly, for the second surface 11b, the second translucent member 72 is formed so as to cover the third conductor 33, the fourth conductor 34, the third light emitting section 43, and the fourth light emitting section 44. As shown in FIG. At this time, the second translucent member 72 is formed so as not to cover the through hole 12b and its periphery by forming a resist mask or the like. In this example, a first translucent member 71 is provided in the gap G1, and a second translucent member 72 is provided in the gap G2.

As described above, the intermediate member A including the first base material 10a, the pair of first wirings 20, the first light-emitting portion 41, the second light-emitting portion 42, and the first translucent member 71 is formed. Similarly, an intermediate member B including a second base material 10b, a pair of second wirings 30, a third light-emitting portion 43, a fourth light-emitting portion 44, and a second translucent member 72 is formed.

As shown in FIG. 10B, intermediate members A and B are laminated together. When bonding the intermediate members A and B, the surface of the first substrate 10a located opposite to the first surface 11a is opposed to the surface of the second substrate 10b located opposite to the second surface 11b. and then glue these faces together. At this time, the positions of the through holes 12a of the intermediate member A and the positions of the through holes 12b of the intermediate member B are aligned to form the first through holes 12c. Further, by aligning the positions of the through holes 12b of the intermediate member A and the through holes 12a of the intermediate member B, the second through holes 12d are formed. The first through hole 12c and the second through hole 12d penetrate from the first surface 11a to the second surface 11b. In this manner, the manufacturing process can be simplified by manufacturing the intermediate members A and B and bonding them together.

The first connecting member 51 is formed by filling the first through hole 12c with a conductive material. The second connection member 52 is formed by filling the second through hole 12d with a conductive material (see FIGS. 10B and 10C). The first connection member 51 and the second connection member 52 are not limited to being formed by filling the conductive member, but are formed along the inner walls defining the first through hole 12c and the second through hole 12d using a plating technique or the like. It may be formed by forming a layered conductive material.

As shown in FIG. 10C , the first terminal 61 is formed on the intermediate member A side so as to be connected to the end of the first connection member 51 . The second terminal 62 is formed on the intermediate member B side so as to be connected to the end of the second connection member 52 . The first connection member 51 and the first terminal 61 are not limited to being formed separately as described above, and may be formed simultaneously. The second connection member and the second terminal 62 are not limited to being formed separately, and may be formed at the same time.

In the manufacturing method described above, the first base material 10a and the second base material 10b having through holes are used. However, the present invention is not limited to this. The through holes may be formed after forming the intermediate member, or may be formed after bonding the intermediate members.

In the manufacturing method described above, the light-emitting device 1 is formed by forming substantially identical intermediate members A and B and bonding them together. However, the present invention is not limited to this, and each component may be formed on the first surface and the second surface of one base material.

The effect of the light emitting device 1 of this embodiment will be described.
The light-emitting device 1 of this embodiment has a pair of first wirings 20 on the first surface 11a of the substrate 10, and a first light-emitting portion 41 and a second light-emitting portion 42 on the pair of first wirings 20. are provided. The first light emitting section 41 and the second light emitting section 42 are connected in anti-parallel via the first conductor 21 and the second conductor 22 . Further, the light emitting device 1 has a pair of second wirings 30 on the second surface 11b of the base material 10, and has a third light emitting section 43 and a fourth light emitting section 44 on the pair of second wirings 30. there is A pair of first wirings 20 includes a first conductor 21 and a second conductor 22 , and a pair of second wirings 30 includes a third conductor 33 and a fourth conductor 34 . The third light emitting section 43 and the fourth light emitting section 44 are connected in anti-parallel via the third conductor 33 and the fourth conductor 34 .

Thus, in the light-emitting device 1 of the present embodiment, the light-emitting portions connected in inverse parallel are arranged on the first surface 11a and the second surface 11b of the substrate 10, respectively. The two sets of antiparallel-connected circuits are connected in parallel by a first connecting member 51 and a second connecting member 52 . Therefore, regardless of the positive or negative polarity of the voltage applied to the first terminal 61 and the second terminal 62, any one of the antiparallel-connected light-emitting portions arranged on the first surface 11a and the second surface 11b, respectively, One of them emits light, and the light-emitting portions emit light on both sides of the substrate 10 .

In the light-emitting device 1 of this embodiment, the first connection member 51 and the second connection member 52 are formed so as to penetrate the base material 10 . Therefore, the area occupied by the two anti-parallel connection light emitting circuits arranged on both sides of the substrate 10 is reduced, and further miniaturization is achieved.

In the light-emitting device 1 of this embodiment, the first terminal 61 and the second terminal 62 are located on opposite sides. In this case, by sandwiching the light-emitting device 1 between light-transmitting plates having a light-transmitting conductive film, which will be described later in a third embodiment described with reference to FIGS. An electrical connection can be made.

(Second embodiment)
FIG. 11 is a schematic perspective view illustrating the light emitting device according to this embodiment.
FIG. 12 is a schematic front view illustrating the light emitting device according to this embodiment.
FIG. 13 is a schematic side view illustrating the light emitting device according to this embodiment.
FIG. 14A is a schematic plan view illustrating the light emitting device according to this embodiment.
FIG. 14B is a schematic bottom view illustrating the light emitting device according to this embodiment.
As shown in FIGS. 11 to 14B, the light emitting device 201 of this embodiment includes a substrate 210, a pair of first wirings 220, a first light emitting element 40a, a pair of second wirings 230, and a second light emitting device. It includes an element 40b, a first connection member 251, a second connection member 252, first terminals 261-1 and 261-2, and second terminals 262-1 and 262-2. The light emitting device 201 further includes a first translucent member 271 and a second translucent member 272 .

This embodiment may also be described using three-dimensional coordinates as in the case of the above-described first embodiment. The substrate 210 has a first surface 211a and a second surface 211b. The second surface 211b is a surface located on the opposite side of the first surface 211a. It is assumed that the first surface 211a is provided parallel to the XY plane. The X-axis is assumed to be parallel to a straight line connecting the first anode electrode A1 and the first cathode electrode K1 of the first light emitting section 41 . In the case of this embodiment, as described with reference to FIGS. 12 and 13, the base material 210 has a first concave portion 210a on the side of the first surface 211a and a second concave portion on the side of the second surface 211b. 210b. 15A and 15B, the first recess 210a and the second recess 210b are each defined by a plurality of planes. In this case, the top surfaces 212a and 216a and the bottom surface 214a of the first surface 211a are provided parallel to the XY plane.

The Z-axis is perpendicular to the XY plane, and the positive direction is the direction from the second surface 211b toward the first surface 211a. The positive direction of the Z-axis is sometimes called "up" or "upper", and the negative direction of the Z-axis is sometimes called "down" or "downward". However, the direction along the Z-axis is not always the direction in which gravity is applied, as in the other embodiments described above.

As shown in FIGS. 11 and 13, the light-emitting device 201 has the first translucent member 271 arranged on the first surface 211a side of the base material 210 . The surface of the first translucent member 271 opposite to the surface facing the first surface 211a is the light extraction surface S201. Further, in the light emitting device 201, the second translucent member 272 is arranged on the second surface 211b side of the base material 210. As shown in FIG. The surface of the second translucent member 272 opposite to the surface facing the second surface 211b is the light extraction surface S202. Therefore, the light emitting device 201 is a double-sided light emitting device having a light extraction surface S201 and a light extraction surface S202 located on the opposite side of the light extraction surface S201.

In the light emitting device 201 of this embodiment, the first connection member 251 and the second connection member 252 are also arranged on the two side surfaces arranged between the light extraction surfaces S201 and S202, and the first terminal 261-1 , 261-2 and second terminals 262-1, 262-2 can function as two terminals.

