JP2020111765A - Hydrophilization treatment agent for metal plate, and hydrophilization treatment method using the same - Google Patents
Hydrophilization treatment agent for metal plate, and hydrophilization treatment method using the same Download PDFInfo
- Publication number
- JP2020111765A JP2020111765A JP2019001163A JP2019001163A JP2020111765A JP 2020111765 A JP2020111765 A JP 2020111765A JP 2019001163 A JP2019001163 A JP 2019001163A JP 2019001163 A JP2019001163 A JP 2019001163A JP 2020111765 A JP2020111765 A JP 2020111765A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- treatment
- agent
- hydrophilic treatment
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 74
- 239000002184 metal Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 37
- 239000004094 surface-active agent Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 23
- 239000003513 alkali Substances 0.000 claims abstract description 9
- 150000005215 alkyl ethers Chemical class 0.000 claims abstract description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 25
- 239000002738 chelating agent Substances 0.000 claims description 19
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 10
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 9
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 150000001447 alkali salts Chemical class 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 4
- 159000000011 group IA salts Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000013522 chelant Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000012459 cleaning agent Substances 0.000 description 10
- 238000005238 degreasing Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 239000012085 test solution Substances 0.000 description 5
- 239000003599 detergent Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- -1 polyoxy Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001365789 Oenanthe crocata Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- TVHALOSDPLTTSR-UHFFFAOYSA-H hexasodium;[oxido-[oxido(phosphonatooxy)phosphoryl]oxyphosphoryl] phosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O TVHALOSDPLTTSR-UHFFFAOYSA-H 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 description 1
- 235000019982 sodium hexametaphosphate Nutrition 0.000 description 1
- 235000019832 sodium triphosphate Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- DHQZXBINJKHIPR-UHFFFAOYSA-J tetrapotassium;1,1-diphosphonatoethanol Chemical compound [K+].[K+].[K+].[K+].[O-]P(=O)([O-])C(O)(C)P([O-])([O-])=O DHQZXBINJKHIPR-UHFFFAOYSA-J 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 1
- 235000019798 tripotassium phosphate Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
本発明は、鉄や非鉄金属等の金属板に対して塗装やめっき処理をおこなう前処理として、金属板を親水化して濡れ性を改善することにより、塗装膜やめっき膜の密着性を改善する金属板の親水化処理剤、及びこれを用いた親水化処理方法に関する。 The present invention improves the adhesion of a coating film or a plating film by hydrophilicizing the metal plate to improve wettability as a pretreatment for coating or plating a metal plate such as iron or non-ferrous metal. The present invention relates to a hydrophilic treatment agent for a metal plate and a hydrophilic treatment method using the same.
鉄や非鉄金属等の金属板に対して塗装やめっきをおこなう際に、金属表面に微小な有機物が残留していると、塗装液やめっき液がはじかれてしまうハジキと呼ばれる現象が発生することがある。この場合には、均一な塗装面やめっき面が得られないことになり、実用面では大きな問題であった。
また、ハジキに至らないまでも、金属表面に微小な有機物が残留していると、塗装膜やめっき膜と金属板との間に微小な有機物が介在することになるため、当該塗装膜と金属板との接着が充分ではなく、このため、当該塗装膜が剥がれやすくなってしまうという問題があった。
When painting or plating a metal plate such as ferrous or non-ferrous metal, if a small amount of organic matter remains on the metal surface, a phenomenon called cissing may occur, in which the coating solution or plating solution is repelled. There is. In this case, a uniform coated surface or plated surface cannot be obtained, which is a serious problem in practical use.
Even if cratering does not occur, if minute organic matter remains on the metal surface, minute organic matter will be present between the coating film or plating film and the metal plate. There is a problem that the coating film is not sufficiently adhered and thus the coating film is easily peeled off.
特に最近では、製品の長期的な信頼性を要求する必要性が高まっており、従来にも増して塗装膜やめっき膜の密着性を向上させることが必要である。また、半導体製造におけるフォトリソグラフィー技術においては、塗装膜に高い品質が求められるようになり、超微細なフォトエッチングにおいても精密な加工ができる高品質の塗装膜が求められるようになっている。 Particularly in recent years, there is an increasing need for long-term reliability of products, and it is necessary to improve the adhesion of coating films and plating films more than ever. Further, in the photolithography technology in semiconductor manufacturing, a high quality coating film is required, and a high quality coating film that can be precisely processed even in ultrafine photoetching is required.
