JP2023088272A - Substrate holding member and method of manufacturing the same - Google Patents

Abstract

A substrate holding member in which a plurality of electrodes are embedded and capable of reducing the number of terminals for supplying power to each electrode is provided.
[Solution]
The substrate holding member 100 has a ceramic base 110 . Inside the ceramic base 110 are three electrodes 121 to 123, three conductive members 131 to 133, five connection portions 141 to 145, four terminals 151 to 154, and two lands 171 and 172. is buried.
[Selection diagram] Fig. 2

Description

The present invention relates to a substrate holding member for holding a substrate such as a silicon wafer and a method for manufacturing the substrate holding member.

Patent Document 1 discloses a ceramic susceptor in which two heating resistors corresponding to two different heating areas are embedded as an example of a substrate holding member that holds a substrate such as a wafer.

JP-A-2018-5999

In the ceramic susceptor disclosed in Patent Document 1, two terminals are connected to two heating resistors to supply power to the two heating resistors. Therefore, the number of terminals that is twice the number of heating resistors is required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technology capable of reducing the number of terminals for supplying power to each electrode in a substrate holding member in which a plurality of electrodes are embedded. With the goal.

According to an aspect of the present invention, a ceramic base having an upper surface and a lower surface that faces the upper surface in the vertical direction;
a plurality of electrodes embedded in the ceramic base;
at least one conductive member embedded in the ceramic base;
a plurality of connecting portions each having one end electrically connected to one of the plurality of electrodes;
a land electrically connected to the at least one conductive member;
a plurality of terminals each having one end electrically connected to one of the plurality of electrodes, the at least one conductive member, or the land;
a resistance value between a connection portion connected to the at least one conductive member and a terminal is smaller than a resistance value between both ends of the plurality of electrodes;
the number of the plurality of terminals is less than twice the number of the plurality of electrodes;
the land overlaps one of the terminals in the vertical direction at a first position on a horizontal plane orthogonal to the vertical direction;
at a second position different from the first position on the horizontal plane,
A substrate holding member is provided that overlaps one of the connection portions and one of the electrodes in the vertical direction, or overlaps the at least one conductive member in the vertical direction. .

In the above aspect, the number of terminals is less than twice the number of electrodes. Thereby, the space for arranging a plurality of terminals can be reduced. Moreover, the resistance value between the portion connected to the terminal and the connection portion of the at least one conductive member is smaller than the resistance value between both ends of the plurality of electrodes. As a result, even when the electrodes and the terminals are connected via the conductive member and the connecting portion, heat generation in the conductive member can be suppressed as much as possible. Also, by providing the land, the resistance of the portion where the land is provided can be reduced, so heat generation can be particularly suppressed in the portion where the land is provided and between the land and the connection portion. .

FIG. 1 is a perspective view of the substrate holding member 100. FIG. FIG. 2 is a diagram schematically showing a longitudinal section of the ceramic base 110. As shown in FIG. FIG. 3(a) is a diagram schematically showing the cross section of the ceramic base 110 on the virtual plane A, and FIG. 3(b) schematically showing the cross section of the ceramic base 110 on the virtual plane B. It is a diagram. FIG. 4 is an explanatory view showing a case where the bonding protrusions 114 are provided on the lower surface 113 of the ceramic base 110 . 5(a) to 5(e) are diagrams showing the flow of the method for manufacturing the ceramic substrate 110. FIG. 6A to 6E are diagrams showing the flow of another manufacturing method for the ceramic substrate 110. FIG. FIG. 7 is a view corresponding to FIG. 2 of the ceramic base 210 in which four electrodes 221 to 224 are embedded. FIG. 8(a) is a view corresponding to FIG. 3(a) of the ceramic base 210 in which the four electrodes 221 to 224 are embedded, and FIG. 8(b) is a view of the ceramic base in which the four electrodes 221 to 224 are embedded. It is the FIG.3(b) equivalent view of the material 210. FIG. FIG. 9 is a flow chart showing a method of manufacturing the substrate holding member 100. As shown in FIG. 10(a) is a view of the ceramic base 110 corresponding to FIG. 6(c), and FIG. 10(b) is a view of the ceramic base 110 corresponding to FIG. 6(e).

A substrate holding member 100 according to an embodiment of the present invention will be described with reference to FIGS. A substrate holding member 100 according to the present embodiment is a ceramic susceptor used for heating a semiconductor wafer such as a silicon wafer (hereinafter simply referred to as wafer 10). In the following description, the vertical direction 5 is defined based on the state in which the substrate holding member 100 is installed in a usable state (the state in FIG. 1). As shown in FIG. 1, the substrate holding member 100 according to this embodiment includes a ceramic base 110 and a shaft 160. As shown in FIG. 2, 3(a) and 3(b), the ceramic base 110 includes electrodes 121 to 123, conductive members 131 to 133, connecting portions 141 to 145, terminals 151 154 and lands 171 and 172 are buried. Further, as shown in FIG. 3(b), paths TC1 to TC3 are provided in the vicinity of the terminals 151 to 153 for disposing temperature sensors such as thermocouples at various locations on the substrate holding member.

<Ceramic base material 110>
The ceramic base 110 is a circular plate-shaped member with a diameter of 12 inches (approximately 300 mm) and a thickness of 25 mm. As shown in FIG. 1, the wafer 10 to be heated is placed on the upper surface 111 of the ceramic base 110 . In addition, in FIG. 1, the wafer 10 and the ceramic substrate 110 are separated from each other in order to make the drawing easier to see. The ceramic base 110 can be made of, for example, a ceramic sintered body such as aluminum nitride, silicon carbide, alumina, or silicon nitride.

FIG. 2 is a diagram schematically showing a longitudinal section of the ceramic base 110. As shown in FIG. Virtual planes A and B indicated by dotted lines in FIG. 2 are both horizontal planes perpendicular to the vertical direction 5 . Virtual plane A
, B are between the upper surface 111 and the lower surface 113 of the ceramic substrate 110 in the vertical direction 5, and the virtual plane A is positioned above the virtual plane B. As shown in FIG. FIG. 3(a) is a diagram schematically showing the cross section of the ceramic base 110 on the virtual plane A, and FIG. 3(b) schematically showing the cross section of the ceramic base 110 on the virtual plane B. It is a diagram. As shown in FIGS. 2, 3(a) and 3(b), inside the ceramic base 110 are three electrodes 121 to 123, three conductive members 131 to 133, and five connecting portions 141. 145, four terminals 151 to 154, and two lands 171 and 172 are buried.

