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JP2021096961A - Vacuum dryer and vacuum drying method - Google Patents

Vacuum dryer and vacuum drying method Download PDF

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Publication number
JP2021096961A
JP2021096961A JP2019227773A JP2019227773A JP2021096961A JP 2021096961 A JP2021096961 A JP 2021096961A JP 2019227773 A JP2019227773 A JP 2019227773A JP 2019227773 A JP2019227773 A JP 2019227773A JP 2021096961 A JP2021096961 A JP 2021096961A
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Prior art keywords
vacuum drying
substrate
stage
head portion
insertion hole
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Inventor
稔彦 植田
Toshihiko Ueda
稔彦 植田
俊文 那須
Toshifumi Nasu
俊文 那須
純史 及川
Junji Oikawa
純史 及川
栄二 小倉
Eiji Ogura
栄二 小倉
林　輝幸
Teruyuki Hayashi
輝幸 林
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2019227773A priority Critical patent/JP2021096961A/en
Priority to TW109142744A priority patent/TW202135212A/en
Priority to KR1020200169631A priority patent/KR20210077598A/en
Priority to CN202011436834.9A priority patent/CN112974180A/en
Publication of JP2021096961A publication Critical patent/JP2021096961A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/02—Applications of driving mechanisms, not covered by another subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
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Abstract

To provide a technique capable of improving the uniformity of vacuum drying processing.SOLUTION: A vacuum dryer according to one aspect of the present disclosure performs vacuum drying processing to dry a liquid on a substrate in a vacuum state. The vacuum dryer according to an embodiment includes a chamber, a plurality of lift pins and a stage. The chamber houses the substrate. Each of the lift pins has a head part in contact with the lower face of the substrate and a rod part connected to the head part, and can be raised and lowered between a lifting position when the substrate is delivered and a lowering position when the vacuum drying processing is performed. The stage has a plurality of insertion holes through which the rod parts are inserted, respectively. The head part has, on at least part of the top surface thereof, a flat surface that is flush with the top surface of the stage at the lowering position.SELECTED DRAWING: Figure 3

Description

開示の実施形態は、減圧乾燥装置および減圧乾燥方法に関する。 The disclosed embodiments relate to vacuum drying devices and vacuum drying methods.

従来、たとえばガラス基板等の基板上に有機ＥＬ（Electro Luminescence）層を形成する製造プロセスにおいて、基板を減圧状態で乾燥することにより、基板上に塗布された有機材料から溶媒を除去する減圧乾燥処理が行われる。 Conventionally, in a manufacturing process for forming an organic EL (Electro Luminescence) layer on a substrate such as a glass substrate, a vacuum drying process for removing a solvent from an organic material coated on the substrate by drying the substrate under reduced pressure. Is done.

特開２０１７−７３３９７号公報JP-A-2017-73397

本開示は、減圧乾燥処理の均一性を向上させることができる技術を提供する。 The present disclosure provides a technique capable of improving the uniformity of the vacuum drying process.

本開示の一態様による減圧乾燥装置は、基板上の液体を減圧状態で乾燥させる減圧乾燥処理を行う。実施形態に係る減圧乾燥装置は、チャンバと、複数のリフトピンと、ステージとを備える。チャンバは、基板を収容する。リフトピンは、基板の下面に接触するヘッド部およびヘッド部に接続されるロッド部を有し、基板の受け渡しを行う際の上昇位置と減圧乾燥処理を行う際の下降位置との間で昇降可能である。ステージは、ロッド部が挿通される挿通孔を複数有する。また、ヘッド部は、上面の少なくとも一部に、下降位置においてステージの上面と面一となる平坦面を有する。 The vacuum drying apparatus according to one aspect of the present disclosure performs a vacuum drying process for drying the liquid on the substrate in a reduced pressure state. The vacuum drying device according to the embodiment includes a chamber, a plurality of lift pins, and a stage. The chamber houses the substrate. The lift pin has a head portion that contacts the lower surface of the substrate and a rod portion that is connected to the head portion, and can be raised and lowered between the ascending position when the substrate is delivered and the descending position when the vacuum drying process is performed. is there. The stage has a plurality of insertion holes through which the rod portion is inserted. Further, the head portion has a flat surface that is flush with the upper surface of the stage at the lowering position at least in a part of the upper surface.

本開示によれば、減圧乾燥処理の均一性を向上させることができる。 According to the present disclosure, the uniformity of the vacuum drying process can be improved.

図１は、実施形態に係る基板処理システムの模式的な平面図である。FIG. 1 is a schematic plan view of the substrate processing system according to the embodiment. 図２は、実施形態に係る減圧乾燥装置の模式的な断面図である。FIG. 2 is a schematic cross-sectional view of the vacuum drying apparatus according to the embodiment. 図３は、実施形態に係る減圧乾燥装置の模式的な断面図である。FIG. 3 is a schematic cross-sectional view of the vacuum drying apparatus according to the embodiment. 図４は、上部連結機構の構成例を示す模式的な断面図である。FIG. 4 is a schematic cross-sectional view showing a configuration example of the upper connecting mechanism. 図５は、上部連結機構の他の構成例を示す模式的な断面図である。FIG. 5 is a schematic cross-sectional view showing another configuration example of the upper connecting mechanism. 図６は、上部連結機構の動作例を示す図である。FIG. 6 is a diagram showing an operation example of the upper connecting mechanism. 図７は、上部連結機構の動作例を示す図である。FIG. 7 is a diagram showing an operation example of the upper connecting mechanism. 図８は、下部連結機構の構成例を示す模式的な断面図である。FIG. 8 is a schematic cross-sectional view showing a configuration example of the lower connecting mechanism. 図９は、下部連結機構の動作例を示す図である。FIG. 9 is a diagram showing an operation example of the lower connecting mechanism. 図１０は、下部連結機構の動作例を示す図である。FIG. 10 is a diagram showing an operation example of the lower connecting mechanism. 図１１は、実施形態に係る減圧乾燥装置が実行する処理の手順を示すフローチャートである。FIG. 11 is a flowchart showing a procedure of processing executed by the vacuum drying apparatus according to the embodiment.

以下に、本開示による減圧乾燥装置および減圧乾燥方法を実施するための形態（以下、「実施形態」と記載する）について図面を参照しつつ詳細に説明する。なお、この実施形態により本開示が限定されるものではない。また、各実施形態は、処理内容を矛盾させない範囲で適宜組み合わせることが可能である。また、以下の各実施形態において同一の部位には同一の符号を付し、重複する説明は省略される。 Hereinafter, a mode for carrying out the vacuum drying apparatus and the vacuum drying method according to the present disclosure (hereinafter, referred to as “the embodiment”) will be described in detail with reference to the drawings. The present disclosure is not limited by this embodiment. In addition, each embodiment can be appropriately combined as long as the processing contents do not contradict each other. Further, in each of the following embodiments, the same parts are designated by the same reference numerals, and duplicate description is omitted.

また、以下参照する各図面では、説明を分かりやすくするために、互いに直交するＸ軸方向、Ｙ軸方向およびＺ軸方向を規定し、Ｚ軸正方向を鉛直上向き方向とする直交座標系を示す場合がある。また、鉛直軸を回転中心とする回転方向をθ方向と呼ぶ場合がある。 Further, in each drawing referred to below, in order to make the explanation easy to understand, an orthogonal coordinate system in which the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to each other are defined and the Z-axis positive direction is the vertical upward direction is shown. In some cases. Further, the rotation direction centered on the vertical axis may be referred to as the θ direction.

また、以下に示す実施形態では、「一定」、「直交」、「垂直」あるいは「平行」といった表現が用いられる場合があるが、これらの表現は、厳密に「一定」、「直交」、「垂直」あるいは「平行」であることを要しない。すなわち、上記した各表現は、製造精度、設置精度などのずれを許容するものとする。 Further, in the embodiments shown below, expressions such as "constant", "orthogonal", "vertical" or "parallel" may be used, but these expressions are strictly "constant", "orthogonal", and "parallel". It does not have to be "vertical" or "parallel". That is, each of the above expressions allows for deviations in manufacturing accuracy, installation accuracy, and the like.

従来、たとえばガラス基板等の基板上に有機ＥＬ（Electro Luminescence）層を形成する製造プロセスにおいて、基板を減圧状態で乾燥することにより、基板上に塗布された有機材料から溶媒を除去する減圧乾燥処理が行われる。 Conventionally, in a manufacturing process for forming an organic EL (Electro Luminescence) layer on a substrate such as a glass substrate, a vacuum drying process for removing a solvent from an organic material coated on the substrate by drying the substrate under reduced pressure. Is done.

特許文献１には、真空引き可能な処理容器と、処理容器内に配置されたステージと、ステージの上面に対して突没可能なリフトピンとを備えた減圧乾燥装置が開示されている。リフトピンは、減圧乾燥処理中においてステージの上面から突出しており、ステージの上面から基板を離隔させた状態で基板を支持する。 Patent Document 1 discloses a vacuum drying device including a processing container that can be evacuated, a stage arranged in the processing container, and a lift pin that can be recessed with respect to the upper surface of the stage. The lift pin protrudes from the upper surface of the stage during the vacuum drying process, and supports the substrate in a state where the substrate is separated from the upper surface of the stage.

