JP2021061370A - Elastic device - Google Patents

Abstract

To provide an elastic device capable of suppressing disconnection of a wiring of a circuit board having elasticity at the time of attachment/detachment.SOLUTION: In an elastic device 100, an elastic circuit board 10 is arranged on one surface side of an elastic device base material 20. The circuit board 10 includes a circuit board base material 1, a wiring 2, and a functional member 4 electrically connected to the wiring 2. The elastic device base material 20 includes a first base material portion 21 on which the circuit board 10 is arranged and a second base material portion 22 on which the circuit board 10 is not arranged. The elasticity of the second base material portion 22 is higher than the elasticity of the first base material portion 21.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to stretchable devices.

In recent years, stretchable electronics (also referred to as stretchable electronics) have been attracting attention, and the development of stretchable stretchable devices has been actively carried out.

For example, Patent Document 1 describes a glove-type input device worn on a hand to detect the movement and shape of a user's hand, which is provided on the outside and / or inside of a glove made of a stretchable material. A glove-type input device is disclosed in which a sensing device for detecting the movement of a knuckle is formed by using a conductive ink having elasticity. Further, in Patent Document 2, a glove body obtained by double molding in which a hand mold is immersed in an insulating rubber liquid tank twice to form an inner layer and an outer layer, and a finger mounting portion of the glove body are provided. An electrode provided with the skin side exposed and applying electrical stimulation to the afferent nerve of the finger worn through the exposed portion, and an electric wire connected to the electrode and wired along the back side of the hand of the glove body. A rubber glove with an electrode is disclosed, wherein the electric wire is sandwiched between the inner layer and the outer layer, and a meandering extension portion is formed in the middle of the wiring. On the other hand, although it is not a technique relating to a circuit board having elasticity, Patent Document 3 includes clothes, a measuring unit for measuring physical activity information, and a tubular accommodating unit for accommodating at least a part of the measuring unit. Wearable biosensors are disclosed.

Japanese Unexamined Patent Publication No. 2016-130940 Japanese Unexamined Patent Publication No. 2016-69761 Japanese Unexamined Patent Publication No. 2017-70599

Since the stretchable device is used by fitting it to the human body or the like, the stretchable device tends to stretch most when it is attached or detached, and at this time, there is a problem that the wiring of the stretchable circuit board is easily broken.

The present disclosure has been made in view of the above circumstances, and an object of the present disclosure is to provide an elastic device capable of suppressing disconnection of wiring of a circuit board having elasticity at the time of attachment / detachment.

In the present disclosure, a stretchable device is a stretchable device in which a stretchable circuit board is arranged on one surface side of a base material for a stretchable device, and the circuit board is a base material for a circuit board, wiring, and the like. The elastic device base material having a functional member electrically connected to the wiring has a first base material portion on which the circuit board is arranged and a first base material portion on which the circuit board is not arranged. Provided is an elastic device having two base materials and having a stretchability of the second base material portion higher than that of the first base material portion.

The stretchable device in the present disclosure has an effect that it is possible to suppress disconnection of wiring of a circuit board having elasticity at the time of attachment / detachment.

It is a schematic plan view which illustrates the stretchable device of this disclosure. It is the schematic cross-sectional view which illustrates the stretchable device of this disclosure. FIG. 3 is a schematic plan view and a cross-sectional view illustrating the stretchable device of the present disclosure. It is the schematic cross-sectional view which illustrates the stretchable device of this disclosure. It is a schematic diagram which illustrates the circuit board in this disclosure. It is a schematic diagram which illustrates the bellows shape part in this disclosure. It is the schematic cross-sectional view which illustrates the circuit board in this disclosure. It is a schematic diagram which illustrates the circuit board in this disclosure. It is a process drawing which illustrates the manufacturing method of the circuit board in this disclosure.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the present disclosure can be implemented in many different embodiments and is not construed as limited to the description of the embodiments illustrated below. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual form, but this is just an example and the interpretation in the present disclosure is limited. do not.

In the present specification, when expressing the mode of arranging another member on a certain member, when simply expressing "above" or "below", unless otherwise specified, the member is in contact with the certain member. , The case where another member is arranged directly above or directly below, and the case where another member is arranged above or below one member via another member. Similarly, in the present specification, when the term "on the surface side of a certain member" is used, unless otherwise specified, another member may be placed directly in contact with the surface of a certain member, or a certain member may be placed. Includes both cases where other members are placed on the surface of the surface via another member.

In the stretchable device in the present disclosure, a circuit board having elasticity is arranged on one surface side of a base material for a stretchable device, and the circuit board includes a base material for a circuit board, wiring, and the wiring. The elastic device base material has a functional member electrically connected to the first base material portion on which the circuit board is arranged, and a second base material portion on which the circuit board is not arranged. It has a material portion, and the elasticity of the second base material portion is higher than the elasticity of the first base material portion.

In the present disclosure, "stretchability" means a property that can be expanded and contracted, that is, a property that can be extended from a normal non-extended state and can be restored when released from this extended state. To say. The non-extended state is a state when no tensile stress is applied. Elasticity is also called stretchable.

1 (a) and 1 (b) are schematic plan views illustrating the stretchable device of the present disclosure, and are examples of a glove-type stretchable device. FIG. 1 (a) shows the back side of the hand, and FIG. 1 (b) shows the palm side. 2 (a) and 2 (b) are cross-sectional views of the broken line portion A of FIGS. 1 (a) and 1 (b), respectively.

As shown in FIGS. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b), the stretchable device 100 has one surface of the stretchable device base material 20 and the stretchable device base material 20. It has a circuit board 10 which is arranged on the side and has elasticity. In FIGS. 1A and 1B, the circuit board 10 is arranged on the surface side of the elastic device base material 20 on the back side of the hand. The circuit board 10 shown in FIG. 2A protects the support film 3, the wiring 2, and the functional member 4 electrically connected to the wiring 2 in this order from the first surface 1a of the circuit board base material 1. It has a layer 5. Further, the circuit board 10 has a reinforcing member 7 for reinforcing the functional member 4 inside the circuit board base material 1. Further, the circuit board 10 has an adhesive layer 6 on the surface side of the circuit board base material 1 opposite to the wiring 2 and the functional member 4, and is a base for an elastic device via the adhesive layer 6. It is adhered to the material 20. In FIG. 1A, the support film, the reinforcing member, and the protective layer are omitted.

