JP2019171431A - Laser processing device and method for adjusting laser processing device - Google Patents

Abstract

An object of the present invention is to provide a laser processing apparatus capable of adjusting a position of a laser beam in a nozzle with high accuracy. A laser processing apparatus includes a laser oscillator that oscillates laser light, a condenser lens that is a condenser optical system that collects laser light, and a laser beam that passes through the condenser optical system. A nozzle 19 having an opening 19 a for emitting light toward the object 20, a camera 23 serving as an imaging unit for imaging the opening 19 a, and an irradiation area of the laser light on the workpiece 20, and light from the laser oscillator 10. A beam splitter 15 which is a light splitting element that reflects the first incident light toward the workpiece 20 and transmits the second incident light incident from the workpiece 20 to be incident on the imaging unit; A lens driving unit 13 that is an adjustment unit that performs adjustment for correcting a shift between the center of the opening 19a and the center of the laser beam based on image data obtained by imaging the unit 19a and the irradiation area. Preparation . [Selection diagram] Fig. 1

Description

  The present invention relates to a laser processing apparatus and a method for adjusting a laser processing apparatus.

  In the laser processing apparatus, an adjustment referred to as centering for allowing the laser light to pass through the center of a nozzle provided in the processing head may be performed. Conventionally, a workpiece is processed while visually confirming the processing area of the workpiece, and the position of an optical element such as a lens or a mirror constituting an optical system provided in the processing head is adjusted. , Centering may be performed. Since the visual judgment requires experience by the operator or trial and error of the operator, the centering work may require time and effort.

  In Patent Document 1, a reflecting mirror that enables insertion of a laser beam into an optical path and retraction of the laser beam from the optical path is used, and a nozzle opening is formed by a camera via the reflecting mirror inserted into the optical path. A technique for adjusting the position of the laser beam in the nozzle has been proposed.

JP 2003-225787 A

  In the technique of Patent Document 1, an optical path different from an optical path when processing by laser light is performed by insertion of a reflecting mirror, and an opening and a processing hole are observed. In order to enable highly accurate adjustment of the position of the laser beam, it is necessary to position the reflecting mirror with high accuracy so that the position of the image of the opening captured by the camera is always constant. It is difficult to enable highly accurate positioning of a reflector that needs to move in and out of the optical path. As described above, in the technique of Patent Document 1, since an optical path different from the optical path when processing by laser light is performed is formed by inserting the reflecting mirror, the position of the laser light at the nozzle is adjusted with high accuracy. There was a problem that it was difficult.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus that enables highly accurate adjustment of the position of laser light in a nozzle.

  In order to solve the above-described problems and achieve the object, a laser processing apparatus according to the present invention includes a laser oscillator that oscillates laser light, a condensing optical system that condenses the laser light, and a condensing optical system. A nozzle having an opening that emits the laser beam toward the workpiece, an imaging unit that images the opening, and an irradiation region of the laser beam on the workpiece, and a first incident incident from the laser oscillator Obtained by imaging an optical branching element that reflects light toward the workpiece and transmits the second incident light incident from the workpiece and enters the imaging unit, and an aperture and an irradiation region An adjustment unit that performs adjustment for correcting a shift between the center of the opening and the center of the laser beam based on the image data.

  According to the present invention, there is an effect that the position of the laser beam in the nozzle can be adjusted with high accuracy.

The figure which shows the structure of the laser processing apparatus concerning Embodiment 1 of this invention. Block diagram of the laser processing apparatus shown in FIG. The figure which shows the hardware constitutions when the function of the control apparatus which the laser processing apparatus concerning Embodiment 1 has is implement | achieved by dedicated hardware. The figure which shows the hardware constitutions in case the function of the control apparatus which the laser processing apparatus concerning Embodiment 1 has is implement | achieved by the processor which executes the program stored in memory. The flowchart which shows the procedure of operation | movement by the laser processing apparatus shown in FIG. The figure which shows the example of the image of the opening part taken in with the camera which the laser processing apparatus shown in FIG. 1 has The figure which shows the example of the image of the irradiation area | region taken in with the camera which the laser processing apparatus shown in FIG. 1 has. The figure which shows the structure of the laser processing apparatus concerning Embodiment 2 of this invention. The flowchart which shows the procedure of operation | movement by the laser processing apparatus shown in FIG.

  Below, the laser processing apparatus concerning the embodiment of the present invention and the adjustment method of a laser processing apparatus are explained in detail based on a drawing. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a configuration of a laser processing apparatus 100 according to the first embodiment of the present invention. The laser processing apparatus 100 is an apparatus that performs hole processing for forming holes in a workpiece by irradiation with laser light. The laser processing apparatus 100 may be an apparatus that performs laser processing other than hole processing. The laser processing apparatus 100 performs centering, which is an adjustment for allowing the laser light to pass through the center of the nozzle 19 provided in the processing head 14.

