JP2021050319A - Adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape having excellent heat resistance and excellent expandability even after undergoing a heating step.
SOLUTION: A base material 10 and an adhesive layer 20 arranged on one side of the base material are provided, and the tensile shear adhesive strength after stage heating and sticking at 150 ° C. for 30 minutes is 0.05 N /. Adhesive tape 100 having a stress of 20 mm or less and a stress of 15 N or less at 10% elongation.
[Selection diagram] Fig. 1

Description

The present invention relates to an adhesive tape. More specifically, the present invention relates to an adhesive tape suitable for a processing process of a semiconductor wafer.

A work (for example, a semiconductor wafer), which is an assembly of electronic components, is manufactured with a large diameter, and after forming a pattern on the front surface, the back surface is usually ground so that the thickness of the wafer is about 100 μm to 600 μm, and then the back surface is ground. It is cut and separated (diced) into small element pieces, and then transferred to the mounting process. In this dicing process, the work is cut into small pieces. In the semiconductor manufacturing process, an adhesive sheet is used to fix a semiconductor wafer or a dicing frame (for example, a SUS ring) used in the dicing process (for example, Patent Document 1).

Adhesive tapes used in the processing process of semiconductor wafers are required to have characteristics according to the process. For example, the adhesive tape used in the dicing step is required to have the property of not producing cutting chips during the dicing step, the pick-up property of the chip after the dicing step, the expandability in the expanding step, and the like. Further, the semiconductor wafer processing process may include a heating process before and after the dicing process. In this heating step, the semiconductor wafer is subjected to the heating step in a state where the adhesive tape is attached. The adhesive tape preferably used in the dicing process as described above has room for improvement in heat resistance. Therefore, when a heating step is included, a step of replacing the pressure-sensitive adhesive sheet to be attached to the semiconductor wafer is required.

Japanese Unexamined Patent Publication No. 2003-007646 Japanese Unexamined Patent Publication No. 2014-37458

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide an adhesive tape having excellent heat resistance and excellent expandability even after undergoing a heating step.

The adhesive tape of the present invention includes a base material and an adhesive layer arranged on one side of the base material. This adhesive tape has a tensile shear adhesive strength of 0.05 N / 20 mm or less after being stage-heated and attached at 150 ° C. for 30 minutes, and a stress at 10% elongation is 15 N or less.
In one embodiment, the adhesive tape has a breaking elongation of 300% or more.
In one embodiment, the shrinkage rate of the adhesive tape after heating at 150 ° C. for 30 minutes is 1.0% or less.
In one embodiment, the initial elastic modulus of the adhesive tape is 500 MPa or less.
In one embodiment, the substrate comprises an aliphatic polyester resin.
In one embodiment, the coefficient of linear expansion of the adhesive tape at 100 ° C. to 150 ° C. is 1000 ppm / ° C. or less.
In one embodiment, the melting start point of the substrate exceeds 150 ° C.
In one embodiment, the adhesive tape is used in the semiconductor wafer processing process.
In one embodiment, the semiconductor wafer processing step includes a heating step and an expanding step.
In one embodiment, the adhesive tape is used as a dicing tape.

The adhesive tape of the present invention includes a base material and an adhesive layer arranged on one side of the base material. This adhesive tape has a tensile shear adhesive strength of 0.05 N / 20 mm or less after being stage-heated and attached at 150 ° C. for 30 minutes, and a stress at 10% elongation is 15 N or less. The adhesive tape of the present invention has excellent heat resistance. Therefore, even when the adhesive tape is used in a manufacturing process including a heating process, the adhesive tape reattachment process becomes unnecessary. Further, the adhesive tape of the present invention can be suitably used in the semiconductor wafer processing process in the same manner as the conventional adhesive tape for semiconductor wafer processing. Specifically, the adhesive tape of the present invention has excellent expandability. Furthermore, excellent expandability (elongation in the plane direction) can be maintained even after undergoing a heating step. Therefore, even when applied to an expanding process in which the adhesive tape is expanded in the plane direction, the adhesive tape does not break and it is possible to satisfactorily pick up a small piece of work (for example, a semiconductor chip) after dicing. it can. As a result, the productivity of the semiconductor wafer can be improved.

It is the schematic sectional drawing of the adhesive tape by one Embodiment of this invention.

A. Outline of Adhesive Tape FIG. 1 is a schematic cross-sectional view of an adhesive tape according to one embodiment of the present invention. The pressure-sensitive adhesive tape 100 of the illustrated example includes a base material 10 and a pressure-sensitive adhesive layer 20 arranged on one surface of the base material 10. The pressure-sensitive adhesive layer is typically formed of an active energy ray-curable pressure-sensitive adhesive composition. Practically, in order to appropriately protect the pressure-sensitive adhesive layer 20 until use, a separator is temporarily attached to the pressure-sensitive adhesive layer 20 so as to be peelable. The adhesive tape 100 may further include any other suitable layer. Preferably, the pressure-sensitive adhesive layer is placed directly on the substrate.

In another embodiment of the present invention, the pressure-sensitive adhesive layer has a two-layer structure, and the pressure-sensitive adhesive tape includes a base material, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order (not shown). ..

The adhesive tape has a tensile shear adhesive strength of 0.05 N / 20 mm or less after being stage-heated and attached at 150 ° C. for 30 minutes (hereinafter, also referred to as stage-heated application), preferably 0.02 N /. It is 20 mm or less, more preferably the measurement limit value or less. Since the tensile shear adhesive strength after the stage heating and sticking is 0.05 N / 20 mm or less, the adhesive tape melted in the heating step even after the heating step, more specifically, the melted base material is used. Can prevent stage contamination. Further, the weaker the adhesive strength of the adhesive tape after stage heating and sticking is, the more preferable it is, and the adhesive strength may be equal to or less than the measurement limit value (substantially no tensile shear adhesive strength). Therefore, depending on the embodiment, it may not be possible to measure the tensile shear adhesive strength itself after the adhesive tape is applied by stage heating. As the adhesive tape of the present invention, a tape whose adhesive strength after heating the stage cannot be measured can also be preferably used. In the present specification, the tensile shear adhesive strength after stage heating and pasting at 150 ° C. for 30 minutes means the tensile shear adhesive strength measured by the method described in Examples described later.

