JP2019052280A - Adhesive sheet - Google Patents
Adhesive sheet Download PDFInfo
- Publication number
- JP2019052280A JP2019052280A JP2017179264A JP2017179264A JP2019052280A JP 2019052280 A JP2019052280 A JP 2019052280A JP 2017179264 A JP2017179264 A JP 2017179264A JP 2017179264 A JP2017179264 A JP 2017179264A JP 2019052280 A JP2019052280 A JP 2019052280A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pressure
- sensitive adhesive
- styrene
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 72
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 132
- 239000011347 resin Substances 0.000 claims abstract description 132
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000000203 mixture Substances 0.000 claims abstract description 31
- -1 polypropylene Polymers 0.000 claims abstract description 26
- 239000004743 Polypropylene Substances 0.000 claims abstract description 17
- 229920001155 polypropylene Polymers 0.000 claims abstract description 17
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims abstract description 17
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229920000359 diblock copolymer Polymers 0.000 claims abstract description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 90
- 239000010410 layer Substances 0.000 claims description 38
- 150000003505 terpenes Chemical class 0.000 claims description 19
- 235000007586 terpenes Nutrition 0.000 claims description 19
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 12
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 abstract description 15
- 229920005672 polyolefin resin Polymers 0.000 abstract description 14
- 239000000463 material Substances 0.000 description 75
- 238000000034 method Methods 0.000 description 26
- 239000013032 Hydrocarbon resin Substances 0.000 description 22
- 229920006270 hydrocarbon resin Polymers 0.000 description 22
- 239000000123 paper Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 11
- 238000000576 coating method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 125000002723 alicyclic group Chemical group 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 5
- 229920006223 adhesive resin Polymers 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229930195734 saturated hydrocarbon Natural products 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000004840 adhesive resin Substances 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920001890 Novodur Polymers 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011086 glassine Substances 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229940057995 liquid paraffin Drugs 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000000077 insect repellent Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- MXXWOMGUGJBKIW-YPCIICBESA-N piperine Chemical compound C=1C=C2OCOC2=CC=1/C=C/C=C/C(=O)N1CCCCC1 MXXWOMGUGJBKIW-YPCIICBESA-N 0.000 description 1
- 229940075559 piperine Drugs 0.000 description 1
- WVWHRXVVAYXKDE-UHFFFAOYSA-N piperine Natural products O=C(C=CC=Cc1ccc2OCOc2c1)C3CCCCN3 WVWHRXVVAYXKDE-UHFFFAOYSA-N 0.000 description 1
- 235000019100 piperine Nutrition 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- MSFGZHUJTJBYFA-UHFFFAOYSA-M sodium dichloroisocyanurate Chemical compound [Na+].ClN1C(=O)[N-]C(=O)N(Cl)C1=O MSFGZHUJTJBYFA-UHFFFAOYSA-M 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、粘着シートに関する。 The present invention relates to an adhesive sheet.
従来、粘着シートは、各種部材の接合用途に広く使用されている。
粘着シートが有する粘着剤層を形成する粘着剤として、アクリル系、シリコーン系、ゴム系、ウレタン系等の様々な粘着剤が使用されている。
例えば、特許文献1には、アクリル(メタ)アクリレートと共に、所定のモノマーから構成されたアクリル系ポリマーからなる粘着剤組成物を架橋してなる粘着剤層を有する粘着シートが開示されている。特許文献1によれば、当該粘着シートは、粘着剤層の厚さを1〜20μmと薄膜化しても、高粘着力を有するとされている。
Conventionally, pressure-sensitive adhesive sheets have been widely used for joining various members.
As the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, various pressure-sensitive adhesives such as acrylic, silicone, rubber, and urethane are used.
For example, Patent Document 1 discloses a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer obtained by crosslinking a pressure-sensitive adhesive composition made of an acrylic polymer composed of a predetermined monomer together with acrylic (meth) acrylate. According to Patent Document 1, the pressure-sensitive adhesive sheet is said to have high adhesive strength even when the thickness of the pressure-sensitive adhesive layer is reduced to 1 to 20 μm.
ところで、ポリエチレンやポリプロピレン等のポリオレフィン系樹脂を含む部材は、様々な分野で使用されている。
しかしながら、ポリオレフィン系樹脂は、極性が低いため、通常の粘着シートを用いて、ポリオレフィン系樹脂部材を接着しようとしても、当該部材に対する粘着力が低く、十分に接着できない場合が多い。
特許文献1では、粘着シートの粘着力の測定は、ガラス面に対して行われているが、ポリオレフィン系樹脂を含む被着体に対する粘着力の測定は行われていない。
By the way, the member containing polyolefin resin, such as polyethylene and a polypropylene, is used in various fields.
However, since the polyolefin resin has low polarity, even if an ordinary pressure-sensitive adhesive sheet is used to adhere the polyolefin resin member, the adhesive strength to the member is low and the adhesion is often insufficient.
In patent document 1, although the measurement of the adhesive force of an adhesive sheet is performed with respect to the glass surface, the measurement of the adhesive force with respect to the to-be-adhered body containing polyolefin resin is not performed.
また、ポリオレフィン系樹脂部材の表面は、凹凸や表面処理等が施され、粗面となっており、接着を阻害する要因ともなる。このような粗面に対しても、優れた粘着力を発現し得る粘着シートが求められている。 In addition, the surface of the polyolefin resin member is roughened and roughened by surface treatment or the like, which becomes a factor that hinders adhesion. There is a demand for a pressure-sensitive adhesive sheet that can exhibit excellent adhesive force even on such a rough surface.
本発明は上記事情に鑑みなされたもので、粗面を有するポリオレフィン系樹脂部材に対して、優れた粘着力を有する粘着シートを提供することを目的とする。 This invention is made | formed in view of the said situation, and it aims at providing the adhesive sheet which has the outstanding adhesive force with respect to the polyolefin-type resin member which has a rough surface.
本発明者らは、特定のスチレン系樹脂及び粘着付与樹脂を含有する粘着剤組成物から形成され、所定の厚さの粘着剤層を有する粘着シートが、上記課題が解決し得ることを見い出し、本発明を完成させた。 The present inventors have found that a pressure-sensitive adhesive sheet formed from a pressure-sensitive adhesive composition containing a specific styrenic resin and a tackifier resin and having a pressure-sensitive adhesive layer having a predetermined thickness can solve the above-mentioned problems. The present invention has been completed.
すなわち本発明は、次の[1]〜[2]を提供する。
[1]スチレン−イソプレンジブロック共重合体(SI)及びスチレン−イソプレン−スチレントリブロック共重合体(SIS)から選ばれる1種以上のスチレン系樹脂(A)、並びに、粘着付与樹脂(B)を含有する粘着剤組成物から形成された粘着剤層を有する粘着シートであって、
前記粘着剤層の厚さが15μm以上であり、
算術平均粗さRaが1.0〜3.0μmである粗面を有するポリプロピレン板の当該粗面に対する粘着力が8.0N/25mm以上である、粘着シート。
[2]粘着付与樹脂(B)が、ロジン系樹脂、テルペン系樹脂、スチレン系樹脂、及び炭化水素系樹脂から選ばれる1種以上である、上記[1]に記載の粘着シート。
That is, the present invention provides the following [1] to [2].
[1] One or more styrene resins (A) selected from styrene-isoprene diblock copolymer (SI) and styrene-isoprene-styrene triblock copolymer (SIS), and tackifying resin (B) A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing
The pressure-sensitive adhesive layer has a thickness of 15 μm or more,
The adhesive sheet whose adhesive force with respect to the said rough surface of the polypropylene plate which has a rough surface whose arithmetic mean roughness Ra is 1.0-3.0 micrometers is 8.0 N / 25mm or more.
[2] The pressure-sensitive adhesive sheet according to [1], wherein the tackifying resin (B) is at least one selected from rosin-based resins, terpene-based resins, styrene-based resins, and hydrocarbon-based resins.
本発明の粘着シートは、粗面を有するポリオレフィン系樹脂部材に対して、優れた粘着力を有する。 The pressure-sensitive adhesive sheet of the present invention has an excellent pressure-sensitive adhesive force against a polyolefin resin member having a rough surface.
本明細書において、「質量平均分子量(Mw)」は、ゲルパーミエーションクロマトグラフィー(GPC)法で測定される標準ポリスチレン換算の値であり、具体的には実施例に記載の方法に基づいて測定した値である。 In the present specification, “mass average molecular weight (Mw)” is a value in terms of standard polystyrene measured by gel permeation chromatography (GPC), and specifically measured based on the method described in Examples. It is the value.
