JP2019062022A - Electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component device in which a decrease in joint strength is suppressed via a joint portion between an external electrode and a metal terminal. An electronic component device 100 includes an electronic component 1, metal terminals 20, 22 and joints 30, 32, and the metal terminals 20, 22 have connection portions 24, 26 and legs 25, 27, and the connecting portions 24 and 26 are provided with protrusions 24a and 26a, and the joint portions 30 and 32 are a first joining member 33 and 35 made of solder and a second joint made of resin. The first joining members 33 and 35 include the joining members 34 and 36, and the first joining members 33 and 35 have the protrusions 24a and 26a and the second joining members 34 and 36 between the protrusions 24a and 26a and the other ends 24c and 26c. It is arranged between the protrusions 24a and 26a and one ends 24b and 26b, and gaps G1 and G2 are formed between the connection portions 24 and 26 and the external electrodes 3 and 4. [Selection diagram] Fig. 2

Description

  The present invention relates to an electronic component device.

  As a conventional electronic component device, for example, the one described in Patent Document 1 is known. The electronic component device described in Patent Document 1 includes an electronic component main body in which a terminal electrode is formed on the outer surface, and a conductive terminal plate member joined so as to be electrically connected to the terminal electrode, The terminal electrode and the terminal plate member are bonded by a resin bonding material made of an electrically insulating resin and a solder bonding material made of solder.

JP, 2002-164246, A

  An object of the present invention is to provide an electronic component device in which a decrease in bonding strength via a bonding portion between an external electrode and a metal terminal is suppressed.

  An electronic component device according to one aspect of the present invention comprises at least an electronic component including an element body, an external electrode disposed in the element body, a metal terminal electrically connected to the external electrode, and A connecting portion disposed between the external electrode and the metal terminal, and joining and electrically connecting the external electrode and the metal terminal, wherein the metal terminal has a surface facing the external electrode; A leg portion extending from one end of the connection portion, and the connection portion of the metal terminal faces the external electrode between the one end and the other end opposite to the one end and protrudes from one surface to the external electrode side And the bonding portion includes a first bonding member made of solder and a second bonding member made of resin, and the first bonding member is formed between the protrusion and the other end, It is disposed between the projection and the second joint member, and the projection In between, a gap is formed between the connection portion and the external electrode.

  In the electronic component device according to one aspect of the present invention, the bonding portion includes a first bonding member made of resin and a second bonding member made of solder. Thus, for example, even when the bonding strength of the second bonding member made of solder is insufficient, the first bonding member can compensate for the strength. Therefore, in the electronic component device, bonding strength can be secured.

  In the electronic component device, the protrusion is provided at the connection portion of the metal terminal. The first joint member is disposed between the projection and the second joint member between the projection and the other end of the connection portion. In this configuration, since the distance between the protrusion and the external electrode is narrow, the protrusion can suppress the solder from flowing out from between the metal terminal and the external electrode when the first bonding member is formed. Therefore, the first bonding member is formed reliably. As a result, in the electronic component device, the decrease in bonding strength can be suppressed.

  In the electronic component, when deflection occurs in the electronic component, stress tends to be concentrated at the edge of the external electrode. Therefore, a crack in the element may occur from the edge of the external electrode. In the electronic component device, the first bonding member is disposed between the protrusion and the second bonding member between the protrusion and the other end of the connection portion. That is, the first bonding member made of solder is disposed at a position away from the edge of the external electrode located on the other end side of the connection portion. A second bonding member is disposed near the edge of the external electrode. The second bonding member made of resin has flexibility. Therefore, the stress (stress) given from the circuit board or the like through the metal terminal can be relieved by the second bonding member. This can suppress concentration of stress on the edge of the external electrode. Therefore, the occurrence of cracks in the element can be suppressed.

  In the electronic component device, a gap is formed between the connection portion and the external electrode between the protrusion and one end of the connection portion. In this configuration, the junction is not disposed in the vicinity of the edge of the external electrode located at one end side of the connection. Therefore, it is possible to suppress concentration of stress applied from the circuit board or the like through the metal terminal to the edge of the external electrode. Therefore, the occurrence of cracks in the element can be suppressed.

  In one embodiment, the element body has a pair of end surfaces facing each other, a pair of main surfaces facing each other, and a pair of side surfaces facing each other, and the external electrodes are a pair The second bonding member may be disposed across the end surface and one of the main surfaces located on the other end side of the connection portion. In this configuration, since the second bonding member is disposed on the end surface and the main surface, bonding strength can be further secured. The second bonding member is disposed in the vicinity of the edge of the external electrode located on the other end side of the connection portion. Therefore, the stress applied from the circuit board or the like through the metal terminal can be relieved by the second bonding member. Thereby, in the electronic component device, concentration of stress on the edge of the external electrode can be suppressed. Therefore, in the electronic component device, the occurrence of cracks in the element can be suppressed.

  In one embodiment, the electronic component includes a plurality of inner electrodes, and the plurality of inner electrodes are electrically connected to a first inner electrode electrically connected to one of the outer electrodes and to the other outer electrode. A second internal electrode and a plurality of third internal electrodes electrically connected by the connection conductor, and the first internal electrode and the third internal electrode disposed on one principal surface side in the element body The first capacitance portion may be configured, and the second capacitance portion may be configured by the second internal electrode and the third internal electrode disposed on the other main surface side in the body. The plurality of third inner electrodes are electrically connected by the connection conductor. Thereby, the first capacitance portion and the second capacitance portion are electrically connected in series. Therefore, for example, when a failure occurs in one of the capacitive portions, the capacitance and the resistance change. Therefore, in the electronic component device, even if a defect occurs in the electronic component after mounting, the defect can be detected.

  Further, in the electronic component of the electronic component device, the first capacitance portion is configured in the region on one main surface side, and the second capacitance portion is configured in the region on the other main surface side. Therefore, in the electronic component, even if a crack occurs in the element from both sides of the first external electrode and the second external electrode, for example, the second internal electrode disposed on the other side can be damaged. However, breakage of the first inner electrode disposed on one side can be avoided. Therefore, in the electronic component, it is possible to protect the first capacitor. Thus, in the electronic component device, even if a crack occurs in the element of the electronic component, it is possible to protect a part of the capacitive portion.