The stress at 10% elongation of the adhesive tape is 15 N or less, preferably 10 N or less, more preferably 8 N or less, and further preferably 5 N or less. When the stress at 10% elongation is within the above range, an adhesive tape having good expandability can be obtained. Therefore, for example, even when it is used in a method for manufacturing a semiconductor wafer including an expanding step of stretching in the plane direction, it can be satisfactorily expanded in the plane direction (MD direction and TD direction), and dicing is performed in the subsequent pick-up step. The semiconductor wafer can be efficiently picked up. The stress at 10% elongation is preferably 4N or more. In the present specification, the stress at 10% elongation means the stress measured by the method described in Examples described later.

The breaking elongation of the adhesive tape is preferably 300% or more, more preferably 400% or more, and further preferably 450% or more. The breaking elongation of the adhesive tape is preferably 1000% or less. When the elongation at break is in the above range, the adhesive tape can be suitably used in the manufacturing process of the semiconductor wafer including the expanding step. The breaking elongation of the adhesive tape can be measured by any suitable method. In one embodiment, the adhesive tape has the above elongation at break in the TD and MD directions. Having the above-mentioned breaking elongation in the TD direction and the MD direction, it can be suitably used in a method for manufacturing a semiconductor wafer including an expanding step.

The shrinkage rate of the adhesive tape after heating at 150 ° C. for 30 minutes is preferably 1.5% or less, more preferably 1.0% or less, still more preferably −0.5% to 1.0%. Yes, particularly preferably −0.2% to 0.7%, and most preferably 0% to 0.5%. Since the shrinkage rate after heating at 150 ° C. for 30 minutes is within the above range, it can be suitably used in a method for manufacturing a semiconductor wafer including a heating step. In the present specification, the shrinkage rate after heating at 150 ° C. for 30 minutes can be measured by the method described in Examples described later. In the present specification, when the shrinkage rate is − (minus), it means that the shrinkage rate is larger (stretched) than the initial value after heating, and when the shrinkage rate is + (plus), it means that the shrinkage rate is higher than the initial value after heating. Also means that it has become smaller (shrinked).

The initial elastic modulus of the adhesive tape is preferably 500 MPa or less, more preferably 300 MPa or less, and further preferably 200 MPa or less. When the initial elastic modulus is in the above range, it can be suitably used as an adhesive tape used in the semiconductor wafer processing process. The initial elastic modulus of the adhesive tape is preferably 50 MPa or more. The initial elastic modulus of the adhesive tape can be measured by any suitable method.

The coefficient of linear expansion of the adhesive tape at 100 ° C. to 150 ° C. is preferably 1000 ppm / ° C. or lower, more preferably 950 ppm / ° C. or lower, and further preferably 600 ppm / ° C. or lower. When the coefficient of linear expansion at 100 ° C. to 150 ° C. is in the above range, it is possible to prevent the occurrence of wrinkles on the base material subjected to the heating step and the occurrence of strain on the adhesive tape subjected to the heating step. The coefficient of linear expansion of the adhesive tape at 100 ° C. to 150 ° C. is, for example, 300 ppm / ° C. or higher. The coefficient of linear expansion of the adhesive tape can be analyzed by thermomechanical analysis (TMA). Specifically, it can be analyzed by the following method. The obtained sample is set in a thermomechanical analyzer (manufactured by TA Instruments, product name: TMA Q-400) with a width of 3 mm and a distance between chucks of 16.05 mm. The temperature is raised from 25 ° C. to 160 ° C. under the condition of 10 ° C./min under the condition of a load of 1.96 mN under a nitrogen atmosphere. In the present specification, the displacement amount of the sample thickness due to linear expansion is measured, and the value obtained from the sample displacement amount of 100 ° C. to 150 ° C. is used as the linear expansion coefficient of the base material.

The thickness of the adhesive tape can be set to any suitable range. It is preferably 50 μm to 300 μm, and more preferably 55 μm to 250 μm.

B. Base material Base material 10 may be composed of any suitable resin. As the resin, a resin having a tensile shear adhesive strength of 0.05 N / 20 mm or less after stage heating and sticking of the obtained adhesive tape and a stress of 15 N or less at 10% elongation can be used. Specifically, an aliphatic polyester resin or the like can be used. Preferably, a polyester resin obtained by dehydrating and condensing an aliphatic polyvalent carboxylic acid and an aliphatic polyhydric alcohol, more preferably obtained by dehydrating and condensing an alicyclic polyvalent carboxylic acid and an alicyclic polyhydric alcohol. Examples include polyester resins.

As the aliphatic polyester resin, for example, an esterified product of an alicyclic dicarboxylic acid and an alicyclic diol can be preferably used. As the alicyclic dicarboxylic acid, a derivative such as an alkyl ester may be used. Specific examples thereof include esterified products of dimethyl 1,4-cyclohexanedicarboxylic acid and 1,4-cyclohexanedimethanol.

In one embodiment, the aliphatic polyester resin is a polyester resin obtained by polymerizing an alicyclic dicarboxylic acid and a dimer acid as a dicarboxylic acid component and an alicyclic diol as a diol component, respectively. .. The heat resistance can be further improved by further containing the dimer acid. In this embodiment, the content ratio of the alicyclic dicarboxylic acid in the dicarboxylic acid component is preferably 75 mol% to 98 mol%, and more preferably 80 mol% to 90 mol% in the total dicarboxylic acid component. The content ratio of dimer acid in the dicarboxylic acid component is preferably 2 mol% to 25 mol%, more preferably 10 mol% to 20 mol%.

