JP2019186350A - Semiconductor device - Google Patents

Abstract

In a configuration for realizing electrical connection, occurrence of a local temperature rise is suppressed. Kind Code: A1 An insertion state in which a pin is inserted into a through hole and a terminal hole, and a non-insertion state in which the pin is not inserted into a through hole and a terminal hole. Exists. In the inserted state, the control terminal E1 is configured such that the control terminal E1 is in surface contact with the terminal surface E2a and the control terminal E1 is electrically connected to the terminal surface E2a. [Selection diagram] FIG.

Description

  The present invention relates to a semiconductor device having a configuration for electrically connecting a control board.

  Patent Document 1 discloses a configuration (hereinafter also referred to as “related configuration A”) in which a module on which a semiconductor element is mounted and a control circuit board that controls the semiconductor element are electrically and mechanically coupled. ing. In the related configuration A, the control circuit board is crimped to the module by the fixing block.

JP 2010-267873 A

  In the related configuration A, the conduction pin, the terminal hole, and the terminal hole are electrically connected by the point contact between the conduction pin, the terminal hole (through hole), and the terminal hole (hole having a bottom). . However, in a configuration in which electrical connection is realized, there is a problem that a local temperature increase is likely to occur at a location where the point contact occurs in a situation where the point contact is used.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a semiconductor device capable of suppressing the occurrence of a local temperature rise in a configuration for realizing electrical connection. And

  In order to achieve the above object, a semiconductor device according to one embodiment of the present invention includes a case in which a relay terminal is provided, a control board in which a through hole is provided, and the control board is crimped to the relay terminal. The relay terminal is provided with a terminal hole which is a through hole, and the fastener is a long pin for insertion into the through hole and the terminal hole. In the state of the fastener, the pin is inserted into the through hole and the terminal hole, and the pin is not inserted into the through hole and the terminal hole. The fastener and the pin are configured so that the control board is crimped to the relay terminal in a situation where the state of the fastener has shifted from the non-inserted state to the inserted state. The control board has a main surface facing a terminal surface that is at least a part of the surface of the relay terminal in the inserted state, and is a region around the through hole in the main surface of the control board. A control terminal which is a land is provided in a peripheral area of the hole, and in the inserted state, the control terminal is in surface contact with the terminal surface, and the control terminal is electrically connected to the terminal surface. As such, the control terminal is configured.

  According to the present invention, in the state of the fastener, the pin is inserted into the through hole and the terminal hole, and the pin is not inserted into the through hole and the terminal hole. States exist. In the inserted state, the control terminal is configured such that the control terminal is in surface contact with the terminal surface, and the control terminal is electrically connected to the terminal surface.

  That is, the control terminal is in surface contact with the terminal surface of the relay terminal. Thereby, generation | occurrence | production of a local temperature rise can be suppressed in the structure which implement | achieves electrical connection.

1 is a cross-sectional view of a semiconductor device according to a first embodiment. 2 is a perspective view showing a fixing module according to Embodiment 1. FIG. 3 is a perspective view showing a fastener according to Embodiment 1. FIG. It is an enlarged view near a hole. FIG. 6 is a cross-sectional view of a semiconductor device according to a second embodiment. It is a figure which shows the module for fixing which has the structure which concerns on the modification 1. FIG. It is a perspective view which shows the structure of the fastener which has the structure which concerns on the modified example 1. FIG. 10 is a cross-sectional view of a semiconductor device having a configuration according to Modification 2. FIG. 10 is a diagram for explaining a configuration according to Modification 3. FIG. FIG. 10 is a cross-sectional view around a hole for explaining a configuration according to modification example 4; FIG. 10 is a diagram for describing a configuration of one form according to Modification 5. 10 is a diagram for explaining a modified configuration according to Modification 5. FIG. It is a figure for demonstrating the structure of another form which concerns on the modification 5. FIG. It is a figure for demonstrating the structure of another form which concerns on the modification 5. FIG. It is a figure for demonstrating the structure of another form based on the modification 5. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals. The names and functions of the components having the same reference numerals are the same. Therefore, a detailed description of some of the components having the same reference numerals may be omitted.

  Note that the dimensions, materials, shapes, and relative arrangements of the components exemplified in the embodiments may be appropriately changed depending on the configuration of the apparatus to which the present invention is applied, various conditions, and the like. Moreover, the dimension of each component in each figure may differ from an actual dimension.

<Embodiment 1>
(Constitution)
FIG. 1 is a cross-sectional view of the semiconductor device 100 according to the first embodiment. In FIG. 1, the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction, Y direction, and Z direction shown in the following figures are also orthogonal to each other. Hereinafter, a direction including the X direction and the direction opposite to the X direction (−X direction) is also referred to as “X axis direction”. In the following, the direction including the Y direction and the direction opposite to the Y direction (−Y direction) is also referred to as “Y-axis direction”. Hereinafter, a direction including the Z direction and a direction opposite to the Z direction (−Z direction) is also referred to as a “Z-axis direction”.

  Hereinafter, a plane including the X-axis direction and the Y-axis direction is also referred to as an “XY plane”. Hereinafter, a plane including the X-axis direction and the Z-axis direction is also referred to as an “XZ plane”. Hereinafter, a plane including the Y-axis direction and the Z-axis direction is also referred to as a “YZ plane”.

