JP2021111716A - Electric device - Google Patents

Abstract

To cool a component, which needs cooling, of an electric device used under an adverse environment.SOLUTION: The electric device comprises a main case 2A and a sub case 2B detachably attached to the main case 2A. The main case 2A has: an air chamber 26A communicating with a first suction hole 32A; and a main passage 43A connecting the air chamber 26A with an exhaust hole 34A. The sub case 2B has a sub passage 20B. When the sub case 2B is attached to the main case 2A, the sub passage 20B communicates with the main passage 43A through the air chamber 26A. A gap 18 exists between the sub passage 20B and the air chamber 26A. A main fan 50A suctions air, which is moved in the sub passage 20B by a sub fan 54B, with air from a first suction hole 26 into the air chamber 26A and leads out air in the air chamber 26A from the exhaust hole 34 through the main passage 43. An air volume of the main fan 50A is larger than an air volume of the sub fan 54B so that air in the sub passage 20A is suctioned into the air chamber 26A.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electric device, particularly to a device in which a plurality of fans cool a component in the electric device.

Conventionally, as a device for cooling a component in a case by a plurality of fans, for example, there is one disclosed in Patent Document 1. In the technique of Patent Document 1, an upper chamber is formed in the entire upper portion of the rectangular parallelepiped case, and a lower chamber is formed in almost the entire lower portion of the case. Cooling required parts are arranged in the intermediate room between these two rooms. An exhaust fan is attached to one side wall of the upper room to exhaust the air inside the upper room to the outside. An introduction fan is attached to the upper room side of the boundary wall between the upper room and the intermediate room, which is the farthest from the exhaust fan, so as to introduce air from the intermediate room into the upper room. In the intermediate room, cooling components are placed below the introduction fan. In the lower room, an air introduction hole is formed in the side wall facing the side wall where the exhaust fan is formed so that air can be introduced from the outside, and the boundary wall between the lower room and the intermediate room has the lower room and the lower room. A through hole is formed that communicates with the intermediate room. When the exhaust fan and the introduction fan are operated at the same time, the air introduced from the air introduction hole in the lower room passes through the parts requiring cooling, is introduced into the upper room by the introduction fan, and is discharged from the upper room to the outside by the exhaust fan. Will be done. This air flow cools the parts requiring cooling.

Patent No. 5043037

According to this technique, the cooling-required parts in the intermediate room can be cooled well. Such electrical equipment may be used in an environment in which dust, a plating solution, or the like is contained in the air. However, according to the conventional technology, consideration is not given to environmental resistance such as dust resistance. Further, in the case of a cooling-requiring part that requires relatively maintenance, there is a need to attach and detach the fan and the cooling-requiring part together.

One aspect of the present invention is to enable cooling of a cooling-requiring component of an electric device used in a bad environment. Another aspect of the present invention is to improve the maintainability of the cooling-required component in addition to the above object.

The electrical device of one aspect of the present invention has a main case. The main case has a first intake hole and an exhaust hole, and further includes an air chamber, a main passage, and a main fan. The air chamber communicates with the first intake hole. In the main passage, a first cooling-requiring component is arranged inside and a circuit component is arranged outside, and the main passage is connected between the air chamber and the exhaust hole. The main fan introduces air into the air chamber from the first intake hole and leads the air in the air chamber to the exhaust hole through the main passage. Further, the electric device also has a sub-case that is detachably mounted on the circuit component of the main case. This sub-case includes a sub-passage and a sub-fan. The sub-passage has a second intake hole, a second cooling-requiring component is arranged inside, and is connected to the second intake hole and the air chamber. The auxiliary fan leads the air from the second intake hole to the air chamber via the auxiliary passage. The air volume of the main fan is larger than the air volume of the sub fan.

