JP2020153647A - Total heat exchange element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a total heat exchange element capable of improving the heat exchange performance of the total heat exchange element. SOLUTION: A partition plate for a total heat exchange element in which a latent heat storage material-encapsulating microcapsule is supported on a base material and a partition plate for a total heat exchange element in which a hygroscopic substance is supported on the base material are used. The total heat exchange element can provide a total heat exchange element capable of improving the heat exchange performance of the total heat exchange element. [Selection diagram] None

Description

The present invention is mounted on a total heat exchanger that supplies fresh outside air to a room and discharges dirty air in the room in order to maintain a comfortable space in a building, office, store, residence, etc. It relates to a total heat exchange element.

In indoor air conditioning, as a ventilation method with excellent cooling and heating efficiency, exchange of humidity (latent heat) as well as temperature (sensible heat) between the air supply that supplies fresh outside air and the exhaust flow that discharges dirty air in the room. It is well known that total heat exchange is performed at the same time.

In a total heat exchange element that performs total heat exchange, partition plates (partition material, element paper, liner, spacer) for total heat exchange elements are laminated via a spacing plate for total heat exchange elements to allow outdoor air to enter the room. The air supply path to be introduced and the exhaust path for discharging the indoor air to the outside are configured, and the air supply path and the exhaust path are independent. Since the partition plate for the total heat exchange element is made of thin leaf paper or film and total heat exchange is performed between the partition plates for the total heat exchange element, the room is ventilated by a total heat exchanger equipped with such a total heat exchange element. For example, it is possible to greatly improve the cooling and heating efficiency.

With the widespread use of total heat exchangers, total heat exchangers have come to be installed in various places and environments. Further, as the total heat exchange element base material used in the total heat exchanger, paper, film or the like is appropriately selected according to the environment and purpose of use and the cost as a system.

Increasing the heat exchange efficiency of the total heat exchanger as a whole is important from the viewpoint of energy saving and system cost reduction, and increasing the heat exchange efficiency of the total heat exchange element used in the total heat exchanger is also important. Is important to. On the other hand, a hygroscopic agent is applied, and the air permeability according to JIS P8117 is 0.13 μm / (Pa · s) or less, and the permeation under the conditions of 23 ° C. and 50% relative humidity according to JIS Z0208. humidity is not less 300 g ^/ m 2 · 24h or more, the ratio of machine direction orientation strength / lateral orientation strength of the sheet is 1.0 to 1.8, more preferably longitudinal orientation strength / lateral A total heat exchange element paper characterized in that the ratio of orientation strength is 1.0 to 1.5 has been proposed (see, for example, Patent Document 1). Although the total heat exchange element made of this total heat exchange element paper is excellent in the heat exchange property of latent heat, the heat exchange property of sensible heat is the same as before, and the heat exchange performance as total heat exchange property is improved. It is more preferable that there is an up.

In addition, a binder is mixed with a fibrous material containing ceramic fibers as a main component, and a flat plate and a corrugated sheet of the paper leaf-like material obtained by papermaking are alternately polymerized to polymerize heat exchange between the paper leaves. A total heat exchange element having a path formed has been proposed (see, for example, Patent Document 2). This total heat exchange element is good because the heat exchange effect performance is improved, but it takes time and cost because a ceramic fiber having good thermal conductivity is made into a paper sheet which is a partition plate for the total heat exchange element. Is.

Further, it has a fiber base material mainly composed of cellulose fibers and a temperature control agent containing a latent heat storage component having a melting point of 10 to 35 ° C. dispersed in the fiber base material, and the content of the temperature control agent is transparent. A breathable sheet has been proposed, characterized in that it is 1.0 to 8.0% by mass and has a density of 0.5 to 1.5 g / cm ³ with respect to the total mass of the wet sheet (eg,). See Patent Document 3). The moisture-permeable sheet and the total heat exchanger element using the moisture-permeable sheet as a partition plate are said to have excellent heat transfer properties, moisture permeability and gas barrier properties, and are less likely to cause dew condensation. However, the gas barrier property is not excellent even though it allows moisture to pass through (moisture permeability), and the temperature control agent itself containing the latent heat storage component dispersed in the fiber substrate does not contribute to moisture absorption or desorption, which is a barrier. As a result, the moisture permeability is further hindered, and even if the heat exchange property of sensible heat is excellent, there is a problem that the heat exchange property of latent heat is inferior.

Japanese Unexamined Patent Publication No. 2015-59286 Japanese Unexamined Patent Publication No. 52-127663 Japanese Unexamined Patent Publication No. 2017-179613

An object of the present invention is to provide a total heat exchange element capable of improving total heat exchange ability, that is, heat exchange performance of both sensible heat and latent heat.

As a result of diligent studies to solve the above problems, the following inventions were made.

