JP2020004688A - Lighting fixture unit and vehicular lighting fixture and lighting fixture unit manufacturing method - Google Patents

Abstract

To provide a lighting fixture unit which has suppressed an influence of heat radiated from the lighting fixture unit on a lamp body, when the lighting fixture unit which has been made into a socket is used being mounted on the lamp body.SOLUTION: A lighting fixture unit 100 includes a light source part 20, and a socket part 10 on which the light source part 20 is mounted, and the lighting fixture unit is mounted on a lamp body 40. In the lighting fixture unit 100, a portion coming into contact with the lamp body 40 in the socket part 10 is formed from a material whose heat conductivity is lower compared to other portions.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a lamp unit, a vehicle lamp, and a method of manufacturing a lamp unit, and more particularly to a lamp unit and a vehicle lamp using a light emitting element as a light source.

  In recent years, vehicular lamps using light-emitting elements such as light-emitting diodes (LEDs) as light sources have become widespread. With the widespread use of such vehicular lamps, there is a demand to be able to replace only necessary parts during maintenance. In response to this demand, for example, as shown in Patent Document 1, a lamp unit (light source unit) in which a light source portion on which a light emitting element is mounted is socketed has been proposed.

  Specifically, the lamp unit includes a light source unit including a light emitting element and a printed wiring board on which the light emitting element is mounted, a socket unit for fixing the light source unit, and a heat radiating member such as a metal plate contacting the light source unit. And Since the light emitting efficiency of the light emitting element tends to decrease with an increase in the temperature of the light emitting element itself, a heat radiation member such as an aluminum plate is brought into contact with the light source unit to dissipate heat of the light emitting element and suppress a temperature rise. . In the vehicle lamp, the light source unit of the lamp unit is inserted from the outside of the lamp body into the lamp body, and the light emitting element of the light source portion is positioned at a predetermined position of the reflecting mirror to realize a desired light distribution. .

  And the housing part which forms the socket part of the lamp unit is formed of a heat conductive resin, and promotes heat radiation from the heat radiation member to the outside.

JP 2013-270661 A

  As described above, the lamp unit is mounted on the lamp body, and the mounting is performed in such a manner that the housing portion of the lamp unit abuts on and is fixed to the lamp body. Therefore, the heat from the light emitting element is transmitted to the lamp body via the heat conductive resin of the housing. Depending on the lighting frequency of the light emitting element or lighting for a long time, the heat transmitted to the lamp body also increases, and this heat may affect the lamp body depending on long-term use.

  In view of the above, the present invention has been made in consideration of the above-described conventional problems. In mounting the socketed lamp unit on the lamp body and using the lamp unit, the effect of heat radiated from the lamp unit on the lamp body is reduced. An object of the present invention is to provide a suppressed lamp unit, a vehicle lamp including the lamp unit, and a method of manufacturing the lamp unit.

  In order to solve the above problems, a lamp unit of the present invention includes a light source unit and a socket unit on which the light source unit is mounted, and is a lamp unit attached to a lamp body. The contacting part is characterized by being formed of a material having a lower thermal conductivity than other parts.

  As a result, since the portion in contact with the lamp body is formed of a material having a lower thermal conductivity than other portions, the lamp body of the heat radiated from the lamp unit when used in the lamp body is used. Can be suppressed.

  In one aspect of the present invention, the socket portion is formed of a resin, and a metal plate is embedded inside the resin.

  In one aspect of the present invention, the socket portion includes a flange portion, a light source holding portion provided on one surface of the flange portion, a mounting portion extending from the flange portion to surround the light source holding portion, A connector portion provided on the other surface of the flange portion, and a portion of the socket portion that comes into contact with the lamp body is the mounting portion.

  In one aspect of the present invention, among the resins, the first resin, which is the material forming the mounting portion, has a higher thermal conductivity than the second resin, which is a thermally conductive resin forming another portion of the socket portion. Low conductivity.

  Further, in one aspect of the present invention, the socket portion, when mounted on the lamp body, includes an airtight holding member located between one surface of the flange portion and the lamp body surface facing the surface. And the first resin is located between the metal plate and the airtight holding member.

  Further, in one aspect of the present invention, in a state where the socket portion is mounted on the lamp body, the first resin exceeds the lamp body in a direction from the one surface of the flange portion toward the lamp body. Extend.