As shown in FIGS. 12 and 13, in the light emitting device 201, the substrate 210 has the first recess 210a on the first surface 211a side and the second recess 210b on the second surface 211b side. there is A first translucent member 271 covers the first recess 210a, and a second translucent member 272 covers the second recess 210b.

The base material 210 may be made of a non-translucent material, or may be made of a translucent material. The material described in the first embodiment can be used for the base material 210 . The materials described in the first embodiment can be used for the first translucent member 271 and the second translucent member 272 .

As shown in FIGS. 12 and 14A, the pair of first wirings 220 are arranged on the first surface 211a. A pair of first wirings 220 includes a first conductor 221 and a second conductor 222 . The first conductor 221 and the second conductor 222 are provided on the first surface 211a via the gap G201. The gap G201 is provided along the Y-axis substantially at the center in the X-axis direction on the first surface 211a. A gap G201 separates the pair of first wirings 220 into a first conductor 221 and a second conductor 222 . The length of the gap G201 in the X-axis direction is set slightly shorter than the distance between the anode electrode and the cathode electrode of each of the first light emitting section 41 and the second light emitting section .

As shown in FIGS. 12 and 14B, the pair of second wirings 230 are arranged on the second surface 211b. A pair of second wirings 230 includes a third conductor 233 and a fourth conductor 234 . The third conductor 233 and the fourth conductor 234 are arranged on the second surface 211b via the gap G202. The gap G202 is provided along the Y-axis at approximately the center in the X-axis direction on the second surface 211b. A gap G202 separates the pair of second wirings 230 into a third conductor 233 and a fourth conductor 234 . The length of the gap G<b>202 in the X-axis direction is set according to the distance between the anode electrode and the cathode electrode of each of the third light emitting section 43 and the fourth light emitting section 44 .

The first conductor 221, the second conductor 222, the third conductor 233 and the fourth conductor 234 can be the same conductive material as in the first embodiment.

As shown in FIG. 14A, in the first light emitting section 41, the first anode electrode A1 is connected to the first conductor 221, and the first cathode electrode K1 is connected to the second conductor 222. As shown in FIG. In the second light emitting section 42 , the second anode electrode A2 is connected to the second conductor 222 and the second cathode electrode K2 is connected to the first conductor 221 . The first anode electrode A1 and the second cathode electrode K2 are electrically connected to each other through the first conductor 221 . The first cathode electrode K1 and the second anode electrode A2 are electrically connected to each other through the second conductor 222 . The first light emitting section 41 and the second light emitting section 42 are connected in inverse parallel with each other by a pair of first wirings 220 .

As shown in FIG. 14B, in the third light emitting section 43, the third anode electrode A3 is connected to the third conductor 233, and the third cathode electrode K3 is connected to the third conductor 233. As shown in FIG. In the fourth light emitting section 44 , the fourth anode electrode A4 is connected to the fourth conductor 234 and the fourth cathode electrode K4 is connected to the third conductor 233 . The third anode electrode A3 and the fourth cathode electrode K4 are electrically connected to each other through the third conductor 233. As shown in FIG. The third cathode electrode K3 and the fourth anode electrode A4 are electrically connected to each other through the fourth conductor 234. As shown in FIG. The third light emitting section 43 and the fourth light emitting section 44 are connected in inverse parallel with each other by a pair of second wirings 230 .

The first light-emitting portion 41, the second light-emitting portion 42, the third light-emitting portion 43, and the fourth light-emitting portion 44 have the same configuration as in the above-described first embodiment. Light emitting elements 120, 120a such as those described in connection with FIGS. 6A-6D may be used.

The first light emitting section 41 and the second light emitting section 42 are arranged to face the third light emitting section 43 and the fourth light emitting section 44 with the substrate 210 interposed therebetween. In this example, the first light emitting section 41 is arranged to face the third light emitting section 43 with the base material 210 interposed therebetween, and the second light emitting section 42 faces the fourth light emitting section 44 with the base material 210 interposed therebetween. are placed. As described with reference to FIGS. 5A and 5B, the first light-emitting portion 41 is arranged to face the fourth light-emitting portion 44 with the substrate 210 interposed therebetween, and the second light-emitting portion 42 faces the substrate 210. You may make it arrange|position facing the 3rd light emission part 43 through.

15A is a schematic cross-sectional view taken along line XVA-XVA of FIG. 14A.
15B is a schematic cross-sectional view taken along line XVB-XVB in FIG. 14A.
A relationship between the first surface 211a and the first concave portion 210a will be described.
As shown in FIGS. 15A and 15B, the first surface 211a includes a top surface 212a, an inner surface 213a, a bottom surface 214a, an inner surface 215a and a top surface 216a. The first recess 210a is defined by an upper surface 212a, an inner side surface 213a, a bottom surface 214a, an inner side surface 215a and an upper surface 216a. The two upper surfaces 212a and 216a are planes parallel to the XY plane and are planes within the same plane. In this example, the two top surfaces 212a and 216a are separated in the X-axis direction, and the bottom surface 214a is arranged between the top surface 212a and the top surface 216a in the XY plan view. The bottom surface 214a is a plane parallel to the XY plane. An inner side surface 213a is arranged between the top surface 212a and the bottom surface 214a, and the inner side surface 213a is provided continuously from the top surface 212a to the bottom surface 214a. An inner side surface 215a is arranged between the top surface 216a and the bottom surface 214a, and the inner side surface 215a is provided continuously from the top surface 216a to the bottom surface 214a.

A relationship between the second surface 211b and the second concave portion 210b will be described.
The second surface 211b includes a top surface 212b, an inner surface 213b, a bottom surface 214b, an inner surface 215b and a top surface 216b and a second recess 210b. The second recess 210b is defined by a top surface 212b, an inner side surface 213b, a bottom surface 214b, an inner side surface 215b and a top surface 216b. The two upper surfaces 212b and 216b are planes parallel to the XY plane and are planes within the same plane. In this example, the two top surfaces 212b and 216b are separated in the X-axis direction, and the bottom surface 214b is arranged between the top surface 212b and the top surface 216b in the XY plan view. The bottom surface 214b is a plane parallel to the XY plane. An inner side surface 213b is arranged between the top surface 212b and the bottom surface 214b, and the inner side surface 213b is provided continuously from the top surface 212b to the bottom surface 214b. An inner side surface 215b is arranged between the top surface 216b and the bottom surface 214b, and the inner side surface 215b is provided continuously from the top surface 216b to the bottom surface 214b.

That is, the first concave portion 210a is defined by the inner side surfaces 213a and 215a in the Y-axis direction. The first concave portion 210a does not have an inner side surface in the X-axis direction. The second recess 210b is defined by inner side surfaces 213b and 215b in the Y-axis direction. The second concave portion 210b does not have an inner side surface in the X-axis direction.

As shown in FIG. 15A, on the first surface 211a side, the first conductor 221 is continuously provided over the top surface 212a, the inner side surface 213a, the bottom surface 214a, the inner side surface 215a, and the top surface 216a. In this example, the first conductor 221 also serves as first terminals 261-1 and 261-2. Alternatively, the first terminals 261-1 and 261-2 may be arranged separately on the first conductor 221. FIG. The first conductor 221 formed on the upper surface 212a functions as a first terminal 261-1. The first conductor 221 formed on the top surface 216a functions as a first terminal 261-2. The number of first terminals may be one, or may be plural as in this example.

On the second surface 211b side, the fourth conductor 234 is arranged over substantially the entire bottom surface 214b in the example of FIG. 15A. The fourth conductor 234 is not disposed on the top surfaces 212b, 216b and the inner surfaces 213b, 215b.

As shown in FIG. 15B, on the first surface 211a side, the second conductor 222 is arranged over substantially the entire bottom surface 214a. The second conductors 222 are not disposed on the top surfaces 212a, 216a and the inner side surfaces 213a, 215a.