According to this configuration, by operating the secondary fan, the air introduced from the second intake hole of the secondary case cools the second cooling-requiring component in the secondary passage to reach the air chamber, and the main fan , The air from the sub-passage is sucked into the air chamber. The air from this sub-passage and the air introduced into the air chamber from the first intake hole of the main case by the operation of the main fan are combined, pass through the main passage, and are exhausted from the exhaust hole of the main case. NS. At this time, the first cooling-requiring component in the main passage is cooled by the air passing through the main passage. Therefore, the first and second cooling-requiring parts and circuit parts are appropriately cooled. Moreover, since the air volume of the main fan is larger than that of the sub fan, air is sucked into the air chamber without dust in the air from the sub-passage falling into the case through the gap between the main case and the sub case. Therefore, there is no need for a dustproof seal on the part where a gap may be created between the main case and the sub case. That is, since the sub case is not fixed to the main case with a sticker, the sub case can be detachably attached to the main case, facilitating cleaning and maintenance.

In the electrical equipment of the above aspect, the first intake hole, the second intake hole, and the exhaust hole can be formed in different directions from each other. As a result, the air flows due to the intake air of the main fan and the auxiliary fan do not interfere with each other, and the heated air exhausted from the exhaust holes is taken in again from the first intake hole and the second intake hole. There is no.

The air volume of the main fan can be four times or more the air volume of the sub fan. In this case, since the air in the sub-passage is guided to the air chamber, it is possible to prevent dust and the like from falling from the gap. The main passage can be configured with a tubular heat sink, such as a hollow cylinder or a quadrangular prism composed of a plurality of heat sinks. By doing so, the cooling efficiency of the first cooling-requiring component and the circuit component is good, and the main passage can be easily formed.

The first cooling-requiring component and the second cooling-requiring component may be environmentally resistant components, and the circuit component may be a semiconductor element. In this case, even if the circuit component is a semiconductor element that is not an environmentally resistant component, deterioration due to dust or the like can be prevented.

As described above, according to the present invention, it is possible to cool a cooling-required component of an electric device used in an adverse environment. The present invention can also improve the maintenance of parts requiring cooling.

It is a longitudinal side view of the electric appliance of 1st Embodiment of this invention. It is sectional drawing which follows the AA line of the electric appliance of FIG. It is a longitudinal side view of the electrical contraindication of the second embodiment of the present invention.

The electric device according to the first embodiment of the present invention is, for example, an electroplating machine 2, which is composed of a main case 2A and a sub case 2B as shown in FIG. It is attached to.

The electroplating machine 2 is formed, for example, in a substantially rectangular parallelepiped shape. The main case 2A has a rectangular lower wall 4A, a rectangular front wall 6A at one end thereof, and a rectangular main back wall 8A at the other end of the lower wall 4A. .. Both the front wall 6A and the main back wall 8A are perpendicular to the lower wall 4A, and the height of the main back wall 8A is lower than that of the front wall 6A by the height of the sub back wall 8B of the sub case 2B described later. As shown in FIG. 2, between the front wall 6A and the main back wall 8A, side walls 12A and 14A having a substantially rectangular shape perpendicular to the lower wall 4A are provided. The heights of the side walls 12A and 14A are the same as those of the front wall 6A.

As shown in FIG. 1, the front wall 6A is formed with a first intake hole 32A composed of a plurality of holes at a position facing the main fan 50A, which will be described later. An exhaust hole 34A composed of a plurality of holes is formed on the main back wall 8A at a position facing the first intake hole 32A.

At a position slightly distant from the front wall 6A of the main case 2A, a vertical partition wall 22A connected from the side wall 12A to the side wall 14A and having the same height as the main back wall 8A is arranged vertically from the lower wall 4A. Therefore, the vertical partition wall 22A divides the inside of the main case 2A into two. The vertical partition wall 22A is formed with one opening corresponding to the first intake hole 32A at a predetermined position, for example, in the center. This opening serves as the main passage entrance 36A of the main passage 43A, which will be described later. A partition plate 17A is horizontally arranged up to the vertical partition wall 22A at the upper end of the vertical partition wall 22A, and an opening is formed in the partition wall 17A, and this opening serves as a sub-passage outlet 48A described later.

