JP2022168760A - Light emitting device, electrical equipment, and substrate for light emitting device - Google Patents

Abstract

An object of the present invention is to provide a light emitting device having an LED light source which has a simple structure and is highly visible when mounted on a substrate. A light-emitting diode (LED) chip (1) having a light-emitting part (11) on a substrate mounting surface side, and an insertion hole into which the light-emitting part (11) is inserted when the LED chip (1) is mounted. A transparent substrate (2) having an LED mounting region (21) provided with (23), and a light blocking solder resist layer (3) provided on the surface of the transparent substrate (2), The transparent substrate (2) has a light emitting area (22) adjacent to the LED mounting area (21) and not provided with the solder resist layer (3) on the surface of the transparent substrate (2). Device. [Selection drawing] Fig. 1

Description

The present invention relates to a light-emitting device, and for example, to a light-emitting device using a light-emitting diode as a light source.

Patent Literature 1 describes a spacer used when soldering a lead wire of a light emitting diode (LED) to a circuit of a printed circuit board. According to the spacer described in this document, it is possible to easily mount the light emitting diode, to avoid resin swelling around the base of the lead wire of the light emitting diode, and to eliminate the floating of the light emitting diode. A light-emitting diode (LED) described in US Pat.

Japanese Patent Application Laid-Open No. 2006-324436

Bullet-shaped LEDs are used in electrical equipment, for example, as warning lights that light up to notify changes in the state of the electrical equipment. A bullet-shaped LED is composed of a bullet-shaped light-emitting portion and two leads extending straight from the light-emitting portion. Such bullet-shaped LEDs can be electrically connected to other surface-mounted electronic components (SMDs) of electrical equipment by mounting them on a substrate inside the housing using lead portions. By providing the light-emitting portion protruding from the housing of the electrical equipment while being mounted on the substrate using the lead portion, the state change of the electrical equipment can be detected through the highly visible light-emitting portion.

However, when the bullet-shaped LED is mounted on the substrate, a spacer is required in addition to the bullet-shaped LED, as described in Cited Document 1. During manufacturing, it is necessary to manually mount the bullet-shaped LED and the spacer and solder the leads to the substrate in a separate step from the process of mounting other SMDs to the substrate.

FIG. 9 is a perspective view of a portion of an electrical device provided with a board on which bullet-shaped LEDs are mounted, and FIG. 10 is a perspective view showing the housing of FIG. 9 through. As shown in FIG. 9, when the bullet-shaped LED 60 having the light-emitting portion 61 projecting from the housing 41 is mounted on the board, a space including the spacer 62 is required for arranging the LED. This does not meet the recent demand for miniaturization of electrical components. In this way, in order to improve the visibility when attached to the substrate, the structure has been inevitably complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of the conventional problems described above, and an object of the present invention is to provide a light-emitting device having an LED light source which has a simple structure and is highly visible when mounted on a substrate. be.

A light-emitting device according to a typical embodiment of the present invention includes a light-emitting diode (LED) chip having a light-emitting portion on a substrate mounting surface side, and an insertion hole into which the light-emitting portion is inserted when the LED chip is mounted. A transparent substrate having an LED mounting area provided thereon, and a light-blocking solder resist layer provided on a surface of the transparent substrate, the transparent substrate being adjacent to the LED mounting area, the transparent substrate has a light emitting region on the surface of which the solder resist layer is not provided.

According to the light-emitting device of the present invention, it is possible to provide a light-emitting device having an LED light source with a simple structure and high visibility when mounted on a substrate.

1 is a perspective view of a light emitting device according to this embodiment; FIG. It is a figure which shows the structure seen from the front of the light-emitting device which concerns on this embodiment. It is a figure which shows the structure seen from the back surface of the light-emitting device which concerns on this embodiment. FIG. 4 is a plan view showing how light is diffused when the light-emitting portion of the LED chip is in a light-emitting state; FIG. 5 is a cross-sectional view taken along line AA of FIG. 4 in FIG. 4; 1 is an external view showing an example of an electric device equipped with a light emitting device of this embodiment; FIG. FIG. 7 is a perspective view of a portion of FIG. 6; FIG. 8 is a view in which the casing of FIG. 7 is transparently displayed; 1 is a perspective view of a portion of an electrical device with a board on which bullet-shaped LEDs are mounted; FIG. FIG. 10 is a perspective view in which the housing of FIG. 9 is transparently displayed;

1. Outline of Embodiment First, an outline of a representative embodiment of the invention disclosed in the present application will be described. In the following description, as an example, the reference numerals on the drawing corresponding to the constituent elements of the invention in FIG. 1 are described with parentheses.

