JP2021119740A

JP2021119740A - Power conversion device

Info

Publication number: JP2021119740A
Application number: JP2021074051A
Authority: JP
Inventors: 晋太郎木暮; Shintaro Kogure
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2019-08-23
Filing date: 2021-04-26
Publication date: 2021-08-12
Also published as: JP2019198229A

Abstract

To provide a power conversion device in which the fixing strength of a plurality of substrates connected electrically to a semiconductor module can be increased.SOLUTION: A power conversion device 1 includes: a second electronic circuit board 20 as a first substrate; a first electronic circuit board 10 as a second substrate; a first connection part provided to the first substrate and corresponding to a contact point to a conductive member 23 that electrically connects the first substrate and a control unit 40 on a vehicle side; a second connection part provided to the first substrate and corresponding to a contact point to a conductive member 22 that electrically connects the first substrate and the second substrate; a third connection part provided to the second substrate and corresponding to a contact point to the conductive member 22 that electrically connects the first substrate and the second substrate; and a plurality of first fixing parts 5 provided to a first metal member 3 in order to fix the second substrate to the first metal member 3. When the first substrate is viewed about a substrate thickness direction Z, the third connection part exists outside a region surrounded by all the first fixing parts 5 disposed along an outer periphery of the first substrate among the plurality of first fixing parts 5.SELECTED DRAWING: Figure 1

Description

本発明は、複数の電子回路基板を備えた電力変換装置に関する。 The present invention relates to a power conversion device including a plurality of electronic circuit boards.

電気自動車、ハイブリッド自動車等の車両は、直流電力と交流電力との間で電力変換を行う電力変換装置を搭載している。例えば、下記の特許文献１には、半導体素子を内蔵した半導体モジュールと、複数の電子回路基板と、を備えた電力変換装置が開示されている。複数の電子回路基板には、高圧系用の第１電子回路基板と、低圧系用の第２電子回路基板と、が含まれている。第１電子回路基板及び第２電子回路基板は、基板厚み方向に空間を隔てて積層配置された状態で半導体モジュールを収容する収容体の固定面に固定されている。このような積層配置は、電子回路基板の板面に沿った方向の寸法を小さく抑えるのに有効である。 Vehicles such as electric vehicles and hybrid vehicles are equipped with a power conversion device that converts power between DC power and AC power. For example, Patent Document 1 below discloses a power conversion device including a semiconductor module incorporating a semiconductor element and a plurality of electronic circuit boards. The plurality of electronic circuit boards include a first electronic circuit board for a high voltage system and a second electronic circuit board for a low voltage system. The first electronic circuit board and the second electronic circuit board are fixed to a fixed surface of an accommodating body accommodating a semiconductor module in a state of being laminated and arranged with a space in the substrate thickness direction. Such a laminated arrangement is effective in suppressing the dimension in the direction along the plate surface of the electronic circuit board to be small.

特開２００９−１５９７６７号公報JP-A-2009-159767

ところが、上記の電力変換装置の場合、第１電子回路基板が収容体の固定面と第２電子回路基板との間に配置される。このため、第２電子回路基板は、収容体との固定の際に、第１電子回路基板が邪魔になってその固定箇所の数を増やすことができない。例えば、第２電子回路基板の固定箇所が該基板の四隅のみに制限される。また、第２電子回路基板の固定箇所が該第２電子回路基板の外周部のみに偏る。そのため、第２電子回路基板は、外力によって変形し易く、車両走行の際に車両側から受ける振動に耐え得る所望の固定強度の確保が難しい。 However, in the case of the above power conversion device, the first electronic circuit board is arranged between the fixed surface of the housing and the second electronic circuit board. Therefore, when the second electronic circuit board is fixed to the housing, the first electronic circuit board becomes an obstacle and the number of fixing points cannot be increased. For example, the fixing points of the second electronic circuit board are limited to only the four corners of the board. Further, the fixed portion of the second electronic circuit board is biased only to the outer peripheral portion of the second electronic circuit board. Therefore, the second electronic circuit board is easily deformed by an external force, and it is difficult to secure a desired fixing strength that can withstand the vibration received from the vehicle side when the vehicle is running.

本発明は、かかる課題に鑑みてなされたものであり、半導体モジュールに電気的に接続された複数の基板の固定強度を高めることができる電力変換装置を提供しようとするものである。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a power conversion device capable of increasing the fixing strength of a plurality of substrates electrically connected to a semiconductor module.

本発明の一態様は、
基板厚み方向（Ｚ）に空間（２ａ）を隔てて積層配置された第１基板（２０）及び第２基板（１０）と、
上記第１基板に設けられ、上記第１基板と車両側の制御部（４０）とを電気的に接続する導電部材（２３）との接点である第１接続部と、
上記第１基板に設けられ、上記第１基板と上記第２基板とを電気的に接続する導電部材（２２）との接点である第２接続部と、
上記第２基板に設けられ、上記第１基板と上記第２基板とを電気的に接続する導電部材（２２）との接点である第３接続部と、
上記第２基板を第１金属部材（３）に固定するために上記第１金属部材に設けられた複数の第１固定部（５）と、
を備え、
上記第３接続部は、上記第１基板を基板厚み方向（Ｚ）について見たとき、上記複数の第１固定部のうち上記第１基板の外周に沿って配置されている全ての上記第１固定部によって囲まれる領域の外側に位置する、電力変換装置（１，１０１，２０１）、
にある。 One aspect of the present invention is
The first substrate (20) and the second substrate (10), which are laminated and arranged with a space (2a) separated in the substrate thickness direction (Z),
A first connection portion provided on the first substrate, which is a contact point between the first substrate and a conductive member (23) that electrically connects the control unit (40) on the vehicle side.
A second connecting portion provided on the first substrate and which is a contact point between the conductive member (22) that electrically connects the first substrate and the second substrate.
A third connecting portion provided on the second substrate and which is a contact point between the conductive member (22) that electrically connects the first substrate and the second substrate.
A plurality of first fixing portions (5) provided on the first metal member for fixing the second substrate to the first metal member (3), and
With
When the first substrate is viewed in the substrate thickness direction (Z), the third connection portion is all of the first fixed portions arranged along the outer periphery of the first substrate among the plurality of first fixing portions. Power converters (1,101,201), located outside the area surrounded by the fixed portion,
It is in.

上記電力変換装置によれば、第１基板を第２基板に邪魔されることなく収容体に固定することができる。同様に、第２基板を第１基板に邪魔されることなく収容体に固定することができる。このため、第１基板及び第２基板のそれぞれを収容体に固定する際に、その固定箇所の配置及び数が制限されにくい。従って、各基板の固定箇所を増やすことができ、またその固定箇所が各基板の例えば四隅のみに偏るのを防止できる。その結果、各基板が外力によって変形しにくく、各基板について車両走行の際に車両側から受ける振動に耐え得る所望の固定強度を確保することができる。 According to the power conversion device, the first substrate can be fixed to the housing without being disturbed by the second substrate. Similarly, the second substrate can be fixed to the housing without being disturbed by the first substrate. Therefore, when each of the first substrate and the second substrate is fixed to the housing, the arrangement and number of the fixing portions are not easily limited. Therefore, the number of fixing points of each substrate can be increased, and it is possible to prevent the fixing points from being biased only to, for example, four corners of each substrate. As a result, each substrate is not easily deformed by an external force, and it is possible to secure a desired fixing strength for each substrate that can withstand the vibration received from the vehicle side when the vehicle is running.

