JP2022138107A - Method for manufacturing laminated coil component - Google Patents

Abstract

To provide a manufacturing method of a lamination coil component capable of thinning an insulating layer between conductors.SOLUTION: A manufacturing method of a lamination coil component 1 includes the steps of forming a plurality of insulator layers by a photolithographic method using a photosensitive insulating paste, forming a plurality of conductors and via conductors by a photolithographic method using a photosensitive conductive paste to form a first conductor, forming a first insulator layer around the first conductor so as to be flush with the top surface of the first conductor, forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and forming a second conductor connected to the first conductor through the via hole on the second insulator layer.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method of manufacturing a laminated coil component.

As a conventional method for manufacturing a laminated coil component, for example, the method described in Patent Document 1 is known. A method for manufacturing a laminated coil component described in Patent Document 1 is a lamination having a plurality of chips each including a coil body enclosed in an insulating layer and a pair of external electrodes connected to both ends of the coil body and exposed from the insulating layer. In the lamination step, a conductor paste is used to form a conductor pattern for the coil body on the insulating layer and an external electrode pattern for the external electrode is formed on the insulating layer by photolithography. A first step of forming on the side part of and using an insulating paste, by a photolithography method, an insulating layer having a notch part continuous with the via hole and the external electrode pattern that looks into the conductor pattern is formed on the conductor pattern and the external electrode pattern and a second step of forming on the

Japanese Patent No. 4816971

Miniaturization and improved characteristics are desired for laminated coil components. In order to reduce the size and improve the characteristics of laminated coil components, it is necessary to reduce the thickness of the insulating layer between adjacent conductor patterns. In the conventional method of manufacturing a laminated coil component, an insulator layer provided around the conductor patterns and an insulator layer between the conductor patterns are formed at the same time. This method cannot reduce the thickness of the insulating layer between the conductor patterns.

An object of one aspect of the present invention is to provide a method of manufacturing a laminated coil component that can reduce the thickness of an insulator layer between conductors.

A method for manufacturing a laminated coil component according to one aspect of the present invention includes an element body formed by laminating a plurality of insulating layers, a plurality of conductors arranged in the element body, and the corresponding conductors connected to each other. and a coil configured to include via conductors, wherein a plurality of insulator layers are formed by a photolithographic method using a photosensitive insulator paste, and a plurality of A step of forming conductors and via conductors by photolithography using a photosensitive conductive paste to form a first conductor; forming a first insulator layer so as to be flat with the upper surface; and forming a second insulator layer on the first conductor and the first insulator layer, the second insulator layer having a via hole exposing a portion of the first conductor. and forming a second conductor on the second insulator layer that is connected to the first conductor through the via hole.

In the method for manufacturing a laminated coil component according to one aspect of the present invention, the first insulator layer is formed so as to be flat with the upper surface of the first conductor, and via holes are provided on the first conductor and the first insulator layer. forming a second insulator layer; That is, the thickness of the first conductor and the thickness of the first insulator layer are formed to be equal, and the second insulator layer is formed on the planar upper surfaces of the first conductor and the first insulator layer. As described above, in the method for manufacturing a laminated coil component, since the second insulator layer is formed after the heights of the first conductor and the first insulator layer are adjusted, the thickness of the second insulator layer is adjusted appropriately. can be done. Therefore, the thickness of the second insulator layer can be reduced. Therefore, in the method for manufacturing a laminated coil component, it is possible to reduce the thickness of the insulating layer between the conductors.

In one embodiment, in the step of forming the first insulator layer, the photosensitive insulator paste is applied to the entire area including the first conductor, and then the photosensitive insulator paste on the first conductor is removed. good too. In this method, the first insulator layer can be formed so as to be flush with the top surface of the first conductor.

In one embodiment, in the step of forming the second conductor, the via hole may be filled with a photosensitive conductive paste to simultaneously form the second conductor and the via conductor. With this method, the second conductor and the via conductor can be formed at the same time, so the efficiency of the manufacturing process can be improved.