From the vertical partition wall 22A to the main back wall 8A, a tubular or square columnar heat sink 40A is arranged so as to surround the main passage entrance 36A. Only one heat sink 40A may be provided, or a plurality of heat sinks may be arranged at predetermined intervals from the vertical partition wall 22A side to the main back wall 8A side. The inside of the heat sink 40A is used as the main passage 43A. It is preferable to form flanges at the front end and the rear end of the heat sink 40A and fix them so that no gap is formed between the vertical partition wall 22A, the heat sink 40A, and the main back wall 8A. The flange of the heat sink 40A can also be used as the vertical partition wall 22A.

The air chamber 26A is composed of the space surrounded by the front wall 6A, the side walls 12A and 14A, the vertical partition wall 22A, and the partition plate 17A. Further, as described above, the inside of the heat sink is the main passage 43A. Here, the space surrounded by the lower wall 4A, the side walls 12A, 14A, the vertical partition wall 22A, the main back wall 8A, and the heat sink 40A is a closed space 25A that is shielded from the outside air. The upper part of the heat sink 40A is surrounded by the side walls 12A and 14A, the vertical partition wall 22A, and the main back wall 8A, and the upper side is open.

The main case 2A is composed of the front wall 6A, the main back wall 8A, the side walls 12A and 14A, and the heat sink 40A. As described above, since a part of the heat sink 40A can also be used as the vertical partition wall 22A, the vertical partition wall 22A is omitted from the configuration of the main case 2A, but the vertical partition wall 22A is configured as the main case 2A. In that case, the heat sink 40A may be omitted from the configuration of the main case 2A, or both may be considered as the configuration of the main case 2A.

A sub-back wall 8B at the height of the upper end of the front wall 6A is arranged above the main back wall 8A. The main back wall 8A and the sub back wall 8B are separate members. The upper end of the sub-back wall 8B has a rectangular upper wall 10B that covers the upper ends of the front wall 6A and the side walls 12A and 14A, and the lower end of the sub-back wall 8B has a size that covers up to the upper end of the vertical partition wall 22A. The rectangular horizontal partition walls 16B are integrally formed with the sub-back wall 8B, respectively. The horizontal partition wall 16B is in contact with the side walls 12A and 14A from the secondary back wall 8B. A second vent 46B communicating with the outside is formed at a position close to the sub-back wall 8B of the upper wall 10B. The sub case 2B is composed of the upper wall 10B, the sub back wall 8B, and the horizontal partition wall 16B.

The sub case 2B is detachable from the main case 2A, and in the attached state, the front wall 6A, the back wall 8 in which the main back wall 8A and the sub back wall 8B are connected, and the side wall 12A, The 14A, the upper wall 10B, and the lower wall 4A are formed in a substantially rectangular parallelepiped shape.

When the sub case 2B is attached to the main case 2A, the horizontal partition wall 16B covers the upper part of the heat sink 40A of the main case 2A. In this way, the intermediate chamber 28C is formed by being surrounded by the upper part of the heat sink 40A, the side walls 12A and 14A, the main back wall 8A, the vertical partition wall 22A (or the flange of the heat sink 50A), and the horizontal partition wall 16B of the sub-case 2B. NS. That is, the intermediate room 28C is formed with the sub-case 2B attached to the main case 2A.

A main fan 50A is attached to the air chamber 26A of the main case 2A at a position facing the main passage 43A of the vertical partition wall 22A. Therefore, the first intake hole 32A, the main fan 50A, the main passage 43A, and the exhaust port 34 are arranged so as to face each other. Inside the main passage 43A, which is inside the heat sink 40A, a first cooling-requiring component, for example, an environmentally resistant reactor 44a is arranged. As the first cooling-requiring component, for example, an environment-resistant capacitor or a capacitor may be arranged. Further, a circuit component having weak environmental resistance, for example, a semiconductor element 45a, is attached to the closed space 25A on the outer surface of the heat sink 40A of the main case 2A. Further, a circuit component, for example, a semiconductor element 45c is also attached to the intermediate chamber 28C, and the reactor 44a and the semiconductor elements 45a and 45c are cooled by the air passing through the main passage 43A. Since the horizontal partition wall 16B of the secondary case 2B extends from the secondary back wall 8B to the vertical partition wall 22A of the main case 2A, there is a space between the front end of the horizontal partition wall 16B and the front wall 6A of the main case 2A. The opening of the partition plate 17A of the main case 2A arranged in the space constitutes the sub-passage outlet 48A.

