JP2021174733A - Circuit board module, connection system, and circuit board - Google Patents

Abstract

The present invention improves communication quality at a first terminal for signal transmission. A board module (first board module M1) includes a first terminal 4T, a second terminal 4P, and a board 150. The first terminal 4T transmits a signal. The second terminal 4P transmits power or a signal having a lower frequency than the signal transmitted by the first terminal 4T. The substrate 150 includes a ground pattern GND3, a second line 126, and a capacitive section (enlarged section 127). The second line 126 is electrically connected to the second terminal 4P. The capacitor portion forms a capacitance with the potential of the ground pattern GND3. The capacitor section is electrically connected to the second line 126. [Selection diagram] Figure 2

Description

The present disclosure generally relates to a board module, a connection system and a board, and more particularly to a board module including a terminal for signal transmission, a connection system including the board module, and a board used for the board module.

Patent Document 1 describes a connector and a shield cover that covers the connector. The connector electrically connects the first circuit board and the second circuit board by fitting the socket mounted on the first circuit board and the header mounted on the second circuit board. .. The shield cover engages with an engaging portion formed on one of the first circuit board and the second circuit board. The connector comprises a plurality of contacts arranged in one direction.

Japanese Unexamined Patent Publication No. 2013-182808

However, in a connector as described in Patent Document 1, noise may propagate between a plurality of contacts (first terminal and second terminal), which may deteriorate communication quality. ..

It is an object of the present disclosure to provide a substrate module, a connection system and a substrate capable of improving the communication quality at the first terminal for signal transmission.

The substrate module according to one aspect of the present disclosure includes a first terminal, a second terminal, and a substrate. The first terminal transmits a signal. The second terminal transmits power or transmits a signal having a lower frequency than the signal transmitted by the first terminal. The substrate is electrically connected to the first terminal and the second terminal. The substrate has a first footprint, a second footprint, a ground pattern, a first via, a second via, a first via pad, a second via pad, a first line, a second line, and the like. It has a capacitance part and. The first footprint is electrically connected to the first terminal. The second footprint is electrically connected to the second terminal. The first via is electrically connected to the first footprint. The second via is electrically connected to the second footprint. The first via pad is electrically connected to the first footprint via the first via. The second via pad is electrically connected to the second footprint via the second via. The first line is electrically connected to the first via pad. The potential of the second line is different from that of the ground pattern. The second line is electrically connected to the second via pad. The capacitance portion forms a capacitance with the potential of the ground pattern. The capacitance section is electrically connected to the second line.

The connection system according to one aspect of the present disclosure includes the board module and the mating board module. The mating board module includes a mating side first terminal, a mating side second terminal, and a mating side board. The mating first terminal is electrically connected to the first terminal of the board module. The other-side first terminal transmits a signal. The mating second terminal is electrically connected to the second terminal of the board module. The other-side second terminal transmits power or transmits a signal having a lower frequency than the signal transmitted by the other-side first terminal. The mating board is electrically connected to the mating first terminal and the mating second terminal.

The substrate according to one aspect of the present disclosure is used in the substrate module as the substrate.

The present disclosure has an advantage that the communication quality in the first terminal for signal transmission can be improved.

FIG. 1 is an exploded perspective view of the connection system according to the first embodiment. FIG. 2 is an exploded perspective view of the first board module of the connection system of the above. FIG. 3 is an exploded perspective view of the socket (connector) of the same connection system. FIG. 4 is a bottom view of the same socket. FIG. 5 is a plan view of the same socket. FIG. 6 is a perspective view of the outer shield of the same socket. FIG. 7 is an exploded perspective view of the second board module of the connection system of the above. FIG. 8 is an exploded perspective view of the header (connector) of the connection system of the above. FIG. 9 is a plan view of the header of the same. FIG. 10 is a bottom view of the header of the same. FIG. 11 is a perspective view of the outer shield of the header of the same. FIG. 12 shows a separated state of the socket and the header of the same as above, and is an end view including an inner shield of each of the socket and the header of the same as above. FIG. 13 shows the connection state of the socket and the header of the same as above, and is an end view including the inner shield of each of the socket and the header of the same as above. FIG. 14 shows a separated state of the socket and the header of the same as above, and is an end view including two terminals of each of the socket and the header of the same as above. FIG. 15 shows the connection state of the socket and the header of the same as above, and is an end view including two terminals of each of the socket and the header of the same as above. FIG. 16 is a bottom view schematically showing the socket of the same. FIG. 17 is an exploded perspective view of the first substrate module according to the second embodiment. FIG. 18 is an exploded perspective view of the first substrate module according to the third embodiment. FIG. 19 is an exploded perspective view of the first substrate module according to the fourth embodiment. FIG. 20 is an exploded perspective view of the first substrate module according to the fifth embodiment. FIG. 21 is an exploded perspective view of the first substrate module according to the sixth embodiment. FIG. 22 is an exploded perspective view of the first substrate module according to the seventh embodiment.

(Embodiment 1)
(1) Outline Hereinafter, the substrate module, the connection system, and the substrate according to the first embodiment will be described with reference to the drawings. However, the following embodiments are only one of the various embodiments of the present disclosure. The following embodiments can be variously modified according to the design and the like as long as the object of the present disclosure can be achieved. Further, each figure described in the following embodiment is a schematic view, and the ratio of the size and the thickness of each component in the figure does not necessarily reflect the actual dimensional ratio. ..

As shown in FIG. 1, the connection system 100 includes a first board module M1 and a second board module M2. The first board module M1 includes a first connector (socket S1) and a first board (board 150). The second board module M2 includes a second connector (header H1) and a second board (board 550). In the following description, the first connector is also referred to as "socket S1", and the second connector is also referred to as "header H1". The socket S1 is attached to the substrate 150. The socket S1 has a plurality of (two in FIG. 1) first terminals 4T and a plurality of (six in FIG. 1) second terminals 4P as the plurality of terminals 4. The header H1 is attached to the substrate 550. The header H1 has a plurality of (two in FIG. 1) first terminals 8T and a plurality of (six in FIG. 1) second terminals 8P as the plurality of terminals 8. The socket S1 is connected to the header H1 (see FIG. 15). At this time, each first terminal 4T of the socket S1 is electrically connected to each first terminal 8T of the header H1, and each second terminal 4P of the socket S1 is electrically connected to each second terminal 8P of the header H1. Be connected. Seen from the socket S1, the header H1 is a "counterpart connector" connected to the socket S1. On the contrary, when viewed from the header H1, the socket S1 is a "counterpart connector" connected to the header H1. That is, the connection system 100 includes a connector (socket S1 or header H1) and a mating connector. Further, when viewed from the first board module M1, the second board module M2 is a "counterpart board module" connected to the first board module M1. On the contrary, when viewed from the second board module M2, the first board module M1 is a "counterpart board module" connected to the second board module M2. That is, the connection system 100 includes a board module (first board module M1 or second board module M2) and a mating board module.

Hereinafter, among the first board module M1 and the second board module M2, the first board module M1 will be referred to as a board module, and the second board module M2 will be described as a mating board module. As shown in FIGS. 1 and 2, the substrate module (first substrate module M1) of the present embodiment includes a first terminal 4T, a second terminal 4P, and a substrate 150. The first terminal 4T transmits a signal. The second terminal 4P transmits power or transmits a signal having a lower frequency than the signal transmitted by the first terminal 4T. The substrate 150 is electrically connected to the first terminal 4T and the second terminal 4P. The substrate 150 includes a first footprint 113, a second footprint 123, a ground pattern GND3, a first via 114, a second via 124, a first via pad 115, a second via pad 125, and a first line. It has 116, a second line 126, and a capacitance section (enlarged section 127). The first footprint 113 is electrically connected to the first terminal 4T. Specifically, the first footprint 113 is electrically connected to the first terminal 4T via solder or the like. The second footprint 123 is electrically connected to the second terminal 4P. Specifically, the second footprint 123 is electrically connected to the second terminal 4P via solder or the like. The first via 114 is electrically connected to the first footprint 113. Specifically, the first via 114 is electrically connected to the first footprint 113 via a pattern or the like formed on the substrate 150. The second via 124 is electrically connected to the second footprint 123. Specifically, the second via 124 is electrically connected to the second footprint 123 via a pattern or the like formed on the substrate 150. The first via pad 115 is electrically connected to the first footprint 113 via the first via 114. The second via pad 125 is electrically connected to the second footprint 123 via the second via 124. The first line 116 is electrically connected to the first via pad 115. The potential of the second line 126 is different from that of the ground pattern GND3. The second line 126 is electrically connected to the second via pad 125. The capacitance section (expansion section 127) forms a capacitance with the potential of the ground pattern GND3. The capacitance section (expansion section 127) is electrically connected to the second line 126.

According to the above configuration, a capacitance is formed between the capacitance portion (enlarged portion 127) and the potential of the ground pattern GND3. Therefore, as compared with the case where there is no capacitance part (enlarged part 127), the resonance generated when the second terminal 4P and the second terminal 8P of the other side module are connected is suppressed, and one first terminal 4T and others are suppressed. It is possible to reduce the deterioration of communication quality due to crosstalk with the first terminal 4T of the above. Further, by reducing the crosstalk from the first terminal 4T to the second terminal 4P, the deterioration of the communication quality of the first terminal 4T is reduced, and at the same time, the amount of noise leaking from the second terminal 4P to the second line 126 is reduced. , It is also possible to reduce electromagnetic noise radiation. The capacitance section (enlarged section 127) reduces resonance caused by the wiring length of the second line 126 or the like, for example.

The second substrate module M2 has the same configuration as that of the first substrate module M1. That is, as shown in FIGS. 1 and 7, the mating board module (second board module M2) includes a mating side first terminal 8T, a mating side second terminal 8P, and a mating side board 550. The mating first terminal 8T is electrically connected to the first terminal 4T of the board module. The other party's first terminal 8T transmits a signal. The second terminal 8P on the other side is electrically connected to the second terminal 4P of the board module. The other-side second terminal 8P transmits power or transmits a signal having a lower frequency than the signal transmitted by the other-side first terminal 8T. The mating board 550 is electrically connected to the mating first terminal 8T and the mating second terminal 8P.

Further, the mating board 550 of the mating board module (second board module M2) has a mating first footprint 513, a mating second footprint 523, a mating ground pattern GND3, and a mating first via. 514, the other side second via 524, the other side first via pad 515, the other side second via pad 525, the other side first line 516, the other side second line 526, and the other side capacity part (enlargement part). 527) and. The mating side first footprint 513 is electrically connected to the mating side first terminal 8T. Specifically, the mating side first footprint 513 is electrically connected to the mating side first terminal 8T via solder or the like. The mating side second footprint 523 is electrically connected to the mating side second terminal 8P. Specifically, the mating side second footprint 523 is electrically connected to the mating side second terminal 8P via solder or the like. The mating first via 514 is electrically connected to the mating first footprint 513. Specifically, the mating side first via 514 is electrically connected to the mating side first footprint 513 via a pattern or the like formed on the mating side substrate 550. The mating second via 524 is electrically connected to the mating second footprint 523. Specifically, the mating side second via 524 is electrically connected to the mating side second footprint 523 via a pattern or the like formed on the mating side substrate 550. The mating first via pad 515 is electrically connected to the mating first footprint 513 via the mating first via 514. The mating side second via pad 525 is electrically connected to the mating side second footprint 523 via the mating side second via 524. The mating side first line 516 is electrically connected to the mating side first via pad 515. The potential of the other side second line 526 is different from that of the other side ground pattern GND3. The other side second line 526 is electrically connected to the other side second via pad 525. The mating capacity portion (enlarged portion 527) forms a capacitance with the potential of the mating side ground pattern GND3. The mating capacity portion (enlarged portion 527) is electrically connected to the mating side second line 526.

That is, capacitance portions are provided on both the substrate module and the mating substrate module. Therefore, the possibility of resonance at the second terminals 4P and 8P can be reduced as compared with the case where the capacitance portion is provided only on one of the substrate module and the mating substrate module.

The capacitance portion of the first substrate module M1 includes an expansion portion 127. The capacity portion of the present embodiment includes only the enlarged portion 127. The enlarged portion 127 overlaps with at least a part of the ground pattern GND3 in the thickness direction of the substrate 150. The expansion unit 127 is electrically connected to the second line 126. The enlarged portion 127 has conductivity.

The mating capacity portion of the second substrate module M2 includes an enlarged portion 527. The mating capacity portion of the present embodiment includes only the expansion portion 527. The enlarged portion 527 overlaps with at least a part of the mating side ground pattern GND3 in the thickness direction of the mating side substrate 550. The expansion unit 527 is electrically connected to the second line 526 on the other side. The enlarged portion 527 has conductivity.

The substrate 150 (or 550) is used for a substrate module (first substrate module M1 or second substrate module M2). The substrates 150 and 550 may be provided independently of the socket S1 or the header H1, respectively, or may be provided together with at least one of the socket S1 and the header H1.

In each drawing such as FIG. 1, only a region occupying a part of each of the substrates 150 and 550 is shown, and the actual substrates 150 and 550 have a larger area.

(2) Details Hereinafter, the substrate modules (first substrate module M1 and second substrate module M2) according to the present embodiment will be described in detail with reference to FIGS. 1 to 16.

Hereinafter, unless otherwise specified, the direction in which the socket S1 and the header H1 are connected or separated from each other is defined as the vertical direction (also referred to as the “first direction”), and the header H1 side as viewed from the socket S1 will be described as upward. Further, a direction orthogonal to the vertical direction and a longitudinal direction of the housing 2 of the socket S1 will be described as a front-rear direction (also referred to as a "second direction"). Further, a direction orthogonal to both the vertical direction and the front-rear direction, that is, the lateral direction of the housing 2 will be described as a horizontal direction (also referred to as a "third direction"). That is, in FIG. 3 and the like, each direction of up, down, front, back, left, and right is shown by the arrows of "top", "bottom", "front", "rear", "left", and "right". To specify. However, these directions are not intended to define the directions in which the socket S1 and the header H1 are used. In addition, the arrows indicating each direction in the drawing are shown only for the sake of explanation, and are not accompanied by an entity.

The connector and the mating connector are connected to each other by moving at least one toward the other in the first direction. In the present embodiment, the socket S1 is arranged below the header H1, and the socket S1 and the header are moved by at least one of the movement of the socket S1 up and the movement of the header H1 down. H1 and H1 are connected to each other. Therefore, "the other side connector side when shifting from the non-connected state of the connector and the other side connector to the connected state" means the upper side when the socket S1 is used as a connector, and the lower side when the header H1 is used as a connector. Means.

The socket S1 and the header H1 of the present embodiment are attached to a substrate 150 or 550 (see FIG. 13) such as a printed wiring board or a flexible printed wiring board, respectively. The socket S1 and the header H1 are used for electrically connecting a plurality of substrates mounted on a mobile terminal such as a smartphone. Of course, the purpose is not to limit the use of the socket S1 and the header H1, and the socket S1 and the header H1 may be used for an electronic device such as a camera module other than a mobile terminal. Further, the use of the socket S1 and the header H1 is not limited to the use of electrically connecting a plurality of boards, for example, between a board and a display, or between a board and a battery, or between a plurality of parts. Any application may be used for electrical connection.

A plurality of circuit components (for example, capacitors, inductors, resistors, ICs, etc.) are mounted on the boards 150 and 550, respectively. The boards 150 and 550 can be electrically connected via the socket S1 and the header H1 to form a circuit using a plurality of circuit components.

(2.1) Board of First Board Module The plan view shape of the board 150 of the first board module M1 is rectangular. The plan view shape of the substrate 150 may be another shape, for example, an L shape.

The substrate 150 is a laminated substrate having three or more layers. As shown in FIG. 2, the substrate 150 has a substrate 160. The base material 160 includes a first base material 161 and a second base material 162 and a third base material 163. The first base material 161 and the second base material 162 and the third base material 163 overlap each other in the vertical direction. The second base material 162 is sandwiched between the first base material 161 and the third base material 163. The first base material 161 is in contact with the socket S1.

The substrate 150 includes at least a first layer LA1, a second layer LA2, and a third layer LA3. The first layer LA1 is the upper surface of the first base material 161. The second layer LA2 is the upper surface of the second base material 162. The third layer LA3 is the upper surface of the third base material 163. The first layer LA1, the second layer LA2, and the third layer LA3 are overlapped in the vertical direction. Of the first layer LA1, the second layer LA2, and the third layer LA3, the first layer LA1 is the closest to the socket S1, the second layer LA2 is the second closest to the socket S1, and the third layer LA3 is the closest to the socket S1. far. The first layer LA1 is in contact with the socket S1.