  In FIG. 1, an X axis and a Y axis are axes parallel to the horizontal direction and perpendicular to each other. The Z axis is assumed to be an axis parallel to the vertical direction and perpendicular to the X axis and the Y axis. The workpiece 20 is placed on a surface parallel to the X axis and the Y axis on the table 21. Of the X-axis directions, the direction indicated by the arrow in the figure is the plus X direction, and the direction opposite to the plus X direction is the minus X direction. A direction toward the front of the page in the Y-axis direction is a plus Y direction, and a direction opposite to the plus Y direction is a minus Y direction. Of the Z-axis directions, a direction indicated by an arrow in the figure is a plus Z direction, and a direction opposite to the plus Z direction is a minus Z direction.

  The laser processing apparatus 100 includes a laser oscillator 10 that oscillates laser light, a processing head 14 that houses a condensing lens 17 that is a condensing optical system that condenses the laser light, a laser oscillator 10, and a processing head 14. And a fiber cable 11 through which the laser light propagates. In FIG. 1, elements provided inside the processing head 14 are schematically shown. The fiber cable 11 is connected to the machining head 14 by inserting an emission end 11 a of the fiber cable 11 from which laser light is emitted into an end 14 a on the plus X direction side of the machining head 14.

  The laser processing apparatus 100 includes a collimator unit 12 that is a collimating optical system. The collimator unit 12 is provided on the minus X direction side from the emission end 11a. The collimator unit 12 collimates the laser light incident on the processing head 14 from the laser oscillator 10 and the fiber cable 11. The collimator unit 12 is accommodated in the holder. In FIG. 1, the illustration of the holder in which the collimator unit 12 is accommodated is omitted. The focal point of the collimator unit 12 coincides with the emission end 11 a of the fiber cable 11. The collimator unit 12 collimates the laser light emitted from the emission end 11 a inside the processing head 14.

  The laser processing apparatus 100 includes a beam splitter 15 that is an optical branching element. The beam splitter 15 is a plate-type beam splitter in which the angle formed between the principal ray of incident light and the incident surface and the angle formed between the principal ray of emitted light and the emission surface are both 45 degrees. It is. An optical thin film having wavelength characteristics is formed on the transparent material plate constituting the beam splitter 15. The beam splitter 15 reflects the first incident light, which is incident light incident from the laser oscillator 10, toward the workpiece 20, and the second incident light, which is incident light incident from the workpiece 20. Is transmitted and incident on the camera 23.

  The beam splitter 15 branches a first optical path that is an optical path between the laser oscillator 10 and the condenser lens 17 and a second optical path that is an optical path between the camera 23 and the condenser lens 17 described later. . The wavelength characteristics of the beam splitter 15 will be described later. The beam splitter 15 travels light from one direction in two directions and travels light from two directions in one direction. The beam splitter 15 may be a cube-type beam splitter constituted by two right-angle prisms.

  The condenser lens 17 is housed inside the holder 16. The nozzle 19 is provided at the end of the processing head 14 on the minus Z direction side. The nozzle 19 has an opening 19 a that emits laser light that has passed through the condenser lens 17 toward the workpiece 20.

  The laser processing apparatus 100 includes a camera 23 that is an imaging unit and an illumination unit 24 that irradiates illumination light to the inside of the nozzle 19. The camera 23 images the opening 19a and the laser light irradiation area on the workpiece 20. The camera 23 includes an imaging lens that captures light from a subject and a CCD (Charge Coupled Device) that is an image sensor that captures a subject image. The image sensor may be a complementary metal oxide semiconductor (CMOS) image sensor. The camera 23 is disposed inside the processing head 14 with the imaging lens facing in the minus Z direction. In FIG. 1, illustration of the imaging lens and the image sensor is omitted.

  The illumination unit 24 is provided side by side with the imaging lens. The illumination unit 24 irradiates the interior of the nozzle 19 with illumination light by emitting illumination light from the position of the camera 23 toward the minus Z direction.

  The processing head 14 is provided with a lens driving unit 18 that moves the holder 16 in the Z-axis direction. The lens driving unit 18 changes the focal position of the condenser lens 17 by moving the holder 16. The lens driving unit 18 includes a motor and a mechanism that converts the rotational motion of the motor into linear motion. In FIG. 1, illustration of the motor and the mechanism is omitted.

  The laser processing apparatus 100 is provided with a table driving unit 22 that moves the table 21 in the X-axis direction and the Y-axis direction. The laser processing apparatus 100 moves the table 21 in the X axis direction and the Y axis direction by the table driving unit 22 to change the irradiation position of the laser beam on the workpiece 20 between the X axis direction and the Y axis direction. .

