JP2020107689A - Electrostatic chuck and manufacturing method of electrostatic chuck - Google Patents

Abstract

To provide an electrostatic chuck in which temperature distribution on the first surface of a plate-like member can be controlled.SOLUTION: An electrostatic chuck includes a plate-like member having a first surface substantially orthogonal to a first direction and a second surface on the opposite side to the first surface, a base member having a third surface, and placed so that the third surface is located on the second surface side of the plate-like member, and a juncture for joining the plate-like member and the base member, and holds an object on the first surface of the plate-like member. In the base member, a first open hole penetrating in the first direction and, in the view of the first direction, located at a position overlapping the first surface of the plate-like member, a second open hole, and a cooling mechanism are formed. The juncture includes a first portion joined to the second surface of the plate-like member and the third surface of the base member, and a second portion joined to the second surface of the plate-like member and the inner surface of the base member defining the first open hole. The second surface of the plate-like member and the inner surface of the base member defining the second open hole are not joined.SELECTED DRAWING: Figure 5

Description

The technology disclosed in this specification relates to an electrostatic chuck.

Electrostatic chucks are used, for example, to hold wafers during semiconductor manufacturing. The electrostatic chuck includes, for example, a plate member made of ceramics, a base member made of metal, a joining portion for joining the plate member and the base member, and a chuck electrode provided inside the plate member. The electrostatic attraction generated by applying a voltage to the chuck electrode is used to attract and hold the wafer on the first surface (adsorption surface) of the plate member.

If the temperature distribution of the wafer held on the electrostatic chuck becomes uneven, the accuracy of each process (deposition, etching, etc.) on the wafer may decrease, so the temperature distribution of the wafer should be as uniform as possible on the electrostatic chuck. The performance to be required is required. Therefore, in order to reduce the temperature variation in the wafer, a holding device including a plate-shaped member, a base member, a joint portion, and a plurality of adjustment rods for temperature adjustment is known (for example, see Patent Document 1). ). A plurality of first through holes penetrating in the thickness direction is formed in the plate member. In addition, a plurality of second through holes that communicate with each of the plurality of first through holes are formed in the joint portion. In such a configuration, the plurality of adjusting rods are formed of a material having a higher thermal conductivity than the thermal conductivity of the joint portion, and are inserted into the first through hole, and the tips of the adjusting rods are inserted into the first through hole. It is supported so that it can be arranged in the two through holes. In this holding device, the temperature in the vicinity of the adjusting rod is changed by adjusting the position of the tip of the adjusting rod from the lower surface of the base member while measuring the temperature of the suction surface of the plate-shaped member.

JP, 2005-185552, A

In the above conventional configuration, since the adjusting rod included in the electrostatic chuck is formed of a material different from that of the joint, when the tip of the adjusting rod makes contact with the joint, uniform thermal conductivity in the plane of the joint is obtained. May decrease.

This specification discloses a technique capable of solving the above-mentioned problems.

The technology disclosed in this specification can be implemented, for example, in the following modes.

(1) An electrostatic chuck disclosed in the present specification is a plate-shaped member having a first surface substantially orthogonal to a first direction and a second surface opposite to the first surface. And a base member having a third surface, the third surface being arranged so as to be located on the second surface side of the plate-shaped member, the base member penetrating in the first direction, A base member having a first through hole, a second through hole, and a cooling mechanism arranged at a position overlapping the first surface of the plate-shaped member when viewed in the first direction. And a joint portion that joins the plate member and the base member to each other, wherein the joint portion holds the object on the first surface of the plate member. A first portion joined to the second surface of the plate-shaped member and the third surface of the base member, the second surface of the plate-shaped member, and the first through hole. An inner surface of the base member defining a second portion joined to the second surface of the plate member, and an inner surface of the base member defining the second through hole, Are not joined.

As described above, in the present electrostatic chuck, the first through hole and the second through hole are formed at positions overlapping the first surface of the plate-shaped member in the first direction view. In addition, the inner surface of the first through hole is joined to the second surface of the plate-shaped member via the second portion. On the other hand, the inner surface of the second through hole is not joined to the second surface of the plate member. That is, in this electrostatic chuck, as compared with the periphery of the second through hole that does not include the second portion, the plate-shaped member and the base member around the first through hole that includes the second portion. The heat transfer between and is good.

A temperature singular point of high temperature may occur on the attraction surface of the plate-shaped member of the electrostatic chuck due to variations in manufacturing the electrostatic chuck. In this electrostatic chuck, the heat transfer (heat conduction) between the plate-shaped member and the base member becomes good in the vicinity of the first through hole, so that the cooling efficiency by the cooling mechanism formed in the base member is improved. Can be improved. That is, in the present electrostatic chuck, since the above-described configuration is adopted, it is possible to adjust the temperature of the region on the first surface overlapping the first through hole in the first direction and the temperature in the vicinity thereof. Therefore, according to the present electrostatic chuck, it is possible to provide an electrostatic chuck in which the temperature distribution of the first surface of the plate-shaped member is controlled (for example, the uniformity of the temperature distribution is improved). The controllability of the temperature distribution of the object held on the first surface can be improved.

(2) In the electrostatic chuck, the material forming the first portion and the material forming the second portion may be the same. Therefore, when the electrostatic chuck is subjected to stress such as strain or compression, the first part and the second part are similarly deformed, so that the stress associated with the deformation can be effectively relieved. You can Further, according to the present electrostatic chuck, since the first portion and the second portion are formed of the same material, the affinity between them is good, and the second portion is different from the first portion. It is possible to suppress peeling.

(3) In the electrostatic chuck, the first surface of the plate-shaped member is substantially circular, and the center of the first surface of the plate-shaped member and the base member in the first direction view. The distance between the center of the first through hole and the distance between the center of the first surface of the plate member and the center of the second through hole formed in The length may be ½ or more of the radius. In other words, in the present electrostatic chuck, the first through hole and the second through hole are located near the outer periphery of the first surface of the plate-shaped member when viewed in the first direction. The vicinity of the outer periphery of the attraction surface of the plate-shaped member is a portion where a temperature singularity is likely to occur due to variations in manufacturing the electrostatic chuck. Since this electrostatic chuck employs the above configuration, the first through hole and the second through hole near the outer periphery of the first surface, which is a portion where the temperature singularity is likely to occur, in the first direction view. It is possible to adjust the temperature of the region overlapping with the through hole and its vicinity. Therefore, according to the present electrostatic chuck, it is possible to provide an electrostatic chuck in which the temperature distribution near the outer periphery of the first surface of the plate-shaped member is controlled (for example, the uniformity of temperature distribution is improved). As a result, the controllability of the temperature distribution of the object held on the first surface can be improved.

(4) In the electrostatic chuck, a joining portion through hole is formed in the joining portion, and the diameter of the joining portion through hole is the diameter of the second through hole that communicates with the joining portion through hole. It may be configured to be larger than that. In other words, in this electrostatic chuck, the area of the exposed surface of the second surface of the plate-shaped member to the joint through-hole is the second area where the diameter of the joint through-hole communicates with the joint through-hole. It is larger than the area of the exposed surface of the joint through-hole in the configuration having the same diameter as the through-hole. Therefore, heat transfer between the plate-shaped member and the base member is suppressed in the vicinity of the joint through-hole, as compared with the vicinity of the joint through-hole having the same diameter as the second through-hole. ..

A low temperature singular point may occur on the attraction surface of the plate-shaped member of the electrostatic chuck due to variations in manufacturing the electrostatic chuck. In this electrostatic chuck, the heat transfer (heat transfer) between the plate member and the base member is suppressed around the second through hole, so that the cooling efficiency of the cooling mechanism formed in the base member is improved. Can be suppressed. That is, in the present electrostatic chuck, since the above-described configuration is adopted, it is possible to adjust the temperature of the region on the first surface overlapping with the second through hole in the first direction and the temperature in the vicinity thereof. .. Therefore, according to the present electrostatic chuck, it is possible to provide an electrostatic chuck in which the temperature distribution of the first surface of the plate-shaped member is more effectively controlled (for example, the uniformity of temperature distribution is improved). Therefore, the controllability of the temperature distribution of the object held on the first surface can be improved more effectively.

