JP2020045253A - Ceramic joined body - Google Patents

Abstract

To improve a strength of a joint portion in a direction substantially perpendicular to a first direction.SOLUTION: The ceramic joined body includes a first ceramic member, a second ceramic member, and a joint portion joining both of them, containing at least one of ceramics and glass as a main component, and formed of a material having a thermal expansion coefficient different from the thermal expansion coefficient of at least one of constituent materials such as the first ceramic member. There is a specific region that includes, in at least one specific cross section substantially perpendicular to the first direction, a plurality of ceramic particles and the constituent materials of the joint portion existing between the ceramic particles, in which a ratio of the number of specific ceramic particles having a roundness of 0.4 or more is 50% or more for a total number of the plurality of the ceramic particles.SELECTED DRAWING: Figure 5

Description

  The technology disclosed in the present specification relates to a ceramic joined body.

  A heating device (also referred to as a “susceptor”) that heats an object (eg, a semiconductor wafer) to a predetermined processing temperature (eg, about 400 to 650 ° C.) while holding the object (eg, a semiconductor wafer) is known. The heating device is used as a part of a semiconductor manufacturing device such as a film forming device (such as a CVD film forming device or a sputtering film forming device) or an etching device (such as a plasma etching device).

  Generally, the heating device has a holding surface and a back surface that are substantially perpendicular to a predetermined direction (hereinafter, referred to as a “first direction”), and extends in a first direction with a plate-shaped holding member formed of ceramics. It has a pillar shape, is joined to the back surface of the holder, and is provided with a pillar support made of ceramics, and a joining part joining the holder and the pillar support. A resistance heating element is disposed inside the holder, and a plurality of power receiving electrodes (electrode pads) electrically connected to the resistance heating element are disposed on the back side of the holder. Further, the columnar support houses electrode terminals joined to the respective power receiving electrodes. When a voltage is applied to the resistance heating element via the electrode terminal and the power receiving electrode, the resistance heating element generates heat, and an object (for example, a semiconductor wafer) held on the holding surface of the holding body is heated to, for example, 400 to 650 ° C. Heated to a degree.

  2. Description of the Related Art Conventionally, in order to improve the joining strength of a joining portion for joining ceramic members such as a holding body and a columnar support member, a technology for reducing the center line average roughness (Ra) of each joining surface of the ceramic member to 0.2 μm or less. Is known (see Patent Document 1 below).

JP-A-8-73280

  In the above-described conventional heating device, the bonding strength between the ceramic member and the bonding portion may not be sufficiently secured, and there is room for further improvement.

  Such a problem is not limited to the heating device, and is a problem common to the ceramic joined body in which the first ceramic member and the second ceramic member are joined by the joint.

  This specification discloses a technique capable of solving at least a part of the above-described problem.

  The technology disclosed in this specification can be realized as the following modes.

(1) A ceramic joined body disclosed in the present specification includes a first ceramic member, a second ceramic member, and a first ceramic member and a second ceramic member in a first direction. The first ceramic member and the second ceramic member are joined to each other, and include at least one of ceramic and glass as a main component, and have a coefficient of thermal expansion of the first ceramic member and the second ceramic member. A joined portion formed of a material having a coefficient of thermal expansion different from that of at least one of the forming members of the ceramic member, wherein at least one specific cross section substantially perpendicular to the first direction has the first A plurality of ceramic particles forming the ceramic member or the second ceramic member; And a material forming the joint portion interposed therebetween, wherein the circularity defined by the following equation (1) is 0.4 or more with respect to the total number of the plurality of ceramic particles. There is a specific region in which the ratio of the number of certain specific ceramic particles is 50% or more.
Roundness = Σri / (Rn) (1)
However,
ri: radius of the circle inscribed in the corner of the ceramic particle R: radius of the largest circle inscribed in the ceramic particle n: number of the corner of the ceramic particle Σ: sum of the ceramic particle to the corner According to the body, at least one specific cross section substantially perpendicular to the first direction, a plurality of ceramic particles forming the first ceramic member or the second ceramic member, and a bonding portion interposed between the ceramic particles. And a specific region in which the proportion of the number of specific ceramic particles having a roundness of 0.4 or more is 50% or more. Thereby, as compared with a configuration in which the specific region does not exist in any of the cross sections substantially perpendicular to the first direction, the connection between the ceramic member (at least one of the first ceramic member and the second ceramic member) and the joint portion is made. The adhesion can be improved, and the strength of the joint in a direction substantially perpendicular to the first direction can be improved.