ステージには、リフトピンを挿通させるための挿通孔が設けられており、リフトピンと挿通孔との間には隙間が存在する。このため、基板の下面とステージの上面との間における空間（基板とステージとの離隔距離）が、挿通孔が設けられていない場所と、挿通孔が設けられている場所（上記隙間が存在する場所）とで変化する。これにより、減圧乾燥処理中、基板の面内において温度のばらつきが生じ、かかる温度のばらつきによって乾燥速度にばらつきが生じるおそれがある。この結果、挿通孔の直上に位置する基板の上面部分に、挿通孔（またはリフトピン）の形状が転写するおそれがある。 The stage is provided with an insertion hole for inserting the lift pin, and there is a gap between the lift pin and the insertion hole. Therefore, the space between the lower surface of the substrate and the upper surface of the stage (the separation distance between the substrate and the stage) is a place where the insertion hole is not provided and a place where the insertion hole is provided (the above gap exists). It changes with the place). As a result, during the vacuum drying process, the temperature varies in the plane of the substrate, and the drying rate may vary due to the temperature variation. As a result, the shape of the insertion hole (or lift pin) may be transferred to the upper surface portion of the substrate located directly above the insertion hole.

また、減圧乾燥処理中にリフトピンがステージ内部に引っ込むタイプの減圧乾燥装置も存在する。この種の減圧乾燥装置では、リフトピンの先端がステージの上面から飛び出さないように、ステージの上面よりも低い位置まで引っ込められる。このため、この種の減圧乾燥装置では、リフトピンと挿通孔との間だけでなく、ステージの上面とリフトピンの先端との間にも隙間が生じることとなる。したがって、上記と同様、基板の面内において温度のばらつきが生じて減圧乾燥処理の均一性が低下するおそれがある。 There is also a type of vacuum drying device in which the lift pin retracts into the stage during the vacuum drying process. In this type of vacuum drying device, the tip of the lift pin is retracted to a position lower than the upper surface of the stage so as not to protrude from the upper surface of the stage. Therefore, in this type of vacuum drying device, a gap is generated not only between the lift pin and the insertion hole but also between the upper surface of the stage and the tip of the lift pin. Therefore, similarly to the above, there is a possibility that the temperature varies in the plane of the substrate and the uniformity of the vacuum drying process is lowered.

そこで、減圧乾燥処理の均一性を向上させることができる技術が期待されている。 Therefore, a technique capable of improving the uniformity of the vacuum drying process is expected.

＜基板処理システムの構成＞
まず、実施形態に係る基板処理システムの構成について図１を参照して説明する。図１は、実施形態に係る基板処理システムの模式的な平面図である。 <Configuration of board processing system>
First, the configuration of the substrate processing system according to the embodiment will be described with reference to FIG. FIG. 1 is a schematic plan view of the substrate processing system according to the embodiment.

図１に示す基板処理システム１００は、たとえば有機ＥＬ（Electro Luminescence）ディスプレイの製造過程で、外部のインクジェット印刷装置によって有機材料がインクジェット印刷されたガラス基板等の基板Ｓの減圧乾燥処理に用いられる。ここでいう減圧乾燥処理とは、基板Ｓを大気圧以下の減圧環境下に置くことにより、基板Ｓ上の有機材料に含有される溶媒や水分等の揮発成分を除去する処理である。 The substrate processing system 100 shown in FIG. 1 is used, for example, in the process of manufacturing an organic EL (Electro Luminescence) display for vacuum drying processing of a substrate S such as a glass substrate on which an organic material is inkjet printed by an external inkjet printing device. The vacuum drying treatment referred to here is a treatment for removing volatile components such as solvent and moisture contained in the organic material on the substrate S by placing the substrate S in a reduced pressure environment of atmospheric pressure or less.

図１に示すように、実施形態に係る基板処理システム１００は、複数（ここでは３つ）の減圧乾燥装置１と、搬送装置２と、ロードロック装置３とが平面視十字状に連結されたマルチチャンバ構造を有する。具体的には、中央に搬送装置２が配置され、搬送装置２の三方の側面に隣接して３つの減圧乾燥装置１が配置される。そして、搬送装置２の残りの一方の側面に隣接してロードロック装置３が配置される。 As shown in FIG. 1, in the substrate processing system 100 according to the embodiment, a plurality of (three in this case) vacuum drying devices 1, a transfer device 2, and a load lock device 3 are connected in a cross shape in a plan view. It has a multi-chamber structure. Specifically, the transport device 2 is arranged in the center, and three vacuum drying devices 1 are arranged adjacent to the three side surfaces of the transport device 2. Then, the load lock device 3 is arranged adjacent to the remaining one side surface of the transfer device 2.

各減圧乾燥装置１と搬送装置２との間およびロードロック装置３と搬送装置２との間には、開閉機能を有するゲートバルブ６０が設けられる。ゲートバルブ６０は、閉状態で各装置を気密にシールするとともに、開状態で装置間を連通させて基板Ｓの移送を可能にしている。また、基板処理システム１００の外部とロードロック装置３との間にも同様のゲートバルブ６０が設けられる。このように、基板処理システム１００は、内部空間を減圧雰囲気（真空状態）に維持することができるように構成されている。 A gate valve 60 having an opening / closing function is provided between each decompression drying device 1 and the transfer device 2 and between the load lock device 3 and the transfer device 2. The gate valve 60 airtightly seals each device in the closed state, and allows the devices to communicate with each other in the open state to transfer the substrate S. Further, a similar gate valve 60 is provided between the outside of the substrate processing system 100 and the load lock device 3. As described above, the substrate processing system 100 is configured so that the internal space can be maintained in a reduced pressure atmosphere (vacuum state).

また、実施形態に係る基板処理システム１００は、３つの減圧乾燥装置１、搬送装置２およびロードロック装置３の動作を制御する制御装置５０を備える。 Further, the substrate processing system 100 according to the embodiment includes a control device 50 that controls the operations of the three vacuum drying devices 1, the transfer device 2, and the load lock device 3.

（減圧乾燥装置について）
減圧乾燥装置１は、有機材料が塗布された基板に対して上述した減圧乾燥処理を行う。減圧乾燥装置１は、矩形状のチャンバ１１の内部にステージ１２を備える。ステージ１２は、複数の挿通孔１２１を有しており、各挿通孔１２１には、基板Ｓを下方から支持する昇降可能なリフトピン１３が配置される。また、ステージ１２の上面には、ステージ１２の上面から突出して基板Ｓを支持する複数の支持部材１４が設けられている。減圧乾燥装置１の詳細な構造については後述する。 (About vacuum drying device)
The vacuum drying device 1 performs the vacuum drying treatment described above on the substrate coated with the organic material. The vacuum drying device 1 includes a stage 12 inside a rectangular chamber 11. The stage 12 has a plurality of insertion holes 121, and a lift pin 13 that can be raised and lowered to support the substrate S from below is arranged in each insertion hole 121. Further, on the upper surface of the stage 12, a plurality of support members 14 projecting from the upper surface of the stage 12 to support the substrate S are provided. The detailed structure of the vacuum drying device 1 will be described later.

（搬送装置について）
搬送装置２は、３つの減圧乾燥装置１およびロードロック装置３に対する基板Ｓの搬入出を行う。搬送装置２には、矩形状のチャンバ２１の内部に搬送機構２２を備える。搬送機構２２は、たとえば、基板を下方から支持する二股状の基板支持部２２１と、基板支持部２２１を進出、退避および旋回させる駆動部２２２とを備える。搬送機構２２は、駆動部２２２による進出、退避および旋回動作の組み合わせにより、３つの減圧乾燥装置１およびロードロック装置３に対する基板Ｓの搬入出を行う。 (About the transport device)
The transport device 2 carries in and out the substrate S to and from the three vacuum drying devices 1 and the load lock device 3. The transfer device 2 is provided with a transfer mechanism 22 inside the rectangular chamber 21. The transport mechanism 22 includes, for example, a bifurcated substrate support portion 221 that supports the substrate from below, and a drive portion 222 that advances, retracts, and swivels the substrate support portion 221. The transport mechanism 22 carries in and out the substrate S to and from the three decompression drying devices 1 and the load lock device 3 by a combination of advance, retract, and swivel operations by the drive unit 222.

（ロードロック装置について）
ロードロック装置３は、大気圧状態と減圧状態とを切り替え可能に構成される。ロードロック装置３は、矩形状のチャンバ３１の内部にステージ３２を備える。ステージ３２は、複数の挿通孔３２２を有しており、各挿通孔３２２には、基板Ｓを下方から支持する昇降可能なリフトピン３２が配置される。 (About load lock device)
The load lock device 3 is configured to be able to switch between an atmospheric pressure state and a depressurized state. The load lock device 3 includes a stage 32 inside a rectangular chamber 31. The stage 32 has a plurality of insertion holes 322, and a lift pin 32 that can be raised and lowered to support the substrate S from below is arranged in each insertion hole 322.