  In one embodiment, one main surface may be located on the other end side of the connection portion, and the gap may be formed at a position corresponding to the end surface of the element body from which the second internal electrode is drawn. In this configuration, the junction is not located at the position where the second internal electrode is pulled out. That is, the bonding portion is not disposed in the vicinity of the edge of the external electrode located on the other main surface side. Therefore, it is possible to suppress concentration of stress applied from the circuit board or the like through the metal terminal to the edge of the external electrode. Therefore, damage to the second internal electrode due to a crack can be suppressed. Therefore, at least the second capacity portion can be protected. Thus, in the electronic component device, even if a crack occurs in the element of the electronic component, it is possible to protect a part of the capacitive portion.

  In one embodiment, the electronic component includes a plurality of inner electrodes, and the plurality of inner electrodes are electrically connected to a first inner electrode electrically connected to one of the outer electrodes and to the other outer electrode. And the plurality of third internal electrodes electrically connected by the connection conductor, wherein the first internal electrode and the second internal electrode are disposed at the same position in the opposing direction of the pair of main surfaces The third inner electrode may be disposed to face each of the first inner electrode and the second inner electrode. In this configuration, the plurality of third inner electrodes are electrically connected by the connection conductor. Thereby, the first capacitance portion and the second capacitance portion are electrically connected in series. Therefore, for example, when a failure occurs in one of the capacitive portions, the capacitance and the resistance change. Therefore, in the electronic component device, even if a defect occurs in the electronic component after mounting, the defect can be detected.

  Further, in the electronic component device of the electronic component device, the first capacitance portion is configured in the area on one end face side, and the second capacitance portion is configured in the area on the other end face side. Therefore, in the electronic component, even if the element body bends and cracks occur in the element body, for example, the second internal electrode disposed on the other end face side may be damaged, but one end face side It is possible to avoid the breakage of the first internal electrode arranged in Therefore, in the electronic component, it is possible to protect the first capacitor. Thus, in the electronic component device, even if a crack occurs in the element of the electronic component, it is possible to protect a part of the capacitive portion.

  According to one aspect of the present invention, a decrease in bonding strength via the bonding portion between the external electrode and the metal terminal is suppressed.

FIG. 1 is a perspective view showing the electronic component device according to the first embodiment. FIG. 2 is a view showing a cross-sectional configuration of the electronic component device shown in FIG. FIG. 3 is an exploded perspective view of an element body in the multilayer capacitor of the electronic component device shown in FIG. FIG. 4 is an equivalent circuit diagram of the multilayer capacitor shown in FIG. FIG. 5 is a view showing a cross-sectional configuration of the electronic component device according to the second embodiment. 6 is an exploded perspective view of an element body in the multilayer capacitor of the electronic component device shown in FIG. FIG. 7 is an equivalent circuit diagram of the multilayer capacitor shown in FIG. FIG. 8 is a view showing a cross-sectional configuration of an electronic component device according to a modification. FIG. 9 is a view showing a cross-sectional configuration of an electronic component device according to a modification.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements will be denoted by the same reference symbols, without redundant description.
First Embodiment
As shown in FIG. 1 or 2, the electronic component device 100 according to the first embodiment includes the multilayer capacitor (electronic component) 1, metal terminals 20 and 22, and bonding portions 30 and 32. .

  As shown in FIGS. 1 and 2, the multilayer capacitor 1 includes an element body 2 and a first external electrode 3 disposed on the outer surface of the element body 2, a second external electrode 4, a first connection conductor 5, and a first And 2 connection conductors 6.

  The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes the shape of a rectangular parallelepiped whose corners and ridges are chamfered, and the shape of a rectangular parallelepiped whose corners and ridges are rounded. The element body 2 has, as its outer surface, a pair of end surfaces 2a and 2b facing each other, a pair of main surfaces 2c and 2d facing each other, and a pair of side surfaces 2e and 2f facing each other, have. The opposing direction in which the pair of main surfaces 2c and 2d are opposed is the first direction D1. The opposing direction in which the pair of end surfaces 2a and 2b is opposed is the second direction D2. The opposing direction in which the pair of side surfaces 2e and 2f are opposed is the third direction D3. In the present embodiment, the first direction D1 is the height direction of the element body 2. The second direction D2 is the longitudinal direction of the element body 2 and is orthogonal to the first direction D1. The third direction D3 is the width direction of the element body 2, and is orthogonal to the first direction D1 and the second direction D2.

  The pair of end surfaces 2a and 2b extend in the first direction D1 so as to connect the pair of main surfaces 2c and 2d. The pair of end surfaces 2a and 2b also extend in the third direction D3 (the short side direction of the pair of main surfaces 2c and 2d). The pair of side surfaces 2e and 2f extend in the first direction D1 so as to connect the pair of main surfaces 2c and 2d. The pair of side surfaces 2e and 2f also extend in the second direction D2 (the long side direction of the pair of end surfaces 2a and 2b). In the present embodiment, the main surface 2d is defined as a mounting surface facing the other electronic device when the multilayer capacitor 1 is mounted on the other electronic device (for example, a circuit board or an electronic component).

The element body 2 is configured by laminating a plurality of dielectric layers (insulator layers) 10 in the direction in which the pair of main surfaces 2c and 2d are opposed. In the element body 2, the stacking direction of the plurality of dielectric layers 10 (hereinafter simply referred to as "stacking direction") coincides with the first direction D1. Each dielectric layer 10 is a sintered body of a ceramic green sheet containing, for example, a dielectric material (a dielectric ceramic such as BaTiO ₃ , Ba (Ti, Zr) O ₃ , or (Ba, Ca) TiO ₃ ). It consists of In the actual element body 2, each dielectric layer 10 is integrated to such an extent that the boundary between each dielectric layer 10 can not be visually recognized.

  As shown in FIG. 2, the multilayer capacitor 1 has a plurality of first internal electrodes 12, a plurality of first dummy electrodes 13, and a plurality of second internal electrodes as internal conductors disposed in the element body 2. A plurality of second dummy electrodes 15 and a plurality of third inner electrodes 16 are provided. In the present embodiment, the number (here, three) of the plurality of first inner electrodes 12 is the same as the number of the plurality of second inner electrodes 14.

