JP2019149530A - Multilayer capacitor - Google Patents

Abstract

To provide a multilayer capacitor which can control an equivalent serial resistance, and can improve reliability.SOLUTION: A multilayer capacitor 1 comprises: an element assembly 2; a part of external electrodes 3 and 4; a pair of connection conductors 5 and 6; and a plurality of inner electrodes. The plurality of inner electrodes includes: a first inner electrode 10; a second inner electrode 12; a third inner electrode 14; a fourth inner electrode 16; and a fifth inner electrode 18. The multilayer capacitor is structured so that the third, fourth, and fifth inner electrodes 14, 16, and 18 are arranged opposite to a lamination direction of a dielectric layer 7, and thereby two capacitor components are serially connected. The first and fourth inner electrodes 10 and 16 are not arranged opposite to the lamination direction, and the second and third inner electrodes 12 and 14 are not arranged opposite to the lamination direction.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a multilayer capacitor.

  As a conventional multilayer capacitor, for example, a capacitor described in Patent Document 1 is known. The multilayer capacitor described in Patent Document 1 includes an element body in which a plurality of dielectric layers are laminated, first and second terminal electrodes, and first and second external connection conductors disposed on an outer surface of the element body. A capacitance part having a first internal electrode connected to the first external connection conductor and a second internal electrode connected to the second external connection conductor, a first terminal electrode and the first external connection A first internal connection conductor connected to the conductor; a second internal connection conductor connected to the second terminal electrode and the second external connection conductor; and the first internal connection in the stacking direction of the plurality of dielectric layers. Each having a first external connection conductor or a third internal electrode connected to the second external connection conductor and having a capacitance portion in the stacking direction. Multiple equivalent series resistance controls placed apart from each other It has a, and.

JP 2013-235975 A

  An object of one aspect of the present invention is to provide a multilayer capacitor capable of controlling an equivalent series resistance and improving reliability.

  A multilayer capacitor according to an aspect of the present invention includes an element body formed by laminating a plurality of dielectric layers, a pair of external electrodes disposed on an outer surface of the element body, and an element body. A pair of connection conductors and a plurality of internal electrodes arranged in the element body, the plurality of internal electrodes being connected to one external electrode and one connection conductor; A second internal electrode connected to the other external electrode and the other connection conductor; a third internal electrode connected to the one connection conductor; a fourth internal electrode connected to the other connection conductor; A fifth internal electrode not connected to the pair of external electrodes and the pair of connection conductors, and the third internal electrode, the fourth internal electrode, and the fifth internal electrode face each other in the stacking direction of the dielectric layers. The two capacitor components are connected in series. The first internal electrode and the fourth internal electrode are not arranged to oppose each other in the stacking direction, and the second internal electrode and the third internal electrode are opposed to each other in the stacking direction. Not placed.

  In the multilayer capacitor according to one aspect of the present invention, the third internal electrode, the fourth internal electrode, and the fifth internal electrode are arranged to face each other in the stacking direction of the dielectric layer, so that two capacitor components are formed. It has the structure connected in series. Further, the first internal electrode and the fourth internal electrode are not arranged to face each other, and the second internal electrode and the third internal electrode are not arranged to face each other. Therefore, the multilayer capacitor can be configured such that two capacitor components are electrically connected in series in a path (shortest path) between one polarity and the other polarity. With this configuration, in the multilayer capacitor, even if a malfunction occurs in one capacitor component, the other capacitor component functions normally. Therefore, since the multilayer capacitor employs a fail-safe structure, the reliability can be improved. In the multilayer capacitor, the first internal electrode and the second internal electrode constitute equivalent series resistance (hereinafter referred to as ESR). In the multilayer capacitor, the ESR can be controlled by changing the structure of the first internal electrode and the second internal electrode and / or the number of stacked layers.

  In one embodiment, the first internal electrode and the second internal electrode may be disposed on the same dielectric layer. With this configuration, it is possible to reduce the number of stacked dielectric layers in the element body while realizing a configuration in which two capacitor components are connected in series. Therefore, it is possible to reduce the height of the multilayer capacitor.

  In one embodiment, the first internal electrode and the second internal electrode may be disposed in different dielectric layers. In this configuration, the degree of freedom in designing the electrode shape is increased in each of the first internal electrode and the second internal electrode. Therefore, ESR can be controlled in the multilayer capacitor.