以上のごとく、上記態様によれば、半導体モジュールに電気的に接続された複数の基板の固定強度を高めることができる。
なお、特許請求の範囲及び課題を解決する手段に記載した括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示すものであり、本発明の技術的範囲を限定するものではない。 As described above, according to the above aspect, it is possible to increase the fixing strength of a plurality of substrates electrically connected to the semiconductor module.
The reference numerals in parentheses described in the scope of claims and the means for solving the problem indicate the correspondence with the specific means described in the embodiments described later, and limit the technical scope of the present invention. It's not a thing.

実施形態１の電力変換装置の概略構造を示す断面図。The cross-sectional view which shows the schematic structure of the power conversion apparatus of Embodiment 1. FIG. 図１中の電力変換装置における第１電子回路基板及び第２電子回路基板のそれぞれの固定構造を示す斜視図。The perspective view which shows each fixed structure of the 1st electronic circuit board and the 2nd electronic circuit board in the power conversion apparatus in FIG. 実施形態２の電力変換装置の概略構造を示す断面図。The cross-sectional view which shows the schematic structure of the power conversion apparatus of Embodiment 2. 図３中の電力変換装置における第１電子回路基板及び第２電子回路基板のそれぞれの固定構造を示す斜視図。The perspective view which shows each fixed structure of the 1st electronic circuit board and the 2nd electronic circuit board in the power conversion apparatus in FIG. 実施形態３の電力変換装置の概略構造を示す断面図。The cross-sectional view which shows the schematic structure of the power conversion apparatus of Embodiment 3. 図５中の電力変換装置における第１電子回路基板及び第２電子回路基板のそれぞれの固定構造を示す斜視図。FIG. 5 is a perspective view showing a fixed structure of each of the first electronic circuit board and the second electronic circuit board in the power conversion device in FIG.

以下、電力変換装置に係る実施形態について、図面を参照しつつ説明する。 Hereinafter, embodiments relating to the power conversion device will be described with reference to the drawings.

なお、本明細書の図面では、特に断わらない限り、半導体モジュールの長手方向である第１方向を矢印Ｘで示し、半導体モジュールの幅方向である第２方向を矢印Ｙで示し、第１方向及び第２方向の双方と直交する第３方向を矢印Ｚで示すものとする。 In the drawings of the present specification, unless otherwise specified, the first direction which is the longitudinal direction of the semiconductor module is indicated by an arrow X, the second direction which is the width direction of the semiconductor module is indicated by an arrow Y, and the first direction and An arrow Z indicates a third direction orthogonal to both of the second directions.

（実施形態１）
図１に示されるように、実施形態１の電力変換装置１は、第１電子回路基板１０、第２電子回路基板２０及び半導体モジュール３０を含む複数の要素を備えている。これら複数の要素は収容体２によって区画された内部空間に収容されている。この電力変換装置１は、例えば、電気自動車やハイブリッド自動車等に搭載され、直流の電源電力を駆動用モータの駆動に必要な交流電力に変換するインバータとして用いられる。 (Embodiment 1)
As shown in FIG. 1, the power conversion device 1 of the first embodiment includes a plurality of elements including a first electronic circuit board 10, a second electronic circuit board 20, and a semiconductor module 30. These plurality of elements are housed in the internal space partitioned by the housing body 2. The power conversion device 1 is installed in, for example, an electric vehicle, a hybrid vehicle, or the like, and is used as an inverter that converts DC power supply power into AC power required for driving a drive motor.

収容体２は、ケース３と、ケース３の開口３ａを塞ぐカバー６と、ケース３の開口３ｂを塞ぐカバー７と、を有する。ケース３は、第３方向Ｚについて内部空間を仕切る仕切壁４を備えている。仕切壁４には、第１電子回路基板１０の固定のために該第１電子回路基板１０に向けて延出する複数のボス部（第１固定部）５が設けられている。ボス部５には、ビス１２の雄ねじ軸が螺合可能な雌ねじ部５ａが設けられている。ケース３及びカバー６，７はいずれもアルミニウムを主体としたアルミニウム系材料からなる。 The housing 2 has a case 3, a cover 6 that closes the opening 3a of the case 3, and a cover 7 that closes the opening 3b of the case 3. The case 3 includes a partition wall 4 that partitions the internal space in the third direction Z. The partition wall 4 is provided with a plurality of boss portions (first fixing portions) 5 extending toward the first electronic circuit board 10 for fixing the first electronic circuit board 10. The boss portion 5 is provided with a female screw portion 5a into which the male screw shaft of the screw 12 can be screwed. The case 3 and the covers 6 and 7 are all made of an aluminum-based material mainly composed of aluminum.

半導体モジュール３０は、直流電力を交流電力に変換するＩＧＢＴ等の半導体素子３１を内蔵している。半導体モジュール３０は、複数の制御端子３２及びパワー端子（図示省略）を備えている。 The semiconductor module 30 has a built-in semiconductor element 31 such as an IGBT that converts DC power into AC power. The semiconductor module 30 includes a plurality of control terminals 32 and power terminals (not shown).

第２基板としての第１電子回路基板１０は、平面視が矩形であり、半導体モジュール３０をスイッチング駆動させるための駆動回路を有する高電圧系の電子回路基板（「制御回路基板」ともいう。）である。この目的のために、第１電子回路基板１０は、基板厚み方向である第３方向Ｚについて第２電子回路基板２０よりも半導体モジュール３０に近い位置に配置され、且つ複数の制御端子３２に電気的に接続されている。複数の制御端子３２は、ケース３の仕切壁４に設けられた開口４ａを通じて半導体モジュール３０から第１電子回路基板１０まで延在している。従って、第１電子回路基板１０は、半導体モジュール３０に電気的に接続されている。 The first electronic circuit board 10 as the second substrate has a rectangular shape in a plan view, and is a high-voltage electronic circuit board having a drive circuit for switching and driving the semiconductor module 30 (also referred to as a "control circuit board"). Is. For this purpose, the first electronic circuit board 10 is arranged at a position closer to the semiconductor module 30 than the second electronic circuit board 20 in the third direction Z, which is the thickness direction of the substrate, and is electrically connected to the plurality of control terminals 32. Is connected. The plurality of control terminals 32 extend from the semiconductor module 30 to the first electronic circuit board 10 through the openings 4a provided in the partition wall 4 of the case 3. Therefore, the first electronic circuit board 10 is electrically connected to the semiconductor module 30.