The substrate 150 further has a plurality of conductors. The plurality of conductors are, for example, copper foil or solder. The plurality of conductors are provided on the surface and inside of the base material 160. The substrate 150 includes a plurality of conductors 180, two first footprints 113, six second footprints 123, a plurality of ground patterns GND1 to GND3, two first vias 114 and 6, as at least a part of the plurality of conductors. It has one second via 124 (only one is shown in FIG. 2). Further, the substrate 150 has two first via pads 115, six (only one is shown in FIG. 2) second via pads 125, and two first lines 116, six (only one is shown in FIG. 2) as at least a part of the plurality of conductors. It has a second line 126 (shown only one in FIG. 2) and an enlarged portion 127 of six (only one is shown in FIG. 2).

In FIG. 4, the region where the conductor 180, the first footprint 113, and the second footprint 123 are provided is illustrated by a two-dot chain line. The conductor 180 electrically connects an electrostatic shield (an outer shield 1 and two inner shields 3 described later) to the ground pattern GND1. Specifically, the electrostatic shield is electrically connected to the ground pattern GND1 via solder or the like forming a part of the conductor 180. The first footprint 113 is electrically connected to the first terminal 4T. Specifically, the first footprint 113 is electrically connected to the first terminal 4T via solder or the like. The second footprint 123 is electrically connected to the second terminal 4P. Specifically, the second footprint 123 is electrically connected to the second terminal 4P via solder or the like.

The ground pattern is provided on the first layer LA1, the second layer LA2, and the third layer LA3, respectively. In the present specification, the ground pattern of the first layer LA1 is referred to as GND1, the ground pattern of the second layer LA2 is referred to as GND2, and the ground pattern of the third layer LA3 is referred to as GND3. The ground pattern GND3 is provided on substantially the entire surface of the third layer LA3. The ground patterns GND1 to GND3 are electrically connected to each other via a plurality of vias.

The first layer LA1 has a plurality of conductors 180, two first footprints 113, six second footprints 123 and a ground pattern GND1.

The two first terminals 4T are arranged at a distance from each other in the longitudinal direction of the substrate 150. Two first footprints 113 electrically connected to the two first terminals 4T are provided. The two first footprints 113 are arranged at a distance from each other in the longitudinal direction of the substrate 150. Two first vias 114 electrically connected to the two first footprints 113 are provided.

Each of the two first terminals 4T is electrically connected to the first line 116 via the corresponding first footprint 113, first via 114 and first via pad 115.

Each first via 114 is provided over the first layer LA1 and the second layer LA2. The second layer LA2 has two first via pads 115 and two first lines 116. Each first via 114 electrically connects the corresponding first footprint 113 with the first via pad 115. Each first via pad 115 is electrically connected to the corresponding first line 116. Each first line 116 is drawn out from the first via pad 115 along the lateral direction of the substrate 150. Each first line 116 is electrically connected to an external circuit of the first board module M1.

Seen from the thickness direction of the substrate 150, the six second terminals 4P are arranged between the two first terminals 4T. More specifically, the six second terminals 4P are arranged between the two first terminals 4T in the longitudinal direction of the substrate 150. Corresponding to the six second terminals 4P, six second footprints 123 electrically connected to the second terminals 4P are provided. The six second footprints 123 are located between the two first footprints 113 in the longitudinal direction of the substrate 150. Corresponding to the six second footprints 123, six second vias 124 electrically connected to the second footprint 123 are provided.

However, FIG. 2 illustrates only one of the six second vias 124. Similarly, in FIG. 2, one of the six second via pads 125, the six second lines 126, and the six expansion portions 127, which correspond one-to-one with the six second vias 124, is the second via pad 125. Only one second line 126 and one enlargement 127 are shown. The remaining five second via pads 125, five second lines 126, and five expansions 127 are provided, for example, in the second layer LA2. Each of the five enlarged portions 127 (not shown in FIG. 2) has, for example, a dimension smaller than that of the enlarged portion 127 shown in FIG. 2 and is formed in a region of the second layer LA2 where no other conductor is formed. Will be done.

Each second terminal 4P is electrically connected to the second line 126 and the expansion portion 127 via the corresponding second footprint 123, second via 124, and second via pad 125. That is, the first substrate module M1 includes a plurality of second terminals 4P, and at least one of the plurality of second terminal 4Ps is electrically connected to the expansion unit 127.

Of the plurality of second terminals 4P, some of the second terminals 4P may be electrically connected to the ground patterns GND1, GND2, or GND3. That is, some of the second terminals 4P may be ground terminals. The second via 124, the second via pad 125, the second line 126, and the expansion portion 127 corresponding to the ground terminal are not indispensable. Therefore, the substrate 150 may include at least one second via 124, a second via pad 125, a second line 126, and an enlarged portion 127, respectively. Further, it is not essential that the corresponding enlarged portion 127 exists for all of the plurality of second terminals 4P that are not the ground terminals. Of the plurality of second terminals 4P that are not ground terminals, some of the second terminals 4P are electrically connected to the corresponding enlargement unit 127, and the corresponding enlargement unit 127 is connected to the remaining second terminal 4P. It does not have to be. As described above, for reasons such as restrictions on the layout of the substrate 150, only the enlarged portion 127 corresponding to a part of the second terminal 4P may be provided.

Each second via 124 is provided over the first layer LA1 and the second layer LA2. The second layer LA2 has six second via pads 125, six second lines 126, and six expansion portions 127. Each second via 124 electrically connects the corresponding second footprint 123 to the second via pad 125. Each second via pad 125 is electrically connected to the corresponding second line 126 and the expansion portion 127. The enlarged portion 127 and the second via pad 125 are connected to each other in the same layer (second layer LA2) on the substrate 150. Each second line 126 is electrically connected to an external circuit of the first board module M1.

The direction in which the second line 126 is pulled out from at least one of the six second via pads 125 is the same as the direction in which the first line 116 is pulled out from each of the first via pads 115. That is, the second line 126 is pulled out from the second via pad 125 along a predetermined direction (direction of arrow A1) from which the first line 116 is pulled out from the first via pad 115 when viewed from the thickness direction of the substrate 150. It has been. Most of the enlarged portion 127 is provided on the side opposite to the side from which the second line 126 is pulled out when viewed from the second via 124 and the second via pad 125. Specifically, the area of the region of the enlarged portion 127 on the side opposite to the predetermined direction with respect to the second via 124 is on the same side as the predetermined direction with respect to the second via 124 of the enlarged portion 127. It is larger than the area of the region (the region closer to the tip of the arrow A1 than the base end of the arrow A1 in FIG. 2).

Further, the sum of the area of the enlarged portion 127 and the area of the second via pad 125 corresponding to the enlarged portion 127 is larger than the area of the (one) second footprint 123 corresponding to the enlarged portion 127. As described above, since the sum of the area of the enlarged portion 127 and the area of the second via pad 125 is relatively large, the capacitance formed by these and the ground pattern GND3 can be made relatively large, and the resonance of the second terminal 4P can be increased. The effect of suppressing static electricity can be improved.

It is desirable that the sum of the area of the enlarged portion 127 and the area of the second via pad 125 corresponding to the enlarged portion 127 is 10 times or more the area of the second footprint 123 corresponding to the enlarged portion 127. More preferably, it is 10 times or more and 100 times or less, or 10 times or more and several hundred times or less.

Further, it is desirable that the sum of the area of the enlarged portion 127 and the area of the second via pad 125 corresponding to the enlarged portion 127 is 10 times or more the area of each first footprint 113. More preferably, it is 10 times or more and 100 times or less, or 10 times or more and several hundred times or less.

In the thickness direction of the substrate 150, the enlarged portion 127 overlaps with at least a part of the ground pattern GND3 of the third layer LA3. That is, the enlarged portion 127 overlaps at least a part of the ground pattern GND3 of the layer (third layer LA3) adjacent to the layer (second layer LA2) provided with the enlarged portion 127. The expansion unit 127 forms a capacitance with the ground pattern GND3. As a result, the possibility of resonance occurring at each second terminal 4P can be reduced as compared with the case where the enlarged portion 127 is not provided.

Further, in the thickness direction of the substrate 150, the first via pad 115 overlaps with at least a part of the ground pattern GND3 of the third layer LA3. The first via pad 115 forms a capacitance with the ground pattern GND3. The capacitance between the first electrode portion composed of the enlarged portion 127 and the second via pad 125 and the second electrode portion composed of the ground pattern GND3 is larger than the capacitance between the first via pad 115 and the ground pattern GND3. big. As described above, since the capacitance is relatively large, the effect of suppressing the resonance of the second terminal 4P can be improved.

In addition, in the ground pattern GND3, the portion overlapping with the first via pad 115 in the thickness direction of the substrate 150 may be missing. This makes it possible to reduce the reflection of the signal passing through the first terminal 4T.

The enlarged portion 127 may overlap with at least a part of the ground pattern GND1 of the first layer LA1. In this way, the enlarged portion 127 may form a capacitance with the ground pattern GND1. That is, the substrate 150 may further have a second ground pattern (ground pattern GND1) in addition to the first ground pattern (ground pattern GND3). The enlarged portion 127 may overlap with at least a part of the second ground pattern in the thickness direction of the substrate 150. The enlarged portion 127 is a layer (second layer LA2) between the layer provided with the first ground pattern (third layer LA3) and the layer provided with the second ground pattern (first layer LA1) on the substrate 150. It may be provided in.

The first layer LA1 has three regions R1 to R3 surrounded by a plurality of conductors 180. Each region R1 to R3 has a rectangular shape. Regions R1 to R3 are aligned in the longitudinal direction of the substrate 150. Region R1 is provided with one of the two first footprints 113 and a first via 114 electrically connected to the first footprint 113. Region R3 is provided with the other of the two first footprints 113 and a first via 114 electrically connected thereto. The region R2 between the regions R1 and the region R3 is provided with six second footprints 123 and six second vias 124. At least one of the six enlarged portions 127 overlaps a part of the region R2 in the vertical direction.

The enlargement portion 127 overlaps at least a part of the corresponding second footprint 123 in the thickness direction of the substrate 150. Further, the enlarged portion 127 overlaps at least a part of the corresponding second terminal 4P in the thickness direction of the substrate 150. As described above, since the enlarged portion 127 is provided at a position relatively close to the second footprint 123 and the second terminal 4P, the effect of suppressing the resonance of the second terminal 4P can be improved.

Further, the enlarged portion 127 is provided at a position where it does not overlap with each of the first via pads 115 and each of the first lines 116 in the thickness direction of the substrate 150. As a result, the possibility that noise is radiated from the enlarged portion 127 to the electric circuit (first line 116 or the like) on the first terminal 4T side can be reduced, and the communication quality at the first terminal 4T can be improved.

(2.2) Substrate of Second Substrate Module Hereinafter, the substrate 550 of the second substrate module M2 will be described. However, since the configuration of the substrate 550 of the second substrate module M2 is the same as the configuration of the substrate 150 of the first substrate module M1, the description thereof will be omitted as appropriate.

As shown in FIGS. 1 and 7, the substrate 550 has a substrate 560. The base material 560 includes a first base material 561, a second base material 562, and a third base material 563. The base material 560, the first base material 561, the second base material 562, and the third base material 563 of the second substrate module M2 are the base material 160, the first base material 161 and the second base material 162 of the first substrate module M1. And corresponds to the third base material 163. The first base material 561 is in contact with the header H1.

Further, the substrate 550 includes at least the first layer LA1, the second layer LA2, and the third layer LA3, similarly to the substrate 150. The first layer LA1 is the lower surface of the first base material 561. The second layer LA2 is the lower surface of the second base material 562. The third layer LA3 is the lower surface of the third base material 563. The first layer LA1 is in contact with the header H1.

The substrate 550 further has a plurality of conductors. More specifically, the substrate 550 has a configuration corresponding to a plurality of conductors of the first substrate module M1, a plurality of conductors 580, two first footprints 513, six second footprints 523, and a plurality of ground patterns GND1. It has ~ GND3, two first vias 514 and six second vias 524 (only one is shown in FIG. 7). Further, the substrate 550 has two first via pads 515, six (only one is shown in FIG. 7) second via pads 525, and two first via pads 515, as a configuration corresponding to a plurality of conductors of the first substrate module M1. It has a second line 516, six lines (only one is shown in FIG. 7) and an enlarged portion 527 of six lines (only one is shown in FIG. 7).

Similar to the first substrate module M1, the second substrate module M2 is also provided with the enlarged portion 527, so that the possibility of resonance occurring at the second terminal 8P of the second substrate module M2 can be reduced. Further, as shown in FIG. 15, the second terminal 8P is electrically connected to the second terminal 4P of the first substrate module M1. Therefore, the enlarged portion 127 of the first substrate module M1 also contributes to the suppression of resonance at the second terminal 8P of the second substrate module M2. Further, the enlarged portion 527 of the second substrate module M2 also contributes to the suppression of resonance at the second terminal 4P of the first substrate module M1.

In the connection system 100 of the present embodiment, the electrostatic shields (the outer shield 1, the outer shield 5, the two inner shields 3, and the two inner shields 7 described later) also contribute to the reduction of the noise level.

(3) Socket and Header (3.1) Socket Configuration Next, the configuration of the socket S1 according to the present embodiment will be described.

The socket S1 is twice symmetrical with respect to an axis passing through the center of the socket S1 and along the vertical direction as a target axis. As shown in FIG. 3, the socket S1 includes an outer shield 1, a housing 2, a plurality (two) inner shields 3, and a plurality (8) terminals 4. Each of the outer shield 1 and the plurality of inner shields 3 is an electrostatic shield. The outer shield 1 surrounds a plurality of terminals 4. That is, the outer shield 1 is arranged outside the plurality of terminals 4. The plurality of inner shields 3 are arranged inside the outer shield 1. Further, the plurality of inner shields 3 are arranged inside the housing 2.

A substrate 150 (see FIG. 14) is mechanically and electrically connected to the socket S1. In the present embodiment, the substrate 150 is a laminated substrate, but the substrate 150 may be a double-sided substrate. The substrate 150 has a substrate 160 (see FIG. 14), conductors 170, 180, and a first footprint 113 and a second footprint 123 (see FIGS. 2 and 14). The base material 160 is, for example, a semiconductor base material or a glass base material. The conductor 170 is a pattern such as a copper foil provided on the surface of the base material 160. The conductor 170 is provided, for example, on substantially the entire surface of the base material 160 on the side to which the socket S1 is connected. The conductor 170 includes, for example, a ground pattern GND1 (see FIG. 2), a conductor connected to the first footprint 113, and a conductor connected to the second footprint 123. The conductor 180, the first footprint 113 and the second footprint 123 are, for example, solder. The conductor 180, the first footprint 113 and the second footprint 123 are provided in a predetermined region (land) of the conductor 170. The conductor 170 is electrically connected to the outer shield 1 and the plurality of inner shields 3 via the conductor 180 (solder). The conductor 170 is electrically connected to the plurality of terminals 4 via the first footprint 113 and the second footprint 123 (solder). The outer shield 1 and the plurality of inner shields 3 are electrically connected to, for example, a ground pattern provided on the substrate 150. In FIG. 4, the region where the conductor 180, the first footprint 113, and the second footprint 123 (solder) are provided is illustrated by a two-dot chain line.

(3.1.1) Socket housing The housing 2 is a resin molded body. The housing 2 has electrical insulation. As shown in FIGS. 3 to 5, the housing 2 has a bottom wall 21 and a peripheral wall 22. The bottom wall 21 is formed in a rectangular shape that is longer in the front-rear direction than in the left-right direction in a plan view. The peripheral wall 22 projects upward from the entire circumference of the outer peripheral portion of one surface (upper surface) of the bottom wall 21 in the thickness direction. The housing 2 has a rectangular parallelepiped shape that is flat in the vertical direction, and has a recess 24 (see FIG. 5) surrounded by a peripheral wall 22 in the center of the upper surface that faces the header H1 on both sides in the vertical direction. Have.

