JP2019082621A - Display unit and manufacturing method thereof - Google Patents

Abstract

A display device capable of withstanding long-term use is provided. An organic EL display (1) includes a first substrate (2), a display element (3) provided on the surface of the first substrate, and a surface of the first substrate, which is in close contact with the surface surrounding the display element. A thermosetting adhesive that covers the sealing material 4B made of low melting point metal, the second substrate 5 facing the first substrate, the display element and the sealing material, and fills the gap between the first substrate and the second substrate. A protective layer 6B. [Selection] Figure 1

Description

  The present invention relates to a display device such as an organic EL display and a quantum dot display and a method of manufacturing the same.

  In recent years, organic EL (Electro Luminescence) displays have attracted attention. The organic EL display includes a drive circuit substrate on which an organic EL layer functioning as a display unit is formed, and an opposing substrate. The organic EL layer provided on the drive circuit substrate side is covered with a protective film. The drive circuit substrate and the opposite substrate are disposed to face each other with the organic EL layer covered by the protective film interposed therebetween, and are bonded by a sealing material disposed to surround the organic EL layer.

  Generally, the sealing material is made of an organic material. In particular, in the organic EL display, there is a problem that moisture or oxygen easily infiltrates from the outside to the inside of the organic EL display through the interface between the sealing material and the drive circuit substrate. When moisture, oxygen and the like enter into the inside of the organic EL display, there is a problem that the element materials constituting the organic EL layer, such as the electron transport layer, the light emitting layer, and the hole transport layer, are altered. In addition to this, there is a problem that the electrode peels off the organic EL layer when moisture, oxygen or the like enters the inside of the organic EL display.

  As a prior art, there is known an organic EL display device in which a moisture blocking portion made of a low melting point inorganic material is provided between an inner seal and an outer seal both surrounding the organic EL layer in a frame shape. (See Patent Document 1). In the manufacture of the organic EL display device, the moisture blocking portion is formed to abut on both the array substrate and the counter substrate. That is, the water blocking portion is formed to penetrate the seal. In this prior art, when the array substrate and the opposite substrate are bonded to each other, the gap between the two substrates is filled with a filler.

JP, 2015-222644, A

  In the above-mentioned prior art, in order to form the moisture blocking portion so as to abut on both the array substrate and the opposing substrate, the design size and volume of each of the inner seal, the moisture blocking portion and the outer seal, and the distance between them Etc. need to be set with high accuracy.

  In the above-mentioned prior art, since the process of forming the inner seal, the process of forming the outer seal, the process of forming the water blocking portion, and the process of forming the filler are required, the number of manufacturing processes is large. Problem of becoming

  In the above-mentioned prior art, when the array substrate and the counter substrate are pasted together, the height of the water blocking portion is set lower than the height of the inner seal and the outer seal. For this reason, in this prior art, there is a problem that air is enclosed inside the seal constituted by the inner seal, the moisture blocking portion and the outer seal. For this reason, there is a possibility that the sealability of the interface between the array substrate and the counter substrate, in which the inner seal, the outer seal, and the moisture blocking portion abut, is reduced. In particular, when the sealability at the interface between the moisture blocking portion and the array substrate is reduced, moisture or the like enters to cause deterioration of the organic EL layer, peeling of the electrode, and the like, and the lifetime of the organic EL display device is shortened.

  This invention is made in view of said subject, Comprising: It aims at providing the display apparatus which can endure long-term use, and its manufacturing method.

  In order to solve the problems described above and achieve the object, an aspect of the present invention is a display device, comprising: a first substrate, a display element provided on the surface of the first substrate, and the surface, A sealing material made of a low melting point metal, which is in close contact with and bonded to the surface surrounding the display element, a second substrate facing the first substrate, and the second substrate, the display element and the sealing material And a protective layer made of a thermosetting adhesive and filling a gap between the first substrate and the second substrate.

  In the above aspect, it is preferable that a metal film having high wettability of the low melting point metal be interposed between the surface and the sealing material.