  The laser processing apparatus 100 is an adjustment for correcting a shift between the center of the opening 19a and the center of the laser beam based on image data obtained by capturing the image of the opening 19a and the image of the irradiation area. A lens driving unit 13 that is an adjusting unit that performs centering is provided. The laser processing apparatus 100 includes an image processing apparatus 25 that processes an image signal obtained by imaging with the camera 23, and a control apparatus 26 that controls the entire laser processing apparatus 100.

  In the first embodiment, the laser oscillator 10 includes an adjustment laser beam that oscillates when the adjustment by the lens driving unit 13 is performed, and a processing laser beam that oscillates when the workpiece 20 is processed. Two can be oscillated. The processing laser beam is a first laser beam that is a laser beam that can process the workpiece 20. The adjustment laser beam is a second laser beam that is a laser beam other than the laser beam capable of processing the workpiece 20.

  FIG. 2 is a block diagram of the laser processing apparatus 100 shown in FIG. The control device 26 is an imaging control unit 31 that is a functional unit that controls the image processing device 25, a condensing control unit 32 that is a functional unit that controls the lens driving unit 18, and a functional unit that controls the lens driving unit 13. An adjustment control unit 33, a laser oscillation control unit 34 that is a functional unit that controls the laser oscillator 10, and a table control unit 35 that is a functional unit that controls the table driving unit 22 are included. The adjustment control unit 33 performs adjustment for correcting a shift between the center of the opening 19a and the center of the laser beam based on image data obtained by imaging the image of the opening 19a and the image of the irradiation region. It is an adjustment unit.

  The image processing device 25 operates the camera 23 and operates the illumination unit 24 via the camera 23 based on the control by the imaging control unit 31. The image processing device 25 acquires an image signal from the camera 23 and processes the image signal. The image processing device 25 sends image data, which is data obtained by processing the image signal, to the imaging control unit 31. Note that the illumination unit 24 is not limited to that controlled via the camera 23, and may be controlled by the image processing device 25 without passing through the camera 23.

  The laser oscillator 10 can oscillate by switching between the adjustment laser beam and the processing laser beam in accordance with control by the laser oscillation control unit 34. The processing laser beam is a laser beam having a wavelength included in a range other than the visible region, and is output with an intensity capable of processing the workpiece 20. The laser oscillation control unit 34 can adjust the oscillation conditions such as the oscillation frequency, the pulse width, and the intensity of the processing laser.

  The adjustment laser beam is a laser beam having a wavelength included in the visible range, and is output at a lower intensity than the processing laser. The intensity of the adjustment laser light is set to an intensity that does not damage the camera 23. The laser oscillator 10 oscillates an adjustment laser beam having a first wavelength included in the visible range. The illumination unit 24 emits illumination light having a second wavelength that is a wavelength included in the range of the visible region and is different from the first wavelength. The camera 23 has sensitivity with respect to the first wavelength light and the second wavelength light. The wavelength of the processing laser light is the third wavelength. The third wavelength is a wavelength included in a range other than the visible region.

  The beam splitter 15 has a wavelength characteristic that reflects 99.9% or more of the incident third wavelength light. The beam splitter 15 has a wavelength characteristic that reflects a part of the incident light having the first wavelength and transmits the other part. For example, the beam splitter 15 reflects about 50% of the incident light having the first wavelength and transmits the other 50%. The beam splitter 15 has a wavelength characteristic that transmits 90% or more of incident light having the second wavelength. The wavelength characteristics of the beam splitter 15 are not limited to the wavelength characteristics described in the first embodiment, and may be changed as appropriate. The reflectance and transmittance of the beam splitter 15 are not limited to those shown in the first embodiment and are arbitrary.

  In the processing head 14, the chief ray of the laser beam emitted from the emission end 11a is parallel to the X-axis direction. The laser light travels in the minus X direction while diffusing in the Y-axis direction and the Z-axis direction from the emission end 11a. The laser light is collimated in the collimator unit 12 so as to be parallel light parallel to the X-axis direction.

  During the processing of the workpiece 20, the traveling direction of the processing laser light, which is the first incident light that has entered the beam splitter 15 from the collimator unit 12, is changed from the minus X direction to the minus Z by the reflection at the beam splitter 15. Folded in the direction. The processing head 14 emits a processing laser beam toward the workpiece 20.