The shape of the peripheral wall 22 is cylindrical. The peripheral wall 22 surrounds a plurality of terminals 4. The peripheral wall 22 is continuous over the entire circumference of the peripheral wall 22 in the circumferential direction. In other words, the peripheral wall 22 is formed so as to have no break over the entire circumference of the peripheral wall 22 in the circumferential direction. As shown in FIG. 3, the peripheral wall 22 includes two first peripheral walls 221 and two second peripheral walls 222. The two first peripheral walls 221 are portions of the peripheral walls 22 extending substantially parallel to each other in the front-rear direction, and face each other in the left-right direction via the recess 24. The two second peripheral walls 222 are portions of the peripheral walls 22 extending substantially parallel to each other in the left-right direction, and face each other in the front-rear direction via the recess 24. The two second peripheral walls 222 connect the ends of the two first peripheral walls 221 to each other. That is, the housing 2 has a shape in which one opening surface (lower surface) of the peripheral wall 22 having a square tubular cross section is closed by the bottom wall 21.

As shown in FIG. 5, the housing 2 further includes a first wall portion 25, a second wall portion 26, and a third wall portion 27. The first wall portion 25, the second wall portion 26, and the third wall portion 27 project upward from the bottom wall 21. The first wall portion 25, the second wall portion 26, and the third wall portion 27 are arranged in the recess 24. That is, the first wall portion 25, the second wall portion 26, and the third wall portion 27 are surrounded by the peripheral wall 22. The shapes of the first wall portion 25, the second wall portion 26, and the third wall portion 27 are rectangular parallelepiped, respectively. When viewed from the vertical direction, each of the first wall portion 25, the second wall portion 26, and the third wall portion 27 is longer in the front-rear direction than in the left-right direction. That is, each of the first wall portion 25, the second wall portion 26, and the third wall portion 27 is a wall portion having a thickness in the direction along the third direction (left-right direction). The first wall portion 25, the second wall portion 26, and the third wall portion 27 are arranged from left to right in this order.

Each of the plurality of wall portions (first wall portion 25, second wall portion 26, and third wall portion 27) has a plurality of (two) accommodating portions 28. An extension portion 32 of the inner shield 3 is accommodated in each of the plurality of accommodating portions 28. Each of the plurality of accommodating portions 28 is a through hole provided in the wall portion. The accommodating portion 28 penetrates the wall portion in the vertical direction. The accommodating portion 28 also penetrates the bottom wall 21 in the vertical direction. Further, when viewed from the vertical direction, the accommodating portion 28 provided in the first wall portion 25 and the third wall portion 27 is a side surface (a surface intersecting the left-right direction) of the first wall portion 25 (third wall portion 27). It is a recess that is recessed from the bottom.

Further, each of the plurality of wall portions (first wall portion 25, second wall portion 26, and third wall portion 27) has a plurality of terminal holding portions 29. Each of the plurality of terminal holding portions 29 holds the terminal 4. Each of the plurality of terminal holding portions 29 is a through hole provided in the wall portion. The wall portion penetrates in the terminal holding portion 29 in the vertical direction. Further, when viewed from the vertical direction, the terminal holding portion 29 is a recess recessed from the side surface of the wall portion (the surface intersecting the horizontal direction). The plurality of terminal holding portions 29 correspond to each other in a set of two, and the two terminal holding portions 29 corresponding to each other are arranged in the left-right direction. The portion of the bottom wall 21 between the two terminal holding portions 29 corresponding to each other is a through hole 211 into which the terminal 4 is inserted.

The plurality of terminals 4 are fixed to the housing 2 by press fitting. That is, the plurality of terminals 4 are held in the housing 2 by being pushed in one direction (upward) with respect to the housing 2. In this embodiment, eight terminals 4 are fixed to the housing 2. The eight terminals 4 are arranged in two rows. That is, of the eight terminals 4, four terminals 4 form the first row, and the remaining four terminals 4 form the second row. The four terminals 4 in each row are arranged in the front-rear direction. Each of the four terminals 4 constituting the first row is held by the terminal holding portion 29 of the first wall portion 25 and the terminal holding portion 29 of the second wall portion 26. Each of the four terminals 4 constituting the second row is held by the terminal holding portion 29 of the second wall portion 26 and the terminal holding portion 29 of the third wall portion 27. That is, each terminal 4 is arranged between the two wall portions and is supported from both sides by the two wall portions.

As shown in FIG. 4, the bottom wall 21 has a plurality of notches 212. The plurality of notches 212 are provided at positions facing the substrate connection portion 45 (described later) of the terminal 4 when viewed from the vertical direction. Further, the bottom wall 21 has a plurality (two) accommodating grooves 213. Each accommodating groove 213 is a groove provided on the lower surface of the bottom wall 21. The accommodating groove 213 is longer in the left-right direction than in the front-rear direction. The accommodating groove 213 accommodates the base 31 of the inner shield 3.

The peripheral wall 22 has a plurality of (four) insertion portions 223. The plurality (four) insertion portions 223 are recesses recessed from the side surfaces (inner surfaces) of the two first peripheral walls 221 and the two second peripheral walls 222. As will be described later, shield protrusions 14 that are a part of the outer shield 1 are inserted into each of the plurality (4) insertion portions 223.

(3.1.2) Outer Shield of Socket The outer shield 1 surrounds a plurality of terminals 4 and a plurality of inner shields 3. The outer shield 1 contains a metal as a main material or a material such as plating constituting the surface. Here, as an example, the outer shield 1 is formed of a metal as a main material. As shown in FIGS. 3 and 6, the outer shield 1 has a cylindrical portion 10 and a plurality of (four) shield projections 14. The tubular portion 10 includes an outer peripheral wall 11, a top wall 12, and an inner peripheral wall 13.

The outer peripheral wall 11 has a square cylindrical shape with a square cross section. The outer peripheral wall 11 includes two first outer peripheral walls 111 and two second outer peripheral walls 112. The two first outer peripheral walls 111 are portions of the outer peripheral wall 11 extending substantially parallel to each other in the front-rear direction and facing each other in the left-right direction. The two second outer peripheral walls 112 are portions of the outer peripheral wall 11 extending substantially parallel to each other in the left-right direction and facing each other in the front-rear direction. The two second outer peripheral walls 112 connect the ends of the two first outer peripheral walls 111 to each other. The lower end portions (lower surfaces) of the first outer peripheral wall 111 and the second outer peripheral wall 112 are parallel to a plane including the front-back and left-right directions, and are formed in substantially the same plane.

The shape of the top wall 12 is a rectangular frame when viewed from the vertical direction. The top wall 12 is connected to the upper end of the outer peripheral wall 11 and extends toward the inside of the outer peripheral wall 11 when viewed from the vertical direction.

The inner peripheral wall 13 is provided inside the outer peripheral wall 11. The inner peripheral wall 13 has a square cylindrical shape with a square cross section. The upper end of the outer peripheral wall 11 and the upper end of the inner peripheral wall 13 are connected by the top wall 12.

The inner peripheral wall 13 includes two first inner peripheral walls 131 and two second inner peripheral walls 132. The two first inner peripheral walls 131 are portions of the inner peripheral wall 13 extending substantially parallel to each other in the front-rear direction and facing each other in the left-right direction. The two second inner peripheral walls 132 are portions of the inner peripheral wall 13 extending substantially parallel to each other in the left-right direction and facing each other in the front-rear direction. The two second inner peripheral walls 132 connect the ends of the two first inner peripheral walls 131 to each other.

The outer peripheral wall 11, the top wall 12, and the inner peripheral wall 13 constitute a tubular portion 10 having both ends opened in the first direction (vertical direction). The outer peripheral surface of the outer peripheral wall 11 corresponds to the outer peripheral surface 101 of the tubular portion 10. The inner peripheral surface of the inner peripheral wall 13 corresponds to the inner peripheral surface 103 of the cylindrical portion 10. Further, the outer shield 1 has a tip surface 102. Of both ends of the tubular portion 10 in the first direction, the tip surface 102 is the mating side when the connector (here, socket S1) and the mating side connector (here, header H1) are transitioned from the non-connected state to the connected state. It is provided at one end (upper end) on the connector side. The tip surface 102 is provided in an annular shape along the inner edge of the tubular portion 10. Here, the upper surface of the top wall 12 corresponds to the tip surface 102. Further, the inner edge of the tip surface 102 corresponds to the inner edge of the cylindrical portion 10 at the upper end of the tubular portion 10.

The boundary portion b1 between the front end surface 102 and the outer peripheral surface 101 is an arcuate surface when viewed from the front-rear direction (see FIG. 12). Further, the boundary portion b2 between the tip surface 102 and the inner peripheral surface 103 is an arc-shaped surface when viewed from the front-rear direction (see FIG. 12). Here, the tip surface 102 is defined as a region of the outer surface of the tubular portion 10 where the acute angle formed in the vertical direction is 0 degrees or more and less than 45 degrees. Further, the outer surface having an acute angle of 45 degrees or more is defined as the outer peripheral surface 101, and the inner surface having the acute angle of 45 degrees or more is defined as the inner peripheral surface 103. It is assumed that the boundary portion b1 includes a part of the front end surface 102 and a part of the outer peripheral surface 101 over the entire circumference of the tubular portion 10 in the circumferential direction. It is assumed that the boundary portion b2 includes a part of the tip surface 102 and a part of the inner peripheral surface 103 over the entire circumference of the tubular portion 10 in the circumferential direction.

A plurality of (four) shield protrusions 14 are provided corresponding to each of the two first inner peripheral walls 131 and the two second inner peripheral walls 132. Each shield protrusion 14 projects downward from the corresponding first inner peripheral wall 131 or second inner peripheral wall 132. The plurality of (four) shield protrusions 14 have a one-to-one correspondence with the plurality (four) insertion portions 223 (see FIG. 4) provided in the housing 2. Each shield protrusion 14 is inserted into the corresponding insertion portion 223.

The outer shield 1 is insert-molded into the housing 2. More specifically, the outer shield 1 is insert-molded into the housing 2 so that the peripheral wall 22 of the housing 2 is inserted between the outer peripheral wall 11 and the inner peripheral wall 13 of the outer shield 1.

The entire surface of the outer shield 1 is seamlessly formed. The outer shield 1 is formed, for example, by drawing, whereby the entire surface of the outer shield 1 is seamlessly formed. In the present embodiment, at least the outer peripheral surface 101 and the inner peripheral surface 103 of the outer shield 1 surfaces are seamless over the entire circumferential direction of the tubular portion 10 (that is, there are no seams or cuts). Further, in the present embodiment, the tip surface 102 is seamless over the entire circumferential direction of the tubular portion 10.

For example, focusing on the outer peripheral surface 101, as shown in FIG. 6, the outer peripheral surface 101 includes an outer surface 1110 of each of the two first outer peripheral walls 111 and an outer surface 1120 of each of the two second outer peripheral walls 112. , Including. Each of the outer surface 1110 and the outer surface 1120 is seamless. Further, the outer surface 1110 and the outer surface 1120, which are two surfaces having different normal directions, are seamlessly connected. In this way, the outer peripheral surface 101 is seamless over the entire circumferential direction of the tubular portion 10.

Focusing on the inner peripheral surface 103, as shown in FIG. 6, the inner peripheral surface 103 is the outer surface 1310 of each of the two first inner peripheral walls 131 and the outer surface of each of the two second inner peripheral walls 132. 1320 and. Each of the outer surface 1310 and the outer surface 1320 is seamless. Further, the outer surface 1310 and the outer surface 1320, which are two surfaces having different normal directions, are seamlessly connected. In this way, the inner peripheral surface 103 is seamless over the entire circumferential direction of the tubular portion 10.

Further, at least one of the boundary portion b1 between the front end surface 102 and the outer peripheral surface 101 and the boundary portion b2 between the front end surface 102 and the inner peripheral surface 103 (both in the present embodiment) is in the circumferential direction of the tubular portion 10. It is seamless all around.

For example, at the upper right of the paper surface (corner portion of the outer shield 1) of FIG. 6, the outer surface 1110 of the first outer peripheral wall 111, the outer surface 1120 of the second outer peripheral wall 112, and the tip surface 102 are seamlessly connected. .. That is, the outer surface 1110, the outer surface 1120, and the tip surface 102, which are three surfaces having different normal directions, are seamlessly connected. Further, on the right side of the paper in FIG. 6, the outer surface 1110 and the tip surface 102, which are two surfaces having different normal directions, are seamlessly connected. Further, on the paper surface of FIG. 6, the outer surface 1120 and the tip surface 102, which are two surfaces having different normal directions, are seamlessly connected. In this way, the boundary portion b1 is seamless over the entire circumferential direction of the tubular portion 10.

Further, for example, at the lower left of the paper surface (corner portion of the outer shield 1) of FIG. 6, the outer surface 1310 of the first inner peripheral wall 131, the outer surface 1320 of the second inner peripheral wall 132, and the tip surface 102 are seamlessly connected. ing. That is, the outer surface 1310, the outer surface 1320, and the tip surface 102, which are three surfaces having different normal directions, are seamlessly connected. Further, on the left side of the paper in FIG. 6, the outer surface 1310 and the tip surface 102, which are two surfaces having different normal directions, are seamlessly connected. Further, under the paper surface of FIG. 6, the outer surface 1320 and the tip surface 102, which are two surfaces having different normal directions, are seamlessly connected. In this way, the boundary portion b2 is seamless over the entire circumferential direction of the tubular portion 10.

(3.1.3) Inner Shield of Socket In this embodiment, the shapes of the two inner shields 3 are the same. The inner shield 3 contains a metal as a main material or a material such as plating constituting the surface. Here, as an example, the inner shield 3 is formed of metal as a main material. As shown in FIGS. 3 and 12, the inner shield 3 has a base 31 and a plurality (three) extension portions 32 (two first extension portions 33 and one second extension portion 34). ing.

The base 31 has a length in a direction along a third direction (left-right direction). The shape of the base 31 is plate-like. When viewed from the thickness direction (front-back direction) of the base portion 31, the base portion 31 is longer in the left-right direction than in the up-down direction. The base 31 is housed in a housing groove 213 provided in the bottom wall 21 of the housing 2.

As shown in FIG. 12, the plurality of extension portions 32 project upward from the base portion 31. That is, when the plurality of extension portions 32 shift from the non-connected state to the connected state of the connector (here, socket S1) and the mating connector (here, header H1) along the first direction (vertical direction). It protrudes along the first direction (vertical direction) in the direction toward the mating connector side. The shape of each extension portion 32 is a plate shape. When viewed from the thickness direction (front-back direction) of each extension portion 32, each extension portion 32 is longer in the vertical direction than in the horizontal direction. The thickness direction of each extension portion 32 may be the left-right direction.

The first extension portion 33 includes an extension portion main body 331 and a contact portion 332. The extension body 331 is a portion protruding from the base 31. The contact portion 332 is a portion that comes into contact with the inner shield 7 of the mating connector (header H1). The contact portion 332 protrudes from the extension portion main body 331. The contact portion 332 is provided on a surface (here, a left surface or a right surface) of the first extension portion 33 (extension portion main body 331) along the length direction of the first extension portion 33. That is, the contact portion 332 projects in the left-right direction from the extension portion main body 331.

The contact portions 332 of the two first extension portions 33 face each other in the left-right direction. Each contact portion 332 contacts the contact portion 720 of the inner shield 7 of the header H1 (see FIG. 13). As a result, the two inner shields 3 are electrically connected to the corresponding inner shields 7 of the two inner shields 7 of the header H1, respectively. Specifically, the two extension portions 72 of the inner shield 7 are inserted between the two first extension portions 33 of the inner shield 3. At this time, the elasticity of the two extension portions 72 and the two first extension portions 33 presses the two extension portions 72 against the two first extension portions 33.

The second extension portion 34 includes an extension portion main body 341 and a plurality (two) of holding protrusions 342. The extension body 341 is a portion protruding from the base 31. The two holding protrusions 342 project from the extension main body 341. The two holding protrusions 342 are provided on the left end and the right end of the extension main body 341. That is, one of the two holding protrusions 342 protrudes to the left from the extension body 341, and the other protrudes to the right from the extension body 341.

Socket S1 has three extensions 32 on each of the two inner shields 3. That is, the socket S1 has a total of six extension portions 32. The six accommodating portions 28 (see FIG. 5) provided in the housing 2 have a one-to-one correspondence with the six extension portions 32. Each extension 32 is accommodated in a corresponding accommodating portion 28. More specifically, the first extension 33 is accommodated in the accommodating portion 28 included in the first wall portion 25 and the third wall portion 27, respectively, and the second extension portion 28 included in the accommodating portion 28 included in the second wall portion 26. Part 34 is housed. In the second extension portion 34, the width in the left-right direction including the two holding protrusions 342 is slightly larger than the width in the left-right direction of the accommodating portion 28. The inner shield 3 is fixed to the housing 2 by press fitting. That is, the inner shield 3 is held by the housing 2 by being pushed in one direction (upward) with respect to the housing 2. The inner shield 3 is held in the housing 2 with two holding protrusions 342 sandwiched between the inner surfaces of the accommodating portion 28.