The stretchable device base material 20 has a first base material portion 21 on which the circuit board 10 is arranged and a second base material portion 22 on which the circuit board 10 is not arranged. One of the features of the present disclosure is that the elasticity of the second base material portion 22 is higher than the elasticity of the first base material portion 21. In FIGS. 1 (a) and 1 (b), the elasticity of the elastic device base material 20 (second base material portion 22) on the palm side is the elasticity of the elastic device base material 20 (first base material) on the back side of the hand. It is higher than the elasticity of the part 22).

According to the present disclosure, the elasticity of the second base material portion of the base material for the elastic device is higher than the elasticity of the first base material portion, so that the wiring of the circuit board is broken when the elastic device is attached or detached. Can be suppressed. Specifically, since the stretchable device is used by fitting it to the human body or the like, the stretchable device tends to stretch most when it is attached or detached. At this time, since the elasticity of the second base material portion is higher than the elasticity of the first base material portion, the second base material portion is more easily stretched than the first base material portion and is arranged on the first base material portion. It is possible to make it difficult for stress to be applied to the wiring and functional members of the circuit board. As a result, it is possible to prevent the wiring of the circuit board from being broken when the elastic device is attached or detached.

Further, since the circuit board is arranged on the elastic device, it may be difficult for the wearer to operate. On the other hand, in the present disclosure, since the elasticity of the second base material portion is higher than the elasticity of the first base material portion, the second base material portion is more easily stretched than the first base material portion, and the stretchable device. When used, it can be easily expanded and contracted and bent, making it easier for the wearer to move. Further, it is possible to prevent the wiring of the circuit board from being broken during expansion and contraction or bending.

Further, according to the present disclosure, the elasticity of the second base material portion is higher than the elasticity of the first base material portion, that is, the elasticity of the first base material portion is lower than the elasticity of the second base material portion. The first base material portion is less likely to stretch than the second base material portion during expansion and contraction or bending, and the position of the functional member of the circuit board arranged on the first base material portion can be stabilized. As a result, the position of the functional member of the circuit board of the elastic device with respect to the wearer can be maintained at a predetermined position, and accurate measurement becomes possible.

Therefore, in the present disclosure, it is possible to provide an elastic device having high reliability and measurement accuracy, comfortable to wear, and easy to wear.

The stretchable device of the present disclosure has at least a base material and a circuit board for the stretchable device. Hereinafter, the stretchable device of the present disclosure will be described in the order of the base material for the stretchable device and the circuit board.

1. 1. Stretchable Device Base Material The stretchable device base material in the present disclosure includes a first base material portion on which a circuit board is arranged and a second base material portion on which no circuit board is arranged.

The elasticity of the second base material portion is higher than the elasticity of the first base material portion. It can be confirmed that the elasticity of the second base material portion is higher than the elasticity of the first base material portion, for example, by the elongation rate of the second base material portion being higher than the elongation rate of the first base material portion. it can. Here, the elongation rates of the first base material portion and the second base material portion are the 8.16.1 elongation rate B method (constant load method of woven fabric) of JIS L1096: 2010 (fabric test method for woven fabrics and knitted fabrics). Can be measured according to. Even when the first base material portion and the second base material portion are other than the woven fabric, the above-mentioned method for measuring the elongation rate shall be applied. Further, when the first base material portion and / or the second base material portion has a direction in which it is easy to expand and contract and a direction in which it is difficult to expand and contract, the difference in elongation rate is large between the direction in which it is easy to expand and contract and the direction in which it is difficult to expand and contract. In that case, a value having a large growth rate shall be adopted.

The elongation rate of the second base material portion may be larger than the elongation rate of the first base material portion, for example, it is preferably 1.1 times or more with respect to the elongation rate of the first base material portion. It is preferably 1.5 times or more, and more preferably 2 times or more.

The elongation rate of the second base material portion may be larger than the elongation rate of the first base material portion, for example, it is preferably 10% or more, more preferably 70% or more, and further preferably 100%. It can be the above. Further, the upper limit of the elongation rate of the second base material portion can be, for example, 1000% or less.

The elongation rate of the first base material portion may be smaller than the elongation rate of the second base material portion, for example, it is preferably 500% or less, more preferably 100% or less, and further preferably 70%. It can be as follows. Further, the lower limit of the elongation rate of the first base material portion can be, for example, 1% or more.

Further, it is confirmed that the elasticity of the second base material portion is higher than the elasticity of the first base material portion, for example, because the bending rigidity of the second base material portion is smaller than the bending rigidity of the first base material portion. You can also do it. The flexural rigidity is the product of the moment of inertia of area of the target member and the elastic modulus (Young's modulus) of the material constituting the target member, and the unit is N · m ² or Pa · m ⁴ . is there. The moment of inertia of area of the first base material portion and the second base material portion is calculated based on the cross section when the base material for the stretchable device is cut by a plane orthogonal to the expansion and contraction direction of the circuit board. Here, the Young's modulus of the first base material portion and the second base material portion can be measured by the nano-intention method according to ISO14577, or can be measured by the method according to ASTM D822. Further, when the first base material portion and / or the second base material portion has a direction in which it is easy to expand and contract and a direction in which it is difficult to expand and contract, the difference in Young's modulus is large between the direction in which it is easy to expand and contract and the direction in which it is difficult to expand and contract. In this case, a value with a small Young's modulus is adopted.

The bending rigidity of the second base material portion may be smaller than the bending rigidity of the first base material portion, and is preferably 0.9 times or less with respect to the bending rigidity of the first base material portion, for example. It can be preferably 0.8 times or less, more preferably 0.7 times or less.

