JP2019064865A - Method for producing metal-ceramic bonded substrate - Google Patents

Abstract

To provide a method for producing a metal-ceramic bonded substrate, capable of wet-spreading a blazing material sufficiently, preventing non-bonded defects from occurring, and preventing thermal shock resistance from degrading, in a method for producing a metal-ceramic bonded substrate including bonding a metal plate to at least one surface of a ceramic substrate with the blazing material.SOLUTION: This invention relates to a method for producing a metal-ceramic bonded substrate, including bonding a metal plate to at least one surface of a ceramic substrate with the blazing material. The blazing material is applied onto at least one surface of the ceramic substrate, so that: the ceramic substrate consists of many small regions in which one regions of applied regions 12 onto which the blazing material is applied and non-applied regions 14 onto which the blazing material is not applied are spaced apart from each other; and the other regions consist of many tiny regions respectively arranged inside many small regions of the one regions and regions extending between many small regions of the one region.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of manufacturing a metal-ceramic bonded substrate, and more particularly to a method of manufacturing a metal-ceramic bonded substrate in which a metal plate is bonded to a ceramic substrate through a brazing material.

  Conventionally, power modules are used to control high power of electric vehicles, trains, machine tools and the like. As such an insulating substrate for a power module, a metal-ceramic bonded substrate in which a metal plate is bonded to a ceramic substrate via a brazing material is used.

  In such a metal-ceramic bonding substrate, when the ceramic substrate has large warpage or waviness, when a brazing material is applied to the ceramic substrate and the metal plate is heat-joined, a metal plate corresponding to a portion where the warpage or waviness is large is used. Without the brazing material coming in contact, it becomes an unbonded defect. If such an unjoined portion is present, there is a problem that the heat dissipation of the metal-ceramic bonded substrate is reduced, and partial discharge is likely to occur. In particular, partial discharge is likely to occur even with a microvoid.

  In order to eliminate such problems, the thickness of the brazing material layer for joining the metal body and the ceramic body is increased to 26 to 100 μm, thereby increasing the amount of liquid phase generated by melting the brazing material during the joining process. It has been proposed to make it easy to spread the brazing material to the joint interface and to make it difficult to form defects such as voids or gaps in the brazing material layer or at the interface between the brazing material layer and the metal or ceramic body. (See, for example, Patent Document 1).

  In addition, a mesh-like joined portion and a non-joined portion exist in the joined surface of the ceramic substrate and the metal plate, and the area ratio of the non-joined portion to the joined surface is 5 to 50% (for example, patent) Patent Document 2), and application of a brazing material in a point-like or linear manner to a bonding surface of a ceramic substrate to a metal plate (see, for example, Patent Document 3).

JP-A-11-228246 (paragraph number 0008) Unexamined-Japanese-Patent No. 6-172051 (paragraph number 0007) Unexamined-Japanese-Patent No. 9-157055 (paragraph number 0008)

  However, as in Patent Document 1, if the brazing material is thickened, non-joining defects can be prevented, but in the case of a metal-ceramic bonding substrate, the thickness of the brazing material is usually 10 to 20 μm, and the brazing material If the thickness of the above is increased to about 40 .mu.m, there is a problem that the thermal shock resistance of the metal-ceramic bonding substrate is deteriorated.

  Also, as in Patent Documents 2 and 3, when the brazing material is applied in the form of dots or lines, the wetting and spreading of the brazing material is insufficient, and the area of the bonding region of the metal plate of the metal-ceramic bonding substrate and the ceramic substrate is There is a problem that it is not enough.

  Therefore, in view of such conventional problems, the present invention, in a method of manufacturing a metal-ceramic bonding substrate in which a metal plate is joined to at least one surface of a ceramic substrate through a brazing material, the wetting and spreading of the brazing material It is an object of the present invention to provide a method for producing a metal-ceramic bonded substrate, which can sufficiently reduce non-bonded defects and prevent a decrease in thermal shock resistance.

