JP2021067558A - Inspection system, method for inspection, and structure - Google Patents

Abstract

To provide an inspection system that can inspect a structure while maintaining a design property.SOLUTION: An inspection system 100 includes an imaging device 3 and an operation processor 50. The imaging device 3 performs an infrared measurement of a structure 1 having a first member and a second member, the second member being located in a surface of the first member so that the surface is partially exposed, being in the same color as that of the first member or being colorless and transparent, and having a thermophysical property value which relates a deformation and a temperature change caused by the deformation to each other and which also is different from that of the first member. The operation processor 50 has an image analysis unit for performing an image analysis on the infrared image obtained by the imaging device 3 according to a digital image correlation method.SELECTED DRAWING: Figure 1

Description

The present invention relates to inspection systems, inspection methods and structures.

For example, in order to maintain the operating rate in a structure such as an industrial machine, it is preferable to identify the damaged part in the structure at an early stage. By early identification of the damaged part, it can be repaired before the damage becomes large, and it is possible to suppress a significant decrease in the operating rate due to a large repair caused by a large damage. Damage to a structure is caused, for example, by stress concentration in the structure. The technique of Patent Document 1 is known in relation to the stress measurement technique for structures.

In Patent Document 1, a first measurement step of measuring time-series infrared intensity distribution data as measurement data regarding the displacement distribution of an object to be measured, which is previously subjected to a spot pattern having a different radiation rate depending on the surface position, using infrared thermography. The calculation step of applying the digital image correlation method to the frame constituting the acquired time-series infrared intensity distribution data to obtain the displacement amount data regarding the displacement distribution of the object to be measured with respect to the load load history, and the thermal elasticity. The second measurement step of measuring the time-series infrared intensity distribution data as stress data for stress measurement using infrared thermography, and the distribution data of the time-series infrared intensity distribution data acquired in the second measurement step for each pixel. Is described as a position correction method in infrared thermoelastic stress measurement, which includes a position correction step of converting the displacement into distribution data for each coordinate corrected based on the displacement amount data regarding the displacement distribution. ..

JP-A-2007-205875 (see claim 1 in particular)

By the way, in the first measurement step described in Patent Document 1, time-series infrared intensity distribution data of the object to be measured with a speckled pattern is acquired under the same load-bearing condition in the thermoelastic stress measurement (see paragraph 0030). The speckled pattern is applied with a black or gray spray paint (see paragraph 0028). Therefore, depending on the color of the structure, the speckled pattern is conspicuous and the design of the structure is deteriorated.

An object of the present invention is to provide an inspection system, an inspection method, and a structure capable of inspecting a structure while maintaining the design.

The inspection system of the present invention is arranged on the surface of the first member and the surface of the first member so as to be partially exposed, has a color similar to that of the first member or is colorless and transparent, and is deformed and deformed. An image pickup device for measuring an infrared ray of a structure including a second member having a thermophysical property value associated with a temperature change caused by the above and having a thermophysical property value different from that of the first member, and an image pickup device obtained by the image pickup device. An arithmetic processing device including an image analysis unit that performs image analysis based on a digital image correlation method for an infrared image is provided. Other solutions will be described later in the form for carrying out the invention.

According to the present invention, it is possible to provide an inspection system, an inspection method and a structure capable of inspecting a structure while maintaining the design.

It is a schematic diagram which shows the inspection system of 1st Embodiment. It is a figure which shows the part A part of FIG. 1 enlarged, and is the schematic diagram which shows the surface of a structure. FIG. 2 is a cross-sectional view taken along the line BB of FIG. It is a schematic diagram which shows the color space of L ^* a ^* b ^{* color system.} It is a block diagram of the inspection system of 1st Embodiment. It is a schematic diagram of the infrared image about the surface of the structure before deformation. It is a schematic diagram of the infrared image about the surface of the structure after deformation. It is an infrared image obtained by an image pickup apparatus and is a schematic diagram which shows a temperature distribution. It is a schematic diagram which shows the displacement amount distribution obtained by the image analysis based on the digital image correlation method to the infrared image shown in FIG. 7. It is a flowchart which shows the inspection method of 1st Embodiment. It is a schematic diagram which shows the inspection system of 2nd Embodiment. It is a schematic diagram of the structure which concerns on 3rd Embodiment. FIG. 11 is a cross-sectional view taken along the line FF of FIG. It is a schematic diagram of the structure which concerns on 4th Embodiment. FIG. 13 is a cross-sectional view taken along the line GG of FIG. It is a schematic diagram of the structure which concerns on 5th Embodiment. FIG. 15 is a cross-sectional view taken along the line HH of FIG. It is a schematic diagram which shows the inspection system of 6th Embodiment.

Hereinafter, embodiments for carrying out the present invention (the present embodiment) will be described. However, the present invention is not limited to the following contents and the illustrated contents, and can be arbitrarily modified and implemented as long as the effects of the present invention are not significantly impaired. The present invention can be implemented by combining different embodiments. In the following description, the same members will be designated by the same reference numerals in different embodiments, and redundant description will be omitted.

