JP2021056479A - Three-dimensional surface projection aligner - Google Patents

Abstract

To collectively project, expose, and transfer a pattern shape formed on the outer shape surface of an original drawing object having three-dimensional concavo-convex surfaces on the outer shape surface of an object to be exposed having the same shape.SOLUTION: In the three-dimensional surface projection aligner, two rotating parabolic mirrors using a surface on a concave side as a reflective surface faces each other; an opening is provided in the central part of each mirror surface so as to have the focus of each mirror surface in the vicinity of the center of the opening of the other mirror surface; an original drawing object put in the center of the opening of one rotating parabolic mirror is lighted; and a pattern image on the outer shape surface is formed on the outer shape surface of an object to be exposed put in the center of the opening of the other rotating parabolic mirror.SELECTED DRAWING: Figure 1

Description

In the present invention, the shape of the reflectance distribution pattern or the transmittance distribution pattern formed on the outer surface of the original drawing object having three-dimensional unevenness is formed, and the shape of the reflectance distribution pattern or the transmittance distribution pattern is formed. The present invention relates to a projection exposure apparatus that simultaneously projects and exposes and transfers an exposed object having three-dimensional irregularities having the same shape as the above.

Lithography technology is used as a fine pattern forming technology for semiconductor integrated circuits and microelectromechanical systems (MEMS).

Lithography technology transfers a pattern on an original drawing substrate such as a reticle onto an exposed substrate on which a photosensitive substance such as a resist is formed, or scans a laser beam and an exposed substrate relative to each other to obtain the photosensitive material. By a development process such as a wet process in which a part or all of the substance is exposed and then infiltrated into a developer after exposure, or a dry process in which gas processing is performed in a plasma, only the photosensitive part at the time of exposure is removed and the unexposed part remains. It is a technique capable of transferring the pattern shape on the original drawing substrate to the photosensitive substance by allowing the exposed portion or removing only the unexposed portion at the time of exposure to leave the photosensitive portion.

A laser beam is irradiated onto an exposed substrate on which a photosensitive substance such as a resist is formed, or a projected image of a laser spot formed by shaping a laser beam by a pinhole or the like is projected onto an exposed substrate on which a photosensitive substance such as a resist is formed. By making it on the top, the photosensitive material can be exposed, and the laser beam or the laser spot projection image is scanned relative to the exposed substrate on which the photosensitive material is formed to draw a pattern and draw a pattern. It is a technique that can also form a shape on the photosensitive material.

As an exposure method for transferring a pattern on an original drawing substrate onto an exposed substrate on which a photosensitive substance is formed, there are methods such as close contact exposure and close exposure, but a lens or a mirror is inserted between the original drawing substrate and the exposed substrate. The used projection optical system is placed, a projected image of the pattern on the original drawing substrate is created on the exposed substrate on which the photosensitive substance is formed, and the photosensitive substance on the exposed substrate is exposed according to the light-dark distribution of the projected image. The projection exposure lithography technology is currently the mainstream of mass production lithography technology.

In projection exposure lithography, the plane original drawing substrate is irradiated with illumination light, and a projection exposure optical system is used to create an optical image of a pattern on the plane original drawing substrate on a photosensitive material formed on the exposed substrate. The photosensitive substance is exposed to the pattern shape on the original plan substrate.

When the maximum incident half angle of the projection exposure light ray reaching the photosensitive substance is θ and the refractive index of the medium between the projection exposure optical system and the photosensitive substance is n, the numerical aperture NA of the projection exposure optical system is NA =. It is represented by nsinθ, and the resolution of the 1: 1 line-and-space pattern is represented by R = k ₁ λ / NA. Here, k ₁ is a constant determined by the thickness, material, direction of illumination, transmittance ratio and phase difference between the light-shielding pattern portion and the transmission pattern portion on the plan original drawing substrate, and k ₁ = 0. It is a value of .25 to 1.

Since the resolution limit R is inversely proportional to the numerical aperture NA, it is necessary to increase the numerical aperture NA as much as possible when it is desired to form a pattern as fine as possible.

Conventional projection exposure devices that want to form as fine a pattern as possible for manufacturing semiconductor integrated circuits and microelectromechanical systems are therefore designed to have as large a numerical aperture NA as possible.

However, since the depth of focus is inversely proportional to the square of the numerical aperture NA, increasing the numerical aperture NA makes the depth of focus significantly shallower.

