JP2019068023A - Soldering apparatus - Google Patents

Abstract

To provide a soldering apparatus which enables an operator to easily set soldering positions.SOLUTION: The present application discloses a soldering apparatus including: a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including a plurality of soldering regions which have a base region and at least one replication region existing at a position different from the base region so as to include a placement pattern that is the same as an arrangement pattern of a soldering position in the base region; an input portion for receiving input of positional relationship data that represents a positional relationship between the base region and the at least one replication region, and base pattern data that represents the arrangement pattern of the at least one soldering position in the base region; and a controller that controls the driving portion to move the soldering iron, based on the base pattern data and the positional relationship data in a soldering operation.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a soldering apparatus that automatically performs soldering at a predetermined soldering position.

  Various soldering apparatuses have been developed that automatically perform soldering at a predetermined soldering position (see Patent Document 1). According to Patent Document 1, the operator can input the coordinate value of the soldering position to the personal computer and set the soldering position (so-called teaching operation). The soldering apparatus can perform soldering at the input soldering position.

JP, 2000-75912, A

  A large soldered electronic substrate may be cut into a plurality of small electronic substrates. These small electronic substrates are incorporated into multiple electrical devices. In this case, the arrangement pattern of the plurality of soldering positions formed on the plurality of small electronic substrates is common. A large number of soldering positions corresponding to the product of the number of soldering positions set on the electronic substrate incorporated in the electric device and the division number of the large electronic substrate exist on the large electronic substrate.

  The operator must have the soldering apparatus remember all the large number of soldering locations on a large electronic board under the above-mentioned techniques for setting the soldering locations. Therefore, the above-described technique for setting the soldering position requires a great deal of labor for the operator who performs a teaching operation to make the soldering device remember the soldering position.

  An object of the present invention is to provide a soldering apparatus which enables an operator to easily set a soldering position.

  A soldering apparatus according to an aspect of the present invention includes: a base region having at least one soldering position; and an arrangement pattern common to an arrangement pattern of the at least one soldering position in the base region; A soldering iron for soldering to the surface of an electronic substrate including a plurality of soldering areas having at least one replication area present at a position different from the base area, and a driving unit for moving the soldering iron; An input for receiving positional relationship data representing a positional relationship between the base region and the at least one duplication region, and base pattern data representing the layout pattern of the at least one soldering position in the base region And controlling the drive unit based on the base pattern data and the positional relationship data in a soldering operation. It includes a control unit, a. The control unit (i) determines a movement pattern for moving the soldering iron to the at least one soldering position in the base region based on the base pattern data, and (ii) the soldering iron Controls the drive unit to move in the determined movement pattern in the base region, and (iii) the movement of the soldering iron is based on the positional relationship data and the determined movement pattern. The drive is controlled to be performed in the at least one replication region.

  According to the above configuration, since the base region is used as a region for storing at least one soldering position, the operator can base pattern data representing an arrangement pattern of the at least one soldering position in the base region. Input to the input section. As a result, the control unit can grasp the soldering position in the base region. Therefore, the control unit can determine a movement pattern for moving the soldering iron to at least one soldering position in the base region based on the base pattern data. The control unit controls the drive unit so that the soldering iron moves in the base region in the determined movement pattern, so the soldering iron moves in the movement pattern determined in the soldering operation, and the base region Soldering can be performed at at least one of the soldering positions.

  Since the positional relationship data input to the input unit represents the positional relationship between the base region and at least one copy region present at a different position from the base region, the control unit referring to the positional relationship data is the base region The relative position of at least one replication region to. Therefore, the control unit is configured to use the positional relationship data representing the positional relationship between the base region and the at least one duplication region, and the movement of the soldering iron according to the movement pattern determined with respect to the base region is at least one duplication region. The drive can be controlled as is done in As a result, in the soldering operation after the teaching operation, the soldering iron can move with the determined movement pattern relative to the base region, and can solder at least one replication region. Since the replication area includes a layout pattern common to the layout pattern of at least one soldering position in the base area, the soldering iron moving according to the movement pattern determined with respect to the base area is the soldering in the replication area It can be soldered according to the pattern of position.

  As mentioned above, even if the soldering position corresponding to the at least one replication area is not input to the input, the soldering apparatus can perform the soldering at the soldering position in the at least one replication area. Therefore, the soldering apparatus can effectively reduce the effort of the operator who inputs the soldering position.

  Regarding the above configuration, the control unit (i) a pattern determination unit that determines the movement pattern in the base region based on the base pattern data, and (ii) the movement in which the soldering iron is determined The soldering iron is moved to the at least one copy area based on a base drive signal for operating the drive unit to move in the base area according to a pattern, the positional relationship data, and the determined movement pattern. And D. a signal generation unit that generates a copy drive signal that moves and operates the drive unit to move in the at least one copy region according to the determined movement pattern. The drive unit may move the soldering iron according to the base drive signal and the duplicate drive signal.

  According to the above configuration, as described above, the operator inputs the base pattern data to the input unit, so that the pattern determination unit of the control unit can grasp the soldering position in the base region. Therefore, the pattern determination unit can determine a movement pattern for moving the soldering iron to at least one soldering position in the base region based on the base pattern data. The signal generation unit generates the base drive signal so that the soldering iron moves in accordance with the determined movement pattern, so that the driving unit can move the soldering iron according to the base driving signal. As a result, the soldering iron can be soldered at at least one soldering position in the base region.

  Since the positional relationship data input to the input unit represents the positional relationship between the base region and at least one duplicate region virtually replicated at a different position from the base region, the control unit that refers to the positional relationship data The signal generation unit of can determine the relative position of the at least one replication region with respect to the base region. Thus, the signal generator can generate a duplicate drive signal to control the driver such that the soldering iron moves to at least one duplicate region. The signal generation unit generates a duplicate drive signal so that the soldering iron operates in the movement pattern determined with respect to the base region even in at least one duplicate region, so that the drive operates according to the duplicate drive signal. The part can also cause the soldering iron to perform the same movement operation as the movement operation in the base region with respect to at least one replication region. Thus, a soldering operation similar to that performed in the base region can also be performed on the at least one replication region.

  With regard to the above configuration, the positional relationship data includes region number data representing the number of a plurality of regions including the base region and the at least one copy region aligned along a predetermined axis from the base region; And offset data representing an amount of deviation between two adjacent areas in the area of. The signal generation unit refers to the region number data and the offset data, and moves the base drive signal and the duplication drive such that the soldering iron moves in each of the plurality of regions according to the determined movement pattern. A signal may be generated.

  According to the above configuration, the region number data of the positional relationship data represents the number of the plurality of first regions including the base region and at least one copy region aligned along the predetermined axis from the base region. The signal generation unit referring to the related data can grasp how many times the copy drive signal should be generated. The offset data represents the amount of deviation between two adjacent areas in the plurality of areas, so that the signal generation unit referring to the positional relationship data grasps the position of each of the plurality of areas aligned along the predetermined axis. can do. Therefore, the signal generation unit can generate the copy drive signal such that the movement pattern determined with respect to the base region is applied to each of the plurality of regions with reference to the region number data and the offset data. As a result, a soldering operation similar to the soldering operation performed in the base region can also be performed in at least one replication region aligned along a predetermined axis with respect to the base region. Even if the teaching operation is not performed on all of the plurality of regions aligned along the predetermined axis, the common soldering operation is performed on the plurality of regions aligned along the predetermined axis. The attaching apparatus can effectively reduce the labor of the operator who performs the teaching operation.

  In the above configuration, the positional relationship data is a first region representing the number of the plurality of first regions including the base region and the at least one copy region aligned along the predetermined first axis from the base region. It may include number data and first offset data representing an amount of deviation between two adjacent ones of the plurality of first regions. The signal generation unit refers to the first area number data and the first offset data, and the base moves the soldering iron in each of the plurality of first areas according to the determined movement pattern. A drive signal and the duplicate drive signal may be generated.

  According to the above configuration, the first region number data of the positional relationship data includes the number of the plurality of first regions including the base region and at least one copy region aligned from the base region along the predetermined first axis. Since it represents, the signal generation part which referred positional relationship data can grasp | ascertain how many times it should generate | occur | produce a duplication drive signal. Since the first offset data represents the amount of deviation between two adjacent ones of the plurality of first regions, the signal generation unit referring to the positional relationship data has the plurality of first regions aligned along the first axis. The position of each area can be grasped. Therefore, the signal generation unit refers to the first region number data and the first offset data, and generates a duplicate drive signal such that the movement pattern determined for the base region is applied to each of the plurality of first regions. can do. As a result, a soldering operation similar to the soldering operation performed in the base region can also be performed in at least one replication region aligned along the first axis with respect to the base region. Even if the teaching operation is not performed on all of the plurality of first regions aligned along the first axis, the common soldering operation is performed on the plurality of first regions aligned along the first axis. The above-described soldering apparatus can effectively reduce the labor of the operator who performs the teaching operation.