  MEANS TO SOLVE THE PROBLEM As a result of earnestly researching in order to solve the said subject, the present inventors join the metal material to the metal-ceramics joining board | substrate which joins a metal plate to at least one surface of a ceramic substrate through a brazing material. The application area to be applied and the non-application area to which the brazing material is not applied consist of a large number of small areas spaced from each other, and the other area is inside each of the small areas of one area. By applying a brazing material to at least one surface of the ceramic substrate so as to consist of a large number of micro areas arranged respectively and an area extending between a large number of small areas of one area, the wetting and spreading of the brazing material is sufficient. It has been found that the present invention can provide a method for producing a metal-ceramic bonded substrate that can prevent non-bonded defects and prevent the decrease in thermal shock resistance. The has been completed.

  That is, in the method of manufacturing a metal-ceramic bonding substrate according to the present invention, the metal material is bonded to at least one surface of the ceramic substrate via the brazing material. The area and one area of the non-applied area not coated with brazing material consist of a large number of small areas spaced apart from one another, and the other area is arranged inside of each of the small areas of one area. A brazing material is applied to at least one surface of the ceramic substrate so as to be composed of a large number of minute regions and a region extending between a large number of small regions in one region.

  In this method of manufacturing a metal-ceramic bonding substrate, the shape of the small area of one area is a polygon, and the shape of the small area of the other area is substantially the same as the polygon of the small area of the one area. Each side of the polygon of the small area of one area is substantially parallel to each side of the polygon of the small area of the other area opposite to the side, and the small area of one area is small. Preferably, each side of the polygon of the region extends substantially parallel to one side of the polygon of the small region facing the side. In this case, the non-application region is one region, and the distance between each side of the polygon of the small region of one region and each side of the polygon of the small region of the other region opposite to the side is 0 It is preferable that it is 0.2 mm or less. Alternatively, the non-coated area is the other area, and the distance between each side of the small area polygon of one area and one side of the small area polygon opposite to the side is 0.2 mm or less. Is preferred. In this case, it is preferable that the polygon is a substantially regular hexagon, and the distance between opposite sides of each of the micro areas of the plurality of micro areas is 0.2 mm or less.

  Further, in the method of manufacturing a metal-ceramic bonding substrate described above, it is preferable that the polygon is a substantially regular hexagon. The area of the coated area is preferably 30 to 80% of the total area of the coated area and the non-coated area.

  The metal-ceramic bonding substrate according to the present invention is a metal-ceramic bonding substrate in which a metal plate is bonded to at least one surface of a ceramic substrate via an active metal-containing brazing material, a surface of the metal plate facing the ceramic substrate. And the area ratio of the joint region of the metal plate and the ceramic substrate is 97% or more, and the active metal in the active metal-containing brazing material exists in substantially the entire region of the joint region and the activity in the active metal-containing brazing material It is characterized in that there is a region enriched in metal.

  In this metal-ceramic bonding substrate, when the active metal-containing brazing material contains 100% by mass of the metal component in the brazing material, 5 to 40% by mass of copper, 1 to 10% by mass of active metal, 1 to 10% by mass It is preferred to include wt% tin and the balance silver. In addition, a scanning electron microscope (Ceramic substrate is an aluminum nitride substrate, an active metal is titanium, and a region where the active metal is concentrated is the surface of the ceramic substrate from which a metal plate and a part of the active metal brazing material have been removed). Peak area ratio of Ti (Kα) to Al (Kα) of characteristic X-rays by energy dispersive X-ray spectroscopy of a scanning electron microscope when the reflected electron image is photographed and observed by SEM) [Ti (Kα) It is preferable that the region is such that / Al (Kα)] is 0.2 or more. Moreover, it is preferable that the area ratio of the area | region which the active metal concentrated with respect to a joining area | region is 20 to 40%.

  According to the present invention, in the method of manufacturing a metal-ceramic bonded substrate in which a metal plate is bonded to at least one surface of the ceramic substrate via the brazing material, the wetting and spreading of the brazing material is made sufficient to prevent unjoined defects. It is possible to provide a method of manufacturing a metal-ceramic bonding substrate that can prevent the reduction in thermal shock resistance.

It is a top view which shows the pattern of the screen version used in Examples 1-2. It is a top view which shows the pattern of the screen version used in Examples 3-5. It is a figure explaining the dimension of the pattern of the screen version used in Examples 1-4. It is a top view which shows the pattern of the screen version used in Comparative Examples 2-4. It is a top view which shows the pattern of the screen version used in Comparative Examples 5-6. 15 is a view showing a backscattered electron image of a bonding interface of the metal-ceramic bonding substrate manufactured in Example 3. FIG.