  In one embodiment of the present invention, the first resin is polybutylene terephthalate (PBT).

  A vehicle lamp of the present invention includes the lamp unit according to any one of the above.

  Further, the method of manufacturing a lamp unit according to the present invention includes a mounting part outer shape preparing step of preparing a mounting part outer shape die for forming a mounting portion surrounding the light source holding portion in the socket portion, and an inner portion of the mounting portion outer shape die. A filling step of filling a first resin having a lower thermal conductivity than the second resin, which is a heat conductive resin, and a socket outer shape for preparing a socket outer shape mold for forming the outer shape of the socket portion It is characterized by comprising a preparation step and a mounting part filling step of filling the inside of the socket part outer mold with the second resin.

  In one embodiment of the present invention, the method further comprises a metal plate preparing step of arranging a metal plate inside the socket part outer mold, and in the socket part filling step, the metal plate is placed inside the socket part outer mold. After the arrangement, the second resin is filled.

  According to the present invention, in a socketed lamp unit, a lamp unit in which the influence of heat radiated from the lamp unit on the lamp body is suppressed when the lamp unit is mounted on a lamp body, and a vehicle lamp including the lamp unit In addition, a method for manufacturing the lamp unit can be provided.

FIG. 2 is a schematic perspective view showing a lamp unit 100 according to the first embodiment. FIG. 2 is a schematic perspective view showing the lamp unit 100 with the light source unit 20 removed in the first embodiment. FIG. 3 is a schematic side view showing the lamp unit 100 with the light source unit 20 of FIG. 2 removed. FIG. 4 is a schematic cross-sectional view taken along a line IV-IV in FIG. 2. FIG. 2 is a schematic top view illustrating a light source unit 20 according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing a mold in a first manufacturing step of the socket section 10 according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing a mold in a second manufacturing step of the socket section 10 according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a state where the lamp unit 100 according to the first embodiment is mounted on a lamp body 40. It is a schematic top view of the socket part 10 to which the other example of the light source part 12 applicable to 1st Embodiment was attached. It is a schematic top view which shows the other example of the light source part 12 board | substrate applicable to 1st Embodiment, The figure (a) is a figure which shows the example which made the periphery of LED23 a black sheet, and the figure (b) () Is a diagram showing an example in which the periphery of the LED 23 is sealed with a black sealing resin. It is a schematic diagram which shows the positional relationship of the soldering land 24b and the through-hole 18 in 1st Embodiment. It is a typical sectional view showing signs that terminal 17a of light source part 20 and soldering land 24b of a wiring pattern in a 1st embodiment were soldered. It is a schematic cross section showing the state where the conventional lamp unit was attached to the lamp body. It is a schematic top view which shows the conventional light source part. It is a schematic top view which shows the conventional light source part board | substrate, The figure (a) is a figure in which resin is not filled around LED23, The figure (b) is resin 28a is filled around LED23. FIG.

(1st Embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are denoted by the same reference numerals, and the repeated description will be omitted as appropriate. FIG. 1 is a schematic perspective view showing the lamp unit 100 in the present embodiment, FIG. 2 is a schematic perspective view showing the lamp unit 100 with the light source part removed, FIG. 3 is a schematic side view, and FIG. is there.

  As shown in FIG. 1, the lamp unit 100 has a socket section 10 and a light source section 20.

  The socket section 10 is a member for holding the light source section 20, radiating heat from the light source section 20, securing electrical connection to the light source section 20 from the outside, and attaching to the lamp body 40 described later. is there. As shown in FIG. 1, the socket section 10 includes a flange section 11, a connector section 12, a radiation fin 13, a light source holding section 14, and a mounting section 15.

  The flange portion 11 is a substantially disk-shaped portion, and a light source holding portion 14 and a mounting portion 15 are provided on a main surface, and a connector portion 12 and a radiation fin 13 are formed on a back surface. The main surface on which the light source holding portion 14 is formed is a surface that comes into contact with the lamp body 40 side when the light source holding portion 14 is attached to the lamp body 40, and the insertion of the light source portion 20 into the lamp body 40 is restricted by the flange portion 11. . Here, a substantially disk-shaped flange portion 11 is shown, but any other shape may be used as long as it is a flat plate shape, and a notch or a projection may be provided for positioning or the like.