When adjustment is performed by the lens driving unit 13, when adjustment laser light is oscillated, about 50% of the adjustment laser light incident on the beam splitter 15 from the collimator unit 12 is reflected by the beam splitter 15. . The adjustment laser light reflected by the beam splitter 15 travels toward the workpiece 20 as in the case of the processing laser light. The adjustment laser light travels in the plus Z direction in the machining head 14 by reflection on the workpiece 20.
The adjustment laser light that is the second incident light from the workpiece 20 enters the beam splitter 15. About 50% of the adjustment laser light incident on the beam splitter 15 is transmitted through the beam splitter 15. The camera 23 takes in the adjustment laser light that has passed through the beam splitter 15.

  When adjustment is performed by the lens driving unit 13, when illumination light is emitted, 90% or more of the illumination light incident on the beam splitter 15 is transmitted through the beam splitter 15. The illumination light transmitted through the beam splitter 15 travels toward the workpiece 20 as in the case of the processing laser light and the adjustment laser light. Illumination light that has traveled in the plus Z direction in the machining head 14 due to reflection from the workpiece 20 enters the beam splitter 15. 90% or more of the illumination light incident on the beam splitter 15 is transmitted through the beam splitter 15. The camera 23 takes in the illumination light that has passed through the beam splitter 15.

  The lens driving unit 18 moves the holder 16 to adjust the focal point of the condensing lens 17 to the position of the workpiece 20 and adjusts the focal point of the condensing lens 17 to the position of the opening 19a under the control of the condensing control unit 32. The holder 16 can be moved.

  The lens driving unit 13 enables the holder in which the collimator unit 12 is accommodated to move in the Y axis direction and the Z axis direction. The lens driving unit 13 adjusts the position of the laser beam in the Y axis direction at the nozzle 19 by moving the holder in the Y axis direction. The lens driving unit 13 adjusts the position of the laser beam in the X-axis direction at the nozzle 19 by moving the holder in the Z-axis direction. The lens driving unit 13 includes an adjustment screw that can adjust the position of the holder in the Y-axis direction and an adjustment screw that can adjust the position of the holder in the Z-axis direction. Each of the two adjustment screws is provided with a motor that rotates the adjustment screw. The adjustment control unit 33 adjusts the position of the holder in the Y-axis direction and the position of the holder in the Z-axis direction by controlling the drive of the motor. In FIG. 1 and FIG. 2, the adjustment screw and the motor are not shown.

  The condenser lens 17 is arranged with its center aligned with an axis parallel to the Z axis. The central axis of the collimator unit 12 is parallel to the Z axis. The central axis of the collimator unit 12 coincides with that obtained by extending the central axis of the condenser lens 17 through 45-degree bending at the beam splitter 15. The central axis of the camera 23 is parallel to the Z axis. The central axis of the camera 23 coincides with that obtained by extending the central axis of the condenser lens 17 through the beam splitter 15. The central axis of the condenser lens 17, the central axis of the collimator unit 12, and the central axis of the camera 23 are referred to as the optical axis of the processing head 14. The condenser lens 17, the collimator unit 12, and the camera 23 are arranged so that the center is aligned with the optical axis of the processing head 14. That is, the condensing lens 17, the collimator unit 12, and the camera 23 are arranged on the same optical axis.

  The function of the control device 26 is realized by a processing circuit. The processing circuit may be hardware dedicated to the laser processing apparatus 100 according to the first embodiment, or may be a processor that executes a program stored in the memory.

  FIG. 3 is a diagram illustrating a hardware configuration when the function of the control device 26 included in the laser processing apparatus 100 according to the first embodiment is realized by dedicated hardware. The processing circuit 51 which is dedicated hardware includes a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or these It is a combination.

  FIG. 4 is a diagram illustrating a hardware configuration in a case where the function of the control device 26 included in the laser processing apparatus 100 according to the first embodiment is realized by a processor that executes a program stored in a memory. The processor 53 and the memory 54 are connected to be able to communicate with each other.

  The processor 53 is a CPU (Central Processing Unit), a processing device, an arithmetic device, a microprocessor, a microcomputer, or a DSP (Digital Signal Processor). The function of the control device 26 is realized by the processor 53 and software, firmware, or a combination of software and firmware. Software or firmware is described as a program and stored in the memory 54. The memory 54 is nonvolatile or volatile such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), and EEPROM (registered trademark) (Electrically Erasable Programmable Read-Only Memory). Built-in memory such as a semiconductor memory.

  A part of the function of the control device 26 may be realized by dedicated hardware, and the other part of the function of the control device 26 may be realized by software or firmware. Thus, the function of the control device 26 can be realized by hardware, software, firmware, or a combination thereof.

  Note that the function of the image processing device 25 is realized by a processing circuit in the same manner as the function of the control device 26. The hardware configuration illustrated in FIG. 3 and the hardware configuration illustrated in FIG. 4 may be applied to the image processing device 25. In the case of the hardware configuration shown in FIG. 4, the processing function of the image processing device 25 is realized by the processor 53 and software, firmware, or a combination of software and firmware.

