JP2019096714A - Heat receiving jacket, liquid cooling system, and semiconductor device - Google Patents

Abstract

To provide a compact heat receiving jacket, a liquid cooling system, and a semiconductor device with improved heat transfer performance.SOLUTION: A heat receiving jacket according to the present invention includes a porous metal 22, an outer cover 10s provided around the porous metal 22 in metallic connection with at least a part of the porous metal 22, and an inlet 23 and an outlet 24 of a liquid refrigerant 100 provided on the outer cover 10s, and the outer cover 10s is a metal member, and the portion of the outer cover 10s joined metallically to the porous metal 22 is attached to a heating element 400 via a heat conducting member 500 to absorb the heat of the heating element 400.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat receiving jacket, a liquid cooling system, and a semiconductor device.

2. Description of the Related Art In recent years, heat transfer systems such as liquid cooling systems in which a heat generating element is cooled with a refrigerant liquid have been advanced and miniaturized.
Along with that, it is necessary to improve the performance and reduce the size and weight of the radiation fin mounted on the heat receiving jacket which absorbs heat from the heat generating element of the liquid cooling system.

  For example, in a liquid cooling system which is mounted on a power module or server and carries out heat dissipation, generally, if the heat transfer performance is lowered, the power module or server or the like becomes high temperature above a predetermined level and not only can not maintain the function. In some cases, it may be broken. For this reason, in the liquid cooling system, the calorific value increases with the improvement of the performance of the power module, the server and the like, and therefore, the demand for a technique for efficiently exchanging heat is strong.

  In such a technical background, as a method of efficiently transporting heat of semiconductor elements mounted on a power module, a server or the like, it is general to circulate coolant liquid by a pump and radiate heat to the outside air. In the heat receiving jacket which is connected to the semiconductor element of the liquid cooling system and absorbs heat, it is common to efficiently transfer the heat of the semiconductor element to the refrigerant liquid.

  In addition, as a prior art related to the present invention, for example, in Patent Document 1, a vaporization promoting plate having a porous structure surface is brought into contact with the bottom surface of a heat receiving jacket which is an outer cover via heat conduction grease. It is described that it is attached to the inner wall side of the bottom plate of the jacket by welding or the like.

Patent Document 2 describes a boiling cooling device including the following heat receiving portion.
The boiling cooling device has a metal porous body, an inlet and an outlet. The heat generating body mounting portion is attached to the heat generating body via the heat conductive grease, and the metal porous body is integrally formed with the bottom wall of the heat receiving portion.

  According to Patent Document 3, a container composed of an upper lid and a heat transfer plate is a cover made of a metal material, and the heat transfer plate is in contact with the heat source directly or via a heat connection member such as grease. The configuration is described.

  Patent Document 4 describes that a semiconductor device including a heat receiving portion, a porous metal, and a cooling body having an inlet and an outlet are used, and solder is used as a bonding material between the semiconductor module and the cooling body. ing.

JP, 2011-47616, A (Drawing 2, Drawing 3A, Drawing 3B, paragraph 0027, 0028 grade) JP, 2015-197245, A (Drawing 1, paragraphs 0044 and 0045 grade) JP, 2012-202570, A (Drawing 2, paragraphs 0018-0021 grade) JP, 2009-16708, A (Drawing 1A, Drawing 1B, Drawing 2, paragraphs 0036-0044 etc.)

  By the way, in all of the patent documents 1 to 4 in the above-mentioned prior art, the porous metal is provided inside the heat receiving jacket, and the heat generating body and the heat receiving jacket are connected to the cooling module connected via the heat conductive grease. I am involved. However, there is no description regarding high performance and compactification when porous metal is used for the heat receiving part of the cooling module of the single layer refrigerant liquid circulation which circulates only the single layer (liquid) of the refrigerant liquid.

  Therefore, in Patent Documents 1 to 4, the porous metal is used for the phase change of the refrigerant liquid, and the heat receiving jacket in which the porous metal is mounted is filled with the vapor after the phase change of the refrigerant liquid. Do not implement empty area is required. That is, an empty area is required for the refrigerant liquid to boil.

  Therefore, there is a problem that the heat transfer performance of the cooling module can not be improved because it can not cope with the mounting form in which the porous metal is provided entirely in the heat receiving jacket. There is no description for this problem, and no consideration is given to improving the heat transfer performance of the liquid cooling system with respect to enhancing the performance and compactness of the porous metal with a single layer refrigerant liquid.

  The present invention has been made in view of the above-mentioned circumstances, and an object thereof is to provide a compact heat receiving jacket, a liquid cooling system, and a semiconductor device in which the heat transfer performance is improved.

  In order to solve the above problems, a heat receiving jacket according to a first aspect of the present invention is an outer cover provided on a periphery of the porous metal by metallically bonding the porous metal and at least a part of the porous metal. And an inlet and an outlet of a liquid refrigerant provided in the outer cover, wherein the outer cover is a metal member, and a portion at which the outer cover is metallically bonded to the porous metal is provided. It is attached to a heat generating body via a heat conducting member to absorb the heat of the heat generating body.

  The heat receiving jacket according to the second aspect of the present invention comprises a porous metal, a solid metal forming an outer cover, and the solid metal covers the porous metal with an outer wall, and the porous metal is provided inside the outer cover A heating element is attached to the outer surface of at least one of the outer walls through a heat conducting member, an inlet and an outlet of liquid refrigerant are provided on the outer wall, and the heating element is attached at the location where the heating element is attached The inner surface where the porous metal and the outer wall are in contact is metallurgically bonded.

  A heat receiving jacket according to a third aspect of the present invention comprises a porous metal, an outer cover joined to the porous metal so as to conduct heat to at least a part of the porous metal, and the outer cover provided around the porous metal The outer cover is formed of a material having thermal conductivity and is in contact with the porous metal of the outer cover so as to be in thermal conductivity However, it is attached to a heat generating body via a heat conducting member to absorb the heat of the heat generating body.

  A liquid cooling system according to a fourth aspect of the present invention includes the second to third heat receiving jackets, a refrigerant driving pump, a heat radiating radiator, and a pipe, and the heat receiving jacket, the refrigerant driving pump, the heat radiating The liquid refrigerant flows in the radiator and the pipe.

  A semiconductor device according to a fifth aspect of the present invention, the heat receiving element and the heat receiving element of the liquid cooling system according to the fourth aspect of the present invention are fixed via a heat conducting member.