  Referring to FIG. 1, a semiconductor device 100 includes a semiconductor module M1, a control board 10, and a fixing module M2. The semiconductor module M1, the control board 10 and the fixing module M2 are configured so that the fixing module M2 and the control board 10 can be attached to and detached from the semiconductor module M1.

  Hereinafter, the state in which the fixing module M2 and the control board 10 are attached to the semiconductor module M1 is also referred to as “attached state”. In the following, the state where the fixing module M2 and the control board 10 are not attached to the semiconductor module M1 is also referred to as “non-attached state”. FIG. 1 shows the configuration of the semiconductor device 100 in the attached state.

  FIG. 2 is a perspective view showing the fixing module M2 according to the first embodiment. The fixing module M2 includes a plurality of fasteners 50 and a lid F1. In FIG. 2, two fasteners 50 are shown as an example. A lid F1 is fixed to each fastener 50.

  FIG. 3 is a perspective view showing the fastener 50 according to the first embodiment. The fastener 50 includes a member 51 and m pins P1. “M” is a natural number of 2 or more. Each pin P1 is a pin for insertion into a later-described through hole H1 and a later-described terminal hole H2.

  The shape of the member 51 is a plate shape. The member 51 has a lower surface 51s. The m pins P1 are provided (fixed) on the lower surface 51s of the member 51. The member 51 is an insulating member. The member 51 may be a conductive member.

  The pin P1 has a long shape (bar shape). The pin P1 is a conductive pin. The pin P1 is made of metal, for example. The pin P1 may be an insulating pin. The pin P1 has the front-end | tip part P1a and the linear part P1b. The tip portion P1a has elasticity. The shape of the front end portion P1a is, for example, a ring shape.

  Referring again to FIG. 1, the semiconductor module M1 includes a case Cs1, a base plate 20, and a relay terminal E2.

  The shape of the case Cs1 is, for example, a cylindrical shape. The shape of the case Cs1 in a plan view (XY plane) is a closed loop shape (rectangular shape). Case Cs1 has an opening H10. In the non-attached state, the inside of the semiconductor device 100 is exposed to the outside of the semiconductor device 100 through the opening H10. The case Cs1 is made of resin, for example. Case Cs1 has end portions Cs1a and Cs1b.

  The case Cs1 has a plurality of holes H3. Specifically, m holes H3 are provided in the end portion Cs1a of the case Cs1. The m holes H3 are provided in the end portion Cs1a so that the m holes H3 are arranged along the Y-axis direction. The m pins P1 in one fastener 50 respectively correspond to m holes H3 in the end portion Cs1a.

  FIG. 4 is an enlarged view of the vicinity of the hole H3 in FIG. Each hole H3 has a bottom B1. Each hole H3 is a hole for accommodating the tip end portion P1a of the pin P1. Note that m holes H3 are provided in the end portion Cs1b as well as the end portion Cs1a.

  Referring to FIGS. 1 and 4, case Cs1 is provided with a relay terminal E2 having conductivity. Specifically, m relay terminals E2 are provided at the end Cs1a of the case Cs1. The m relay terminals E2 are provided at the end Cs1a so that the m relay terminals E2 are arranged along the Y-axis direction. Each relay terminal E2 has a terminal surface E2a. The terminal surface E2a is a surface in contact with the control board 10 in the attached state. The above-described fastener 50 is an instrument for crimping the control board 10 to the m relay terminals E2.

  Each relay terminal E2 is provided with one terminal hole H2. The terminal hole H2 is a through hole. That is, m terminal holes H2 are provided in the end portion Cs1a of the case Cs1, in which m relay terminals E2 are provided. The m terminal holes H2 are provided in the end portion Cs1a so that the m terminal holes H2 are arranged along the Y-axis direction. The m pins P1 in one fastener 50 correspond to the m terminal holes H2, respectively. The width (diameter) of the hole H3 is equal to or greater than the width (diameter) of the terminal hole H2.

  The number of relay terminals E2 provided at the end Cs1a is not limited to m. The number of relay terminals E2 provided at the end Cs1a may be k. “K” is a natural number of 1 or more and less than m. In this configuration, the k relay terminals E2 include the relay terminals E2 provided with one or more terminal holes H2. In this configuration, m terminal holes H2 are provided in the end portion Cs1a where the k relay terminals E2 are provided.

  Note that a relay terminal E2 having the same configuration as the relay terminal E2 provided in the end Cs1a is also provided in the end Cs1b.

  The case Cs1 is coupled to the base plate 20. The base plate 20 is provided with a semiconductor element S1 as a semiconductor chip via an insulating substrate 7. The semiconductor element S1 is, for example, a power semiconductor element. The semiconductor element S1 is electrically connected to the relay terminal E2 via a conductive wire W1.

  A plurality of electronic components 11 are provided on the control board 10. All or some of the plurality of electronic components 11 have a function of controlling the semiconductor element S1. The control board 10 has a main surface 10s and a side surface 10sd. Main surface 10s is in contact with terminal surface E2a in the attached state. The side surface 10sd is in contact with the case Cs1 (the end Cs1a or the end Cs1b) in the attached state.

  The control board 10 has end portions 10a and 10b. The control substrate 10 is provided with a plurality of through holes H1. Specifically, m through holes H <b> 1 are provided in the end portion 10 a of the control board 10. The m through holes H1 are provided in the end portion 10a so that the m through holes H1 are arranged along the Y-axis direction. The m pins P1 in one fastener 50 respectively correspond to the m through holes H1.