In one embodiment, in the step of forming the first insulator layer, the thickness of the photosensitive conductive paste applied around the first conductor is greater than the thickness of the photosensitive conductive paste applied on the first conductor. You can make it bigger. In this method, since the photosensitive conductive paste on the first conductor is easily smoothed, it becomes easier to adjust the magnetic path length of the coil.

According to one aspect of the present invention, it is possible to reduce the thickness of the insulator layer between the conductors.

FIG. 1 is a perspective view of a laminated coil component according to one embodiment. FIG. 2 is a diagram showing a cross-sectional configuration of a laminated coil component. 3(a), 3(b), 3(c), 3(d), 3(e) and 3(f) are diagrams showing the manufacturing process of the laminated coil component. 4(a), 4(b), 4(c), 4(d), 4(e) and 4(f) are diagrams showing the manufacturing process of the laminated coil component. 5(a), 5(b), 5(c) and 5(d) are diagrams showing the manufacturing process of the laminated coil component.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

A laminated coil component according to an embodiment will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a perspective view of a laminated coil component according to one embodiment. FIG. 2 is a diagram showing a cross-sectional configuration of a laminated coil component. As shown in FIGS. 1 and 2 , the laminated coil component 1 includes an element body 2 , first terminal electrodes 3 and second terminal electrodes 4 , and a coil 5 .

The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges. The element body 2 has end surfaces 2a and 2b, main surfaces 2c and 2d, and side surfaces 2e and 2f as outer surfaces. The end faces 2a, 2b face each other. The main surfaces 2c and 2d face each other. Sides 2e and 2f face each other. Hereinafter, the facing direction of the main surfaces 2c and 2d is defined as a first direction D1, the facing direction of the end surfaces 2a and 2b is defined as a second direction D2, and the facing direction of the side surfaces 2e and 2f is defined as a third direction D3. The first direction D1, the second direction D2, and the third direction D3 are substantially orthogonal to each other.

The end faces 2a, 2b extend in the first direction D1 so as to connect the main faces 2c, 2d. The end surfaces 2a and 2b also extend in the third direction D3 so as to connect the side surfaces 2e and 2f. The main surfaces 2c, 2d extend in the second direction D2 so as to connect the end surfaces 2a, 2b. The main surfaces 2c and 2d also extend in the third direction D3 so as to connect the side surfaces 2e and 2f. The side surfaces 2e and 2f extend in the first direction D1 so as to connect the main surfaces 2c and 2d. The side surfaces 2e and 2f also extend in the second direction D2 so as to connect the end surfaces 2a and 2b.

Principal surface 2d is a mounting surface, and is a surface that faces another electronic device (for example, a circuit board or a laminated electronic component) when mounting laminated coil component 1 on another electronic device (for example, a circuit board or laminated electronic component) not shown. The end surfaces 2a and 2b are surfaces continuous from the mounting surface (that is, the main surface 2d).

In this embodiment, the length of the element 2 in the second direction D2 is longer than the length of the element 2 in the third direction D3 and the length of the element 2 in the first direction D1. The length of the element body 2 in the third direction D3 and the length of the element body 2 in the first direction D1 are, for example, equal to each other. That is, in this embodiment, the end surfaces 2a and 2b are square, and the main surfaces 2c and 2d and the side surfaces 2e and 2f are rectangular. The length of the element body 2 in the second direction D2 may be equal to the length of the element body 2 in the third direction D3 and the length of the element body 2 in the first direction D1, or may be longer than these lengths. It can be short. The length of the element body 2 in the third direction D3 and the length of the element body 2 in the first direction D1 may be different from each other.

In this embodiment, "equal" may mean equal to a value including a slight difference or a manufacturing error within a preset range. For example, multiple values are defined as equivalent if they fall within ±5% of the mean of the multiple values.

A first recess 7 and a second recess 8 are provided on the outer surface of the base body 2 . Specifically, the first concave portion 7 is provided in the end surface 2a and is recessed toward the end surface 2b. The second recessed portion 8 is provided on the end surface 2b and is recessed toward the end surface 2a.