第１基板としての第２電子回路基板２０は、平面視が第１電子回路基板１０と同様の寸法を有する矩形であり、車両情報に基づいて半導体モジュール３０を制御する制御回路を有する低電圧系の電子回路基板である。この第２電子回路基板２０は、ターミナル等の導電部材２２によって第１電子回路基板１０に電気的に接続され、且つターミナル等の導電部材２３によって車両側の制御部（ＥＣＵ）４０に電気的に接続されている。従って、第２電子回路基板２０は、半導体モジュール３０に電気的に接続されている。制御部４０からの入力信号は、第１電子回路基板１０、導電部材２２及び第２電子回路基板２０を介して半導体モジュール３０に伝送される。一方で、半導体モジュール３０から出力される電流等の検出信号は、第２電子回路基板２０、導電部材２２及び第１電子回路基板１０を介して制御部４０に伝送される。 The second electronic circuit board 20 as the first substrate is a rectangular shape having the same dimensions as the first electronic circuit board 10 in a plan view, and is a low-voltage system having a control circuit for controlling the semiconductor module 30 based on vehicle information. It is an electronic circuit board of. The second electronic circuit board 20 is electrically connected to the first electronic circuit board 10 by a conductive member 22 such as a terminal, and is electrically connected to a control unit (ECU) 40 on the vehicle side by a conductive member 23 such as a terminal. It is connected. Therefore, the second electronic circuit board 20 is electrically connected to the semiconductor module 30. The input signal from the control unit 40 is transmitted to the semiconductor module 30 via the first electronic circuit board 10, the conductive member 22, and the second electronic circuit board 20. On the other hand, the detection signal such as the current output from the semiconductor module 30 is transmitted to the control unit 40 via the second electronic circuit board 20, the conductive member 22, and the first electronic circuit board 10.

第１電子回路基板１０及び第２電子回路基板２０は、第３方向Ｚに空間２ａを隔てて積層配置されている。このような配置は、これら２つの電子回路基板１０，２０の機能を兼ね備えた１つの電子回路基板を用いる場合に比べて、基板面に沿った方向の寸法を小さく抑えるのに有効である。 The first electronic circuit board 10 and the second electronic circuit board 20 are laminated and arranged in the third direction Z with a space 2a. Such an arrangement is effective in suppressing the dimension in the direction along the substrate surface to be smaller than in the case of using one electronic circuit board having the functions of these two electronic circuit boards 10 and 20.

第１電子回路基板１０と第２電子回路基板２０との間には、介装部材としての基板間プレート８が介装されている。この基板間プレート８は、平面視が矩形の平板部８ａと、平板部８ａの第１方向Ｘの両側に設けられたフランジ部８ｂと、を備える板状部材であり、フランジ部８ｂがビス１２を用いてケース３の仕切壁４に固定されている。基板間プレート８が仕切壁４に固定された状態では、この基板間プレート８が収容体２の構成要素となる。この場合、収容体２が基板間プレート８を有するということができる。 An inter-board plate 8 as an interposing member is interposed between the first electronic circuit board 10 and the second electronic circuit board 20. The inter-board plate 8 is a plate-like member including a flat plate portion 8a having a rectangular plan view and flange portions 8b provided on both sides of the flat plate portion 8a in the first direction X, and the flange portion 8b is a screw 12 Is fixed to the partition wall 4 of the case 3. When the inter-board plate 8 is fixed to the partition wall 4, the inter-board plate 8 is a component of the housing 2. In this case, it can be said that the housing 2 has the inter-board plate 8.

基板間プレート８は、第３方向Ｚについて第１電子回路基板１０及び第２電子回路基板２０の一方から他方を遮蔽する大きさ（以下、「遮蔽寸法」ともいう。）を有する。即ち、この基板間プレート８は、平面視の大きさが第１電子回路基板１０及び第２電子回路基板２０の双方を上回るように構成されている。また、基板間プレート８は、鉄を主体とした鉄系材料からなる。この鉄系材料は、磁気遮蔽性を有する材料であり、且つケース３及びカバー６を構成するアルミニウム系材料よりも線膨張率（固体の熱膨張による長さの増加の割合を温度差で割った値）の小さい材料である。 The inter-board plate 8 has a size (hereinafter, also referred to as “shielding dimension”) that shields one of the first electronic circuit board 10 and the second electronic circuit board 20 from one of the second electronic circuit boards 20 in the third direction Z. That is, the inter-board plate 8 is configured so that the size in a plan view exceeds both the first electronic circuit board 10 and the second electronic circuit board 20. Further, the inter-board plate 8 is made of an iron-based material mainly composed of iron. This iron-based material is a material having a magnetic shielding property, and has a linear expansion coefficient (the rate of increase in length due to thermal expansion of a solid divided by a temperature difference) as compared with the aluminum-based material constituting the case 3 and the cover 6. It is a material with a small value).

基板間プレート８には、第２電子回路基板２０の固定のための複数の固定ピン（第２固定部）９が取付けられている。固定ピン９は、基板間プレート８の平板部８ａに設けられた貫通孔（図示省略）に圧入されることによって基板間プレート８に取付けられている。この固定ピン９は、ビス１２の雄ねじ軸が螺合可能な雌ねじ部９ａを備えている。 A plurality of fixing pins (second fixing portions) 9 for fixing the second electronic circuit board 20 are attached to the inter-board plate 8. The fixing pin 9 is attached to the inter-board plate 8 by being press-fitted into a through hole (not shown) provided in the flat plate portion 8a of the inter-board plate 8. The fixing pin 9 includes a female screw portion 9a into which the male screw shaft of the screw 12 can be screwed.

図２に示されるように、基板間プレート８は、各フランジ部８ｂに貫通形成された複数（図２では２つ）の挿入孔８ｃを備えている。仕切壁４は、ビス１２の雄ねじ軸が螺合可能な雌ねじ部４ｂを備えている。基板間プレート８は、各挿入孔８ｃに挿入されたビス１２の雄ねじ軸が仕切壁４の雌ねじ部４ｂに螺合することによって仕切壁４に固定されるように構成されている。なお、本構成に代えて、仕切壁４から基板間プレート８に向けて延出するボス部に雌ねじ部４ｂのような雌ねじ部を設け、該ボス部に基板間プレート８を固定する構成を採用することもできる。 As shown in FIG. 2, the inter-board plate 8 includes a plurality of (two in FIG. 2) insertion holes 8c formed through each flange portion 8b. The partition wall 4 includes a female screw portion 4b into which the male screw shaft of the screw 12 can be screwed. The inter-board plate 8 is configured so that the male screw shaft of the screw 12 inserted into each insertion hole 8c is screwed into the female screw portion 4b of the partition wall 4 to be fixed to the partition wall 4. Instead of this configuration, a configuration is adopted in which a female screw portion such as a female screw portion 4b is provided on a boss portion extending from the partition wall 4 toward the inter-board plate 8 and the inter-board plate 8 is fixed to the boss portion. You can also do it.