Under these circumstances, conventional projection exposure equipment is made with the idea of transferring a pattern on a flat surface original drawing substrate as flat as possible onto a photosensitive substance formed on a substrate to be exposed as flat as possible, and is three-dimensional. The shape of the reflection pattern or transmission pattern of the original drawing object formed on the outer surface having various irregularities is the shape of the exposed object having three-dimensional irregularities having the same shape as the shape of the reflection pattern or transmission pattern. There was no idea of projection exposure transfer on the outer surface.

Further, in order to increase the numerical aperture NA, the aperture of the projection exposure optical system must be increased, and the projection exposure optical system is configured so that light rays passing diagonally through the aperture can pass through the projection exposure optical system. It is also necessary to increase the numerical aperture of the lens and mirror.

However, in order to increase the aperture of the lens or mirror so that a pattern image can be formed accurately, the surface accuracy is improved, and in order to correct aberrations, the number of surfaces is increased or an aspherical surface that is difficult to manufacture or design is used. It is necessary to do it. In addition, it is necessary to strictly control the temperature, humidity, atmospheric pressure, etc. of the usage environment.

Therefore, the price of the projection exposure optical system becomes very high, the size becomes large, the preparation, maintenance, and management of the equipment become extremely difficult, and the price of the exposure apparatus is extremely high.

Therefore, the use of lithography technology other than the needs that are in great demand to meet the price of the projection exposure optical system can be considered from various points such as the price of the exposure equipment, the scale of the equipment, the technical level required for maintenance, and management. It was very difficult.

On the other hand, even if the price of the device is ignored, the projection exposure device itself that forms a pattern on the outer surface having three-dimensional unevenness is not commercially available.

As a projection exposure device that forms a pattern on an outer surface with three-dimensional unevenness, the pattern on the plan original drawing substrate is limited to a portion that can be regarded as an almost flat portion of the ridgeline portion of the upper surface of a columnar or cylindrical object to be exposed. Then, it is projected and exposed, transferred to a photosensitive material formed on the exposed object, and the exposed object is intermittently rotated around its axis to project and expose the photosensitive material on the entire circumference of the exposed object. Patent Document 1 discloses a projection exposure apparatus for this purpose.

The pattern on the plane original drawing substrate is projected and exposed and transferred only to the portion of the ridgeline portion of the upper surface of the cylindrical or cylindrical object to be exposed that can be regarded as almost flat, and the plane original drawing substrate is transferred to the distance from the projection optical system. Is linearly moved at a constant speed in a direction perpendicular to the axis of the cylindrical or cylindrical object to be exposed, and the object to be exposed is continuously rotated around the axis in synchronization with the linear movement. It is also disclosed in Patent Document 1 that the entire circumference may be exposed.

However, in these devices that rotate a cylindrical or cylindrical object to be exposed around its axis to expose the entire circumference, it is an essential condition that the object to be exposed is an axially symmetric cylindrical or cylindrical object. When an attempt is made to project-expose an object other than an axially symmetric cylindrical or cylindrical object to be exposed, the height of the exposed position of the object to be exposed changes, and the projected exposure pattern cannot be clearly transferred.

In addition, when projecting and exposing an object other than an axisymmetric cylindrical or cylindrical object to be exposed, the movement distance with respect to a unit rotation angle changes according to the shape when the outer shape is rotated around the axis. Projection exposure cannot be performed under unified conditions.

On the other hand, as yet another projection exposure device that forms a pattern on an outer surface having three-dimensional unevenness, for a spot of laser light formed on a cylindrical or cylindrical object to be exposed by using a pinhole or the like. Non-Patent Document 1 discloses an apparatus for drawing a pattern on a photosensitive substance formed on an exposed object by scanning the cylindrical or cylindrical object to be exposed.
Patent No. 4572365 Japanese Journal of Applied Physics, Vol. 43, No. 6B, 2004, pp. 4031-4035

In recent years, there has been a need to use lithography for applications that are much larger than semiconductor integrated circuits and micro-electromechanical systems. Specifically, it is a flow path device having a minimum pattern size on the order of 10 to 100 μm, a microlens, a coil, a leaf spring, a stent, or the like.

For such large pattern lithography with a minimum pattern size of 10 to 100 μm, the number of patterns required is small, so an expensive exposure device cannot be used. Since it is used as a structure such as, it is necessary to use a photosensitive substance with a thick film thickness, and on an exposed object having a three-dimensional surface shape, specifically, a cylindrical surface, a shaft surface, an inclined surface, and unevenness. There is a feature that an exposure device for forming a pattern on an object to be exposed having a surface or the like is required.