The element body 2 is made of, for example, a dielectric material (one or more of alumina, magnesia, spinel, silica, forsterite, steatite, enstatite, diopside, cordierite, strontium feldspar, and zinc silicate). It is configured. The base body 2 may be made of ferrite (eg, Ni--Cu--Zn ferrite, Ni--Cu--Zn--Mg ferrite, Cu--Zn ferrite).

The first terminal electrode 3 is arranged on the side of the end surface 2 a of the element body 2 . The second terminal electrode 4 is arranged on the end surface 2 b side of the element body 2 . The first terminal electrode 3 and the second terminal electrode 4 are separated from each other in the second direction D2. The first terminal electrode 3 is arranged inside the first recess 7 . The second terminal electrode 4 is arranged inside the second recess 8 . The first terminal electrode 3 is arranged over the end surface 2a and the main surface 2d. The second terminal electrode 4 is arranged over the end surface 2b and the main surface 2d. In this embodiment, the surface of the first terminal electrode 3 is substantially flush with each of the end surface 2a and the main surface 2d. The surface of the second terminal electrode 4 is substantially flush with each of the end surface 2b and the main surface 2d. The first terminal electrode 3 and the second terminal electrode 4 are made of a conductive material (eg Ag and/or Pd).

The first terminal electrode 3 has an L shape when viewed from the third direction D3. The first terminal electrode 3 has a plurality of electrode portions 3a and 3b. The electrode portion 3a and the electrode portion 3b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 3a and the electrode portion 3b are integrally formed. The electrode portion 3a extends along the first direction D1. The electrode portion 3a has a rectangular shape when viewed from the second direction D2. The electrode portion 3b extends along the second direction D2. The electrode portion 3b has a rectangular shape when viewed from the first direction D1. Each electrode portion 3a, 3b extends along the third direction D3.

The first terminal electrode 3 is formed by laminating a plurality of first electrode layers 20, 21, 22, 23, 24, 25, 26 (see FIG. 5(d)) in the first direction D1. That is, the stacking direction of the first electrode layers 20 to 26 is the first direction D1. In the actual first terminal electrode 3, the plurality of first electrode layers 20 to 26 are integrated to such an extent that the boundaries between the layers cannot be visually recognized.

The second terminal electrode 4 has an L shape when viewed from the third direction D3. The second terminal electrode 4 has a plurality of electrode portions 4a and 4b. The electrode portion 4a and the electrode portion 4b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 4a and the electrode portion 4b are integrally formed. The electrode portion 4a extends along the first direction D1. The electrode portion 4a has a rectangular shape when viewed from the second direction D2. The electrode portion 4b extends along the second direction D2. The electrode portion 4b has a rectangular shape when viewed from the first direction D1. Each electrode portion 4a, 4b extends along the third direction D3.

The second terminal electrode 4 is formed by stacking a plurality of second electrode layers 30, 31, 32, 33, 34, 35, and 36 (see FIG. 5(d)) in the first direction D1. That is, the stacking direction of the second electrode layers 30 to 36 is the first direction D1. In the actual second terminal electrode 4, the plurality of second electrode layers 30 to 36 are integrated to such an extent that the boundaries between the layers cannot be visually recognized.

The first terminal electrode 3 and the second terminal electrode 4 may be provided with a plated layer (not shown) containing, for example, Ni, Sn, Au, or the like by electroplating or electroless plating. The plating layer may include, for example, a Ni plating film containing Ni and covering the first terminal electrode 3 and the second terminal electrode 4, and an Au plating film containing Au and covering the Ni plating film.

The coil 5 is arranged inside the element body 2 . One end of the coil 5 is connected to the first terminal electrode 3 by a connection conductor 48 (see FIG. 3(a)). The other end of the coil 5 is connected to the second terminal electrode 4 by a connection conductor 49 (see FIG. 5(b)). As shown in FIG. 2 , the coil 5 includes multiple coil conductors 40 , 41 , 42 , 43 , 44 , 45 , 46 and via conductors 70 . A plurality of coil conductors 40 to 46 are connected to each other to form the coil 5 . A coil axis of the coil 5 is provided along the first direction D1. The coil conductors 40 to 46 are arranged so that at least parts of them overlap each other when viewed in the first direction D1. Coil conductors 40 to 46 and via conductors 70 are spaced apart from end surfaces 2a, 2b, main surfaces 2c, 2d, and side surfaces 2e, 2f. The coil 5 is made of a conductive material (eg Ag and/or Pd).