  The plurality of first internal electrodes 12, the plurality of first dummy electrodes 13, the plurality of second internal electrodes 14, the plurality of second dummy electrodes 15, and the plurality of third internal electrodes 16 are used as internal electrodes of the stacked electrical element. It consists of a conductive material (for example, Ni or Cu etc.) usually used. The plurality of first internal electrodes 12, the plurality of first dummy electrodes 13, the plurality of second internal electrodes 14, the plurality of second dummy electrodes 15, and the plurality of third internal electrodes 16 are conductive pastes including the above-described conductive material. It is configured as a sintered body of

  The first inner electrode 12, the second inner electrode 14, and the third inner electrode 16 are disposed at different positions (layers) in the first direction D1 of the element body 2. The first internal electrodes 12 and the third internal electrodes 16 are alternately arranged in the element body 2 so as to face each other with a gap in the first direction D1. The second inner electrodes 14 and the third inner electrodes 16 are alternately arranged in the element body 2 so as to face each other with a gap in the first direction D1. The first internal electrode 12 and the first dummy electrode 13 are disposed at the same position (layer) in the element body 2. The second inner electrode 14 and the second dummy electrode 15 are disposed at the same position (layer) in the element body 2.

  As shown in FIG. 2, the plurality of first inner electrodes 12 are disposed in a region on one main surface 2 c side in the first direction D1 of the element body 2. In the present embodiment, the plurality of first inner electrodes 12 are disposed in a region closer to the one main surface 2c than the central portion of the element body 2 in the first direction D1.

  As shown in FIG. 3, each first inner electrode 12 has a rectangular shape in which the second direction D2 is a long side direction and the third direction D3 is a short side direction. One end in the longitudinal direction of the first inner electrode 12 is exposed to one end face 2 a. The other end of the first internal electrode 12 in the longitudinal direction is located closer to the one end face 2 a than the other end face 2 b and is separated from the other end face 2 b. The first inner electrode 12 is not exposed to the other end face 2 b, the pair of main faces 2 c and 2 d, and the pair of side faces 2 e and 2 f. The end of the first inner electrode 12 exposed to one end face 2 a is electrically connected to the first outer electrode 3.

  Each first dummy electrode 13 has a rectangular shape in which the second direction D2 is a lateral direction and the third direction D3 is a longitudinal direction. One end in the short side direction of the first dummy electrode 13 is exposed to the other end face 2 b. The other end in the short side direction of the first dummy electrode 13 is located closer to the other end face 2 b than the one end face 2 a, and is separated from the one end face 2 a. The first inner electrode 12 and the first dummy electrode 13 are arranged at predetermined intervals in the second direction D2 (electrically insulated). An end of the first dummy electrode 13 exposed to the other end face 2 b is electrically connected to the second external electrode 4.

  As shown in FIG. 2, the plurality of second inner electrodes 14 are disposed in a region on the other main surface 2 d side in the first direction D1 of the element body 2. In the present embodiment, the plurality of second inner electrodes 14 are disposed in a region closer to the other main surface 2 d than the central portion of the element body 2 in the first direction D1.

  As shown in FIG. 3, each second internal electrode 14 has a rectangular shape in which the second direction D2 is a long side direction and the third direction D3 is a short side direction. One end of the second inner electrode 14 is exposed to the other end face 2 b. The other end of the second internal electrode 14 in the longitudinal direction is located closer to the other end surface 2 b than the one end surface 2 a, and is separated from the one end surface 2 a. The second inner electrode 14 is not exposed to the one end face 2a, the pair of main surfaces 2c and 2d, and the pair of side surfaces 2e and 2f. The end of the second inner electrode 14 exposed to the other end face 2 b is electrically connected to the second outer electrode 4.

  Each second dummy electrode 15 has a rectangular shape in which the second direction D2 is a lateral direction and the third direction D3 is a longitudinal direction. One end in the short side direction of the second dummy electrode 15 is exposed at one end face 2 a. The other end in the short direction of the second dummy electrode 15 is located closer to the one end face 2 a than the other end face 2 b and is separated from the other end face 2 b. The second inner electrode 14 and the second dummy electrode 15 are disposed at a predetermined distance in the second direction D2. An end of the second dummy electrode 15 exposed at one end face 2 a is electrically connected to the first external electrode 3.

  Each third inner electrode 16 includes a main electrode portion 16a and connection portions 16b and 16c. The main electrode portion 16a is opposed to the first internal electrode 12 or the second internal electrode 14 via a part (dielectric layer 10) of the element body 2 in the first direction D1. The main electrode portion 16a has a rectangular shape in which the second direction D2 is a long side direction and the third direction D3 is a short side direction. The connection portion 16 b extends from one side (one long side) of the main electrode portion 16 a and is exposed to one side surface 2 e. The connection portion 16c extends from one side (the other long side) of the main electrode portion 16a and is exposed to the other side surface 2f. The third inner electrode 16 is exposed to the pair of side surfaces 2e and 2f, and is not exposed to the pair of end surfaces 2a and 2b and the pair of main surfaces 2c and 2d. The main electrode portion 16a and the connection portions 16b and 16c are integrally formed.

  As shown in FIG. 1, the first external electrode 3 is disposed on one end face 2 a side. The first external electrode 3 is disposed on the electrode portion 3a disposed on the end face 2a, the electrode portions 3b and 3c disposed on the pair of main surfaces 2c and 2d, and the pair of side surfaces 2e and 2f, respectively. And electrode portions 3d and 3e. The electrode portion 3a and the electrode portions 3b, 3c, 3d and 3e are connected at the ridge line portion of the element body 2 and are electrically connected to each other. The first external electrode 3 is formed on five faces of one end face 2a, a pair of main faces 2c and 2d, and a pair of side faces 2e and 2f. The electrode portion 3 a is disposed so as to cover all the portion exposed to the end face 2 a of the first inner electrode 12, and the first inner electrode 12 is directly connected to the first outer electrode 3.

