JP2022147816A - Resonator, filter, and communication device - Google Patents

Abstract

A resonator having excellent electrical characteristics, a filter using the same, and a communication device are provided. A resonator (R) includes a first dielectric portion (1), a conductor portion (2), a bonding material portion (4), a second dielectric portion (5), and a shield housing (6). The first dielectric portion 1 has a first surface 11 and a second surface 12 opposite to the first surface 11 . The conductor portion 2 is positioned from the first surface 11 to the second surface 12 of the first dielectric portion 1 . The second dielectric portion 5 is positioned apart from the first surface 11 and has a third surface 51 facing the first surface 11 and a fourth surface 52 opposite to the third surface 51 . The joining material portion 4 joins the end surface of the conductor portion 2 on the side of the first surface 11 and the third surface 51 of the second dielectric portion 5 . The third surface 51 of the second dielectric portion 5 has a bonding region 5b to which the bonding material portion 4 is bonded and a groove 5a located around the bonding region 5b. [Selection drawing] Fig. 1

Description

The present invention relates to a resonator, a filter using the same, and a communication device.

A resonator is known in which a conductive film is formed on the outer surface of a dielectric block provided with through-holes, and the resonance frequency is set by the outer dimensions of the dielectric block, the size of the through-holes, and the positions where the through-holes are formed (for example, See Patent Document 1)

JP-A-10-93311

However, the conventional resonator disclosed in Patent Literature 1 has a problem that the resonance frequency of the higher-order mode is close to the resonance frequency of the fundamental mode, and the out-of-band characteristics are deteriorated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resonator with excellent out-of-band characteristics, a filter and a communication device using the same.

A resonator of the present disclosure includes a first dielectric portion having a first surface and a second surface opposite to the first surface;
a columnar conductor portion positioned from the first surface to the second surface of the first dielectric portion;
a second dielectric portion spaced from the first surface and having a third surface facing the first surface and a fourth surface opposite to the third surface;
a joining material portion that joins the end surface of the conductor portion on the side of the first surface and the third surface of the second dielectric portion;
A shield housing comprising: a first portion covering the fourth surface of the second dielectric portion; and a second portion connected to the first portion and surrounding the first dielectric portion and the second dielectric portion. body and
with
The third surface of the second dielectric part has a bonding area to which the bonding material part is bonded, and a groove positioned around the bonding area.

The resonator of the present disclosure includes a shield housing with one side open,
a dielectric portion covering the open surface of the shield housing;
a columnar conductor portion extending from the inner surface of the dielectric portion to the bottom surface of the shield housing;
a bonding material portion that bonds the conductor portion and the inner surface of the dielectric portion;
with
The inner surface of the dielectric portion has a bonding area to which the bonding material portion is bonded and a groove located around the bonding area.

The filter of the present disclosure comprises the above resonator,
a first terminal portion electrically or electromagnetically connected to the resonator;
and a second terminal portion electrically or electromagnetically connected to the resonator.

A communication device according to the present disclosure includes an antenna, a communication circuit, and the filter described above connected to the antenna and the communication circuit.

According to the resonator of the present disclosure, it is possible to obtain a resonator with excellent electrical characteristics. According to the filter of the present disclosure, a filter with excellent electrical characteristics can be obtained. According to the communication device of the present disclosure, it is possible to obtain a communication device with excellent communication quality.

1 is a cross-sectional view schematically showing a resonator according to a first embodiment of the invention; FIG. FIG. 2 is a cross-sectional view of the resonator shown in FIG. 1 as viewed from the cross-section line II-II; FIG. 4 is a perspective view of a state in which the third surface of the second dielectric portion faces upward; FIG. 5 is a cross-sectional view schematically showing a resonator according to a second embodiment; FIG. 5 is a sectional view seen from the section line VV in FIG. 4; It is a sectional view showing a filter of a 3rd embodiment typically. FIG. 7 is a sectional view seen from the section line VII-VII in FIG. 6; It is a sectional view showing a filter of a 4th embodiment typically. It is a sectional view showing a filter of a 5th embodiment typically. FIG. 10 is a sectional view seen from the section line XX in FIG. 9; It is a sectional view showing a filter of a 6th embodiment typically. FIG. 12 is a sectional view seen from the section line XII-XII in FIG. 11; FIG. 11 is a cross-sectional view schematically showing a resonator of a seventh embodiment; 1 is a block diagram showing a communication device; FIG. 5 is a graph showing filter characteristics of Example 1 and Comparative Example.

