JP2019036607A - Multi-layer wiring board containing glass substrate with circuit and manufacturing method thereof - Google Patents

Abstract

An object of the present invention is to provide a high-quality multilayer glass substrate that can be obtained using a conventional laminated plate manufacturing apparatus, and a method for manufacturing the same. To achieve this object, there is provided a glass substrate-containing multilayer wiring board with a circuit comprising a glass substrate with a circuit on both sides of an insulating layer with a buried through-hole, wherein the insulating layer with a buried through-hole comprises the buried through-hole. Provided with a buried through hole filled with a conductive material for electrically connecting the circuits of two glass substrates with a circuit arranged via an insulating layer with holes, the glass substrate with a circuit is provided on the surface of the glass substrate A glass substrate-containing multilayer wiring board with a circuit, which is provided with a predetermined circuit and has a through hole for connecting to a buried through hole provided in the insulating layer with the buried through hole, is employed. [Selection] Figure 1

Description

  The present application relates to a multilayer substrate having a glass substrate with a circuit and a method for producing the same.

  In recent years, wiring boards using glass plates for insulating layers have been used in various fields. Various types of layer configurations exist.

  For example, as having the most simplified layer structure, Patent Document 1 discloses an adhesive tape that contaminates the surface of a multilayer glass substrate for constituting a reflective mirror element and a cutter that is a consumable item. A method of forming a crack in a multilayer glass substrate in which one or more thin films are provided on at least one main surface of the glass substrate is disclosed for the purpose of providing a low-cost reflection mirror element without using it. Among these, the glass substrate used for explanation is disclosed in which a thin film is provided on both surfaces of a glass plate. However, in recent years, multilayering has been desired for a wiring board including a glass substrate.

  From the viewpoint of multilayering a glass substrate, there are some which attempt to multilayer by using only a glass substrate as described in Patent Document 2. In Patent Document 2, for the purpose of providing a method for producing a multilayer glass substrate that ensures airtightness without filling an insulating material or a conductive material in a through hole of a glass substrate in which a through hole is formed, A through hole for connecting the first main surface and the second main surface is formed, an inner wall surface of the through hole, a surface in the vicinity including the periphery of the through hole opening of the first main surface, and the second main surface A method for manufacturing a multilayer glass substrate is disclosed, in which a plurality of glass substrates on which conductive films are formed are stacked on the surface of the surface including the periphery of the opening of the through-hole, and bonded by heating and pressing. ” ing.

  Patent Document 3 discloses an invention that uses a glass substrate and a resin substrate at the same time. In Patent Document 3, for the purpose of providing a laminate having good glass adhesion and excellent heat resistance and chemical resistance, and a laminate using the laminate, “one or more resin layers and one or more layers” are disclosed. A laminate having a glass substrate layer, wherein the resin composition constituting the resin layer is at least one resin (a) selected from a polybutadiene resin having a reactive substituent at the terminal and a hydrogenated polybutadiene resin; A thermosetting resin obtained by reacting a compound (b) having at least two cyanate groups in one molecule with a compound (c) having at least two epoxy groups in one molecule is contained. What gave the characteristic to the resin composition which comprises resin layers, such as a laminated body, is disclosed.

JP 2001-0664029 A JP 2005-259801 A JP2015-229286A

  However, as described in Patent Document 2 described above, when trying to increase the number of layers by using only a glass substrate, diffusion bonding between glasses is required, so that the processing conditions are restricted and a normal laminate manufacturing process may be employed. Can not. Therefore, new capital investment is required and the processing cost tends to increase.

  In the case of the invention disclosed in Patent Document 3, the resin composition constituting the resin layer is limited in order to ensure adhesion between the glass substrate and the resin layer, and the resin layer of the multilayer glass substrate. As a result, it becomes difficult to use various resins.

  As can be understood from the above description, when a multilayer glass substrate is manufactured, it is required that a conventional laminated plate manufacturing apparatus can be used. Furthermore, there has been a demand for a multilayer glass substrate that can use an insulating layer constituent material containing a conventional resin.