(2) In the ceramic joined body, in the specific region, the joint may include a mesh portion continuously surrounding the ceramic particles and connected in a mesh shape over the plurality of ceramic particles. Good. In the present ceramic bonded body, since the bonding portion includes a mesh portion in the specific region, the adhesion between the ceramic member (at least one of the first ceramic member and the second ceramic member) and the bonding portion is further improved. As a result, the strength of the joint in the direction substantially perpendicular to the first direction is higher than in a configuration in which the joint does not include the mesh portion. Further, the residual stress caused by the difference in thermal expansion between the ceramic member (the first ceramic member and the second ceramic member) and the joint is reduced. As a result, according to the present ceramic joined body, it is possible to suppress a decrease in joining strength due to a difference in thermal expansion.

(3) In the ceramic joined body, the first ceramic member includes a heater electrode, and the second ceramic member does not include a heater electrode. The density of the specific ceramic particles near the boundary with the second ceramic member may be higher than the density of the specific ceramic particles near the boundary between the second ceramic member and the joint. According to the present ceramic joined body, it is possible to suppress a decrease in joining strength due to a difference in thermal expansion on the side of the first ceramic member having a large amount of thermal expansion due to heat generated by the heater.

  The technology disclosed in the present specification can be realized in various forms, for example, a holding device such as an electrostatic chuck, a vacuum chuck, a heating device such as a susceptor, and a semiconductor manufacturing device such as a shower head. The present invention can be realized in the form of a component, a ceramic joined body in which a first ceramic member and a second ceramic member are joined by a joint, a method of manufacturing the same, and the like.

FIG. 1 is a perspective view schematically illustrating an external configuration of a heating device 100 according to an embodiment. It is explanatory drawing which shows the XZ sectional structure of the heating apparatus 100 in embodiment schematically. It is a schematic diagram which shows the XZ sectional structure of the peripheral part of the joining part 30 of the heating device 100 in embodiment. It is a schematic diagram which shows the XY cross-sectional structure of the peripheral part of the joining part 30 of the heating device 100 in embodiment. FIG. 5 is an enlarged schematic diagram illustrating an XY cross-sectional configuration of a portion X1 in FIG. 4. FIG. 6 is an explanatory diagram showing a measurement result regarding the roundness of each ceramic particle 11 in FIG. 5.

A. This embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically illustrating an external configuration of a heating device 100 according to the present embodiment, and FIG. 2 is an explanatory diagram schematically illustrating an XZ cross-sectional configuration of the heating device 100 according to the present embodiment. Each drawing shows XYZ axes orthogonal to each other for specifying the direction. In the present specification, for convenience, the positive direction of the Z axis is referred to as an upward direction, and the negative direction of the Z axis is referred to as a downward direction. However, the heating device 100 is actually installed in a direction different from such a direction. You may.

  The heating device 100 is a device that heats an object (for example, a semiconductor wafer W) to a predetermined processing temperature (for example, about 400 to 650 ° C.) while holding it, and is also called a susceptor. The heating device 100 is used as a part of a semiconductor manufacturing device such as a film forming device (such as a CVD film forming device or a sputtering film forming device) or an etching device (such as a plasma etching device).

  As shown in FIGS. 1 and 2, the heating device 100 includes a holder 10 and a columnar support 20.

(Holder 10)
The holding body 10 is a substantially disk-shaped member having a holding surface S1 and a back surface S2 that are substantially perpendicular to a predetermined direction (the vertical direction in the present embodiment). The holding body 10 is formed of, for example, ceramics containing AlN (aluminum nitride) as a main component. Here, the main component means a component having the largest content ratio (weight ratio). The diameter of the holding body 10 is, for example, about 100 mm or more and about 500 mm or less, and the thickness (length in the vertical direction) of the holding body 10 is, for example, about 3 mm or more and about 20 mm or less.