  In the above aspect, the low melting point metal is preferably selected from gallium, indium, bismuth, tin, and an alloy thereof.

  In the aspect described above, the thermosetting adhesive is preferably selected from an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a thermosetting polyimide, an alkyd resin, and a polyurethane.

  Another aspect of the present invention is a method of manufacturing a display device, which comprises the steps of forming a display element on the surface of a first substrate, and a protective layer made of a thermosetting adhesive before thermosetting on the surface of a second substrate. And disposing a sealing material made of low melting point metal on the surface of the protective layer so as to form a ring around the periphery of the second substrate; The second substrate is disposed opposite to each other, and pressure is applied to form a predetermined gap, and the sealing material is buried in the protective layer in a state where the sealing material is in contact with the surface of the first substrate. In the step of bonding the first substrate and the second substrate, and in the state where the first substrate and the second substrate are bonded, the curing temperature of the thermosetting adhesive and the melting point of the sealing material are the highest. Temperature above to heat cure the protective layer and melt the sealing material. And that step, characterized in that it comprises a.

  Another aspect of the present invention is a method of manufacturing a display device, which comprises the steps of forming a display element on the surface of a first substrate, and a protective layer made of a thermosetting adhesive before thermosetting on the surface of a second substrate. Placing a sealing material made of a low melting point metal on the surface of the first substrate so as to form a ring around the periphery of the first substrate; and And the second substrate are arranged opposite to each other and pressurized so as to have a predetermined gap, and the sealing material is embedded in the protective layer and attached in a state where the sealing material is in contact with the surface of the first substrate Combining the first substrate and the second substrate, heating the curing temperature of the thermosetting adhesive and the melting point of the sealing material to a higher temperature or higher, Heat curing the protective layer to melt the sealing material. And butterflies.

  In the above aspect, it is preferable that the method further comprises the step of forming a metal film having high wettability of a low melting point metal in a region of the surface of the first substrate where the sealing material is disposed.

  In the above aspect, the low melting point metal is preferably selected from gallium, indium, bismuth, and an alloy thereof.

  In the aspect described above, the thermosetting adhesive is preferably selected from an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a thermosetting polyimide, an alkyd resin, and a polyurethane.

  In the aspect described above, the sealing material is preferably formed by a printing method.

  ADVANTAGE OF THE INVENTION According to this invention, the display apparatus which can endure long-term use and its manufacturing method can be provided.

FIG. 1 is a cross-sectional view of a display device according to a first embodiment of the present invention. FIG. 2 is a plan view of a display device according to the first embodiment of the present invention. FIG. 3 is process sectional drawing which shows the manufacturing method of the display apparatus based on the 1st Embodiment of this invention. FIG. 4 is a process sectional view showing a method of manufacturing a display device according to the first embodiment of the present invention. FIG. 5 is a process sectional view showing a method of manufacturing a display device according to the first embodiment of the present invention. FIG. 6 is a process sectional view showing a method of manufacturing a display device according to the first embodiment of the present invention. FIG. 7 is a process sectional view showing a method of manufacturing a display device according to the second embodiment of the present invention. FIG. 8 is a process sectional view showing a method of manufacturing a display device according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view of a display device according to a third embodiment of the present invention. FIG. 10 is a process sectional view showing a method of manufacturing a display device according to the third embodiment of the present invention. FIG. 11 is a process sectional view showing a method of manufacturing a display device according to a third embodiment of the present invention. FIG. 12 is a process sectional view showing a method of manufacturing a display device according to a third embodiment of the present invention. FIG. 13 is a process sectional view showing a method of manufacturing a display device according to a third embodiment of the present invention. FIG. 14 is a process sectional view showing a method of manufacturing a display device according to the fourth embodiment of the present invention.

  The present invention is applicable to display devices such as organic EL displays and quantum dot displays. Hereinafter, an embodiment in which the present invention is applied to an organic EL display will be described based on the drawings. However, it should be noted that the drawings are schematic, and that the dimensions and ratios of the dimensions and shapes of the respective members are different from actual ones. In addition, parts having different dimensional relationships, ratios, and shapes among the drawings are included.