  According to the present invention, it is possible to realize a compact heat receiving jacket, a liquid cooling system, and a semiconductor device whose heat transfer performance is improved.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view of the liquid cooling system which connected one heat-receiving jacket to two heat generating bodies of Embodiment 1 of this invention. The figure which permeate | transmits the inside of a heat-receiving jacket, and is shown. The figure which shows the II cross section of the heat-receiving jacket which connected the several heat generating body of FIG. The perspective view around a heat receiving jacket in case direction of a refrigerant fluid inlet and a refrigerant fluid outlet with the same direction as Drawing 2 which connected one heating element which is other examples of Embodiment 1 of the present invention is the same. FIG. 10 is a perspective view around a heat receiving jacket in which one heating element of Embodiment 2 is connected. The perspective view around a heat receiving jacket which connected one heat generating body which is Embodiment 3, and provided an empty area inside the heat receiving jacket of a refrigerant fluid inlet and a refrigerant fluid outlet. The perspective view around the heat receiving jacket which connected one heat generating body of Embodiment 4. FIG. Sectional drawing of the single heat receiving jacket of the liquid cooling system which cools the heat | fever of the semiconductor element of Embodiment 5. FIG. Sectional drawing of the heat-receiving jacket of the liquid cooling system which cools the heat of the semiconductor element of other example 1 of Embodiment 5. FIG. Sectional drawing of one heat receiving jacket of the liquid cooling system which cools the some power module of other example 2 of Embodiment 5. FIG. The perspective view which shows the internal structure of the state which removed the upper plate of the lid which the electronic device to which the liquid cooling system using the porous metal of Embodiment 6 is applied is removed. The top view which shows the internal structure of the state which removed the upper plate of the cover body to the electronic device to which the liquid cooling system using the porous metal of Embodiment 6 is applied.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the present invention, a heat receiving jacket capable of improving heat transfer performance by transferring heat from a high temperature side fluid to a low temperature side fluid through a porous metal 22 and using it as a cooling medium for water etc. The present invention relates to a liquid cooling system and a semiconductor device.

Embodiment 1
FIG. 1 shows a perspective view of a liquid cooling system 1 in which one heat receiving jacket 10 is connected to two heating elements A (400) and heating elements B (401) according to the first embodiment of the present invention.
In the liquid cooling system 1 of the first embodiment, the heat generated by the two heating elements A (400) and B (401) (hereinafter, shown by omitting parentheses) is a refrigerant via the heat receiving jacket 10. It is a system which circulates the liquid 100 and radiates heat.
The liquid cooling system 1 is configured to include a heat receiving jacket 10, a radiator 160, a pump 200, and a pipe 300 which connects these and circulates the refrigerant liquid 100.

  As the refrigerant liquid 100, an ethylene glycol aqueous solution, an ethylene propylene aqueous solution, an inert non-conductive refrigerant, for example, an aqueous solution containing a rust inhibitor such as a fluorine-based refrigerant is used. The refrigerant liquid 100 may use other than these.

The heat receiving jacket 10 absorbs the heat generated by the heat generating members A and B 400 and 401 by the refrigerant liquid 100 and radiates the heat.
The radiator 160 dissipates heat of the refrigerant liquid 100, which has become high temperature in the heat receiving jacket 10, by heat exchange with the external air.

  The pump 200 circulates the refrigerant liquid 100 to the heat receiving jacket 10 and the radiator 160.

[Heat receiving jacket 10]
In the heat receiving jacket 10, the outer cover 10s constitutes a housing.
The outer cover 10 s of the heat receiving jacket 10 is provided with a refrigerant liquid inlet 23 in which the refrigerant liquid 100 flows in from the pump 200 and a refrigerant liquid outlet 24 in which the refrigerant liquid 100 flows out toward the radiator 160.
The heat receiving jacket 10 has a porous metal 22 described later mounted therein and is covered with the outer wall 26 of the outer cover 10s.

  The refrigerant liquid 100 flows inside the heat receiving jacket 10 and exchanges heat with the porous metal 22, whereby the heat of the porous metal 22 is dissipated to the refrigerant liquid 100. Therefore, the heat generating body A 400 and the heat generating body B 401 to be heat absorbed are thermally connected to the outer wall 26 of the heat receiving jacket 10 via the heat conductive grease 500. The portion of the heat receiving from the heat generating members A and B 400 and 401 in the heat receiving jacket 10 has high thermal conductivity by the thermal conductive grease 500.

The outer wall 26 of the heat receiving jacket 10 transfers the heat of the heating element A 400 and the heating element B 401 to the porous metal 22 and transfers the heat to the refrigerant liquid 100. The material of the outer cover 10s of the heat receiving jacket 10 is solid metal.
The heat-absorbed refrigerant liquid 100 flowing out of the heat receiving jacket 10 flows in the pipe 300 and is thermally transported to the radiator 160.

Radiator 160
As described above, the radiator 160 is an element that cools the refrigerant liquid 100 that has reached a high temperature.
The radiator 160 has headers 162a and 162b on both sides, and has a large number of flat tubes 161 communicating with the headers 162a and 162b on both sides in the middle. A radiation fin 163 such as a corrugated fin is provided in a region sandwiched by the flat tubes 161.

The high temperature refrigerant liquid 100 flowing into the radiator 160 flows to the header 162a, is branched by the flat pipe 161, and is joined by the header 162b. The refrigerant liquid 100 in the header 162 b flows to the pump 200 via the pipe 300.
The air 110 is supplied to the heat dissipating fins 163 of the radiator 160 by the drive of the cooling fan 710. In the cooling fan 710, the blades 712 are rotated by a motor (not shown), and the air 110 is caused to flow to the radiation fins 163.

The refrigerant liquid 100 which has been subjected to heat exchange by the heat receiving jacket 10 and has become high temperature is exchanged with the low temperature air 110 by the radiator 160, and the refrigerant liquid 100 becomes low temperature. The refrigerant liquid 100 having a low temperature flows into the pump 200 and flows from the refrigerant liquid inlet 23 of the heat receiving jacket 10 to the heat receiving jacket 10 and is circulated.
In the radiator 160, the air 110 which has passed through the heat dissipating fins 163 has a high temperature due to heat exchange and is dissipated to the atmosphere.

[Heat transport]
As described above, the heat of the heat generating element A 400 and the heat generating element B 401 is transmitted to the air 100 via the porous metal 22 of the heat receiving jacket 10, the refrigerant liquid 100, and the radiator 160 to perform heat transport. As a result, the heating element A400 and the heating element B401 are cooled, and the allowable temperature is not exceeded. Therefore, when the heat generating element A 400 and the heat generating element B 401 are semiconductor elements, it is possible to suppress the semiconductor elements from becoming high temperature and to ensure normal operation. Thereby, the reliability of the device using the semiconductor element can be improved.

[Heat receiving jacket 10]
A perspective view around the heat receiving jacket 10 in which a plurality of heating elements (400, 401) of FIG. 1 are connected is shown in FIG. FIG. 2 shows the inside of the heat receiving jacket 10 in a transparent manner.