  Hereinafter, a region around the through hole H1 in the main surface 10s of the control substrate 10 is also referred to as a “hole peripheral region”. The control board 10 is provided with a plurality of control terminals E1. Specifically, a control terminal E1 is provided in a hole peripheral region of each through hole H1 in the end portion 10a of the control board 10. The control terminal E1 is a land having conductivity. The control terminal E1 is fixed to a portion of the end portion 10a that is in contact with each through-hole H1. Hereinafter, the through hole formed by providing the control terminal E1 in the peripheral area of the hole is also referred to as “through hole H1a”.

  Note that m through-holes H1 are also provided in the end portion 10b of the control board 10 in the same manner as the end portion 10a.

  The through hole H1, the terminal hole H2, and the hole H3 are arranged so that each pin P1 can be inserted into the through hole H1, the terminal hole H2, and the hole H3 corresponding to the pin P1.

  Hereinafter, the state in which the pin P1 is inserted into the through hole H1 and the terminal hole H2 is also referred to as “inserted state”. The inserted state corresponds to the above-described attached state. In the following, the state in which the pin P1 is not inserted into the through hole H1 and the terminal hole H2 is also referred to as “non-insertion state”. The non-inserted state corresponds to the aforementioned non-attached state. The state of the fastener 50 includes an inserted state and a non-inserted state.

  The fastener 50 and the pin P1 are configured so that the control board 10 is crimped to the m relay terminals E2 in a state where the state of the fastener 50 has shifted from the non-insertion state to the insertion state. The terminal surface E2a of each relay terminal E2 is at least a part of the surface of the relay terminal E2.

  The main surface 10s of the control board 10 faces the terminal surface E2a in the inserted state. Further, the lower surface 51s of the fastener 50 is in contact with the control board 10 in the inserted state.

  Further, in the inserted state, the control terminal E1 is configured such that the control terminal E1 is in surface contact with the terminal surface E2a and the control terminal E1 is electrically connected to the terminal surface E2a.

  Specifically, as shown in FIG. 4, the control terminal E1 has a plane portion E1a. The planar portion E1a is configured so that the planar portion E1a is in surface contact with the terminal surface E2a in the inserted state. The shape of the planar portion E1a in plan view (XY plane) is planar.

  Further, the hole H3 of the case Cs1 accommodates the tip end portion P1a of the pin P1 in the inserted state. Further, as shown in FIG. 1, the control board 10 is configured such that the control board 10 closes the opening H10 in the inserted state.

  Next, the tip portion P1a of the pin P1 will be described. Hereinafter, the state of the tip portion P1a or the pin P1 when no pressure is applied to the tip portion P1a is also referred to as a “non-pressure state”. In the following, the width of the tip portion P1a in the non-pressure state is also referred to as “normal width”. In the following, the state of the distal end portion P1a or the pin P1 when pressure is applied to the distal end portion P1a is also referred to as a “pressure state”.

  The pin P1 is configured so that the tip end portion P1a is exposed from the relay terminal E2 in the inserted state (see FIG. 4). Further, in the inserted state, the width of the hole H3 is set so that the state of the distal end portion P1a becomes a non-pressure state. That is, in the inserted state, the distal end portion P1a does not receive pressure from the surface of the case Cs1 that contacts the hole H3. As shown in FIG. 4, the width (normal width) of the tip portion P1a in the non-pressure state is larger than the width of the terminal hole H2. In the inserted state, the width of the hole H3 may be set so that the state of the distal end portion P1a becomes a pressure state.

  Next, a process for assembling the semiconductor device 100 (hereinafter also referred to as “assembly process”) will be described. In the assembly process, first, in a non-attached state, the control board 10 is installed in the case so that each pin P1 of the fixing module M2 can be inserted into the through hole H1, the terminal hole H2, and the hole H3 corresponding to the pin P1. It is placed on the terminal surface E2a of the relay terminal E2 in Cs1.

  Next, an attachment operation is performed. The attachment operation is an operation of attaching the fixing module M2 to the semiconductor module M1 so that the fixing module M2 in the non-attached state is in the attached state. The attachment operation is also an operation for shifting the state of the fastener 50 from the non-insertion state to the insertion state. The attachment operation is performed by, for example, an operator or a robot.

  Hereinafter, the period during which the state of the fastener 50 transitions from the non-insertion state to the insertion state is also referred to as “period Pr1”. In the period Pr1, each pin P1 of the fastener 50 is inserted into the through hole H1, the terminal hole H2, and the hole H3 corresponding to the pin P1 in the order of the through hole H1, the terminal hole H2, and the hole H3. .

  In the period Pr1, the tip end portion P1a is elastically deformed so that the width of the tip portion P1a of the pin P1 is equal to or less than the width of the terminal hole H2. When the tip portion P1a passes through the terminal hole H2, the width of the tip portion P1a becomes the normal width. Thereby, the front-end | tip part P1a of the pin P1 is accommodated in the hole H3 like FIG.

  Further, in a situation where the state of the fastener 50 has shifted from the non-inserted state to the inserted state, the control board 10 and the relay terminal E2 are sandwiched between the lower surface 51s of the fastener 50 and the distal end portion P1a. Thereby, the control board 10 is pressure-bonded to the relay terminal E2. The flat portion E1a of the control terminal E1 is in surface contact with the terminal surface E2a. Therefore, the control terminal E1 is electrically connected to the terminal surface E2a of the relay terminal E2. Thereby, the control terminal E1 of the control board 10 is electrically connected to the semiconductor element S1 via the relay terminal E2 and the wire W1.