Here, the accommodation space of each of the two first extension portions 33 in the shield holding portion (accommodation portion 28) is larger than that of each of the two first extension portions 33. That is, play is provided in the alignment between each of the two first extension portions 33 and the inner surface of the accommodating portion 28. The function of holding the inner shield 3 in the housing 2 is realized by at least the second extension portion 34. That is, at least the second extension portion 34 is press-fitted into the accommodating portion 28, so that the inner shield 3 is held in the housing 2. In short, the plurality of extension portions 32 are held by the first extension portion 33 including the contact portion 332 that contacts the inner shield 7 of the mating connector (header H1 in this case) and the shield holding portion (accommodation portion 28). The second extension 34 and the like. However, the second extension portion 34 may also include a contact portion that contacts the inner shield 7 of the mating connector (here, header H1).

As shown in FIG. 12, the base 31 of the inner shield 3 is located at the lower end of the socket S1. The inner shield 3 is surrounded by the outer shield 1. The inner shield 3 includes two tip regions r1 facing the outer shield 1. The two tip regions r1 are provided at both ends (left end and right end) of the base portion 31 in the length direction.

Here, the outer shield 1 has a first end e1 and a second end e2. The first end e1 is an end (upper end) that becomes the mating side connector side when the connector (here, socket S1) and the mating side connector (here, header H1) shift from the non-connected state to the connected state. The second end e2 is an end (lower end) opposite to the first end e1. Here, the second end e2 is a region extending over the entire circumference of the cylindrical portion 10 in the circumferential direction. The outer shield 1 faces two tip regions r1 in the region including the second end e2.

The outer shield 1 faces at least one of the two tip regions r1 with a gap g1 in between in the region including the second end e2. As shown in FIG. 12, conductors 170 and 180 of the substrate 150 are electrically connected to the outer shield 1. Further, the conductors 170 and 180 are provided so as to bridge the second end e2 of the outer shield 1 over the two tip regions r1 of the inner shield 3, respectively. That is, the outer shield 1 is electrically connected to the inner shield 3 via the conductors 170 and 180. On the other hand, in the absence of the substrate 150, the outer shield 1 is electrically insulated from at least one of the two tip regions r1 (both in the present embodiment) via the gap g1. The shortest distance L1 between the outer shield 1 and at least one of the two tip regions r1 in the gap g1 is 0.01 mm or more and 0.1 mm or less.

The inner shield 3 has a first end e3 and a second end e4. The first end e3 is an end (upper end) that becomes the mating side connector side when the connector (here, socket S1) and the mating side connector (here, header H1) shift from the non-connected state to the connected state. The second end e4 is an end (lower end) opposite to the first end e3. The inner shield 3 has a connecting surface 310 (lower surface) at the second end e4 that is electrically connected to the substrate 150. The connecting surface 310 is flat and continuous over the two tip regions r1. More specifically, the connecting surface 310 is a rectangular plane connecting the two tip regions r1.

(3.1.4) Socket Terminals (3.1.4.1) Arrangement As shown in FIGS. 4 and 5, the plurality (8) terminals 4 are the plurality (2) first terminals 4T. Includes (high frequency terminals) and a plurality (six) second terminals 4P (low frequency terminals). Each terminal 4 is inserted into a through hole 211 of the bottom wall 21 of the housing 2 and is held by the terminal holding portion 29.

The two first terminals 4T are arranged on both sides of the inner shield 3 so as to sandwich the at least one inner shield 3. In other words, at least one inner shield 3 is arranged between the two first terminals 4T. This makes it possible to reduce the possibility of noise propagation between the two first terminals 4T.

More specifically, the two first terminals 4T are arranged on both sides in the second direction (front-back direction) with respect to at least one inner shield 3, that is, on the front side and the rear side of the inner shield 3. Focusing on one of the two inner shields 3 in FIG. 4, one first terminal 4T is arranged in front of the inner shield 3, and the remaining one first terminal 4T is arranged behind the inner shield 3. Has been done. Further, two inner shields 3 are arranged between the two first terminals 4T. The length direction (left-right direction) of the inner shield 3 is a direction that intersects the direction in which the two first terminals 4T are lined up (substantially the front-rear direction).

The six second terminals 4P are arranged between the two inner shields 3. That is, the space where one of the two first terminals 4T is arranged and the space where the six second terminals 4P are arranged are separated by one of the two inner shields 3. Further, the space in which the other of the two first terminals 4T is arranged and the space in which the six second terminals 4P are arranged are separated by the other of the two inner shields 3. The six second terminals 4P are arranged in two rows, three each in the front-rear direction.

The three second terminals 4P in each row are arranged at equal pitches in the front-rear direction. Further, a first terminal 4T is arranged in front of or behind the second terminal 4P at the end of each row. The pitch between the second terminal 4P and the first terminal 4T is an integral multiple (twice in this embodiment) of the pitches of the three second terminals 4P. With such an arrangement, the process of incorporating the six second terminals 4P and the two first terminals 4T into the housing 2 can be easily realized.

In this embodiment, the pitch between the second terminal 4P and the first terminal 4T is longer than the pitch of the three second terminals 4P. As a result, a space for arranging the inner shield 3 can be secured between the second terminal 4P and the first terminal 4T.

Since a space in which a plurality of second terminals 4P are arranged is provided between the two first terminals 4T, the distance between the two first terminals 4T can be secured. As a result, the possibility of noise propagation between the two first terminals 4T can be further reduced. Further, the two first terminals 4T are arranged at diagonal positions inside the peripheral wall 22 of the housing 2. As a result, the distance between the two first terminals 4T can be made longer.

The two first terminals 4T are electrically connected to a signal line patterned by a conductor 170 on the substrate 150. At least one of the six second terminals 4P is electrically connected to a power supply line patterned by conductors 170 on the substrate 150. In the two first terminals 4T, a signal having a higher frequency is transmitted as compared with the six second terminals 4P. The frequency of the signal transmitted by the two first terminals 4T is, for example, about 5 to 50 GHz.

Further, at least one of the six second terminals 4P may be electrically connected to the inner shield 3. As a result, at least one of the six second terminals 4P has the same potential as the inner shield 3. Specifically, the potential of at least one of the six second terminals 4P and the potential of the inner shield 3 are ground potentials. At least one of the six second terminals 4P may be electrically connected to the inner shield 3 via, for example, conductors 170, 180 of the substrate 150. At least one of the six second terminals 4P may be electrically connected to the inner shield 3 regardless of the substrate 150.

(3.14.2) Shape The shape of each terminal 4 is the same as that of each other. Each terminal 4 is formed, for example, by punching, bending, or the like on a metal plate. As shown in FIG. 14, each terminal 4 includes a (first) contact portion 41, a base portion 42, a connecting portion 43, a protruding portion 44, a board connecting portion 45, and a (second) contact portion 46. have.

The board connection portion 45 is electrically connected to, for example, the first footprint 113 and the second footprint 123 (solder) of the board 150. That is, the substrate connecting portion 45 is bonded to the substrate 150 by a bonding means such as soldering. As a result, the substrate 150 and the terminal 4 are electrically and mechanically connected. Further, as shown in FIG. 4, the substrate connecting portion 45 is surrounded by the outer shield 1 when viewed from the first direction (vertical direction). Further, at least a part of the substrate connecting portion 45 and at least a part of the outer shield 1 are present on one plane orthogonal to the vertical direction.

The connecting portion 43 is formed in a U shape that is open downward. The connecting portion 43 connects the upper end portion of the base portion 42 and the upper end portion of the contact portion 41. The lower end of the base 42 is connected to the board connecting portion 45.

The protrusion 44 is formed in a U shape that is open upward. The protruding portion 44 connects the lower end portion of the contact portion 41 and the contact portion 46. The contact portion 41, which is the first contact portion, and the contact portion 46, which is the second contact portion, face each other in the left-right direction. In the present embodiment, at least the connecting portion 43 and the protruding portion 44 of the terminals 4 have elasticity.

With the terminal 4 held in the housing 2, at least a part of the contact portion 41 and the contact portion 46 is exposed when viewed from above. The contact portion 41 and the contact portion 46 come into contact with the corresponding terminal 8 of the plurality of terminals 8 (counterpart terminals) of the header H1 (counterpart connector) and are electrically connected to the terminal 8 (see FIG. 15). ). Specifically, the contact portion 81 and the contact portion 84 of the terminal 8 are inserted between the contact portion 41 and the contact portion 46. At this time, the contact portion 41 and the contact portion 46 are pressed against the terminal 8 by the elasticity of the protruding portion 44.

The terminal 4 further has a force sense unit 47. The force sense unit 47 gives a click feeling when the terminal 4 and the terminal 8 (the other side terminal) come into contact with each other. The force sense portion 47 is a protrusion protruding from the contact portion 41. When the force sense portion 85 (projection) of the terminal 8 gets over the force sense portion 47, a click feeling is generated. Specifically, when the force sense unit 85 moves downward and gets over the force sense unit 47, the magnitude of the force acting between the terminal 4 and the terminal 8 decreases, so that the terminal 4 and the terminal 8 The worker who connects the force perceives the decrease in the magnitude of the force as a click feeling. The operator can know the progress of the connection between the socket S1 and the header H1 by perceiving the click feeling. The connection between the socket S1 and the header H1 and the connection between the terminal 4 and the terminal 8 accompanying the connection are not limited to being made manually, but may be made by a machine.

When the terminal 4 and the terminal 8 are connected, the contact portion 46 is inserted into the recess 840 of the terminal 8. When shifting from the state in which the terminal 4 and the terminal 8 are connected to the state in which the terminal 8 is not connected, the force sense unit 85 moves upward to overcome the force sense unit 47, and the contact portion 46 is formed from the recess 840. It requires a certain amount of force to escape. As described above, the set of the force sense unit 85 and the force sense unit 47, and the set of the contact portion 46 and the recess 840 each form a lock mechanism capable of maintaining the connected state between the socket S1 and the header H1.

As shown in FIG. 5, the contact portion 332 of the inner shield 3 and the contact portion 41 of at least one of the plurality of terminals 4 are arranged in the second direction (front-back direction).

(3.1.5) Substrate on the socket side Socket S1 is electrically connected to the conductor 180, the first footprint 113, and the second footprint 123 (solder) of the substrate 150. In FIG. 4, a region on the lower surface of the socket S1 where the conductor 180, the first footprint 113, and the second footprint 123 are provided is illustrated by a two-dot chain line. A part of the conductor 180 is provided on the lower surface of the outer shield 1 along the circumferential direction of the outer shield 1. Here, on the lower surface of the outer shield 1, conductors 180 are provided in a plurality of regions existing at intervals in the circumferential direction of the outer shield 1, respectively. However, the conductor 180 may be continuously provided on the lower surface of the outer shield 1 over the entire circumference in the circumferential direction of the outer shield 1. That is, the outer shield 1 may be in continuous contact with the conductor 180 over the entire circumference in the circumferential direction.

Further, a part of the conductor 180 is provided so as to bridge the outer shield 1 and each inner shield 3. Further, a part of the conductor 180 is provided on the lower surface of each inner shield 3 along the length direction of the inner shield 3. Here, on the lower surface of each inner shield 3, conductors 180 are provided in each of a plurality (three) regions existing at intervals in the length direction of the inner shield 3. However, the conductor 180 may be continuously provided on the lower surface of each inner shield 3 over the entire length direction of the inner shield 3. That is, the inner shield 3 may be in continuous contact with the conductor 180 over the entire length direction thereof.

A part of the conductor 180 is thus electrically connected to the outer shield 1 and each inner shield 3, and is also electrically connected to the ground potential conductor 170 of the conductors 170 of the substrate 150. That is, the potentials of the outer shield 1 and each inner shield 3 become the ground potential. It is preferable that most of the surface of the base material 160 on the side to which the socket S1 is connected is occupied by the ground potential conductor 170. That is, it is preferable that the substrate 150 is provided with a so-called ground plane. As a result, the shielding effect can be enhanced.

Further, the first footprint 113 and the second footprint 123 are electrically connected to the board connection portion 45 of the terminal 4. The terminal 4 is electrically connected to an appropriate circuit or the like via a conductor 170 (wiring pattern) of the substrate 150. For example, the plurality of first terminals 4T are electrically connected to a circuit that processes a signal. Further, for example, at least a part of the second terminal 4Ps among the plurality of second terminal 4Ps is electrically connected to a wiring for transmitting a signal having a frequency lower than the signal transmitted by the first terminal 4T, or a power supply circuit or a ground pattern. Is connected.

(3.1.6) Electrically Closed Loop of Socket In FIG. 16, the arrangement of the outer shield 1, the plurality (two) inner shields 3, and the plurality (8) terminals 4 as viewed from below is schematically shown. show.

In the socket S1, at least a plurality (three) electrically closed loops LO1, LO2, and LO3 described below are formed. Each of the electrically closed loops LO1, LO2, LO3 is at least one or two insides of the outer shield 1, two inner shields 3, and the virtual paths W7, W8, W9, W10. Includes shield 3. That is, each of the electrically closed loops LO1, LO2, and LO3 always has a path completed within the outer shield 1 and a path completed within one inner shield 3 or within each of the two inner shields 3. Includes and optionally includes at least one of virtual paths W7, W8, W9, W10. The two virtual paths W7, W8 (or W9, W10) connect the outer shield 1 and the two tip regions r1 of the inner shield 3 with the shortest distance L1, respectively. Each of the electrically closed loops LO1, LO2, LO3 surrounds at least one terminal 4. Each of the electrically closed loops LO1, LO2, LO3 does not enclose the other electrically closed loops. Other electrically closed loops include an outer shield 1, two inner shields 3, and virtual paths W7, W8, W9, W10, of which at least the outer shield 1 and one or two inner shields 3. .. The electrical closed loop LO1 does not surround the electrical closed loops LO2 and LO3, the electrical closed loop LO2 does not surround the electrical closed loops LO1 and LO3, and the electrical closed loop LO3 does not surround the electrical closed loops LO1 and LO2.

In the present disclosure, when it is said that one electrically closed loop (hereinafter referred to as a first closed loop) surrounds another electrically closed loop (hereinafter referred to as a second closed loop), a part of the first closed loop and a second closed loop are used. It may overlap with a part of the closed loop of.

The longest loop length among the electrically closed loops LO1, LO2, and LO3 is shorter than the wavelength corresponding to the maximum frequency of the transmission signal flowing through the terminal 4. As a result, the possibility of resonance of the transmitted signal can be reduced. Here, the maximum frequency is, more specifically, the maximum frequency of the transmission signal flowing through the first terminal 4T. That is, in the present embodiment, the maximum frequency is determined according to the specifications of the first terminal 4T.

Unless it is limited to a plane orthogonal to the vertical direction (a plane parallel to the paper surface of FIG. 16), an electrically closed loop other than the electrically closed loops LO1, LO2, and LO3 is also formed in the socket S1, but all of them are formed. Since the loop length is shorter than that of the electrically closed loops LO1, LO2, and LO3, it is not discussed here.

Next, the paths W1 to W10 constituting the electrically closed loops LO1, LO2, and LO3 will be described.

Two inner shields 3 are arranged side by side in the socket S1. On the left side surface of the outer shield 1, there is a region r2 facing the left tip region r1 of the front inner shield 3 and a region r3 facing the left tip region r1 of the rear inner shield 3. On the right side surface of the outer shield 1, there is a region r4 facing the right tip region r1 of the front inner shield 3 and a region r5 facing the right tip region r1 of the rear inner shield 3.

The path W1 is included in the front region of the outer shield 1 and connects the regions r4 and r2 along the outer shield 1. The path W2 connects the regions r2 and r3 along the left side surface of the outer shield 1.

The path W3 is included in the rear region of the outer shield 1 and connects the regions r3 and r5 along the outer shield 1. The path W4 connects the regions r5 and r4 along the right side surface of the outer shield 1.

The path W5 connects the two tip regions r1 of the upper inner shield 3. The path W6 connects the two tip regions r1 of the lower inner shield 3.