従来、金属表面に塗装やめっき処理を行う場合には、その前処理として脱脂処理と濡れ性改善処理が行われていた。
すなわち、脱脂処理において、苛性アルカリ等からなる脱脂洗浄液により金属表面を洗浄する。しかし、金属板の表面濡れ性は脱脂洗浄のみでは向上しないため、さらに、表面濡れ性を改善するための表面処理が必要であった。そして、その濡れ性改善処理においては、酸素プラズマにより金属表面に残留する微小な有機物等を分解し、金属表面に親水性官能基を導入する方法、あるいは、金属表面に研磨剤を打ち込むブラスト処理により微小な有機物ごと金属表面を研磨・除去し、表面のアンカー効果と相俟って塗装等の密着力を高める方法、等の方法が採用されていた。
Conventionally, when a metal surface is coated or plated, degreasing treatment and wettability improving treatment are performed as pretreatments.
That is, in the degreasing treatment, the metal surface is washed with a degreasing cleaning liquid such as caustic alkali. However, the surface wettability of the metal plate is not improved only by degreasing and cleaning, and therefore, surface treatment for improving the surface wettability is required. Then, in the wettability improving treatment, a method of decomposing minute organic substances and the like remaining on the metal surface by oxygen plasma and introducing a hydrophilic functional group to the metal surface, or a blasting treatment in which an abrasive is injected into the metal surface A method of polishing/removing a metal surface together with minute organic substances to enhance the adhesion force such as coating in combination with the anchor effect of the surface has been adopted.
従来の塗装・めっき前処理技術は、脱脂処理と濡れ性改善処理という2工程で行なうので煩雑で手間がかかるため、これを簡略化して1回の処理で金属表面を親水化する技術を提供することが望まれていた。すなわち、金属表面を塗装あるいはめっきする前の前処理において、1回の処理で金属表面に残留する微小な有機物を除去し、金属表面を塗装やめっき処理に適した程度に親水化することが必要である。このような課題を解決し、新たな金属板の親水化処理剤及び親水化方法を提供することが、本発明の解決しようとする課題である。 The conventional coating/plating pretreatment technology is complicated and time-consuming because it is performed in two steps of degreasing treatment and wettability improvement treatment. Therefore, we provide a technology to simplify the process and make the metal surface hydrophilic in one treatment. Was desired. That is, in the pretreatment before coating or plating the metal surface, it is necessary to remove minute organic substances remaining on the metal surface in one treatment to make the metal surface hydrophilic to an extent suitable for coating or plating treatment. Is. It is a problem to be solved by the present invention to solve such a problem and to provide a new hydrophilic treatment agent and a hydrophilic method for a metal plate.
本発明は、従来技術の課題を解決するために、次の組成からなる親水化処理剤、及びこれを用いた親水化処理方法を提供するものである。
(1)次の成分を有する金属板の親水化処理剤
(a)無機アルカリ、(b)キレート剤、及び(c)表面張力30mN/m以下の界 面活性剤
(2)前記(a)の無機アルカリが、NaOH又はKOHであることを特徴とする金属板の親水化処理剤
(3)前記(b)のキレート剤がリン酸又はホスホン酸のアルカリ塩であることを特徴とする金属板の親水化処理剤。
(4)前記(b)のリン酸又はホスホン酸のアルカリ塩がエチドロン酸のアルカリ塩であることを特徴とする金属板の親水化処理剤
(5)前記(c)の界面活性剤がポリオキシアルキレンアルキルエーテルであることを特徴とする金属板の親水化処理剤。
(6)金属板に(1)〜(5)に記載された親水化処理剤を塗布することを特徴とする金属板の親水化処理方法。
(7)(6)に記載された親水化処理方法により親水化処理した金属板に塗料を塗布することを特徴とする塗装方法。
(8)(6)に記載された親水化処理方法により親水化処理した金属板にめっきを施すことを特徴とするめっき方法。
(9)(6)に記載された親水化処理方法によりリードフレームを親水化処理し、その後にめっき又は塗装処理を施すことを特徴するリードフレームの表面処理方法。
In order to solve the problems of the prior art, the present invention provides a hydrophilic treatment agent having the following composition, and a hydrophilic treatment method using the same.
(1) Hydrophilizing agent for a metal plate having the following components (a) an inorganic alkali, (b) a chelating agent, and (c) a surface tension agent having a surface tension of 30 mN/m or less (2) the above (a) Hydrophilic treatment agent for metal plates, wherein the inorganic alkali is NaOH or KOH (3) A metal plate characterized in that the chelating agent in (b) above is an alkali salt of phosphoric acid or phosphonic acid. Hydrophilizing agent.
(4) The hydrophilizing agent for a metal plate, wherein the alkali salt of phosphoric acid or phosphonic acid in (b) above is an alkali salt of etidronic acid (5) The surfactant in (c) above is polyoxy A hydrophilizing agent for a metal plate, which is an alkylene alkyl ether.
(6) A method for hydrophilizing a metal plate, which comprises applying the hydrophilizing agent described in (1) to (5) to the metal plate.