  As shown in FIG. 2, a heater electrode 50 configured by a resistance heating element that heats the holder 10 is disposed inside the holder 10. The heater electrode 50 is formed of, for example, a conductive material such as tungsten or molybdenum. The pair of ends of the heater electrode 50 are arranged on the peripheral side of the holder 10. Further, inside the holding body 10, a pair of peripheral side via conductors 51, a pair of conductive paths 53, and a via group 52 are provided. Each peripheral-side via conductor 51 is a linear conductor extending in the vertical direction, and is located on the peripheral side of the holder 10. The upper end of each peripheral via conductor 51 is connected to each end of the heater electrode 50. Each conductive path 53 is a linear conductor extending in the radial direction of the holder 10, and the lower end of each peripheral side via conductor 51 is connected to the radially outer end of each conductive path 53. The via group 52 includes a plurality of (two in the present embodiment) vias 52A which are linear conductors extending in the vertical direction. The upper end of each via 52A is connected to the radially inner end of each conductive path 53. A pair of recesses 12 are formed near the center of the back surface S2 of the holder 10, and a power receiving electrode (electrode pad) 54 is arranged in each recess 12. Each power receiving electrode 54 is arranged so as to be exposed on the back surface S <b> 2 of the holder 10, and the exposed portion of the power receiving electrode 54 is covered with a brazing portion 56. The lower end of each via 52A is connected to each power receiving electrode 54. Thus, the heater electrode 50 and each power receiving electrode 54 are electrically connected.

(Column support 20)
The columnar support 20 is a substantially columnar member extending in the predetermined direction (vertical direction). The columnar support body 20 is formed of, for example, a ceramic containing AlN as a main component, similarly to the holding body 10. The outer diameter of the columnar support 20 is, for example, about 30 mm or more and 90 mm or less, and the height (length in the vertical direction) of the columnar support 20 is, for example, about 100 mm or more and 300 mm or less.

(Joining part 30)
The holder 10 and the columnar support 20 are arranged such that the back surface S2 of the holder 10 and the upper surface S3 of the columnar support 20 face each other in the vertical direction. The columnar support 20 is joined to the vicinity of the center of the back surface S2 of the holder 10 via a joint 30 formed of a joint material described later.

  As shown in FIG. 2, a through-hole 22 that opens to the back surface S <b> 2 side of the holder 10 is formed in the columnar support 20. The through hole 22 is a hole having a substantially circular cross section that extends in substantially the same direction as the vertical direction and has a substantially constant inner diameter in the extending direction. A plurality of (two in the present embodiment) electrode terminals 70 are accommodated in the through holes 22. The upper end of each electrode terminal 70 is joined to the power receiving electrode 54 via a brazing portion 56 including a metal brazing material (for example, a gold brazing material). When a voltage is applied to the heater electrode 50 from a power supply (not shown) via each electrode terminal 70, each power receiving electrode 54, and the via group 52 (via 52A), the heater electrode 50 generates heat, and the heater electrode 50 generates heat on the holding surface S1 of the holding body 10. (For example, a semiconductor wafer W) held at a predetermined temperature (for example, about 400 to 650 ° C.).

A-2. Detailed configuration near the joint 30:
The joint 30 includes at least one of ceramics and glass as a main component, and is formed of a material having a coefficient of thermal expansion different from that of the material forming the support 10 and the columnar support 20. In addition, the calculation method of the thermal expansion coefficient of each forming material of the joint part 30, the holding body 10, and the columnar support body 20 is as follows.

Moreover, the heating device 100 satisfies the following condition 1.
Condition 1: A specific region exists in at least one specific cross section that is substantially perpendicular to the vertical direction (Z-axis direction) of the heating device 100.
The specific region includes a plurality of ceramic (crystal) particles (AlN particles in the present embodiment) forming the holding body 10 or the columnar support body 20, a material for forming the bonding portion 30 interposed between the ceramic particles, including. In the specific region, the ratio of the number of the specific ceramic particles having a roundness defined by the following equation (1) of 0.4 or more to the total number of the plurality of ceramic particles is 50% or more.
Roundness = Σri / (Rn) (1)
However,
ri: radius of the circle inscribed in the corner of each ceramic particle R: radius of the largest circle inscribed in each ceramic particle n: number of corners of each ceramic particle Σ: sum of the corners of each ceramic particle The cross section is located near at least one of the boundary between the holder 10 and the joint 30 and near the boundary between the columnar support 20 and the joint 30.

