JP2023071674A - Imaging apparatus and moving body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shielding property against a radiation noise with a simple configuration.

SOLUTION: An imaging apparatus includes an imaging optical system 18, a second substrate 13, a second flat plate part 32, a placing part, and a first shielding part. An electronic part is mounted on the second substrate 13. The electronic part is arranged along the optical axis of the imaging optical system. The second flat plate part 32 faces the main surface of the second substrate 13. The placing part places the second substrate 13 away from the second flat plate part 32. The first shielding part is formed of a sheet metal for covering the side surface of the second substrate 13. The second flat plate part 32 and the placing part are formed by bending a second sheet metal 13.

SELECTED DRAWING: Figure 3

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to an imaging device and a moving object.

Electronic devices such as in-vehicle cameras are required to be miniaturized and perform various processes at high speed. 2. Description of the Related Art As circuit boards become multi-layered and highly integrated for miniaturization, radiation noise and heat generation of electronic devices on circuit boards are increasing. Therefore, a configuration has been proposed in which the entire side surface of the circuit board is covered with a shield member, and the circuit board and the heat transfer member are brought into contact with each other via a heat transfer member formed of a soft material such as silicone gel (see Patent Document 1). ).

JP 2011-259101 A

However, electronic devices are required to have shielding properties against radiation noise with a simple configuration.

Accordingly, an object of the present disclosure, which has been made in view of the problems of the conventional technology as described above, is to provide an imaging device and a moving body that have a simple configuration and shielding properties against radiation noise.

In order to solve the above-mentioned problems, the imaging device according to the first aspect is
an imaging optical system;
a second substrate on which electronic components are mounted, arranged along the optical axis of the imaging optical system;
a second flat plate portion facing the main surface of the second substrate;
a mounting portion for mounting the second substrate while being separated from the second flat plate portion;
a first shielding portion formed of sheet metal covering the side surface of the second substrate;
The second flat plate portion and the placement portion are formed by bending a second metal plate.

In addition, the moving object according to the second aspect is
an imaging optical system; a second substrate on which electronic components are mounted and arranged along the optical axis of the imaging optical system; a mounting portion on which a second substrate is placed while being separated from the second flat plate; The flat plate portion and the mounting portion are provided with an imaging device formed by bending a second metal plate.

According to the present disclosure configured as described above, it is possible to shield radiation noise with a simple configuration.

FIG. 2 is a layout diagram showing mounting positions in a moving object of the electronic device according to the present embodiment; 2 is a cross-sectional view taken along the optical axis of an imaging optical system, showing a schematic configuration of the electronic device of FIG. 1; FIG. FIG. 3 is a cross-sectional view of the electronic device of FIG. 1 rotated 90° about the optical axis from the cross-section of FIG. 2 ; 4 is a perspective view showing the appearance of the first substrate of FIGS. 2 and 3; FIG. FIG. 4 is a perspective view showing the appearance of a second substrate and a third substrate in FIGS. 2 and 3; FIG. 4 is a perspective view showing the appearance of the first metal plate in FIGS. 2 and 3; 7 is a plan development view of the first sheet metal in FIG. 6. FIG. FIG. 4 is a perspective view showing the appearance of the second metal plate in FIGS. 2 and 3; 9 is a plan development view of the second sheet metal in FIG. 8. FIG. FIG. 4 is a perspective view showing the appearance of the first housing of FIGS. 2 and 3; FIG. 4 is a perspective view showing the appearance of the second housing of FIGS. 2 and 3; FIG. FIG. 4 is a view showing the method of manufacturing the electronic device of FIGS. 2 and 3, showing a step of assembling the second board and the third board to the second sheet metal; 4 is a view showing the method of manufacturing the electronic device of FIGS. 2 and 3, showing another step of assembling the second board and the third board to the second sheet metal; FIG. 4 is a view showing the method of manufacturing the electronic device of FIGS. 2 and 3, showing still another step of assembling the second board and the third board to the second sheet metal; FIG. FIG. 4 is a view showing the method of manufacturing the electronic device of FIGS. 2 and 3, showing a step of assembling the second substrate and the third substrate to the first sheet metal; 4 is a view showing the method of manufacturing the electronic device of FIGS. 2 and 3, showing another step of assembling the second board and the third board to the first sheet metal; FIG. FIG. 4 is a view showing the method of manufacturing the electronic device of FIGS. 2 and 3, and showing a step of electrically connecting the first substrate and the second substrate; FIG. FIG. 4 is a diagram showing a method of manufacturing the electronic device of FIGS. 2 and 3, and showing a step of assembling a third substrate to a second housing; FIG.