  Therefore, in order to solve the above-described problems, as a result of intensive studies, a glass substrate-containing multilayer wiring board with a circuit having the following layer structure has been adopted.

<Multi-layer wiring board with glass substrate with circuit>
The glass substrate-containing multilayer wiring board with a circuit according to the present application is a glass substrate-containing multilayer wiring board with a circuit provided with a glass substrate with a circuit on both sides of an insulating layer with a buried through hole, and the insulating layer with a buried through hole is A glass substrate with a circuit is provided with a buried through hole filled with a conductive material for electrically connecting the circuits of two glass substrates with a circuit arranged via the insulating layer with the buried through hole. A predetermined circuit is provided on the surface, and a through hole for connecting to a buried through hole provided in the insulating layer is provided.

  In the multilayer substrate having a glass substrate with a circuit according to the present application, the glass substrate with a circuit preferably includes a predetermined circuit on both surfaces of the glass substrate.

In the multilayer wiring board with a glass substrate with a circuit according to the present application, the insulating layer with an embedded through hole is a material having an insulation resistance of 1 × 10 ⁶ Ω or more as its constituent resin, Any plastic resin can be used.

In the multilayer wiring board with a glass substrate with a circuit according to the present application, the conductive material disposed in the buried through hole of the insulating layer with the buried through hole is a copper paste, a silver paste or the like exhibiting an insulation resistance of 1 × 10 ² Ω or less. A conductive paste, a conductive resin containing a conductive filler, a solder material, or the like is preferably used.

<Manufacturing method of glass substrate-containing multilayer wiring board with circuit>
The above-described method for producing a glass substrate-containing multilayer wiring board with a circuit includes the following steps.

Manufacturing process of insulating layer with embedded through hole: The through hole forming hole is formed by providing a predetermined through hole forming hole for electrically connecting the glass insulating layer circuits to the insulating layer constituting material. The hole is filled with a conductive material to form a buried through hole, and an insulating layer with a buried through hole is obtained.
Manufacturing process of glass substrate with circuit: A plate-like glass substrate is prepared, and a perforating process for providing a through hole forming hole on the glass substrate is performed, and then both surfaces of the glass substrate and an inner peripheral wall of the through hole forming hole. A conductive metal layer is provided on the glass substrate, and a glass substrate with a conductive metal layer having a through-hole hole is formed. And the glass substrate with a circuit is obtained by carrying out the etching process of the conductive metal layer in the surface of the said glass substrate with a conductive metal layer, and forming a circuit.
Lamination process: A glass substrate with a circuit on one side and the other side of the insulating layer with an embedded through hole so that the embedded through hole of the insulating layer with the embedded through hole faces the through hole of the glass substrate with the circuit. Are arranged and processed to obtain a glass substrate-containing multilayer wiring board with a circuit comprising a glass substrate with a circuit on both surfaces of an insulating layer with an embedded through hole.

  In the method for producing a glass substrate-containing multilayer wiring board with a circuit according to the present application, it is preferable that the drilling process for providing a through-hole forming hole in the glass substrate is performed using an ultrashort pulse laser.

<Specific products using glass circuit board-containing multilayer wiring boards with circuit>
The glass substrate-containing multilayer wiring board with a circuit according to the present application is suitable as a glass substrate-containing multilayer wiring board with a circuit for a touch panel by including a circuit for a touch panel.

  The multilayer wiring board with a glass substrate with a circuit according to the present application has a simplified basic layer configuration of “glass substrate with circuit / insulating layer with embedded through-hole / glass substrate with circuit”, and an insulating layer with an embedded through-hole in the middle By using an insulating layer constituent material other than a glass substrate, it is possible to manufacture by employing an existing lamination method and lamination conditions. Therefore, it is possible to use an existing laminated board manufacturing facility, and the manufacturing cost is not increased. In addition, the glass substrate-containing multilayer wiring board with circuit according to the present application adopts the basic layer configuration of “glass substrate with circuit / insulating layer with embedded through hole / glass substrate with circuit”, and is opposed to the insulating layer through the insulating layer. The arranged “glass substrates with circuit” can be reliably connected to each other, and the multilayer wiring board is highly reliable.