First Embodiment
(Configuration of display device)
FIGS. 1 and 2 show an organic EL display 1 as a display device according to a first embodiment of the present invention. As shown in FIG. 1, the organic EL display 1 includes a drive circuit board 2 as a first substrate, an organic EL display element 3 as a display element, a sealing material 4B, and an opposing substrate 5 as a second substrate. And a protective layer 6B.

  In the present embodiment, the drive circuit substrate 2 and the counter substrate 5 are formed of a glass substrate. As shown in FIG. 1, the drive circuit board 2 and the counter board 5 are arranged at predetermined gaps so as to face each other.

  The organic EL display element 3 is provided along the surface 2 A of the drive circuit board 2. The organic EL display element 3 includes pixel regions arranged in a matrix. Each pixel region is provided with a switching element. The organic EL display device 3 includes at least a hole transport layer, a light emitting layer, an electron transport layer, an electrode, a wiring, and the like.

  As shown in FIGS. 1 and 2, the sealing material 4B is formed in an annular shape surrounding the organic EL display element 3 on the surface 2A of the drive circuit substrate 2, and is closely bonded to the surface 2A. The sealing material 4B is made of, for example, a low melting point metal such as a single substance such as gallium (Ga), indium (In), bismuth (Bi), tin (Sn) or an alloy containing them.

  The protective layer 6B is formed of, for example, a thermosetting adhesive such as an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a thermosetting polyimide, an alkyd resin, and a polyurethane. In the present embodiment, the protective layer 6B covers the organic EL display element 3 and the sealing material 4 at once and fills the gap between the drive circuit substrate 2 and the counter substrate 5.

  The organic EL display 1 is subjected to heat treatment at a temperature higher than the curing temperature of the thermosetting adhesive constituting the protective layer 6B and at a temperature higher than the melting point of the sealing material 4B. For this reason, the thermosetting adhesive constituting the protective layer 6B is in a cured state. Since the heat treatment is performed on the protective layer 6B, the drive circuit board 2 and the counter substrate 5 are bonded in a state of being in close contact with the protective layer 6B. Of course, the temperature of the heat treatment is performed at a temperature that does not affect the performance of the organic EL display element 3.

  The sealing material 4B is sealed in close contact with the drive circuit board 2 by the protective layer 6B. Since the sealing material 4B is subjected to heat treatment at a temperature higher than the melting point when the protective layer 6B is thermally cured, the bonding closely follows the fine unevenness of the glass structure of the surface 2A of the drive circuit board 2 at the time of melting. It is joined by the surface. Also, for example, even if lead wiring or the like is covered with the insulating film and formed on the surface 2A of the drive circuit substrate 2, the melted sealing material 4A (see FIG. 5) follows the minute step shape such as the insulating film. Form a close interface. Therefore, the bonding interface between the seal material 4B solidified by lowering the temperature and the drive circuit board 2 is highly airtight and water tight.

  Since the protective layer 6B is configured to cover the entire organic EL display element 3, the organic EL display element 3 is isolated and protected from the external environment, and the surface of the organic EL display element 3 is mechanically and chemically protected.

  The sealing material 4B is sealed in the protective layer 6B in a state in which the sealing material 4B is in close contact with and is bonded to the drive circuit substrate 2, and therefore moisture, air, etc. pass through the interface between the sealing material 4B and the drive circuit substrate 2. You can stop that.

  Further, since the protective layer 6B is thermally cured, a strong adhesion surface is maintained not only at the interface with the drive circuit board 2 but also at the interface with the counter substrate 5. Therefore, the protective layer 6B can suppress entry of moisture, air, and the like into the display. The organic EL display 1 according to the present embodiment can prevent the occurrence of deterioration of the organic EL display element 3 due to moisture, oxygen, etc., peeling of electrodes not shown, and the like. Therefore, the organic EL display 1 according to the present embodiment can withstand long-term use.