However, the pattern on the original drawing object is sequentially projected and exposed onto the axially symmetric cylindrical or cylindrical object to be exposed, which is disclosed in Patent Document 1 and Non-Patent Document 1, and the spot of the laser beam is used. In a conventional exposure device that scans an axially symmetric cylindrical or cylindrical object to be exposed and draws a pattern, it is almost in the vicinity of the ridgeline of the axially symmetric cylindrical or cylindrical object to be exposed. Pattern formation in a narrow range that can be regarded as a flat surface is repeated, or pattern formation in the narrow range is continuously performed by synchronously scanning the original drawing object and the object to be exposed, or the axis with respect to the spot of the laser beam. By scanning a symmetrical cylindrical or cylindrical object to be exposed and drawing a pattern, a pattern is gradually formed in a desired exposed region. Then, it was not possible to simultaneously project and expose the pattern on the surface of the original drawing object having irregularities onto the outer surface of the object to be exposed at the same time and transfer it.

Therefore, it takes a long time to expose the photosensitive substance formed on the outer surface of the object to be exposed to a desired pattern shape.

Further, the photosensitive substance formed on the object to be exposed having an outer surface that is not axisymmetric could not be exposed to a desired pattern shape.

As disclosed in Patent Document 1, even in an exposed object having an axisymmetric outer surface, the exposure device can be attached to the exposed object by shifting the attachment of the exposed object to the exposed device with respect to the axis of symmetry of the exposed object. Even if the rotation axis is eccentric, it is not possible to expose the desired pattern shape with high accuracy.

Furthermore, if the outer shape of the original drawing object or the exposed object is not a simple convex or concave surface but an arbitrary three-dimensional surface with continuous unevenness, the pattern of the original drawing object should be faithfully projected and exposed on the exposed object and transferred. I couldn't.

The present invention has been made as a result of diligent studies in view of the above problems, and the shape of the reflection pattern or transmission pattern formed on the outer surface of the original drawing object having three-dimensional unevenness is changed to the reflection pattern or transmission. Provided is an apparatus for projection exposure transfer to an outer surface of an object to be exposed having three-dimensional unevenness having the same shape as the pattern formed.

In order to achieve the above object, the three-dimensional surface projection exposure apparatus of the present invention has a first rotating parabolic mirror having a concave surface as a reflecting surface and a second rotating parabolic mirror having the same reflecting surface shape with the concave surface as a reflecting surface. The parabolic mirror is arranged so that the axes of both rotating parabolic surfaces are overlapped so that both reflecting surfaces on the concave surface side face each other, and the central portion of the mirror surface of the first rotating parabolic mirror and the second An opening is provided in each of the central portions of the mirror surface of the rotating parabolic mirror, and the focus of the first rotating parabolic mirror is near the opening surface provided in the second rotating parabolic mirror, and the second rotating parabolic mirror is provided. The object mirror has a focal distance in which the focal point is near the opening surface provided in the first rotating parabolic mirror, and both focal points are the first rotating parabolic mirror and the second rotating parabolic mirror. The surface of the original drawing object placed in the opening of the first rotating parabolic mirror so as to be on the axis of the rotating surface of the surface mirror is obliquely inclined from the back surface side of the first rotating parabolic mirror. The image of the reflection pattern or transmission pattern of the three-dimensional surface of the original drawing object illuminated and placed in the opening of the first rotating parabolic mirror is placed in the opening of the second rotating parabolic mirror. By forming it on the three-dimensional surface of the object to be exposed with the same shape and dimensions as the three-dimensional surface on which the reflection pattern or transmission pattern of the above is formed, the covering has an image shape corresponding to the reflection pattern or transmission pattern of the three-dimensional surface on the original drawing substrate. It is characterized by exposing a three-dimensional surface of an exposed object.

According to the present invention, the shape of the reflection pattern or transmission pattern formed on the outer surface of the original drawing object having three-dimensional unevenness is three-dimensional with the same shape as the shape of the reflection pattern or transmission pattern is formed. It is possible to simultaneously perform simultaneous projection exposure and transfer to the outer surface of an object to be exposed having various irregularities.

A flat surface is also a special case of a curved surface, and as a matter of course, the shape of the reflectance distribution pattern or the transmittance distribution pattern formed on the flat surface portion of the outer shape of the original drawing object is projected and exposed to the flat surface portion of the outer shape of the object to be exposed. can do.

Since it is a projection exposure optical system that can project a three-dimensional surface onto a three-dimensional surface with a very deep focal depth, the shape of the reflectance distribution pattern or transmittance distribution pattern formed on a flat original drawing object is exposed to unevenness. The pattern is distorted on the object, but it can be projected and exposed without blurring.