  With regard to the above configuration, the positional relationship data includes the number of second regions including the base region and the at least one duplicate region aligned along a second axis orthogonal to the first axis from the base region. And second offset data representing an amount of deviation between two adjacent ones of the plurality of second regions. The signal generation unit refers to the second area number data and the second offset data, and the base moves the soldering iron in each of the plurality of second areas according to the determined movement pattern. A drive signal and the duplicate drive signal may be generated.

  According to the above configuration, the second region number data of the positional relationship data includes the plurality of second regions including the base region and at least one duplicate region aligned along the second axis orthogonal to the first axis from the base region. Since the number of regions is indicated, the signal generation unit referring to the positional relationship data can grasp how many times the copy drive signal should be generated. The second offset data represents the amount of deviation between two adjacent ones of the plurality of second regions, so that the signal generation unit referring to the positional relationship data has the plurality of second regions aligned along the second axis. The position of each area can be grasped. Therefore, the signal generation unit refers to the second region number data and the second offset data, and generates a duplicate drive signal such that the movement pattern determined for the base region is applied to each of the plurality of second regions. can do. As a result, a soldering operation similar to the soldering operation performed in the base region can also be performed in at least one replication region aligned along the second axis with respect to the base region. A common soldering operation is performed on the plurality of second regions aligned along the second axis, even though the teaching operation is not performed on all the plurality of second regions aligned along the second axis. The above-described soldering apparatus can effectively reduce the labor of the operator who performs the teaching operation.

  With regard to the above configuration, the input unit is configured to move the soldering iron when the soldering iron after soldering to the at least one soldering position in the base region moves upward from the surface of the electronic substrate. The input of the movement amount data representing the movement amount of may be accepted. The pattern determination unit may determine the movement pattern in which the soldering iron moves upward for each soldering with reference to the movement amount data. The drive unit is operated to move the copy drive signal generated by the signal generation unit in the at least one copy area according to the determined movement pattern, and the soldering iron in the at least one copy area May be moved upward with each soldering.

  According to the above configuration, the movement amount data represents the movement amount when the soldering iron after soldering moves upward from the surface of the electronic substrate. Therefore, the pattern determination unit referring to the movement amount data is soldered The driving pattern of the driving unit can be determined such that the soldering iron after the above is separated upward from the surface of the electronic substrate. The soldering iron can be moved up and down toward the soldering position in the base area to attach point solder on the surface of the electronic substrate.

  Since the drive unit is operated to move the copy drive signal generated by the signal generation unit in the at least one copy region in accordance with the determined movement pattern, the soldering iron also performs soldering in each of the at least one copy region. Can move upwards. The soldering iron can be moved up and down to a soldering position in the replication area to cause point solder to adhere on the surface of the electronic substrate.

  In the above configuration, the base pattern data is a coordinate value representing the at least one soldering position, and the first soldering position and the second soldering position present at positions different from the first soldering position, respectively. When the input unit includes a plurality of coordinate values to be expressed, the input unit may receive, as the movement amount data, inputs of a plurality of different values for the first soldering position and the second soldering position.

  According to the above configuration, since the input unit receives inputs of a plurality of different values between the first soldering position and the second soldering position as movement amount data, the operator can perform the first soldering The amount of movement required at the position and the amount of movement required at the second soldering position can be input separately. Since the soldering iron does not move up significantly unnecessarily, the time for moving the soldering iron is shortened and the soldering operation is made efficient.

  In the above configuration, the base pattern data is a coordinate value representing the at least one soldering position, and the first soldering position and the second soldering position present at positions different from the first soldering position, respectively. When the plurality of coordinate values to be expressed are included, the input unit may collectively receive, as the movement amount data, an input of a common value for the first soldering position and the second soldering position.

  According to the above configuration, the input unit receives the input of values common to the first soldering position and the second soldering position as movement amount data at one time, so that the operator moves the amount of movement of the soldering iron. It is not necessary to separately set the first soldering position and the second soldering position. Therefore, the operator can set the moving amount of the soldering iron in a short time.

  With regard to the above configuration, the input unit may receive designation of a soldering order for the plurality of soldering regions. The drive unit may move the soldering iron under control of the control unit such that the soldering iron is soldered in the plurality of soldering regions in accordance with the designated order.

  According to the above configuration, since the input unit receives the designation of the order for the plurality of soldering areas, the operator can set the soldering order that is convenient for the operator's work procedure. The control unit controls the drive unit and moves the soldering iron so that the soldering is sequentially performed on the plurality of soldering regions in the specified order through the input unit, so the soldering operation is performed by the operator. It can be performed in a convenient order for the procedure.

  The above-mentioned soldering apparatus enables the operator to easily set the soldering position.

FIG. 1 is a schematic block diagram of an exemplary soldering apparatus. It is a flowchart of the example movement pattern which the pattern determination part of the soldering apparatus shown by FIG. 1 determines. It is a flowchart which shows the movement pattern which the pattern analysis part of the soldering apparatus shown by FIG. 1 changed using offset amount. It is a flowchart which shows the movement pattern which the pattern analysis part of the soldering apparatus shown by FIG. 1 changed using offset amount. It is a flowchart which shows the movement pattern which the pattern analysis part of the soldering apparatus shown by FIG. 1 changed using offset amount. FIG. 2 is a schematic flow chart representing an exemplary operation of the control unit of the soldering apparatus shown in FIG. FIG. 1 is a schematic plan view of an exemplary electronic substrate. 2 is an exemplary image displayed by the input interface of the soldering apparatus shown in FIG. 1; FIG. 2 is a schematic perspective view of the soldering apparatus shown in FIG. 1; FIG. 1 is a schematic plan view of an exemplary electronic substrate.

<Solder developed by the present inventors>
FIG. 7 is a schematic perspective view of a soldering apparatus 100 developed by the present inventors. The schematic structure of the soldering apparatus 100 will be described with reference to FIG.

  FIG. 7 shows orthogonal coordinates defined by the x-axis, y-axis and z-axis. For the following description, the positive direction of the x-axis is defined as "right". The negative direction of the x-axis is defined as "left". The positive direction of the y-axis is defined as "front". The negative direction of the y-axis is defined as "after". The positive direction of the z-axis is defined as "up". The negative direction of the z-axis is defined as "down". The terms "clockwise" and "counterclockwise" refer to rotation about an axis of rotation parallel to the z-axis. These terms for direction are used only for the clarity of the description. Thus, the principles of the present embodiment are in no way limited to these terms representing direction.

  The soldering apparatus 100 includes a soldering mechanism 110, a support 120, an operation unit 130, a heating control unit 140, an input interface 150, and a driving unit (not shown). The soldering mechanism 110 solders to an electronic substrate (not shown). The heating control unit 140 is used to control the temperature of the soldering mechanism 110. The support 120 supports the soldering mechanism 110, the operation unit 130 and the drive unit. A plurality of motors used as drive units are attached to the support 120 and the soldering mechanism 110. The operation unit 130 can be suitably used for a teaching operation for storing the coordinate value of the soldering position on the electronic substrate in the soldering apparatus 100. When the operator who performs the teaching operation operates the operation unit 130, the drive unit moves or rotates the soldering mechanism 110 in the direction determined by the operation on the operation unit 130. The input interface 150 is used to input various operating parameters of the soldering apparatus 100.

  The support 120 includes a base 121, two columns 122 and 123, a support bridge 124, and a mounting table 125. The base 121 is a substantially rectangular plate-like portion. The post 122 is erected upward from the left edge of the base 121. The post 123 is erected upward from the right edge of the base 121. The columns 122 and 123 are aligned in the x-axis direction. The support bridge 124 is bridged from the left column 122 to the right column 123. Thus, the support bridge 124 extends in the x-axis direction. The soldering mechanism 110 is attached to the support bridge 124. When the operator operates the operation unit 130, one of the plurality of motors used as the drive unit can move the soldering mechanism 110 along the support bridge 124.

  The installation table 125 is a substantially rectangular plate-like portion installed on the upper surface of the base 121. The operator can secure the electronic board on the installation table 125. The operator operates the operation unit 130 to move the soldering mechanism 110 in the x-axis direction and the z-axis direction on the installation table 125 or rotationally move the soldering mechanism 110 around a rotation axis parallel to the z-axis it can. As shown in FIG. 7, a slot 126 extending in the y-axis direction is formed on the upper surface of the base 121. When the operator operates the operation unit 130, one of the plurality of motors used as the drive unit can move the installation stand 125 along the slot 126. The relative positional relationship between the electronic substrate on the mounting table 125 and the soldering mechanism 110 is adjusted by the movement of the soldering mechanism 110 in the x-axis direction and the z-axis direction. The relative positional relationship between the electronic substrate on the installation table 125 and the soldering mechanism 110 is adjusted by the movement of the installation table 125 in the y-axis direction.