  The connector portion 12 is provided on the back surface of the flange portion 11 and is a portion to which a wire harness (not shown) is connected from the outside. As shown in FIGS. 1 to 4, the connector portion 12 has a cylindrical shape with an inside diameter capable of accommodating the connector on the wire harness side, and although not shown, the terminal holding portion 17 and the terminal 17 a are exposed inside. ing. The connector section 12 extends in parallel with the axis A that is the mounting direction of the light source section 20. When the wire harness side connector is inserted into the connector section 12, the terminals 17a and the wire harness are electrically connected, and power and signals are supplied to the lamp unit 100 from outside.

  As shown in FIGS. 1 to 4, the heat radiation fins 13 are a plurality of columnar portions on the back surface of the flange portion 11 erected over substantially the entire region where the connector portion 12 is not formed. The plurality of radiation fins 13 include one extending in the direction of the axis A along the outer shell of the socket part 10 and one extending in parallel with the connector part 12 (not shown). A gap is provided between the adjacent heat radiation fins 13 to increase the surface area per volume of the heat radiation fins 13 to improve heat radiation. Further, the shape of the radiation fin 13 is a long plate shape, but is not limited to this shape, and may be various shapes such as a rod shape and a corrugated plate shape. Further, convection of air is likely to occur in the gaps provided between the radiation fins 13, and further improvement in heat radiation can be expected. The direction in which the radiating fins 13 extend may be not only the direction of the axis A but also other directions.

  The light source holding portion 14 is provided on a main surface, which is one surface of the flange portion 11, and is configured by exposing a light source portion mounting surface 30a of a metal plate 30, which will be described later. The terminal holder 17 and the terminal 17a are exposed from the light source holder 14 adjacent to the light source 20, and the terminal 17a and the light source 20 are electrically connected.

  The mounting portion 15 is a portion that comes into contact with the lamp body 40 when the lamp unit 100 is mounted on the lamp body 40. The mounting portion 15 extends from the main surface of the flange portion 11 so as to surround the light source holding portion 14, and has a front end portion formed as a side wall 15a separated by a plurality of cutouts. In other words, the light source holding unit 14 is positioned inside the cylinder that is the mounting unit 15. In addition, a plurality of locking portions 16 that engage with the lamp body 40 when mounted on the lamp body 40 are provided on the outer periphery of the mounting portion 15.

  The locking portion 16 is a protruding portion formed intermittently at the upper end of the outer periphery of the mounting portion 15. On the other hand, an insertion hole having a shape corresponding to the outer shape of the mounting portion 15 is formed in the lamp body 40. When the lamp unit 100 is inserted into the insertion hole and rotated, the locking portion 16 and the main surface of the flange portion 11 are formed. The lamp unit 100 is fixed with the lamp body 40 interposed therebetween.

  Therefore, as shown in FIG. 1, the center of the light source holding unit 14, the mounting unit 15 and the flange unit 11 coincide with each other, and the mounting unit 15 and the flange unit 11 are arranged so as to be concentric. The diameter of the mounting portion 15 may be such that the light source portion 20 can be accommodated therein, and the four corners of the light source portion 20 are preferably located on the outer periphery of the mounting portion 15 as shown in FIG. In the mounting portion 15, the height from the main surface of the flange portion 11 to the locking portion 16, that is, the height from the portion on which the light source portion 20 is mounted, is designed to be the insertion depth into the lamp body.

  The terminal holding portion 17 is a portion made of an insulating resin and holding a plurality of terminals 17a. The terminal 17 a is a rod-shaped member formed of a metal having good conductivity, and a plurality of terminals 17 a are integrated with an insulating resin of the terminal holding portion 17. As shown in FIGS. 1 and 2, one end of the terminal holder 17 and the terminal 17 a is exposed on the upper surface of the light source holder 14 adjacent to the light source 20. Although not shown, the terminal 17 a extends through the light source holding portion 14 and the flange portion 11 in a direction parallel to the axis A, and extends into the socket portion 10. The other end of the terminal 17a is exposed inside the connector section 12. As described above, when the wire harness is inserted into the connector section 12, it is electrically connected to the other end of the terminal 17a.

  The terminal 17a exposed on the upper surface of the light source holding portion 14 penetrates through two through holes 18 provided in the light source portion 20, and is electrically connected to the terminal 24a (see FIG. 6) by being directly soldered with the solder 18a. . Details of the soldering will be described later.

