JP2020019111A - ホイールマウント - Google Patents
ホイールマウント Download PDFInfo
- Publication number
- JP2020019111A JP2020019111A JP2018145817A JP2018145817A JP2020019111A JP 2020019111 A JP2020019111 A JP 2020019111A JP 2018145817 A JP2018145817 A JP 2018145817A JP 2018145817 A JP2018145817 A JP 2018145817A JP 2020019111 A JP2020019111 A JP 2020019111A
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- JP
- Japan
- Prior art keywords
- grinding
- wheel
- grinding water
- center
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/003—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Toilet Supplies (AREA)
- Mechanical Operated Clutches (AREA)
- Devices For Checking Fares Or Tickets At Control Points (AREA)
Abstract
Description
X軸移動機構では、X軸パルスモータがX軸ボールネジを回転させることにより、X軸移動テーブル11が、X軸ガイドレールに沿って、X軸方向に移動する。
Z軸移動機構16では、Z軸パルスモータ24がZ軸ボールネジ22を回転させることにより、Z軸移動テーブル20が、Z軸ガイドレール18に沿って、Z軸方向に移動する。
図4は、図3に示したホイールマウント34の、A−B線およびA−C線での断面を示す。マウント流路35は、図3および図4に示すように、スピンドル装着面34aに設けられた接続口51、ホイール装着面34bに設けられた第1の供給口53、第2の供給口55、第1の環状溝65および第2の環状溝67、および、ホイールマウント34の内部に設けられた第1の接続路57および第2の接続路59を含んでいる。
第1の環状溝65および第2の環状溝67は、ホイール装着面34bの中心を中心とするように、ホイール装着面34bに設けられている。第2の環状溝67の半径は、第1の環状溝65の半径よりも長い。
本実施形態では、第1の埋め栓61および第2の埋め栓63のいずれか一方が、研削装置2を用いた研削処理を実施する作業者によって、第1の接続路57あるいは第2の接続路59に設置される。
研削ホイール取付ネジ穴71は、ホイールマウント34に研削ホイール36のホイール基台38をネジ止めするために用いられる。ホイールマウント取付穴73は、スピンドル32にホイールマウント34をネジ止めするために用いられる。
2:研削装置、4:基台、6:支持柱、
8:チャックテーブル部、12:チャックテーブル、13:保持面、
16:Z軸移動機構、18:Z軸ガイドレール、20:Z軸移動テーブル、
22:Z軸ボールネジ、24:Z軸パルスモータ、
26:研削手段、28:支持構造、30:スピンドルハウジング、32:スピンドル、
33:スピンドル流路、
34:ホイールマウント、34a:スピンドル装着面、34b:ホイール装着面、
35:マウント流路、
36:研削ホイール、38:ホイール基台、40:研削砥石、
51:接続口、53:第1の供給口、55:第2の供給口、57:第1の接続路、
59:第2の接続路、61:第1の埋め栓、63:第2の埋め栓、65:第1の環状溝、67:第2の環状溝、71:研削ホイール取付ネジ穴、73:ホイールマウント取付穴
Claims (2)
- スピンドルの先端に装着されるスピンドル装着面と、該スピンドル装着面の反対面であり環状に配置された研削砥石を有する研削ホイールが装着されるホイール装着面と、を有するホイールマウントであって、
該スピンドル装着面の中心に形成され、該スピンドルの中心を貫通し研削水を通す供給路に接続される接続口と、
該ホイール装着面の中心を中心とし、第1の半径を有する円の円周上に配設される第1の供給口と、
該ホイール装着面の中心を中心とし、該第1の半径よりも大きい第2の半径を有する円の円周上に配設される第2の供給口と、
該接続口と該第1の供給口とを接続するように内部に形成される第1の接続路と、
該接続口と該第2の供給口とを接続するように内部に形成される第2の接続路と、
該第1の接続路を遮断するための第1の埋め栓と、
該第2の接続路を遮断するための第2の埋め栓と、を備え、
該第1の埋め栓もしくは該第2の埋め栓を用いて、研削水を通す接続路が、該第1の接続路と該第2の接続路との間で切り換えられる、ホイールマウント。 - 該ホイール装着面の中心を中心とする、該第1の供給口が配設される第1の環状溝と、
該ホイール装着面の中心を中心とする、該第2の供給口が配設される第2の環状溝と、
をさらに備える、請求項1記載のホイールマウン卜。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018145817A JP7100524B2 (ja) | 2018-08-02 | 2018-08-02 | ホイールマウント |
CN201910648587.XA CN110788686B (zh) | 2018-08-02 | 2019-07-18 | 轮安装座 |
KR1020190087082A KR102714432B1 (ko) | 2018-08-02 | 2019-07-18 | 휠 마운트 |
TW108127137A TWI811412B (zh) | 2018-08-02 | 2019-07-31 | 輪座 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018145817A JP7100524B2 (ja) | 2018-08-02 | 2018-08-02 | ホイールマウント |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020019111A true JP2020019111A (ja) | 2020-02-06 |
JP7100524B2 JP7100524B2 (ja) | 2022-07-13 |
Family
ID=69427397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018145817A Active JP7100524B2 (ja) | 2018-08-02 | 2018-08-02 | ホイールマウント |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7100524B2 (ja) |
KR (1) | KR102714432B1 (ja) |
CN (1) | CN110788686B (ja) |