  The soldering mechanism 110 includes a horizontal movable column 111, a vertical movable column 112, a wire solder 113, a solder delivery portion 114, a soldering iron 115, and a holding portion 116. The horizontally movable column 111 holds the vertically movable column 112, the wire solder 113, the solder delivery unit 114, the soldering iron 115 and the holding unit 116, and moves in the x-axis direction under the operation of the drive unit. The vertically movable column 112 holds the wire solder 113, the solder delivery portion 114, the soldering iron 115 and the holding portion 116, and moves in the z-axis direction under the operation of the drive portion. The holding portion 116 holds the solder delivery portion 114 and the soldering iron 115, and moves them around a rotation axis substantially coinciding with the vertical central axis of the vertically movable column 112. The solder delivery portion 114 delivers the solder wire 113 by forming the tip of the soldering iron 115 first. The soldering iron 115 melts the solder paste 113 delivered from the solder delivery part 114 under the temperature control of the heating control part 140.

  The horizontal movable column 111 is a columnar member elongated in the z-axis direction. The horizontally movable column 111, the support bridge 124 and the drive are designed such that the horizontally movable column 111 moves substantially horizontally along the support bridge 124 when one of the motors forming the drive operates. The known structure of the soldering apparatus may be applied to the design of the horizontal movable column 111, the support bridge 124 and the drive unit. Therefore, the principle of the present embodiment is not limited to the specific connection structure between the horizontal movable column 111, the support bridge 124, and the drive unit.

  Similar to the horizontal movable column 111, the vertical movable column 112 is a columnar member elongated in the z-axis direction. The vertically movable column 112, the horizontally movable column 111, and the drive unit are designed such that the vertically movable column 112 moves along the horizontally movable column 111 substantially vertically when one of the plurality of motors forming the drive unit operates. Ru. The known structure of the soldering apparatus may be applied to the design of the vertically movable column 112, the horizontally movable column 111 and the drive unit. Therefore, the principle of the present embodiment is not limited to the specific connection structure between the vertically movable column 112, the horizontally movable column 111, and the drive unit.

  The holding portion 116 is used to hold the solder delivery portion 114 and the soldering iron 115. The holding portion 116 is connected to the lower end of the vertically movable column 112. Therefore, the holding part 116, the solder delivery part 114 and the soldering iron 115 can move upward, downward, leftward and rightward together with the vertically movable column 112. When one of the plurality of motors forming the drive unit operates, the holding unit 116, the vertically movable column 112, and the vertically movable column 112 rotate so that the holding unit 116 rotates about a rotation axis substantially corresponding to the vertical central axis of the vertically movable column 112. The drive is designed. The operator operates the operation unit 130 and rotates the holding portion 116 to prevent the soldering iron 115 from contacting the electronic components on the electronic substrate. Since both the solder delivery portion 114 and the soldering iron 115 are attached to the holding portion 116, the relative positional relationship between them does not change during the rotation of the holding portion 116. The known structure of the soldering apparatus may be applied to the design of the holding part 116, the vertically movable column 112 and the driving part. Therefore, the principle of the present embodiment is not limited to the specific connection structure between the holding portion 116, the vertically movable column 112, and the drive portion.

  The holding portion 116 includes an arc-shaped plate 117 to which a soldering iron 115 is attached. An arcuate slot 118 is formed in the arcuate plate 117. The operator can change the mounting position of the soldering iron 115 along the slot 118 and adjust the inclination angle of the soldering iron 115 with respect to the upper surface of the electronic board on the installation table 125. A scale (not shown) may be marked along the slot 118. In this case, the operator can grasp the inclination angle of the soldering iron 115 numerically.

  The heating control unit 140 is used to control the temperature of the soldering iron 115 tip. The feedback control techniques used in the known soldering apparatus can be applied to the temperature control performed between the heating control 140 and the soldering iron 115. Therefore, the principle of the present embodiment is not limited to a specific temperature control technology performed between the heating control unit 140 and the soldering iron 115.

  The solder bobbin 119 around which the solder wire 113 is wound is attached to the upper end of the vertically movable column 112. The solder wire 113 extends from the solder bobbin 119 to the solder delivery portion 114. When soldering is performed, the solder delivery unit 114 supplies the solder to the soldering iron 115 (or near the soldering iron) by an amount set by the operator. As a result, the solder is melted at the tip of the soldering iron 115 (or near the tip). The structure of the solder delivery mechanism of the known soldering apparatus can be applied to the solder delivery portion 114. Therefore, the principle of the present embodiment is not limited to the specific structure of the solder delivery portion 114.

  Operation unit 130 includes a housing 131, a left lever 132, a right lever 133, and a coordinate input unit 134. The operator can move the soldering iron 115 and the installation base 125 by tilting the left lever 132 and the right lever 133 protruding from the upper surface of the housing 131. The coordinate input unit 134 is used to store the coordinates of the tip of the soldering iron 115 in the soldering apparatus 100. When the soldering iron tip of the soldering iron 115 reaches a predetermined soldering position on the electronic substrate fixed on the installation table 125, the operator operates the coordinate input unit 134, and the soldering apparatus 100 executes it. The coordinate value of the position of the tip in the coordinate space set for arithmetic processing can be stored in the soldering apparatus 100 as a soldering position. Various electronic components that generate electrical signals indicating the amount of tilt of the left lever 132 and the right lever 133 and the fact that an operation has been performed on the coordinate input unit 134 are disposed in the housing 131.

  The operator inclines the left lever 132 and the right lever 133 protruding from the upper surface of the housing 131, and designates the direction of change of the relative position between the electronic board on the installation table 125 and the soldering iron tip can do. The left lever 132 moves the tip of the soldering iron 115 in the z-axis direction (that is, the movement of the tip of the tip upward and downward) and rotates the holding portion 116 (that is, around the rotation axis of the holding portion 116). It is used for the movement of the tip of the soldering iron 115). The right lever 133 moves the tip of the soldering iron 115 in the x-axis direction (that is, the movement of the tip to the left and right) and the movement of the mounting table 125 in the y-axis direction (that is, the mounting table) 125) relative movement of the tip of the tip with respect to the electronic substrate on 125). The following table shows an exemplary correspondence of the operation of the soldering apparatus 100 to the operation of the left lever 132 and the right lever 133.

  When the tip reaches the soldering position defined on the electronic board on the installation table 125 during the teaching operation, the operator arranges between the left lever 132 and the right lever 133 aligned in the x-axis direction. By operating the coordinate input unit 134, it is possible to input the coordinate position of the tip in the coordinate space set for the arithmetic processing performed by the soldering apparatus 100. As a result, the soldering apparatus 100 can remember the input coordinate position as a soldering position. During the subsequent soldering operation, the soldering apparatus 100 can automatically perform soldering with reference to the stored coordinate positions of the soldering position. In the present embodiment, the coordinate input unit 134 is designed as a general push button. Therefore, the operator can perceive the reaction force received from the press button with a fingertip, and can determine whether the press button has been operated.

  The input interface 150 is used to input other operation parameters related to the operation of the soldering apparatus 100 (for example, the above-described supply amount of the solder wire 113). A touch panel may be used as the input interface 150. In this case, the input interface 150 can display coordinate values (i.e., soldering positions) input during the above-described teaching operation. Therefore, the operator can grasp the result of the teaching operation numerically.

  As a result of the common arrangement pattern (hereinafter referred to as "common pattern") regarding the soldering positions being formed at different positions of one electronic substrate, the electronic substrate may have a large number of soldering positions. The present inventors have worked to reduce the load of teaching work on an electronic substrate having a plurality of common patterns.

  FIG. 8 is a schematic plan view of an exemplary electronic substrate 900. With reference to FIGS. 7 and 8, the heavy load of teaching operations on an electronic substrate 900 having a plurality of common patterns will be described.

  The dotted line DLx shown in FIG. 8 is an imaginary line extending parallel to the x-axis. The dotted line DLy shown in FIG. 8 is an imaginary line extending parallel to the y-axis. The electronic substrate 900 is equally divided into four regions by dotted lines DLx and DLy. After the soldering operation, the electronic substrate 900 is cut along dotted lines DLx and DLy to form four small substrates.

  Sixteen soldering positions P01 to P16 exist on the electronic substrate 900. A set of four soldering positions P01 to P04, a set of four soldering positions P05 to P08, a set of four soldering positions P09 to P12 and a set of four soldering positions P13 to P16 are four pieces. Corresponding to the area of. A set of four soldering positions P01 to P04, a set of four soldering positions P05 to P08, a set of four soldering positions P09 to P12 and a set of four soldering positions P13 to P16 are common. (That is, these sets are common patterns). Therefore, each of the four regions virtually divided by the dotted lines DLx and DLy is a soldering region where a soldering operation using the soldering iron 115 is performed.