FIG. 1 is a schematic view showing the inspection system 100 of the first embodiment. The inspection system 100 inspects the structure 1 by infrared measurement. Specifically, in an infrared image acquired by infrared measurement, a temperature change due to a thermoelastic effect due to deformation occurs. Therefore, the inspection system 100 inspects the displacement amount and the displacement direction (only one of them may be used) on the surface of the structure 1 due to the deformation by applying the digital image correlation method to the infrared image in which the temperature has changed. To do. However, the inspection content is not limited to this example.

The structure 1 inspected by the inspection system 100 is a power generation facility in the illustrated example, and specifically, a wind power generation facility. However, the structure 1 is not limited to the power generation facility, and may be a railroad vehicle or a construction machine. That is, the structure 1 is, for example, at least one of a power generation facility, a railroad vehicle, or a construction machine, but the structure 1 is not limited thereto.

For example, the structure 1 composed of wind power generation equipment includes a blade 20, a tower 21, a rotating shaft 22, and a nacelle 23. The blade 20 is attached to the rotating shaft 22, and the rotating shaft 22 is connected to a power generation device (not shown) in the nacelle 23. The rotation of the blade 20 drives the power generation device to generate power. The nacelle 23 is supported by the tower 21, and an imaging device 3 (described later) is installed on the upper surface of the nacelle 23. The description of the image pickup apparatus 3 will be given after the description of the structure 1. The installation location of the image pickup device 3 is not limited to the upper surface of the nacelle 23, and can be installed at any height and installation location, such as on the ground or on the tower 21. Further, for example, the image pickup device 3 may be mounted on an unmanned aerial vehicle (not shown), and the image pickup device 3 may take an image while flying the unmanned aerial vehicle in synchronization with the rotation of the blade 20.

FIG. 2 is an enlarged view showing a part of part A of FIG. 1, and is a schematic view showing the surface of the structure 1. In FIG. 2, in order to show that the structure 1 extends beyond the area shown in the drawing, the surfaces on the front side and the back side of the paper surface are cut with a curved line to show a cross-sectional perspective view. The same applies to FIGS. 11, 13, and 15 described later. Although details will be described later, the image pickup apparatus 3 images a portion of the structure 1 in which stress is likely to be concentrated (part A shown in FIG. 2).

The structure 1 includes a first member 10 and a second member 11 arranged on the surface 10a of the first member 10. The surface 10a of the first member 10 has a color corresponding to the type of the structure 1, and is, for example, white in the structure 1 exemplifying the wind power generation facility.

The details will be described later, but the inspection performed in the first embodiment will be described. The first member 10 and the second member 11 have different thermophysical property values such as a thermoelastic modulus. Therefore, when the structure 1 is deformed, the temperature change due to the deformation of the first member 10 constituting the structure 1 and the thermoelastic effect due to the deformation of the second member 11 constituting the structure 1 are caused. It is different from the temperature change. Therefore, in order to measure the difference in temperature change, for example, an infrared image of the surface 10a of the structure 1 using infrared thermography is acquired. Then, based on the digital image correlation method to the infrared image showing the difference in temperature change, the displacement amount and the displacement direction of an arbitrary point on the surface 10a of the structure 1 due to the deformation can be measured.

The first member 10 is, for example, a base material that supports the second member 11, and is made of, for example, a polymer resin material. Examples of the polymer resin material include polyurethane resins, acrylic resins, fluorine resins, olefin resins, polyester resins, polyamide resins, epoxy resins, phenol resins, vinyl chloride resins, and polycarbonate resins. In addition to epoxy resins, copolymers and mixtures of these resins can be mentioned.

The arrangement of the second member 11 on the first member 10 will be described with reference to FIG.

FIG. 3 is a cross-sectional view taken along the line BB of FIG. The second member 11 is arranged on the surface 10a so that the surface 10a of the first member 10 is partially exposed. In the illustrated example, the second member 11 is arranged in a scattered manner, specifically in a mosaic pattern. By arranging the second member 11 in a scattered manner, the second member 11 can be arranged at an arbitrary position regardless of the surface shape (for example, a flat surface or a curved surface) of the first member 10.

The amount of arrangement of the second member 11 on the first member 10 is, for example, the target for evaluating the stress distribution in all the surfaces 10a of the first member 10 (the region (part A) imaged by the imaging device 3). The second member 11 can be arranged in a scattered manner so that, for example, 30% or more, preferably 40% or more, and the upper limit is, for example, 70% or less, preferably 60% or less of the surface) is exposed. It is preferable that the second member 11 is evenly arranged on all the surfaces 10a of the first member 10.

The thickness of the second member 11 is, for example, 5 mm or less, preferably 3 mm or less, and more preferably 1 mm or less. By setting the second member 11 in this thickness range, it is possible to prevent the second member 11 from appearing three-dimensionally when the structure 1 is visually recognized, and the second member 11 is less noticeable with respect to the first member 10. it can.

Returning to FIG. 2, the second member 11 has a similar color or colorless and transparent to the first member 10. However, in FIG. 2 (including the following drawings), the second member 11 is shown in a color significantly different from the color of the first member 10 in order to make it easier to grasp the arrangement of the second member 11. The similar colors are, for example, the same color for both the first member 10 and the second member 11, and a cream color in which the first member 10 is white and the second member 11 is whitish. Since the second member 11 has the same color as the first member 10, the second member 11 can be made inconspicuous. Similar colors will be described with reference to FIG.