（制御装置について）
制御装置５０は、ユーザーインターフェース５１と、ＣＰＵを備えたコントローラ５２と、記憶部５３とを備える。コントローラ５２は、コンピュータ機能を有しており、基板処理システム１００において、減圧乾燥装置１、搬送装置２およびロードロック装置３を制御する。ユーザーインターフェース５１は、作業者による入力操作を受け付けるキーボードや、基板処理システム１００の稼働状況等を表示するディスプレイ等を含む。記憶部５３には、基板処理システム１００で実行される各種処理をコントローラ５２の制御にて実現するための制御プログラム（ソフトウエア）や処理条件データ等が記録されたレシピが保存されている。ユーザーインターフェース５１および記憶部５３は、コントローラ５２に接続されている。 (About the control device)
The control device 50 includes a user interface 51, a controller 52 including a CPU, and a storage unit 53. The controller 52 has a computer function and controls the vacuum drying device 1, the transfer device 2, and the load lock device 3 in the substrate processing system 100. The user interface 51 includes a keyboard that accepts input operations by an operator, a display that displays an operating status of the board processing system 100, and the like. The storage unit 53 stores a recipe in which a control program (software) for realizing various processes executed by the substrate processing system 100 under the control of the controller 52, processing condition data, and the like are recorded. The user interface 51 and the storage unit 53 are connected to the controller 52.

そして、必要に応じて、ユーザーインターフェース５１からの指示等にて任意のレシピを記憶部５３から呼び出してコントローラ５２に実行させることで、コントローラ５２の制御下で、基板処理システム１００での所望の処理が実行される。前記制御プログラムや処理条件データ等のレシピは、コンピュータ読み取り可能な記憶媒体、たとえばＣＤ−ＲＯＭ、ハードディスク、フレキシブルディスク、フラッシュメモリなどに格納された状態のものを利用できる。あるいは、他の装置から、たとえば専用回線を介して随時伝送させてオンラインで利用したりすることも可能である。 Then, if necessary, an arbitrary recipe is called from the storage unit 53 by an instruction from the user interface 51 or the like and executed by the controller 52, so that the desired processing in the substrate processing system 100 is performed under the control of the controller 52. Is executed. As the recipe such as the control program and the processing condition data, those stored in a computer-readable storage medium such as a CD-ROM, a hard disk, a flexible disk, or a flash memory can be used. Alternatively, it can be transmitted online at any time from another device, for example, via a dedicated line.

（減圧乾燥装置の詳細構成について）
次に、減圧乾燥装置１の詳細な構成例について図２および図３を参照して説明する。図２および図３は、実施形態に係る減圧乾燥装置１の模式的な断面図である。 (Detailed configuration of vacuum drying device)
Next, a detailed configuration example of the vacuum drying device 1 will be described with reference to FIGS. 2 and 3. 2 and 3 are schematic cross-sectional views of the vacuum drying apparatus 1 according to the embodiment.

ここで、図２には、複数のリフトピン１３を上昇位置に配置させた状態を示しており、図３には、複数のリフトピン１３を下降位置に配置させた状態を示している。上昇位置は、搬送装置２との間で基板Ｓの受け渡しを行う際の複数のリフトピン１３の高さ位置である。また、下降位置は、上述した減圧乾燥処理を行う際の複数のリフトピン１３（後述するヘッド部１３１）の高さ位置である。 Here, FIG. 2 shows a state in which a plurality of lift pins 13 are arranged in an ascending position, and FIG. 3 shows a state in which a plurality of lift pins 13 are arranged in a descending position. The ascending position is the height position of the plurality of lift pins 13 when the substrate S is delivered to and from the transport device 2. The lowering position is the height position of the plurality of lift pins 13 (head portion 131 described later) when the above-mentioned vacuum drying process is performed.

図２および図３に示すように、減圧乾燥装置１は、チャンバ１１と、ステージ１２と、複数のリフトピン１３と、複数の支持部材１４とを備える。 As shown in FIGS. 2 and 3, the vacuum drying device 1 includes a chamber 11, a stage 12, a plurality of lift pins 13, and a plurality of support members 14.

チャンバ１１は、減圧状態を維持可能な耐圧容器である。チャンバ１１が有する複数の側壁のうち搬送装置２に隣接する側壁１１１には、基板Ｓの搬入出口１１２が設けられている。搬入出口１１２は、ゲートバルブ６０によって開閉される。 The chamber 11 is a pressure-resistant container capable of maintaining a reduced pressure state. Of the plurality of side walls of the chamber 11, the side wall 111 adjacent to the transfer device 2 is provided with a carry-in / outlet 112 for the substrate S. The carry-in outlet 112 is opened and closed by the gate valve 60.

また、チャンバ１１の底壁１１３には、排気口１１４が設けられている。排気口１１４は、真空ポンプ等の排気装置１１５に接続されており、この排気装置１１５を駆動させることにより、減圧乾燥装置１内をたとえば数Ｐａの圧力まで減圧排気できるように構成される。 Further, an exhaust port 114 is provided on the bottom wall 113 of the chamber 11. The exhaust port 114 is connected to an exhaust device 115 such as a vacuum pump, and by driving the exhaust device 115, the inside of the vacuum drying device 1 can be depressurized and exhausted to a pressure of, for example, several Pa.

ステージ１２は、平坦な上面１２５を有する。ステージ１２は、チャンバ１１の底壁１１３に直接または図示しない支柱を介して固定される。ステージ１２は、加熱部を内蔵していてもよい。加熱部としては、たとえば抵抗加熱方式のヒーター等を用いることができる。 The stage 12 has a flat top surface 125. The stage 12 is fixed to the bottom wall 113 of the chamber 11 directly or via a strut (not shown). The stage 12 may have a built-in heating unit. As the heating unit, for example, a resistance heating type heater or the like can be used.

ステージ１２には、ステージ１２を上下に貫通する複数の挿通孔１２１が形成される。挿通孔１２１は、チャンバ１１の底壁１１３にも形成される。 A plurality of insertion holes 121 are formed in the stage 12 so as to vertically penetrate the stage 12. The insertion hole 121 is also formed in the bottom wall 113 of the chamber 11.

ステージ１２の上面１２５には、複数の支持部材１４が設けられる。複数の支持部材１４は、ステージ１２の上面１２５から鉛直上方に突出しており、減圧乾燥処理時において基板Ｓを下方から支持する。 A plurality of support members 14 are provided on the upper surface 125 of the stage 12. The plurality of support members 14 project vertically upward from the upper surface 125 of the stage 12, and support the substrate S from below during the vacuum drying process.

リフトピン１３は、挿通孔１２１に配置され、基板Ｓを下方から支持して昇降させる。なお、ここでは図示を省略するが、リフトピン１３と挿通孔１２１との間にはブシュが設けられており、これにより、チャンバ１１の気密性が維持される。 The lift pin 13 is arranged in the insertion hole 121, and supports the substrate S from below to move up and down. Although not shown here, a bush is provided between the lift pin 13 and the insertion hole 121, whereby the airtightness of the chamber 11 is maintained.

リフトピン１３は、ヘッド部１３１と、ロッド部１３２と、上部連結機構１３３と、昇降機構１３４と、下部連結機構１３５とを備える。なお、ここでは、複数のリフトピン１３の各々が昇降機構１３４を備える場合の例を示すが、減圧乾燥装置１は、複数のリフトピン１３を一括で昇降させる単一の昇降機構１３４を備えていてもよい。 The lift pin 13 includes a head portion 131, a rod portion 132, an upper connecting mechanism 133, an elevating mechanism 134, and a lower connecting mechanism 135. Here, an example is shown in which each of the plurality of lift pins 13 is provided with an elevating mechanism 134, but the vacuum drying device 1 may be provided with a single elevating mechanism 134 for raising and lowering the plurality of lift pins 13 at once. Good.

ヘッド部１３１は、たとえばＰＥＥＫ（ポリエーテルエーテルケトン）等の樹脂で形成される。ヘッド部１３１は、チャンバ１１内に配置され、チャンバ１１に搬入された基板Ｓを下方から支持する。 The head portion 131 is formed of, for example, a resin such as PEEK (polyetheretherketone). The head portion 131 is arranged in the chamber 11 and supports the substrate S carried into the chamber 11 from below.

ロッド部１３２は、鉛直方向に沿って延在する部材である。ロッド部１３２は、ステージ１２に形成された挿通孔１２１に挿通されており、チャンバ１１の内部および外部に跨がって配置される。上部連結機構１３３は、チャンバ１１内に配置され、ヘッド部１３１とロッド部１３２とを接続する。 The rod portion 132 is a member extending along the vertical direction. The rod portion 132 is inserted into the insertion hole 121 formed in the stage 12, and is arranged so as to straddle the inside and the outside of the chamber 11. The upper connecting mechanism 133 is arranged in the chamber 11 and connects the head portion 131 and the rod portion 132.

昇降機構１３４は、たとえばエアシリンダおよびボールネジ等の駆動源と、この駆動源によって鉛直方向に移動するシャフトとを備える。昇降機構１３４のシャフトは、先端部において下部連結機構１３５に接続される。昇降機構１３４は、下部連結機構１３５を介してロッド部１３２に接続され、ロッド部１３２を鉛直方向に沿って移動させる。これにより、昇降機構１３４は、基板Ｓの受け渡しを行う際の上昇位置と減圧乾燥処理を行う際の下降位置との間でヘッド部１３１を昇降させる。 The elevating mechanism 134 includes, for example, a drive source such as an air cylinder and a ball screw, and a shaft that moves in the vertical direction by the drive source. The shaft of the elevating mechanism 134 is connected to the lower connecting mechanism 135 at the tip end portion. The elevating mechanism 134 is connected to the rod portion 132 via the lower connecting mechanism 135, and moves the rod portion 132 along the vertical direction. As a result, the elevating mechanism 134 raises and lowers the head portion 131 between the ascending position when the substrate S is delivered and the descending position when the vacuum drying process is performed.