  The inventors of the present invention performed a teaching operation on one of the four areas, and incorporated in the soldering apparatus 100 a palletizing function that eliminates the need for teaching operations on the remaining three areas. The palletizing function applies the operation pattern of the soldering iron 115 obtained as a result of the teaching operation performed for one area to the other area, and the area where the teaching operation is performed also for the other area It is possible to do the same soldering. As a result of the palletizing function, the teaching operation on the electronic substrate 900 is performed on only one of the four regions. Soldering to soldering positions on other regions is performed based on the result of teaching operation performed on one of four regions without teaching operation on these regions. On the other hand, if there is no palletizing function, the operator needs to perform teaching work for all 16 soldering positions on the electronic substrate 900. Therefore, the palletizing function can contribute to a significant improvement in the efficiency of teaching work.

<Solder with palletizing function>
FIG. 1 is a schematic block diagram of a soldering apparatus 100. As shown in FIG. The soldering apparatus 100 is described with reference to FIGS. 1, 7 and 8.

  FIG. 1 shows the operation unit 130 and the input interface 150 described with reference to FIG. The input unit 190 is used to input data required for the palletizing function.

  The soldering apparatus 100 includes a storage unit 160 and a control unit 170. These are incorporated into the soldering apparatus 100 for palletizing functions. The storage unit 160 stores input data from the input unit 190. The control unit 170 controls the drive unit 180 with reference to data stored in the input unit 190.

  The operator sets one of the four areas described with reference to FIG. 8 as a base area 911 where a teaching operation for storing the soldering positions P01 to P04 in the soldering apparatus 100 is performed. Can. In the present embodiment, the operator sets the left front area as the base area 911. The choice of base area 911 is entirely dependent on the operator. Therefore, the principle of the present embodiment is not limited at all depending on which area is set as the base area 911.

  The remaining area among the four areas described with reference to FIG. 8 is set as three copy areas 912, 913, and 914. The teaching operation may not be performed on these copy areas 912, 913, and 914. Instead, soldering to soldering positions P05-P16 in these replication areas 912, 913, 914 is performed by the palletizing function. The replication area 912 is located to the right of the base area 911. The copy area 913 is located after the base area 911. The replication area 914 is aligned on the diagonal of the rectangular electronic substrate 900 with respect to the base area 911. These copy areas 912, 913, 914 are treated as copies of the base area 911 in the palletizing process of the control unit 170. That is, the movement locus of the soldering iron 115 set for the base area 911 is replicated to the replication areas 912, 913, 914 by the palletizing function, and on the replication areas 912, 913, 914 during the soldering operation. The soldering iron to be soldered will move along the replicated movement locus.

  The operator who performs the teaching operation operates the operation unit 130 and inputs coordinate values of the soldering position in the base area 911. In the present embodiment, a front left corner of the electronic substrate 900 is set as a coordinate origin. The coordinate values are set based on the coordinate origin. The following table represents coordinate values of the soldering positions P01 to P04 in the base region 911. The input coordinate values are stored in storage unit 160 as base pattern data representing an arrangement pattern of soldering positions P01 to P04 in base region 911. For the present embodiment, the first soldering position is one of the soldering positions P01 to P04. The second soldering position is another one of the soldering positions P01 to P04.

  As shown in FIG. 8, the soldering positions P05 to P08 on the replication region 912 are offset from the soldering positions P01 to P04 on the base region 911 by “xa” in the positive direction in the x-axis. ing. The soldering positions P09 to P12 on the replication region 913 are offset from the soldering positions P01 to P04 on the base region 911 by “ya” in the negative direction in the y axis. Soldering positions P13 to P16 on replication region 914 deviated from soldering positions P01 to P04 on base region 911 by "xa" in the positive direction in the x-axis and "ya" in the negative direction in the y-axis Exist in position. Therefore, the soldering positions P05 to P16 on the replication areas 912, 913 and 914 can have coordinate values shown in the following table.

  As shown in “Table 3”, the soldered position of the replication area 912, 913, 914 can be expressed using coordinate values of the soldered position of the base area 911. The positional relationship between the base area 911 and the copy areas 912, 913, and 914 (that is, the shift amounts of the copy areas 912, 913, and 914 from the base area 911) is represented by the offset amounts "xa" and "ya". It can be done. The operator can input the offset amounts “xa” and “ya” to the input interface 150. The input offset amounts “xa” and “ya” are stored in the storage unit 160 as positional relationship data representing the positional relationship between the base area 911 and the copy areas 912, 913, and 914.

  The operator can input, to the input interface 150, movement amount data representing the movement amount of the soldering iron tip of the soldering iron 115 in the base region 911 during vertical movement. The movement amount data indicates that the point solder operation is performed to prevent the tip of the soldering iron 115 from coming into contact with the electronic component mounted on the electronic substrate 900 or to attach point solder to the upper surface of the electronic substrate 900. It is set to determine the amount of upward and / or downward movement of the tip. Just before the soldering is performed, the soldering iron tip of the soldering iron 115 is arranged at a position separated from the upper surface of the electronic substrate 900 by the value of the movement amount data above the soldering position. Thereafter, the tip of the soldering iron 115 is lowered by the value of the movement amount data, and soldering is performed at the soldering position. After soldering, the tip of the soldering iron 115 is raised by the value of the movement amount data. Since the soldering iron tip of the soldering iron 115 is separated upward from the upper surface of the electronic substrate 900 by the value of the movement amount data, even if the soldering iron tip of the soldering iron 115 subsequently moves horizontally, Do not touch the mounted electronic components. The movement amount of the soldering iron tip of the soldering iron 115 may be set individually for each soldering position. In this case, the operator can set the amount of movement so that the tip of the soldering iron 115 does not move an unnecessary distance in the z-axis direction. For example, if a short electronic component is present at a position overlapping the movement trajectory of the soldering iron tip of the soldering iron 115, the operator can set a small value as the movement amount. On the other hand, if tall electronic components are present, the operator can set a large value as the movement amount. Soldering to the electronic substrate 900 can be completed in a short time because the soldering iron 115 does not move an unnecessarily long distance in the z-axis direction. Alternatively, the amount of movement of the soldering iron tip may be a common value for all the soldering positions. For example, the operator can set the movement amount to a value larger than the height of the electronic component so that the tip of the tallest electronic component among the electronic components on the electronic substrate 900 does not hit the tip. In this case, the input operation of the movement amount is simplified. In the present embodiment, one of the x axis and the y axis is used as a first axis. The other of the x axis and the y axis is used as a second axis.

  Control unit 170 includes a pattern determination unit 171 and a signal generation unit 172. The pattern determination unit 171 refers to the base pattern data and movement amount data, and how to move the iron tip of the soldering iron 115 in the base region 911 (that is, how to drive the drive unit 180) To determine). When the drive unit 180 moves the soldering iron tip of the soldering iron 115 in the base region 911, the signal generation unit 172 generates a base driving signal for moving the soldering iron 115 according to the determined movement pattern. Do. When the drive unit 180 moves the soldering iron tip of the soldering iron 115 in the duplication area 912, 913, 914, the signal generation unit 172 refers to the positional relationship data in the storage unit 160. The signal generation unit 172 copies the movement pattern of the tip on the base area 911 to the copy areas 912, 913, and 914 based on the positional relationship data and the movement pattern determined for the base area 911. To generate a duplicate drive signal. The base drive signal and the copy drive signal are output from the signal generation unit 172 to the drive unit 180. The driving unit 180 moves the soldering iron 115 and the installation table 125 in response to the base driving signal and the replication driving signal, and solders the soldering area P01 to P16 on the base area 911 and the replication areas 912, 913, and 914. Reach 115 tips.

  FIG. 2 is a flowchart of an exemplary movement pattern determined by the pattern determination unit 171. The pattern determination unit 171 is described with reference to FIGS. 1, 2, 7 and 8.

  A series of operations shown in FIG. 2 represent the movement pattern of the soldering iron 115 in the soldering operation after the teaching operation. The soldering iron 115 is moved on the base region 911 in accordance with a series of operations shown in FIG. When given the coordinate values of the soldering position obtained as a result of the teaching operation, the pattern determination unit 171 uses a predetermined algorithm designed to move the soldering iron tip of the soldering iron 115 to the coordinate values. A series of actions shown in FIG. 2 can be determined.

  With respect to the soldering apparatus 100 described with reference to FIG. 7, the movement of the soldering iron 115 in the x-axis and z-axis directions and the rotation of the soldering iron 115 around the rotation axis of the holding portion 116 115 actually moves. On the other hand, the soldering iron 115 does not actually move in the y-axis direction, but instead, the mounting table 125 moves in the y-axis direction. The soldering iron 115 can be displaced relative to the electronic substrate 900 in the y-axis direction while the mounting table 125 moves in the y-axis direction. In the following description, the term "moving pattern" means not only the actual movement of the soldering iron 115 but also the relative movement of the soldering iron 115 relative to the surface of the electronic substrate 900.