As a means for making the elasticity of the second base material portion higher than the elasticity of the first base material portion, for example, a method of making the materials of the first base material portion and the second base material portion different, or a second base material portion. Examples thereof include a method of making the thickness of the portion thinner than the thickness of the first base material portion. When the base material for the elastic device is a cloth, a method of differently weaving or knitting the first base material portion and the second base material portion, and the method of differently weaving or knitting the first base material portion and the second base material portion. A method of making the thickness of the thread different, a method of making a notch or a hole in the second base material portion, a method of assuming that the first base material portion is a laminated base material layer and an auxiliary layer, the first method. Another method is to make the base material portion by laminating a base material layer and an auxiliary layer having a pattern shape. Of these, a method in which the materials of the first base material portion and the second base material portion are different, and a method in which the weaving method and the knitting method of the first base material portion and the second base material portion are different are preferable. This is because in these methods, the choice of materials for the first base material portion and the second base material portion is wide, and the elasticity of the first base material portion and the second base material portion can be easily different. Further, a method in which the thickness of the second base material portion is made thinner than the thickness of the first base material portion is also preferable. In this method, since the elastic device can be easily folded by the thin second base material portion, the circuit board arranged on the first base material portion does not bend when the elastic device is folded, and the elastic device is expanded and contracted. It is possible to prevent the circuit board from being damaged during storage of the sex device.

The base material for the stretchable device has a first base material portion on which the circuit board is arranged and a second base material portion on which the circuit board is not arranged. The arrangement of the first base material portion and the second base material portion is appropriately selected according to the form of the stretchable device of the present disclosure, the shape of the circuit board, and the like. Above all, it is preferable that the first base material portion and the second base material portion are arranged so that they can face each other with a part of the wearer's body sandwiched between them when the elastic device of the present disclosure is attached or worn. .. This is because the wiring of the circuit board is less likely to be broken when the elastic device is attached / detached and used, and the wearer can easily operate the device. Further, it is easy to design the first base material portion and the second base material portion.

For example, when the stretchable device of the present disclosure is a glove type, one of the base material for the stretchable device on the back side of the hand and the base material for the stretchable device on the palm side is the first base material portion and the other is the second base material. It can be a timber part. When the elastic device of the present disclosure is a sock type, one of the elastic device base material on the instep side and the elastic device base material on the sole side is the first base material portion and the other is the first base material portion. A second base material portion, or one of the base material for the elastic device on the outside of the foot and the base material for the elastic device on the inside of the foot may be used as the first base material portion and the other as the second base material portion. Of the base material for the elastic device on the front side of the foot and the base material for the elastic device on the rear side of the foot, one may be a first base material portion and the other may be a second base material portion. When the stretchable device of the present disclosure is a wristband type, one of the base material for the stretchable device on the back side of the hand and the base material for the stretchable device on the palm side is the first base material portion and the other is the second base material portion. It can be a base material part. When the stretchable device of the present disclosure is an ankle supporter type, one of the base material for the stretchable device on the instep side and the base material for the stretchable device on the heel side of the foot is the first base material portion. The other is used as the second base material, or one of the base material for the elastic device on the ankle side and the base material for the elastic device on the heel side is the first base material part and the other is the second base material part. Can be. Further, when the elastic device of the present disclosure is a leg supporter type such as a knee, thigh, calf, tights type, spats type, etc., the base material for the elastic device inside the leg and the elastic device outside the leg. One of the base materials for the elastic device on the front side of the leg and the base material for the elastic device on the back side of the leg, one of which is the first base material portion and the other is the second base material portion. Can be used as the first base material portion, and the other can be used as the second base material portion. When the stretchable device of the present disclosure is an arm or elbow supporter type, one of the base material for the stretchable device inside the arm and the base material for the stretchable device outside the arm is the first base material portion. The other can be the second base material portion. When the stretchable device of the present disclosure is a garment type, one of the base material for the stretchable device on the front body side and the base material for the stretchable device on the back body side is the first base material portion and the other is the first base material. 2 It can be a base material part.

In addition, the first base material portion and the second base material portion may be arranged side by side when the stretchable device of the present disclosure is attached or worn. For example, FIGS. 3A and 3B are schematic plan views and cross-sectional views illustrating the stretchable device of the present disclosure, and are examples of a wristband type stretchable device. FIG. 3B is a cross-sectional view taken along the line BB of FIG. 3A. In the examples shown in FIGS. 3A and 3B, when the elastic device 100 is attached or worn, the first base material portion 21 and the second base material portion 22 sandwich a part of the wearer's body. They are arranged so as to face each other and arranged side by side, and the thickness of the first base material portion 21 is thicker than the thickness of the second base material portion 22.

The first base material portion and the second base material portion may be integrated, separate bodies, and may be joined. For example, when the base material for the stretchable device is a cloth, the first base material portion and the second base material portion may be sewn together or adhered to each other.

The material of the base material for the stretchable device may be any material having elasticity, and examples thereof include cloths such as woven fabrics, knitted fabrics, and non-woven fabrics, and elastomers. Examples of the elastomer include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, amide-based elastomers, nitrile-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, 1,2-polybutadiene-based elastomers, fluorine-based elastomers, and silicone rubbers. Examples thereof include urethane rubber, fluororubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene, and chlorosulfonated polyethylene. Further, the base material for the stretchable device may be a cloth coated with an elastomer.

Above all, the base material for the stretchable device is preferably cloth. This is because cloth is often used as the base material of the stretchable device.

The materials of the first base material portion and the second base material portion may be the same or different from each other. When the materials of the first base material portion and the second base material portion are different from each other, the elasticity of the first base material portion and the second base material portion can be made different by appropriately selecting the materials.

The thickness of the base material for the stretchable device is appropriately selected depending on the use of the stretchable device of the present disclosure, the material of the base material for the stretchable device, and the like.

The thickness of the first base material portion and the second base material portion may be the same or different from each other. When the thicknesses of the first base material portion and the second base material portion are different from each other, the elasticity of the first base material portion and the second base material portion can be made different by appropriately selecting the thickness. .. Specifically, by making the thickness of the second base material portion thinner than the thickness of the first base material portion, the elasticity of the second base material portion is made higher than the elasticity of the first base material portion. Can be done.

Further, the colors of the first base material portion and the second base material portion may be the same or different from each other. When the colors of the first base material portion and the second base material portion are different from each other, it is possible to easily distinguish between the side on which the circuit board is arranged and the side on which the circuit board is not arranged when the elastic device is attached or worn. At the same time, it is possible to enhance the design.