Hereinafter, resonators, filters, and communication devices according to embodiments of the present invention will be described in detail with reference to the drawings.

・Resonator <First embodiment>
FIG. 1 is a cross-sectional view schematically showing the resonator of the first embodiment, and FIG. 2 is a cross-sectional view taken along line II--II in FIG. The resonator R of this embodiment includes a first dielectric portion 1 , a conductor portion 2 , a bonding material portion 4 , a second dielectric portion 5 and a shield housing 6 . The shield housing 6 has a rectangular parallelepiped box-like shape with a cavity serving as a resonance space inside, and is connected to a reference potential. Reference potential refers to a potential that is also called ground potential, earth potential, or ground potential. The first dielectric portion 1 , the conductor portion 2 , the bonding material portion 4 , and the second dielectric portion 5 are positioned inside the cavity of the shield housing 6 .

The first dielectric portion 1 of this embodiment has, for example, a rectangular parallelepiped shape, and includes a first surface 11, a second surface 12 opposite to the first surface 11, and the first surface 11 and the second surface 12. and a side 13 located between. The first dielectric portion 1 is made of a dielectric material. The dielectric material may be, for example, a resin material or a ceramic material. As the resin material, for example, epoxy resin or polyimide resin can be used. As the ceramic material, for example, a ferroelectric ceramic material containing BaTiO ₃ , Pb ₄ Fe ₂ Nb ₂ O ₁₂ , TiO ₂ or the like can be used. The first dielectric section 1 may be a block body made of the dielectric material described above, or may be a laminate obtained by stacking the dielectric materials described above in layers. Alternatively, the dielectric material may be air. In this case, the first dielectric part 1 is, for example, a hollow box containing air inside.

When the first dielectric part 1 has a rectangular parallelepiped shape, for example, the length and width are each 5 to 20 mm, and the height is 2 to 5 mm. By setting the first dielectric part 1 to such dimensions, the out-of-band characteristics can be improved while downsizing in the height direction.

The conductor portion 2 is a columnar member positioned from the first surface 11 to the second surface 12 of the first dielectric portion 1 . When the first dielectric portion 1 is a block or laminate of dielectric material, the conductor portion 2 is embedded in the first dielectric portion 1 and penetrates from the first surface 11 to the second surface 12. is doing. When the first dielectric portion 1 is a hollow box, the conductor portion 2 is erected inside the box. The conductor portion 2 has exposed end surfaces on the first surface 11 and the second surface 12 of the first dielectric portion. The conductor part 2 may be columnar, and may be cylindrical or prismatic.

The conductor portion 2 is made of a conductive material. The conductive material may be a metallic material or a non-metallic conductive material. As the conductive material, for example, a material mainly composed of Ag alloy such as Ag, Ag--Pd, Ag--Pt, or a Cu-, W-, Mo-, or Pd-based material can be used.

The conductor portion 2 may have a conductor layer 3 covering the end face exposed on the first surface 11 side of the first dielectric portion 1 . The conductor layer 3 is made of the same conductive material as the conductor portion 2, for example. The conductor layer 3 may have a size that covers the entire end surface of the conductor portion 2, and may have the same size as the end surface or may be larger than the end surface. In this embodiment, the conductor portion 2 is cylindrical, the conductor layer 3 is disk-shaped concentrically with the conductor portion 2 , and the diameter of the conductor layer 3 is larger than the diameter of the conductor portion 2 .