  “Operation 1” to “Operation 4” shown in FIG. 2 represent movement patterns for the soldering position P01. "Operation 5" to "Operation 8" represent movement patterns for the soldering position P02. "Operation 9" to "Operation 12" represent movement patterns for the soldering position P03. "Operation 13" to "Operation 16" represent movement patterns for the soldering position P04. The “operation 1” to the “operation 16” are sequentially performed by the drive unit 180. Coordinate values (x01, y01, z01, θ01) to coordinate values (x04, y04, z04, θ04) shown in FIG. 2 are obtained as a result of teaching operation using the operation unit 130.

  With regard to "operation 1", "operation 5", "operation 9" and "operation 13", the pattern determination unit 171 causes the driving unit 180 to position the soldering iron tip of the soldering iron 115 above the soldering positions P01 to P04. Specifies the behavior of. With regard to "operation 2", "operation 6", "operation 10" and "operation 14", the pattern determination unit 171 operates the drive unit 180 to lower the soldering iron tip of the soldering iron 115 to the soldering positions P01 to P04. Specify With regard to "operation 3", "operation 7", "operation 11" and "operation 15", the pattern determination unit 171 designates an operation of stopping the drive unit 180 until the soldering at the soldering positions P01 to P04 is completed. Do. With regard to “operation 4”, “operation 8”, “operation 12” and “operation 16”, the pattern determination unit 171 sets the soldering iron tip of the soldering iron 115 above the soldering positions P01 to P04. Specifies the behavior of.

  As shown in FIG. 1, the signal generation unit 172 includes a first generation unit 271, a second generation unit 272, a third generation unit 273, a fourth generation unit 274, a pattern analysis unit 275, and an offset command. And 276. The first generation unit 271 generates a drive signal for rotating the tip of the soldering iron 115 counterclockwise or clockwise. The second generation unit 272 generates a drive signal for lowering or raising the tip of the soldering iron 115. The third generation unit 273 generates a drive signal for moving the tip of the soldering iron 115 left or right. The fourth generation unit 274 generates a drive signal for moving the installation table 125 forward or backward. The pattern analysis unit 275 analyzes the movement pattern shown in FIG. 2 and determines which of the first generation unit 271 to the fourth generation unit 274 the generation instruction of the drive signal is given to. The pattern analysis unit 275 instructs the selected generation unit (that is, one of the first generation unit 271 to the fourth generation unit 274) to generate a drive signal and information required to generate the drive signal (for example, Give the coordinates of the target position). The first generation unit 271 to the fourth generation unit 274 generate the above-described drive signal in response to the generation instruction. The offset command unit 276 refers to the positional relationship data stored in the storage unit 160, and notifies the pattern analysis unit 275 of the positions of the copy areas 912, 913, and 914. The pattern analysis unit 275 uses the movement pattern shown in FIG. 2 (i.e., the movement pattern for the base area 911) from the positional relationship information (i.e., the offset amounts "xa", "ya") received from the offset command unit 276. Use to change. The pattern analysis unit 275 targets the drive signal generation instruction (that is, the first generation unit 271 to the fourth generation unit) based on the changed movement pattern (that is, the movement pattern for the copy areas 912, 913, and 914). Determine any of 274).

  The pattern analysis unit 275 generates a command to generate the third generation unit 273 and / or the fourth generation unit 274 with respect to “operation 1”, “operation 5”, “operation 9” and “operation 13” shown in FIG. Determined as above. At this time, if it is necessary to change the angle of the tip of the soldering iron 115 around the rotation axis of the holding unit 116, the pattern analysis unit 275 also includes the first generation unit 271 as an output destination of the generation command. . The pattern analysis unit 275 generates the second for the “operation 2”, “operation 4”, “operation 6”, “operation 8”, “operation 10”, “operation 12”, “operation 14” and “operation 16”. The unit 272 is determined as the output destination of the generation command.

  With regard to the movement pattern shown in FIG. 2, the soldering in the base region 911 is performed in the order of the soldering positions P01, P02, P03 and P04. However, the order of soldering may be determined by the operator. For example, the order of soldering may be determined according to the order of teaching operations. Alternatively, the operator may rank coordinate values obtained from the teaching operation after the teaching operation. Thus, the principles of the present embodiment are not limited to a particular order of soldering within the base region 911.

  FIGS. 3A to 3C are flowcharts showing movement patterns changed by the pattern analysis unit 275 using the offset amounts “xa” and “ya”. The movement pattern change process is described with reference to FIGS. 1 to 3C, 7 and 8.

  The movement pattern described with reference to FIG. 2 applies to the base region 911, whereas the movement pattern of the soldering iron 115 shown in FIGS. 3A to 3C corresponds to the replication regions 912, 913, 914. Apply to each That is, the soldering iron 115 is moved in accordance with the series of operations shown in FIGS. 3A to 3C on the replication regions 912, 913, 914 in the soldering operation after the teaching operation.

  “Act 17” to “Act 32” shown in FIG. 3A correspond to “Act 1” to “Act 16” described with reference to FIG. Of the coordinate values of "action 17" to "action 32", only the x-coordinate value is changed from the coordinate values of "action 1" to "action 16". That is, among the coordinate values of "operation 17" to "operation 32", the x coordinate value is shifted from the coordinate values of "operation 1" to "operation 16" by the offset amount "xa" in the positive direction of the x axis. There is. Since the replication area 912 is offset from the base area 911 in the positive direction of the x axis by the offset amount “xa”, when the drive unit 180 operates according to the movement pattern shown in FIG. 3A, the tip is the base It is possible to move on the duplication area 912 by following the movement locus of the same pattern as the movement locus drawn by the tip on the area 911.

  The "action 33" to the "action 48" shown in FIG. 3B correspond to the "action 1" to the "action 16" described with reference to FIG. Of the coordinate values of "action 33" to "action 48", only the y-coordinate value is changed from the coordinate values of "action 1" to "action 16". That is, the y-coordinate value among the coordinate values of "action 33" to "action 48" is shifted from the coordinate values of "action 1" to "action 16" by the offset amount "ya" in the negative direction of the y axis. There is. Since the copy area 913 is offset from the base area 911 in the negative direction of the y axis by the offset amount "ya", when the drive unit 180 operates according to the movement pattern shown in FIG. 3B, the tip is the base It is possible to move on the duplication area 913 by following the movement locus of the same pattern as the movement locus drawn by the tip on the area 911.

  The "action 49" to the "action 64" shown in FIG. 3C correspond to the "action 1" to the "action 16" described with reference to FIG. Of the coordinate values of "action 49" to "action 64", only the x coordinate value and the y coordinate value are changed from the coordinate values of "action 1" to "action 16". That is, the x coordinate value and the y coordinate value among the coordinate values of "operation 49" to "operation 64" are offset amounts "xa" in the positive direction of the x axis from the coordinate values of "operation 1" to "operation 16". Shifted by the offset amount "ya" in the negative direction of the y axis. Since the replication area 914 is offset from the base area 911 in the positive direction of the x axis by the offset amount “xa” and in the negative direction of the y axis by the offset amount “ya”, the drive unit 180 is shown in FIG. By operating according to the movement pattern to be moved, the tip can move on the duplication area 914 by following the movement locus of the same pattern as the movement locus drawn by the tip on the base area 911.

  The driving unit 180 includes a first motor 181, a second motor 182, a third motor 183, a fourth motor 184, a first encoder 185, a second encoder 186, a third encoder 187, and a fourth encoder. And 188. The first motor 181 to the fourth motor 184 receive drive signals from the first generation unit 271 to the fourth generation unit 274, respectively. The first motor 181 rotates the holding unit 116 so that the soldering iron tip of the soldering iron 115 moves counterclockwise or clockwise according to the drive signal from the first generation unit 271. The second motor 182 lowers or raises the vertically movable column 112 according to the drive signal from the second generation unit 272. As a result, the iron tip of the soldering iron 115 attached to the vertically movable column 112 via the holding portion 116 is also lowered or raised. The third motor 183 moves the horizontal movable column 111 leftward or rightward in accordance with the drive signal from the third generation unit 273. Since the soldering iron 115 is attached to the horizontal movable column 111 via the holding portion 116 and the vertical movable column 112, the soldering iron of the soldering iron 115 also moves leftward or rightward with the horizontal movable column 111. can do. The fourth motor 184 moves the installation stand 125 forward or backward in response to the drive signal from the fourth generation unit 274. As a result, the relative position of the soldering iron tip of the soldering iron 115 to the electronic substrate 900 on the installation table 125 changes forward or backward.

  The first encoder 185 to the fourth encoder 188 are attached to the first motor 181 to the fourth motor 184, and detect the amounts of rotation of these. An electrical signal representing the detected amount of rotation is output from the first encoder 185 to the fourth encoder 188 to the first generation unit 271 to the fourth generation unit 274. The first generation unit 271 to the fourth generation unit 274 perform feedback control on the first motor 181 to the fourth motor 184 with reference to the electric signals from the first encoder 185 to the fourth encoder 188.