An embodiment of a fixing structure to which the present invention is applied will be described below with reference to the drawings.

Specifically, an electronic device according to an embodiment of the present disclosure is, for example, an imaging device. As shown in FIG. 1, an electronic device 10 applied to the image capturing apparatus according to the present embodiment is mounted on a moving body 11, for example.

The mobile object 11 may include, for example, a vehicle, a ship, an aircraft, and the like. Vehicles may include, for example, automobiles, industrial vehicles, rail vehicles, utility vehicles, and fixed-wing aircraft that travel on runways, and the like. Motor vehicles may include, for example, cars, trucks, buses, motorcycles, trolleybuses, and the like. Industrial vehicles may include, for example, industrial vehicles for agriculture and construction, and the like. Industrial vehicles may include, for example, forklifts, golf carts, and the like. Industrial vehicles for agriculture may include, for example, tractors, tillers, transplanters, binders, combines, lawn mowers, and the like. Industrial vehicles for construction may include, for example, bulldozers, scrapers, excavators, mobile cranes, tippers, road rollers, and the like. Vehicles may include those that are powered by humans. Vehicle classification is not limited to the above example. For example, automobiles may include road-drivable industrial vehicles. Multiple classifications may contain the same vehicle. Vessels may include, for example, marine jets, boats, tankers, and the like. Aircraft may include, for example, fixed-wing and rotary-wing aircraft.

As shown in FIGS. 2 and 3, electronic device 10 includes first board 12 , second board 13 , third board 14 , first sheet metal 15 and second sheet metal 16 . The electronic device 10 may further include a heat transfer section 17 , an imaging optical system 18 , a first housing 19 and a second housing 20 .

As shown in FIG. 4, the first substrate 12 is flat. The first substrate 12 may be generally rectangular. As shown in FIGS. 2 and 3, the first substrate 12 mounts an imaging element 21 as an electronic component on the side opposite to the surface facing the first flat plate portion, which will be described later. The imaging element 21 is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and generates an image signal by capturing an optical image formed on a light receiving surface. The first substrate 12 may mount a first connector 22 for electrical connection with the second substrate 13 on the back surface of the surface on which the imaging device 21 is mounted.

As shown in FIG. 5, the second substrate 13 is flat. The second substrate 13 may be substantially rectangular. Electronic components 23 are mounted on at least one main surface of the second substrate 13 . The electronic component 23 drives the imaging element 21 or processes an image signal generated by the imaging element 21 . The second substrate 13 may have a second connector 24 mounted on one main surface for electrical connection with the first connector 22 .

The third substrate 14 is flat. The third substrate 14 may be substantially rectangular. An electronic component 23 is mounted on at least one main surface of the third substrate 14 . The electronic component 23 drives the imaging element 21 or processes an image signal generated by the imaging element 21 . The third substrate 14 may have a third connector 25 mounted on one main surface for electrical connection with the second housing 20 .

The third board 14 may be electrically connected to the second board 13 by a flexible board 26 . The third board 14 may have the second connector 24 and the third connector 25 mounted on the same main surface thereof with the entire flexible board 26 extended flat.

As shown in FIGS. 2 and 3, in the electronic device 10, the first substrate 12, the second substrate 13, and the third substrate 14 are stacked in the stacking direction so that their main surfaces face each other. positioned in order.

As shown in FIG. 6 , the first sheet metal 15 has a first flat plate portion 27 and a first shielding portion 28 . The first sheet metal 15 may further have a third shielding portion 29 .

The first flat plate portion 27 has a flat plate shape. The first plate portion 27 may be generally rectangular, wider than the first substrate 12 , the second substrate 13 and the third substrate 14 . As shown in FIGS. 2 and 3 , in electronic device 10 , first flat plate portion 27 is interposed between first substrate 12 and second substrate 13 . In the electronic device 10 , the main surface of the first flat plate portion 27 may be substantially parallel to the main surfaces of the first substrate 12 and the second substrate 13 .