(7) A coating method, which comprises applying a coating material to a metal plate that has been subjected to the hydrophilic treatment by the hydrophilic treatment method described in (6).
(8) A plating method which comprises plating a metal plate hydrophilically treated by the hydrophilic treatment method described in (6).
(9) A surface treatment method for a lead frame, which comprises subjecting the lead frame to a hydrophilic treatment by the hydrophilic treatment method described in (6) and then performing plating or coating treatment.
本発明によれば、鉄や非鉄金属に対して塗装やめっき処理をおこなう前に、前処理として従来おこなわれた脱脂と濡れ性改善を、本発明に係る親水化処理剤を用いて一回の処理でおこなうことができる。そして、親水化の程度も、NaOHを用いた脱脂や既存の洗浄剤を用いて洗浄することに比べて格段の向上が見られることがわかった。この点を以下の実施例で示す。 According to the present invention, before performing coating or plating treatment on ferrous or non-ferrous metal, degreasing and wettability improvement conventionally performed as pretreatment are performed once by using the hydrophilic treatment agent according to the present invention. It can be done by processing. It was also found that the degree of hydrophilization was remarkably improved as compared with degreasing using NaOH and cleaning using an existing cleaning agent. This point will be shown in the following examples.
本発明の親水化処理剤を開発するにあたり、その組成の出発点を、出願人が既に開発しているディスプレイ用ガラス洗浄剤とした。以下では、この洗浄剤を既存洗浄剤と呼ぶ。
この既存洗浄剤は、無機アルカリ、キレート剤、界面活性剤、界面活性剤の可溶化剤、及び純水を含む組成物である。
In developing the hydrophilic treatment agent of the present invention, the starting point of its composition was the glass detergent for a display that the applicant has already developed. Hereinafter, this cleaning agent is referred to as an existing cleaning agent.
This existing cleaning agent is a composition containing an inorganic alkali, a chelating agent, a surfactant, a solubilizing agent for the surfactant, and pure water.
この既存洗浄剤を金属板の親水化処理剤の開発の出発点にしたのは、この洗浄剤は、無機アルカリとして水酸化カリウム等を含むため、金属表面の微細な有機物の脱脂作用が期待できるし、キレート剤は粒子汚れを洗浄剤中に分散させる作用を有するので、金属表面への洗浄効果が期待できたからである。
なお、この既存洗浄剤が洗浄の対象とするガラスの洗浄においては、洗浄剤の泡立ちは極端に嫌われるので、添加される界面活性剤は特に起泡性の低いものが採用されている。
This existing cleaning agent was used as the starting point for the development of the hydrophilic treatment agent for metal plates. Since this cleaning agent contains potassium hydroxide as an inorganic alkali, a degreasing action of fine organic substances on the metal surface can be expected. However, since the chelating agent has an action of dispersing the particle dirt in the detergent, the effect of washing the metal surface can be expected.
In addition, since the foaming of the cleaning agent is extremely disliked in the cleaning of the glass to be cleaned by the existing cleaning agent, a surfactant having a particularly low foaming property is adopted.
本発明者らは、上記の既存洗浄剤の組成を金属表面の親水化処理剤として活用するにあたり、個々の構成成分について、金属表面の親水化処理剤としての観点から最適な化合物を探すことにした。具体的には、金属表面に残留する微小な有機物の剥離を促進するためには、処理後の金属表面の接触角を小さくする作用を有する構成成分からなる組成物で親水化処理剤を構成することが有効であると考え、そのような機能を有する構成成分を選択する方向で検討をおこなった。 In utilizing the composition of the above existing cleaning agent as a hydrophilic treatment agent for metal surface, the present inventors have searched for an optimum compound for each constituent component from the viewpoint of the hydrophilic treatment agent for metal surface. did. Specifically, in order to promote the exfoliation of minute organic substances remaining on the metal surface, the hydrophilic treatment agent is constituted by a composition comprising constituents having an action of reducing the contact angle of the metal surface after treatment. Therefore, we considered that it is effective, and conducted a study in the direction of selecting a constituent having such a function.
まず、キレート剤について検討した。
各種のリン酸又はホスホン酸のキレート剤を使用し、被処理金属板(純鉄:SS400)を処理した場合の接触角を測定した。すなわち、洗浄剤用の界面活性剤として一般に使われるアデカノールB-787Sを仮の界面活性剤として採用し、これを4.8重量%となるように溶解した溶液中に、各種のキレート剤をそれぞれ溶解させた溶液を5wt%に希釈したものを試験液とし、これを用いて金属板を処理した。
処理の具体的内容は、それぞれの試験液中に金属板を5〜10分間浸漬し、これを取り出して温風乾燥した後に、金属板の表面に水滴を落とし接触角を測定するというものである。各種試験液で処理した試料を試料1〜9とした。
First, the chelating agent was examined.