Further, the first base material portion of the stretchable device base material may be a member different from the circuit board base material of the circuit board, or may also serve as the circuit board base material of the circuit board. For example, in FIG. 2A, the first base material portion 21 of the stretchable device base material 20 is a member different from the circuit board base material 1 of the circuit board 10, and in FIG. 4, it is stretchable. The first base material portion 21 of the base material 20 for a sex device also serves as the base material 1 for the circuit board of the circuit board 10. Above all, it is preferable that the first base material portion of the base material for the stretchable device is a member different from the base material for the circuit board of the circuit board.

2. Circuit board The circuit board in the present disclosure has at least a circuit board base material and wiring, and has elasticity. Further, the circuit board may have each member described later in addition to the circuit board base material and wiring.

5 (a) is a schematic plan view illustrating the circuit board in the present disclosure, and FIG. 5 (b) is a sectional view taken along the line CC of FIG. 5 (a). The circuit board 10 shown in FIGS. 5A and 5B has a circuit board base material 1, a support film 3, a wiring 2, and a functional member 4 in this order. In the circuit board 10, the wiring 2 has peaks 51 and valleys 52 in the normal direction of the first surface 1a of the circuit board base material 1 along the in-plane direction of the first surface 1a of the circuit board base material 1. It has a bellows-shaped portion 50 that repeatedly appears. In the present disclosure, as shown in FIGS. 5A and 5B, the direction in which the peaks 51 and valleys 52 of the bellows-shaped portion 50 repeatedly appear may be referred to as the first direction D1.

(1) Substrate for circuit board The substrate for circuit board in the present disclosure has elasticity. Further, the substrate for a circuit board includes a first surface located on the wiring side and a second surface located on the opposite side of the first surface. The first surface and the second surface in the present disclosure refer to surfaces on the same direction regardless of the members.

The substrate for a circuit board has elasticity. An example of a parameter representing the elasticity of a substrate for a circuit board is a restoration rate. The restoration rate of the base material for circuit boards is 80% when released from this extended state after being extended to 50% (1.5 times the initial length) based on the normal state (non-extended state). The above is preferable, 85% or more is more preferable, and 90% or more is further preferable. The upper limit of the restoration rate is 100%. The restoration rate can be calculated by preparing a test piece having a width of 25 mm, extending the test piece by 50% and holding it for 1 hour, then releasing the extension and leaving it for 1 hour to restore it, and then using the following formula. it can.
Restoration rate (%) = (length immediately after extension-length after restoration) ÷ (length immediately after extension-length before tension) x 100
The length immediately after stretching means the length in a state of being stretched by 50%.

Further, as another example of a parameter representing the elasticity of the substrate for a circuit board, there is an elongation rate. The substrate for a circuit board is preferably able to be stretched by 1% or more from the non-stretched state without being destroyed, more preferably 20% or more, and further preferably 75% or more. .. By using a substrate for a circuit board having such elasticity, the circuit board can have elasticity as a whole. Further, the circuit board can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a human arm. It is generally said that a product mounted under the armpit of a person needs to have an elasticity of 72% in the vertical direction and 27% in the horizontal direction. In addition, it is said that products attached to human knees, elbows, buttocks, ankles, and armpits need to have elasticity of 26% or more and 42% or less in the vertical direction. It is also said that products that are attached to other parts of the human body need to have less than 20% elasticity.

The Young's modulus of the substrate for a circuit board is, for example, 10 MPa or less, and may be 1 MPa or less. The Young's modulus of the substrate for a circuit board is, for example, 1 kPa or more. The Young's modulus of each member is the Young's modulus at room temperature (25 ° C.). As a method for measuring the Young's modulus of the substrate for a circuit board, a method of performing a tensile test in accordance with JIS K6251 using a sample of the substrate for a circuit board can be adopted. Further, as a method for determining the Young's modulus of the substrate for a circuit board, a measurement method by a nano-intention method can be adopted in accordance with ISO14577. Specifically, the Young's modulus of the substrate for a circuit board can be measured using a nanoindenter. As a method of preparing a sample of the base material for a circuit board, a method of taking out a part of the base material for the circuit board as a sample from the circuit board or a part of the base material for the circuit board before forming the circuit board as a sample. There is a method of taking out. Further, as a method for determining the Young's modulus of the substrate for a circuit board, a method conforming to ASTM D822 can also be adopted. Another method for determining the Young's modulus of the substrate for a circuit board is to analyze the materials constituting the substrate for the circuit board and determine the Young's modulus of the substrate for the circuit board based on the existing database of materials. Can also be adopted. The method for determining the Young's modulus of each member other than the substrate for the circuit board is the same as described above.

Examples of the material of the base material for the circuit board include an elastomer. Examples of the elastomer include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, amide-based elastomers, nitrile-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, 1,2-polybutadiene-based elastomers, fluorine-based elastomers, and silicone rubbers. Examples thereof include elastomer rubber, fluororubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Further, the substrate for the circuit board may contain silicone. Silicone is excellent in heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for a base material for a circuit board. Further, as the material of the base material for the circuit board, for example, a cloth such as a non-woven fabric, a woven cloth, or a knitted cloth can be used.

The thickness of the substrate for the circuit board is, for example, 10 μm or more, 20 μm or more, or 25 μm or more. The thickness of the substrate for the circuit board is, for example, 10 mm or less, may be 3 mm or less, or may be 1 mm or less.

For example, in FIG. 5B, the bellows-shaped portion appears on the first surface 1a of the circuit board base material 1, but the bellows-shaped portion does not appear on the second surface 1b of the circuit board base material 1. On the other hand, in the first aspect, the bellows-shaped portion may appear on the second surface of the substrate for the circuit board.

(2) Wiring The wiring in the present disclosure has conductivity. Further, the wiring is preferably located on the first surface side of the substrate for the circuit board and has the bellows-shaped portion described above. In FIG. 5B, the wiring 2 is located on the first surface 1a side of the circuit board base material 1 and has a bellows-shaped portion 50.