Next, an example of a method for manufacturing the laminated coil component 1 will be described with reference to FIGS. 3, 4 and 5. FIG. 3(a) to 3(f), 4(a) to 4(f) and 5(a) to 5(d) show plan views and/or cross-sectional views in the manufacturing process. there is In this embodiment, the laminated coil component 1 is manufactured using a photolithography method. The “photolithography method” of the present embodiment is not limited to the type of mask and the like, as long as it processes a desired pattern by exposing and developing a layer to be processed containing a photosensitive material.

As shown in FIG. 3(a), first, a dielectric layer 10 is formed by coating a dielectric material on a substrate B (for example, PET film). Subsequently, the first electrode layer 20 , the second electrode layer 30 , the coil conductor (first conductor) 40 and the connection conductor 48 are formed on the dielectric layer 10 . The first electrode layer 20, the second electrode layer 30, the coil conductor 40 and the connection conductor 48 are formed using photolithography. Specifically, a photosensitive silver paste (photosensitive conductive paste) is applied on the dielectric layer 10 . Subsequently, the photosensitive silver paste is irradiated with ultraviolet rays through a mask (for example, a Cr mask) having a pattern of the first electrode layer 20, the second electrode layer 30, the coil conductor 40, and the connection conductor 48, and developed. The first electrode layer 20, the second electrode layer 30, the coil conductor 40 and the connection conductor 48 are formed by developing with a liquid. The first electrode layer 20 and the coil conductor 40 are electrically connected by a connection conductor 48 . Thereafter, the first electrode layers 21-26, the second electrode layers 31-36, the coil conductors 41-46, and the connection conductor 49 are formed by the same method as the photolithography method described above.

Next, as shown in FIG. 3B, a dielectric layer (first insulator layer) 50 is formed. A dielectric layer 50 is formed around the first electrode layer 20 , the second electrode layer 30 and the coil conductor 40 . Dielectric layer 50 is formed using a photolithography method. Specifically, a photosensitive dielectric paste is applied on the dielectric layer 10 , the first electrode layer 20 , the second electrode layer 30 , the coil conductor 40 and the connection conductor 48 . That is, the photosensitive dielectric paste is applied so as to cover the entire area of the first electrode layer 20, the second electrode layer 30, the coil conductor 40, and the connection conductor . At this time, the thickness of the photosensitive dielectric paste applied on the first electrode layer 20, the second electrode layer 30, the coil conductor 40, and the connection conductor 48 is the same as the thickness of the photosensitive dielectric paste applied on the other regions. less than That is, the thickness of the photosensitive dielectric paste applied to regions other than the first electrode layer 20, the second electrode layer 30, the coil conductor 40 and the connection conductor 48 is the same as the thickness of the first electrode layer 20, the second electrode layer 30, the coil It is greater than the thickness of the photosensitive dielectric paste on conductors 40 and connecting conductors 48 .

Subsequently, through a mask having a pattern of the first electrode layer 20, the second electrode layer 30, the coil conductor 40, and the connection conductor 48, the resin paste is exposed to ultraviolet light and developed with a developer to form a dielectric. A layer 50 is formed. The dielectric layer 50 is formed so as to be flat with the upper surface 40a of the coil conductor 40 (first electrode layer 20, second electrode layer 30). That is, the dielectric layer 50 is formed so that the thickness of the dielectric layer 50 and the thickness of the coil conductor 40 are the same. Thereafter, dielectric layers 51 to 56 are formed by a method similar to the photolithography method described above.