The path from the second intake hole 46B of the sub-case 2B to the sub-passage outlet 48 is the sub-passage 20B, and a second cooling-requiring component, for example, an electronic circuit board 44b is arranged in the sub-passage 20B. There is. Electronic components other than the electronic circuit board 44b can also be used as the second cooling-requiring component. However, the second cooling-requiring component 44b generates less heat than the reactor 44a and the semiconductor elements 45a and 45c, and requires less cooling than the reactor 44a and the semiconductor elements 45a and 45c. In FIG. 2, the second cooling-requiring component 44b is omitted.

An auxiliary fan 54B is attached to the inner surface side of the upper wall 10B in which the second intake hole 46B is formed. The air volume of the sub fan 54B is smaller than that of the main fan 50A. For example, the air volume of the main fan 50A is four times or more that of the sub fan 54B. The sub fan 54B may be mounted not in the sub passage 20B but on the outer surface side of the upper wall 10B. A flat plate-shaped wind direction changing plate 56B is attached between the rear side of the horizontal partition wall 16B below the secondary fan 54B and the vicinity of the upper end of the secondary back wall 8B in a state of being inclined downward. The first intake hole 32A, the second intake hole 46B, and the exhaust hole 34A are arranged at different positions.

The sub case 2B is removable from the main case 2A. Since it is detachable in this way, the front end of the horizontal partition wall 16B is in a state of simply riding on the upper end of the vertical partition wall 22A. As shown in FIG. 1, since the horizontal partition wall 16B is only mounted on the vertical partition wall 22A and is not fixed or sealed, there may be a slight gap due to the warp of the horizontal partition wall 16B, or the sub-passage 20B may be driven by a fan. Even when there is a pressure difference between the inside and the intermediate room 28C separated by the horizontal partition wall 16B, or when air moves when the fans 46B and 50A are turned on and off, there is a gap 18 between the horizontal partition wall 16B and the vertical partition wall 22A. Will be created. A gap 18 is formed between the vertical partition wall 22A of the main case 2A and the horizontal partition wall 16B, that is, between the sub-passage 20B and the air chamber 26A (sub-passage outlet 48A). As described above, when the seal is not provided, the intermediate chamber 28C formed by the main case 2A and the sub case 2B is not completely sealed due to the gap 18.

Since the semiconductor element 45C attached to the intermediate chamber 28C may be damaged by dust, a plating solution, or the like, it has been conventionally considered to fix the semiconductor element 45C with a seal so that the gap 18 does not occur. However, if a seal is used, the sub case 2B is fixed to the main case 2A. If the electroplating machine 2 as in the present embodiment is fixed with a seal, the main fan 50A of the main case 2A can be maintained by removing the front wall 6A inside the main case 2A. If the wall 4A and the side walls 12A and 14A are removed, the semiconductor element 45a can be maintained, and if the main back wall 8B is removed, the reactor 44a can be maintained. On the other hand, regarding the inside of the sub case 2B, if the upper wall 10B is removed, the sub fan 54B and the electronic circuit board 44b can be maintained. However, when maintaining the semiconductor element 45C in the intermediate chamber 28C, it is necessary to remove the upper wall 10B, then remove the seal, and remove the horizontal partition wall 16B. After the maintenance, contrary to the previous procedure, it is necessary to fix it again with an expensive seal and attach each part, and the maintainability is not good.