The alicyclic dicarboxylic acid has an alicyclic structure such as a monocyclic cycloalkane such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, and a bicyclic alkane such as decahydronaphthalene (decalin), and two carboxyl groups. It is a compound. Examples of the alicyclic dicarboxylic acid include 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,4-decahydronaphthalenedicarboxylic acid, and 1,5-decahydro. Examples thereof include naphthalenedicarboxylic acid, 2,6-decahydronaphthalenedicarboxylic acid, and 2,7-decahydronaphthalenedicarboxylic acid. Preferably, 1,4-cyclohexanedicarboxylic acid is used.

The alicyclic dicarboxylic acid may be an unsubstituted compound or a derivative such as an alkyl ester of the alicyclic dicarboxylic acid. Examples of the alkyl ester derivative include alkyl esters having 1 to 10 carbon atoms such as dimethyl ester and diethyl ester. Preferably, it is a dimethyl ester.

Dimeric acid is a dicarboxylic acid compound obtained by dimerizing unsaturated fatty acids having 10 to 30 carbon atoms, and is, for example, unsaturated fatty acids having 18 carbon atoms such as oleic acid and linoleic acid, and erucic acid and the like. It is a dicarboxylic acid dicarboxylic acid having 36 or 44 carbon atoms obtained by dimerizing 22 unsaturated fatty acids, or an ester-forming derivative thereof. Further, hydrogenated dimer acid in which the unsaturated double bond remaining after dimerization is saturated by hydrogenation may be used. By using the hydrogenated dimer acid, reaction stability, flexibility, impact resistance and the like can be improved. Dimer acid is usually obtained as a mixture of a linear branched structure compound, a compound having an alicyclic structure, and the like, and the content of these is different depending on the production process, but the content of these is not particularly limited.

Further, a dicarboxylic acid component other than the alicyclic dicarboxylic acid and the dimer acid may be further contained. For example, aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, and succinic acid, glutaric acid, adipic acid, Examples thereof include aliphatic dicarboxylic acids such as pimelic acid, suberic acid, adipic acid and succinic acid. These dicarboxylic acid components may be used alone or in combination of two or more. Dicarboxylic acids other than alicyclic dicarboxylic acids and dimer acids are used in any appropriate amount.

The alicyclic diol is a compound having an alicyclic structure such as a monocyclic cycloalkane or a bicyclic alkane and two hydroxyl groups. For example, 1,2-cyclopentanediol, 1,3-cyclopentanediol, 1,2-cyclopentanedimethanol, 1,3-cyclopentanedimethanol, bis (hydroxymethyl) tricyclo [5.2.1.0]. ] 5-membered ring diols such as decane, 1,2-cyclocyclohexanediol, 1,3-cyclocyclohexanediol, 1,4-cyclocyclohexanediol, 1,2-cyclocyclohexanedimethanol, 1,3-cyclocyclohexanedimethanol , 1,4-Cyclocyclohexanedimethanol, 6-membered ring diols such as 2,2-bis- (4-hydroxycyclohexyl) -propane and the like. It is preferably 1,2-cyclohexanedimethanol, 1,3-cyclocyclohexanedimethanol, 1,4-cyclocyclohexanedimethanol, and more preferably 1,4-cyclohexanedimethanol. 1,4-Cyclohexanedimethanol can be preferably used because the methylol group is in the para position, the reactivity is high, and a polyester having a high degree of polymerization can be easily obtained.

Further, a diol component other than the alicyclic diol may be further used. Examples of the diol component other than the alicyclic diol include ethylene glycol, propylene glycol, butanediol, hexanediol, octanediol, decanediol, ethylene oxide adducts such as bisphenol A and bisphenol S, and trimethylolpropane. Can be mentioned. These may be used alone or in combination of two or more. The diol component other than the alicyclic diol is preferably used so as to be less than 25 mol% in the total amount of the diol component.

The polyester resin can be produced by any suitable method. For example, it can be produced by polymerizing a dicarboxylic acid component and a diol component using any suitable catalyst. Specific examples thereof include a method of directly esterifying an unsubstituted dicarboxylic acid as a starting material and a method of performing a transesterification reaction using an esterified product such as dimethyl ester as a starting material. More specifically, a transesterification reaction or an esterification reaction is carried out under normal pressure using any suitable catalyst, and then a further polymerization reaction is carried out under reduced pressure using any suitable catalyst.

Any suitable catalyst can be used as the catalyst for the transesterification reaction. Preferably, one or more kinds of metal compounds are used. Examples of the metal element contained in the metal compound include sodium, potassium, calcium, titanium, lithium, magnesium, manganese, zinc, tin and cobalt. Of these, titanium compounds and manganese compounds are preferable because of their high reactivity and good color tone of the obtained resin. The amount of the transesterification catalyst used is usually 5 ppm to 1000 ppm, preferably 10 ppm to 100 ppm, based on the polyester resin to be produced.

In the transesterification reaction, for example, each component used as a polymerization raw material and any other suitable copolymerization component are charged into a reaction vessel equipped with a heating device, a stirrer and a distillate, and a reaction catalyst is added. The temperature is raised while stirring in a pressure-inert gas atmosphere, and the reaction is carried out while distilling off by-products such as methanol generated by the reaction. The reaction temperature is, for example, 150 ° C. to 270 ° C., preferably 160 ° C. to 260 ° C. The reaction time is usually about 3 to 7 hours.

Further, after the transesterification reaction is completed, it is preferable to further add an equimolar or more phosphorus compound with the transesterification catalyst to further proceed with the esterification reaction. Examples of the phosphorus compound include phosphoric acid, fluoric acid, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trimethyl phosphate, triethyl phosphate, tributyl phosphate and the like. Preferably, trimethyl phosphate is used. The amount of the phosphorus compound used is usually 5 ppm to 1000 ppm, preferably 20 ppm to 100 ppm, based on the polyester resin to be produced.

