JP2021018959A - Interposer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an interposer having improved electrical characteristics while keeping a partition wall separating adjacent through holes of a housing having a predetermined thickness or more. A contact 30 has a base press-fitted into a through hole 21 of a housing 20, a first contact beam 32, and a second contact beam 33. The first contact beam 32 extends outward from the first surface 20A from the base. Further, the second contact beam 33 extends outward from the second surface 20B from the base portion. Here, the first contact beam so that the first distance x1 between the first contact beams 32 of the two contacts 30 adjacent to each other in the width direction is narrower than the second distance x2 between the second contact beams. 32 is formed wider than the second contact beam 33. [Selection diagram] Fig. 1

Description

The present invention relates to an interposer that is sandwiched between two electronic components (including a circuit board) and is in contact with a connection pad formed on each of the two electronic components to electrically connect the electronic components to each other.

Conventionally, an interposer that is sandwiched between two electronic components and electrically connects the electronic components has been known. The interposer comprises a plate-like housing having a large number of arranged through holes and a large number of contacts inserted into each of the large number of through holes and held in the housing.

Here, Patent Document 1 discloses an interposer including a contact in which an arm having a constant width extends vertically from a wide central portion in which a plastic body is overmolded except for a tip.

Special Table 2016-503946

The contacts that make up the interposer include a base that is located in the through hole of the housing and held in the housing. The contact then comprises two contact beams extending from the base to the first and second surfaces of the housing, respectively.

The two contact beams are formed in the same shape, for example, as in Patent Document 1 described above. In the case of Patent Document 1, the two contact beams have a narrower width, that is, a tapered shape toward the tip end side. Further, these contact beams are formed to be narrower than the base because the base needs to be arranged in the through hole. Further, the partition wall separating the adjacent through holes needs to have a thickness of a predetermined value or more in order to maintain the strength. Under these circumstances, the distance between adjacent contacts is greater than or equal to the partition wall.

However, it may be preferable to make the two contacts adjacent to each other in the width direction narrower than the thickness of the partition wall in order to improve the electrical characteristics.

An object of the present invention is to provide an interposer having improved electrical characteristics while maintaining a partition wall of a housing that separates adjacent through holes from each other to a predetermined thickness or more.

The interposer of the present invention that achieves the above object is
An interposer that is sandwiched between two electronic components and is in contact with a connection pad formed on each of the two electronic components to electrically connect the two electronic components.
The first surface of the two electronic components facing the first electronic component side, the second surface of the two electronic components facing the second electronic component side, and the first and second surfaces. A housing having a plurality of through holes penetrating through the holes, and a base portion press-fitted into the through holes, and a first portion extending obliquely from the base portion to the outside of the first surface in the thickness direction of the housing with respect to the first surface. A first contact beam having a first contact portion in contact with an electric component, and a second contacting a second electrical component at a tip portion extending diagonally in the thickness direction with respect to a second surface outward from the base portion and a second surface. Having a plurality of contacts with a second contact beam having a contact portion of
The first distance between the first contact beams of two adjacent contacts adjacent to each other in the width direction is larger than the second distance between the second contact beams of the second contact beams of the two adjacent contacts. The first contact beam is wider than the second contact beam so as to be narrower.

In the case of the interposer of the present invention, the first interval is narrower than the second interval. Therefore, it is inserted into the through hole from the narrow second contact beam side and the base portion is press-fitted into the through hole. By doing so, an interposer having improved electrical characteristics is realized while keeping the partition walls between adjacent through holes having a predetermined thickness or more.

Here, in the interposer of the present invention, the first contact beam is wide so that the first distance is narrower than the thickness of the partition wall separating the two through holes into which the bases of the two adjacent contacts are press-fitted. Is preferable.

The first contact beam need not be able to penetrate through the through hole. Therefore, the electrical characteristics can be improved by widening the first contact beam so that the above-mentioned first spacing is narrower than the thickness of the partition wall separating the two through holes.

Further, in the interposer of the present invention, the portion of the first contact beam excluding the tip portion having the first contact portion has a uniform first width and the second contact beam of the second contact beam. It is preferable that the portion excluding the tip portion having the contact portion has a uniform second width narrower than the first width described above.

When the first contact beam and the second contact beam are formed to have a uniform width, the contact is excellent in high-speed signal transmission as compared with the tapered contact beam as in Patent Document 1 described above. Therefore, by adopting the contact, an interposer excellent in high-speed signal transmission is realized.

Further, in the interposer of the present invention, it is preferable that the contacts have a symmetrical structure in the width direction.

The contact beam is pushed by the electronic component and elastically deformed. Here, if the contact has a structure symmetrical in the width direction, the force when pressed by the electric component is evenly distributed in the left and right sides in the width direction, so that buckling and the like are less likely to occur and high reliability can be ensured.

According to the above invention, an interposer having improved electrical characteristics is realized while keeping the partition wall separating the adjacent through holes of the housing at a predetermined thickness or more.

It is a perspective view of the interposer of one Embodiment of this invention. It is a figure which showed one contact which constitutes the interposer shown in FIG. It is a figure which showed the housing which constitutes the interposer shown in FIG. It is a figure which showed the modification of the through hole.