The amplitude of the bellows-shaped portion is, for example, 1 μm or more, may be 10 μm or more, may be 50 μm or more, or may be 100 μm or more. The amplitude of the bellows-shaped portion may be, for example, 500 μm or less, 400 μm or less, or 300 μm or less.

As shown in FIG. 6, the amplitude of the bellows-shaped portion can be represented by the symbols S1 and S2, and is in the normal direction of the first surface of the substrate for the circuit board between the adjacent peaks and valleys. The distance. The amplitude S1 is the amplitude of the bellows-shaped portion 50 on the surface of the wiring 2 opposite to the surface of the circuit board base material in the normal direction. Further, the amplitude S2 is the amplitude of the bellows-shaped portion 50 on the surface of the wiring 2 on the circuit board base material side in the normal direction of the circuit board base material.

The amplitude of the bellows-shaped portion is measured, for example, by measuring the distance in the normal direction of the first surface of the substrate for a circuit board between adjacent peaks and valleys over a certain range in the length direction of the wiring. , Calculated by finding the average of them. A certain range in the length direction of the wiring is, for example, 10 mm. As the measuring instrument for measuring the distance between the adjacent peaks and valleys, a non-contact measuring instrument using a laser microscope may be used, or a contact measuring instrument may be used. Further, the distance between the adjacent peaks and valleys may be measured based on an image such as a cross-sectional photograph.

The period of the bellows-shaped portion is, for example, 10 μm or more, 50 μm or more, or 100 μm or more. The period of the bellows-shaped portion may be, for example, 1000 μm or less, 750 μm or less, or 500 μm or less. As shown in FIG. 6, the period of the bellows-shaped portion can be represented by the reference numeral F, which is the distance between adjacent peaks in the first direction D1.

The period of the bellows-shaped portion is calculated, for example, by measuring the distance between adjacent peaks in the first direction over a certain range in the length direction of the wiring and calculating the average of them. A certain range in the length direction of the wiring is, for example, 10 mm. As a measuring instrument for measuring the distance between adjacent peaks, a non-contact measuring instrument using a laser microscope may be used, or a contact measuring instrument may be used. Further, the distance between adjacent mountain portions may be measured based on an image such as a cross-sectional photograph.

The Young's modulus of the wiring is, for example, 100 MPa or more, and may be 200 MPa or more. Further, the Young's modulus of the wiring may be, for example, 300 GPa or less, 200 GPa or less, or 100 GPa or less.

The wiring material may or may not be elastic in itself. Examples of the non-stretchable material include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. On the other hand, examples of the stretchable material include a conductive composition containing conductive particles and an elastomer. In this case, the wiring comprises conductive particles and an elastomer. Examples of the conductive particles include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Examples of the elastomer include styrene-based elastomers, acrylic-based elastomers, olefin-based elastomers, urethane-based elastomers, silicone rubbers, urethane rubbers, fluororubbers, nitrile rubbers, polybutadienes, and polychloroprenes.

The plan-view shape of the wiring is not particularly limited, but it is particularly preferable that the wiring is linear as illustrated in FIG. 5 (a). Further, the wiring may function as an electrode. Examples of the electrode include an electrode for a solar cell and an electrode for organic electroluminescence.

The thickness of the wiring is not particularly limited. For example, when the material of the wiring does not have elasticity, the thickness of the wiring may be, for example, 25 nm or more, 50 nm or more, or 100 nm or more. Further, in this case, the thickness of the wiring may be, for example, 50 μm or less, 10 μm or less, or 5 μm or less. On the other hand, when the material of the wiring has elasticity, the thickness of the wiring may be, for example, 5 μm or more, 10 μm or more, or 20 μm or more. Further, in this case, the thickness of the wiring may be, for example, 60 μm or less, 50 μm or less, or 40 μm or less. The width of the wiring is, for example, 50 μm or more and 10 mm or less.

The method of forming the wiring is not particularly limited. For example, when the wiring material does not have elasticity, a metal film is formed by, for example, a vapor deposition method, a sputtering method, a plating method, a transfer / crimping method of a metal foil, and then the metal film is patterned by a photolithography method. There is a way to do it. On the other hand, when the wiring material has elasticity, for example, a method of printing a conductive composition containing conductive particles and an elastomer in a pattern by a general printing method can be mentioned.

(3) Functional member The functional member in the present disclosure is a member electrically connected to the wiring. The functional member is preferably located on the first surface side of the substrate for the circuit board. In FIG. 5B, the functional member 4 is located on the first surface 1a side of the circuit board base material 1 and is electrically connected to the wiring 2. The functional member is preferably in physical contact with the wiring. Further, the circuit board may have a functional member inside.

The functional member may be an active element, a passive element, or a mechanical element. Functional members include, for example, transistors, LSIs (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs and LCDs, sounding elements such as sensors and buzzers, and vibrations that generate vibrations. Examples thereof include elements, cooling and heating components such as Perche elements and heating wires that control cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors.

Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, magnetic sensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, etc. Examples thereof include gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and photometric sensors. In particular, the sensor is preferably a biosensor capable of measuring biological information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, blood oxygen concentration, myoelectricity, and brain wave.

In order to reinforce the electrical joint connecting the functional member and the wiring, the periphery of the functional member can be covered with a resin such as a potting agent. This makes it possible to improve the mechanical reliability of the functional member and the electrical joint of the wiring. The functional member may or may not have a bellows-shaped portion. For example, when the functional member is a TFT or OLED, it can have a bellows-shaped portion. Further, a part of the wiring may be used as a functional member.

(4) Support Film The circuit board in the present disclosure may have a support film that supports the wiring between the circuit board base material and the wiring. For example, in FIGS. 7A to 7D, the circuit board 10 has a support film 3 between the circuit board base material 1 and the wiring 2. In addition, the support film usually has a bellows-shaped portion. The bellows-shaped portion is as described above.

When the support film is located between the circuit board base material and the wiring, the tensile stress is removed from the circuit board base material bonded to the support film in the circuit board manufacturing method, and the circuit board base material is removed. When the is contracted, a bellows-shaped portion is formed on the support film and the wiring. It is preferable that the characteristics and dimensions of the support film are set so that such a bellows-shaped portion can be easily formed.