The I-I cross section of the heat receiving jacket 10 which connected the several heat generating body (400, 401) of FIG. 2 in FIG. 3 is shown.
A porous metal 22 is mounted inside the heat receiving jacket 10. The inner area (internal space) of the heat receiving jacket 10 and the porous metal 22 have substantially the same shape. Therefore, the inner surface of the outer wall 26 of the heat receiving jacket 10 and the porous metal 22 are in physical contact with each other. Therefore, the porous metal 22 can be easily positioned inside the heat receiving jacket 10.

The material of the outer cover 10s of the heat receiving jacket 10 is solid metal.
The heat generating element A 400 and the heat generating element B 401 are attached to two surfaces of the outer wall 26 of the outer cover 10 s via the heat conductive grease 500. The heat of the heating element A 400 and the heating element B 401 is transmitted to the two surfaces of the outer wall 26 of the heat receiving jacket 10 through the heat conductive grease 500, respectively.

  The inner surface of the outer wall 26 of the heat receiving jacket 10 to which the heating element A400 and the heating element B401 are attached and the porous metal 22 are joined by metallic bonding (for example, brazing) 25 or the like in order to ensure thermal conductivity. . The metallic bonding improves the thermal conductivity of the outer wall 26 of the heat receiving jacket 10 and the porous metal 22.

The metallic bonding 25 may be soldering other than brazing, or heating may be performed while heating the interface, and another bonding method may be used as long as thermal conductivity can be ensured.
According to this configuration, the heat of the heat generating element A 400 and the heat of the heat generating element B 401 can be well transferred from the outer wall 26 of the heat receiving jacket 10 to the porous metal 22 through metallic bonding. The porous metal 22 is composed of innumerable fine wires 20 and cavities 21 and has a large heat transfer area (surface area). The fine wire 20 is made of, for example, a metal material such as aluminum or copper.

  As described above, the refrigerant liquid 100 flows into the heat receiving jacket 10 from the refrigerant liquid inlet 23, exchanges heat through the porous metal 22, and flows out from the refrigerant liquid outlet 24. At this time, since the direction of the refrigerant liquid 100 flowing into the porous metal 22 (arrow α 01 in FIG. 3) is different from the direction of the refrigerant liquid 100 flowing out of the porous metal 22 (arrow α 02 in FIG. 3) The length of the heat transfer path of 100 can be increased to promote heat exchange.

  Since the porous metal 22 is composed of innumerable fine wires 20 and hollow portions 21, the porous metal 22 has almost no directivity of the flow of the refrigerant liquid 100, and the refrigerant liquid 100 covers the entire area of the porous metal 22. Flows. For this reason, heat can be transferred to the refrigerant liquid 100 over the large surface area of the porous metal 22, and the waste of heat exchange of the refrigerant liquid 100 is small.

It compares with the pin fin used as a heat transfer surface of the conventional heat receiving jacket.
The heat transfer area of the porous metal 22 of the heat receiving jacket 10 of Embodiment 1 can be several to several tens times as large as the heat transfer area of the pin fins of the conventional heat receiving jacket 10 of the same volume.

  Even considering the difference in fin efficiency between the conventional pin fin and the porous metal 22 of the first embodiment, the thermal resistance defined by dividing the temperature difference between the heat transfer surface temperature and the refrigerant liquid inlet temperature by the calorific value The same volume can be smaller for porous metal 22. Therefore, the heat receiving jacket 10 using the porous metal 22 can be miniaturized.

  In order to obtain the same thermal resistance, the porous metal 22 of this configuration can be miniaturized to a size of 60% per side in three dimensions as compared to the case of the conventional pin fin. Therefore, by using the porous metal 22 instead of the conventional pin fin, the volume is approximately 0.216 (= 0.6 × 0. 6) in comparison with the volume 1 (= 1 × 1 × 1) of the conventional pin fin. It can be miniaturized to a size of 6 × 0.6).

  As a result, the heating element A 400 and the heating element B 401 can be cooled by the compact heat receiving jacket 10, and the temperature exceeding the allowable temperature can be suppressed. Therefore, in the case where the heating element A 400 and the heating element B 401 are semiconductor elements, it is possible to suppress the temperature from exceeding the allowable temperature, to ensure normal operation of the semiconductor elements, and to improve the reliability of the device using the semiconductor elements.

[Porous metal 22]
An example of the manufacturing method of the porous metal 22 which bears heat exchange inside the heat receiving jacket 10 is demonstrated.
[Substrate of porous metal 22]
The substrate of the porous metal 22 uses a three-dimensional network structure having a three-dimensionally linked skeleton, and pores forming three-dimensionally connected pores are formed by the skeleton.

  The substrate is a substrate on which an aluminum powder and / or an aluminum alloy powder is attached and supported on the surface of the frame, and is to be heated and decomposed and eliminated. Thus, the substrate is made of resin. Specifically, polyurethane foam is most commonly used as a substrate. As the substrate, in addition to polyurethane foam, foam of silicone resin, polyester resin, etc. may be used.

[Aluminum powder or aluminum alloy powder]
The powder to be attached to the resin skeleton of the substrate should have high thermal conductivity and low specific gravity. Therefore, aluminum powder is used to balance thermal conductivity and specific gravity. The powder may be replaced by aluminum powder, and aluminum alloy powder in which a component for strengthening aluminum is pre-alloyed may be used. For example, when using an aluminum alloy powder in which an alloying element such as Cu, Mn, Mg, or Si is pre-alloyed to Al, the skeleton of the aluminum-based porous body is formed of an aluminum alloy, and the strength of the aluminum-based porous body Can be improved. In this case, the thermal conductivity of the porous metal 22 is lower than that of Al alone, but since the base metal is Al, a sufficiently high thermal conductivity can be maintained.

As the aluminum powder or aluminum alloy powder, one having an oxide film (alumina: Al ₂ O ₃ ) of about 10 Å on the surface is used to increase the strength.
The aluminum powder and / or the aluminum alloy powder to be attached to the resin skeleton of the substrate is preferably fine because it can be closely attached to the resin skeleton surface of the thin substrate. When the powder becomes large, it becomes difficult to adhere tightly to the resin skeleton surface of the substrate, the mass of the powder increases, and it becomes difficult to adhere to the resin skeleton surface of the substrate, or it becomes easy to drop off. From this viewpoint, the aluminum powder and / or the aluminum alloy powder preferably has an average particle diameter of 50 μm or less.

  Furthermore, it is preferable that the average particle diameter is 50 μm or less and the powder not including a particle diameter exceeding 100 μm. However, since Al is an active metal, too fine powder becomes difficult to handle. From this viewpoint, it is preferable to use an aluminum powder and / or an aluminum alloy powder having an average particle diameter of 1 μm or more.

[Attachment process]
In depositing the aluminum powder and / or the aluminum alloy powder on the resin skeleton of the substrate, various conventional methods can be applied. The representative methods are described below.