Hereinafter, embodiments of the present invention will be described.

FIG. 1 is a perspective view of an interposer according to an embodiment of the present invention. Here, FIG. 1A is a perspective view of a posture in which the first surface of the housing is facing upward, and FIG. 1B is a perspective view of a posture in which the second surface of the housing is facing upward. For example, 4000 contacts are arranged in the interposer, but it is a repetition of the same structure, and only a part of them is shown here.

The interposer 10 has a plate-shaped housing 20 and a plurality of contacts 30. The housing 20 is formed with a plurality of through holes 21 (see also FIG. 3) arranged in a grid pattern penetrating the first surface 20A and the second surface 20B. Then, one contact 30 is press-fitted into each through hole 21.

FIG. 2 is a diagram showing one contact constituting the interposer shown in FIG. Here, FIG. 2A is a perspective view, and FIG. 2B is a front view.

Further, FIG. 3 is a diagram showing a housing constituting the interposer shown in FIG. Here, FIG. 3A is a perspective view, and FIG. 3B is a plan view.

The contact 30 has a flat plate-shaped base portion 31 and a first contact beam 32 and a second contact beam 33 extending from the upper end and the lower end of the base portion 31, respectively.

The base portion 31 is provided with a press-fitting portion 311 protruding in the width direction. The press-fitting portion 311 is a portion that, when the contact 30 is press-fitted into the through-hole 21, bites into the inner wall surface of the through-hole 21 and holds the contact 30 in the through-hole 21.

The contact 30 is press-fitted into the through hole 21 from the first surface 20A side of the housing 20 so that the base 31 is along one inner wall surface 211 of the through hole 21.

Further, the first contact beam 32 extends obliquely from the base 31 to the outside of the first surface 20A of the housing 20 with respect to the first surface 20A. A first contact portion 321 is provided at the extended tip portion of the first contact beam 32. An IC (Integrated Circuit) (not shown), which is an example of the first electronic component of the present invention, is mounted at a position facing the first surface 20A. Connection pads arranged in the same arrangement as the contact 20 and at the same pitch are provided on the surface of the IC facing the first surface 20A. Then, when the IC is mounted, each of the first contact portions 321 provided at the tip of each first contact beam 32 of each contact 30 electrically contacts the connection pad. The surface of the contact portion 321 that contacts the contact pad is rounded so that it can slide on the connection pad.

An opening 322 is formed in the central portion of the first contact beam 32 excluding the tip portion. The first contact beam 32 is divided into two sub-beams 323 by the opening 322. By configuring the first contact beam 32 with two sub-beams 323 sandwiching the opening 322, the spring force of elastic deformation when the IC is mounted is adjusted. That is, the width of the first contact beam 32, that is, the distance between the side edges of the two sub-beams 323 on the side away from the opening 322 is a constant width d1. On the other hand, the opening 322 is formed wider toward the tip. With these configurations, a tapered sub-beam that is less likely to cause stress concentration is formed.

A high-speed signal of, for example, 100 GHz is transmitted between the contact 30 and the IC. The width of the entire contact beam is important for the transmission of this high-speed signal. That is, it does not matter whether the contact beam is composed of two sub-beams with slits in between, or is configured as an integral beam without slits. Therefore, in the present embodiment, the first contact beam 32 is composed of two sub-beams 323 with an opening 322 sandwiched between them to form a constant width d1 to ensure high-speed signal transmission performance and contact. The springiness of the beam is adjusted appropriately.

Further, the second contact beam 33 extends obliquely from the base 31 to the outside of the second surface 20B of the housing 20 with respect to the second surface 20B. A second contact portion 331 is provided at the extended tip portion of the second contact beam 33. Here, the interposer 10 is mounted on the circuit board with its second surface 20B side facing the circuit board (not shown) which is an example of the second electronic component of the present invention. Connection pads arranged in the same arrangement as the contacts 20 and at the same pitch are provided on the surface of the circuit board facing the second surface 20B side. Then, when the interposer 10 is mounted on the circuit board, each of the second contact portions 331 provided at the tip of each second contact beam 33 of each contact 30 is electrically attached to the connection pad on the circuit board. Contact. That is, the interposer 10 is, for example, an interposer that mediates signal transmission between the circuit board on which the interposer 10 is mounted and the IC mounted on the interposer 10.

An opening 332 is formed in a portion of the second contact beam 33 other than the tip portion. The second contact beam 33 is divided into two sub-beams 333 by the opening 332. By configuring the second contact beam 33 with two sub-beams 333 sandwiching the opening 332, the spring force of deformation when the IC is mounted is adjusted. The point that each sub-beam 333 forms a tapered shape is the same as that of the sub-beam 323. That is, the width of the second contact beam 33, that is, the distance between the side edges of the two sub-beams 333 on the side away from the opening 332 is a constant width d2. On the other hand, the opening 332 is formed wider toward the tip.