The support film has, for example, a Young's modulus larger than the Young's modulus of the substrate for a circuit board. The Young's modulus of the support film is, for example, 100 MPa or more, and may be 1 GPa or more. Further, the Young's modulus of the support film is, for example, 100 times or more and 50,000 times or less, and may be 1000 times or more and 10000 times or less with respect to the Young's modulus of the substrate for the circuit board. By setting the Young's modulus of the support film in this way, it is possible to prevent the period of the bellows-shaped portion from becoming too small. In addition, it is possible to suppress the occurrence of local bending in the bellows-shaped portion. Further, if the Young's modulus of the support film is too large, it becomes difficult to restore the circuit board base material at the time of relaxation, and the circuit board base material is liable to crack or break.

Examples of the material of the support film include resin. Specific examples of the resin include polyesters such as polyethylene naphthalate and polyethylene terephthalate, polyimide, polyamide, polycarbonate, polyolefin, cycloolefin polymer, and acrylic resin. Further, it is preferable that the support film is positioned so as to overlap with at least a part of the wiring in a plan view. Further, the support film may be located on the entire surface of the circuit board base material on the first surface side, or may be partially located on the first surface side of the circuit board base material.

The thickness of the support film is, for example, 500 nm or more, and may be 1 μm or more. On the other hand, the thickness of the support film is, for example, 10 μm or less, and may be 5 μm or less. If the thickness of the support film is too thin, it becomes difficult to handle the support film in the process of manufacturing the support film and the process of forming a member on the support film. Further, if the thickness of the support film is too thick, it becomes difficult to restore the base material for the circuit board at the time of relaxation, and the target expansion and contraction of the base material for the circuit board may not be obtained. When the circuit board has a support film between the circuit board base material and the wiring, it is preferable to have an adhesive layer between the circuit board base material and the support film.

(5) Adjustment Layer The circuit board in the present disclosure may have an adjustment layer that is located on the first surface side of the substrate for the circuit board, has a Young's modulus smaller than that of the wiring, and has a bellows-shaped portion. .. For example, in FIGS. 7A to 7D, the circuit board 10 is located on the first surface 1a side of the circuit board base material 1 and has an adjusting layer 8 having a bellows-shaped portion.

By providing the adjusting layer, even when the degree of bending or bending occurring in the wiring is locally increased, it is possible to reduce the stress concentration at the place where the degree of bending or bending is locally large. In the method of manufacturing a circuit board having elasticity, when the wiring is deformed in a bellows shape, the degree of deformation is the variation in the elongation of the substrate for the circuit board during elongation and the distribution of the metal thin film on the substrate for the circuit board. Due to the difference in density, etc., it varies depending on the position. If the degree of deformation of the wiring varies, the degree of bending or bending that occurs in the wiring may locally increase. Stress is concentrated in places where the degree of bending or bending that occurs in the wiring is locally large. Further, in general, an elastomer is used for the substrate for a circuit board, and a metal, an alloy, or the like is used for the wiring. Therefore, the Young's modulus of the wiring is much larger than the Young's modulus of the substrate for the circuit board. That is, the wiring is harder and less likely to be deformed than the circuit board base material. Therefore, stress tends to be concentrated in a place where the degree of bending or bending that occurs in the wiring is locally large. In the wiring where stress is concentrated, damage such as breakage may occur, and the resistance value may increase when the circuit board is repeatedly expanded and contracted. On the other hand, the stress can be dispersed by locating the adjustment layer having a Young's modulus smaller than that of the wiring, that is, being softer and more easily deformed than the wiring. Therefore, even when the degree of bending or bending occurring in the wiring is locally increased, it is possible to reduce the stress concentration at the place where the degree of bending or bending is locally large.

The Young's modulus of the adjustment layer is smaller than the Young's modulus of the wiring. Further, the Young's modulus of the adjusting layer is preferably larger than the Young's modulus of the substrate for the circuit board. That is, the adjusting layer preferably has a Young's modulus intermediate between that of the wiring and the substrate for the circuit board. Stress concentration can be reduced by providing an adjustment layer that is softer and more easily deformed than wiring and harder and less easily deformed than the substrate for a circuit board.

Further, when the support film is located between the substrate for the circuit board and the wiring, the Young's modulus of the adjustment layer may be smaller than the Young's modulus of the support film and may be the same as the Young's modulus of the support film. , May be greater than the Young's modulus of the supporting film. Above all, the Young's modulus of the adjusting layer is preferably smaller than the Young's modulus of the supporting film.

The Young's modulus of the adjusting layer is, for example, 1 GPa or less, 100 MPa or less, or 10 MPa or less. The Young's modulus of the adjusting layer is, for example, 10 kPa or more, and may be 1 MPa or more.

The material of the adjusting layer may or may not have elasticity. Examples of the stretchable material include elastomers. Examples of the elastomer include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, amide-based elastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadienes, polyisobutylenes, polystyrene butadienes, and polychloroprenes. On the other hand, examples of the material having no elasticity include resin. As the resin, for example, any of a thermoplastic resin, a thermosetting resin, and a photocurable resin can be used.

The adjusting layer is preferably located so as to overlap at least a part of the wiring in a plan view. Further, the adjusting layer may be located on the entire surface of the circuit board base material on the first surface side, or may be partially located on the first surface side of the circuit board base material.

The adjusting layer may be located on the first surface side of the substrate for the circuit board. For example, the adjusting layer may be located between the circuit board base material and the wiring, or may be located on the surface side of the wiring opposite to the circuit board base material. Further, when the circuit board has a support film between the substrate for the circuit board and the wiring, the adjustment layer may be located between the support film and the wiring, and the surface opposite to the support film of the wiring. It may be located on the side, or may be located between the substrate for the circuit board and the support film.

The conditioning layer is usually non-sticky. When the circuit board has a support film between the circuit board base material and the wiring, it may have an adhesive layer between the circuit board base material and the support film, and the adjusting layer may have an adhesive layer with such an adhesive layer. Are distinguished. Here, having no adhesiveness means that the adhesive strength of the adjusting layer is 0.01 N / 25 mm or less, may be 0.005 N / 25 mm or less, and is 0.001 N / 25 mm or less. You may.