(1) Wet Method This is a method of preparing a dispersion in which aluminum powder and / or aluminum alloy powder are dispersed in a dispersion medium, immersing the substrate in the dispersion, and then drying the substrate. As the dispersion medium, a volatile liquid such as alcohol or water is used as a solvent, and a solution in which the binder is dissolved is used. In this case, a dispersant may be added to the dispersion medium so that the powder does not settle. Further, as the dispersion medium, a solution of high molecular organic matter such as phenol resin may be used.

(2) Dry method Adhesiveness is imparted by applying an adhesive resin solution such as acrylic or rubber, or an adhesive resin solution such as phenol resin, epoxy resin, furan resin, etc. on the surface of the substrate to impart adhesiveness to the substrate in powder. In this method, the powder is deposited on the surface of the skeleton by a method such as rocking or spraying the powder on a substrate.

[Heating process]
The substrate having the aluminum powder or aluminum alloy powder attached to the surface of the skeleton is heated in the non-oxidizing atmosphere to a temperature higher than the melting point of the aluminum powder and / or the aluminum alloy powder. In the temperature raising process up to the melting point, the resin base is decomposed, removed and disappears.

When the heating temperature exceeds the melting point of aluminum (melting point: 660.4 ° C.) or aluminum alloy, the aluminum powder or aluminum alloy powder is internally melted. That is, the surface of aluminum powder or aluminum alloy powder is covered with an oxide film (alumina: Al ₂ O ₃ ), and the melting point of alumina is as high as 2072 ° C., so the oxide film on the surface of aluminum powder or aluminum alloy powder melts. In addition, the inside of these powders melts.

  The aluminum or aluminum alloy thus melted internally breaks the oxide film on the surface of the powder and wet-covers the powder surface, and the molten aluminum or molten aluminum alloy generated from each powder is mixed and bonded. At this time, the oxide film formed on the powder surface becomes a substitute skeleton, maintaining the shape of the skeleton, and the surface of the skeleton becomes relatively smooth due to the surface tension of the molten aluminum or molten aluminum alloy bonded to each other, and the neck portion disappears. It will be a continuous metal surface.

  On the other hand, when the heating temperature is less than the melting point of aluminum or aluminum alloy, a strong oxide film formed on the surface of aluminum powder or aluminum alloy powder serves as a barrier to diffuse aluminum powders or aluminum alloy powders. Inhibits the bonding due to the sintering and does not proceed.

  If the atmosphere in the heating step is an oxidizing atmosphere such as air, the molten aluminum or molten aluminum alloy exposed by breaking the oxide film on the powder surface is immediately oxidized, wetted and covered on the powder surface, and the melting generated from each powder The mixing of the aluminum or molten aluminum alloy is prevented, and the bonding of the powders is inhibited.

Therefore, it is desirable that the atmosphere in the heating step be a non-oxidizing atmosphere such as nitrogen gas or inert gas. In the above heating process, the purpose is not to remove the oxide film on the surface of the aluminum powder or aluminum alloy powder, so it is not necessary to use a reducing atmosphere such as hydrogen gas or hydrogen mixed gas. Since the atmosphere of is a non-oxidative atmosphere, it may be a reducing atmosphere. In addition, the pressure may be a reduced pressure atmosphere (vacuum atmosphere) of 10 ⁻³ Pa or less.

  If the heating temperature exceeds the melting point of the aluminum powder or aluminum alloy powder deposited on the substrate, the powder can be melted, but heating at a temperature greatly exceeding the melting point requires extra energy and The heating temperature is preferably up to the melting point + 100 ° C. because the viscosity of the aluminum or aluminum alloy is reduced and the shape is likely to be deformed.

  The three-dimensional network structure of the aluminum-based porous body manufactured by the above-described manufacturing method is the one in which the three-dimensional network structure of the resin base is maintained as it is. Therefore, by changing the three-dimensional network structure of the resin substrate, the three-dimensional network structure of the aluminum-based porous body can be changed, and the porosity and pore size of the entire aluminum-based porous body can be changed. It is possible to adjust to a desired one. Specifically, the porosity can be 85 to 95%, and the size of the pores can be 30 to 4000 μm in diameter, 6 to 80 ppi (cell number / 25.4 mm) (cell number) The number of pixels per inch can easily be manufactured.

  In the case of forming an aluminum-based porous body with an aluminum alloy, a component (Cu, Mg, etc.) that generates a eutectic liquid phase with Al as a raw material powder is added to the aluminum powder as a single powder or an aluminum alloy powder. A method is conceivable in which an aluminum-based mixed powder is attached to the surface of a resin base having a three-dimensional network structure using an aluminum-based mixed powder, and sintering is performed at a temperature at which a eutectic liquid phase is generated. In such a case, the distribution of the component elements in the aluminum-based porous body becomes uneven, and the oxide of aluminum does not disperse inside the skeleton, and it is difficult to obtain a desired strength.

  On the other hand, by using the aluminum pre-alloy powder in which the component elements are alloyed into Al in advance as described above, the distribution of the component elements in the aluminum-based porous body becomes uniform. Moreover, the oxide of aluminum resulting from a manufacturing method disperse | distributes inside frame | skeleton. For this reason, high strength can be obtained as compared to the method of sintering with a eutectic liquid phase using an aluminum-based mixed powder.

  Also, in order to make the shape to avoid pressure loss during the heating step, a relatively high-speed gas is sprayed to the porous metal, or the front surface of the metal shape is curved by centrifugal force or the weight of the porous metal 22 itself. The rear surface portion can be changed into a long thin shape in a streamlined manner.

In addition, also in manufacturing methods, such as a casting_mold | template other than the above-mentioned manufacturing method, it is sponge-like and can produce | generate the porous metal which consists of a metal and space.
The mold manufacturing method is a structure that creates a flow path in a block. For example, a material of aluminum is inserted into a sand mold to form a flow path such that the material of aluminum does not flow. After the sand mold channels are formed, the sand mold is flushed with water to form channels in the block.

  According to the above-described configuration, the outer wall 26 thermally contacting the heating elements A and B 400 and 401 via the heat conduction grease 500 and the like, and the porous metal 22 are metallic joints 25 (for example, brazing). Thus, the heat transfer between the outer wall 26 and the porous metal 22 can be made good. The refrigerant liquid 100 flows into the porous metal 22 from the refrigerant liquid inlet 23 provided in the outer wall 26, flows in the non-directional porous metal 22, and flows out from the refrigerant liquid outlet 24. Thereby, the heat of the heat receiving jacket 10 is transferred from the porous metal 22 to the refrigerant liquid 100, and the heat can be transferred well.