Following the transesterification reaction and the esterification reaction, a polycondensation reaction is further carried out until the desired molecular weight is reached. As the catalyst for the polycondensation reaction, preferably one or more kinds of metal compounds are used. Examples of the metal element contained in the metal compound include titanium, germanium, antimony, aluminum and the like. Titanium compounds and germanium compounds are preferably used because they have high reactivity and excellent transparency of the obtained resin. The amount of the polymerization catalyst used is usually 30 ppm to 1000 ppm, preferably 50 ppm to 500 ppm, based on the polyester resin to be produced.

In the polycondensation reaction, for example, the polycondensation catalyst is added to the reaction vessel containing the product after the transesterification reaction and the esterification reaction, and then the temperature in the reaction vessel is gradually increased and the pressure is reduced. While doing. The pressure in the tank is finally reduced from under normal pressure atmosphere to, for example, 0.4 kPa or less, preferably 0.2 kPa or less. The temperature inside the tank is raised from, for example, 220 ° C. to 230 ° C., and finally, for example, 250 ° C. to 290 ° C., preferably 260 ° C. to 270 ° C., and after reaching a predetermined torque, from the bottom of the tank. The reaction product is extruded and recovered. Usually, the reaction product is extruded into water in a strand shape, cooled, and then cut to obtain a pellet-shaped polyester resin.

Such a polyester resin is described in, for example, Japanese Patent Application Laid-Open No. 2016-69600. The entire description of the publication is incorporated herein by reference.

The melting point of the resin constituting the base material is preferably 150 ° C. to 250 ° C., more preferably 170 ° C. to 220 ° C., and even more preferably 180 ° C. to 210 ° C. When the melting point is in the above range, the heat resistance of the base material itself is also improved, and an adhesive tape having more excellent heat resistance can be obtained. The melting point of the resin can be measured by any suitable method. In the present specification, the melting point of the resin means the peak temperature of the endothermic peak measured using a differential scanning calorimeter (for example, manufactured by TA Instruments, product name: Q-2000).

The elastic modulus of the base material after heating at 100 ° C. is preferably 50 MPa to 200 MPa, more preferably 60 MPa to 100 MPa. The elastic modulus of the base material after heating at 130 ° C. is preferably 50 MPa to 200 MPa, more preferably 60 MPa to 100 MPa. Further, the elastic modulus of the base material after heating at 150 ° C. is preferably 60 MPa to 150 MPa, more preferably 70 MPa to 120 MPa. Since the elastic modulus of the base material after heating at 100 ° C., 130 ° C., and 150 ° C. is within the above range, the adhesive tape can be suitably used in a method for manufacturing a semiconductor wafer including a heating step and an expanding step. it can.

The coefficient of linear expansion of the base material at 100 ° C. to 150 ° C. is preferably 1000 ppm / ° C. or lower, more preferably 950 ppm / ° C. or lower, and further preferably 600 ppm / ° C. or lower. When the coefficient of linear expansion at 100 ° C. to 150 ° C. is in the above range, it is possible to prevent the occurrence of wrinkles on the base material subjected to the heating step and the occurrence of strain on the adhesive tape subjected to the heating step. The coefficient of linear expansion of the base material at 100 ° C. to 150 ° C. is, for example, 300 ppm / ° C. or higher. The coefficient of linear expansion of the substrate can be analyzed by thermomechanical analysis (TMA). Specifically, it can be analyzed by the following method. The obtained sample is set in a thermomechanical analyzer (manufactured by TA Instruments, product name: Q-400) with a width of 3 mm and a distance between chucks of 16.05 mm. The temperature is raised from 25 ° C. to 160 ° C. under the condition of 10 ° C./min under the condition of a load of 1.96 mN under a nitrogen atmosphere. In the present specification, the displacement amount of the sample thickness due to linear expansion is measured, and the value obtained from the sample displacement amount of 100 ° C. to 150 ° C. is used as the linear expansion coefficient of the base material.

The melting start point of the base material preferably exceeds 150 ° C., more preferably 155 ° C. or higher, and further preferably 160 ° C. or higher. When the melting start point is in the above range, it is possible to prevent the occurrence of wrinkles on the base material subjected to the heating step and the occurrence of strain on the adhesive tape subjected to the heating step. The melting start point of the base material is, for example, 200 ° C. or lower. In the present specification, the melting start point of the base material can be determined by the following method. The extrapolation melting start temperature (Tim) is measured according to JIS K7121-1987. The intersection of the straight line extending the baseline on the low temperature side of the differential scanning calorimeter to the high temperature side and the tangent line obtained by subtracting the point where the gradient becomes maximum with respect to the curve on the low temperature side of the melting peak is defined as the melting start point.

The thickness of the base material is preferably 30 μm to 250 μm, more preferably 40 μm to 200 μm, and further preferably 50 μm to 150 μm.

In one embodiment, the substrate is preferably annealed. By performing the annealing treatment, it is possible to prevent the occurrence of distortion of the adhesive tape subjected to the heating step. Therefore, it is possible to prevent the occurrence of defects in the manufacturing process performed after the heating process, for example, the expanding process.

The annealing process can be performed by any suitable method. For example, it can be performed by heating the base material using a heating device such as an oven. The heating time and the heating temperature can be set to arbitrary appropriate values depending on the resin used for the base material, the thickness of the base material, and the like. For example, when the base material containing the aliphatic polyester resin is used, the heating temperature is preferably 155 ° C. or higher, more preferably 160 ° C. or higher, and further preferably 170 ° C. or higher. The heating temperature is, for example, 180 ° C. or lower. The heating time is, for example, 1 minute to 30 minutes.

