JP2019123808A - Resin composition for electronic components and resin sheet for electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition for electronic parts, which has both improved reactivity of an epoxy resin and storage stability at room temperature without using a microcapsule type curing agent, and a resin sheet for electronic parts using the same. A resin sheet for electronic parts, comprising (a) an acrylic copolymer, (b) an epoxy resin, (c) an inorganic filler, (d) a curing agent, and (e) a curing accelerator, The electronic component, wherein the content of the (a) acrylic copolymer in the resin sheet for electronic components is 50% by mass or more, and (e) the curing accelerator is an imidazole compound having a triazine skeleton. Resin composition. [Selection diagram] None

Description

  The present invention relates to a resin composition for electronic components and a resin sheet for electronic components using the same.

  BACKGROUND ART In recent years, sheet-like adhesives are often used for bonding of substrates of electronic components, bonding of heat sinks, and bonding of circuit boards. The sheet adhesive is excellent in productivity because it can be processed by a general-purpose device such as a laminator or a press without preparing a special coating device as compared with the liquid adhesive. Moreover, if it is a sheet-like adhesive agent, it is a material which can be expected to be applied to various electronic parts which can be widely used and used since shape processing such as punching can be performed before bonding. Moreover, since the sheet-like adhesive can be processed so as to uniformly cover the thickness even on a base having unevenness, it can be used more widely than liquid adhesive.

  The sheet-like adhesive generally contains a thermosetting resin such as an epoxy resin, and after bonding to an adherend, heat or heat and pressure are applied to cure the thermosetting resin. At this time, the film elasticity of the adhesive sheet is improved and the adhesion to the adherend occurs, and the adhesion between the adherend and the adhesive sheet is improved. In order to shorten the bonding process, it is desirable in terms of production tact that the curing time of the thermosetting resin be short. In order to shorten the curing time, it is most common to increase the reactivity between the resin such as epoxy resin and its curing agent, but such a treatment also improves the reactivity at room temperature, so adhesion It becomes difficult to maintain the pot life as an agent. In a general liquid adhesive, an epoxy resin etc. and a curing agent are divided into two, and the method of maintaining quick curability and pot life by 2 liquefaction mixed immediately before use is taken (patent document 1).

  However, it is difficult to make a sheet-like adhesive into two liquefaction or two-layer due to its product shape. For this reason, in order to achieve both quick curing and pot life, the curing agent is enclosed in microcapsules made of urethane resin or the like to suppress the reactivity at low temperature while adding energy such as heating and pressing. By breaking the microcapsules at the time, a method has been adopted in which the cured resin and the epoxy resin are brought into contact and reacted. However, microcapsule-type curing agents are very expensive, and there is a problem that the reaction does not proceed unless the heating and pressure conditions that can break the coating layer of the microcapsules cause rapid curing to easily occur (precedence) Patent Document 2).

Unexamined-Japanese-Patent No. 5-105862 Unexamined-Japanese-Patent No. 5-255654

  Then, the objective of this invention is providing the adhesive agent sheet which made the improvement of the reactivity of an epoxy resin, and the storage stability in room temperature make compatible, without using a microcapsule-type hardening | curing agent.

In order to solve the above-mentioned subject, the present invention consists of the following composition.
(1) A resin composition for electronic parts comprising (a) an acrylic copolymer, (b) an epoxy resin, (c) an inorganic filler, (d) a curing agent and (e) a curing accelerator, The electron is characterized in that the content of the (a) acrylic copolymer in the resin composition for electronic parts is 50 mass% or more, and (e) the curing accelerator is an imidazole compound having a triazine skeleton. Resin composition for parts.
(2) The resin composition for an electronic component according to (1), wherein the (d) curing agent of the resin composition for an electronic component is a novolac type phenolic resin.
(3) The resin composition for an electronic component according to (1) or (2), wherein the content of the (c) inorganic filler in the resin composition for an electronic component is 5 to 25% by mass.
(4) The resin for electronic parts according to any one of (1) to (3), wherein the tensile elongation at break after heating at 200 ° C. for 5 minutes of the resin composition for electronic parts is 100% or more. Composition.
(5) The ratio (S2 / S1) of breaking strength S1 of the resin composition for electronic parts before curing to breaking strength S2 of the resin composition for electronic parts after heating at 200 ° C. for 5 minutes is 1.5 or more The resin composition for electronic parts according to any one of (1) to (4), which is characterized in that
(6) The resin sheet for electronic components by which the resin composition for electronic components as described in (1)-(5) is laminated | stacked on the surface of the at least one side of a film.
(7) An electronic component device assembly formed by sealing a plurality of electronic components mounted on a substrate using the resin sheet for electronic components according to (6).
(8) An electronic component device obtained by dicing the electronic component device assembly according to (7).