  In the inserted state, the lid F1 closes the opening H10 of the case Cs1. By performing the attaching operation, assembly of the lid F1, the control board 10, the case Cs1, etc., that is, the assembly of the semiconductor device 100 can be performed collectively.

  As described above, according to the present embodiment, in the state of the fastener 50, the pin P1 is inserted into the through hole H1 and the terminal hole H2, and the pin P1 is connected to the through hole H1 and the terminal hole. There is a non-insertion state that is not inserted into H2. In the inserted state, the control terminal E1 is configured such that the control terminal E1 is in surface contact with the terminal surface E2a and the control terminal E1 is electrically connected to the terminal surface E2a.

  That is, the control terminal E1 is in surface contact with the terminal surface E2a of the relay terminal E2. Thereby, in the structure which implement | achieves electrical connection, the effect that generation | occurrence | production of a local temperature rise can be suppressed is acquired. Moreover, the increase in contact thermal resistance can be suppressed.

  Moreover, in this Embodiment, the control board 10 can be fixed to the semiconductor module M1 with the fastener 50. FIG. Therefore, in the present embodiment, the lock pin and the lock groove of the related configuration A are not necessary. Therefore, the effect that the number of parts required for fixing the control board 10 to the semiconductor module M1 can be reduced as compared with the related configuration A is obtained.

  In the present embodiment, the fixing module M2 includes a lid F1 and a fastener 50. Therefore, in the present embodiment, the height of the semiconductor device can be made lower than the semiconductor device having a configuration in which the leading end portion of the relay terminal protrudes from the upper portion of the control board.

  In the present embodiment, the control board 10 can be fixed to the semiconductor module M1 by attaching the fixing module M2 including the lid F1 to the semiconductor module M1. Therefore, a lid attachment process, a control board attachment process, etc. can be omitted. Therefore, the number of steps for manufacturing the semiconductor device 100 can be reduced. As a result, the manufacturing cost of the semiconductor device 100 can be reduced.

  In the present embodiment, the relay terminal E2 is electrically connected to the semiconductor element S1 (semiconductor chip) via the wire W1. Therefore, the pin P1 may be either a conductor or an insulator. That is, the material constituting the pin P1 is not limited.

  Therefore, a material suitable for the pin P1 can be selected from the material of the control board 10, the material of the relay terminal E2, the material of the case Cs1, and the like. For example, by using the same material as that of the member 51 of the fastener 50 as the material constituting the pin P1, the fastener 50 can be manufactured by a single process.

  Further, the hole H3 of the case Cs1 is a hole having a simple configuration that can accommodate the distal end portion P1a. Therefore, high machining accuracy is not required to form the hole H3. Therefore, the effect that the processing cost for forming the hole H3 can be reduced as compared with the related configuration A is obtained.

  In the related configuration A, in order to realize electrical connection between the control circuit board and the module having the semiconductor element, the two widened portions of the conduction pins are respectively provided on the side surface of the terminal hole and the side surface of the terminal hole. Point contact. That is, since the electrical joint surface is small, the following problems may occur. The malfunction is, for example, an increase in contact thermal resistance. Moreover, the said malfunction is a local temperature rise in a point contact part, for example.

  Further, in the related configuration A, it is structurally difficult to electrically connect the terminal hole and the terminal. Further, regarding the material, from the viewpoint of electrical connection, the conduction pin needs to be made of a conductive material.

  Further, in the related configuration A, the following is necessary for the processability of the module. For example, in the processing of the terminal hole, a step of providing a conductor such as gold plating on the inner peripheral surface of the terminal hole is necessary. Further, it is necessary to process the terminal hole so that the diameter of the terminal hole is slightly smaller than the diameter of the conductive pin, and to bond the terminal hole and the terminal.

  Further, it is necessary to process the module to form the lock groove so that the lock pin can be inserted into the lock groove and the lock pin is engaged with the lock groove. Therefore, the process for forming the said lock groove is required so that the length of the longitudinal direction of a lock groove may become longer than the length of a through-hole.

  Materials and workability are reflected in costs such as direct material costs and processing costs. Therefore, selection diversity is indispensable for materials in order to reduce costs. In addition, for ease of processing, easy processing is essential for cost reduction.

  Therefore, the semiconductor device 100 of the present embodiment has a configuration for achieving the above effects. Therefore, the semiconductor device 100 according to the present embodiment can satisfy the above-described requirements regarding the material and workability in the related configuration A.

<Embodiment 2>
FIG. 5 is a cross-sectional view of the semiconductor device 100A according to the second embodiment. The semiconductor device 100A is different from the semiconductor device 100 of FIG. 1 in that the semiconductor device 100A includes a fixing module M2a instead of the fixing module M2. Since other configurations and functions of semiconductor device 100A are the same as those of semiconductor device 100, detailed description will not be repeated.

  The fixing module M2a differs from the fixing module M2 of FIG. 2 in that it does not include the lid F1. Since the other configuration of fixing module M2a is the same as that of fixing module M2, detailed description will not be repeated. That is, the fixing module M2a includes two fasteners 50.

  In the following, the state where the fixing module M2a and the control board 10 are attached to the semiconductor module M1 is also referred to as “attached state”. In the following, the state where the fixing module M2a and the control board 10 are not attached to the semiconductor module M1 is also referred to as “non-attached state”. FIG. 5 shows the configuration of the semiconductor device 100A in the attached state.