The contact angle was measured when a metal plate to be treated (pure iron: SS400) was treated with various phosphoric acid or phosphonic acid chelating agents. That is, ADEKA NOL B-787S, which is generally used as a detergent surfactant, is used as a temporary surfactant, and various chelating agents are dissolved in a solution prepared by dissolving it to 4.8% by weight. A solution obtained by diluting the solution to 5 wt% was used as a test solution, and a metal plate was treated with the test solution.
The specific content of the treatment is to immerse the metal plate in each test solution for 5 to 10 minutes, remove the metal plate and dry it with warm air, and then drop water drops on the surface of the metal plate to measure the contact angle. .. Samples 1 to 9 were treated with various test solutions.
各試験液で使用したキレート剤の種類とこれにより処理した試料1〜9の処理後の金属板の接触角を表1にまとめた。なお、試料7(エチレンジアミン四酢酸塩溶液で処理)、試料8(水酸化カリウムで処理)、試料9(処理をしていない)については、対比のために測定した接触角を対照用に示す。
表1の結果から、キレート剤としては、リン酸三カリウム、ピロリン酸カリウム、トリポリリン酸ナトリウム、テトラリン酸ナトリウム、ヘキサメタリン酸ナトリウム、及びエチドロン酸カリウムが適していることがわかった。
すなわち、これらのキレート剤で処理した金属板(試料1〜6)は、試料8(エチレンジアミン四酢酸で処理)や試料9(水酸化カリウムのみで処理)に比較して、同等あるいは、それ以上に金属表面の接触角を低減化することが可能であることが明らかとなった。また、リン酸及びホスホン酸のキレート剤のうちで、エチドロン酸を使用した溶液で処理した試料6は、接触角を最低にすることができるので、金属板の親水化処理剤の構成成分として、最も好ましいキレート剤であることが判明した。
From the results in Table 1, it was found that tripotassium phosphate, potassium pyrophosphate, sodium tripolyphosphate, sodium tetraphosphate, sodium hexametaphosphate, and potassium etidronate are suitable as the chelating agent.
That is, the metal plates (Samples 1 to 6) treated with these chelating agents are equivalent to or more than Samples 8 (treated with ethylenediaminetetraacetic acid) and Sample 9 (treated with potassium hydroxide only). It was revealed that it is possible to reduce the contact angle on the metal surface. Further, among the phosphoric acid and phosphonic acid chelating agents, Sample 6 treated with a solution using etidronic acid can minimize the contact angle, and therefore, as a constituent of the metal plate hydrophilizing agent, It turned out to be the most preferred chelating agent.
本発明で使用するキレート剤としてエチドロン酸が最も適していることがわかったので、次に、本発明の親水化処理剤に添加する界面活性剤としては何が適しているかを明らかにすべく、各種の界面活性剤を用いて試験を行った。 Since etidronic acid was found to be most suitable as the chelating agent used in the present invention, next, to clarify what is suitable as the surfactant to be added to the hydrophilic treatment agent of the present invention, The test was carried out using various surfactants.
次の界面活性剤を用いて接触角の測定試験をおこなった。試験と検討に使用した界面活性剤とその入手先は次のとおりである。これらの界面活性剤は、いずれもポリオキシアルキレンアルキルエーテルである(但し対照用のアデカトールSP-12及びアデカノールB-787Sは除く)。以下では、それぞれの界面活性剤を、その記号のみで表記する。
エマレックスEMALEX640 (日本エマルジョン(株))
同 130 ( 同 上 )
同 120 ( 同 上 )
同 115 ( 同 上 )
アデカトールSO−145 ((株)ADEKA)
ノイゲンTDS−80 (第一工業製薬(株))
ノイゲンXL−80 ( 同 上 )
同 60 ( 同 上 )
ノイゲンSD−70 ( 同 上 )
同 60 ( 同 上 )
ノイゲンEA−137 ( 同 上 )
アデカトールSP−12 ((株)ADEKA)
アデカノールB−787S ( 同 上 )
アデカノールB−4009 ( 同 上 )
ファインサーフ9161 (青木油脂工業(株))
アデカノールAS−054C (第一工業製薬(株))
ファインサーフD−1305 (青木油脂工業(株))
A contact angle measurement test was performed using the following surfactants. The surfactants used in the tests and investigations and their sources are as follows. All of these surfactants are polyoxyalkylene alkyl ethers (excluding ADECATOL SP-12 and ADECANOL B-787S for control). Below, each surfactant is described only by its symbol.
EMALEX 640 (Japan Emulsion Co., Ltd.)
