JP2020021784A - Led and manufacturing method - Google Patents

Abstract

To provide an LED having a small size similar to a chip LED and a manufacturing method of the same.SOLUTION: A method of manufacturing an LED is includes steps of: molding a package comprising a frame by a resin of a thermal hardening property with a transfer mold to a metal lead frame, assembling an LED chip to the package, implanting a liquid resin of the other thermal hardening property to the package in which the LED chip is assembled to seal with the resin, and dividing them into an individual LED by a die. The package can arrange a plurality of LED chips in one array to one direction extending the lead frame, and the one array is surrounded with the one frame, and has one or more array surrounded with the frame to a direction orthogonal to one direction. The one frame is formed on the side corresponding to a side opposite to te one of the LED of a rectangle shape to be manufactured, and is not formed on the side corresponding to the other opposite side orthogonal to the side opposite to the one.SELECTED DRAWING: Figure 2

Description

  The present invention relates to light emitting diodes (LEDs). In particular, the present invention relates to a surface-mounted LED in which an LED chip is assembled in a package having a resin frame formed on a lead frame by transfer molding, and a liquid resin is injected and resin-sealed, and a method of manufacturing the same.

  Chip LEDs are LEDs that are excellent in productivity and can be manufactured at low cost. Chip LEDs have been proposed by Stanley Electric Co., Ltd. (Patent Document 1) and have become one of the mainstream methods of LED production.

  This is a manufacturing method in which a large number of LED chips are die-bonded and wire-bonded in a large number of rows on a crow epoxy substrate, a large number of the LED chips are collectively resin-sealed simultaneously by transfer molding, and divided into individual LEDs by dicing. This method has hitherto been the most efficient method for mass production and can be produced at low cost.

  At present, for example, a method proposed by Hitachi Chemical Co., Ltd., in which a resin frame is formed on a metal lead frame by transfer molding and an LED is assembled therein (Patent Literature 2) has attracted attention as the most efficient and inexpensive method. ing.

  The present invention is close to the latter.

  In addition, Patent Document 3 of Nichia Corporation is the same proposal as Patent Document 2.

JP-A-62-112333 JP 2006-140207 A JP 2006-156704 A

  The conventional methods proposed in Patent Literatures 2 and 3 form a resin frame around the four sides of an LED chip by transfer molding, assemble the LED chip therein, and seal with a sealing resin. is there.

  The package of the LED manufacturing method used in the conventional method proposed in Patent Documents 2 and 3 has a very simple structure in which a copper lead frame is silver-plated and transfer-molded with a thermosetting epoxy resin. Things. This structure is simpler than the structure of an LED using a conventional glass epoxy substrate, and is now the cheapest method for manufacturing an LED.

  However, each of the packages of the LED manufacturing method used in the conventional methods proposed in Patent Documents 2 and 3 has a structure in which four sides around which the LED chips are arranged are surrounded by a resin frame. .

  A perspective view showing one embodiment in which an LED element is mounted on an LED element mounting board using a package having such a structure is described in FIG. As described in this drawing, a concave portion serving as an LED element 100 mounting area is formed on the LED element mounting substrate 110. An LED in which a reflector 103 surrounding a concave portion is formed by transfer molding on a metal lead frame for forming a metal wiring 105 is manufactured by dicing. In the recess, the LED element 100 is bonded to the metal wiring 105 by the bonding wire 102, and the inner peripheral surface of the reflector 103 is made of a thermosetting resin composition for light reflection.

  As described above, the LED manufactured by the conventional method proposed in Patent Documents 2 and 3 has a structure in which the resin frame is formed by transfer molding around the four sides of the LED chip. It has not been easy to apply to very small size LEDs, which are only 2-3 times the size width.

  That is, the conventional methods proposed in Patent Literatures 2 and 3 have a problem when applied to a small-sized LED such as 1005 type, for example. The 1005 type has a length of 1.0 mm and a width of 0.5 mm, and there is almost no space for forming a resin frame horizontally.