  In one embodiment, the third internal electrode and the fourth internal electrode may not be arranged to face each other in the stacking direction. In this configuration, since the third internal electrode connected to one polarity and the fourth internal electrode connected to the other polarity do not face each other, a capacitor component is not formed by the third internal electrode and the fourth internal electrode. Therefore, in the multilayer capacitor, it is possible to reliably realize a structure in which two capacitor components are electrically connected in series.

  In one embodiment, the first internal electrode and the second internal electrode may not be disposed to face each other in the stacking direction. In this configuration, since the first internal electrode connected to one polarity and the second internal electrode connected to the other polarity do not face each other, a capacitor component is not formed by the first internal electrode and the second internal electrode. Therefore, in the multilayer capacitor, it is possible to reliably realize a structure in which two capacitor components are electrically connected in series.

  According to one aspect of the present invention, ESR can be controlled and reliability can be improved.

FIG. 1 is a perspective view showing the multilayer capacitor mounting structure according to the first embodiment. FIG. 2 is an exploded perspective view of the element body. FIG. 3A is a diagram showing the first internal electrode, and FIG. 3B is a diagram showing the second internal electrode. FIG. 4A is a diagram showing the third internal electrode and the fourth internal electrode, and FIG. 4B is a diagram showing the fifth internal electrode. FIG. 5 is a diagram showing a circuit configuration of the multilayer capacitor shown in FIG. FIG. 6 is an exploded perspective view of an element body of the multilayer capacitor in accordance with the second embodiment. FIG. 7 is a diagram showing a circuit configuration of the multilayer capacitor shown in FIG. FIG. 8 is an exploded perspective view of an element body of the multilayer capacitor in accordance with the third embodiment. FIG. 9 is a diagram showing a circuit configuration of the multilayer capacitor shown in FIG. FIG. 10 is an exploded perspective view of an element body of the multilayer capacitor in accordance with the fourth embodiment. FIG. 11 is a diagram showing a circuit configuration of the multilayer capacitor shown in FIG. FIG. 12 is an exploded perspective view of an element body of the multilayer capacitor in accordance with the fifth embodiment. FIG. 13A is a diagram showing the first internal electrode arranged in the element body shown in FIG. 12, and FIG. 13B is a diagram showing the second internal electrode arranged in the element body shown in FIG. It is a figure which shows an internal electrode. FIG. 14 is a diagram showing a circuit configuration of the multilayer capacitor shown in FIG.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

[First Embodiment]
As shown in FIG. 1, the multilayer capacitor 1 according to the first embodiment includes an element body 2, a first external electrode 3, a second external electrode 4 disposed on the outer surface of the element body 2, and an element body. 2, and a first connection conductor 5 and a second connection conductor 6 disposed on the outer surface.

  The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded. The element body 2 has, as its outer surface, a pair of end surfaces 2a and 2b facing each other, a pair of main surfaces 2c and 2d facing each other, a pair of side surfaces 2e and 2f facing each other, have. The facing direction in which the pair of main surfaces 2c and 2d are facing each other is the first direction D1. The facing direction in which the pair of end faces 2a and 2b are facing is the second direction D2. A facing direction in which the pair of side surfaces 2e and 2f are facing each other is a third direction D3. In the present embodiment, the first direction D1 is the height direction of the element body 2. The second direction D2 is the longitudinal direction of the element body 2 and is orthogonal to the first direction D1. The third direction D3 is the width direction of the element body 2 and is orthogonal to the first direction D1 and the second direction D2.

  The pair of end surfaces 2a and 2b extend in the first direction D1 so as to connect the pair of main surfaces 2c and 2d. The pair of end surfaces 2a and 2b also extend in the third direction D3 (the short side direction of the pair of main surfaces 2c and 2d). The pair of side surfaces 2e and 2f extends in the first direction D1 so as to connect the pair of main surfaces 2c and 2d. The pair of side surfaces 2e and 2f also extend in the second direction D2 (the long side direction of the pair of end surfaces 2a and 2b). In the present embodiment, the main surface 2d is defined as a mounting surface facing the other electronic device when the multilayer capacitor 1 is mounted on another electronic device (for example, a circuit board or an electronic component).