On the contrary, the shape of the reflectance distribution pattern or the transmittance distribution pattern formed on the three-dimensional surface-shaped original drawing object can be projected and exposed and transferred to the planar exposed object without blurring although the pattern is distorted.

Since the projection exposure optical system has a very deep depth of focus, it is easy to use a resist having a thick film thickness, and a thick resist pattern can be formed.

In addition, since projection exposure can be performed with a very simple optical system consisting of only two rotating parabolic mirrors, it is much cheaper than a commercially available projection exposure device for forming fine patterns, and it is compact, lightweight, and simple. Stereoscopic projection exposure is possible with various devices.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.
(First Embodiment)
FIG. 1 is a cross-sectional view of a stereoscopic projection exposure apparatus according to a first embodiment of the present invention. In FIG. 1, the three-dimensional surface projection exposure apparatus includes a rotating parabolic mirror 1 having a concave rotating parabolic surface as a reflecting surface and a rotating parabolic mirror 2 having the same dimensions, shape, and reflecting surface. It has a structure in which the axes of rotating parabolic mirrors are overlapped and opposed to each other. The space surrounded by the two rotating parabolic mirrors 1 and 2 has a structure in which a rotating parabolic reflector is provided on the entire surface.

The focal point 3 of the rotating parabolic mirror 1 is located slightly inside the apex of the parabolic mirror surface of the rotating parabolic mirror 2, and the focal point 4 of the rotating parabolic mirror 2 is the firing of the rotating parabolic mirror 1. It is configured so that it is slightly inside the apex of the parabolic surface. Since the opening 5 and the opening 6 described later are provided in FIG. 1, the apex of the parabolic mirror surface of the rotating parabolic mirror 1 and the rotating parabolic mirror 2 is cut off by the opening 5 and the opening 6. There is.

An opening 5 is provided in the central portion of the rotating parabolic mirror 1 near the focal point 4 of the rotating parabolic mirror 2, and the focal point 3 of the rotating parabolic mirror 1 is provided in the central portion of the rotating parabolic mirror 2. An opening 6 is provided near the position of. The shape and dimensions of the opening 5 of the rotating parabolic mirror 1 and the opening 6 of the rotating parabolic mirror 2 are arbitrary, and the opening 5 and the opening 6 may have the same shape and dimensions, or may be different.

When the rotating parabolic mirror 1 and the rotating parabolic mirror 2 are assembled as shown in FIG. 1, they rotate out of the focal point 4 of the rotating parabolic mirror 2 in the opening 5 at the center of the rotating parabolic mirror 1. Since the arbitrary light beam 7 that hits the parabolic mirror 2 is a light beam emitted from the focal point, after being reflected by the rotating parabolic mirror 2, it travels parallel to the optical axis and hits the rotating parabolic mirror 1. Since this light ray is also parallel to the optical axis of the rotating parabolic mirror 1, it goes to the focal point 3 of the rotating parabolic mirror 1 in the opening 6 of the rotating parabolic mirror 2.

Since the light ray 7 described above is an arbitrary light ray, the light ray that comes out of the focal point 4 of the rotating parabolic mirror 2 in the opening 5 at the center of the rotating parabolic mirror 1 and hits the rotating parabolic mirror 2. All go to the focal point 3 of the rotating parabolic mirror 1 in the opening 6 at the center of the rotating parabolic mirror 2. That is, the focal point 4 of the rotating parabolic mirror 2 and the focal point 3 of the rotating parabolic mirror 1 are optically conjugated.

Therefore, if an object is placed in the opening 5 at the center of the rotating parabolic mirror 1, the image is formed in the opening 6 at the center of the rotating parabolic mirror 2.

In FIG. 1, a light beam 7 emitted in the upper right direction from the focal point 4 of the rotating parabolic mirror 2 in the opening 5 in the center of the rotating parabolic mirror 1 is inside the opening 6 in the center of the rotating parabolic mirror 2. As can be seen from the fact that the focal point 3 of the rotating parabolic mirror 1 is reached in the upper left direction, the direction of the image remains upright because the direction of the light beam is the same as the emitted light in the vertical direction. Since the direction of the light beam is opposite to that of the emitted light, the direction is reversed. Since FIG. 1 is a cross-sectional view in the left-right direction, it cannot be understood from the figure alone, but the orientation of the image is reversed with respect to the front and the depth.

