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JP2021088114A - Manufacturing method for bonded body of metal base material and resin material - Google Patents

Manufacturing method for bonded body of metal base material and resin material Download PDF

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JP2021088114A
JP2021088114A JP2019219610A JP2019219610A JP2021088114A JP 2021088114 A JP2021088114 A JP 2021088114A JP 2019219610 A JP2019219610 A JP 2019219610A JP 2019219610 A JP2019219610 A JP 2019219610A JP 2021088114 A JP2021088114 A JP 2021088114A
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resin material
film
metal
bonded body
resin
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JP7389336B2 (en
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豊 薬師神
Yutaka Yakushijin
豊 薬師神
進之助 西島
Shinnosuke Nishijima
進之助 西島
教昌 三浦
Norimasa Miura
教昌 三浦
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Nippon Steel Corp
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Nippon Steel Corp
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Abstract

【課題】加圧状態で行う複数の工程を有する場合であっても、効率よく製造可能な金属素形材と樹脂材との接合体の製造方法を提供する。【解決手段】金属素形材と樹脂材との接合体の製造方法は、金属素形材1と樹脂材2とが接合された接合体10を製造する方法であって、前記金属素形材1と前記樹脂材2とを積層して未接合状態の積層体10Aを作製する積層工程と、前記積層体10Aを高融点フィルム4の内部に配置するフィルム内配置工程と、前記高融点フィルム4の内部を真空引きすることで、前記積層体10Aを加圧する真空引き工程と、前記積層体10Aを接合して接合体10を作製する接合工程と、前記接合体10から前記高融点フィルム4を除去するフィルム除去工程と、を備える。【選択図】図1PROBLEM TO BE SOLVED: To provide a method for producing a bonded body of a metal element and a resin material, which can be efficiently produced even when there are a plurality of steps performed in a pressurized state. SOLUTION: A method for manufacturing a joint body of a metal base material and a resin material is a method of manufacturing a joint body 10 in which a metal base material 1 and a resin material 2 are joined, and the metal shape material. A laminating step of laminating 1 and the resin material 2 to produce a laminated body 10A in an unbonded state, an in-film placement step of arranging the laminated body 10A inside the high melting point film 4, and the high melting point film 4 A vacuuming step of pressurizing the laminated body 10A by vacuuming the inside of the laminated body 10A, a joining step of joining the laminated body 10A to prepare a bonded body 10, and a refractory film 4 from the bonded body 10 It comprises a film removing step of removing. [Selection diagram] Fig. 1

Description

本発明は、金属素形材と樹脂材との接合体の製造方法に関する。 The present invention relates to a method for producing a bonded body of a metal shape material and a resin material.

金属素形材は、自動車をはじめとする多種多様な工業製品の製造に用いられている。金属素形材に熱可塑性樹脂組成物の成形体である樹脂材が接合した接合体は、金属のみからなる部品よりも軽量であり、且つ、樹脂のみからなる部品よりも強度が高い。そのため、当該接合体は、携帯電話機やパーソナルコンピューター等の電子機器等にも使用されている。また、建築資材として外壁等にも用いられている(特許文献1参照)。 Metallic materials are used in the manufacture of a wide variety of industrial products such as automobiles. A bonded body in which a resin material, which is a molded body of a thermoplastic resin composition, is bonded to a metal shape material is lighter than a component made of only metal and has higher strength than a part made of only resin. Therefore, the joint is also used in electronic devices such as mobile phones and personal computers. It is also used as a building material for outer walls and the like (see Patent Document 1).

