JP2022140211A - Heater unit for heat treatment oven - Google Patents

Abstract

To provide a heater unit for a heat treatment oven that can be used inside a chamber of the heat treatment oven, maintain temperature uniformity without dielectric breakdown even at high temperature, and satisfies the temperature performance at high temperature and temperature uniformity required in a substrate manufacturing process.SOLUTION: A heater unit for a heat treatment oven which includes a chamber for accommodating a substrate for heating and drying a substrate and heats and dries the substrate via heat generated from the heater unit by mounting a plurality of heater units in the chamber is configured to include a pipe which incorporates a heating wire for generating heat by electrical resistance, an upper heat transfer plate and a lower heat transfer plate disposed above and below the pipe, and a plurality of push units which are arranged between the upper heat transfer plate and the lower heat transfer plate, maintain a gap between the upper heat transfer plate and the lower heat transfer plate, and supports the upper heat transfer plate and the lower heat transfer plate.SELECTED DRAWING: Figure 9

Description

The present invention relates to a heat treatment oven heater unit that stably maintains temperature uniformity with respect to a substrate surface during heat treatment of a glass substrate inside the chamber of the heat treatment oven.

Recently, displays have been applied to various kinds of image devices such as TVs, mobile phones, monitors, etc. With rapid technological development, efforts are being made to improve the performance of the products. Organic light emitting display devices and LCD substrates are one of next-generation display devices and are applied to various product fields. The glass substrates that make up the display device are manufactured by heat treatment.In order to meet the conditions required for each process during the heat treatment, it is necessary to prevent the influence of the outside air and minimize the heat emitted outside the chamber. must be kept to As a result, deterioration in performance can be prevented, and the defective rate of products can be reduced. In addition, in order to improve the yield of finished products, it is better to have less in-plane variations in the substrate during heat treatment.

On the other hand, in manufacturing substrates for organic light-emitting display devices and LCD glass substrates (hereinafter referred to as “substrates” or “glass substrates”), which are representative of flat displays, temperature control and temperature uniformity are important factors in determining the quality and yield of non-defective substrates. is absolutely necessary for the maintenance of For example, in the substrate manufacturing process using a heat treatment oven, an organic layer is formed on the surface of the substrate, which can contain a certain amount of moisture, so a drying process is required to evaporate the moisture. In the process, a cleaning process is performed before coating the surface of the substrate with a photosensitive film, and after the cleaning process, a heating and drying process is performed to remove moisture. Many substrate manufacturing processes include heating and drying processes. manufactures the substrates. Moisture generated in the substrate manufacturing process is removed by heating and drying by using infrared rays or placing the substrate in a heat treatment oven chamber including a heating element such as a sheath heater. In this regard, Korean Patent No. 10-1238560 and Korean Patent Publication No. 10-2013-0028322 propose an “LCD glass oven chamber”. However, the heating element arrangement method of the conventional heat treatment oven having a heater as a heating element has limitations in satisfying high-temperature temperature performance and temperature uniformity required in the substrate manufacturing process. As a result, the heater heating element can be used inside the chamber of the heat treatment oven and can maintain temperature uniformity without dielectric breakdown even at high temperatures, and the high temperature performance and temperature uniformity required in the substrate manufacturing process. There is a need for a new heat treatment oven heater that can satisfy the requirements.

Korean Patent No. 10-1238560 (publication date February 28, 2013) Korean Patent No. 10-0722154 (Publication date May 28, 2007) Korean Patent No. 10-2013-0028322 (Published on March 19, 2013)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heater unit for a heat treatment oven that stably maintains temperature uniformity with respect to a substrate surface during heat treatment of the substrate inside the chamber of the heat treatment oven.

Another object of the present invention is to be able to be used inside the chamber of a heat treatment oven, to maintain temperature uniformity without dielectric breakdown even at high temperatures, and to provide high temperature performance and temperature performance required in the substrate manufacturing process. To provide a heater unit for a heat treatment oven which can satisfy uniformity.

According to the present invention, the above object is achieved by providing a chamber for housing a substrate for heating and drying the substrate, and mounting a plurality of heater units in the chamber so that the heat generated from the heater unit heats the substrate. In a heat treatment oven for heating or drying, the heater unit includes a heated pipe containing a heating wire that generates heat by electrical resistance, an upper heat transfer plate and a lower heat transfer plate disposed above and below the pipe, is disposed between the upper heat transfer plate and the lower heat transfer plate, maintains a gap between the upper heat transfer plate and the lower heat transfer plate, and supports the upper heat transfer plate and the lower heat transfer plate. It can be achieved by a heater unit of a heat treatment oven, including a plurality of bushings.