<Electrodes 121 to 123>
The electrodes 121-123 will be described with reference to FIGS. 2, 3(a) and 3(b). The electrodes 121 to 123 are formed by cutting heat-resistant metals (high melting point metals with a melting point of 2000° C. or higher) such as meshes and foils woven with alloy wires containing tungsten (W), molybdenum (Mo), molybdenum and/or tungsten into strips. It is formed by When using the electrodes 121 to 123 as heater electrodes, it is preferable to use a mesh in order to secure a resistance value. The resistance of the electrodes 121-123 is preferably about 2Ω-20Ω. The electrodes 121 to 123 can be formed, for example, by cutting a material of Mo mesh (wire diameter 0.1 mm, plain weave #50 mesh) into a predetermined pattern. The purity of tungsten and molybdenum is preferably 99% or higher. The thickness of the electrodes 121 to 123 is preferably 0.03 mm to 0.2 mm except for wire crossing points. The width of the electrodes 121 to 123 cut into strips is preferably 2.5 mm to 20 mm, more preferably 5 mm to 15 mm. In the present embodiment, the electrodes 121 to 123 are cut into the shapes shown in FIGS. 3(a) and 3(b), respectively. I can. In addition to the electrodes 121 to 123 inside the ceramic base 110, an electrostatic chuck electrode for attracting the wafer 10 to the upper surface 111 by Coulomb force and a plasma electrode for generating plasma above the ceramic base 110 are provided. At least one of may be embedded.

As shown in FIG. 3A, the electrode 121 is arranged substantially in the center of the virtual plane A of the ceramic base 110, and the electrode 122 is arranged so as to surround the outside of the electrode 121. As shown in FIG. The electrode 121 includes a substantially annular ring portion 121a and two linear portions 121b extending linearly. The ring portion 121a has an open annular shape on the upper side of FIG. extending towards. The electrode 122 includes two semicircular annular inner ring portions 122a arranged to surround the outer side of the ring portion 121a of the electrode 121, and the two inner ring portions 122a arranged to surround the outer side of the inner ring portion 122a. It includes a substantially annular outer ring portion 122b and two linear portions 122c extending linearly so as to connect the two inner ring portions 122a and the outer ring portion 122b. The outer ring portion 122b has an annular shape with an open left side in FIG. 3(a). The two straight portions 122c extend in the horizontal direction of FIG. 3A so as to connect both ends of the outer ring portion 122b and the two inner ring portions 122a.

As shown in FIG. 3B, the electrodes 123 are arranged on the outer peripheral portion of the imaginary plane B of the ceramic base 110 . The electrode 123 includes a substantially annular ring portion 123a whose upper side is open in FIG. 3(b). When the virtual plane A and the virtual plane B overlap, the electrode 123 is arranged outside the electrodes 121 and 122, and the electrodes 121, 122, and 123 are arranged concentrically so as not to overlap each other. It is That is, the outer diameter of the electrode 123 is larger than the outer diameters of the electrodes 121 and 122 . As a result, the upper surface 111 of the ceramic substrate 110 has three zones corresponding to the electrodes 121, 122, and 123 (in the vertical direction, a zone overlapping the electrode 121, a zone overlapping the electrode 122, and a zone overlapping the electrode 123). zone).

<Conductive members 131 to 133>
Next, the conductive members 131 to 133 will be described with reference to FIGS. 2, 3(a) and 3(b). As shown in FIG. 3(b), the conductive members 131 to 133 are arranged on the same imaginary plane B. As shown in FIG. The conductive members 131 to 133 are arranged so as not to overlap each other so as to occupy a substantially circular area inside the electrode 123 . The conductive member 131 has a substantially semicircular shape, and occupies substantially the left half of the area inside the electrode 123 in FIG. 3(b). A rectangular notch 131</b>C is formed in the substantially central portion of the right side of the conductive member 131 . The conductive member 132 has a sector shape with a central angle of about 90°, and is arranged on the right side of the conductive member 131 so as to face the lower half of the conductive member 131 . A rectangular notch 132</b>C is formed in the substantially central portion of the upper side of the conductive member 132 . The conductive member 133 has a sector shape with a central angle of about 90°, and is arranged on the right side of the conductive member 131 so as to face the upper half of the conductive member 131 .

The total area of the conductive members 131 to 133 is preferably 40% or more, more preferably 55% or more, of the area of the virtual circle defined by the outer diameter of the electrode 123 having the largest outer diameter among the electrodes 121 to 123. It is even more preferable to have Each of the area of the conductive member 131, the area of the conductive member 132, and the area of the conductive member 133 is 40% of the area obtained by dividing the area of the virtual circle by the number (three) of the electrodes 121 to 123. It is preferably 55% or more, more preferably 55% or more.

As with the electrodes 121 to 123, the conductive members 131 to 133 are made of heat-resistant metal (high-melting-point metal ) into a predetermined shape. The conductive members 131-133 are preferably made of the same metal material as the electrodes 121-123. In this case, manufacturing is facilitated, and distortion due to differences in shrinkage during firing can be suppressed. As will be described later, the conductive member 131 is connected to the connection portion 144 (see FIG. 3(b)). Also, the conductive member 131 is connected to the terminal 152 via the land 171 . The resistance between the portion of the conductive member 131 connected to the land 171 and the connection portion 144 is about 0.001Ω to 1Ω, which is smaller than the resistance of any of the electrodes 121-123. The conductive member 132 is connected to the terminal 153 and the connecting portion 143 (see FIG. 3B). The resistance between the portion of the conductive member 132 connected to the terminal 153 and the connection portion 143 is about 0.001Ω to 1Ω, which is smaller than the resistance of any of the electrodes 121-123. However, in this embodiment, a notch 132C is formed in the conductive member 132 in order to secure a space for installing the temperature sensor TC3. As a result, the resistance between the portion of the conductive member 132 connected to the terminal 153 and the connection portion 143 is slightly higher than when there is no cut 132C. The conductive member 133 is connected to the terminal 154 and the connecting portions 141, 142, 145 (see FIG. 3(b)). The resistance between the portion of the conductive member 133 connected to the terminal 154 and the connection portion 141, the resistance between the portion of the conductive member 133 connected to the terminal 154 and the connection portion 142, and the portion connected to the terminal 154 and the connection portion 145 are all about 0.001Ω to 1Ω, which is less than the resistance of the electrodes 121-123.