(Method of manufacturing display device)
Next, the method of manufacturing the display device of the present invention will be described by applying the method of manufacturing the organic EL display 1 with reference to FIGS. 3 to 6.

  As shown in FIG. 3, the organic EL display element 3 is formed on the surface 2A of the drive circuit board 2. The step of forming the organic EL display device 3 includes a step of forming a hole injection electrode, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection electrode, a wiring, and the like (not shown).

  Further, on one surface of the opposing substrate 5, a protective layer 6A made of a thermosetting resin before thermosetting is applied so as to have a predetermined thickness dimension. The thickness dimension of the protective layer 6A is set to be slightly longer (thicker) than the set gap between the drive circuit substrate 2 and the counter substrate 5. The protective layer 6A is adjusted to a viscosity having fluidity so as to maintain the coated film thickness.

  As shown in FIG. 3, on the surface of the protective layer 6A formed on the surface of the counter substrate 5, a sealing material 4B made of low melting point metal is formed in a pattern that turns around along the periphery of the surface to become annular. Are formed by the printing method. The sealing material 4B shown in FIG. 3 is in a state in which the temperature is lowered and solidified after printing in a molten state. As shown in FIG. 2, when the manufacturing of the organic EL display 1 is completed, the sealing material 4B has a square annular shape along the outline of the organic EL display 1 so as to surround the organic EL display element 3. It is set.

  Next, the drive circuit substrate 2 provided with the organic EL display element 3 and the opposite substrate 5 provided with the protective layer 6A and the sealing material 4B are disposed to face each other as shown in FIG.

  Then, as shown in FIG. 4, the drive circuit board 2 and the counter board 5 are pressurized and attached. Here, the drive circuit substrate 2 and the counter substrate 5 are set to separate a predetermined gap. At this time, the sealing material 4B is buried in the protective layer 6A and is in contact with the drive circuit board 2. Further, in a state where the sealing material 4B is buried in the protective layer 6A, the surface of the protective layer 6A and the surface of the sealing material 4B (surface exposed from the protective layer 6A) become flush. At this time, the protective layer 6A is in close contact with the surface of the drive circuit board 2. As shown in FIG. 4, in the bonded state, the organic EL display element 3 is buried in the protective layer 6A in the same manner as the sealing material 4B, and is sealed by the drive circuit board 2 and the protective layer 6A.

  Next, as shown in FIG. 5, with the drive circuit substrate 2 and the counter substrate 5 attached, the curing temperature of the thermosetting adhesive that is the constituent material of the protective layer 6A, and the melting point of the sealing material 4B The heat treatment is performed for a predetermined time above the higher temperature to heat-set the protective layer 6A and melt the sealing material 4B. FIG. 5 shows the protective layer 6B in a cured state and the sealing material 4A in a melted state. Thus, the manufacture of the organic EL display 1 is completed. FIG. 6 shows the completed state of the organic EL display 1. That is, the organic EL display 1 is in a state where it returns to normal temperature after heat treatment.

  According to the above manufacturing method, since the sealing material 4B can be fluidized by heat treatment and can be bonded in close contact with the drive circuit board 2, the surface 2A of the drive circuit board 2 provided with the organic EL display element 3 is provided. Water and oxygen can be prevented from entering along. For this reason, according to the method of manufacturing the organic EL display (display device) according to the present embodiment, it is possible to prevent the deterioration of the organic EL layer constituting the organic EL display element 3 and the peeling of the electrodes. Therefore, according to the method of manufacturing an organic EL display according to the present embodiment, the organic EL display 1 having a long lifetime can be manufactured.

  According to the above manufacturing method, as shown in FIG. 3, if the sealing material 4B is formed on the protective layer 6A, the size, shape, and volume of the sealing material 4B are not affected by the accuracy. A reliable sealing surface between the surface 2A of the drive circuit board 2 and the sealing material 4B can be secured.