  The resin composition for electronic parts of the present invention is a resin for electronic parts which can maintain high adhesiveness for a long time while achieving both improvement in reactivity of epoxy resin and storage stability at room temperature without using a microcapsule type curing agent. It provides a sheet.

It is a schematic diagram of the state which covered the electronic component mounted in multiple numbers by the board | substrate with a thermosetting sheet-like material.

  The resin composition for electronic parts of the present invention comprises (a) an acrylic copolymer, (b) an epoxy resin, (c) an inorganic filler, (d) a curing agent and (e) a curing accelerator. An imidazole compound having a content of 50% by mass or more of (a) an acrylic copolymer in the resin composition for electronic parts, and (e) a curing accelerator having a triazine skeleton. It is a resin composition for electronic parts characterized by being.

  The (a) acrylic copolymer in the present invention has functions such as flexibility of the resin sheet, relaxation of thermal stress, and improvement of insulation due to low water absorption. There are no particular limitations on the type of structural unit other than acrylonitrile in the (a) acrylic copolymer. Examples of acrylic acid esters and methacrylic acid esters include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, pentyl acrylate, methacrylic acid Examples thereof include alkyl acrylates such as pentyl, hexyl acrylate, hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, octyl acrylate and octyl methacrylate, and methacrylate alkyl esters. Further, esters of acrylic acid with alicyclic alcohols such as cyclohexyl acrylate and the like can be mentioned.

  Moreover, structural units other than the said acrylic ester and methacrylic ester may be contained. For example, vinyl acetate, styrene, methylstyrene, chlorostyrene, vinylidene chloride, ethyl α-acetoxy acrylate and the like can be mentioned.

  Furthermore, it is preferable that the (a) acrylic copolymer has at least one functional group selected from an epoxy group, a hydroxyl group, an amino group, a hydroxyalkyl group, a vinyl group, a silanol group and an isocyanate group. As a result, the bond with the thermosetting resin (b) described later becomes strong, and the reliability of the electronic device is improved. In particular, the epoxy group is more preferable from the viewpoint of compatibility with the epoxy resin.

  The content of the (a) acrylic copolymer in the present invention is preferably 50% by mass or more, more preferably 55% by mass or more, based on the entire resin sheet for electronic parts. (A) By setting the content of the acrylic copolymer to 50% by mass or more, the flexibility of the adhesive sheet before curing can be improved, and the followability to the substrate having irregularities can be enhanced, so It can be applied to processing. In addition, since the flexibility of the adhesive sheet after curing can also be improved, when applied to bonding applications of electronic components, the adhesive is not easily cracked due to temperature change, and peeling from the substrate is suppressed. be able to.

  The epoxy resin (b) in the present invention preferably has two or more epoxy groups in one molecule, and specific examples thereof include cresol novolak epoxy resin, phenol novolac epoxy resin, biphenyl epoxy resin, Bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, etc. It can be mentioned. Among these epoxy resins, those preferably used in the present invention are biphenyl type epoxy resins having a low content of chlorine, a low softening point, and a flexible bifunctional epoxy resin, bisphenol A type epoxy resin Resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin. Of course, these epoxy resins may be mixed and used.