  Due to such circumstances, chip LEDs using a glass epoxy substrate are mainly used as 1005 type LEDs at present.

  Since the chip LED is covered only with the sealing resin on both sides of the chip, a small size is possible.

  An object of the present invention is to propose an LED having a small size equivalent to a chip LED and a manufacturing method thereof.

[1]
A package including a frame made of a thermosetting resin is formed by transfer molding on a metal lead frame, an LED chip is assembled to the package, and another thermosetting liquid is added to the package in which the LED chip is assembled. A method of manufacturing an LED by injecting a resin, sealing the resin, dividing the LED into individual LEDs by dicing,
In the package, the plurality of LED chips can be arranged in a line in one direction in which the lead frame extends, and the line is surrounded by one frame, and the one line surrounded by the frame is moved in the one direction. A package having at least one in a direction orthogonal to
The one frame is formed on a side corresponding to one opposite side of the manufactured rectangular LED, and a side corresponding to another opposite side orthogonal to the one opposite side. An LED manufacturing method, wherein the LED is not formed.

[2]
The LED manufacturing method according to [1], wherein the side portions of the manufactured LEDs facing each other are formed by dicing the frame.

[3]
The LED manufacturing method according to [2], wherein other opposing sides of the manufactured LED are formed by dicing a sealing resin obtained by curing the liquid resin.

[4]
A portion formed by curing the thermosetting resin forming the frame, which is present in other opposing side portions formed by dicing the sealing resin, The rectangular shape that is orthogonal to the one of the mutually facing sides and the other of the mutually facing sides that are formed by curing the thermosetting resin that forms the frame. The LED manufacturing method according to [3], wherein a metal portion constituting the lead frame is exposed at a bottom portion of the LED.

[5]
Any one of [1] to [4], wherein the thermosetting resin forming the frame is opaque, and the other thermosetting liquid resin used for the resin sealing is translucent. LED manufacturing method.

[6]
A package including a frame made of a thermosetting resin is formed by transfer molding on a metal lead frame, an LED chip is assembled to the package, and another thermosetting liquid is added to the package in which the LED chip is assembled. A rectangular LED manufactured by injecting a resin, sealing the resin, and dividing the LED into individual LEDs by dicing,
One side of the six sides of the rectangular shape and one side portion orthogonal to the one side and orthogonal to the one side are formed of the light-impermeable resin,
A central portion of the side opposite to the one side, which is surrounded by the one side portion facing each other, is formed of the light-transmitting resin, and the one side portion facing each other. A portion that is continuous from the side portion that is formed of the light-transmitting resin that faces the one side of the other side portion that is opposed to each other and that is orthogonal to is formed of the light-transmitting resin. Forming an area through which light emitted by the LED is transmitted,
A portion of the other one of the opposite sides orthogonal to the one of the opposite sides, which is continuous from the one side formed of the opaque resin, is the opaque part. Formed from light-sensitive resin,
The other side portion orthogonal to the one side portion facing each other, the other side portion opposing each other, the light transmissive portion being continuous from the one side formed of the light transmissive resin. An LED in which a metal part constituting the lead frame is exposed on a portion formed of the resin and the one side.

[7]
The LED chip in the rectangular LED and the light-transmissive resin facing the one side of the other one of the opposite sides orthogonal to the one of the sides facing each other. A projection is formed between the side portion and the outer wall surface of the portion formed of the light-transmitting resin and blocking transmission of light emitted from the LED chip [6]. LED.

[8]
The LED of [6] or [7], wherein a die bonding area of the lead frame in which the LED chip is assembled is formed in a concave portion, and the LED chip is die-bonded to the concave portion.

  According to the present invention, it is possible to provide an LED having a small size equivalent to a chip LED and a method for manufacturing the same.