Therefore, the heat of the heating elements A and B 400 and 401 can be efficiently dissipated through the porous metal 22.
Further, the heat receiving body 10 having a plurality of different mounting directions and the heat generating body B 400 having the same form as that described above are thermally bonded to the outer metal wall 26 so that one heat receiving jacket 10 has a plurality of different mounting directions. The heating element A400 and the heating element B401 can be cooled.

Therefore, the mounting efficiency of the heat absorption structure of the heat generating element A 400 and the heat generating element B 400 can be improved, and the size can be reduced. That is, the heat radiation area of the heat of the heating element A 400 and the heating element B 400 can be made compact.
Moreover, since the porous metal 22 has no directivity unlike the conventional pin fin, the heat receiving jacket 10 using the porous metal 22 can be selected in any shape.

  In addition, since the heat receiving jacket 10 has no directivity in the heat transfer surface, any direction can be used as the heat transfer surface. As described above, since the positions of the refrigerant liquid inlet 23 and the refrigerant liquid outlet 24 can be freely taken and there is no restriction or few, the piping 300 of the water cooling system can be easily routed.

  Furthermore, as shown in FIG. 3, if the direction in which the refrigerant liquid 100 flows in from the refrigerant liquid inlet 23 (arrow α01 in FIG. 3) is different from the direction in which the refrigerant liquid 100 flows out from the refrigerant liquid outlet 24 (arrow α02 in FIG. 3). By setting the flow path, the flow path of the refrigerant liquid 100 can be freely selected. Thereby, the flow path length of the refrigerant liquid 100 flowing in the inside of the porous metal 22 can be made longer as compared with the case where the inflow and outflow directions of the refrigerant liquid 100 are the same direction, and heat exchange can be promoted.

[Another Example of Embodiment 1]
Around the heat receiving jacket 10 in the case where the orientation of the refrigerant liquid inlet 23 and the refrigerant liquid outlet 24 is the same as that in FIG. 2 to which one heating element A 400 which is another example of Embodiment 1 of the present invention is connected. Shows a perspective view of

The heat receiving jacket 10 has a rectangular parallelepiped shape, and its material is formed of a heat conductive solid metal. The material of the heat receiving jacket 10 may be a material other than metal as long as it has good thermal conductivity and satisfies conditions such as predetermined strength.
A porous metal 22 is mounted in the inside of the heat receiving jacket 10 so as to pass through the inside of the heat receiving jacket 10. The inner area (internal space) of the heat receiving jacket 10 and the porous metal 22 have substantially the same shape. Specifically, the inner surface of the outer wall 26 of the heat receiving jacket 10 and the outer surface of the porous metal 22 are in physical contact. Thereby, the porous metal 22 can be positioned inside the heat receiving jacket 10. Also, the heat of the heat receiving jacket 10 is transferred to the porous metal 22.

  A heating element A 400 is attached to one outer surface of the outer wall 26 of the heat receiving jacket 10 via a heat conductive grease 500. Thereby, the heat generated in the heating element A 400 is well transferred to the outer wall 26 of the heat receiving jacket 10 through the heat conductive grease 500.

The inner surface of the outer wall 26 of the heat receiving jacket 10 to which the heating element A 400 is attached and the porous metal 22 are joined by metallic joining 25 such as brazing.
As described above, the material of the heat receiving jacket 10 is solid metal. Therefore, the heat of the heating element A400 is transmitted to the outer wall 26 of the heat receiving jacket 10 through the heat conductive grease 500, and the outer wall 26 of the heat receiving jacket 10 is thermally conducted. It can be well transmitted to the porous metal 22.

  The heat receiving jacket 10 is provided with a refrigerant liquid inlet 23 and a refrigerant liquid outlet 24. The refrigerant liquid 100 flows into the inside of the heat receiving jacket 10 from the refrigerant liquid inlet 23, passes through the hollow portion 21 (see FIG. 3) of the porous metal 22, and flows out from the refrigerant liquid outlet 24.

  As shown in FIG. 3, the porous metal 22 is composed of innumerable fine fine wires 20 and cavities 21 having no directivity. Therefore, the porous metal 22 has almost no directivity of the flow of the refrigerant liquid 100, and the refrigerant liquid 100 flows in the entire area of the porous metal 22. For this reason, the heat of the heat generating element A 400 can be transferred to the refrigerant liquid 100 through the large surface area of the innumerable fine fine wires 20 of the porous metal 22, and the refrigerant liquid 100 is not wasted.

As a result, the heating element A 400 can be cooled by the compact heat receiving jacket 10, and it is possible to suppress exceeding the allowable temperature.
Therefore, when the heating element A 400 is a semiconductor element, the temperature of the semiconductor element can be suppressed to the allowable temperature or less, and the normal operation of the semiconductor element can be secured. Therefore, the reliability of the device using the semiconductor element can be improved.

Second Embodiment
FIG. 5 shows a perspective view around the heat receiving jacket 10A to which one heating element of the second embodiment is connected.
In the second embodiment, the refrigerant liquid inlet 23 connected to the heat receiving jacket 10A, and spaces 10a1 and 10a2 of the empty area are provided inside the heat receiving jacket 10A of the refrigerant liquid outlet 24.

Only portions different from the other example of the first embodiment of FIG. 4 will be described.
In the second embodiment, as shown in FIG. 5, the outer wall 26a having the surface to which the heating element A400 is attached through the heat conductive grease 500 is the same as the heating element A400 in the outer wall 26 constituting the heat receiving jacket 10A. It is larger in size than the other outer wall 26 of the heat receiving jacket 10A.

  Furthermore, although the porous metal 22 is metallically joined 25 (for example, brazed) to the above-mentioned overhanging outer wall 26a and mounted on the heat receiving jacket 10A, the area downstream of the refrigerant liquid inlet 23 and the refrigerant liquid There is no porous metal 22 in the area on the upstream side of the outflow port 24, and it is set as the spaces 10a1 and 10a2.

  The spaces 10a1 and 10a2 become chambers, and the refrigerant liquid 100 flowing from the refrigerant liquid inlet 23 into the heat receiving jacket 10A spreads into the space 10a1. Then, the refrigerant liquid 100 spreads and flows in the entire area of the porous metal 22. Thereafter, the refrigerant liquid 100 (arrow α1 in FIG. 5) having passed through the entire area of the porous metal 22 spreads out into the space 10a2 and flows out from the refrigerant liquid outlet 24 to the outside.

  Also in the heat receiving jacket 10A, as in the heat receiving jacket 10 of the first embodiment, the porous metal 22 is embedded in the entire flow passage cross section of the heat receiving jacket 10 in the flow direction of the refrigerant liquid 100 (arrow α1 in FIG. 5). Therefore, all of the refrigerant liquid 100 is subjected to heat exchange through the porous metal 22, and no waste of heat exchange of the refrigerant liquid 100 occurs. Note that, as in the first embodiment, the porous metal 22 may be spread over the entire inner area of the heat receiving jacket 10 without the spaces 10a1 and 10a2.