[1] A light-emitting device according to a typical embodiment includes a light-emitting diode (LED) chip (1) having a light-emitting portion (11) on the substrate mounting surface side, and when the LED chip (1) is mounted A transparent substrate (2) having an LED mounting area (21) provided with an insertion hole (23) for inserting the light emitting part (11), and a light blocking solder provided on the surface of the transparent substrate (2). and a resist layer (3), wherein the transparent substrate (2) is provided with the solder resist layer (3) on the surface of the transparent substrate (2) adjacent to the LED mounting area (21). It has a free light emitting area (22).

According to this aspect, unlike the bullet-shaped LED, no spacer is required when mounting the LED on the substrate, so the configuration can be simplified. On the other hand, since the light emitting region can be provided conspicuously outside the housing while mounted on the substrate, the light diffused from the light emitting portion of the LED chip can be observed with high visibility.

[2] In the light-emitting device described in [1] above, the transparent substrate may have a through hole provided adjacent to the LED mounting area on the side opposite to the light emitting area.

According to this aspect, the light diffused from the light emitting portion of the LED chip mounted in the LED mounting area and propagated through the transparent substrate on the side opposite to the light emitting area is reflected by the through hole. Therefore, the light emitted from the light emitting section is emitted to the outside of the transparent substrate after being propagated to the light emitting area, so that the light emitted from the light emitting area can be made stronger.

[3] In the light emitting device described in [2] above, the inner wall surface of the through hole may be covered with metal.

According to this aspect, the light incident from the transparent substrate toward the through hole can be more reliably reflected inside the transparent substrate by the metal.

[4] In the light emitting device described in [2] or [3] above, the through hole may be formed in an elongated hole shape having a length corresponding to the light emission region.

According to this aspect, the elongated hole shape can reflect the light propagating inside the transparent substrate 2 like a reflector so that the light can be gathered in the light emitting area.

[5] In the light emitting device described in [1] above, the LED mounting region may be surrounded by the light emitting region.

According to this aspect, more light can be emitted from the light emitting region because the LED can be mounted in the light emitting region.

[6] In the light-emitting device described in any one of [1] to [5] above, the light emitting region may be formed as a substrate region protruding from the end surface of the transparent substrate.

According to this aspect, by forming the light emitting region as the substrate region protruding from the end face, it is possible to make the portion of the light emitting device that emits light to the outside conspicuous.

[7] An electrical device according to a representative embodiment is mounted on the light emitting device according to any one of [1] to [6] above, and the transparent substrate of the light emitting device, and is electrically connected to the LED chip. and a housing that accommodates the light-emitting device mounted with the surface-mounted electronic component with the light-emitting region of the transparent substrate exposed.

According to this aspect, it is possible to provide an electric device having a light-emitting device having an LED light source that has a simple configuration and is highly visible when mounted on a substrate.

[8] A substrate for a light-emitting device according to a representative embodiment includes a transparent substrate having an LED mounting area provided with an insertion hole for inserting a light-emitting portion of the LED chip when the LED chip is mounted; a solder resist layer provided on a surface of the transparent substrate, the transparent substrate having a light emission region adjacent to the LED mounting region and having no solder resist layer provided on the surface of the transparent substrate. have.

According to this aspect, it is possible to obtain a transparent substrate that is simple in structure and used in manufacturing a light-emitting device having an LED light source that is highly visible when mounted on the substrate.

2. Specific Examples of Embodiments Specific examples of embodiments of the present invention will be described below with reference to the drawings. In the following description, constituent elements common to each embodiment are denoted by the same reference numerals, and repeated descriptions are omitted. Also, it should be noted that the drawings are schematic, and the relationship of dimensions of each element, the ratio of each element, and the like may differ from reality. Even between the drawings, there are cases where portions with different dimensional relationships and ratios are included.

FIG. 1 is a perspective view of a light emitting device according to this embodiment. FIG. 2 is a diagram showing the configuration of the light emitting device according to this embodiment viewed from the front, and FIG. 3 is a diagram showing the configuration of the light emitting device according to this embodiment viewed from the back.

As shown in FIGS. 1 to 3, the light emitting device 10 of the present embodiment includes a light emitting diode (Light Emitting Diode, hereinafter simply referred to as LED) chip 1, a transparent substrate 2, and a and a solder resist layer 3 . Note that a surface mount electronic component (SMD: Surface Mount Device) 25 is mounted on the transparent substrate 2 in the light emitting device 10 of FIG.