In the electronic device 10 , the first flat plate portion 27 directly or indirectly abuts the electronic component 23 mounted on each of the first substrate 12 and the second substrate 13 . In the electronic device 10 , the first flat plate portion 27 indirectly abuts the imaging device 21 , which is an electronic component, via the heat dissipation sheet 30 and the first substrate 12 , for example. In the electronic device 10 , the first flat plate portion 27 indirectly abuts the electronic component 23 mounted on the second substrate 13 via the heat dissipation sheet 30 , for example. The heat-dissipating sheet 30 may be made of a soft, conformable material with relatively high thermal conductivity, such as filler-containing silicon rubber.

As shown in FIG. 6, the first flat plate portion 27 may have an opening op. The opening op may be larger than the first connector 22 when viewed from the direction perpendicular to the main surface of the first substrate 12 . As shown in FIG. 2, in the electronic device 10, the first connector 22 may be inserted through the opening op. In the electronic device 10, the second connector 24 may be connected to the first connector 22 inserted through the opening op.

As shown in FIG. 6 , the first shielding portion 28 is formed along the entire outer edge of the first flat plate portion 27 on the main surface side of the first flat plate portion 27 facing the first substrate 12 . is erected. As shown in FIGS. 2 and 3 , in the electronic device 10 , the first shielding portion 28 covers the entire side surface of the first substrate 12 .

As shown in FIG. 6 , the third shielding portion 29 is arranged parallel to the first flat plate portion 27 on the side opposite to the principal surface on which the first shielding portion 28 of the first flat plate portion 27 is erected. It may be erected along two sides. As shown in FIG. 2 , in the electronic device 10 , the third shielding portion 29 at least partially covers the side surfaces of the second substrate 13 and the third substrate 14 exposed from the second shielding portion described later. You can cover it. In the electronic device 10, the third shielding part 29 may cover the flexible substrate 26 when viewed from the direction perpendicular to the stacking direction.

The third shielding portion 29 may have a first leg portion 31 on the stacking direction side, in other words, on the end in the direction away from the first flat plate portion 27 . The first leg 31 may be parallel to the first plate 27 . The first leg portion 31 may overlap the first flat plate portion 27 when viewed from a direction perpendicular to the first flat plate portion 27 . As shown in FIG. 2 , in the electronic device 10 , the third shielding portion 29 may contact the heat transfer portion 17 at the first leg portion 31 .

The first sheet metal 15 is formed by bending a predetermined portion of a sheet metal, in other words, a metallic flat plate having a desired shape as shown in FIG. In addition, in FIG. 7, a straight line bent to the front side is indicated by a wavy line, and a straight line bent to the back side is indicated by a dashed line. Therefore, by extending the bent portion of the first metal plate 15 to make it flat, any portions of the first metal plate 15 are separated from each other without causing interference. The first sheet metal 15 may be made of a metal with high thermal conductivity such as copper.

As shown in FIG. 8 , the second sheet metal 16 has a second flat plate portion 32 and a second shielding portion 33 .

The second flat plate portion 32 has a flat plate shape. The second plate portion 32 may be substantially rectangular, wider than the first substrate 12 , the second substrate 13 , and the third substrate 14 and slightly narrower than the first plate portion 27 . As shown in FIGS. 2 and 3 , in the electronic device 10 , the second flat plate portion 32 is interposed between the second substrate 13 and the third substrate 14 . In the electronic device 10 , the main surface of the second flat plate portion 32 may be substantially parallel to the main surfaces of the second substrate 13 and the third substrate 14 .

In the electronic device 10 , the second flat plate portion 32 directly or indirectly abuts the electronic component 23 mounted on each of the second substrate 13 and the third substrate 14 . In the electronic device 10 , the second flat plate portion 32 indirectly abuts the electronic component 23 mounted on the second substrate 13 via the heat dissipation sheet 30 , for example. In the electronic device 10 , the second flat plate portion 32 indirectly contacts the electronic component 23 mounted on the third substrate 14 via the heat dissipation sheet 30 , for example. The heat-dissipating sheet 30 may be made of a soft, conformable material with relatively high thermal conductivity, such as filler-containing silicon rubber.