ボス部５は、収容体２の構成要素であり、仕切壁４に開口４ａを取り囲むように複数（図２では８つ）設けられている。固定ピン９は、基板間プレート８の平板部８ａにほぼ偏りなく複数（図２では９つ）設けられている。この固定ピン９は、基板間プレート８に取付けられた状態で収容体２の構成要素となる。なお、これらボス部５及び固定ピン９のそれぞれの配置及び数は、図２に示すものに限定されるものではなく、必要に応じて種々変更が可能である。 The boss portions 5 are constituent elements of the housing body 2, and a plurality of boss portions 5 (eight in FIG. 2) are provided on the partition wall 4 so as to surround the openings 4a. A plurality of fixing pins 9 (nine in FIG. 2) are provided on the flat plate portion 8a of the inter-board plate plate 8 with almost no bias. The fixing pin 9 becomes a component of the housing 2 in a state of being attached to the inter-board plate 8. The arrangement and number of the boss portions 5 and the fixing pins 9 are not limited to those shown in FIG. 2, and can be variously changed as needed.

第１電子回路基板１０は、いずれも第３方向Ｚに貫通形成された複数（図２では８つ）の挿入孔１１を備えている。この第１電子回路基板１０は、各挿入孔１１をボス部５の雌ねじ部５ａに位置合わせした状態で、各挿入孔１１に挿入されたビス１２の雄ねじ軸をボス部５の雌ねじ部５ａに螺合させることによってボス部５に固定される。その結果、第１電子回路基板１０は、複数のボス部５によって支持された状態で収容体２のケース３に固定される。 Each of the first electronic circuit boards 10 includes a plurality of (eight in FIG. 2) insertion holes 11 formed through the third direction Z. In the first electronic circuit board 10, the male screw shaft of the screw 12 inserted into each insertion hole 11 is placed on the female screw portion 5a of the boss portion 5 in a state where each insertion hole 11 is aligned with the female screw portion 5a of the boss portion 5. It is fixed to the boss portion 5 by being screwed. As a result, the first electronic circuit board 10 is fixed to the case 3 of the housing 2 in a state of being supported by the plurality of boss portions 5.

この場合、電力変換装置１は、基板厚み方向である第３方向Ｚについてボス部５（収容体２の構成要素）と第１電子回路基板１０との間に第２電子回路基板２０が介在しないように構成されている。換言すれば、ボス部５は、第３方向Ｚについて第１電子回路基板１０との間に第２電子回路基板２０が介在しない位置（以下、「第１の非介在位置」ともいう。）に設けられている。この第１の非介在位置を、第１電子回路基板１０との固定が第２電子回路基板２０によって邪魔されない位置ということもできる。 In this case, in the power conversion device 1, the second electronic circuit board 20 does not intervene between the boss portion 5 (component of the housing 2) and the first electronic circuit board 10 in the third direction Z, which is the thickness direction of the substrate. It is configured as follows. In other words, the boss portion 5 is located at a position where the second electronic circuit board 20 does not intervene with the first electronic circuit board 10 in the third direction Z (hereinafter, also referred to as “first non-intervening position”). It is provided. This first non-intervening position can also be said to be a position where the fixing with the first electronic circuit board 10 is not hindered by the second electronic circuit board 20.

第２電子回路基板２０は、いずれも第３方向Ｚに貫通形成された複数（図２では８つ）の挿入孔２１を備えている。この第２電子回路基板２０は、各挿入孔２１を固定ピン９の雌ねじ部９ａに位置合わせした状態で、各挿入孔２１に挿入されたビス１２の雄ねじ軸を固定ピン９の雌ねじ部９ａに螺合させることによって固定ピン９に固定される。その結果、第２電子回路基板２０は、基板間プレート８の複数の固定ピン９によって支持された状態で、収容体２を構成するケース３に固定される。 Each of the second electronic circuit boards 20 includes a plurality of (eight in FIG. 2) insertion holes 21 which are formed through in the third direction Z. In the second electronic circuit board 20, the male screw shaft of the screw 12 inserted into each insertion hole 21 is aligned with the female screw portion 9a of the fixing pin 9 in a state where each insertion hole 21 is aligned with the female screw portion 9a of the fixing pin 9. It is fixed to the fixing pin 9 by screwing. As a result, the second electronic circuit board 20 is fixed to the case 3 constituting the housing 2 in a state of being supported by the plurality of fixing pins 9 of the inter-board plate 8.

この場合、電力変換装置１は、基板厚み方向である第３方向Ｚについて固定ピン９（収容体２の構成要素）と第２電子回路基板２０との間に第１電子回路基板１０が介在しないように構成されている。換言すれば、固定ピン９は、ケース３のうち第３方向Ｚについて第２電子回路基板２０との間に第１電子回路基板１０が介在しない位置（以下、「第２の非介在位置」ともいう。）に設けられている。この第２の非介在位置を、第２電子回路基板２０との固定が第１電子回路基板１０によって邪魔されない位置ということもできる。 In this case, in the power conversion device 1, the first electronic circuit board 10 does not intervene between the fixing pin 9 (component of the housing 2) and the second electronic circuit board 20 in the third direction Z, which is the thickness direction of the substrate. It is configured as follows. In other words, the fixing pin 9 is located at a position in the case 3 where the first electronic circuit board 10 does not intervene with the second electronic circuit board 20 in the third direction Z (hereinafter, also referred to as a “second non-intervening position”). It is provided in.). This second non-intervening position can also be said to be a position where the fixing with the second electronic circuit board 20 is not hindered by the first electronic circuit board 10.

このように、実施形態１の場合、ケース３に固定された基板間プレート８に第２電子回路基板２０の固定のための固定ピン９（第２固定部）が設けられ、且つ収容体２のうち基板間プレート８を挟んで該基板間プレート８に固定される第２電子回路基板２０とは反対側の部位（ケース３の仕切壁４）に第１電子回路基板１０の固定のためのボス部５（第１固定部）が設けられるように構成されている。なお、本構成に代えて、第１電子回路基板１０が固定ピン９に固定され、且つ第２電子回路基板２０がボス部５に固定される構成を採用することもできる。 As described above, in the case of the first embodiment, the inter-board plate 8 fixed to the case 3 is provided with the fixing pin 9 (second fixing portion) for fixing the second electronic circuit board 20, and the housing body 2 is provided with the fixing pin 9 (second fixing portion). A boss for fixing the first electronic circuit board 10 to a portion (partition wall 4 of the case 3) opposite to the second electronic circuit board 20 fixed to the inter-board plate 8 with the inter-board plate 8 sandwiched between them. A portion 5 (first fixed portion) is provided. Instead of this configuration, a configuration in which the first electronic circuit board 10 is fixed to the fixing pin 9 and the second electronic circuit board 20 is fixed to the boss portion 5 can be adopted.

次に、実施形態１の電力変換装置１の作用効果について説明する。 Next, the operation and effect of the power conversion device 1 of the first embodiment will be described.