  According to the above manufacturing method, the protective layer 6A applied to the counter substrate 5 is subjected to pressure treatment and heat treatment, whereby the sealing effect of the sealing material 4B, the adhesion effect between the drive circuit substrate 2 and the counter substrate 5, And the protective effect of the organic EL display element 3 can be realized simultaneously. Therefore, according to the method of manufacturing an organic EL display according to the present embodiment, the number of manufacturing steps can be reduced, and manufacturing time and cost can be significantly reduced.

  According to the above manufacturing method, since the protective layer 6B covers the whole of the organic EL display element 3, the organic EL display element 3 should be exposed to moisture or oxygen from the interface between the opposing substrate 5 and the protective layer 6B. Since the protective layer 6B protects the organic EL display element 3, deterioration of the organic EL layer constituting the organic EL display element 3, peeling of the electrode and the like can be prevented. That is, even if moisture or oxygen intrudes from the interface between the opposing substrate 5 and the protective layer 6B, the protective layer 6 causes the moisture or oxygen to reach the interface between the organic EL display element 3 and the drive circuit substrate 2 To prevent.

  In the above manufacturing method, since the sealing material 4B and the organic EL display element 3 are gradually buried in the protective layer 6A before the heat treatment along with the pressure treatment, air remains in the protective layer 6A. It is possible to suppress the formation of a cavity. For this reason, it can prevent that the cavity in which water | moisture content, oxygen, etc. are accumulate | stored in the inside of the organic EL display 1 is formed.

Second Embodiment
Next, a second embodiment in which the method for manufacturing a display device of the present invention is applied to a method for manufacturing an organic EL display will be described using FIGS. 7 and 8. In the present embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description will be omitted.

  As shown in FIG. 7, the organic EL display element 3 is formed on the surface 2A of the drive circuit substrate 2. On the periphery of the surface 2A of the drive circuit board 2, a sealing material 4B made of a low melting point metal is formed by printing so as to surround the organic EL display element 3. The sealing material 4 B is set to have a square ring shape along the contour of the organic EL display 1 so as to surround the organic EL display element 3.

  As shown in FIG. 7, on one surface of the counter substrate 5, a protective layer 6A made of a thermosetting resin before thermosetting is applied so as to have a predetermined thickness. The thickness dimension of the protective layer 6A is set to be slightly longer (thicker) than the gap between the drive circuit substrate 2 and the counter substrate 5.

  Next, the drive circuit board 2 on which the organic EL display element 3 and the sealing material 4B are provided, and the counter substrate 5 on which the protective layer 6A is formed are disposed to face each other as shown in FIG.

  Then, as shown in FIG. 8, the drive circuit board 2 and the counter board 5 are pressurized and bonded. At this time, the drive circuit board 2 and the counter board 5 are set to separate a predetermined gap. At this time, the sealing material 4B is buried in the protective layer 6A and is maintained in a state of being in contact with the drive circuit board 2 (the sealing material 4B is printed on the drive circuit board 2). In this state, the protective layer 6 is in close contact with the surface 2 A of the drive circuit board 2. As shown in FIG. 8, in the bonded state, the organic EL display element 3 is buried in the protective layer 6A in the same manner as the sealing material 4 and sealed with the drive circuit board 2 and the protective layer 6A.

  Next, in the same manner as in the first embodiment, in the state where the drive circuit board 2 and the counter board 5 are bonded to each other, the curing temperature of the thermosetting adhesive which is the constituent material of the protective layer 6A, and the sealing material By heating the protective layer 6A for a predetermined time at a temperature higher than the melting point of 4B and higher, the manufacturing of the organic EL display 1 is completed.

  In the present embodiment, since the sealing material 4B is formed on the side of the drive circuit substrate 2 with high flatness, there is an advantage that the process of forming the sealing material 4B becomes easy. In addition, since the operation and effect in the present embodiment are the same as those in the first embodiment, the description will be omitted.