下部連結機構１３５は、ロッド部１３２と昇降機構１３４とを接続する。上部連結機構１３３および下部連結機構１３５は、所謂フリージョイントであり、２つの部材を連結しつつ、連結する２つの部材の一方を他方に対して鉛直方向に沿って相対的に移動させることが可能である。この点については後述する。 The lower connecting mechanism 135 connects the rod portion 132 and the elevating mechanism 134. The upper connecting mechanism 133 and the lower connecting mechanism 135 are so-called free joints, and while connecting two members, one of the two connecting members can be relatively moved along the vertical direction with respect to the other. Is. This point will be described later.

複数のリフトピン１３は、図２に示す上昇位置において搬送装置２の搬送機構２２から基板Ｓを受け取った後、昇降機構１３４を用いてヘッド部１３１を下降位置まで下降させる。ここで、複数の支持部材１４の先端は、下降位置（ステージ１２の上面１２５の高さ位置）よりも高い位置にある。このため、ヘッド部１３１を下降させる過程で、リフトピン１３から支持部材１４への基板Ｓの受け渡しが行われる。その後、ヘッド部１３１はさらに下降して下降位置に到達する。 The plurality of lift pins 13 receive the substrate S from the transport mechanism 22 of the transport device 2 at the lift position shown in FIG. 2, and then lower the head portion 131 to the lower position using the lift mechanism 134. Here, the tips of the plurality of support members 14 are at positions higher than the descending position (the height position of the upper surface 125 of the stage 12). Therefore, in the process of lowering the head portion 131, the substrate S is delivered from the lift pin 13 to the support member 14. After that, the head portion 131 further descends to reach the descending position.

図３に示すように、ヘッド部１３１は、平坦な上面１３１ａを有する。そして、かかるヘッド部１３１の上面１３１ａは、下降位置においてステージ１２の上面１２５と面一となる。 As shown in FIG. 3, the head portion 131 has a flat upper surface 131a. Then, the upper surface 131a of the head portion 131 is flush with the upper surface 125 of the stage 12 at the descending position.

本明細書において「面一」とは、二つの面、すなわち、ヘッド部１３１の上面１３１ａとステージ１２の上面１２５との間に段差がなく平坦である状態を意味する。ヘッド部１３１の上面１３１ａとステージ１２の上面１２５との間は、実質的に無段差であればよく、たとえば寸法誤差等による僅かな段差は許容されるものとする。 As used herein, the term "plane" means a state in which there is no step between the two surfaces, that is, the upper surface 131a of the head portion 131 and the upper surface 125 of the stage 12, and the surface is flat. It suffices that there is substantially no step between the upper surface 131a of the head portion 131 and the upper surface 125 of the stage 12, and a slight step due to, for example, a dimensional error is allowed.

また、ヘッド部１３１の上面１３１ａとステージ１２の上面１２５とが平坦であるとは、ヘッド部１３１の上面１３１ａとステージ１２の上面１２５とが同一平面上に位置することを意味する。ヘッド部１３１の上面１３１ａとステージ１２の上面１２５とは、実質的に平坦であればよく、たとえば、ヘッド部１３１が下方に引っ張られることによるヘッド部１３１の上面１３１ａの僅かな湾曲等は許容されるものとする。 Further, the fact that the upper surface 131a of the head portion 131 and the upper surface 125 of the stage 12 are flat means that the upper surface 131a of the head portion 131 and the upper surface 125 of the stage 12 are located on the same plane. The upper surface 131a of the head portion 131 and the upper surface 125 of the stage 12 may be substantially flat, and for example, a slight curvature of the upper surface 131a of the head portion 131 due to the head portion 131 being pulled downward is allowed. Shall be.

上述したように、減圧乾燥処理時において基板の面内で温度の不均一が生じると、減圧乾燥処理の均一性が低下することで、基板の上面に挿通孔またはリフトピンの形状が転写するおそれがある。 As described above, if the temperature is not uniform in the plane of the substrate during the vacuum drying process, the uniformity of the vacuum drying process is lowered, and the shape of the insertion hole or the lift pin may be transferred to the upper surface of the substrate. is there.

これに対し、実施形態に係る減圧乾燥装置１では、減圧乾燥処理時において、ヘッド部１３１の上面１３１ａとステージ１２の上面１２５とが面一になる。すなわち、基板Ｓの下面とステージ１２の上面１２５との離隔距離が基板Ｓの面内において均一になるため、基板Ｓの面内における温度のばらつきが生じ難い。したがって、実施形態に係る減圧乾燥装置１によれば、減圧乾燥処理の均一性を向上させることができ、基板Ｓ上面への挿通孔１２１またはリフトピン１３の形状の転写を抑制することができる。 On the other hand, in the vacuum drying apparatus 1 according to the embodiment, the upper surface 131a of the head portion 131 and the upper surface 125 of the stage 12 are flush with each other during the vacuum drying process. That is, since the separation distance between the lower surface of the substrate S and the upper surface 125 of the stage 12 is uniform in the plane of the substrate S, the temperature variation in the plane of the substrate S is unlikely to occur. Therefore, according to the vacuum drying device 1 according to the embodiment, the uniformity of the vacuum drying process can be improved, and the transfer of the shape of the insertion hole 121 or the lift pin 13 to the upper surface of the substrate S can be suppressed.

また、ヘッド部１３１は、下降位置においてステージ１２と面一になるだけでなく、下降位置において挿通孔１２１を塞ぐ。具体的には、ステージ１２は、挿通孔１２１の上端部に挿通孔１２１よりも大径の凹部１２２を有する。ヘッド部１３１は、挿通孔１２２よりも大径であり、下降位置において凹部１２２に収まることで、挿通孔１２１を塞ぐ。 Further, the head portion 131 not only flushes with the stage 12 in the lowered position, but also closes the insertion hole 121 in the lowered position. Specifically, the stage 12 has a recess 122 having a diameter larger than that of the insertion hole 121 at the upper end of the insertion hole 121. The head portion 131 has a diameter larger than that of the insertion hole 122, and fits in the recess 122 at the lowered position to close the insertion hole 121.

このように、ステージ１２の上面１２５における挿通孔１２１とロッド部１３２との隙間をヘッド部１３１が埋めることで、基板Ｓの下面とステージ１２の上面１２５と離隔距離が局所的に大きくなる場所をさらに減らすことができる。したがって、減圧乾燥処理の均一性をさらに向上させることができる。 In this way, the head portion 131 fills the gap between the insertion hole 121 and the rod portion 132 on the upper surface 125 of the stage 12, so that the lower surface of the substrate S and the upper surface 125 of the stage 12 are separated from each other locally. It can be further reduced. Therefore, the uniformity of the vacuum drying process can be further improved.

凹部１２２は、ステージ１２の上面１２５に向かって拡径するテーパ形状を有する。また、ヘッド部１３１は、凹部１２２に対応するテーパ形状を有する。ヘッド部１３１をテーパ状に形成することで、ヘッド部１３１の周縁部の厚みが薄くなるため、ヘッド部１３１が下降位置に位置したときに、ステージ１２の上面１２５とヘッド部１３１の上面１３１ａとの間に段差を生じさせにくくすることができる。したがって、減圧乾燥処理の均一性をさらに向上させることができる。 The recess 122 has a tapered shape that expands in diameter toward the upper surface 125 of the stage 12. Further, the head portion 131 has a tapered shape corresponding to the recess 122. By forming the head portion 131 in a tapered shape, the thickness of the peripheral portion of the head portion 131 becomes thin, so that when the head portion 131 is positioned in the lowered position, the upper surface 125 of the stage 12 and the upper surface 131a of the head portion 131 It is possible to make it difficult to generate a step between the two. Therefore, the uniformity of the vacuum drying process can be further improved.

（上部連結機構の詳細構成および動作について）
次に、上部連結機構１３３の詳細な構成例について図４および図５を参照して説明する。図４は、上部連結機構１３３の構成例を示す模式的な断面図である。また、図５は、上部連結機構１３３の他の構成例を示す模式的な断面図である。 (Detailed configuration and operation of the upper connection mechanism)
Next, a detailed configuration example of the upper connecting mechanism 133 will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic cross-sectional view showing a configuration example of the upper connecting mechanism 133. Further, FIG. 5 is a schematic cross-sectional view showing another configuration example of the upper connecting mechanism 133.

図４に示すように、上部連結機構１３３は、ヘッド部１３１の下部に配置されてヘッド部１３１と一体化された第１部材３０１と、ロッド部１３２の上部に配置されてロッド部１３２と一体化された第２部材３０２とを備える。 As shown in FIG. 4, the upper connecting mechanism 133 is arranged in the lower part of the head portion 131 and integrated with the head portion 131, and is arranged in the upper part of the rod portion 132 and integrated with the rod portion 132. It is provided with a modified second member 302.