上記の電力変換装置１によれば、ボス部５を上記の第１の非介在位置に設けることによって、第１電子回路基板１０を第２電子回路基板２０によって邪魔されることなく収容体２のケース３に固定することができる。同様に、固定ピン９を上記の第２の非介在位置に設けることによって、第２電子回路基板２０を第１電子回路基板１０によって邪魔されることなく収容体２のケース３に固定することができる。 According to the power conversion device 1, by providing the boss portion 5 at the first non-intervening position, the first electronic circuit board 10 of the housing 2 is not disturbed by the second electronic circuit board 20. It can be fixed to the case 3. Similarly, by providing the fixing pin 9 at the second non-intervening position, the second electronic circuit board 20 can be fixed to the case 3 of the housing 2 without being disturbed by the first electronic circuit board 10. can.

このため、第１電子回路基板１０及び第２電子回路基板２０のそれぞれを収容体２に固定する際に、その固定箇所の配置及び数が制限されにくい。従って、各電子回路基板の固定箇所を増やすことができ、またその固定箇所が各電子回路基板の例えば四隅のみに偏るのを防止できる。その結果、各電子回路基板が外力によって変形しにくく、各電子回路基板について車両走行の際に車両側から受ける振動に耐え得る所望の固定強度を確保することができる。 Therefore, when each of the first electronic circuit board 10 and the second electronic circuit board 20 is fixed to the housing body 2, the arrangement and number of the fixing portions are not easily restricted. Therefore, the number of fixing points of each electronic circuit board can be increased, and it is possible to prevent the fixing points from being biased only to, for example, four corners of each electronic circuit board. As a result, each electronic circuit board is not easily deformed by an external force, and it is possible to secure a desired fixing strength of each electronic circuit board that can withstand the vibration received from the vehicle side when the vehicle is running.

なお、仕切壁４のうち開口４ａの部位にボス部５を設けることができない。従って、第１電子回路基板１０の開口４ａとの対向面は、ボス部５によって支持されないが、その代わりに開口４ａに配置される複数の制御端子３２によって支持されている。これにより、第１電子回路基板１０の固定強度の低下が抑えられている。これに対して、基板間プレート８の平板部８ａにおける固定ピン９の配置は制限されない（例えば、平板部８ａの中央部にも固定ピン９を配置できる）ため、固定ピン９による第２電子回路基板２０の固定強度を高くできる。 It should be noted that the boss portion 5 cannot be provided at the portion of the partition wall 4 having the opening 4a. Therefore, the surface of the first electronic circuit board 10 facing the opening 4a is not supported by the boss portion 5, but is supported by a plurality of control terminals 32 arranged in the opening 4a instead. As a result, a decrease in the fixing strength of the first electronic circuit board 10 is suppressed. On the other hand, the arrangement of the fixing pin 9 on the flat plate portion 8a of the inter-board plate 8 is not limited (for example, the fixing pin 9 can be arranged also on the central portion of the flat plate portion 8a), so that the second electronic circuit by the fixing pin 9 is used. The fixing strength of the substrate 20 can be increased.

また、上記の電力変換装置１によれば、第１電子回路基板１０と第２電子回路基板２０との間の基板間プレート８は、上記遮蔽寸法を有し且つ磁気遮蔽性を有する材料からなるため、所謂「シールド板」としての機能を有する。このため、特に、高電圧系の第１電子回路基板１０で発生したノイズの影響が低電圧系の第２電子回路基板２０に及ぶのを抑制できる。 Further, according to the power conversion device 1, the inter-board plate 8 between the first electronic circuit board 10 and the second electronic circuit board 20 is made of a material having the above-mentioned shielding dimensions and having magnetic shielding properties. Therefore, it has a function as a so-called "shield plate". Therefore, in particular, it is possible to suppress the influence of noise generated on the first electronic circuit board 10 of the high voltage system on the second electronic circuit board 20 of the low voltage system.

また、上記の電力変換装置１によれば、基板間プレート８は、該基板間プレート８が固定されるケース３よりも線膨張率の小さい材料からなる。このため、ケース３が半導体モジュール３０などの発熱部品から受ける熱によって歪んだ場合でも、基板間プレート８がケース３によって引っ張られて歪むのを抑制できる。
さらに、基板間プレート８の線膨張率は、ケース３より小さく且つ第１電子回路基板１０よりも大きい値であるのが好ましい。これにより、熱膨張率の大きさが、大きい方から順番にケース３、基板間プレート８、第１電子回路基板１０となる。この場合、ケース３と第１電子回路基板１０との間に介在する基板間プレート８の線膨張率は、ケース３の線膨張率と第１電子回路基板１０の線膨張率との中間の値となるため、これら部品間の熱歪の影響を小さくすることができる。 Further, according to the power conversion device 1 described above, the inter-board plate 8 is made of a material having a smaller linear expansion coefficient than the case 3 to which the inter-board plate 8 is fixed. Therefore, even if the case 3 is distorted by the heat received from a heat generating component such as the semiconductor module 30, it is possible to prevent the inter-board plate 8 from being pulled and distorted by the case 3.
Further, the coefficient of linear expansion of the inter-board plate 8 is preferably smaller than that of the case 3 and larger than that of the first electronic circuit board 10. As a result, the case 3, the inter-board plate 8, and the first electronic circuit board 10 are arranged in descending order of the coefficient of thermal expansion. In this case, the coefficient of linear expansion of the inter-board plate 8 interposed between the case 3 and the first electronic circuit board 10 is an intermediate value between the coefficient of linear expansion of case 3 and the coefficient of linear expansion of the first electronic circuit board 10. Therefore, the influence of thermal strain between these parts can be reduced.

（実施形態２）
実施形態２の電力変換装置１０１は、実施形態１の電力変換装置１とは第２電子回路基板２０の固定構造が異なる。その他の構成は、実施形態１と同様である。従って、ここでは図３及び図４を参照しつつ第２電子回路基板２０の固定構造に関連する要素のみについて説明するものとし、その他の要素の説明は省略する。また、これらの図面において、図１及び図２に示される要素と同一の要素には同一の符号を付している。 (Embodiment 2)
The power conversion device 101 of the second embodiment has a different fixed structure of the second electronic circuit board 20 from the power conversion device 1 of the first embodiment. Other configurations are the same as those in the first embodiment. Therefore, here, only the elements related to the fixed structure of the second electronic circuit board 20 will be described with reference to FIGS. 3 and 4, and the description of the other elements will be omitted. Further, in these drawings, the same elements as those shown in FIGS. 1 and 2 are designated by the same reference numerals.