The path W7 connects the region r2 of the outer shield 1 and the tip region r1 on the left side of the inner shield 3 on the front side with the shortest distance L1. The path W8 connects the region r4 of the outer shield 1 and the tip region r1 on the right side of the inner shield 3 on the front side with the shortest distance L1.

The path W9 connects the region r3 of the outer shield 1 and the tip region r1 on the left side of the inner shield 3 on the rear side with the shortest distance L1. The path W10 connects the region r5 of the outer shield 1 and the tip region r1 on the right side of the inner shield 3 on the rear side with the shortest distance L1.

The electrically closed loop LO1 is formed by paths W1, W7, W5, W8. The electrically closed loop LO2 is formed by paths W2, W9, W6, W10, W4, W8, W5, W7. The electrically closed loop LO3 is formed by paths W3, W10, W6, W9.

As described above, in the present disclosure, when one electrically closed loop (first closed loop) is said to surround another electrically closed loop (second closed loop), a part of the first closed loop and one of the second closed loops. The parts may overlap. For example, in FIG. 16, the first closed loop formed by the paths W4, W1, W2, W9, W6, and W10 and the electrically closed loop LO1 as the second closed loop overlap in the path W1 and The first closed loop surrounds the second closed loop.

In the present embodiment, the loop length of the electrically closed loop LO2 is the longest loop length among the electrically closed loops LO1, LO2, and LO3. An example of the longest loop length is about 6 to 7 [mm].

Assuming that the maximum frequency _{f MAX} of the transmission signal flowing in the terminal 4 to 10GHz ^{(10 10} Hz), the wavelength lambda corresponding to the maximum frequency ^{_{f MAX, λ = 3 × 10}} 8 / f MAX = 0.03 [m ] = 30 [mm]. Loop length of the longest, the case of 6 to 7 [mm], the loop length of the longest, the condition that is shorter than the wavelength λ corresponding to the maximum frequency f _MAX.

Further, the outer shield 1 constitutes an electrically closed loop LO4 surrounding the terminal 4 regardless of the inner shield 3. The electrically closed loop LO4 is formed by the paths W1, W2, W3, W4. That is, of the outer shield 1, the cylindrical portion 10 (see FIG. 6) that is continuous in the circumferential direction constitutes the electrically closed loop LO4. The electrically closed loop LO4 surrounds the electrically closed loops LO1, LO2, and LO3.

Here, since the outer shield 1 is formed so that there is no gap in the circumferential direction of the tubular portion 10, the outer shield 1 constitutes the electrically closed loop LO4 by itself. However, the outer shield 1 may form an electrically closed loop LO4 together with the conductors 170 and / or 180 of the substrate 150. That is, when a gap is formed in the outer shield 1, a path connecting both ends of the gap may be formed by conductors 170 and / or 180, and the electrically closed loop LO4 may include this path. Here, the conductors 170 and / or 180 need not be included in the configuration of the socket S1.

(3.2) Header Configuration Next, the configuration of the header H1 according to the present embodiment will be described. Of the configurations of the header H1, the same configurations as those of the socket S1 will be omitted as appropriate.

The header H1 is twice symmetrical with respect to an axis passing through the center of the header H1 and along the vertical direction as a target axis. As shown in FIG. 8, the header H1 includes an outer shield 5, a housing 6, a plurality (two) inner shields 7, and a plurality (8) terminals 8. Each of the outer shield 5 and the plurality of inner shields 7 is an electrostatic shield. The outer shield 5 surrounds the plurality of terminals 8. That is, the outer shield 5 is arranged outside the plurality of terminals 8. The plurality of inner shields 7 are arranged inside the outer shield 5. Further, the plurality of inner shields 7 are arranged inside the housing 6.

A substrate 550 (see FIG. 12) is mechanically and electrically connected to the header H1. The substrate 550 has the same configurations as the substrate 160 and the conductors 170 and 180, the first footprint 113 and the second footprint 123 of the substrate 150 connected to the socket S1, and has the same configuration as the substrate 560 (see FIG. 14) and the conductor 570. It has a 580, a first footprint 513 and a second footprint 523 (see FIGS. 7, 14). The conductor 570 is provided, for example, on substantially the entire surface of the base material 560 on the side to which the header H1 is connected. Further, in FIG. 9, the region where the conductor 580, the first footprint 513 and the second footprint 523 (solder) are provided is illustrated by a two-dot chain line.

(3.2.1) Header housing The housing 6 is a resin molded body. The housing 6 has electrical insulation. The housing 6 has a bottom wall 61 and a peripheral wall 62. The bottom wall 61 is formed in a rectangular shape that is longer in the front-rear direction than in the left-right direction in a plan view. The peripheral wall 62 projects downward from the outer peripheral portion of one surface (lower surface) of the bottom wall 61 in the thickness direction. The left side surface and the right side surface of the housing 6 have a plurality of notches 601 (two on the left side surface and two on the right side surface in FIG. 8) penetrating the bottom wall 61 and the peripheral wall 62 in the vertical direction. The plurality of notches 601 are provided at positions facing the board connection portion 83 of the terminal 8 when viewed from the vertical direction (see FIG. 9).

As shown in FIG. 10, the housing 6 further has two wall portions 65. Each wall portion 65 projects downward from the bottom wall 61. The shape of the wall portion 65 is a rectangular parallelepiped whose lower surface is curved like a cylindrical side surface (see FIG. 13). The front end and the rear end of the wall portion 65 are connected to the peripheral wall 62. When viewed from the vertical direction, the wall portion 65 is longer in the front-rear direction than in the left-right direction. That is, the wall portion 65 has a thickness in the direction along the third direction (left-right direction). The two wall portions 65 are arranged side by side.

Each wall portion 65 has a plurality of (two) accommodating portions 68. An extension portion 72 of the inner shield 7 is accommodated in each of the plurality of accommodating portions 68. Each of the plurality of accommodating portions 68 is a through hole provided in the wall portion 65. The accommodating portion 68 penetrates the wall portion 65 in the vertical direction. The accommodating portion 68 also penetrates the bottom wall 61 in the vertical direction. Further, when viewed from the vertical direction, the accommodating portion 68 provided in the wall portion 65 is a recess recessed from the side surface (the surface intersecting the left-right direction) of the wall portion 65.

Further, each wall portion 65 has a plurality of (four) terminal holding portions 69. One terminal 8 is held for each terminal holding portion 69. Each of the plurality of terminal holding portions 69 is a recess provided in the wall portion 65.

The plurality of terminals 8 are insert-molded into the housing 6. In this embodiment, eight terminals 8 are fixed to the housing 6. The eight terminals 8 of the header H1 correspond one-to-one with the eight terminals 4 of the socket S1. Each terminal 8 is arranged at a position connected to the corresponding terminal 4.

As shown in FIGS. 8 and 9, the bottom wall 61 has a plurality (two) of accommodating grooves 613. Each accommodating groove 613 is a groove provided on the upper surface of the bottom wall 61. The accommodating groove 613 is longer in the left-right direction than in the front-rear direction. The accommodating groove 613 accommodates the base 71 of the inner shield 7.

As shown in FIG. 10, the peripheral wall 62 has a plurality (two) insertion portions 623. Each of the plurality (two) insertion portions 623 is a recess provided on the bottom surface (lower surface) of the peripheral wall 62. As will be described later, shield protrusions 54, which are a part of the outer shield 5, are inserted into each of the plurality (two) insertion portions 623.

(3.2.2) Outer Shield of Header The outer shield 5 surrounds a plurality of terminals 8 and a plurality of inner shields 7. The outer shield 5 contains a metal as a main material or a material such as plating constituting the surface. Here, as an example, the outer shield 5 is formed of a metal as a main material. As shown in FIGS. 8 and 11, the outer shield 5 has an outer peripheral wall 51, a plurality (4) top walls 52, a plurality (2) shield protrusions 54, and a bottom wall 55. ing.

The outer peripheral wall 51 has a square cylindrical shape with a square cross section. The outer peripheral wall 51 includes two first outer peripheral walls 511 and two second outer peripheral walls 512. The two first outer peripheral walls 511 are portions of the outer peripheral wall 51 extending substantially parallel to each other in the front-rear direction and facing each other in the left-right direction. The two second outer peripheral walls 512 are portions of the outer peripheral wall 51 extending substantially parallel to each other in the left-right direction and facing each other in the front-rear direction. The two second outer peripheral walls 512 connect the ends of the two first outer peripheral walls 511 to each other.

The outer shield 5 further has a plurality of protrusions 56 protruding from the outer peripheral wall 51. The plurality of protrusions 56 function as contact portions that come into contact with the outer shield 1 of the mating connector (here, socket S1). The outer peripheral wall 51, the top wall 52, and the plurality of protrusions 56 form a tubular portion 50 having both ends opened in the first direction (vertical direction). That is, the tubular portion 50 includes an outer peripheral wall 51, a top wall 52, and a plurality of protrusions 56. The outer peripheral surface 501 of the tubular portion 50 includes a part of the outer peripheral surface of the outer peripheral wall 51 and the surfaces of the plurality of protrusions 56.

The outer shield 5 of the connector (here, header H1) has a side surface (outer peripheral surface 501) along the first direction (vertical direction). The side surface (outer peripheral surface 501) has a convex structure. That is, the structure composed of the plurality of protrusions 56 corresponds to the convex structure. The outer shield 5 of the connector (here, header H1) contacts the outer shield 1 of the mating connector (here, socket S1) in the convex structure (plurality of protrusions 56). More specifically, the plurality of protrusions 56 come into contact with the inner peripheral surface 103 of the tubular portion 10 of the outer shield 1 (see FIG. 13).

Compared with the case where the outer peripheral surface 501 is flat without a plurality of protrusions 56, the outer shield 1 can be pushed into the outer shield 5 even if the dimensions of the outer shields 1 and 5 are slightly different. It becomes. Therefore, for example, it is possible to reduce the possibility of poor contact such that the outer shields 1 and 5 are in contact with each other on one of the left and right sides (or front and back) and are separated from each other on the other side.

Each of the two first outer peripheral walls 511 is provided with three protrusions 56. One protrusion 56 is provided on the two second outer peripheral walls 512. The plurality of protrusions 56 are provided at intervals in the circumferential direction of the tubular portion 50. The maximum value of the creepage distances L2 and L3 between the plurality of protrusions 56 is 1/4 or less of the wavelength λ corresponding to the maximum frequency of the transmission signal flowing through the terminal 8. This makes it possible to reduce the possibility of noise leaking from the region between the plurality of protrusions 56 (the region of the outer shield 5 that is not electrically connected to the outer shield 1). Here, the creepage distance L2 between the protrusion 56 provided on the first outer peripheral wall 511 and the protrusion 56 provided on the second outer peripheral wall 512 is between the plurality of protrusions 56 provided on the first outer peripheral wall 511. It is larger than the creepage distance L3. That is, the maximum value of the creepage distance between the plurality of protrusions 56 is the creepage distance L2. Here, the maximum frequency is, more specifically, the maximum frequency of the transmission signal flowing through the first terminal 8T among the plurality of terminals 8. That is, in the present embodiment, the maximum frequency is determined according to the specifications of the first terminal 8T.

The shape of each of the plurality (four) top walls 52 is L-shaped when viewed from the vertical direction. The plurality (four) top walls 52 are connected to the lower ends of the four corners of the outer peripheral wall 51, and extend toward the inside of the outer peripheral wall 51 when viewed from the vertical direction.

The shape of the bottom wall 55 is a rectangular frame when viewed from the vertical direction. The bottom wall 55 is connected to the upper end of the outer peripheral wall 51 and extends toward the outside of the outer peripheral wall 51 when viewed in the vertical direction. The lower surface of the bottom wall 55 is formed so as to be parallel to a plane including the front-back and left-right directions.

The inner peripheral surface of the outer peripheral wall 51 corresponds to the inner peripheral surface 503 of the cylindrical portion 50. Further, the outer shield 5 has a tip surface 502. The tip surface 502 changes from the unconnected state to the connected state of the connector (here, header H1) and the mating connector (here, socket S1) among both ends of the tubular portion 50 in the first direction (vertical direction). It is provided at one end (lower end) on the other side connector side at the time of migration. The tip surface 502 is provided along the inner edge of the tubular portion 50. Here, the upper surface of the top wall 52 corresponds to the tip surface 502. Further, the inner edge of the tip surface 502 corresponds to a part of the inner edge of the tubular portion 50 at the lower end of the tubular portion 50.

The boundary portion b3 between the front end surface 502 and the outer peripheral surface 501 is an arcuate surface when viewed from the front-rear direction (see FIG. 12). Here, the tip surface 502 is defined as a region of the outer surface of the tubular portion 50 where the acute angle formed in the vertical direction is 0 degrees or more and less than 45 degrees. Further, the outer surface having an acute angle of 45 degrees or more is defined as the outer peripheral surface 501. It is assumed that the boundary portion b3 has a predetermined length along the circumferential direction of the tubular portion 10.

A plurality of (two) shield protrusions 54 are provided corresponding to two of the plurality (four) top walls 52. Each shield protrusion 54 projects upward from the corresponding top wall 52. The plurality of (two) shield protrusions 54 have a one-to-one correspondence with the plurality (two) insertion portions 623 (see FIG. 10) provided in the housing 6. Each shield projection 54 is inserted into the corresponding insertion portion 623.

The outer shield 5 is fixed to the housing 6 by press fitting. That is, the outer shield 5 is held by the housing 6 by being pushed in one direction (upward) with respect to the housing 6. At this time, the plurality of top walls 52 of the outer shield 5 cover at least a part of the peripheral wall 62 of the housing 6. Further, at this time, each shield protrusion 54 is inserted into the corresponding insertion portion 623.

The entire surface of the outer shield 5 is seamlessly formed. In the present embodiment, at least the outer peripheral surface 501 and the inner peripheral surface 503 of the outer shield 5 surfaces are seamless over the entire circumferential direction of the tubular portion 50 (that is, there are no seams or cuts).

As shown in FIG. 11, the outer peripheral surface 501 includes an outer surface 5110 (including the surface of the first outer peripheral wall 511 and the surface of the protrusion 56) corresponding to each of the two first outer peripheral walls 511, and two second outer peripheral surfaces. Includes an outer surface 5120 (including the surface of the second outer wall 512 and the surface of the protrusions 56) corresponding to each of the walls 512. Each of the outer surface 5110 and the outer surface 5120 is seamless. Further, the outer surface 5110 and the outer surface 5120, which are two surfaces having different normal directions, are seamlessly connected. In this way, the outer peripheral surface 501 is seamless over the entire circumferential direction of the tubular portion 50.

Further, as shown in FIG. 11, the inner peripheral surface 503 includes an inner surface 5111 of each of the two first outer peripheral walls 511 and an inner surface 5121 of each of the two second outer peripheral walls 512. Each of the inner surface 5111 and the inner surface 5121 is seamless. Further, the inner surface 5111 and the inner surface 5121, which are two surfaces having different normal directions, are seamlessly connected. In this way, the inner peripheral surface 503 is seamless over the entire circumferential direction of the tubular portion 10.

Further, the boundary portion b3 between the outer peripheral surface 501 and the tip surface 502 is seamless. For example, in the upper right corner of the paper surface (corner portion of the outer shield 5) of FIG. 11, the outer surface 5110, the outer surface 5120, and the tip surface 502, which are three surfaces having different normal directions, are seamlessly connected.

(3.2.3) Inner Shield of Header In this embodiment, the shapes of the two inner shields 7 are the same. The inner shield 7 contains a metal as a main material or a material such as plating constituting the surface. Here, as an example, the inner shield 7 is formed of metal as a main material. As shown in FIG. 12, the inner shield 7 has a base portion 71 and a plurality (two) extension portions 72 (first extension portions).

The base 71 has a length in a direction along a third direction (left-right direction). The shape of the base 71 is plate-like. When viewed from the thickness direction (front-back direction) of the base portion 71, the base portion 71 is longer in the left-right direction than in the up-down direction. The base 71 is housed in a storage groove 613 provided in the bottom wall 61 of the housing 6.

The plurality of extension portions 72 project downward from the base portion 71. That is, when the plurality of extension portions 72 shift from the non-connected state to the connected state of the connector (here, header H1) and the mating connector (here, socket S1) along the first direction (vertical direction). It protrudes along the first direction (vertical direction) in the direction toward the mating connector side. The shape of each extension portion 72 is a rectangular plate shape. When viewed from the thickness direction (front-back direction) of each extension portion 72, each extension portion 72 is longer in the vertical direction than in the horizontal direction. The thickness direction of each extension portion 72 may be the left-right direction.