The LED chip 1 has a support substrate 12 and a light emitting portion 11, and a light emitting diode (LED) chip formed so that the light emitting portion 11 diffuses light on the same surface as the substrate mounting surface can be used. The LED chip 1 diffuses light from the light emitting portion 11 when a predetermined voltage is applied. The LED chip 1 can be mounted by fixing the support substrate 12 to the transparent substrate 2 using a bonding material such as solder on the substrate mounting surface. A bullet-shaped LED requires a spacer when mounted, but the LED chip 1 does not require a separate part such as a spacer. Therefore, it is possible to reduce the number of parts and the space required for mounting compared to the bullet-shaped LED.

The transparent substrate 2 is a flat substrate made of a light-transmitting member such as glass epoxy resin. A light blocking solder resist layer 3 is provided on the surface of the transparent substrate 2 . The solder resist layer 3 is an insulating film that protects the circuit pattern provided on the surface of the transparent substrate 2 . Since the transparent substrate 2 is made of a light transmissive member, light can propagate inside. Since the solder-resist layer 3 is light blocking, light propagating inside the transparent substrate 2 is prevented from being emitted from the surface of the transparent substrate 2 in the region where the solder-resist layer 3 is provided on the surface of the transparent substrate 2 . can be

The transparent substrate 2 has an LED mounting area 21 and a light emission area 22 . The LED mounting area 21 is an area where the LED chip 1 is mounted, and is provided with an insertion hole 23 into which the light emitting portion 11 is inserted when the LED chip 1 is mounted. When the LED chip 1 is mounted, the light emitting portion 11 inserted into the insertion hole 23 of the LED mounting area 21 is surrounded by the transparent substrate 2 . The light diffused from the light emitting portion 11 inserted into the insertion hole 23 enters the surrounding transparent substrate 2 and propagates through the transparent substrate 2 . The shape of the insertion hole 23 is preferably formed along the outline of the light emitting portion 11 of the LED chip 1 . Since air does not intervene at the interface with the transparent substrate 2 , diffused light can easily enter the transparent substrate 2 .

The light emission area 22 is an area where the solder resist layer 3 is not provided on the surface of the transparent substrate 2 and is adjacent to the LED mounting area 21 . In this specification, "adjacent to the LED mounting area 21" is not limited to the case where it is provided in contact with the LED mounting area 21, but is provided in the vicinity of the LED mounting area 21 without being in contact with the LED mounting area 21 as in the present embodiment. It also includes being In this embodiment, there is a region where the solder resist layer 3 is provided on the surface of the transparent substrate 2 between the LED mounting region 21 and the light emission region 22 . Light propagating through the transparent substrate 2 is emitted from the surface of the transparent substrate 2 in the light emitting region 22 where the solder resist layer 3 is not provided on the surface of the transparent substrate 2 .

In this embodiment, the light emission area 22 is formed as a substrate area protruding from the end surface of the transparent substrate 2 . By forming the light emitting region 22 as a substrate region protruding from the end surface, the light emitting device 10 can have a shape that makes the portion that emits light to the outside stand out.

The transparent substrate 2 further has a through hole 24 provided adjacent to the LED mounting area 21 on the side opposite to the light emission area 22 with respect to the LED mounting area 21 . The through hole 24 is formed at a substrate position surrounding the LED mounting area 21 on the side opposite to the light emitting area 22 . In the illustrated example, the through holes 24 are formed as a plurality of round holes. For example, the glass epoxy resin forming the transparent substrate 2 has a refractive index of 1.55 to 1.61, and the air existing in the cavity inside the through hole 24 has a refractive index of about 1. Light traveling from the epoxy resin to air, which has a low refractive index, is reflected at the interface between the two substances. Based on the difference in refractive index between the glass epoxy resin forming the transparent substrate 2 and the air existing in the cavity inside the through hole 24 , the through hole 24 reflects light on the wall surface of the through hole 24 to form the light emitting section 11 . light diffused from can be prevented from propagating to the side opposite the light emitting region 22 .
The inner wall surface of the through hole 24 may be further covered with a metal (not shown). Metals that can be used include, for example, copper and aluminum, but are not limited as long as they have high light reflectance. The through-hole 24 whose inner wall surface is covered with metal can function to reflect light incident on the through-hole 24 from inside the transparent substrate 2 with a higher reflectance than in the case of a cavity due to the metal on the inner wall surface. can.

In the light-emitting device 10 of this embodiment, propagation of light diffused from the light-emitting portion 11 of the LED chip 1 will be described.