When the conductor part 2 is cylindrical, its diameter is, for example, 1 to 3 mm, and its length is the same as the height dimension of the first dielectric part 1 . Since the basic principle of the resonator R is a coaxial resonator, the maximum value of the Q value is determined by the dimension ratio of the outer shape and the conductor portion 2 . By setting the conductor portion 2 to such dimensions, the Q value can be optimized. Q value (Quality Factor) is a dimensionless parameter index indicating the energy storage capacity represented by the reciprocal (1/tan δ) of dielectric loss (tan δ), and the higher this value, the lower the dielectric loss. .

The second dielectric portion 5 is positioned apart from the first surface 11 of the first dielectric portion 1 , and has a third surface 51 facing the first surface 11 and a third surface opposite to the third surface 51 . four sides 52; The thickness of the second dielectric portion 5, which is the distance between the third surface 51 and the fourth surface 52, is greater than the thickness, which is the distance between the first surface 11 and the second surface 12 of the first dielectric portion 1. small. The second dielectric part 5 may be plate-shaped, for example.

The second dielectric portion 5 is made of a dielectric material. The dielectric material may be, for example, a resin material or a ceramic material, similar to the first dielectric section 1 . In this embodiment, the first dielectric portion 1 is made of a resin material, and the second dielectric portion 5 is made of a ceramic material.

The first dielectric portion 1 and the second dielectric portion 5 have a gap between the first surface 11 and the third surface 51, and the end surface of the conductor portion 2 on the first surface 11 side 2 is joined to the third surface 51 of the dielectric portion 5 by the joining material portion 4 . The material forming the bonding material portion 4 may be any bonding material capable of bonding the conductor portion 2 and the second dielectric portion 5 together. As the joining material, for example, solder or metal brazing material can be used. When the conductor portion 2 has the conductor layer 3 as in the present embodiment, the conductor layer 3 and the second dielectric portion 5 may be joined together. The bonding material portion 4 may have, for example, a columnar shape or a plate shape depending on the size of the gap between the first dielectric portion 1 and the second dielectric portion 5 .

FIG. 3 is a perspective view of a state in which the third surface of the second dielectric portion faces upward. The third surface 51 of the second dielectric portion 5 has a bonding region 5b to which the bonding material portion 4 is bonded. The joint region 5b only needs to include the portion to which the joint material portion 4 is joined, and may be larger than the portion to which the joint material portion 4 is joined. The third surface 51 has a recessed groove 5a positioned around the bonding region 5b. The planar shape of the concave groove 5a and the planar shape of the bonding region 5b are not particularly limited. In the present embodiment, the end face of the conductor portion 2 is circular, and the joint region 5b is also circular. may In the present embodiment, the recessed groove 5a is provided in an annular shape with a constant groove width along the circular joint region 5b. A part may be interrupted. In addition, when a part of the ring is interrupted, the interrupted portion (the portion without the recessed groove 5a) may be 20% or less of the outer peripheral length of the bonding region 5b, preferably 10% or less. . The cross-sectional shape of the concave groove 5a is also not particularly limited. In this embodiment, the cross-sectional shape is rectangular, but it is not limited to this, and may be semicircular, U-shaped, V-shaped, or the like.

A plated layer, for example, may be provided on the bonding region 5b. As the plating material, for example, metal materials such as silver and copper can be used. The plating layer can improve the wettability with the bonding material and increase the bonding strength between the bonding material portion 4 and the second dielectric portion 5 .

The shield housing 6 includes a first portion 6 a covering the fourth surface 52 of the second dielectric portion 5 and a second portion connecting the first portion 6 a and surrounding the first dielectric portion 1 and the second dielectric portion 5 . 2 parts 6b. Further, in the present embodiment, the shield housing 6 further has a third portion 6c that continues to the second portion 6b and covers the second surface 12 of the first dielectric portion 1. As shown in FIG. As described above, since the shield housing 6 has a rectangular parallelepiped shape, for example, the first portion 6a is the upper wall portion, the second portion 6b is the side wall portion, and the third portion 6c is the bottom wall portion. .