On the second surface 211b side, the third conductor 233 is arranged over the top surface 212b, the inner surface 213b, the bottom surface 214b, the inner surface 215b and the top surface 216b. In this example, the third conductor 233 also serves as second terminals 262-1 and 262-2. Not limited to this, the second terminals 262-1 and 262-2 may be arranged separately on the third conductor 233. FIG. A third conductor 233 formed on the upper surface 212b functions as a second terminal 262-1. A third conductor 233 formed on the upper surface 216b functions as a second terminal 262-2. The number of second terminals may be one, or may be plural as in this example.

On the first surface 211a side, the first conductor 221 electrically connects the first light emitting portion 41 and the second light emitting portion 42 to the first terminals 261-1 and 261-2. On the second surface 211b side, the third conductor 233 electrically connects the third light emitting portion 43 and the fourth light emitting portion 44 to the second terminals 262-1 and 262-2.

In this example, the light emitting device 201 is provided with a substrate 210 having recesses on both the first surface 211a side and the second surface 211b side. The length of the first concave portion 210a in the Z-axis direction, that is, the depth, is the length in the Z-axis direction when the first light-emitting portion 41 and the second light-emitting portion 42 are placed on the pair of first wirings 220, that is, It is set to be deeper than the mounting height. Similarly, on the second surface 211b side, the depth of the second concave portion 210b is set to be deeper than the mounting height of the third light emitting portion 43 and the fourth light emitting portion 44. As shown in FIG. By arranging the light-emitting portion so as to be housed in the recess, it is possible to reduce the length of the light-emitting device 201 itself in the Z-axis direction, that is, the thickness. Note that the light emitting device 201 may have a concave portion on one of the first surface 211a side and the second surface 211b side, or may not have a concave portion on both the first surface 211a side and the second surface 211b side. good too.

A configuration relating to electrical connection between the first conductor 221 and the fourth conductor 234 will be described.
FIG. 16A is a schematic cross-sectional view for explaining the operation of the light emitting device according to this embodiment, and is a cross-sectional view taken along line XVIA-XVIA in FIG. 14A.
FIG. 16B is a schematic cross-sectional view for explaining the operation of the light-emitting device according to this embodiment, and is a cross-sectional view taken along line XVIB-XVIB in FIG. 14A.
As shown in FIG. 12, the side surface 218a is parallel to the gap G201 among the four side surfaces between the first surface 211a and the second surface 211b of the base material 210, and extends toward the first conductor 221 and the fourth conductor 234 side. It is the surface on which it is located. The side surface 218b is a surface located on the opposite side of the side surface 218a, and is a surface located on the second conductor 222 and the third conductor 233 side.

As shown in FIGS. 12 and 16A, the first connecting member 251 is arranged over the entire side surface 218a of the base material 210. As shown in FIGS. The first connecting member 251 is connected to the first conductor 221 and the fourth conductor 234 . The first terminals 261-1 and 261-2 also serve as the first conductor 221 and are electrically connected to the first conductor 221, as described with reference to FIG. 15A. Therefore, the first terminals 261-1, 261-2 are electrically connected to the first conductor 221 and the fourth conductor 234. FIG.

As shown in FIGS. 12 and 16B, the second connection member 252 is arranged over the entire side surface 218b of the base material 210. As shown in FIG. The second connection member 252 is connected to the second conductor 222 and the third conductor 233 . The second terminals 262-1 and 262-2 also serve as the third conductor 233 and are electrically connected to the third conductor 233, as described with reference to FIG. 15B. Second terminals 262 - 1 and 262 - 2 are thus electrically connected to second conductor 222 and third conductor 233 .

Therefore, the first terminals 261-1 and 261-2 are electrically connected to the first anode electrode A1, the second cathode electrode K2, the third cathode electrode K3 and the fourth anode electrode A4. The second terminals 262-1, 262-2 are electrically connected to the first cathode electrode K1, the second anode electrode A2, the third anode electrode A3 and the fourth cathode electrode K4.

In this example, flexible conductive films 281-1 and 281-2 are arranged on the first terminals 261-1 and 261-2, respectively. Flexible conductive films 282-1 and 282-2 are arranged on the second terminals 262-1 and 262-2, respectively. Examples of materials for the flexible conductive film include conductive resins. A conductive resin is a resin containing metal particles.
In addition, the flexible conductive film can be arranged on the first terminal 61 and the second terminal 62 of the light emitting device 1 .

Current paths when the light-emitting device 201 of this embodiment operates will be described with reference to FIGS. 16A and 16B.
As shown in FIGS. 16A and 16B, in this example, a higher voltage is applied to the first terminals 261-1 and 261-2 than the voltage applied to the second terminals 262-1 and 262-2. A power source I0 is connected. The power source I0 causes current to flow into the first terminals 261-1 and 261-2 and current to flow out of the second terminals 262-1 and 262-2.

As indicated by the arrow in FIG. 16A, the current flowing from the first terminal 261-1 flows through the first conductor 221 and reaches the first anode electrode A1 of the first light emitting section 41. As shown in FIG. Current flows into the first anode electrode A1 and out of the first cathode electrode K1. The current flowing out from the first cathode electrode K1 flows through the second conductor 222 and reaches the second terminal 262-1 via the second connection member 252 and the fourth conductor 234. In this way, on the side of the first surface 211a of the substrate 210, current flows through the first light emitting section 41 and the first light emitting section 41 emits light. Since no current flows into the second cathode electrode K2 of the second light emitting section 42, the second light emitting section 42 does not emit light.

As indicated by the arrow in FIG. 16B, the current flowing from the first terminal 261-1 branches to the first connection member 251, flows through the fourth conductor 234, and reaches the fourth anode electrode A4 of the fourth light emitting section 44. . Current flows into the fourth anode electrode A4 and out of the fourth cathode electrode K4. The current flowing out from the fourth cathode electrode flows through the third conductor 233 and flows out from the second terminal 262-1. In this way, on the second surface 211b side of the base material 210, current flows through the fourth light emitting section 44, and the fourth light emitting section 44 emits light. Since current does not flow into the third cathode electrode K2 of the third light emitting section 43, the third light emitting section 43 does not emit light.

Even if the polarity of the power supply I0 connected to the first terminals 261-1, 261-2 and the second terminals 262-1, 262-2 is changed, the light emitting device 201 is The fact that the light emitting parts emit light from both sides is the same as in the case of the first embodiment.

A method for manufacturing the light emitting device 201 of this embodiment will be described.
17A to 18A are schematic perspective views illustrating the method for manufacturing the light emitting device according to this embodiment.
18B is a schematic cross-sectional view of section XVIIIB in FIG. 18A.
FIG. 19A is a schematic perspective view illustrating the method for manufacturing the light emitting device according to this embodiment.
19B is a schematic cross-sectional view of the XIXB portion of FIG. 19A.
FIG. 20A is a schematic perspective view illustrating the method for manufacturing the light emitting device according to this embodiment.
FIG. 20B is a schematic perspective view illustrating the method for manufacturing the light emitting device according to this embodiment.
21A and 21B are schematic perspective views illustrating the method for manufacturing the light emitting device according to this embodiment.
As shown in Figure 17A, a substrate 1210 is provided. The substrate 1210 has a surface 1211a and a surface 1211b located opposite to the surface 1211a. The surfaces 1211a and 1211b are surfaces parallel to the XY plane. The substrate 1210 has a concave portion 1210a on the side of the surface 1211a, and similarly has a concave portion on the side of the surface 1211b. The concave portion 1210a is provided in a groove shape along the X-axis direction, and a plurality of concave portions 1210a are formed parallel to the Y-axis direction. The concave portion on the surface 1211b side is also provided in a groove shape along the X-axis direction, and a plurality of concave portions are formed parallel to the Y-axis direction. The recess on the surface 1211b side is formed so that the outer peripheries of the recess 1210a and the recess 1210a substantially overlap each other in the XY plan view. The length in the Z-axis direction, ie, the depth of the recess on the side of the recess 1210a and the surface 1211b, is set based on the length in the Z-axis direction of the light emitting portion. For example, the depth of the recess on the side of recess 1210a and surface 1211b is such that when the light emitting unit is placed in the recess on the side of recess 1210a and surface 1211b, the light emitting unit is sufficiently embedded in the recess on the side of recess 1210a and surface 1211b. is set to be

A well-known processing technique is used to form the concave portion 1210a and the concave portion on the side of the surface 1211b. For example, the recesses 1210a and the recesses on the surface 1211b side may be formed by cutting the substrate with a laser processing machine or the like, or the recesses 1210a and the recesses on the surface 1211b side may be formed by etching using a mask.