  In an embodiment of a method of manufacturing a metal-ceramic bonding substrate according to the present invention, a brazing material is applied in a method of manufacturing a metal-ceramic bonding substrate in which a metal plate is bonded to at least one surface of the ceramic substrate via the brazing material. The application area and the non-application area where the brazing material is not applied consists of a large number of small areas spaced from each other, and the other area is inside each of the large areas of one area. A brazing material is applied to at least one surface of the ceramic substrate so as to consist of a large number of micro areas to be arranged and an area extending between a large number of small areas of one area.

  In this method of manufacturing a metal-ceramic bonding substrate, the (maximum) distance between the small area of one area and the small area of the other area arranged inside the small area is preferably 0.2 mm or less (more preferably) Is 0.1 to 0.2 mm), and the (maximum) distance between a small area of one area and a small area adjacent to the small area is preferably 0.2 mm or less (more preferably 0.1 to 0). .2 mm).

  Further, in the method of manufacturing a metal-ceramic bonding substrate described above, the shape of the small region of one region is a polygon, and the shape of the minute region of the other region is substantially the same as the polygon of the small region of one region. A polygon of a shape, each side of the polygon of the small area of one area extending substantially parallel to each side of the polygon of the small area of the other area opposite to those sides, Preferably, each side of the small area polygon of the area extends substantially parallel to one side of the small area polygon facing (adjacent to) each side. In this case, the (maximum) distance between each side of the polygon of the small area of one area and each side of the polygon of the small area of the other area opposite to those sides is preferably 0.2 mm or less (each More preferably, it is 0.1 to 0.2 mm), and the (maximum) distance between each side of the polygon of the small area of one area and one side of the polygon of the small area opposite to the side is preferably each Is 0.2 mm or less (more preferably 0.1 to 0.2 mm). The polygon may be any of a substantially triangular shape, a substantially square shape, a substantially pentagonal shape, a substantially hexagonal shape, etc., but a substantially regular hexagonal shape is preferable.

  Further, in the above-described method of manufacturing a metal-ceramic bonded substrate, the area of the coated area with respect to the total area of the coated area and the non-coated area is preferably 30 to 80% (more preferably 40 to 70%).

In the method of manufacturing a metal-ceramic bonding substrate described above, the ceramic substrate has a length of 10 to 150 mm (preferably 50 mm or more), a width of 10 to 150 mm (preferably 50 mm or more), and a thickness of 0.2 to 2.0 mm. A ceramic substrate mainly composed of aluminum nitride, alumina, silicon nitride or the like can be used. The amount of warpage per 2 inches of the main surface of the ceramic substrate is preferably 45 μm or more, more preferably 69 μm or more. The metal plate is preferably made of copper, a copper alloy, aluminum or an aluminum alloy. The brazing material is preferably a brazing material comprising a paste containing an active metal, and it is preferable to use an Ag-Cu-based brazing material or an Al-Si-based brazing material. The brazing material is preferably applied by screen printing or the like, and the application amount of the brazing material is preferably 0.008 to 0.013 mg / cm ² .

  According to such a method for manufacturing a metal-ceramic bonded substrate, it is possible to manufacture a metal-ceramic bonded substrate having an area ratio of 97% of a bonded region to a region to be bonded (the total area of a coated region and a non-coated region).

  After forming a resist mask having a circuit pattern shape or the like on the metal plate of the metal-ceramic bonding substrate thus manufactured, unnecessary portions of the metal plate and the brazing material are etched away to remove the metal circuit. A board etc. can be formed and a metal circuit board etc. can be plated as needed, and a metal-ceramics joining circuit board can be manufactured.

  Hereinafter, an embodiment of a method of manufacturing a metal-ceramic bonded substrate according to the present invention will be described in detail.