Third Embodiment
(Configuration of display device)
FIG. 9 shows an organic EL display 1A as a display device according to a third embodiment of the present invention. The present embodiment is characterized in that the organic EL display 1A includes the metal film 7 in addition to the sealing material 4B. In the present embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description will be omitted.

  As shown in FIG. 9, the organic EL display 1A includes a drive circuit board 2 as a first substrate, an organic EL display element 3 as a display element, a sealing material 4B, and an opposing substrate 5 as a second substrate. A protective layer 6B and a thin metal film 7 to be bonded to the sealing material 4B are provided.

  Also in the present embodiment, the drive circuit substrate 2 and the counter substrate 5 are formed of a glass substrate. As shown in FIG. 9, the drive circuit substrate 2 and the counter substrate 5 are disposed with a predetermined gap so as to face each other.

  The organic EL display element 3 is provided along the surface 2 A of the drive circuit board 2. The metal film 7 is in close contact with and bonded to the surface so as to surround the organic EL display element 3. The metal film 7 is a metal having high wettability with the low melting point metal constituting the sealing material 4B, and examples thereof include gold (Au) and silver (Ag). In addition, the printing method, the vapor deposition method, etc. can be used as a formation method of this metal film.

  The sealing material 4 B is formed in substantially the same shape so as to overlap the metal film 7. The sealing material 4 B is made of, for example, a low melting point metal such as a single substance such as gallium (Ga), indium (In), bismuth (Bi), tin (Sn) or an alloy containing them. It has high wettability.

  The protective layer 6B is formed of, for example, a thermosetting adhesive such as an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a thermosetting polyimide, an alkyd resin, and a polyurethane. The protective layer 6 B covers the organic EL display element 3, the sealing material 4 and the metal film 7 at one time, and fills the gap between the drive circuit substrate 2 and the counter substrate 5.

  The organic EL display 1A is subjected to heat treatment at a temperature higher than the curing temperature of the thermosetting adhesive constituting the protective layer 6B and at a temperature higher than the melting point of the sealing material 4B. For this reason, the thermosetting adhesive constituting the protective layer 6B is in a cured state. Since the heat treatment is performed on the protective layer 6B, the drive circuit board 2 and the counter substrate 5 are bonded in a state of being in close contact with the protective layer 6B.

  The sealing material 4B is sealed by the protective layer 6B in close contact with the drive circuit board 2 via the metal film 7. Since the sealing material 4B is subjected to heat treatment at a temperature equal to or higher than the melting point when the protective layer 6B is thermally cured, the sealing material 4B is bonded in a state of good wettability to the metal film 7 at the time of melting.

  Since the protective layer 6B is configured to cover the entire organic EL display element 3, the organic EL display element 3 is isolated and protected from the external environment, and the surface of the organic EL display element 3 is mechanically and chemically protected. Since the sealing material 4B is sealed in the protective layer 6B in a state in which the sealing material 4B is in close contact with and bonded to the metal film 7 having high wettability with the sealing material 4B, the interface between the metal film 7 and the sealing material 4B And air can be blocked.

(Method of manufacturing display device)
10 to 13 are process sectional views showing a method of manufacturing an organic EL display in which the display device of the present invention is applied to the organic EL display 1A.

  As shown in FIG. 10, the organic EL display element 3 is formed on the surface 2 A of the drive circuit substrate 2. A metal film 7 is annularly formed on the outside of the organic EL display element 3 in the drive circuit substrate 2 so as to surround the organic EL display element 3.

  Further, on one surface of the opposing substrate 5, a protective layer 6A made of a thermosetting resin before thermosetting is applied so as to have a predetermined thickness dimension. The thickness dimension of the protective layer 6A is set to be slightly longer (thicker) than the gap between the drive circuit substrate 2 and the counter substrate 5. In this state, the protective layer 6A is adjusted to a viscosity having fluidity so as to maintain the coated film thickness.