  The second external electrode 4 is disposed on the other end face 2 b side. The second external electrode 4 is disposed on the electrode portion 4a disposed on the end face 2b, the electrode portions 4b and 4c disposed on the pair of main surfaces 2c and 2d, and the pair of side surfaces 2e and 2f, respectively. And the electrode portions 4d and 4e. The electrode portion 4a and the electrode portions 4b, 4c, 4d and 4e are connected at the ridge line portion of the element body 2 and electrically connected to each other. The second external electrode 4 is formed on five faces of one end face 2 b, a pair of main faces 2 c and 2 d, and a pair of side faces 2 e and 2 f. The electrode portion 4 a is disposed so as to cover the entire portion exposed to the end face 2 b of the second inner electrode 14, and the second inner electrode 14 is directly connected to the second outer electrode 4.

  The first connection conductor 5 is disposed at a central portion in the second direction D2 on one side face 2e side. The first connection conductor 5 has an electrode portion 5a disposed on the side surface 2e, and electrode portions 5b and 5c disposed on the pair of main surfaces 2c and 2d, respectively. The electrode portion 5a, the electrode portion 5b and the electrode portion 5c are connected at the ridge portion of the element body 2 and are electrically connected to each other. The first connection conductor 5 is formed on three surfaces of the pair of main surfaces 2c and 2d and one side surface 2e.

  The electrode portion 5 a is disposed so as to cover all the portion exposed to the side surface 2 e of the connection portion 16 b of the third inner electrode 16, and the connection portion 16 b is directly connected to the first connection conductor 5. That is, the connection portion 16 b connects the main electrode portion 16 a and the electrode portion 5 a. Thereby, each third inner electrode 16 is electrically connected to the first connection conductor 5.

  The second connection conductor 6 is disposed at the central portion in the second direction D2 on the other side surface 2f side. The second connection conductor 6 includes an electrode portion 6a disposed on the side surface 2f, and electrode portions 6b and 6c disposed on the pair of main surfaces 2c and 2d, respectively. The electrode portion 6a, the electrode portion 6b and the electrode portion 6c are connected at the ridge portion of the element body 2 and electrically connected to each other. The second connection conductor 6 is formed on three surfaces of the pair of main surfaces 2c and 2d and one side surface 2f.

  The electrode portion 6 a is disposed so as to cover all the part exposed to the side surface 2 e of the connection portion 16 c of the third inner electrode 16, and the connection portion 16 c is directly connected to the second connection conductor 6. That is, the connection portion 16c connects the main electrode portion 16a and the electrode portion 6a. Thereby, each third inner electrode 16 is electrically connected to the second connection conductor 6.

  As shown in FIG. 4, the multilayer capacitor 1 includes a first capacitance portion C1 and a second capacitance portion C2. The first capacitance portion C1 is configured by the first inner electrodes 12 and the third inner electrodes 16 alternately arranged to face each other at an interval in the first direction D1 in the element body 2. In the present embodiment, the first capacitance portion C1 is configured in a region closer to the one main surface 2c than the central portion of the element body 2 in the first direction D1. The first capacitance portion C1 constitutes a first capacitor component.

  The second capacitance portion C2 is configured by the second inner electrodes 14 and the third inner electrodes 16 which are alternately arranged to face each other at an interval in the first direction D1 in the element body 2. In the present embodiment, the second capacitance portion C2 is configured in a region on the other main surface 2d side than the central portion of the element body 2 in the first direction D1. The second capacitance portion C2 constitutes a second capacitor component.

  In the multilayer capacitor 1, the plurality of first capacitance portions C1 are electrically connected in parallel, and the plurality of second capacitance portions C2 are electrically connected in parallel. In the multilayer capacitor 1, the first capacity portion C1 and the second capacity portion C2 are electrically connected in series. Specifically, the first capacitance portion C1 and the second capacitance portion C2 are electrically connected in series by the plurality of third inner electrodes 16 electrically connected by the first connection conductor 5 and the second connection conductor 6. It is connected to the. Note that the numbers of the first capacitance portion C1 and the second capacitance portion C2 shown in FIG. 4 do not necessarily coincide with the numbers of the first inner electrode 12, the second inner electrode 14 and the third inner electrode 16 shown in FIG. .

  As shown in FIGS. 1 and 2, the metal terminals 20 and 22 are electrically connected to the first external electrode 3 and the second external electrode 4, respectively. The metal terminal 20 is disposed to face the end face 2a of the multilayer capacitor 1 (element body 2). The metal terminal 20 is electrically connected to the first external electrode 3. The metal terminal 20 is electrically connected to the first inner electrode 12 via the first outer electrode 3. The metal terminal 20 has an L shape.

  The metal terminal 20 includes a connection portion 24 and a leg portion 25. The connection portion 24 and the leg portion 25 are plate members. The connection portion 24 and the leg portion 25 are integrally formed. The connection portion 24 has a surface 24 s facing the first external electrode 3 (the end surface 2 a of the element body 2). An electrode portion 3 a disposed on the end face 2 a of the first external electrode 3 is electrically connected to the connection portion 24. The connection portion 24 extends in the first direction D1, and has a rectangular shape when viewed from the second direction D2.

  The connection portion 24 is provided with a protrusion 24 a. The protrusion 24 a is disposed at a position facing the first external electrode 3 between the one end 24 b and the other end 24 c of the connection portion 24. The protrusion 24 a protrudes from the connection portion 24 toward the first external electrode 3 (laminated capacitor 1). The protrusion 24 a is provided on the main surface 2 d side of the element body 2 of the multilayer capacitor 1 in the first direction D 1. In the present embodiment, the protrusion 24 a is formed by bending a part of the connection portion 24. In addition, the projection part 24a may be comprised by arranging another member in the connection part 24. FIG.

  The leg portion 25 extends in the second direction D2 from one end (lower end) 24b of the connection portion 24, and has a rectangular shape when viewed from the first direction D1. The connection portion 24 and the leg portion 25 extend in directions intersecting with each other (in the present embodiment, directions orthogonal to each other). The legs 25 are connected to other electronic devices (for example, a circuit board or an electronic component).

  The metal terminal 22 is disposed to face the end face 2b of the multilayer capacitor 1 (element body 2). The metal terminal 22 is electrically connected to the second external electrode 4. The metal terminal 22 is electrically connected to the second inner electrode 14 via the second outer electrode 4. The metal terminal 22 has an L shape.