(1) A total heat exchange element partition plate in which a latent heat storage material-encapsulating microcapsule is supported on the base material and a partition plate for the total heat exchange element in which a hygroscopic substance is supported on the base material. Heat exchange element.
(2) The total heat exchange element according to (1) above, wherein the base material of the partition plate for the total heat exchange element is paper or a film.
(3) The total heat exchange element according to (1) or (2) above, wherein the content of the latent heat storage material-encapsulating microcapsules in the interval plate for the total heat exchange element is 1 to 50% by mass with respect to the base material.
(4) The total heat exchange element according to any one of (1) to (3) above, wherein the latent heat storage material used for the latent heat storage material-encapsulating microcapsules has a melting point of 8 to 36 ° C.

A total heat exchange element spacing plate in which a latent heat storage material-encapsulating microcapsule is supported on the base material of the present invention, and a partition plate for a total heat exchange element in which a hygroscopic substance is supported on the base material. The heat exchange element can provide a total heat exchange element capable of improving the heat exchange performance of the total heat exchange element.

It is the schematic of the total heat exchange element.

Hereinafter, the components of the total heat exchange element using the total heat exchange element spacing plate and the total heat exchange element partition plate according to the present invention will be described in detail.

The total heat exchange element 1 of the present invention will be described with reference to FIG. In the total heat exchange element 1 that performs total heat exchange, the partition plate 2 (partition material, liner, spacer) for the total heat exchange element is laminated via the interval plate 3 for the total heat exchange element, and the outdoor air is introduced into the room. The air supply path 4 to be introduced and the exhaust path 5 for discharging the indoor air to the outside are configured, and the air supply path 4 and the exhaust path 5 are independent. Airflows 6 and 7 flow through the air supply path 4 and the exhaust path 5, and total heat exchange is performed between the partition plates 2 for the total heat exchange element. If the room is ventilated by a total heat exchanger provided with such a total heat exchange element 1, the cooling and heating efficiency can be greatly improved.

Further, the partition plate 2 for the total heat exchange element is placed between the upper and lower total heat exchange element spacing plates 3 when laminating the total heat exchange element spacing plate 3, and is bonded with a binder to obtain total heat. The exchange element 1 is formed.

The base material of the spacing plate 3 for the total heat exchange element is not particularly limited, and general materials such as wood board, paper, metal board, film, fiber sheet such as rayon and polyamide, and plastic sheet are used, but wavy. A material that is easy to process is appropriately selected. Among them, paper is preferable, and among papers, kraft paper and the like are one of the easy-to-use materials.

When the latent heat storage material is supported on the base material of the interval plate 3 for the total heat exchange element, the heat exchange performance can be further improved as the total heat exchange element. Compared to the case where the latent heat storage material is supported on the partition plate for the total heat exchange element as in Patent Document 3, the case where the latent heat storage material is supported on the base material of the interval plate for the total heat exchange element as in the present invention. Is the amount of latent heat storage material carried in the space formed by the two partition plates and the space plate between them, even if the amount of latent heat storage material carried per unit area of each partition plate and spacing plate is the same. Is more likely to be supported on the spacing plate than on the partition plate, which not only improves the sensible heat exchangeability, but also does not hinder the moisture absorption of the partition plate by the latent heat storage material. Can be improved. Therefore, the base material of the interval plate 3 for the total heat exchange element according to the present invention is supported with the latent heat storage material-encapsulating microcapsules in which the latent heat storage material is encapsulated in the microcapsules. Even if the latent heat storage material itself that is not encapsulated is supported on the base material, the heat exchange performance can be improved to a certain extent, but if the latent heat storage material that is not encapsulated is supported, the latent heat storage material is melted by the external environment. This is not preferable because the latent heat storage material may flow out and move into or out of the interval plate for the total heat exchange element. In the present invention, the latent heat storage material-encapsulating microcapsules in which the latent heat storage material is encapsulated in the microcapsules may be abbreviated as the heat storage material-encapsulating microcapsules.

The latent heat storage material contained in the heat storage material-encapsulating microcapsules according to the present invention is used for the purpose of storing heat by utilizing the latent heat associated with the phase transition, and any compound having a melting point or a freezing point can be used. .. Specific latent heat storage materials include aliphatic hydrocarbon compounds (paraffin compounds) such as tetradecane, hexadecane, octadecane, and paraffin wax, fatty acids such as palmitic acid and myristic acid, and aromatic carbonization such as benzene and p-xylene. Examples thereof include hydrogen compounds, ester compounds such as isopropyl palmitate, butyl stearate, stearyl stearate, and myristyl myristate, and compounds such as alcohols such as stearyl alcohol, which have a heat of fusion of 80 kJ / kg or more and are chemically and physically. It is preferable to use a substance that is stable and inexpensive. Further, in order to improve the heat exchange performance, it is preferable to use a latent heat storage material having a melting point in the range of 8 to 36 ° C. Furthermore, depending on the location where the total heat exchanger including the total heat exchange element is installed, the weather environment, etc., either cooling or heating is emphasized, and in order to improve the heat exchange performance under the emphasized conditions. Select the melting point zone of the latent heat storage material. Specifically, it is desirable to appropriately select and use a latent heat storage material having a melting point of about 8 to 25 ° C. for cooling and about 18 to 36 ° C. for heating.