FIG. 4 is a perspective view showing an embodiment of a conventional example in which an LED element is mounted on an LED element mounting board. (A) A schematic plan view, partially omitted, showing an example of a package used in the manufacturing method of the present invention, and (b) a resin seal in the manufacturing method of the present invention, as viewed in a section XX in FIG. FIG. 4 is a schematic diagram illustrating a stopping step. FIG. 2 is a perspective view showing an example of the LED of the present invention. FIG. 4A is a schematic plan view partially illustrating another example of a package used in the manufacturing method of the present invention, and FIG. 4B is a sectional view taken along line ZZ of FIG. (A) A schematic plan view, partially omitted, showing still another example of a package used in the manufacturing method of the present invention, (b) YY cross section when an LED chip is assembled to the package of FIG. 5 (a) FIG. 5C is a cross-sectional view taken along the line YY in which a part of the LED chip is assembled to the package in another example of the embodiment of FIG. 5B.

  The method for manufacturing an LED of the present invention comprises the steps of: molding a package including a frame made of a thermosetting resin by transfer molding on a metal lead frame; assembling an LED chip in the package; and assembling the package in which the LED chip is assembled. Then, another thermosetting liquid resin is injected into the resin, the resin is sealed, and the LED is divided into individual LEDs by dicing to manufacture the LEDs.

  In the LED manufacturing method according to the aspect of the invention, in the package, a plurality of the LED chips can be arranged in a line in one direction in which the lead frame extends, and the line is surrounded by one frame, and is surrounded by the frame. And one or more rows in the direction orthogonal to the one direction.

  The package used in the LED manufacturing method of the present invention is a package in which a frame is not provided on one side of a rectangular LED to be manufactured, the side corresponding to one of the sides facing each other, and the side corresponding to the other side of the square LED is not provided. Only has a frame.

  For example, in the case where a rectangular parallelepiped LED as shown in FIG. 3 is manufactured, as shown in FIG. 2A, the resin to be manufactured is formed on the narrow side of the manufactured LED, that is, on the side b side of FIG. The frame 2 is not provided, and the resin frame 2 is provided only on the wide side of the LED, that is, on the side a. The resin frame 2 is formed on the lead frame 4 by transfer molding using an opaque resin.

  The dashed line 5 in FIG. 2A is a line that is finally divided into individual LEDs by a dicing line, and the portion indicated by the light black symbol 1 in FIG. 2A is an individual LED. Area.

  The package used in the LED manufacturing method of the present invention is a package in which a frame is not provided on one side of a rectangular LED to be manufactured, the side corresponding to one of the sides facing each other, and the side corresponding to the other side of the square LED is not provided. Is provided with a frame only in the. For example, as shown in FIG. 2A, there is no resin frame 2 on the side where the width of the LED to be manufactured is narrow, that is, on the side b side of FIG. 2A. Therefore, as shown in FIG. 2B, both sides of the LED chip 9 are covered with the sealing resin 3 only. The sealing resin 3 is a thermosetting translucent resin.

  This is equivalent to a chip LED in which both sides of the LED chip are covered only with the sealing resin. That is, according to the LED manufacturing method of this embodiment, an LED having a size as small as a chip LED can be realized.

  Hereinafter, embodiments and examples of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to these embodiments and examples, and technical aspects understood from the description of the claims. Various changes can be made within the range.

(Embodiment of LED manufacturing method)
An LED manufacturing method according to this embodiment will be described with reference to FIGS.

  The resin frame 2 is formed on the metal lead frame 4 by transfer molding using an opaque resin to prepare a package.

  The surface of the lead frame 4 on the predetermined direction side of the resin frame 2 (the upper surface in FIG. 2B) is set as the front side, and the die bonding electrode surface 6 and the wire bonding electrode are exposed here. The soldering electrode surface 7 is exposed on the back side of the lead frame 4 (the lower surface in FIG. 2B).

  FIG. 2A is for emphasizing the resin frame 2 and not shown here, but the resin around the lead frame 4 is formed simultaneously with the resin frame 2 as shown in FIG. The frame 2 is covered with a resin 8 of the same material.