According to an embodiment of the invention, said pipe may consist of a circular hollow pipe.

According to an embodiment of the present invention, a power sleeve connected to a conductive part to supply power is installed at one end of the pipe, and a sleeve heat dissipation block is arranged based on the arrangement position of the power sleeve. .

According to an embodiment of the present invention, the bushing portion includes a bushing having a hollow hole and positioned along an opening of the lower heat transfer plate, the bushing extending through the opening through a support means. It can be configured to be mounted and secured along.

According to an embodiment of the present invention, the support means protrudes downward from the upper heat transfer plate along the hollow hole of the bush so as to be centered in an opening drilled in the lower heat transfer plate. It may comprise an entering fixer and a fixing nut that supports the fixer from the bottom surface of the lower heat transfer plate.

According to an embodiment of the present invention, a washer may be installed between the lower surface of the lower heat transfer plate and the upper surface of the fixing nut to prevent floating and deformation of the fixer.

Advantageous Effects of Invention The present invention has the effect of stably maintaining temperature uniformity with respect to a substrate surface during heat treatment of the substrate inside the chamber of the heat treatment oven.

In addition, the present invention can be used inside the chamber of a heat treatment oven, can maintain temperature uniformity without dielectric breakdown even at high temperatures, and has the high temperature performance and temperature uniformity required in the substrate manufacturing process. has the effect of being able to satisfy

Further, according to the present invention, an insert-type bush portion is interposed between the upper heat transfer plate and the lower heat transfer plate that constitute the heater unit, and the heat deformation of the upper heat transfer plate and the lower heat transfer plate is caused through the bush portion. Alternatively, it is possible to control various deformation factors including positional deformation due to impact applied to the upper heat transfer plate and the lower heat transfer plate.

In addition, the present invention satisfies the high temperature performance and temperature uniformity required in the substrate manufacturing process by spacing the upper heat transfer plate and the lower heat transfer plate, which constitute the heater unit, at a constant distance. has the effect of

1 is an exemplary diagram showing a heat treatment oven; FIG. It is an exemplary view showing the front of the heat treatment oven. It is an exemplary view showing a plane of a heat treatment oven. 1 is an exemplary view showing one side of a heat treatment oven; FIG. 1 is an exemplary view of a heater unit according to one embodiment of the present invention arranged in a heat treatment oven; FIG. FIG. 2 is an exemplary view showing a planar structure of a heater unit according to one embodiment of the present invention arranged in a heat treatment oven; FIG. 4 is an exemplary view showing a heater unit according to one embodiment of the present invention; FIG. 8 is an exemplary diagram showing details of an A section extracted from FIG. 7 ; FIG. 3 is an exemplary diagram illustrating the detailed structure of a heater unit according to one embodiment of the present invention; FIG. 4 is an exemplary diagram illustrating the bush structure of the heater unit according to one embodiment of the present invention; FIG. 4 is an exemplary exploded view showing a bush of the heater unit according to one embodiment of the present invention;

A "heater unit for a heat treatment oven" according to a preferred embodiment of the present invention will be described below.

FIG. 1 is an exemplary diagram showing a heat treatment oven. FIG. 2 is an exemplary view showing the front of the heat treatment oven. FIG. 3 is an exemplary view showing the plane of the heat treatment oven. FIG. 4 is an exemplary view showing a side view of the heat treatment oven.

1 to 4 show the overall structure of the heat treatment oven 100, and are exemplary views of the heat treatment oven 100 including a chamber 200. FIG.

As shown in FIGS. 1 to 4, the heat treatment oven 100 takes a heat treatment target substrate into each stage provided in the chamber 200 to heat the substrate, or puts the heat treated substrate into the chamber 200 . 200, a door portion 110 can be provided on the rear portion and a shutter portion 120 can be provided on the front portion.

In addition, the heat treatment oven 100 includes a chamber 200 that accommodates substrates that need to be heated or dried. It is configured to heat the substrate with the heat generated or evaporate the moisture to dryness.

In addition, the heat treatment oven 100 has an air supply port for inflowing fluid including process gas and an exhaust port for exhausting the fluid in the chamber 200 on one side of the chamber 200 , and a frame with lugs supporting the chamber 200 . , and a conductive portion 301 to which a large number of bus bars for connecting the heating wires of the heater unit 300 and passing current are connected.