FIG. 4 is a schematic diagram showing the color space ^{of the L *} a ^* b ^{* color system.} In the first embodiment, whether or not the color of the first member 10 and the color of the second member 11 are similar colors can be determined based on ^{, for example, the L *} a ^* b ^{* color system.} The L ^* a ^* b ^* color system was standardized by the International Commission on Illumination in 1976 and established in JIS Z8781-4: 2013. In the L ^* a ^* b ^* color system, the lightness is represented by L ^* , and the chromaticity indicating hue and saturation is represented by a ^* b ^* . The ^{larger the value of L *,} the brighter the image, and the ^{smaller the value of L *} , the darker the image. a ^* and b ^* indicate the color direction, a ^* indicates the red direction, -a ^* indicates the green direction, b ^* indicates the yellow direction, and -b ^* indicates the blue direction. In ^{each of a *} and b ^*, the larger the value, the clearer the color, and the closer to the center, the dull the color.

In FIG. 4, points C and D indicate the colors of the first member 10 and the second member 11, respectively. ΔL ^* is the difference between ^{the brightness L * of} the first member 10 and the brightness L ^* of the second member 11. .Delta.a ^*, [Delta] b ^*, respectively, the chromaticity ^a * of the first member 10, ^{b *} and chromaticity ^a second member 11 * are each the difference between ^{b *. The color difference ΔE *} ab between the first member 10 and the second member 11 can be calculated by the following formula (1).
ΔE ^* ab = {(ΔL ^* ) ² + (Δa ^* ) ² + (Δb ^* ) ² } ^1/2 ... Equation (1)

In the first embodiment, it is determined whether or not the color of the first member 10 and the color of the second member 11 are similar colors based on the value of ^{ΔE * ab.} Specifically, when ^{the value of ΔE *} ab is, for example, 0.4 or less, it is preferable to determine that the color of the first member 10 and the color of the second member 11 are similar colors. When ^{the value of ΔE *} ab is 0.4 or less, it is possible to make it difficult for a general person to notice the second member 11 when the structure 1 is visually recognized. Above all, it is more preferable that the value of ^{ΔE * ab is 0.2 or less.} When ^{the value of ΔE *} ab is 0.2 or less, it is possible to make it difficult to visually distinguish the color of the first member 10 and the color of the second member 11, and it is possible to make it difficult to notice by the second member 11.

The brightness and chromaticity of the first member 10 and the second member 11 can be determined using, for example, a color difference meter (for example, manufactured by Konica Minolta). Therefore, ΔE ^* ab can be calculated based on, for example, the brightness and chromaticity determined by the formula color difference meter. The color difference can also be calculated by, for example, a method of recording an image or a moving image on a recording device using a camera having a high resolution and performing post-processing by the image processing device.

It is not necessary to judge whether or not the colors are similar ^{to each other based on the L *} a ^* b ^* color system. For example, the Mansell color system, the XYZ color system, the L ^* c ^* h color system, and the hunter. A standardized color system such as the Lab color system may be used as a reference, or a unique color system may be used.

Returning to FIG. 2, the second member 11 may be colorless and transparent. By making it colorless and transparent, the color of the first member 10 can be transmitted from the second member 11 and the second member 11 can be made inconspicuous. As for the degree of transparency, the second member 11 is preferably as close to transparent as possible, and specifically, the transmittance of visible light is, for example, 70% or more, preferably 80% or more, and more preferably 90% or more.

The second member 11 has a thermophysical property value that is different from that of the first member 10 and is a thermophysical property value that associates the deformation with the temperature change caused by the deformation. Since the first member 10 and the second member 11 have different thermophysical property values, when the first member 10 and the second member 11 fixed to the first member 10 are similarly deformed, they are thermally elastic. The degree of temperature change due to the effect can be different. This makes it possible to measure the difference in temperature distribution due to the difference in thermoelasticity in the infrared image. Then, by measuring the difference in temperature distribution, even if the material properties of the first member 10 cannot be accurately grasped, the displacement amount and the displacement direction can be simultaneously measured based on the digital image correlation method.
The thermoelastic effect means that the adiabatic expansion of a solid lowers the solid temperature, and the adiabatic compression raises the solid temperature. Adiabatic expansion and compression occur due to the deformation of structure 1.

As described above, the thermophysical characteristic value is a value that associates the deformation with the temperature change caused by the deformation. Specifically, the thermophysical property value is, for example, a constant that determines the amount of change in temperature that changes due to deformation when stress is generated, and is a constant that associates stress with the amount of temperature change. The thermophysical property value is, for example, at least one of a coefficient of thermal expansion, a coefficient of thermal elasticity, or a constant pressure specific heat. By using these thermophysical property values, the distribution of stress fluctuations in the structure 1 can be evaluated based on the known physical characteristic values.

The thermophysical characteristic value is determined based on the constituent materials of the first member 10 and the second member 11. An example of the constituent materials and thermophysical characteristics is shown in Table 1 below. Table 1 shows, as an example, the stress fluctuation Δσ when the coefficient of thermal expansion is used as the thermophysical property value. In Table 1, SUS represents stainless steel and GFRP represents glass fiber reinforced resin. However, the constituent materials of the first member 10 and the second member 11 are not limited to the constituent materials in Table 1.