第１部材３０１の内部には、鉛直方向に延在する摺動空間３０１ａが形成される。また、第１部材３０１の下部には、後述する第２部材３０２の軸部３０２ｂが挿通される挿通孔３０１ｂが形成される。挿通孔３０１ｂの径（水平方向の幅）は、摺動空間３０１ａの径よりも小さい。 Inside the first member 301, a sliding space 301a extending in the vertical direction is formed. Further, an insertion hole 301b through which the shaft portion 302b of the second member 302, which will be described later, is inserted is formed in the lower portion of the first member 301. The diameter (horizontal width) of the insertion hole 301b is smaller than the diameter of the sliding space 301a.

第２部材３０２は、第１部材３０１の摺動空間３０１ａに配置された係合部３０２ａと、係合部３０２ａとロッド部１３２とを連結する軸部３０２ｂとを備える。係合部３０２ａの径（水平方向の幅）は、軸部３０２ｂおよび挿通孔３０１ｂの径よりも大きい。 The second member 302 includes an engaging portion 302a arranged in the sliding space 301a of the first member 301, and a shaft portion 302b that connects the engaging portion 302a and the rod portion 132. The diameter (horizontal width) of the engaging portion 302a is larger than the diameter of the shaft portion 302b and the insertion hole 301b.

なお、図４に示した構成例に限らず、たとえば図５に示すように、上部連結機構１３３は、第１部材３０１がロッド部１３２と一体化され、第２部材３０２がヘッド部１３１と一体化された構成であってもよい。 Not limited to the configuration example shown in FIG. 4, for example, as shown in FIG. 5, in the upper connecting mechanism 133, the first member 301 is integrated with the rod portion 132, and the second member 302 is integrated with the head portion 131. It may be a modified configuration.

次に、上部連結機構１３３の動作について図６および図７を参照して説明する。図６および図７は、上部連結機構１３３の動作例を示す図である。なお、図６および図７では、図４に示した上部連結機構１３３の動作例を示しているが、図５に示した上部連結機構１３３についても同様である。 Next, the operation of the upper connecting mechanism 133 will be described with reference to FIGS. 6 and 7. 6 and 7 are views showing an operation example of the upper connecting mechanism 133. Although FIGS. 6 and 7 show an operation example of the upper connecting mechanism 133 shown in FIG. 4, the same applies to the upper connecting mechanism 133 shown in FIG.

上述したように、ヘッド部１３１は、昇降機構１３４（図２参照）によってステージ１２の凹部１２２に当接する位置まで下降する。しかしながら、昇降機構１３４の精度によっては、ヘッド部１３１を適切な位置で停止させることができず、ヘッド部１３１が凹部１２２に当接した後も、引き続きヘッド部１３１を下方に引き下げようとするおそれがある。この場合、仮にヘッド部１３１とロッド部１３２とがリジッドに固定されていると、ヘッド部１３１およびロッド部１３２に負荷がかかってリフトピン１３が損傷するおそれがある。 As described above, the head portion 131 is lowered to a position where it abuts on the recess 122 of the stage 12 by the elevating mechanism 134 (see FIG. 2). However, depending on the accuracy of the elevating mechanism 134, the head portion 131 cannot be stopped at an appropriate position, and even after the head portion 131 comes into contact with the recess 122, the head portion 131 may continue to be pulled downward. There is. In this case, if the head portion 131 and the rod portion 132 are rigidly fixed, a load may be applied to the head portion 131 and the rod portion 132 to damage the lift pin 13.

そこで、実施形態に係る減圧乾燥装置１では、ヘッド部１３１とロッド部１３２とを上部連結機構１３３を介して連結することとしている。上部連結機構１３３は、ヘッド部１３１が凹部１２２に当接した後、ロッド部１３２だけを下降させることができる。具体的には、ヘッド部１３１は、凹部１２２に当接することで下方への移動が規制されるのに対し（図６参照）、ロッド部１３２は、上部連結機構１３３の係合部３０２ａが摺動空間３０１ａの下部に突き当たるまで引き続き下降することができる（図７参照）。 Therefore, in the vacuum drying device 1 according to the embodiment, the head portion 131 and the rod portion 132 are connected via the upper connecting mechanism 133. The upper connecting mechanism 133 can lower only the rod portion 132 after the head portion 131 comes into contact with the recess 122. Specifically, the head portion 131 is restricted from moving downward by abutting on the recess 122 (see FIG. 6), whereas the rod portion 132 is slid by the engaging portion 302a of the upper connecting mechanism 133. It can continue to descend until it hits the lower part of the moving space 301a (see FIG. 7).

このように、実施形態に係る減圧乾燥装置１によれば、ヘッド部１３１がステージ１２に当接するまでリフトピン１３を下降させることに伴うリフトピン１３の損傷を抑制することができる。 As described above, according to the vacuum drying device 1 according to the embodiment, it is possible to suppress damage to the lift pin 13 due to lowering the lift pin 13 until the head portion 131 comes into contact with the stage 12.

（下部連結機構の詳細構成について）
次に、下部連結機構の詳細な構成および動作について図８を参照して説明する。図８は、下部連結機構の構成例を示す模式的な断面図である。 (Detailed configuration of lower connection mechanism)
Next, the detailed configuration and operation of the lower connecting mechanism will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view showing a configuration example of the lower connecting mechanism.

図８に示すように、下部連結機構１３５は、本体部５０１と、上側当接部材５０２と、下側当接部材５０３と、弾性部材５０４とを備える。 As shown in FIG. 8, the lower connecting mechanism 135 includes a main body 501, an upper contact member 502, a lower contact member 503, and an elastic member 504.

本体部５０１は、昇降機構１３４のシャフト４０１の先端部に接続される。本体部５０１は、上面に凹部５０１ａを有する。上側当接部材５０２は、本体部５０１に固定されて本体部５０１とともに昇降する。上側当接部材５０２は、本体部５０１の上面よりも上方において本体部５０１の上面と対向配置される平板部５０２ａを有する。平板部５０２ａには、ロッド部１３２を挿通させるための挿通孔５０２ｂが形成される。 The main body 501 is connected to the tip of the shaft 401 of the elevating mechanism 134. The main body 501 has a recess 501a on the upper surface. The upper contact member 502 is fixed to the main body 501 and moves up and down together with the main body 501. The upper contact member 502 has a flat plate portion 502a that is arranged above the upper surface of the main body 501 and faces the upper surface of the main body 501. An insertion hole 502b for inserting the rod portion 132 is formed in the flat plate portion 502a.

下側当接部材５０３は、本体部５０１の上面よりも上方かつ上側当接部材５０２の平板部５０２ａよりも下方に配置される。下側当接部材５０３は、ロッド部１３２よりも大径の板状部材であり、ロッド部１３２に固定されてロッド部１３２とともに昇降する。 The lower contact member 503 is arranged above the upper surface of the main body 501 and below the flat plate portion 502a of the upper contact member 502. The lower contact member 503 is a plate-shaped member having a diameter larger than that of the rod portion 132, and is fixed to the rod portion 132 and moves up and down together with the rod portion 132.

弾性部材５０４は、たとえばコイルバネであり、上側当接部材５０２の平板部５０２ａと下側当接部材５０３との間に配置される。弾性部材５０４の上端部は、上側当接部材５０２の平板部５０２ａに固定され、弾性部材５０４の下端部は、下側当接部材５０３に固定される。弾性部材５０４は、上側当接部材５０２の平板部５０２ａと下側当接部材５０３とを離す方向に付勢する。 The elastic member 504 is, for example, a coil spring, and is arranged between the flat plate portion 502a of the upper contact member 502 and the lower contact member 503. The upper end portion of the elastic member 504 is fixed to the flat plate portion 502a of the upper contact member 502, and the lower end portion of the elastic member 504 is fixed to the lower contact member 503. The elastic member 504 is urged in a direction in which the flat plate portion 502a of the upper contact member 502 and the lower contact member 503 are separated from each other.

次に、下部連結機構１３５の動作について図９および図１０を参照して説明する。図９および図１０は、下部連結機構１３５の動作例を示す図である。 Next, the operation of the lower connecting mechanism 135 will be described with reference to FIGS. 9 and 10. 9 and 10 are diagrams showing an operation example of the lower connecting mechanism 135.

図９に示すように、昇降機構１３４によって下部連結機構１３５が上方に移動すると、下部連結機構１３５の本体部５０１に形成された凹部５０１ａにロッド部１３２の下端部が突き当たる。この状態で昇降機構１３４によって下部連結機構１３５がさらに上方に移動することで、ヘッド部１３１、ロッド部１３２および上部連結機構１３３は上昇する。 As shown in FIG. 9, when the lower connecting mechanism 135 is moved upward by the elevating mechanism 134, the lower end portion of the rod portion 132 abuts on the recess 501a formed in the main body portion 501 of the lower connecting mechanism 135. In this state, the lower connecting mechanism 135 is further moved upward by the elevating mechanism 134, so that the head portion 131, the rod portion 132, and the upper connecting mechanism 133 are raised.