特開2017−114111号公報JP-A-2017-114111

しかし、上記従来技術は、加熱板で加熱した鋼板で樹脂を挟みこんで加熱及び加圧を行う。その後、一旦除荷され、別の冷却板で加圧及び冷却を行う。このため、接合工程で一旦除荷される時間があり、除荷によって加熱された鋼板が反り、接合部のはく離が生じて未接合となる可能性がある。また、加熱時と冷却時とで2台以上のプレス機構が必要である。
一方、一般的な加熱プレス装置では、加熱と冷却を同一装置で行うものがある。このような装置は、加熱された装置を冷却する時間がかかる。さらに、冷却後、再度装置を加熱する時間がかかるので生産性が悪い。
本発明は、加圧状態で行う複数の工程を有する場合であっても、効率よく製造可能な金属素形材と樹脂材との接合体の製造方法を提供することを目的とする。
However, in the above-mentioned conventional technique, the resin is sandwiched between the steel plates heated by the heating plate to heat and pressurize. After that, the load is temporarily removed, and pressurization and cooling are performed with another cooling plate. For this reason, there is a time when the steel sheet is once unloaded in the joining process, and the steel sheet heated by the unloading may warp, causing peeling of the joint portion and unjoining. In addition, two or more press mechanisms are required for heating and cooling.
On the other hand, in a general heating press device, there is one in which heating and cooling are performed by the same device. Such a device takes time to cool the heated device. Further, after cooling, it takes time to heat the device again, resulting in poor productivity.
An object of the present invention is to provide a method for producing a bonded body of a metal element and a resin material, which can be efficiently produced even when there are a plurality of steps performed in a pressurized state.

上記課題を解決するために、本発明は、金属素形材と樹脂材とが接合された接合体を製造する方法であって、前記金属素形材と前記樹脂材とを積層して未接合状態の積層体を作製する積層工程と、前記積層体を高融点フィルムの内部に配置するフィルム内配置工程と、前記高融点フィルムの内部を真空引きすることで、前記積層体を加圧する真空引き工程と、前記積層体を接合して接合体を作製する接合工程と、前記接合体から前記高融点フィルムを除去するフィルム除去工程と、を備える、金属素形材と樹脂材との接合体の製造方法を提供する。 In order to solve the above problems, the present invention is a method for producing a bonded body in which a metal base material and a resin material are bonded, and the metal base material and the resin material are laminated and unbonded. A laminating step of producing a laminated body in a state, an in-film placement step of arranging the laminated body inside a refractory film, and a vacuum drawing for pressurizing the laminated body by vacuuming the inside of the refractory film. A joint of a metal body and a resin material, comprising a step, a joining step of joining the laminated bodies to prepare a joined body, and a film removing step of removing the refractory film from the joined body. Provide a manufacturing method.

前記金属素形材は前記樹脂材と接合される面に有機樹脂層を有し、前記接合工程は、加熱工程を備え、前記加熱工程において前記有機樹脂層を溶融することで前記金属素形材と前記樹脂材とを熱溶着させることが好ましい。 The metal base material has an organic resin layer on the surface to be joined to the resin material, the joining step includes a heating step, and the metal base material is formed by melting the organic resin layer in the heating step. And the resin material are preferably heat-welded.

前記接合工程は、前記加熱工程の後に冷却工程を備えることが好ましい。 The joining step preferably includes a cooling step after the heating step.

加圧状態で行う複数の工程を有する場合であっても、効率よく製造可能な金属素形材と樹脂材との接合体の製造方法を提供することができる。 Even when there are a plurality of steps performed in a pressurized state, it is possible to provide a method for producing a bonded body of a metal element and a resin material that can be efficiently produced.

金属素形材と樹脂材との接合体の製造方法を説明する図である。It is a figure explaining the manufacturing method of the joint body of a metal element shape material and a resin material.