Same as above (same as above)
Same as above 120 (Same as above)
Ibid 115 (ibid)
ADEKA TOL SO-145 (ADEKA Corporation)
Neugen TDS-80 (Daiichi Kogyo Seiyaku Co., Ltd.)
Neugen XL-80 (same as above)
Same as above 60 (Same as above)
Neugen SD-70 (same as above)
Same as above 60 (Same as above)
Neugen EA-137 (same as above)
ADEKA TOL SP-12 (ADEKA Corporation)
ADEKA NOL B-787S (same as above)
ADEKA NOL B-4009 (same as above)
Fine Surf 9161 (Aoki Yushi Kogyo Co., Ltd.)
ADEKA NOL AS-054C (Daiichi Kogyo Seiyaku Co., Ltd.)
Fine Surf D-1305 (Aoki Yushi Kogyo Co., Ltd.)
接触角の測定においては、水酸化カリウム8.4wt%、エチドロン酸(60%aq)6.7wt%の水溶液を5%に希釈し、これに上記の各種界面活性剤を0.2%濃度となるように添加して処理液とした。この処理液中にSUS304を浸漬して10分間、試験温度50℃に維持して表面処理をおこなった。その後に被処理板を乾燥した後に表面に水滴を落とし、その接触角を測定した。また、上記した各種の界面活性剤自体のHLB値と20℃における表面張力(ST(20℃))を併せて、表2にまとめた。 To measure the contact angle, dilute an aqueous solution of potassium hydroxide 8.4 wt% and etidronic acid (60%aq) 6.7 wt% to 5%, and add the above-mentioned various surfactants to this to a concentration of 0.2%. To obtain a treatment liquid. SUS304 was dipped in this treatment solution and surface treatment was performed for 10 minutes while maintaining the test temperature at 50°C. After that, the plate to be treated was dried, water drops were dropped on the surface, and the contact angle was measured. In addition, the HLB values of the above-mentioned various surfactants themselves and the surface tension (ST (20° C.)) at 20° C. are also summarized in Table 2.
ここで、HLB値は、界面活性剤の水及び水に不溶な有機物への親和性の程度を表す値である。0から20までの値をとり、0に近いほど親油性が高く、20に近いほど親水性が高くなる。また、表面張力は、液体に働く、その表面積をできるだけ小さくしようとする力で、水銀で476.00、水で72.75mN/mの値をとる。
金属板表面の接触角を低下させる機能を有する界面活性剤を選択するにあたり、この機能に関係すると考えられた特性がHLB値と表面張力(ST(20℃))である。いずれの特性に基づいて界面活性剤を選択するかを決定するために、それぞれの特性と処理後の金属基板の接触角の関係を調べた。その結果が表2にまとめられている。
Here, the HLB value is a value representing the degree of affinity of the surfactant for water and organic substances insoluble in water. It takes a value from 0 to 20, and the closer to 0, the higher the lipophilicity, and the closer to 20, the higher the hydrophilicity. The surface tension is a force that acts on a liquid to minimize its surface area, and has a value of 476.00 for mercury and 72.75 mN/m for water.
In selecting a surfactant having a function of reducing the contact angle on the surface of a metal plate, the properties considered to be related to this function are the HLB value and the surface tension (ST (20°C)). In order to determine which property to select the surfactant based on, the relationship between each property and the contact angle of the treated metal substrate was investigated. The results are summarized in Table 2.
ガラス洗浄剤には界面活性剤としてアデカノールB−787Sが用いられることがある。しかし、表2から明らかなとおり、B−787Sを用いて金属板を処理しても処理後の接触角は76.5°にすることができるにとどまるものであった。
そこで、本発明者らは、まず、HLB値と表面張力(ST(20℃))のうち、いずれの特性に基づいて界面活性剤を選択すべきかを検討した。そして、表2のデータの統計処理の結果、詳細は省略するが、処理後の金属板の接触角は、HLB値のデータではなく、界面活性剤の表面張力のデータと強い相関関係があることが確認された。
こうしたことから、界面活性剤においては表面張力が低いものを選択することが有効で、特に表面張力が30mN/m以下のものを選択することとした。なぜなら、表2においては、TDS-80、XL-80、60、SD-70、-60、AS-054C、D1305がこの条件を満たすが、接触角は43〜58°となっているからである。これらの界面活性剤は、他の界面活性剤では達成することのできない低い接触角を実現している。特に、ノイゲンXL-80及びXL-60は、検討をおこなった界面活性剤中で最も低い接触角(47°未満)を実現しているので、最も好ましい界面活性剤であることが明らかとなった。
また、界面活性剤を添加するにあたっては、溶解性を向上するために可溶化剤を添加することが好ましい。
Adecanol B-787S may be used as a surfactant in the glass detergent. However, as is clear from Table 2, even if the metal plate was treated with B-787S, the contact angle after the treatment could be 76.5°.