The extension portion 72 includes a contact portion 720 (contact surface) that contacts the inner shield 3 of the mating connector (socket S1). The contact portion 720 is provided on a surface (here, a left surface or a right surface) of the extension portion 72 along the length direction of the extension portion 72. The abutting portions 720 of the two extension portions 72 face each other in opposite directions (rightward and leftward).

The header H1 has two extensions 72 on each of the two inner shields 7. That is, the header H1 has a total of four extension portions 72. The four accommodating portions 68 (see FIG. 10) provided in the housing 6 have a one-to-one correspondence with the four extension portions 72. Each extension 72 is accommodated in a corresponding accommodating portion 68.

The inner shield 7 is fixed to the housing 6 by press fitting. That is, the inner shield 7 is held by the housing 6 by being pushed in one direction (downward) with respect to the housing 6. At this time, each extension portion 72 is accommodated in the corresponding accommodating portion 68. Here, the accommodation space of each of the two extension portions 72 in the shield holding portion (accommodation portion 68) is larger than that of each of the two extension portions 72.

As shown in FIG. 12, the base 71 of the inner shield 7 is located at the upper end of the header H1. Here, the outer shield 5 has a first end e5 and a second end e6. The first end e5 is an end (lower end) that becomes the mating side connector side when the connector (here, header H1) and the mating side connector (here, socket S1) shift from the non-connected state to the connected state. The second end e6 is an end (upper end) opposite to the first end e5. Here, the second end e6 is a region extending over the entire circumference of the bottom wall 55 of the outer shield 5 in the circumferential direction. The outer shield 5 faces the two tip regions r7 of the inner shield 7 in the region including the second end e6.

The outer shield 5 faces at least one of the two tip regions r7 with a gap g7 in between in the region including the second end e6. As shown in FIG. 12, conductors 570 and 580 of the substrate 550 are electrically connected to the outer shield 5. Further, the conductors 570 and 580 are provided so as to bridge the second end e6 of the outer shield 5 to the two tip regions r7 of the inner shield 7, respectively. That is, the outer shield 5 is electrically connected to the inner shield 7 via the conductors 570 and 580. On the other hand, in the absence of the substrate 550, the outer shield 5 is electrically insulated from at least one (in this embodiment, both) of the two tip regions r7 via the void g7. The shortest distance L7 between the outer shield 5 and at least one of the two tip regions r7 in the gap g7 is 0.01 mm or more and 0.1 mm or less.

The inner shield 7 has a first end e7 and a second end e8. The first end e7 is an end (lower end) that becomes the mating side connector side when the connector (here, header H1) and the mating side connector (here, socket S1) shift from the non-connected state to the connected state. The second end e8 is an end (upper end) opposite to the first end e7. The inner shield 7 has a connecting surface 710 (upper surface) electrically connected to the substrate 550 at the second end e8. The connecting surface 710 is planar and continuous over the two tip regions r7. More specifically, the connecting surface 710 is a rectangular plane connecting the two tip regions r7.

(3.2.4) Header Terminals As shown in FIGS. 9 and 10, the plurality (8) terminals 8 are the plurality (6) second terminals 8P and the plurality (2) first terminals. Includes terminal 8T. The arrangement of the plurality of terminals 8 is the same as the arrangement of the plurality of terminals 4 of the socket S1. That is, the content described in "(3.1.4.1) Arrangement" also applies to a plurality of terminals 8.

The shapes of the terminals 8 are the same as each other. Each terminal 8 is formed, for example, by punching, bending, or the like on a metal plate. As shown in FIG. 14, each terminal 8 has a (first) contact portion 81, a winding piece 82, a substrate connection portion 83, and a (second) contact portion 84.

The board connection portion 83 is electrically connected to, for example, the first footprint 513 and the second footprint 523 (solder) of the board 550. That is, the substrate connecting portion 83 is bonded to the substrate 550 by a bonding means such as soldering. As a result, the substrate 550 and the terminal 8 are electrically and mechanically connected. Further, as shown in FIG. 9, the substrate connecting portion 83 is surrounded by the outer shield 5 when viewed from the first direction (vertical direction). Further, at least a part of the substrate connecting portion 83 and at least a part of the outer shield 5 are present on one plane orthogonal to the vertical direction.

The contact portion 81 and the contact portion 84 have a length in the vertical direction. The contact portion 81 is a portion that contacts the contact portion 41 of the terminal 4 of the socket S1, and the contact portion 84 is a portion that contacts the contact portion 46 of the terminal 4 of the socket S1. The winding piece 82 is formed in a U shape that is open upward. The winding piece 82 connects the lower end portion of the contact portion 81 and the lower end portion of the contact portion 84. The board connection portion 83 is a portion protruding from the upper end portion of the contact portion 81.

With the terminal 8 held in the housing 6, at least a part of the contact portion 81 and the contact portion 84 is exposed when viewed from below. The contact portion 81 and the contact portion 84 come into contact with the corresponding terminal 4 of the plurality of terminals 4 (counterpart terminals) of the socket S1 (counterpart connector) and are electrically connected to the terminal 4 (see FIG. 15). ).

The terminal 8 further has a force sense unit 85. The force sense unit 85 gives a click feeling when the terminal 8 and the terminal 4 (the other side terminal) come into contact with each other. The force sense portion 85 is a protrusion protruding from the contact portion 81. When the force sense portion 85 (protrusion) gets over the force sense portion 47 of the terminal 4, a click feeling is generated.

The contact portion 84 has a recess 840 on the contact surface with the contact portion 46. That is, the contact portion 46 is inserted into the recess 840. Here, the contact portion 46 comes into contact with the side surface of the recess 840.

As shown in FIG. 10, the contact portion 720 of the inner shield 7 and the contact portion 81 of at least one of the plurality of terminals 8 are arranged in the second direction (front-back direction).

(3.2.5) Substrate on the header side The header H1 is electrically connected to the conductor 580, the first footprint 513, and the second footprint 523 (solder) of the substrate 550. In FIG. 9, a region on the upper surface of the header H1 where the conductor 580, the first footprint 513, and the second footprint 523 are provided is illustrated by a two-dot chain line. The arrangement and electrical connection of the conductors 570 and 580 of the substrate 550, the first footprint 513, the second footprint 523, the outer shield 5, the plurality of inner shields 7, and the plurality of terminals 8 are the substrates corresponding to the socket S1. The same is true for the arrangement and electrical connection of the 150 conductors 170, 180, the first footprint 113, the second footprint 123, the outer shield 1, the plurality of inner shields 3, and the plurality of terminals 4.

(3.2.6) Electrically Closed Loop of Header The arrangement of the outer shield 5 of the header H1, the plurality (two) inner shields 7, and the plurality (8) terminals 8 is the outer side of the socket S1 shown in FIG. This is the same as the arrangement of the shield 1, the plurality (two) inner shields 3, and the plurality (8) terminals 4. Therefore, in the header H1, at least a plurality (three) electrically closed loops LO1, LO2, and LO3 are formed as in the socket S1. The details regarding the electrically closed loops LO1, LO2, LO3 of the header H1 are the same as the details regarding the electrically closed loops LO1, LO2, LO3 of the socket S1. Further, the outer shield 5, like the outer shield 1, constitutes an electrically closed loop LO4 that surrounds the terminal 8 regardless of the inner shield 7.

Here, since the outer shield 5 is formed so that there is no gap in the circumferential direction of the tubular portion 50, it constitutes the electrically closed loop LO4 by itself. However, the outer shield 5 may form an electrically closed loop LO4 together with the conductors 570 and / or 580 of the substrate 550. That is, when a gap is formed in the outer shield 5, a path connecting both ends of the gap may be formed by conductors 570 and / or 580, and the electrically closed loop LO4 may include this path. Here, the conductors 570 and / or 580 do not have to be included in the configuration of the header H1.

(4) Assembly Step Next, an example of a step of connecting the socket S1 and the header H1 to assemble the connection system 100 will be described with reference to FIGS. 12 to 15.

The substrate 150 is mechanically and electrically connected to the socket S1. The substrate 550 is mechanically and electrically connected to the header H1. In this state, as shown in FIGS. 12 and 14, the socket S1 is arranged below the header H1. Then, at least one of the movement of the socket S1 up and the movement of the header H1 down is performed. As a result, as shown in FIGS. 13 and 15, the socket S1 and the header H1 are mechanically connected. Further, as shown in FIG. 13, the inner shield 3 of the socket S1 and the inner shield 7 of the header H1 come into contact with each other and are electrically connected. Further, as shown in FIG. 15, the plurality of terminals 4 of the socket S1 and the plurality of terminals 8 of the header H1 come into contact with each other and are electrically connected. Further, as shown in FIGS. 13 and 15, the outer shield 1 of the socket S1 and the outer shield 5 of the header H1 come into contact with each other and are electrically connected. Further, as shown in FIG. 13, the header H1 is located between the first wall portion 25 and the second wall portion 26 of the housing 2 of the socket S1 and between the second wall portion 26 and the third wall portion 27. Two wall portions 65 of the housing 6 of the above are inserted.

Here, when the socket S1 and the header H1 (connector and the mating connector) shift from the non-connected state to the connected state, the configurations of the socket S1 and the header H1 come into contact with each other in the order described below.

First, the socket S1 and the header H1 come into contact with each other at the outer shields 1 and 5. That is, the region near the upper end of the inner peripheral surface 103 of the tubular portion 10 of the outer shield 1 contacts the region near the lower end of the outer peripheral surface 501 of the tubular portion 50 of the outer shield 5.

Next, the socket S1 and the header H1 come into contact with each other at terminals 4 and 8. That is, at least one of the contact portion 41 and the contact portion 81 coming into contact with each other and the contact portion 46 and the contact portion 84 coming into contact with each other is performed.

Next, the socket S1 and the header H1 come into contact with each other at the inner shields 3 and 7. That is, the contact portion 332 of the inner shield 3 and the contact portion 720 of the inner shield 7 come into contact with each other.

Next, the force sense unit 47 (or 85) of the connector (socket S1 or header H1) comes into contact with the mating terminal (terminal 8 or 4). That is, at least one of the force sense unit 47 contacting the contact portion 81 of the terminal 8 and the force sense unit 85 contacting the contact portion 41 of the terminal 4 is performed. Then, the force sense units 47 and 85 generate a click feeling.

Next, the outer shield 5 of the connector (here, header H1) contacts the outer shield 1 of the mating connector (here, socket S1) in a convex structure (plurality of protrusions 56) (also referred to as a contact portion). That is, the plurality of protrusions 56 come into contact with the inner peripheral surface 103 of the tubular portion 10 of the outer shield 1 (see FIG. 13). More specifically, first, the plurality of protrusions 56 come into contact with the region near the upper end of the inner peripheral surface 103. After that, due to the contact pressure between the plurality of protrusions 56 and the inner peripheral surface 103, the outer shield 1 is elastically deformed so that the inner peripheral wall 13 of the outer shield 1 faces the outer side (outer peripheral wall 11 side), and the plurality of protrusions. 56 moves further down. Finally, as shown in FIG. 13, the plurality of protrusions 56 come into contact with a region of the inner peripheral surface 103 along the vertical direction. With the above, the connection of the socket S1 and the header H1 is completed.

As described above, when the plurality of protrusions 56 come into contact with the outer shield 1, a click feeling is generated at the terminals 4 and 8 prior to the increase in the contact pressure and the frictional force between the outer shields 1 and 5. Therefore, the operator can easily perceive the click feeling as compared with the case where the click feeling occurs after the plurality of protrusions 56 come into contact with the outer shield 1. That is, it is possible to prevent the click feeling from becoming difficult to be perceived due to the frictional force. Further, since the positional relationship between the outer shields 1 and 5 fixed by the plurality of protrusions 56 coming into contact with the outer shield 1 is not changed in the subsequent steps, the positioning accuracy can be improved. As a result, the contact area between the outer shields 1 and 5 can be secured.

(5) Noise level As the connection system of the comparative example, the following connection system is assumed. In the connection system of the comparative example, each of the outer shields 1 and 5 is different from the connection system 100 of the embodiment in that each of the outer shields 1 and 5 is formed by bending a metal plate, and the other configurations are the same as those of the embodiment. It is the same as the connection system 100. Therefore, on each of the outer shields 1 and 5 of the connection system of the comparative example, for example, the outer peripheral surface and the inner peripheral surface of the tubular portion 10 (50), a seam or a cut is formed in the circumferential direction of the tubular portion 10 (50). Exists. On the other hand, in the connection system 100 of the embodiment, each of the outer shields 1 and 5 is formed by drawing metal. Therefore, the outer peripheral surface and the inner peripheral surface of each of the outer shields 1 and 5 of the tubular portion 10 (50) are seamlessly (that is, seams) over the entire circumference of the tubular portion 10 (50) in the circumferential direction. And so that there are no cuts).

At each frequency, the noise level of the connection system 100 of the embodiment is lower than that of the connection system of the comparative example. That is, as compared with the comparative example, in the embodiment, since the seams of the outer shields 1 and 5 are removed, not only the influence of resonance is suppressed, but also the noise radiated from the seams is reduced. Be done.

(Embodiment 2)
Hereinafter, the first substrate module M1 according to the second embodiment will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. Further, the contents described in this embodiment can also be applied to the second substrate module M2.

The first substrate module M1 of the present embodiment is different from the first substrate module M1 of the first embodiment in that the second line 126 is provided in the third layer LA3. Other configurations of the first substrate module M1 are the same as those in the first embodiment.

The enlarged portion 127 is provided in the second layer LA2. That is, the enlarged portion 127 and the second line 126 are provided in different layers on the substrate 150.

The second via 124 is provided over the first layer LA1, the second layer LA2, and the third layer LA3. The second footprint 123 is electrically connected to the enlarged portion 127 of the second layer LA2 via the second via 124. Further, the second footprint 123 is electrically connected to the second line 126 of the third layer LA3 via the second via 124. In the drawing, the second via 124 continuously connects between the first layer LA1 and the second layer LA2 and between the second layer LA2 and the third layer LA3 at the same position. However, the second via 124 connecting between the first layer LA1 and the second layer LA2 and the second via 124 connecting between the second layer LA2 and the third layer LA3 are provided at different positions. You may.

The expansion unit 127 is provided in the electric circuit between the second footprint 123 and the second line 126. That is, the current flows from the second footprint 123 through the expansion portion 127 to the second line 126. As a result, the capacitance formed by the enlarged portion 127 enhances the effect of reducing noise.

In the present embodiment, of the enlarged portion 127 and the second line 126, the enlarged portion 127 is in a layer (second layer LA2) closer to the layer provided with the second footprint 123 (first layer LA1). It is provided. The enlarged portion 127 may be provided in a layer closer to the layer in which the second footprint 123 is provided. That is, the enlarged portion 127 may be provided in the layer (first layer LA1) provided with the second footprint 123.

For example, the enlargement unit 127 may be provided so as to enlarge the second footprint 123. That is, the enlarged portion 127 may be directly connected to the second footprint 123 in the same layer as the second footprint 123. The enlarged portion 127 and the second footprint 123 may be electrically connected by at least one linear conductor, and the shape of the enlarged portion 127 is, for example, an annular shape, a U shape, or a C shape. It may be in the form. With such a configuration, it is possible to reduce the possibility that the solder will flow out to the surroundings when the solder connecting the second footprint 123 and the terminal 4P is melted. Further, when the solder connecting the second footprint 123 and the terminal 4P is melted, heat is transferred to the enlarged portion 127, and the possibility that the solder is difficult to melt can be reduced.

Further, of the enlarged portion 127 and the second line 126, the second line 126 may be provided in a layer closer to the layer (first layer LA1) in which the second footprint 123 is provided.

(Embodiment 3)
Hereinafter, the first substrate module M1 according to the third embodiment will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. Further, the contents described in this embodiment can also be applied to the second substrate module M2.

In the first substrate module M1 of the present embodiment, at least two (two in FIG. 18) of the second footprint 123 (six in FIG. 18) have a common second line. It differs from the first substrate module M1 of the first embodiment in that it is electrically connected to the 126 and the common expansion unit 127. The shape of the enlarged portion 127 is also different. Other configurations of the first substrate module M1 are the same as those in the first embodiment.