(5) The method of manufacturing an electrostatic chuck disclosed in the present specification has a first surface substantially orthogonal to the first direction, and a second surface opposite to the first surface. A plate-shaped member; and a base member having a third surface, the base member having a cooling mechanism, the base member being arranged such that the third surface is located on the second surface side of the plate-shaped member, In a method of manufacturing an electrostatic chuck, comprising: a joining member that joins a plate-shaped member and the base member, and holding an object on the first surface of the plate-shaped member; The base having a first through hole and a second through hole formed at a position penetrating in a first direction and overlapping the first surface of the plate-shaped member when viewed in the first direction. A first step of preparing a member and a first joining portion in a state before joining the plate member and the base member in the joining portion are penetrated in the first direction. And a first joint in which a joint portion through hole communicating with at least the second through hole of the first through hole and the second through hole formed in the base member is formed. A second step of preparing a portion, and arranging the first joint between the plate-shaped member and the base member, and joining the plate-shaped member and the base member by the joint. In the third step of producing a laminated body, in the fourth step of measuring the temperature distribution of the first surface of the plate-shaped member constituting the laminated body, and in the fourth step, the plate As a result of the measurement of the temperature distribution on the first surface of the strip-shaped member, when the presence of a high temperature region is shown in the temperature distribution on the first surface, in the first direction view, in a region overlapping the high temperature region. By filling a filling member into the first through hole located, the second surface of the plate-like member and the inner surface of the base member that defines the first through hole are connected to each other. In the fifth step and the fourth step, as a result of measuring the temperature distribution on the first surface of the plate-shaped member, the existence of a low temperature region was shown in the temperature distribution on the first surface. At this time, in the first direction view, with respect to the joint portion through hole communicating with the second through hole located in the region overlapping with the low temperature region, the diameter of the joint portion through hole is equal to the joint portion penetrating hole. At least one of a sixth step of removing a part of the joint so as to be larger than a diameter of the second through hole communicating with the hole.

As described above, in the present electrostatic chuck manufacturing method, the first through hole and the second through hole are previously formed in the base member. Next, a laminated body composed of a base member having the first through hole and the second through hole formed therein, a plate-shaped member, and a joint portion is produced, and the first of the plate-shaped members in the produced laminated body is produced. The temperature distribution on the surface of No. 1 is measured. As a result of the measurement, when the presence of a high temperature region of the temperature distribution is shown on the first surface, in the first direction view, with respect to the first through hole located in the region overlapping the high temperature region, Perform the process of. Further, as a result of the above measurement, when the presence of the low temperature region of the temperature distribution is shown on the first surface, the joint portion communicating with the second through hole located in the region overlapping with the low temperature region in the first direction view. The sixth step is performed on the through hole.

In the fifth step, the second surface of the plate-like member and the inner surface of the base member defining the first through hole are connected by filling the second portion in the first through hole. As a result, heat transfer from the plate member to the base member can be improved, and the cooling efficiency of the cooling mechanism formed on the base member can be improved. That is, the temperature of the high temperature region of the first surface can be lowered. Further, in the sixth step, the joint portion is formed such that the exposed surface of the second surface of the plate-shaped member to the joint through hole is larger than that of the joint through hole communicating with the second through hole. A part of the (first portion) is removed to form a joint through hole. As a result, heat transfer from the plate member to the base member can be suppressed, and the cooling efficiency of the cooling mechanism formed on the base member can be suppressed. That is, the temperature of the low temperature region of the first surface can be raised. Therefore, according to the present electrostatic chuck manufacturing method, the temperature distribution of the first surface of the plate-shaped member is controlled based on the measurement result of the temperature distribution of the first surface of the plate-shaped member of the laminated body (for example, The uniformity of the temperature distribution can be improved), and by extension, the controllability of the temperature distribution of the object held on the first surface can be improved.

The technology disclosed in the present specification can be realized in various forms, for example, a holding device, an electrostatic chuck, a vacuum chuck, a manufacturing method thereof, or the like. is there.

It is a perspective view which shows the external appearance structure of the electrostatic chuck 100 in this embodiment roughly. It is explanatory drawing which shows roughly the XZ cross-section structure of the electrostatic chuck 100 in this embodiment. FIG. 3 is an explanatory diagram schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 at the position of III-III in FIG. 2. FIG. 4 is an explanatory diagram schematically showing an XY sectional configuration of the electrostatic chuck 100 at a position IV-IV in FIG. 2. It is explanatory drawing which shows schematically the XZ cross-section structure of a part (X1 part of FIG. 2 and FIG. 3) of the electrostatic chuck 100 in this embodiment. It is explanatory drawing which shows schematically the XZ cross-section structure of a part (X2 part of FIG. 2 and FIG. 3) of the electrostatic chuck 100 in this embodiment. 6 is a flowchart showing a method of manufacturing the electrostatic chuck 100 according to the present embodiment. It is explanatory drawing which shows the manufacturing method of the electrostatic chuck 100 in this embodiment typically.

A. This embodiment:
A-1. Structure of the electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of an electrostatic chuck 100 according to the present embodiment, and FIG. 2 is an explanatory diagram schematically showing an XZ sectional configuration of the electrostatic chuck 100 according to the present embodiment. .. FIG. 3 is an explanatory diagram schematically showing the XY sectional configuration of the electrostatic chuck 100 in the present embodiment, and FIG. 4 is an explanatory diagram schematically showing the XY sectional configuration of the electrostatic chuck 100 in the present embodiment. is there. FIG. 3 shows an XY sectional configuration of the electrostatic chuck 100 at the position III-III in FIG. 2, and FIG. 4 shows an XY sectional configuration of the electrostatic chuck 100 at the position IV-IV in FIG. It is shown. In each drawing, XYZ axes that are orthogonal to each other for specifying directions are shown. In this specification, the Z-axis positive direction is referred to as an upward direction and the Z-axis negative direction is referred to as a downward direction for convenience sake, but the electrostatic chuck 100 is actually installed in a direction different from such an orientation. May be done.

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a semiconductor wafer W) by electrostatic attraction, and fixes the wafer W (hereinafter, referred to as “wafer W”) in a vacuum chamber of a semiconductor manufacturing apparatus, for example. Used to The electrostatic chuck 100 includes a plate-shaped member 10 and a base member 20, which are arranged side by side in a predetermined arrangement direction (the vertical direction (Z-axis direction in this embodiment)). The plate-shaped member 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the plate-shaped member 10 and the upper surface S3 of the base member 20 face each other in the above-mentioned arrangement direction with a joint portion 30 described later interposed therebetween. To be done. That is, the base member 20 is arranged such that the upper surface S3 of the base member 20 is located on the lower surface S2 side of the plate member 10.

The plate-shaped member 10 is a member having a substantially circular planar upper surface (hereinafter, referred to as “adsorption surface”) S1 that is substantially orthogonal to the array direction (Z-axis direction) described above, and is, for example, ceramics (for example, alumina or aluminum nitride). Etc.). The plate member 10 has a diameter of, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the plate member 10 has a thickness of, for example, about 1 mm to 10 mm. The suction surface S1 of the plate member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate member 10 corresponds to the second surface in the claims, and the Z-axis direction is It corresponds to the first direction in the claims. Further, in the present specification, the direction orthogonal to the Z-axis direction is also referred to as “plane direction”.

As shown in FIG. 2, inside the plate-shaped member 10, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged. The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a power source (not shown), electrostatic attraction is generated, and the electrostatic attraction causes the wafer W to be attracted and fixed to the attraction surface S1 of the plate-shaped member 10.