In one embodiment, the heating temperature in the annealing process can be set depending on the temperature of the heating step in which the adhesive tape is provided. The heating temperature in the annealing treatment is, for example, the temperature of the heating step in which the adhesive tape is provided + 10 ° C. or higher, preferably the temperature of the heating step in which the adhesive tape is provided + 20 ° C. or higher. By performing the annealing treatment at such a temperature, it is possible to prevent the occurrence of distortion of the adhesive tape subjected to the heating step. The heating temperature in the annealing treatment is, for example, lower than the melting point of the resin used for the base material.

C. Adhesive layer The adhesive layer 20 is formed by using a composition (adhesive composition) that forms a pressure-sensitive adhesive layer.

C-1. Adhesive composition As the adhesive layer composition (adhesive), any suitable adhesive is used. For example, an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyvinyl ether-based pressure-sensitive adhesive, and the like can be mentioned.

In one embodiment, the pressure-sensitive adhesive composition is preferably an active energy ray-curable pressure-sensitive adhesive composition. By using an active energy ray-curable adhesive, the adhesive strength is reduced by irradiation with active energy rays (typically, ultraviolet rays) after dicing, and it is easy to pick up small pieces of workpieces (for example, semiconductor chips). It is possible to obtain an adhesive tape that can be used.

C-1-1. The base polymer pressure-sensitive adhesive composition may include a base polymer that exhibits stickiness. Examples of the monomer constituting the base polymer include hydrophilic monomers. As the hydrophilic monomer, any suitable monomer having a polar group can be used. Specifically, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; and acid anhydride monomers such as maleic anhydride and icotanic anhydride. 2-Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate , (Meta) acrylic acid 10-hydroxydecyl, (meth) acrylic acid 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methylmethacrylate and other hydroxyl group-containing monomers; styrene sulfonic acid, allyl sulfonic acid, 2- (meth) Sulfonic acid group-containing monomers such as acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalene sulfonic acid; phosphoric acid such as 2-hydroxyethylacryloyl phosphate. Group-containing monomer; (N) such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, acryloyl morpholine, etc. -Substituted) amide-based monomer; (meth) aminoalkyl-acrylate monomer such as aminoethyl acrylate, N, N-dimethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate; (Meta) alkoxyalkyl-based monomers such as methoxyethyl (meth) acrylate and ethoxyethyl (meth) acrylate; maleimide-based monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide. Monomer; Itaconimide-based monomer such as N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexylitaconimide, N-laurylitaconimide, etc. N- (meth) acryloyl oxymethylene succinimide, N- (meth) acroyl-6-oxyhexamethylene succinimide, N- (meth) acryloyl-8-oxyoctamethylene succinimide Succinimide-based monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholin, N- Vinyl-based monomers such as vinylcarboxylic acid amides, styrene, α-methylstyrene, N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth) acrylate; Glycol-based acrylic ester monomers such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate; tetrahydrofurfuryl (meth) acrylate, fluorine Acrylate-based monomers having heterocycles such as (meth) acrylate and silicon (meth) acrylate, halogen atoms, silicon atoms, etc .; hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) ) Propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) Examples thereof include polyfunctional monomers such as acrylate, epoxy acrylate, polyester acrylate, and urethane acrylate. As the hydrophilic monomer, a hydroxyl group-containing monomer and / or a (N-substituted) amide-based monomer can be preferably used. Only one kind of hydrophilic monomer may be used, or two or more kinds may be used in combination.

Moreover, you may use the said hydrophilic monomer and hydrophobic monomer in combination. The hydrophobic monomer may be any monomer having hydrophobicity, and any suitable monomer can be used. Specifically, vinyl alkyl or aryl ether having an alkyl group having 9 to 30 carbon atoms such as vinyl 2-ethylhexanoate, vinyl laurate, vinyl stearate, stearyl vinyl ether; hexyl (meth) acrylate, (meth). Heptyl acrylate, octyl (meth) acrylate, isooctyl acrylate, isononyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, dodecyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, ( Alkyl esters of 6-30 carbon atoms of benzyl (meth) acrylate, lauryl (meth) acrylate, oleyl (meth) acrylate, palmityl (meth) acrylate, and stearyl (meth) acrylate (meth) acrylate; fatty acids And unsaturated vinyl esters of (meth) acrylic acid derived from aliphatic alcohols; monomers derived from cholesterol; 1-butene, 2-butene, 1-pentene, 1-hexene, 1-octene, isobutylene, isoprene, etc. Olefin monomer can be mentioned. Only one kind of hydrophobic monomer may be used, or two or more kinds may be used in combination. In addition, in this specification, a hydrophobic monomer means a monomer having a solubility in 100 g of water of 0.02 g or less.

The base polymer may further contain monomer components other than the hydrophilic monomer and the hydrophobic monomer. Examples of other monomer components include alkyl acrylates such as butyl acrylate and ethyl acrylate. Only one type of other monomer component may be used, or two or more types may be used in combination.

The base polymer may further contain a structural unit derived from an isocyanate-based compound having a curable functional group in the molecule. The base polymer containing the structural unit derived from the isocyanate-based compound can be obtained, for example, by reacting the substituent (for example, OH group) of the structural unit derived from the hydrophilic monomer with the NCO group of the isocyanate-based compound. Examples of the isocyanate-based compound include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate and the like.

The weight average molecular weight of the base polymer constituting the pressure-sensitive adhesive is preferably 300,000 to 2,000,000, more preferably 500,000 to 1,500,000. The weight average molecular weight can be measured by GPC (solvent: THF).