The two second footprints 123a have a one-to-one correspondence with the two second vias 124 and are electrically connected to the common second line 126 and the common extension 127 via the corresponding second vias 124. ing. Further, as a result, the two second terminals 4P corresponding to the two second footprints 123a (in FIG. 18, they are referred to as “4a” to distinguish them from the other second terminals 4P) have a common second terminal 4P. It is electrically connected to the two lines 126 and the common expansion unit 127.

That is, the first substrate module M1 includes a plurality of second terminals 4P, and at least two second terminals 4a of the plurality of second terminal 4Ps are electrically connected to the (one) expansion unit 127.

Of the plurality of second lines 126, the second line 126a electrically connected to the two second terminals 4a is wider than the other second lines 126f. As a result, the current capacity of the second line 126a is larger than that of the second line 126f. As described above, the contents of the present disclosure can also be applied to the first substrate module M1 through which a relatively large current flows.

Further, among the plurality of enlarged portions 127, the enlarged portion 127a electrically connected to the two second terminals 4a has a larger area than the enlarged portion 127f electrically connected to the one second terminal 4P. That is, the enlarged portion 127a electrically connected to the second line 126a having a relatively large width has a larger area than the enlarged portion 127f electrically connected to the second line 126f having a relatively small width. This enhances the effect of reducing noise.

The two enlarged portions 127 may be provided in separate layers. For example, when the substrate 150 is a laminated substrate having four or more layers, the second line 126f and the corresponding expansion portion 127f are provided in the third layer LA3, and the second line 126a and the corresponding expansion are provided. The portion 127a and the portion 127a may be provided in the second layer LA2.

The two second terminals 4a may be electrically connected to each other in the first layer LA1 and electrically connected to one expanding portion 127 via one second via 124.

(Embodiment 4)
Hereinafter, the first substrate module M1 according to the fourth embodiment will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. Further, the contents described in this embodiment can also be applied to the second substrate module M2.

In the first substrate module M1 of the present embodiment, the areas of two enlarged portions 127b and 127c out of the plurality of enlarged portions 127 are different from each other. The plurality of second lines 126 include the second lines 126b and 126c. The expansion unit 127b is electrically connected to the second line 126b. The expansion unit 127c is electrically connected to the second line 126c. The line widths (lengths in the direction orthogonal to the extension direction in the plan view) of the second lines 126b and 126c are equal to each other. Further, the first substrate module M1 includes only one first terminal 4T. Other configurations of the first substrate module M1 are the same as those in the first embodiment.

One of the plurality of (six in FIG. 19) second terminals 4P, the second terminal 4b, is electrically connected to the second line 126b and the enlargement portion 127b via the corresponding second footprint 123 and the second via 124. It is connected to the. Another second terminal 4c of the plurality of second terminals 4P is electrically connected to the second line 126c and the expansion portion 127c via the corresponding second footprint 123 and the second via 124. ..

The area of the enlarged portion 127b is the first size. The area of the enlarged portion 127c is a second size, and the second size is larger than the first size.

The distance between the first terminal 4T and the second terminal 4c (second distance L5) is shorter than the distance between the first terminal 4T and the second terminal 4b (first distance L4). The plurality of enlarged portions 127 includes an enlarged portion 127b and an enlarged portion 127c. The enlarged portion 127b is electrically connected to the second terminal 4b whose distance between the second terminal 4P and the first terminal 4T is the first distance L4, and the area of the enlarged portion 127b is the first. It is the size of 1. The enlarged portion 127c is electrically connected to the second terminal 4c whose distance between the second terminal 4P and the first terminal 4T is the second distance L5, and the area of the enlarged portion 127c is the second. It is a size of 2, and the second size is larger than the first size. In the second terminal 4c near the first terminal 4T, the signal transmitting the first terminal 4T is more likely to propagate as noise than in the second terminal 4b, but with this configuration, it propagates to the second terminal 4c near the first terminal 4T. Noise is suppressed by the enlarged portion 127c, which has a larger area than the enlarged portion 127b.

When the first board module M1 has a plurality of first terminals 4T, paying attention to the second terminal 4P among the plurality of second terminals 4P, it is between the first terminal 4T and the second terminal 4P. The distance refers to the distance between the second terminal 4P and the first terminal 4T closest to the second terminal 4P.

The two enlarged portions 127 may be provided in separate layers. For example, when the substrate 150 is a laminated substrate having four or more layers, the second line 126b and the corresponding expansion portion 127b are provided in the third layer LA3, and the second line 126c and the corresponding expansion are provided. The portion 127c and the portion 127c may be provided in the second layer LA2.

(Embodiment 5)
Hereinafter, the first substrate module M1 according to the fifth embodiment will be described with reference to FIG. The same components as those in the fourth embodiment are designated by the same reference numerals, and the description thereof will be omitted. Further, the contents described in this embodiment can also be applied to the second substrate module M2.

In the first substrate module M1 of the present embodiment, the line widths (lengths in the direction orthogonal to the extension direction in the plan view) of the two second lines 126b and 126c out of the plurality of second lines 126 are different from each other. Other configurations of the first substrate module M1 are the same as those in the fourth embodiment.

The line width of the second line 126b is the first width WD1. The line width of the second line 126c is the second width WD2, and the second width WD2 is larger than the first width WD1.

The substrate 150 has a plurality of sets of the second line 126 and the enlarged portion 127 electrically connected to the second line 126. The substrate 150 has at least a set of a second line 126b and an enlarged portion 127b, and a set of a second line 126c and an enlarged portion 127c. The plurality of second terminals 4P are electrically connected to the plurality of second lines 126. More specifically, each second terminal 4P is electrically connected to the corresponding second line 126. The plurality of enlarged portions 127 include a first enlarged portion (enlarged portion 127b) and a second enlarged portion (expanded portion 127c). The first enlarged portion (enlarged portion 127b) is electrically connected to the second line 126b whose line width is the first width WD1 among the plurality of second lines 126, and the area of the first enlarged portion is the first. It is an area of 1 (the first size described above). The second expansion unit (expansion unit 127c) is electrically connected to the second line 126c, which is the second width WD2 whose line width is larger than the first width WD1 among the plurality of second lines 126. The area of the second enlarged portion is the second area (the second size described above), and the second area is larger than the first area. That is, the area of the enlarged portion 127 is designed according to the size of the line width of the second line 126. Therefore, noise can be effectively reduced.

Contrary to the present embodiment, the width of the second line 126b may be larger than the width of the second line 126c.

(Embodiment 6)
Hereinafter, the first substrate module M1 according to the sixth embodiment will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. Further, the contents described in this embodiment can also be applied to the second substrate module M2.

In the first substrate module M1 of the present embodiment, a plurality of (two in FIG. 21) enlarged portions 127 are electrically connected to at least one second line 126 of the plurality of second lines 126. , Different from the first substrate module M1 of the first embodiment. Other configurations of the first substrate module M1 are the same as those in the first embodiment.

More specifically, the expansion portions 127d and 127e are electrically connected to the second line 126, which is one of the plurality of second lines 126. An enlarged portion 127d is directly connected to the second line 126. The second line 126 and the expansion portion 127d are provided in the second layer LA2. Further, most of the enlarged portion 127d is provided on the same side as the direction in which the second line 126 is pulled out with respect to the second via 124.

The enlarged portion 127e is provided in the first layer LA1. The enlarged portion 127e is adjacent to the second via 124. The second via 124 is provided in an electric circuit that electrically connects the enlarged portion 127e and the second footprint 123. The enlarged portion 127e forms a capacitance with the ground pattern GND2 of the second layer LA2.

As described above, the substrate 150 has a plurality of enlarged portions 127d and 127e, and the plurality of enlarged portions 127d and 127e are electrically connected to the common second line 126. The plurality of enlarged portions 127d and 127e are the enlarged portion 127e provided on the same layer as the second footprint 123 of the substrate 150 (first layer LA1) and a layer different from the second footprint 123 of the substrate 150 (first layer LA1). Includes an enlarged portion 127d provided in the two-layer LA2).

Since the enlarged portion 127 is provided in each of the first layer LA1 and the second layer LA2, the total area of the enlarged portion 127 is increased as compared with the case where the enlarged portion 127 is provided in only one layer, and a plurality of enlarged portions are provided. The sum of the capacitances between each of 127 and the ground pattern can be increased.

(Embodiment 7)
Hereinafter, the first substrate module M1 according to the seventh embodiment will be described with reference to FIG. 22. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. Further, the contents described in this embodiment can also be applied to the second substrate module M2.

The first substrate module M1 of the present embodiment is different from the first substrate module M1 of the first embodiment in that the capacitance portion further includes the chip capacitor 128 in addition to the expansion portion 127. Further, the base material 160 is different from the first substrate module M1 of the first embodiment in that the base material 160 does not include the third base material 163 and the lower surface of the second base material 162 is used as the third layer LA3. .. Other configurations of the first substrate module M1 are the same as those in the first embodiment.

The chip capacitor 128 is arranged on the outer surface of the base material 160. More specifically, the chip capacitor 128 is arranged on the lower surface of the second base material 162. The chip capacitor 128 has a first electrode 1281 and a second electrode 1282. The first electrode 1281 is electrically connected to the second line 126. More specifically, the first electrode 1281 is electrically connected to the second line 126 via a second via 124 provided over the first layer LA1, the second layer LA2, and the third layer LA3. ing. The second electrode 1282 is electrically connected to the ground pattern GND3 of the third layer LA3. A capacitance is formed between the first electrode 1281 and the ground potential second electrode 1282.

In the present embodiment, since the capacitance of the chip capacitor 128 exists in addition to the capacitance formed by the enlarged portion 127, the possibility of noise propagating to the second line 126 can be further reduced.

The chip capacitor 128 may be embedded inside the base material 160.

Further, the capacitance unit may include only the chip capacitor 128 among the expansion unit 127 and the chip capacitor 128.

(Other variants of the embodiment)
Hereinafter, other modifications of the embodiment will be listed. The following modifications may be realized in appropriate combinations. In addition, the following modified examples may be realized in combination with the above-mentioned modified examples as appropriate. Further, two or more of the above-described modifications may be appropriately combined and realized.

The power transmitted by the second terminal 4P is DC power in the embodiment, but may be AC power.

The outer shield 1 (5) and the inner shield 3 (7) are not limited to being electrically connected to each other via the conductor 180 (580) of the substrate 150 (550), but via another conductive member. They may be electrically connected to each other.

At least one of the outer shield 1 (5), the plurality of inner shields 3 (7) and the plurality of terminals 4 (8) contacts the conductor 170 (570), thereby electrically contacting the conductor 170 (570). It may be connected.

In the socket S1, at least one of the two tip regions r1 of the inner shield 3 may be directly coupled to the outer shield 1. Similarly, in the header H1, at least one of the two tip regions r7 of the inner shield 7 may be directly coupled to the outer shield 5. For example, even if the length of the inner shield 3 (7) is extended as compared with the embodiment and the inner shield 3 (7) is connected to the outer shield 1 (5) by means such as welding, press fitting or caulking. good. Alternatively, a portion of the inner shield 3 (7) including the tip region r1 (r7) and at least a part of the outer shield 1 (5) may be formed by one member. The inner shield 3 (7) and the outer shield 1 (5) may be seamlessly connected.

The extension 32 (or 72) is not limited to projecting vertically from the base 31 (or 71). For example, the extension portion 32 (or 72) may protrude from the base portion 31 (or 71) in the front-rear direction.

The number of each configuration in the embodiment is an example, and is not limited to the number shown in the embodiment. For example, the number of extension portions 32 (72) included in the inner shield 3 (7) can be appropriately changed. Further, the number of terminals 4 (8) included in each connector (socket S1 and header H1) can be appropriately changed.

The portion formed as a recess or a recess in the embodiment may be appropriately replaced with a through hole. On the contrary, the portion formed as the through hole in the embodiment may be appropriately replaced with a recess or a recess.

In the embodiment, the portions bonded by press fitting may be bonded by insert molding. On the contrary, in the embodiment, the portions bonded by insert molding may be bonded by press fitting. Further, instead of press-fitting or insert molding, another bonding method such as bonding, welding, or caulking may be adopted.

The outer shields 1 and 5 are formed, for example, by molding instead of drawing, whereby at least a part of the surfaces of the outer shields 1 and 5 (for example, the entire outer peripheral surfaces 101 and 501) are seamlessly formed. You may. Further, for example, at least a part of the surfaces of the outer shields 1 and 5 may be seamlessly formed by welding.

The plurality of protrusions 56 of the outer shield 5 may be provided on the inner peripheral surface 503 instead of the outer peripheral surface 501 of the tubular portion 50.

A part of the configuration of the socket S1 in the embodiment may be appropriately applied to the header H1. On the contrary, a part of the configuration of the header H1 in the embodiment may be appropriately applied to the socket S1. For example, the plurality of protrusions 56 may be provided on both of the outer shields 1 and 5, or may be provided only on the outer shield 1 of the outer shields 1 and 5.

(summary)
From the above-described embodiments and the like, the following aspects are disclosed with respect to the substrate module and the mating substrate module. Here, the first board module (M1) is regarded as a board module, and the second board module (M2) is regarded as a mating board module. However, the first board module (M1) can be regarded as the mating board module, and the second board module (M2) can be regarded as the board module.

The substrate module (first substrate module M1) according to the first aspect includes a first terminal (4T), a second terminal (4P), and a substrate (150). The first terminal (4T) transmits a signal. The second terminal (4P) transmits power or transmits a signal having a lower frequency than the signal transmitted by the first terminal (4T). The substrate (150) is electrically connected to the first terminal (4T) and the second terminal (4P). The substrate (150) has a first footprint (113), a second footprint (123), a ground pattern (GND3), a first via (114), a second via (124), and a first via pad. It has (115), a second via pad (125), a first line (116), a second line (126), and a capacitance section (enlarged section 127). The first footprint (113) is electrically connected to the first terminal (4T). The second footprint (123) is electrically connected to the second terminal (4P). The first via (114) is electrically connected to the first footprint (113). The second via (124) is electrically connected to the second footprint (123). The first via pad (115) is electrically connected to the first footprint (113) via the first via (114). The second via pad (125) is electrically connected to the second footprint (123) via the second via (124). The first line (116) is electrically connected to the first via pad (115). The potential of the second line (126) is different from that of the ground pattern (GND3). The second line (126) is electrically connected to the second via pad (125). The capacitance section (expansion section 127) forms a capacitance with the potential of the ground pattern (GND3). The capacitance section (expansion section 127) is electrically connected to the second line (126).

According to the above configuration, a capacitance is formed between the capacitance portion (enlarged portion 127) and the ground pattern (GND3). Therefore, as compared with the case where there is no capacitance portion (enlarged portion 127), the resonance of the second terminal (4P) is suppressed, and the resonance between one first terminal (4T) and the other first terminal (4T) is suppressed. Deterioration of communication quality due to crosstalk can be reduced. Further, by reducing the crosstalk from the first terminal (4T) to the second terminal (4P), the deterioration of the communication quality of the first terminal (4T) is reduced, and at the same time, the second line from the second terminal (4P) is reduced. By reducing the amount of noise leaking to (126), it is possible to reduce electromagnetic noise radiation.

Further, in the substrate module (first substrate module M1) according to the second aspect, in the first aspect, the capacitance portion includes the enlarged portion (127). The enlarged portion (127) overlaps at least a part of the ground pattern (GND3) in the thickness direction of the substrate (150). The enlargement section (127) is electrically connected to the second line (126). The enlarged portion (127) has conductivity.

According to the above configuration, a capacitance can be formed between the enlarged portion (127) and the ground pattern (GND3).

Further, in the substrate module (first substrate module M1) according to the third aspect, in the second aspect, the enlarged portion (127) is at least the second footprint (123) in the thickness direction of the substrate (150). It overlaps a part.

According to the above configuration, since the enlarged portion (127) is provided at a position relatively close to the second footprint (123), the effect of suppressing the resonance of the second terminal (4P) is improved. Can be done.

Further, in the substrate module (first substrate module M1) according to the fourth aspect, in the second or third aspect, the enlarged portion (127) is of the second terminal (4P) in the thickness direction of the substrate (150). It overlaps at least partly.

According to the above configuration, since the enlarged portion (127) is provided at a position relatively close to the second terminal (4P), the effect of suppressing the resonance of the second terminal (4P) can be improved. can.

Further, in the substrate module (first substrate module M1) according to the fifth aspect, in any one of the second to fourth aspects, the enlarged portion (127) is the first in the thickness direction of the substrate (150). It is provided at a position that does not overlap with the via pad (115) and the first line (116).