  Next, the operation of the laser processing apparatus 100 will be described. FIG. 5 is a flowchart showing an operation procedure by the laser processing apparatus 100 shown in FIG. FIG. 5 shows an operation procedure when the laser processing apparatus 100 adjusts the position of the laser beam at the nozzle 19.

  In step S <b> 1, the lens driving unit 18 moves the condenser lens 17. The lens driving unit 18 adjusts the focal point of the condensing lens 17 to the position of the opening 19a by moving the holder 16 according to the control by the condensing control unit 32.

  In step S2, the illumination unit 24 emits illumination light. The illumination unit 24 is lit according to control by the imaging control unit 31. The illumination light emitted from the illumination unit 24 passes through the beam splitter 15 and the condenser lens 17 and reaches the opening 19a. The illumination light reflected by the opening 19 a passes through the condenser lens 17 and the beam splitter 15 and reaches the camera 23.

  In step S3, the camera 23 images the opening 19a. The camera 23 takes in the illumination light reflected by the opening 19 a and takes an image of the opening 19 a according to the control by the imaging control unit 31. The camera 23 outputs an image signal obtained by imaging. In step S4, the illumination unit 24 stops emitting illumination light.

  FIG. 6 is a diagram illustrating an example of an image 40 of the opening 19a captured by the camera 23 included in the laser processing apparatus 100 illustrated in FIG. The magnification of the image 40 with respect to the opening 19a is determined by the ratio between the focal length of the imaging lens of the camera 23 and the focal length of the condenser lens 17. The magnification is set so that the size of the image 40 determined by multiplying the size of the opening 19a by the magnification is within the imaging range.

  The image processing device 25 obtains the xy coordinates of the center position C1 of the image 40 based on the image signal output by the camera 23. The x-axis shown in FIG. 6 is an axis corresponding to the X-axis shown in FIG. The y axis shown in FIG. 6 is an axis corresponding to the Y axis shown in FIG. The image processing device 25 performs binarization processing on the image signal acquired by imaging, and then calculates the xy coordinates of the center position C1 using image processing such as circle approximation, edge detection, or Hough transform. Note that the image processing device 25 may calculate the xy coordinates of the center position C1 by a method other than this method. The image processing device 25 outputs image data that is xy coordinates indicating the center position C1 by processing the image signal. The imaging control unit 31 acquires image data output from the image processing device 25.

  In step S <b> 5, the lens driving unit 18 moves the condenser lens 17. The lens driving unit 18 moves the holder 16 according to the control by the condensing control unit 32 to adjust the focusing point of the condensing lens 17 to the workpiece 20. In step S5, the table driving unit 22 moves the table 21 on which the workpiece 20 is placed to a position on the minus Z direction side of the opening 19a according to control by the table control unit 35.

  In step S6, the laser oscillator 10 oscillates the adjustment laser beam. The laser oscillator 10 oscillates an adjustment laser beam in accordance with control by the laser oscillation control unit 34. The adjustment laser light oscillated by the laser oscillator 10 enters the processing head 14 through the fiber cable 11. The adjustment laser light passes through the collimator unit 12 and then enters the beam splitter 15. The adjustment laser light reflected by the beam splitter 15 passes through the condenser lens 17, passes through the opening 19 a, and enters the workpiece 20. The adjustment laser light reflected by the workpiece 20 passes through the opening 19 a, passes through the condenser lens 17, and enters the beam splitter 15. The adjustment laser beam that has passed through the beam splitter 15 reaches the camera 23.

  In step S <b> 7, the camera 23 images the irradiation region of the adjustment laser light on the workpiece 20. The camera 23 takes in the adjustment laser light reflected by the workpiece 20 and captures an image of the irradiation area according to the control by the imaging control unit 31. The camera 23 outputs an image signal obtained by imaging. After imaging by the camera 23, the laser oscillator 10 stops the oscillation of the adjustment laser light.

  FIG. 7 is a diagram illustrating an example of an image 41 of an irradiation area captured by the camera 23 included in the laser processing apparatus 100 illustrated in FIG. In FIG. 7, an image 41 of the irradiation area is superimposed on the image 40 of the opening 19a shown in FIG. The image processing device 25 obtains the xy coordinates of the center position C2 of the image 41 based on the image signal output by the camera 23. The image processing device 25 calculates the xy coordinates of the center position C2 by the same method as the xy coordinates of the center position C1. The image processing device 25 outputs image data that is xy coordinates indicating the center position C2 by processing the image signal. The imaging control unit 31 acquires image data output from the image processing device 25.