〔粘着シートの構成〕
本発明の粘着シートは、粘着剤層を有するものであれば、特に制限は無い。
図1は、本発明の粘着シートの構成の一例を示す、粘着シートの模式断面図である。
本発明の一態様の粘着シートとしては、例えば、図1(a)に示すように、基材11の少なくとも一方の表面上に、粘着剤層12を有する基材付き粘着シート1aが挙げられる。
なお、基材付き粘着シート1aの構成においては、図1(b)に示すように、粘着剤層12上に、さらに剥離材13を積層した基材付き粘着シート1bとしてもよい。
[Configuration of adhesive sheet]
If the adhesive sheet of this invention has an adhesive layer, there will be no restriction | limiting in particular.
FIG. 1 is a schematic cross-sectional view of an adhesive sheet showing an example of the configuration of the adhesive sheet of the present invention.
As an adhesive sheet of 1 aspect of this invention, as shown to Fig.1 (a), the adhesive sheet 1a with a base material which has the adhesive layer 12 on the at least one surface of the base material 11 is mentioned, for example.
In addition, in the structure of the adhesive sheet 1a with a base material, as shown in FIG.1 (b), it is good also as the adhesive sheet 1b with a base material which laminated | stacked the peeling material 13 on the adhesive layer 12. FIG.
また、本発明の一態様の粘着シートとしては、図1(c)に示すように、基材11の両面に、それぞれ粘着剤層12a、12bを有する基材付き両面粘着シート1cのような構成としてもよい。なお、図1(c)に示す両面粘着シート1cは、粘着剤層12a、12b上に、さらに剥離材を積層した構成としてもよい。 Moreover, as an adhesive sheet of 1 aspect of this invention, as shown in FIG.1 (c), the structure like the double-sided adhesive sheet 1c with a base material which has the adhesive layers 12a and 12b on both surfaces of the base material 11, respectively. It is good. In addition, the double-sided pressure-sensitive adhesive sheet 1c shown in FIG. 1C may have a configuration in which a release material is further laminated on the pressure-sensitive adhesive layers 12a and 12b.
また、本発明の一態様の粘着シートとしては、図1(d)のように、基材を用いずに、2枚の剥離材13a、13bに粘着剤層12が挟持された構成を有する基材無し粘着シート1dとしてもよい。
この基材無し粘着シート1dの剥離材13a、13bは、同じ種類の素材であってもよく、互いに異なる種類の素材であってもよいが、剥離材13aと剥離材13bとの剥離力が異なるように調整された素材であることが好ましい。
なお、基材無し粘着シートとしては、両面に剥離処理が施された剥離材の一方の面上に粘着剤層を設けたものをロール状に巻いた構成を有する粘着シートも挙げられる。
Moreover, as an adhesive sheet of 1 aspect of this invention, as shown in FIG.1 (d), the base | substrate which has the structure by which the adhesive layer 12 was pinched | interposed into two peeling materials 13a and 13b, without using a base material. The materialless adhesive sheet 1d may be used.
The release materials 13a and 13b of the adhesive sheet without base material 1d may be the same type of material or different types of materials, but the release force between the release material 13a and the release material 13b is different. It is preferable that the material is adjusted as described above.
In addition, as an adhesive sheet without a base material, the adhesive sheet which has the structure which wound what provided the adhesive layer on one side of the peeling material by which the peeling process was given to both surfaces was rolled is mentioned.
図1及び2に示す粘着シートでは、基材と粘着剤層とが直接積層した構成を有しているが、本発明の一態様の粘着シートにおいては、用途に応じて、基材と粘着剤層との間に他の層を有する構成であってもよい。 The pressure-sensitive adhesive sheet shown in FIGS. 1 and 2 has a configuration in which a base material and a pressure-sensitive adhesive layer are directly laminated. However, in the pressure-sensitive adhesive sheet of one embodiment of the present invention, the base material and the pressure-sensitive adhesive are used. The structure which has another layer between layers may be sufficient.
ところで、本発明の粘着シートは、算術平均粗さRaが1.0〜3.0μmである粗面を有するポリプロピレン板の当該粗面に対する粘着力が8.0N/25mm以上であることを要する。
なお、算術平均粗さRaは、JIS B 0601:1994に準拠して測定した値であって、具体的には実施例に記載の方法に基づき測定された値を意味する。
上記の粘着力は、一般的に広く使用される粗面を有するポリオレフィン系樹脂部材に対する粘着力を想定したものである。つまり、上記粘着力が8.0N/25mm以上であれば、このような部材の粗面に対しても十分に接着し得る粘着シートであるといえる。
本発明の粘着シートにおいて、上記粘着力は、8.0N/25mm以上であるが、好ましくは15.0N/25mm以上、より好ましくは20N/25mm以上、更に好ましくは30N/25mm以上、より更に好ましくは40N/25mm以上である。
なお、本明細書において、上記の粘着力は、実施例に記載の方法に基づき測定された値を意味する。
By the way, the adhesive sheet of this invention requires that the adhesive force with respect to the said rough surface of the polypropylene plate which has a rough surface whose arithmetic mean roughness Ra is 1.0-3.0 micrometers is 8.0 N / 25mm or more.
The arithmetic average roughness Ra is a value measured according to JIS B 0601: 1994, and specifically means a value measured based on the method described in the examples.
Said adhesive force assumes the adhesive force with respect to the polyolefin-type resin member which has a rough surface generally used widely. That is, if the said adhesive force is 8.0 N / 25mm or more, it can be said that it is an adhesive sheet which can fully adhere | attach also on the rough surface of such a member.
In the pressure-sensitive adhesive sheet of the present invention, the pressure-sensitive adhesive strength is 8.0 N / 25 mm or more, preferably 15.0 N / 25 mm or more, more preferably 20 N / 25 mm or more, still more preferably 30 N / 25 mm or more, and still more preferably. Is 40 N / 25 mm or more.
In addition, in this specification, said adhesive force means the value measured based on the method as described in an Example.
以下、本発明の一態様の粘着シートを構成する、粘着剤層、基材、及び剥離材について説明する。 Hereinafter, the pressure-sensitive adhesive layer, the base material, and the release material that constitute the pressure-sensitive adhesive sheet of one embodiment of the present invention will be described.
〔粘着剤層〕
本発明の粘着シートが有する粘着剤層は、スチレン−イソプレンジブロック共重合体(SI)及びスチレン−イソプレン−スチレントリブロック共重合体(SIS)から選ばれる1種以上のスチレン系樹脂(A)、並びに、粘着付与樹脂(B)を含有する粘着剤組成物から形成された層である。
特定のスチレン系樹脂(A)と共に、粘着付与樹脂(B)を含有する粘着剤組成物から形成された粘着剤層は、粗面を有するポリオレフィン系樹脂部材に対して、一般的なアクリル系粘着剤を用いた場合に比べて、高い粘着力を発現させることができる。
(Adhesive layer)
The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of the present invention comprises at least one styrene resin (A) selected from a styrene-isoprene block copolymer (SI) and a styrene-isoprene-styrene triblock copolymer (SIS). And a layer formed from a pressure-sensitive adhesive composition containing a tackifying resin (B).
The pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition containing the tackifying resin (B) together with the specific styrene-based resin (A) is a general acrylic pressure-sensitive adhesive against a polyolefin resin member having a rough surface. Compared with the case where an agent is used, high adhesive force can be expressed.
なお、本発明の粘着シートの粘着剤層の厚さは、粗面を有するポリオレフィン系樹脂部材に対する粘着力を向上させる観点から、15μm以上であるが、好ましくは17μm以上である。
また、取扱性が良好な粘着シートとする観点から、粘着剤層の厚さは、好ましくは100μm以下、より好ましくは90μm以下である。
In addition, the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of the present invention is 15 μm or more, preferably 17 μm or more, from the viewpoint of improving the adhesive force to the polyolefin resin member having a rough surface.
Moreover, from the viewpoint of obtaining a pressure-sensitive adhesive sheet with good handleability, the thickness of the pressure-sensitive adhesive layer is preferably 100 μm or less, more preferably 90 μm or less.
粘着剤層の形成材料である粘着剤組成物は、本発明の効果を損なわない範囲で、成分(A)及び(B)と共に、他の樹脂成分や、粘着剤用添加剤を含有してもよい。 The pressure-sensitive adhesive composition, which is a material for forming the pressure-sensitive adhesive layer, may contain other resin components and additives for pressure-sensitive adhesives together with the components (A) and (B) as long as the effects of the present invention are not impaired. Good.