According to the above configuration, the possibility of signal propagation between the enlarged portion (127) and the electric circuit on the first terminal (4T) side is reduced, and the communication quality at the first terminal (4T) is further improved. Can be done.

Further, in the substrate module (first substrate module M1) according to the sixth aspect, in any one of the second to fifth aspects, the first electrode portion including the enlarged portion (127) and the second via pad (125). The capacitance between the first via pad (115) and the second electrode portion composed of the ground pattern (GND3) is larger than the capacitance between the first via pad (115) and the ground pattern (GND3).

According to the above configuration, since the capacitance between the first electrode portion and the second electrode portion is relatively large, the effect of suppressing the resonance of the second terminal (4P) can be improved.

Further, in the substrate module (first substrate module M1) according to the seventh aspect, in any one of the second to sixth aspects, the area of the enlarged portion (127) and the area of the second via pad (125) are The sum is larger than the area of the second footprint (123).

According to the above configuration, since the capacitance between the first electrode portion (enlarged portion 127 and the second via pad 125) and the second electrode portion (ground pattern GND3) is relatively large, the second terminal (4P) The effect of suppressing the resonance of the above can be improved.

Further, in the substrate module (first substrate module M1) according to the eighth aspect, in any one of the second to seventh aspects, the first via pad (115) is viewed from the thickness direction of the substrate (150). The second line (126) is pulled out from the second via pad (125) along a predetermined direction from which the first line (116) is pulled out. The area of the region of the enlarged portion (127) opposite to the predetermined direction with respect to the second via (124) has a predetermined orientation with respect to the second via (124) of the enlarged portion (127). It is larger than the area of the area on the same side.

According to the above configuration, the area of the enlarged portion (127) can be secured even when the occupied area of the first line (116) or the second line (126) is relatively large.

Further, in the substrate module (first substrate module M1) according to the ninth aspect, in any one of the second to eighth aspects, the substrate (150) is a ground pattern (GND3). In addition to the ground pattern GND3), it further has a second ground pattern (ground pattern GND1). The enlarged portion (127) overlaps at least a part of the second ground pattern in the thickness direction of the substrate (150). The enlarged portion (127) is provided in the layer between the layer provided with the first ground pattern and the layer provided with the second ground pattern on the substrate (150).

According to the above configuration, the effect of suppressing the resonance of the second terminal (4P) can be improved as compared with the case where there is no second ground pattern.

Further, in the substrate module (first substrate module M1) according to the tenth aspect, in any one of the second to ninth aspects, the enlarged portion (127) and the second via pad (125) are the substrate (150). ) Are connected in the same layer.

According to the above configuration, the enlarged portion (127) and the second via pad (125) can be integrated in the same layer.

Further, in the substrate module (first substrate module M1) according to the eleventh aspect, in any one of the second to tenth aspects, the enlarged portion (127) and the second line (126) are the substrate (150). ) Are provided in different layers.

According to the above configuration, it is easy to increase the area of the enlarged portion (127).

Further, the substrate module (first substrate module M1) according to the twelfth aspect includes a plurality of second terminals (4P) in any one of the second to eleventh aspects. At least two of the plurality of second terminals (4P) are electrically connected to one enlargement portion (127).

According to the above configuration, the possibility of resonance occurring at at least two second terminals (4P) can be reduced.

Further, in the substrate module (first substrate module M1) according to the thirteenth aspect, in the twelfth aspect, the substrate (150) is electrically connected to the second line (126) and the second line (126). It has a plurality of sets of enlarged portions (127). The plurality of second terminals (4P) are electrically connected to the plurality of second lines (126). The plurality of enlarged portions (127) include a first enlarged portion (enlarged portion 127b) and a second enlarged portion (enlarged portion 127c). The first enlarged portion (enlarged portion 127b) is electrically connected to the second line (126b) whose line width is the first width (WD1) among the plurality of second lines (126), and is the first. The area of the enlarged portion is the first area. The second enlarged portion (enlarged portion 127c) is a second line (126c) having a line width larger than the first width (WD1) among the plurality of second lines (126). It is electrically connected, and the area of the second enlarged portion is the second area, and the second area is larger than the first area.

According to the above configuration, noise can be effectively reduced.

Further, in the substrate module (first substrate module M1) according to the fourteenth aspect, in the twelfth or thirteenth aspect, the substrate (150) is electrically connected to the second line (126) and the second line (126). It has a plurality of sets of connected expansion units (127). The plurality of second terminals (4P) are electrically connected to the plurality of second lines (126). The plurality of enlarged portions (127) include an enlarged portion (127b) and an enlarged portion (127c). The enlarged portion (127b) is electrically connected to the second terminal (4b) in which the distance between the plurality of second terminals (4P) and the first terminal (4T) is the first distance (L4). The area of the enlarged portion (127b) is the first size. The enlarged portion (127c) is electrically connected to the second terminal (4c) in which the distance between the plurality of second terminals (4P) and the first terminal (4T) is the second distance (L5). The area of the enlarged portion (127c) is the second size, and the second size is larger than the first size. The second distance (L5) is shorter than the first distance (L4).

According to the above configuration, the effect of reducing noise propagating to the second terminal (4P) closer to the first terminal (4T) among the plurality of second terminals (4P) is enhanced.

Further, in the substrate module (first substrate module M1) according to the fifteenth aspect, in any one of the second to fourteenth aspects, the substrate (150) is electrically connected to the common second line (126). It has a plurality of connected expansion units (127). The plurality of enlarged portions (127) include an enlarged portion (127d) provided in the same layer as the second footprint (123) of the substrate (150) and a second footprint (123) of the substrate (150). Includes an enlarged portion (127e) provided in different layers.

According to the above configuration, it is easy to secure a space for providing each of the plurality of enlarged portions (127). Therefore, it is easy to increase the total capacitance between each of the plurality of enlarged portions (127) and the ground pattern (GND2, GND3).

Further, in the substrate module (first substrate module M1) according to the sixteenth aspect, in any one of the first to fifteenth aspects, the capacitance portion includes the chip capacitor (128). The chip capacitor (128) has a first electrode (1281) and a second electrode (1282). The first electrode (1281) is electrically connected to the second line (126). The second electrode (1282) is electrically connected to the ground pattern (GND3).

According to the above configuration, the possibility of resonance occurring at the second terminal (4P) can be further reduced.

Further, the substrate module (first substrate module M1) according to the seventeenth aspect includes a plurality of first terminals (4T) in any one of the first to sixteenth aspects. The second terminal (4P) is arranged between two first terminals (4T) of the plurality of first terminals (4T) when viewed from the thickness direction of the substrate (150).

According to the above configuration, the two first terminals (4T) can be arranged apart from each other. Therefore, the possibility of noise propagation between the two first terminals (4T) can be reduced.

Further, the substrate module (first substrate module M1) according to the eighteenth aspect further includes a shield (outer shield 1) in any one of the first to seventeenth aspects. The shield surrounds the first terminal (4T) and the second terminal (4P).

According to the above configuration, the possibility of noise propagation between the inside and the outside of the shield (outer shield 1) can be reduced.

Configurations other than the first aspect are not essential configurations for the substrate module (first substrate module M1) and can be omitted as appropriate.

Further, the connection system (100) according to the nineteenth aspect includes a substrate module (first substrate module M1) according to any one of the first to eighteenth aspects and a mating substrate module (second substrate module M2). And. The mating board module includes a mating side first terminal (8T), a mating side second terminal (8P), and a mating side board (550). The first terminal (8T) on the other side is electrically connected to the first terminal (4T) of the board module. The other party's first terminal (8T) transmits a signal. The second terminal (8P) on the other side is electrically connected to the second terminal (4P) of the board module. The other-side second terminal (8P) transmits power or transmits a signal having a lower frequency than the signal transmitted by the other-side first terminal (8T). The mating board (550) is electrically connected to the mating first terminal (8T) and the mating second terminal (8P).

According to the above configuration, it is possible to improve the communication quality at the first terminal (4T) for signal transmission and the first terminal (8T) on the other side.

Further, in the connection system (100) according to the twentieth aspect, in the nineteenth aspect, the mating board (550) of the mating board module (second board module M2) has a mating first footprint (513). , The opponent's second footprint (523), the opponent's ground pattern (GND3), the opponent's first via (514), the opponent's second via (524), and the opponent's first via pad (515). A second via pad (525) on the other side, a first line (516) on the other side, a second line (526) on the other side, and a capacitance unit (enlarged part 527) on the other side. The mating side first footprint (513) is electrically connected to the mating side first terminal (8T). The mating side second footprint (523) is electrically connected to the mating side second terminal (8P). The mating first via (514) is electrically connected to the mating first footprint (513). The mating second via (524) is electrically connected to the mating second footprint (523). The mating first via pad (515) is electrically connected to the mating first footprint (513) via the mating first via (514). The mating second via pad (525) is electrically connected to the mating second footprint (523) via the mating second via (524). The mating side first line (516) is electrically connected to the mating side first via pad (515). The potential of the other side second line (526) is different from that of the other side ground pattern (GND3). The other side second line (526) is electrically connected to the other side second via pad (525). The mating capacity portion (enlarged portion 527) forms a capacitance with the potential of the mating side ground pattern (GND3). The mating capacity portion (enlarged portion 527) is electrically connected to the mating side second line (526).

According to the above configuration, the communication quality at the first terminal (4T) and the first terminal (8T) on the other side can be further improved as compared with the case where the other side capacitance part (enlarged part 527) is not provided.

Configurations other than the nineteenth aspect are not essential configurations for the connection system (100) and can be omitted as appropriate.

Further, the substrate (150) according to the 21st aspect is used as the substrate (150) in the substrate module (1st substrate module M1) according to any one of the 1st to 18th aspects.

According to the above configuration, it is possible to improve the communication quality at the first terminal (4T) for signal transmission and the first terminal (8T) on the other side.

1, 5 Outer shield (shield)
4T 1st terminal 4P 2nd terminal 8T Opposite 1st terminal 8P Opposite 2nd terminal 100 Connection system 113 1st footprint 114 1st via 115 1st via pad 116 1st line 123 2nd footprint 124 2nd via 125 2nd via pad 126 2nd line 127 Expansion part (capacity part)
128 chip capacitor (capacitive part)
1281 1st electrode 1282 2nd electrode 150 Substrate 513 Opponent 1st footprint 514 Opponent 1st via 515 Opposite 1st via pad 516 Opposite 1st line 523 Opposite 2nd footprint 524 Opposite 2nd via 525 Opposite Side 2nd via pad 526 Opposite side 2nd line 527 Enlarged part (opposite side capacitance part)
550 Mating board GND1 to GND3 Ground pattern L4 First distance L5 Second distance M1 First board module (board module)
M2 2nd board module (counterpart board module)
WD1 1st width WD2 2nd width

Claims (21)

The first terminal that transmits signals and
A second terminal that transmits power or transmits a signal having a lower frequency than the signal transmitted by the first terminal,
A substrate electrically connected to the first terminal and the second terminal is provided.
The substrate is
A first footprint electrically connected to the first terminal,
A second footprint electrically connected to the second terminal,
With the ground pattern
A first via electrically connected to the first footprint,
A second via electrically connected to the second footprint,
A first via pad electrically connected to the first footprint via the first via,
A second via pad electrically connected to the second footprint via the second via,
The first line electrically connected to the first via pad and
The second line, which has a different potential from the ground pattern and is electrically connected to the second via pad,
It has a capacitance portion that forms a capacitance with the potential of the ground pattern and is electrically connected to the second line.
Board module. The capacitive portion overlaps with at least a part of the ground pattern in the thickness direction of the substrate and includes a conductive enlarged portion electrically connected to the second line.
The board module according to claim 1. The enlarged portion overlaps at least a part of the second footprint in the thickness direction of the substrate.
The board module according to claim 2. The enlarged portion overlaps at least a part of the second terminal in the thickness direction of the substrate.
The board module according to claim 2 or 3. The enlarged portion is provided at a position that does not overlap with the first via pad and the first line in the thickness direction of the substrate.
The board module according to any one of claims 2 to 4. The capacitance between the first electrode portion including the enlarged portion and the second via pad and the second electrode portion composed of the ground pattern is larger than the capacitance between the first via pad and the ground pattern. big,
The board module according to any one of claims 2 to 5. The sum of the area of the enlarged portion and the area of the second via pad is larger than the area of the second footprint.
The board module according to any one of claims 2 to 6. The second line is drawn out from the second via pad along a predetermined direction in which the first line is drawn out from the first via pad when viewed from the thickness direction of the substrate.
The area of the enlarged portion on the side opposite to the predetermined direction with respect to the second via is the area of the region of the enlarged portion on the same side as the predetermined direction with respect to the second via. Greater than
The board module according to any one of claims 2 to 7. The substrate further has a second ground pattern in addition to the first ground pattern which is the ground pattern.
The enlarged portion overlaps with at least a part of the second ground pattern in the thickness direction of the substrate.
The enlarged portion is provided in a layer between the layer provided with the first ground pattern and the layer provided with the second ground pattern on the substrate.
The board module according to any one of claims 2 to 8. The enlarged portion and the second via pad are connected in the same layer on the substrate.
The board module according to any one of claims 2 to 9. The enlarged portion and the second line are provided on different layers on the substrate.
The board module according to any one of claims 2 to 10. A plurality of the second terminals are provided.
At least two of the plurality of second terminals are electrically connected to the enlarged portion.
The board module according to any one of claims 2 to 11. The substrate has a plurality of sets of the second line and the enlarged portion electrically connected to the second line.
The plurality of second terminals are electrically connected to the plurality of second lines.
The plurality of enlarged parts
A first enlarged portion which is electrically connected to a second line having a line width of the first width among the plurality of second lines and has an area of the first area, and
A second line that is electrically connected to a second line having a width larger than the first width among the plurality of second lines and has an area larger than the first area. Including the second enlarged part, which is the area,
The board module according to claim 12. The substrate has a plurality of sets of the second line and the enlarged portion electrically connected to the second line.
The plurality of second terminals are electrically connected to the plurality of second lines.
The plurality of enlarged parts
An enlarged portion which is electrically connected to a second terminal whose distance between the plurality of second terminals and the first terminal is the first distance and has an area of the first size, and
Of the plurality of second terminals, the distance between the first terminal and the first terminal is electrically connected to the second terminal, which is a second distance shorter than the first distance, and the area is the first. Including an enlarged portion, which is a second size larger than the size,
The board module according to claim 12 or 13. The substrate has a plurality of the enlarged portions electrically connected to the common second line.
The plurality of enlarged parts
An enlarged portion of the substrate provided on the same layer as the second footprint,
The substrate includes an enlarged portion provided in a layer different from that of the second footprint.
The substrate module according to any one of claims 2 to 14. The capacitance portion includes a chip capacitor having a first electrode and a second electrode, and includes a chip capacitor.
The first electrode is electrically connected to the second line and is connected to the second line.
The second electrode is electrically connected to the ground pattern.
The board module according to any one of claims 1 to 15. A plurality of the first terminals are provided.
The second terminal is arranged between two first terminals of the plurality of first terminals when viewed from the thickness direction of the substrate.
The board module according to any one of claims 1 to 16. A shield surrounding the first terminal and the second terminal is further provided.
The board module according to any one of claims 1 to 17. The board module according to any one of claims 1 to 18.
With a mating board module,
The mating board module
A first terminal on the other side, which is electrically connected to the first terminal of the board module and transmits a signal,
A second terminal on the other side that is electrically connected to the second terminal of the board module and transmits power or a signal having a frequency lower than that transmitted by the first terminal on the other side.
A mating board electrically connected to the mating first terminal and the mating second terminal is provided.
Connection system. The mating board of the mating board module
With the other party's first footprint electrically connected to the other party's first terminal,
With the other party's second footprint electrically connected to the other party's second terminal,
The other party's ground pattern and
The mating first via, which is electrically connected to the mating first footprint,
With the other side second via electrically connected to the other side second footprint,
A mating first via pad electrically connected to the mating first footprint via the mating first via.
A mating second via pad electrically connected to the mating second footprint via the mating second via.
The other side first line electrically connected to the other side first via pad and
A second line on the other side, which has a different potential from the ground pattern on the other side and is electrically connected to the second via pad on the other side.
It has a mating capacitance portion that forms a capacitance with the potential of the mating ground pattern and is electrically connected to the mating second line.
The connection system according to claim 19. The substrate module according to any one of claims 1 to 18 is used as the substrate.
substrate.

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