Example 1
In pattern 10 shown in FIG. 1 (a length of one side of a substantially hexagonal small area of application area 12 shown in FIG. 3 = 0.34 mm, a space between adjacent small areas b = 0.19 mm, an opposite side space of small areas c = 0.589 mm, diagonal length d of small area d = 0.68 mm, opposite-to-side distance e = 0.19 mm of substantially hexagonal micro area of non-coated area 14, side of small area of coated area 12 and this side On the both sides of a 71 mm × 60 mm × 0.635 mm sized aluminum nitride substrate using a screen plate (200 mesh) with a spacing f of 0.199 mm between one side of the minute area of the non-coated area 14 A paste-like active metal-containing brazing material containing 85% by mass of silver, 7% by mass of copper, 5% by mass of tin and 3% by mass of titanium (as an active metal component) to a thickness of 40 μm Screen printing, each side Place a copper plate of 72 mm × 61 mm × 0.25 mm on the brazing material, by joining copper plates to both surfaces of an aluminum nitride substrate was heated to 850 ° C. in a vacuum, the metal - to produce ceramic bonding substrate. In addition, it was 58.3% when the ratio (area ratio) of the area of the application area 12 with respect to the area of the non-application area 14 by a screen plate was calculated.

  The 45 metal-ceramic bonded substrates thus obtained were examined by an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. All were 97% or more and less than 97%. The number of the metal-ceramic bonding substrates was zero, and the wetting and spreading of the brazing material was sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, for each of the obtained 10 metal-ceramic bonded substrates, the temperature is raised from the room temperature to 380 ° C. in 10 minutes for each metal-ceramic bonded substrate, held for 10 minutes, and then returned to room temperature in 5 minutes. When the processing was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, but no crack was generated in any case. Moreover, even if the above-described furnace-passing treatment is repeated 10 times, no cracks are generated in any case, and even if the furnace-passing treatment is repeated, the number of times of furnace-passing (the furnace tolerance) is not abnormal. It was over time.

Example 2
Pattern 10 shown in FIG. 1 (length a = 0.28 mm of one side of a substantially hexagonal small area of application area 12 shown in FIG. 3, interval b = 0.14 mm between adjacent small areas, opposite area of small areas c = 0.485 mm, diagonal length d of small area d = 0.56 mm, distance between opposite sides of substantially hexagonal micro area of non-coated area 14 = 0.14 mm, side of small area of coated area 12 and this side A metal / ceramic bonding substrate was manufactured in the same manner as in Example 1 except that a screen plate with a spacing f of 0.173 mm between one side of the micro area of the non-coated area 14 was used. In addition, it was 59.0% when the ratio (area ratio) of the area of the application area 12 with respect to the area of the non-application area 14 by a screen plate was calculated.

  The 45 metal-ceramic bonded substrates thus obtained were examined by an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. All were 97% or more and less than 97%. The number of the metal-ceramic bonding substrates was zero, and the wetting and spreading of the brazing material was sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Moreover, even if the same furnace treatment as in Example 1 was repeated 10 times, no cracks occurred in any case, and the furnace tolerance was 10 times or more.

[Example 3]
In the pattern 110 shown in FIG. 2 (the length a of one side of the substantially hexagonal small area of the non-coated area 114 shown in FIG. 3 = 0.34 mm, the interval b between adjacent small areas b = 0.19 mm, the opposite side of the small area Spacing c = 0.589 mm, diagonal length d of small area d = 0.68 mm, Spacing e between small areas of substantially hexagonal micro area of coated area 112 = 0.19 mm, side and side of small area of non-coated area 114 A metal / ceramic bonding substrate was manufactured in the same manner as in Example 1 except that a screen plate with a spacing f of 0.199 mm between one side of the minute area of the opposite application area 112 was used. The ratio (area ratio) of the area of the coated area 112 to the area of the non-coated area 114 by the screen plate was 54.1%.

  The 45 metal-ceramic bonded substrates thus obtained were examined by an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. All were 97% or more and less than 97%. The number of the metal-ceramic bonding substrates was zero, and the wetting and spreading of the brazing material was sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Further, even when the same furnace treatment as in Example 1 is repeated 10 times or 15 times, no cracks are generated in any case, and when the metal-ceramics bonded substrate is cracked 20 times when repeated 20 times. However, the furnace resistance was more than 15 times.