Examples of the inorganic filler (c) in the present invention include fused silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, silicon nitride and titanium oxide, and fused silica is preferably used in view of its low moisture permeability. The term "fused silica" as used herein means amorphous silica having a true specific gravity of 2.3 or less. It is not necessary to necessarily go through the molten state in the method for producing fused silica, and any producing method can be used, and for example, it can be produced by a method of melting crystalline silica and a method of synthesizing from various raw materials. The particle size of the fused silica used in the present invention is not particularly limited as long as it does not affect the thickness of the adhesive and the distance between the components to be mounted, but usually, those having an average particle size of 1 μm or less are used . The average particle size and the maximum particle size referred to herein are those measured by a Horiba LA 500 laser diffraction particle size distribution analyzer. In addition, the purity of the particles is preferably more than 99%, preferably more than 99.8%, and more preferably more than 99.9%. In particular, it is preferable that Na ion of impurity ion is 0.1 ppm or less and Cl ion is 0.2 ppm or less.
In the present invention, the content of (c) the inorganic filler is preferably 5 to 25% by mass with respect to 100% by mass of the adhesive sheet. By setting the amount of the inorganic filler to 5% by mass or more, the membrane elasticity can be appropriately improved and high adhesion can be exhibited. Moreover, the extensibility of the adhesive agent sheet | seat after hardening is not impaired by an inorganic filler being 25 mass% or less.

  The curing agent (d) of the present invention is not particularly limited as long as it reacts with an epoxy resin, and specific examples thereof include, for example, a phenol novolac resin, cresol novolac resin, bisphenol A and resorcinol And various acid anhydrides such as maleic anhydride and pyromellitic anhydride and aromatic amines such as diaminodiphenyl sulfone. Among these curing agents, those which are preferably used are novolac type phenol resin, cresol novolac resin, bisphenol A, diaminodiphenyl sulfone from the viewpoint of heat resistance and moisture resistance, and the reactivity and compatibility with epoxy resin are preferable. From the point of view, novolac type phenol resin is particularly preferably used. The addition amount of the thermosetting resin is preferably 1 to 20 parts by weight with respect to 100 parts by weight of the epoxy resin. By mixing the curing agent in this range, it is possible to obtain an adhesive sheet in which the reaction at room temperature is suppressed while the reactivity is enhanced.

The (e) curing accelerator of the present invention is preferably an imidazole compound, and in particular, an imidazole compound having a triazine skeleton is preferably used. As a specific example, 2,4-diamino-6- [2'-methylimidazolyl (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl (1') ] -Ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4-methylimidazolyl (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′- Examples thereof include isocyanuric acid adducts of methylimidazolyl (1 ′)]-ethyl-s-triazine, isocyanuric acid adducts of 2-phenylimidazole, isocyanuric acid adducts of 2-methylimidazole, and the like. The reactivity of the adhesive sheet can be improved by using an imidazole having a triazine skeleton. In addition, since the imidazole having a triazine skeleton has low compatibility with the epoxy resin, it can suppress the reactivity with the epoxy resin at room temperature, and promotes the reactivity with the epoxy resin only at the time of heating and pressing. Can. In addition, by using imidazole having a triazine skeleton as a curing accelerator, the crosslinking reaction of the epoxy resin can spread in a network, and the elastic modulus of the adhesive sheet after curing can be improved.

  Moreover, it is preferable to contain 0.01-0.1 mass% with respect to 100 mass% of (e) epoxy resin of (e) hardening accelerator of this invention. By adding a curing accelerator in this range, it is possible not only to effectively improve the reaction of the epoxy resin but also to maintain the room temperature storage stability. In addition, by setting the content of the curing accelerator to 0.1% by mass or less, an adhesive sheet which can be highly adhered and which can follow unevenness can be obtained without impairing the film extensibility of the adhesive sheet after curing. Can be provided.

  The resin sheet for electronic parts of the present invention preferably has a tensile elongation at break of 100% or more, more preferably 150% or more after heating at 200 ° C. for 5 minutes. When the tensile elongation at break is 100% or more, even the uneven shape formed by the mounting of the electronic component can be covered without causing a break or the like and making the thickness of the adhesive layer uniform. In addition, even in the case of measurement of 90 ° adhesion to a substrate, the adhesive itself is stretched so that interfacial peeling hardly occurs and adhesion strength is likely to be improved.