As shown in FIG. 8 , the second shielding portion 33 has a first one-side shielding portion 34 and a second one-side shielding portion 35 . The first one-side shielding portion 34 is erected along at least a portion of the outer edge of the second flat plate portion 32 on one main surface of the second flat plate portion 32 . The second one-side shielding portion 35 is erected along at least a portion of the outer edge of the second flat plate portion 32 on the other main surface of the second flat plate portion 32 .

The first one-side shielding portion 34 is, for example, erected along three sides other than one side of the second flat plate portion 32 on one main surface side (upper side in FIG. 8). The second one-side shielding part 35 is, for example, on the other main surface side (lower side in FIG. 8), and is opposed among the three sides on which the first one-side shielding part 34 is erected on one main surface side. It is erected along the two sides that do.

As shown in FIGS. 2 and 3 , in the electronic device 10 , the second shielding portion 33 covers at least part of the side surfaces of the second substrate 13 and the third substrate 14 . As shown in FIG. 2 , in the electronic device 10 , the second shielding part 33 covers part of the side surfaces of the second substrate 13 and the third substrate 14 and exposes other parts without covering them. good.

As shown in FIG. 8 , the second one-side shielding portion 35 may have a second leg portion 36 on the stacking direction side, in other words, on the end in the direction away from the second flat plate portion 32 . The second leg 36 may be parallel to the second plate 32 . The second leg portion 36 may overlap the second plate portion 32 when viewed in a direction perpendicular to the second plate portion 32 . As shown in FIG. 3 , in the electronic device 10 , the second shielding portion 33 may abut the heat transfer portion 17 at the second leg portion 36 .

The second sheet metal 16 is formed by bending a sheet metal, in other words, a metallic flat plate having a desired shape as shown in FIG. In addition, in FIG. 9, a straight line that bends toward the front side is indicated by a wavy line, and a straight line that bends toward the back side is indicated by a dashed line. Therefore, by extending the bent portion of the second metal plate 16 to form a flat surface, the portions of the second metal plate 16 are separated from each other without causing interference. The second sheet metal 16 may be made of a metal with high thermal conductivity such as copper.

As shown in FIGS. 2 and 3, the second sheet metal 16 may be positioned apart from the first sheet metal 15 over the entire surface without contact.

As shown in FIGS. 2 and 3 , the heat transfer section 17 is located on the stacking direction side of the first substrate 12 . The heat transfer section 17 may be located on the stacking direction side of the third substrate 14 . In the electronic device 10 , the heat transfer section 17 may contact the first metal sheet 15 and the second metal sheet 16 . As shown in FIG. 2 , the heat transfer portion 17 may contact the first metal plate 15 at the first leg portion 31 . As shown in FIG. 3 , the heat transfer portion 17 may contact the second metal plate 16 at the second foot portion 36 .

As shown in FIGS. 2 and 3 , the heat transfer section 17 may include a third metal plate 37 and a heat dissipation sheet 38 . The heat transfer portion 17 may contact the first metal plate 15 and the second metal plate 16 on the heat dissipation sheet 38 . The heat dissipation sheet 38 may contact the third metal plate 37 on a surface other than the surface contacting the first metal plate 15 and the second metal plate 16 . The heat-dissipating sheet 38 may be made of a flexible, conformable material with relatively high thermal conductivity, such as filler-containing silicon rubber. In the electronic device 10 , the third metal sheet 37 extends toward the stacking direction side from the surface in contact with the first metal sheet 15 and the second metal sheet 16 . The third sheet metal 37 may be made of a metal with high thermal conductivity such as copper.

The imaging optical system 18 is composed of optical elements such as lenses. The imaging optical system 18 is designed and formed so that optical characteristics such as the angle of view and the depth of field have desired values. The imaging optical system 18 forms a formed subject image on the light receiving surface of the imaging device 21 .