  When a cross section approximately perpendicular to the main surface of the obtained metal-ceramic bonding substrate is observed by scanning a reflected electron image at a magnification of 1000 with a scanning electron microscope (SEM), the copper plate has a brazing material interposed therebetween. It bonded to the aluminum nitride board | substrate, the void was not recognized any of the application | coating area | region and the non-application | coating area | region, and the unjoined defect was not recognized.

  In addition, the obtained metal-ceramic bonding substrate is immersed in 65 mass% concentrated nitric acid for about 10 minutes to dissolve and remove a copper plate and a part of the brazing material, and then aluminum nitride in which the copper plate and a part of the brazing material are removed. The surface of the substrate was observed by scanning a 100 × backscattered electron image with an accelerating voltage of 20 kV by SEM, as shown in FIG. 6, in a portion substantially corresponding to the non-coated area of the screen plate, in the active metal-containing brazing material The peak area ratio of Ti (Kα) to Al (Kα) of the characteristic X-ray detected by the (white) region where the titanium concentration is concentrated (SEM: energy dispersive X-ray spectroscopy (EDS) Ti (Kα) / Al There is a region (Kα) of 0.36), and titanium in the active metal-containing brazing material is detected in the region surrounding the region and inside the region, compared to the region where titanium is concentrated and detected. Extremely small There is a (gray) region of peak intensity to be detected (peak area ratio of Ti (Kα) to Al (Kα) of EDS characteristic X-ray of SEM to a region of Ti (Kα) / Al (Kα) of 0.008) It was found that the distribution of titanium in the active metal-containing brazing material differs depending on the bonding region at the bonding interface of the metal-ceramic bonding substrate. When the reflection electron image in FIG. 6 is binarized by image processing and the area ratio of the region detected by concentration of titanium in the active metal-containing brazing material to the entire bonding region is determined, it is 28.0%. there were.

  In addition, when a cross section of a (white) region detected by concentration of titanium in the active metal-containing brazing material by SEM is observed by observing a characteristic X-ray image by EDS of SEM, the aluminum nitride substrate and the active metal-containing brazing material At the interface with the material, the thickness of the titanium enrichment layer in the region where titanium was concentrated and detected was about 1 μm, and in the other regions (the titanium was diffused and detected without being concentrated and uniformly distributed The thickness of the titanium diffusion layer in the region) was about 20 μm.

Example 4
In the pattern 110 shown in FIG. 2 (the length a of one side of the substantially hexagonal small area of the non-coated area 114 shown in FIG. 3 = 0.28 mm, the spacing b between adjacent small areas = 0.14 mm, the opposite side of the small area Spacing c = 0.485 mm, diagonal length d of small area d = 0.56 mm, Spacing e between small areas of substantially hexagonal micro area of coated area 112 = 0.14 mm, side and side of small area of non-coated area 114 A metal / ceramic bonding substrate was manufactured in the same manner as in Example 1 except that a screen plate with a spacing f of 0.173 mm between one side of the minute area of the opposite application area 112 was used. In addition, it was 53.4% when the ratio (area ratio) of the area of the application area 112 with respect to the area of the non-application area 114 by screen printing was calculated.

  The 45 metal-ceramic bonded substrates thus obtained were examined by an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. All were 97% or more and less than 97%. The number of the metal-ceramic bonding substrates was zero, and the wetting and spreading of the brazing material was sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Also, even when the same furnace treatment as in Example 1 is repeated 10 times or 15 times, no cracks are generated in any case, and a metal-ceramic bonded substrate in which a crack is generated when repeated 20 times is 1 However, the furnace resistance was more than 15 times.

[Example 5]
In the pattern 110 shown in FIG. 2 (one side length a = 0.77 mm of the substantially hexagonal small area of the non-coated area 114 shown in FIG. 3, the space b = 0.40 mm between adjacent small areas, the small side Spacing c = 1.335 mm, diagonal length d of small area d = 1.54 mm, opposite side spacing e = 0.94 mm of micro area of substantially hexagonal coated area 112, side and side of small area of non-coated area 114 A metal-ceramic bonded substrate was manufactured in the same manner as in Example 1 except that a screen plate with a spacing f of 0.20 mm between one side of the micro area of the opposite application area 112 was used. The ratio (area ratio) of the area of the coated area 112 to the area of the non-coated area 114 by the screen plate was 70%.