  The metal terminal 22 includes a connection portion 26 and a leg portion 27. The connection portion 26 and the leg portion 27 are plate members. The connection portion 26 and the leg portion 27 are integrally formed. The connection portion 26 has a surface 26 s facing the second external electrode 4 (the end surface 2 b of the element body 2). An electrode portion disposed on the end face 2 b of the second external electrode 4 is electrically connected to the connection portion 26. The connection portion 26 extends in the first direction D1, and has a rectangular shape when viewed from the second direction D2.

  The connecting portion 26 is provided with a protrusion 26 a. The protrusion 26 a is disposed at a position facing the second external electrode 4. The protrusion 26 a protrudes from the connection portion 26 toward the second external electrode 4 (laminated capacitor 1). The protrusion 26 a is provided on the main surface 2 d side of the element body 2 of the multilayer capacitor 1 in the first direction D 1. In the present embodiment, the protrusion 26 a is formed by bending a part of the connection portion 26. The protrusion 26 a may be configured by disposing another member in the connection portion 26.

  The leg portion 27 extends in the second direction D2 from the one end 26b of the connection portion 26, and has a rectangular shape when viewed from the first direction D1. The connection portion 26 and the leg portion 27 extend in directions intersecting with each other (in the present embodiment, directions orthogonal to each other). The legs 27 are connected to other electronic devices (for example, a circuit board or an electronic component).

  The bonding portion 30 bonds the first external electrode 3 and the metal terminal 20. In the present embodiment, the electrode portion 3 a of the first external electrode 3 and the connection portion 24 of the metal terminal 20 are bonded by the bonding portion 30. The bonding portion 30 electrically connects the first external electrode 3 and the metal terminal 20.

  The bonding portion 30 includes a first bonding member 33 and a second bonding member 34. The first bonding member 33 is made of solder. As the solder, for example, lead-free solder containing tin as a main component is used.

  The first bonding member 33 is disposed between the protrusion 24 a and the second bonding member 34 between the protrusion 24 a of the connection portion 24 and the other end 24 c of the connection portion 24. That is, the first bonding member 33 is disposed below the second bonding member 34 and above the protrusion 24 a in the first direction D1. The first bonding member 33 has a predetermined width in the first direction D1 and extends along the third direction D3.

  The second bonding member 34 is made of, for example, an insulating resin. The second bonding member 34 is formed of a resin adhesive. The resin is, for example, a thermosetting resin. As a thermosetting resin, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin etc. are used, for example.

  The second bonding member 34 is disposed above the first bonding member 33 in the first direction D1. The second bonding member 34 is disposed at a position where the internal electrode is drawn out (a position exposed to the end face 2 a of the element body 2). In the present embodiment, the second bonding member 34 is disposed at a position where the first inner electrode 12 is pulled out.

  The second bonding member 34 is disposed on the electrode portion 3 a and the electrode portion 3 b of the first external electrode 3. The second bonding member 34 is disposed continuously over the electrode portion 3 a and the electrode portion 3 b of the first external electrode 3. As shown in FIG. 1, the second bonding member 34 is disposed at the central portion in the third direction D3 in the electrode portion 3 b. That is, the second bonding members 34 are not disposed on both end sides in the third direction D3 in the electrode portion 3b.

  In the electronic component device 100, a gap G1 is formed between the connection portion 24 and the first external electrode 3 between the protrusion 24a of the connection portion 24 and the one end 24b of the connection portion 24. That is, the joint portion 30 is not disposed between the connection portion 24 and the first external electrode 3 between the protrusion 24 a of the connection portion 24 and the one end 24 b of the connection portion 24. The width of the gap G1 is appropriately set in accordance with the width (thickness) of the bonding portion 30.

  The bonding portion 32 bonds the second external electrode 4 and the metal terminal 22. In the present embodiment, the electrode portion 4 a of the second external electrode 4 and the connection portion 26 of the metal terminal 22 are bonded by the bonding portion 32. The bonding portion 32 electrically connects the second external electrode 4 and the metal terminal 22. The bonding portion 32 includes a first bonding member 35 and a second bonding member 36. The first bonding member 35 is made of solder. The second bonding member 36 is made of, for example, an insulating resin.

  The first bonding member 35 is disposed between the protrusion 26 a and the second bonding member 36 between the protrusion 26 a of the connection portion 26 and the other end 26 c of the connection 26. That is, the first bonding member 35 is disposed below the second bonding member 36 and above the protrusion 26 a in the first direction D1. The first bonding member 35 has a predetermined width in the first direction D1 and extends along the third direction D3.

  The second bonding member 36 is disposed above the first bonding member 35 in the first direction D1. The second bonding member 36 is disposed at a position where the internal electrode is drawn out (a position exposed to the end face 2 a of the element body 2). In the present embodiment, the second bonding member 36 is disposed at a position where the first inner electrode 12 is pulled out.

  The second bonding member 36 is disposed on the electrode portion 3 a and the electrode portion 3 b of the first external electrode 3. The second bonding member 36 is disposed continuously over the electrode portion 3 a and the electrode portion 3 b of the first outer electrode 3. As shown in FIG. 1, the second bonding member 36 is disposed at the central portion in the third direction D3 in the electrode portion 3 b. That is, the second bonding members 36 are not disposed on both end sides in the third direction D3 in the electrode portion 3b.

  In the electronic component device 100, a gap G2 is formed between the connection portion 26 and the second external electrode 4 between the protrusion 26a of the connection portion 26 and the one end 26b of the connection portion 26. That is, the joint portion 32 is not disposed between the connection portion 26 and the second external electrode 4 between the protrusion 26 a of the connection portion 26 and the one end 26 b of the connection portion 26. The width of the gap G2 is appropriately set according to the width (thickness) of the bonding portion 32.

  As described above, in the electronic component device 100 according to the present embodiment, the bonding portions 30, 32 include the first bonding members 33, 35 made of resin, and the second bonding members 34, 36 made of solder. It is. As a result, for example, even when the bonding strength of the second bonding members 34 and 36 made of solder is insufficient, the strength can be compensated by the first bonding members 33 and 35. Therefore, in the electronic component device 100, bonding strength can be secured.