Inside the plate-shaped member 10, a heater electrode 50 composed of a resistance heating element containing a conductive material (for example, tungsten, molybdenum, platinum, etc.) is also arranged. When a voltage is applied to the heater electrode 50 from a power source (not shown), the heater electrode 50 generates heat to warm the plate-shaped member 10 and warm the wafer W held on the suction surface S1 of the plate-shaped member 10. To be Thereby, control of the temperature distribution of the wafer W is realized.

The base member 20 is, for example, a circular flat plate member having the same diameter as the plate member 10 or a diameter larger than that of the plate member 10, and is made of, for example, metal (aluminum, aluminum alloy, or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (normally 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to the third surface in the claims.

The base member 20 is joined to the plate member 10 by the joint portion 30 arranged between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20. The joint portion 30 is made of, for example, an adhesive material such as silicone resin, acrylic resin, or epoxy resin. The thickness of the joint portion 30 is, for example, about 0.1 mm to 1 mm. As shown in FIG. 3, the joining portion 30 includes an inter-face joining portion 31 and a temperature adjusting portion 33, which will be described later. Further, the joint portion 30 has a joint portion through hole 130 described later. The configuration of the joint portion 30 will be described later in detail. The face-to-face joint portion 31 corresponds to the first portion in the claims and the temperature adjusting portion 33 corresponds to the second portion in the claims.

A coolant passage 21 is formed inside the base member 20. When a coolant (for example, a fluorine-based inert liquid, water, etc.) is flown into the coolant channel 21, the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-shaped member 10 via the joint portion 30. The plate member 10 is cooled by (heat extraction), and the wafer W held on the suction surface S1 of the plate member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized. The refrigerant passage 21 corresponds to the cooling mechanism in the claims.

In addition, as shown in FIG. 2, the electrostatic chuck 100 enhances heat transfer between the plate-shaped member 10 and the wafer W to further enhance controllability of the temperature distribution of the wafer W. It has a configuration for supplying an inert gas (for example, helium gas) to the space existing between the surface S1 and the surface of the wafer W. That is, in the electrostatic chuck 100, a first gas passage hole 131 extending in the up-down direction from the lower surface S4 of the base member 20 to the upper surface of the joining portion 30, and a plate-like member that communicates with the first gas passage hole 131. A second gas passage hole 132 that opens to the adsorption surface S1 of the member 10 is formed. The first gas passage hole 131 is an integral hole in which a hole 25 penetrating the base member 20 in the Z-axis direction and a hole 35 penetrating the joint portion 30 in the Z-axis direction are in communication with each other. Further, the lower end portion of the second gas flow path hole 132 is an enlarged diameter portion 134 having an enlarged diameter, and a filling member (breathable plug) 160 having air permeability is provided in the enlarged diameter portion 134. It is filled. Further, inside the plate-shaped member 10, a lateral flow passage 133 is formed which communicates with the second gas flow passage hole 132 and extends annularly in the surface direction. When the helium gas supplied from the helium gas source (not shown) flows into the first gas passage hole 131, the inflowing helium gas is filled in the expanded diameter portion 134 from the first gas passage hole 131. The adsorbing surface S1 while passing through the inside of the filled gas-permeable filling member 160, flowing into the second gas flow path hole 132 inside the plate-shaped member 10 and flowing in the surface direction through the lateral flow path 133. It is ejected from the gas ejection hole formed in the. In this way, the helium gas is supplied to the space existing between the suction surface S1 and the surface of the wafer W.

Further, as shown in FIGS. 2 and 4, the base member 20 is formed with a base member through hole 120 used for adjusting the temperature of the suction surface S1 of the plate member 10. The base member through hole 120 is a through hole that extends in the vertical direction from the lower surface S4 of the base member 20 to the upper surface S3. When viewed in the Z-axis direction, the diameter Wba (see FIG. 6) of the base member through hole 120 is, for example, 1 mm or more and 5 mm or less. Further, as shown in FIG. 4, the base member through hole 120 is formed at a position overlapping the suction surface S1 of the plate member 10 when viewed in the Z-axis direction. More specifically, the base member through holes 120 are arranged at substantially equal intervals in the circumferential direction in the vicinity of the outer circumference of the suction surface S1. In the present embodiment, in the base member through hole 120, the distance Lr between the center PO of the suction surface S1 and the center of the base member through hole 120 in the Z-axis direction is one half of the radius R of the suction surface S1. It is arranged at a position having the above length. Further, the difference between the radius R of the suction surface S1 and the distance Lr (that is, “radius R of the suction surface S1−distance Lr”) is preferably, for example, 75 mm or less.

In the present embodiment, the base member 20 is formed with eight base member through holes 120. As shown in FIGS. 2 and 4, a joint portion 30 (a temperature adjusting portion 33 described later) is filled in a part of the inside of the three base member through holes 120 of the base member through hole 120 in the high temperature adjusting base member through hole 127. Has been done. On the other hand, in the holes of the base member through holes 120 (the normal base member through hole 125 and the low temperature adjustment base member through hole 129) other than the high temperature adjusting base member through hole 127, the joint portion 30 (the temperature adjusting portion 33) is provided. Is not filled. In addition, as shown in FIGS. 2, 3 and 4, the normal base member through hole 125 and the low temperature adjustment base member through hole 129 are respectively connected to a joint portion through hole 130 (a normal joint portion through hole which will be described later) in the joint portion 30. It communicates with the hole 135 and the expanded diameter joint through hole 139). The high temperature adjustment base member through hole 127 corresponds to the first through hole in the claims, and the low temperature adjustment base member through hole 129 corresponds to the second through hole in the claims.

The base member through hole 120 includes a hole 25 forming a first gas passage hole 131 for supplying the helium gas, which is formed in the base member 20, a lift pin insertion hole (not shown), a terminal through hole. The holes are formed separately from the holes (not shown) and the temperature sensor holes (not shown). The lift pin insertion hole is a hole for inserting a lift pin (not shown) for pushing up the wafer W held on the suction surface S1 of the plate-shaped member 10 and separating it from the suction surface S1. The terminal hole is a hole for accommodating a power supply terminal for supplying power to the chuck electrode 40 and the heater electrode 50 arranged on the plate-shaped member 10. The temperature sensor hole is a hole for accommodating a temperature sensor (for example, a thermocouple) for detecting the internal temperature of the plate member 10.

A-2. Detailed structure of the joint part 30:
A-2-1. Detailed structure of the entire joint 30:
Next, the detailed configuration of the joint portion 30 will be described. FIG. 5 is an explanatory diagram showing an enlarged XZ cross-sectional configuration of a peripheral portion (X1 portion in FIGS. 2 and 3) of the temperature adjusting portion 33 in the bonding portion 30 of the electrostatic chuck 100 of the present embodiment, and FIG. FIG. 4 is an explanatory diagram showing an enlarged XZ cross-sectional structure of a peripheral portion (X2 portion in FIGS. 2 and 3) of a diameter-increased bonding portion through hole 139 in the bonding portion 30 of the electrostatic chuck 100 of the present embodiment.

As described above, the joining portion 30 includes the inter-face joining portion 31 and the temperature adjusting portion 33. As shown in FIGS. 3 and 5, the face-to-face joint portion 31 is a portion joined to the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20, and a portion occupying most of the joint portion 30. Is. The temperature adjusting portion 33 is a portion joined to the lower surface S2 of the plate member 10 and the inner surface S7 of the base member 20 that defines the base member through hole 127 for high temperature adjustment in the base member through hole 120. In the present embodiment, the temperature adjustment portion 33 is a portion of the joint portion 30 that overlaps with the high temperature adjustment base member through hole 127 formed in the base member 20 when viewed in the Z-axis direction. Reference numeral 31 denotes a portion of the joint portion 30 that overlaps with the base member 20 when viewed in the Z-axis direction. In other words, the face-to-face joint portion 31 is a portion of the joint portion 30 other than the temperature adjusting portion 33. The detailed configuration of the peripheral portion (X1 portion shown in FIGS. 2 and 3) of the temperature adjusting portion 33 will be described later.