  The 45 metal-ceramic bonded substrates thus obtained were examined by an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. The spread was enough. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Also, even when the same furnace treatment as in Example 1 is repeated 10 times or 15 times, no cracks are generated in any case, and a metal-ceramic bonded substrate in which a crack is generated when repeated 20 times is 1 However, the furnace resistance was more than 15 times.

  In the metal-ceramic bonding substrate obtained, when a cross section approximately perpendicular to the main surface was photographed and observed by SEM using a method similar to that of Example 3, the coated region and the non-coated region were obtained. In all cases, no void was observed, and no unjoined defect was observed.

  In addition, with respect to the obtained metal-ceramic bonding substrate, the surface of the aluminum nitride substrate from which a copper plate and a part of the brazing material have been removed is observed by SEM using a method similar to the third embodiment. Similarly to FIG. 6, (white) area detected by concentration of titanium in the active metal-containing brazing material in a portion substantially corresponding to the non-coated area of the screen plate (white (characteristic X-ray Al by SEM EDS There is a peak area ratio Ti (Kα) / Al (Kα) of 0.3 area of Ti (Kα) to Kα), titanium in the active metal-containing brazing material in the area surrounding the area and inside the area (Gray) region of the peak intensity detected (gray) with a very small detection compared to the region where titanium is detected as concentrated but the concentration of Ti (K α) to Al (K α) characteristic X-ray by SEM EDS There is an area ratio Ti (Kα) / Al region of (K [alpha) is 0.024), the metal - the distribution of the titanium of the active metal-containing brazing material is found to differ by a bonding region in the bonded interface of ceramic bonding substrate. In addition, it was 31.0% when the above-mentioned backscattered electron image was binarized by image processing, and the area ratio to the whole joining area of the area detected by concentration of titanium in the active metal-containing brazing material was determined. The

  In addition, when a cross section of a (white) region detected by concentration of titanium in the active metal-containing brazing material by SEM is observed by observing a characteristic X-ray image by EDS of SEM, the aluminum nitride substrate and the active metal-containing brazing material At the interface with the material, the thickness of the titanium enrichment layer in the region where titanium was concentrated and detected was about 1 μm, and in the other regions (the titanium was diffused and detected without being concentrated and uniformly distributed The thickness of the titanium diffusion layer in the region) was about 20 μm.

Comparative Example 1
A metal-ceramic bonding substrate was prepared by the same method as in Example 1, except that the brazing material was applied to the entire surface on both sides of the aluminum nitride substrate to a thickness of 18 μm (the coating weight is within ± 10% of Example 1). Manufactured. The ratio (area ratio) of the area of the coated area to the area of the non-coated area by the screen plate is 100%.

  In the 170 metal-ceramic bonded substrates thus obtained, it was visually observed whether or not there is a portion (unbonded portion) where the copper plate is peeled from the peripheral portion of each surface of the aluminum nitride substrate. There were unjoined parts on 60 metal-ceramic bonded substrates.

  Further, with respect to the obtained five metal-ceramic bonding substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Moreover, when the same furnace treatment as in Example 1 is repeated ten times, two metal-ceramic bonded substrates with cracks are generated, and when repeated 15 times, four metal-ceramic bonded substrates generated with cracks. The number of metal-ceramic bonding substrates in which cracking occurred when repeated 15 times was five, and the furnace resistance was 5 times or more.

Comparative Example 2
In the pattern 210 shown in FIG. 4 (length a = 0.75 mm of one side of a substantially hexagonal small area of the application area 212, interval b = 0.43 mm between adjacent small areas, opposite side interval c = 1. A metal-ceramic bonded substrate was prepared in the same manner as in Example 1 except that a screen plate of 299 mm and a small area with a diagonal length d = 1.5 mm was used ((a to d are large and not having a small area)). Manufactured. The ratio (area ratio) of the area of the coated area 212 to the area of the non-coated area 214 by the screen plate was 62.4%.

  The number of metal-ceramic bonded substrates less than 97% was determined by examining whether the area of the bonded region is 97% or more with an ultrasonic flaw detector for the 24 metal-ceramic bonded substrates obtained in this manner. There were five, and the wetting and spreading of the brazing material was not sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Further, even when the same furnace treatment as in Example 1 was repeated 10 times, no cracks were generated in any case, and when repeated 15 times, there was one metal-ceramic bonded substrate in which a crack was generated. The furnace capacity was 10 times or more.