  The position of the table 21 in the Z-axis direction may be adjusted so that the irradiation area observed by imaging with the camera 23 is as close as possible from the opening 19a. In the Z-axis direction, the height of the surface of the workpiece 20 that is irradiated with the adjustment laser light may be adjusted to the height of the opening 19a. As a result, the laser processing apparatus 100 can observe the center position of the adjustment laser light at a position as close as possible to the opening 19a, and can adjust the position of the laser light at the nozzle 19 with high accuracy. The shape of the irradiated area to be imaged is not limited to a circle, but may be an ellipse. The camera 23 may capture an image of the irradiation area at a position out of focus in the Z-axis direction.

  In step S8, the imaging control unit 31 calculates a deviation amount of the center position of the adjustment laser light irradiation region from the center position of the opening 19a. The imaging control unit 31 calculates the distance between the center position C1 and the center position C2 based on the image data acquired from the image processing device 25. The imaging control unit 31 calculates the amount of deviation between the center positions by dividing the calculated distance by the magnification.

  In step S9, the imaging control unit 31 determines whether or not the deviation amount calculated in step S8 is less than a preset threshold value. When the calculated shift amount is less than the threshold value (step S9, Yes), the adjustment control unit 33 determines that the shift between the center of the opening 19a and the center of the laser beam has been eliminated. Thereby, the laser processing apparatus 100 complete | finishes the adjustment by the operation | movement shown in FIG.

  When the calculated shift amount is equal to or greater than the threshold (No in step S9), the adjustment control unit 33 determines that the shift between the center of the opening 19a and the center of the laser beam has not been eliminated. In step S <b> 10, the adjustment control unit 33 calculates the movement amount of the collimator unit 12. The adjustment control unit 33 calculates a movement amount that can cancel out the deviation amount calculated in step S9. As shown in FIG. 7, when the center position C2 is shifted in the minus x direction and the minus y direction with respect to the center position C1, the adjustment control unit 33 increases the plus X direction and plus Y by a distance corresponding to the deviation amount. The amount of movement for moving the collimator unit 12 in the direction is calculated.

  In step S <b> 11, the lens driving unit 13 moves the collimator unit 12 according to the control by the adjustment control unit 33. The lens driving unit 13 moves the collimator unit 12 by the amount of movement calculated in step S10. In this way, the lens driving unit 13 corrects the deviation between the center of the opening 19a and the center of the laser beam based on the image data obtained by capturing the image of the opening 19a and the image of the irradiation region. Make adjustments for.

  After finishing the procedure of step S11, the laser processing apparatus 100 repeats the procedure from step S1. After the procedure from step S1 to step S11, the laser processing apparatus 100 may omit the procedure from step S1 to step S4. In step S8, the laser processing apparatus 100 may calculate the amount of deviation using the image 40 of the opening 19a that has already been captured.

  The laser processing apparatus 100 determines whether or not the deviation between the center of the opening 19a and the center of the laser beam has been eliminated by comparing the deviation amount and the threshold value in step S9. Accordingly, it is possible to determine how close the center of the laser beam is to the center of the opening 19a by the processing of the laser processing apparatus 100 regardless of the user's subjectivity, and whether or not the adjustment can be finished.

  The laser processing apparatus 100 may appropriately change the order of the steps shown in FIG. For example, the laser processing apparatus 100 may capture the image 40 of the opening 19a after capturing the image 41 of the irradiation region of the adjustment laser light.

  In the first embodiment, the condensing lens 17, the collimator unit 12, and the camera 23 are arranged on the optical axis of the processing head 14, so that the camera 23 always has the opening 19a at a fixed position. An image 40 can be acquired. The laser processing apparatus 100 has an optical path that is different from the optical path when processing with laser light is formed by using an optical element that can be inserted into and retracted from the optical path. It is possible to easily adjust the position of the laser beam at the nozzle 19 with high accuracy.

  The laser processing apparatus 100 is capable of adjusting the position of the laser beam in the nozzle 19 by adjusting the position of the collimator unit 12, so that the laser processing apparatus 100 is capable of adjusting the position of the laser beam as compared with the case where an optical element for adjusting the position of the laser beam is separately provided. The influence on the beam mode of light can be reduced. Further, the laser processing apparatus 100 can easily correct the deviation by adjusting the position of the collimator unit 12 even when the center of the laser beam from the center of the nozzle 19 is significantly displaced.