  The LED chip 9 is die-bonded and wire-bonded to such a package. Thereafter, a sealing resin 3 made of a thermosetting translucent resin is injected into the resin frame 2 with a dispenser or the like.

  Thereafter, as shown in FIG. 2B, an extra sealing resin 3 is scraped along the resin frame 2 using a squeegee 10.

  After that, the sealing resin 3 is cured, diced, and divided into individual LEDs to obtain the LED of this embodiment. A dashed line 5 in FIG. 2A is a line that is finally divided into individual LEDs by a dicing line, and a portion indicated by a light black symbol 1 in FIG. It is. FIG. 3 shows a perspective view of an example of the LED manufactured in this manner.

(Embodiment of LED)
FIG. 3 shows an LED according to an embodiment of the present invention. The LED of this embodiment can be manufactured by the above-described embodiment of the LED manufacturing method of the present invention. A rectangular LED having the following structure illustrated in FIG. 3 is manufactured by dicing in a portion indicated by a light black code 1 in FIG. 2A.

  One of the six sides of the rectangular shape (the side constituting the bottom side in the LED shown in FIG. 3) and one of the sides orthogonal to the one side and opposed to each other form the resin frame 2. It is formed of a translucent resin.

  The side opposite to the side forming the bottom side of the LED shown in FIG. 3 (the side forming the upper side in the LED shown in FIG. 3) is made of the light-impermeable resin forming the resin frame 2. A central portion surrounded by the formed one side portion facing each other is formed of a translucent resin forming a sealing resin, and is a region through which light emitted by the LED chip 9 is transmitted. Is formed.

  The bottom of the other opposing side of the LED shown in FIG. 3 which is orthogonal to the one side opposing to each other and formed of the light-impermeable resin forming the resin frame 2 The part that is continuous from the side (the side that forms the upper side in the LED shown in FIG. 3) that faces the side that forms the side part is also made of a translucent resin that forms the sealing resin. It forms a region through which light emitted by the LED is transmitted.

  A bottom side of the other opposing side of the LED shown in FIG. 3 which is orthogonal to the one side opposing to each other and formed of the light-impermeable resin forming the resin frame 2. The portion that is continuous from the side constituting the side portion is formed of a light-impermeable resin forming the resin frame 2.

  The other side of the LED shown in FIG. 3, which is orthogonal to the side forming the bottom side and the one side opposite to each other, which is formed of a light-impermeable resin forming the resin frame 2. The metal parts 7 and 4-1 forming the lead frame 4 are exposed to the side parts facing each other and to the part continuing from the side forming the bottom side part in the LED shown in FIG. ing.

  In the embodiment illustrated in FIG. 3, the manufactured LED has a rectangular parallelepiped shape. Since this LED has the above-described structure, the thermosetting translucent resin 3 is exposed on three sides (three sides) of the rectangular parallelepiped, and the thermosetting non-translucent resin is exposed on six sides (six sides) of the rectangular solid. Are exposed, and the metal parts 7 and 4-1 constituting the lead frame 4 are exposed at least on three sides (three surfaces) of the rectangular parallelepiped.

  That is, the translucent resin 3 is exposed at a portion formed by the sealing resin 3 made of a thermosetting translucent resin. In addition, the thermosetting non-transparent resin is exposed in the resin frame 2 formed of the non-translucent resin and the resin 8 similarly formed of the non-transparent resin forming the resin frame 2. Further, a thin portion 4-1 of the lead frame formed by the metal lead frame 4 is exposed on a front side portion in FIG. 3 and a rear side portion (not shown) opposed thereto, and further, FIG. The electrode surface formed by the metal lead frame 4 shown in FIG. 3B is exposed on the bottom side in FIG. 3 (not shown).

  According to the LED manufacturing method and the LED of this embodiment described above, as shown in FIG. 2A, a small and inexpensive LED can be manufactured by using the resin frame 2 only on two sides of the LED.