図３に示されるように、第１電子回路基板１０と第２電子回路基板２０との間には、介装部材としての基板間プレート１０８が介装されている。この基板間プレート１０８は、平面視が矩形であり、平面視の大きさが第１電子回路基板１０及び第２電子回路基板２０の双方を上回るように構成された板状部材である。また、カバー６は、いずれも基板間プレート１０８に向けて延出する複数のボス部６ａを備えている。基板間プレート１０８は、平板状の部材であり、ビス１２を用いてカバー６のボス部６ａに固定されている。基板間プレート１０８がカバー６のボス部６ａに固定された状態では、この基板間プレート１０８が収容体２の構成要素となる。この場合、収容体２が基板間プレート１０８を有するということができる。この基板間プレート１０８は、上記の基板間プレート８と同様の鉄系材料からなる。 As shown in FIG. 3, an inter-board plate 108 as an interposing member is interposed between the first electronic circuit board 10 and the second electronic circuit board 20. The inter-board plate 108 is a plate-shaped member having a rectangular plan view and having a plan view size larger than that of both the first electronic circuit board 10 and the second electronic circuit board 20. Further, each of the covers 6 is provided with a plurality of boss portions 6a extending toward the inter-board plate 108. The inter-board plate 108 is a flat plate-shaped member, and is fixed to the boss portion 6a of the cover 6 by using screws 12. When the inter-board plate 108 is fixed to the boss portion 6a of the cover 6, the inter-board plate 108 becomes a component of the housing 2. In this case, it can be said that the housing 2 has the inter-board plate 108. The inter-board plate 108 is made of the same iron-based material as the inter-board plate 8 described above.

基板間プレート１０８には、第２電子回路基板２０の固定のための複数の固定ピン（第２固定部）１０９が取付けられている。固定ピン１０９は、基板間プレート１０８に設けられた貫通孔（図示省略）に圧入されることによって基板間プレート１０８に取付けられている。 A plurality of fixing pins (second fixing portions) 109 for fixing the second electronic circuit board 20 are attached to the inter-board plate 108. The fixing pin 109 is attached to the inter-board plate 108 by being press-fitted into a through hole (not shown) provided in the inter-board plate 108.

図４に示されるように、基板間プレート１０８は、複数（図４では２つ）の挿入孔１０８ａを備えている。一方で、カバー６のボス部６ａは、ビス１２の雄ねじ軸が螺合可能な雌ねじ部６ｂを備えている。従って、基板間プレート１０８は、各挿入孔１０８ａに挿入されたビス１２の雄ねじ軸がボス部６ａの雌ねじ部６ｂに螺合することによってボス部６ａに固定される。 As shown in FIG. 4, the inter-board plate 108 includes a plurality of (two in FIG. 4) insertion holes 108a. On the other hand, the boss portion 6a of the cover 6 includes a female screw portion 6b to which the male screw shaft of the screw 12 can be screwed. Therefore, the inter-board plate 108 is fixed to the boss portion 6a by screwing the male screw shaft of the screw 12 inserted into each insertion hole 108a into the female screw portion 6b of the boss portion 6a.

固定ピン１０９は、基板間プレート１０８にほぼ偏りなく複数（図４では９つ）設けられている。この固定ピン１０９は、上記の固定ピン９の雌ねじ部９ａと同様の雌ねじ部１０９ａを備えている。この固定ピン１０９は、基板間プレート１０８に取付けられた状態で収容体２の構成要素となる。なお、この固定ピン１０９の配置及び数は、図４に示すものに限定されるものではなく、必要に応じて種々変更が可能である。 A plurality of fixing pins 109 (nine in FIG. 4) are provided on the inter-board plate 108 with almost no bias. The fixing pin 109 includes a female threaded portion 109a similar to the female threaded portion 9a of the fixing pin 9. The fixing pin 109 becomes a component of the housing 2 in a state of being attached to the inter-board plate 108. The arrangement and number of the fixing pins 109 are not limited to those shown in FIG. 4, and can be variously changed as needed.

第２電子回路基板２０は、各挿入孔２１を固定ピン１０９の雌ねじ部１０９ａに位置合わせした状態で、各挿入孔２１に挿入されたビス１２の雄ねじ軸を固定ピン１０９の雌ねじ部１０９ａに螺合させることによって固定ピン１０９に固定される。その結果、第２電子回路基板２０は、基板間プレート１０８の複数の固定ピン１０９によって支持された状態で、収容体２を構成するカバー６に固定される。この場合、第３方向Ｚについて固定ピン１０９（収容体２の構成要素）と第２電子回路基板２０との間に第１電子回路基板１０が介在しない。即ち、固定ピン１０９は、上記の固定ピン９の場合と同様に、カバー６のうち第３方向Ｚについて第２電子回路基板２０との間に第１電子回路基板１０が介在しない位置（第２の非介在位置）に設けられている。 In the second electronic circuit board 20, the male screw shaft of the screw 12 inserted into each insertion hole 21 is screwed into the female screw portion 109a of the fixing pin 109 in a state where each insertion hole 21 is aligned with the female screw portion 109a of the fixing pin 109. By matching, it is fixed to the fixing pin 109. As a result, the second electronic circuit board 20 is fixed to the cover 6 constituting the housing 2 in a state of being supported by a plurality of fixing pins 109 of the inter-board plate 108. In this case, the first electronic circuit board 10 does not intervene between the fixing pin 109 (component of the housing 2) and the second electronic circuit board 20 in the third direction Z. That is, the fixing pin 109 is at a position (second) in the cover 6 where the first electronic circuit board 10 does not intervene with the second electronic circuit board 20 in the third direction Z, as in the case of the fixing pin 9. It is provided at the non-intervening position).

このように、実施形態２の場合、カバー６に固定された基板間プレート１０８に第２電子回路基板２０の固定のための固定ピン１０９（第２固定部）が設けられ、且つ収容体２のうち基板間プレート１０８を挟んで該基板間プレート１０８に固定される第２電子回路基板２０とは反対側の部位（ケース３の仕切壁４）に第１電子回路基板１０の固定のためのボス部５（第１固定部）が設けられるように構成されている。なお、本構成に代えて、第１電子回路基板１０が固定ピン１０９に固定され、且つ第２電子回路基板２０がボス部５に固定される構成を採用することもできる。 As described above, in the case of the second embodiment, the inter-board plate 108 fixed to the cover 6 is provided with the fixing pin 109 (second fixing portion) for fixing the second electronic circuit board 20, and the housing body 2 is provided with the fixing pin 109 (second fixing portion). A boss for fixing the first electronic circuit board 10 to a portion (partition wall 4 of the case 3) opposite to the second electronic circuit board 20 fixed to the inter-board plate 108 with the inter-board plate 108 sandwiched between them. A portion 5 (first fixed portion) is provided. Instead of this configuration, it is also possible to adopt a configuration in which the first electronic circuit board 10 is fixed to the fixing pin 109 and the second electronic circuit board 20 is fixed to the boss portion 5.