As described above, the joint portion 30 is formed with the plurality of joint portion through holes 130. As shown in FIG. 3, in the present embodiment, five joining portion through holes 130 are formed in the inter-face joining portion 31 in the joining portion 30. Further, the five joining portion through holes 130 are composed of two normal joining portion through holes 135 and three diameter-increasing joining portion through holes 139. The diameter of the normal joining part through hole 135 is the same as the diameter of the base member through hole 120 (normal base member through hole 125) formed in the base member 20 communicating with the normal joining part through hole 135 when viewed in the Z-axis direction. It is an equivalent through hole. The diameter expansion joint through hole 139 has a diameter larger than the diameter of the base member through hole 120 (low temperature adjustment base member through hole 129) communicating with the diameter expansion joint through hole 139 in the Z-axis direction. It is a hole. The expanded-diameter joint portion through hole 139 corresponds to the joint portion through hole in the claims.

As shown in FIGS. 2, 3 and 6, the normal joint part through hole 135 and the enlarged diameter joint part through hole 139 penetrate the joint part 30 in the thickness direction (vertical direction) and when viewed in the Z-axis direction. Are formed so as to overlap the normal base member through hole 125 and the low temperature adjustment base member through hole 129 formed in the plate member 10, respectively. That is, the normal joining portion through hole 135 and the expanded diameter joining portion through hole 139 communicate with the normal base member through hole 125 and the low temperature adjustment base member through hole 129, respectively.

A-2-2. Detailed configuration of the peripheral portion of the temperature adjusting portion 33 in the joint portion 30:
Next, a detailed configuration of the peripheral portion (X1 portion in FIGS. 2 and 3) of the temperature adjusting portion 33 in the joint portion 30 will be described with reference to FIG. As described above, the temperature adjusting portion 33 is filled in the high temperature adjusting base member through hole 127. As described above, the temperature adjusting portion 33 is a portion joined to the lower surface S2 of the plate member 10 and the inner surface S7 of the base member 20 that defines the high temperature adjusting base member through hole 127. In this way, the temperature adjusting portion 33 is in contact with both the lower surface S2 of the plate-shaped member 10 and the inner surface S7 of the high temperature adjusting base member through hole 127 formed in the base member 20, so that the temperature adjusting portion 33 is adjusted. Heat can be transferred from the plate member 10 to the base member 20 through the portion 33.

As shown in FIG. 5, the length Lf of the temperature adjusting portion 33 in the Z-axis direction is longer than the thickness of the face-to-face joining portion 31. Further, as shown in FIG. 2, in the present embodiment, from the viewpoint of reducing the influence of the temperature on the temperature adjusting portion 33 by the refrigerant flowing through the refrigerant flow passage 21 in the base member 20, the lower end surface of the temperature adjusting portion 33. Are located above the upper end surface of the coolant channel 21. The length Lf of the temperature adjusting portion 33 in the Z-axis direction is preferably, for example, 0.5 mm or more and 25 mm or less. Thus, in the peripheral portion of the temperature adjusting portion 33, both the contact area between the temperature adjusting portion 33 and the lower surface S2 of the plate-shaped member 10 and the contact area between the temperature adjusting portion 33 and the inner surface S7 of the base member 20 are provided. By sufficiently securing the heat, it is possible to secure the heat transfer from the plate member 10 to the base member 20. Further, in the present embodiment, the material forming the temperature adjusting portion 33 is the same as the material forming the face-to-face joint portion 31, and is formed of a silicone resin.

A-2-3. Detailed configuration of the peripheral portion of the expanded diameter joint through hole 139 in the joint 30:
Next, with reference to FIG. 6, a detailed configuration of the peripheral portion (X2 portion in FIGS. 2 and 3) of the enlarged diameter joint through hole 139 in the joint 30 will be described. As described above, when viewed in the Z-axis direction, the diameter Wbo of the expanded diameter joint through hole 139 is larger than the diameter Wba of the low temperature adjustment base member through hole 129 communicating with the expanded diameter joint through hole 139. .. That is, in this embodiment, the area of the exposed surface of the lower surface S2 of the plate-shaped member 10 to the expanded diameter joint through hole 139 is equal to the area of the exposed surface of the bonded portion through hole 130 other than the expanded diameter joint through hole 139. Big compared to. When viewed in the Z-axis direction, the diameter Wbo of the expanded-diameter joint through-hole 139 is preferably 1 mm or more and 10 mm or less. Further, the difference (that is, Wa×2) between the diameter Wbo of the expanded joint through hole 139 and the diameter Wba of the low temperature adjustment base member through hole 129 is preferably 0 mm or more and 5 mm or less. As described above, the temperature adjustment portion 33 is not filled in the expanded diameter joint through hole 139. That is, the lower surface S2 of the plate member 10 and the inner surface S9 of the low temperature adjustment base member through hole 129 are not joined by the temperature adjustment portion 33. As described above, the temperature adjusting portion 33 is not provided in the peripheral portion of the expanded diameter joint through hole 139, and the area of the exposed surface of the lower surface S2 of the plate member 10 to the expanded diameter joint through hole 139 is smaller. By being large, it is possible to suppress heat transfer from the plate member 10 to the base member 20.

In the electrostatic chuck 100 of the present embodiment, the joining portion 30 having the above-described configuration improves heat transfer from the plate-shaped member 10 to the base member 20 in the peripheral portion of the temperature adjusting portion 33, and the diameter expansion joining is performed. In the peripheral part of the part through hole 139, the heat transfer can be suppressed. As a result, it is possible to suppress the occurrence of a high temperature or a low temperature singularity on the suction surface S1 of the plate-shaped member 10, and thus obtain the electrostatic chuck 100 in which the uniformity of the temperature distribution on the suction surface S1 is improved. it can. Here, that the temperature distribution on the adsorption surface S1 is uniform means that the temperature difference Δt between the highest temperature portion and the lowest temperature portion on the adsorption surface S1 is, for example, 2° C. or less.

A-3. Manufacturing method of the electrostatic chuck 100:
FIG. 7 is a flowchart showing a method of manufacturing the electrostatic chuck 100 according to this embodiment. Further, FIG. 8 is an explanatory view schematically showing a method for manufacturing the electrostatic chuck 100 in this embodiment.

(Preparation process of the plate member 10)
First, the plate member 10 is prepared (S100). The plate member 10 can be manufactured by a known method. The plate-shaped member 10 is manufactured by the following method, for example. That is, a plurality of ceramic green sheets (for example, alumina green sheets) are prepared, metalized ink for forming the chuck electrode 40, the heater electrode 50, and the like is printed on each ceramic green sheet, and then the plurality of ceramic green sheets are formed. The plate-shaped member 10 is manufactured by stacking the sheets, thermocompression-bonding them, cutting them into a predetermined disk shape, firing them, and finally performing polishing and the like.

(Preparation process of the base member 20)
Next, the base member 20 is prepared (S110). The base member 20 is manufactured by forming a base member through hole 120 penetrating in the coolant flow path 21 and the Z-axis direction in a circular flat plate-shaped member manufactured by a known method. As shown in FIG. 4, in the present embodiment, eight base member through holes 120 are formed in the base member 20 at positions overlapping the suction surface S1 of the plate member 10 when viewed in the Z-axis direction. .. Further, as described above, the eight base member through holes 120 are formed in the vicinity of the outer periphery of the suction surface S1 at substantially equal intervals in the circumferential direction. The base member through hole 120 can be formed, for example, by using a machining center to which a drill-shaped tool is attached. The coolant channel 21 can be formed by a known method. The step of preparing the base member 20 corresponds to the first step in the claims.