The shield housing 6 is configured including a conductive material. For example, the entire shield housing 6 may be made of a metal material such as silver, copper, or aluminum. The conductive material may be, for example, an aluminum material plated with silver. For example, a non-conductive material such as a resin material or a ceramic material may be mixed with a conductive material and molded, or a non-conductive material is molded and a conductive material layer is provided on the surface. may

The fourth surface 52 of the second dielectric portion 5 and the first portion 6a are in contact with each other without any gap, and may be joined using an adhesive or the like, for example. The entire surfaces of the side surfaces of the first dielectric portion 1 and the second dielectric portion 5 and the second portion 6b are in contact with each other without a gap, and may be joined using an adhesive or the like, for example. The second surface 12 of the first dielectric portion 1 and the third portion 6c are in contact with each other without any gap, and may be joined using an adhesive or the like, for example.

The resonator of the present disclosure has improved out-of-band characteristics by shifting the resonance frequency of the higher-order mode to a higher frequency and away from the resonance frequency of the fundamental mode compared to the resonator of the conventional structure. The out-of-band characteristics of the resonator can be represented, for example, by the ratio fh/f between the fundamental mode resonance frequency f and the higher-order mode resonance frequency fh. A higher ratio fh/f indicates a higher higher mode frequency.

As a modification of the resonator R of the present embodiment, a material having a relatively low dielectric constant may be used as the dielectric material of the second dielectric section 5 . By lowering the dielectric constant of the second dielectric portion 5, the Q value can be increased while maintaining good out-of-band characteristics.

<Second embodiment>
FIG. 4 is a cross-sectional view schematically showing the resonator of the second embodiment, and FIG. 5 is a cross-sectional view seen from the cross-sectional line VV of FIG. The resonator R of this embodiment differs from that of the first embodiment only in that the first dielectric portion 1 has a through hole 1a penetrating from the first surface 11 to the second surface 12. , other configurations are common. The same reference numerals are given to the configurations common to the present embodiment and the first embodiment, and the description thereof is omitted.

The first dielectric part 1 of the present embodiment is a block or laminate made of a dielectric material. Such a structure has higher mechanical strength and higher dielectric constant than air as the dielectric material. By providing the through-hole 1a in the first dielectric portion 1, the inside of the through-hole 1a can be replaced with air, and the apparent dielectric constant of the first dielectric portion 1 can be lowered. By lowering the dielectric constant of the first dielectric portion 1, the Q value can be further increased while maintaining good out-of-band characteristics.

One or a plurality of through holes 1 a are provided in the first dielectric portion 1 . The shape and size of through-holes 1a are not particularly limited, and the total volume of all through-holes 1a may be 5 to 40% of the entire first dielectric portion 1. FIG. By providing the through holes 1a in this manner, the out-of-band characteristics are further improved.

When a plurality of through-holes 1a are provided, all the through-holes 1a may be the same or different in shape or size. The position where the through-holes 1a are provided is not particularly limited, and a plurality of through-holes 1a may be uniformly provided. For example, the out-of-band characteristics can be further improved by arranging the through holes 1a in a houndstooth pattern.

<Third Embodiment>
FIG. 6 is a cross-sectional view schematically showing the resonator of the third embodiment, and FIG. 7 is a cross-sectional view taken along line VII--VII in FIG. The resonator of this embodiment has a configuration including input/output terminals. It should be noted that the same reference numerals are given to the same configurations as in the embodiment of the resonator described above, and the description thereof will be omitted. The resonator R of this embodiment includes a terminal section 7 for signal input/output. In addition to the two terminal portions 7, the resonator R of the present embodiment includes a coupling wire 8 that connects the two terminal portions 7 and capacitively couples with the conductor portion 2, and a pad portion 9 that is connected to the terminal portion 7. And further comprising.

One of the two terminals 7 is for input and the other is for output. The terminal portion 7 of this embodiment is a through conductor penetrating from the first surface 11 to the second surface 12 of the first dielectric portion 1 . The coupling wiring 8 is provided on the first surface 11 of the first dielectric portion 1 . The coupling wiring 8 is provided with a straight portion connected to the terminal portion 7 exposed on the first surface 11 and extending toward the conductor portion 2 and a gap for coupling with the conductor portion 2, and is provided with two straight portions. and a connecting portion connecting the In the resonator R of this embodiment, the conductor portion 2 has the circular conductor layer 3 on the first surface 11 , and the coupling portion is provided in an arc shape along the outer periphery of the conductor layer 3 . The pad portion 9 is connected to the terminal portion 7 exposed on the second surface 12 .