As shown in FIG. 10, the first housing 19 may have a tubular shape with a rectangular cross section. As shown in FIGS. 2 and 3, in the first housing 19, the optical axis of the imaging optical system 18 substantially coincides with the axis of the first housing 19, and the imaging optical system 18 is exposed from one opening. As such, the imaging optical system 18 may be accommodated. The first housing 19 may accommodate the first substrate 12 so that the imaging device 21 is fixed at a predetermined position with respect to the imaging optical system 18 and in a predetermined orientation. The first housing 19 accommodates the second substrate 13, the third substrate 14, the first metal plate 15, and the second metal plate 16 so as to satisfy the configuration described above for the first substrate 12. You can

As shown in FIG. 11, the second housing 20 may have a shape having a flat plate portion and a quadrangular prism extending perpendicularly to the main surface of the flat plate portion. The second housing 20 may have a third sheet metal 37 as the heat transfer section 17 . The second housing 20 may have a fourth connector 39 that can be mated with the third connector 25 . As shown in FIGS. 2 and 3, the second housing 20 has its flat plate portion sealed in the opening of the first housing 19 at the end opposite to the end where the imaging optical system 18 is exposed. may be worn.

Next, a method for manufacturing the electronic device 10 will be described below.

As shown in FIG. 12, the third substrate 14 is inserted into a space sp1 defined by the second flat plate portion 32 and the second one-sided shielding portion 35 of the second metal plate 16. As shown in FIG. The third substrate 14 is inserted into the space sp1 from the outer edge side of the second flat plate portion 32 where the first one-side shielding portion 34 is not provided. The third board 14 is inserted so that the main surface opposite to the main surface on which the third connector 25 is provided faces the second flat plate portion 32 . The third substrate 14 is inserted into the space sp1 from the side opposite to the side on which the flexible substrate 26 is provided.

As shown in FIG. 13, the third substrate 14 is attached to the second flat plate portion 32 while being inserted. A heat radiation sheet 30 may be used for attaching the third substrate 14 to the second flat plate portion 32 . As shown in FIG. 14 , the flexible substrate 26 is folded back and the second substrate 13 is attached to the second flat plate portion 32 . A heat radiation sheet 30 may be used for attaching the second substrate 13 to the second flat plate portion 32 .

As shown in FIG. 15, the second sheet metal 16 to which the second substrate 13 and the third substrate 14 are attached is defined as the first flat plate portion 27 and the third shielding portion 29 of the first sheet metal 15. is inserted into the space sp2. The second sheet metal 16 is inserted so that the second substrate 13 faces the first flat plate portion 27 .

As shown in FIG. 16, the second metal plate 16 is connected through the second substrate 13 while the second connector 24 of the second substrate 13 is inserted into the opening op of the first flat plate portion 27 . is attached to the first flat plate portion 27 by pressing. A heat radiation sheet 30 may be used for attaching the second substrate 13 to the first flat plate portion 27 .

As shown in FIG. 17, the second substrate 13 assembled with the first metal plate 15 and the second metal plate 16 is attached to the first connector 22 by fitting the second connector 24 to the first connector 22 . is connected to the substrate 12 of the Before the connection, the first substrate 12 is fixed to the lens barrel 40 housing the imaging optical system 18 with a heat transfer member 41 such as a sheet metal interposed therebetween. For fixing the first substrate 12 to the lens barrel 40, for example, bonding with an adhesive, fastening with screws, or the like is applied.

As shown in FIG. 18, with the second board 13 connected to the first board 12, the third board 14 is connected by fitting the third connector 25 to the fourth connector 39 to form the third board. 2 housing 20 . After that, the first housing 19 is placed over the imaging optical system 18 , the first substrate 12 , the second substrate 13 , the third substrate 14 , the first metal plate 15 and the second metal plate 16 . The electronic device 10 is manufactured by fixing the first housing 19 to the second housing 20 while covering the first housing 19 . The first housing 19 and the second housing 20 are fixed by, for example, welding, bonding with an adhesive, fastening with screws, or the like.