Comparative Example 3
In the pattern 210 shown in FIG. 4 (the length a of one side of the substantially hexagonal small area of the application area 212 is a = 0.25 mm, the spacing b between adjacent small areas is 0.16 mm, and the opposing spacing c of small areas By the same method as in Example 1, except that a screen plate of 433 mm, diagonal length d of small area d = 0.5 mm) (the width of the application area exceeds 0.2 mm because it does not have micro areas) was used, A metal-ceramic bonding substrate was manufactured. The ratio (area ratio) of the area of the coated area 212 to the area of the non-coated area 214 by the screen plate was 60.3%.

  The 45 metal-ceramic bonded substrates thus obtained were examined using an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. The number of metal-ceramic bonded substrates less than 97% is There were five, and the wetting and spreading of the brazing material was not sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Further, even when the same furnace treatment as in Example 1 was repeated 10 times, no cracks were generated in any case, and when repeated 15 times, there was one metal-ceramic bonded substrate in which a crack was generated. The furnace capacity was 10 times or more.

Comparative Example 4
In the pattern 210 shown in FIG. 4 (the length a of one side of the substantially hexagonal small area of the application area 212 is 0.26 mm, the interval b between adjacent small areas is 0.21 mm, and the opposing interval c of the small areas is 0.2). A screen plate of 450 mm, small area diagonal length d = 0.52 mm) (the width of the coated area exceeds 0.2 mm and the width of the non-coated area also exceeds 0.2 mm because there is no micro area) A metal-ceramic bonded substrate was manufactured in the same manner as in Example 1 except for the following. The ratio (area ratio) of the area of the coated area 212 to the area of the non-coated area 214 by the screen plate was 53.0%.

  The 45 metal-ceramic bonded substrates thus obtained were examined using an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. The number of metal-ceramic bonded substrates less than 97% is There were seven, and the wetting and spreading of the brazing material was not sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Moreover, even if the same furnace treatment as in Example 1 was repeated 10 times, no cracks occurred in any case, and the furnace tolerance was 10 times or more.

Comparative Example 5
Pattern 310 shown in FIG. 5 (length a of one side of a substantially hexagonal small area of non-coated area 314 = 0.25 mm, interval b between adjacent small areas = 0.16 mm, distance between opposing sides of small areas c = 0 The same method as in Example 1 except that a screen plate of (.433 mm, diagonal length d of small area d = 0.5 mm) (the width of the non-coated area exceeds 0.2 mm because it does not have micro area) is used. Thus, a metal-ceramic bonded substrate was manufactured. The ratio (area ratio) of the area of the coated area 312 to the area of the non-coated area 314 by the screen plate was 52.1%.

  The 45 metal-ceramic bonded substrates thus obtained were examined using an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. The number of metal-ceramic bonded substrates less than 97% is It was 15 pieces, and the wetting and spreading of the brazing material was not sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Moreover, even if the same furnace treatment as in Example 1 was repeated 10 times, no cracks occurred in any case, and the furnace tolerance was 10 times or more.

Comparative Example 6
In the pattern 310 shown in FIG. 5 (the length a of one side of the substantially hexagonal small area of the non-coated area 314 is 0.26 mm, the spacing b between adjacent small areas is 0.21 mm, the spacing between opposing small areas c = 0 (.450 mm, diagonal length d of small area d = 0.52 mm) (The width of non-coated area exceeds 0.2 mm and the width of coated area also exceeds 0.2 mm because there is no micro area) A metal / ceramic bonding substrate was manufactured in the same manner as in Example 1 except for the above. In addition, it was 59.4% when the ratio (area ratio) of the area of the application area 312 with respect to the area of the non-application area 314 by screen printing was calculated.

  The 45 metal-ceramic bonded substrates thus obtained were examined using an ultrasonic flaw detector to determine whether the area of the bonded region is 97% or more. The number of metal-ceramic bonded substrates less than 97% is There were 16 and the wetting and spreading of the brazing material was not sufficient. Moreover, when it was visually observed whether the copper plate has peeled off from the peripheral part of each surface of the aluminum nitride board | substrate (unjoined part), it was not unjoined in any case.