実施形態２によれば、実施形態１の場合と同様に、第２電子回路基板２０を第１電子回路基板１０に邪魔されることなく収容体２のカバー６に固定することができる。このため、第１電子回路基板１０及び第２電子回路基板２０のそれぞれを収容体２に固定する際に、その固定箇所の配置及び数が制限されにくい。その結果、各電子回路基板が外力によって変形しにくく、各電子回路基板について車両走行の際に車両側から受ける振動に耐え得る所望の固定強度を確保することができる。特に、基板間プレート１０８における固定ピン１０９の配置は制限されない（例えば、基板間プレート１０８の中央部にも固定ピン１０９を配置できる）ため、固定ピン１０９による第２電子回路基板２０の固定強度を高くできる。
その他、実施形態１と同様の作用効果を奏する。 According to the second embodiment, as in the case of the first embodiment, the second electronic circuit board 20 can be fixed to the cover 6 of the housing 2 without being disturbed by the first electronic circuit board 10. Therefore, when each of the first electronic circuit board 10 and the second electronic circuit board 20 is fixed to the housing body 2, the arrangement and number of the fixing portions are not easily restricted. As a result, each electronic circuit board is not easily deformed by an external force, and it is possible to secure a desired fixing strength of each electronic circuit board that can withstand the vibration received from the vehicle side when the vehicle is running. In particular, since the arrangement of the fixing pin 109 on the inter-board plate 108 is not limited (for example, the fixing pin 109 can also be arranged at the center of the inter-board plate 108), the fixing strength of the second electronic circuit board 20 by the fixing pin 109 can be increased. Can be high.
Other than that, it has the same effect as that of the first embodiment.

（実施形態３）
実施形態３の電力変換装置２０１は、実施形態１の電力変換装置１とは第２電子回路基板２０の固定構造が異なる。その他の構成は、実施形態１と同様である。従って、ここでは図５及び図６を参照しつつ第２電子回路基板２０の固定構造のみについて説明するものとし、その他の説明は省略する。また、これらの図面において、図１及び図２に示される要素と同一の要素には同一の符号を付している。 (Embodiment 3)
The power conversion device 201 of the third embodiment has a different fixed structure of the second electronic circuit board 20 from the power conversion device 1 of the first embodiment. Other configurations are the same as those in the first embodiment. Therefore, here, only the fixed structure of the second electronic circuit board 20 will be described with reference to FIGS. 5 and 6, and other description will be omitted. Further, in these drawings, the same elements as those shown in FIGS. 1 and 2 are designated by the same reference numerals.

図５に示されるように、第１電子回路基板１０と第２電子回路基板２０との間には、上記の基板間プレート８のような部材が介装されていない。カバー６は、その天板面にいずれも第２電子回路基板２０に向けて延出する複数のボス部２０９を備えている。 As shown in FIG. 5, a member such as the above-mentioned inter-board plate 8 is not interposed between the first electronic circuit board 10 and the second electronic circuit board 20. The cover 6 is provided with a plurality of boss portions 209 extending toward the second electronic circuit board 20 on the top plate surface thereof.

図６に示されるように、ボス部２０９は、カバー６の天板面にほぼ偏りなく複数（図６では９つ）設けられている。このボス部２０９は、ビス１２の雄ねじ軸が螺合可能な雌ねじ部２０９ａを備えている。このボス部２０９は、収容体２の構成要素である。なお、このボス部２０９の配置及び数は、図６に示すものに限定されるものではなく、必要に応じて種々変更が可能である。 As shown in FIG. 6, a plurality of boss portions 209 are provided on the top plate surface of the cover 6 with almost no bias (nine in FIG. 6). The boss portion 209 includes a female screw portion 209a into which the male screw shaft of the screw 12 can be screwed. The boss portion 209 is a component of the housing body 2. The arrangement and number of the boss portions 209 are not limited to those shown in FIG. 6, and can be variously changed as needed.

第２電子回路基板２０は、各挿入孔２１をボス部２０９の雌ねじ部２０９ａに位置合わせした状態で、各挿入孔２１に挿入されたビス１２の雄ねじ軸をボス部２０９の雌ねじ部２０９ａに螺合させることによってボス部２０９に固定される。その結果、第２電子回路基板２０は、収容体２を構成するカバー６に固定される。この場合、第３方向Ｚについてボス部２０９（収容体２の構成要素）と第２電子回路基板２０との間に第１電子回路基板１０が介在しない。即ち、ボス部２０９は、上記の固定ピン９の場合と同様に、カバー６のうち第３方向Ｚについて第２電子回路基板２０との間に第１電子回路基板１０が介在しない位置（第２の非介在位置）に設けられている。 In the second electronic circuit board 20, the male screw shaft of the screw 12 inserted into each insertion hole 21 is screwed into the female screw portion 209a of the boss portion 209 in a state where each insertion hole 21 is aligned with the female screw portion 209a of the boss portion 209. By matching, it is fixed to the boss portion 209. As a result, the second electronic circuit board 20 is fixed to the cover 6 constituting the housing 2. In this case, the first electronic circuit board 10 does not intervene between the boss portion 209 (a component of the housing 2) and the second electronic circuit board 20 in the third direction Z. That is, the boss portion 209 is at a position (second) in which the first electronic circuit board 10 does not intervene with the second electronic circuit board 20 in the third direction Z of the cover 6, as in the case of the fixing pin 9 described above. It is provided at the non-intervening position).

このように、実施形態３の場合、ケース３に第１電子回路基板１０の固定のためのボス部５（第１固定部）が設けられ、且つカバー６に第２電子回路基板２０の固定のためのボス部２０９（第２固定部）が設けられるように構成されている。なお、本構成に代えて、第２電子回路基板２０がボス部５に固定され、且つ第１電子回路基板１０がボス部２０９に固定される構成を採用することもできる。 As described above, in the case of the third embodiment, the case 3 is provided with the boss portion 5 (first fixing portion) for fixing the first electronic circuit board 10, and the cover 6 is fixed to the second electronic circuit board 20. A boss portion 209 (second fixed portion) for the purpose is provided. Instead of this configuration, a configuration in which the second electronic circuit board 20 is fixed to the boss portion 5 and the first electronic circuit board 10 is fixed to the boss portion 209 can be adopted.

実施形態３によれば、実施形態１の場合と同様に、第２電子回路基板２０を第１電子回路基板１０に邪魔されることなく収容体２のカバー６に固定することができる。このため、第１電子回路基板１０及び第２電子回路基板２０のそれぞれを収容体２に固定する際に、その固定箇所の配置及び数が制限されにくい。その結果、各電子回路基板が外力によって変形しにくく、各電子回路基板について車両走行の際に車両側から受ける振動に耐え得る所望の固定強度を確保することができる。また、上記の基板間プレート１０８のような部材を使用しないため部品点数を少なくできる。特に、カバー６の天板面におけるボス部２０９の配置は制限されない（例えば、カバー６の天板面の中央部にもボス部２０９を配置できる）ため、ボス部２０９による第２電子回路基板２０の固定強度を高くできる。
その他、実施形態１と同様の作用効果を奏する。 According to the third embodiment, as in the case of the first embodiment, the second electronic circuit board 20 can be fixed to the cover 6 of the housing 2 without being disturbed by the first electronic circuit board 10. Therefore, when each of the first electronic circuit board 10 and the second electronic circuit board 20 is fixed to the housing body 2, the arrangement and number of the fixing portions are not easily restricted. As a result, each electronic circuit board is not easily deformed by an external force, and it is possible to secure a desired fixing strength of each electronic circuit board that can withstand the vibration received from the vehicle side when the vehicle is running. Further, since the member such as the above-mentioned inter-board plate 108 is not used, the number of parts can be reduced. In particular, since the arrangement of the boss portion 209 on the top plate surface of the cover 6 is not limited (for example, the boss portion 209 can also be arranged on the central portion of the top plate surface of the cover 6), the second electronic circuit board 20 by the boss portion 209 can be arranged. Can increase the fixing strength of.
Other than that, it has the same effect as that of the first embodiment.