By the operation of the auxiliary fan 54B, as shown by the arrow 58, the air introduced from the second intake hole 46B faces the horizontal partition wall 16B in the auxiliary passage 20B, and faces the front wall 6A side by the wind direction deflection plate 56B. Is changed, and the electronic circuit board 44b, which is the second component requiring cooling, is moved in the direction of the sub-passage outlet 48A while being cooled. Here, since the main fan 50 is also operating, the air from the sub-passage 20B is drawn into the air chamber 26A from the sub-passage outlet 48 by the suction force of the main fan 50. At the same time, the main fan 50A sucks air into the air chamber 26A from the first intake hole 32A, and the air sucked from the sub-passage outlet 48A and the air sucked from the first intake hole 32A are the main. By the operation of the fan 50A, the fan 50A enters the main passage 43A from the main passage inlet 36A, cools the reactor 44a, which is the first cooling-requiring component, and the semiconductor elements 45a, 45c, which are circuit components, and from the exhaust hole 34A to the case 2. It is discharged to the outside. Therefore, the electronic circuit board 44b, which is the second cooling-requiring component, is cooled by the air passing through the sub-passage 20B, and the reactor 44a, which is the first cooling-requiring component, and the semiconductor elements 45a, 45c of the circuit component are the sub-passage 20B. It is cooled by both the air that has passed through and the air that has entered through the first intake port 32A.

For example, when the air volumes of the main fan 50A and the sub fan 54B are the same, the dust contained in the air of the sub passage 20B is present from the gap 18 between the horizontal partition wall 16B and the vertical partition wall 22A to the semiconductor element 45c. There is a risk of falling into the intermediate room 28C. However, when the air volume of the main fan 50A is larger than that of the sub fan 54B, the air discharged from the sub-aisle 20B is attracted by the strong air volume of the main fan 50A and is introduced into the air chamber 26A from the sub-aisle outlet 48A. Dust and the like in the air do not fall from the gap 18 into the intermediate chamber 28C. Therefore, it is not necessary to seal the gap 18, and the sub case 2B can be attached to and detached from the main case 2A.

Further, since the upper wall 10A, the sub-back wall 8B, and the horizontal partition wall 16B are integrally formed, and the sub-case 2B is detachable from the main case 2A, the inside of the sub-passage 20B with the sub-case 2B removed. Maintenance such as cleaning, repair and replacement of the auxiliary fan 54B, the electronic circuit board 44b, and the semiconductor element 45c in the intermediate chamber 28C can be performed, and the maintenance of the entire electroplating machine 2 becomes easy.

The electrical device of the second embodiment is shown in FIG. In the case of the electroplating machine which is the electric device of this embodiment, the main back wall 8A is formed as a single piece like the front wall 6A. Similar to the first embodiment, the first intake hole 32A is provided on the front wall 6A, the second intake hole 46B is provided on the upper wall 10B, and the exhaust hole 34A is provided on the back wall 8B. However, the inside of the main case 2A is divided into an air chamber 26A and a rear chamber 60A by a vertical partition wall 22A provided at a position close to the front wall 6A. The lower edge of the vertical partition wall 22A is integrated with the lower wall 4A, and both side edges are integrated with the side walls 12A and 14A, respectively, and the upper edge thereof is in contact with the upper wall 10B. The vertical partition wall 22A is provided with an opening at a position facing the position of the first intake port 26A, and this opening serves as the main passage inlet 36A. An opening is also provided above the main passage inlet 36A of the vertical partition wall 22A, and this opening is a communication hole 62A that communicates the air chamber 26A and the rear chamber 60A. The lower wall 4A, the front wall 6A, the vertical partition wall 22A, the back wall 8A, the side walls 12A, and 14A constitute the main case 2A. Further, the upper wall 10B is removable from the front wall 6A, the back wall 8A and the side walls 12A, 14A, and protrudes slightly from the front wall 6A and the back wall 8A.

Similar to the first embodiment, the rear chamber 60A is provided with a heat sink 40A, a reactor 44a, semiconductor elements 45a, 45c and the like, and a closed space 25A is formed between the heat sink 40A and the lower wall 4A. ing. Further, a sub-case 2B is provided above the sub-case 2B, and an intermediate chamber 28C is formed between the sub-case 2B and the heat sink 40A as in the first embodiment.