<Connecting parts 141 to 145>
Next, the connecting portions 141 to 145 will be described with reference to FIGS. 2, 3(a) and 3(b). As shown in FIG. 2, the connecting portions 141, 142 are arranged between the virtual planes A and B. As shown in FIG. Lower ends of the connecting portions 141 and 142 are electrically connected to the conductive member 133 . In the following description, being electrically connected is simply referred to as being connected. The upper end of the connecting portion 141 is connected to the straight portion 121 b of the electrode 121 , and the upper end of the connecting portion 142 is connected to the ring portion 122 a of the electrode 122 . Like the connecting portions 141 and 142, the connecting portion 143 is also arranged between the virtual planes A and B (see FIGS. 3(a) and 3(b)). A lower end of the connecting portion 143 is connected to the conductive member 132 , and an upper end of the connecting portion 143 is connected to the ring portion 122 a of the electrode 122 . These connection portions 141 to 143 are via structures that connect the virtual planes A and B. FIG. Further, the connecting portions 144 and 145 are arranged on the virtual plane B as shown in FIG. 3(b). One ends of the connection portions 144 and 145 (upper ends in FIG. 3B) are connected to the electrode 123 . The other end of the connecting portion 144 (lower end in FIG. 3B) is connected to the conductive member 131, and the other end of the connecting portion 145 (lower end in FIG. 3B) is conductive. It is connected to member 133 . The connection portions 144 and 145 are made of the same material as the electrodes 121 to 123 and the conductive members 131 to 133 (tungsten (W), molybdenum (Mo), a mesh or foil woven from an alloy wire containing molybdenum and/or tungsten). ). Thereby, the connection portion 144 is integrated with the conductive member 131 and the electrode 123 , and the connection portion 145 is integrated with the conductive member 133 and the electrode 123 .

<Terminals 151 to 154>
Next, the terminals 151 to 154 will be described with reference to FIGS. 2, 3(a) and 3(b). As shown in FIG. 2, the upper end of terminal 151 is connected to straight portion 121b of electrode 121 (see FIG. 3A). The upper end of terminal 151 may be in contact with straight portion 121 b of electrode 121 . Alternatively, the upper end of the terminal 151 and the straight portion 121b of the electrode 121 may be in contact via a pellet made of tungsten, molybdenum, or an alloy containing at least one of these. The same applies to terminals 152 to 154, which will be described later. The terminal 151 extends downward from the straight portion 121b of the electrode 121 and further extends downward through a hollow portion of a hollow cylindrical portion 161 of the shaft 160, which will be described later. In addition, as shown in FIG. 3(b), a rectangular notch 131C is formed in a substantially central portion on the right side of the conductive member 131 arranged on the imaginary plane B. As shown in FIG. Since the terminal 151 extends downward through the portion of the imaginary plane B where the notch 131C is formed, the terminal 151 and the conductive member 131 are not electrically connected.

As shown in FIG. 2, the upper end of the terminal 154 is connected to the conductive member 133 arranged on the imaginary plane B. As shown in FIG. Terminal 154 extends downwardly from conductive member 133 and, like terminal 151 , extends downwardly through a hollow portion of cylindrical portion 161 of shaft 160 . The upper end of the terminal 152 is connected to the land 171 arranged on the imaginary plane B (see FIG. 3(b)). Terminal 152 extends downward from land 171 and, like terminal 151 , extends downward through a hollow portion of cylindrical portion 161 of shaft 160 . It should be noted that, like the terminal 151, the terminal 152 extends downward through the portion of the imaginary plane B where the notch 131C is formed. Therefore, terminal 152 is not in direct contact with conductive member 131 . Also, the upper end of the terminal 153 is connected to the conductive member 132 arranged on the imaginary plane B (see FIG. 3B). Terminal 153 extends downwardly from conductive member 132 and, like terminal 151 , extends downwardly through a hollow portion of cylindrical portion 161 of shaft 160 . Thus, four terminals 151 to 154 are arranged in the hollow portion of the cylindrical portion 161 of the shaft 160 . Passages TC1 and TC2 are respectively provided near the terminals 151 and 152 in the area where the notch 131C is formed, and temperature sensors such as thermocouples are arranged through the passages TC1 and TC2. there is Similarly, a passage TC3 is provided near the terminal 153 in the area where the notch 132C is formed, and the temperature sensor is arranged through the passage TC3.

<Land 171, 172>
As shown in FIGS. 2 and 3B, the land 171 has a substantially rectangular plate-like outer shape. Land 171 extends in the horizontal direction of FIG. 3B, the left end of the land 171 is connected to the conductive member 131, and the right end of the land 171 is connected to the upper surface of the terminal 152. As shown in FIG. As will be described later, the land 171 and the terminal 152 may be connected via a pellet made of tungsten, molybdenum, or an alloy containing at least one of these. The land 172 has a substantially L-shaped plate-like outer shape. The land 172 extends downward in FIG. 3B so as to avoid the notch 132C from the position covering the upper end of the terminal 153 on the imaginary plane B, and then extends rightward. In FIG. 3B, the position of the right end of the land 172 in the horizontal direction is substantially the same as the position of the connection portion 143 in the horizontal direction.

A land 171 is provided for electrically connecting the terminal 152 and the conductive member 131 . Land 172 is provided to reduce the resistance value between terminal 153 and connecting portion 143, as will be described later. The lands 171 and 172 are preferably made of a high melting point metal having a melting point of 2000° C. or higher. In particular, it is preferably made of an alloy containing tungsten (W), molybdenum (Mo), molybdenum and/or tungsten. The width of the lands 171 and 172 is preferably about 1 mm to 10 mm, and the thickness is preferably about 0.1 mm to 4 mm. Although the land 171 has a linear shape and the land 172 has a polygonal line shape, the shapes may not necessarily be such shapes, and may be, for example, a curved shape.

<Shaft 160>
Shaft 160 will now be described with reference to FIGS. As shown in FIGS. 1 and 2, a shaft 160 is connected to the bottom surface 113 of the ceramic base 110 . The shaft 160 has a hollow cylindrical portion 161 and a large diameter portion 162 (see FIG. 1) provided below the cylindrical portion 161 . The large diameter portion 162 has a diameter larger than that of the cylindrical portion 161 . In the description below, the longitudinal direction of the cylindrical portion 161 is defined as the longitudinal direction 6 of the shaft 160 . As shown in FIG. 1, the longitudinal direction 6 of the shaft 160 is parallel to the vertical direction 5 when the substrate holding member 100 is in use.

As shown in FIG. 2, a through hole extending in the longitudinal direction 6 (see FIG. 1) is formed inside the cylindrical portion 161 of the shaft 160 (the region inside the inner diameter). 123 are provided with terminals 151-154. As a result, power is supplied to the electrodes 121-123 via the terminals 151-154.

A protrusion 114 for joining with the shaft 130 (hereinafter referred to as joining protrusion 114) can be provided on the lower surface 113 of the ceramic base 110 (see FIG. 4). The shape of the bonding projection 114 is preferably the same as the shape of the upper surface of the shaft 160 to be bonded, and the diameter of the bonding projection 114 is preferably 100 mm or less. The height (height from the lower surface 113) of the bonding projection 114 may be 0.2 mm or more, preferably 1 mm or more. Although there is no particular upper limit on the height, the height of the joint protrusion 114 is preferably 20 mm or less in consideration of ease of manufacture. Also, the lower surface of the joint projection 114 is preferably parallel to the lower surface 113 of the ceramic base 100 . The surface roughness Ra of the lower surface of the bonding projection 114 may be 1.6 μm or less. In addition, the surface roughness Ra of the lower surface of the bonding protrusion 114 is preferably 0.4 μm or less, more preferably 0.2 μm or less.