  For the above-described embodiment, the soldering iron 115 moves along the z-axis in accordance with the movement amount data. However, the movement amount data may represent the start point and the end point of the point solder operation for attaching point solder to the surface of the electronic substrate 900. That is, if coordinates representing an upper start point of the soldering position are designated in the movement amount data corresponding to the soldering position (that is, the end point) on the surface of electronic substrate 900, the soldering iron is designated It is possible to move back and forth from the start point to the end point and then from the end point to the start point.

  FIG. 4 is a schematic flowchart illustrating an exemplary operation of the control unit 170. The operation of the control unit 170 will be described with reference to FIGS. 1 to 4 and FIGS. 7 and 8.

(Step S105)
Step S105 is performed after the end of the teaching operation on the base area 911. Therefore, the base pattern data, the movement amount data, and the positional relationship data are stored in the storage unit 160. When the soldering operation is started, the pattern determination unit 171 reads out the base pattern data and the movement amount data from the storage unit 160. Thereafter, step S110 is performed.

(Step S110)
The pattern determination unit 171 refers to the base pattern data and the movement amount data, and determines a movement pattern (see FIG. 2) for the base area 911. The determined movement pattern is output from the pattern determination unit 171 to the pattern analysis unit 275. Thereafter, step S115 is performed.

(Step S115)
The pattern analysis unit 275 analyzes the determined movement pattern and determines an output destination of the generation command. If it is necessary to change the angular position of the soldering tip of the soldering iron 115 with regard to “operation 1” of the movement pattern shown in FIG. 2, the pattern analysis unit 275 generates the first generation unit 271. Decide on the output destination. If it is necessary to adjust the amount of movement of the soldering iron tip of the soldering iron 115 (that is, the distance between the upper surface of the electronic substrate 900 and the soldering iron tip), the pattern analysis unit 275 operates the second generation unit 272. Decide to the output destination of the generation command. If the soldering iron tip of the soldering iron 115 needs to be moved in the x-axis direction, the pattern analysis unit 275 determines the third generation unit 273 as the output destination of the generation command. If the mounting table 125 needs to be moved in the y-axis direction, the pattern analysis unit 275 determines the fourth generation unit 274 as the output destination of the generation command. The generation command is output to the output destination (at least one of the first generation unit 271 to the fourth generation unit 274) determined from the pattern analysis unit 275 together with the coordinate value of the target. Thereafter, step S120 is performed.

(Step S120)
If the first generation unit 271 receives a generation command, the soldering iron tip of the soldering iron 115 corresponds to the target value of the angular position (the angular coordinate value “θ01” for “operation 1” in FIG. 2). A base drive signal is generated to reach the angular position. If the second generation unit 272 receives the generation command, the soldering iron tip of the soldering iron 115 corresponds to the target value of the z coordinate (the angle coordinate value “z01 + za” for “operation 1” in FIG. 2). A base drive signal is generated to reach the position. If the third generation unit 273 receives a generation command, the soldering iron tip of the soldering iron 115 corresponds to the target value of the x coordinate (the angular coordinate value “x01” for “operation 1” in FIG. 2). A base drive signal is generated to reach the position. If the fourth generation unit 274 receives the generation command, the soldering iron tip of the soldering iron 115 corresponds to the target value of y coordinate (the angular coordinate value “y01” for “operation 1” in FIG. 2). A base drive signal is generated to reach the position. These base drive signals are output to the first motor 181 to the fourth motor 184, respectively. The first motor 181 to the fourth motor 184 operate in response to these base drive signals. With regard to “operation 1” in FIG. 2, the soldering iron tip of the soldering iron 115 is a target coordinate value (x01, y01, z01 + za, as a result of the operation of the first motor 181 to the fourth motor 184 according to the base drive signal. The position corresponding to θ01) is reached. The pattern analysis unit 275 monitors the signal generation processing of the first generation unit 271 to the fourth generation unit 274, and the first generation unit 271 to the fourth generation unit 274 use the soldering iron tip of the soldering iron 115 as a target coordinate value. It can be determined whether or not the operation for reaching the position corresponding to Y has been completed. If the pattern analysis unit 275 determines that the soldering iron tip of the soldering iron 115 has reached the target coordinate value, step S125 is executed.

(Step S125)
The pattern analysis unit 275 determines whether or not a series of operations ("Operation 1" to "Operation 4" for the soldering position P01 shown in FIG. 8) defined for the target soldering position have been completed. Do. If the series of operations defined for the target soldering position have been completed, step S130 is performed. Otherwise, step S115 is performed.

  With regard to the soldering position P01 shown in FIG. 8, the processing loop consisting of steps S115 to S125 is repeated until "action 4" is completed. That is, after the process (see steps S115 and S120 described above) for the “operation 1”, the processes for “operation 2”, “operation 3” and “operation 4” are sequentially executed.

  Regarding “operation 2”, the pattern analysis unit 275 determines the second generation unit 272 as the output destination of the generation command, and the soldering iron tip of the soldering iron 115 is the z coordinate value from the position corresponding to the z coordinate value “z01 + za” Create a generation command instructing to lower to the position corresponding to "z01". The generation command is output from the pattern analysis unit 275 to the second generation unit 272. The second generation unit 272 is a base drive signal that lowers the tip from the position corresponding to the z coordinate value “z01 + za” to the position corresponding to the z coordinate value “z01” in response to the generation command from the pattern analysis unit 275 Generate The second motor 182 lowers the tip of the soldering iron 115 to a position corresponding to the z coordinate value “z01” in response to the base drive signal from the second generation unit 272.

  With regard to “operation 3”, the pattern analysis unit 275 stops the output of the generation command for a predetermined period, and waits for the completion of the soldering at the soldering position P01. The pattern analysis unit 275 may refer to the signal from the solder delivery unit 114 to determine the completion of the soldering, or may stop the output of the generation command for a predetermined period based on the signal from the timer element. .

  Regarding “operation 4”, the pattern analysis unit 275 determines the second generation unit 272 as the output destination of the generation command, and the soldering iron tip of the soldering iron 115 is the z coordinate value from the position corresponding to the z coordinate value Create a generation command that instructs raising to the position corresponding to "z01 + za". The generation command is output from the pattern analysis unit 275 to the second generation unit 272. The second generation unit 272 is a base drive signal that raises the point from the position corresponding to the z coordinate value “z01” to the position corresponding to the z coordinate value “z01 + za” in response to the generation command from the pattern analysis unit 275 Generate The second motor 182 raises the tip of the soldering iron 115 to a position corresponding to the z coordinate value “z01 + za” in response to the base drive signal from the second generation unit 272.

(Step S130)
The pattern analysis unit 275 determines whether or not the soldering to all the soldering positions in the base region (the soldering positions P01 to P04 on the base region 911 shown in FIG. 8) is completed. If the execution of the movement pattern determined in step S110 is complete, step S135 is executed. Otherwise, step S115 is performed.

  With respect to the base region 911 shown in FIG. 8, the processing loop consisting of steps S115 to S130 is repeated until the soldering to the soldering position P04 is completed. When the soldering is changed from the soldering position P01 to the soldering position P02 (that is, at the time of transition from “operation 4” to “operation 5”), the pattern analysis unit 275 sets for “operation 4”. It is checked whether the z coordinate value “z01 + za” and the angular coordinate value “θ01” are equal to the z coordinate value “z02 + zb” and the angular coordinate value “θ02” set for the “operation 5”, respectively. If these z coordinate values do not match, the pattern analysis unit 275 determines the output destination of the generation command as the second generation unit 272. Thereafter, the second motor 182 displaces the soldering iron tip of the soldering iron 115 in the z-axis direction in accordance with the base drive signal generated by the second generation unit 272. If the angular coordinate value “θ01” is not equal to the angular coordinate value “θ02”, the pattern analysis unit 275 determines the output destination of the generation command as the first generation unit 271. The first motor 181 rotates the tip of the soldering iron 115 around the rotation axis of the holding unit 116 in accordance with the base drive signal generated by the first generation unit 271.

  The z coordinate value “z01 + za” and the angle coordinate value “θ01” set for “operation 4” are respectively set to the z coordinate value “z02 + zb” and the angle coordinate value “θ02” set for “operation 5”. If they are equal, the process of moving the tip of the soldering iron 115 horizontally does not cause the displacement of the soldering iron tip of the soldering iron 115 along the z axis and the circumferential movement of the holding portion 116 around the rotation axis. It will be. At this time, the pattern analysis unit 275 designates the third generation unit 273 and the fourth generation unit 274 as output destinations of the generation command. The third generation unit 273 generates and outputs a base drive signal for moving the tip of the soldering iron 115 in the positive direction along the x-axis according to the generation command. As a result, the third motor 183 moves the tip of the soldering iron 115 to the right, and the tip reaches the position corresponding to the x coordinate value “x02”. The fourth generation unit 274 generates and outputs a base drive signal for moving the installation table 125 in the positive direction of the y-axis. The fourth motor 184 moves the installation table 125 forward according to the base drive signal generated by the fourth generation unit 274, so the soldering iron tip of the soldering iron 115 is placed on the electronic substrate 900 on the installation table 125. It moves relatively backward (that is, in the negative direction of the y axis). As a result, the tip reaches a position corresponding to the y coordinate value “y02”.