The sub-case 2B has a front side wall 64B extending from the inner surface of the upper wall 10B near the vertical partition wall 22A to the lower main passage 43A side, and a main passage 43A side below the inner surface of the upper wall 10B near the back wall 8A. The bottom wall 68B is connected between the front side wall 64B and the lower end of the rear side wall 66B, and the side walls (not shown) are the front side wall 64B, the rear side wall 66B, and the bottom. It is formed so as to connect between the wall 68B and the upper wall 10B, respectively. A sub-case 2B is formed by the upper wall 10B, the front side wall 64B, the rear side wall 66B, the bottom wall 68B, and the side wall, and the sub-passage 20B is formed inside the sub-case 2B.

An electronic circuit board 44b, which is a second cooling component, is mounted in the sub-case 2A. The sub-passage outlet 48b of the sub-case 2A is formed at the position of the front side wall 64B corresponding to the communication hole 62A of the main case 2A, and the sub-fan 54B is attached to the inside of the second intake hole 46 of the sub-case 2B. There is. The relationship between the air volume of the main fan 50A and the sub fan 54B is the same as that of the first embodiment. Further, a curved wind direction deflecting plate 56B is provided between the bottom wall 68B and the rear side wall 66B. Similar to the wind direction deflecting plate 56B of the first embodiment, a flat plate-shaped wind direction deflecting plate may be used.

The sub-case 2B is detached from the main case 2A by lifting the upper wall 10B, and is detachable. Further, when the sub-case 2B is attached to the main case 2A, a gap 18 is formed between the communication hole 62A of the vertical partition wall 22A and the front side wall 64B of the sub-passage 20B as in the first embodiment. There is.

In the electric device of this embodiment as well, the reactor 44a, the semiconductor elements 45a, and 45c are cooled by the main fan 50A and the sub fan 54B, and the secondary fan 54B cools the second, as in the electric device of the first embodiment. The cooling-required component 44b is cooled.

Since the air volume of the main fan 50A is four times or more the air volume of the sub fan 54B, dust from the sub-passage 20B can be collected from the gap 18 without sealing the gap 18 as in the first embodiment. It is possible to prevent the invasion of the intermediate room 28C. Moreover, since the sub-case 2B is removable, the inside of the sub-case 2B can be cleaned, the rear room 60A can be cleaned, and each part can be easily replaced or repaired. Although not shown, one of the walls constituting the sub-case 2B is detachable in order to facilitate cleaning inside the sub-case 2B.

In the above two embodiments, the present invention has been carried out on an electroplating machine, but the present invention is not limited to this, and can be carried out on other electric devices such as a power supply device of an electric welding machine. Further, although the electroplating machine 2 shows a rectangular parallelepiped shape as a whole, other shapes such as a cylindrical shape can also be used.

2 Electroplating machine 2A Main case 2B Sub case 18 Gap 20B Sub passage 26A Air chamber 43A Main passage 44a Reactor (first cooling required part)
44b Electronic circuit board (second cooling component required)
45a, 45c Semiconductor elements (circuit parts)
46B 2nd intake hole 50A Main fan 54B Secondary fan

Claims (5)

An air chamber having a first intake hole and an exhaust hole and communicating with the first intake hole, a first cooling-requiring component is arranged inside, and a circuit component is arranged outside, and the air chamber is arranged. Air is introduced into the air chamber from the main passage connected between the air chamber and the exhaust hole and the first intake hole, and the air in the air chamber is introduced into the exhaust hole through the main passage. The main fan to be derived, the main case where is located, and
It has a second intake hole, a second cooling component is arranged inside, the second intake hole, a sub-passage connected to the air chamber, and air from the second intake hole. A sub-fan is arranged and detachably mounted on the circuit component of the main case.
An electric device having an air volume of the main fan larger than that of the sub fan. In the electric device according to claim 1, in a state where the sub-case is attached to the main case, the first intake hole, the second intake hole, and the exhaust hole are formed in different directions from each other. Electrical equipment. The electric device according to claim 1 or 2, wherein the air volume of the main fan is four times or more the air volume of the sub fan. In the electric device according to any one of claims 1 to 3, the main passage is an electric device composed of a tubular heat sink. The electrical device according to any one of claims 1 to 4, wherein the first cooling-requiring component and the second cooling-requiring component are environmentally resistant components, and the circuit component is a semiconductor element.

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