C-1-2. Polymerization Initiator The active energy ray-curable pressure-sensitive adhesive composition typically contains a polymerization initiator. As the polymerization initiator, any suitable initiator can be used, and a photopolymerization initiator is preferably used. Any suitable initiator can be used as the photopolymerization initiator. Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, and 2-methyl-2-hydroxypropio. Α-Ketol compounds such as phenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -Phenyl] -2-Acetphenone compounds such as morpholinopropane-1, benzophenone compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyl dimethyl ketal; 2-naphthalene sulfonyl chloride and the like. Aromatic sulfonyl chloride compounds; photoactive oxime compounds such as 1-phenone-1,1-propandion-2- (o-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4 -Benzophenone compounds such as methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4 Examples thereof include thioxanthone compounds such as-diethylthioxanthone and 2,4-diisopropylthioxanthone; benzophenone; ketone halide; acylphosphinoxide; acylphosphonate and the like. Only one type of photopolymerization initiator may be used, or two or more types may be used in combination. The amount of the photopolymerization initiator used can be set to any suitable amount. The amount of the photopolymerization initiator used is preferably 1 part by weight to 10 parts by weight, and more preferably 3 parts by weight to 7 parts by weight with respect to 100 parts by weight of the base polymer.

A commercially available product may be used as the photopolymerization initiator. For example, BASF's trade names "Irgacure 651", "Irgacure 184", "Irgacure 369", "Irgacure 819", "Irgacure 2959" and the like can be mentioned.

C-1-3. Cross-linking agent The active energy ray-curable pressure-sensitive adhesive composition preferably further contains a cross-linking agent. Examples of the cross-linking agent include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, and metal alkoxide-based cross-linking agents. Examples thereof include a metal chelate-based cross-linking agent, a metal salt-based cross-linking agent, a carbodiimide-based cross-linking agent, and an amine-based cross-linking agent.

In one embodiment, an isocyanate-based cross-linking agent is preferably used. Isocyanate-based cross-linking agents are preferable because they can react with various functional groups. Specific examples of the isocyanate-based cross-linking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone diisocyanate; 2,4- Aromatic isocyanates such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylol propane / tolylene diisocyanate trimer adduct (manufactured by Toso Co., Ltd., trade name "Coronate L"), trimethylol propane / Addisocyanate such as hexamethylene diisocyanate trimeric adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), isocyanurate of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HX") Things; etc. Preferably, a cross-linking agent having 3 or more isocyanate groups is used.

The active energy ray-curable pressure-sensitive adhesive composition may further contain any suitable additive. Examples of the additive include an active energy ray polymerization accelerator, a radical trapping agent, an antistatic agent, a plasticizer (for example, a trimellitic acid ester-based plasticizer, a pyromellitic acid ester-based plasticizer), a pigment, a dye, and a filler. , Antioxidants, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, release modifiers, softeners, surfactants, flame retardants, antioxidants and the like.

The content of the cross-linking agent can be adjusted to any suitable amount. For example, it is preferably 0.005 parts by weight to 20 parts by weight, and more preferably 0.02 parts by weight to 10 parts by weight with respect to 100 parts by weight of the base polymer. When the pressure-sensitive adhesive layer has a single-layer structure, the content ratio of the cross-linking agent is preferably 0.1 part by weight to 10 parts by weight, more preferably 0, with respect to 100 parts by weight of the base polymer of the pressure-sensitive adhesive. .5 to 8 parts by weight. Within such a range, a pressure-sensitive adhesive layer having an appropriately adjusted elastic modulus can be formed.

The pressure-sensitive adhesive layer may be a single layer or may be composed of two or more layers. In one embodiment, the pressure-sensitive adhesive layer is composed of a single layer. When the pressure-sensitive adhesive layer has a single-layer structure, the tensile elastic modulus of the pressure-sensitive adhesive layer at 22 ° C. is preferably 0.05 MPa to 1 MPa, more preferably 0.1 MPa to 0.8 MPa, and further preferably 0. It is .15 MPa to 0.6 MPa. Within such a range, a pressure-sensitive adhesive layer having sufficient strength can be formed, and the pressure-sensitive adhesive layer and the base material are in good contact with each other, and voids are generated near the interface between the base material and the pressure-sensitive adhesive layer. Can be suppressed. On the other hand, if the tensile elastic modulus is less than 0.05 MPa, the pressure-sensitive adhesive layer may not maintain its fixed shape and may not have sufficient characteristics. As described above, when the pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, it is preferable that the tensile elastic modulus at 22 ° C. before irradiation with the active energy ray is in the above range. The method for measuring the tensile elastic modulus of the pressure-sensitive adhesive layer will be described later.

When the pressure-sensitive adhesive layer has a single-layer structure, ^{the tensile elastic modulus of the pressure-sensitive adhesive layer at 22 ° C. after irradiation with ultraviolet rays (460 mJ / cm 2} ) is preferably 50 MPa to 3000 MPa, more preferably 100 MPa to 1500 MPa, and further. It is preferably 200 MPa to 1000 MPa. Within such a range, an adhesive tape having excellent pick-up property can be obtained.

When the pressure-sensitive adhesive layer has a single-layer structure, the thickness of the pressure-sensitive adhesive layer is preferably 5 μm to 200 μm, more preferably 5 μm to 150 μm, and even more preferably 5 μm to 100 μm.

D. Method for Producing Adhesive Tape The adhesive tape can be manufactured by any suitable method. The adhesive tape can be obtained, for example, by applying the above-mentioned adhesive onto a base material. Coating methods include bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, screen printing, etc. Various methods can be adopted. Alternatively, a method of separately forming an adhesive layer on the separator and then laminating it to the base material may be adopted.