A high-speed signal is transmitted between the IC and the circuit board via the contact 30. For the transmission of this high-speed signal, it is preferable that the width of the contact beam is constant. Therefore, in the present embodiment, like the first contact beam 32, the second contact beam 33 is also composed of two sub-beams 333 with an opening 332 sandwiched between them. As a result, the width is formed to be constant to ensure high-speed signal transmission performance, and the springiness of the second contact beam is appropriately adjusted.

Here, when the maximum width of the base 31 is d3,
d1>d3> d2
It has become.

In this contact 30, the second contact beam 33 is inserted into the through hole 21 of the housing 20, passes through the through hole 21, and the base 31 is press-fitted into the through hole 21. Therefore, the width d2 of the second contact beam 33 needs to be a width that can pass through the through hole 21. Further, the width d3 of the base portion 31 needs to be press-fitted into the through-hole 21, and is wider than the through-hole 21 by the amount that the press-fitting portion 311 protrudes.

Here, as shown in FIG. 3B, the width w1 of the through hole 21 along the inner wall surface 211 of the through hole 21 on the side where the press-fitted base 31 contacts is the through hole of the portion away from the wall surface 211. It is wider than the width w2 of 21. This is because the second contact beam 33 has a size capable of passing through a portion having a width w2, and the portion into which the base portion 31 is press-fitted is widened to a width w1 so that the base portion in the through hole 21 is formed. This is to stabilize the position of 31.

On the other hand, the first contact beam 32 has a width d1 that cannot be inserted into the through hole 21. A second contact beam 33 is inserted into the through hole 21. Therefore, it is not necessary to insert the first contact beam 32 into the through hole 21. Therefore, the distance x1 between the first contact beams 32 of the two adjacent contacts 30 (see FIG. 1A) is the distance x2 between the two adjacent second contact beams 33 (FIG. 1B). See) is narrower. Further, assuming that the thickness of the partition wall 22 separating the two adjacent through holes 21 is x3 (see FIG. 3),
x2 ≧ x3> x1
Meet the relationship.

In the case of the present embodiment, the first contact beam 32 has a wide width d1 so as to satisfy these relationships, and the distance between the contacts 30 adjacent to each other in the width direction is reduced to lower the characteristic impedance, thereby improving the electrical characteristics. I'm letting you.

Here, the first contact beam 32 has a constant width d1 except for the portion of the first contact portion 321 at the tip portion, and the second contact beam 33 is the second contact portion 331 at the tip portion. The constant width d2 is used except for the part. The base 31, the first contact beam 32, and the second contact beam 33 have widths that satisfy d1> d3> d2 and x2 ≧ x3> x1. However, the first contact beam 32 and the second contact beam 33 do not have to have constant widths d1 and d2, respectively. When the widths are not constant, the maximum widths d1 and d2 of the first contact beam 32 and the second contact beam 33 and the closest distances x1 and x2 between the two adjacent contact beams 32 and 33 are compared. Then, d1> d3> d2 and x2 ≧ x3> x1 may be satisfied.

FIG. 4 is a diagram showing a modified example of the through hole.

The shape of the through hole 21 may be set to w1 = w2'as shown in FIG. Also in this case, the width d2 of the second contact beam 33 and the width d3 of the base 31 have a relationship of d3> d2.

10 Interposer 20 Housing 20A Housing 20A Housing first surface 20B Housing second surface 21 Through hole 22 Partition wall separating adjacent through holes 30 Contact 31 Base 311 Press-fit 32 First contact beam 321 First contact 33 Second Contact beam 331 2nd contact part d1 1st width d2 2nd width x1 1st interval x2 2nd interval

Claims (4)

An interposer that is sandwiched between two electronic components and is in contact with a connection pad formed on each of the two electronic components to electrically connect the two electronic components to each other.
The first surface of the two electronic components facing the first electronic component side, the second surface of the two electronic components facing the second electronic component side, the first surface and the said A housing having a plurality of through holes penetrating the second surface, a base portion press-fitted into the through holes, and an oblique portion of the base portion outward from the first surface in the thickness direction of the housing with respect to the first surface. A first contact beam having a first contact portion in contact with the first electric component at the extending tip portion, and an oblique portion in the thickness direction with respect to the second surface from the base portion to the outside of the second surface. It has a plurality of contacts having a second contact beam having a second contact portion in contact with the second electric component at the extending tip portion.
The first distance between the closest portions of the first contact beams of two adjacent contacts adjacent to each other in the width direction is the second of the closest portions of the second contact beams of the two adjacent contacts. An interposer characterized in that the first contact beam is wider than the second contact beam so as to be narrower than the distance between the two. A claim characterized in that the first contact beam is wide such that the first spacing is narrower than the thickness of the bulkhead separating the two through holes into which the base of the two adjacent contacts is press-fitted. The interposer according to 1. The portion of the first contact beam excluding the tip portion having the first contact portion has a uniform first width and has the second contact portion of the second contact beam. The interposer according to claim 1 or 2, wherein the portion excluding the tip portion has a uniform second width narrower than the first width. The interposer according to any one of claims 1 to 3, wherein the contact has a structure symmetrical in the width direction.

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