The upper surface of the cylindrical portion 161 is fixed to the lower surface 113 of the ceramic base 110 (the lower surface of the joining protrusion 114 when the joining protrusion 114 is provided). It should be noted that the shaft 160 may be made of a ceramic sintered body such as aluminum nitride, silicon carbide, alumina, or silicon nitride, like the ceramic base 110 . Alternatively, it may be formed of a material having a lower thermal conductivity than the ceramic base 110 in order to improve heat insulation. Further, an enlarged diameter portion 163 similar to the large diameter portion 162 provided below the cylindrical portion 161 may be provided on the upper surface of the cylindrical portion 161 .

<Manufacturing Method of Substrate Holding Member 100>
Next, a method for manufacturing the substrate holding member 100 will be described. A case in which the ceramic base 110 and the shaft 160 are made of aluminum nitride will be described below as an example. However, in order to make the explanation easier to understand, it is assumed that the conductive member 132 , the connecting member 143 , the electrode 122 and the land 172 are embedded in the ceramic base 110 .

First, a method for manufacturing the ceramic substrate 110 will be described. As shown in FIG. 5( a ), granulated powder P containing aluminum nitride (AlN) powder as a main component is put into a floored mold 501 made of carbon and temporarily pressed with a punch 502 . The granulated powder P preferably contains 5 wt % or less of a sintering aid (for example, Y ₂ O ₃ ). Next, as shown in FIG. 5B, a conductive member 132 cut into a predetermined shape is arranged on the granulated powder P that has been temporarily pressed. In addition, the conductive member 132 is arranged so as to be parallel to a plane perpendicular to the pressurizing direction (bottom surface of the floored mold 501). At this time, a pellet made of tungsten, molybdenum, or an alloy containing at least one of these may be embedded at a position overlapping the terminal 153 (see FIG. 3B).

Furthermore, as shown in FIG. 5(b), a preform 143P is arranged on the conductive member 132. Then, as shown in FIG. The preform 143P is a porous material made of tungsten, molybdenum, or an alloy containing at least one of these. Also, as shown in FIG. 5B, a land 172 is arranged on the conductive member 132 .

As shown in FIG. 5(c), the granulated powder P is further put into the floored mold 501 so as to cover the conductive member 132, the land 172 and the preform 143P, and the punch 502 is used to form a temporary powder in the same manner as described above. After pressing, the electrode 122 is placed on the preform 143P. At this time, a pellet made of tungsten, molybdenum, or an alloy containing at least one of these may be embedded at a position overlapping the terminal 153 (see FIG. 3B). When the pellets are embedded, if necessary, between the conductive member 132 and the pellets and between the electrode 122 and the pellets, a powder of a high-melting-point metal such as tungsten or molybdenum is applied as a paste. may This can improve the adhesion between the conductive member 132 and the pellet and between the electrode 122 and the pellet.

Next, as shown in FIG. 5(d), the granulated portion P is further put into the floored mold 501 so as to cover the electrode 122, and the conductive member 132, the land 172, the preform 143P and the electrode 122 are embedded. The granulated powder P thus obtained is fired while being pressed. The pressure applied during firing is preferably 1 MPa or more. Moreover, it is preferable to bake at the temperature of 1800 degreeC or more. At this time, the preform 143P is fired while a predetermined pressure is applied, so that the porous preform 143P becomes a dense via structure, and the connection portion 143 is formed. Note that the porous preform 143P does not necessarily have to be used. A via structure can also be formed by forming a predetermined hole at the position where the preform 143P is to be arranged, filling the hole with a paste containing tungsten or molybdenum, and firing the paste. Next, as shown in FIG. 5( e ), blind hole machining is performed up to the conductive member 132 in order to form the terminal 153 . In addition, when the pellet is embedded, a blind hole may be drilled to the pellet.

Ceramic base material 110 can also be manufactured by the following method. As shown in FIG. 6(a), a binder is added to the aluminum nitride granulated powder P, CIP molding is performed, and the mixture is processed into a disk shape to produce a plurality of aluminum nitride compacts 510 (FIG. 9: See step S1). Next, as shown in FIG. 6B, the compact 510 is degreased to remove the binder.

A conductive member 132, a land 172, and an electrode 122 are prepared (see FIG. 9: step S2). As shown in FIG. 6(c), recesses 511 for burying the conductive members 132, lands 172 and electrodes 122 and through holes for inserting the preforms 143P are formed in the degreased compact 510. (see FIG. 9: step S3). Note that the concave portion 511 and the through hole may be formed in the molded body 510 in advance.

A conductive member 132 is placed in the recess 511 of the molded body 510 (see FIG. 9: step S4). Also, the land 172 and the electrode 122 are arranged in the concave portion 511 of another molded body 510 (see FIG. 9: step S5). Also, the preform 143P is placed in the through hole (see FIG. 9: step S6). Then, a plurality of molded bodies 510 are laminated (see FIG. 9: step S7). The land 172 is arranged so as to come into contact with the conductive member 132 when the plurality of laminates 510 are laminated. Also, a pellet made of tungsten, molybdenum, or an alloy containing at least one of these may be embedded at a position overlapping the terminal 153 (see FIG. 3B). When the pellets are embedded, if necessary, between the conductive member 132 and the pellets and between the electrode 122 and the pellets, a powder of a high-melting-point metal such as tungsten or molybdenum is applied as a paste. may This can improve the adhesion between the conductive member 132 and the pellet and between the electrode 122 and the pellet. Next, as shown in FIG. 6(d), a plurality of stacked compacts 510 are fired while being pressed (uniaxial hot press firing) to produce a fired body (see FIG. 9: step S8). The pressure applied during firing is preferably 1 MPa or more. Moreover, it is preferable to bake at the temperature of 1800 degreeC or more. At this time, as in the above process, the preform 143P is fired while a predetermined pressure is applied, whereby the porous preform 143P becomes a dense via structure and the connecting portion 143 is formed. . After producing the sintered body, in order to form the terminal 153, blind hole processing is performed up to the conductive member 132 in the same manner as in the above-described steps (see FIG. 9: step S9). As a result, the portion of the conductive member 132 that overlaps the land 172 can be exposed. In addition, when the pellet is embedded, a blind hole may be drilled to the pellet.

The upper surface 111 of the ceramic base 110 thus formed is subjected to contouring. The lower surface 113 of the ceramic substrate 110 may be provided with a joining protrusion 114 (see FIG. 4) protruding from the lower surface 113 . Then, the shaft 160 is joined to the ceramic base 110 as described later (see FIG. 9: step S10).