Two or more kinds of these latent heat storage materials may be mixed and used, and an overcooling preventive material, a specific gravity adjusting material, a deterioration preventive agent and the like can be added as needed. Further, two or more kinds of latent heat storage material-encapsulating microcapsules having different melting points of the latent heat storage material can be mixed and used.

Physical methods and chemical methods are known as methods for producing the latent heat storage material-encapsulating microcapsules according to the present invention. In particular, as a method for microencapsulating the latent heat storage material containing the heat storage material, encapsulation by a composite emulsion method is performed. Method (Japanese Patent Laid-Open No. 62-1452), method of spraying a thermoplastic resin on the surface of heat storage material particles (Japanese Patent Laid-Open No. 62-45680), forming a thermoplastic resin in a liquid on the surface of heat storage material particles. (Japanese Patent Laid-Open No. 62-149334), a method of polymerizing and coating a monomer on the surface of heat storage material particles (Japanese Patent Laid-Open No. 62-225241), a method of producing a polyamide film heat storage material microcapsule by an interfacial polycondensation reaction. (Japanese Patent Laid-Open No. 2-258502) and the like are used.

As the film material of the latent heat storage material-encapsulating microcapsules according to the present invention, polystyrene, polyacrylonitrile, poly (meth) acrylate, and polyamide obtained by a method such as an interfacial polymerization method, an in-situ method, or a radical polymerization method. , Polyacrylamide, ethyl cellulose, polyurethane, polyurethane urea, aminoplast resin, melamine formalin resin, urea formalin resin, or synthetic or natural resin using the core selvation method of gelatin and carboxymethyl cellulose or Arabic rubber is used. In particular, melamine formalin resin, urea formalin resin, polyamide, polyurea, and polyurethane urea, which are physically and chemically stable films, are preferable.

The volume average particle size of the latent heat storage material-encapsulating microcapsules according to the present invention is preferably in the range of 0.5 to 50 μm, and more preferably in the range of 1 to 20 μm. A volume average particle size larger than 50 μm may be extremely vulnerable to mechanical shearing force, and a volume average particle size smaller than 0.5 μm suppresses fracture, but the film thickness becomes thin and heat resistance becomes poor. There is. The volume average particle diameter described in the present invention represents the average particle diameter of the volume conversion value of the microcapsule particles. In principle, particles having a constant volume are screened in ascending order and correspond to 50% of the volume. It means the particle size at the time when the particles are separated. The volume average particle size can be measured by actual measurement by microscopic observation, but it can be automatically measured by using a commercially available electrical and optical particle size measuring device, and the volume average particle size in the present invention is the United States. The measurement was performed using a particle size measuring device Multisizer II manufactured by Beckman Coulter.

The content of the latent heat storage material-encapsulating microcapsules in the base material of the total heat exchange element spacing plate 3 is not particularly limited, but is preferably 0.5 to 40 g / m ² , and more preferably 1.0 to 30 g / m ^2. , More preferably 1.0 to 10 g / m ² . If it is less than 0.5 g / m ² , the effect of improving the heat exchange performance as a total heat exchange element may be reduced. On the other hand, even if it contains more than 40 g / m ² , the effect of improving the heat exchange performance reaches a plateau, which is uneconomical.

The method of supporting the latent heat storage material-encapsulating microcapsules on the base material of the interval plate 3 for the total heat exchange element is to impregnate, coat, spray, or the like with a mixture of the latent heat storage material-encapsulating microcapsules and the binder. A method of fixing by drying after adhering to the water can be used. The binder is not particularly limited, but for example, polyvinyl alcohol type, (meth) acrylic acid resin type, aromatic vinyl compound resin type, styrene-butadiene rubber type, vinyl acetate resin type, ethylene-vinyl acetate copolymer resin type. , Silicon resin-based, fluororesin-based and the like, and water-based binder is particularly preferable.

In the present invention, paper or film is used as the base material of the partition plate 2 for the total heat exchange element.