As described above, the deformation of the structure 1 causes adiabatic expansion or adiabatic compression. The resulting thermoelastic effect causes a temperature change in the structure 1. The temperature change ΔT1 due to the thermoelastic effect is calculated by the following equation (2).
ΔT1 = −K _m・ T ・ Δσ ・ ・ ・ Equation (2)
K _m is the thermoelastic modulus (N / mm ² ), T is the atmospheric temperature (K), and Δσ is the stress fluctuation value of the structure 1 (N / mm ² (= MPa)). The coefficient of thermal elasticity K _m can be calculated by dividing the coefficient of linear expansion α by the product of the density ρ and the constant pressure specific heat C _p.

For example, when the ambient temperature (for example, outside air temperature) T is 300 K and the temperature change ΔT1 of the structure 1 is 0.1 mK, if the constituent material is iron, for example, the thermal elastic modulus K _m is 3.45 × ^10-6 (1). Since / (N · mm ² ), the stress fluctuation Δσ ^{can be calculated as 0.97 N / mm 2. When the} same calculation is performed for the other constituent materials, the numerical values shown in Table 1 are calculated. By infrared measurement using 3, the difference in temperature distribution due to the difference in thermoelasticity between the first member 10 and the second member 11 can be measured.

As described above, the thermophysical property value of the first member 10 and the thermophysical characteristic value of the second member 11 are different values. The thermophysical property value of the first member 10 may be larger than the thermophysical characteristic value of the second member 11, and the thermophysical characteristic value of the second member 11 may be larger than the thermophysical characteristic value of the first member 10. However, it is preferable that the difference between the thermophysical property value of the first member 10 and the thermophysical characteristic value of the second member 11 is as large as possible. Specifically, for example, the thermophysical property value having a larger thermophysical characteristic value can be, for example, twice or more, preferably three times or more, more preferably five times or more, as compared with the thermophysical characteristic value having a smaller thermophysical characteristic value. For example, when the thermophysical property value of the first member 10 is larger than the thermophysical characteristic value of the second member 11, the thermophysical characteristic value of the first member 10 is, for example, twice or more the thermophysical characteristic value of the second member 11. It can be preferably 3 times or more, more preferably 5 times or more.

Explaining this point based on Table 1 above, for example, it is assumed that the constituent material of the first member 10 is a fluororesin and the constituent material of the second member 11 is a polyurethane resin. For example thermoelastic coefficient of the fluorine resin is ^{46.9 × 10 -6 (1 / (} N / mm 2)), for example thermoelastic coefficient of polyurethane resin ^{5.17 × 10 -6 (1 / (} N / mm ² )). Therefore, in this case, the thermophysical property value of the first member 10 is about 9 times the thermophysical characteristic value of the second member 11. In this case, if the stress fluctuation Δσ is 1.0 N / mm ² , the temperature fluctuation ΔT1 of the first member 10 which is a fluororesin is 14 mK, and the temperature fluctuation ΔT1 of the second member 11 which is a polyurethane resin is 15 mK.

By increasing the difference between the thermophysical property value of the first member 10 and the thermophysical characteristic value of the second member 11 (for example, within the above range), the first member 10 and the second member due to the deformation of the structure 1 The temperature difference from 11 can be increased. As a result, when the surface of the structure 1 is imaged by the imaging device 3, the difference between the high temperature portion and the low temperature portion can be clarified.

According to the structure 1 including the first member 10 and the second member 11, the second member 11 can be arranged on the first member 10 without significantly impairing the designability played by the first member 10. As a result, infrared measurement of the structure 1 can be performed while maintaining the design of the structure 1.

Returning to FIG. 1, the inspection system 100 includes an image pickup device 3 and an arithmetic processing unit 50. The image pickup apparatus 3 measures the structure 1 by infrared rays. The image pickup apparatus 3 is composed of, for example, infrared thermography capable of measuring a temperature change in a non-steady state. The thermoelastic heat generated by the deformation of the structure 1 can be measured by infrared measurement. Further, by infrared measurement, for example, an infrared image (an image showing a temperature distribution) in which a relatively high temperature portion is displayed in a dark color and a relatively low temperature portion is displayed in a light color can be obtained.

The image pickup device 3 is a single monocular camera that acquires a two-dimensional image, and is installed on the upper surface of the nacelle 23 in the illustrated example. The image pickup apparatus 3 measures the portion where stress concentration is likely to occur, specifically, the surface end portion of the blade 20 in the portion A in FIG. 1 by infrared rays. Other parts where stress concentration is likely to occur include, for example, a joint portion that may exist in the structure 1, a curved surface portion whose shape or dimension suddenly changes, a notch portion, and the like, and are not limited to the illustrated imaging location. Absent. For example, the image pickup device 3 may be used to image a bolt or a welded portion that fixes the tower to a foundation (not shown) on the ground.

The image pickup apparatus 3 acquires an infrared image of the blade 20, thereby performing infrared measurement. The acquired infrared image is transmitted to the arithmetic processing unit 50. The arithmetic processing unit 50 will be described with reference to FIG.

FIG. 5 is a block diagram of the inspection system 100 of the first embodiment. The arithmetic processing unit 50 includes an image acquisition unit 51, a binarization processing unit 52, an image analysis unit 53, a display unit 54, and a notification unit 55.

