JP2019096584A - Contact plating structure - Google Patents

Abstract

An object of the present invention is to provide a contact plating structure capable of increasing a contact area of a contact portion and reducing contact resistance.
SOLUTION: A contact portion 3 capable of contacting each other, a surface plating layer 5 formed on the outermost surface of the contact portion 3, and a base plating formed between a base material 7 of the contact portion 3 and the surface plating layer 5 In contact plating structure 1 having layer 9, intermediate plating layer 11 is provided between surface plating layer 5 and base plating layer 9 to provide ductility to surface plating layer 5 when contact portion 3 contacts. It formed.
[Selected figure] Figure 2

Description

  The present invention relates to a contact plating structure. In particular, the present invention relates to a contact plating structure having a plating formed on surfaces of contact portions that can contact each other.

  Conventionally, as a contact plating structure, an electrical contact as a contact portion that can be contacted with each other, an Ag layer as a surface plating layer formed on the outermost surface of the electrical contact, and a base material of the electrical contact and the Ag layer The thing provided with the Ag-Sn alloy layer formed in is known (for example, refer patent document 1).

  In this contact plating structure, the contact resistance with the other connector terminal is reduced by forming an Ag layer on the outermost surface of the electrical contact, and the Ag-Sn layer is formed below the Ag layer to achieve heat resistance and the like. Improves wear resistance.

  In such a contact plating structure, the base material of the electric contact is made of copper or copper alloy, and it is suppressed that the copper atoms diffuse from the base material of the electric contact to the outermost surface to form an oxide due to the temperature rise. In addition, a Ni layer as a base plating layer is formed on the base material of the electrical contact.

JP, 2015-219975, A

  By the way, in the contact plating structure as in Patent Document 1, the connection between the surface plating layer made of silver (Ag) and the Ag-Sn layer made of silver (Ag) and tin (Sn) is strong, and nickel (Ni (Ni) There is a strong bond between the base plating layer of A) and the Ag-Sn layer.

  However, when an intermediate plating layer such as an Ag-Sn layer having a strong bond between the surface plating layer and the base plating layer is formed, the surface plating layer is the surface of the intermediate plating layer when the contact portion comes in contact. It was difficult to extend upward, the contact area of the contact portion did not increase so much, and the contact resistance could not be reduced efficiently.

  Then, this invention can increase the contact area of a contact part, and it aims at provision of the contact plating structure which can reduce contact resistance.

  The invention according to claim 1 is a contact portion which can be mutually contacted, a surface plating layer formed on the outermost surface of the contact portion, and a base formed between a base material of the contact portion and the surface plating layer. A contact comprising: a plating layer; and an intermediate plating layer which is formed between the surface plating layer and the base plating layer and which imparts ductility to the surface plating layer when the contact portion comes in contact with each other. It is a plating structure.

  In this contact plating structure, since an intermediate plating layer is provided between the surface plating layer and the base plating layer to impart ductility to the surface plating layer when the contact portion comes in contact, the ductility by the intermediate plating layer is formed. The surface plating layer can be easily extended by the application of the above, and the contact area of the contact portion can be increased.

  Therefore, in such a contact plating structure, the contact area of the contact portion can be increased, and the contact resistance can be reduced.

  The invention according to claim 2 is the contact plating structure according to claim 1, wherein the intermediate plating layer is made of a material having a lower affinity than the base plating layer with respect to the surface plating layer. .

  In this contact plating structure, since the intermediate plating layer is made of a material having a lower affinity to the surface plating layer than the base plating layer, bonding between the surface plating layer and the intermediate plating layer can be reduced. Is likely to flow on the surface of the intermediate plating layer, and the contact area of the contact portion can be increased.

  The invention according to a third aspect is the contact plating structure according to the first aspect, wherein the intermediate plating layer is made of a material having a hardness lower than that of the surface plating layer.

  In this contact plating structure, since the intermediate plating layer is made of a material having a hardness lower than that of the surface plating layer, the flexibility of the intermediate plating layer makes it easy to deform the surface plating layer, and the contact area of the contact portion can be increased. .

  According to the present invention, the contact area of the contact portion can be increased, and the contact plating structure capable of reducing the contact resistance can be provided.

It is sectional drawing of the male terminal as an example to which the contact point plating structure which concerns on embodiment of this invention is applied, and a female terminal. It is sectional drawing of the contact point plating structure which concerns on 1st Embodiment of this invention. It is sectional drawing of the connection part side of the contact point plating structure which concerns on 1st Embodiment of this invention. It is sectional drawing of the contact point plating structure which concerns on 2nd Embodiment of this invention. It is sectional drawing of the connection part side of the contact point plating structure which concerns on 2nd Embodiment of this invention.