Therefore, the present inventors first examined which property of the HLB value and the surface tension (ST (20° C.)) should be used to select the surfactant. Although the details are omitted as a result of the statistical processing of the data in Table 2, the contact angle of the metal plate after the processing has a strong correlation with the surface tension data of the surfactant, not the HLB value data. Was confirmed.
Therefore, it is effective to select a surfactant having a low surface tension, and particularly a surfactant having a surface tension of 30 mN/m or less is selected. This is because in Table 2, TDS-80, XL-80, 60, SD-70, -60, AS-054C and D1305 satisfy this condition, but the contact angle is 43 to 58°. .. These surfactants achieve low contact angles that cannot be achieved with other surfactants. In particular, Neugen XL-80 and XL-60 achieved the lowest contact angle (less than 47°) among the investigated surfactants, and thus were found to be the most preferred surfactants. ..
When adding the surfactant, it is preferable to add a solubilizer in order to improve the solubility.
以上の検討の結果、金属板の親水化処理剤として適した組成物は、次の成分から構成されるものであることが明らかとなった。すなわち、(a)NaOHやKOHである無機アルカリ、(b)エチドロン酸等のリン酸又はホスホン酸であるキレート剤、(c)表面張力30mN/m以下の界面活性剤、からなる組成物である。 As a result of the above examination, it became clear that a composition suitable as a hydrophilic treatment agent for a metal plate is composed of the following components. That is, it is a composition comprising (a) an inorganic alkali such as NaOH or KOH, (b) a chelating agent which is phosphoric acid or phosphonic acid such as etidronic acid, and (c) a surfactant having a surface tension of 30 mN/m or less. ..
本発明に係る親水化処理剤は、技術的に広い範囲に活用されることが期待できる。具体的には、塗装処理やリン酸被膜形成を行う際の前処理剤として使用できる。これに加え、金属めっきを行う際の前処理剤、リードフレーム用銅系材料のめっき・塗装前処理剤として使用することができる。
また、親水化処理をおこなう金属板にしても、様々な金属に対して親水化処理を行うことができる。具体的に効果が確認されているのは、アルミニウム、アルミ合金、鉄、鉄系合金、銅、銅系合金、亜鉛、チタンなどである。
The hydrophilic treatment agent according to the present invention can be expected to be utilized in a wide range of technical fields. Specifically, it can be used as a pretreatment agent when performing coating treatment or phosphoric acid film formation. In addition to this, it can be used as a pretreatment agent for metal plating and a pretreatment agent for plating/painting copper-based materials for lead frames.
Moreover, even if the metal plate is subjected to the hydrophilic treatment, the hydrophilic treatment can be performed on various metals. Specific effects have been confirmed for aluminum, aluminum alloys, iron, iron-based alloys, copper, copper-based alloys, zinc, titanium and the like.
本発明の効果を具体的に確認するために、下記表3に示す洗浄剤組成物I〜VII(以下、処理液I〜VII)を調整し、各種特性を測定して評価した。
処理液Iが本発明の構成要件を全て満たす実施例であり、処理液II〜VIIは1以上の要件を満たさない比較例である。比較例となる理由は下記のとおりである。ここで、可溶化剤は、界面活性剤の溶解性を向上するために必要に応じて添加されるもので、本発明の必須の要件を構成するものではない。
なお、以下では、本発明の内容を実施例および比較例によってさらに具体的に説明するが、本発明はこれらの例によって何ら限定されるものではない。
In order to specifically confirm the effect of the present invention, cleaning composition I to VII (hereinafter, treatment liquids I to VII) shown in Table 3 was prepared, and various characteristics were measured and evaluated.
Treatment liquid I is an example that satisfies all the constituent requirements of the present invention, and treatment liquids II to VII are comparative examples that do not satisfy one or more requirements. The reason for the comparison example is as follows. Here, the solubilizer is added as necessary to improve the solubility of the surfactant, and does not constitute an essential requirement of the present invention.
In the following, the content of the present invention will be described more specifically with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
各処理液I〜VIIの組成は、次の表3にまとめられるとおりとなる。
処理液II:キレート剤がリン酸、ホスホン酸ではなく、一般に使用されるEDTAを使用。
処理液III:界面活性剤(B-4009)の表面張力が47.0mN/mであり30以下ではない。
処理液IV:キレート剤を配合していない。
処理液V:KOHがHEDPにより中和されてフリーのKOHは存在しない。
処理液VI:界面活性剤を添加していない。
処理液II〜VIは、本発明の親水化処理剤の3つの必須成分のいずれかを含有していない点で、本発明の従来技術に相当する。
The compositions of the respective processing liquids I to VII are summarized in Table 3 below.