In the present embodiment, "flat" means that the upper surface of the coil conductor 40 and the upper surface of the dielectric layer 50 are equal in height, and includes slight differences or manufacturing errors within a preset range. good too. For example, it may include a range of ±2 to 3 μm with respect to the average value of the height of the coil conductor 40 (the distance from the dielectric layer 10 to the upper surface 40a in the first direction D1). When the thickness of the coil conductor 40 and the thickness of the dielectric layer 50 are different, it is preferable that the thickness of the dielectric layer 50 is larger than the thickness of the coil conductor 40 .

Next, as shown in FIG. 3C, a dielectric layer (second insulator layer) 60 is formed. The thickness of dielectric layer 60 is less than the thickness of dielectric layer 50 . Dielectric layer 60 is formed using a photolithography method. Specifically, a photosensitive dielectric paste is applied on the first electrode layer 20 , the second electrode layer 30 , the coil conductor 40 , the connection conductor 48 and the dielectric layer 50 . Subsequently, the photosensitive dielectric paste is irradiated with ultraviolet rays through a mask that partially exposes the first electrode layer 20, the second electrode layer 30, and the coil conductor 40, and is also developed with a developer to form a dielectric. A body layer 60 is formed. The dielectric layer 60 exposes portions of the first electrode layer 20 , the second electrode layer 30 and the coil conductor 40 . A via hole BH is provided in the dielectric layer 60 . Thereafter, dielectric layers 61 to 65 are formed by a method similar to the photolithography method described above.

Next, as shown in FIG. 3D, a first electrode layer 21, a second electrode layer 31 and a coil conductor (second conductor) 41 are formed. Specifically, a photosensitive silver paste is applied on the first electrode layer 20 , the second electrode layer 30 and the dielectric layer 50 . Thereby, the via hole BH of the dielectric layer 60 is filled with the photosensitive silver paste. Therefore, the coil conductor 41 and the via conductor 70 are formed at the same time. A first electrode layer 21 is formed on the first electrode layer 20 . The first electrode layer 21 is electrically connected to the first electrode layer 20 . A second electrode layer 31 is formed on the second electrode layer 30 . The second electrode layer 31 is electrically connected to the second electrode layer 32 . Coil conductor 41 is electrically connected to coil conductor 40 through via conductor 70 . Next, as shown in FIG. 3(e), a dielectric layer 51 is formed. Dielectric layer 51 is formed over dielectric layer 60 . Next, as shown in FIG. 3(f), a dielectric layer 61 is formed. The dielectric layer 61 exposes portions of the first electrode layer 21 , the second electrode layer 31 and the coil conductor 41 . A via hole BH is provided in the dielectric layer 61 .

Next, as shown in FIG. 4A, the first electrode layer 22, the second electrode layer 32 and the coil conductor 42 are formed. Specifically, a photosensitive silver paste is applied on the first electrode layer 21 , the second electrode layer 31 and the dielectric layer 51 . Thereby, the via hole BH of the dielectric layer 61 is filled with the photosensitive silver paste. A first electrode layer 22 is formed on the first electrode layer 21 . The first electrode layer 22 is electrically connected to the first electrode layer 21 . A second electrode layer 32 is formed on the second electrode layer 31 . The second electrode layer 32 is electrically connected to the second electrode layer 31 . Coil conductor 42 is electrically connected to coil conductor 41 through via conductor 70 . Next, as shown in FIG. 4(b), a dielectric layer 52 is formed. Dielectric layer 52 is formed on dielectric layer 61 . Next, as shown in FIG. 4(c), a dielectric layer 62 is formed. The dielectric layer 62 exposes portions of the first electrode layer 22 , the second electrode layer 32 and the coil conductor 42 . A via hole BH is provided in the dielectric layer 62 .

Next, as shown in FIG. 4D, the first electrode layer 23, the second electrode layer 33 and the coil conductor 43 are formed. Specifically, a photosensitive silver paste is applied on the first electrode layer 22 , the second electrode layer 32 and the dielectric layer 52 . Thereby, the via holes BH of the dielectric layer 62 are filled with the photosensitive silver paste. A first electrode layer 23 is formed on the first electrode layer 22 . The first electrode layer 23 is electrically connected to the first electrode layer 22 . A second electrode layer 33 is formed on the second electrode layer 32 . The second electrode layer 33 is electrically connected to the second electrode layer 32 . Coil conductor 43 is electrically connected to coil conductor 42 through via conductor 70 . Next, as shown in FIG. 4(e), a dielectric layer 53 is formed. Dielectric layer 53 is formed over dielectric layer 62 . Next, as shown in FIG. 4(f), a dielectric layer 63 is formed. The dielectric layer 63 exposes portions of the first electrode layer 23 , the second electrode layer 33 and the coil conductor 43 . A via hole BH is provided in the dielectric layer 63 .