以下、本発明の実施形態に係る、金属素形材1と樹脂材2との接合体10の製造方法について説明する。実施形態に係る製造方法は、表面に有機樹脂層3が設けられた金属素形材1と樹脂材2とを重ねて、金属素形材1における有機樹脂層3が設けられた表面と樹脂材2の表面とが対向して接合された接合体10を作製するものである。
なお、金属素形材1と樹脂材2とが接合しているとは、両者が密着して、容易に剥離しない状態、例えば、樹脂材2を下向きにして接合体10を持ち上げても、樹脂材2が自重で剥離することがないことを意味する。
Hereinafter, a method for manufacturing the bonded body 10 of the metal element 1 and the resin material 2 according to the embodiment of the present invention will be described. In the manufacturing method according to the embodiment, the metal base material 1 provided with the organic resin layer 3 on the surface and the resin material 2 are overlapped with each other, and the surface and the resin material provided with the organic resin layer 3 in the metal base material 1 are overlapped. A bonded body 10 is produced in which the surfaces of 2 are joined to face each other.
It should be noted that the fact that the metal element 1 and the resin material 2 are joined means that they are in close contact with each other and do not easily peel off, for example, even if the resin material 2 is turned downward and the bonded body 10 is lifted, the resin is used. This means that the material 2 does not peel off due to its own weight.

図1は、実施形態に係る、金属素形材1と樹脂材2との接合体10の製造方法を説明する図である。 FIG. 1 is a diagram illustrating a method of manufacturing a bonded body 10 of a metal element 1 and a resin material 2 according to an embodiment.

(積層工程)
図1(a)は、金属素形材1と樹脂材2との接合体10の製造方法における積層工程を説明する図である。積層工程において、2枚の金属素形材1の間に樹脂材2を配置して、位置合わせを行い、未接合状態の積層体10Aを作製する。
(Laminating process)
FIG. 1A is a diagram illustrating a laminating step in a method for manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the laminating step, the resin material 2 is arranged between the two metal body members 1 and aligned to prepare a laminated body 10A in an unbonded state.

(金属素形材1)
金属素形材1は、少なくとも樹脂材2と接する表面に有機樹脂層3を有する。金属素形材1を構成する金属の種類は、特に限定されない。例えば、上記金属の種類は、鉄であってもよいし、鉄以外の金属であってもよいし、合金であってもよい。金属素形材1の例には、冷延鋼板、亜鉛めっき鋼板、Zn−Al合金めっき鋼板、Zn−Al−Mg合金めっき鋼板、アルミニウムめっき鋼板、ステンレス鋼板(オーステナイト系、マルテンサイト系、フェライト系、フェライト・マルテンサイト二相系を含む)、アルミニウム板、アルミニウム合金板、銅板等の金属素形材1や、そのプレス加工品、あるいは、アルミダイカスト、亜鉛ダイカスト等の鋳造・鍛造物や、切削加工、粉末冶金等により成形された各種金属部材等が含まれる。金属素形材1は、必要に応じて、脱脂、酸洗等の公知の塗装前処理が施されていてもよい。
(Metallic material 1)
The metal element 1 has an organic resin layer 3 at least on the surface in contact with the resin material 2. The type of metal constituting the metal element 1 is not particularly limited. For example, the type of the metal may be iron, a metal other than iron, or an alloy. Examples of the metal profile 1 include cold-rolled steel sheets, galvanized steel sheets, Zn-Al alloy-plated steel sheets, Zn-Al-Mg alloy-plated steel sheets, aluminum-plated steel sheets, and stainless steel sheets (austenite-based, martensite-based, ferrite-based). , Ferrite / martensite two-phase system), aluminum plate, aluminum alloy plate, copper plate, etc., and its pressed products, cast / forged products such as aluminum die cast, galvanized die cast, and cutting. Various metal members formed by processing, powder metallurgy, etc. are included. If necessary, the metal shape material 1 may be subjected to known pre-painting treatments such as degreasing and pickling.

(有機樹脂層3)
有機樹脂層3は、金属素形材1と樹脂材2との密着性を向上させる。有機樹脂層3の樹脂として、ポリプロピレン等のオレフィン系樹脂、ポリウレタン、アクリル系樹脂、アクリル・スチレン系樹脂、酢酸ビニル、EVA(エチレンー酢酸ビニル共重合)、エステル系樹脂を使用することができる。
(Organic resin layer 3)
The organic resin layer 3 improves the adhesion between the metal element 1 and the resin material 2. As the resin of the organic resin layer 3, an olefin resin such as polypropylene, a polyurethane, an acrylic resin, an acrylic / styrene resin, vinyl acetate, EVA (ethylene-vinyl acetate copolymer), and an ester resin can be used.