  The conventional method proposed in Patent Literatures 2 and 3, which is not easy to apply to an LED having a very small size, because it has a structure in which four sides around which an LED chip is arranged is surrounded by a resin frame. As described in the above embodiment, the problem is, as shown in FIG. 2A, on the side corresponding to one of the sides facing each other among the six sides of the rectangular LED to be manufactured. Only the resin frame 2 is provided, and the resin frame 2 is not provided on the side orthogonal to the one side facing each other and corresponding to the other side facing each other. .

  In FIG. 3, the rectangular LED is used. In this case, for example, the resin frame 2 is not provided on the side “b” where the width of the rectangular LED is narrow, and the resin is only provided on the side “a” where the width is wide. By providing the frame 2, it is possible to manufacture an inexpensive and smaller-sized LED.

  The present invention is particularly effective for the manufacture of small white LEDs. A white LED is a white light emitting element in which a blue light emitting element is sealed with a resin containing a fluorescent substance, and a white color appears as a mixed color of blue light emission and fluorescent light excited by blue light.

  When an epoxy resin is used as the sealing resin, the epoxy resin is degraded by blue light, so that a silicone resin is generally used as the sealing resin.

  When manufacturing a white LED, it is necessary to adjust the wavelength of blue light emission and the amount of a phosphor, so that a method of making and using a tablet with a large amount of resin like a transfer mold is not suitable.

  Therefore, a silicone liquid resin is mainly used as the sealing resin. That is, the amount of the phosphor to be put into the liquid resin is adjusted and used each time according to the lot of the wavelength of the chip emitting blue light.

  Conventionally, when a liquid resin is used, it is generally used by injecting it into a package having a resin frame on four sides of the chip shown in FIG. However, if there are frames on four sides, space for the frames is required, and miniaturization is not easy.

  In the present invention, the resin frame 2 is provided only on the side corresponding to one of the sides facing each other among the six sides of the rectangular LED to be manufactured, and the resin frame 2 is orthogonal to the one side facing each other. By not providing the resin frame 2 on the side corresponding to the other side opposite to each other, an inexpensive and small white LED with high productivity can be realized.

  Of course, this method can be applied not only to white LEDs but also to various LEDs.

(Example)
(Preparation of package used for LED production)
The package used in the embodiment of the LED manufacturing method of the present invention is an LED package formed by transfer-molding a metal lead frame 4. In this package, a plurality of LED chips can be arranged in a line in one direction in which the lead frame 4 extends, as partially shown in FIG. The package is a package having one row surrounded by one resin frame 2 and having one or more such rows in a direction orthogonal to the one direction in which the lead frame 4 extends.

  A lead frame 4 is prepared by punching or etching a metal plate. The lead frame 4 is sandwiched by a mold (not shown), and a package is formed by transfer molding using a resin including the resin frame 2.

  FIG. 2A shows an example of the package thus formed. FIG. 2A is a schematic diagram, and although not shown, the lead frame 4 is an integral unit connected at the outer periphery.

  The material of the metal plate used for the lead frame 4 is generally a copper plate. Of course, an iron or aluminum plate may be used.

  In order to perform wire bonding, the surface of the metal plate needs to be plated with gold or silver. Usually, a copper plate plated with silver is used. When the metal plate is iron or aluminum, gold or silver plating is applied to copper or copper + nickel plating. This plating step may be performed before the transfer molding, or may be performed after the transfer molding.

  As the transfer mold resin, an opaque epoxy resin or silicone resin is used. The resin has a coefficient of thermal expansion matched to that of the lead frame 4 as much as possible in consideration of the adhesive strength with the lead frame. This can be adjusted by adding silica or the like as a filler in the resin.

  In Patent Documents 2 and 3 of the related art, as shown in FIG. 1, the package is provided with a concave portion in the resin corresponding to each chip on the side where the LED chip is arranged. That is, four sides are surrounded by the resin frame around the chip.

  The present invention has a structure in which the resin frame 2 is provided only on two sides of the LED as shown in FIG. That is, the resin frame 2 is provided only on the side a of the LED, and there is no resin frame on the side b.