As shown in FIG. 17B, the substrate 1210 is severed using a blade BLD. One blade BLD is arranged along the Y-axis direction, and the base material 1210 is divided in the X-axis direction at approximately equal intervals.

As shown in FIG. 17C, blocks 2210 are formed that are separated by the blade BLD. A block 2210 is a member that continuously includes a plurality of substrates 210 shown in FIG. 11 and the like in the Y-axis direction. The divided surfaces of the block 2210 are side surfaces 2218a and 2218b of the block 2210 . The side surface 2218b is a surface located on the opposite side of the side surface 2218a.

As shown in Figures 18A and 18B, the segmented block 2210 shown in Figure 17C has a first side 211a and a second side 211b. The first surface 211a includes a top surface 1212a, an inner surface 213a, a bottom surface 214a, an inner surface 215a and a top surface 1216a. The second surface 211b includes a top surface 1212b, an inner surface 213b, a bottom surface 214b, an inner surface 215b and a top surface 1216b.

As shown in FIG. 18A, block 2210a is covered with a conductive layer. Specifically, a first conductive layer 1220a entirely on the first surface 211a, a second conductive layer 1220b entirely on the second surface 211b, a third conductive layer 1220c entirely on the side surface 2218a, and an entire surface on the side surface 2218b. A fourth conductive layer 1220d is formed on the . The first conductive layer 1220a, the second conductive layer 1220b, the third conductive layer 1220c, and the fourth conductive layer 1220d may be formed at the same time, for example, on the first surface 211a, the second surface 211b, and the side surface 2218a. and side surfaces 2218b, respectively. A sputtering technique, for example, is used to form the first conductive layer 1220a, the second conductive layer 1220b, the third conductive layer 1220c, and the fourth conductive layer 1220d.

As shown in FIG. 18B, the block 2210a has a first recess 210a on the side of the first surface 211a and a second recess 210b on the side of the second surface 211b. The first recess 210a is defined by an inner side surface 213a, a bottom surface 214a and an inner side surface 215a. The second recess 210b is defined by an inner side surface 213b, a bottom surface 214b and an inner side surface 215b.

Block 2210b is formed by forming gaps G201 and G202, as shown in FIGS. 19A and 19B. Gap G201 is formed on the first surface 211a side. Gap G202 is formed on the second surface 211b side. The gap G201 is formed by inserting the blade BLD on the first surface 211a side so as to extend along the Y-axis direction about the center of the block 2210b in the X-axis direction. The gap G202 is formed by inserting the blade BLD on the second surface 211b side so as to extend along the Y-axis direction about the center of the block 2210b in the X-axis direction.

The blade BLD cuts a portion of the base material of the block 2210b and the conductive layer 1220a on the first surface 211 side to form separated first conductors 1221a and second conductors 1222a. The blade BLD divides the conductive layer 1220b on the second surface 211b side to form separated third conductors 1221b and fourth conductors 1222b. Since the third conductive layer 1220c is formed on the side surface 2218a, the first conductor 1221a and the fourth conductor 1222b are electrically connected via the third conductive layer 1220c. Since the fourth conductive layer 1220d is formed on the side surface 2218b, the second conductor 1222a and the third conductor 1221b are electrically connected via the fourth conductive layer 1220d. In addition to the above, the conductive layer may be cut so that part of the base material is not cut. The base material and the conductive layer may be cut by laser irradiation or etching instead of cutting by the blade.

After that, the block 2210b is divided along the X-axis direction at approximately the center of the Y-axis direction of the upper surface 1212a, and is divided along the X-axis direction approximately at the center of the Y-axis direction of the upper surface 1216a. When the block 2210b is cut, the base material 210 is cut, and the first conductor 1221a, the second conductor 1222a, the third conductor 1221b, the fourth conductor 1222b, the third conductive layer 1220c, and the fourth conductive layer 1220d are the same as the base material 210. separated by position.

As shown in FIGS. 20A and 20B, the first conductor 221 is formed by dividing the first conductor 1221a along the X-axis direction. The second conductor 222 is formed by dividing the second conductor 1222a along the X-axis direction, and removing part of the divided second conductor 1222a to form the second conductor 222 . The portions removed are portions of the conductors on the top surfaces 212a, 216a and portions of the conductors on the inner surfaces 213a, 215a. The second conductor 222 is the portion of the conductor left on the bottom surface 214a.

The third conductor 233 is formed by dividing the third conductor 1221b along the X-axis direction. As for the fourth conductor 234, the fourth conductor 1222b is divided along the X-axis, and a part of the divided fourth conductor 1222b is removed to form the fourth conductor 234. FIG. The removed portions are portions of the conductors on the top surfaces 212b, 216b and portions of the conductors on the inner surfaces 213b, 215b. The fourth conductor 234 is the portion of the conductor left on the bottom surface 214b.

The third conductive layer 1220c is divided into the first connecting member 251 by the dividing step of the block 2210b. The fourth conductive layer 1220d is divided into the second connecting members 252 by the dividing step of the block 2210b.

On the side of the first surface 211a, the first conductors 221 on the upper surfaces 212a and 216a are left as they are, and are used as first terminals 261-1 and 261-2 connected to the fourth conductor 234 and the first connection member 251. be. On the side of the second surface 211b, the third conductors 233 on the top surfaces 212b and 216b are left as they are and are used as second terminals 262-1 and 262-2 connected to the second conductor 222 and the second connection member 252. be.

In order to remove a part of the divided second conductor 1222a to form the second conductor 222 and to remove a part of the divided fourth conductor 1222b to form the fourth conductor 234, for example, laser processing is performed. machine is used. An appropriate laser wavelength is selected according to the metal materials forming the second conductor 222 and the fourth conductor 234 .

As shown in FIG. 21A, on the first surface 211a side, the first light emitting section 41 and the second light emitting section 42 are placed in the first concave portion 210a. The first light-emitting portion 41 and the second light-emitting portion 42 are respectively placed from the first conductor 221 to the second conductor 222 . One electrode of the first light emitting unit 41 and the second light emitting unit 42 is connected to the first conductor 221, and the other electrode of the first light emitting unit 41 and the second light emitting unit 42 is connected to the second conductor 222. .

On the second surface 211b side, the third light emitting section 43 and the fourth light emitting section 44 are placed in the second concave portion 210b. The third light-emitting portion 43 and the fourth light-emitting portion 44 are placed from the third conductor 233 to the fourth conductor 234, respectively. One electrode of the third light emitting portion 43 and the fourth light emitting portion 44 is connected to the third conductor 233, and the other electrode of the third light emitting portion 43 and the fourth light emitting portion 44 is connected to the fourth conductor 234. .

As shown in FIG. 21B, the first translucent member 271 is arranged so as to cover the first light emitting section 41 and the second light emitting section 42 . The first translucent member 271 is arranged to cover the inner side surface 213a, the bottom surface 214a, and the inner side surface 215a shown in FIG. 15A in addition to the first light emitting portion 41 and the second light emitting portion . The second translucent member 272 is arranged to cover the third light emitting section 43 and the fourth light emitting section 44 . The second translucent member 272 is arranged to cover the inner side surface 213b, the bottom surface 214b, and the inner side surface 215b shown in FIG. 15A in addition to the third light emitting section 43 and the fourth light emitting section 44.