<スチレン系樹脂(A)>
本発明で用いる粘着剤組成物は、スチレン−イソプレンジブロック共重合体(SI)(以下、「SI樹脂」ともいう)及びスチレン−イソプレン−スチレントリブロック共重合体(SIS)(以下「SIS樹脂」ともいう)から選ばれる1種以上のスチレン系樹脂(A)を含有する。
本発明の一態様において、スチレン系樹脂(A)としては、SI樹脂とSIS樹脂とを併用することが好ましい。
<Styrene resin (A)>
The pressure-sensitive adhesive composition used in the present invention includes a styrene-isoprene block copolymer (SI) (hereinafter also referred to as “SI resin”) and a styrene-isoprene-styrene triblock copolymer (SIS) (hereinafter referred to as “SIS resin”). 1) or more styrene-based resin (A) selected from.
In one embodiment of the present invention, it is preferable to use an SI resin and an SIS resin in combination as the styrene resin (A).
本発明の一態様において、スチレン系樹脂(A)の全量(100質量%)に対する、SI樹脂の含有量としては、粗面を有するポリオレフィン系樹脂部材に対する粘着力を向上させる観点から、好ましくは10〜90質量%、より好ましくは20〜80質量%、更に好ましくは25〜70質量%である。 In one embodiment of the present invention, the SI resin content relative to the total amount (100% by mass) of the styrenic resin (A) is preferably 10 from the viewpoint of improving the adhesive force to the polyolefin resin member having a rough surface. -90 mass%, More preferably, it is 20-80 mass%, More preferably, it is 25-70 mass%.
また、本発明の一態様において、スチレン系樹脂(A)の構成単位の全量(100質量%)に対する、スチレンに由来する構成単位の含有量としては、粗面を有するポリオレフィン系樹脂部材に対する粘着力を向上させる観点から、好ましくは5〜40質量%、より好ましくは8〜35質量%、更に好ましくは10〜30質量%である。 Moreover, in 1 aspect of this invention, as content of the structural unit derived from styrene with respect to the whole quantity (100 mass%) of the structural unit of styrene resin (A), it is the adhesive force with respect to the polyolefin-type resin member which has a rough surface. From the viewpoint of improving the viscosity, it is preferably 5 to 40% by mass, more preferably 8 to 35% by mass, and still more preferably 10 to 30% by mass.
スチレン系樹脂(A)の質量平均分子量(Mw)としては、好ましくは1万〜50万、より好ましくは2万〜40万、更に好ましくは2.5万〜35万、より更に好ましくは3万〜30万である。 The mass average molecular weight (Mw) of the styrene resin (A) is preferably 10,000 to 500,000, more preferably 20,000 to 400,000, more preferably 25,000 to 350,000, and still more preferably 30,000. ~ 300,000.
本発明の一態様で用いる粘着剤組成物において、成分(A)の含有量は、当該粘着剤組成物の有効成分の全量(100質量%)に対して、好ましくは10〜90質量%、より好ましくは20〜80質量%、更に好ましくは30〜70質量%である。
なお、本明細書において、「粘着剤組成物の有効成分」とは、当該粘着剤組成物に含まれる成分から、水や有機溶媒等の溶媒を除いた成分を指す。
In the pressure-sensitive adhesive composition used in one embodiment of the present invention, the content of the component (A) is preferably 10 to 90% by mass, more preferably 10 to 90% by mass, based on the total amount (100% by mass) of the active ingredients in the pressure-sensitive adhesive composition. Preferably it is 20-80 mass%, More preferably, it is 30-70 mass%.
In the present specification, the “active component of the pressure-sensitive adhesive composition” refers to a component obtained by removing a solvent such as water or an organic solvent from the components contained in the pressure-sensitive adhesive composition.
<成分(A)以外の粘着性樹脂>
本発明の一態様で用いる粘着剤組成物において、本発明の効果を損なわない範囲で、成分(A)以外の質量平均分子量(Mw)が1万以上の粘着性樹脂を含有してもよい。
このような粘着性樹脂としては、例えば、成分(A)以外のスチレン系樹脂、アクリル系樹脂、ウレタン系樹脂、ポリイソブチレン系樹脂等が挙げられる。
<Adhesive resin other than component (A)>
The pressure-sensitive adhesive composition used in one embodiment of the present invention may contain a pressure-sensitive adhesive resin having a mass average molecular weight (Mw) other than the component (A) of 10,000 or more as long as the effects of the present invention are not impaired.
Examples of such an adhesive resin include styrene resins other than the component (A), acrylic resins, urethane resins, polyisobutylene resins, and the like.
<粘着付与樹脂(B)>
本発明で用いる粘着剤組成物は、粘着付与樹脂(B)を含有する。
本明細書において、粘着付与樹脂とは、粘着性樹脂の粘着力を補助的に向上させる成分であって、質量平均分子量(Mw)が通常1万未満のオリゴマーであり、上述の粘着性樹脂とは区別されるものである。
粘着付与樹脂(B)の質量平均分子量(Mw)は、好ましくは400〜4000、より好ましくは800〜1500である。
<Tackifying resin (B)>
The pressure-sensitive adhesive composition used in the present invention contains a tackifier resin (B).
In the present specification, the tackifying resin is a component that assists in improving the adhesive strength of the adhesive resin, and is an oligomer having a mass average molecular weight (Mw) of usually less than 10,000. Are distinct.
The mass average molecular weight (Mw) of the tackifier resin (B) is preferably 400 to 4000, more preferably 800 to 1500.
粘着付与樹脂(B)としては、ロジン系樹脂、テルペン系樹脂、スチレン系樹脂、及び炭化水素系樹脂から選ばれる1種以上であることが好ましい。
なお、粘着付与樹脂(B)としては、これらの樹脂を水素化した水素化樹脂を用いてもよい。
The tackifier resin (B) is preferably at least one selected from rosin resins, terpene resins, styrene resins, and hydrocarbon resins.
In addition, as the tackifier resin (B), a hydrogenated resin obtained by hydrogenating these resins may be used.
ロジン系樹脂としては、例えば、ロジン樹脂、ロジンエステル樹脂、及びロジンフェノール樹脂等が挙げられ、これらの樹脂を水素化した水素化ロジン系樹脂であってもよい。 Examples of the rosin resin include rosin resins, rosin ester resins, and rosin phenol resins, and may be hydrogenated rosin resins obtained by hydrogenating these resins.
テルペン系樹脂としては、イソプレンに由来する構成単位を有する化合物であればよく、例えば、テルペン樹脂、芳香族変性テルペン樹脂、及びテルペンフェノール系樹脂等が挙げられ、これらの樹脂を水素化した水素化テルペン系樹脂であってもよい。 The terpene resin may be a compound having a structural unit derived from isoprene, and examples thereof include terpene resins, aromatic modified terpene resins, and terpene phenol resins, and hydrogenation of these resins by hydrogenation. A terpene resin may be used.
スチレン系樹脂としては、例えば、α−メチルスチレン又はβ−メチルスチレン等のスチレン系モノマーと脂肪族系モノマーとを共重合して得られる樹脂等が挙げられ、当該樹脂を水素化した水素化スチレン系樹脂であってもよい。
なお、粘着付与樹脂(B)として用いられるスチレン系樹脂は、成分(A)には該当しない樹脂であり、少なくとも分子量の点で、成分(A)とは区別し得る。
Examples of the styrene resin include a resin obtained by copolymerizing a styrene monomer such as α-methylstyrene or β-methylstyrene and an aliphatic monomer, and hydrogenated styrene obtained by hydrogenating the resin. A resin may be used.
The styrenic resin used as the tackifier resin (B) is a resin that does not correspond to the component (A), and can be distinguished from the component (A) at least in terms of molecular weight.
炭化水素系樹脂としては、例えば、石油ナフサの熱分解で生成するペンテン、イソプレン、ピペリン、1.3−ペンタジエン等のC5留分を共重合して得られるC5系炭化水素樹脂;石油ナフサの熱分解で生成するインデン、ビニルトルエン等のC9留分を共重合して得られるC9系炭化水素樹脂;及び、これらを水素化した水素化炭化水素樹脂等が挙げられる。
なお、炭化水素系樹脂としては、脂肪族炭化水素樹脂、脂環族炭化水素樹脂、及び芳香族炭化水素樹脂のいずれであってもよいが、脂肪族炭化水素樹脂、及び脂環族炭化水素樹脂が好ましい。
Examples of hydrocarbon resins include C5 hydrocarbon resins obtained by copolymerizing C5 fractions such as pentene, isoprene, piperine, and 1.3-pentadiene produced by the thermal decomposition of petroleum naphtha; And C9 hydrocarbon resins obtained by copolymerizing C9 fractions such as indene and vinyltoluene produced by decomposition; and hydrogenated hydrocarbon resins obtained by hydrogenating these.