The image acquisition unit 51 acquires an infrared image obtained by the image pickup apparatus 3. The infrared image acquired by the image acquisition unit 51 is transmitted to the binarization processing unit 52. The image acquisition (that is, the imaging timing by the imaging device 3) is performed in synchronization with the rotation timing of the blade 20 so that the same portion of the blade 20 can be imaged.

The binarization processing unit 52 binarizes the infrared image obtained by the image pickup apparatus 3. The binarization processing unit 52 can clarify the difference (for example, the difference in shading) between the high temperature portion and the low temperature portion in the infrared image, and can improve the image analysis accuracy by the digital image correlation method (described later). The threshold value used for the binarization process is arbitrary. For example, when the difference between _{the maximum temperature T max} and the minimum temperature T _min is ΔT2, the threshold value is in the range of _{T max} −0.1 × ΔT2 ≦ T ≦ T _max. It is possible to convert a part of a certain temperature into a temperature of T _max and set a threshold value that erases the other part.

The image analysis unit 53 performs image analysis based on the digital image correlation method (DIC method) on the infrared image obtained by the image pickup apparatus 3. By the DIC method, the displacement amount and the displacement direction of the surface of the structure 1 can be simultaneously determined based on the brightness distribution in the infrared image by using the acquired infrared images (digital images) of the structure 1 before and after the deformation. That is, the image analysis unit 53 can determine the displacement amount and the displacement direction of the surface of the structure 1 due to the deformation of the structure 1. The determination of the displacement amount and the displacement direction based on the DIC method will be described with reference to FIGS. 6A and 6B.

FIG. 6A is a schematic view of an infrared image relating to the surface of the structure 1 before deformation. Further, FIG. 6B is a schematic view of an infrared image relating to the surface of the deformed structure 1. In FIGS. 6A and 6B, a pattern P called a speckle pattern is applied. In the first embodiment, the brightness distribution within the region (subset) R of a minute image centered on an arbitrary point Q on the image before deformation (FIG. 6A) is obtained. Then, in the image after deformation (FIG. 6B), a region S having a brightness distribution that has the best correlation with the brightness distribution of the region R before deformation is searched for. By setting the position of the center point U of the region S to the position of the point Q displaced by the deformation of the structure 1, the displacement amount and the displacement direction of the point Q can be determined at the same time.

FIG. 7 is an infrared image obtained by the image pickup apparatus 3 and is a schematic diagram showing a temperature distribution. The dark part is the high temperature part, and the light part is the low temperature part. It should be noted that the shading shown in FIG. 7 and the arrangement location of the second member 11 shown in FIG. 2 and the like do not always match. Stress concentration is likely to occur due to shape discontinuities, notches, and the like. Therefore, as shown in FIG. 7, the image pickup apparatus 3 images the end portion of the blade 20. In the portion where stress concentration is likely to occur, the temperature change ΔT accompanying the deformation of the structure 1 becomes large.

FIG. 8 is a schematic diagram showing a displacement amount distribution obtained by image analysis based on the DIC method on the infrared image shown in FIG. 7. By image analysis of the infrared image shown in FIG. 7, the image analysis unit 53 obtains a visualized displacement amount distribution map (FIG. 8) including a contour line diagram 24 of the displacement amount and a displacement vector diagram (not shown). The obtained displacement amount distribution map is transmitted to the display unit 54 and the notification unit 55 (both described later). The displacement distribution map may be recorded in a recording unit (not shown). Further, the displacement amount distribution map may be transmitted to another device via, for example, an external transmission unit (not shown) and a communication cable (which may be wireless).

Returning to FIG. 5, the display unit 54 displays the result of the image analysis by the image analysis unit 53 on the display device 60. Specifically, in the first embodiment, the display unit 54 displays the displacement amount distribution map shown in FIG. 8 on the display device 60. The display device 60 is, for example, a monitor. By providing the display unit 54, the user can confirm the displacement amount distribution map.

The notification unit 55 notifies the user of an alarm when the result of the image analysis by the image analysis unit 53 deviates from a predetermined standard. The reference here is, for example, a physical quantity related to deformation (for example, a displacement amount, etc.), and specifically, for example, an allowance indicating that the deformation of the structure 1 does not significantly affect the service life of the structure 1. The amount of displacement. The permissible displacement amount can be determined by, for example, an experiment, a trial run, a simulation, or the like. The permissible displacement amount may be an input value by an operator via an input device (for example, a keyboard) (not shown).

For example, when the displacement amount determined based on the displacement amount distribution unit is included in the displacement amount range that has almost no effect on the service life, the notification unit 55 does not notify the alarm. However, when the displacement amount determined based on the displacement amount distribution map deviates from the displacement amount range which hardly affects the service life, that is, when the deformation of the structure 1 affects the service life of the structure 1. The notification unit 55 notifies the alarm. As a result, the displacement that the user cannot tolerate can be grasped, and for example, an extraordinary inspection can be urged to the user.

The alarm is generated by driving the notification device 61 (for example, blinking of a red lamp). Further, by using the notification device 61 in combination with the display device 60, an alarm may be displayed on the display device 60. Further, for example, the alarm may also notify a portion outside the displacement amount range (that is, a portion to be repaired).