Thus, the light emitting device 201 of this embodiment is manufactured.

The effects of the light emitting device 201 of this embodiment will be described.
The light-emitting device 201 of this embodiment has the same effect as the light-emitting device 1 of the above-described other embodiments.

In addition to the same effects as in the case of the first embodiment, the following effects are obtained.
In the light emitting device 201 of this embodiment, the first connecting member 251 and the second connecting member 252 are arranged on the two side surfaces 218a and 218b of the base material 210 of the light emitting device 201, respectively. Therefore, it becomes possible to connect to a wiring member from an external power source at a position orthogonal to the light extraction surface. That is, by sandwiching the light-emitting device 201 between two wiring members connected to an external power source through the first connection member 251 and the second connection member 252, light is extracted toward the region sandwiched between the two wiring members. be able to. Therefore, in the light-emitting device 201, the degree of freedom of arrangement and mounting is improved when the device is incorporated. Note that when the first connection member 251 and the second connection member 252 are used as terminals, the first terminal and the second terminal do not have to be arranged. By not arranging the first terminal and the second terminal, the process of forming the terminals described in connection with FIGS. 20A and 20B can be simplified.

(Third embodiment)
In each of the following embodiments, a light-emitting module in which the above-described light-emitting devices 1 and 201 are arranged will be described.
FIG. 22A is a schematic front view illustrating the light emitting module according to this embodiment.
FIG. 22B is a schematic plan view illustrating the light emitting module according to this embodiment.
As shown in FIGS. 22A and 22B, a light emitting module 301 of this embodiment includes a light emitting device 1, a first translucent plate 310, and a second translucent plate 320. FIG.

The first translucent plate 310 includes a translucent substrate 311 and a first translucent conductive layer 312 . The first translucent conductive layer 312 is arranged on one surface 311 a of the translucent base material 311 . The second translucent plate 320 includes a translucent substrate 321 and a second translucent conductive layer 322 . The second translucent conductive layer 322 is arranged on one surface 321 a of the translucent base material 321 .

A light-emitting module 301 of this embodiment includes the light-emitting device 1 of the first embodiment. In the following description, three-dimensional coordinates different from the three-dimensional coordinates in the case of the light emitting device 1 of the first embodiment are used. In the three-dimensional coordinates of this embodiment, one surface 311a of the first translucent base material 311 is a plane parallel to the XY plane. Since the second translucent plate 320 has a surface 321a parallel to the surface 311a of the first translucent substrate 311, the surface 321a is also parallel to the XY plane. In this example, a plurality of light emitting devices 1 are arranged. The plurality of light emitting devices 1 are arranged on the XY plane along the X-axis direction and arranged along the Y-axis direction. The Z-axis is perpendicular to the XY plane, and the direction from the surface 321a of the second translucent substrate 321 to the surface 311a of the first translucent substrate 311 is positive. Even if the positive and negative directions of the Z-axis are referred to as "up" or "down", the direction along the Z-axis is not limited to the direction of gravity, as in the other embodiments described above. .

The first translucent conductive layer 312 disposed on the first translucent plate 310 faces the second translucent conductive layer 322 disposed on the second translucent plate 320 . The light emitting device 1 is arranged between the first translucent plate 310 and the second translucent plate 320 .

More specifically, the first translucent conductive layer 312 is arranged to face one of the light extraction surfaces S<b>1 and S<b>2 of the light emitting device 1 . When the first translucent conductive layer 312 faces the light extraction surface S1, the first translucent conductive layer 312 is electrically connected to the first terminal 61 on the light extraction surface S1 side. The second translucent conductive layer 322 is arranged to face the light extraction surface S2 and is electrically connected to the second terminal 62 on the light extraction surface S2 side.

When the first translucent conductive layer 312 faces the light extraction surface S2, the first translucent conductive layer 312 is connected to the second terminal 62 on the light extraction surface S2 side. The second translucent conductive layer 322 is arranged to face the light extraction surface S1 and is connected to the first terminal 61 on the light extraction surface S1 side. In the example of FIG. 22A, the light emitting device 1 located on the most negative side of the X axis has the light extraction surface S1 facing the first translucent conductive layer 312, and the first terminal 61 and the first translucent conductive layer 312 connects. In the light emitting device 1 adjacent to this light emitting device 1, the light extraction surface S2 faces the first translucent conductive layer 312, and the second terminal and the first translucent conductive layer 312 are connected.

The light emitting device 1 can have a flexible conductive film on the first terminal 61 and the second terminal 62 as described above. By having the flexible conductive film, the electrical connection between the light emitting device 1 and the first translucent plate and the second translucent plate 320 becomes better. More specifically, the light emitting device 1 may be sandwiched in an inclined state with respect to the first translucent plate 310 and the second translucent plate 320, or the first translucent plate 310 and the second translucent plate may be sandwiched. Even if the plate 320 is warped, the contact area between the light-emitting device 1 and the first translucent plate 310 and the second translucent plate 320 is increased by arranging the flexible conductive film, so that reliable An electrical connection can be made.

In the light-emitting module 301, the light-emitting device 1 may be electrically connected to the first translucent plate 310 and the second translucent plate 320 in a state of being adhered via a conductive adhesive, or Electrical connection may be made by direct contact without using an adhesive. The same applies to light emitting modules 401 and 501, which will be described later.

When a plurality of light-emitting devices 1 are arranged, as described above, the light-emitting device 1 connected to the first terminal 61 and the light-emitting device 1 connected to the second terminal 62 are connected to the first translucent conductive layer 312. may exist. However, the present invention is not limited to this, and the first translucent conductive layer may be connected to the first terminals 61 of all the light emitting devices 1, or may be connected to the second terminals 62 of all the light emitting devices 1. .

In the example of FIG. 22, the first translucent conductive layer 312 is arranged on the entire surface of the first translucent substrate 311 on the second translucent plate 320 side. Accordingly, no matter where the light emitting device 1 is arranged on the surface of the first light transmitting substrate 311 on the side of the second light transmitting plate 320 , electricity between the light emitting device 1 and the first light transmitting plate 310 is maintained. connection can be ensured. In addition, since a pattern for arranging the light emitting device on the first translucent conductive layer 312 is not required, the process of forming the first translucent conductive layer 312 on the first translucent plate 310 can be simplified. can be done. The same applies to the second translucent conductive layer 322 as well.

As shown in the example of FIG. 22A, multiple light emitting devices 1 can be connected to one first translucent conductive layer 312 . Also, a plurality of light emitting devices 1 can be connected to one second translucent conductive layer 322 . Thereby, a current can be supplied from the translucent conductive layer to the plurality of light emitting devices 1, and the plurality of light emitting devices 1 can be lit at the same time. The same applies to fourth, fifth, and sixth embodiments to be described later.

The translucent base materials 311 and 321 are plate-like members having surfaces parallel to the XY plane on both sides, and are made of glass or resin, for example. The first translucent conductive layer 312 and the second translucent conductive layer 322 are, for example, ITO or ZnO.

The light emitting module 301 may include one light emitting device 1 or may include a plurality of light emitting devices 1 . The light-emitting module 301 can be a planar light source by including a plurality of light-emitting devices. The plurality of light emitting devices 1 are arranged at equal intervals in the X-axis direction and the Y direction as shown in the example of FIG. 22B. When a plurality of light emitting devices 1 are arranged, all the light emitting devices 1 are not necessarily arranged regularly as shown in FIG. 22B, and may be arranged irregularly.