FIG. 4 is a plan view showing how light is diffused when the light-emitting portion 11 of the LED chip 1 is in a light-emitting state, and FIG. 5 is a cross-sectional view taken along the line AA in FIG. In FIG. 4, the configuration on the opposite side of the substrate is indicated by broken lines so as to clarify the positional relationship. In FIG. 5, the side shown in FIG. 2 is arranged on the top and the side shown in FIG. 3 is arranged on the bottom.

In the light-emitting device 10 of this embodiment, the light-emitting portion 11 of the LED chip 1 is inserted into the insertion hole 23 of the transparent substrate 2 , so most of the light diffused from the light-emitting portion 11 passes through the transparent substrate 2 . spread through. At this time, some light diffuses from the inside of the transparent substrate 2 toward the surface. not diffuse. However, in the light emission region 22, since the solder resist layer 3 is not provided on the surface of the transparent substrate 2, light is emitted from the surface. That is, light diffused from the light emitting portion 11 of the LED chip 1 propagates to the light emission region 22 inside the transparent substrate 2 and is diffused from the surface of the light emission region 22 .

Further, the transparent substrate 2 is provided with a through hole 24 provided adjacent to the LED mounting area 21 on the side opposite to the light emitting area 22 with respect to the LED mounting area 21 . In a region opposite to the light emission region 22 with respect to the LED mounting region 21 , the light diffused from the light emitting portion 11 of the LED chip 1 and propagated through the transparent substrate 2 is reflected by the through hole 24 . Since the light is reflected by the through-holes 24 , the light propagating inside the transparent substrate 2 cannot propagate in the plane direction of the substrate in the area opposite to the light emitting area 22 . Therefore, most of the light diffused from the light emitting portion 11 of the LED chip 1 and propagated through the transparent substrate 2 is emitted outside from the surface of the transparent substrate 2 in the light emission region 22 .

According to the light emitting device of this embodiment, light is emitted from the light emission area 22 provided on the end surface of the substrate. do not do. On the other hand, the light diffused from the light emitting part 11 is confined inside the transparent substrate 2 and propagates to the light emission region 22. The light is emitted from the light emission region 22 away from the LED chip. It becomes an LED light source with high visibility even in the state.

Next, electric equipment equipped with the light emitting device of this embodiment will be described.

FIG. 6 is an external view showing an example of an electric device equipped with the light emitting device of this embodiment. 7 is a perspective view of a portion of FIG. 6. FIG. FIG. 8 is a transparent view of the housing of FIG.

FIG. 6 shows the voltage measuring device 30, the protection adapter 40, and the connection terminals 50. As shown in FIG. A connection terminal 50 is connected to the voltage measuring device 30 via a protection adapter 40, and a predetermined voltage is applied to the LED chip 1 when the voltage input via the protection adapter 40 exceeds a predetermined value. Then, the light emitting portion 11 of the LED chip 1 emits light.

As shown in FIG. 8, the light emitting device 10 mounted with the surface mount electronic component 25 including the LED chip 1 is accommodated in the housing 41 with the light emission region 22 of the transparent substrate 2 exposed. Even though the housing 41 of the protective adapter 40 covers the area other than the light emitting area 22 , light is emitted from the light emitting area 22 exposed from the housing 41 . Therefore, in the housing 41 of the protective adapter 40, the light emitting region 22 exposed to the outside of the housing detects that the voltage input via the protective adapter 40 has exceeded a predetermined value. It can be notified by emitting light.

In the electrical equipment equipped with the light emitting device of this embodiment, the light emission region 22 can be configured as part of the transparent substrate 2 . Therefore, unlike the bullet-shaped LED, it is not attached to the substrate, so even if force is applied to the light emitting portion exposed to the outside of the housing, it is unlikely to break.

A description will be given of the process of manufacturing an electronic device equipped with the light emitting device of the present embodiment described with reference to FIGS.

First, a transparent substrate 2 having a solder resist layer 3 on its surface is prepared. The transparent substrate 2 may have an LED mounting area 21 provided with an insertion hole 23 into which the light emitting portion 11 of the LED chip 1 is inserted when the LED chip 1 is mounted. A necessary circuit pattern may be formed on the surface of the transparent substrate 2 in addition to the solder resist layer 3 . In this embodiment, the solder resist layer 3 that is not formed on the light emission region 22 can be used.

By mounting a surface mount electronic component 25 including the LED chip 1 on the surface of the prepared transparent substrate 2, the light emitting device 10 of the present embodiment is obtained.