The hydrocarbon resin may be any of an aliphatic hydrocarbon resin, an alicyclic hydrocarbon resin, and an aromatic hydrocarbon resin, but the aliphatic hydrocarbon resin and the alicyclic hydrocarbon resin. Is preferred.
粘着付与樹脂(B)の軟化点としては、粗面を有するポリオレフィン系樹脂部材に対する粘着力を向上させる観点から、好ましくは70〜170℃、より好ましくは80〜160℃である。 The softening point of the tackifier resin (B) is preferably 70 to 170 ° C., more preferably 80 to 160 ° C., from the viewpoint of improving the adhesive force to the polyolefin resin member having a rough surface.
なお、粘着付与樹脂(B)として、ロジン系樹脂を用いる場合、当該ロジン系樹脂の軟化点は、好ましくは80〜130℃、より好ましくは80〜110℃、更に好ましくは80〜90℃である。 In addition, when using rosin-type resin as tackifying resin (B), the softening point of the said rosin-type resin becomes like this. Preferably it is 80-130 degreeC, More preferably, it is 80-110 degreeC, More preferably, it is 80-90 degreeC. .
粘着付与樹脂(B)として、テルペン系樹脂を用いる場合、当該テルペン系樹脂の軟化点は、好ましくは80〜150℃、より好ましくは85〜130℃、更に好ましくは90〜105℃である。 When a terpene resin is used as the tackifier resin (B), the softening point of the terpene resin is preferably 80 to 150 ° C, more preferably 85 to 130 ° C, and still more preferably 90 to 105 ° C.
粘着付与樹脂(B)として、炭化水素系樹脂を用いる場合、当該炭化水素系樹脂の軟化点は、好ましくは90〜160℃、より好ましくは100〜155℃、更に好ましくは120〜150℃である。 When a hydrocarbon resin is used as the tackifier resin (B), the softening point of the hydrocarbon resin is preferably 90 to 160 ° C, more preferably 100 to 155 ° C, still more preferably 120 to 150 ° C. .
なお、本明細書において、粘着付与樹脂(B)の軟化点は、JIS K 2531に準拠して測定した値を意味する。
また、2種以上の粘着付与樹脂を併用している場合、各粘着付与樹脂の軟化点と配合量から算出した加重平均の値が上記範囲であることが好ましい。
In addition, in this specification, the softening point of tackifying resin (B) means the value measured based on JISK2531.
Moreover, when using together 2 or more types of tackifying resin, it is preferable that the value of the weighted average calculated from the softening point and compounding quantity of each tackifying resin is the said range.
本発明の一態様において、成分(B)の含有量は、粘着剤組成物中の成分(A)の全量100質量部に対して、好ましくは10〜300質量部、より好ましくは30〜200質量部、更に好ましくは50〜180質量部である。 In one embodiment of the present invention, the content of the component (B) is preferably 10 to 300 parts by mass, more preferably 30 to 200 parts by mass with respect to 100 parts by mass of the total amount of the component (A) in the pressure-sensitive adhesive composition. Part, more preferably 50 to 180 parts by weight.
<粘着剤用添加剤>
本発明の一態様で用いる粘着剤組成物は、本発明の効果を損なわない範囲で、さらに一般的な粘着剤用添加剤を含有してもよい。
このような粘着剤用添加剤としては、例えば、架橋剤、可塑剤(液体樹脂、流動パラフィン等)、紫外線吸収剤、酸化防止剤、防錆剤、抗菌剤、防虫剤、香料、顔料、染料、硬化剤、硬化助剤、触媒等が挙げられる。
<Adhesive additive>
The pressure-sensitive adhesive composition used in one embodiment of the present invention may further contain a general pressure-sensitive adhesive additive as long as the effects of the present invention are not impaired.
Examples of such an adhesive additive include a crosslinking agent, a plasticizer (liquid resin, liquid paraffin, etc.), an ultraviolet absorber, an antioxidant, a rust inhibitor, an antibacterial agent, an insect repellent, a fragrance, a pigment, and a dye. , Curing agents, curing aids, catalysts and the like.
〔基材〕
本発明の一態様の粘着シートが有する基材としては、用途に応じて適宜選択されるが、例えば、紙基材、金属基材、不織布等の多孔質基材、樹脂フィルム等が挙げられる。
〔Base material〕
Although the base material which the adhesive sheet of 1 aspect of this invention has is suitably selected according to a use, porous base materials, such as a paper base material, a metal base material, and a nonwoven fabric, a resin film etc. are mentioned, for example.
紙基材を構成する紙材としては、例えば、薄葉紙、中質紙、上質紙、含浸紙、コート紙、アート紙、硫酸紙、グラシン紙等が挙げられる。
金属基材を構成する金属としては、例えば、アルミニウム、銅、銀、金等が挙げられる。
Examples of the paper material constituting the paper base include thin paper, medium quality paper, high quality paper, impregnated paper, coated paper, art paper, sulfuric acid paper, glassine paper and the like.
As a metal which comprises a metal base material, aluminum, copper, silver, gold | metal | money etc. are mentioned, for example.
樹脂フィルムを構成する樹脂としては、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル系樹脂;ポリエチレン、ポリプロピレン等のポリオレフィン樹脂;ポリ塩化ビニル、ポリ塩化ビニリデン、ポリビニルアルコール、エチレン−酢酸ビニル共重合体、エチレン−ビニルアルコール共重合体等のビニル系樹脂;ポリスチレン;アクリロニトリル−ブタジエン−スチレン共重合体;三酢酸セルロース;ポリカーボネート;ポリウレタン、アクリル変性ポリウレタン等のウレタン樹脂;ポリメチルペンテン;ポリスルホン;ポリエーテルエーテルケトン;ポリエーテルスルホン;ポリフェニレンスルフィド;ポリエーテルイミド、ポリイミド等のポリイミド系樹脂;ポリアミド系樹脂;アクリル樹脂;フッ素系樹脂等が挙げられる。 Examples of the resin constituting the resin film include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyolefin resins such as polyethylene and polypropylene; polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, and ethylene-vinyl acetate. Vinyl resins such as copolymers and ethylene-vinyl alcohol copolymers; polystyrene; acrylonitrile-butadiene-styrene copolymers; cellulose triacetate; polycarbonate; urethane resins such as polyurethane and acrylic-modified polyurethane; polymethylpentene; Polyetheretherketone; Polyethersulfone; Polyphenylene sulfide; Polyimide resins such as polyetherimide and polyimide; Polyamide Resins, acrylic resins, fluorine-based resins.
これらの樹脂フィルムは、1種の樹脂のみから構成されたものであってもよく、2種以上の樹脂から構成されたものであってもよい。
また、樹脂フィルムは、未延伸でもよいし、縦又は横等の一軸方向あるいは二軸方向に延伸されていてもよい。
さらに、樹脂フィルムは、内部に空洞を含む空洞含有層を有する樹脂フィルムであってもよい。なお、当該空洞含有層の少なくとも一方の表面側に、さらに空洞を含まない樹脂層が積層した樹脂フィルムとしてもよい。
加えて、樹脂フィルムは、これらの樹脂と共に、紫外線吸収剤、光安定剤、酸化防止剤、帯電防止剤、スリップ剤、アンチブロッキング剤、着色剤等の各種添加剤を含有していてもよい。
These resin films may be composed of only one kind of resin, or may be composed of two or more kinds of resins.
The resin film may be unstretched, or may be stretched in a uniaxial direction or a biaxial direction such as longitudinal or lateral.
Further, the resin film may be a resin film having a cavity-containing layer including a cavity inside. In addition, it is good also as a resin film which laminated | stacked the resin layer which does not contain a cavity further on the at least one surface side of the said cavity content layer.
In addition, the resin film may contain various additives such as an ultraviolet absorber, a light stabilizer, an antioxidant, an antistatic agent, a slip agent, an antiblocking agent, and a colorant together with these resins.
これらの基材は、単独で用いてもよく、2種以上を組み合わせて複層体としてもよい。
基材として用いる複層体としては、紙基材を樹脂でラミネートしたラミネート基材や、樹脂フィルムの表面に金属膜を有する金属膜付き樹脂フィルム等も含まれる。
These base materials may be used alone or in combination of two or more types.