The effect of the light emitting module 301 of this embodiment will be described.
A light-emitting module 301 of this embodiment includes the light-emitting device 1 . Even when a voltage higher than the voltage applied to the second terminal 62 is applied to the first terminal 61, the light-emitting device 1 is applied with a voltage lower than the voltage applied to the second terminal 62. Even if it is, both sides emit light. Therefore, in the light-emitting module 301, the light-emitting device 1 can be mounted without considering the polarity of the wiring connected to the first terminal 61 and the second terminal 62. FIG. Moreover, since it is not necessary to consider the polarities of the first terminal 61 and the second terminal 62 of the light emitting device 1, it is possible to simplify the manufacturing of the light emitting module 301 and improve the productivity.

In the light-emitting device 1 of the light-emitting module 301 of this embodiment, the first terminal 61 and the second terminal 62 are located on one light extraction surface S1 and the opposite light extraction surface S2, respectively. By sandwiching two translucent plates 310 and 320 having a translucent conductive layer from the light extraction surface S1 side and the light extraction surface S2 side of the light emitting device 1, the light emitting device 1 is connected to the wiring member from the external power supply. is completed. In this respect as well, the manufacturing of the light emitting module 301 can be simplified, and the productivity can be improved.

(Fourth embodiment)
FIG. 23A is a schematic front view illustrating the light emitting module according to this embodiment.
FIG. 23B is a schematic plan view illustrating the light emitting module according to this embodiment.
The light emitting device 201 of the second embodiment can be applied to the light emitting module 401 by replacing the light emitting device 1 in the light emitting module 301 of the third embodiment. The same components may be denoted by the same reference numerals, and detailed description thereof may be omitted.
As shown in FIGS. 23A and 23B, the light-emitting module 401 of this embodiment includes a light-emitting device 201, a first translucent plate 310, and a second translucent plate 320. FIG. The first translucent plate 310 and the second translucent plate 320 are the same as in the third embodiment. Detailed description may be omitted.
In the case of this embodiment, the same three-dimensional coordinates as in the case of the third embodiment will be used for explanation.

A light emitting device 201 is the light emitting device described in the second embodiment. The light emitting device 201 has light extraction surfaces S201 and S202. The light extraction surface S202 is a surface located on the opposite side of the light extraction surface S201. The light emitting device 201 has first terminals 261-1 and 261-2 on the light extraction surface S201 side, and second terminals 262-1 and 262-2 on the light extraction surface S202 side. Flexible conductive films 281-281-2 are arranged on the first terminals 261-1 and 261-2, respectively, and flexible conductive films 282-2 are arranged on the second terminals 262-1 and 262-2. 1 and 282-2 are arranged respectively. In the following description, the flexible conductive film located on the light extraction surface S201 side is denoted by 281 in order to avoid complication of illustration and notation, and the flexible conductive film located on the light extraction surface S202 side The code shall be written as 282.

The first translucent conductive layer 312 is arranged to face one of the light extraction surfaces S201 and S202 of the light emitting device 201 . When the first translucent conductive layer 312 faces the light extraction surface S<b>201 , the first translucent conductive layer 312 is electrically connected to the flexible conductive film 281 on the first terminal 261 . The second translucent conductive layer 322 is electrically connected to the flexible conductive film 282 on the second terminal 262 .

When the first translucent conductive layer 312 faces the light extraction surface S<b>202 , the first translucent conductive layer 312 is electrically connected to the flexible conductive film 282 on the second terminal 262 . The second translucent conductive layer 322 is electrically connected to the flexible conductive film 281 on the first terminal 261 .

The light emitting module 401 may include one light emitting device 201 or may include a plurality of light emitting devices 201, as in the case of the third embodiment. As in the case of the third embodiment, when a plurality of light emitting devices 201 are provided, the facing relationship between the light extraction surface and the translucent conductive layer may be changed for each light emitting device 201 .

The effect of the light emitting module 401 of this embodiment will be described.
The light-emitting module 401 of this embodiment has the same effects as the light-emitting module 301 of the third embodiment, and also has the following effects.
A light-emitting module 401 of this embodiment includes a light-emitting device 201 . The light emitting device 201 has a first concave portion 210a on the first surface 211a side of the substrate 210 and a second concave portion 210b on the second surface 211b side. The first light emitting element 40a including the light emitting section 41 and the light emitting section 42 is arranged in the first recess 210a, and the second light emitting element 40b including the light emitting section 43 and the light emitting section 44 is arranged in the second recess 210b. . Therefore, the light-emitting device 201 can be made thinner, and the gap created by the light-emitting device 201 when arranged between the two translucent plates can also be made thinner. Therefore, the light emitting module 401 can be made thinner.

(Fifth embodiment)
FIG. 24A is a schematic front view illustrating the light emitting module according to this embodiment.
FIG. 24B is a schematic plan view illustrating the light emitting module according to this embodiment.
In the light emitting module 501 of this embodiment, the arrangement of the light emitting devices 201 is different from that of the fourth embodiment. The same components may be denoted by the same reference numerals, and detailed description thereof may be omitted.
As shown in FIGS. 24A and 24B, the light-emitting module 501 of this embodiment includes a light-emitting device 201, a first translucent plate 310, and a second translucent plate 320. FIG. The light emitting device 201, the first translucent plate 310 and the second translucent plate 320 are the same as in the fourth embodiment.

In the light-emitting module 501 of this embodiment, the light-emitting device 201 includes a first connection member 251 and a second connection member 252, and the first connection member 251 is connected to the first side surface of the base material 210 constituting the light-emitting device 201. 218a, the second connecting member 252 is located on the second side 218b opposite the first side 218a. The light emitting device 201 is electrically connected to the first translucent conductive layer 312 and the second translucent conductive layer 322 via the first connecting member 251 and the second connecting member 252 .

More specifically, the first translucent conductive layer 312 is arranged to face the first connection member 251 or the second connection member 252 . When the first translucent conductive layer 312 faces the first connection member 251 , the first translucent conductive layer 312 is electrically connected to the first connection member 251 . The second translucent conductive layer 322 is electrically connected to the second connection member 252 . When the first translucent conductive layer 312 faces the second connection member 252 , the first translucent conductive layer 312 is electrically connected to the second translucent conductive layer 322 . When the first translucent conductive layer 312 faces the second connecting member 252 , the first translucent conductive layer 312 is electrically connected to the second connecting member 252 . The second translucent conductive layer 322 is electrically connected to the first connection member 251 .

In the light emitting module 501 of this embodiment, the light emitting device 201 is arranged such that the light extraction surfaces S201 and S202 are orthogonal to or cross the XY plane.

The light-emitting module 501 may include one light-emitting device 201 or a plurality of light-emitting devices 201, as in the third and fourth embodiments. In the case where the light-emitting module 501 includes a plurality of light-emitting devices 201, the opposing relationship between the connection member and the translucent conductive layer may be changed for each light-emitting device 201, as in the third embodiment and the fourth embodiment. It is the same as in the case of the embodiment.

The effect of the light emitting module 501 of this embodiment will be described.
The light emitting module 501 of this embodiment has the same effects as the light emitting module 301 of the third embodiment. In addition, the light-emitting module 501 of this embodiment has the following effects. That is, in the light emitting module 501, the two light extraction surfaces S201 and S202 of the light emitting device 201 are not parallel to the XY plane, but are arranged perpendicular to or at an angle to the XY plane. Since the XY plane is parallel to one surface 311a of the translucent substrate 311 of the first translucent plate 310 and one surface 321a of the translucent substrate 321 of the second translucent plate 320, The light emitting device 201 emits light with the highest luminance in the direction along the X axis. Therefore, it is possible to ensure the amount of light in the peripheral portion of the light-emitting module 501 where light is difficult to reach. Therefore, when the light emitting module 501 is seen as a whole, the light emitting module 501 having a more uniform amount of light can be realized.