(樹脂材2)
樹脂材2は、特に限定されない。樹脂材2は、樹脂からなる成形体や部材を含む。樹脂としては、ポリエチレン樹脂、ポリプロピレン樹脂、ポリブチレンテレフタレート樹脂、ポリアミド樹脂、ポリフェニレンサルファイド樹脂、アクリロニトリル−ブタジエン−スチレン樹脂、ポリ塩化ビニル樹脂、ポリカーボネート樹脂、等を含むものに適用できる。
(Resin material 2)
The resin material 2 is not particularly limited. The resin material 2 includes a molded body and a member made of resin. The resin can be applied to those containing polyethylene resin, polypropylene resin, polybutylene terephthalate resin, polyamide resin, polyphenylene sulfide resin, acrylonitrile-butadiene-styrene resin, polyvinyl chloride resin, polycarbonate resin and the like.

(フィルム内配置工程)
図1(b)は、金属素形材1と樹脂材2との接合体10の製造方法におけるフィルム内配置工程を説明する図である。フィルム内配置工程において、金属素形材1の間に樹脂材2を配置して、位置合わせが行われた積層体10Aを、袋状の高融点フィルム4内に配置する。配置方法は、袋状の高融点フィルム4を用意して、その中に積層体10Aを入れてもよいし、積層体10Aの上下にそれぞれシート状の高融点フィルム4を配置し、積層体10Aを囲むように上下の高融点フィルム4を溶着させることにより、積層体10Aの外周を高融点フィルム4で覆ってもよい。
なお、高融点フィルム4とは、金属素形材1の有機樹脂層3と樹脂材2との溶着温度(有機樹脂層3を構成する樹脂の融点)よりも融点の高い材料により構成されたフィルムを示す。高融点フィルム4は、例えばバギングフィルムである。
(Placement process in film)
FIG. 1B is a diagram illustrating an in-film arrangement step in a method for manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the in-film arrangement step, the resin material 2 is arranged between the metal element 1 and the aligned laminate 10A is arranged in the bag-shaped high melting point film 4. As a method of arranging, a bag-shaped high melting point film 4 may be prepared and the laminated body 10A may be put therein, or sheet-shaped high melting point films 4 may be arranged above and below the laminated body 10A, respectively, and the laminated body 10A may be placed. The outer periphery of the laminated body 10A may be covered with the high melting point film 4 by welding the upper and lower melting point films 4 so as to surround the laminated body 10A.
The high melting point film 4 is a film made of a material having a melting point higher than the welding temperature (melting point of the resin constituting the organic resin layer 3) between the organic resin layer 3 of the metal forming material 1 and the resin material 2. Is shown. The melting point film 4 is, for example, a bagging film.

(真空引き工程)
図1(c)は、金属素形材1と樹脂材2との接合体10の製造方法における真空引き工程を説明する図である。真空引き工程において、真空引きにより高融点フィルム4内を真空引きする。これにより、金属素形材1と樹脂材2とが加圧状態で保持され、位置合わせされた金属素形材1と樹脂材2とが、以後の工程においてずれることがない。
(Vacuum process)
FIG. 1C is a diagram illustrating a vacuuming step in a method for manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the vacuuming step, the inside of the refractory film 4 is evacuated by vacuuming. As a result, the metal element 1 and the resin material 2 are held in a pressurized state, and the aligned metal element 1 and the resin material 2 do not shift in the subsequent steps.