In the electronic device 10 of the present embodiment having the configuration as described above, the imaging element 21 and the second substrate 13 mounted on the first substrate 12 are interposed between the first substrate 12 and the second substrate 13. has a first flat plate portion 27 that indirectly contacts the electronic component 23 mounted on the . With such a configuration, the electronic device 10 includes an imaging element 21 mounted on the first substrate 12 and an electronic component 23 mounted on the second substrate 13, which serve as heat sources, and generally heat-conductive heat-dissipating sheets 30. Since the high first flat plate portion 27 is adjacent, heat dissipation is improved as compared with the structure in which only the heat dissipation sheet 30 is interposed. Further, the electronic device 10 is interposed between the second substrate 13 and the third substrate 14 and indirectly contacts the electronic components 23 mounted on the second substrate 13 and the third substrate 14 respectively. 2 flat plate portions 32 are provided. With such a configuration, the electronic device 10 includes the electronic components 23 mounted on the second substrate 13 and the third substrate 14, which serve as heat sources, and the second flat plate, which generally has higher heat conductivity than the heat dissipation sheet 30. Since the portions 32 are close to each other, heat dissipation is improved as compared with a configuration in which only the heat dissipation sheet 30 is interposed.

Furthermore, the electronic device 10 according to this embodiment has a first shielding portion 28 that covers the entire side surface of the first substrate 12 . With such a configuration, the electronic device 10 can shield radiation noise from the first substrate 12 or the electronic components 23 mounted on the first substrate 12 . The electronic device 10 also has a second shielding portion 33 that covers at least part of the side surfaces of the second substrate 13 and the third substrate 14 . With such a configuration, the electronic device 10 can shield radiation noise from the electronic components 23 mounted on the second substrate 13 and the third substrate 14, respectively.

Furthermore, in the electronic device 10 according to this embodiment, the first metal plate 15 has the first flat plate portion 27 and the first shielding portion 28 . Also, in the electronic device 10 , the second metal plate 16 has the second flat plate portion 32 and the second shielding portion 33 . With such a configuration, in the electronic device 10, the first flat plate portion 27 and the first shielding portion 28 having the above-described configuration, and the second flat plate portion 32 and the second shielding portion 33 having the above-described configuration are , and can be manufactured in a simple configuration without processes such as welding.

Therefore, as described above, the electronic device 10 according to the present embodiment can further improve heat dissipation with a simple configuration while shielding radiation noise.

Further, in the electronic device 10 according to the present embodiment, the first metal sheet 15 and the second metal sheet 16 are positioned separately. With such a configuration, the electronic device 10 can reduce heat transfer between the first metal plate 15 and the second metal plate 16 compared to a configuration in which they are in contact with each other. Therefore, in the electronic device 10, in a configuration in which one of the first metal sheet 15 and the second metal sheet 16 is close to a part that is greatly affected by high temperature, even if the temperature of the other is increased, the temperature from the other to the other is increased. can reduce the heat transfer of

Further, in the electronic device 10 according to the present embodiment, the second shielding portion 33 partially covers the side surfaces of the second substrate 13 and the third substrate 14, and the third shielding portion 29 of the first metal plate 15 covers at least the portion exposed from the second shielding portion 33 . With such a configuration, the electronic device 10 connects the second substrate 13 and the third substrate 14 by wiring such as the flexible substrate 26 extending from the side surface of each of the second substrate 13 and the third substrate 14 . Even with such a configuration, the electronic components mounted on the second substrate 13 and the third substrate 14 can be easily attached to the second metal plate 16 while facilitating the attachment of the second substrate 13 and the third substrate 14 to the second metal plate 16. 23 radiation noise shielding.

Further, in the electronic device 10 according to this embodiment, the flexible substrate 26 connecting the second substrate 13 and the third substrate 14 is covered with the third shielding portion 29 . With such a configuration, the electronic device 10 uses the flexible substrate 26, which contributes to the simplification of manufacturing and the reduction of the manufacturing cost. It is possible to suppress a decrease in shielding performance against radiation noise.

The electronic device 10 according to the present embodiment also includes a heat transfer section 17 located on the stacking direction side of the first substrate 12 and in contact with the first metal sheet 15 and the second metal sheet 16 . With such a configuration, the electronic device 10 transfers heat generated in the electronic components 23 mounted on the first substrate 12, the second substrate 13, and the third substrate 14 in the stacking direction. obtain. Therefore, even if the electronic device 10 has a configuration in which a component, such as the imaging optical system 18 made of resin, that is greatly affected by high temperature is positioned in the direction opposite to the stacking direction, the component can be prevented from becoming overheated.