(Sixth embodiment)
FIG. 25 is a schematic front view illustrating the light emitting module according to this embodiment.
As shown in FIG. 25 , a light emitting module 601 of this embodiment includes a light emitting device 201 , a first translucent plate 310 , a support member 610 and an optical member 620 . Although FIG. 25 shows a light emitting module 501 having one light emitting device 201, the number of light emitting devices 201 is not limited to one, and a plurality of light emitting devices may be provided.
The light-emitting device 201 of this embodiment is the light-emitting device of the second embodiment, and the first light-transmitting plate (third light-transmitting plate) 310 is the light-emitting device of the third to fifth embodiments. It is a first translucent plate and includes a translucent substrate 311 having a first translucent conductive layer (third translucent conductive layer) 312 disposed on one surface thereof. The same components may be denoted by the same reference numerals, and detailed description thereof may be omitted.

In the three-dimensional coordinates of this embodiment, one surface 611a of the support member 610 is parallel to the XY plane. The X and Y axes can be in any direction. In this example, the light emitting device 201 and the optical member 620 are arranged along the X-axis direction. The direction and positive/negative of the Z-axis are the same as in the third embodiment.

The first translucent plate 310 is arranged to face the support member 610 .

The support member 610 is a plate-like member having a surface 611a, and supports the light emitting device 201 and the optical member 620 thereon. A conductive layer (portion having conductivity) 612 is arranged on one surface 611 a of the support member 610 . The conductive layer 612 has an area in the XY plan view that is large enough to mount and connect the connection member of the light emitting device 201 . The supporting member 610 and the conductive layer 612 may or may not be translucent.

The optical member 620 is arranged on the surface 611 a of the support member 610 . The optical member 620 is placed on the surface 611 a and arranged in the optical path of the light emitted from the light emitting device 201 . In this example, the optical member 620 is a reflector having an inclined surface 621 at an angle θ from the surface 611a. The angle θ is set according to the direction in which the light incident on the optical member 620 is reflected. All of the light incident on the inclined surface 621 may be reflected by the inclined surface 621, or part of the light may be reflected and the other light may be transmitted. The inclined surface 621 may be a flat surface, or may be a surface having a convex surface or a concave surface. Further, depending on the application of the light emitting module 601, another optical member such as a prism or a filter may be used in order to efficiently extract light from the light emitting device.

The light emitting device 201 is arranged between the first translucent plate 310 and the support member 610 . The light emitting device 201 is arranged such that the first connection member 251 or the second connection member 252 faces the conductive layer 612 . In this example, the light emitting device 201 has the second connection member 252 facing the conductive layer 612 and the second connection member 252 is connected to the conductive layer 612 . In the light emitting device 201 , the first connection member 251 is arranged to face the first translucent conductive layer 312 , and the first connection member 251 is connected to the first translucent conductive layer 312 . The first connection member 251 is arranged to face the conductive layer 612 and is connected to the conductive layer 612 . The second connection member 252 may be arranged to face the first translucent conductive layer 312 and may be connected to the first translucent conductive layer 312 . Note that one light emitting device 201 is arranged in this example. However, it is not limited to this, and a plurality of them may be arranged.

The optical member 620 is arranged between the first translucent plate 310 and the support member 610 . In this example, the optical member 620 is arranged such that the inclined surface 621 faces the light extraction surface of the light emitting device 201 . In this example, light emitting device 201 and optical member 620 are arranged such that light extraction surface S202 faces inclined surface 621 . The light emitting device 201 may be arranged such that the light extraction surface S<b>201 faces the inclined surface 621 .

In the light-emitting module 601, the light-emitting device 201 is electrically connected to the first light-transmitting plate (third light-transmitting plate) 310 and the conductive layer 612 of the supporting member 610 while being adhered to each other via a conductive adhesive. Alternatively, they may be electrically connected by direct contact without using a conductive adhesive.

The operation of the light emitting module 601 of this embodiment will be described.
In the light-emitting module 601 of this embodiment, the optical paths of the light emitted from both the light extraction surfaces S201 and S202 can be made different. In this example, light from the light extraction surface S201 is emitted along the gap between the first translucent plate 310 and the support member 610, as indicated by the thick straight arrow in FIG. Light from the other light extraction surface S202 is reflected by the inclined surface 621 of the optical member 620 and emitted through the first translucent plate 310, as indicated by the thick curved arrow in FIG.

The effect of the light emitting module 601 of this embodiment will be described.
The light-emitting module 601 of this embodiment includes the light-emitting device 201 . The light emitting device 201 has a first connection member 251 on one side surface and a second connection member 252 on the other side surface. Light-emitting device 201 is sandwiched between third translucent plate 310 and supporting member 610, and is connected to wiring members (third translucent plate 310 and It is electrically connected to the support member 610). Accordingly, the light from the light emitting device 1 is mainly emitted in a direction parallel to the surface 611a of the support member 610. As shown in FIG. The optical member can change the optical path of the light from one light extraction surface of the light emitting device 201, or process the emitted light, so that various optical presentations are possible. .

According to the embodiments described above, it is possible to realize a light-emitting device that does not require terminal identification and is easy to mount, a light-emitting module using the light-emitting device, and a method for manufacturing the light-emitting device.

Although several embodiments of the invention have been described above, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included within the scope and spirit of the invention, and are included within the scope of the invention described in the claims and equivalents thereof. Moreover, each of the above-described embodiments can be implemented in combination with each other.

DESCRIPTION OF SYMBOLS 1, 201... Light-emitting device 10, 210... Base material 10a... First base material 10b... Second base material 12a... First through-hole 12b... Second through-hole 20, 220... Pair of first Wiring 21, 221... First conductor 22, 222... Second conductor 30, 230... Pair of second wires 33, 233... Third conductor 34, 234... Fourth conductor 41... First light emitting part , 42... second light emitting part 43... third light emitting part 44... fourth light emitting part 51, 251... first connection member 52, 252... second connection member 61, 261-1, 261-2... First terminal 62, 262-1, 262-2 Second terminal 71, 271 First translucent member 72, 272 Second translucent member 120, 120a Light emitting element 281, 281 -1, 281-2, 282, 282-1, 282-2... flexible conductive film, 210a... first concave portion, 210b... second concave portion, 218a... first side surface, 218b... second side surface, 1002... resist Layer 1003 Resist pattern 1020, 1030 Seed layer 1220 Conductive layer S1, S2, 41S, 42S, 43S, 44S, S201, S202 Light extraction surface G1, G2, G201, G202 Gap

Claims (19)