In the projection optical system of the three-dimensional surface projection exposure apparatus of the present invention shown in FIG. 1, the light rays emitted from the focal point 4 of the rotating parabolic mirror 2 and forming an image at the focal point 3 of the rotating parabolic mirror 1 are the light rays 7. A ray emitted from the focal point 4 in the upper right direction advances in the upper left direction to reach the focal point 3, while a ray emitted from the focal point 4 in the upper left direction advances in the upper right direction and reaches the focal point 3, as in the ray 8. .. That is, the image is formed only by the oblique light rays from all directions, and the image is formed by the interference of two luminous fluxes from both sides when considering the inside of an arbitrary plane including the vertical axis.

Moreover, the light rays reaching the focal point 3 diagonally from all directions are symmetrical in the left-right, front, and depth directions, and the inclination of the light rays from the optical axis is large, so that the depth of focus of the image formation in the vertical direction becomes very large.

Therefore, if the original drawing object 9 is placed near the focal point 4, a stereoscopic image thereof is formed near the focal point 3. Therefore, the object to be exposed 10 is placed at the position where the three-dimensional image is formed in consideration of the direction in which the image shown above is formed, and the original drawing object 9 having the three-dimensional unevenness is arbitrarily illuminated and its outer shape. If the shape of the reflection pattern or the transmittance pattern formed on the surface is projected onto the outer surface of the object 10 to be exposed having the same three-dimensional unevenness to form an image, the reflectance distribution pattern or the transmittance distribution pattern is formed. The shape of the above can be exposed and transferred onto the outer surface of the object to be exposed 10.

FIG. 1 shows an image 12 of the reflection pattern by projecting the reflection pattern 11 as the original drawing formed on the convex outer surface of the upper surface of the original drawing object 9 onto the exposed object 10 having the concave outer surface of the same shape. The case of making is drawn as an example.

If the photosensitive substance is formed on the imaging surface of the object to be exposed 10, the photosensitive substance is exposed in accordance with the brightness of the image 12 of the reflection pattern formed on the outer surface of the projected original drawing object 9. Then, when developed, the pattern of the photosensitive substance can be transferred to the three-dimensional surface of the object to be exposed 10.

The following is an experiment demonstrating that stereoscopic projection exposure is possible. A ring illumination light source 14 in which a large number of light emitting diodes 13 are arranged as a light source is placed below the rotating parabolic mirror 1, and the focal point 4 of the rotating parabolic mirror 2 in the opening 5 at the center of the rotating parabolic mirror 1. In the vicinity, a frog-shaped plastic object with yellow and red stripes as the original drawing object 9 is supported and installed on the original drawing object support base 15 created by combining bolts and nuts, and light is emitted from the ring illumination light source 14. Illuminated from diagonally below by the diode 13.

As the light source, a ring illumination light source 14 in which a large number of light emitting diodes 13 are arranged is used, but the light source such as a lamp light source or a laser light source is arbitrary, and the reflected light from the reflection pattern 11 of the original drawing object 9 by the illumination light is rotationally released. As long as it is a light source that can uniformly illuminate the reflection pattern 11 of the original drawing object 9 so as to hit the object mirror 2, and includes a wavelength to which the photosensitive substance formed on the exposed surface of the exposed object 10 is exposed. Good.

The outer diameters of the rotating parabolic mirror 1 and the rotating parabolic mirror 2 are about 150 mm, the openings 5 and 6 are circular with a diameter of about 40 mm, and the heights of the rotating parabolic mirror 1 and the rotating parabolic mirror 2 are each. It was about 25 mm so that the focal point 3 and the focal point 4 were centered on the aperture 6 and the aperture 5.

A projection optical system consisting of a rotating parabolic mirror 1, a rotating parabolic mirror 2, an original object support base 13, an original object 9, and a ring illumination light source 12 is placed in a black plastic bag to block external light, and then rotated. FIG. 2 shows a photograph of an optical image of the original drawing object 9 formed at the position of the light source 3 of the rotating parabolic mirror 1 in the opening 6 at the center of the object mirror 2.

It can be seen that the image of the frog-shaped plastic object is clearly formed. Therefore, if a photosensitive substance is formed on an object having a dent of the same shape on the lower surface as the object to be exposed 10, the lower surface thereof can be exposed to light and dark corresponding to the pattern on the surface of the frog-shaped plastic object. it can.

The exposed object 10 is a thin exposed object 10 made of a substance that has the same surface shape and dimensions as the original drawing object 9 and transmits an exposed light beam, and a photosensitive substance is formed on the upper surface of the exposed object 10 instead of the lower surface. For example, the photosensitive substance formed on the upper surface of the object to be exposed 10 may be exposed according to the reflection pattern formed on the outer surface of the original drawing object 9 by the imaging light transmitted through the object 10 to be exposed from below. it can.