  As shown in FIGS. 2 and 4, a metal plate 30 serving as a heat radiating member is disposed on the upper surface 19 of the light source holding unit 14 formed continuously from the mounting unit 15. The metal plate 30 is formed integrally with the socket 10 so as to be exposed on the upper surface 19. Specifically, it is bent in advance along the housing that is the outer shell of the mounting portion 15, the flange portion 11, and the socket portion 10. Then, a metal plate 30 is disposed in a mold described later, and a first resin which is a general resin is used for the mounting portion 15 and the continuous light source holding portion 14, and a second resin which is a heat conductive resin is used for other portions. The socket portion 10 is formed by injection molding of a resin, and the metal plate 30 is fixed in the socket portion 10. That is, the metal plate 30 is embedded and fixed in the first resin or the second resin forming the housing along the inside of the mounting portion 15, the inside of the flange portion 11, and the inside of the radiation fin 13.

  The metal plate 30 is a member made of a metal having a higher heat conductivity than a heat conductive resin housing forming the outer shell of the socket portion 10. For example, an aluminum plate or a copper plate can be used. In order to improve heat radiation and reduce the weight of the lamp unit 100, an aluminum plate is preferable. In addition, the metal plate 30 is not limited to this shape, and may have a size of about the upper surface 19 of the light source holding portion 14 or a size up to the mounting portion 15, but is preferably shown in FIG. As described above, a heat radiation effect can be obtained by extending to the radiation fins.

  In a region of the metal plate 30 which is located near the upper surface 19 of the light source holder 14, the surface 30a is exposed from the upper surface 19. The light source unit 20 is mounted on the surface 30a of the metal plate 30. When the light source unit 20 is mounted, the back surface of the light source unit 20, which will be described later, comes into contact with the metal plate 30, and the heat generated by the light emission of the LED 23 is transferred to the socket unit 10 Is transmitted to a housing or the like that constitutes the outer shell. The metal plate 30 has a higher thermal conductivity than the second resin (thermally conductive resin) of the housing, and is provided from the vicinity of the upper surface of the light source holding portion 14 to the inside of the radiation fin 13. It is possible to improve the efficiency of heat radiation to the device.

The second resin constituting the housing corresponding to the flange portion 11, the connector portion 12, and the radiation fins 13 in the socket portion 10 is not limited as long as the material has good thermal conductivity. It is preferable to use When the carbon fiber is contained in the thermally conductive resin, it has high thermal conductivity and good conductivity, and when it contains a ceramic filler such as Al ₂ O ₃ , AlN and BN, it has high thermal conductivity. It is particularly preferable because it has excellent efficiency and good electrical insulation properties, and both are lightweight.

  On the other hand, the housing of the portion corresponding to the mounting portion 15 in the socket portion 10 is formed of a general resin instead of the heat conductive resin as described above.

  In the conventional lamp unit of FIG. 13, since the mounting portion 15 that is in contact with (contacts with) the lamp body 40 is also formed of a heat conductive resin, heat transmitted from the light source unit 20 to the metal plate 30 is radiated, The temperature of the contact portion of the lamp body 40 with the mounting portion 15 was likely to rise, and the temperature was likely to be high. In many cases, the lamp body 40 is formed of acrylonitrile / acrylic rubber / styrene copolymer resin (AAS), and since the heat resistance temperature of AAS is 90 ° C., heat is continuously radiated for a long time, such as long-time LED lighting. If so, the lamp body could be adversely affected.

  The mounting portion 15 in the present embodiment is formed of a first resin having a lower thermal conductivity than the second resin. This suppresses transmission of heat generated from the light source unit 20 from the mounting unit 15 to the lamp body 40. Examples of the first resin include polybutylene terephthalate (PBT) resin (a general resin having a thermal conductivity of about 0.2 to 0.3 W / m · K). Examples of the second resin include polyethylene terephthalate (PET) resin (a heat conductive resin having a heat conductivity of about 10 W / m · K). The first resin forming the mounting portion 15 is not limited to polybutylene terephthalate (PBT) resin but has a lower thermal conductivity than a thermally conductive resin and has a hardness enough to withstand rubbing when mounted on the lamp body 40. Should be fine.

  FIG. 5 is a schematic top view showing the light source unit 20 in the present embodiment. The light source unit 20 includes a light emitting element including a circuit board 21 and an LED 23. Here, an example in which the LED 23 is mounted on the circuit board 21 as the light emitting element in the present invention has been described, but only the LED package may be used as the light emitting element, or a bare chip LED may be used as the light emitting element. FIG. 5 shows an example in which four light emitting elements are arranged, but the number and arrangement may be any.