As shown in FIG. 2, the element body 2 is configured by laminating a plurality of dielectric layers 7 in a direction in which a pair of main surfaces 2 c and 2 d face each other. In the element body 2, the stacking direction of the plurality of dielectric layers 7 (hereinafter simply referred to as “stacking direction”) coincides with the first direction D <b> 1. Each dielectric layer 7 is a sintered body of a ceramic green sheet containing a dielectric material (dielectric ceramic such as BaTiO ₃ series, Ba (Ti, Zr) O ₃ series, or (Ba, Ca) TiO ₃ series), for example. Consists of In the actual element body 2, the dielectric layers 7 are integrated so that the boundary between the dielectric layers 7 is not visible.

  The multilayer capacitor 1 includes a first internal electrode 10, a second internal electrode 12, a third internal electrode 14, a fourth internal electrode 16, and a fifth internal electrode as internal conductors disposed in the element body 2. 18.

  The first internal electrode 10, the second internal electrode 12, the third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18 are electrically conductive materials (for example, Ni Or Cu). The 1st internal electrode 10, the 2nd internal electrode 12, the 3rd internal electrode 14, the 4th internal electrode 16, and the 5th internal electrode 18 are comprised as a sintered compact of the electrically conductive paste containing the said electrically conductive material.

  The first internal electrode 10, the second internal electrode 12, the third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18 are at different positions (layers) in the first direction D1 of the element body 2. Has been placed. The third internal electrode 14 and the fourth internal electrode 16 are arranged at the same position (layer) in the element body 2.

  As shown in FIG. 3A, the first internal electrode 10 includes a main electrode portion 10a, a first connection portion 10b, a second connection portion 10c, and a third connection portion 10d. . The main electrode portion 10a has a rectangular shape in which the second direction D2 is the long side direction and the third direction D3 is the short side direction. The first connection portion 10b has a rectangular shape in which the third direction D3 is the long side direction and the second direction D2 is the short side direction. The 1st connection part 10b is exposed to one end surface 2a. The second connection portion 10c extends from one side (one long side) of the main electrode portion 10a and is exposed on one side surface 2e. The third connection portion 10d connects one side (one short side) of the main electrode portion 10a and one side (one long side) of the first connection portion 10b. The first internal electrode 10 has a first connection portion 10b exposed at one end surface 2a joined to the first external electrode 3, and a second connection portion 10c exposed at one side surface 2e as a first connection conductor 5. It is joined to. The first internal electrode is electrically connected to the first external electrode 3 and the first connection conductor 5.

  As shown in FIG. 3B, the second internal electrode 12 has a main electrode portion 12a, a first connection portion 12b, a second connection portion 12c, and a third connection portion 12d. . The main electrode portion 12a has a rectangular shape in which the second direction D2 is the long side direction and the third direction D3 is the short side direction. The first connection portion 12b has a rectangular shape in which the third direction D3 is the long side direction and the second direction D2 is the short side direction. The 1st connection part 12b is exposed to the other end surface 2b. The second connection portion 12c extends from one side (one long side) of the main electrode portion 12a and is exposed on the other side surface 2f. The third connection portion 12d connects one side (one short side) of the main electrode portion 12a and one side (one long side) of the first connection portion 12b. In the second internal electrode 12, the first connection portion 12b exposed at the other end surface 2b is joined to the second external electrode 4, and the second connection portion 12c exposed at the other side surface 2f is the second connection conductor 6. It is joined to. The second internal electrode 12 is electrically connected to the second external electrode 4 and the second connection conductor 6.

  As shown in FIG. 4A, the third internal electrode 14 has a main electrode portion 14a and a connection portion 14b. The main electrode portion 14a has a rectangular shape in which the second direction D2 is the long side direction and the third direction D3 is the short side direction. The connection portion 14b extends from one side (one long side) of the main electrode portion 14a and is exposed on one side surface 2e. In the third internal electrode 14, a connection portion 14 b exposed on one side surface 2 e is joined to the first connection conductor 5. The third internal electrode 14 is electrically connected to the first connection conductor 5.

  The fourth internal electrode 16 has a main electrode portion 16a and a connection portion 16b. The main electrode portion 16a has a rectangular shape in which the second direction D2 is the long side direction and the third direction D3 is the short side direction. The connection portion 16b extends from one side (one long side) of the main electrode portion 16a and is exposed on the other side surface 2f. In the fourth internal electrode 16, the connection portion 16 b exposed on the other side surface 2 f is joined to the second connection conductor 6. The fourth internal electrode 16 is electrically connected to the second connection conductor 6. The third internal electrode 14 and the fourth internal electrode 16 are disposed in the same dielectric layer 7 with a predetermined interval in the third direction D3.