The multilayer body used as the substrate includes a laminate substrate obtained by laminating a paper substrate with a resin, a resin film with a metal film having a metal film on the surface of the resin film, and the like.
ラミネート基材としては、上記の紙基材を、ポリエチレン等の熱可塑性樹脂でラミネートしたラミネート紙等が挙げられる。 Examples of the laminated base material include laminated paper obtained by laminating the above paper base material with a thermoplastic resin such as polyethylene.
金属膜付き樹脂フィルムが有する金属膜は、アルミニウム、スズ、クロム、チタン等の金属から形成することができる。
樹脂フィルムの表面に金属膜を形成する方法としては、これらの金属を、真空蒸着、スパッタリング、イオンプレーティング等のPVD(physical vapor deposition)法により蒸着する方法や、上記金属からなる金属箔を一般的な粘着剤を用いて貼付する方法等が挙げられる。
The metal film which a resin film with a metal film has can be formed from metals such as aluminum, tin, chromium, and titanium.
As a method of forming a metal film on the surface of a resin film, a method of depositing these metals by a PVD (physical vapor deposition) method such as vacuum deposition, sputtering, or ion plating, or a metal foil made of the above metals is generally used. The method of sticking using a typical adhesive is mentioned.
なお、本発明の一態様で用いる基材が、樹脂フィルムやラミネート基材である場合、粘着剤層との密着性を向上させる観点から、これらの基材の表面に対して、酸化法や凹凸化法等の表面処理、あるいはプライマー処理を施してもよい。
酸化法としては、特に限定されず、例えば、コロナ放電処理法、プラズマ処理法、クロム酸酸化(湿式)、火炎処理、熱風処理、オゾン・紫外線照射処理等が挙げられる。
凹凸化法としては、特には限定されず、例えば、サンドブラスト法、溶剤処理法等が挙げられる。
In addition, when the base material used by 1 aspect of this invention is a resin film or a laminate base material, it is an oxidation method or uneven | corrugated with respect to the surface of these base materials from a viewpoint of improving adhesiveness with an adhesive layer. Surface treatment such as chemical conversion or primer treatment may be performed.
The oxidation method is not particularly limited, and examples thereof include a corona discharge treatment method, a plasma treatment method, chromic acid oxidation (wet), flame treatment, hot air treatment, and ozone / ultraviolet irradiation treatment.
The unevenness forming method is not particularly limited, and examples thereof include a sand blast method and a solvent treatment method.
基材の厚さとしては、好ましくは5〜1000μm、より好ましくは10〜500μm、更に好ましくは12〜250μm、より更に好ましくは15〜150μmである。 As thickness of a base material, Preferably it is 5-1000 micrometers, More preferably, it is 10-500 micrometers, More preferably, it is 12-250 micrometers, More preferably, it is 15-150 micrometers.
〔剥離材〕
本発明の一態様の粘着シートが有する剥離材としては、両面剥離処理をされた剥離材や、片面剥離処理された剥離材等が用いられ、剥離材用基材上に剥離剤を塗布したもの等が挙げられる。
剥離材用基材としては、例えば、グラシン紙、コート紙、上質紙等の紙基材、これらの紙基材にポリエチレン等の熱可塑性樹脂をラミネートしたラミネート紙、又はポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンナフタレート樹脂等のポリエステル樹脂フィルム、ポリプロピレン樹脂、ポリエチレン樹脂等のポリオレフィン樹脂フィルム等のプラスチックフィルム等が挙げられる。
剥離剤としては、例えば、シリコーン系樹脂、オレフィン系樹脂、長鎖アルキル系樹脂、アルキド系樹脂、フッ素系樹脂等が挙げられる。
[Release material]
As the release material of the pressure-sensitive adhesive sheet of one embodiment of the present invention, a release material that has been subjected to a double-sided release treatment, a release material that has been subjected to a single-side release treatment, or the like is used, and a release agent is applied on a release material base Etc.
Examples of the base material for the release material include paper base materials such as glassine paper, coated paper, high-quality paper, laminated paper obtained by laminating a thermoplastic resin such as polyethylene on these paper base materials, or polyethylene terephthalate resin, polybutylene terephthalate. Examples thereof include plastic films such as resins, polyester resin films such as polyethylene naphthalate resin, and polyolefin resin films such as polypropylene resin and polyethylene resin.
Examples of the release agent include silicone resins, olefin resins, long chain alkyl resins, alkyd resins, fluorine resins, and the like.
剥離材の厚さは、適宜設定されるが、好ましくは10〜200μm、より好ましくは25〜150μmである。 The thickness of the release material is appropriately set, but is preferably 10 to 200 μm, and more preferably 25 to 150 μm.
〔粘着シートの製造方法〕
本発明の粘着シートの製造方法としては、特に制限はなく、基材又は剥離材上に、上述の粘着剤組成物を塗布して塗膜を形成し、当該塗膜を乾燥させて、粘着剤層を形成する工程を有する製造方法が挙げられる。
なお、基材又は剥離材への基材や剥離材の表面上への塗布の作業性を向上させるために、粘着剤層の形成材料である本発明の粘着剤組成物は、更に有機溶媒で希釈して、溶液の形態とすることが好ましい。
[Method for producing adhesive sheet]
There is no restriction | limiting in particular as a manufacturing method of the adhesive sheet of this invention, The above-mentioned adhesive composition is apply | coated on a base material or a peeling material, a coating film is formed, the said coating film is dried, and an adhesive. The manufacturing method which has the process of forming a layer is mentioned.
In addition, in order to improve the workability | operativity of the application | coating on the surface of the base material or a peeling material to a base material or a peeling material, the adhesive composition of this invention which is a forming material of an adhesive layer is further with an organic solvent. It is preferable to dilute to form a solution.
有機溶媒としては、例えば、メチルエチルケトン、アセトン、酢酸エチル、テトラヒドロフラン、ジオキサン、シクロヘキサン、n−ヘキサン、トルエン、キシレン、n−プロパノール、イソプロパノール等が挙げられる。
粘着剤組成物の溶液の固形分濃度としては、好ましくは5〜70質量%、より好ましくは10〜65質量%、更に好ましくは15〜60質量%である。
Examples of the organic solvent include methyl ethyl ketone, acetone, ethyl acetate, tetrahydrofuran, dioxane, cyclohexane, n-hexane, toluene, xylene, n-propanol, isopropanol and the like.
As solid content concentration of the solution of an adhesive composition, Preferably it is 5-70 mass%, More preferably, it is 10-65 mass%, More preferably, it is 15-60 mass%.
基材又は剥離材上に、粘着剤組成物の溶液の塗布方法としては、例えば、スピンコート法、スプレーコート法、バーコート法、ナイフコート法、ロールコート法、ブレードコート法、ダイコート法、グラビアコート法等が挙げられる。 Examples of the method for applying the solution of the pressure-sensitive adhesive composition on the substrate or release material include spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure. Examples thereof include a coating method.
具体的な製造方法として、図1(a)のような基材付き粘着シート1aの製造方法としては、例えば、基材11の一方の面に、粘着性組成物の溶液を直接塗布し、乾燥して粘着剤層12を形成させて製造する方法が挙げられる。
また、図1(b)のような基材付き粘着シート1bの製造方法としては、例えば、剥離材13の剥離処理面上に、粘着性組成物の溶液を直接塗布し、乾燥して粘着剤層12を形成させた後、表出している粘着剤層12の表面と基材11とを貼り合わせて製造する方法等が挙げられる。
さらに、図1(c)のような基材付き両面粘着シート1cの製造方法としては、例えば、基材の両面のそれぞれに、粘着性組成物の溶液を直接塗布し、乾燥して粘着剤層12、12’を形成させて製造する方法や、2枚の剥離材を用意し、それぞれの剥離材の剥離処理面上に、粘着性組成物の溶液を直接塗布し、乾燥して粘着剤層を形成させた後、2つの剥離材上に形成した粘着剤層12a、12bを基材11の両面に貼り合わせて製造する方法等が挙げられる。
そして、図1(d)のような基材無し粘着シート1dの製造方法としては、例えば、一つの剥離材13aの剥離処理面に粘着性組成物の溶液を直接塗布し、乾燥して粘着剤層12を形成させた後、表出している粘着剤層12の表面に、別の剥離材13bを貼り合わせて製造する方法等が挙げられる。
As a specific manufacturing method, as a manufacturing method of the pressure-sensitive adhesive sheet 1a with a substrate as shown in FIG. 1A, for example, a solution of the pressure-sensitive adhesive composition is directly applied to one surface of the substrate 11 and dried. Then, the method of forming the pressure-sensitive adhesive layer 12 and producing it can be mentioned.