E. Uses of Adhesive Tape The adhesive tape of the present invention has excellent heat resistance and expandability, and has excellent expandability even after undergoing a heating step. Therefore, it can be suitably used for applications requiring these characteristics. In one embodiment, the adhesive tape of the present invention can be suitably used in the processing process of a semiconductor wafer, and preferably can be used as a dicing tape. Further, the adhesive tape can be suitably used in a method for manufacturing a semiconductor wafer including an expanding step. In the expanding step, the adhesive tape is stretched in the plane direction (MD direction and TD direction) while being attached to the semiconductor wafer. The adhesive tape has excellent elongation not only in one direction but also in the surface direction. Therefore, it can be suitably used in a method for manufacturing a semiconductor wafer including an expanding step. Further, the adhesive tape has excellent heat resistance and can maintain excellent expandability even after undergoing a heating step. Therefore, it can be suitably used in a method for manufacturing a semiconductor wafer including a heating step. Further, since the step of reattaching the adhesive tape can be omitted, the productivity of the semiconductor wafer can be improved.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. The tests and evaluation methods in the examples are as follows. Unless otherwise specified, "parts" and "%" are based on weight.

<Production Example 1> Preparation of Polymer Solution A monomer solution 1 was prepared by mixing 100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acroylmorpholine, and 22 parts by weight of 2-hydroxyethyl acrylate. Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen introduction tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 500 parts by weight of ethyl acetate, 1 part of the monomer solution, and 0.2 parts by weight of azoisobutynitrile (AIBN) were introduced. Was charged and stirred at 60 ° C. for 24 hours. Then, the mixture was cooled to room temperature to obtain an acrylic copolymer solution containing an acrylic copolymer (weight average molecular weight: 600,000). To the obtained acrylic copolymer solution, 24 parts by weight of 2-methacryloyloxyethyl isocyanate was added and reacted to add an NCO group to the side chain terminal OH group of 2-hydroxyethyl acrylate in the copolymer. , An acrylic copolymer solution 1 (polymer) having a carbon-carbon double bond at the terminal and having a weight average molecular weight of 800,000 was obtained.

[Example 1]
(Preparation of Adhesive Layer Forming Composition)
100 parts by weight of the acrylic polymer solution obtained in Production Example 1, 3 parts by weight of a cross-linking agent (manufactured by Tosoh, trade name: Coronate L), 7 weights of a photopolymerization initiator (manufactured by BASF, trade name: Irgacure 184) The parts and the diluent solvent (ethyl acetate) were mixed and stirred to obtain a pressure-sensitive adhesive composition.
(Preparation of base material)
A base material (thickness: 80 μm) was prepared using an aliphatic polyester resin manufactured by Bell Polyester Products Co., Ltd. (manufactured by Seadam, product name: an aliphatic polyester resin containing BPP-TPEE1).
(Making adhesive tape)
The pressure-sensitive adhesive layer-forming composition was applied to a polyethylene terephthalate (PET) separator (manufactured by Mitsubishi Chemical Corporation, product name: Diafoil MRF38, silicone-coated polyester film), and then heated at 120 ° C. for 2 minutes. Next, the pressure-sensitive adhesive layer was transferred to the base material to obtain a pressure-sensitive adhesive tape (thickness: 100 μm) having a pressure-sensitive adhesive layer having a thickness of 10 μm.

[Example 2]
The base material used in Example 1 was placed in an oven heated to 150 ° C. for 5 minutes to perform annealing treatment. Next, an adhesive tape was produced in the same manner as in Example 1.

[Example 3]
The base material used in Example 1 was placed in an oven heated to 160 ° C. for 5 minutes to perform annealing treatment. Next, an adhesive tape was produced in the same manner as in Example 1.

[Example 4]
The base material used in Example 1 was placed in an oven heated to 170 ° C. for 5 minutes to perform annealing treatment. Next, an adhesive tape was produced in the same manner as in Example 1.

(Comparative Example 1)
An adhesive tape C1 was produced in the same manner as in Example 1 except that a polyolefin-based resin film (manufactured by Okura Industrial Co., Ltd., product name: ODZ2, thickness: 80 μm) was used as the base material.

(Comparative Example 2)
An adhesive tape C2 was produced in the same manner as in Example 1 except that a polyolefin-based resin film (manufactured by Okura Industrial Co., Ltd., product name: ODZ5, thickness: 80 μm) was used as the base material.

(Comparative Example 3)
An adhesive tape C3 was produced in the same manner as in Example 1 except that a polyethylene terephthalate film (manufactured by Toray Industries, Inc., product name: Lumirror S10 # 100, thickness: 100 μm) was used as a base material.

(Comparative Example 4)
An adhesive tape C4 was produced in the same manner as in Example 1 except that a polyethylene naphthalate film (manufactured by Teijin Film Solutions Co., Ltd., product name: Theonex Q51C, thickness: 50 μm) was used as a base material.

(Comparative Example 5)
An adhesive tape C5 was produced in the same manner as in Example 1 except that a polyimide film (manufactured by Toray DuPont, product name: Kapton 100H, thickness: 25 μm) was used as a base material.

The following evaluations were carried out using the adhesive tapes obtained in Examples and Comparative Examples. The results are shown in Tables 1 and 2.
(1) Tensile Shear Adhesive Strength after Stage Warming and Adhesive Adhesive Tape Side (BA304) is placed on the stage heated to 100 ° C to 150 ° C by superimposing the base material surface of a 10 mm square adhesive tape on the SUS plate (BA304). The adhesive layer) was placed in contact with the adhesive layer and left for 30 minutes. Then, it was taken down from the stage, placed so that the SUS plate was on the lower side, and left to stand until it reached room temperature. Next, using a tensile tester (manufactured by Orientec, product name: RTM-100), tension was performed at 22 ° C., a distance between chucks of 50 mm, a speed of 300 mm / min, and a tensile angle of 180 degrees, and tensile shear adhesive strength (N /). 10 mm) was measured.

(2) Stress at 10% elongation, elastic modulus, elongation at break The obtained adhesive tape was cut into strips having a width of 10 mm and a length of 100 mm to prepare test pieces. Using the above tensile tester, the stress, elastic modulus, and elongation at break at 10% elongation were measured under the conditions of 23 ° C., a distance between chucks of 50 mm, and a speed of 300 mm / min. The elastic modulus is the initial elastic modulus (Young's modulus) obtained from the strain in a range that can be regarded as a straight line immediately after tensioning. The elongation at break was defined as the strain (%) when the tape was cut.