  The fifth internal electrode 18 has a rectangular shape in which the second direction D2 is the long side direction and the third direction D3 is the short side direction. The fifth internal electrode 18 is not joined to any of the first external electrode 3, the second external electrode 4, the first connection conductor 5, and the second connection conductor 6.

  As shown in FIG. 1, the first external electrode 3 is disposed on the one end face 2a side. In the present embodiment, the first external electrode 3 is formed on the five surfaces of one end surface 2a, a pair of main surfaces 2c, 2d, and a pair of side surfaces 2e, 2f. The first external electrode 3 is joined to the first internal electrode 10 and is electrically connected to the first internal electrode 10.

  The second external electrode 4 is disposed on the other end face 2b side. In the present embodiment, the second external electrode 4 is formed on the five surfaces of one end surface 2b, a pair of main surfaces 2c, 2d, and a pair of side surfaces 2e, 2f. The second external electrode 4 is joined to the second internal electrode 12 and is electrically connected to the second internal electrode 12.

  The first connection conductor 5 is disposed at the central portion in the second direction D2 on the side surface 2e side. In the present embodiment, the first connection conductor 5 is formed on the three surfaces of the pair of main surfaces 2c, 2d and one side surface 2e. The first connection conductor 5 is joined to the first internal electrode 10 and the third internal electrode 14, and is electrically connected to the first internal electrode 10 and the third internal electrode 14. That is, the first internal electrode 10 and the third internal electrode 14 are electrically connected via the first connection conductor 5.

  The second connection conductor 6 is disposed at the central portion in the second direction D2 on the other side surface 2f side. The second connection conductor 6 is formed on three surfaces of a pair of main surfaces 2c and 2d and one side surface 2f. The second connection conductor 6 is joined to the second internal electrode 12 and the fourth internal electrode 16, and is electrically connected to the second internal electrode 12 and the fourth internal electrode 16. That is, the second internal electrode 12 and the fourth internal electrode 16 are electrically connected via the second connection conductor 6.

  The first external electrode 3, the second external electrode 4, the first connection conductor 5, and the second connection conductor 6 include a conductive material (for example, Ag or Pd). The first external electrode 3, the second external electrode 4, the first connection conductor 5 and the second connection conductor 6 are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). The A plating layer is formed on the surfaces of the first external electrode 3, the second external electrode 4, the first connection conductor 5 and the second connection conductor 6. The plating layer is formed by, for example, electroplating. The plating layer has a layer structure including a Cu plating layer, a Ni plating layer, and a Sn plating layer, or a layer structure including a Ni plating layer and a Sn plating layer.

  In the present embodiment, the first internal electrode 10 is disposed on the one main surface 2 c side in the first direction D <b> 1 of the element body 2. The second internal electrode 12 is disposed on the other main surface 2d side in the first direction D1 of the element body 2. The third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18 are disposed between the first internal electrode 10 and the second internal electrode 12. The third internal electrode 14 and the fourth internal electrode 16 are disposed between the fifth internal electrodes 18. That is, in the element body 2, the first internal electrode 10, the fifth internal electrode 18, the third internal electrode 14, and the fourth internal electrode 16, from one main surface 2 c side to the other main surface 2 d side, The fifth internal electrode 18 and the second internal electrode 12 are arranged in this order.

  In the multilayer capacitor 1, the third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18 are disposed to face each other with the dielectric layer 7 interposed therebetween. The main electrode portion 10 a of the first internal electrode 10 and the fifth internal electrode 18 are disposed to face each other with the dielectric layer 7 interposed therebetween. The main electrode portion 12a of the second internal electrode 12 and the fifth internal electrode 18 are disposed to face each other with the dielectric layer 7 in between.

  In the multilayer capacitor 1, the first internal electrode 10 and the fourth internal electrode 16 are not disposed to face each other in the first direction D <b> 1 (lamination direction). That is, the first internal electrode 10 electrically connected to one polarity and the fourth internal electrode 16 electrically connected to the other polarity do not overlap each other when viewed from the first direction D1. In the multilayer capacitor 1, the second internal electrode 12 and the third internal electrode 14 are not disposed to face each other in the first direction D1. That is, the second internal electrode 12 electrically connected to the other polarity and the third internal electrode 14 electrically connected to the one polarity do not overlap each other when viewed from the first direction D1.