The resonator R of this embodiment functions, for example, as a notch circuit. A signal input through one pad portion 9 flows through one terminal portion 7, is capacitively coupled with the conductor portion 2 by the coupling wiring 8, flows through the other terminal portion 7, and is output from the other pad portion 9. be. This output signal exhibits frequency characteristics in which only a specific frequency band of the input signal is blocked and other frequency bands are passed.

・Filter <Fourth Embodiment>
FIG. 8 is a cross-sectional view schematically showing the filter of the fourth embodiment. It should be noted that the same reference numerals are given to the same configurations as in the embodiment of the resonator described above, and the description thereof will be omitted. In this embodiment, the two terminal portions 7 do not penetrate the first dielectric portion 1 , one end is inside the first dielectric portion 1 , and the other end is exposed on the second surface 12 to form the pad portion 9 . Connected. The filter F of the present embodiment includes coupling wirings 10 extending from one end of each terminal portion 7 through the inside of the first dielectric portion 1 and inductively coupled to the conductor portion 2 .

The filter F of this embodiment functions, for example, as a bandpass filter. A signal input through one pad portion 9 flows through one terminal portion 7, is inductively coupled with the resonator R through the coupling wiring 10, flows through the other terminal portion 7, and is output from the other pad portion 9. be. This output signal exhibits frequency characteristics in which only a specific frequency band of the input signal is passed and other frequency bands are blocked.

<Fifth Embodiment>
FIG. 9 is a cross-sectional view schematically showing the filter of the fifth embodiment. FIG. 10 is a sectional view seen from the section line XX in FIG. It should be noted that the same reference numerals are given to the same configurations as in the filter embodiment described above, and the description thereof will be omitted. The filter F of this embodiment includes two resonators R and a terminal section 7 electrically or electromagnetically connected to one resonator R and the other resonator R, respectively. Coupling lines 8 are provided for two resonators R, respectively.

One terminal portion 7 is capacitively coupled to one resonator R via one coupling wiring 8, and the other terminal portion 7 is capacitively coupled to the other resonator R via the other coupling wiring 8. . The filter F of this embodiment functions, for example, as a bandpass filter. A signal input through one pad portion 9 flows through one terminal portion 7 and is capacitively coupled with one resonator R through one coupling wiring 8 . The two resonators R are electromagnetically coupled within the shield housing 6 . The other resonator R is capacitively coupled with the other coupling wiring 8 , and the signal flows through the other terminal portion 7 and is output from the other pad portion 9 . This output signal exhibits frequency characteristics in which only a specific frequency band of the input signal is passed and other frequency bands are blocked.

The filter F of this embodiment has a shielding portion 6 d between two conductor portions 2 . The shielding portion 6d is a wall-like portion extending inwardly from the two parallel second portions 6b. The opening between the two shielding portions 6d is the waveguide region, through which the two resonators R are electromagnetically coupled.

<Sixth embodiment>
FIG. 11 is a cross-sectional view schematically showing the filter of the sixth embodiment. FIG. 12 is a cross-sectional view seen from the section line XII-XII in FIG. It should be noted that the same reference numerals are given to the same configurations as in the filter embodiment described above, and the description thereof will be omitted. The filter F of this embodiment differs from that of the fifth embodiment in the positions where the terminal portion 7, the coupling wiring 8 and the pad portion 9 are provided. The terminal portion 7 of this embodiment is a through conductor penetrating from the third surface 51 to the fourth surface 52 of the second dielectric portion 5 . The coupling wiring 8 is provided on the third surface 51 of the second dielectric portion 5 . The coupling wiring 8 is connected to the terminal portion 7 exposed on the third surface 51 . The connection pad portion 9 is connected to the terminal portion 7 exposed on the fourth surface 52 . The second dielectric portion 5 may be positioned on the second portion 6 b of the shield housing 6 . In this case, a bonding layer 15 that bonds to the second portion 6 b may be provided at the periphery of the third surface 51 of the second dielectric 5 . The bonding layer 15 can be provided in the same manner as the coupling wiring 8 .

