JP2020080295A - Method for manufacturing photoelectric device with partition wall - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a photoelectric mechanism including a partition wall. The present invention discloses a method for manufacturing a photoelectric mechanism capable of improving the processing accuracy of a partition wall and reducing the cost, and the manufacturing method is at least one in order to expose a mounting surface and a step of preparing a substrate. A step of laminating a partition film having an opening of the above on a mounting surface of the substrate, and at least one photoelectric unit is provided in the at least one opening, and the photoelectric unit is either a light emitting unit or a light receiving unit. It includes a step in which the partition film is higher than the photoelectric unit. [Selection diagram] Fig. 5

Description

  The present invention relates to a method for manufacturing a photoelectric device, and more particularly to a method for forming a partition on the photoelectric device.

  A conventional optical sensor includes a light emitting unit and a light receiving unit, and after the light emitted from the light emitting unit is reflected by a detection object, the light receiving unit receives the light and outputs a detection signal. In order to prevent the light emitted from the light emitting unit from being directly transmitted to the light receiving unit, the conventional light sensor has a partition between the light emitting unit and the light receiving unit, so that the light emitting unit emits light only in a predetermined direction. In addition, the reliability of the optical sensor is improved by emitting the light and causing the light receiving unit to detect only the light coming from the predetermined direction.

  Most of the barrier ribs of the conventional optical sensor have been formed by a molding method such as injection molding. And (2) easily affects the precision due to mold shift and is disadvantageous in downsizing, and (3) increases the cost by manufacturing each die according to different partition wall shapes. There was a drawback.

  In view of the above-mentioned problems of the conventional technology, the main object of the present invention is to provide a method of manufacturing a photoelectric mechanism that can improve accuracy and reduce cost.

  In order to achieve the above object, a method of manufacturing a photoelectric device including a partition according to the present invention comprises a step of preparing a substrate, and a partition film having at least one opening for exposing a mounting surface of the substrate. Laminating on the mounting surface, at least one photoelectric unit is provided on the mounting surface, the at least one photoelectric unit is located in the at least one opening, and the photoelectric unit is a light emitting unit and One of the light receiving units, wherein the partition film is higher than the photoelectric unit.

  The accuracy of the partition formed by the above method is high, the processing cost can be reduced, and the degree of freedom in the circuit design of the photoelectric mechanism can be increased. There is no need to rework or repair the mold.

It is a schematic diagram which shows the manufacturing method which concerns on Example 1 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 1 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 1 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 1 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 1 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 2 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 2 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 2 of this invention. It is a schematic diagram which shows the manufacturing method which concerns on Example 2 of this invention. It is a top view of the produced photoelectric mechanism which concerns on Example 2 of this invention.

  The present invention is a method of manufacturing a photoelectric mechanism including a partition, wherein the photoelectric mechanism can be a light emitting device, a light receiving device or a device having light emitting and light receiving functions at the same time, for example, a conventional optical sensor, The optical sensor can be used as a remote controller or a rangefinder, but is not limited thereto.

  Referring to FIGS. 1, 2 and 3, in one embodiment of the present invention, the fabrication method includes the following steps. A substrate 10 is prepared, and the substrate 10 may be a circuit substrate in which a circuit is already manufactured or a lead frame for LED. For example, the substrate 10 is formed of an insulating base material and an insulating base material. The insulating base material includes a circuit structure and a contact pad, and the insulating base material is, for example, an epoxy resin, a glass cloth, a polyester, or a base material that is often used for manufacturing a circuit board. Next, the partition wall film 20 is laminated on the mounting surface 11 of the substrate 10, and the partition wall film 20 has at least one opening 21 (the number of openings in this embodiment is two). After the partition wall film 20 is laminated on the substrate 10, it is formed by a laser cutting method, the mounting surface 11 can be exposed from the opening 21, and the circuit structure or the contact pad can be covered in the opening 21. In a preferred embodiment, the main component of the partition wall film 20 is an epoxy resin, and the partition wall film 20 is in a semi-cured state before being stacked on the substrate 10, that is, a polymer in the partition wall film 20. Cross-linking is incomplete, and after the partition wall film 20 is laminated on the substrate 10, the partition wall film 20 is transferred to a full curing stage through thermal curing and photo-curing, and the polymer in the partition wall film 20 is completely cross-linked. The barrier rib film in the cured state has a function similar to the light blocking of the barrier rib of the optical sensor described above. In a preferred embodiment, the semi-cured barrier film 20 is formed on the carrier film before being laminated on the substrate 10, and the carrier film is removed after the barrier film 20 is laminated on the substrate 10, and the carrier film is It can be polyethylene terephthalate (PET) or other polyester thin film, polyimide thin film, polyamideimide thin film, polypropylene thin film, polystyrene thin film. In a preferred embodiment, the partition wall film 20 can absorb most of the light by making it black.