Although not shown, the arithmetic processing unit 50 is, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), or an I / F (interface). Etc. are provided. Then, the arithmetic processing device 50 is embodied by the CPU executing a predetermined control program stored in the ROM. Further, the arithmetic processing unit 50 and the image pickup device 3 are electrically connected by a wired cable or wirelessly. A power cable is appropriately connected to the arithmetic processing unit 50 and the image pickup device 3.

FIG. 9 is a flowchart showing the inspection method of the first embodiment. The inspection method shown in FIG. 9 can be mainly executed by the arithmetic processing unit 50 shown in FIG. Therefore, in the following description, FIG. 9 will be described with reference to FIG.

The inspection method of the first embodiment includes an arrangement step S1, a measurement step S2, an image acquisition step S3, an image analysis step S5, a display step S6, and a notification step S8.

The arranging step S1 is a step of arranging the second member 11 on the surface 10a (see FIG. 2) of the first member 10 so that the surface of the first member 10 is partially exposed. The first member 10 and the second member 11 are the same as the first member 10 and the second member 11 described in the description of the structure 1.

The arrangement of the second member 11 on the first member 10 can be arbitrarily determined according to, for example, the form of the second member 11. For example, when the second member 11 is a coating film, it can be arranged by applying and drying a solution containing a solvent and a constituent material of the second member 11 to the first member 10. Coating and drying can be performed by any coating and drying device. Further, the second member 11 can be arranged by molding it into an arbitrary shape such as a covering material, a thin-walled sheet, or a seal, and fixing it to the first member 10 so as not to peel off. The pasting can be performed by any pasting device.

The measurement step S2 is a step of infrared-measuring the structure 1 obtained by arranging the second member 11 on the first member 10 by the image pickup apparatus 3. Further, the image acquisition step S3 is a step in which the image acquisition unit 51 acquires an infrared image captured by the image pickup apparatus 3. Further, the binarization processing step S4 is a step of performing binarization processing on the infrared image acquired by the image acquisition unit 51. The binarization processing step S4 is executed by the binarization processing unit 52. As the threshold value used for the binarization processing, for example, the threshold value described in the above description of the binarization processing unit 52 can be used.

The image analysis step S5 is a step of performing image analysis based on the DIC method on the infrared image obtained by the image pickup apparatus 3. The image analysis step S5 is executed by the image analysis unit 53. In the image analysis step S5, the displacement amount and the displacement direction of the structure surface due to the deformation of the structure 1 can be determined at the same time. Further, the display step S6 is a step of displaying the result of the image analysis by the image analysis unit 53 on the display device 60. The display step S6 is executed by the display unit 54.

The notification step S7 is a step of notifying the user of an alarm when the result of the image analysis by the image analysis unit 53 deviates from a predetermined standard. The reference referred to here is synonymous with the content described in the description of the notification unit 55. The notification step S7 is executed by the notification unit 55.

According to the above inspection method and inspection system 100, the structure 1 can be inspected while maintaining the design of the structure 1. That is, since the color of the first member 10 and the color of the second member 11 are similar in color or the second member 11 is colorless and transparent, the second member 11 installed in the first member 10 is inconspicuous when visually recognized. .. Therefore, the structure 1 can be inspected while maintaining the design of the structure 1 (that is, without significantly damaging it).

Further, for example, since the design of the structure 1 is maintained at the time of inspection, the structure 1 can be inspected without stopping the operation of the structure 1. Therefore, it is possible to suppress the economic loss due to the shutdown of the structure 1. Further, for example, when the inspection is performed while the operation of the structure 1 is stopped, the structure 1 is newly processed (for example, as described in paragraph 0031 of Patent Document 1, the spotted pattern is removed and the black paint is applied. There is no need to apply). Therefore, after the inspection, it is not necessary to perform a process for recovering the deterioration of the design due to the inspection, and it is possible to save the labor of the worker involved in the inspection.

Furthermore, since the analysis is performed based on the infrared image, the structure 1 can be inspected by imaging day and night. Therefore, the lighting or the like that illuminates the structure 1 becomes unnecessary, and the inspection can be easily performed. Further, in addition to the inspection of the newly installed structure 1, the existing structure 1 not provided with the second member 11 can be easily inspected. That is, in the existing structure 1, the inspection by the inspection system 100 can be easily performed only by newly installing the second member 11 on the surface of the first member 10.

In addition, by inspecting the structure 1, the tendency and frequency of displacement and strain can be recorded and analyzed. In particular, the inspection by the inspection system 100 can be performed, for example, in a state where the operation of the structure 1 is continued as described above. Therefore, a large amount of inspection data can be acquired, and the accuracy of analysis of the tendency and frequency of displacement and distortion can be improved. As a result, the maintenance plan can be optimized. Further, by feeding back the analysis result to the person in charge of designing the structure 1, it is possible to strengthen the structure at the time of designing the next model and improve the reliability of the structure 1.

FIG. 10 is a schematic view showing the inspection system 200 of the second embodiment. The structure 1 shown in FIG. 10 can be inspected by, for example, the inspection system 100 described above. In FIG. 1 above, a power generation facility is exemplified as a structure 1, but in FIG. 10, a railroad vehicle is exemplified as a structure 1.