The ratio (S2 / S1) of the breaking strength S1 of the resin sheet for electronic parts before curing to the breaking strength S2 of the resin sheet for electronic parts after heating at 200 ° C. for 5 minutes is preferably 1.5 or more, and more preferably Preferably it is 1.8 or more. By improving the breaking strength of the adhesive sheet at 200 ° C. for 5 minutes, the function as the adhesive can be imparted only by the bonding process in a short time, and the production tact can be shortened.
The adhesive sheet for electronic components of the present invention may have a protective film on one side or both sides. The protective film referred to in the present invention is not particularly limited as long as it protects the surface of the resin sheet for electronic parts and can be peeled off from the resin sheet for electronic parts, but polyester films coated with silicone, fluorine compound, alkyd compound etc., polyolefin A film etc. are mentioned. Although the thickness of a protective film is not specifically limited, 10-100 micrometers is common Next, the example of the manufacturing method of the resin composition for electronic components of this invention is demonstrated.
The resin composition for electronic parts of the present invention can be prepared by melt-kneading, for example, into a sheet after melt-kneading using a known kneading method such as Banbury mixer, kneader roll, uniaxial or biaxial extruder and co-kneader. A method of molding, an organic solvent, for example, an aromatic solvent such as toluene, xylene, chlorobenzene, etc., a ketone system such as methyl ethyl ketone, methyl ketone, methyl isobutyl ketone, a non-proton such as dimethyl formamide, dimethyl acetamide, N methyl pyrrolidone etc. After dissolving / dispersing in a polar solvent alone or in a mixture, it can be prepared by coating and drying on a substrate layer, for example, a polyester film treated with silicone, fluorine, an alkyd compound or the like. In particular, a method of dissolving and dispersing in a solvent, and then applying and drying on a substrate layer is preferable because a thinner film can be formed.

  Although the usage method of the resin sheet for electronic components using the resin composition for electronic components of this invention is not specifically limited, It arrange | positions between a base material and a base material, and it can be heat-hardened and used. Further, in particular, the above-mentioned resin sheet for electronic parts is disposed so as to cover a plurality of electronic parts mounted on a substrate, and is heat-formed to be crimped and cured on the surfaces of the plurality of electronic parts and the substrate. Component device assemblies can be made.

  In order to make the resin sheet for electronic parts of the present invention follow the irregularities formed by the plurality of electronic parts mounted on the substrate as described above, the resin sheet for electronic parts described above using a rubber material of low hardness Preferably, pressure is applied to the plurality of electronic components and the surface of the substrate.

  Known low-hardness rubber materials can be used, but silicone rubber is preferable from the viewpoint of heat resistance when processing at processing temperature, and one having an Asker hardness of less than 50 is preferable from the viewpoint of unevenness followability. At this time, in order to prevent transfer of foreign substances attached to the rubber material to the resin sheet for electronic parts, the film material having high releasability and following the unevenness formed by mounting the electronic parts is rubber material and electronic parts It is preferable to intervene between the resin sheets. As an example of a film material that is high in mold release and follows irregularities formed by electronic component mounting, the Sumilight CEL series (made by Sumitomo Bakelite Co., Ltd.), the Opyuran series (made by Mitsui Chemicals Tosoh Co., Ltd.), etc. Is not limited to this.

  The method of applying pressure during processing is not particularly limited, but it is preferable to use a known vacuum laminator so that air bubbles do not remain inside. As an example of a vacuum laminator, a vacuum pressure laminator MVLP manufactured by Meiki Co., Ltd. may be mentioned, but the invention is not limited thereto. The processing pressure is not particularly limited as long as the resin sheet for electronic components can follow the unevenness formed by mounting the electronic components, but it is more preferable to lower the pressure applied to the electronic components.