In the sixth embodiment, the coupling wire 8 is provided on the same third surface 51 of the second dielectric portion 5 as the groove 5a. Therefore, as shown in FIG. It is an annular ring that surrounds the arc-shaped connecting portion, and a part of the annular ring is interrupted. A straight portion of the coupling wiring 8 is positioned at this discontinuous portion. The filter F of this embodiment functions, for example, as a bandpass filter, as in the fifth embodiment.

Although the filter F of the present embodiment has a configuration including two resonators R, it is not limited to this and may include three or more resonators R. A plurality of resonators R may be arranged in one row, or may be arranged in two or more rows. A shielding portion 6d may be provided between the resonators R to be electromagnetically coupled, and an opening serving as a waveguide region may be formed. In addition, between the resonators R that are not coupled, an inner wall portion may be provided from one second portion 6b to the other second portion 6b so as not to form an opening that serves as a waveguide region. By combining a plurality of resonators R in this manner, a filter F having desired characteristics can be realized.

The filter F as described above is used as a filter for microwave communication equipment typified by a mobile phone device, and can pass only the necessary frequency band of signals to be transmitted and received and cut off unnecessary frequency bands. Also, in other communication terminal equipment, it is mainly used as an antenna duplexer such as a duplexer. Unlike a filter using a piezoelectric element, the filter of this embodiment has no mechanical vibration at all, and the electromagnetic wave itself resonates within the shield housing 6 .

<Seventh Embodiment>
FIG. 13 is a cross-sectional view schematically showing the resonator of the seventh embodiment. The resonator R of this embodiment includes a shield housing 6 , a dielectric portion 16 , a conductor portion 2 and a bonding material portion 4 . The same reference numerals are given to the same configurations in this embodiment and each of the above-described embodiments, and the description thereof is omitted. The shield housing 6 has a rectangular parallelepiped box-like shape with a cavity serving as a resonance space inside, and one side is open. The dielectric portion 16 is positioned to cover the open surface of the shield housing 6 and has a configuration corresponding to the second dielectric portion 5 in each of the above-described embodiments. The dielectric portion 16 is made of the same dielectric material as the second dielectric portion 5 . The conductor portion 2 is a columnar member positioned from the inner surface of the dielectric portion 16 to the bottom surface of the shield housing 6 . The conductor portion 2 and the inner surface of the dielectric portion 16 are joined by a joint portion 4 .

The inner surface of the dielectric portion 16 has a bonding region 16b to which the bonding material portion 4 is bonded and a groove 16a positioned around the bonding region 16b. The groove 16a and the bonding region 16b correspond to the groove 5a and the bonding region 5b of the second dielectric portion 5, respectively. A bonding layer 15 that bonds to the shield housing 6 may be provided at the periphery of the inner surface of the dielectric portion 5 .

In the resonator R of the present embodiment, the resonance frequency of the higher-order mode is also shifted to a higher frequency than the resonator of the conventional structure, and the out-of-band characteristics are improved by moving away from the resonance frequency of the fundamental mode.

In the resonator R of this embodiment, the outer surface of the dielectric portion 16 may be covered with a conductive layer. The conductor layer may be, for example, a plated layer or the like, or may be a metal foil or a metal plate pasted thereon. Also, the conductor portion 2 may be integrated with the shield housing 6 . For example, the shield housing 6 with the conductor portion 2 may be cut out from a block-shaped metal body by cutting.

・Communication Device <Eighth Embodiment>
FIG. 14 is a block diagram showing a communication device with filters. The communication device of this embodiment has an antenna 20 , a communication circuit 21 , and a filter F connected to the antenna 20 and the communication circuit 21 . The filter F may be any of the filters F of the previous embodiments. Antenna 20 and communication circuit 21 can be known conventional ones.