The paper used as the base material of the partition plate 2 for the total heat exchange element is a thin paper that is easily coated with a hygroscopic substance or the like, and preferably has a basis weight of 15 to 130 g / m ² . Tracing paper, glassine paper, condenser paper and the like, which are thin papers having a basis weight of 15 to 40 g / m ² , are more preferable. Even if the basis weight is less than 15 g / m ² or more than 130 g / m ² , the workability as the partition plate 2 for the total heat exchange element may be deteriorated, which is not preferable. Moreover, if the basis weight exceeds 130 g / m ² , the material cost also increases, which is uneconomical. In the present invention, the basis weight of paper is a value measured according to JIS P8124: 2011 “Paper and Paperboard-Measurement Method of Basis Weight”.

The film used as the base material of the partition plate 2 for the total heat exchange element includes a polyolefin film such as polyethylene and polypropylene, a polyvinyl chloride film, a polyvinylidene chloride film, a polyvinyl alcohol film, a polyester film, and ethylene-vinyl acetate. A general film such as a polymer film can be used. The film used as the base material of the partition plate 2 for the total heat exchange element is more preferably a moisture-permeable film in which innumerable micropores are formed by containing an inorganic filler to impart moisture permeability and breathability.

Examples of the inorganic filler contained in the film include fine particles such as calcium carbonate, calcium sulfate, barium carbonate, barium sulfate, and titanium oxide. Among them, calcium carbonate and barium sulfate are preferable, and the average particle size of the inorganic filler is preferably 0.1 to 10 μm, more preferably 0.3 to 5 μm. When the average particle size of the inorganic filler is 10 μm or less, the generation of large pores can be suppressed during film formation, and sufficient strength, moisture permeability and air permeability can be formed. In the present invention, the average particle size was measured using Microtrac MT-3300EXII manufactured by Microtrac Bell Co., Ltd. A 0.025 mass% sodium hexametaphosphate aqueous solution was used as a solvent, and the dispersion conditions were 40 W and 10 minutes by internal ultrasonic waves.

The basis weight of the film is preferably 10 to 50 g / m ² . Even if the basis weight is less than 10 g / m ² or more than 50 g / m ² , the workability as the partition plate 2 for the total heat exchange element may be deteriorated, which is not preferable. Moreover, if the basis weight exceeds 50 g / m ² , the material cost also increases, which is uneconomical. In the present invention, the basis weight of the film is such that three target sheets having a size of 20 cm × 30 cm are held in a room at 23 ° C. and 50% RH for 12 hours in advance, and then the mass (g) of the sheets is adjusted to the last four digits. It is an average integer value measured by a balance and calculated by the following formula.

Film basis weight (g / m ² ) = average mass of one sheet (g) / 0.06 (m ² )

The base material of the partition plate 2 for the total heat exchange element according to the present invention contains a hygroscopic substance in order to improve the heat exchange efficiency. Examples of the hygroscopic substance according to the present invention include inorganic acid salts, organic acid salts, inorganic fillers, polyhydric alcohols, ureas, and hygroscopic (water-absorbing) polymers. Examples of the inorganic acid salt include lithium chloride, calcium chloride, magnesium chloride and the like. Examples of the organic acid salt include sodium lactate, calcium lactate, sodium pyrrolidone carboxylate and the like. Examples of the inorganic filler include aluminum hydroxide, calcium carbonate, aluminum silicate, magnesium silicate, talc, clay, zeolite, diatomaceous earth, sepiolite, silica gel, and activated charcoal. Examples of the polyhydric alcohol include glycerin, ethylene glycol, triethylene glycol, and polyglycerin. Examples of ureas include urea and hydroxyethyl urea. Examples of the moisture-absorbing (water-absorbing) polymer include polyaspartic acid, polyacrylic acid, polyglutamic acid, polylysine, alginic acid, carboxymethyl cellulose, hydroxyalkyl cellulose and their salts or crosslinked products, carrageenan, pectin, gellan gum, agar, xanthan gum, hyaluron. Acids, guar gum, gum arabic, starch and their crosslinked products, polyethylene glycol, polypropylene glycol, collagen, acrylic nitrile polymer saponification, starch / acrylate graft copolymer, vinyl acetate / acrylate copolymer ken Compounds, starch / acrylic nitrile graft copolymer, acrylate / acrylamide copolymer, polyvinyl alcohol / maleic anhydride copolymer, polyethylene oxide-based, isobutylene / maleic anhydride copolymer, polysaccharide / acrylate graft There are self-crosslinked bodies and the like. It is used by selecting the type and the amount of adhesion according to the target moisture permeability.