Although it depends on the specifications, in general, an upper heat transfer plate 321 and a lower heat transfer plate 322 are installed in close contact with the upper and lower portions of the pipe 310, which is a heating element that constitutes the heater unit 300. It is configured to effectively perform the substrate heating process that takes place within.

Here, the heater unit 300 functioning as a heating element of the heat treatment oven includes a heating wire (heating coil) that generates heat by electrical resistance in a pipe (metal protective tube), and is filled with insulating powder of magnesium oxide (MgO). It can be a heater that insulates the heating wire and the pipe 310 by filling them together. Pipe 310 can be used as a Mineral Insulated Heater. In this case, it has the characteristic that it can be manufactured thinly.

On the other hand, in FIGS. 1 and 4, unexplained reference numerals “210” and “220” indicate “inner and outer casings” of the chamber 200. As shown in FIG. An unexplained reference numeral '230' denotes a 'cooling jacket' that forms a cooling airflow in the chamber 200 and cools the chamber 200 with a uniform temperature distribution through a cooling airflow guideway formed inside the chamber 200. FIG. An unexplained reference numeral “240” indicates a “power supply unit” that protrudes a feedthrough and supplies power into the chamber 200 through this.

Incidentally, as shown in FIGS. 1 and 4, the basic structure constituting the heat treatment oven includes, for example, the structure of the chamber, the process gas supply and exhaust system, and the bus bar that supplies power to the heater unit. The configuration of the conductive portion and power supply portion is not directly relevant to the present invention. Further, since the basic configuration of the heat treatment oven is a well-known configuration that is irrelevant to the subject matter of the present invention, the description of the configuration and operation of the present invention will be omitted.

As shown in FIGS. 1 to 4, a heat treatment oven generally takes a substrate to be heat-treated into stages provided in a chamber in which a heater is installed, and heat-treats the substrate in order to heat-treat the substrate. A door can be provided on the rear side and a shutter on the front side for taking out the finished substrate from the chamber.

In addition, the heat treatment oven includes a chamber containing a substrate that needs to be heated or dried, and a heater unit comprising a heating element is mounted in the chamber to heat the substrate with heat generated from the heater unit. Alternatively, it can be configured to evaporate and dry moisture.

In addition, although it differs depending on the specifications, in general, upper and lower heat transfer plates are installed on the upper and lower portions of the heating element constituting the heater so as to effectively perform the substrate heating process. there is

In addition, on one side of the chamber of the heat treatment oven, an air supply port for inflowing the fluid containing the process gas and an exhaust port for exhausting the fluid in the chamber are provided. It includes a conductive portion to which a large number of bus bars are connected to which the heating wires are connected to conduct current.

On the other hand, the heat treatment oven contains a heater inside the chamber to remove the moisture remaining on the substrate during the substrate heat treatment process, and it is a more efficient and high performance process to improve the product quality. Seeking ability.

In addition, in order to mass-produce more products by shortening the time of the heat treatment process, the heater unit installed inside the chamber is required to have high performance and structurally reinforced durability. .

However, conventional heat treatment oven heater units have difficulty maintaining temperature uniformity without dielectric breakdown even at high temperatures. accompanied.

As a result, the present invention can be used inside the chamber of a heat treatment oven, and can maintain temperature uniformity without dielectric breakdown even at high temperatures. To provide a heater unit for a heat treatment oven capable of satisfying the requirements.

Next, the main components of the heater unit of the heat treatment oven according to the present invention will be specifically described with reference to FIGS. 5 to 11. FIG.

FIG. 5 is an exemplary view of a heater unit according to one embodiment of the present invention arranged in a heat treatment oven. FIG. 6 is an exemplary view showing a planar structure of a heater unit according to an embodiment of the present invention arranged in a heat treatment oven. FIG. 7 is an exemplary view showing a cutaway part of a heater unit according to an embodiment of the present invention. FIG. 8 is an exemplary view showing in detail the A portion of FIG. 7. As shown in FIG. FIG. 9 is an exemplary view explaining the detailed structure of the heater unit according to one embodiment of the present invention.

Heater units 300 of the heat treatment oven according to the embodiment of the present invention, as shown in FIGS. Can be implemented and deployed. The heat treatment oven 100 can be configured to heat or dry the substrate by heat generated from the heater unit 300 .

The heater unit 300 can be composed of a heated pipe 310 containing a heating wire 302 that generates heat by electrical resistance.