また、図９に示す状態において、昇降機構１３４によって下部連結機構１３５が下方に移動すると、ロッド部１３２の下端部が本体部５０１の凹部５０１ａから離れる。しかし、ロッド部１３２と本体部５０１とは、上側当接部材５０２、下側当接部材５０３および弾性部材５０４によって接続されているため、ヘッド部１３１、ロッド部１３２および上部連結機構１３３は、下部連結機構１３５の下降に伴って下降する。 Further, in the state shown in FIG. 9, when the lower connecting mechanism 135 is moved downward by the elevating mechanism 134, the lower end portion of the rod portion 132 is separated from the recess 501a of the main body portion 501. However, since the rod portion 132 and the main body portion 501 are connected by the upper contact member 502, the lower contact member 503, and the elastic member 504, the head portion 131, the rod portion 132, and the upper connecting mechanism 133 are connected to the lower portion. It descends as the coupling mechanism 135 descends.

そして、図１０に示すように、ヘッド部１３１がステージ１２の凹部１２２に当接した後、昇降機構１３４によってさらに下部連結機構１３５が引き下げられたとする。この場合、下側当接部材５０３の位置は変わらず、上側当接部材５０２のみが下方に移動することとなるが、このとき、上側当接部材５０２は、弾性部材５０４を圧縮させながら下方に移動する。 Then, as shown in FIG. 10, it is assumed that after the head portion 131 comes into contact with the recess 122 of the stage 12, the lower connecting mechanism 135 is further pulled down by the elevating mechanism 134. In this case, the position of the lower contact member 503 does not change, and only the upper contact member 502 moves downward. At this time, the upper contact member 502 moves downward while compressing the elastic member 504. Moving.

このように、実施形態に係る減圧乾燥装置１は、下部連結機構１３５を備えるため、たとえば、上部連結機構１３３の可動域以上にロッド部１３２が引き下げられた場合であっても、リフトピン１３の損傷を抑制することができる。すなわち、ロッド部１３２の下降が規制された状態であっても、上側当接部材５０２の平板部５０２ａと下側当接部材５０３とのクリアランス分だけ、昇降機構１３４（シャフト４０１）のさらなる下降を許容することができる。 As described above, since the vacuum drying device 1 according to the embodiment includes the lower connecting mechanism 135, the lift pin 13 is damaged even when the rod portion 132 is pulled down beyond the range of motion of the upper connecting mechanism 133, for example. Can be suppressed. That is, even when the lowering of the rod portion 132 is restricted, the elevating mechanism 134 (shaft 401) can be further lowered by the clearance between the flat plate portion 502a of the upper contact member 502 and the lower contact member 503. It can be tolerated.

また、下部連結機構１３５は、弾性部材５０４を備えており、弾性部材５０４の付勢力に抗しながら下降するため、ヘッド部１３１等に急激な負荷が加わることを抑制することができる。 Further, since the lower connecting mechanism 135 includes the elastic member 504 and descends while resisting the urging force of the elastic member 504, it is possible to suppress a sudden load from being applied to the head portion 131 or the like.

なお、リフトピン１３は、上部連結機構１３３および下部連結機構１３５のうち何れか一方のみを備える構成であってもよい。すなわち、リフトピン１３は、上部連結機構１３３および下部連結機構１３５のうち、上部連結機構１３３のみを備える構成であってもよし、下部連結機構１３５のみを備える構成であってもよい。また、下部連結機構１３５は、必ずしも弾性部材５０４を備えることを要しない。この場合であっても、下部連結機構１３５は、上側当接部材５０２の平板部５０２ａと下側当接部材５０３とのクリアランス分だけ、昇降機構１３４（シャフト４０１）のさらなる下降を許容することができる。 The lift pin 13 may be configured to include only one of the upper connecting mechanism 133 and the lower connecting mechanism 135. That is, the lift pin 13 may have a configuration including only the upper connecting mechanism 133 or a configuration including only the lower connecting mechanism 135 among the upper connecting mechanism 133 and the lower connecting mechanism 135. Further, the lower connecting mechanism 135 does not necessarily have to include the elastic member 504. Even in this case, the lower connecting mechanism 135 may allow the elevating mechanism 134 (shaft 401) to be further lowered by the clearance between the flat plate portion 502a of the upper contact member 502 and the lower contact member 503. it can.

（減圧乾燥装置の具体的な動作について）
次に、実施形態に係る減圧乾燥装置１の具体的な動作について図１１を参照して説明する。図１１は、実施形態に係る減圧乾燥装置１が実行する処理の手順を示すフローチャートである。なお、図１１に示す処理手順は、制御装置５０による制御に従って実行される。 (Specific operation of vacuum drying device)
Next, the specific operation of the vacuum drying apparatus 1 according to the embodiment will be described with reference to FIG. FIG. 11 is a flowchart showing a procedure of processing executed by the vacuum drying apparatus 1 according to the embodiment. The processing procedure shown in FIG. 11 is executed according to the control by the control device 50.

まず、前段階として、外部のインクジェット印刷装置において基板Ｓ上に有機材料が所定のパターンで印刷される。有機材料が印刷された基板Ｓは、図示しない搬送装置によってロードロック装置３に搬入される。その後、基板Ｓは、搬送装置２が備える搬送機構２２によってロードロック装置３から搬出されて３つの減圧乾燥装置１のいずれかに搬入される。 First, as a preliminary step, an organic material is printed on the substrate S in a predetermined pattern in an external inkjet printing apparatus. The substrate S on which the organic material is printed is carried into the load lock device 3 by a transfer device (not shown). After that, the substrate S is carried out from the load lock device 3 by the transport mechanism 22 included in the transport device 2, and is carried into any of the three vacuum drying devices 1.

減圧乾燥装置１では、まず、搬入処理が行われる（ステップＳ１０１）。搬入処理では、複数のリフトピン１３を上昇位置に配置させ（図２参照）、かかる複数のリフトピン１３を用いて搬送機構２２から基板Ｓを受け取る。具体的には、搬送機構２２の基板支持部２２１を複数のリフトピン１３の上方に位置させた後、基板支持部２２１を下降させることにより、基板支持部２２１に支持された基板Ｓを複数のリフトピン１３に渡す。 In the vacuum drying device 1, first, the carry-in process is performed (step S101). In the carry-in process, a plurality of lift pins 13 are arranged at raised positions (see FIG. 2), and the substrate S is received from the transport mechanism 22 using the plurality of lift pins 13. Specifically, after the substrate support portion 221 of the transport mechanism 22 is positioned above the plurality of lift pins 13, the substrate S supported by the substrate support portion 221 is lifted by the plurality of lift pins by lowering the substrate support portion 221. Pass it to 13.

つづいて、減圧乾燥装置１では、下降処理が行われる（ステップＳ１０２）。下降処理は、複数のリフトピン１３を下降させることによって基板Ｓを下降させる。具体的には、下降処理では、ヘッド部１３１がステージ１２と面一になる下降位置に到達するまで複数のリフトピン１３を下降させる。この過程において、基板Ｓは、複数のリフトピン１３からステージ１２に設けられた複数の支持部材１４に受け渡される。 Subsequently, in the vacuum drying apparatus 1, the lowering process is performed (step S102). In the lowering process, the substrate S is lowered by lowering the plurality of lift pins 13. Specifically, in the lowering process, the plurality of lift pins 13 are lowered until the head portion 131 reaches a lowering position flush with the stage 12. In this process, the substrate S is transferred from the plurality of lift pins 13 to the plurality of support members 14 provided on the stage 12.

つづいて、減圧乾燥装置１では、減圧乾燥処理が行われる（ステップＳ１０３）。減圧乾燥処理では、排気装置１１５によってチャンバ１１の内部が排気される。これにより、チャンバ１１の内部は、所定の真空度まで減圧され、基板Ｓ上の有機材料から溶媒や水分等の揮発成分が除去される。 Subsequently, in the vacuum drying apparatus 1, the vacuum drying process is performed (step S103). In the vacuum drying process, the inside of the chamber 11 is exhausted by the exhaust device 115. As a result, the inside of the chamber 11 is depressurized to a predetermined degree of vacuum, and volatile components such as a solvent and water are removed from the organic material on the substrate S.

つづいて、減圧乾燥装置１では、上昇処理が行われる（ステップＳ１０４）。上昇処理では、排気装置１１５を停止させ、チャンバ１１内を大気圧状態に戻した後、複数のリフトピン１３を上昇位置まで上昇させる。 Subsequently, in the vacuum drying apparatus 1, the ascending process is performed (step S104). In the ascending process, the exhaust device 115 is stopped, the inside of the chamber 11 is returned to the atmospheric pressure state, and then the plurality of lift pins 13 are raised to the ascending position.

減圧乾燥処理は、基板Ｓが複数の支持部材１４に支持された状態、すなわち、ステージ１２の上面１２５から基板Ｓを離隔させた状態で行われる。このため、基板Ｓが減圧によってステージ１２の上面１２５に張り付くことを抑制することができる。ステージ１２に張り付いた基板Ｓを複数のリフトピン１３で上昇させた場合、基板Ｓが損傷するおそれがある。したがって、複数の支持部材１４によって基板Ｓを支持した状態で減圧乾燥処理を行うことで、上昇処理時における基板Ｓの損傷を抑制することができる。基板Ｓは、上昇処理の過程で、複数の支持部材１４から複数のリフトピン１３に受け渡される。 The vacuum drying process is performed in a state where the substrate S is supported by a plurality of support members 14, that is, in a state where the substrate S is separated from the upper surface 125 of the stage 12. Therefore, it is possible to prevent the substrate S from sticking to the upper surface 125 of the stage 12 due to the reduced pressure. When the substrate S attached to the stage 12 is raised by a plurality of lift pins 13, the substrate S may be damaged. Therefore, by performing the vacuum drying treatment in a state where the substrate S is supported by the plurality of support members 14, damage to the substrate S during the ascending treatment can be suppressed. The substrate S is transferred from the plurality of support members 14 to the plurality of lift pins 13 in the process of raising.