Further, it is preferable that heating device 100 satisfies the following condition 2.
Condition 2: In a specific region, the bonding portion 30 includes a mesh-like portion that surrounds the ceramic particles and is continuously connected in a mesh shape over a plurality of ceramic particles.

Further, it is preferable that heating device 100 satisfies the following condition 3:
Condition 3: The density of the specific ceramic particles near the boundary between the holding body 10 and the joint 30 is higher than the density of the specific ceramic particles near the boundary between the columnar support 20 and the joint 30.

  Note that the heating device 100 corresponds to a ceramic joined body in the claims, the holding body 10 corresponds to a first ceramic member in the claims, and the columnar support 20 corresponds to the first ceramic member in the claims. The vertical direction (Z-axis direction) corresponds to the first direction in the claims.

A-3. Manufacturing method of heating device 100:
The manufacturing method of the heating device 100 is, for example, as follows. First, the holder 10 and the columnar support 20 are manufactured.

The method of manufacturing the holder 10 is, for example, as follows. First, a mixture of 100 parts by weight of aluminum nitride powder, 1 part by weight of yttrium oxide (Y ₂ O ₃ ) powder, 20 parts by weight of an acrylic binder, and an appropriate amount of a dispersant and a plasticizer is added to an organic compound such as toluene. A solvent is added and mixed with a ball mill to prepare a green sheet slurry. The green sheet slurry is formed into a sheet by a casting device and then dried to produce a plurality of green sheets.

  A metallized paste is prepared by adding a conductive powder such as tungsten or molybdenum to a mixture of an organic solvent such as aluminum nitride powder, an acrylic binder, and terpineol and kneading the mixture. By printing this metallized paste using, for example, a screen printing device, an unsintered conductor layer that will later become the heater electrode 50, the power receiving electrode 54, and the like is formed on a specific green sheet. Further, the green sheet is printed in a state in which a via hole is provided in advance, thereby forming a non-sintered conductor portion to be a via group 52 (via 52A) later.

  Next, a plurality of these green sheets (for example, 20 sheets) are thermocompression-bonded, and if necessary, the outer periphery is cut to produce a green sheet laminate. The green sheet laminate is cut by machining to form a disc-shaped molded body, the molded body is degreased, and the degreased body is fired to produce a fired body. The surface of the fired body is polished. Through the above steps, the holder 10 is manufactured.

  The method of manufacturing the columnar support 20 is, for example, as follows. First, an organic solvent such as methanol is added to a mixture of 100 parts by weight of aluminum nitride powder, 1 part by weight of yttrium oxide powder, 3 parts by weight of a PVA binder, and an appropriate amount of a dispersant and a plasticizer. Mix to obtain a slurry. This slurry is granulated by a spray drier to prepare a raw material powder. Next, the raw material powder is filled in a rubber mold in which a core corresponding to the through hole 22 is arranged, and cold isostatic pressing is performed to obtain a molded body. The obtained molded body is degreased, and the degreased body is further fired. Through the above steps, the columnar support 20 is manufactured.

  Next, the support 10 and the columnar support 20 are joined. After performing a lapping process on the back surface S2 of the support 10 and the upper surface S3 of the columnar support 20, if necessary, at least one of the rear surface S2 of the support 10 and the upper surface S3 of the columnar support 20 is provided with a rare earth or organic material. After a solvent or the like is mixed and the paste made into a paste is uniformly applied, degreasing is performed. Next, the back surface S2 of the support 10 and the upper surface S3 of the columnar support 20 are overlapped with each other, and hot press firing is performed to join the support 10 and the columnar support 20 together. The joining portion 30 (joining agent) preferably contains, for example, a composite oxide of rare earth and Al.

  Here, the degree of roundness of the ceramic particles near the boundary between the holding body 10 and the joint 30 or near the boundary between the columnar support 20 and the joint 30 can be adjusted as follows. That is, at the time of joining the support 10 and the columnar support 20, the degree of roundness of the ceramic particles increases as the heating temperature of the joining portion 30 (joining agent) increases and as the heating time increases. . Therefore, by changing at least one of the heating temperature and the heating time at the time of joining, the degree of roundness of the ceramic particles can be adjusted. Note that the heating temperature is preferably 1650 ° C. or higher, preferably 1800 ° C. or lower, and the heating time is preferably 10 minutes or longer, and more preferably 90 minutes or shorter.