a substrate having a first side and a second side opposite the first side;
a pair of first wirings arranged on the first surface;
a first light emitting unit and a second light emitting unit arranged on the pair of first wirings;
a pair of second wirings arranged on the second surface;
a third light emitting unit and a fourth light emitting unit arranged on the pair of second wirings;
a first connecting member electrically connecting one of the pair of first wirings and one of the pair of second wirings;
a second connecting member electrically connecting the other of the pair of first wirings and the other of the pair of second wirings;
a first terminal disposed on the first surface and electrically connected to the first connection member;
a second terminal disposed on the second surface and electrically connected to the second connection member;
with
The first light emitting unit is
a first anode electrode electrically connected to one of the pair of first wirings;
a first cathode electrode electrically connected to the other of the pair of first wirings;
including
The second light emitting unit is
a second cathode electrode electrically connected to one of the pair of first wirings;
a second anode electrode electrically connected to the other of the pair of first wirings;
including
The third light emitting unit is
a third anode electrode electrically connected to one of the pair of second wirings;
a third cathode electrode electrically connected to the other of the pair of second wirings;
including
The fourth light emitting unit is
a fourth cathode electrode electrically connected to one of the pair of second wirings;
a fourth anode electrode electrically connected to the other of the pair of second wirings;
A light-emitting device comprising: The first connecting member is arranged in a first through hole penetrating the base material from the first surface to the second surface,
2. The light-emitting device according to claim 1, wherein said second connection member is arranged in a second through-hole penetrating said base material from said first surface to said second surface. 2. The light emitting device according to claim 1, wherein said first connecting member and said second connecting member are respectively arranged on side surfaces located between said first surface and said second surface of said base material. the sides of the substrate include a first side and a second side opposite the first side;
The first connection member is arranged on the first side surface,
4. The light emitting device according to claim 3, wherein said second connection member is arranged on said second side surface. the first surface of the substrate includes a first recess defined by a first top surface, a first inner surface continuous with the first top surface, and a first bottom surface;
One of the pair of first wirings is arranged on the first top surface, the first inner side surface and the first bottom surface, and is arranged on at least one of the first top surface, the first inner side surface and the first bottom surface. one electrically connected to the first connection member;
the other of the pair of first wirings is arranged on the first bottom surface and electrically connected to the second connection member at the first bottom surface;
The first terminal is arranged on the first upper surface,
5. The light-emitting device according to claim 3, wherein said first light-emitting portion and said second light-emitting portion are arranged on said first bottom surface via said pair of first wirings. the second surface of the substrate includes a second recess defined by a second top surface, a second inner surface continuous from the second top surface, and a second bottom surface;
one of the pair of second wirings is disposed on the second bottom surface and electrically connected to the first connection member at the second bottom surface;
The other of the pair of second wirings is arranged on the second top surface, the second inner side surface and the second bottom surface, and is one of the second top surface, the second inner side surface and the second bottom surface. at least one electrically connected to the second connection member;
the second terminal is disposed on the second top surface;
6. The light-emitting device according to claim 5, wherein said third light-emitting portion and said fourth light-emitting portion are arranged on said second bottom surface via said pair of second wirings. The light-emitting device according to any one of claims 1 to 6, wherein the base material has translucency. 8. The light-emitting device according to claim 1, further comprising a translucent member covering said first light-emitting portion and said second light-emitting portion. 9. The light-emitting device according to claim 1, further comprising flexible conductive films respectively arranged on the first terminal and the second terminal. a first translucent plate including a first translucent conductive layer;
a second translucent plate including a second translucent conductive layer;
a light-emitting device according to any one of claims 1 to 9;
with
The first translucent plate and the second translucent plate are arranged such that the first translucent conductive layer and the second translucent conductive layer face each other,
The light emitting device is arranged between the first translucent member and the second translucent member,
the first terminal is electrically connected to the first translucent conductive layer;
The light-emitting module, wherein the second terminal is electrically connected to the second translucent conductive layer. a first translucent plate including a first translucent conductive layer;
a second translucent plate including a second translucent conductive layer;
a light-emitting device according to any one of claims 1 to 9;
with
The first translucent plate and the second translucent plate are arranged such that the first translucent conductive layer and the second translucent conductive layer face each other,
The light emitting device is arranged between the first translucent member and the second translucent member,
The first connecting member is electrically connected to the first translucent conductive layer,
The second connection member is a light-emitting module electrically connected to the second translucent conductive layer. a support member including an electrically conductive portion;
a third translucent plate including a third translucent conductive layer disposed facing the support member;
an optical member disposed between the supporting member and the third translucent plate;
a light emitting device according to any one of claims 3 to 6 arranged between the supporting member and the third translucent plate;
with
The conductive portion is electrically connected to the first connection member,
The third translucent conductive layer is electrically connected to the second connection member,
The light-emitting module, wherein the optical member includes an inclined surface forming a predetermined angle with respect to the surface of the support member on which the optical member is arranged. providing a substrate having a first side and a second side opposite the first side;
forming a pair of first wirings on the first surface;
connecting a first light emitting element to the pair of first wirings;
forming a pair of second wirings on the second surface;
connecting a second light emitting element to the pair of second wirings;
forming a first connecting member electrically connecting one of the pair of first wirings and one of the pair of second wirings;
forming a second connection member electrically connecting the other of the pair of first wirings and the other of the pair of second wirings;
with
The first light emitting element is
a first light emitting unit;
a first anode electrode for the first light emitting unit electrically connected to one of the pair of first wirings;
a first cathode electrode for the first light emitting unit electrically connected to the other of the pair of first wirings;
the second light emitting unit;
a second cathode electrode for the second light emitting unit, electrically connected to one of the pair of first wirings;
a second anode electrode for the second light emitting unit, electrically connected to the other of the pair of first wirings;
including
The second light emitting element is
a third light emitting unit;
a third anode for the third light emitting unit electrically connected to one of the pair of second wirings;
a third cathode for the third light emitting unit, electrically connected to the other of the pair of second wirings;
a fourth light emitting unit;
a fourth cathode for the fourth light emitting unit, electrically connected to one of the pair of second wirings;
a fourth anode for the fourth light emitting unit electrically connected to the other of the pair of second wirings;
A method of manufacturing a light emitting device comprising: The step of connecting the first light emitting element includes:
forming a conductive seed layer on the first surface;
forming a resist on the seed layer;
The first anode electrode, the first cathode electrode, the second anode electrode and the second cathode electrode face the seed layer, and the resist is between the first anode electrode and the first cathode electrode. and placing the first light emitting element on the resist so as to be between the second cathode electrode and the second anode electrode;
a step of joining the first anode electrode, the first cathode electrode, the second anode electrode and the second cathode electrode, and the seed layer by plating;
removing the resist;
removing the exposed portion of the seed layer;
14. The method of manufacturing a light-emitting device according to claim 13, comprising: The step of forming the first connection member includes forming a conductive material in a first through-hole penetrating the first base material from the first surface to the opposite surface to connect the pair of first wirings. A step of electrically connecting one of the pair of second wirings to one of the pair of second wirings,
The step of forming the second connection member includes forming a conductive material in a second through-hole penetrating the first base material from the first surface to the opposite surface to connect the pair of first wirings. 15. The method of manufacturing a light emitting device according to claim 13, further comprising the step of electrically connecting the other to the other of the pair of second wirings. The step of preparing the base material includes:
providing a first substrate having the first surface;
providing a second substrate having the second surface;
including
16. The method according to any one of claims 13 to 15, further comprising a step of bonding said first base material and said second base material together before said step of forming said first connection member and said step of forming said second connection member. 3. A method for manufacturing a light-emitting device according to claim 1. The step of forming the pair of first wirings includes:
forming a first conductive layer on the first surface;
separating the first conductive layer into one of the pair of first wires and the other of the pair of first wires;
including
The step of forming the pair of second wirings includes:
forming a second conductive layer on the opposite surface;
separating the second conductive layer into one of the pair of second wires and the other of the pair of second wires;
14. The method of manufacturing a light-emitting device according to claim 13, comprising: The step of forming the first connection member includes forming a third conductive layer connected to the first conductive layer and the second conductive layer on a side surface located between the first surface and the second surface of the base material. forming a conductive layer;
The step of forming the second connection member includes forming a fourth conductive layer on the side surface of the base material, separated from the third conductive layer and connected to the first conductive layer and the second conductive layer. 17. The method of manufacturing a light-emitting device according to claim 16, comprising the steps of: In the step of connecting the first light emitting element, the first anode electrode and the second cathode electrode face one of the pair of first wirings, and the first cathode electrode and the second anode electrode face one of the pair of first wirings. A step of placing the first light emitting element on the pair of first wirings so as to face the other of the first wirings;
In the step of connecting the second light emitting element, the third anode electrode and the fourth cathode electrode face one of the pair of second wires, and the third cathode electrode and the fourth anode electrode face one of the pair of second wires. 19. The method of manufacturing a light-emitting device according to claim 17, further comprising the step of placing the second light-emitting element on the pair of second wires so as to face the other of the second wires.

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