  The resin sheet for electronic parts of the present invention can be preferably used for an electronic member having a plurality of semiconductor elements flip-chip mounted as described above on a substrate, and further, after the resin sheet for electronic parts is adhered and cured. It can be preferably used in the manufacture of an electronic component device assembly in which a space exists between the substrate of the electronic component and the semiconductor element.

  The electronic component device assembly can be singulated by dicing and used as an electronic component device.

  Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited thereto. In addition, the detail of the raw material shown with the symbol in each Example is shown below.

<Acrylic copolymer 1>
Acrylonitrile (Wako Pure Chemical Industries, Ltd., special grade) 106 g (2.00 mol) and butyl acrylate (Wako Pure Chemical Industries, special grade) 231 g (1. 80 mol), 28 g (0.20 mol) of glycidyl methacrylate (manufactured by Wako Pure Chemical Industries, Ltd., special grade), 2900 g of methyl ethyl ketone (manufactured by Wako Pure Chemical Industries, Ltd., first grade) as a solvent are added and heated to 85 ° C. under atmospheric pressure (1013 hPa) And 0.001 g of 2-ethylhexyl mercaptoacetate (manufactured by Wako Pure Chemical Industries, Ltd.) as a chain transfer agent, and 0.002 g of azobisisobutyronitrile (V-60 manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator. It polymerized until the weight average molecular weight became 700,000. The weight average molecular weight was measured by GPC (gel permeation chromatography) method (apparatus: GELPERMEATION CHROMATOGRAPH manufactured by Tosoh Corp., column: TSK-GEL GMHXL 7.8 × 300 mm manufactured by Tosoh Corp.), and calculated in terms of polystyrene.
Thus, an acrylic copolymer 1 having a molar ratio of acrylonitrile: butyl acrylate: glycidyl methacrylate = 50: 45: 5 (weight average molecular weight 700,000) was obtained.

<Acrylic copolymer 2>
In a reactor equipped with a mixer and a condenser, under a nitrogen atmosphere, 200 g (2.00 moles) of ethyl acrylate (manufactured by Wako Pure Chemical Industries, Ltd., special grade), 118 g (0 grade of butyl acrylate (manufactured by Wako Pure Chemical Industries, Ltd., special grade) 920 g), 22 g (0.155 mol) of glycidyl methacrylate (manufactured by Wako Pure Chemical Industries, Ltd., special grade), 3000 g of methyl ethyl ketone (manufactured by Wako Pure Chemical Industries, Ltd., first grade) as a solvent is added to 85 ° C. under atmospheric pressure (1013 hPa) The mixture is heated, and 0.001 g of 2-ethylhexyl mercaptoacetate (manufactured by Wako Pure Chemical Industries, Ltd.) as a chain transfer agent, and 0.001 g of azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, V-60) as a polymerization initiator In addition, polymerization was performed until the weight average molecular weight reached 1.2 million. The measurement method of the weight average molecular weight was performed by the same method as that of the above-mentioned acrylic copolymer 1.

<Epoxy resin>
Bisphenol A type epoxy resin ("EPIC LON" 1050, epoxy equivalent: 450-500, DIC Corporation, solid at normal temperature, softening point: 64-74)
<Inorganic filler>
Spherical silica (SO-E1, average particle size 0.25 μm (manufactured by Admatex Co., Ltd.))
<Hardener 1>
Novolak-type phenolic resin (H-1, manufactured by Meiwa Kasei Co., Ltd.)
<Hardener 2>
Resol type phenolic resin (PS-2655, manufactured by Gunei Chemical Industry Co., Ltd.)
<Hardener 3>
4,4'-Diaminodiphenyl sulfone ("Seikacure" S, amine equivalent 62, manufactured by Seika Co., Ltd.)
<Hardening accelerator 1>
2,4-Diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine (C11Z-A, manufactured by Shikoku Kasei Kogyo Co., Ltd.)
<Hardening accelerator 2>
2,4-Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct (2MAOK-PW, manufactured by Shikoku Kasei Kogyo Co., Ltd.)
<Hardening accelerator 3>
2-undecylimidazole (C11Z, manufactured by Shikoku Kasei Kogyo Co., Ltd.).