Moreover, as a manufacturing method of the adhesive sheet 1b with a base material like FIG.1 (b), the solution of an adhesive composition is directly apply | coated on the peeling process surface of the peeling material 13, for example, it dries and it is an adhesive. Examples include a method in which the surface of the pressure-sensitive adhesive layer 12 exposed and the base material 11 are bonded together after the layer 12 is formed.
Furthermore, as a manufacturing method of the double-sided pressure-sensitive adhesive sheet 1c with a substrate as shown in FIG. 1C, for example, a solution of the pressure-sensitive adhesive composition is directly applied to each of both surfaces of the substrate and dried to be a pressure-sensitive adhesive layer. A method for producing 12, 12 ′ and two release materials are prepared, and a solution of the adhesive composition is directly applied onto the release-treated surface of each release material, followed by drying to provide an adhesive layer The method of bonding the adhesive layers 12a and 12b formed on the two release materials to both surfaces of the base material 11 and the like, etc., after the formation of the substrate, can be mentioned.
And as a manufacturing method of the adhesive sheet 1d without a base material like FIG.1 (d), for example, the solution of an adhesive composition is directly apply | coated to the peeling process surface of the one peeling material 13a, it dries by drying. Examples include a method in which another release material 13b is bonded to the surface of the pressure-sensitive adhesive layer 12 that is exposed after the layer 12 is formed.
以下の実施例及び比較例において、各種物性の測定方法は、以下に記載のとおりである。
<質量平均分子量(Mw)>
ゲル浸透クロマトグラフ装置(東ソー株式会社製、製品名「HLC−8020」)を用いて、下記の条件下で測定し、標準ポリスチレン換算にて測定した。
(測定条件)
・カラム:「TSK guard column HXL−H」、「TSK gel GMHXL」(2本)、及び「TSK gel G2000HXL」(いずれも東ソー株式会社製)を順次連結したもの
・カラム温度:40℃
・展開溶媒:テトラヒドロフラン
・流速:1.0mL/min
In the following examples and comparative examples, methods for measuring various physical properties are as described below.
<Mass average molecular weight (Mw)>
Using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name “HLC-8020”), the measurement was performed under the following conditions, and the measurement was performed in terms of standard polystyrene.
(Measurement condition)
Column: “TSK guard column HXL-H”, “TSK gel GMHXL” (two), and “TSK gel G2000HXL” (both manufactured by Tosoh Corporation) Column temperature: 40 ° C.
・ Developing solvent: Tetrahydrofuran ・ Flow rate: 1.0 mL / min
<軟化点>
JIS K 2531に準拠して測定した。
<Softening point>
It measured based on JISK2531.
<算術平均粗さRa、最大断面高さRt>
表面粗さ測定機(株式会社ミツトヨ製、製品名「SV3000S4」、触針式)を用いて、JIS B0601:1994に準拠して測定した。なお、測定条件は以下のとおりである。
・基準長さ=2.5mm、λc=0.25mm、λs=0.008mm、評価長さ=10mm、走査速度=1.0mm/s、レンジ=800μm。
<Arithmetic mean roughness Ra, maximum section height Rt>
Using a surface roughness measuring machine (product name “SV3000S4”, stylus type, manufactured by Mitutoyo Corporation), the measurement was performed according to JIS B0601: 1994. The measurement conditions are as follows.
Reference length = 2.5 mm, λc = 0.25 mm, λs = 0.008 mm, evaluation length = 10 mm, scanning speed = 1.0 mm / s, range = 800 μm.
<基材の剛軟度>
実施例及び比較例で使用した基材を、長さ38mm×幅25mmの長方形に裁断したものを測定用サンプルとした。
当該測定用サンプルについて、剛軟度試験機(株式会社東洋精機製作所製、製品名「ガーレ式柔軟度試験機」)を使用し、23℃、50%RH(相対湿度)の環境下で、JIS L 1096(1999)8.20.1のガーレ法に準じて、基材の成形時の流れ方向(MD方向)と、MD方向に対して直角方向(TD方向)とで、基材の剛軟度をそれぞれ測定した。
<Flexibility of base material>
A sample for measurement was prepared by cutting a base material used in Examples and Comparative Examples into a rectangle of length 38 mm × width 25 mm.
About the measurement sample, using a bending resistance tester (manufactured by Toyo Seiki Seisakusho Co., Ltd., product name “Gurley type flexibility tester”) under an environment of 23 ° C. and 50% RH (relative humidity), JIS In accordance with the Gurley method of L 1096 (1999) 8.20.1, the stiffness of the substrate in the flow direction (MD direction) during molding of the substrate and the direction perpendicular to the MD direction (TD direction) Each degree was measured.
<基材の引裂強度>
実施例及び比較例で使用した基材を、長さ75mm×幅63mmの長方形に裁断したものを測定用サンプルとした。
当該測定サンプルを4枚重ね、エレメンドルフ引裂試験機(株式会社東洋精機製作所製)を用いて、23℃、50%RH(相対湿度)の環境下で、JIS K 7128に準じて、引き裂き試験を、基材のMD方向とTD方向とでそれぞれ4回行った。そして、MD方向及びTD方向で測定した各4つの値の平均値(基材4枚分の引裂強度)をそれぞれ算出し、その平均値の1/4の値を、その基材の引裂強度とした。
<Tear strength of substrate>
A sample for measurement was prepared by cutting a base material used in Examples and Comparative Examples into a rectangle having a length of 75 mm and a width of 63 mm.
Four measurement samples are stacked, and a tear test is performed in accordance with JIS K 7128 using an Elmendorf Tear Tester (Toyo Seiki Seisakusho Co., Ltd.) in an environment of 23 ° C. and 50% RH (relative humidity). 4 times each in the MD direction and TD direction of the substrate. Then, the average value of each of the four values measured in the MD direction and the TD direction (tear strength for four base materials) is calculated, respectively, and the value of 1/4 of the average value is the tear strength of the base material. did.
<粘着剤層の厚さ>
粘着剤層の定圧厚さ測定器(株式会社テクロック製、製品名「PG−02J」)を使用し、JIS K6783、Z1702、Z1709に準拠して測定した。
<Thickness of adhesive layer>
The pressure-sensitive adhesive layer was measured in accordance with JIS K6783, Z1702, and Z1709 using a constant pressure thickness measuring device (manufactured by Teclock Co., Ltd., product name “PG-02J”).
実施例1〜43
表1に示す種類及び配合量(固形分比)の各成分を添加し、さらにトルエンで希釈して、撹拌して、固形分濃度50質量%の粘着剤組成物の溶液をそれぞれ調製した。
そして、剥離シート(リンテック株式会社製、製品名「SP−PET751130」、厚さ75μm)の剥離処理面上に、調製した粘着剤組成物の溶液を塗布して塗膜を形成し、当該塗膜を100℃で1分間で乾燥して、表1に記載の厚さの粘着剤層をそれぞれ形成した。
次いで、形成した粘着剤層の粘着表面上に、表1に示す種類の基材を積層し、図1(b)に示す粘着シート1bと同じ構成を有する、粘着シートを得た。
Examples 1-43
Each component of the kind and compounding quantity (solid content ratio) shown in Table 1 was added, further diluted with toluene, and stirred to prepare respective solutions of the pressure-sensitive adhesive composition having a solid content concentration of 50% by mass.
Then, the prepared pressure-sensitive adhesive composition solution is applied to the release-treated surface of the release sheet (product of Lintec Corporation, product name “SP-PET751130”, thickness 75 μm) to form a coating film. Were dried at 100 ° C. for 1 minute to form pressure-sensitive adhesive layers having the thicknesses shown in Table 1, respectively.
Subsequently, the base material of the kind shown in Table 1 was laminated on the pressure-sensitive adhesive surface of the formed pressure-sensitive adhesive layer to obtain a pressure-sensitive adhesive sheet having the same configuration as that of the pressure-sensitive adhesive sheet 1b shown in FIG.