  The same process is performed when the soldering is changed from the soldering position P02 to the soldering position P03 (ie, at the transition from "action 8" to "action 9"), and when the soldering is in the soldering position It is also performed when changing from P03 to the soldering position P04 (that is, at the time of transition from "action 12" to "action 13"). After the process of changing the soldering positions, the "tip lowering", "temporary stop" and "tip raising" described in connection with the processing loop consisting of steps S115 to S125. Processing is performed.

(Step S135)
The pattern analysis unit 275 notifies the offset command unit 276 that the soldering to the base region 911 is completed. The offset command unit 276 and the pattern analysis unit 275 are used for processing for counting processed copy regions (replication regions 912, 913, and 914 shown in FIG. 8) in response to the notification from the pattern analysis unit 275. Set the count value "n" to "1". Thereafter, step S140 is performed.

(Step S140)
The offset command unit 276 reads the position data from the storage unit 160. Thereafter, step S145 is performed.

(Step S145)
The offset command unit 276 calculates the offset amount for the nth duplication area. With respect to the electronic substrate 900 described with reference to FIG. 8, soldering is performed in the order of the replication regions 912, 913, 914. Therefore, when the count value “n” is “1”, soldering is performed on the replication area 912. When the count value “n” is “2”, soldering is performed on the replication area 913. When the count value “n” is “3”, soldering is performed on the replication area 914.

  As shown in FIG. 8, the shift of the copy area 912 from the base area 911 is “xa” in the x-axis direction, and is “0” in the y-axis direction. Therefore, when count value “n” is “1” (ie, when soldering is performed in copy region 912), offset command unit 276 has the offset amount in the x-axis direction “xa”, and , And notify that the offset amount in the y-axis direction is "0". The deviation of the copy area 913 from the base area 911 is “0” in the x-axis direction, but is “ya” in the y-axis direction. Therefore, when count value “n” is “2” (ie, when soldering is performed in copy region 913), offset command unit 276 has the offset amount in the x-axis direction “0”, and , And notify that the offset amount in the y-axis direction is "ya". The offset of the replication area 914 from the base area 911 is “xa” and “ya” in the x-axis and y-axis directions. Therefore, when count value “n” is “3” (ie, when soldering is performed in copy region 913), offset command unit 276 has offset amounts “xa” in the x-axis direction and y-axis direction. And "ya" is notified. When the offset amount for the copy area to be processed (that is, the n-th copy area) is output from the offset command unit 276 to the pattern analysis unit 275, step S150 is executed.

(Step S150)
The pattern analysis unit 275 changes the movement pattern determined in step S110 based on the offset amount notified from the offset command unit 276. As a result, when the count value “n” is “1”, the movement pattern described with reference to FIG. 3A is obtained. When the count value “n” is “2”, the movement pattern described with reference to FIG. 3B is obtained. When the count value “n” is “3”, the movement pattern described with reference to FIG. 3C is obtained. After the change of the movement pattern, a processing loop consisting of steps S155 to S170 is performed.

(Processing loop consisting of steps S155 to S170)
The processing loop consisting of steps S155 to S170 is similar to the processing loop for steps S115 to S130. Therefore, at the position shifted by the offset amount obtained in step S145, the soldering iron of soldering iron 115 has a movement locus of the same pattern as the movement locus drawn by the soldering iron tip of soldering iron 115 in base region 911 You can move by following The coordinate data (that is, base pattern data) obtained from the teaching operation performed on the base area 911 corresponds to the setting of the movement locus of the soldering iron 115 tip for the copy areas 912, 913, and 914. As it is used, teaching work for the copy areas 912, 913, 914 is not required. Therefore, the soldering apparatus 100 can significantly reduce the load of teaching work as compared with the conventional soldering apparatus which requires teaching work for all the soldering positions. After the end of the processing loop consisting of steps S155 to S170 (that is, after the soldering is completed at all the soldering positions of the nth replication region), step S175 is performed.

(Step S175)
The pattern analysis unit 275 confirms whether the count value “n” is equal to the total number “N” of copy areas (N = 3 for the electronic substrate 900 shown in FIG. 2). If the count value "n" is equal to the total number "N", the soldering process is complete (i.e. soldering has been performed at all soldering positions on the electronic substrate 900). Otherwise, step S180 is performed.

(Step S180)
The pattern analysis unit 275 and the offset command unit 276 increment the count value “n” by “1”. Thereafter, step S145 is performed. As a result, soldering to the next replication area is started.

<Other features>
A designer can provide various features to the above-described soldering apparatus 100. The features described below do not limit the design principle of the soldering apparatus 100 in any way.

(Various division patterns of electronic board)
The electronic substrate 900 described with reference to FIG. 8 is divided into 2 × 2 divided areas. However, the principles of the above-described embodiments are applicable to various division patterns of the electronic substrate 900.

  FIG. 5 is a schematic plan view of the electronic substrate 900. Another division pattern for the electronic substrate 900 will be described with reference to FIGS. 1, 4, 5, 7 and 8.

  The electronic substrate 900 shown in FIG. 5 is divided by a division pattern of Ny rows and Nx columns. That is, the electronic substrate 900 includes (Nx × Ny) division regions. One of these divided areas is set as a base area. Similar to FIG. 8, the base region shown in FIG. 5 is a rectangular region that forms the front left corner of the electronic substrate 900. The operator can input the items shown in the following table as positional relationship data before the soldering operation.

  Offset command unit 276 calculates a coefficient matrix for calculating the offset amount of each of a plurality of copy areas with respect to the base area based on the data representing “total number of columns” and “total number of rows” shown in “Table 4”. decide. The following equation shows the coefficient matrix.

  The offset command unit 276 sets the coefficient “Cx” of the duplicate region belonging to the column closest to the base region in the x-axis direction to “1” (that is, nx = 1). The offset command unit 276 sets the coefficient “Cx” of the duplicate region belonging to the second row closest to the base region in the x-axis direction to “2” (that is, nx = 2). Similarly, offset command unit 276 sets the coefficient “Cx” of the duplicate region belonging to the (Nx−1) -th closest column to the base region in the x-axis direction to “Nx−1” (ie 1). The offset command unit 276 sets the coefficient “Cy” of the duplicate region belonging to the column closest to the base region in the y-axis direction to “1” (ie, ny = 1). The offset command unit 276 sets the coefficient “Cy” of the duplicate region belonging to the second row closest to the base region in the y-axis direction to “2” (that is, ny = 2). Similarly, offset command unit 276 sets the coefficient “Cy” of the duplicate region belonging to the (Ny−1) th closest column to the base region in the y-axis direction to “Ny−1” (ie, ny = Ny− 1). In the present embodiment, the first region number data is one of the “total number of columns” and the “total number of rows” in “Table 4”. The second region number data is the other of “total number of columns” and “total number of rows” in “Table 4”. The first offset data is one of the offset amounts “xa” and “ya” of “Table 4”. The second offset data is the other of the offset amounts “xa” and “ya” of “Table 4”.

  The offset command unit 276 calculates offset amounts “xb” and “yb” to be output to the pattern analysis unit 275 using the offset amounts “xa” and “ya” and the coefficient matrix. The following matrix is a formula for calculating the offset amounts "xb" and "yb" from the base region.

  Since “nx” and “ny” of “Equation 2” are natural numbers for specifying the positions of a plurality of replicated areas divided in a matrix, a set of offsets “xb” and “yb” from the base area Are different in each of the plurality of replication regions.

  In step S140 shown in FIG. 4, the offset command unit 276 reads positional relationship data (see “Table 4”) from the storage unit 160. The offset command unit 276 can grasp the division pattern of the electronic substrate 900 and the soldering order from the “total number of columns” and “total number of rows” of the positional relationship data (see FIG. 5).

  The count value “n” described with reference to FIG. 4 corresponds to the order of soldering. Therefore, in step S145 described with reference to FIG. 4, the offset command unit 276 can find the copy region to be processed with reference to the count value "n" and the "soldering order" of the positional relationship data. . That is, for the divided area shown in FIG. 5, if count value "n" is "1", offset instructing unit 276 recognizes the copied area belonging to the 0th column and the 1st row as the target copied area. be able to. If the count value “n” is “(Nx−3) × Ny”, the copy area belonging to the (Nx−3) th column and the (Ny−1) th row can be recognized as the target copy area. . The offset command unit 276 can determine the set of (nx, ny) based on the column and row to which the copy area to be processed belongs. After determining the set of (nx, ny) corresponding to the replication region to be processed, the offset command unit 276 calculates the set of (xb, yb) based on the matrix of “Equation 2”. The set of (xb, yb) is output from the offset command unit 276 to the pattern analysis unit 275.