It is a schematic cross section of the glass substrate-containing multilayer wiring board with circuit according to the present application. It is a schematic diagram for demonstrating the manufacture process of the insulating layer with a buried through-hole used for manufacture of the glass substrate containing multilayer wiring board with a circuit which concerns on this application. It is a schematic diagram for demonstrating the manufacturing process of the glass substrate with a circuit used for manufacture of the glass substrate with a circuit board containing circuit which concerns on this application. It is the schematic diagram which showed the lamination | stacking image of the insulating layer with a buried through hole, and the glass substrate with a circuit when manufacturing the glass substrate containing circuit-equipped multilayer wiring board which concerns on this application. It is the schematic diagram which showed the lamination | stacking image for the high multilayering of the glass substrate containing multilayer board with a circuit which concerns on this application.

  Hereinafter, the glass substrate-containing multilayer wiring board with circuit according to the present application will be described in detail, but by explaining the manufacturing method in detail, the “glass substrate-containing multilayer wiring board with circuit” will also be described in detail through the manufacturing method.

  FIG. 1 exemplarily shows a circuit board-containing multilayer wiring board with a circuit according to the present application. In FIG. 1 (a), an insulating layer with a buried through hole is arranged between two glass substrates with a circuit, and a through hole of a glass substrate with a circuit and a buried through of an insulating layer with a buried through hole. The holes are laminated with the holes aligned, and there is an advantage that through-hole plating in a multilayered state is unnecessary. The layer structure shown in FIG. 1B is arranged between two glass substrates with a circuit in an insulating layer with a buried through hole, and the through hole of the glass substrate with a circuit and the buried through of the insulating layer with a buried through hole Laminate the holes so that they match, and then fill the through-holes with conductive paste, resin paste, etc., form the buried portion 8 with a conductive material, perform plating to close the through-holes, and form a circuit. It is obtained. In the case of this layer structure, blind via holes can be formed, and connection reliability can be improved. The layer structure shown in FIG. 1 (c) is a structure in which a through-hole is embedded in a through-hole hole of a glass substrate with a circuit between the two glass substrates with a circuit and disposed in an insulating layer with an embedded through-hole. It is obtained by infiltrating the resin of the insulating layer with holes and embedding the resin. In such a case, since it is not necessary to stack the through holes of the glass substrate with circuit and the embedded through holes of the insulating layer with the embedded through holes, the degree of freedom in designing the substrate is increased, and FIG. As in the layer configuration of b), blind via holes can be formed and connection reliability can be improved. In the following description, it demonstrates using the manufacturing process in the case of the glass substrate containing multilayer wiring board 1 with a circuit shown to Fig.1 (a).

A. Form of glass substrate-containing multilayer wiring board with circuit and method for manufacturing the same
As long as the insulating layer 2 can secure sufficient adhesion to the glass substrate 5 to be described later and has an insulation resistance of 1 × 10 ⁶ Ω or more, either a thermosetting resin or a thermoplastic resin can be used. Is possible. Examples of these are epoxy resins, polyimide resins, fluororesins, aramid resins, polyethylene terephthalate resins, polyphenylene ether resins, bismaleidotriazine resins, cyanate ester resins, liquid crystal polymers, cycloolefin polymer resins, etc. It is preferable to use a glass-epoxy resin substrate, a glass-polyimide resin substrate, or the like containing a skeleton material such as glass cloth or glass nonwoven fabric as the resin component.

  And the above-mentioned insulating layer 2 is perforated, and it is set as the state of FIG. 2 (B). The drilling process at this time can arbitrarily select methods, such as a drill process, a laser process, and a punching process, according to the hole diameter to form. Moreover, the hole diameter (diameter: R) of the through-hole forming hole 3 provided in the constituent material of the insulating layer 2 is as follows based on the hole diameter (diameter: r) of the through-hole hole 4 provided in the glass substrate 5 described later. It is preferable that the relational expression (1) is satisfied.