  Next, a process for assembling the semiconductor device 100A (hereinafter also referred to as “assembly process A”) will be described. Since assembly process A is similar to the assembly process of the first embodiment, detailed description will not be repeated. A brief description is given below.

  In the assembly process A, first, in a non-attached state, the control board 10 is configured so that each pin P1 of the fixing module M2a can be inserted into the through hole H1, the terminal hole H2, and the hole H3 corresponding to the pin P1. It is placed on the terminal surface E2a of the relay terminal E2.

  Next, attachment operation A is performed. The attachment operation A is an operation of attaching the fixing module M2a to the semiconductor module M1 so that the non-attached fixing module M2a is in the attached state. Further, the attachment operation A is also an operation for shifting the state of the fastener 50 from the non-insertion state to the insertion state. By performing the above-described attachment operation, the same action as in the first embodiment can be obtained. In the inserted state, the control board 10 closes the opening H10. By performing the attachment operation A, the assembly of the control board 10, the case Cs1, etc., that is, the assembly of the semiconductor device 100A can be performed collectively.

  As described above, according to the present embodiment, the same effect as in the first embodiment can be obtained. In the inserted state, the control board 10 closes the opening H10. Therefore, the control board 10 functions as a lid that closes the opening H10. Therefore, in the present embodiment, the cost of the semiconductor device 100A can be reduced by the cost of the lid F1.

<Modification 1>
Hereinafter, the configuration of the first embodiment is also referred to as “configuration Ct1”. Hereinafter, the configuration of the second embodiment is also referred to as “configuration Ct2”. In the following, the configuration of this modification is also referred to as “configuration Ctm1”. The configuration Ctm1 is a configuration in which the number of pins P1 included in the fastener 50 is smaller than the number of pins P1 included in the fastener 50 in the configuration Ct1 or the configuration Ct2. The configuration Ctm1 is applied to all or part of the configuration Ct1 (Embodiment 1) and the configuration Ct2 (Embodiment 2).

  As an example, a configuration Ct1 to which the configuration Ctm1 is applied (hereinafter also referred to as “configuration Ct1m1”) is shown below. The configuration Ct1m1 is a configuration in which the configuration Ctm1 is applied to the configuration of FIG.

  FIG. 6 is a diagram illustrating a fixing module M2 having a configuration Ct1m1 according to the first modification. FIG. 7 is a perspective view illustrating a configuration of a fastener 50 having a configuration Ct1m1 according to the first modification.

  6 and 7, in the configuration Ct1m1, the fastener 50 has n pins P1. “N” is a natural number smaller than m. That is, in the configuration Ct1m1, the number (n) of the pins P1 included in the fastener 50 is smaller than the number (m) of the relay terminals E2 provided at the end Cs1a or the end Cs1b in the case Cs1.

  In the configuration Ct1m1, the terminal hole H2 is provided only in the n relay terminals E2 among the m relay terminals E2 in the end portion Cs1a or the end portion Cs1b. That is, the number (n) of the pins P1 included in the fastener 50 is the same as the number (n) of the terminal holes H2 provided in the end portion Cs1a or the end portion Cs1b. In the configuration Ct1m1, the pin P1 is inserted into all the terminal holes H2 in the inserted state.

  As described above, according to this modification, the cost of the member can be reduced as compared with the configuration Ct1 or the configuration Ct2.

<Modification 2>
In the following, the configuration of this modification is also referred to as “configuration Ctm2”. The configuration Ctm2 is a configuration in which the side surface of the control board is exposed to the outside of the semiconductor device in the inserted state. The configuration Ctm2 is applied to all or part of the configuration Ct1, the configuration Ct2, and the configuration Ctm1.

  As an example, a configuration Ct2 to which the configuration Ctm2 is applied (hereinafter also referred to as “configuration Ct2m2”) is shown below. The configuration Ct2m2 is obtained by applying the configuration Ctm2 to the configuration of FIG.

  FIG. 8 is a cross-sectional view of a semiconductor device 100A having the configuration Ct2m2 according to the second modification. In the configuration Ct2m2, the case Cs1 is configured such that one side surface 10sd and the other side surface 10sd of the control board 10 do not contact the end portion Cs1a and the end portion Cs1b, respectively. That is, in the configuration Ct2m2, the side surface 10sd of the control substrate 10 is exposed to the outside of the semiconductor device 100A in the inserted state.

  As described above, according to the present modification, for example, as shown in the configuration of FIG. 5, the control board 10 is attached to the semiconductor module M1 by the fastener 50 without supporting the control board 10 by the side surface of the case Cs1. Can be fixed. Therefore, the width of the semiconductor device can be reduced to the position of the side surface 10sd of the control substrate 10. Therefore, the semiconductor device can be reduced in size.

<Modification 3>
Hereinafter, the configuration of this modification is also referred to as “configuration Ctm3”. The configuration Ctm3 is a configuration in which the depth of the hole H3 is characteristic. The configuration Ctm3 is applied to all or part of the configuration Ct1, the configuration Ct2, the configuration Ctm1, and the configuration Ctm2.

  FIG. 9 is a diagram for explaining a configuration Ctm3 according to the third modification. Fig.9 (a) is a figure which shows the periphery structure of the hole H3 in an insertion state. In addition, Fig.9 (a) has shown the front-end | tip part P1a of a non-pressure state.