  As shown in FIG. 10, on the surface of the protective layer 6A formed on the surface of the opposing substrate 5, a sealing material 4B made of low melting point metal is formed in a pattern that turns around along the periphery of this surface to become annular. Are formed by the printing method. The sealing material 4B shown in FIG. 10 is in a state in which the temperature is lowered and solidified after being printed in a melted state. The sealing material 4 B has an annular shape corresponding to the metal film 7.

  Next, as shown in FIG. 11, the drive circuit board 2 and the counter board 5 are faced to each other, pressed and bonded. Here, the drive circuit substrate 2 and the counter substrate 5 are set to separate a predetermined gap. At this time, the sealing material 4B and the metal film 7 are in contact with each other, and both are buried in the protective layer 6A. As shown in FIG. 11, in the bonded state, the organic EL display element 3 is buried in the protective layer 6A in the same manner as the sealing material 4 and the metal film 7, and sealed with the drive circuit board 2 and the protective layer 6A. ing.

  Next, as shown in FIG. 12, with the drive circuit substrate 2 and the counter substrate 5 attached to each other, the curing temperature of the thermosetting adhesive that is the constituent material of the protective layer 6A and the melting point of the sealing material 4B The heat treatment is performed for a predetermined time above the higher temperature to heat-set the protective layer 6A and melt the sealing material 4B. FIG. 12 shows the protective layer 6B in a cured state and the sealing material 4A in a melted state. Thus, the manufacture of the organic EL display 1A is completed.

  According to the above manufacturing method, the seal material 4B is difficult to peel off from the drive circuit board 2 by the metal film 7 having high wettability (high affinity with the seal material 4B). For this reason, it is possible to prevent moisture, oxygen, and the like from entering along the surface 2A of the drive circuit substrate 2 provided with the organic EL display element 3. According to the method of manufacturing an organic EL display according to the present embodiment, it is possible to prevent the deterioration of the organic EL layer constituting the organic EL display element 3 and the peeling of electrodes. And according to the manufacturing method of the organic EL display concerning this embodiment, organic EL display 1A with a long life can be manufactured. In the present embodiment, the sealing material 4B is formed in a band shape having the same width as the metal film 7. However, the width of the sealing material 4B is made larger than the width of the metal film 7, and the sealing material 4B is used as the driving circuit substrate 2. You may make it provide the part which contact | abuts directly.

Fourth Embodiment
FIG. 14 shows an organic EL display 1B according to a fourth embodiment of the display device of the present invention. The organic EL display 1B according to the present embodiment is characterized by including an inner seal material 41B and an outer seal material 42B, both of which are low melting point metals. The other configuration of the organic EL display 1B according to the present embodiment is the same as that of the organic EL display 1 according to the first embodiment described above, and thus the description of the other configuration is omitted.

  In the organic EL display 1B according to the present embodiment, the sealing material 41B and the sealing material 42B can reliably prevent the entry of moisture, oxygen, and the like at the interface between the surface 2A of the drive circuit substrate 2. For this reason, in the organic EL display 1B, even if water, oxygen and the like enter from the interface between the drive circuit substrate 2 in the peripheral portion and the protective layer 6B, the organic EL display 1B is used as long as the two sealing materials 41B and 42B are not overcome. It can not reach to the inside. That is, the two sealing materials 41B and 42B have an effect of suppressing the penetration of moisture, oxygen, and the like because the penetration distance of moisture, oxygen, and the like is increased.

[Other Embodiments]
Although the embodiments of the present invention have been described above, it should not be understood that the statements and drawings that form a part of the disclosure of the embodiments limit the present invention. Various alternative embodiments, examples and operation techniques will be apparent to those skilled in the art from this disclosure.

  For example, although the present invention is applied to an organic EL display as a display device in each of the above embodiments, it is needless to say that the present invention can be applied to other display devices such as a quantum dot display.

  In the above embodiments, the first substrate and the second substrate are glass substrates, but the present invention is not limited thereto.

  In each of the above-described embodiments, the protective layer 6B covering the sealing materials 4B, 41B, 42B, etc. and the protective layer 6B covering the organic EL display element 3 have a single-layer integral structure, but the area where the organic EL display element 3 is disposed And the peripheral seal area may be separated to form the protective layer 6B.