  According to the first embodiment, the laser processing apparatus 100 is provided with the beam splitter 15 at a position where the first optical path and the second optical path are branched, so that the condenser lens 17, the collimator unit 12, The camera 23 can be placed on the same optical axis. Since the laser processing apparatus 100 can always acquire the image 40 of the opening 19a at a fixed position, the laser beam position at the nozzle 19 can be easily adjusted with high accuracy. The laser processing apparatus 100 automatically adjusts the position of the laser beam, so that high-precision adjustment can be performed regardless of the operator's experience, and high-precision adjustment can be performed regardless of the trial and error of the operator. Can be easily performed. Thereby, the laser processing apparatus 100 has an effect that the position of the laser beam in the nozzle 19 can be adjusted with high accuracy.

Embodiment 2. FIG.
FIG. 8 is a diagram showing the configuration of the laser processing apparatus 101 according to the second embodiment of the present invention. The laser processing apparatus 101 according to the second embodiment makes it possible to adjust the position of the laser beam by using the processing laser beam instead of the adjustment laser beam according to the first embodiment. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the configuration different from the first embodiment will be mainly described.

  The laser processing apparatus 101 according to the second embodiment is provided with a switching unit 60 in addition to the units included in the laser processing apparatus 100 according to the first embodiment. The switching unit 60 switches the laser beam used for adjusting the position of the laser beam between a first laser beam that is a processing laser beam and a second laser beam that is an adjustment laser beam. As the processing laser light used for the adjustment, low-intensity laser light is used in the intensity range of the processing laser light used for processing by the laser processing apparatus 101. The low-intensity laser beam is a laser beam having an intensity capable of processing a material such as acrylic that can be easily processed by laser energy. In the second embodiment, the workpiece 20 made of a material such as acrylic is used for adjusting the position of the laser beam.

  Next, the operation of the laser processing apparatus 101 will be described. FIG. 9 is a flowchart showing a procedure of operations performed by the laser processing apparatus 101 shown in FIG. FIG. 9 shows an operation procedure when the laser processing apparatus 101 adjusts the position of the laser beam in the nozzle 19.

  In step S <b> 21, the laser processing apparatus 101 selects a laser beam to be used for adjustment from two laser beams for adjustment and processing. The laser beam is selected based on an operation on the switching unit 60 by the user. FIG. 9 illustrates the operation when the processing laser beam is selected in step S21. The operation when the processing laser beam is selected in step S21 is the same as the operation in the first embodiment.

  In step S <b> 22, the lens driving unit 18 moves the condenser lens 17. The lens driving unit 18 adjusts the focal point of the condensing lens 17 to the position of the opening 19a by moving the holder 16 according to the control by the condensing control unit 32. In step S23, the illumination unit 24 emits illumination light. In step S24, the camera 23 images the opening 19a. The image processing device 25 obtains xy coordinates indicating the center position of the image of the opening 19a.

  In step S25, the laser oscillation control unit 34 sets the laser light oscillation conditions. The laser oscillation control unit 34 sets an oscillation condition so that the laser beam to be oscillated becomes the above-described low-intensity laser beam in accordance with the selection of the processing laser beam in step S21. In step S <b> 26, the lens driving unit 18 moves the condenser lens 17. The table driving unit 22 moves the table 21. The lens driving unit 18 moves the holder 16 according to the control by the condensing control unit 32 to adjust the focusing point of the condensing lens 17 to the workpiece 20.

  In step S27, the laser oscillator 10 oscillates a processing laser beam. In the laser oscillator 10, the laser oscillation control unit 34 controls the laser oscillator 10 according to the oscillation condition set in step S25. The workpiece 20 is processed by being irradiated with a processing laser beam. When the workpiece 20 is processed, the laser oscillator 10 stops the oscillation of the processing laser light according to the control by the laser oscillation control unit 34.

  In step S <b> 28, the camera 23 images a processing area formed on the workpiece 20. The processing region is irradiated with illumination light emitted from the illumination unit 24. The camera 23 captures the illumination light reflected by the workpiece 20 and captures an image of the processing area. Thus, in step S <b> 27, the camera 23 images a processing area corresponding to the irradiation area of the processing laser light when the processing laser light is incident on the workpiece 20. The image processing device 25 obtains xy coordinates indicating the center position of the image of the processing area based on the image signal output by the camera 23.

  In step S29, the imaging control unit 31 calculates a deviation amount of the center position of the processing area from the center position of the opening 19a. In step S30, the imaging control unit 31 determines whether or not the deviation amount calculated in step S29 is less than a preset threshold value. When the calculated shift amount is less than the threshold value (Yes in step S30), the adjustment control unit 33 determines that the shift between the center of the opening 19a and the center of the laser beam has been eliminated. Thereby, the laser processing apparatus 100 complete | finishes the adjustment by the operation | movement shown in FIG.