  After joining the support 10 and the columnar support 20, each electrode terminal 70 is inserted into each through-hole 22, and the upper end of each electrode terminal 70 is brazed to each power receiving electrode 54 using, for example, a gold brazing material. Thus, the brazing portion 56 was formed. By the above manufacturing method, the heating device 100 having the above-described configuration is manufactured.

A-4. Effects of this embodiment:
For example, in the XZ cross section substantially parallel to the up-down direction (Z-axis direction) of the heating device 100, when the ceramic particles forming the holder 10 and the columnar support 20 and the material forming the bonding portion are in contact with each other, the adhesion becomes higher. The bonding strength between the ceramic particles of the holder 10 or the columnar support 20 and the material for forming the bonding portion 30 increases. However, this alone may not ensure sufficient bonding strength between the ceramic particles and the material for forming the bonding portion 30. Even if the joining strength in the direction substantially parallel to the vertical direction between the ceramic particles and the forming material of the joint 30 is improved, the joining strength in the XY plane direction substantially perpendicular to the vertical direction of the ceramic particles and the forming material of the joint 30 is improved. May not be sufficiently secured. Heretofore, no consideration has been given to the adhesion between the ceramic particles and the forming material of the joint in the XY plane direction.

  On the other hand, as described above, according to the heating device 100 of the present embodiment, the specific region exists in at least one specific cross section that is substantially perpendicular to the vertical direction (Z-axis direction). The specific region includes a plurality of ceramic particles forming the support 10 or the columnar support 20 and a material for forming the joint 30 interposed between the ceramic particles. In the specific region, the ratio of the number of specific ceramic particles having a roundness of 0.4 or more is 50% or more (condition 1 above). Thereby, the adhesion between the ceramic member (at least one of the holding body 10 and the columnar support body 20) and the bonding portion 30 is improved as compared with a configuration in which the specific region does not exist in any cross section substantially perpendicular to the vertical direction. And the strength in the direction substantially perpendicular to the up-down direction of the joint portion 30 can be improved.

  Further, in the present embodiment, in the specific region, the bonding portion 30 includes a mesh-shaped portion that surrounds the ceramic particles (for example, one by one) and is continuously connected in a mesh shape over a plurality of ceramic particles. It is preferable (condition 2 above). In the specific region, since the joining portion 30 includes a mesh portion, the adhesion between the ceramic member (the holding member 10 and the columnar support 20) and the joining portion 30 is further improved, and the joining portion 30 is formed in the mesh portion. The strength in the direction substantially perpendicular to the up-down direction (Z-axis direction) of the joint portion 30 is higher than that of the configuration not including. Further, the residual stress caused by the difference in thermal expansion between the ceramic member (the holding body 10 and the columnar support body 20) and the joint 30 is reduced. Thus, according to the present embodiment, it is possible to suppress a decrease in bonding strength due to a difference in thermal expansion.

  Further, in the present embodiment, the holder 10 includes the heater electrode 50, and the columnar support 20 does not include the heater electrode 50. In the heating device 100, the density of the specific ceramic particles near the boundary between the holding body 10 and the joint 30 is preferably higher than the density of the specific ceramic particles near the boundary between the columnar support 20 and the joint 30 ( Condition 3) above. Thus, according to the present embodiment, it is possible to suppress a decrease in bonding strength due to a difference in thermal expansion on the side of the holder 10 having a large amount of thermal expansion due to heat generated by the heater electrode 50.

  Hereinafter, a method of calculating the roundness will be specifically described. FIG. 3 is a schematic diagram illustrating an XZ cross-sectional configuration of a peripheral portion of the bonding portion 30 of the heating device 100 according to the present embodiment. FIG. 4 is a schematic diagram illustrating an XY cross-sectional configuration of a peripheral portion of the bonding unit 30 of the heating device 100 according to the present embodiment, and FIG. 5 is a schematic diagram illustrating an enlarged XY cross-sectional configuration of an X1 portion in FIG. is there. FIG. 6 is an explanatory diagram showing a measurement result regarding the roundness of each ceramic particle 11 in FIG.