The hygroscopic substance is applied or impregnated on the substrate, spray-coated, and then dried.
The amount of the hygroscopic substance attached to the substrate is not particularly limited. Depending on the type of the hygroscopic material used, JIS Z0208: using the evaluation method 1976, 23 ° C., if the moisture permeability measured at 50% relative humidity is 300g ^/ m 2 · 24h or more, A total heat exchange element having excellent wet heat exchange performance can be obtained. The amount of the hygroscopic agent attached depends on the physical properties of the base material used and the type of the hygroscopic agent used, but largely depends on the device used for the adhesion. In the case of adhesion by impregnation machine, depending on the drying capacity of the apparatus, it is preferable that the attached amount of the adsorbent is ^{1g / m 2 ~30g / m 2} , 3.0g / m 2 ~25g / More preferably, it is m ² . Preferably the water vapor permeability is ^{300g / m 2 · 24h~3000g / m} 2 · 24h, more preferably ^{400g / m 2 · 24h~2000g / m} 2 · 24h.

The spacing plate for the total heat exchange element and the partition plate for the total heat exchange element may be subjected to calendar processing on the base material in order to obtain the required density, smoothness, and air permeability. As the calendar device, a device consisting of hard rolls, elastic rolls, or a combination of hard rolls and elastic rolls is preferably used, and a machine calendar, soft nip calendar, super calendar, multi-stage calendar, multi-nip calendar, etc. are also used. can do.

Further, a flame retardant can be attached to the base material for the purpose of imparting flame retardancy to the total heat exchange element spacing plate and the total heat exchange element partition plate. Examples of the flame retardant include an inorganic flame retardant, an inorganic phosphorus compound, a nitrogen-containing compound, a chlorine compound, and a bromine compound. For example, a mixture of boric acid and boric acid, aluminum hydroxide, antimony trioxide, ammonium phosphate, ammonium polyphosphate, ammonium sulfamate, guanidine sulfamate, guanidine phosphate, phosphate amide, chlorinated polyolefin, ammonium bromide, Examples thereof include a flame retardant that can be dispersed in an aqueous solution such as a non-ether type polybromocyclic compound or water. As for the level of flame retardancy, the carbonization length measured by JIS A 1322: 1966 is preferably less than 10 cm, and the amount of the flame retardant adhered is not particularly limited. Incidentally, depending on the flame retardant to be used, it is preferable deposition amount of the flame retardant is in the range of ^{3g / m 2 ~10g / m 2} . Even if more than 10 g / m ² is attached, the flame retardant effect will reach a plateau, which is uneconomical and not preferable. The method of adhering the flame retardant is generally such as impregnation, coating, spray coating, etc. of the base material of the partition plate 2 for the total heat exchange element or the interval plate 3 for the total heat exchange element with a mixed solution of the flame retardant and the binder. After adhering in a specific manner, it can be fixed by drying. As the binder, the above-mentioned binder can be used.

Further, additives such as an antibacterial agent and an anti-allergen agent are attached to the total heat exchange element spacing plate and the total heat exchange element partition plate used in the present invention for the purpose of imparting functions such as antibacterial properties. Is also good.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to the Examples. Unless otherwise specified, "%" and "part" in the examples represent "mass%" and "parts by mass", respectively.

<Preparation of microcapsules 1 containing latent heat storage material>
Hexamethylene diisocyanate bullet-type isocyanate prepolymer (manufactured by Sumika Cobestrourethane Co., Ltd., trade name: Death Module (registered trademark) N-3200) 13 g and polypeptide diphenylmethane diisocyanate (manufactured by Toso Co., Ltd., trade name: millionate) A solution prepared by dissolving 2 g of MR-200) in 50 g of ethyl acetate at room temperature and butyl stearate as a latent heat storage material (manufactured by Kao Co., Ltd., trade name: Exepearl (registered trademark) BS) (melting point: 21). ~ 24 ° C.) 60 g was mixed with a liquid heated to 50 ° C. to obtain an oil-soluble liquid A. Next, 50 g of a sodium salt aqueous solution of a 6% styrene-maleic anhydride copolymer hydrolyzate adjusted to pH 7 and 4% polyvinyl alcohol (manufactured by Kuraray Co., Ltd., trade name: Kuraray Poval (registered trademark) 23-88E). An oil-soluble liquid A heated to 50 ° C. is slowly added to a liquid obtained by mixing 50 g of an aqueous solution and heated to 50 ° C., and strong stirring is performed until the volume average particle size becomes 3 μm for emulsification. Obtained liquid. Further, 10 g of a 30% diethylenetriamine aqueous solution was added while stirring the emulsion, and the mixture was heated and stirred at 80 ° C. for 3 hours to obtain microcapsules 1 containing a latent heat storage material on a polyurethane urea resin wall.