Treatment liquid II: The commonly used EDTA is used as the chelating agent instead of phosphoric acid and phosphonic acid.
Treatment liquid III: The surface tension of the surfactant (B-4009) is 47.0 mN/m, which is not 30 or less.
Treatment liquid IV: No chelating agent is added.
Treatment solution V: KOH is neutralized by HEDP and free KOH does not exist.
Treatment liquid VI: No surfactant was added.
The treatment liquids II to VI correspond to the prior art of the present invention in that they do not contain any of the three essential components of the hydrophilic treatment agent of the present invention.
上記した実施例と比較例の処理液を用いて、各種の金属板を処理した後の金属板の接触角を測定した。接触角の測定では、被処理板の表面を酸洗した後に、200、1000及び2000メッシュの順に紙やすりで被処理板を研磨し、これを室温で10分間各種の処理液中に浸漬し、これを取り出してシャワーリンスの後に温水乾燥して接触角を測定した。 Using the treatment liquids of the above Examples and Comparative Examples, the contact angles of the metal plates after treating various metal plates were measured. In the measurement of the contact angle, after the surface of the plate to be treated is pickled, the plate to be treated is polished with sandpaper in the order of 200, 1000 and 2000 mesh, and the plate is immersed in various treatment liquids at room temperature for 10 minutes, This was taken out, shower rinsed, and then dried with warm water to measure the contact angle.
ステンレス鋼(SS304)を表3の処理液の5%希釈液により処理した。25℃の処理液中に5分間浸漬し、シャワーですすいだ後に温風乾燥したものを試験体とした。
得られた試験体に表面に水滴をたらし、上記した測定法で接触角を測定した結果を表4に示す。
Table 4 shows the results of measuring the contact angle by dropping water droplets on the surface of the obtained test body and by the above-mentioned measuring method.
処理液による処理前のステンレス鋼には多数の微小な有機物が残留していたため、未処理板の接触角は95.2°であった。しかし、本発明の親水化処理剤(処理液I)をステンレス鋼に適用することにより、接触角は32.8°まで減少させることができる。このため、従来の洗浄剤(処理液II〜VI)で洗浄した場合に比較しても、親水化特性が格段に向上していることがわかる。 The contact angle of the untreated plate was 95.2° because many minute organic substances remained on the stainless steel before the treatment with the treatment liquid. However, by applying the hydrophilic treatment agent (treatment liquid I) of the present invention to stainless steel, the contact angle can be reduced to 32.8°. Therefore, it can be seen that the hydrophilic property is remarkably improved even when compared with the case of cleaning with the conventional cleaning agents (treatment liquids II to VI).
純鉄(SS400)に対して実施例1と同様の処理を行った。
本発明の親水化処理剤を使用した場合には、被処理板が純鉄の場合も、ステンレス鋼の場合と同様に接触角を減少させることができ、親水性を向上することができた。表面張力が30mN/m以下の界面活性剤を使用していない処理液IIIで処理した場合に比較して、その効果の差は明らかである。 When the hydrophilic treatment agent of the present invention was used, the contact angle could be reduced and the hydrophilicity could be improved even when the plate to be treated was pure iron, as in the case of stainless steel. The difference in the effect is clear as compared with the case of treating with the treatment liquid III which does not use a surfactant having a surface tension of 30 mN/m or less.
リードフレーム用銅材料に対しも同様の処理を行った。
5%に希釈した処理液を50℃に保ち、銅材量を5分間浸漬した後に、シャワーですすいで温風乾燥した。その後に、上記した方法により接触角を測定した。なお、銅材は、神戸製鋼社製KFC材を使用した。
The same process was performed on the copper material for the lead frame.
The treatment liquid diluted to 5% was kept at 50° C., the copper material amount was immersed for 5 minutes, then rinsed with a shower and dried with warm air. Then, the contact angle was measured by the method described above. The copper material used was KFC manufactured by Kobe Steel.
銅(C1100P)に対しても実施例3と同じ処理をおこない、接触角を測定した。
本発明の親水化処理剤及び親水化処理方法によれば、金属板表面に塗装あるいはめっき処理を施す前に従来行なわれていた前処理に比較して、格段に優れた親水性を金属板表面に付与することができる。さらに、塗装・めっきの前処理として、従来は脱脂洗浄と濡れ性改善処理という2工程が必要であったが、本発明の親水化処理剤及び親水化処理方法によれば、1回の親水化処理により前処理を行なうことができるので、作業効率が格段に向上する。 According to the hydrophilizing agent and the hydrophilizing method of the present invention, the metal plate surface is remarkably excellent in hydrophilicity as compared with the pretreatment which is conventionally performed before the coating or plating treatment is performed on the metal plate surface. Can be given to. Further, as a pretreatment for coating/plating, conventionally, two steps of degreasing cleaning and wettability improving treatment were required, but according to the hydrophilizing treatment agent and the hydrophilizing treatment method of the present invention, one hydrophilizing treatment is performed. Since the pretreatment can be performed by the treatment, the working efficiency is remarkably improved.