  A wiring pattern 24 and terminals 24 a are formed on the upper surface of the circuit board 21, and electronic components 25 and 26 are mounted on the wiring pattern 24. In the center of the terminal 24a, a through hole 18 is formed penetrating the circuit board 21. The material forming the circuit board 21 is not limited, and glass epoxy resin, alumina, or the like used for a normal printed wiring board can be used. The circuit board 21 is attached to the upper surface of the light source holder 14 by applying a thermally conductive grease or an adhesive to the back surface side.

  The LED 23 is a light emitting diode that emits light of a predetermined wavelength when a voltage is applied. The LED 23 emits white light when the lamp unit 100 is a headlight, and emits red light when the lamp unit 100 is a tail lamp or a stop lamp. It emits light. As the LED 23 that emits white light, an LED 23 that combines a bare chip that emits light with a wavelength of blue to ultraviolet light as primary light and a yellow phosphor, an LED that combines a bare chip of each color of RGB, or the like can be used. As the LED 23 that emits red light, an AlGaInP-based or GaAs-based LED can be used. Further, a part of the plurality of LEDs 23 may be used as a tail lamp, and the rest may be used as a stop lamp.

  The wiring pattern 24 is a circuit wiring formed by patterning a metal film formed on the circuit board 21, and has electronic components 25 and 26 mounted thereon to constitute a driving circuit of the LED 23. A part of the wiring pattern 24 is a terminal 24a, and the terminal 24a is connected to the terminal 17a and the solder 18a.

  The electronic components 25 and 26 are components that constitute a drive circuit for driving the LED 23, and include a resistor, a capacitor, an inductance, a transistor, an IC (Integrated Circuit), and the like. Since the material forming the circuit board 21 has a lower thermal conductivity and relatively lower heat dissipation than the material forming the socket portion 10, bare chip mounting or resistance printing is performed so that the solder is not melted by heat generated by the electronic components 25 and 26. It is preferable to implement it. When the electronic components 25 and 26 are solder-mounted on the circuit board 21, AuSn solder having a high melting point is preferable.

  In the lamp unit 100 of the present embodiment, when a wire harness is connected to the connector portion 12 and power is supplied from the outside, power is supplied from the terminals 17 a to the electronic components 25 and 26 via the terminals 24 a and the wiring pattern 24. The drive circuit operates. The output from the drive circuit is transmitted to the LED 23, and the LED 23 emits light.

  At this time, in the light source section 20, the electronic components 25 and 26 included in the drive circuit also generate heat, and the LED 23 also generates heat. In the lamp unit 100, heat from the light emitting element is transmitted to the radiating fin 13 via the mounting portion 15 and the flange portion 11 via the metal plate 30 located on the upper surface of the light source holding portion 14. The heat from the light emitting element is conducted toward the flange portion 11 by using the metal plate 30 directly below the mounting surface, rather than being transmitted to the other electronic components 25 and 26, and is transmitted through the flange portion 11 and the radiation fins 13. Heat is dissipated.

  Next, a method for manufacturing the socket 10 will be described. 6 and 7 are schematic cross-sectional views illustrating a method of forming the socket portion 10 using the dies 51 to 53. FIG. 6 is a schematic cross-sectional view showing a first manufacturing step of forming the mounting section 15 in the socket section 10. As described above, the socket portion 10 forms a housing using two types of resins (first resin and second resin). First, a portion corresponding to the mounting portion 15 is formed of the first resin having low thermal conductivity.

  As shown in FIG. 6, the molds 51 and 52 are arranged on the portion of the metal plate 30 on the light source unit mounting surface 30a and on the portion located inside the mounting unit 15 following the portion. That is, assuming that the light source holding portion 14 side of the axis A in FIG. 1 is upward, a portion extending in the vertical direction along the axis A of the metal plate 30 is inside the mounting portion 15, and the mold 51 is arranged in this portion. . Then, the mold 52 is arranged above the mold 51 (mounting part outer shape preparation step). The mold 51 has a cavity formed according to the shape of the mounting portion 15, and is arranged so that the metal plate comes to a predetermined position in the cavity.