As a method for measuring the adhesive strength, a method of performing a 180 ° peeling test using a sample of the adjusting layer can be adopted. In the 180 ° peeling test, first, a test piece having a width of 25 mm is collected, and a glass plate having a width of 25 mm is attached to the surface of the test piece on the adjustment layer side. Next, using a tensile tester, the adhesive strength (N / 25 mm) to the glass plate is measured under the conditions of tensile speed: 1200 mm / min, peeling angle: 180 °, temperature: 20 ° C., and humidity: 50%.

The thickness of the adjusting layer is, for example, 0.1 μm or more, may be 1 μm or more, or may be 10 μm or more. The thickness of the adjusting layer is, for example, 1 mm or less, may be 500 μm or less, or may be 100 μm or less.

(6) Protective Layer Even if the circuit board in the present disclosure has a protective layer located on the first surface side of the circuit board base material and located on the surface side opposite to the circuit board base material of the wiring. Good. For example, in FIG. 2A, a protective layer in which the circuit board 10 is located on the first surface 1a side of the circuit board base material 1 and is located on the surface side of the wiring 2 opposite to the circuit board base material 1. Has 5. By providing the protective layer, it is possible to protect the constituent members (for example, wiring) of the circuit board. Further, the protective layer may have an insulating property.

The Young's modulus of the protective layer is preferably smaller than the Young's modulus of the wiring. The Young's modulus of the protective layer is, for example, 1 GPa or less, 100 MPa or less, or 10 MPa or less. The Young's modulus of the protective layer is, for example, 10 kPa or more, and may be 1 MPa or more.

The material of the protective layer is preferably elastic. Examples of the stretchable material include elastomers. Examples of the elastomer include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, amide-based elastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadienes, polyisobutylenes, polystyrene butadienes, and polychloroprenes.

The protective layer is preferably located so as to overlap at least a part of the wiring in a plan view. Further, the protective layer may be located on the entire surface of the circuit board base material on the first surface side, or may be partially located on the first surface side of the circuit board base material, for example. Further, the surface of the protective layer opposite to the circuit board base material is preferably flat.

The thickness of the protective layer is, for example, 100 μm or more, 500 μm or more, or 1000 μm or more. The thickness of the protective layer is, for example, 10 mm or less, may be 5 mm or less, or may be 2 mm or less.

(7) Reinforcing Member The circuit board in the present disclosure has a reinforcing member located on the first surface side of the circuit board base material, the second surface side of the circuit board base material, or inside the circuit board base material. You may be. In FIG. 2A, the circuit board 10 has a reinforcing member 7 at a position overlapping the end portion of the functional member 4 in a plan view. Further, although not shown, the circuit board may have a reinforcing member at a position overlapping the end portion of the terminal portion of the wiring in a plan view.

By providing the reinforcing member, it is possible to prevent a large mountain portion from being generated in the wiring in the vicinity of the functional member or the terminal portion. As a result, good electrical bonding can be maintained.

The reinforcing member preferably has a Young's modulus larger than the Young's modulus of the substrate for the circuit board. The Young's modulus of the reinforcing member is, for example, 1 GPa or more, more preferably 10 GPa or more. The Young's modulus of the reinforcing member may be 100 times or more, or 1000 times or more, the Young's modulus of the substrate for the circuit board. The Young's modulus of the reinforcing member may be 500 GPa or less. Further, the Young's modulus of the reinforcing member may be 500,000 times or less the Young's modulus of the substrate for the circuit board.

Examples of the reinforcing member material include metal materials such as copper, aluminum, and stainless steel; general thermoplastic elastomers; acrylic-based, urethane-based, epoxy-based, polyester-based, epoxy-based, vinyl ether-based, and polyene-thiol-based materials. Examples thereof include oligomers such as silicones, and polymers such as acrylics, urethanes, epoxys, polyesters, epoxys, vinyl ethers, polyenes and thiols, and silicones. The thickness of the reinforcing member is, for example, 10 μm or more.

(8) Adhesive Layer The circuit board in the present disclosure may have an adhesive layer on the surface side opposite to the wiring of the circuit board base material. By providing the adhesive layer, for example, the circuit board can be adhered to the base material for the elastic device. The adhesive layer may or may not have a bellows-shaped portion.

As the material of the adhesive layer, a general adhesive or an adhesive can be used. Examples of the adhesive include heat sealants, acrylic adhesives, epoxy adhesives, urethane adhesives and the like. Examples of the pressure-sensitive adhesive include an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive.

The thickness of the adhesive layer is, for example, 10 μm or more and 100 μm or less. Examples of the method for forming the adhesive layer include a method of applying an adhesive or an adhesive.

Further, in order to improve the adhesion between the base material for the elastic device and the adhesive layer, a primer layer may be arranged between the base material for the elastic device and the adhesive layer. The primer layer is appropriately selected depending on the material of the base material for the elastic device and the adhesive layer. Further, the primer layer may also have a function such as waterproofness.

(9) First Expansion / Contraction Control Unit The circuit board in the present disclosure is located on the first surface side of the circuit board base material, the second surface side of the circuit board base material, or inside the circuit board base material. It may have a plurality of first expansion / contraction control units arranged along the first direction. The first expansion / contraction control unit is preferably located so as to overlap at least a part of the wiring in a plan view.

8 (a) is a schematic plan view illustrating the circuit board in the present disclosure, and FIG. 8 (b) is a sectional view taken along the line AA of FIG. 8 (a). In FIGS. 8A and 8B, the circuit board 10 has a plurality of first expansion / contraction control units 91 arranged along the first direction D1 in which the peaks 51 and valleys 52 of the bellows-shaped portion 50 repeatedly appear. doing.

By providing the first expansion / contraction control unit, the period or amplitude of the bellows-shaped portion can be controlled. Therefore, it is possible to prevent the wiring from being locally significantly curved or bent. As a result, it is possible to prevent the wiring from being damaged.