  When the calculated shift amount is equal to or greater than the threshold (No at Step S30), the adjustment control unit 33 determines that the shift between the center of the opening 19a and the center of the laser beam has not been eliminated. The adjustment control unit 33 calculates the movement amount of the collimator unit 12. In step S31, the adjustment control unit 33 calculates a movement amount that can cancel out the deviation amount calculated in step S29.

  In step S <b> 32, the lens driving unit 13 moves the collimator unit 12 according to the control by the adjustment control unit 33. The lens driving unit 13 moves the collimator unit 12 by the amount of movement calculated in step S31. When the procedure of step S32 is completed, the laser processing apparatus 101 repeats the procedure from step S21. After the procedure from step S21 to step S32, the laser processing apparatus 101 may omit the procedure from step S21 to step S25. In step S29, the laser processing apparatus 101 may calculate the shift amount using the image of the opening 19a that has already been captured.

  Also in the second embodiment, the laser processing apparatus 101 has an effect that the position of the laser beam in the nozzle 19 can be adjusted with high accuracy, as in the first embodiment. The laser processing apparatus 101 may have a configuration in which the switching unit 60 is omitted. The laser processing apparatus 101 may be one that can use only the processing laser light in adjusting the position of the laser light.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

  DESCRIPTION OF SYMBOLS 10 Laser oscillator, 11 Fiber cable, 11a Output end, 12 Collimator unit, 13, 18 Lens drive part, 14 Processing head, 14a End part, 15 Beam splitter, 16 Holder, 17 Condensing lens, 19 Nozzle, 19a Opening part, 20 Workpieces, 21 Table, 22 Table Drive Unit, 23 Camera, 24 Illumination Unit, 25 Image Processing Device, 26 Control Device, 31 Imaging Control Unit, 32 Condensing Control Unit, 33 Adjustment Control Unit, 34 Laser Oscillation Control Unit , 35 table control unit, 40, 41 image, 51 processing circuit, 53 processor, 54 memory, 60 switching unit, 100, 101 laser processing apparatus.

Claims (8)

A laser oscillator that oscillates laser light;
A condensing optical system for condensing the laser light;
A nozzle having an opening for emitting the laser light that has passed through the condensing optical system toward a workpiece;
An imaging unit for imaging the opening and an irradiation area of the laser beam in the workpiece;
An optical branching element that reflects the first incident light incident from the laser oscillator toward the workpiece and transmits the second incident light incident from the workpiece to be incident on the imaging unit. When,
An adjustment unit that performs adjustment to correct a deviation between the center of the opening and the center of the laser beam based on image data obtained by imaging the opening and the irradiation region;
A laser processing apparatus comprising: A collimating optical system for collimating the laser light from the laser oscillator;
The laser processing apparatus according to claim 1, wherein the adjustment unit performs the adjustment by moving the collimating optical system. An illumination unit that irradiates illumination light inside the nozzle;
The laser processing apparatus according to claim 1, wherein the imaging unit images the opening when the illumination light is irradiated. The laser oscillator oscillates the laser light having a first wavelength,
The illumination unit emits the illumination light having a second wavelength,
4. The optical branching element according to claim 3, wherein a part of the laser light having the first wavelength is reflected, the other part is transmitted, and the illumination light having the second wavelength is transmitted. The laser processing apparatus as described. The laser oscillator oscillates a first laser beam that is a laser beam capable of processing the workpiece,
The imaging unit images a processing region corresponding to an irradiation region of the first laser light when the first laser light is incident on the workpiece. The laser processing apparatus as described in any one of these. The laser oscillator oscillates a second laser beam that is a laser beam other than a laser beam capable of processing the workpiece,
5. The imaging device according to claim 1, wherein the imaging unit images an irradiation region of the second laser light when the workpiece is irradiated with the second laser light. The laser processing apparatus as described in. An adjustment control unit for controlling the adjustment by the adjustment unit;
7. The adjustment control unit according to claim 1, wherein the adjustment control unit ends the adjustment by the adjustment unit when a deviation amount between the center of the opening and the center of the laser beam is less than a threshold value. The laser processing apparatus as described in any one. A laser oscillator that oscillates laser light;
A condensing optical system that condenses the laser light traveling in the first optical path from the laser oscillator;
A nozzle having an opening that emits the laser light that has passed through the condensing optical system toward a workpiece, and an adjustment method for a laser processing apparatus,
Irradiating illumination light into the nozzle, and imaging the opening by an imaging unit provided in a second optical path branched from the first optical path;
Imaging the laser beam irradiation area of the workpiece by the imaging unit;
A step of performing adjustment for correcting a deviation between the center of the opening and the center of the laser beam based on image data obtained by imaging the opening and the irradiation region;
A method for adjusting a laser processing apparatus, comprising:

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