Here, the pipe 310 functioning as a heating element can preferably be configured by selecting a circular hollow pipe 310 in which the heating wire 302 is built. Circular pipes 310 are curved at regular intervals as shown in FIGS. Arrangement is preferred.

When the circular pipe 310 is applied in this way, it can be manufactured into a heating element with a smoothly bent shape without sharp bends while maintaining a constant interval, so it plays an important role in maintaining a uniform temperature. , while reducing the thickness, it is possible to narrow the bending limit value and interval according to the thickness, thereby improving the overall performance when applied as a heating element of the heat treatment oven 100. There is

As shown in FIG. 9, the heater unit 300 includes an upper heat transfer plate 321 and a lower heat transfer plate 322 arranged above and below the pipe 310, and the upper heat transfer plate 321 and the lower heat transfer plate 322. A plurality of bushings 330 may be disposed between the upper heat transfer plate 321 and the lower heat transfer plate 322 to maintain a distance between the upper heat transfer plate 321 and the lower heat transfer plate 322 and support the upper heat transfer plate 321 and the lower heat transfer plate 322 .

Also, as shown in FIG. 8, a power sleeve 311 is attached to one end of a pipe 310 constituting the heater unit 300 to which a conductive portion 301 is connected to supply power. The sleeve heat dissipation block 312 can be arranged on the basis.

Here, the power sleeve 311 may be configured to guide the connection of the conductive portion 301 and block the heat loss radiated from the pipe 310 to the outside. For this reason, a sleeve heat radiation block 312 is attached to the periphery of the power sleeve 311 based on the placement position of the power sleeve 311, through which high temperature heat is radiated, thereby preventing damage to the conductive portion 301 due to overheating. It can effectively protect the conductive part 301 from danger of fire and fire.

The sleeve heat-dissipating block 312 is preferably selected from aluminum alloys or ceramic materials, which are resistant to high temperatures, have excellent heat-dissipating performance and electrical insulation.

FIG. 10 is an exemplary view explaining the bush structure of the heater unit according to one embodiment of the present invention. FIG. 11 is an exemplary exploded view of the bush of the heater unit according to one embodiment of the present invention.

9 to 11, the bush part 330 constituting the heater unit 300 has a hollow hole 332 and is positioned along the opening hole 323 of the lower heat transfer plate 322. can be configured including The bush 331 can be configured by being mounted and fixed along the opening 323 via a support means.

Here, the bush 331 is interposed between the upper heat transfer plate 321 and the lower heat transfer plate 322 that are positioned above and below the pipe 310 and are in contact with each other, so that the upper heat transfer plate 321 does not break down even at high temperatures. and control the floating and deformation of the lower heat transfer plate 322 to form a constant clearance, through which the temperature uniformity is guided to be kept constant.

For example, the upper heat transfer plate 321 and the lower heat transfer plate 322 finally radiate the heat conducted from the pipe 310 into the chamber 200 of the heat treatment oven 100. At this time, the upper heat transfer plate 321 and the lower heat transfer plate Variations in the distance from the plate 322, thermal stress deformation, and the like may cause variations in temperature uniformity. This can appear as a problem that causes a sudden change in the deformation and thermal equilibrium of the heat radiation area set in the heat treatment oven 100 .

The temperature uniformity and temperature control of the heater units 300 arranged in the chamber 200 of the thermal processing oven 100 directly or indirectly affect the yield and performance maintenance in the thermal processing manufacturing of substrates to varying degrees.

According to the present invention, the bush part 330 interposed between the upper heat transfer plate 321 and the lower heat transfer plate 322 in an insert manner prevents thermal deformation of the upper heat transfer plate 321 and the lower heat transfer plate 322 or prevents upper heat transfer. By effectively controlling various deformation factors, including positional deformation due to impact applied to the plate 321 and the lower heat transfer plate 322, and separating the upper heat transfer plate 321 and the lower heat transfer plate 322 at a constant distance, the substrate High-temperature temperature performance and temperature uniformity required in the manufacturing process can be satisfied.

For this purpose, the bushes 331 may be arranged at a plurality of locations between the upper heat transfer plate 321 and the lower heat transfer plate 322 via support means, and the support means may be formed in the lower heat transfer plate 322 . A fixer 340 projecting downward from the upper heat transfer plate 321 and entering along the hollow hole 332 of the bushing 331 so as to be centered in the opening hole 323 , and a fixing member supporting the fixer 340 from the bottom surface of the lower heat transfer plate 322 . It can be configured including a nut 341 .