  Next, the above-described first resin is injected and filled into the hollow portions inside the molds 51 and 52 (mounting part filling step), and the filled resin is cured by heat curing or the like (curing step).

  Next, as shown in FIG. 7, the flange portion 11, the connector portion 12, and the radiation fins 13 of the socket portion 10 are formed. The mold 53 is arranged below the mold 52 along the axis A (socket portion outer shape preparation step). The metal plate 30 is arranged so that the metal plate 30 comes to a predetermined position of the cavity in the mold 53. On the other hand, the upper mold 52 is removed because the mounting portion 15 has been formed.

  Then, the above-mentioned second resin is injected and filled into the internal cavity formed by the molds 51 and 53 (socket filling step), and is cured by thermosetting (curing step). After curing sufficiently, the molds 51 and 53 are removed. Then, the housing as shown in FIG. 2 is formed of two kinds of resins.

  Thus, the socket part 10 is formed of two kinds of resins. Since the mounting portion 15 is formed of the first resin having a lower thermal conductivity than other portions, heat generated from the light source portion 20 is transmitted to the metal plate 30, but heat radiation in the mounting portion 15 portion is not so much. It is not performed and moves to the flange portion 11 and the radiation fin 13. On the other hand, since the flange portion 11, the radiating fins 13 and the like are formed of the second resin having high thermal conductivity, heat is radiated positively. Therefore, the outer periphery of the mounting portion 15 of the socket portion 10 is less likely to generate heat than other portions.

  As shown in FIG. 8, when the socket portion 10 is mounted on the lamp body 40, the mounting portion 15 comes into contact with the lamp body 40. Since the outer periphery of the mounting portion 15 is less likely to be heated than other portions, the influence of the heat on the lamp body 40 can be reduced. It is desirable that at least a portion of the mounting portion 15 that contacts the lamp body 40 is formed of the first resin. It is desirable that the portion that contacts the insertion hole of the lamp body 40 and the locking portion 16 in FIG. 8 be formed of the first resin.

  In addition, when the socket portion 10 is attached to the lamp body 40, the first resin should be located below the contact portion (contact) with the lamp body 40 in the figure, that is, below the direction of the axis A. More desirable. Specifically, when the light source unit 20 is attached to the lamp body 40, the light source unit 20 side (upper direction in the axis A) is locked to the lamp body 40 by the locking unit 16, and the flange unit 11 side (lower direction in the axis A) is It is fixed by an airtight holding member 41 such as an O-ring. It is desirable that the first resin also extends to a location fixed by the airtight holding member 41, and in the present embodiment, extends to the flange portion 11. If the contact portion with the airtight holding member 41 is also formed of the first resin in this manner, heat is less likely to be transmitted to the airtight holding member 41 than is formed of the second resin. Degradation can be suppressed. Further, no heat is transmitted to the lamp body 40 via the airtight holding member 41.

  Further, the airtight holding member 41 is sandwiched between the lamp body 40 and the flange portion 11, and the boundary between the mounting portion 15 made of the first resin and the flange portion 11 made of the second resin is airtight. It is located inside the member 41. Thereby, it is possible to suppress the invasion of outside air or moisture into the lamp body 40 via the interface between the first resin and the second resin.

(Other)
(Another Example of Light Source Applicable to First Embodiment)
Next, another example of the light source unit for reducing the influence of the heat on the lamp body 40 will be described. FIG. 14 is a schematic top view showing a positional relationship between a conventional light source unit 20 and a mounting unit. The light source unit 20 is provided with a thermistor 27 that senses the LED temperature so that the LED temperature does not exceed the upper-limit use temperature. The driving current of the LED is controlled by the temperature derating circuit. As shown in FIG. 14, the conventional thermistor 27 is disposed beside the LED 23 to detect the temperature near the LED.

  However, it is more accurate to detect the temperature near the mounting portion of the lamp body 40 such as the mounting portion 15 of the socket portion 10 outside the light source unit 20 substrate, rather than the temperature near the LED 23, so that the influence of the temperature on the lamp body 40 is more accurate. And the effect of the temperature of the lamp body 40 can be suppressed, and the lighting control of the LED 23 can be efficiently performed.

  As shown in FIG. 9, in this example, the thermistor 27 in the light source unit 20 is arranged near the outer periphery of the substrate. In addition, when the light source unit 20 is mounted on the socket unit 10, it is preferable that the light source unit 20 be disposed at a position facing the locking unit 16.