  Hereinafter, the length of the pin P1 in the non-pressure state in the longitudinal direction is also referred to as “length L1” or “L1”. In the following, the length in the longitudinal direction of the tip portion P1a in the non-pressure state is also referred to as “length L1a” or “L1a”. In the following, the length in the longitudinal direction of the straight line portion P1b is also referred to as “length L1b” or “L1b”.

  Hereinafter, the thickness of the control board 10 in the inserted state is also referred to as “thickness L21” or “L21”. Hereinafter, the thickness of the relay terminal E2 in the inserted state is also referred to as “thickness L22” or “L22”. In the following, in the inserted state, the length corresponding to L21 + L22 is also referred to as “length L2” or “L2”. The length L2 corresponds to the sum of the thickness of the control board 10 and the thickness of the relay terminal E2 in the inserted state. In the following, the depth of the hole H3 is also referred to as “depth L3” or “L3”.

  FIG. 9B is a diagram illustrating the depth of the hole H3 in the configuration Ctm3 according to the third modification. In the configuration Ctm3, the depth of the hole H3 is set so that the bottom B1 of the hole H3 applies pressure to the tip end portion P1a in the inserted state. Specifically, the depth of the hole H3 is set so that the relational expression of L3 <L1-L2 (that is, L3 <L1a) is established.

  Thereby, in the inserted state, the bottom B1 applies pressure to the tip portion P1a. Further, in a situation where the bottom B1 applies pressure to the tip portion P1a, the tip portion P1a applies pressure to the relay terminal E2. Specifically, a repulsive force generated when pressure is applied to the tip end portion P1a is applied to the relay terminal E2.

  As described above, according to the present modification, the distal end portion P1a applies pressure to the relay terminal E2 in the inserted state. Therefore, the pressure bonding force between the control board 10 and the relay terminal E2 can be strengthened, and the electrical adhesion can be strengthened.

<Modification 4>
In the following, the configuration of this modification is also referred to as “configuration Ctm4”. The configuration Ctm4 is a configuration in which the thickness of the relay terminal E2 is increased. The configuration Ctm4 is applied to all or part of the configuration Ct1, the configuration Ct2, the configuration Ctm1, the configuration Ctm2, and the configuration Ctm3. Hereinafter, the area around the terminal hole H2 in the relay terminal E2 is also referred to as “terminal hole peripheral area R2”.

  FIG. 10 is a cross-sectional view around the hole H3 for explaining the configuration Ctm4 according to the fourth modification. FIG. 10A is a diagram illustrating the terminal hole peripheral region R2 in a state where the state of the fastener 50 is in the middle of transition from the non-insertion state to the insertion state. FIG. 10B is a diagram showing the terminal hole peripheral region R2 (relay terminal E2) in the inserted state.

  With reference to FIG. 10A and FIG. 10B, in the configuration Ctm4, the terminal hole peripheral region R2 of the relay terminal E2 includes the uneven portion X2. Specifically, the uneven portion X2 is provided on the terminal hole peripheral region R2 on the side to be contacted with the control board 10. The uneven portion X2 has elasticity. The concavo-convex portion X2 has a concave portion and a convex portion.

  In the following, the state of the terminal hole peripheral region R2 when no pressure is applied to the terminal hole peripheral region R2 is also referred to as a “non-pressure state”. In the following, in the configuration Ctm4, the thickness of the portion having the maximum thickness in the terminal hole peripheral region R2 in the non-pressure state is also referred to as “thickness L22” or “L22”.

  Further, in the configuration Ctm4, the concavo-convex portion X2 is configured such that the distal end portion P1a applies pressure to the terminal hole peripheral region R2 (relay terminal E2) in the insertion state of FIG. Specifically, the concavo-convex portion X2 is configured such that the thickness L22 of the terminal hole peripheral region R2 in the non-pressure state is a thickness that satisfies L2> L1b in FIG. 9A.

  The length L2 is the sum of the thickness L21 of the control board 10 and the thickness L22 of the relay terminal E2. That is, in the configuration Ctm4, the concavo-convex portion X2 is configured such that the length L2 in the state where the terminal hole peripheral region R2 is in the non-pressure state is longer than the length L1b of the linear portion P1b.

  Next, in the configuration Ctm4, it is assumed that the mounting operation is performed as in the first embodiment. In this case, the state of the fastener 50 shifts from the non-insertion state to the insertion state. As described above, FIG. 10A shows the terminal hole peripheral region R2 in a state where the state of the fastener 50 is changing from the non-insertion state to the insertion state. As shown in FIG. 10A, the tip end portion P1a heads toward the hole H3 while applying pressure to the uneven portion X2 around the terminal hole H2.

  And in the situation where the state of the fastener 50 is in the inserted state, the tip end portion P1a applies pressure to the uneven portion X2 (terminal hole peripheral region R2). Thereby, the said uneven | corrugated | grooved part X2 elastically deforms (compresses), and becomes a shape like FIG.10 (b).

  As described above, according to this modification, the tip end portion P1a applies pressure to the terminal hole peripheral region R2 (relay terminal E2) in the inserted state. Therefore, it is possible to enhance the pressure bonding force between the control board 10 and the relay terminal E2.

  In addition, the shape of the recessed part and convex part which the uneven | corrugated | grooved part X2 has may be what kind of shape, as long as the shape which strengthens the crimping | compression-bonding force of the control board 10 and the relay terminal E2.