  As a result, a small LED having a width of 0.5 mm or less can be easily manufactured. FIG. 3 shows an example of the appearance of a completed LED product.

(Assembly process)
The LED chip 9 is die-bonded to the package shown in FIG. 2A, and thereafter, wire bonding is performed. Die bonding is performed with silver paste or resin paste. There is a method called eutectic die bonding, but it is possible if the package has heat resistance. The wire bond uses a gold wire. Of course, aluminum wire and copper wire are also possible.

  After wire bonding, resin sealing is performed. A fixed amount of the sealing resin 3 made of a translucent resin is discharged into the resin frame 2 of the package by a dispenser.

  As the sealing resin 3, a translucent epoxy resin or silicone resin is used. The amount of the resin to be discharged is such that it rises from the inside of the resin frame 2, and as shown in FIG. 2B, excess resin is scraped out while being applied to the resin frame 2 using a squeegee 10 in the figure. Thereby, resin sealing can be performed with the same resin thickness as the height of the resin frame 2.

  Further, if necessary, the sealing resin 3 is defoamed. Thereafter, the resin is cured.

  In the schematic diagram in which a part of FIG. 2A is omitted, there are three rows of resin frames 2 in the vertical direction of FIG. 2A, and only five chips are arranged in one frame. The number of rows is 20 to 100, and the number of chips close to or more than 100 is arranged in one frame.

  It is cut along the alternate long and short dash line 5 in FIG. 2A and divided into individual LEDs.

  The size of each LED is the size indicated by reference numeral 1 in light black color shown in FIG.

  Cutting is performed by dicing. Assuming that the blade width of dicing is 0.1 mm, in the 1005 size, the long side has a pitch of 1.1 mm and the short side has a pitch of 0.6 mm. It is 11 cm for 100 rows on the long side and 12 cm for 200 pieces on the short side. That is, 20,000 LEDs can be assembled in a package of only 11 cm × 12 cm.

  The package is a simple and inexpensive structure formed by molding an epoxy resin on a copper plate, and the assembly is a small and very efficient method of mass production. This has made it possible to mass-produce even cheaper LEDs than before.

(LED Manufacturing Method / Example 1 of LED)
When a blue light emitting chip is sealed with a resin containing a phosphor to produce a white light emitting LED, for example, the resin used for the package, that is, the resin forming the resin frame 2 is hardly deteriorated by blue light. A derivative epoxy resin is used.

  The use of a resin in which the resin forming the resin frame 2 is mixed with titanium oxide, alumina or the like that reflects visible light can improve the light extraction efficiency.

  Further, in order to adjust the thermal expansion coefficient to the material of the lead frame 4 as needed, silica is filled in the epoxy resin forming the resin frame 2.

  As the lead frame 4, for example, a copper plate that has been etched and then silver-plated on the entire surface is used.

  As shown in FIGS. 4 (a) and 4 (b), the copper plate is etched in the thickness direction of the copper plate in order to improve the adhesive strength with the resin 8 of the same material as that for forming the resin frame 2 by transfer molding. As shown in FIG. 4 (b), countermeasures such as enlarging the contact area between the resin 8 and the lead frame are taken.

  A portion of the lead frame having the original thickness of copper foil and having a thickness of 4 which is etched and thinned is denoted by a reference numeral 4-1. FIG. 4B shows a state in which the resin 8 of the transfer mold wraps around the thinned copper foil portion indicated by reference numeral 4-1.

  The portion indicated by reference numeral 2 in FIG. 4A is a resin frame. The portion indicated by reference numeral 2 and the portion indicated by reference numeral 8 are the same resin and are formed at the same time during transfer molding and are the same. In the accompanying drawings, the portion indicated by reference numeral 2 is indicated by a different number from reference numeral 8 in order to emphasize the resin frame.

  As shown in FIG. 2B, the LED chip 9 is die-bonded and wipe-bonded to this package, and the sealing resin 3 containing the phosphor is discharged into the resin frame 2 using a dispenser or the like.