  In each of the above-described embodiments, the seal members 4B, 41B, 42B and the like are printed, but the present invention is not limited to this, and various forming methods can be applied.

  In each of the above-mentioned embodiments, although gallium, indium, bismuth, tin, and alloys thereof are mentioned as low melting point metals, the invention is not limited thereto, and other low melting point metals may be applied. . Therefore, in each of the above-described embodiments, a material which is in a solid state at normal temperature is applied as the low melting point metal, but a low melting point metal which is in a molten state at normal temperature may be applied. In this case, when the sealing material is formed on the surface of the drive circuit substrate 2 or the surface of the protective layer 6A, the ambient temperature may be set low.

1 Organic EL Display (Display Device)
2 Drive circuit board (first board)
2A Surface 3 Organic EL Display Element (Display Element)
4A Sealing material (melted)
4B Sealing material (solidified)
5 Counter substrate (second substrate)
6A Protective layer (uncured)
6B Protective layer (cured state)
7 Metal film 41B Sealing material 42B Sealing material

Claims (10)

A first substrate,
A display element provided on the surface of the first substrate;
A sealing material made of a low melting point metal that adheres to and is bonded to the surface surrounding the display element on the surface;
A second substrate facing the first substrate;
A protective layer formed of a thermosetting adhesive, provided on the second substrate, covering the display element and the sealing material, and filling a gap between the first substrate and the second substrate;
A display device comprising: The display device according to claim 1, wherein a metal film having high wettability of a low melting point metal is interposed between the surface and the sealing material. The display device according to claim 1, wherein the low melting point metal is selected from gallium, indium, bismuth, tin, and an alloy thereof. The display according to any one of claims 1 to 3, wherein the thermosetting adhesive is selected from an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a thermosetting polyimide, an alkyd resin and a polyurethane. apparatus. Forming a display element on the surface of the first substrate;
Arranging a protective layer of thermosetting adhesive before thermosetting on the surface of the second substrate;
Disposing a sealing material made of a low melting point metal on the surface of the protective layer so as to form a ring around the periphery of the second substrate;
The first substrate and the second substrate are disposed to face each other and pressurized so as to form a predetermined gap, and the sealing material is applied to the protective layer while the sealing material is in contact with the surface of the first substrate. And burying the first substrate and the second substrate.
In a state where the first substrate and the second substrate are bonded to each other, the protective layer is heated by heating to a temperature higher than the curing temperature of the thermosetting adhesive and the melting point of the sealing material. Curing and melting the sealing material;
Method of manufacturing a display device comprising: Forming a display element on the surface of the first substrate;
Arranging a protective layer of thermosetting adhesive before thermosetting on the surface of the second substrate;
Disposing a sealing material made of a low melting point metal on the surface of the first substrate so as to form a ring around the periphery of the first substrate;
The first substrate and the second substrate are disposed to face each other and pressurized so as to form a predetermined gap, and the sealing material is applied to the protective layer while the sealing material is in contact with the surface of the first substrate. Process of embedding and bonding
In a state where the first substrate and the second substrate are bonded to each other, the protective layer is heated by heating to a temperature higher than the curing temperature of the thermosetting adhesive and the melting point of the sealing material. Curing and melting the sealing material;
Method of manufacturing a display device comprising: Forming a metal film having high wettability of a low melting point metal in a region of the surface of the first substrate where the sealing material is disposed;
The manufacturing method of the display apparatus of Claim 5 or Claim 6. The method for manufacturing a display device according to any one of claims 5 to 7, wherein the low melting point metal is selected from gallium, indium, bismuth, and an alloy thereof. The display device according to any one of claims 5 to 8, wherein the thermosetting adhesive is selected from an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester resin, a thermosetting polyimide, an alkyd resin, and a polyurethane. Manufacturing method. The method for manufacturing a display device according to any one of claims 5 to 9, wherein the sealing material is formed by a printing method.

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