Next, a method for manufacturing the shaft 160 and a method for joining the shaft 160 and the ceramic base 110 will be described. First, granulated powder P of aluminum nitride to which several wt % of binder is added is compacted under hydrostatic pressure (approximately 1 MPa), and the compact is processed into a predetermined shape. The outer diameter of shaft 160 is approximately 30 mm to 100 mm. A flange portion 163 having a diameter larger than the outer diameter of the cylindrical portion 161 may be provided on the end surface of the cylindrical portion 161 of the shaft 160 (see FIG. 4). The length of the cylindrical portion 161 can be, for example, 50 mm to 500 mm. After processing the compact into a predetermined shape, the compact is fired in a nitrogen atmosphere. For example, it is baked at a temperature of 1900° C. for 2 hours. Then, the shaft 160 is formed by processing the sintered body into a predetermined shape after firing. The upper surface of the cylindrical portion 161 and the lower surface 113 of the ceramic base 110 can be fixed by diffusion bonding at 1600° C. or higher and under a uniaxial pressure of 1 MPa or higher. In this case, the surface roughness Ra of the lower surface 113 of the ceramic substrate 110 is preferably 0.4 μm or less, more preferably 0.2 μm or less. Alternatively, the upper surface of the cylindrical portion 161 and the lower surface 113 of the ceramic base 110 can be bonded using a bonding agent. As the bonding agent, for example, AlN bonding material paste to which 10 wt % of Y ₂ O ₃ is added can be used. For example, the above AlN bonding agent paste is applied to the interface between the upper surface of the cylindrical portion 161 and the lower surface 113 of the ceramic base 110 to a thickness of 15 μm, and a pressure of 5 kPa is applied in a direction perpendicular to the upper surface 111 (longitudinal direction 6 of the shaft 130). It can be joined by heating at a temperature of 1700° C. for 1 hour while applying a force of . Alternatively, the upper surface of the cylindrical portion 161 and the lower surface 113 of the ceramic base 110 can be fixed by screwing, brazing, or the like.

<Power supply path of electrodes 121 to 123>
As shown in FIGS. 2 and 3(a), the terminal 151 is connected to one end of the electrode 121 (the left straight portion 121b in FIG. 3(a)). The other end of the electrode 121 (right straight portion 121b in FIG. 3A) is connected to the connecting portion 141. As shown in FIG. As shown in FIG. 3B, the connection portion 141 is connected to the conductive member 133, and the conductive member 133 is connected to the terminal 154. As shown in FIG. As a result, an electric circuit is formed from the terminal 151 to the terminal 154 through the electrode 121 , the connecting portion 141 and the conductive member 133 . By using the terminal 154 as a ground terminal and connecting an external power supply to the terminals 151 and 154, the electrode 121 can be energized. That is, the conductive member 133 is grounded.

As shown in FIG. 3B, the terminal 153 is connected to the conductive member 132, and the conductive member 132 is connected to the connecting portion 143. As shown in FIG. As shown in FIG. 3( a ), the connecting portion 143 is connected to one end of the electrode 122 and the other end of the electrode 122 is connected to the connecting portion 142 . As shown in FIG. 3B, the connecting portion 142 is connected to the conductive member 133, and the conductive member 133 is connected to the terminal 154. As shown in FIG. As a result, an electric circuit is formed from terminal 153 to terminal 154 through conductive member 132 , connecting portion 143 , electrode 122 , connecting portion 142 , and conductive member 133 . Thus, by using the terminal 154 as a ground terminal and connecting an external power supply to the terminals 153 and 154, the electrode 122 can be energized. That is, the conductive member 133 is grounded. Also, the conductive member 132 arranged on the same plane as the conductive member 133 is connected to an external power source.

A rectangular notch 132C extending downward in FIG. there is By providing the notch 132</b>C as described above, it is possible to easily secure a space for arranging the temperature sensor TC<b>3 near the terminal 153 . On the other hand, between the portion of the conductive member 132 connected to the terminal 153 and the portion connected to the connection portion 143, the current cannot flow linearly in the shortest distance, avoiding the notch 132C. It will flow like Therefore, in the present embodiment, the resistance value between the portion of the conductive member 132 connected to the terminal 153 and the portion connected to the connection portion 143 is lower than that in the case where the notch 132C is not provided. higher. Therefore, in this embodiment, the land 172 is arranged on the conductive member 132 so as to avoid the notch 132C. As described above, current can flow through land 172 between the portion of conductive member 132 connected to terminal 153 and the portion connected to connecting portion 143 . As a result, the resistance between the portion connected to the terminal 153 and the portion connected to the connection portion 143 can be reduced compared to the case where the land 172 is not provided.

As shown in FIG. 3B , the terminal 152 is connected to one end of the land 171 and the other end of the land 171 is connected to the conductive member 131 . Conductive member 131 is connected to connecting portion 144 . Furthermore, the connection portion 144 is connected to one end of the electrode 123 and the other end of the electrode 123 is connected to the connection portion 145 . The connection portion 145 is connected with the conductive member 133 , and the conductive member 133 is further connected with the terminal 154 . Thus, an electric circuit is formed from terminal 152 to terminal 154 through land 171, conductive member 131, connecting portion 144, electrode 123, connecting portion 145, and conductive member 133. FIG. By using the terminal 154 as a ground terminal and connecting an external power source to the terminals 153 and 154, the electrode 123 can be energized. That is, the conductive member 133 is grounded. Conductive member 131 arranged on the same plane as conductive member 133 is connected to an external power source.

<Action and effect of the embodiment>
In the above embodiment, the substrate holding member 100 includes the ceramic base 110, the electrodes 121-123, the conductive members 131-133, the connection portions 141-145, the terminals 151-154, and the lands 171 and 172. ing. Electrodes 121 to 123, conductive members 131 to 133, connecting portions 141 to 145 and lands 171 and 172 are embedded in ceramic base 110. As shown in FIG. A connecting portion 141 connects the electrode 121 and the conductive member 133, a connecting portion 142 connects the electrode 122 and the conductive member 133, and a connecting portion 145 connects the electrode 123 and the conductive member 133. there is A connection portion 143 connects the electrode 122 and the conductive member 132 . A connection portion 144 connects the electrode 123 and the conductive member 131 . Terminal 151 is connected to electrode 121 , terminal 152 is connected to land 171 , terminal 153 is connected to conductive member 132 , and terminal 154 is connected to conductive member 133 . The land 171 vertically overlaps the terminal 152 at a first position (the right end of the land 171 in this embodiment), and is electrically conductive at a second position (the left end of the land 171 in this embodiment) different from the first position. It overlaps with the member 131 in the vertical direction. At this time, the land 171 can electrically connect the terminal 152 and the conductive member 131 .