  In step S150 shown in FIG. 4, the pattern analysis unit 275 moves the movement path of the soldering iron tip set in the base region by “xb” in the x-axis direction and “y” in the y-axis direction. The movement pattern which realizes the movement of the tip along the movement locus drawn by translating by yb "is determined. In the processing loop consisting of steps S155 to S170, a duplicate drive signal for the determined movement pattern is generated. The drive unit 180 moves the soldering iron 115 and the installation table 125 in response to the duplication drive signal. As a result, the soldering iron tip of the soldering iron 115 can move along the movement locus obtained by translating the movement locus set on the base region. As a result of execution of the processing loop consisting of steps S140 to S180 shown in FIG. 4, soldering to a plurality of replication areas set on the electronic substrate 900 is sequentially completed according to the soldering order set by the operator. When the count value “n” becomes equal to “N ×× Ny−1” in step S175, the soldering to all the duplicate areas set on the electronic substrate 900 is completed, and the process of the control unit 170 is completed.

  FIG. 6 is an exemplary image displayed by the input interface 150 for input of the input items shown in “Table 4”. The input image displayed by the input interface 150 will be described with reference to FIGS. 1, 5 and 6.

  FIG. 6 shows four input windows 151, 152, 153, 154 and one display window 155. The operator can input the “total number of columns” shown in “Table 4” into the input window 151. The operator can input the “total number of rows” shown in “Table 4” into the input window 152. The operator can input the value of the offset amount “xa” shown in “Table 4” into the input window 153. The operator can input the value of the offset amount "ya" shown in "Table 4" into the input window 154.

  The display window 155 represents a soldering route and is associated with the soldering order shown in “Table 4”. According to the soldering route shown in FIG. 6, soldering is first performed on a plurality of divided areas (see FIG. 5) aligned in the “0” row. Thereafter, soldering is performed on the plurality of divided areas aligned in the first "1" row. Soldering is performed row by row, and the row to be soldered is changed backward. Finally, soldering is performed on a plurality of divided areas aligned in the (Ny-1) th row.

  Since the offset command unit 276 automatically determines the soldering order based on the soldering route, the operator does not have to set the soldering order individually for the plurality of divided areas. Therefore, the order setting of soldering does not become too complicated.

  The operator can operate the input interface 150 to change the pattern of the soldering route displayed in the display window 155. That is, a plurality of patterns different from one another are prepared in advance as soldering routes. Since the operator can select the pattern most suitable for the soldering operation as the soldering route, appropriate soldering will be performed. For example, the operator can select, as a soldering route, a pattern in which a soldering order suitable for the mounting order of electronic components can be set.

  For the above-described embodiment, in the base region 911 there are four soldering positions P01 to P04. However, in the base region 911, one soldering position may exist. Thus, the principles of the above-described embodiments are not limited in any way by how many soldering positions are present in the base region 911.

  With respect to the above-described embodiment, the point soldering operation for attaching point solder on the electronic substrate 900 is performed at each of the soldering positions P01 to P16. However, the above-described palletizing function is also applicable to a wire soldering operation in which linear solder is attached to the electronic substrate 900. Thus, the principles of the above-described embodiments are not limited to any particular soldering operation on the electronic substrate 900.

  The soldering apparatus 100 is provided with the operation unit 130 regarding the above-mentioned embodiment. The operator can grasp how to operate the operation unit based on the touch received from the operation unit 130, so the soldering iron 115 is moved while looking at the soldering iron 115 tip. It can be done. The soldering apparatus 100 enables the operator to simultaneously execute the confirmation of the position of the soldering iron and the operation of the soldering iron 115, so that the operator can efficiently perform the teaching operation. However, the palletizing function described above can be incorporated into a general soldering apparatus that does not have the operation unit 130. Thus, the principles of the embodiments described above are not limited to the particular structure of the soldering apparatus 100.

  For the embodiments described above, the electronic substrate 900 is divided in a matrix. However, palletizing functions are also available under other segmentation patterns. That is, if the arrangement pattern of the soldering position to be a target of the teaching operation and the arrangement pattern identical to the arrangement pattern exist at a different position on the electronic substrate 900, the operator performs the above-mentioned palletizing function Can be used to perform teaching operations for a smaller number of soldering positions than conventional teaching operations. Therefore, the principle of the above-described embodiment is not limited to a specific division pattern virtually set on the electronic substrate 900.

  The principles of the above-described embodiments are suitably utilized in various work sites where solder melting operations are performed.

100 ···························································································· 170 170 ··················································· Pattern determination unit 172 ············································ · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · Electronic board Replication area P01 to P16 ................. Soldering position

Claims (9)

At least one base region having at least one soldering position, and a layout pattern common to the layout pattern of the at least one soldering position in the base region, and located at a position different from the base region A soldering iron for soldering to the surface of an electronic substrate comprising a plurality of soldering areas having a replication area;
A drive unit for moving the soldering iron;
An input for receiving positional relationship data representing a positional relationship between the base region and the at least one duplication region, and base pattern data representing the layout pattern of the at least one soldering position in the base region Department,
A control unit configured to control the drive unit based on the base pattern data and the positional relationship data in a soldering operation;
The control unit
(I) determining a movement pattern for moving the soldering iron to the at least one soldering position in the base region based on the base pattern data;
(Ii) controlling the drive unit so that the soldering iron moves in the determined movement pattern in the base region;
(Iii) Based on the positional relationship data and the determined movement pattern, the drive unit is controlled such that the movement of the soldering iron is performed in the at least one duplication region. The control unit
(I) a pattern determination unit that determines the movement pattern in the base region based on the base pattern data;
(Ii) A base driving signal for operating the driving unit to move the soldering iron in the base region according to the determined movement pattern, and based on the positional relationship data and the determined movement pattern Generating a duplicate drive signal for operating the driver to move the soldering iron to the at least one duplication area and to move in the at least one duplication area according to the determined movement pattern. A signal generator, and
The soldering apparatus according to claim 1, wherein the driving unit moves the soldering iron according to the base driving signal and the duplication driving signal. The positional relationship data includes area number data representing the number of a plurality of areas including the base area and the at least one duplicate area aligned along a predetermined axis from the base area, and among the plurality of areas And offset data representing an amount of deviation between two adjacent areas,
The signal generation unit refers to the region number data and the offset data, and moves the base drive signal and the duplication drive such that the soldering iron moves in each of the plurality of regions according to the determined movement pattern. The soldering apparatus according to claim 2, which generates a signal. The first area number data representing the number of first areas including the base area and the at least one copy area aligned along the predetermined first axis from the base area; And first offset data representing an amount of deviation between two adjacent ones of the plurality of first regions,
The signal generation unit refers to the first area number data and the first offset data, and the base moves the soldering iron in each of the plurality of first areas according to the determined movement pattern. The soldering apparatus according to claim 2 or 3, which generates a drive signal and the duplicate drive signal. A second area representing the number of second areas including the base area and the at least one duplicate area aligned along a second axis orthogonal to the first axis from the base area Number data, and second offset data representing an amount of deviation between two adjacent ones of the plurality of second regions,
The signal generation unit refers to the second area number data and the second offset data, and the base moves the soldering iron in each of the plurality of second areas according to the determined movement pattern. The soldering apparatus according to claim 4, which generates a drive signal and the duplicate drive signal. The input unit represents a movement amount of the soldering iron when the soldering iron after soldering to the at least one soldering position in the base region moves upward from the surface of the electronic substrate. Accept the input of movement amount data,
The pattern determination unit refers to the movement amount data and determines the movement pattern in which the soldering iron moves upward for each soldering.
The drive unit is operated to move the copy drive signal generated by the signal generation unit in the at least one copy area according to the determined movement pattern, and the soldering iron in the at least one copy area The soldering apparatus according to any one of claims 2 to 5, wherein the soldering apparatus is moved upward every soldering. A plurality of coordinate values respectively representing the first soldering position and a second soldering position present at positions different from the first soldering position as coordinate values representing the at least one soldering position. The soldering apparatus according to claim 6, wherein the input unit receives inputs of a plurality of different values for the first soldering position and the second soldering position as the movement amount data. . A plurality of coordinate values respectively representing the first soldering position and a second soldering position present at positions different from the first soldering position as coordinate values representing the at least one soldering position. 7. The soldering apparatus according to claim 6, wherein the input unit collectively accepts, as the movement amount data, inputs of values common to the first soldering position and the second soldering position. . The input unit receives specification of a soldering order for the plurality of soldering areas;
9. The drive unit moves the soldering iron under the control of the control unit such that the soldering iron is soldered in the plurality of soldering regions in accordance with the designated order. Soldering equipment as described in 1 or 2.

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