(Preparation process of the first joint portion 30a)
Next, the first joint portion 30a is prepared (S120). The first joining portion 30 a is in a state before joining the plate-shaped member 10 and the base member 20 in the joining portion 30 forming the electrostatic chuck 100. The first bonding portion 30a has a desired shape (for example, a substantially circular shape) by, for example, punching an adhesive sheet manufactured by a known method, and further has a bonding penetrating in the Z-axis direction. It is manufactured by forming the partial through hole 130. In the present embodiment, eight joint through holes 130 having substantially the same diameter as the base member through hole 120 formed in the base member 20 are connected to the base member through hole 120 with respect to the first joint portion 30a. To form. That is, the joint portion through holes 130 formed in the first joint portion 30a are formed so as to have substantially equal intervals in the circumferential direction in the vicinity of the outer periphery of the suction surface S1 when viewed in the Z-axis direction. The step of preparing the first joint portion 30a corresponds to the second step in the claims.

(Process of manufacturing laminated body 100a)
Next, the laminated body 100a in which the plate member 10 and the base member 20 are joined by the joining portion 30 is manufactured (S131, S133). First, the first bonding portion 30a is arranged between the prepared lower surface S2 of the plate-shaped member 10 and the upper surface S3 of the base member 20 to prepare a precursor of the stacked body 100a (S131). The first joint portion 30a is arranged such that the joint portion through hole 130 overlaps the base member through hole 120 formed in the base member 20 in the Z-axis direction. Then, the precursor of the manufactured laminated body 100a is subjected to a curing treatment for curing the adhesive forming the first bonding portion 30a, and the laminated body 100a is manufactured (S133). Through the above steps, as shown in the column (A) of FIG. 8, the laminated body 100a in which the base member through hole 120 formed in the base member 20 and the joint portion through hole 130 formed in the joint portion 30 communicate with each other is obtained. Can be made. The manufacturing process of the stacked body 100a corresponds to the third process in the claims.

(Measurement process of temperature distribution of adsorption surface S1)
Next, the temperature distribution of the adsorption surface S1 of the plate member 10 of the laminated body 100a manufactured in the above process is measured (S141). The temperature distribution of the adsorption surface S1 refers to the temperature distribution in a plane direction substantially parallel to the adsorption surface S1 (direction substantially vertical to the vertical direction). At this time, it is preferable to measure the temperature distribution of the suction surface S1 of the plate-shaped member 10 in the state of use. For example, in a state in which electric power is supplied to the chuck electrode 40 and the heater electrode 50 provided on the plate-shaped member 10 and the refrigerant is supplied to the refrigerant flow passage 21 formed in the base member 20, the temperature distribution of the adsorption surface S1. To measure. By measuring the temperature at a plurality of locations (temperature measurement locations) on the adsorption surface S1, the measured temperature at each temperature measurement location is acquired. The temperature distribution can be measured using a thermocouple-equipped wafer, infrared thermography, or a temperature measuring device such as an infrared radiation thermometer. The step of measuring the temperature distribution of the suction surface S1 corresponds to the fourth step in the claims.

(Adjustment process at high temperature)
As a result of the measurement of the temperature distribution of the adsorption surface S1 obtained in step S141 above, when the temperature distribution of the adsorption surface S1 indicates the presence of a high temperature region (S143: high temperature region exists), the process proceeds to step S151. As shown in the column (B) of FIG. 8, in step S151, among the base member through holes 120 formed in the base member 20, all the base member through holes which are located in a region overlapping with the high temperature region when viewed in the Z-axis direction are penetrated. The temperature adjusting portion 33 is filled in the hole 120 (high temperature adjusting base member through hole 127). In the present embodiment, the temperature adjusting portion 33 is also filled in the joining portion through hole 130 that communicates with the high temperature adjustment base member through hole 127. The filling of the temperature adjusting portion 33 can be performed by injecting the same material (adhesive) as that of the joint portion 30 into the base member through hole 120 and the joint portion through hole 130 using, for example, an injector. As a result, the lower surface S2 of the plate member 10 and the inner surface S7 of the base member 20 defining the high temperature adjustment base member through hole 127 are connected by the temperature adjustment portion 33. In other words, the temperature adjustment portion 33 is filled so as to be in contact with both the lower surface S2 of the plate-shaped member 10 and the inner surface S7 of the base member 20 that defines the high temperature adjustment base member through hole 127. The temperature adjustment portion 33 has a length Lf in the Z-axis direction (see FIG. 5) longer than the thickness of the inter-surface joint portion 31, and the lower end surface of the temperature adjustment portion 33 is above the upper end surface of the refrigerant flow passage 21. It is preferable to be filled so as to be located at (see FIG. 2). In the present embodiment, after step S151, a curing process for curing the temperature adjustment portion 33 is performed (S153).

Thus, in the peripheral portion of the temperature adjusting portion 33, both the contact area between the temperature adjusting portion 33 and the lower surface S2 of the plate-shaped member 10 and the contact area between the temperature adjusting portion 33 and the inner surface S7 of the base member 20 are provided. By sufficiently securing the heat, it is possible to secure the heat transfer from the plate member 10 to the base member 20. The high temperature region in the temperature distribution of the suction surface S1 can be specified by a known method. For example, it is possible to specify a high temperature region within a predetermined range (for example, within a diameter of 30 mm) centered on a high temperature temperature singular point on the suction surface S1. Here, the high temperature singular point means a portion that is higher than the average temperature on the adsorption surface S1 by a predetermined temperature (for example, 2° C.) or more. The temperature adjusting portion 33 corresponds to the filling member in the claims, and the high temperature adjusting step corresponds to the fifth step in the claims.

(Adjustment process at low temperature)
As a result of the measurement of the temperature distribution of the adsorption surface S1 obtained in step S141, when the temperature distribution of the adsorption surface S1 indicates that a low temperature region exists (S143: low temperature region exists), the process proceeds to step S160. As shown in column (C) of FIG. 8, in step S160, all of the base member through holes 120 formed in the base member 20 are penetrated in the region overlapping with the low temperature region when viewed in the Z-axis direction. With respect to each joint portion through hole 130 communicating with the hole 120 (low temperature adjustment base member through hole 129), a part of the joint portion 30 (inter-surface joint portion 31) is removed to increase the diameter expanding joint portion through hole. 139 is formed. The joining portion 30 (inter-face joining portion 31) can be removed using, for example, a hook-shaped resin jig. As a result, the diameter Wbo of the expanded diameter joint through hole 139 becomes larger than the diameter Wba of the low temperature adjustment base member through hole 129 communicating with the expanded diameter joint through hole 139. In other words, in the present embodiment, the area of the exposed surface of the lower surface S2 of the plate-shaped member 10 to the expanded-diameter joining portion through hole 139 is equal to the area of the joined-part through hole 130 (normal joined portion It becomes larger than the area of the exposed surface to the through hole 135). From the viewpoint of suppressing heat transfer from the plate-shaped member 10 to the base member 20, it is preferable that the diameter Wbo of the expanded diameter joint through hole 139 is 1 mm or more and 10 mm or less when viewed in the Z-axis direction (see FIG. 6). ). Further, it is preferable that the difference (that is, Wa×2) between the diameter Wbo of the expanded diameter joint through hole 139 and the diameter Wba of the low temperature adjustment base member through hole 129 is 0 mm or more and 5 mm or less.

As described above, in the peripheral portion of the expanded diameter joint through hole 139, the plate member is not filled with the temperature adjusting portion 33 and a part of the joint portion 30 (inter-surface joint portion 31) is removed. It is possible to suppress heat transfer from 10 to the base member 20. The low temperature region in the temperature distribution of the adsorption surface S1 can be specified by a known method. For example, a predetermined range centered on a low temperature singular point on the adsorption surface S1 (for example, a range of 30 mm in diameter) can be specified as the low temperature region. Here, the low temperature singular point means a portion that is lower than a predetermined temperature (for example, 2° C.) or more as compared with the average temperature on the adsorption surface S1. The low temperature adjustment step corresponds to the sixth step in the claims.

The manufacturing of the electrostatic chuck 100 in which the uniformity of the temperature distribution on the suction surface S1 of the plate-shaped member 10 is improved is mainly completed through the above steps.