  In addition, with respect to the obtained ten metal-ceramic bonded substrates, when the same furnace treatment as in Example 1 was repeated five times, it was visually observed whether or not a crack was generated in the aluminum nitride substrate, There were no cracks in any case. Moreover, even if the same furnace treatment as in Example 1 was repeated 10 times, no cracks occurred in any case, and the furnace tolerance was 10 times or more.

  The manufacturing conditions and characteristics of the metal-ceramic bonded substrates of these Examples and Comparative Examples are shown in Tables 1 and 2.

10, 110. 210, 310 Screen version pattern 12, 112, 212, 312 Application area 14, 114, 214, 314 Non-application area

Claims (11)

In a method of manufacturing a metal-ceramic bonded substrate in which a metal plate is joined to at least one surface of a ceramic substrate via a brazing material, one of a coated region to which the brazing material is applied and a non-coated region to which the brazing material is not applied Between a large number of small areas which are arranged at a distance from one another and a large number of small areas which are respectively arranged inside each of a large number of small areas of one area and a large number of small areas of one area A brazing material is applied to at least one surface of a ceramic substrate so as to form an extended region, and a method for manufacturing a metal-ceramic bonded substrate. The shape of the small region of the one region is a polygon, and the shape of the minute region of the other region is a polygon of substantially the same shape as the polygon of the small region of the one region, the one region Each side of the small area polygon extends substantially parallel to each side of the small area polygon of the other area opposite to the side of the small area polygon, and the small area polygon of the one area The method for producing a metal-ceramic bonding substrate according to claim 1, wherein each side extends substantially in parallel to one side of a polygon of a small area facing each side. The non-application area is the one area, and the distance between each side of the polygon of the small area of the one area and each side of the polygon of the small area of the other area opposite to the side is respectively The method for producing a metal-ceramic bonded substrate according to claim 2, wherein the thickness is 0.2 mm or less. The non-application region is the other region, and the distance between each side of the polygon of the small region of the one region and one side of the polygon of the small region opposite to the side is 0.2 mm or less The method for producing a metal-ceramic bonded substrate according to claim 2, characterized in that: The method for manufacturing a metal-ceramic bonding substrate according to claim 4, wherein the polygon is a substantially regular hexagon, and an interval between opposite sides of each of the minute regions of the large number of minute regions is 0.2 mm or less. . The method for producing a metal-ceramic bonded substrate according to any one of claims 2 to 4, wherein the polygon is a substantially regular hexagon. The method of manufacturing a metal-ceramic bonding substrate according to any one of claims 1 to 5, wherein the area of the coated area is 30 to 80% of the total area of the coated area and the non-coated area. . In a metal-ceramic bonding substrate in which a metal plate is bonded to at least one surface of a ceramic substrate via an active metal-containing brazing material, an area of a bonding region of the metal plate and the ceramic substrate with respect to a surface of the metal plate facing the ceramic substrate. And the active metal in the active metal-containing brazing material is present in substantially the entire area of the joint region, and the active metal-enriched region in the active metal-containing brazing material is present. Metal-ceramic bonding substrate. Assuming that the active metal-containing brazing material contains 100% by mass of the metal component in the brazing material, 5 to 40% by mass of copper, 1 to 10% by mass of active metal, 1 to 10% by mass of tin, and the balance The metal-ceramic bonding substrate according to claim 8, wherein the metal comprises: silver. The scanning electron microscope of the surface of the ceramic substrate wherein the ceramic substrate is an aluminum nitride substrate, the active metal is titanium, and the region where the active metal is concentrated is a metal plate and a part of the active metal brazing material removed. When the backscattered electron image is photographed and observed, the peak area ratio of Ti (Kα) to Al (Kα) of characteristic X-rays by energy dispersive X-ray spectroscopy of a scanning electron microscope [Ti (Kα) / Al The metal-ceramic bonding substrate according to claim 8 or 9, which is a region in which (Kα)] is 0.2 or more. The metal-ceramic bonding substrate according to any one of claims 8 to 10, wherein an area ratio of a region in which the active metal is concentrated to the bonding region is 20 to 40%.

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