  In the electronic component device 100 according to the present embodiment, the connection portions 24 and 26 of the metal terminals 20 and 22 are provided with protrusions 24 a and 26 a. The first bonding members 33 and 35 are disposed between the protrusions 24 a and 26 a and the second bonding members 34 and 36 between the protrusions 24 a and 26 a and the other ends 24 c and 26 c of the connection portions 24 and 26. ing. In this configuration, since the distance between the protrusion 24a (26a) and the first external electrode 3 (second external electrode 4) is narrow, the solder is metal when forming the first bonding member 33 (35). The protrusion 24a (26a) can suppress the flow out from between the terminal 20 (22) and the first external electrode 3 (the second external electrode 4). Therefore, the first bonding members 33 and 35 are formed reliably. As a result, in the electronic component device 100, a decrease in bonding strength can be suppressed.

  In the multilayer capacitor 1, when bending occurs in the multilayer capacitor 1, stress tends to be concentrated at the edges of the first outer electrode 3 and the second outer electrode 4. Therefore, the cracks in the element body 2 can be generated starting from the edges of the first external electrode 3 and the second external electrode 4. In the electronic component device 100, the first bonding member 33 (35) is a portion between the protrusion 24a (26a) and the second portion 24c (26c) between the protrusion 24a (26a) and the other end 24c (26c) of the connection portion 24 (26). It is disposed between the joining member 34 (36). That is, the first bonding member 33 (35) made of solder is the edge (electrode portion 3b) of the first external electrode 3 (second external electrode 49) located on the other end 24c (26c) side of the connection portion 24 (26). It is arranged at a position away from (4b). A second bonding member 34 (36) is disposed in the vicinity of the edge of the first external electrode 3 (second external electrode 4). The second bonding member 34 (36) made of resin has flexibility. Therefore, in the electronic component device 100, the stress applied from the circuit board or the like through the metal terminal 20 (22) can be relaxed by the second bonding member 34 (36). Thereby, it is possible to suppress concentration of stress on the edge of the first external electrode 3 (second external electrode 4). Therefore, in the electronic component device 100, the occurrence of cracks in the element body 2 can be suppressed.

  In the electronic component device 100 according to the present embodiment, the connecting portion 24 (26) and the first external electrode 3 (second electrode) are disposed between the protrusion 24a (26a) and the one end 24b (26b) of the connecting portion 24 (26). A gap G1 (G2) is formed between the external electrode 4). In this configuration, the bonding portion 30 (32) is not disposed in the vicinity of the edge of the first external electrode 3 (second external electrode 4) located on the end 24b (26b) side of the connection portion 24 (26). Therefore, in the electronic component device 100, it is possible to suppress concentration of stress applied from a circuit board or the like through the metal terminal 20 (22) to the edge of the first external electrode 3 (second external electrode 44). Therefore, in the electronic component device 100, the occurrence of cracks in the element body 2 can be suppressed.

  In the electronic component device 100 according to the present embodiment, the second bonding member 34 (36) has one end surface 2a (2b) and one main surface 2c located on the other end 24c (26c) side of the connection portion 24 (26). And are arranged across. In this configuration, since the second bonding member 34 (36) is disposed on the end face 2a (2b) and the main surface 2c, bonding strength can be further secured. The second bonding member 34 (36) is disposed in the vicinity of the edge of the first external electrode 3 (second external electrode 4) located on the other end 24c (26c) side of the connection portion 24 (26). Therefore, the stress applied from the circuit board or the like through the metal terminal 20 (22) can be relaxed by the second bonding member 34 (36). Thereby, in the electronic component device 100, concentration of stress on the edge of the first external electrode 3 (second external electrode 4) can be suppressed. Therefore, in the electronic component device 100, the occurrence of cracks in the element body 2 can be suppressed.

  In the multilayer capacitor 1 of the electronic component device 100 according to the present embodiment, the first capacitance portion C1 is configured by the first internal electrode 12 and the third internal electrode 16, and the second internal electrode 14 and the third internal electrode 16 And the second capacitance portion C2 is configured. In the multilayer capacitor 1, the plurality of third inner electrodes 16 are electrically connected by the first connection conductor 5 and the second connection conductor 6. Thereby, the first capacitive portion C1 and the second capacitive portion C2 are electrically connected in series. Therefore, for example, when a failure occurs in one of the capacitive portions, the capacitance and the resistance change. Therefore, in the electronic component device 100, even if a failure occurs in the multilayer capacitor 1 after mounting, the failure can be detected.

  In the multilayer capacitor 1 of the electronic component device 100 according to the present embodiment, the first inner electrode 12 is disposed on the one main surface 2 c side in the element body 2, and the second inner electrode 14 is in the element body 2. The third inner electrode 16 is disposed to face each of the first inner electrode 12 and the second inner electrode 14. In this configuration, the first capacitance portion C1 is formed in the region on one main surface 2c side, and the second capacitance portion C2 is formed in the region on the other main surface 2d side. Therefore, in the multilayer capacitor 1, even if cracks occur in the element body 2 from both sides of the first external electrode 3 and the second external electrode 4, for example, the first internal electrode 12 may be broken, but 2. Damage to the internal electrode 14 can be avoided. Therefore, the multilayer capacitor 1 can protect the second capacitance portion C2. As described above, in the multilayer capacitor 1, even if the element body 2 is cracked, a part of the capacity portion can be protected.

  In the electronic component device 100 according to the present embodiment, one main surface 2c of the element body 2 of the multilayer capacitor 1 is located on the other end 24c, 26c side of the connection portions 24, 26 of the metal terminals 20, 22. The gaps G1 and G2 are formed at positions corresponding to the end face 2b of the element body 2 from which the second internal electrode 14 is drawn. In this configuration, the bonding portions 30 and 32 are not arranged at the position where the second inner electrode 14 is pulled out. That is, the bonding portions 30 and 32 are not disposed in the vicinity of the edges of the first external electrode 3 and the second external electrode 4 located on the other main surface 2 d side. Therefore, it is possible to suppress concentration of stress applied from the circuit board or the like through the metal terminals 20 and 22 to the respective edges of the first external electrode 3 and the second external electrode 4. Therefore, damage to the second internal electrode 14 due to a crack can be suppressed. Therefore, at least the second capacity portion C2 can be protected. As described above, in the electronic component device 100, even if a crack occurs in the element body 2 of the multilayer capacitor 1, it is possible to protect a part of the capacitance portion.