<Making microcapsules 2 containing latent heat storage material>
6.5 g of a 37% aqueous formaldehyde solution and 10 g of water were added to 5 g of melamine powder to adjust the pH to 8, and then heated to about 70 ° C. to obtain an aqueous melamine-formaldehyde initial condensate. Next, the temperature was adjusted to 50 ° C. in advance as a latent heat storage material in 100 g of a sodium salt aqueous solution of a 5% styrene-maleic anhydride copolymer hydrolyzate whose pH was adjusted to 4.5. Add 60 g of warm n-pentadecane (special grade reagent manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) (melting point: about 10 ° C) with vigorous stirring, emulsify until the volume average particle size reaches 3 μm, and add the emulsion. Obtained. An aqueous solution of the initial condensate of melamine-formaldehyde was added to this emulsion with stirring, and a heating reaction was carried out at 80 ° C. for 3 hours to obtain microcapsules 2 containing a latent heat storage material of a melamine-formaldehyde resin wall.

<Coating liquid a>
Latent heat storage material-encapsulated microcapsules 1:10 parts 20% polyvinyl alcohol aqueous solution (manufactured by Kuraray Co., Ltd., trade name: Kuraray Poval (registered trademark) 5-98): 1.5 parts Water: 88.5 parts

<Preparation of spacing plate 3-1 for total heat exchange element>
The coating liquid a was applied to 60 g / m ² bleached kraft paper with a rod bar to dry the latent heat storage material-encapsulating microcapsules 1 at 6 g / m ² on both sides, and dried at 120 ° C. for 3 minutes. This was prepared as a spacing plate 3-1 for a total heat exchange element. The content of the latent heat storage material-encapsulating microcapsules 1 in the base material is 10%.

<Preparation of partition plate I for total heat exchange element>
The softwood bleached kraft pulp (NBKP) was disintegrated at a concentration of 3% and then beaten using a double disc refiner and a deluxe finer until the Canadian modified filtrate of the pulp reached 100 ml. Then, a substrate for a partition plate for a total heat exchange element having a basis weight of 30 g / m ² was manufactured by a long net paper machine. Then, calcium chloride as a hygroscopic substance was impregnated with a nip coater so as to be 6 g / m ² after drying, and dried to obtain a partition plate I for a total heat exchange element. The Canadian modified water freshness is the Canadian standard described in JIS P8121: 2012, except that an 80-mesh wire mesh with a wire diameter of 0.14 mm and a mesh size of 0.18 mm was used as a sieving plate and the sample concentration was 0.05%. It is the degree of free water measured by the method for measuring the degree of drainage.

(Example 1)
Using the total heat exchange element spacing plate 3-1, a total heat exchange element spacing plate 3 having a length of 200 mm, a width of 200 mm, a height of 250 mm, and a one-step height of 4 mm was produced. Next, the partition plate I for the total heat exchange element is used as the partition plate 2 for the total heat exchange element, and an ethylene-vinyl acetate-based adhesive is used for bonding the members, and the total heat exchange has the shape shown in FIG. The element (1) was manufactured.

(Example 2)
A spacing plate 3-2 for a total heat exchange element was prepared in the same manner as in Example 1 except that the latent heat storage material-encapsulating microcapsules 1 were contained at 3 g / m ² on both sides after drying. The content of the latent heat storage material-encapsulating microcapsules 1 in the spacing plate 3-2 for the total heat exchange element is 5%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (2) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Example 3)
A spacing plate 3-3 for a total heat exchange element was prepared in the same manner as in Example 1 except that the latent heat storage material-encapsulating microcapsules 1 were contained at 0.6 g / m ² on both sides after drying. The content of the latent heat storage material-encapsulating microcapsules 1 in the spacing plate 3-3 for the total heat exchange element is 1%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (3) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Example 4)
A spacing plate 3-4 for a total heat exchange element was prepared in the same manner as in Example 1 except that the latent heat storage material-encapsulating microcapsules 1 were contained at 30 g / m ² on both sides after drying. The content of the latent heat storage material-encapsulating microcapsules 1 in the spacing plate 3-4 for the total heat exchange element is 50%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (4) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Comparative Example 1)
A 60 g / m ² bleached kraft paper was prepared as a spacing plate 3-11 for the total heat exchange element. The content of the latent heat storage material-encapsulating microcapsules in the spacing plate 3-11 for the total heat exchange element is 0%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (11) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Comparative Example 2)
Similar to Comparative Example 1, 60 g / m ² bleached kraft paper was prepared as a spacing plate 3-11 for the total heat exchange element. Further, the coating liquid a prepared in Example 1 is applied to the partition plate I for the total heat exchange element with a rod bar so that the latent heat storage material-encapsulating microcapsules 1 are dried to 1.5 g / m ² on both sides. , 120 ° C. for 3 minutes to prepare as a partition plate II for a total heat exchange element. The content of the latent heat storage material-encapsulating microcapsules 1 in the base material is 5%.
Using the above spacing plate 3-11 for total heat exchange element that does not contain the latent heat storage material and the partition plate II for total heat exchange element that contains the capsule-shaped latent heat storage material and hygroscopic substance, in the same manner as in Example 1. A total heat exchange element (12) having the shape shown in FIG. 1 was produced.