(接合工程)
接合工程は加熱工程と、搬送工程と、冷却工程とを含む。
(加熱工程)
図1(d)は、金属素形材1と樹脂材2との接合体10の製造方法における加熱工程を説明する図である。加熱工程において、高融点フィルム4内に保持された積層体10Aを、加熱プレート11上に配置し、金属素形材1を加熱する。加熱によって、金属素形材1における樹脂材2との接合面に設けられた有機樹脂層3と、樹脂材2とが溶融する。なお、この際、高融点フィルム4は溶融しない。
(Joining process)
The joining step includes a heating step, a transporting step, and a cooling step.
(Heating process)
FIG. 1D is a diagram illustrating a heating process in a method for manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the heating step, the laminate 10A held in the refractory film 4 is placed on the heating plate 11 to heat the metal profile material 1. By heating, the organic resin layer 3 provided on the joint surface of the metal shape material 1 with the resin material 2 and the resin material 2 are melted. At this time, the high melting point film 4 does not melt.

(搬送工程)
図1(e)は、金属素形材1と樹脂材2との接合体10の製造方法における搬送工程を説明する図である。搬送工程において、加熱プレート11から冷却プレート12へと積層体10Aを搬送する。この際、有機樹脂層3はまだ溶融したままであるが、金属素形材1と樹脂材2とは位置合わせされた状態で加圧されているので、位置がずれることがない。
(Transport process)
FIG. 1 (e) is a diagram illustrating a transfer process in a method for manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the transfer step, the laminate 10A is transferred from the heating plate 11 to the cooling plate 12. At this time, the organic resin layer 3 is still melted, but the metal element 1 and the resin material 2 are pressurized in a aligned state, so that the positions do not shift.

(冷却工程)
図1(f)は、金属素形材1と樹脂材2との接合体10の製造方法における冷却工程を説明する図である。冷却工程において、積層体10Aを冷却プレート12上に配置し、冷却する。冷却によって、溶融した有機樹脂層3と樹脂材2とが硬化し、金属素形材1と樹脂材2と接合された接合体10が製造される。
(Cooling process)
FIG. 1F is a diagram illustrating a cooling step in a method of manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the cooling step, the laminate 10A is placed on the cooling plate 12 and cooled. By cooling, the molten organic resin layer 3 and the resin material 2 are cured, and a bonded body 10 in which the metal element 1 and the resin material 2 are joined is manufactured.

(フィルム除去工程)
図1(g)は、金属素形材1と樹脂材2との接合体10の製造方法におけるフィルム除去工程を説明する図である。フィルム除去工程において、接合体10の外周から高融点フィルム4を除去する。
以上のような実施形態に係る、金属素形材1と樹脂材2との接合体10の製造方法により、接合体10が製造される。
(Film removal process)
FIG. 1 (g) is a diagram illustrating a film removing step in a method for manufacturing a bonded body 10 of a metal element 1 and a resin material 2. In the film removing step, the refractory film 4 is removed from the outer circumference of the bonded body 10.
The joint body 10 is manufactured by the method for manufacturing the joint body 10 of the metal element 1 and the resin material 2 according to the above embodiment.

以上、実施形態によると、接合工程において、加熱後に無負荷の状況にならないので、金属素形材1及び樹脂材2の反りによる接合不良が生じることがない。
実施形態では、有機樹脂層3を備える金属素形材1を用いるので、樹脂材2との接合に接着剤を用いる必要がない。このため、接着剤の塗布及び乾燥の時間が不要であり、短時間で接合体10を製造することができる。
一般的な熱ラミネート処理ラインによって接合体10を製造可能であるため特段の設備を製造ラインに組み込む必要がない。
また、実施形態の製造方法によると、加熱工程、搬送工程、冷却工程において加圧された状態が継続されるので、それぞれの工程での位置合わせが不要である。
以上、実施形態の製造方法によると、より短時間、且つより低コストで、接合体10を製造することができる。
As described above, according to the embodiment, in the joining step, no load is generated after heating, so that the joining failure due to the warp of the metal element 1 and the resin material 2 does not occur.
In the embodiment, since the metal shape material 1 provided with the organic resin layer 3 is used, it is not necessary to use an adhesive for joining with the resin material 2. Therefore, the time for applying the adhesive and drying is not required, and the bonded body 10 can be manufactured in a short time.
Since the bonded body 10 can be manufactured by a general heat laminating processing line, it is not necessary to incorporate special equipment into the manufacturing line.
Further, according to the manufacturing method of the embodiment, the pressurized state is continued in the heating step, the transport step, and the cooling step, so that the alignment in each step is unnecessary.
As described above, according to the manufacturing method of the embodiment, the bonded body 10 can be manufactured in a shorter time and at a lower cost.