Furthermore, the obtained light-emitting device 10 is incorporated in the housing 41 of the electrical equipment, and the product is assembled to complete the electrical equipment.

Thus, the light-emitting device 10 of this embodiment can be mounted in the same process as the other surface mount electronic component 25 is mounted. Mounting of the surface-mounted component including the LED chip 1 can be performed by an automatic machine, so that manpower is not required and the man-hours can be reduced as compared with the mounting of the bullet-shaped LED.

As described above, according to the present embodiment, it is possible to manufacture a light-emitting device having an LED light source that has a simple configuration and is highly visible when mounted on a substrate.

(Modification of embodiment)
Although the light emitting devices of the above embodiments have been described with specific examples, the present invention is not limited to these, and various modifications can be adopted. For example, although the through holes 24 are formed by a plurality of round holes, the shape and number of the holes are not limited, and for example, they may be formed in the shape of one elongated hole. Specifically, if the through hole 24 is formed in a long hole shape having a length corresponding to the light emitting area 22, the light propagating inside the transparent substrate 2 is reflected by the long hole shape like a reflector. can be used to concentrate light in the light emitting region.

In the above embodiment, the light emitting region 22 is formed as a substrate region protruding from the substrate end face of the transparent substrate 2, but it is not limited to this. A region not provided with the solder resist layer 3 may be provided on the substrate end face of the transparent substrate 2 to serve as the light emitting region 22 .

In the above embodiment, the LED mounting area 21 has been described as an example in which a portion of the substrate edge side is adjacent to the light emitting area 22, but the present invention is not limited to this. The LED mounting area 21 can be formed entirely adjacent to the light emitting area 22 . In this case, the LED mounting area 21 can be formed within the light emitting area 22 . That is, the LED mounting area 21 can be formed so as to be surrounded by the light emitting area 22 . Since the LEDs can be implemented within the light emitting region, more light can be emitted from the light emitting region.

In the above embodiments, the protective adapter 40 was described as an example of an electrical device equipped with a light emitting device, but the present invention is not limited to this. For example, the voltage measuring device 30 may be configured as a voltage measuring device with a built-in protection adapter 40 . Further, in the above embodiment, an example in which the protection adapter 40 is attached to the voltage measuring instrument 30 has been described. may be attached to or built into the measuring instrument of Furthermore, the function of the electrical equipment is not limited to the function of the protection adapter 40 either.

1 LED chip, 2 transparent substrate, 3 solder resist layer, 10 light emitting device, 11 light emitting part, 12 support substrate, 21 LED mounting area, 22 light emission area, 23 insertion hole, 24 through hole, 25 surface mount electronic component, 30 Voltage measuring instrument 40 Protective adapter 41 Case 42 Terminal insertion part 50 Connection terminal 60 Bullet-shaped LED 61 Light emitting part 62 Spacer

Claims (8)

a light-emitting diode (LED) chip having a light-emitting portion on the substrate mounting surface side;
a transparent substrate having an LED mounting area provided with an insertion hole for inserting the light emitting portion when the LED chip is mounted;
and a light blocking solder resist layer provided on the surface of the transparent substrate,
The transparent substrate has a light emission area adjacent to the LED mounting area, the surface of the transparent substrate being free of the solder resist layer.
Luminescent device. The light emitting device according to claim 1,
The transparent substrate has a through hole provided adjacent to the LED mounting area on the side opposite to the light emitting area.
Luminescent device. The light emitting device according to claim 2,
an inner wall surface of the through-hole is covered with metal;
Luminescent device. The light emitting device according to claim 2 or 3,
The through hole is formed in an elongated hole shape having a length corresponding to the light emission region,
Luminescent device. The light emitting device according to claim 1,
the LED mounting area is surrounded by the light emitting area;
Luminescent device. The light emitting device according to any one of claims 1 to 5,
wherein the light emitting region is formed as a substrate region protruding from an end surface of the transparent substrate;
Luminescent device. a light emitting device according to any one of claims 1 to 6;
a surface mount electronic component mounted on the transparent substrate of the light emitting device and electrically connected to the LED chip;
a housing that houses the light-emitting device on which the surface-mounted electronic component is mounted, with the light-emitting region of the transparent substrate exposed;
electrical equipment. a transparent substrate having an LED mounting area provided with an insertion hole for inserting the light emitting portion of the LED chip when the LED chip is mounted;
and a solder resist layer provided on the surface of the transparent substrate,
The transparent substrate has a light emission area adjacent to the LED mounting area, the surface of the transparent substrate being free of the solder resist layer.
Substrate for light emitting device.

Images