When a thin object to be exposed 10 made of a substance that transmits an exposed light beam is used, the thickness and material of the object to be exposed 10 do not necessarily have to be the same as that of the original drawing object 9. The surface shape and dimensions of the surface to be imaged on the object to be exposed 10 need only be the same as the reflection pattern surface of the original object 9.

In order to place the object to be exposed 10 near the focal point 3 of the rotating parabolic mirror 1 in the opening 6 at the center of the rotating parabolic mirror 2, a holding mechanism is required, and an image formation coming from an oblique direction below is required. It is necessary not to obstruct the optical path of light.

As shown in FIG. 1, when a photosensitive substance is formed on the lower surface side of the exposed object 10 and an image of the outer surface of the original drawing object 9 is formed on the lower surface, the upper surface side of the exposed object 10 is the exposed object. It may be held by the holder 16.

Further, when the object to be exposed 10 is an object made of a substance that transmits a thin exposed light beam, a photosensitive substance is formed on the upper surface side of the transmitted object, and an image of the outer surface of the original drawing object 9 is formed on the upper surface surface, the lower surface is formed. The side surface side of the object to be exposed 10 may be held by the object holder 16 so as not to obstruct the optical path of the imaging light coming from the oblique direction. When it is unavoidable to hold the lower surface side of the object to be exposed 10, the area of the holding portion that obstructs the optical path is reduced as much as possible so as not to obstruct the optical path of the imaging light coming from the diagonally downward direction.

Adjust the position and / or the position and / or orientation by moving the object holder 16 back and forth, left and right, up and down, and / or adjust the rotation angle around the front and back, left and right, and up and down axes. It is even more preferable to attach a stage to be exposed, or a stage 17 for adjusting the position and orientation of the object to be exposed, which is a part of those stages, as needed. Reference numeral 18 denotes a connecting component for attaching the exposed object holder 16 to the exposed object position / orientation adjusting stage 17.

When the exposed object position / orientation adjustment stage 17 is attached, the exposed object 10 may be directly attached to the exposed object position / orientation adjustment stage 17 without using the exposed object holder 16 or the connecting component 18. ..

On the other hand, with respect to the original drawing object 9, the stage for adjusting the front-back, left-right, up-down position and / or front-back, left-right, up-down so that the original drawing object support 15 can be moved back and forth, left, right, up and down to adjust the position and / or orientation. It is even more preferable to attach a stage for adjusting the rotation angle around the axis, or an original drawing object position / orientation adjustment stage 19 including a part of those stages, if necessary.

When the original drawing object position / orientation adjustment stage 19 is attached, the original drawing object 9 may be directly attached to the original drawing object position / orientation adjustment stage 19 without using the original drawing object support base 15.

In addition, in order to combine the above equipment into one to form a three-dimensional projection exposure device, it is necessary to attach each part to the base 20 and set it at a predetermined position and height. The support base 21 is a support base for attaching the ring illumination light source 14 to the base 20, and the support base 22 is a support base for attaching the exposed object position / orientation adjustment stage 17 to the base 20.

In FIG. 1, the rotating parabolic mirror 1 and the rotating parabolic mirror 2 are installed on the ring illumination light source 14, but the rotating parabolic mirror 1 and the rotating parabolic mirror 2 are separately used as a base. A structure may be provided in which a support base is provided to support and attach to 20.

By the way, in the above description, a bright and dark image corresponding to the reflection pattern 11 on the convex outer surface of the original drawing object 9 is formed on the object to be exposed 10 and projected and exposed. However, the original drawing object 9 is made of a substance that transmits a thin exposure light beam, and a transmission pattern is formed on either surface or both surfaces by a light-shielding substance, and the original drawing object 9'is the same as in the case of FIG. Similarly, it is clear that the shape of the transmission pattern of the original drawing object 9'can be projected and exposed on the object to be exposed 10 by illuminating from diagonally downward.

FIG. 3 shows a projection exposure apparatus using an original drawing object 9'in which the original drawing object 9'is thinly made of a substance that transmits an exposure ray and a pattern is formed on either surface or both surfaces by a light-shielding substance. This is an example.

In the embodiment of FIG. 1, the exposed object 10 is a thin exposed object 10 having the same surface shape and dimensions as the original drawing object 9 made of a substance that transmits an exposed light beam, and is not on the lower surface but on the upper surface of the exposed object 10. When a photosensitive substance is formed, the imaging light transmitted from below through the object to be exposed 10 reflects the photosensitive substance formed on the upper surface of the object to be exposed 10 on the outer surface of the original drawing object 9. It was stated that it is possible to expose according to the pattern.