  Next, referring to FIG. 4, a photoelectric unit 30 is provided in each opening 21, and the photoelectric unit 30 is any one of a light emitting unit and a light receiving unit. The photoelectric unit on the right side is the light emitting unit, the photoelectric unit on the left side of FIG. 4 is the light receiving unit, and the partition wall film 20 is higher than the photoelectric unit to block light, and if necessary, the photoelectric unit 30 is In the case where the optoelectronic unit is a flip chip LED, or other suitable case, an electric connection is formed with a circuit structure or a contact pad on the substrate 10, and the electric connection is realized by, for example, wire bonding. The wire bonding step can be omitted. When the light emitting unit is an LED, when the light receiving unit is a CCD or a CMOS, the light emitting unit is used to emit light, and the light receiving unit is used to detect light, and the light is visible light or invisible light. It can be, for example, infrared.

  Next, referring to FIG. 5, a gel is applied in the opening, and the applied gel 40 may be a transparent gel or a translucent gel such as a fluorescent gel, and is used to protect the photoelectric unit. And/or used to emit light of a preselected wavelength, that is, the fabricated optoelectronic device has a substrate 10 and a barrier film 20 having at least one opening 21 laminated on the substrate 10. The mounting surface 11, the at least one photoelectric unit 30 formed on the mounting surface 11 and located in the opening 21, and the gel 40 formed in the opening 21.

  Referring to FIGS. 6 to 10, in another embodiment of the present invention, a difference from the above-described manufacturing method is that the barrier film 20 is in a cured state 22 and a semi-cured state before being stacked on the substrate 10. 23, the cured portion 22 does not contact the mounting surface 11 thereafter, and the semi-cured portion 23 contacts the mounting surface 11 after being stacked; and the partition wall film 20 of the present embodiment is applied to the substrate 10. Prior to stacking, the opening 21 is further formed by punching or other method, and the opening 21 penetrates the cured portion 22 and the semi-cured portion 23; Is to shift the semi-cured part 23 to a full curing stage through heat curing and light curing. In this embodiment, the semi-cured portion has a gel-like function, and fixes the partition film 20 on the substrate 10 in the process of thermosetting and photocuring. In a preferred embodiment, the cured portion 22, the semi-cured portion 23, and the insulating base material of the substrate 10 are made of the same material so that the substrate 10 and the partition film 20 have the same coefficient of thermal expansion. Also, it prevents cracking during the subsequent heat treatment and helps improve reliability of the manufacturing process.

DESCRIPTION OF SYMBOLS 10 Substrate 11 Mounting surface 20 Partition film 21 Opening 22 Cured state part 23 Semi-cured state part 30 Photoelectric unit 40 Gel

Claims (6)

A step of preparing a substrate,
Stacking a barrier film having at least one opening on the mounting surface of the substrate to expose the mounting surface;
At least one photoelectric unit is provided on the mounting surface, the at least one photoelectric unit is located in the at least one opening, and the photoelectric unit is one of a light emitting unit and a light receiving unit. And a step in which the partition wall film is higher than the photoelectric unit, and a method of manufacturing a photoelectric mechanism including a partition wall.     When the partition film is stacked on the mounting surface, at least a part of the partition film is in a semi-cured state, and the semi-cured part of the partition film is in contact with the mounting surface. Item 2. A method of manufacturing a photoelectric mechanism including a partition according to Item 1.     The part of the partition wall film is in a cured state when the partition wall film is stacked on the mounting surface, and the cured portion of the partition wall film does not come into contact with the mounting surface. A method of manufacturing an optoelectronic mechanism having a partition as described.     The method of claim 1, wherein the at least one opening is formed before the partition film is stacked on the mounting surface.     The method of claim 1, wherein the at least one opening is formed after the partition film is stacked on the mounting surface. The photoelectric device with a partition according to claim 1 or 2, characterized in that after the photoelectric unit is provided in the at least one opening, gel is further applied in the at least one opening. Production method.

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