  In the multilayer capacitor 1, the first internal electrode 10 and the third internal electrode 14 are disposed to face each other in the first direction D1. Specifically, the main electrode portion 10a of the first internal electrode 10 and the main electrode portion 14a of the third internal electrode 14 face each other. That is, the first internal electrode 10 electrically connected to one polarity and the third internal electrode 14 electrically connected to one polarity overlap each other when viewed from the first direction D1. In the multilayer capacitor 1, the second internal electrode 12 and the fourth internal electrode 16 are disposed to face each other in the first direction D1. Specifically, the main electrode portion 12a of the second internal electrode 12 and the main electrode portion 16a of the fourth internal electrode 16 face each other. That is, the second internal electrode 12 electrically connected to the other polarity and the fourth internal electrode 16 electrically connected to the other polarity overlap each other when viewed from the first direction D1.

  In the multilayer capacitor 1, a capacitor component is formed by the third internal electrode 14 and the fifth internal electrode 18, and a capacitor component is formed by the fourth internal electrode 16 and the fifth internal electrode 18. In the present embodiment, a capacitor component is substantially formed by the first internal electrode 10 and the fifth internal electrode 18, and a capacitor component is substantially formed by the second internal electrode 12 and the fifth internal electrode 18. Is formed. The first internal electrode 10 and the second internal electrode 12 function as an ESR (Equivalent Series Resistance) control unit.

  As shown in FIG. 1, in the mounting structure 100 of the multilayer capacitor 1, the multilayer capacitor 1 is mounted on an electronic device with the main surface 2d as a mounting surface. When the multilayer capacitor 1 is mounted so that the main surface 2d of the element body 2 faces the circuit board S, the first external electrode 3 and the second external electrode 4 are connected to the land electrodes L1, L2 arranged on the circuit board S. Connect to. Specifically, the first external electrode 3 is connected to the land electrode L1, and the second external electrode 4 is connected to the land electrode L2. The first connection conductor 5 and the second connection conductor 6 are not connected to the land electrodes arranged on the circuit board S.

  The land electrodes L1 and L2 are connected to wiring formed on the circuit board S. Specifically, the land electrode L1 is electrically connected to a wiring connected to one polarity (for example, positive electrode). The land electrode L2 is electrically connected to a wiring connected to the other polarity (for example, negative electrode). In the mounting structure 100, only the first external electrode 3 and the second external electrode 4 are electrically connected to the wiring, and the first connection conductor 5 and the second connection conductor 6 are not electrically connected to the wiring. . The first connection conductor 5 and the second connection conductor 6 may be connected to the land electrodes as long as they are land electrodes that are electrically insulated from the wiring.

  As shown in FIG. 5, the multilayer capacitor 1 mounted on the circuit board S has a configuration in which two capacitor components are electrically connected in series. Specifically, the capacitor component formed by the third internal electrode 14 and the fifth internal electrode 18 and the capacitor component formed by the fourth internal electrode 16 and the fifth internal electrode 18 are electrically connected in series. It is connected to the. In FIG. 5, “black circle” indicates that it is connected to one polarity (for example, “positive electrode”), and “white circle” indicates that it is connected to the other polarity (for example, “negative electrode”).

  As described above, in the multilayer capacitor 1 according to the present embodiment, the third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18 are arranged to face each other in the first direction D1 (lamination direction). As a result, two capacitor components are connected in series. In the multilayer capacitor 1, the first internal electrode 10 and the fourth internal electrode 16 are not disposed to face each other, and the second internal electrode 12 and the third internal electrode 14 are not disposed to face each other. Therefore, the multilayer capacitor 1 can be configured such that two capacitor components are electrically connected in series in a path (shortest path) between one polarity and the other polarity. With this configuration, in the multilayer capacitor 1, even if one capacitor component is defective, the other capacitor component functions normally. Therefore, since the multilayer capacitor 1 employs a fail-safe structure, the reliability can be improved.

  In the multilayer capacitor 1 according to this embodiment, the first internal electrode 10 and the second internal electrode 12 constitute an ESR. In the multilayer capacitor 1, ESR can be controlled by changing the structure and / or the number of layers of the first internal electrode 10 and the second internal electrode 12.

  In the multilayer capacitor 1 according to this embodiment, the first internal electrode 10 and the second internal electrode 12 are arranged in different dielectric layers 7. In this configuration, the degree of freedom in designing the electrode shape increases in each of the first internal electrode 10 and the second internal electrode 12. Therefore, the multilayer capacitor 1 can control ESR.