In the embodiment shown in FIG. 3, the original drawing object 9'is made thin with a substance that transmits an exposure ray, and the original drawing object 9'that has a transmission pattern 23 formed on either surface or both surfaces by a light-shielding substance is used.

Then, the exposed object 10'is a thin exposed object 10'having the same surface shape and dimensions as the original drawing object 9', and a photosensitive substance is formed on the upper surface of the exposed object 10'rather than the lower surface. If the image 24 of the transmission pattern 23 of the original drawing object 9'is formed on the photosensitive substance formed on the upper surface of the object to be exposed 10' by the imaging light transmitted from below to the object to be exposed 10', the photosensitive material is exposed to light. The sex substance can be exposed according to the transmission pattern 23 formed on the outer surface of the original drawing object 9'.

The thickness and material of the object to be exposed 10'do not necessarily have to be the same as that of the original object 9'. It is only necessary that the surface shape and dimensions of the surface to be imaged on the object to be exposed 10'are the same as the transmission pattern surface of the original object 9'.

The original drawing object 9'is an object having a concave outer surface, and the exposed object 10'is also an object having a concave outer surface, and the image 24 of the transmission pattern 23 of the original drawing object 9'is the concave outer shape of the exposed object 10'. It may be made on a photosensitive material formed on the lower surface.

When the photosensitive substance is exposed and developed corresponding to the brightness and darkness of the image 24 of the transmission pattern formed on the outer surface of the projected original drawing object 9', the exposed object 10'on the concave outer outer surface of the object 10'. Can be transferred as a pattern of photosensitive substances.

Since no obstacle can be placed near the original object 9'and the exposed object 10'to prevent the passage of light rays, the original object 9'and the exposed object 10'are, for example, from the side surface, the original object support 25 and the original object support 25. It is held by the object holder 26 to be exposed.

When the original drawing object 9'and / or the exposed object 10'is unavoidably held in the part that enters the optical path, a method such as reducing the area of the holding portion is used so as not to obstruct the optical path of the illumination light or the imaging light as much as possible. Hold.

In FIG. 1, the original drawing object position / orientation adjustment stage 19 is directly attached to the base 20, but in FIG. 3, it is attached to the base 20 via the original drawing object position / orientation adjustment stage support base 27. The support method of the object to be exposed object position / orientation adjustment stage 17 to the base 20, the original drawing object position / orientation adjustment stage 19, the original drawing object 9', the exposed object 10', the illumination light source 14, and the like may be arbitrary.

In the embodiment shown in FIG. 3, the transmission pattern can be illuminated from below not only by the original drawing object 9'that is convex upward but also by the original drawing object 9'that is convex downward, that is, the upper surface is recessed. Therefore, if the convex object to be exposed 10'is placed with the pattern projection surface facing down, projection exposure is possible.

Therefore, for example, if a semi-cylindrical reticle having a transmission pattern and being convex downward, that is, having a concave upper surface is used as the original drawing object 9', the outer surface of a cylindrical or cylindrical exposed object 30 having an outer surface having the same radius. A little less than half can be projected and exposed at the same time.

Further, in the embodiment shown in FIGS. 1 and 3, the reflection pattern surface and the transmission pattern surface of the original drawing object 9'and the pattern projection surface of the object to be exposed 10'have been described as simple convex surfaces and concave surfaces. Any three-dimensional surface having continuous irregularities may be used as long as the illumination rays can be illuminated almost evenly and can be projected.

Needless to say, the original drawing object 9'and the exposed object 10'may be flat objects. Therefore, for example, the original drawing object 9'is a reticle in which a light-shielding pattern is formed on quartz, glass, film, etc., and the exposed object 10'is a silicon wafer, a metal plate, a plastic plate, etc. If a photosensitive substance is formed and used, it can also be used as a normal projection exposure device.

In the above description, it is assumed that the original drawing object 9 or 9'is placed below and illuminated from below to expose the exposed object 10 or 10'placed above. However, if the original drawing objects 9 and 9'are maintained in relative positional relationship with respect to the object to be exposed 10 or 10', the projection optical system including the rotating parabolic mirror 1 and the rotating parabolic mirror 2 is an apparatus. The whole may be installed in any orientation.

That is, for example, the original drawing object 9 or 9'may be illuminated from above and the exposed object 10 or 10'placed below may be exposed.