  First, an example of the entire structure to which the contact plating structure according to the embodiment of the present invention is applied will be described using FIG.

  The contact plating structure according to the embodiment of the present invention is applied to, for example, the contact portion 3 for electrically connecting the male terminal 13 and the female terminal 15 as shown in FIG.

  The male terminal 13 has a tab-like connection portion 17 by processing a thin plate-like base material made of a copper-based metal such as copper (Cu) or a copper alloy.

  The male terminal 13 is electrically connected to a power source, equipment, etc. on the opposite side to the connecting portion 17, and the connecting portion 17 is inserted into the box-like connecting portion 19 of the female terminal 15, whereby the male terminal 13 and the female terminal are connected. And 15 are electrically connected.

  The female terminal 15 has a box-like connection portion 19 by processing a thin plate-like base material made of a copper-based metal such as copper or copper alloy.

  The female terminal 15 is electrically connected to the power supply, equipment, etc. on the opposite side to the connecting portion 19, and is connected to the tab-shaped connecting portion 17 in the connecting portion 19 into which the tab-shaped connecting portion 17 of the male terminal 13 is inserted. A contact portion 21 to be contacted is provided.

  The contact portion 21 is provided so as to protrude from the elastic piece 23 provided so as to be elastically deformable in the connection portion 19, and the tab-like connection portion 17 is inserted into the connection portion 19. The male terminal 13 and the female terminal 15 are electrically connected by being in contact with the tab-like connection portion 17.

  Hereinafter, the contact plating structure according to the embodiment of the present invention in the contact portion 3 such as the contact between the connection portion 17 of the male terminal 13 and the contact portion 21 of the female terminal 15 with reference to FIGS. Will be explained.

First Embodiment
The first embodiment will be described using FIGS. 2 and 3.

  The contact plating structure 1 according to the present embodiment includes the contact portion 3 capable of contacting each other, the surface plating layer 5 formed on the outermost surface of the contact portion 3, the base material 7 of the contact portion 3 and the surface plating layer 5 And a base plating layer 9 formed between the two.

  Then, an intermediate plating layer 11 is provided between the surface plating layer 5 and the base plating layer 9 to impart ductility to the surface plating layer 5 when the contact portion 3 contacts.

  Further, the intermediate plating layer 11 is made of a material having a lower affinity to the surface plating layer 5 than the base plating layer 9.

  As shown in FIG. 2 and FIG. 3, the surface of the contact portion 3 in the vicinity of a portion in contact with the contact portion 21 of at least the female terminal 15 (see FIG. 1) of the connection portion 17 of the male terminal 13 (see FIG. A plated layer 5, a base plated layer 9, and an intermediate plated layer 11 are formed.

  The surface plating layer 5 is made of gold (Au), Au alloy, silver (Ag) or Ag alloy, and is formed on the outermost surface of the contact portion 3 (connection portion 17).

  The surface plating layer 5 contacts the surface of the contact portion 21 when the contact portion 21 contacts the connection portion 17 in the contact portion 3 and reduces contact resistance by being made of Au or Ag.

  The base plating layer 9 is made of nickel (Ni), and is integrally formed on the surface of the base material 7 of the contact portion 3 between the base material 7 of the contact portion 3 and the surface plating layer 5.

  In the base plating layer 9, copper (Cu) constituting the base material 7 of the contact portion 3 diffuses Cu atoms from the base material 7 to the surface of the surface plating layer 5 to form an oxide when the temperature rises. Suppress that.

  The intermediate plating layer 11 is integrally formed on the surface of the surface plating layer 5 and the surface of the base plating layer 9 between the surface plating layer 5 and the base plating layer 9.

  Here, when the intermediate plating layer 11 is not provided between the surface plating layer 5 and the base plating layer 9, the base plating layer 9 is integrally formed on the surface of the base material 7 of the contact portion 3. The surface plating layer 5 is integrally formed on the surface of the.

  In such a plating structure, the base plating layer 9 (Ni) and the surface plating layer 5 (Au) have a strong bond (adhesion) to each other, and when the contact portion 21 contacts the connection portion 17, surface plating The layer 5 was difficult to extend, and it was difficult to obtain the contact area of the connection portion 17 with the contact portion 21.

  Therefore, the intermediate plating layer 11 is made of a material that imparts ductility to the surface plating layer 5 when the contact portion 21 contacts the connection portion 17.

  Specifically, the intermediate plating layer 11 is made of, for example, a metal having lower mutual solubility with Au of the surface plating layer 5 than Ni of the base plating layer 9.