A-4. Effects of this embodiment:
As described above, the electrostatic chuck 100 of this embodiment has the plate-shaped member 10 having the attraction surface S1 that is substantially orthogonal to the Z-axis direction and the lower surface S2 opposite to the attraction surface S1, and the upper surface S3. And a joint portion 30 for joining the plate-shaped member 10 and the base member 20 to each other, and the plate-shaped member 10 having the upper surface S3 located on the lower surface S2 side of the plate-shaped member 10. This is a device for holding an object (for example, a wafer W) on the suction surface S1 of 10. Further, in the electrostatic chuck 100 of the present embodiment, the base member 20 is penetrated in the Z-axis direction, and when viewed in the Z-axis direction, the electrostatic chuck 100 is arranged at a position overlapping with the attraction surface S1 of the plate-shaped member 10 at a high temperature. The adjustment base member through hole 127, the low temperature adjustment base member through hole 129, and the refrigerant flow path 21 are formed. Further, in the electrostatic chuck 100 of the present embodiment, the bonding portion 30 includes the inter-surface bonding portion 31 bonded to the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20, and the plate member 10. The lower surface S2 and the inner surface S7 of the base member 20 defining the high temperature adjustment base member through hole 127 are provided with a temperature adjustment portion 33 joined to the lower surface S2. Further, in the electrostatic chuck 100 of the present embodiment, the lower surface S2 of the plate member 10 and the inner surface of the base member 20 that normally defines the base member through hole 125 are not joined, and the plate member 10 is not bonded. The lower surface S2 and the inner surface S9 of the base member 20 that defines the low temperature adjustment base member through hole 129 are not joined.

As described above, in the electrostatic chuck 100 according to the present embodiment, the plurality of base member through holes 120 are formed at the position overlapping the suction surface S1 of the plate-shaped member 10 when viewed in the Z-axis direction. The inner surface S7 of the high temperature adjustment base member through hole 127 of the plurality of base member through holes 120 is joined to the lower surface S2 of the plate member 10 via the temperature adjustment portion 33. On the other hand, the inner surface of the normal base member through hole 125 and the low temperature adjustment base member through hole 129 of the plurality of base member through holes 120 is not joined to the lower surface S2 of the plate member 10. That is, in the electrostatic chuck 100 of the present embodiment, the temperature adjusting portion 33 is provided as compared with the surroundings of the normal base member through hole 125 and the low temperature adjustment base member through hole 129 which are not provided with the temperature adjusting portion 33. Good heat transfer between the plate member 10 and the base member 20 around the high temperature adjustment base member through hole 127.

A temperature singular point of high temperature may occur on the attraction surface of the plate-shaped member of the electrostatic chuck due to variations in manufacturing the electrostatic chuck. In the electrostatic chuck 100 of the present embodiment, the heat transfer (heat conduction) between the plate-shaped member 10 and the base member 20 becomes good in the vicinity of the high temperature adjustment base member through hole 127, so that the base member is improved. It is possible to improve the cooling efficiency due to the coolant flow passage 21 formed in 20. That is, since the electrostatic chuck 100 according to the present embodiment employs the above-described configuration, the temperature of the suction surface S1 and the temperature in the vicinity of the region overlapping the high temperature adjustment base member through hole 127 in the Z-axis direction are lowered. Can be adjusted. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to provide the electrostatic chuck 100 in which the temperature distribution of the suction surface S1 of the plate-shaped member 10 is controlled (for example, the uniformity of the temperature distribution is improved). As a result, the controllability of the temperature distribution of the wafer W held on the suction surface S1 can be improved.

In addition, in the electrostatic chuck 100 of the present embodiment, the material forming the inter-surface joint portion 31 included in the joint portion 30 and the material forming the temperature adjusting portion 33 are the same. Therefore, when the electrostatic chuck 100 of the present embodiment receives a stress such as a strain or a compression, the face-to-face joint portion 31 and the temperature adjusting portion 33 are similarly deformed, and the stress caused by the deformation is effective. Can be relaxed. Further, according to the electrostatic chuck 100 of the present embodiment, since the inter-surface bonding portion 31 and the temperature adjusting portion 33 are formed of the same material, the affinity between them is good, and the temperature adjusting portion 33 is It is possible to suppress peeling from the face-to-face joint portion 31.

Further, in the electrostatic chuck 100 of this embodiment, the attraction surface S1 of the plate-shaped member 10 is substantially circular. Further, in the electrostatic chuck 100 of the present embodiment, the base member through hole 120 formed in the center PO of the attraction surface S1 of the plate member 10 and the base member 20 (normal base member through hole 125, when viewed in the Z-axis direction, The distance Lr from the centers of the high temperature adjustment base member through hole 127 and the low temperature adjustment base member through hole 129) is equal to or greater than half the radius R of the suction surface S1. In other words, in the electrostatic chuck 100 of the present embodiment, the plurality of base member through holes 120 are located near the outer periphery of the attraction surface S1 of the plate member 10 when viewed in the Z-axis direction. The vicinity of the outer periphery of the attraction surface of the plate-shaped member is a portion where a temperature singularity is likely to occur due to variations in manufacturing the electrostatic chuck. Since the electrostatic chuck 100 according to the present embodiment employs the above configuration, the base member through hole 120 is formed in the vicinity of the outer periphery of the adsorption surface S1 that is a portion where the temperature singularity is likely to occur in the Z-axis direction. The temperature of the overlapping area and its vicinity can be adjusted. Therefore, according to the electrostatic chuck 100 of the present embodiment, the electrostatic chuck 100 in which the temperature distribution near the outer periphery of the attraction surface S1 of the plate-shaped member 10 is controlled (for example, the uniformity of the temperature distribution is improved) is obtained. Therefore, the controllability of the temperature distribution of the wafer W held on the suction surface S1 can be improved.

Further, in the electrostatic chuck 100 of the present embodiment, the joint portion 30 has a joint portion through hole 130. Further, the diameter Wbo of the expanded-diameter joint through-hole 139 in the bonded-section through-hole 130 is smaller than the diameter Wba of the low temperature adjustment base member through-hole 129 communicating with the expanded-diameter joint through-hole 139. large. In other words, in the electrostatic chuck 100 of the present embodiment, the area of the exposed surface of the lower surface S2 of the plate-shaped member 10 to the expanded diameter joint through hole 139 has the same diameter as that of the base member through hole 120. It is larger than the area of the exposed surface to the hole 135. Therefore, heat transfer between the plate-shaped member 10 and the base member 20 is suppressed in the vicinity of the enlarged-diameter joint through-hole 139, as compared with the vicinity of the normal joint through-hole 135.

A low temperature singular point may occur on the attraction surface of the plate-shaped member of the electrostatic chuck due to variations in manufacturing the electrostatic chuck. In the electrostatic chuck 100 of the present embodiment, the heat transfer (heat conduction) between the plate-shaped member 10 and the base member 20 is suppressed around the low temperature adjustment base member through hole 129, so that the base member is suppressed. It is possible to suppress the cooling efficiency due to the coolant flow passage 21 formed in 20. That is, since the electrostatic chuck 100 according to the present embodiment employs the above-described configuration, the temperature of the suction surface S1 and the vicinity thereof in the region overlapping the low temperature adjustment base member through hole 129 in the Z-axis direction are increased. The temperature can be adjusted. Therefore, according to the electrostatic chuck 100 of this embodiment, the temperature distribution of the suction surface S1 of the plate-shaped member 10 is more effectively controlled (for example, the uniformity of the temperature distribution is improved). Therefore, the controllability of the temperature distribution of the wafer W held on the suction surface S1 can be improved more effectively.