  Using a squeegee 10, the excess resin that has been discharged a little more and that protrudes from the resin frame 2 is scraped out. Thus, resin sealing at the same height as the resin frame 2 is performed.

  After the resin is degassed and cured, the resin is diced and divided into individual LEDs.

  As the sealing resin, a silicone resin or an epoxy resin having resistance to short wavelength is used, and a phosphor or a filler such as silica is mixed with this resin as necessary.

  FIG. 3 shows an external view of an example of a completed LED manufactured in this manner.

(LED Manufacturing Method / Example 2 of LED)
In a package used for an LED having a wavelength of 470 nm or longer, which is not a short wavelength, it is not necessary to consider resin deterioration due to light. Therefore, a transfer mold resin for general semiconductors may be used instead of the triazine derivative epoxy resin.

  If light quantity is required, use a white resin in which a reflective material such as titanium oxide is added to the resin. When the light amount is not necessary, a black general transfer molding resin for IC sealing may be used.

  Further, an additive such as silica is mixed in the resin, and the coefficient of thermal expansion is adjusted to the material of the lead frame.

  Epoxy resin is used for resin sealing after die bonding and wire bonding of the chip. Of course, a silicone resin can be used, but if the chip does not emit blue light, an epoxy resin is more compatible with the package.

(Example 3 of LED manufacturing method and LED)
According to the LED manufacturing method and the LED of the present invention, there is a dicing portion of the light-impermeable resin frame formed in the package on one side (two sides) of the LED facing each other. There is no dicing portion of the resin frame on the other side (two sides) orthogonal to one side (two sides). The opposite side (two sides) orthogonal to one side (two sides) of the LED where the opaque resin frame is diced is present in the resin seal. It is a light-transmitting sealing resin that is injected into a package for hardening and hardened.

  Therefore, when the LED is turned on, the side where the dicing of the light-impermeable resin frame formed on the package does not exist, the light leaks sideways. When a plurality of LEDs are used side by side, this lateral leakage of light becomes a problem. That is, an LED that is not turned on is erroneously recognized as if it is turned on because of the lateral leakage of light from an adjacent LED.

  FIGS. 5A, 5B, and 5C show an example of an embodiment that provides this measure. One side (two sides) of the LED chip 9 in the rectangular LED and one of the opposing sides (the two sides) in which the dicing portion of the opaque resin frame that forms the area through which the light emitted by the LED is transmitted exists. ), The LED chip 9 is located between the opposing outer sides (two sides) of the light-transmitting sealing resin injected into the package for resin sealing and cured. This is an embodiment in which a projection that blocks transmission of light emitted from the light source is formed.

  As shown in FIG. 5B, the protrusions 11 or 14 which are protrusions in this embodiment are higher than the chip thickness of the LED chip 9 and lower than the resin frame 2. The protrusions 11 or 14 can prevent light in the lateral direction of the LED chip 9 and can emit light forward (upper side in (b) and (c) of FIG. 5).

  The shape of the protrusion may be a semicircle as shown by the protrusion 11 or a trapezoid as shown by the protrusion 14. The point is that there is no particular limitation on the shape of the projection, as long as it has a function of preventing lateral leakage of light and reflecting light forward.

  The width 12 of the protrusions 11 and 14 may be appropriately determined according to the width a of the short side of the LED and the chip size. The point is that the width 12 of the convex portion may be determined so as not to hinder die bonding of the chip.

  FIG. 5C shows that when the copper plate is etched to form the lead frame 4, a recess 13 is formed in the die bond area of the lead frame 4 where the LED chip 9 is assembled, and the LED chip 9 is inserted into the recess 13. It is die-bonded.

  In this case, it is possible to provide the same function without providing the above-mentioned protrusion 11 or protrusion 14.

  As shown in the example of FIG. 5C, it is also effective to combine the concave portion 13 with the convex portion 11 or the convex portion 14 as necessary.

  Subsequent assembly of the LED and resin encapsulation conform to the LED manufacturing method and the first and second embodiments of the LED.