By connecting terminals to both ends of each electrode, the electrodes can be energized from an external power source through the two terminals. However, in this case, the number of terminals twice as many as the number of electrodes is required. On the other hand, in the above-described embodiment, the conductive member 133 has a connecting portion 141 connected to the electrode 121, a connecting portion 142 connected to the electrode 122, and a connecting portion 145 connected to the electrode 123. is connected. Furthermore, a terminal 154 is connected to the conductive member 133 . Therefore, multiple electrodes 121 to 123 are connected to one terminal 154 via one conductive member 133 . With such a configuration, the number of terminals 151-154 (four) can be less than twice the number of electrodes 121-123 (three). Thereby, the space for arranging a plurality of terminals can be reduced. In addition, since the electrodes and terminals can be connected via the conductive members, lands, and connection portions, the electrodes and terminals can be connected without the conductive members, lands, and/or connection portions. The degree of freedom in arranging the terminals can be increased as compared with . For example, the terminals 151 to 154 can be gathered near the center of the lower surface 113 of the ceramic base 110 so that all the terminals 151 to 154 pass through the through holes of the shaft 160 as in this embodiment.

In the above embodiment, the resistance value between the portion of land 171 connected to terminal 152 and connection portion 144 is smaller than the resistance value of any of electrodes 121-123. The resistance value between the portion of conductive member 132 connected to terminal 153 and connection portion 143 is smaller than the resistance value of any of electrodes 121-123. The resistance value between the portion of conductive member 133 connected to terminal 154 and connection portion 141 is smaller than the resistance value of electrodes 121-123. Similarly, the resistance value between the portion of the conductive member 133 connected to the terminal 154 and the connection portion 142 and the resistance value between the portion of the conductive member 133 connected to the terminal 154 and the connection portion 145 are the electrodes 121 to 123 less than the resistance of As a result, heat generation between the electrodes and the terminals can be suppressed as much as possible even when the electrodes and the terminals are not directly connected.

The land 172 extends in an L shape from a first position (the upper end of the land 172 in this embodiment) to a second position (the right end of the land 172 in this embodiment) different from the first position. The land 172 vertically overlaps the terminal 153 at the first position. As mentioned above, the land 172 can form a detour for current flow from the first position to the second position of the conductive member 132 . That is, when land 172 is not formed, current can flow through conductive member 132 from the first position to the second position. If a land 172 is formed on the conductive member 132, current can flow through the conductive member 132 from the first position to the second position and through the land 172 to the first position. to a second position. Therefore, the resistance value between the first position and the second position can be reduced. Moreover, the thickness of the land 172 is large compared to the thickness of the conductive member 132 . This also contributes to lowering the resistance value between the first position and the second position. Thus, in the present embodiment, by providing the lands 171 and 172, it is possible to reduce the resistance of the portions where the lands are provided, so that the portions where the lands 171 and 172 are provided particularly generate heat. can be suppressed.

In the above embodiment, the ceramic base 110 contains aluminum nitride. Also, the lands 171 and 172 are made of a high melting point metal having a melting point of 2000° C. or higher. Aluminum nitride and high melting point metals such as tungsten and molybdenum have a small difference in average coefficient of linear expansion. Therefore, when the lands 171 and 172 are buried in the aluminum nitride ceramic base 110 and fired, the occurrence of cracks or the like can be suppressed.

In the above embodiment, the conductive member 131 is provided with a cutout 131C, and the terminal 151 extends upwardly through the area provided with the cutout 131C so as not to contact the conductive member 131 . As a result, the terminal can be arranged at a position overlapping the conductive member that is not electrically connected to the terminal, and the degree of freedom in arranging the terminal can be increased. Moreover, when the terminals and the electrodes are connected without using the connection member embedded inside the ceramic base 110, the risk of poor connection inside the ceramic base 110 can be reduced. Temperature sensors TC1 and TC2 such as thermocouples are provided near the terminals 151 and 152 in the area where the notch 131C is provided. A notch 132C is provided in the conductive member 132, and a similar temperature sensor TC3 is provided in the vicinity of the terminal 153 in the area where the notch 132C is provided. By forming the notch in the conductive member in this way, it is possible to easily secure a space for arranging the temperature sensor. However, as described above, providing the notch in the conductive member may increase the resistance value between the terminal and the connecting portion. In the present embodiment, as described above, the land is arranged so as to bypass the notch, so it is possible to suppress an increase in the resistance value between the terminal and the connecting portion.

In the above embodiment, the cylindrical shaft 160 is provided on the lower surface 113 of the ceramic base 110 . Terminals 151 to 154 are arranged inside the outer diameter of shaft 160 . In this case, the terminals 151 to 154 can be protected from the external environment of the shaft 160 by hermetically sealing the inside and outside of the cylindrical shaft 160 . Further, by providing the tubular shaft 160, the ceramic base 110 can be prevented from coming into direct contact with an external device or the like. As a result, the ceramic base 110 can be insulated from the surroundings, and the heat uniformity of the ceramic base 110 can be improved.

In the above embodiment, the conductive members 131 to 133 and the electrodes 121 to 123 are made of the same material (tungsten (W), molybdenum (Mo), mesh or foil woven from alloy wires containing molybdenum and/or tungsten). formed by This facilitates manufacture of the substrate holding member 100 . In the above embodiment, the connecting portions 141 to 143 are via structures that connect the virtual planes A and B. FIG. The connecting portions 144 and 145 are made of the same material as the electrodes 121 to 123 and the conductive members 131 to 133 (tungsten (W), molybdenum (Mo), a mesh or foil woven from an alloy wire containing molybdenum and/or tungsten). ). Furthermore, the connecting portion 144 is integrated with the conductive member 131 and the electrode 123 , and the connecting portion 145 is integrated with the conductive member 133 and the electrode 123 . Thereby, the connection portion can be reliably connected to the electrode and/or the conductive member, and the risk of connection failure can be reduced. The material of the electrodes 121-123 may be different from the material of the conductive members 131-133. In that case, the degree of freedom in selecting materials for the electrodes 121 to 123 and the conductive members 131 to 133 can be increased.
For example, the electrodes 121 to 123 are made of a material having a large sheet resistance and volume resistivity, and are made of tungsten (W), molybdenum (Mo), molybdenum and/or may be formed of a mesh of woven wires of an alloy containing tungsten. The conductive members 131 to 133 are made of materials having low sheet resistance and volume resistivity, and are made of tungsten (W), molybdenum (Mo), It can be formed from an alloy foil containing molybdenum and/or tungsten.

<Change form>
The above-described embodiment is merely an example, and can be changed as appropriate. For example, the shape and dimensions of the ceramic substrate 110 and the shaft 160 are not limited to those of the above embodiment, and can be changed as appropriate. Also, the shape, size, number, etc. of electrodes, conductive members, joints, terminals, and lands embedded in the ceramic substrate 110 can be changed as appropriate. Also, the shape, size, etc. of the notch formed in the conductive member can be changed as appropriate. Also, an opening may be formed in the conductive member instead of the notch.