  Thus, by arranging the thermistor 27 as close to the lamp body 40 as possible, it is possible to detect and control the heat near the lamp body 40 due to the heat generated by the LED 23. The temperature that affects the lamp body 40 is 100 ° C. or higher, while the upper limit operating temperature of the LED 23 is 150 ° C. Therefore, if the thermistor 27 is controlled in the vicinity of the LED 23 at the upper limit use temperature of the LED 23 of 150 ° C., a situation occurs in which the current control is not performed even though the temperature has already reached the lamp body 40. . On the other hand, when the thermistor 27 is installed near the lamp body 40, the temperature near the lamp body 40 can be more accurately detected, and the current can be controlled at an appropriate timing.

(Other Examples of Light Source Unit Substrates Applicable to First Embodiment)
FIG. 15A is a schematic diagram illustrating a substrate 21 of a conventional light source unit 20, and FIG. 15B is a schematic diagram illustrating a state in which the periphery of an LED 23 is filled with a white sealing resin.

  The conventional circuit board 21 was white, and the sealing resin 28a for sealing the wiring pattern 24 was also white. The light source unit 20 in the lamp unit 1 is required to have a point light source, while the light from the LED 23 is reflected by a white portion around the substrate 21 and does not become a fine point light source, but affects the cut line of the lamp. was there.

  FIG. 10A is a schematic diagram showing another example of the substrate 21 of the light source unit 20 applicable to the present embodiment, and FIG. 10B is a diagram in which the periphery of the LED 23 is filled with a black sealing resin. It is a schematic diagram which shows a state.

  In the substrate 21 of the present example, a black sheet is provided around the LED 23, or the LED 21 is sealed with a black sealing resin 28b to make the periphery of the LED 23 black. As described above, by making the periphery of the LED 23 black, reflection at the light emitting portion is less likely to occur, so that the light from the LED 23 becomes a fine point light source. Light having fine light distribution characteristics is emitted without blurring (reflecting) near the light source. Therefore, if the present invention is applied to a light source or the like that requires a high light distribution characteristic such as a headlight, a cut line in the lamp becomes clear and the light distribution characteristic is improved.

  Note that the surroundings of the LED 23 are not limited to black, but may be any dark color that does not easily cause reflection.

(Soldering of the first embodiment)
FIG. 11 is a schematic diagram illustrating a positional relationship between the soldering lands 24b and the through holes 18 according to the present embodiment. FIG. 12 is a schematic cross-sectional view showing a state where the terminal 17a of the light source unit 20 and the terminal 24a of the wiring pattern are soldered.

  As shown in FIGS. 2 and 5, the connection between the terminal 17a of the socket 10 and the terminal 24a of the light source 20 is made by passing the terminal 17a into a through hole 18 formed at the center of the terminal 24a. Soldering is performed so that the terminals 24a on the wiring pattern 24 side conduct. A soldering land is formed in advance on the terminal 24a on the wiring pattern 24 side, and the solder is applied so that the solder is placed on the soldering land.

  Here, conventionally, the through hole 18 through which the terminal 17a penetrates has an inside diameter substantially corresponding to the width of the terminal 17a, and the hole of the soldering land also has the same inside diameter as the through hole 18. Therefore, there was almost no gap between the terminal 17a and the hole of the soldering land. When the terminal 17a and the terminal 24a are soldered, the solder extends to the end of the through hole 18 or the inside of the through hole 18. With the operation of the light source unit 20, a thermal change occurs in the terminal 17a. Such a heat change occurs with the use of the light source unit 20, and depending on the frequency of use, cracks may occur in the solder. Depending on the movement of the solder, the soldering land may come off in some cases, for example, the solder may enter the through hole 18 due to cracks. Then, the printing material of the soldering land further drips into the through hole 18, and when the terminal 17 a penetrates into the through hole 18, the soldering land may come off further by contacting the printing material.

  As shown in FIG. 11, the soldering land 24b of the present embodiment has a hole corresponding to the through hole 18 at the center. The inner diameter of the hole corresponding to the through hole 18 is formed so as to be larger than the diameter of the through hole 18, and is formed so as to be outside by a distance h3 from the circumference of the through hole 18. In other words, the inner periphery of the soldering land 24b is separated from the end of the through hole 18 by h3. h3 is 0.1 mm or more, and preferably in the range of 0.1 mm or more and 0.3 mm or less.