1 Part that becomes individual LED after division by dicing (part of light black color)
2 Resin frame (opaque resin)
3 sealing resin (translucent resin)
4 Lead frame 4-1 Thin part of lead frame 5 Cut line (dicing line)
6 Die bond electrode surface (lead frame surface side)
7 Soldering electrode surface (back side of lead frame)
8 Resin (integral with the resin constituting the resin frame (opaque resin) 2 of the package)
9 LED chip 10 squeegee 11 hemispherical convex part 12 convex part width 13 concave part (die bond area) formed in lead frame
14 trapezoidal projections
a Short side of rectangular LED
b Long side of rectangular LED

Claims (8)

A package including a frame made of a thermosetting resin is formed by transfer molding on a metal lead frame, an LED chip is assembled to the package, and another thermosetting liquid is added to the package in which the LED chip is assembled. A method of manufacturing an LED by injecting a resin, sealing the resin, dividing the LED into individual LEDs by dicing,
In the package, the plurality of LED chips can be arranged in a line in one direction in which the lead frame extends, and the line is surrounded by one frame, and the one line surrounded by the frame is moved in the one direction. A package having at least one in a direction orthogonal to
The one frame is formed on a side corresponding to one opposite side of the manufactured rectangular LED, and a side corresponding to another opposite side orthogonal to the one opposite side. An LED manufacturing method, wherein the LED is not formed.   2. The LED manufacturing method according to claim 1, wherein the one side of the manufactured LED facing each other is formed by dicing the frame. 3.   3. The LED manufacturing method according to claim 2, wherein the other opposing sides of the manufactured LED are formed by dicing a sealing resin in which the liquid resin is cured.   A portion formed by curing the thermosetting resin forming the frame, which is present in other opposing side portions formed by dicing the sealing resin, The rectangular shape that is orthogonal to the one of the mutually facing sides and the other of the mutually facing sides that are formed by curing the thermosetting resin that forms the frame. The LED manufacturing method according to claim 3, wherein a metal portion forming the lead frame is exposed at a bottom portion of the LED.   The said thermosetting resin which forms the said frame is opaque, and the said other thermosetting liquid resin used for the said resin sealing is translucent. An LED manufacturing method according to claim 1. A package including a frame made of a thermosetting resin is formed by transfer molding on a metal lead frame, an LED chip is assembled to the package, and another thermosetting liquid is added to the package in which the LED chip is assembled. A rectangular LED manufactured by injecting a resin, sealing the resin, and dividing the LED into individual LEDs by dicing,
One side of the six sides of the rectangular shape and one side portion orthogonal to the one side and orthogonal to the one side are formed of the light-impermeable resin,
A central portion of the side opposite to the one side, which is surrounded by the one side portion facing each other, is formed of the light-transmitting resin, and the one side portion facing each other. A portion that is continuous from the side portion that is formed of the light-transmitting resin that faces the one side of the other side portion that is opposed to each other and that is orthogonal to is formed of the light-transmitting resin. Forming an area through which light emitted by the LED is transmitted,
A portion of the other one of the opposite sides orthogonal to the one of the opposite sides, which is continuous from the one side formed of the opaque resin, is the opaque part. Formed from light-sensitive resin,
The other side portion orthogonal to the one side portion facing each other, the other side portion opposing each other, the light transmissive portion being continuous from the one side formed of the light transmissive resin. An LED in which a metal part constituting the lead frame is exposed on a portion formed of the resin and the one side. The LED chip in the rectangular LED and the light-transmissive resin facing the one side of the other one of the opposite sides orthogonal to the one of the sides facing each other. 7. A protruding portion that blocks transmission of light emitted from the LED chip is formed between the side portion and the outer wall surface of a portion formed of the translucent resin and continuous with the side portion. The described LED.   The LED according to claim 6, wherein a die bonding area of the lead frame in which the LED chip is assembled is formed in a concave portion, and the LED chip is die-bonded to the concave portion.