In the above embodiments, molybdenum, tungsten, and an alloy containing molybdenum and/or tungsten are used as the electrodes 121 to 123, but the present invention is not limited to such an aspect. For example, metals or alloys other than molybdenum and tungsten can also be used.

In the above-described embodiment, the substrate holding member 100 has the three electrodes 121 to 123 embedded in the ceramic base 110, but the present invention is not limited to such an aspect. The number of electrodes embedded in the material 110 may be two or four or more. For example, four electrodes 221 to 224 may be embedded in the ceramic base 210 as shown in FIGS.

As shown in FIGS. 7, 8(a) and 8(b), four electrodes 221 to 224 are arranged on the virtual plane A of the ceramic substrate 210, and four conductive members 231 are arranged on the virtual plane B. 234 and three lands 271-273 are arranged. Five terminals 251 to 255 are provided on the ceramic base 210, and paths TC1 to TC4 for arranging temperature sensors and the like are provided in the vicinity of the terminals 251 to 254, respectively. The material of the electrodes 221 to 224 is the same as the electrodes 121 to 123 described above, the material of the conductive members 231 to 234 is the same as the conductive members 151 to 153 described above, and the material of the lands 271 to 273 is the same as the lands described above. 171 and 172, and the materials of the terminals 251 to 255 are the same as those of the terminals 151 to 154 described above, so description thereof will be omitted.

As shown in FIGS. 7 and 8(a), the terminal 251 is connected to one end of the electrode 221. As shown in FIGS. The other end of the electrode 221 is connected with the connecting portion 241 . As shown in FIG. 8(b), the connection portion 241 is connected to the conductive member 234, and the conductive member 234 is connected to the terminal 254. As shown in FIG. As a result, an electric circuit is formed from the terminal 251 to the terminal 254 through the electrode 221 , the connecting portion 241 and the conductive member 234 . By using the terminal 254 as a ground terminal and connecting an external power supply to the terminals 251 and 254, the electrode 221 can be energized.

As shown in FIG. 8(b), the terminal 253 is connected to the conductive member 233, and the conductive member 233 is connected to the connection portion 243. As shown in FIG. A notch 233C is provided in the conductive member 233, and an L-shaped land 272 similar to the land 172 is provided so as to avoid the notch 233C. The connecting portion 243 is connected to one end of the electrode 222 . The other end of electrode 222 is connected to connecting portion 242 . As shown in FIG. 8(b), the connecting portion 242 is connected with the conductive member 234, and the conductive member 234 is further connected with the terminal 254. As shown in FIG. Thereby, an electric circuit is formed from the terminal 253 to the terminal 254 through the conductive member 233 , the connection portion 243 , the electrode 222 , the connection portion 242 , and the conductive member 234 . As a result, the electrode 222 can be energized by connecting an external power source to the terminals 253 and 254 using the terminal 254 as a ground terminal. A land 272 is provided on the conductive member 233 . Therefore, current can flow through the land 272 between the portion of the conductive member 233 connected to the terminal 253 and the portion connected to the connection portion 243 . As a result, the resistance value between the portion connected to the terminal 253 and the portion connected to the connection portion 243 can be reduced compared to the case where the land 272 is not provided, thereby suppressing heat generation in this portion. can do.

As shown in FIG. 8(b), the terminal 255 is connected to the conductive member 231, and the conductive member 231 is connected to the connecting portion 246. As shown in FIG. The connecting portion 246 is connected to one end of the electrode 223 . The other end of electrode 223 is connected to connecting portion 247 . As shown in FIG. 8(b), the connecting portion 247 is connected to the conductive member 234, and the conductive member 234 is connected to the terminal 254. As shown in FIG. As a result, an electric circuit is formed from terminal 255 to terminal 254 through conductive member 231 , connecting portion 246 , electrode 223 , connecting portion 247 , and conductive member 234 . By using the terminal 254 as a ground terminal and connecting an external power source to the terminals 255 and 254, the electrode 223 can be energized.

As shown in FIG. 8B, the terminal 252 is connected to the land 271, the land 271 is connected to the conductive member 232, and the conductive member 232 is connected to the connecting portion 245. As shown in FIG. The connecting portion 245 is connected to one end of the electrode 224 . The other end of electrode 224 is connected to connecting portion 244 . As shown in FIG. 8(b), the connecting portion 244 is connected to the conductive member 234, and the conductive member 234 is further connected to the terminal 254. As shown in FIG. As a result, an electric circuit is formed from terminal 252 to terminal 254 through conductive member 232 , connecting portion 245 , electrode 224 , connecting portion 244 , and conductive member 234 . By using the terminal 254 as a ground terminal and connecting an external power source to the terminals 252 and 254, the electrode 224 can be energized. In addition, as shown in FIG. 8B, the land 271 extends to the vicinity of the connecting portion 245 on the conductive member 232 . As a result, the resistance between the terminal 252 and the connection portion 245 can be reduced compared to when the land 272 does not extend to the vicinity of the connection portion 245, and heat generation between the terminal 252 and the connection portion 245 can be reduced. can be suppressed.

In this way, even when the four electrodes 221 to 224 are embedded in the ceramic base 110, the same effects as those of the substrate holding member 100 described above can be obtained.

Although the substrate holding member 100 has the shaft 160 in the above embodiment, the present invention is not limited to such an aspect, and the substrate holding member 100 does not necessarily have the shaft 160 .

Although the land is arranged above the conductive member in the above embodiment, the present invention is not limited to such an aspect, and the land may be arranged below the conductive member. The substrate holding member 100 in which the land is arranged under the conductive member can be manufactured, for example, as follows. Note that description of the same steps as in the manufacturing method of the substrate holding member 100 of the above-described embodiment is omitted, and different steps are described. In the method of manufacturing the substrate holding member 100 of the above-described embodiment, in FIG. was placed. Alternatively, as shown in FIG. 10(a), a land 172 is formed in the recess 511 of the lower compact 510.
, and the conductive member 132 is placed in the recess 511 on the lower surface of the central molded body 510 . After that, uniaxial hot press firing is performed in the same manner as the manufacturing method described above, and then blind hole processing is performed up to the land 172 in order to form the terminal 153 (see FIG. 10(b)). Thereby, the land 172 can be exposed. In addition, the land 172 and the conductive member 132 may be overlapped on the molded body 510 below. In that case, a two-stage concave portion may be provided at the position where both of the lower molded bodies 510 are arranged. In the process shown in FIG. 10(a), the contact point 172 formed of tungsten, molybdenum, or an alloy containing at least one of these is positioned below the land 172 and overlaps with the terminal 153 (see FIG. 3(b)). Pellets may be buried. When pellets are embedded, blind holes may be drilled up to the pellets.