Further, in the electronic device 10 according to the present embodiment, the third shielding portion 29 and the second shielding portion 33 contact the heat transfer portion 17 at the first leg portion 31 and the second leg portion 36, respectively. . With such a configuration, the electronic device 10 according to the present embodiment can increase the contact area between each of the first metal sheet 15 and the second metal sheet 16 and the heat transfer section 17 . Therefore, the electronic device 10 can improve the heat transfer to the heat transfer portion 17 of the heat generated in the electronic components 23 mounted on the first board 12 , the second board 13 , and the third board 14 .

In addition, in the electronic device 10 according to the present embodiment, the first board 12 and the second board 13 are provided with the first connector 22 and the second connector 22 that are inserted through the opening op formed in the first flat plate portion 27 . are electrically connected via the connector 24 of the . With such a configuration, the electronic device 10 can be formed with the first shielding portion 28 and the third shielding portion 29 covering the entire side surface of at least one of the first substrate 12 and the second substrate 13. . Therefore, the electronic device 10 can cover at least one side surface of the first substrate 12 and the second substrate 13 entirely by using the single first metal plate 15 without using a plurality of metal plates. obtain.

Although the present invention has been described with reference to the drawings and examples, it should be noted that various variations and modifications will be readily apparent to those skilled in the art based on this disclosure. Therefore, it should be noted that these variations and modifications are included within the scope of the present invention.

For example, in the present embodiment, the second substrate 13 and the third substrate 14 are configured to be connected via the flexible substrate 26, but an opening is formed in the second flat plate portion 32 to allow the opening to pass through. may be connected by a connector through In such a configuration, the second shielding portion 33 may cover the sides of the second substrate 13 and the third substrate 14 all around. Since the side surfaces of the second substrate 13 and the third substrate 14 are entirely covered, the third shielding portion 29 partially covers the side surfaces of the second substrate 13 and the third substrate 14. It doesn't have to be. In this way, a plurality of substrates positioned side by side in the stacking direction, a flat plate portion interposed between two substrates adjacent to each other among the plurality of substrates, and the side surfaces of the two substrates are arranged all around. As described above, an electronic device having a sheet metal having a shielding portion that covers the entire surface of the electronic device can further improve heat dissipation with a simple configuration while shielding against radiation noise, as described above.

REFERENCE SIGNS LIST 10 electronic device 11 moving body 12 first substrate 13 second substrate 14 third substrate 15 first sheet metal 16 second sheet metal 17 heat transfer section 18 imaging optical system 19 first housing 20 second housing Body 21 Imaging element 22 First connector 23 Electronic component 24 Second connector 25 Third connector 26 Flexible board 27 First flat plate portion 28 First shielding portion 29 Third shielding portion 30 Heat dissipation sheet 31 First shield Foot 32 Second flat plate 33 Second shield 34 First one-sided shield 35 Second one-sided shield 36 Second foot 37 Third metal plate 38 Radiation sheet 39 Fourth connector 40 Lens barrel 41 heat transfer member op opening sp1 space defined by second flat plate portion and second one-side shielding portion sp2 space defined by first flat plate portion and third shielding portion

Claims (6)

an imaging optical system;
a second substrate on which electronic components are mounted, arranged along the optical axis of the imaging optical system;
a second flat plate portion facing the main surface of the second substrate;
a mounting portion for mounting the second substrate while being separated from the second flat plate portion;
a first shielding portion formed of sheet metal covering the side surface of the second substrate;
The imaging device, wherein the second flat plate portion and the placement portion are formed by bending a second metal plate. a third board on which an electronic component is mounted, arranged opposite to the second board with the second flat plate part interposed therebetween;
The imaging device according to Claim 1, further comprising: a second shielding portion formed of a sheet metal that covers the side surface of the third substrate. The imaging device according to claim 2, wherein the second shielding portion is formed by bending the second sheet metal. 4. The imaging device according to claim 3, further comprising: a first metal sheet forming a third shielding portion defining a space for accommodating the second metal sheet. further comprising a flexible substrate electrically connecting the second substrate and the third substrate;
The imaging device according to claim 4, wherein the third shielding section covers the flexible substrate. A moving object comprising the imaging device according to any one of claims 1 to 5.

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