The communication apparatus of this embodiment having such a configuration eliminates unnecessary electrical signals by using the above-described filter F having excellent electrical characteristics, thereby achieving excellent communication quality.

(Evaluation 1)
In Evaluation 1, the presence or absence of grooves in the second dielectric portion was evaluated. The electrical characteristics of the resonator of Example 1 and the resonator of Comparative Example were evaluated by simulation. Example 1 was based on the structure of the first embodiment, and simulation conditions such as dimensions and material properties were set as follows. The dimensions inside the shield housing were 10 mm×8.5 mm×4.32 mm, and all boundary surfaces were conductors. The first dielectric portion had a thickness of 3.5 mm and assumed a resin material with a dielectric constant εr of 3.4 and tan δ of 0.001. The second dielectric portion had a thickness of 0.5 mm, and assumed a ceramic material with a dielectric constant εr=40 and tan δ=6.3×10 ⁻⁵ . The distance between the first dielectric portion and the second dielectric portion was set to 0.3 mm. The conductor portion had a cylindrical shape with a diameter of 2 mm, and the conductor layer had a disc shape with a diameter of 3 mm and a thickness of 0.1 mm. Assuming that solder is used as the bonding material, the bonding material portion was shaped like a disc with a diameter of 1.3 mm. On the third surface of the second dielectric portion, the bonding area was circular with a diameter of 1.3 mm. A metal layer having a thickness of 0.1 mm was provided in the joint region for solder joint. The concave groove was annular with a groove width of 2.7 mm and a depth of 0.25 mm.

Comparative Example was the same as Example 1 except that the second dielectric portion did not have a groove and the third surface of the second dielectric portion was flat.

Models of Example 1 and Comparative Example were created, and out-of-band characteristics and Q values were evaluated under the conditions of eigenvalue analysis using simulation software HFSS manufactured by ANSYS. For the out-of-band characteristics, the ratio fh/f between the fundamental mode resonance frequency f and the higher mode resonance frequency fh was calculated. A higher ratio fh/f indicates a higher higher mode frequency. FIG. 15 shows the filter characteristics of Example 1 and Comparative Example.

The fh/f of Example 1 was 5.35 and the Q value was 950. The fh/f of the comparative example in which the groove was not provided in the second dielectric portion was 4.97, and the Q value was 935. These results show that Example 1 is superior to Comparative Example in out-of-band characteristics and Q value.

(Evaluation 2)
In Evaluation 2, the difference in dielectric constant of the second dielectric portion was evaluated. In Example 2, based on the structure of the first embodiment, simulation conditions such as dimensions and material properties were set as follows. The dimensions inside the shield housing were 10 mm×8.5 mm×4.32 mm, and all boundary surfaces were conductors. The first dielectric portion had a thickness of 3.5 mm and assumed a resin material with a dielectric constant εr of 3.4 and tan δ of 0.001. The second dielectric portion had a thickness of 0.5 mm, and assumed a ceramic material with a dielectric constant εr=20 and tan δ=6.3×10 ⁻⁵ . The distance between the first dielectric portion and the second dielectric portion was set to 0.3 mm. The conductor portion had a cylindrical shape with a diameter of 2 mm, and the conductor layer had a disk shape with a diameter of 2.5 mm and a thickness of 0.1 mm. Assuming that solder is used as the bonding material, the bonding material portion was formed in a disc shape with a diameter of 2.0 mm. On the third surface of the second dielectric portion, the bonding area was circular with a diameter of 2.0 mm. A metal layer having a thickness of 0.1 mm was provided in the joint region for solder joint. The concave groove was annular with a groove width of 1.3 mm and a depth of 0.25 mm.

The fh/f of Example 1 was 5.35 and the Q value was 950. In Example 2, in which the relative permittivity of the second dielectric portion was lower than that in Example 1, fh/f was 5.36 and the Q value was 1,013. In Example 2, the Q value improved while maintaining fh/f.