The railroad vehicle constituting the structure 1 travels on the rail 41 via the bogie 42, and includes an entrance / exit portion 43 and a window portion 44. In a railway vehicle as well, as in the case of the above power generation equipment, stress tends to be concentrated in, for example, a corner portion or a portion where the shape changes. Therefore, in the illustrated example, the image pickup apparatus 3 takes an image of the vicinity of the window frame (part E in FIG. 10) of the window portion 44 where stress is likely to be concentrated, and the inspection system 200 performs the inspection.

The image pickup device 3 is installed on the ground. Therefore, when the structure 1 composed of the railroad vehicle passes through the installation location of the image pickup device 3, the image pickup device 3 images the vicinity of the window frame of the window portion 44. As a result, the displacement amount and the displacement direction of the window portion 44 in the vicinity of the window frame can be measured at the same time.

The inspection system 200 uses two imaging devices 3a and 3b to obtain a three-dimensional image. Therefore, in the inspection system 200, the infrared image obtained by the imaging devices 3a and 3b is a three-dimensional image. The image pickup devices 3a and 3b are monocular cameras, respectively, but stereo cameras may also be used. By obtaining a three-dimensional image, a visualized displacement amount distribution map of the three-dimensional surface including the depth direction as well as the in-plane direction can be obtained. Therefore, it is possible to measure the amount of displacement not only in the in-plane direction but also in the depth direction.

FIG. 11 is a schematic view of the structure 1 according to the third embodiment. Further, FIG. 12 is a cross-sectional view taken along the line FF of FIG. The structure 1 shown in FIGS. 11 and 12 can be inspected by, for example, the inspection system 100 described above.

In the third embodiment as well, as in the first embodiment, the second member 11 is scatteredly arranged on the surface 10a of the first member 10. However, in the third embodiment, unlike the first embodiment, the second member 11 is arranged in a speckled pattern on the surface 10a of the first member 10. Although the second member 11 is composed of spots of various sizes in the illustrated example, it may be composed of spots of the same size. Further, the second member 11 is not limited to a circular shape, and a speckled pattern such as an ellipse, a rectangle, or a hexagon may be formed on the first member 10.

The speckled second member can be arranged by attaching the second member 11 formed of a circular seal in the illustrated example to the surface 10a of the first member 10. Therefore, by arranging the second member 11 in a speckled pattern, the arrangement of the second member 11 can be facilitated.

FIG. 13 is a schematic view of the structure 1 according to the fourth embodiment. Further, FIG. 14 is a cross-sectional view taken along the line GG of FIG. The structure 1 shown in FIGS. 13 and 14 can be inspected by, for example, the inspection system 100 described above.

In the fourth embodiment, the second member 11 is arranged in a grid pattern. By arranging the second member 11 in a grid pattern, the second member 11 can be continuously arranged even if the size (surface area) of the surface 10a of the first member 10 is large. Thereby, the arrangement of the second member 11 can be easily performed.

Further, a plurality of unit surfaces 10b are formed on the surface 10a of the first member 10 by being surrounded by the lattice-shaped second member 11, and the shapes of the plurality of unit surfaces 10b are all different. In this way, by arranging the second member 11 in a grid pattern so that the shapes of the unit surfaces 10b are different, the second member 11 can be arranged irregularly. As a result, when the image analysis unit 53 (see FIG. 5) analyzes the image, it is possible to easily determine where the point Q before the deformation (see FIG. 6A) has moved due to the deformation. That is, since the second member 11 is irregularly arranged, the second member 11 is arranged in the region S (see FIG. 6B) to which the point Q is moved and the region R (see FIG. 6A) before the movement. Is different. Therefore, the temperature distribution is also different, and it is possible to easily determine the displacement amount and the displacement direction of the point Q in the image analysis based on the DIC method.

The arrangement form of the second member 11 arranged in a grid pattern is not limited to the illustrated example including a straight line and a curved line, and may be only a straight line or only a curved line. Further, the second member 11 may have an appropriately distorted shape. The arrangement site and the number of the second members are not limited to the illustrated examples. Further, as described above, although it is preferable that the second members 11 in a grid pattern are arranged irregularly, they may be arranged regularly (that is, the shapes of the unit surfaces 10b are all the same).

FIG. 15 is a schematic view of the structure 1 according to the fifth embodiment. Further, FIG. 16 is a cross-sectional view taken along the line HH of FIG. The structure 1 shown in FIGS. 15 and 16 can be inspected by, for example, the inspection system 100 described above.

The structure 1 of the fifth embodiment includes a protective member 12 having a thermal property value different from that of the first member 10 and the second member 11 on the surface 10a of the first member 10 so as to cover the second member 11. The protective member 12 is, for example, a resin material having excellent environmental resistance. In the illustrated example, the protective member 12 is arranged so as to cover the entire surface 10a of the first member 10, but the protective member 12 may cover at least the second member 11 and only a part of the surface 10a. The protective member 12 may be arranged on the. The protective member 12 may be colorless and transparent, may be colored transparent, or may be opaque.

By providing the protective member 12, the second member 11 can be protected, and the detachment of the second member 11 from the first member 10 and the change in the physical properties of the second member 11 can be suppressed. Further, since the protective member 12 has a thermophysical property value different from that of the first member 10 and the second member 11, it is caused by the thermoelastic effect of the first member 10 and the second member 11 when the structure 1 is deformed. The temperature change can be measured from the outside (that is, the surface side) of the protective member 12. Further, since the second member 11 is covered with the protective member 12, the unevenness of the surface 10a caused by the second member 11 is alleviated. As a result, the second member 11 can be made less noticeable.