Next, as shown in FIG. 5A, a first electrode layer 24 and a first electrode layer 25 are formed. A first electrode layer 24 is formed on the first electrode layer 23 . A first electrode layer 25 is formed on the first electrode layer 24 . Also, a second electrode layer 34 and a second electrode layer 35 are formed. A second electrode layer 34 is formed on the second electrode layer 33 . A second electrode layer 35 is formed on the second electrode layer 34 .

Also, a coil conductor 44 and a coil conductor 45 are formed. Coil conductor 44 is electrically connected to coil conductor 43 through via conductor 70 . Coil conductor 45 is electrically connected to coil conductor 44 via via conductor 70 .

Also, a dielectric layer 54 and a dielectric layer 55 are formed. Dielectric layer 54 is formed over dielectric layer 63 . Dielectric layer 55 is formed over dielectric layer 64 . Also, a dielectric layer 64 and a dielectric layer 65 are formed. A dielectric layer 64 is formed over the dielectric layer 54 . A dielectric layer 65 is formed over the dielectric layer 55 . A via hole BH is provided in each of the dielectric layers 64 and 65 .

Next, as shown in FIG. 5B, the first electrode layer 26, the second electrode layer 36, the coil conductor 46 and the connection conductor 49 are formed. A first electrode layer 26 is formed on the first electrode layer 25 . A second electrode layer 36 is formed on the second electrode layer 35 . Coil conductor 46 is electrically connected to coil conductor 45 through via conductor 70 . The second electrode layer 36 and the coil conductor 46 are electrically connected by a connection conductor 49 .

Next, as shown in FIG. 5(c), a dielectric layer 56 is formed. Dielectric layer 56 is formed over dielectric layer 65 . Next, as shown in FIG. 5(d), a dielectric layer 11 is formed. A dielectric layer 11 is formed on the first electrode layer 26 , the second electrode layer 36 and the dielectric layer 56 . Finally, the laminate is heat-treated and fired. As described above, the laminated coil component 1 is obtained. If necessary, the first terminal electrode 3 and the second terminal electrode 4 may be subjected to electrolytic plating or electroless plating to form a plating layer after the heat treatment.

As described above, in the laminated coil component 1 according to the present embodiment, the dielectric layers 50 to 55 are formed so as to be flat with the upper surfaces of the coil conductors 40 to 45, and the coil conductors 40 to 45 and the dielectric layer 50 Dielectric layers 60 to 65 provided with via holes BH on .about.55 are formed. That is, the thickness of the coil conductors 40 to 45 and the thickness of the dielectric layers 50 to 55 are equal to each other. form 65; As described above, in the method for manufacturing the laminated coil component 1, the dielectric layers 60 to 65 are formed after the heights of the coil conductors 40 to 45 and the dielectric layers 50 to 55 are adjusted. thickness can be adjusted appropriately. Therefore, the thickness of the dielectric layers 60-65 can be reduced. Therefore, in the method for manufacturing the laminated coil component 1, the thickness of the dielectric layers 60 to 65 between the conductors can be reduced.

In the method of manufacturing the laminated coil component 1 according to the present embodiment, in the step of forming the dielectric layers 50 to 56, the photosensitive dielectric paste is applied to the entire region including the coil conductors 40 to 46, and then the coil conductors 40 are coated. Remove the photosensitive dielectric paste on ~46. In this manner, the dielectric layers 50-56 can be formed so as to be flush with the top surfaces of the coil conductors 40-46.