  In the multilayer capacitor 1 according to the present embodiment, the third internal electrode 14 and the fourth internal electrode 16 are not disposed to face each other in the first direction D1. In this configuration, since the third internal electrode 14 connected to one polarity and the fourth internal electrode 16 connected to the other polarity do not face each other, the capacitor component by the third internal electrode 14 and the fourth internal electrode 16 Is not formed. Therefore, the multilayer capacitor 1 can reliably realize a structure in which two capacitor components are electrically connected in series.

  In the multilayer capacitor 1 according to this embodiment, the first internal electrode 10 and the second internal electrode 12 are not disposed to face each other in the first direction D1. In this configuration, since the first internal electrode 10 connected to one polarity and the second internal electrode 12 connected to the other polarity do not face each other, the capacitor component by the first internal electrode 10 and the second internal electrode 12 Is not formed. Therefore, the multilayer capacitor 1 can reliably realize a structure in which two capacitor components are electrically connected in series.

[Second Embodiment]
Next, the second embodiment will be described. As shown in FIG. 6, the multilayer capacitor 1A according to the second embodiment includes a first internal electrode 10, a second internal electrode 12, and a third internal electrode as internal conductors arranged in the element body 2A. 14, a fourth internal electrode 16, and a fifth internal electrode 18.

  In the multilayer capacitor 1A, the third internal electrode 14, the fourth internal electrode 16, the fifth internal electrode 18, the first internal electrode 10, the fifth internal electrode 18, from one main surface 2c toward the other main surface 2d, The second internal electrode 12, the fifth internal electrode 18, the third internal electrode 14, and the fourth internal electrode 16 are arranged in this order.

  As shown in FIG. 7, the multilayer capacitor 1A has a configuration in which two capacitor components are electrically connected in series. Specifically, the capacitor component formed by the third internal electrode 14 and the fifth internal electrode 18 and the capacitor component formed by the fourth internal electrode 16 and the fifth internal electrode 18 are electrically connected in series. It is connected to the.

  As described above, also in the multilayer capacitor 1A according to this embodiment, the ESR can be controlled and the reliability can be improved.

[Third Embodiment]
Subsequently, the third embodiment will be described. As shown in FIG. 8, the multilayer capacitor 1 </ b> B according to the third embodiment includes a first internal electrode 10, a second internal electrode 12, and a third internal electrode as internal conductors arranged in the element body 2 </ b> B. 14, a fourth internal electrode 16, and a fifth internal electrode 18.

  In the multilayer capacitor 1B, the first internal electrode 10, the third internal electrode 14, the fourth internal electrode 16, the fifth internal electrode 18, the third internal electrode 14, and the like from the one main surface 2c to the other main surface 2d. The fourth internal electrode 16, the fifth internal electrode 18, the third internal electrode 14, the fourth internal electrode 16, and the second internal electrode 12 are arranged in this order.

  As shown in FIG. 9, the multilayer capacitor 1B has a configuration in which two capacitor components are electrically connected in series. Specifically, the capacitor component formed by the third internal electrode 14 and the fifth internal electrode 18 and the capacitor component formed by the fourth internal electrode 16 and the fifth internal electrode 18 are electrically connected in series. It is connected to the.

  As described above, also in the multilayer capacitor 1B according to the present embodiment, the ESR can be controlled and the reliability can be improved.

[Fourth Embodiment]
Subsequently, a fourth embodiment will be described. As shown in FIG. 10, the multilayer capacitor 1C according to the fourth embodiment includes a first internal electrode 10, a second internal electrode 12, and a third internal electrode as internal conductors arranged in the element body 2C. 14, a fourth internal electrode 16, and a fifth internal electrode 18.

  As shown in FIG. 10, the first internal electrode 10 and the second internal electrode 12 are disposed on the same dielectric layer 7. In the multilayer capacitor 1C, the first internal electrode 10, the second internal electrode 12, the fifth internal electrode 18, the third internal electrode 14, and the fourth internal electrode 16, from one main surface 2c to the other main surface 2d, The fifth internal electrode 18, the third internal electrode 14 and the fourth internal electrode 16, the fifth internal electrode 18, the third internal electrode 14 and the fourth internal electrode 16, the fifth internal electrode 18, the third internal electrode 14 and the fourth internal electrode The internal electrode 16, the fifth internal electrode 18, and the first internal electrode 10 and the second internal electrode 12 are arranged in this order.