そして、減圧乾燥装置１では、搬出処理が行われる（ステップＳ１０５）。搬出処理では、複数のリフトピン１３から搬送機構２２に基板Ｓが受け渡され、搬送機構２２に受け渡された基板Ｓは、搬送機構２２によって減圧乾燥装置１から搬出される。その後、基板Ｓは、搬送機構２２によってロードロック装置３に搬入され、外部の搬送装置によってロードロック装置３から搬出される。 Then, in the vacuum drying device 1, the carry-out process is performed (step S105). In the carry-out process, the substrate S is delivered from the plurality of lift pins 13 to the transport mechanism 22, and the substrate S delivered to the transport mechanism 22 is carried out from the vacuum drying device 1 by the transport mechanism 22. After that, the substrate S is carried into the load lock device 3 by the transfer mechanism 22, and is carried out from the load lock device 3 by an external transfer device.

（変形例について）
ヘッド部１３１の上面１３１ａは、必ずしも全体的に平坦であることを要しない。たとえば、ヘッド部１３１は、平坦な上面１３１ａの一部に凸部または凹部が形成されていてもよい。このように、ヘッド部１３１は、上面１３１ａの少なくとも一部に、下降位置においてステージ１２の上面１２５と面一となる平坦面を有していればよい。また、ヘッド部１３１は、必ずしもテーパ形状を有することを要しない。 (About the modified example)
The upper surface 131a of the head portion 131 does not necessarily have to be flat as a whole. For example, the head portion 131 may have a convex portion or a concave portion formed on a part of a flat upper surface 131a. As described above, the head portion 131 may have a flat surface flush with the upper surface 125 of the stage 12 at the lowering position at least in a part of the upper surface 131a. Further, the head portion 131 does not necessarily have to have a tapered shape.

上述した実施形態では、インクジェット印刷装置によって基板Ｓ上に有機材料がインクジェット印刷される場合の例について説明したが、基板Ｓ上の有機材料は、必ずしもインクジェット印刷されたものであることを要しない。また、上述した実施形態では、基板がガラス基板である場合の例について説明したが、基板は半導体ウエハ等であってもよい。 In the above-described embodiment, an example in which the organic material is inkjet-printed on the substrate S by the inkjet printing apparatus has been described, but the organic material on the substrate S does not necessarily have to be inkjet-printed. Further, in the above-described embodiment, an example in which the substrate is a glass substrate has been described, but the substrate may be a semiconductor wafer or the like.

また、上述した実施形態では、減圧乾燥装置１を用いて基板Ｓ上にインクジェット印刷された有機材料を乾燥させる例について説明した。これに限らず、減圧乾燥装置１は、たとえばフラットパネルディスプレイ（ＦＰＤ）製造のフォトリソグラフィー工程に用いることができる。この場合、減圧乾燥装置１は、ガラス基板等の基板上に塗布されたレジスト液の塗布膜をプリベーキングに先立って適度に乾燥させるために使用される。 Further, in the above-described embodiment, an example of drying the organic material inkjet-printed on the substrate S by using the vacuum drying device 1 has been described. Not limited to this, the vacuum drying device 1 can be used, for example, in a photolithography process for manufacturing a flat panel display (FPD). In this case, the vacuum drying device 1 is used to appropriately dry the coating film of the resist liquid applied on the substrate such as a glass substrate prior to prebaking.

上述してきたように、実施形態に係る減圧乾燥装置は、基板上の液体を減圧状態で乾燥させる減圧乾燥処理を行う。実施形態に係る減圧乾燥装置は、チャンバと、複数のリフトピンと、ステージとを備える。チャンバは、基板を収容する。リフトピンは、基板の下面に接触するヘッド部およびヘッド部に接続されるロッド部を有し、基板の受け渡しを行う際の上昇位置と減圧乾燥処理を行う際の下降位置との間で昇降可能である。ステージは、ロッド部が挿通される挿通孔を複数有する。また、ヘッド部は、上面の少なくとも一部に、下降位置においてステージの上面と面一となる平坦面を有する。 As described above, the vacuum drying apparatus according to the embodiment performs a vacuum drying process for drying the liquid on the substrate in a reduced pressure state. The vacuum drying device according to the embodiment includes a chamber, a plurality of lift pins, and a stage. The chamber houses the substrate. The lift pin has a head portion that contacts the lower surface of the substrate and a rod portion that is connected to the head portion, and can be raised and lowered between the ascending position when the substrate is delivered and the descending position when the vacuum drying process is performed. is there. The stage has a plurality of insertion holes through which the rod portion is inserted. Further, the head portion has a flat surface that is flush with the upper surface of the stage at the lowering position at least in a part of the upper surface.

これにより、減圧乾燥処理時において基板の面内で温度の不均一が生じることを抑制することができる。したがって、実施形態に係る減圧乾燥装置によれば、減圧乾燥処理の均一性を向上させることができる。具体的には、基板の上面に挿通孔またはリフトピンの形状が転写することを抑制することができる。 As a result, it is possible to suppress the occurrence of non-uniform temperature in the surface of the substrate during the vacuum drying process. Therefore, according to the vacuum drying apparatus according to the embodiment, the uniformity of the vacuum drying treatment can be improved. Specifically, it is possible to prevent the shape of the insertion hole or the lift pin from being transferred to the upper surface of the substrate.

ヘッド部は、下降位置において挿通孔を塞いでもよい。たとえば、ステージは、挿通孔の上端部に挿通孔よりも大径の凹部を有し、ヘッド部は、挿通孔よりも大径であり、下降位置において凹部に収まってもよい。挿通孔とロッド部との隙間をヘッド部が埋めることで、基板の下面とステージの上面と離隔距離が局所的に大きくなる場所をさらに減らすことができる。したがって、減圧乾燥処理の均一性をさらに向上させることができる。 The head portion may close the insertion hole in the lowered position. For example, the stage has a recess at the upper end of the insertion hole having a diameter larger than that of the insertion hole, and the head portion has a diameter larger than that of the insertion hole and may be accommodated in the recess in the descending position. By filling the gap between the insertion hole and the rod portion with the head portion, it is possible to further reduce the place where the separation distance between the lower surface of the substrate and the upper surface of the stage is locally increased. Therefore, the uniformity of the vacuum drying process can be further improved.

凹部は、ステージの上面に向かって拡径するテーパ形状を有していてもよい。この場合、ヘッド部は、凹部に対応するテーパ形状を有していてもよい。ヘッド部をテーパ状に形成することで、ヘッド部の周縁部の厚みが薄くなるため、ヘッド部が下降位置に位置したときに、ステージの上面とヘッド部の上面との間に段差を生じさせにくくすることができる。したがって、減圧乾燥処理の均一性をさらに向上させることができる。 The recess may have a tapered shape that increases in diameter toward the upper surface of the stage. In this case, the head portion may have a tapered shape corresponding to the concave portion. By forming the head portion in a tapered shape, the thickness of the peripheral portion of the head portion becomes thin, so that when the head portion is positioned in the descending position, a step is generated between the upper surface of the stage and the upper surface of the head portion. It can be made difficult. Therefore, the uniformity of the vacuum drying process can be further improved.

リフトピンは、上部連結機構を備えていてもよい。上部連結機構は、ヘッド部とロッド部とを、ヘッド部に対してロッド部を鉛直方向に沿って相対的に移動可能に連結する。これにより、ヘッド部がステージに当接するまでリフトピンを下降させることに伴うリフトピンの損傷を抑制することができる。 The lift pin may include an upper connecting mechanism. The upper connecting mechanism connects the head portion and the rod portion so as to be relatively movable along the vertical direction with respect to the head portion. As a result, damage to the lift pin due to lowering the lift pin until the head portion abuts on the stage can be suppressed.

リフトピンは、昇降機構と、下部連結機構とを備えていてもよい。昇降機構は、ヘッド部およびロッド部を昇降させる。下部連結機構は、ロッド部と昇降機構とを、ロッド部に対して昇降機構を鉛直方向に沿って相対的に移動可能に連結する。これにより、ヘッド部がステージに当接するまでリフトピンを下降させることに伴うリフトピンの損傷を抑制することができる。 The lift pin may include an elevating mechanism and a lower connecting mechanism. The elevating mechanism raises and lowers the head portion and the rod portion. The lower connecting mechanism connects the rod portion and the elevating mechanism so as to be relatively movable along the vertical direction with respect to the rod portion. As a result, damage to the lift pin due to lowering the lift pin until the head portion abuts on the stage can be suppressed.