(Example 11)
The interval plate 3-21 for the total heat exchange element was prepared in the same manner as in Example 1 except that the latent heat storage material-encapsulating microcapsules 2 were replaced with the latent heat storage material-encapsulating microcapsules 2. The content of the latent heat storage material-encapsulating microcapsules 2 in the spacing plate 3-21 for the total heat exchange element is 10%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (21) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Example 12)
The interval plate 3-22 for the total heat exchange element was prepared in the same manner as in Example 2 except that the latent heat storage material-encapsulating microcapsules 2 were replaced with the latent heat storage material-encapsulating microcapsules 2. The content of the latent heat storage material-encapsulating microcapsules 2 in the spacing plate 3-22 for the total heat exchange element is 5%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (22) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Example 13)
The interval plate 3-23 for the total heat exchange element was prepared in the same manner as in Example 3 except that the latent heat storage material-encapsulating microcapsules 2 were replaced with the latent heat storage material-encapsulating microcapsules 2. The content of the latent heat storage material-encapsulating microcapsules 2 in the spacing plate 3-23 for the total heat exchange element is 1%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (23) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Example 14)
The interval plate 3-24 for the total heat exchange element was prepared in the same manner as in Example 4 except that the latent heat storage material-encapsulating microcapsules 2 were replaced with the latent heat storage material-encapsulating microcapsules 2. The content of the latent heat storage material-encapsulating microcapsules 2 in the spacing plate 3-24 for the total heat exchange element is 50%. Further, a total heat exchange element partition plate I was used as the total heat exchange element partition plate 2, and a total heat exchange element (24) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Comparative Example 11)
A total heat exchange element (31) having the shape shown in FIG. 1 was produced in exactly the same manner as in Comparative Example 1.

(Example 21)
As the total heat exchange element spacing plate 3, a total heat exchange element spacing plate 3-1 was used. The content of the latent heat storage material-encapsulating microcapsules 1 with respect to the base material is 10%. Further, as a base material for a partition plate for a total heat exchange element, a polyethylene film (thickness 24 μm, basis weight 20 g / m ² ) produced by adding 50% of calcium carbonate having an average particle diameter of 3 μm is used for the total heat exchange element. Prepared as partition plate III. Using these interval plates for total heat exchange elements 3-1 and partition plates III for total heat exchange elements, a total heat exchange element (41) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Example 22)
A total heat exchange element spacing plate 3-2 was used as the total heat exchange element spacing plate. The content of the latent heat storage material-encapsulating microcapsules 1 with respect to the base material is 5%. Further, as the partition plate 2 for the total heat exchange element, the partition plate III for the total heat exchange element produced in Example 21 is used, and the total heat exchange element (42) having the shape of FIG. 1 is used in the same manner as in Example 1. Made.

(Example 23)
A total heat exchange element spacing plate 3-2 was used as the total heat exchange element spacing plate. The content of the latent heat storage material-encapsulating microcapsules 1 with respect to the base material is 1%. Further, as the partition plate 2 for the total heat exchange element, the partition plate III for the total heat exchange element produced in Example 21 is used, and the total heat exchange element (43) having the shape of FIG. 1 is used in the same manner as in Example 1. Made.

(Example 24)
A total heat exchange element spacing plate 3-4 was prepared as a total heat exchange element spacing plate. The content of the heat storage material-encapsulating microcapsules 1 with respect to the base material is 50%. Further, using the partition plate III for the total heat exchange element, a total heat exchange element (44) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

(Comparative Example 21)
As the total heat exchange element spacing plate 3, the total heat exchange element spacing plate 3-11 was used. Further, a total heat exchange element partition plate III was used as the total heat exchange element partition plate 2, and a total heat exchange element (51) having the shape shown in FIG. 1 was produced in the same manner as in Example 1.

[Evaluation method of heat exchange performance]
According to JIS B8628: 2003, the heat exchange efficiency of the total heat exchange element was evaluated using each total heat exchange element produced above. The total heat exchange elements (1) to (4), (41) to (44), (11) to (11) to Examples 1 to 4, Examples 21 to 24, Comparative Examples 1 to 2, and Comparative Example 21. 12) and (51) evaluated the heat exchange efficiency of heating, and the total heat exchange elements (21) to (24) and (31) of Examples 11 to 14 and Comparative Example 11 evaluated the heat exchange efficiency of cooling. .. Further, the heat exchange efficiencies of the total heat exchange elements (1) to (4) and (12) of Examples 1 to 4 and Comparative Example 2 are compared with the heat exchange efficiencies of the total heat exchange elements (11) of Comparative Example 1. The good or bad of the heat exchange efficiency of the total heat exchange elements (21) to (24) of Examples 11 to 14 was compared with the heat exchange efficiency of the total heat exchange elements (31) of Comparative Example 11. The heat exchange efficiency of the total heat exchange elements (41) to (44) of Examples 21 to 24 was evaluated as good or bad as compared with the heat exchange efficiency of the total heat exchange element (51) of Comparative Example 21. The evaluation is made in order from 1 to 5 on a 5-point scale (1 is defective, 2 is slightly defective, 3 is equivalent, 4 is slightly good, and 5 is good), and the results are shown in Tables 1 to 3.