In the above embodiment, the plurality of first internal electrodes 12 are disposed in the area on the main surface 2c side, and the plurality of second internal electrodes 14 are disposed in the area on the main surface 2d side. . That is, an example in which the first capacitance portion C1 is configured in the region on the main surface 2c side and the second capacitance portion C2 is configured in the region on the main surface 2c side has been described as an example. However, the plurality of first inner electrodes 12 may be disposed in the region on the main surface 2 d side, and the plurality of second inner electrodes 14 may be disposed in the region on the main surface 2 c side.
Second Embodiment
As shown in FIG. 5, the electronic component device 110 according to the second embodiment includes the multilayer capacitor 1 </ b> A, the metal terminals 20 and 22, and the bonding portions 30 and 32. The metal terminals 20 and 22 and the bonding portions 30 and 32 have the same configuration as that of the first embodiment.

  The multilayer capacitor 1A includes an element body 2 and a first external electrode 3 disposed on an outer surface of the element body 2, a second external electrode 4, a first connection conductor 5 (see FIG. 1), and a second connection conductor 6. Is equipped.

  The multilayer capacitor 1A includes a plurality of first inner electrodes 12A, a plurality of second inner electrodes 14A, and a plurality of third inner electrodes 16 as inner conductors disposed in the element body 2. In the present embodiment, the number of the plurality of first inner electrodes 12 (here, six) is the same as the number of the plurality of second inner electrodes 14.

  The first inner electrode 12A and the second inner electrode 14A are disposed at the same position (layer) in the first direction D1 of the element body 2. The first inner electrode 12A, the second inner electrode 14A, and the third inner electrode 16 are alternately arranged in the element body 2 so as to face each other with a gap in the first direction D1.

  The plurality of first inner electrodes 12A are arranged in a region on one end face 2a side in the second direction D2 of the element body 2. In the present embodiment, the plurality of first inner electrodes 12A are disposed in a region closer to one end face 2a than the central portion of the element body 2 in the second direction D2.

  As shown in FIG. 6, one end of the first inner electrode 12A is exposed to one end face 2a. The other end of the first inner electrode 12 is spaced apart from the other end of the second inner electrode 14A by a predetermined distance. The first inner electrode 12 is not exposed to the other end face 2 b, the pair of main faces 2 c and 2 d, and the pair of side faces 2 e and 2 f. The end of the first inner electrode 12 exposed to one end face 2 a is electrically connected to the first outer electrode 3.

  The plurality of second inner electrodes 14A are disposed in a region on the other end face 2b side in the second direction D2 of the element body 2. In the present embodiment, the plurality of second inner electrodes 14A are disposed in a region closer to the other end face 2b than the central portion of the element body 2 in the second direction D2. In the present embodiment, the second inner electrode 14A exhibits the same shape as the first inner electrode 12A and has the same dimensions.

  One end of the second inner electrode 14A is exposed to the other end face 2b. The other end of the second inner electrode 14A is separated from the other end of the first inner electrode 12A by a predetermined distance. The second inner electrode 14A is not exposed to the one end face 2a, the pair of main surfaces 2c and 2d, and the pair of side surfaces 2e and 2f. The end of the second inner electrode 14 exposed to the other end face 2 b is electrically connected to the second outer electrode 4.

  Each third inner electrode 16 includes a main electrode portion 16a and connection portions 16b and 16c. The main electrode portion 16a is opposed to the first internal electrode 12 and the second internal electrode 14 via a part of the element body 2 (dielectric layer 10) in the first direction D1.

  As shown in FIG. 7, the multilayer capacitor 1A includes a first capacitance C11 and a second capacitance C22. The first capacitance portion C11 is configured by the first inner electrodes 12A and the third inner electrodes 16 alternately arranged to face each other with a gap in the first direction D1 in the element body 2. In the present embodiment, the first capacitance portion C11 is configured in a region closer to the one end face 2a than the central portion of the element body 2 in the second direction D2. The first capacitance portion C11 constitutes a first capacitor component.

  The second capacitance portion C22 is configured by the second inner electrodes 14A and the third inner electrodes 16 which are alternately arranged so as to face each other at an interval in the first direction D1 in the element body 2. In the present embodiment, the second capacitance portion C22 is configured in a region closer to the other end surface 2b than the central portion of the element body 2 in the second direction D2. The second capacitance portion C22 constitutes a second capacitor component.

  In the multilayer capacitor 1A, the plurality of first capacitive portions C11 are electrically connected in parallel, and the plurality of second capacitive portions C22 are electrically connected in parallel. In the multilayer capacitor 1A, the first capacitance C11 and the second capacitance C22 are electrically connected in series. Specifically, the first capacitance portion C11 and the second capacitance portion C22 are electrically connected in series by the plurality of third inner electrodes 16 electrically connected by the first connection conductor 5 and the second connection conductor 6. It is connected to the. Note that the numbers of the first capacitance portion C11 and the second capacitance portion C22 illustrated in FIG. 7 do not necessarily match the numbers of the first inner electrode 12A, the second inner electrode 14A, and the third inner electrode 16 illustrated in FIG. .

  As described above, in the electronic component device 110 according to the present embodiment, as in the electronic component device 100 according to the first embodiment, in the electronic component device 100, a decrease in bonding strength can be suppressed.

  In the multilayer capacitor 1A of the electronic component device 110 according to the present embodiment, the first capacitance portion C11 is configured in the region on one end surface 2a side, and the second capacitance portion C22 is configured in the region on the other end surface 2b side. Therefore, in the multilayer capacitor 1A, even if the element body 2 is bent and a crack is generated in the element body 2 from the main surfaces 2c and 2d side, for example, the second inner portion disposed on the other end face 2b side Although the electrode 14A can be broken, breakage of the first inner electrode 12A disposed on the side of one end face 2a can be avoided. Therefore, in the multilayer capacitor 1A, the first capacitance portion C11 can be protected. As described above, in the electronic component device 110, even when a crack is generated in the element body 2 of the multilayer capacitor 1A, a part of the capacitive portion can be protected.

  As mentioned above, although embodiment of this invention was described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  In the above embodiment, the embodiment in which the electronic component is a multilayer capacitor has been described as an example. However, the electronic component is not limited to the multilayer capacitor.