  Since the porous metal 22 is a high-performance heat transfer member, heat exchange is efficiently performed even when the porous metal 22 having a size smaller than the external dimension of the heat generating element A 400 is inserted, and heat exchange is efficiently performed. It can cool the body A400. The material of the component of the heat receiving jacket 10 is solid metal. As a result, the heating element A400 can be cooled using the heat receiving jacket 10A smaller than the external dimension of the heating element A400, and the temperature can be suppressed to the allowable temperature or less.

  When the heating element A 400 is a semiconductor element, the semiconductor element can be suppressed to a temperature lower than the allowable temperature, and the normal operation of the semiconductor element can be secured. Therefore, the reliability of the device using the semiconductor element can be improved.

Third Embodiment
6 is a perspective view around a heat receiving jacket 10B in which one heat generating body 400 according to the third embodiment is connected and spaces 10b1 and 10b2 are provided inside the heat receiving jacket 10B of the refrigerant liquid inlet 23 and the refrigerant liquid outlet 24. Figure shows.
The third embodiment is the case where the positions of 10b1 and 10b2 are different from the case of FIG. 5 of the second embodiment.
Therefore, only the differences from the second embodiment shown in FIG. 5 will be described.

  In the third embodiment, there is no porous metal 22 in the area on the downstream side of the refrigerant liquid inlet 23 and the area on the upstream side of the refrigerant liquid outlet 24 inside the heat receiving jacket 10B, and it becomes spaces 10b1 and 10b2. ing. Spaces 10b1 and 10b2 become chambers in which the refrigerant liquid 100 spreads.

  The refrigerant liquid 100 flowing in from the refrigerant liquid inlet 23 spreads over the entire space 10b1. Then, the refrigerant liquid 100 spreads and flows from the space 10b1 to the entire area of the porous metal 22 (arrow α22 in FIG. 6). Unlike the case of FIG. 5, the inside of the porous metal 22 has a flow in which the refrigerant liquid 100 is bent in the direction (arrow α22) passing through the porous metal 22 from the inflow direction (arrow α21).

  Further, the porous metal 22 is embedded in the entire flow passage cross section of the heat receiving jacket 10B in the flow direction (arrow α22) of the refrigerant liquid 100, and all the refrigerant liquid 100 passes through the porous metal 22 and exchanges heat. Therefore, no waste occurs when the refrigerant liquid 100 exchanges heat with the porous metal 22.

  The porous metal 22 may be spread over the entire heat receiving jacket 10B without the spaces 10b1 and 10b2. As described above, the porous metal 22 is a high-performance heat transfer member having a large surface area for heat transfer and a large amount of heat exchange. Therefore, even with the porous metal 22 having an outer dimension smaller than the outer dimension of the heat generator A400, the heat generator A400 can be effectively cooled.

  The material of the outer cover 10s of the heat receiving jacket 10B is solid metal. Thereby, the heat of the heat generating body A400 is conducted to the outer cover 10s of the heat receiving jacket 10B using the heat receiving jacket 10B smaller than the external dimension of the heat generating body A400, and further, porous through the outer cover 10s of the heat receiving jacket 10B. It can conduct heat to the metal 22.

Therefore, the heat generated in the heating element A400 is dissipated and cooled, and the heating element A400 can be maintained at or below the allowable temperature.
Therefore, when the heating element A 400 is a semiconductor element, the temperature of the semiconductor element can be suppressed to the allowable temperature or less, and the normal operation of the semiconductor element can be secured. Therefore, the reliability of the device using the semiconductor element can be improved.

Fourth Embodiment
FIG. 7 shows a perspective view around a heat receiving jacket 10C to which one heating element A400 of Embodiment 4 is connected.
The fourth embodiment differs from FIG. 5 of the second embodiment and FIG. 6 of the third embodiment in that there are one refrigerant liquid inlet 23 and two refrigerant liquid outlets 24a and 24b, and a space 10c1 inside the heat receiving jacket 10C. , 10c2 and 10c3 are provided.

Only portions different from FIG. 5 of the second embodiment and FIG. 6 of the third embodiment will be described.
As in the second and third embodiments (FIGS. 5 and 6), the heat receiving jacket 10C of the fourth embodiment has one refrigerant liquid inlet 23 but two refrigerant liquid outlets 24a and 24b. .

  In the heat receiving jacket 10C, the porous metal 22 is not provided on the downstream side of the refrigerant liquid inlet 23 and on the upstream side of the refrigerant liquid outlets 24a and 24b, and they are spaces 10c1, 10c2 and 10c3. The spaces 10 c 1, 10 c 2 and 10 c 3 become chambers, and the refrigerant liquid 100 flows in the entire area of the porous metal 22.

That is, the refrigerant liquid 100 flows into the space 10c1 from the refrigerant liquid inlet 23 (arrow α31 in FIG. 7). The refrigerant liquid 100 expanded in the space 10c1 is branched into the inside of the porous metal 22 and flows (arrows α32, α33).
That is, unlike the case of FIG. 5 of Embodiment 2 and FIG. 6 of Embodiment 3 inside the porous metal 22 of Embodiment 4, the refrigerant liquid 100 (arrow α 31) flowing from the refrigerant liquid inlet 23 branches off. It becomes a bending flow (arrows α32 and α33).

  Further, since the porous metal 22 is embedded in the entire flow passage cross section of the heat receiving jacket 10 in the flow direction of the refrigerant liquid 100 (arrows α 32 and α 33), the refrigerant liquid 100 does not leak and flows inside the porous metal 22 Exchange is promoted. Therefore, there is no waste of the refrigerant liquid 100 in heat exchange between the refrigerant liquid 100 and the porous metal 22.

The refrigerant liquid 100 in which the porous metal 22 is inserted respectively flows out to the spaces 10c2 and 10c3 and flows out from the refrigerant liquid outlets 24a and 24b (arrows α34 and α35 in FIG. 7).
The spaces 10c1, 10c2 and 10c3 may not exist, and the porous metal 22 may be spread over the entire inside of the heat receiving jacket 10C.

  Since the porous metal 22 is a high-performance heat transfer member having a large heat transfer area with the refrigerant liquid 100, the heat generating element A400 can be used as the refrigerant liquid even with the porous metal 22 whose external dimensions are smaller than the external dimensions of the heat generating element A400. It can cool effectively by heat exchange with 100.

  In addition, since the number of refrigerant liquid outlets 24a and 24b is larger than the number of refrigerant liquid inlets 23, the refrigerant liquid 100 branches and flows (arrows α32 and α33), and the porous metal 22 near the refrigerant liquid 100 The temperature gradient per volume can be reduced. Therefore, the cooling capacity of the heating element A 400 can be improved. As a result, cooling can be performed using the heat receiving jacket 10C smaller than the external dimension of the heating element A400, and the temperature of the heating element A400 can be suppressed from exceeding the allowable temperature.