<Modification 5>
In the following, the configuration of this modification is also referred to as “configuration Ctm5”. The configuration Ctm5 has a feature in the shape of the pin P1. The configuration Ctm5 is applied to all or part of the configuration Ct1, the configuration Ct2, the configuration Ctm1, the configuration Ctm2, the configuration Ctm3, and the configuration Ctm4. The configuration Ctm5 has a plurality of forms. Hereinafter, the configuration of one form of the configuration Ctm5 is also referred to as “configuration Ctm5a”.

  FIG. 11 is a diagram for explaining a configuration Ctm5a according to the fifth modification. Hereinafter, the upper end of the tip end portion P1a is also referred to as “upper end P1au”. In the following, the distance (shortest distance) from the lower surface 51s of the member 51 to the upper end P1au of the tip end portion P1a in the inserted state is also referred to as a “clamping distance”. The configuration Ctm5a is a configuration in which the pinching distance changes as the pin P1 rotates.

  FIG. 11A is a front view of the configuration Ctm5a in the inserted state. FIG. 11B is a front view of the configuration Ctm5a in the inserted state. In FIG. 11A and FIG. 11B, the control board 10 and the relay terminal E2 are not shown for easy understanding of the configuration. 11A and 11B show a cross section of the member 51 of the fastener 50. FIG.

  In the configuration Ctm5a, the fastener 50 and the pin P1 are configured so that the pinching distance is shortened by the rotation of the pin P1 in the inserted state. Specifically, in the configuration Ctm5a, the pin P1 is fixed to the member 51 so as to be rotatable. That is, the pin P1 is a rotating body. The pin P1 has a protrusion P1x. In addition, recesses V <b> 1 and V <b> 2 are provided in the member 51 of the fastener 50. Each of the recesses V1 and V2 is a recess for accommodating the protrusion P1x. The depth of the recess V2 is smaller (shallow) than the depth of the recess V1.

  Hereinafter, an operation of rotating the pin P1 by 90 degrees counterclockwise using the upper portion of the pin P1 is also referred to as a “rotating operation”. The rotating operation is performed by an operator, for example. In the configuration Ctm5a, the member 51 is configured such that the upper portion of the pin P1 is exposed to the outside of the member 51 so that the rotation operation can be performed.

  By rotating in the inserted state, the state of the pin P1 changes from the state of FIG. 11A to the state of FIG. 11B. Further, as the pin P1 rotates, the protrusion P1x moves from the recess V1 to the recess V2. As a result, the pinching distance is shortened. Thus, in the state of FIG. 11B, the control board 10 and the relay terminal E2 are sandwiched between the lower surface 51s of the member 51 (fastener 50) and the upper end P1au of the tip end portion P1a. That is, the crimping force between the control board 10 and the relay terminal E2 can be strengthened, and electrical adhesion can be strengthened.

  In addition, in the member 51 of FIG. 11, it is good also as a structure (henceforth a "deformation structure") which replaced the position of the hollow V1 and the position of the hollow V2. FIG. 12 is a diagram for explaining a modified configuration of the configuration Ctm5a according to the modified example 5. Fig.12 (a) is a side view of the deformation | transformation structure in an insertion state. FIG. 12B is a side view of the modified configuration in the inserted state. In the modified configuration, the rotation of the pin P1 in the inserted state changes the state of the pin P1 from the state of FIG. 12 (a) to the state of FIG. 12 (b). Further, as the pin P1 rotates, the protrusion P1x moves from the recess V1 to the recess V2. As a result, the pinching distance is shortened. Thereby, the same effect as the structure of FIG. 11 is acquired.

  Hereinafter, another configuration of the configuration Ctm5 is also referred to as “configuration Ctm5b”. FIG. 13 is a diagram for explaining a configuration Ctm5b according to the fifth modification. The shape of the tip portion P1a of the pin P1 is not limited to the ring shape (circular shape) shown in FIG. 13A, and may be another shape. The shape of the tip portion P1a of the pin P1 may be, for example, an ellipse. Moreover, the shape of the front-end | tip part P1a of the pin P1 may be the rectangular shape shown by FIG.13 (b), for example. Further, the shape of the tip portion P1a of the pin P1 may be, for example, a bifurcated shape as shown in FIG.

  Moreover, as shown in FIG. 14, the taper surface Tp1 (slope) may be provided in the member 51 side (root part) among the pins P1. The tapered surface Tp1 is provided on the pin P1 so that the crimping force between the control board 10 and the relay terminal E2 in the inserted state is increased.

  FIG. 14A shows a configuration in which a tapered surface Tp1 is provided on the pin P1 of FIG. FIG. 14B shows a configuration in which a tapered surface Tp1 is provided on the pin P1 of FIG. FIG. 14C shows a configuration in which a tapered surface Tp1 is provided on the pin P1 of FIG.

  The configuration in which the taper surface Tp1 is provided on the pin P1 can reinforce the pressure-bonding force between the control board 10 and the relay terminal E2, and can enhance the electrical adhesion, compared with the configuration in which the taper surface is not provided. it can.

  Hereinafter, the configuration of still another form of the configuration Ctm5 is also referred to as “configuration Ctm5c”. FIG. 15 is a diagram for explaining a configuration Ctm5c according to the fifth modification. In the configuration Ctm5c, the fastener 50 (pin P1) has a press-fit structure. In the configuration Ctm5c, the pin P1 has conductivity.