  By providing the intermediate plating layer 11, the affinity of the intermediate plating layer 11 to the surface plating layer 5 is lower than that of the base plating layer 9, and the connection between the surface plating layer 5 and the intermediate plating layer 11 (adhesion) ) Can be weakened.

  Therefore, when the contact portion 21 comes in contact with the connection portion 17, the surface plating layer 5 has the intermediate plating layer 11 as shown by the arrow in FIG. 2 than when it is formed on the surface of the base plating layer 9. It becomes easy to flow and to extend on the surface of the contact surface, and the contact area of the connection portion 17 with the contact portion 21 can be gained.

  In such a contact plating structure 1, an intermediate plating layer 11 is formed between the surface plating layer 5 and the base plating layer 9 to impart ductility to the surface plating layer 5 when the contact portion 3 comes into contact. Therefore, the provision of ductility by the intermediate plating layer 11 facilitates the surface plating layer 5 to be extended, and the contact area of the contact portion 3 can be increased.

  Therefore, in such a contact plating structure 1, the contact area of the contact portion 3 can be increased, and the contact resistance can be reduced.

  Further, since the intermediate plating layer 11 is made of a material having a lower affinity to the surface plating layer 5 than the base plating layer 9, the connection between the surface plating layer 5 and the intermediate plating layer 11 can be reduced. The layer 5 can easily flow on the surface of the intermediate plating layer 11, and the contact area of the contact portion 3 can be increased.

Second Embodiment
The second embodiment will be described with reference to FIGS. 4 and 5.

  In contact plating structure 101 according to the present embodiment, intermediate plating layer 103 is made of a material having a hardness lower than that of surface plating layer 5.

  The same components as those in the first embodiment are indicated by the same symbols, and the explanation of the configuration and functions will be made with reference to the first embodiment, but the explanation will be omitted because they are the same as the first embodiment. The effects are the same.

  As shown in FIGS. 4 and 5, the surface plated layer 5 is made of gold (Au), Au alloy, silver (Ag) or Ag alloy, and is formed on the outermost surface of the contact portion 3 (connection portion 17). There is.

  An intermediate plated layer 103 is integrally formed on the surface of the surface plated layer 5 and the surface of the base plated layer 9 between the surface plated layer 5 and the base plated layer 9.

  In the present embodiment, surface plating layer 5, base plating layer 9, and intermediate plating layer 103 are provided also on the side of contact portion 21, but have the same configuration as the plating layer on the side of connection portion 17. Therefore, the same reference numerals are given and the explanation of the contact portion 21 is omitted.

  The intermediate plating layer 103 is made of a material that imparts ductility to the surface plating layer 5 when the contact portion 21 contacts the connection portion 17.

  Specifically, the intermediate plating layer 103 is made of, for example, tin (Sn) having a hardness lower than that of Au or Ag of the surface plating layer 5.

  By providing the intermediate plating layer 103, the base of the surface plating layer 5 becomes soft, and the surface plating layer 5 easily deforms following the intermediate plating layer 103.

  Therefore, when the contact portion 21 contacts the connection portion 17, the surface plating layer 5 is likely to extend following the deformation of the intermediate plating layer 103, and the contact area of the connection portion 17 with the contact portion 21 can be increased. it can.

  In such a contact plating structure 101, since the intermediate plating layer 103 is made of a material having a hardness lower than that of the surface plating layer 5, the surface plating layer 5 is easily deformed by the flexibility of the intermediate plating layer 103. The contact area can be increased.

  In addition, although the metal used for a plating layer is illustrated in the contact point plating structure which concerns on embodiment of this invention, not only the illustrated metal but what kind of metal is used for a surface plating layer and a base plating layer Any metal may be used as the intermediate plating layer as long as it imparts ductility to the surface plating layer when the contact portion is in contact.

  In addition, the intermediate plating layer may be any metal having a lower affinity to the surface plating layer than the base plating layer or a lower hardness than the surface plating layer.

1, 101 ... contact plating structure 3 ... contact portion 5 ... surface plating layer 7 ... base material 9 ... base plating layer 11, 103 ... intermediate plating layer

Claims (3)

Contact parts that can contact each other;
A surface plating layer formed on the outermost surface of the contact portion;
An undercoating layer formed between the base material of the contact portion and the surface plating layer;
An intermediate plating layer formed between the surface plating layer and the base plating layer to impart ductility to the surface plating layer when the contact portion comes in contact;
Contact plating structure characterized by having. The contact plating structure according to claim 1, wherein
The contact plating structure, wherein the intermediate plating layer is made of a material having a lower affinity to the surface plating layer than the base plating layer. The contact plating structure according to claim 1, wherein
The contact plating structure, wherein the intermediate plating layer is made of a material having a hardness lower than that of the surface plating layer.

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