  Therefore, when the heating element A 400 is a semiconductor element, similarly, the semiconductor element can be suppressed within the allowable temperature, and the normal operation of the semiconductor element can be secured. Therefore, the reliability of the device using the semiconductor element can be improved.

Fifth Embodiment
FIG. 8A shows a cross-sectional view of a single heat receiving jacket 10D of a liquid cooling system 1A for cooling the heat of the semiconductor device of the fifth embodiment.
The fifth embodiment is a liquid cooling system 1A that transfers the heat of the semiconductor element (power device 402), which is a representative example of the power module Pm, to the heat receiving jacket 10D.

  The power module Pm is obtained by bonding a power device 402 such as an IGBT (Insulated Gate Bipolar Transistor) to the insulating substrate 1001 with a solder h1 or the like, and is mounted and used for traveling control of a car, a railway vehicle or the like. In transporting the heat of the power device 402, the liquid cooling system 1A is used. The heat receiving jacket 10D in the liquid cooling system 1A is connected to the power module Pm via the heat conductive grease 500.

  A porous metal 22 is mounted inside the heat receiving jacket 10D. That is, the heat receiving jacket 10D has a flat plate-shaped jacket base portion 10a and a box-shaped jacket box portion 10b of which one surface is opened. A porous metal 22 is stored inside the jacket box 10b.

The jacket box portion 10b and the jacket base portion 10a are sealed by an O-ring disposed between them and fixed by fastening a fixing screw 28 to constitute a heat receiving jacket 10D.
The jacket box portion 10 b and the outer wall 26 of the jacket base portion 10 a are integrated as a heat receiving jacket 10 D by an O-ring 27 and a fixing screw 28. Although the refrigerant liquid inlet and the refrigerant liquid outlet are not shown, the refrigerant liquid flows into the heat receiving jacket 10D from the refrigerant liquid inlet. Then, it flows out of the refrigerant liquid outlet through the porous metal 22.

According to the above configuration, the assembly of the upper power module Pm can be made, and the heat receiving jacket 10D can be integrally screwed in and assembled. Therefore, it is easy to assemble and maintain.
Further, the heat of the power device 402 can be transmitted to the porous metal 22 of the small heat receiving jacket 10D, and the heat can be transported by the refrigerant liquid. As a result, the power device 402 can be cooled and kept below the allowable temperature.

  Therefore, by keeping the temperature of the power device 402 within the allowable temperature, the normal operation of the power device 402 can be ensured. Therefore, the reliability of the device using the power device 402 can be improved.

  FIG. 8B is a cross-sectional view of the heat receiving jackets 10E1 and 10E2 of the liquid cooling system 1B for cooling the heat of the semiconductor device of the other example 1 of the fifth embodiment.

  As illustrated in FIG. 8B, the power modules Pm illustrated in FIG. 8A can respectively receive the heat receiving jackets 10E1, 10E2,... Of the liquid cooling system 1B as a plurality of (two or more) power modules Pm. It should be noted that the plurality of power modules Pm and the respective heat receiving jackets 10E1, 10E2,... May be arranged not only in the lateral direction (left and right direction in FIG. 8B) but also in the vertical direction (front and rear direction in FIG. 8B). .

  Thereby, cooling control of a plurality of power modules Pm can be performed. Further, since a plurality of power modules Pm can be configured, the power modules Pm can be configured according to an arbitrary number of target devices. Therefore, the handling of each block can be performed, and the assemblability is good. Further, maintenance of the plurality of power modules Pm and the heat receiving jackets 10E1, 10E2,... Can be performed simultaneously, and the maintainability is good.

FIG. 8C shows a cross-sectional view of one heat receiving jacket 10F of a liquid cooling system 1C that cools a plurality of power modules Pm in another example 2 of the fifth embodiment.
The plurality of (two or more) power modules Pm may be fixed by screwing one heat receiving jacket 10F of the liquid cooling system 1C.

According to this configuration, it is possible to receive and cool the power modules Pm of a plurality of multi heating elements with one heat receiving jacket 10F. In addition, the structure is simple, and the assembly and maintenance are good.
The plurality of power modules Pm may be arranged not only in the lateral direction (left and right direction in FIG. 8C) but also in the vertical direction (front and rear direction in FIG. 8C).

Sixth Embodiment
FIG. 9 is a perspective view showing the internal structure of the electronic device D to which the liquid cooling system 1 using the porous metal of the sixth embodiment is applied with the upper plate of the lid 5 removed. , The top view is shown.
In the electronic device D of the sixth embodiment, for example, in consideration of its maintainability, a plurality of (three in this example) large-capacity recording devices are provided on one side (the front side shown in the right side of FIG. 9 in this example). A hard disk drive 51 is provided. A plurality of (four in this example) cooling fans 710 for air cooling the hard disk drive 51 serving as a heat generation source in the housing 5 are attached to the rear side thereof.

  Then, in the rear space between the housing 5 and the other surface of the housing 5, a block 54 is provided together with the cooling fan 710, in which a LAN serving as an interface of the power supply and the communication means is housed. Also, a radiator 160 is disposed behind the four cooling fans 710 for air cooling the hard disk drive 51.

  That is, the radiators 160 constituting the liquid cooling system 1 are arranged side by side along the path of the air (cooling air) supplied from the outside by the cooling fan 710. That is, the radiators 160 are mounted side by side in parallel with the row of the cooling fans 710. That is, two radiators 160 are provided behind the cooling fan 710.

Behind the radiator 160 on the right hand, two heat receiving jackets 10G are provided.
Furthermore, in the remaining space, a circuit board 1000 on which semiconductor elements C (403) (see FIG. 10) and semiconductor elements D (404), which are a plurality of heat sources, are mounted on the surface. Two sets of liquid cooling systems 1 of the sixth embodiment similar to the first embodiment are provided in the two semiconductor devices C (403) and the semiconductor devices D (404) (hereinafter, parentheses are omitted).
The liquid cooling system 1 is constituted by the small heat receiving jacket 10G described above, the radiator 160, the pump 200 (see FIG. 10), and a pipe 300 for connecting them and through which the refrigerant liquid flows.

  The plurality of heat sources such as the semiconductor element C403 (see FIG. 10) and the semiconductor element D404 are attached and fixed to the small heat receiving jacket 10E via the heat conductive grease 500. That is, the surfaces of the two sets of semiconductor elements C403 and D404 are connected to the bottom surface and the side surface of the heat receiving jacket 10G respectively via the thermally conductive grease 500 applied therebetween, and good thermal bonding is achieved. I have secured.