TW (1) | TWI811412B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022177651A (ja) * | 2021-05-18 | 2022-12-01 | オムロン株式会社 | 画像認識装置、画像認識装置の方法、および画像認識装置プログラム |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2349615T3 (es) * | 2004-02-06 | 2011-01-07 | Mayekawa Mfg. Co., Ltd. | Dispositivo de transporte extensible y sistema de transporte de alimentos que presenta el mismo. |
EP3900876B1 (de) * | 2020-04-23 | 2024-05-01 | Siltronic AG | Verfahren zum schleifen einer halbleiterscheibe |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6434651A (en) * | 1987-07-29 | 1989-02-06 | Disco Abrasive Systems Ltd | Grinding stone device and grinding machine with said device |
JP2002217143A (ja) * | 2001-01-18 | 2002-08-02 | Fujitsu Ltd | 研磨方法及び研磨装置 |
JP2004025344A (ja) * | 2002-06-25 | 2004-01-29 | Mito Kogyo Kk | 回転カッタ |
JP2009279709A (ja) * | 2008-05-23 | 2009-12-03 | Asahi-Seiki Mfg Co Ltd | コイルばねの両端研削機 |
JP2011143495A (ja) * | 2010-01-13 | 2011-07-28 | Disco Abrasive Syst Ltd | 研削装置 |
EP3260236A2 (en) * | 2016-06-22 | 2017-12-27 | Biesse S.p.A. | Method and system for feeding a cooling fluid during machining of a workpiece by means of a cup grinding wheel, and cup grinding wheel used therein |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0326462U (ja) * | 1989-07-20 | 1991-03-18 | ||
JPH0516138U (ja) * | 1991-08-14 | 1993-03-02 | 三菱重工業株式会社 | 組立式cbn砥石 |
JPH07223152A (ja) | 1994-02-10 | 1995-08-22 | Disco Abrasive Syst Ltd | 平面研削盤 |
JP3289183B2 (ja) * | 1997-05-30 | 2002-06-04 | 株式会社亀井 | ダイヤモンドフルバック |
JP2000094342A (ja) * | 1998-09-25 | 2000-04-04 | Okamoto Machine Tool Works Ltd | カップホイ−ル型砥石およびそれを具備した平面研削装置 |
JP2010052076A (ja) * | 2008-08-27 | 2010-03-11 | Disco Abrasive Syst Ltd | 研削ホイール |
JP5284209B2 (ja) * | 2009-07-17 | 2013-09-11 | 本田技研工業株式会社 | 工具ホルダ |
JP6117030B2 (ja) * | 2013-07-08 | 2017-04-19 | Sumco Techxiv株式会社 | 飛散板、研削ホイール、および、研削装置 |
JP6335592B2 (ja) | 2014-04-02 | 2018-05-30 | 株式会社ディスコ | 研削方法 |
JP6707278B2 (ja) * | 2015-09-04 | 2020-06-10 | 株式会社ディスコ | 研削ホイール及び被加工物の研削方法 |
-
2018
- 2018-08-02 JP JP2018145817A patent/JP7100524B2/ja active Active
-
2019
- 2019-07-18 CN CN201910648587.XA patent/CN110788686B/zh active Active
- 2019-07-18 KR KR1020190087082A patent/KR102714432B1/ko active Active
- 2019-07-31 TW TW108127137A patent/TWI811412B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6434651A (en) * | 1987-07-29 | 1989-02-06 | Disco Abrasive Systems Ltd | Grinding stone device and grinding machine with said device |
JP2002217143A (ja) * | 2001-01-18 | 2002-08-02 | Fujitsu Ltd | 研磨方法及び研磨装置 |
JP2004025344A (ja) * | 2002-06-25 | 2004-01-29 | Mito Kogyo Kk | 回転カッタ |
JP2009279709A (ja) * | 2008-05-23 | 2009-12-03 | Asahi-Seiki Mfg Co Ltd | コイルばねの両端研削機 |
JP2011143495A (ja) * | 2010-01-13 | 2011-07-28 | Disco Abrasive Syst Ltd | 研削装置 |
EP3260236A2 (en) * | 2016-06-22 | 2017-12-27 | Biesse S.p.A. | Method and system for feeding a cooling fluid during machining of a workpiece by means of a cup grinding wheel, and cup grinding wheel used therein |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022177651A (ja) * | 2021-05-18 | 2022-12-01 | オムロン株式会社 | 画像認識装置、画像認識装置の方法、および画像認識装置プログラム |
Also Published As
Publication number | Publication date |
---|---|
KR20200015378A (ko) | 2020-02-12 |
TW202007473A (zh) | 2020-02-16 |
JP7100524B2 (ja) | 2022-07-13 |
CN110788686B (zh) | 2023-04-07 |
CN110788686A (zh) | 2020-02-14 |
KR102714432B1 (ko) | 2024-10-07 |
TWI811412B (zh) | 2023-08-11 |
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