(3) Heat shrinkage rate (dimension change rate)
The obtained adhesive tape was cut into 100 mm × 100 mm and used as a test piece. The lengths of the test piece in the TD direction and the MD direction were measured with a projector (manufactured by Mitutoyo Co., Ltd., product name: PJ-H3000F) and used as initial values. The test pieces were placed in ovens heated to 100 ° C., 130 ° C., 150 ° C., and 180 ° C. with the adhesive layer of the adhesive tape facing up. After 30 minutes, the test piece was removed from the oven and cooled at room temperature 22 ° C. for 30 minutes or longer. Next, the lengths of the test piece after heating in the TD direction and the MD direction were measured with a projector. The ratio of the length after heating to the initial value (initial value / length after heating) was calculated and used as the heat shrinkage rate (dimensional change rate).

As is clear from Table 1, the adhesive tape of Example 1 had a small shrinkage rate even after heating at 100 ° C. to 180 ° C., and was excellent in heat resistance. Further, even after heating, it has the same elastic modulus and breaking strength as before heating, and can be suitably used in the manufacturing process of semiconductor wafers.

The adhesive tapes obtained in Examples 1 to 4 and the base material used in each Example were evaluated as follows. The results are shown in Table 3.
(4) Coefficient of linear expansion at 100 ° C. to 150 ° C. The base material used in Examples 1 to 4 has a width of 3 mm and a chuck distance of 16.05 mm, and is a thermomechanical analyzer (manufactured by TA Instruments, product name: Q-400). I set it to. Next, the temperature was raised from 25 ° C. to 160 ° C. under the condition of 10 ° C./min under the condition of a load of 1.96 mN under a nitrogen atmosphere. The amount of displacement of the thickness of the base material due to linear expansion was measured, and the amount of sample displacement from 100 ° C. to 150 ° C. was determined.
In addition, the linear expansion coefficient was measured in the same manner for the adhesive tapes obtained in Examples 1 to 4.

(5) Melting start point and melting point The base material used in Examples 1 to 4 was punched into a circle with a diameter of 4 mm and used as a sample. Using a differential scanning calorimeter (manufactured by TA Instruments, product name: Q-2000), the temperature of this sample was raised in the measurement range of -30 ° C to 300 ° C at 10 ° C / min, and the melting start point was reached. And the melting point was measured. The melting start point was determined by the following method.
The extrapolation melting start temperature (Tim) was measured according to JIS K7121-1987. The intersection of the straight line extending the baseline on the low temperature side of the differential scanning calorimeter to the high temperature side and the tangent line obtained by subtracting the point where the gradient becomes maximum with respect to the curve on the low temperature side of the melting peak was defined as the melting start point.

(6) Elastic modulus, breaking point stress, and breaking elongation The base material used in each example was cut into strips having a width of 10 mm and a length of 100 mm to prepare test pieces. Using the above tensile tester, the elastic modulus, the breaking point stress, and the breaking elongation were measured under the conditions of 23 ° C., a distance between chucks of 50 mm, and a speed of 300 mm / min. The elastic modulus is the initial elastic modulus (Young's modulus) obtained from the strain in a range that can be regarded as a straight line immediately after tensioning. The elongation at break was defined as the strain (%) when the tape was cut.

(7) Chip contact in the dicing step An 8-inch Si wafer backgrown to a thickness of 150 μm was mounted on the adhesive tape obtained in Examples 1 to 4. Then, it was attached to the dicing ring. Dicing was performed using a dicing device (manufactured by Disco Corporation, product name DFD6450, chip size 10 mm square, blade ZH05-SD3000-N1-70HI). Next, the wafer was placed on the upper surface and the tape was placed on the lower surface, and columns were attached to the four corners of the dicing ring, and the mixture was placed in an oven at 150 ° C. and removed from the oven after 2 minutes. Next, the wafer was divided into four areas according to the MD direction and the TD direction of the tape. After that, light was applied from the tape side, the light leaking to the wafer side was visually confirmed, and the presence or absence of chip contact was determined based on the following criteria.
Yes: There are places where the leaking light cannot be confirmed in all areas Partial contact: There are places where the leaking light cannot be confirmed in one to three areas None: There are no places where the leaking light cannot be confirmed in all areas

The adhesive tape of the present invention can be suitably used for semiconductor processing applications.

10 Base material 20 Adhesive layer 100 Adhesive tape

Claims (10)

A base material and an adhesive layer arranged on one side of the base material are provided.
An adhesive tape having a tensile shear adhesive strength of 0.05 N / 20 mm or less after being stage-heated and pasted at 150 ° C. for 30 minutes, and a stress of 15 N or less at 10% elongation. The adhesive tape according to claim 1, wherein the elongation at break is 300% or more. The adhesive tape according to claim 1 or 2, wherein the shrinkage rate after heating at 150 ° C. for 30 minutes is 1.0% or less. The adhesive tape according to any one of claims 1 to 3, wherein the initial elastic modulus is 500 MPa or less. The adhesive tape according to any one of claims 1 to 4, wherein the base material contains an aliphatic polyester resin. The adhesive tape according to any one of claims 1 to 5, wherein the adhesive tape has a linear expansion coefficient of 1000 ppm / ° C. or less at 100 ° C. to 150 ° C. The adhesive tape according to any one of claims 1 to 6, wherein the melting start point of the base material exceeds 150 ° C. The adhesive tape according to any one of claims 1 to 7, which is used in a semiconductor wafer processing process. The adhesive tape according to claim 8, wherein the semiconductor wafer processing step includes a heating step and an expanding step. The adhesive tape according to claim 8 or 9, which is used as a dicing tape.

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