1 金属素形材
2 樹脂材
3 有機樹脂層
4 高融点フィルム
10 接合体
10A 積層体
1 Metal element 2 Resin material 3 Organic resin layer 4 Melting point film 10 Bonded body 10A Laminated body

Claims (3)

金属素形材と樹脂材とが接合された接合体を製造する方法であって、
前記金属素形材と前記樹脂材とを積層して未接合状態の積層体を作製する積層工程と、
前記積層体を高融点フィルムの内部に配置するフィルム内配置工程と、
前記高融点フィルムの内部を真空引きすることで、前記積層体を加圧する真空引き工程と、
前記積層体を接合して接合体を作製する接合工程と、
前記接合体から前記高融点フィルムを除去するフィルム除去工程と、
を備える、金属素形材と樹脂材との接合体の製造方法。
It is a method of manufacturing a bonded body in which a metal element and a resin material are bonded.
A laminating step of laminating the metal element and the resin material to prepare a laminated body in an unbonded state, and
In-film placement step of arranging the laminate inside the high melting point film,
A vacuuming step of pressurizing the laminate by vacuuming the inside of the refractory film.
A joining step of joining the laminated bodies to prepare a joined body,
A film removing step of removing the refractory film from the bonded body,
A method for manufacturing a bonded body of a metal base material and a resin material.
前記金属素形材は前記樹脂材と接合される面に有機樹脂層を有し、
前記接合工程は、加熱工程を備え、
前記加熱工程において前記有機樹脂層を溶融することで前記金属素形材と前記樹脂材とを熱溶着させる、
請求項1に記載の金属素形材と樹脂材との接合体の製造方法。
The metal shape material has an organic resin layer on the surface to be joined to the resin material.
The joining step includes a heating step.
By melting the organic resin layer in the heating step, the metal body material and the resin material are heat-welded.
The method for producing a bonded body of a metal body material and a resin material according to claim 1.
前記接合工程は、前記加熱工程の後に冷却工程を備える、
請求項2に記載の金属素形材と樹脂材との接合体の製造方法。
The joining step comprises a cooling step after the heating step.
The method for producing a bonded body of a metal element and a resin material according to claim 2.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006044264A (en) * 2004-07-08 2006-02-16 Toray Ind Inc Decorative molded article and its production method
JP2008006730A (en) * 2006-06-29 2008-01-17 Kanto Auto Works Ltd Bonding method of material by autoclave process and bonding structure
JP2014159125A (en) * 2013-02-20 2014-09-04 Nisshin Steel Co Ltd Composite and method of manufacturing the same
CN208495627U (en) * 2018-07-11 2019-02-15 株洲电力机车广缘科技有限责任公司 A kind of vacuum bag pressing molding device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006044264A (en) * 2004-07-08 2006-02-16 Toray Ind Inc Decorative molded article and its production method
JP2008006730A (en) * 2006-06-29 2008-01-17 Kanto Auto Works Ltd Bonding method of material by autoclave process and bonding structure
JP2014159125A (en) * 2013-02-20 2014-09-04 Nisshin Steel Co Ltd Composite and method of manufacturing the same
CN208495627U (en) * 2018-07-11 2019-02-15 株洲电力机车广缘科技有限责任公司 A kind of vacuum bag pressing molding device

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