  In addition, the width h1 of the soldering land 24b is set to 0.5 mm or more. In this way, by providing a certain width, an installation area with the solder is secured. 0.5 mm or more and 2.5 mm or less are preferable.

  As shown in FIG. 12, in the connection between the terminal 17a of the socket section 10 and the terminal 24a of the light source section 20, the solder 50 is provided so as to extend over the terminal 17a and the soldering land 24b. Here, since the soldering land 24b is separated from the end of the through hole 18 by h3, the solder is not applied to the end of the through hole 18. Therefore, it becomes difficult for the solder to enter the through hole 18. That is, a material having low affinity for solder is interposed between the end of the through hole 18 and the solder land by the width h3, so that the solder is less likely to move to the through hole 18 side. Then, even when a crack occurs in the solder due to a thermal change, the solder is less likely to move to the through hole 18 side, and as a result, the soldering land can be prevented from peeling.

  As shown in FIGS. 11 and 12, the outer periphery of the soldering land 24b is provided so as to overlap the overcoat layer made of a glass material by the width h2. h2 is preferably 0.025 mm or more. Thus, by disposing the overcoat layer on the end of the soldering land 24b so as to overlap by the width h2, the peeling of the soldering land on the outer peripheral side can be suppressed.

  The present invention is not limited to the above embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

REFERENCE SIGNS LIST 100 lamp unit 10 socket portion 11 flange portion 12 connector portion 13 radiating fin 14 light source holding portion 15 mounting portion 15a side wall 16 locking portion 17 terminal holding portions 17a, 24a terminal 18 penetrating Hole 18a Solder 19 Upper surface 20 of light source holder Light source 21 Circuit board 23 LED
24 wiring pattern 24b soldering lands 25 and 26 electronic components 27 thermistor 28a sealing resin (white)
28b ... sealing resin (black)
30 ... metal plate (radiation member)
40 ... lamp body 51 ... mold 52 ... mold (mounting part side)
53 Mold (socket side)

Claims (10)

A lamp unit including a light source section and a socket section for mounting the light source section, the lamp unit being attached to a lamp body,
A lamp unit, wherein a portion of the socket portion that contacts the lamp body is formed of a material having a lower thermal conductivity than other portions. The lamp unit according to claim 1,
The lamp unit, wherein the socket portion is formed of a resin, and a metal plate is embedded in the resin. The lamp unit according to claim 1 or 2,
The socket portion is provided on a flange portion, a light source holding portion provided on one surface of the flange portion, a mounting portion extending from the flange portion to surround the light source holding portion, and provided on the other surface of the flange portion. With a connector part,
The lamp unit, wherein a portion of the socket portion that comes into contact with the lamp body is the mounting portion. The lamp unit according to claim 2,
Among the resins, the first resin that is the material forming the mounting portion has a lower thermal conductivity than the second resin that is a heat conductive resin forming another portion of the socket portion. Lighting unit. The lamp unit according to claim 4,
The socket portion, when mounted on the lamp body, includes an airtight holding member located between one surface of the flange portion and the lamp body surface facing the surface.
The lamp unit, wherein the first resin is located between the metal plate and the airtight holding member. The lamp unit according to claim 5, wherein
In a state where the socket portion is mounted on the lamp body, the first resin extends beyond the lamp body in a direction from the one surface of the flange portion toward the lamp body. Lighting unit. The lamp unit according to any one of claims 4 to 6, wherein
The lamp unit, wherein the first resin is polybutylene terephthalate (PBT).   A vehicle lamp comprising the lamp unit according to any one of claims 1 to 7. A mounting part outer shape preparation step of preparing a mounting part outer shape die for forming a mounting part surrounding the light source holding part in the socket part,
A mounting part filling step of filling the inside of the mounting part outer mold with a first resin having a lower thermal conductivity than a second resin that is a heat conductive resin;
A socket portion outer shape preparing step of preparing a socket portion outer shape die for configuring the outer shape of the socket portion,
A mounting part filling step of filling the second resin into the socket outer shape mold. It is a manufacturing method of the lamp unit of Claim 9, Comprising:
Further, a metal plate preparing step of arranging a metal plate inside the socket outer shape mold,
The method of manufacturing a lamp unit, wherein, in the socket outer shape preparing step, the second resin is filled after disposing the metal plate inside the socket outer shape die.