  In the above embodiment, the first internal electrode 12 (12A), the second internal electrode 14 (14A) and the third internal electrode 16 are included as the plurality of internal electrodes, and the first internal electrode 12 (12A) and the third internal electrode are included. The configuration in which the first capacitance portion C1 (C11) is configured by the second capacitance portion 16 and the second capacitance portion C2 (C22) is configured by the second inner electrode 14 (14A) and the third inner electrode 16 has been described as an example. However, in the multilayer capacitor (electronic component), one capacity portion may be configured by alternately laminating two internal electrodes.

  In the said embodiment, the form provided with the 1st connection conductor 5 and the 2nd connection conductor 6 in side 2e, 2f of the element body 2 was demonstrated to an example in the multilayer capacitors 1 and 1A. However, the connecting conductor may be arranged on another surface. Further, in the multilayer capacitor, the connecting conductor may not be disposed on the outer surface of the element body. In this case, the plurality of third inner electrodes 16 may be connected by via conductors, for example.

  In the above embodiment, an example in which the second bonding member 34 is disposed also on the electrode portion 3 b of the first external electrode 3 (the main surface 2 c of the element body 2) has been described. However, the second bonding member 34 may not be disposed on the electrode portion 3 b. Similarly, the second bonding member 36 may not be disposed on the electrode portion 4 b.

  In the said embodiment, the form which the 2nd joining member 34 and the 2nd joining member 36 consist of insulating resin was demonstrated as an example. However, the second bonding member may be a conductive resin.

  As shown in FIG. 8, a part of the first bonding member 33 may be disposed on the protrusion 24 a. In this case, the distance between the protrusion 24 a of the connection 24 and the other end 24 c of the connection 24 is the distance between the top of the protrusion 24 a and the other end 24 c. In addition, a part of the first bonding member 35 may be disposed on the protrusion 26 a.

  As shown in FIG. 9, the multilayer capacitor 1 </ b> B of the electronic component device 120 includes the element body 2 and the first external electrode 3 and the second external electrode 4 disposed on the outer surface of the element body 2. . That is, the multilayer capacitor 1B does not include the connection conductor. The multilayer capacitor 1B may include a plurality of first inner electrodes 12B and a plurality of second inner electrodes 14B as inner conductors disposed in the element body 2. The plurality of first inner electrodes 12 B are electrically connected to the first outer electrode 3. The plurality of second inner electrodes 14 B are electrically connected to the second outer electrode 4. The first inner electrodes 12B and the second inner electrodes 14B are alternately arranged in the element body 2 so as to face each other with an interval in the first direction D1.

  In the said embodiment, the 1st exterior electrode 3 demonstrated the form which has electrode part 3a-3e as an example. However, the first external electrode 3 only needs to have at least the electrode portion 3a. Similarly, the second outer electrode 4 may have at least an electrode portion 4a.

  In the above embodiment, the first inner electrode 12, 12A, the second inner electrode 14, 14A and the third inner electrode 16 are orthogonal to the side faces 2e, 2f of the element body 2 and the pair of end faces 2a, 2b are opposed The form extending along the direction has been described as an example. That is, an example in which the laminating direction of the dielectric layer 10 is the opposing direction of the pair of main surfaces 2c and 2d has been described. However, the first internal electrode, the second internal electrode, and the third internal electrode may be orthogonal to the main surfaces 2c and 2d of the element body 2 and extend along the opposing direction of the pair of end surfaces 2a and 2b. .

  1, 1A, 1B: multilayer capacitor (electronic component), 2: element body, 2a, 2b: end surface, 2c, 2d: main surface, 2e, 2f: side surface, 3: first external electrode, 4: second external electrode 20, 22: metal terminal 24, 24: connection portion 24a, 26a: projection portion 24b, 26b: one end, 24c, 26c: the other end, 24s, 26s: one surface, 30, 32: joint portion 33 , 35: first bonding member, 34, 36: second bonding member, 100, 110, 120: electronic component device, C1, C11: first capacitance portion, C2, C22: second capacitance portion, G1, G2: gap .

Claims (5)

An electronic component comprising an element body and an external electrode arranged in the element body;
A metal terminal electrically connected to the external electrode;
And a junction portion disposed between at least the external electrode and the metal terminal, and joining and electrically connecting the external electrode and the metal terminal,
The metal terminal has a connection portion having a surface facing the external electrode, and a leg portion extending from one end of the connection portion.
Between the one end and the other end opposite to the one end, the connection portion of the metal terminal is provided with a projection that faces the external electrode and protrudes from the one surface to the external electrode side. ,
The joint portion includes a first joint member made of solder and a second joint member made of resin,
The first bonding member is disposed between the protrusion and the second bonding member, between the protrusion and the other end.
An electronic component device, wherein a gap is formed between the connection portion and the external electrode between the protrusion and the one end. The element body has a pair of end surfaces facing each other, a pair of main surfaces facing each other, and a pair of side surfaces facing each other,
The external electrode is disposed on each of a pair of the end faces,
The electronic component device according to claim 1, wherein the second bonding member is disposed across the end surface and one of the main surfaces located on the other end side of the connection portion. The electronic component comprises a plurality of internal electrodes,
The plurality of internal electrodes are electrically connected by a connection conductor to a first internal electrode electrically connected to one of the external electrodes and a second internal electrode electrically connected to the other external electrode. And a plurality of third internal electrodes
A first capacitance portion is configured by the first internal electrode and the third internal electrode disposed on the one main surface side in the body.
The electronic component device according to claim 2, wherein a second capacitance portion is configured by the second internal electrode and the third internal electrode which are disposed on the other main surface side in the body. One of the main surfaces is located on the other end side of the connection portion,
The electronic component device according to claim 3, wherein the gap is formed at a position corresponding to the end face of the element body from which the second internal electrode is drawn out. The electronic component comprises a plurality of internal electrodes,
The plurality of internal electrodes are electrically connected by a connection conductor to a first internal electrode electrically connected to one of the external electrodes and a second internal electrode electrically connected to the other external electrode. And a plurality of third internal electrodes
The first internal electrode and the second internal electrode are disposed at the same position in the opposing direction of the pair of main surfaces,
The electronic component device according to claim 2, wherein the third inner electrode is disposed to face each of the first inner electrode and the second inner electrode.

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