  The specific cross section under the condition 1 can be obtained, for example, by the following method. As shown in FIG. 3, the heating unit 100 passes through the center of a predetermined direction (for example, the X direction) substantially perpendicular to the vertical direction (the Z-axis direction) of the bonding portion 30, and The cross section obtained by cutting along the slightly inclined plane L is referred to as a specific cross section. In the specific cross section, at least at the center in the predetermined direction, a plurality of ceramic particles 11 forming the holding body 10 or the columnar support body 20 and a material 31 for forming the bonding portion 30 interposed between the ceramic particles 11 are formed. There is a region where coexists. FIG. 4 shows a central portion of a specific cross section of the heating device 100.

  The presence or absence of the above-described specific region in the specific cross section is determined by setting the region including 10 or more ceramic particles in the specific cross section as the target region, and if the target region satisfies the above condition 1, the target region Is determined to be a specific area. For example, for each ceramic particle 11 included in the target area (X1 portion) shown in FIG. 5, it is determined whether or not the ceramic particle 11 is the specific ceramic particle described above. However, the determination as to whether or not the ceramic particles are the specific ceramic particles is made based on the ceramic particles 11 (numbered in FIG. 5) which are entirely included in the target region among the ceramic particles 11 included in the target region. The ceramic particles 11 (parts without numbers in FIG. 5) which are partially missing are excluded.

  FIG. 6 shows the measurement results of the respective radii and the calculation results of the roundness of the 18 ceramic particles included in the target region (X1 portion). For example, the number (n) of the corners of the first ceramic particles 11 (the ceramic particles indicated by “1” in FIG. 5) is five. The radius r1 of the circle m1 inscribed in the first corner is 2.9 μm, the radius r2 of the circle m2 inscribed in the second corner is 3.6 μm, and the third corner The radius r3 of the circle m3 inscribed in the circle is 3.6 μm, the radius r4 of the circle m4 inscribed in the fourth corner is 2.0 μm, and the radius m3 of the circle m5 inscribed in the fifth corner is The radius r5 was 2.3 μm. The radius R of the largest circle M inscribed in the first ceramic particles 11 was 9.6 μm. In this case, since the roundness A of the first ceramic particles 11 is 0.30, the first ceramic particles 11 do not correspond to the specific ceramic particles. Similarly, as a result of calculating the roundness A for each of the second ceramic particle 11 to the eighteenth ceramic particle 11, all of the second ceramic particle 11 to the eighteenth ceramic particle 11 correspond to the specific ceramic particle. did.

  As described above, the specific ceramic particles having a high degree of circularity A have a high degree of roundness, so that the specific ceramic particles and the forming material 31 of the bonding portion 30 are in contact with each other without any gap, and the contact area increases. Therefore, the adhesion to each other increases. When a specific region including a large number of specific ceramic particles is present in a specific cross section (XY plane) substantially perpendicular to the vertical direction (Z-axis direction) of the heating device 100, the strength in a direction substantially perpendicular to the vertical direction of the bonding portion 30 is present. Is improved. Further, as shown in FIGS. 4 and 5, the forming material 31 of the bonding portion 30 is continuously connected in a mesh shape over the plurality of ceramic particles 11 while surrounding the ceramic particles 11 one by one. For this reason, it becomes difficult for each ceramic particle 11 to come off from the forming material 31 of the joint part 30, and the strength in the direction substantially perpendicular to the up-down direction of the joint part 30 is further improved, and the joint strength due to the difference in thermal expansion. Reduction can be suppressed.

B. Modification:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof. For example, the following modifications are also possible.

Further, the material for forming each member constituting the heating device 100 in the above embodiment is merely an example, and each member may be formed of another material. For example, in the heating device 100 in the above embodiment, the main component (ceramic particles) of the holder 10 and the columnar support 20 is AlN, but other ceramics such as Al ₂ O ₃ (alumina) are used. You may. Further, the main component of the holder 10 and the main component of the columnar support 20 may be different materials. The joint 30 is not limited to the one containing the rare earth and the complex oxide of Al. In other words, the joint 30 contains not the resin but at least one of the ceramics and the glass as a main component, and has a coefficient of thermal expansion of the holder 10 and the columnar shape. The support 20 may be formed of a material different from the thermal expansion coefficient of at least one of the forming materials. Whether or not the coefficient of thermal expansion of the joint 30 is different from the coefficients of thermal expansion of the holder 10 and the columnar support 20 can be determined, for example, by performing the following steps (a) to (c). .
(A) SEM observation of the cross section of the joint 30, EPMA (Electron Probe Micro Analyzer), and micro X-ray crystal structure analysis (XRD) are performed, and the identification and composition ratio of the compound constituting the joint 30 are examined.
(B) Check the coefficient of thermal expansion of the compound constituting the bonding portion 30 by literature or the like (if the document or the like does not understand, prepare a sample and measure the coefficient of thermal expansion of the sample)
(C) The obtained coefficient of thermal expansion of the joint 30 is compared with the coefficients of thermal expansion of the holder 10 and the columnar support 20.