Further, in the method for manufacturing the electrostatic chuck 100 of the present embodiment, first, the base member 20 is penetrated in the Z-axis direction, and at a position overlapping the attraction surface S1 of the plate-shaped member 10 when viewed in the Z-axis direction. A base member 20 having a base member through hole 120 (normal base member through hole 125, high temperature adjusting base member through hole 127, low temperature adjusting base member through hole 129) and a coolant channel 21 is prepared. (Preparing step of the base member 20, S110), the joining portion 30 is penetrated in the Z-axis direction with respect to the first joining portion 30a in the state before joining the plate member 10 and the base member 20. Also, a joint part through hole communicating with the base member through hole 120 (normal base member through hole 125, high temperature adjusting base member through hole 127, low temperature adjusting base member through hole 129) formed in the base member 20. The 1st joined part 30a in which 130 was formed is prepared (the preparation process of the 1st joined part 30a, S120). After that, the first joint portion 30a is arranged between the plate-shaped member 10 and the base member 20, and the laminated body 100a in which the plate-shaped member 10 and the base member 20 are joined by the joint portion 30 is manufactured (a laminated body). The manufacturing process of 100a, S131, S133), and the temperature distribution of the adsorption surface S1 of the plate-shaped member 10 constituting the stacked body 100a is measured (the temperature distribution measurement process of the adsorption surface S1, S141). Further, in step S141, when the temperature distribution of the suction surface S1 of the plate-shaped member 10 is measured and the temperature distribution of the suction surface S1 indicates the presence of a high temperature region (S143: there is a high temperature region), the Z-axis direction view is performed. In the above, by filling the temperature adjusting portion 33 in the base member through hole 120 (high temperature adjusting base member through hole 127) located in the region overlapping with the high temperature region, the lower surface S2 of the plate member 10 and the high temperature The inner surface S7 of the base member 20 defining the time adjusting base member through hole 127 is connected (high temperature adjusting step, S151, S153), and in step 141, the temperature distribution of the suction surface S1 of the plate member 10 is measured. As a result, when the existence of a low temperature region is shown in the temperature distribution of the adsorption surface S1 (S143: there is a low temperature region), the base member through hole 120 (adjusted at low temperature) located in a region overlapping the low temperature region in the Z-axis direction view. For the joint portion through hole 130 communicating with the base member through hole 129), the diameter Wbo of the joint portion through hole 130 is equal to the diameter Wba of the low temperature adjustment base member through hole 129 communicating with the joint portion through hole 130. A part of the joint portion 30 (inter-face joint portion 31) is removed so as to be larger than the other, and the enlarged joint portion through hole 139 is formed (low temperature adjustment step, S160).

As described above, in the method of manufacturing the electrostatic chuck 100 according to the present embodiment, the base member through hole 120 is formed in the base member 20 in advance. Next, a laminated body 100a including the base member 20 having the base member through holes 120 formed therein, the plate-shaped member 10 and the first joint portion 30a (joint portion 30) is produced, and the produced laminate body is produced. The temperature distribution of the adsorption surface S1 of the plate member 10 at 100a is measured. As a result of the measurement, when the existence of the high temperature region of the temperature distribution is shown on the adsorption surface S1, the base member through hole 120 (the high temperature adjustment base member through hole) located in the region overlapping with the high temperature region when viewed in the Z-axis direction. For 127), the high temperature adjustment step is executed. Further, as a result of the above measurement, when the existence of a low temperature region of the temperature distribution on the adsorption surface S1 is shown, the base member through hole 120 (the low temperature adjustment base member) located in the region overlapping with the low temperature region when viewed in the Z-axis direction. The above-described low temperature adjustment step is performed on the joint portion through hole 130 communicating with the through hole 129).

In the high temperature adjustment step, the base member 20 defining the high temperature adjustment base member through hole 127 and the lower surface S2 of the plate member 10 is filled by filling the high temperature adjustment base member through hole 127 with the temperature adjustment portion 33. Is connected to the inner surface S7. As a result, heat transfer from the plate-shaped member 10 to the base member 20 can be improved, and the cooling efficiency by the refrigerant flow path 21 formed in the base member 20 can be improved. That is, the temperature of the high temperature region in the adsorption surface S1 can be lowered. Further, in the low temperature adjustment step, the exposed surface of the lower surface S2 of the plate member 10 to the joining portion through hole 130 becomes larger than the joining portion through hole 130 communicating with the low temperature adjustment base member through hole 129. Thus, a part of the joint portion 30 (inter-face joint portion 31) is removed to form the enlarged diameter joint portion through hole 139. Thereby, heat transfer from the plate-shaped member 10 to the base member 20 can be suppressed, and the cooling efficiency by the refrigerant flow path 21 formed in the base member 20 can be suppressed. That is, it is possible to raise the temperature of the low temperature region in the suction surface S1. Therefore, according to the method for manufacturing the electrostatic chuck 100 of the present embodiment, the temperature distribution of the attraction surface S1 of the plate member 10 is determined based on the measurement result of the temperature distribution of the attraction surface S1 of the plate member 10 of the stacked body 100a. Can be controlled (for example, the uniformity of the temperature distribution can be improved), and by extension, the controllability of the temperature distribution of the wafer W held on the suction surface S1 can be improved.

B. Modification:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof, for example, the following modifications are also possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and can be variously modified. For example, at least one of the chuck electrode 40 and the heater electrode 50 may not be provided inside the plate member 10. Further, in the above embodiment, the heater electrode 50 is arranged inside the plate-shaped member 10. However, the heater electrode 50 does not necessarily have to be arranged inside the plate-shaped member 10, and the surface of the plate-shaped member 10 is not necessarily arranged. The heater electrode 50 may be disposed in the. Further, in each of the above-described embodiments, the coolant channel 21 is formed in the base member 20, but the coolant channel 21 does not necessarily have to be formed in the base member 20. The cooling mechanism may be provided.

In the electrostatic chuck 100 according to the above-described embodiment, the suction surface S1 of the plate member 10 has a substantially circular flat shape, but the shape is not limited to this. For example, it may be a polygonal flat surface or another shape.

In the electrostatic chuck 100 according to the above-described embodiment, in the base member 20, the eight base member through holes 120 are provided in the vicinity of the outer periphery of the suction surface S1 (positions having a length of ½ or more of the radius R in the suction surface S1). , Are formed so as to be arranged at substantially equal intervals in the circumferential direction, but are not limited to this. For example, the number of base member through holes 120 may be two or more and less than eight, or may be more than eight. Further, the base member through hole 120 does not have to be formed in the vicinity of the outer periphery of the suction surface S1 and may be formed, for example, on the entire surface or the central portion of the suction surface S1. Further, the base member through holes 120 do not have to be formed on the suction surface S1 at substantially equal intervals, and may be formed at random, for example.

In the above-described embodiment, the temperature adjusting portion 33 that constitutes the joint portion 30 includes the entire surface of the surface of the temperature adjusting portion 33 that faces the lower surface S2 of the plate-shaped member 10 and the base member 20 for adjusting the base member 20 at high temperature. The entire surface of the base member 20 facing the inner surface S7 that defines the through hole 127 is joined to the plate member 10 and the base member 20, but is not limited to this. For example, among the respective surfaces of the temperature adjusting portion 33, there may be a portion which is not joined to the lower surface S2 of the plate member 10 and the inner surface S7 of the base member 20, respectively. In addition, in the above-described embodiment, the inter-face joining portion 31 and the temperature adjusting portion 33 are joined to each other, but the embodiment is not limited to this, and is not joined between the inter-face joining portion 31 and the temperature adjusting portion 33. There may be parts.

In the above-described embodiment, the joint portion 30 employs the configuration including the enlarged diameter joint portion through hole 139, but the present invention is not limited to this, and the joint portion 30 may not include the enlarged diameter joint portion through hole 139. .. That is, all the joining portion through holes 130 included in the joining portion 30 may be the normal joining portion through holes 135. Further, in the above embodiment, all the low temperature adjustment base member through holes 129 communicate with the expanded diameter joint through holes 139, respectively, but the present invention is not limited to this. For example, all or some of the low temperature adjustment base member through holes 129 may be in communication with the normal joint through holes 135.