  Referring to FIG. 15, in the configuration Ctm5c, the pin P1 has a widened portion P1b. The widened portion P1b is configured such that the widened portion P1b contacts the control terminal E1 in the inserted state. Therefore, the widened part P1b contacts the control terminal E1 in the inserted state. That is, the widened portion P1b is electrically connected to the control terminal E1 existing on the side surface of the through hole H1.

  Note that the configuration Ctm5 is not limited to the above-described configurations Ctm5a, Ctm5b, and Ctm5c. If the state of the fastener 50 is shifted from the non-insertion state to the insertion state, the control board 10 is crimped to the relay terminal E2 and the control board 10 is electrically connected to the relay terminal E2. Other configurations than the configurations Ctm5a, Ctm5b, and Ctm5c may be used.

  A part or all of the configurations Ctm5a, Ctm5b, and Ctm5c may be combined. For example, the configuration Ctm5c may be applied to the configuration Ctm5a. Hereinafter, the configuration Ctm5a to which the configuration Ctm5c is applied is also referred to as “configuration Ctm5ac”. The configuration Ctm5ac may be applied to all or part of the configuration Ct1, the configuration Ct2, the configuration Ctm1, the configuration Ctm2, the configuration Ctm3, and the configuration Ctm4.

  Note that the present invention can be freely combined with each embodiment and each modification within the scope of the invention, and each embodiment and each modification can be appropriately modified and omitted.

  For example, the number of pins P1 that the fastener 50 has may be one. In this configuration, one pin P1, one relay terminal E2, and one terminal hole H2 are used. For example, one pin P1 is inserted into one terminal hole H2 provided in one relay terminal E2.

  10 control board, 50 fastener, 100, 100A semiconductor device, Cs1 case, E1 control terminal, E2 relay terminal, F1 lid, H1 through hole, H2 terminal hole, H3 hole, P1 pin, P1a tip.

Claims (10)

A case where a relay terminal is provided;
A control board provided with a through hole;
A fastener for crimping the control board to the relay terminal,
The relay terminal is provided with a terminal hole which is a through-hole,
The fastener has an elongated pin for insertion into the through hole and the terminal hole,
The state of the fastener includes an insertion state in which the pin is inserted into the through hole and the terminal hole, and a non-insertion state in which the pin is not inserted into the through hole and the terminal hole,
The fastener and the pin are configured such that the control board is crimped to the relay terminal in a state where the state of the fastener has shifted from the non-insertion state to the insertion state,
The control board has a main surface facing a terminal surface which is at least a part of the surface of the relay terminal in the inserted state,
A control terminal which is a land is provided in a hole peripheral region which is a peripheral region of the through hole in the main surface of the control board,
The control terminal is configured such that, in the inserted state, the control terminal is in surface contact with the terminal surface, and the control terminal is electrically connected to the terminal surface. The fastener has a lower surface in contact with the control board in the inserted state,
The pin is provided on the lower surface,
The tip of the pin has elasticity,
The width of the tip is larger than the width of the terminal hole,
In a period in which the state of the fastener transitions from the non-insertion state to the insertion state, the tip portion is elastically deformed such that the width of the tip portion is equal to or less than the width of the terminal hole,
The pin is configured so that the tip is exposed from the relay terminal in the inserted state,
2. The semiconductor according to claim 1, wherein the control board and the relay terminal are sandwiched between the lower surface and the tip of the fastener in a state where the state of the fastener has shifted from the non-insertion state to the insertion state. apparatus. The case has an opening;
The semiconductor device according to claim 1, wherein the control board is configured so that the control board closes the opening in the inserted state. The case has an opening;
The semiconductor device according to any one of claims 1 to 3, wherein a lid that covers the opening in the inserted state is fixed to the fastener. The fastener has a plurality of pins including the pin,
The case is provided with a plurality of relay terminals including the relay terminal,
The semiconductor device according to claim 1, wherein the number of pins is smaller than the number of relay terminals. The semiconductor device according to claim 1, wherein a side surface of the control board is exposed to the outside of the semiconductor device in the inserted state. The tip of the pin has elasticity,
The pin is configured so that the tip is exposed from the relay terminal in the inserted state,
The case is provided with a hole having a bottom for accommodating the tip in the inserted state,
The depth of the hole is set so that the bottom of the hole applies pressure to the tip in the inserted state,
The semiconductor device according to claim 1, wherein the tip applies pressure to the relay terminal in a situation where the bottom applies pressure to the tip. The width of the tip of the pin is larger than the width of the terminal hole,
The pin is configured so that the tip is exposed from the relay terminal in the inserted state,
The terminal hole peripheral region which is a region around the terminal hole among the relay terminals includes an uneven portion having elasticity,
The semiconductor device according to claim 1, wherein the concavo-convex portion is configured such that the tip portion applies pressure to the peripheral region of the terminal hole in the inserted state. The tip of the pin has elasticity,
The width of the tip of the pin is larger than the width of the terminal hole,
The pin is configured so that the tip is exposed from the relay terminal in the inserted state,
The fastener has a lower surface in contact with the control board in the inserted state,
The said fastener and the said pin are comprised so that the distance from the said lower surface to the upper end of the said front-end | tip part may become short when the said pin rotates in the said insertion state. A semiconductor device according to 1. The semiconductor device according to claim 1, wherein the pin has a widened portion that contacts the control terminal in the inserted state.

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