実施形態に係る減圧乾燥装置は、ステージの上面から突出し、減圧乾燥処理時において基板を支持する複数の支持部材を備えていてもよい。複数の支持部材によって基板を支持した状態で減圧乾燥処理を行うことで、減圧乾燥処理後に複数のリフトピンを用いて基板を上昇させる際に基板の損傷を抑制することができる。 The vacuum drying device according to the embodiment may include a plurality of support members that protrude from the upper surface of the stage and support the substrate during the vacuum drying process. By performing the vacuum drying treatment in a state where the substrate is supported by a plurality of support members, damage to the substrate can be suppressed when the substrate is raised by using a plurality of lift pins after the vacuum drying treatment.

今回開示された実施形態は全ての点で例示であって制限的なものではないと考えられるべきである。実に、上記した実施形態は多様な形態で具現され得る。また、上記の実施形態は、添付の特許請求の範囲及びその趣旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。 It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. Indeed, the above embodiments can be embodied in a variety of forms. Further, the above-described embodiment may be omitted, replaced or changed in various forms without departing from the scope of the appended claims and the purpose thereof.

１ ：減圧乾燥装置
２ ：搬送装置
３ ：ロードロック装置
１１ ：チャンバ
１２ ：ステージ
１３ ：リフトピン
１４ ：支持部材
１００ ：基板処理システム
１１１ ：側壁
１１２ ：搬入出口
１１３ ：底壁
１１４ ：排気口
１１５ ：排気装置
１２１ ：挿通孔
１２２ ：凹部
１２５ ：上面
１３１ ：ヘッド部
１３１ａ ：上面
１３２ ：ロッド部
１３３ ：上部連結機構
１３４ ：昇降機構
１３５ ：下部連結機構
Ｓ ：基板 1: Decompression drying device 2: Conveyor device 3: Load lock device 11: Chamber 12: Stage 13: Lift pin 14: Support member 100: Substrate processing system 111: Side wall 112: Carry-in outlet 113: Bottom wall 114: Exhaust port 115: Exhaust Device 121: Insertion hole 122: Recessed 125: Upper surface 131: Head portion 131a: Upper surface 132: Rod portion 133: Upper connecting mechanism 134: Elevating mechanism 135: Lower connecting mechanism S: Substrate

Claims (8)

基板上の液体を減圧状態で乾燥させる減圧乾燥処理を行う減圧乾燥装置であって、
前記基板を収容するチャンバと、
前記基板の下面に接触するヘッド部および前記ヘッド部に接続されるロッド部を有し、前記基板の受け渡しを行う際の上昇位置と前記減圧乾燥処理を行う際の下降位置との間で昇降可能な複数のリフトピンと、
前記ロッド部が挿通される挿通孔を複数有するステージと
を備え、
前記ヘッド部は、上面の少なくとも一部に、前記下降位置において前記ステージの上面と面一となる平坦面を有する、減圧乾燥装置。 A vacuum drying device that performs a vacuum drying process that dries the liquid on the substrate under reduced pressure.
A chamber for accommodating the substrate and
It has a head part that contacts the lower surface of the substrate and a rod part that is connected to the head part, and can move up and down between the ascending position when the substrate is delivered and the descending position when the vacuum drying process is performed. With multiple lift pins
A stage having a plurality of insertion holes through which the rod portion is inserted is provided.
The head portion is a vacuum drying device having a flat surface flush with the upper surface of the stage at the lowering position on at least a part of the upper surface. 前記ヘッド部は、前記下降位置において前記挿通孔を塞ぐ、請求項１に記載の減圧乾燥装置。 The vacuum drying device according to claim 1, wherein the head portion closes the insertion hole at the descending position. 前記ステージは、前記挿通孔の上端部に前記挿通孔よりも大径の凹部を有し、
前記ヘッド部は、前記挿通孔よりも大径であり、前記下降位置において前記凹部に収まる、請求項２に記載の減圧乾燥装置。 The stage has a recess at the upper end of the insertion hole having a diameter larger than that of the insertion hole.
The vacuum drying device according to claim 2, wherein the head portion has a diameter larger than that of the insertion hole and fits in the recess in the descending position. 前記凹部は、前記ステージの上面に向かって拡径するテーパ形状を有し、
前記ヘッド部は、前記凹部に対応するテーパ形状を有する、請求項３に記載の減圧乾燥装置。 The recess has a tapered shape that increases in diameter toward the upper surface of the stage.
The vacuum drying device according to claim 3, wherein the head portion has a tapered shape corresponding to the concave portion. 前記リフトピンは、
前記ヘッド部と前記ロッド部とを、前記ヘッド部に対して前記ロッド部を鉛直方向に沿って相対的に移動可能に連結する上部連結機構を備える、請求項３または４に記載の減圧乾燥装置。 The lift pin
The vacuum drying apparatus according to claim 3 or 4, further comprising an upper connecting mechanism for connecting the head portion and the rod portion so as to be relatively movable along the vertical direction with respect to the head portion. .. 前記リフトピンは、
前記ヘッド部および前記ロッド部を昇降させる昇降機構と、
前記ロッド部と前記昇降機構とを、前記ロッド部に対して前記昇降機構を鉛直方向に沿って相対的に移動可能に連結する下部連結機構と
を備える、請求項３〜５のいずれか一つに記載の減圧乾燥装置。 The lift pin
An elevating mechanism for elevating and lowering the head portion and the rod portion,
Any one of claims 3 to 5, further comprising a lower connecting mechanism for connecting the rod portion and the elevating mechanism to the rod portion so as to be relatively movable along the vertical direction. The vacuum drying device according to. 前記ステージの上面から突出し、前記減圧乾燥処理時において前記基板を支持する複数の支持部材
を備える、請求項１〜６のいずれか一つに記載の減圧乾燥装置。 The vacuum drying apparatus according to any one of claims 1 to 6, further comprising a plurality of support members that project from the upper surface of the stage and support the substrate during the vacuum drying process. 基板上の液体を減圧状態で乾燥させる減圧乾燥処理を行う減圧乾燥方法であって、
ステージに形成された挿通孔に挿通されたロッド部と、前記ロッド部に接続され、前記基板の下面に接触するヘッド部とを有する昇降可能な複数のリフトピンを用いて前記基板を受け取る工程と、
前記ヘッド部の上面の少なくとも一部に設けられた平坦面が前記ステージの上面と面一となる下降位置に前記複数のリフトピンを下降させる工程と、
前記下降させる工程の後、前記減圧乾燥処理を行う減圧乾燥工程と
を含む、減圧乾燥方法。 It is a vacuum drying method that performs a vacuum drying process that dries the liquid on the substrate under reduced pressure.
A step of receiving the substrate by using a plurality of lift pins that can be raised and lowered having a rod portion inserted into an insertion hole formed in the stage and a head portion connected to the rod portion and in contact with the lower surface of the substrate.
A step of lowering the plurality of lift pins to a lowering position where a flat surface provided on at least a part of the upper surface of the head portion is flush with the upper surface of the stage.
A vacuum drying method including a vacuum drying step of performing the vacuum drying treatment after the lowering step.
JP2019227773A 2019-12-17 2019-12-17 Vacuum dryer and vacuum drying method Pending JP2021096961A (en)

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Publication number Priority date Publication date Assignee Title
KR20240021103A (en) * 2022-08-09 2024-02-16 가부시키가이샤 스크린 홀딩스 Reduced pressure drying apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023137546A (en) * 2022-03-18 2023-09-29 東京エレクトロン株式会社 Substrate mounting table, substrate processing device, and substrate processing method
US20240038575A1 (en) * 2022-07-27 2024-02-01 Applied Materials, Inc. Thickness uniformity improvement kit for thermally sensitive epitaxial processing
CN116093012A (en) * 2023-02-13 2023-05-09 东莞触点智能装备有限公司 A multi-degree-of-freedom jacking structure, separation method and crystal bonding equipment
JP7649340B2 (en) * 2023-03-20 2025-03-19 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus, substrate processing system, and method for rearranging support pins

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100732A (en) * 2001-09-26 2003-04-04 Nec Yamagata Ltd Precoating method in plasma cvd system
JP3177614U (en) * 2012-05-31 2012-08-09 東京エレクトロン株式会社 Vacuum dryer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3989384B2 (en) * 2003-02-07 2007-10-10 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2007073833A (en) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd Reduced pressure drying apparatus and substrate drying method
JP5089288B2 (en) * 2007-01-26 2012-12-05 大日本スクリーン製造株式会社 Vacuum dryer
JP4850811B2 (en) * 2007-11-06 2012-01-11 東京エレクトロン株式会社 Mounting table, processing apparatus and processing system
JP6476215B2 (en) 2017-01-12 2019-02-27 東京エレクトロン株式会社 Vacuum drying apparatus, vacuum drying method and baking processing system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100732A (en) * 2001-09-26 2003-04-04 Nec Yamagata Ltd Precoating method in plasma cvd system
JP3177614U (en) * 2012-05-31 2012-08-09 東京エレクトロン株式会社 Vacuum dryer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240021103A (en) * 2022-08-09 2024-02-16 가부시키가이샤 스크린 홀딩스 Reduced pressure drying apparatus
JP7541554B2 (en) 2022-08-09 2024-08-28 株式会社Ｓｃｒｅｅｎホールディングス Reduced pressure drying device
KR102764687B1 (en) 2022-08-09 2025-02-07 가부시키가이샤 스크린 홀딩스 Reduced pressure drying apparatus

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