In the above-described embodiment, the expanded diameter joint portion through hole 139 and the low temperature adjustment base member through hole 129 formed in the joint portion 30 may further include a temperature adjusting portion 33. Further, instead of the temperature adjusting portion 33, the portion exposed to the expanded diameter joint through hole 139 in the lower surface S2 of the plate-shaped member 10 and the expanded diameter joint through hole 139 in the upper surface S3 of the base member 20. A joint portion that joins the exposed portion may be provided.

In the above-described embodiment, the configuration in which the inter-face joint portion 31 and the temperature adjusting portion 33 provided in the joint portion 30 are made of the same material is adopted, but the configuration is not limited to this, and the inter-face joint portion 31 and the temperature adjusting portion 33 are It may be a configuration of different materials. From the viewpoint of suppressing peeling between the face-to-face joint portion 31 and the temperature adjustment portion 33, and from the viewpoint of equalizing the degree of stress relaxation between the face-to-face joint portion 31 and the temperature adjustment portion 33, the face-to-face joint The part 31 and the temperature adjusting part 33 are preferably made of the same material.

In the method of manufacturing the electrostatic chuck 100 according to the above-described embodiment, the joining portion through hole 130 is formed in the step of preparing the first joining portion 30a, but the present invention is not limited to this, and the joining portion through hole 130 is not formed. May be In this case, in the high temperature adjustment step, the base member 20 that defines the high temperature adjustment base member through hole 127 and the portion of the lower surface of the joint portion 30 exposed to the high temperature adjustment base member through hole 127. The temperature adjusting portion 33 can be filled so as to be bonded to the inner surface S7 of the. In the low temperature adjustment step, at least one of the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20 is exposed in the peripheral portion of the low temperature adjustment base member through hole 129 in the joint portion 30. Thus, a part of the joint portion 30 can be removed to form the expanded diameter joint portion through hole 139.

In the method of manufacturing the electrostatic chuck 100 according to the above-described embodiment, the manufacturing process of the stacked body 100a includes the curing process of the first bonding portion 30a, but the manufacturing process is not limited thereto. For example, when the adhesive used as the bonding portion 30 does not require a curing treatment, the curing treatment may not be included in the manufacturing process of the laminated body 100a.

In the manufacturing method of the electrostatic chuck 100 of the above-described embodiment, both the high temperature adjustment step and the low temperature adjustment step are executed, but the present invention is not limited to this, and according to the measurement result of the temperature distribution of the adsorption surface S1, Either one of the steps may be performed.

In the manufacturing method of the electrostatic chuck 100 of the above-described embodiment, in the high temperature adjustment step, with respect to all the base member through holes 120 located in the area overlapping the high temperature area of the suction surface S1 in the Z-axis direction. Although the temperature adjusting portion 33 is filled, the present invention is not limited to this, and the temperature adjusting portion 33 may be filled in some of the base member through holes 120. Also in the low temperature adjustment step, as viewed in the Z-axis direction, with respect to each joint part through hole 130 that communicates with all the base member through holes 120 that are located in the region that overlaps the low temperature region in the suction surface S1, Although the process for forming the expanded-diameter joint through hole 139 is performed, the process is not limited to this, and the process for forming the expanded-diameter joint through hole 139 may be performed for some of the base member through holes 120.

Further, in each of the above-described embodiments, the monopolar system in which one chuck electrode 40 is provided inside the plate member 10 is adopted, but a pair of chuck electrodes 40 is provided inside the plate member 10. A bipolar system may be adopted. Further, the material forming each member in each of the above embodiments is merely an example, and each member may be formed of another material.

The present invention is not limited to the electrostatic chuck 100 that holds the wafer W by using electrostatic attraction, and includes a plate-shaped member, a base member, and a bonding portion, and holds an object on the surface of the plate-shaped member. It can be similarly applied to other holding devices (for example, a vacuum chuck etc.).

10: Plate-shaped member 20: Base member 21: Refrigerant flow path 25: Hole 30: Joining part 30a: First joining part 31: Inter-face joining part 33: Temperature adjusting part 35: Hole 40: Chuck electrode 50: Heater electrode 100: Electrostatic chuck 100a: Laminated body 120: Base member through hole 125: Normal base member through hole 127: High temperature adjustment base member through hole 129: Low temperature adjustment base member through hole 130: Joined portion through hole 131: First gas passage hole 132: Second gas passage hole 133: Lateral passage 134: Expanded portion 135: Normal joint through hole 139: Expanded joint through hole 141: Step 160: Filling member (air permeability) Plug) Lf: Length Lr: Distance PO: Center R: Radius S1: Adsorption surface S2: Lower surface S3: Upper surface S4: Lower surface S7: Inner surface S9: Inner surface W: Wafer

Claims (5)

A plate-shaped member having a first surface substantially orthogonal to the first direction and a second surface opposite to the first surface;
A base member having a third surface, the third surface being arranged so as to be located on the second surface side of the plate-shaped member, the base member penetrating in the first direction, and A first through hole arranged at a position overlapping the first surface of the plate-shaped member in the first direction, a second through hole, and a base member on which a cooling mechanism is formed,
A joint portion that joins the plate member and the base member,
And an electrostatic chuck for holding an object on the first surface of the plate-shaped member,
The joint is
A first portion joined to the second surface of the plate member and the third surface of the base member;
A second portion joined to the second surface of the plate-shaped member and an inner surface of the base member defining the first through hole;
Equipped with
The second surface of the plate-shaped member and the inner surface of the base member defining the second through hole are not joined,
An electrostatic chuck characterized in that The electrostatic chuck according to claim 1,
The material forming the first portion and the material forming the second portion are the same,
An electrostatic chuck characterized in that The electrostatic chuck according to claim 1 or 2,
The first surface of the plate-shaped member is substantially circular,
In the first direction, the distance between the center of the first surface of the plate-shaped member and the center of the first through hole formed in the base member, and the first distance of the plate-shaped member. The distance between the center of the surface and the center of the second through hole is equal to or more than half the radius of the first surface.
An electrostatic chuck characterized in that The electrostatic chuck according to any one of claims 1 to 3,
In the joint, a joint through hole is formed,
The diameter of the joint through-hole is larger than the diameter of the second through-hole communicating with the joint through-hole,
An electrostatic chuck characterized in that A plate-like member having a first surface substantially orthogonal to the first direction and a second surface opposite to the first surface; and a third surface, the third surface Is provided so as to be located on the side of the second surface of the plate-shaped member, and includes a base member having a cooling mechanism, and a joint portion that joins the plate-shaped member and the base member, In a method of manufacturing an electrostatic chuck for holding an object on the first surface of a plate-shaped member,
A first penetrating hole and a second penetrating hole penetrate through the base member in the first direction and overlap the first surface of the plate-shaped member in the first direction. A first step of preparing the base member having holes formed therein;
The first joining portion in the joining portion, which is in a state before joining the plate member and the base member, penetrates in the first direction and is formed on the base member. A second step of preparing the first joining portion in which a joining portion through hole communicating with at least the second through hole of the first through hole and the second through hole is prepared;
A third step of arranging the first joint between the plate-shaped member and the base member to produce a laminated body in which the plate-shaped member and the base member are joined by the joint. ,
A fourth step of measuring the temperature distribution of the first surface of the plate-shaped member constituting the laminated body,
In the fourth step, when the temperature distribution of the first surface of the plate-shaped member is measured and the presence of a high temperature region is indicated in the temperature distribution of the first surface, In, the filling member is filled in the first through hole located in the region overlapping with the high temperature region to define the second surface of the plate member and the first through hole. As a result of measuring the temperature distribution of the first surface of the plate-shaped member in the fifth step and the fourth step of connecting the inner surface of the base member, the temperature distribution of the first surface When the presence of the low temperature region is indicated in the first direction, the joint portion penetrating hole is communicated with the joint portion penetrating hole communicating with the second penetrating hole located in a region overlapping the low temperature region. At least one of a sixth step of removing a part of the joint so that the diameter of the hole is larger than the diameter of the second through hole communicating with the joint through hole,
With
A method of manufacturing an electrostatic chuck, comprising:

Images