  As shown in FIG. 11, the multilayer capacitor 1 </ b> C has a configuration in which two capacitor components are electrically connected in series. Specifically, the capacitor component formed by the third internal electrode 14 and the fifth internal electrode 18 and the capacitor component formed by the fourth internal electrode 16 and the fifth internal electrode 18 are electrically connected in series. It is connected to the.

  As described above, also in the multilayer capacitor 1C according to the present embodiment, the ESR can be controlled and the reliability can be improved.

  In the multilayer capacitor 1 </ b> C according to this embodiment, the first internal electrode 10 and the second internal electrode 12 are disposed on the same dielectric layer 7. With this configuration, the number of stacked dielectric layers 7 in the element body 2 can be reduced while realizing a configuration in which two capacitor components are connected in series. Therefore, it is possible to reduce the height of the multilayer capacitor 1C.

[Fifth Embodiment]
Subsequently, a fifth embodiment will be described. As shown in FIG. 12, the multilayer capacitor 1D includes a first internal electrode 20, a second internal electrode 22, a third internal electrode 14, and a fourth internal electrode as internal conductors arranged in the element body 2D. An electrode 16 and a fifth internal electrode 18 are provided.

  As shown in FIG. 13A, the first internal electrode 20 has a main electrode portion 20a, a first connection portion 20b, and a second connection portion 20c. The main electrode portion 20a has a strip-shaped first portion extending in the second direction D2, and a strip-shaped portion extending along the third direction D3 from the end portion on the end surface 2b side of the first portion toward the side surface 2e. A second portion; and a belt-like third portion extending along the second direction D2 from the end portion of the second portion on the side surface 2e side toward the end surface 2a side.

  The first connection portion 20b extends from the end portion on the end surface 2a side of the first portion of the main electrode portion 20a, and is exposed on one end surface 2a. The second connection portion 20c extends from the third portion of the main electrode portion 20a and is exposed on one side surface 2e. The first internal electrode 20 has a first connection portion 20b exposed at one end surface 2a joined to the first external electrode 3, and a second connection portion 20c exposed at one side surface 2e as the first connection conductor 5. It is joined to. The first internal electrode 20 is electrically connected to the first external electrode 3 and the first connection conductor 5.

  As shown in FIG. 13B, the second internal electrode 22 has a main electrode portion 22a, a first connection portion 22b, and a second connection portion 22c. The main electrode portion 22a has a strip-shaped first portion extending in the second direction D2, and a strip-shaped portion extending in the third direction D3 from the end portion on the end surface 2a side of the first portion toward the side surface 2f. A second portion, and a belt-like third portion extending along the second direction D2 from the end portion of the second portion on the side surface 2f side toward the end surface 2b side.

  The first connection portion 22b extends from the end portion on the end surface 2b side of the first portion of the main electrode portion 22a, and is exposed on the other end surface 2b. The second connection portion 22c extends from the third portion of the main electrode portion 22a and is exposed on the other side surface 2f. In the second internal electrode 22, the first connection portion 22b exposed on the other end surface 2b is joined to the second external electrode 4, and the second connection portion 22c exposed on the other side surface 2f is the second connection conductor 6. It is joined to. The second internal electrode 22 is electrically connected to the second external electrode 4 and the second connection conductor 6.

  As shown in FIG. 12, in the multilayer capacitor 1D, the first internal electrode 20, the first internal electrode 20, the fifth internal electrode 18, the third internal electrode are directed from one main surface 2c to the other main surface 2d. 14 and the fourth internal electrode 16, the fifth internal electrode 18, the third internal electrode 14 and the fourth internal electrode 16, the fifth internal electrode 18, the third internal electrode 14 and the fourth internal electrode 16, the fifth internal electrode 18, The third internal electrode 14, the fourth internal electrode 16, the fifth internal electrode 18, and the second internal electrode 22 are arranged in this order.

  As shown in FIG. 14, the multilayer capacitor 1 </ b> D has a configuration in which two capacitor components are electrically connected in series. Specifically, the capacitor component formed by the third internal electrode 14 and the fifth internal electrode 18 and the capacitor component formed by the fourth internal electrode 16 and the fifth internal electrode 18 are electrically connected in series. It is connected to the.

  As described above, also in the multilayer capacitor 1D according to this embodiment, the ESR can be controlled and the reliability can be improved.