Further, the optical axis of the projection optical system including the rotating parabolic mirror 1 and the rotating parabolic mirror 2 may be in the horizontal direction or the oblique direction instead of the vertical direction.

According to the present invention, it is possible to form a resist pattern with a constant pattern on the surface of a three-dimensional micro component at low cost, easily and at a high processing speed. Then, if the surface of the object to be exposed is etched using the resist pattern as a masking material, a groove pattern, a dot array, or the like can be manufactured with high accuracy.

Therefore, it is very useful for mass production of oil grooves, static pressure pockets, herringbone grooves of air bearings, etc. of semi-cylindrical concave bearings.

It is also useful for grooving and hole drilling in semi-cylindrical concave parts for retrofitting surgical tools, sensors, etc. to the outside of the tip of the endoscope.

Since it is attached to the curved surface of a fingertip or a part of the body, it is also useful for processing wiring patterns and electrode patterns for manufacturing sensors and bio parts that need to be curved substrates.

Further, a film of a photosensitive substance is formed on the front surface and / or the back surface of the coin whose prototype is manufactured by casting or plastic working, and a complicated fine shape is projected and exposed on the patterned portion forming the curved surface of the coin, and the coin is developed after the projection exposure. By etching the front surface and / or the back surface of the coin using the pattern of the photosensitive substance formed in the above process as a masking material, it is possible to engrave a fine shape that is difficult to imitate on the coin, which is very useful for preventing the coin from being counterfeited.

Further, a film of a photosensitive material is formed on a solid or hollow conical surface, a conical base surface, or an object to be exposed in which one of them is distorted or partially dented, and a cam groove shape having a predetermined width is formed. Is projected and exposed, and the pattern of the photosensitive substance formed by development after the projection exposure is used as a masking material, and the solid or hollow conical surface, the conical base surface, or any one of them is distorted or partially dented. By etching a loose object to be exposed, it is possible to produce a non-linear cam having a guide groove on a conical surface, a conical base surface, or a three-dimensional surface in which one of them is distorted or partially recessed. ..

Stereoscopic projection exposure apparatus according to the first embodiment of the present invention Photograph of experimental results showing that stereoscopic projection exposure according to the first embodiment of the present invention is possible. A stereoscopic projection exposure apparatus having another configuration according to the first embodiment of the present invention.

1 Rotating parabolic mirror 2 Rotating parabolic mirror 3 Focus of rotating parabolic mirror 1 Focus of rotating parabolic mirror 2 5 Opening 6 Opening 7 Ray 8 Ray 9 Original drawing object 9'Original drawing object 10 Exposed object 10 'Exposure object 11 Reflection pattern 12 Reflection pattern image 13 Light emitting diode 14 Ring illumination light source 15 Original drawing Object support stand 16 Exposed object holder 17 Exposed object position and orientation adjustment stage 19 Original drawing Object position and orientation adjustment stage 20 Base 23 Transmission Pattern 24 Transmission pattern image 25 Original drawing Object support 26 Exposed object holder

Claims (1)

The first rotating parabolic mirror having the concave side as the reflecting surface and the second rotating parabolic mirror having the same reflecting surface shape with the concave side as the reflecting surface are opposed to each other by both reflecting surfaces on the concave side. As described above, the axes of both rotating parabolic surfaces are arranged so as to overlap each other, and openings are provided in each of the central portion of the mirror surface of the first rotating parabolic mirror and the central portion of the mirror surface of the second rotating parabolic mirror. The first rotating parabolic mirror has its focus near the opening surface provided in the second rotating parabolic mirror, and the second rotating parabolic mirror has its focus provided in the first rotating parabolic mirror. A first rotating parabolic mirror having a focal distance close to the opening surface and having both focal points on the axes of the rotating surfaces of the first rotating parabolic mirror and the second rotating parabolic mirror. The surface of the original drawing object placed in the opening of the rotating parabolic mirror is illuminated diagonally from the back surface side of the first rotating parabolic mirror, and placed in the opening of the first rotating parabolic mirror. The image of the reflection pattern or transmission pattern on the three-dimensional surface of the original drawing object is placed in the opening of the second rotating parabolic mirror and has the same shape and dimensions as the three-dimensional surface on which the reflection pattern or transmission pattern of the original drawing object is formed. By forming on the three-dimensional surface of the object to be exposed, the three-dimensional surface of the object to be exposed is exposed to an image shape corresponding to the reflection pattern or the transmission pattern of the three-dimensional surface on the original drawing substrate. apparatus

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