FIG. 17 is a schematic view showing the inspection system 300 of the sixth embodiment. The structure 1 inspected by the inspection system 300 is a construction machine in the illustrated example, and more specifically, a hydraulic excavator. The structure 1 shown in FIG. 17 can be inspected by, for example, the above-mentioned inspection system 100.

In the structure 1 composed of the hydraulic excavator, the upper swivel body 82 is mounted on the lower traveling body 81. The upper swing body 82 includes a boom 83, an arm 84, a bucket 85, a boom cylinder 86, an arm cylinder 87, and a bucket cylinder 88. The image pickup device 3 is installed on the side surface of the boom 83 so that the corner portion of the side surface of the boom 83 can be imaged. As a result, the displacement and the displacement direction at the corners of the side surface of the boom 38 can be measured at the same time. However, the installation location and the imaging site of the image pickup apparatus 3 are not limited to this, and the upper swing body 82 may be mounted on the upper swing body 82 or the like to image the upper swing body 82.

1 Structure 10 First member 100 Inspection system 10a Surface 10b Unit surface 11 Second member 12 Protective member 20 Blade 200 Inspection system 21 Tower 22 Rotating shaft 23 Nasser 3 Imaging device 300 Inspection system 3a Imaging device 3b Imaging device 41 Rail 42 Cart 43 Doorway 44 Window 50 Arithmetic processing device 51 Image acquisition unit 52 Binarization processing unit 53 Image analysis unit 54 Display unit 55 Notification unit 60 Display device 61 Notification device 81 Lower traveling body 82 Upper swivel body 83 Boom 84 Arm 85 Bucket 86 Boom Cylinder 87 Arm Cylinder 88 Bucket Cylinder

Claims (15)

The first member and the surface of the first member are arranged so as to be partially exposed, and the color is similar to that of the first member or colorless and transparent, and the deformation and the temperature change due to the deformation are obtained. An image pickup device for infrared measurement of a structure including a second member having a thermophysical property value to be associated and having a thermophysical characteristic value different from that of the first member.
An inspection system including an arithmetic processing device including an image analysis unit that performs image analysis based on a digital image correlation method on an infrared image obtained by the image pickup device. In L ^* a ^* b ^* color system, the difference between the lightness ^{L *} of the first member of the lightness ^{L *} and the second member [Delta] L ^*, the first member of the chromaticity ^a *, the a ^{b *} No. Assuming that the differences between the chromaticity a ^* and b ^{* of the two members are Δa *} and Δb ^* , the following equation (1)
ΔE ^* ab = {(ΔL ^* ) ² + (Δa ^* ) ² + (Δb ^* ) ² } ^1/2 ... Equation (1)
The inspection system according to claim 1, ^{wherein the value of the color difference ΔE *} ab between the first member and the second member calculated according to the above is 0.4 or less. The inspection system according to claim 1 or 2, wherein the thermophysical property value is at least one of a coefficient of thermal expansion, a coefficient of thermal elasticity, or a constant pressure specific heat. The inspection system according to claim 1 or 2, wherein the second member is scatteredly arranged. The inspection system according to claim 1 or 2, wherein the second member is arranged in a grid pattern. A plurality of unit surfaces are formed on the surface of the first member by being surrounded by the second member in a grid pattern.
The inspection system according to claim 5, wherein the shapes of the plurality of unit surfaces are all different. The inspection system according to claim 1 or 2, wherein the thickness of the second member is 5 mm or less. The structure according to claim 1 or 2, wherein the structure is provided with a protective member having a thermophysical property value different from that of the first member and the second member on the surface of the first member so as to cover the second member. Inspection system. The inspection system according to claim 1 or 2, wherein the arithmetic processing unit includes a binarization processing unit that binarizes an infrared image obtained by the imaging device. The inspection system according to claim 1 or 2, wherein the infrared image obtained by the image pickup apparatus is a three-dimensional image. The inspection system according to claim 1 or 2, wherein the arithmetic processing unit includes a display unit that displays the result of image analysis by the image analysis unit on the display device. The inspection system according to claim 1 or 2, wherein the arithmetic processing unit includes a notification unit that notifies the user of an alarm when the result of image analysis by the image analysis unit deviates from a predetermined standard. The inspection system according to claim 1 or 2, wherein the structure is at least one of a power generation facility, a railroad vehicle, or a construction machine. The first member is a thermophysical property value that is similar in color or colorless and transparent to the first member and that associates the deformation with the temperature change caused by the deformation so that the surface of the first member is partially exposed. An arrangement step of arranging a second member having a thermophysical characteristic value different from that of the above surface.
A measurement step of measuring the structure obtained by arranging the second member on the first member by infrared rays with an imaging device, and
An inspection method including an image analysis step of performing image analysis based on a digital image correlation method on an infrared image obtained by the image pickup apparatus. A structure that is inspected by infrared measurement
The first member and
It is arranged on the surface so that the surface of the first member is partially exposed, has a similar color or colorless and transparent to the first member, and has a thermophysical property value that associates the deformation with the temperature change caused by the deformation. A structure comprising a second member having a thermophysical characteristic value different from that of the first member.

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