  In the multilayer capacitor 1D according to this embodiment, the first internal electrode 20 has a main electrode portion 20a having three strip-shaped portions, and the second internal electrode 22 is a main electrode having three strip-shaped portions. It has a portion 22a. With this configuration, the length (line length) is secured in the first internal electrode 20 and the second internal electrode 22. Thereby, in the multilayer capacitor 1D, ESR can be increased. Thus, in the multilayer capacitor 1D, by arranging the first internal electrode 20 and the second internal electrode 22 in different dielectric layers 7, the degree of freedom in designing the electrode shape can be increased, and the ESR is controlled. be able to.

  ESR can be controlled by changing the shape of the first internal electrode 20 and the second internal electrode 22 and / or the number of stacked layers of the first internal electrode 20 and the second internal electrode 22. For example, the ESR can be increased by elongating the first internal electrode 20 and the second internal electrode 22. In addition, ESR can be reduced by increasing the number of stacked first internal electrodes 20 and second internal electrodes 22.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  In the embodiment described above, an example in which the third internal electrode 14 and the fourth internal electrode 16 are disposed on the same dielectric layer 7 has been described. However, the third internal electrode 14 and the fourth internal electrode 16 may be disposed on different dielectric layers 7.

  In the above embodiment, the number of stacked layers and shapes of the first internal electrode 10 (20), the second internal electrode 12 (22), the third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18 are designed. It may be set appropriately according to the above. The number of stacks of the first internal electrode 10 (20) and / or the second internal electrode 12 (22) may be at least as small as the stack of the third internal electrode 14, the fourth internal electrode 16, and the fifth internal electrode 18. Good. With this configuration, ESR can be increased (controlled) while increasing the capacitance of the multilayer capacitor.

  In the said embodiment, the 1st external electrode 3 demonstrated as an example the form arrange | positioned at one end surface 2a, a part of a pair of main surface 2c, 2d, and a part of a pair of side surface 2e, 2f. . However, the 1st external electrode 3 should just be arrange | positioned at least to the end surface 2a. Similarly, the second external electrode 4 only needs to be disposed on at least the end face 2b.

  In the said embodiment, the 1st connection conductor 5 and the 2nd connection conductor 6 demonstrated as an example the form arrange | positioned on the outer surface of the element | base_body 2. As shown in FIG. However, the first connection conductor and the second connection conductor may be arranged in the element body 2. For example, the first connection conductor and the second connection conductor may be through-hole conductors.

  DESCRIPTION OF SYMBOLS 1,1A-1D ... Multilayer capacitor, 2, 2A-2D ... Element body, 3 ... 1st external electrode, 4 ... 2nd external electrode, 5 ... 1st connection conductor, 6 ... 2nd connection conductor, 7 ... Dielectric material Layers 10, 20,... First internal electrode, 12, 22 ... Second internal electrode, 14 ... Third internal electrode, 16 ... Fourth internal electrode, 18 ... Fifth internal electrode.

Claims (5)

An element body formed by laminating a plurality of dielectric layers;
A pair of external electrodes disposed on the outer surface of the element body;
A pair of connecting conductors arranged in the element body;
A plurality of internal electrodes arranged in the element body,
The plurality of internal electrodes are
A first internal electrode connected to one of the external electrodes and one of the connection conductors;
A second internal electrode connected to the other external electrode and the other connection conductor;
A third internal electrode connected to one of the connection conductors;
A fourth internal electrode connected to the other connection conductor;
A fifth internal electrode that is not connected to the pair of external electrodes and the pair of connection conductors,
A configuration in which two capacitor components are connected in series by disposing the third internal electrode, the fourth internal electrode, and the fifth internal electrode facing each other in the stacking direction of the dielectric layer. Have
The first internal electrode and the fourth internal electrode are not disposed to face each other in the stacking direction, and the second internal electrode and the third internal electrode are not disposed to face each other in the stacking direction. , Multilayer capacitor.   The multilayer capacitor according to claim 1, wherein the first internal electrode and the second internal electrode are disposed on the same dielectric layer.   The multilayer capacitor according to claim 1, wherein the first internal electrode and the second internal electrode are arranged in different dielectric layers.   The multilayer capacitor according to any one of claims 1 to 3, wherein the third internal electrode and the fourth internal electrode are not disposed to face each other in the stacking direction.   5. The multilayer capacitor according to claim 1, wherein the first internal electrode and the second internal electrode are not disposed to face each other in the stacking direction.

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