比較例1〜6
後述のアクリル系樹脂(1)100質量部(固形分比)に対して、後述の架橋剤を表1に示す配合量(固形分比)で添加し、酢酸エチルで希釈して、粘着剤組成物の溶液をそれぞれ調製した。
そして、剥離シート(リンテック株式会社製、製品名「SP−PET751130」、厚さ75μm)の剥離処理面上に、調製した粘着剤組成物の溶液を塗布して塗膜を形成し、当該塗膜を100℃で1分間乾燥して、表1に記載の厚さの粘着剤層をそれぞれ形成した。
次いで、形成した粘着剤層の粘着表面上に、表1に示す種類の基材を積層し、図1(b)に示す粘着シート1bと同じ構成を有する、粘着シートを得た。
Comparative Examples 1-6
To 100 parts by mass (solid content ratio) of an acrylic resin (1) described later, a cross-linking agent described later is added in a blending amount (solid content ratio) shown in Table 1, diluted with ethyl acetate, and an adhesive composition. Each product solution was prepared.
Then, the prepared pressure-sensitive adhesive composition solution is applied to the release-treated surface of the release sheet (product of Lintec Corporation, product name “SP-PET751130”, thickness 75 μm) to form a coating film. Were dried at 100 ° C. for 1 minute to form pressure-sensitive adhesive layers having the thicknesses shown in Table 1, respectively.
Subsequently, the base material of the kind shown in Table 1 was laminated on the pressure-sensitive adhesive surface of the formed pressure-sensitive adhesive layer to obtain a pressure-sensitive adhesive sheet having the same configuration as that of the pressure-sensitive adhesive sheet 1b shown in FIG.
実施例及び比較例で使用した、基材の詳細は、以下のとおりである。
・PETフィルム:東レ株式会社製、製品名「ルミラー(R)T−60」、厚さ50μmのポリエチレンテレフタレート(PET)フィルム。
・発泡PETフィルム(1):空洞含有層を有する、厚さ50μmの発泡PETフィルム。剛軟度:MD方向=0.21mN、TD方向=0.22mN、引裂強度:MD方向=270mN、TD方向=294mN。
・発泡PETフィルム(2):東洋紡株式会社製、製品名「クリスパーK2411」。空洞含有層を有する、厚さ50μmの発泡PETフィルム。剛軟度:MD方向=0.25mN、TD方向=0.28mN、引裂強度:MD方向=319mN、TD方向=294mN。
・発泡PPフィルム:株式会社ユポ・コーポレーション製、製品名「ユポSGP80」、空洞含有層を有する、厚さ80μmの発泡ポリプロピレン(PP)フィルム。
The details of the substrate used in Examples and Comparative Examples are as follows.
PET film: manufactured by Toray Industries, Inc., product name “Lumirror (R) T-60”, 50 μm thick polyethylene terephthalate (PET) film.
-Foamed PET film (1): A foamed PET film having a void-containing layer and a thickness of 50 µm. Bending softness: MD direction = 0.21 mN, TD direction = 0.22 mN, tear strength: MD direction = 270 mN, TD direction = 294 mN.
Foamed PET film (2): manufactured by Toyobo Co., Ltd., product name “Crisper K2411”. A foamed PET film having a void-containing layer and a thickness of 50 μm. Bending softness: MD direction = 0.25 mN, TD direction = 0.28 mN, tear strength: MD direction = 319 mN, TD direction = 294 mN.
-Foamed PP film: a product of "Yupo SGP80" manufactured by YUPO CORPORATION, and a foamed polypropylene (PP) film having a thickness of 80 µm and having a void-containing layer.
粘着剤組成物の調製に使用した、各成分の詳細は以下のとおりである。
<粘着性樹脂>
・スチレン系樹脂(1):SIS樹脂(トリブロック体)/SI樹脂(ジブロック体)=75/25(質量%)の混合樹脂、スチレン含有量=15質量%、Mw=19万。
・スチレン系樹脂(2):SIS樹脂(トリブロック体)/SI樹脂(ジブロック体)=25/75(質量%)の混合樹脂、スチレン含有量=15質量%、Mw=16万。
・スチレン系樹脂(3):SIS樹脂(トリブロック体)/SI樹脂(ジブロック体)=35/65(質量%)の混合樹脂、スチレン含有量=25質量%、Mw=18万。
・アクリル系樹脂(1):n−ブチルアクリレート(BA)、2−エチルヘキシルアクリレート(2EHA)、アクリル酸(AAc)、及び2−ヒドロキシエチルアクリレート(HEA)を共重合してなる、Mw55万のアクリル共重合体(構成単位比率:BA/EHA/AAc/HEA=47.0/47.0/5.5/0.5(質量%))。
The detail of each component used for preparation of an adhesive composition is as follows.
<Adhesive resin>
Styrene resin (1): SIS resin (triblock body) / SI resin (diblock body) = 75/25 (mass%) mixed resin, styrene content = 15 mass%, Mw = 190,000.
Styrene resin (2): SIS resin (triblock body) / SI resin (diblock body) = 25/75 (mass%) mixed resin, styrene content = 15 mass%, Mw = 160,000.
Styrene resin (3): SIS resin (triblock body) / SI resin (diblock body) = 35/65 (mass%) mixed resin, styrene content = 25 mass%, Mw = 180,000.
Acrylic resin (1): Mw of 550,000 acryl, copolymerized with n-butyl acrylate (BA), 2-ethylhexyl acrylate (2EHA), acrylic acid (AAc), and 2-hydroxyethyl acrylate (HEA) Copolymer (constituent unit ratio: BA / EHA / AAc / HEA = 47.0 / 47.0 / 5.5 / 0.5 (mass%)).
<粘着付与樹脂>
・テルペン系樹脂(1):ヤスハラケミカル株式会社製、製品名「YSレジンPX1150N」、非水素化テルペン系樹脂、Mw=1万未満、軟化点=115℃。
・テルペン系樹脂(2):ヤスハラケミカル株式会社製、製品名「YSポリエスターU115」、テルペンフェノール系樹脂、Mw=1万未満、軟化点=115℃。
・テルペン系樹脂(3):ヤスハラケミカル株式会社製、製品名「YSレジンPX1000」、非水素化テルペン系樹脂、Mw=1万未満、軟化点=100℃。
・テルペン系樹脂(4):ヤスハラケミカル株式会社製、製品名「クリアロンP105」、水素化テルペン系樹脂、Mw=1万未満、軟化点=105℃。
<Tackifying resin>
Terpene resin (1): manufactured by Yasuhara Chemical Co., Ltd., product name “YS Resin PX1150N”, non-hydrogenated terpene resin, Mw = less than 10,000, softening point = 115 ° C.
Terpene resin (2): manufactured by Yasuhara Chemical Co., Ltd., product name “YS Polyester U115”, terpene phenol resin, Mw = less than 10,000, softening point = 115 ° C.
Terpene resin (3): manufactured by Yasuhara Chemical Co., Ltd., product name “YS Resin PX1000”, non-hydrogenated terpene resin, Mw = less than 10,000, softening point = 100 ° C.
Terpene resin (4): manufactured by Yasuhara Chemical Co., Ltd., product name “Clearon P105”, hydrogenated terpene resin, Mw = less than 10,000, softening point = 105 ° C.
・炭化水素系樹脂(1):荒川化学工業株式会社製、製品名「アルコンP−100」、脂環族飽和炭化水素系樹脂、Mw=1万未満、軟化点=100℃。
・炭化水素系樹脂(2):荒川化学工業株式会社製、製品名「アルコンP−90」、脂環族飽和炭化水素系樹脂、Mw=1万未満、軟化点=90℃。
・炭化水素系樹脂(3):荒川化学工業株式会社製、製品名「アルコンP−115」、脂環族飽和炭化水素系樹脂、Mw=1万未満、軟化点=115℃。
・炭化水素系樹脂(4):荒川化学工業株式会社製、製品名「アルコンP−125」、脂環族飽和炭化水素系樹脂、Mw=1万未満、軟化点=125℃。
・炭化水素系樹脂(5):荒川化学工業株式会社製、製品名「アルコンP−140」、脂環族飽和炭化水素系樹脂、Mw=1万未満、軟化点=140℃。
・炭化水素系樹脂(6):日本ゼオン社製、製品名「クイントンLB406」、炭化水素系樹脂、Mw=1万未満、軟化点=90℃。
Hydrocarbon resin (1): manufactured by Arakawa Chemical Industries, Ltd., product name “Alcon P-100”, alicyclic saturated hydrocarbon resin, Mw = less than 10,000, softening point = 100 ° C.
Hydrocarbon resin (2): manufactured by Arakawa Chemical Industries, Ltd., product name “Alcon P-90”, alicyclic saturated hydrocarbon resin, Mw = less than 10,000, softening point = 90 ° C.