<Breaking elongation measurement>
The 12 μm-thick polypropylene film (Torefan manufactured by Toray Industries, Inc.), the adhesive sheet of the present invention, and the 38 μm-thick polyethylene terephthalate film (PET38X manufactured by Lintec Co., Ltd.) with a silicone mold A polypropylene film and a polyethylene terephthalate film are peeled off from the laminate laminated in this order to make a film of only an adhesive sheet, and this is used as a tensile tester (UCT 100 type, Inc. Co., Ltd.) under the conditions of a sample length of 40 mm and a width of 5 mm. Tensile test at a speed of 50 mm / min at 25 ° C., and the stress-strain curve up to breakage was recorded, and the elongation at break was determined.
Moreover, the breaking elongation measurement after leaving it to stand at room temperature for 1 week was implemented, and the pot life of an adhesive agent sheet was evaluated.

<Break strength measurement>
The 12 μm-thick polypropylene film (Torefan manufactured by Toray Industries, Inc.), the adhesive sheet of the present invention, and the 38 μm-thick polyethylene terephthalate film (PET38X manufactured by Lintec Co., Ltd.) with a silicone mold A polypropylene film and a polyethylene terephthalate film are peeled off from the laminate laminated in this order to make a film of only an adhesive sheet, and this is used as a tensile tester (UCT 100 type, Inc. Co., Ltd.) under the conditions of a sample length of 40 mm and a width of 5 mm. A tensile test was carried out at a speed of 50 mm / min at 25 ° C., and a stress-strain curve up to breakage was recorded, and a breaking strength S1 was determined. Moreover, the test was similarly implemented also with respect to the sample which implemented heat processing for 5 minutes at 200 degreeC, and breaking strength S2 after heating was calculated | required.

<Coverability evaluation>
The coatability when the surface of a substrate on which a plurality of electronic components are mounted is coated with a thermosetting adhesive composition for electronic component coating was evaluated in the following procedure.
As a substrate on which a plurality of electronic components are mounted, an evaluation Si chip of width 0.9 mm × length 1.1 mm × height 0.5 mm is flip-chiped on an alumina substrate via solder bumps of height 0.06 mm. The mounted substrate was used. The Si chips are mounted 5 rows x 5 columns in the center on a 10cm x 10cm alumina substrate, and four types of 1.0mm, 0.5mm, 0.3mm and 0.2mm are prepared for the spacing of the mounted Si chips. did.

The substrate with the above electronic components mounted on a silicone rubber with Asker hardness 20 is placed with the Si chip on top, and then an adhesive sheet with the release film peeled off is placed on the substrate, and heat resistance separation is further performed. Film “Opyuran” (made by Mitsui Chemicals Tosoh Co., Ltd.) CR1031 (thickness 150 μm) and further silicone rubber with a thickness of 2.5 mm with an Asker hardness of 20, and this is evacuated for 30 seconds at a temperature of 100 ° C. Vacuum lamination was carried out using MVLP manufactured by Meiki Engineering Co., Ltd. under the conditions of vacuum pressurization of 0.5 MPa.
Regarding the appearance after the coating with the adhesive, it was judged by microscopic observation whether the adhesive sheet follows the unevenness formed by mounting the Si chip on the alumina substrate. The adhesive sheet is not torn, and it is determined that the adhesive sheet follows sufficiently to the concave as 凹 部, and the adhesive sheet is torn, or the position which does not sufficiently follow to the concave is two or more places It was judged that the adhesive sheet was not torn, and the adhesive sheet was ○ (see FIG. 1) if there was only one place which did not sufficiently follow the recess.
The above-described test was similarly performed on a sample left at room temperature for one week to confirm the pot life.