(Evaluation 3)
In evaluation 3, the presence or absence of through holes in the first dielectric portion was evaluated. Example 3 was based on the structure of the first embodiment, and simulation conditions such as dimensions and material properties were set as follows. Example 3 was based on the structure of the first embodiment, and simulation conditions such as dimensions and material properties were set as follows. The dimensions inside the shield housing were 10 mm×8.5 mm×4.32 mm, and all boundary surfaces were conductors. The first dielectric portion had a thickness of 3.5 mm and assumed a resin material with a dielectric constant εr of 3.4 and tan δ of 0.001. The second dielectric portion had a thickness of 0.5 mm, and assumed a ceramic material with a dielectric constant εr=40 and tan δ=6.3×10 ⁻⁵ . The distance between the first dielectric portion and the second dielectric portion was set to 0.3 mm. The conductor portion had a cylindrical shape with a diameter of 2 mm, and the conductor layer had a disk shape with a diameter of 2.5 mm and a thickness of 0.1 mm. Assuming that solder is used as the bonding material, the bonding material portion was shaped like a disk with a diameter of 1.7 mm. On the third surface of the second dielectric portion, the bonding area was circular with a diameter of 1.4 mm. A metal layer having a thickness of 0.1 mm was provided in the joint region for solder joint. The concave groove was annular with a groove width of 1.3 mm and a depth of 0.25 mm.

Example 4 was the same as Example 3, based on the structure of the second embodiment, except that a through hole was provided in the first dielectric portion. In Example 4, the through-holes were air holes with a diameter of 0.5 mm, and the total volume of all the through-holes was 8% of the entire first dielectric portion.

The fh/f of Example 3, in which the first dielectric portion was not provided with the through hole, was 5.23, and the Q value was 946. The fh/f of Example 4 in which the through holes were provided in the first dielectric portion was 5.20, and the Q value was 992. Example 4 improved the Q value while maintaining fh/f.

1 First Dielectric Part 1a Through Hole 2 Conductor Part 3 Conductor Layer 4 Bonding Material Part 5 Second Dielectric Part 5a Groove 5b Bonding Area 6 Shield Case 6a First Part 6b Second Part 6c Third Part 6d Shielding Part 7 terminal portion 8 coupling wire 9 pad portion 10 coupling wire 11 first surface 12 second surface 13 side surface 16 dielectric portion 16a concave groove 16b junction region 20 antenna 21 communication circuit 51 third surface 52 fourth surface F filter R resonator

Claims (8)

a first dielectric portion having a first surface and a second surface opposite to the first surface;
a columnar conductor portion positioned from the first surface to the second surface of the first dielectric portion;
a second dielectric portion spaced from the first surface and having a third surface facing the first surface and a fourth surface opposite to the third surface;
a joining material portion that joins the end surface of the conductor portion on the side of the first surface and the third surface of the second dielectric portion;
A shield comprising: a first portion covering the fourth surface of the second dielectric portion; and a second portion connected to the first portion and surrounding the first dielectric portion and the second dielectric portion. a housing;
with
The resonator, wherein the third surface of the second dielectric part has a bonding area to which the bonding material part is bonded, and a groove positioned around the bonding area. the first dielectric part has a through hole penetrating from the first surface to the second surface,
2. The resonator according to claim 1, wherein said shield housing has a third portion connected to said second portion and covering said second surface of said first dielectric portion. 3. The resonator according to claim 1, wherein said joining material portion includes solder or metal brazing material. The resonator according to any one of claims 1 to 3, wherein said second dielectric portion comprises a ceramic material. 5. The resonator according to any one of claims 1 to 4, wherein said first dielectric portion includes a resin material. A shield housing with one side open,
a dielectric portion covering the open surface of the shield housing;
a columnar conductor portion extending from the inner surface of the dielectric portion to the bottom surface of the shield housing;
a bonding material portion that bonds the conductor portion and the inner surface of the dielectric portion;
with
The resonator according to claim 1, wherein the inner surface of the dielectric part has a bonding area to which the bonding material part is bonded, and a groove positioned around the bonding area. a resonator according to any one of claims 1 to 6;
and a terminal portion electrically or electromagnetically connected to the resonator. A communication device comprising an antenna, a communication circuit, and a filter according to claim 7 connected to said antenna and said communication circuit.

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