As shown in FIG. 10, the bushing portion 330 can be mounted between the upper heat transfer plate 321 and the lower heat transfer plate 322, and the bushing 331, as shown in FIG. It is positioned on the lower heat transfer plate 322 via a fixer 340 that protrudes downward from the plate 321 and enters along the hollow hole 332 of the bushing 331 so that there is a certain amount of play between the upper heat transfer plate 321 and the lower heat transfer plate 322 . A function of forming a gap and supporting the upper heat transfer plate 321 and the lower heat transfer plate 322 so that the gap maintains a constant gap even under the condition that the upper heat transfer plate 321 and the lower heat transfer plate 322 receive high heat. do.

10, the fixer 340 protrudes from the upper heat transfer plate 321, passes through the hollow hole 332 of the bushing 331, and is inserted along the opening 323 of the lower heat transfer plate 322. Then, the fixing nut 341 is fastened from the bottom surface of the lower heat transfer plate 322 to firmly support and fix the lower heat transfer plate 322 . Here, when the washer 342 is installed between the bottom surface of the lower heat transfer plate 322 and the contact surface of the fixing nut 341, it is possible to effectively prevent the fixer 340 from floating and deforming.

Thus, the heater unit of the heat treatment oven according to the present invention can be used inside the chamber of the heat treatment oven, and can maintain temperature uniformity without dielectric breakdown even at high temperatures, which is required in the substrate manufacturing process. It has the advantageous advantage that high temperature temperature performance and temperature uniformity can be satisfied.

In addition, thermal deformation of the upper heat transfer plate and the lower heat transfer plate or heat transfer to the upper heat transfer plate and the lower heat transfer plate is applied through the bush part interposed between the upper heat transfer plate and the lower heat transfer plate in the form of an insert. It has the advantage of being able to effectively control various deformation factors, including positional deformation due to impact.

Also, by maintaining a constant distance between the upper heat transfer plate and the lower heat transfer plate, there is an advantage that high temperature performance and temperature uniformity required in the substrate manufacturing process can be satisfied. .

Although the present invention has been described with reference to an illustrated embodiment, it is not limited to this embodiment and can be practiced with modifications and changes without departing from the spirit of the invention. It should be understood that modifications are also included in the technical concept of the present invention.

REFERENCE SIGNS LIST 100 heat treatment oven 200 chamber 300 heater unit 301 conductive part 302 heating wire 310 pipe 311 power sleeve 312 sleeve heat dissipation block 321 upper heat transfer plate 322 lower heat transfer plate 323 opening hole 330 bush part 331 bush 332 hollow hole 340 fixer 341 fixing nut 342 washer

Claims (6)

A heater of a heat treatment oven comprising a chamber for housing a substrate for heating and drying the substrate, and mounting a plurality of heater units in the chamber to heat or dry the substrate via the heat generated from the heater unit. being a unit
The heater unit includes a heated pipe containing a heating wire that generates heat by electrical resistance, an upper heat transfer plate and a lower heat transfer plate disposed above and below the pipe, and the upper heat transfer plate and the lower heat transfer plate. a plurality of bushing portions disposed between the heat transfer plate, maintaining a distance between the upper heat transfer plate and the lower heat transfer plate, and supporting the upper heat transfer plate and the lower heat transfer plate. , heating units of heat treatment ovens. 2. The heater unit of a heat treatment oven as set forth in claim 1, wherein said pipe is circular with a hollow. 2. The pipe as set forth in claim 1, wherein a power sleeve is attached to one end of the pipe to supply power by being connected to a conductive part, and a sleeve heat dissipation block is arranged based on the arrangement position of the power sleeve. heat treatment oven heater unit. The bush part has a hollow hole and includes a bush positioned along the opening of the lower heat transfer plate, and the bush is mounted and fixed along the opening through a support means. A heater unit of a heat treatment oven according to claim 1, characterized in that. The support means includes a fixer projecting downward from the upper heat transfer plate so as to be centered in an opening formed in the lower heat transfer plate and entering along the hollow hole of the bush; 5. The heater unit of a heat treatment oven according to claim 4, further comprising a fixing nut that supports the bottom surface of the heat transfer plate. 6. The heat treatment oven as set forth in claim 5, wherein a washer is installed between the lower surface of the lower heat transfer plate and the upper surface of the fixing nut to prevent the fixer from floating and deforming. heater unit.

Images