<Peeling strength measurement>
An adhesive layer having a thickness of 30 μm was laminated on the surface of a pure copper plate having a thickness of 0.5 mm at 130 ° C. and 0.5 MPa. A polyimide film ("UPILEX" 75S, manufactured by Ube Industries, Ltd., "UPILEX" 75S) was bonded to the adhesive layer side at 130 ° C. and 0.5 MPa to the pure copper plate with the adhesive. The prepared sample was subjected to heat and pressure curing treatment at 200 ° C., 5 minutes, and 0.3 MPa. The polyimide film and adhesive layer of the obtained sample are cut by a cutter so that the width becomes 5 mm, and the interface between the adhesive layer and the polyimide film or the interface between the adhesive layer and the pure copper plate at a speed of 50 mm / min in 90 ° direction. It peeled, and the force applied at that time was made into peeling strength. The adhesive strength in the cured state is preferably 6 N / cm or more from the viewpoints of processability, handleability, moldability, and reliability of the semiconductor device. The peel strength was measured with TENSILON / UTM-4-100 manufactured by TOYOBALDWIN.

Example 1
The elastomer, the epoxy resin, the inorganic filler, the curing accelerator, and the curing agent were mixed so as to have the composition shown in Table 1. Then, methyl ethyl ketone was added so that solid content concentration might be 25 mass%, and it stirred at 30 degreeC for 5 hours, and prepared the coating material for resin compositions. In addition, the numerical value of each component in a table represents a mass part.

  The resin composition solution is applied by a bar coater to a 38 μm thick polyethylene terephthalate film (PET 38C manufactured by Lintec Corporation) with a silicone release agent so that the thickness after drying is 30 μm, and dried at 110 ° C. for 5 minutes. A 12 μm thick polypropylene film (Torayan made by Toray Industries, Inc.) is bonded together, and a 38 μm thick polyethylene terephthalate film (Lintech Co., Ltd. PET38) with a silicone release agent, an adhesive sheet for electronic parts and a 12 μm thick polypropylene A resin sheet for electronic parts in which a film (Torefan made by Toray Industries, Inc.) was laminated in this order was produced and evaluated.

Examples 2-8, Comparative Examples 1-3
A polyethylene terephthalate film (PET 38C manufactured by Lintec Corp.) having a thickness of 38 μm with a silicone mold release agent was used in the same manner as in Example 1 except that the type and blending amount of each composition were changed as described in Table 1 A sheet (a resin sheet for electronic parts having a thickness of 30 μm) in which a sheet and a polypropylene film having a thickness of 12 μm (Torefan made by Toray Industries, Inc.) were laminated in this order was produced and evaluated.

DESCRIPTION OF SYMBOLS 1 package substrate 2 element 3 sheet-like material 4 bump 5 wiring 6 substrate internal wiring 7 external electrode

Claims (8)

A resin composition for electronic parts, comprising (a) an acrylic copolymer, (b) an epoxy resin, (c) an inorganic filler, (d) a curing agent and (e) a curing accelerator. The resin for electronic parts, wherein the content of (a) an acrylic copolymer in the resin composition for use is 50% by mass or more, and (e) the curing accelerator is an imidazole compound having a triazine skeleton. Composition. The said (d) hardening | curing agent of the resin composition for electronic components is a novolak-type phenol resin, The resin composition for electronic components of Claim 1 characterized by the above-mentioned. The content rate of said (c) inorganic filler of the resin composition for electronic components is 5-25 mass%, The resin composition for electronic components of Claim 1 or 2 characterized by the above-mentioned. The resin composition for electronic parts according to any one of claims 1 to 3, wherein the tensile elongation at break after heating the resin composition for electronic parts at 200 ° C for 5 minutes is 100% or more. The ratio (S2 / S1) of breaking strength S1 of the resin composition for electronic parts before curing to breaking strength S2 of the resin composition for electronic parts after heating at 200 ° C. for 5 minutes is 1.5 or more The resin composition for electronic components in any one of the Claims 1-4 characterized by the above-mentioned. The resin sheet for electronic parts by which the resin composition for electronic parts in any one of Claims 1-5 is laminated | stacked on the surface of the at least one side of a film. An electronic component device assembly formed by sealing a plurality of electronic components mounted on a substrate using the resin sheet for electronic components according to claim 6. An electronic component device obtained by dicing the electronic component device assembly according to claim 7.

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