In the method of manufacturing the laminated coil component 1 according to the present embodiment, in the step of forming the coil conductors 41, 43, 45, the via holes BH are filled with a photosensitive conductive paste to form the coil conductors 41, 43, 45 and the via conductors 70. and are formed at the same time. In this method, since the coil conductors 41, 43, 45 and the via conductors 70 can be formed simultaneously, the efficiency of the manufacturing process can be improved.

In the method of manufacturing the laminated coil component 1 according to the present embodiment, in the step of forming the dielectric layers 50-56, the thickness of the coil conductors 40-46 is greater than the thickness of the photosensitive conductive paste applied on the coil conductors 40-46. increase the thickness of the photosensitive conductive paste applied around the In this method, since the photosensitive conductive paste on the coil conductors 40 to 46 is easily smoothed, the magnetic path length of the coil 5 can be easily adjusted.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

In the above embodiment, the coil 5 has the coil conductors 40 to 46 as an example. However, the number of coil conductors is not limited to the above values.

In the above embodiment, the first terminal electrode 3 and the second terminal electrode 4 are L-shaped when viewed from the third direction D3. However, the shape of the first terminal electrode 3 and the second terminal electrode 4 is not limited to this, and may be, for example, a rectangular parallelepiped shape (rectangular shape when viewed from the second direction D2).

In the above embodiment, in the step of forming the coil conductors 41, 43, 45, the via holes BH are filled with a photosensitive conductive paste, and the coil conductors 41, 43, 45 and the via conductors 70 are formed at the same time. explained. However, the timing of forming coil conductors 41, 43, and 45 and the timing of forming via conductor 70 may be different.

In the above embodiment, in the step of forming the dielectric layers 50-56, the thickness of the photosensitive conductive paste applied around the coil conductors 40-46 is greater than the thickness of the photosensitive conductive paste applied on the coil conductors 40-46. A form in which the thickness of the paste is increased has been described as an example. However, the thickness of the photosensitive conductive paste applied on the coil conductors 40-46 and the thickness of the photosensitive conductive paste applied around the coil conductors 40-46 may be the same.

In the above-described embodiment, an example in which the element body 2 is made of a dielectric material has been described. However, the element body 2 may be made of ferrite. In this configuration, the insulator layers (layers corresponding to the dielectric layers 50 to 56 and 60 to 65 in the above embodiment) forming the element body 2 are formed using a photosensitive ferrite paste (photosensitive insulator paste). can do.

DESCRIPTION OF SYMBOLS 1... Laminated coil component, 2... Element body, 5... Coil, 40 to 46... Coil conductor (first conductor, second conductor), 40a... Upper surface, 50 to 56... Dielectric layer (first insulator layer), 60 to 65... dielectric layer (second insulator layer), 70... via conductor, BH... via hole.

Claims (4)

an element formed by laminating a plurality of insulator layers;
a coil arranged in the element body and configured to include a plurality of conductors and via conductors connecting the corresponding conductors, the method for manufacturing a laminated coil component,
forming a plurality of the insulator layers by photolithography using a photosensitive insulator paste;
forming a plurality of the conductors and the via conductors by a photolithographic method using a photosensitive conductive paste;
forming a first conductor;
forming a first insulator layer around the first conductor so as to be flat with the upper surface of the first conductor;
forming, on the first conductor and the first insulator layer, a second insulator layer provided with a via hole exposing a portion of the first conductor;
forming a second conductor on the second insulator layer to be connected to the first conductor through the via hole. In the step of forming the first insulator layer, after the photosensitive insulator paste is applied to the entire area including the first conductor, the photosensitive insulator paste on the first conductor is removed. Item 1. A method for manufacturing a laminated coil component according to Item 1. 3. The manufacturing of the laminated coil component according to claim 1, wherein in the step of forming the second conductor, the via hole is filled with the photosensitive conductive paste to simultaneously form the second conductor and the via conductor. Method. In the step of forming the first insulator layer, the thickness of the photosensitive conductive paste applied around the first conductor is made larger than the thickness of the photosensitive conductive paste applied on the first conductor. The method for manufacturing a laminated coil component according to any one of claims 1 to 3.

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