本発明は、上記の典型的な実施形態のみに限定されるものではなく、本発明の目的を逸脱しない限りにおいて種々の応用や変形が考えられる。例えば、上記の実施形態を応用した次の各形態を実施することもできる。 The present invention is not limited to the above-mentioned typical embodiments, and various applications and modifications can be considered as long as the object of the present invention is not deviated. For example, the following embodiments to which the above embodiments are applied can also be implemented.

上記の実施形態１，２では、アルミニウム系材料からなるケース３及びカバー６と、鉄系材料からなる基板間プレート８，１０８とについて例示したが、これら各要素の材料は必要に応じて適宜に変更が可能である。好ましくは、基板間プレート８，１０８がケース３及びカバー６よりも線膨張率が小さく且つ磁気遮蔽性を有する材料からなるように材料選定を行う。なお、必要に応じては、線膨張率及び磁気遮蔽性を考慮することなく基板間プレート８，１０８の材料選定を行うこともできる。例えば、基板間プレート８，１０８をアルミニウム系材料や樹脂材料によって構成してもよい。 In the above-described first and second embodiments, the case 3 and the cover 6 made of an aluminum-based material and the inter-board plates 8 and 108 made of an iron-based material have been illustrated, but the materials of these elements are appropriately used as needed. It can be changed. Preferably, the material is selected so that the inter-board plates 8 and 108 are made of a material having a coefficient of linear expansion smaller than that of the case 3 and the cover 6 and having a magnetic shielding property. If necessary, the materials of the inter-board plates 8 and 108 can be selected without considering the coefficient of linear expansion and the magnetic shielding property. For example, the inter-board plates 8 and 108 may be made of an aluminum-based material or a resin material.

上記の実施形態１，２では、２つの電子回路基板１０，２０の間に板状部材である基板間プレート８，１０８が介装される場合について例示したが、基板間プレート８，１０８に代えて、板状以外の形状の部材を用いることもできる。 In the above-described first and second embodiments, the case where the inter-board plates 8 and 108 which are plate-like members are interposed between the two electronic circuit boards 10 and 20 has been illustrated, but instead of the inter-board plates 8 and 108. It is also possible to use a member having a shape other than the plate shape.

上記の実施形態１〜３では、２つの電子回路基板１０，２０が第３方向Ｚに積層配置される場合について例示したが、必要に応じてこれら２つの電子回路基板１０，２０に加えて１または複数の電子回路基板が積層配置されてもよい。 In the above-described first to third embodiments, the case where the two electronic circuit boards 10 and 20 are laminated and arranged in the third direction Z has been illustrated, but if necessary, in addition to these two electronic circuit boards 10 and 20, 1 Alternatively, a plurality of electronic circuit boards may be stacked and arranged.

１，１０１，２０１電力変換装置
２収容体
２ａ空間
３ケース
３ａ開口
５ボス部（第１固定部）
６，７カバー
８，１０８基板間プレート（介装部材）
９固定ピン（第２固定部）
１０第１電子回路基板（第２基板）
２０第２電子回路基板（第１基板）
３０半導体モジュール
３１半導体素子
１０９固定ピン（第２固定部）
２０９ボス部（第２固定部）
Ｚ第１方向（基板厚み方向） 1,101,201 Power converter 2 Accommodating body 2a Space 3 Case 3a Opening 5 Boss part (1st fixed part)
6,7 Cover 8,108 Inter-board plate (intermediate member)
9 Fixing pin (2nd fixing part)
10 1st electronic circuit board (2nd board)
20 Second electronic circuit board (first board)
30 Semiconductor module 31 Semiconductor element 109 Fixing pin (second fixing part)
209 Boss part (second fixed part)
Z 1st direction (board thickness direction)

Claims

The first substrate (20) and the second substrate (10), which are laminated and arranged with a space (2a) separated in the substrate thickness direction (Z),
A first connection portion provided on the first substrate, which is a contact point between the first substrate and a conductive member (23) that electrically connects the control unit (40) on the vehicle side.
A second connecting portion provided on the first substrate and which is a contact point between the conductive member (22) that electrically connects the first substrate and the second substrate.
A third connecting portion provided on the second substrate and which is a contact point between the conductive member (22) that electrically connects the first substrate and the second substrate.
A plurality of first fixing portions (5) provided on the first metal member for fixing the second substrate to the first metal member (3), and
With
When the first substrate is viewed in the substrate thickness direction (Z), the third connection portion is all of the first fixed portions arranged along the outer periphery of the first substrate among the plurality of first fixing portions. A power converter (1,101,201) located outside the area surrounded by the fixed portion.

A semiconductor module (30) with a built-in semiconductor element (31) and
The semiconductor module, the first substrate, and the accommodating body (2) accommodating the second substrate together are provided.
The housing has a first fixing portion and a second fixing portion (9) to which the first substrate is fixed.
In the substrate thickness direction, the first substrate is not interposed between the first fixing portion of the housing and the second substrate, and in the substrate thickness direction, the second fixing portion of the housing and the second fixing portion are described. The power conversion device according to claim 1, wherein the second board is not interposed between the first board and the first board.

The housing has a case (3) and a cover (6) for closing the opening (3a) of the case, and the case is provided with one of the first fixing portion and the second fixing portion. The power conversion device according to claim 2, wherein the cover is provided with the other of the first fixing portion and the second fixing portion.

The housing is interposed between the case (3), the cover (6) that closes the opening (3a) of the case, and the first substrate and the second substrate, and the case and the cover. It has an intervening member (8,108) fixed to either one, and the interposing member is provided with one of the first fixing portion and the second fixing portion, and the above-mentioned accommodating body. The power conversion device according to claim 2, wherein the first fixing portion and the other of the second fixing portion are provided on a portion opposite to the substrate fixed to the interposing member with the interposing member sandwiched between them. ..

The electric power according to claim 4, wherein the interposing member is made of a material having a size of shielding one of the first substrate and the second substrate from one of the second substrates and having a magnetic shielding property in the thickness direction of the substrate. Conversion device.

The power conversion device according to claim 4 or 5, wherein the interposing member is made of a material having a linear expansion coefficient smaller than that of the case and the cover.

The second substrate is a high-voltage electronic circuit board that is arranged at a position closer to the semiconductor module than the first substrate and has a drive circuit for switching and driving the semiconductor module. The power conversion device according to any one of claims 2 to 6, which is a low-voltage electronic circuit board having a control circuit for controlling the semiconductor module based on vehicle information.