Although the embodiments of the invention and their modifications have been described above, the technical scope of the invention is not limited to the scope of the above description. It will be apparent to those skilled in the art that various modifications or improvements may be made to the above embodiments. It is also clear from the description of the scope of claims that forms with such modifications or improvements can also be included in the technical scope of the present invention.

The execution order of each process in the manufacturing method shown in the specification and drawings is not specified in particular, and unless the output of the previous process is used in the subsequent process, in any order can be executed. For the sake of convenience, "first", "next", etc. are used for explanation, but it does not mean that it is essential to carry out in this order.

The present disclosure can also be implemented as the following forms.
[Application example 1]
a ceramic base having an upper surface and a lower surface vertically opposed to the upper surface;
a plurality of electrodes embedded in the ceramic base;
at least one conductive member embedded in the ceramic base;
a plurality of connecting portions each having one end electrically connected to one of the plurality of electrodes;
a land electrically connected to the at least one conductive member;
a plurality of terminals each having one end electrically connected to one of the plurality of electrodes, the at least one conductive member, or the land;
a resistance value between a connection portion connected to the at least one conductive member and a terminal is smaller than a resistance value between both ends of the plurality of electrodes;
the number of the plurality of terminals is less than twice the number of the plurality of electrodes;
the land overlaps one of the terminals in the vertical direction at a first position on a horizontal plane perpendicular to the vertical direction;
at a second position different from the first position on the horizontal plane,
A substrate holding member that overlaps one of the connection portions and one of the electrodes in the vertical direction, or overlaps the at least one conductive member in the vertical direction.
[Application example 2]
At least part of the plurality of electrodes and the at least one conductive member is a woven mesh of wires of at least one metal selected from tungsten, molybdenum, and alloys containing molybdenum and/or tungsten. A substrate holding member according to Application Example 1, characterized in that:
[Application Example 3]
The substrate holding member according to Application Example 1 or Application Example 2, wherein thicknesses of the plurality of electrodes and the conductive member are 0.03 mm to 0.2 mm excluding intersections of the wires.
[Application example 4]
The substrate holding member according to any one of application examples 1 to 3, wherein the ceramic base material contains aluminum nitride, and the land contains a metal having a melting point of 2000° C. or higher.
[Application example 5]
Further comprising a cylindrical shaft joined to the lower surface of the ceramic base,
The substrate holding member according to any one of application examples 1 to 4, wherein the plurality of terminals are arranged inside an outer diameter of the shaft.
[Application example 6]
a step of preparing a plurality of flat ceramic molded bodies containing aluminum nitride as a component;
providing a plurality of electrodes, at least one conductive member and lands;
arranging the plurality of electrodes on one surface of one of the ceramic molded bodies, and arranging one of the at least one conductive member on the other surface or one surface of another ceramic molded body; ,
locating a connecting portion between the plurality of electrodes and the at least one conductive member;
placing the land in contact with the conductive member;
one of the ceramic molded bodies and the other ceramic molded body so as to embed the plurality of electrodes, the at least one conductive member, and the land in another ceramic molded body and another ceramic molded body a step of laminating the body and the further ceramic molded body to form a laminated body;
Uniaxial hot press firing of the laminate;
exposing the land or exposing a portion of at least one conductive member overlapping the land in the vertical direction from the fired laminate.
[Application example 7]
Further, a tubular ceramic shaft containing aluminum nitride is provided on the lower surface of the laminate, in which portions of the plurality of terminals, the lands, or at least one conductive member that vertically overlap the lands are exposed. A method for manufacturing a substrate holding member according to Application Example 6, including a step of bonding.

Reference Signs List 100 Substrate holding member 110 Ceramic base material 121-123, 221-224 Electrode 131-133, 231-234 Conductive member 141-145, 241-247 Connection part 151-154, 251-255 Terminal 160 Shaft 171, 172, 271 ~273 Rand

Claims (7)

a ceramic base having an upper surface and a lower surface vertically opposed to the upper surface;
a plurality of electrodes embedded in the ceramic base;
at least one conductive member embedded in the ceramic base;
a plurality of connecting portions each having one end electrically connected to one of the plurality of electrodes;
a land electrically connected to the at least one conductive member;
a plurality of terminals each having one end electrically connected to one of the plurality of electrodes, the at least one conductive member, or the land;
a resistance value between a connection portion connected to the at least one conductive member and a terminal is smaller than a resistance value between both ends of the plurality of electrodes;
the number of the plurality of terminals is less than twice the number of the plurality of electrodes;
the land overlaps one of the terminals in the vertical direction at a first position on a horizontal plane orthogonal to the vertical direction;
at a second position different from the first position on the horizontal plane,
A substrate holding member that overlaps one of the connection portions and one of the electrodes in the vertical direction, or overlaps the at least one conductive member in the vertical direction. At least part of the plurality of electrodes and the at least one conductive member is a woven mesh of wires of at least one metal selected from tungsten, molybdenum, and alloys containing molybdenum and/or tungsten. A substrate holding member according to claim 1, characterized in that. 3. The substrate holding member according to claim 2, wherein thicknesses of the plurality of electrodes and the conductive member are 0.03 mm to 0.2 mm except for intersections of the wires. The substrate holding member according to any one of claims 1 to 3, wherein the ceramic base material contains aluminum nitride, and the land contains a metal having a melting point of 2000°C or higher. Further comprising a cylindrical shaft joined to the lower surface of the ceramic base,
4. The substrate holding member according to claim 1, wherein the plurality of terminals are arranged inside the outer diameter of the shaft. a step of preparing a plurality of flat ceramic molded bodies containing aluminum nitride as a component;
providing a plurality of electrodes, at least one conductive member and lands;
arranging the plurality of electrodes on one surface of one of the ceramic molded bodies, and arranging one of the at least one conductive member on the other surface or one surface of another ceramic molded body; ,
locating a connecting portion between the plurality of electrodes and the at least one conductive member;
placing the land in contact with the conductive member;
one of the ceramic molded bodies and the other ceramic molded body so as to embed the plurality of electrodes, the at least one conductive member, and the land in another ceramic molded body and another ceramic molded body a step of laminating the body and the further ceramic molded body to form a laminated body;
Uniaxial hot press firing of the laminate;
exposing the land or exposing a portion of at least one conductive member overlapping the land in the vertical direction from the fired laminate. Further, a tubular ceramic shaft containing aluminum nitride is provided on the lower surface of the laminate, in which portions of the plurality of terminals, the lands, or at least one conductive member that vertically overlap the lands are exposed. 7. The method of manufacturing a substrate holding member according to claim 6, comprising a step of bonding.

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