In the total heat exchange elements (1) to (4) of Examples 1 to 4, the latent heat storage material-encapsulating microcapsule 1 containing the latent heat storage material having a melting point of 21 to 24 ° C. is 1 to 50 mass with respect to the base material. Percentage for total heat exchange elements and partition plate for total heat exchange elements whose base material is paper, but for total heat exchange elements that do not contain microcapsules containing latent heat storage material The heat exchange efficiency was better than that of the total heat exchange element (11) of Comparative Example 1 using the spacing plate.

Further, in the total heat exchange elements (21) to (24) of Examples 11 to 14, the latent heat storage material-encapsulating microcapsules 2 containing the latent heat storage material having a melting point of about 10 ° C. are provided from 1 to 50 with respect to the base material. A total heat exchange element that uses a mass% content spacing plate for total heat exchange elements and a partition plate for total heat exchange elements whose base material is paper, but does not contain microcapsules containing a latent heat storage material. The heat exchange efficiency was all better than that of the total heat exchange element (31) of Comparative Example 11 using the interval plate.

In the total heat exchange elements (41) to (44) of Examples 21 to 24, the latent heat storage material-encapsulating microcapsule 1 containing the latent heat storage material having a melting point of 21 to 24 ° C. is 1 to 50 mass by mass with respect to the base material. Although the interval plate for the total heat exchange element and the partition plate for the total heat exchange element whose base material is a film are used, the heat is compared with the total heat exchange element (51) of Comparative Example 21. The exchange efficiency was all good.

In the total heat exchange element (12) of Comparative Example 2, the interval plate for the total heat exchange element does not contain the latent heat storage material, and the partition plate for the total heat exchange element contains the microcapsules containing the latent heat storage material. The heat exchange efficiency of the total heat exchange element (11) of Comparative Example 1 was good, and there was a certain heat exchange property. However, even if the amount of the latent heat storage material-encapsulating microcapsules carried per unit area of the partition plate for the total heat exchange element and the interval plate for the total heat exchange element is the same, the latent heat storage material is applied to the partition plate for the total heat exchange element. The heat exchange performance is inferior to that of Example 1 in which the space plate for the total heat exchange element contains the latent heat storage material-encapsulating microcapsules, and the space plate for the total heat exchange element does not contain the latent heat storage material. The amount of capsules carried is half that of Example 2, that is, the amount of microcapsules containing the latent heat storage material per unit area is almost the same as that of Example 3 which is two-fifths of Comparative Example 1, and the total heat. It was not excellent in exchangeability.

To summarize all the results above, a spacing plate for total heat exchange elements in which a latent heat storage material-encapsulating microcapsule is supported on the base material and a partition plate for total heat exchange elements in which a hygroscopic substance is supported on the base material. The total heat exchange element using the above has improved heat exchange efficiency as compared with the total heat exchange element that does not use the latent heat storage material-encapsulating microcapsule in the interval plate for the total heat exchange element. It can be said that the assembly workability is good.

Then, the heat exchange performance of the total heat exchange element can be improved by the total heat exchange element formed by using the total heat exchange element spacing plate and the total heat exchange element partition plate of the present invention.

The total heat exchange element using the total heat exchange element spacing plate and the total heat exchange element partition plate of the present invention can be used for a total heat exchanger.

1 Total heat exchange element 2 Partition plate for total heat exchange element 3 Spacing plate for total heat exchange element 4 Air supply path 5 Exhaust path 6, 7 Air flow

Claims (4)

Total heat exchange element using a spacing plate for total heat exchange element in which latent heat storage material-encapsulating microcapsules are supported on the base material and a partition plate for total heat exchange element in which a hygroscopic substance is supported on the base material. .. The total heat exchange element according to claim 1, wherein the base material of the partition plate for the total heat exchange element is paper or a film. The total heat exchange element according to claim 1 or 2, wherein the content of the latent heat storage material-encapsulating microcapsules in the interval plate for the total heat exchange element is 1 to 50% by mass with respect to the base material. The total heat exchange element according to any one of claims 1 to 3, wherein the latent heat storage material used for the latent heat storage material-encapsulating microcapsules has a melting point of 8 to 36 ° C.

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