The heat of the semiconductor element C (hidden in FIG. 9), the heat of the semiconductor element D 404 is transmitted from the small heat receiving jacket 10G to the radiator 160 by the refrigerant liquid, from the radiator 160 to the air by the cooling fan 170, to the air from the server housing 5 discharge.
Therefore, also in the electronic device D such as a semiconductor device, the liquid cooling system 1 including the heat receiving jacket 10G can be used.

  As described above, in the above-described structure of the electronic device D, the cooling fan 710 which is a cooling means of the hard disk drive 51 of another device incorporated in the housing 5 is the radiator 160 which constitutes the liquid cooling system 1 of the present invention Is used (or shared) as a means for cooling the fins.

  According to this configuration, the semiconductor element C403 and the semiconductor element D404 which are heat sources in the housing 5 can be cooled without having a dedicated cooling fan. In other words, the semiconductor elements C · D 403 and 404 which are heat sources can be cooled relatively easily, inexpensively, efficiently and reliably.

Therefore, the liquid cooling system 1 which can cool the semiconductor element C403 of several heat generating bodies and the semiconductor element D404 can be made compact.
Further, according to the liquid cooling system 1 of the sixth embodiment, the heat exchange efficiency is relatively high, and the structure is relatively simple. Therefore, even in the case of an electronic device D such as a server that requires high density mounting, a highly flexible arrangement of the liquid cooling system 1 is possible.

Moreover, the radiator 160 which comprises the liquid cooling system 1 is arrange | positioned so that the exhaust surface of the several cooling fan 710 may be covered.
According to this configuration, even if any of the cooling fans 710 is stopped due to a failure, the cooling air generated by the remaining cooling fans 710 continues cooling of the radiator 160. That is, since redundancy can be secured, it is suitable as a structure of a cooling system of the electronic device D. If the radiator 160 is brought closer to the side of the cooling fan 710 having a smaller area opposite to this, the redundancy can be further improved against the stop due to the failure of any of the cooling fans 710.
Thus, the system of the highly reliable electronic device D can be provided.

Other Embodiments
1. In the said embodiment, although the shape which combined the rectangular parallelepiped and the rectangular parallelepiped with the heat receiving jackets 10-10G was illustrated, another shape may be sufficient. The heat-receiving jacket 10 may have any shape, for example, spherical, cylindrical, conical, or polygonal. That is, the heat receiving jacket 10 can select an arbitrary shape.

2. In the second to fourth embodiments, the case where the space is provided in the vicinity of both the refrigerant liquid inlet 23 and the refrigerant liquid outlet 24 has been exemplified, but in any one of the refrigerant liquid inlet 23 and the refrigerant liquid outlet 24 A space may be provided. Also in this case, the same effects as those of the second to fourth embodiments described above can be obtained.

3. Although various configurations have been described in the embodiment and the like, the above configurations may be appropriately selected and combined.
Further, various configurations described in the embodiment and the like show an example of the present invention, and various modifications and concrete forms are possible within the scope of the claims.

  The present invention can be widely applied to cooling devices for heating elements such as IT devices, devices for vehicles, servers, etc., as examples of application of the present invention.

1, 1A, 1B, 1C Liquid cooling system 10, 10A, 10B, 10C, 10D, 10F Heat receiving jacket 10a1, 10a2, 10b1, 10b2, 10c1, 10c2, 10c3 Space 10s Outer cover (solid metal)
Reference Signs List 20 fine wire 21 cavity 22 porous metal 23 refrigerant liquid inlet (inlet)
24 Refrigerant liquid outlet (outlet)
25 Metallic bonding (Brazed)
26 Outer wall 27 O-ring (sealing material)
28 Fixing screw 51 Hard disk drive 54 Block containing LAN 100 Refrigerant liquid (refrigerant)
110 Air 160 Radiator (radiator for heat radiation)
161 Flat tube 162 Header 163 Heat dissipation fin 200 Pump (pump for driving refrigerant)
300 Piping 400 Heating element A (heating element)
401 Heating element B (heating element)
402 Power device (heating element)
403 Semiconductor Element C (Heating Element)
404 Semiconductor Element D (Heating Element)
500 Heat Transfer Grease (Heat Transfer Member)
710 cooling fan 711 cooling fan 712 blade 1000 circuit board 1001 insulating board D electronic device (semiconductor device)

Claims (10)

Porous metal,
An outer cover provided metallically on at least a portion of the porous metal and provided around the porous metal;
A liquid refrigerant inlet and an outlet provided on the outer cover;
The outer cover is a metal member,
A heat receiving jacket characterized in that a portion of the outer cover metallurgically joined to the porous metal is attached to a heat generating body via a heat conducting member to absorb heat of the heat generating body. Porous metal,
With solid metal forming the outer cover,
The solid metal covers the porous metal with an outer wall, and the porous metal is provided inside the outer cover,
A heating element is attached to the outer surface of at least one of the outer walls via a heat conducting member,
The outer wall is provided with a liquid refrigerant inlet and an outlet.
A heat receiving jacket characterized in that the inner surface where the porous metal and the outer wall are in contact with each other at a place where the heat generating element is attached, is metallically bonded. Porous metal,
An outer cover provided around the porous metal and thermally coupled to at least a portion of the porous metal;
A liquid refrigerant inlet and an outlet provided on the outer cover;
The outer cover is formed of a thermally conductive material,
A heat receiving jacket characterized in that a portion of the outer cover joined so as to conduct heat with the porous metal is attached to a heat generating body via a heat conductive member to absorb the heat of the heat generating body. In the heat receiving jacket according to any one of claims 1 to 3,
A heat receiving jacket characterized by having a space between the inlet and the porous metal near at least any one of the outlets. In the heat receiving jacket according to any one of claims 1 to 3,
A heat receiving jacket characterized in that the number of the inlets is smaller than the number of the outlets. In the heat receiving jacket according to any one of claims 1 to 3,
A heat receiving jacket characterized in that the direction of the liquid refrigerant flowing into the porous metal is different from the direction of the liquid refrigerant flowing out of the porous metal. In the heat receiving jacket according to any one of claims 1 to 3,
A heat-receiving jacket, characterized in that the outer wall of the heat-receiving jacket and the porous metal are joined metallically or fixed via a sealing material. The heat receiving jacket according to claim 7,
A plurality of the heat generating members provided on the outer wall of the heat receiving jacket via a heat conducting member. The heat receiving jacket according to any one of claims 1 to 3;
A refrigerant drive pump,
A radiator for heat radiation,
Equipped with piping,
A liquid cooling system characterized in that liquid refrigerant flows in the heat receiving jacket, the refrigerant driving pump, the heat radiating radiator, and the pipe. 10. The semiconductor device according to claim 9, wherein the heat receiving jacket and the heat generating element of the liquid cooling system according to claim 9 are fixed via a heat conducting member.