Claims (9)
(a)無機アルカリ、
(b)キレート剤、及び
(c)表面張力30mN/m以下の界面活性剤 A hydrophilic treatment agent for a metal plate having the following components.
(A) inorganic alkali,
(B) chelating agent, and
(C) Surfactant having a surface tension of 30 mN/m or less
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019001163A JP2020111765A (en) | 2019-01-08 | 2019-01-08 | Hydrophilization treatment agent for metal plate, and hydrophilization treatment method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019001163A JP2020111765A (en) | 2019-01-08 | 2019-01-08 | Hydrophilization treatment agent for metal plate, and hydrophilization treatment method using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020111765A true JP2020111765A (en) | 2020-07-27 |
Family
ID=71667634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019001163A Pending JP2020111765A (en) | 2019-01-08 | 2019-01-08 | Hydrophilization treatment agent for metal plate, and hydrophilization treatment method using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2020111765A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005126553A (en) * | 2003-10-23 | 2005-05-19 | Kao Corp | Hard surface cleaning composition |
JP2007016263A (en) * | 2005-07-06 | 2007-01-25 | Kao Corp | Cleaning composition for copper or copper alloy |
JP2010024534A (en) * | 2008-07-24 | 2010-02-04 | Kao Corp | Detergent composition for use in surface-treating steel sheet |
WO2011105449A1 (en) * | 2010-02-23 | 2011-09-01 | ライオン株式会社 | Metal cleaner |
-
2019
- 2019-01-08 JP JP2019001163A patent/JP2020111765A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005126553A (en) * | 2003-10-23 | 2005-05-19 | Kao Corp | Hard surface cleaning composition |
JP2007016263A (en) * | 2005-07-06 | 2007-01-25 | Kao Corp | Cleaning composition for copper or copper alloy |
JP2010024534A (en) * | 2008-07-24 | 2010-02-04 | Kao Corp | Detergent composition for use in surface-treating steel sheet |
WO2011105449A1 (en) * | 2010-02-23 | 2011-09-01 | ライオン株式会社 | Metal cleaner |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100385042C (en) | Cleaning agent for degreasing and decontaminating the surface of NdFeB magnetic material and its application method | |
JP6577526B2 (en) | Post chemical mechanical polishing (post CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or polycarboxylic acid | |
JP4025953B2 (en) | Cleaning composition | |
JP2023162285A (en) | Cleaning solution containing mixture of polyoxyalkylene nonionic surfactants for cleaning metal surfaces | |
JP7057653B2 (en) | Detergent composition for removing resin mask | |
CN108070872A (en) | A kind of Phosphorus-Free Water-Based Cleaning Agent for Metals | |
US20010013473A1 (en) | Pre-plate treating system | |
TWI746583B (en) | A water-based composition for post-treatment of metal surfaces | |
CN103890231A (en) | Surface treatment method and coating method for steel material, and method for producing machine component | |
CN115216772B (en) | Environment-friendly roughening treatment fluid suitable for copper surface and application thereof | |
CN113646467A (en) | Phosphate-free cleaning agent for metal surfaces with reduced pickling attack | |
JP2020111765A (en) | Hydrophilization treatment agent for metal plate, and hydrophilization treatment method using the same | |
CN112176371B (en) | Electroplating process for plating gold on beryllium copper surface | |
CN119144964A (en) | Semiconductor chip post-CMP cleaning solution, and preparation method and application thereof | |
CN109072454A (en) | For the composition in the pickling removal comprising reducing material in zinc-plated and/or ungalvanized steel metal surface pickling | |
JP2973379B2 (en) | Aqueous liquid detergent composition for cleaning electronic components | |
CN115852381A (en) | High-pressure spray cleaning agent for automatic line spraying and preparation method thereof | |
JP3252186B2 (en) | Etching agent | |
TW201339299A (en) | A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and comprising no significant amounts of specific nitrogen-containing compounds | |
CN119776960A (en) | A metal surface electrochemical degreasing liquid and its application | |
JPH10251697A (en) | Detergent composition for light metals | |
JP2007297461A (en) | Alkaline detergent composition for steel sheet | |
JP3491656B2 (en) | Pretreatment agent for drying metal and drying method | |
CN117568809A (en) | Electroplating cleaning liquid and electroplating cleaning method | |
CN118854295A (en) | Aluminum alloy cleaning agent and preparation and use method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211217 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221019 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230315 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230509 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230809 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20240214 |