Hydrocarbon resin (3): manufactured by Arakawa Chemical Industries, Ltd., product name “Alcon P-115”, alicyclic saturated hydrocarbon resin, Mw = less than 10,000, softening point = 115 ° C.
Hydrocarbon resin (4): manufactured by Arakawa Chemical Industries, Ltd., product name “Alcon P-125”, alicyclic saturated hydrocarbon resin, Mw = less than 10,000, softening point = 125 ° C.
Hydrocarbon resin (5): manufactured by Arakawa Chemical Industries, Ltd., product name “Arcon P-140”, alicyclic saturated hydrocarbon resin, Mw = less than 10,000, softening point = 140 ° C.
Hydrocarbon resin (6): manufactured by Nippon Zeon Co., Ltd., product name “Quinton LB406”, hydrocarbon resin, Mw = less than 10,000, softening point = 90 ° C.
・スチレン系樹脂(1):スチレン系モノマー及び脂肪族系モノマーの共重合体、Mw=1万未満、軟化点=95℃。 Styrene resin (1): copolymer of styrene monomer and aliphatic monomer, Mw = less than 10,000, softening point = 95 ° C.
・ロジン系樹脂(1):荒川化学工業株式会社製、製品名「パインクリスタルKE−100」、ロジンエステル系樹脂、Mw=1万未満、軟化点=100℃。
・ロジン系樹脂(2):AR BROWN社製、製品名「Sylvalite RE85L」、非水素化ロジン系樹脂、Mw=1万未満、軟化点=85℃。
・ロジン系樹脂(3):荒川化学工業株式会社製、製品名「エステルガムHP」、水素化ロジンエステル系樹脂、Mw=1万未満、軟化点=80℃以上。
Rosin resin (1): manufactured by Arakawa Chemical Industries, Ltd., product name “Pine Crystal KE-100”, rosin ester resin, Mw = less than 10,000, softening point = 100 ° C.
Rosin resin (2): manufactured by AR BROWN, product name “Sylvalite RE85L”, non-hydrogenated rosin resin, Mw = less than 10,000, softening point = 85 ° C.
Rosin resin (3): manufactured by Arakawa Chemical Industries, Ltd., product name “Ester Gum HP”, hydrogenated rosin ester resin, Mw = less than 10,000, softening point = 80 ° C. or higher.
<他の添加剤>
・液状樹脂:ヤスハラケミカル株式会社製、製品名「ダイマロン」、テルペン系樹脂。
・流動パラフィン:株式会社MORESCO製、製品名「モレスコホワイトP−350P」。
・酸化防止剤:株式会社ADEKA製、製品名「アデカスタブAO60」、ヒンダードフェノール系酸化防止剤。
・紫外線吸収剤:株式会社ADEKA製、製品名「アデカスタブLA32」、ベンゾトリアゾール系紫外線吸収剤。
・架橋剤:東ソー株式会社製、製品名「コロネートL」、イソシアネート系架橋剤。
<Other additives>
-Liquid resin: Yasuhara Chemical Co., Ltd., product name "Dimaron", terpene resin.
-Liquid paraffin: Product name “MORESCO White P-350P” manufactured by MORESCO Co., Ltd.
Antioxidant: manufactured by ADEKA Corporation, product name “ADK STAB AO60”, hindered phenol antioxidant.
UV absorber: manufactured by ADEKA Corporation, product name “ADK STAB LA32”, benzotriazole UV absorber.
-Cross-linking agent: manufactured by Tosoh Corporation, product name “Coronate L”, isocyanate-based cross-linking agent.
実施例及び比較例で作製した粘着シートを用いて、「ポリプロピレン板の粗面に対する粘着力」を測定した。その結果を表1に示す。
<ポリプロピレン(PP)板の粗面に対する粘着力>
実施例及び比較例で作製した粘着シートを縦150mm×幅25mmの長方形に切断した試験片の剥離シートを除去して、表出した粘着剤層の表面を、算術平均粗さRaが2μm、最大断面高さRtが17μmである粗面を有するポリプロピレン板の当該粗面に、2kgのローラーを用いて貼付し、23℃、50%RH(相対湿度)の環境下で24時間静置した。
静置後、JIS Z0237:2000に基づき、180°引き剥がし法により、引っ張り速度300mm/分にて、ポリプロピレン(PP)板の粗面に対する粘着力を測定した。
Using the pressure-sensitive adhesive sheets prepared in Examples and Comparative Examples, “adhesive strength against a rough surface of a polypropylene plate” was measured. The results are shown in Table 1.
<Adhesion to rough surface of polypropylene (PP) plate>
The pressure-sensitive adhesive sheets prepared in Examples and Comparative Examples were removed from the test piece release sheet cut into a rectangular shape with a length of 150 mm and a width of 25 mm, and the surface of the exposed pressure-sensitive adhesive layer had an arithmetic average roughness Ra of 2 μm and a maximum. The polypropylene plate having a rough surface with a cross-sectional height Rt of 17 μm was attached to the rough surface using a 2 kg roller and allowed to stand for 24 hours in an environment of 23 ° C. and 50% RH (relative humidity).
After standing, the adhesive force to the rough surface of the polypropylene (PP) plate was measured by a 180 ° peeling method at a pulling speed of 300 mm / min based on JIS Z0237: 2000.
表1より、実施例1〜43で作製した粘着シートは、比較例1〜6の粘着シートに比べて、ポリプロピレン板の粗面に対する粘着力が高い結果となった。 From Table 1, the pressure-sensitive adhesive sheets produced in Examples 1 to 43 were higher in the adhesive strength to the rough surface of the polypropylene plate than the pressure-sensitive adhesive sheets of Comparative Examples 1 to 6.
1a、1b、1c、1d 粘着シート
11 基材
12、12a、12b 粘着剤層
13、13a、13b 剥離材
1a, 1b, 1c, 1d Adhesive sheet 11 Base material 12, 12a, 12b Adhesive layer 13, 13a, 13b Release material
Claims (2)
前記粘着剤層の厚さが15μm以上であり、
算術平均粗さRaが1.0〜3.0μmである粗面を有するポリプロピレン板の当該粗面に対する粘着力が8.0N/25mm以上である、粘着シート。 1 or more types of styrene resin (A) chosen from a styrene-isoprene diblock copolymer (SI) and a styrene-isoprene-styrene triblock copolymer (SIS), and a tackifying resin (B) are contained. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition,
The pressure-sensitive adhesive layer has a thickness of 15 μm or more,
The adhesive sheet whose adhesive force with respect to the said rough surface of the polypropylene plate which has a rough surface whose arithmetic mean roughness Ra is 1.0-3.0 micrometers is 8.0 N / 25mm or more.
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Cited By (2)
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CN110527467A (en) * | 2019-08-28 | 2019-12-03 | 佛山市南海骏驰新材料有限公司 | A kind of heat molten type velcro glue and its production technology |
DE112023000850T5 (en) | 2022-05-31 | 2024-11-28 | Nitto Denko Corporation | adhesive film |
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JPH01162804A (en) * | 1987-11-06 | 1989-06-27 | Minnesota Mining & Mfg Co <3M> | Pressure-sensitive adhesive closuure for disposable clothing |
JP2009235168A (en) * | 2008-03-26 | 2009-10-15 | Dic Corp | Pressure-sensitive adhesive composition and pressure-sensitive adhesive tape |
JP2010077372A (en) * | 2008-09-25 | 2010-04-08 | Toyo Adl Corp | Pressure-sensitive adhesive composition and laminate using the pressure-sensitive adhesive composition |
JP2018199810A (en) * | 2017-05-29 | 2018-12-20 | 東洋インキScホールディングス株式会社 | Synthesis rubber adhesive, adhesive sheet, and polishing member laminate |
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JPH01162804A (en) * | 1987-11-06 | 1989-06-27 | Minnesota Mining & Mfg Co <3M> | Pressure-sensitive adhesive closuure for disposable clothing |
JP2009235168A (en) * | 2008-03-26 | 2009-10-15 | Dic Corp | Pressure-sensitive adhesive composition and pressure-sensitive adhesive tape |
JP2010077372A (en) * | 2008-09-25 | 2010-04-08 | Toyo Adl Corp | Pressure-sensitive adhesive composition and laminate using the pressure-sensitive adhesive composition |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN110527467A (en) * | 2019-08-28 | 2019-12-03 | 佛山市南海骏驰新材料有限公司 | A kind of heat molten type velcro glue and its production technology |
DE112023000850T5 (en) | 2022-05-31 | 2024-11-28 | Nitto Denko Corporation | adhesive film |
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