The Young's modulus of the first expansion / contraction control unit may be larger than the Young's modulus of the substrate for the circuit board, and may be equal to or less than the Young's modulus of the substrate for the circuit board. An example of the material of the first expansion / contraction control unit is a metal material. Examples of the metal material include copper, aluminum, and stainless steel. On the other hand, as another example of the material of the first expansion / contraction control unit, styrene-based elastomer, acrylic-based elastomer, olefin-based elastomer, urethane-based elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, and polychloroprene are used. Can be mentioned. The thickness of the first expansion / contraction control unit is, for example, 1 μm or more and 100 μm or less.

(10) Second expansion / contraction control unit The circuit board in the present disclosure is located on the first surface side of the circuit board base material, the second surface side of the circuit board base material, or inside the circuit board base material. A second expansion / contraction control unit may be provided at a position overlapping the end portion of the functional member in a plan view. In FIGS. 8A and 8B, the circuit board 10 has a second expansion / contraction control unit 92 at a position overlapping the end portion of the functional member 4.

By providing the second expansion / contraction control unit, it is possible to prevent a large mountain portion from being generated in the wiring in the vicinity of the functional member. As a result, it is possible to prevent the electrical joint between the functional member and the wiring from being damaged. The Young's modulus, material, thickness, etc. of the second expansion / contraction control unit are the same as those of the first expansion / contraction control unit.

(11) Manufacturing Method of Circuit Board The circuit board in the present disclosure has elasticity. Such a method for manufacturing a circuit board includes, for example, an stretching step of stretching a stretchable circuit board base material and one surface side of the circuit board base material in a stretched state. A manufacturing method including a wiring arrangement step of arranging the wiring in the circuit board and a release step of removing the tensile stress of the substrate for the circuit board after the wiring arrangement step can be mentioned.

9 (a) to 9 (e) are process diagrams illustrating the method for manufacturing the circuit board in the present disclosure. First, as shown in FIG. 9A, a first laminated body having a circuit board base material 1 and an adhesive layer 9 is prepared. Next, as shown in FIG. 9B, a second laminated body having the support film 3, the wiring 2, and the functional member 4 is prepared. Next, as shown in FIG. 9C, the first laminated body (laminated body including the circuit board base material 1) is stretched. Next, as shown in FIG. 9D, the second laminated body (the laminated body including the wiring 2 and the functional member 4) is arranged on the first laminated body in a state where the first laminated body is extended. To do. Finally, as shown in FIG. 9E, the tensile stress of the circuit board base material 1 is removed. At this time, as the elastic circuit board base material 1 shrinks, the wiring 2, the support film 3, and the adhesive layer 9 are deformed to form a bellows-shaped portion. As a result, the circuit board 10 is obtained. When such a manufacturing method is used, the amplitudes and periods of the peaks and valleys constituting the bellows-shaped portion are not uniform but non-uniform.

3. 3. Stretchable device The stretchable device of the present disclosure is used, for example, by being worn or worn by a person. By wearing or wearing the stretchable device in an extended state, the stretchable device can be brought into close contact with the body. Therefore, a good wearing feeling can be realized. Further, since the stretchable device has elasticity, it can be worn or worn along a curved surface or a three-dimensional shape.

The form of the elastic device of the present disclosure includes, for example, gloves; legwear such as socks, stockings, panty stockings, tights, leggings, spats; wristbands; ankle supporters, knee supporters, waist supporters, shoulder supporters, arm supporters, etc. Elbow supporters, wrist supporters, finger supporters, thigh supporters, calf supporters, ankle covers, arm covers, leg covers, knee covers, elbow covers and other supporters; innerwear, sportswear, swimwear, tops, bottoms and other clothing; hats ; Hair band; etc.

Above all, the elastic device of the present disclosure preferably has a tubular portion and a portion for covering the wearer's joint. In such a form of elastic device, the elastic device tends to be stretched most especially when the elastic device is attached and detached. However, according to the present disclosure, it is possible to prevent the wiring of the circuit board from being broken when the elastic device is attached and detached. Is. Further, according to the present disclosure, when the elastic device is used, the wearer can easily move the joint, and when the wearer moves the joint, it is possible to prevent the wiring of the circuit board from being broken. It is possible. Further, according to the present disclosure, when the wearer moves the joint, the position of the functional member of the circuit board of the stretchable device with respect to the wearer can be maintained at a predetermined position, and accurate measurement becomes possible. ..

When the elastic device of the present disclosure has a portion for covering the wearer's joint, the movement of the joint is not particularly limited. The elastic devices of the present disclosure may have a portion for covering, for example, flexing and extending joints, adduction and abduction joints, internal and external rotation joints, supination and supination joints, and the like. .. The present disclosure is useful for such forms of stretchable devices. Above all, it is preferable that the stretchable device of the present disclosure has a bendable portion in which the deformation rate (stretch rate) of the stretchable device due to the movement of a joint is particularly large.

The form of the stretchable device of the present disclosure is particularly preferably gloves.

The present disclosure is not limited to the above embodiments. The above embodiment is an example, and any object having substantially the same structure as the technical idea described in the claims of the present disclosure and exhibiting the same effect and effect is the present invention. Included in the technical scope of the disclosure.

1 ... Circuit board base material 2 ... Wiring 3 ... Support film 4 ... Functional member 5 ... Protective layer 6 ... Adhesive layer 10 ... Circuit board 20 ... Stretchable device base material 21 ... First base material 22 ... Second Substrate 100 ... Elastic device

Claims (5)

A stretchable device in which a stretchable circuit board is arranged on one surface side of a base material for a stretchable device.
The circuit board has a base material for a circuit board, wiring, and a functional member electrically connected to the wiring.
The stretchable device base material has a first base material portion on which the circuit board is arranged and a second base material portion on which the circuit board is not arranged.
An elastic device in which the elasticity of the second base material portion is higher than the elasticity of the first base material portion. The first aspect of the circuit board, wherein the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along a first direction, which is one of the in-plane directions of the first surface of the circuit board base material. Elastic device. The stretchable device according to claim 1 or 2, wherein the base material for the stretchable device is a cloth. The invention according to any one of claims 1 to 3, wherein the first base material portion and the second base material portion are arranged so as to face each other with a part of the wearer's body interposed therebetween. Elastic device. The stretchable device according to any one of claims 1 to 4, which has a tubular portion and a portion for covering a wearer's joint.

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