  Further, in the above embodiment, the heating device 100 may have a configuration that does not satisfy at least one of the above conditions 2 and 3.

  Further, the configuration of the heating device 100 in the above embodiment is merely an example, and can be variously modified. For example, in the above embodiment, the outer shape of the holding body 10 and the columnar support body 20 as viewed in the Z-axis direction is substantially circular, but may be other shapes. Further, the electrode terminals accommodated in the through holes 22 formed in the columnar support body 20 are not limited to the terminals electrically connected to the heater electrode 50, but may be, for example, a radio frequency (RF) electrode for generating plasma. Or a terminal electrically connected to a suction electrode for electrostatic suction. Further, in the above-described embodiment, the power receiving electrode 54 is arranged in the concave portion 12 formed on the back surface S2 of the holding body 10, but may be arranged on the back surface S2 of the holding body 10. In short, the power receiving electrode only needs to be arranged on the second surface side of the holder.

  In the above embodiment, the via group 52 may include one via 52A, or may include three or more vias 52A.

  The method of manufacturing the heating device 100 in the above embodiment is merely an example, and can be variously modified.

  The present invention is not limited to a heating device, but is also applicable to a holding device such as an electrostatic chuck and a vacuum chuck, a heating device such as a susceptor, and a method of manufacturing a component for a semiconductor manufacturing device such as a shower head. In short, the present invention is applicable to a ceramic joined body in which a first ceramic member and a second ceramic member are joined by a joint.

Reference Signs List 10: Holder 11: Ceramic particles 12: Recess 20: Columnar support 22: Through hole 30: Joint 31: Forming material 50: Heater electrode 51: Peripheral side via conductor 52: Via group 52A: Via 53: Conductive path 54 : Receiving electrode 56: brazing portion 70: electrode terminal 100: heating device L: flat surface M: maximum circle R: radius S1: holding surface S2: back surface S3: top surface W: semiconductor wafer m1 to m5: circle r1 to r5: radius

Claims (3)

A first ceramic member,
A second ceramic member,
The first ceramic member is disposed between the first ceramic member and the second ceramic member in a first direction, and the first ceramic member and the second ceramic member are joined to each other, and at least one of ceramic and glass is provided. And a joining portion formed of a material having a coefficient of thermal expansion different from that of at least one of the first ceramic member and the second ceramic member.
In the ceramic joined body having
In at least one specific cross section substantially perpendicular to the first direction,
A specific region including a plurality of ceramic particles forming the first ceramic member or the second ceramic member, and a material for forming the bonding portion interposed between the ceramic particles; There is a specific region in which the ratio of the number of specific ceramic particles having a roundness defined by the following equation (1) of 0.4 or more to the total number of ceramic particles is 50% or more.
A ceramic joined body characterized in that:
Roundness = Σri / (Rn) (1)
However,
ri: radius of a circle inscribed in the corner of the ceramic particle R: radius of the largest circle inscribed in the ceramic particle n: number of corners of the ceramic particle Σ: sum of the corner of the ceramic particle The ceramic joined body according to claim 1,
In the specific region, the joining portion includes a mesh-shaped portion surrounding the ceramic particles and continuously connected in a mesh shape over the plurality of ceramic particles,
A ceramic joined body characterized in that: The ceramic joined body according to claim 1 or 2,
The first ceramic member includes a heater electrode, and the second ceramic member does not include a heater electrode.
The density of the specific ceramic particles near the boundary between the first ceramic member and the joint is higher than the density of the specific ceramic particles near the boundary between the second ceramic member and the joint,
A ceramic joined body characterized in that:

Images