1.1r ≦ R ≦ 3.0r (1)
However, R: Hole diameter of the hole provided in the insulating layer constituent material
r: Hole diameter of the through hole provided in the glass substrate

  Here, when R is less than 1.1r, when laminated together in the laminating process described later, the difference of expansion coefficient in the heating state when laminating the insulating layer with the buried through hole and the glass substrate with the circuit, It becomes difficult to align the "buried through hole provided in the insulating layer with hole" and "the through hole hole provided in the glass substrate with circuit" to face each other, and the glass substrate with circuit provided through the insulating layer with the buried through hole. Since it becomes difficult to electrically connect these circuits, it is not preferable. On the other hand, when R exceeds 3.0r, it becomes easy to align the “buried through hole provided in the insulating layer with the buried through hole” and the “through hole hole provided in the glass substrate with circuit”, and there is no particular problem. However, while a fine pitch circuit is required, there is no market requirement for 3.0r <R.

The drilling process is completed as described above, and as shown in FIG. 2C, the inside of the through hole forming hole 3 of the insulating layer 2 is filled with a conductive material having an insulation resistance of 1 × 10 ² Ω or less. Then, a buried through hole 4 ′ is formed to form an insulating layer 10 with a buried through hole. As the conductive material, a conductive paste such as a copper paste or a silver paste, a conductive resin containing a conductive filler, a solder material, or the like can be used.

  In addition, it is also preferable to use a solder ball. By placing solder balls in the opened holes of the resin layer and laminating them, it becomes possible to form embedded through holes in the resin layer. The melting point of the solder material constituting the solder hole at this time is preferably about the same as the curing temperature of the resin constituting the resin layer, and assuming a general lamination temperature of the laminate, the melting point is 180 ° C. or less. It is preferable to employ solder balls using low-temperature solder.

  These conductive materials are generally used after being filled in the holes of the insulating layer 2 and then heat-cured. Accordingly, although heating for curing is required, the constituent resin of the insulating layer 2 is cured depending on the heating level, and the semi-cured state cannot be maintained. In such a case, at this stage, heating at a dry level may be performed and cured by heating in a later lamination process. When the conductive material is filled into the holes of the insulating layer 2, the thickness of the circuit 7 provided on the surface of the glass substrate 11 with circuit used for stacking, which will be described later, is taken into consideration, as shown in FIG. Thus, it is preferable that the filled conductive material that becomes the buried through hole 4 ′ protrude from the surface of the insulating layer 2 in a semi-cured state by 1 μm to 1.5 μm. By doing in this way, the reliable electrical connection of "the through-hole of the glass substrate with a circuit" when laminated | stacked and "the embedded through-hole of the insulating layer with an embedded through-hole" is securable. As described above, the embedded through hole 4 'is formed by filling the through hole forming hole 3 with the conductive material, and the insulating layer 10 with the embedded through hole is prepared.

<Manufacture of glass substrate with circuit>
Here, a plate-like glass substrate 5 as shown in FIG. As the glass material used for the glass substrate 5, any glass material can be used as long as it exhibits electrical insulation. In view of procurement cost and availability in the market, it is preferable to use borosilicate glass, soda lime glass, or the like. And there is no special limitation regarding thickness, size, etc. of this glass substrate, and it can select suitably according to the request | requirement of a market. Hereinafter, it demonstrates according to a manufacture process, referring FIG.

Drilling of Glass Substrate: As shown in FIG. 3B, the glass substrate 5 is drilled to form a desired through-hole forming hole 3. In drilling the glass substrate 5, any one of a sandblasting method, an etching method, and a laser processing method can be employed. There are two types of sandblasting methods, the drive blast method and the wet blast method. The former is excellent in processing speed, and the latter tends to have a beautifully finished hole wall and open end, and which one is used depends on the required quality. Select and use. In the etching method, holes are formed by masking the portion other than the hole formation portion of the glass substrate 5 and bringing a glass-dissolvable hydrofluoric acid solution into contact with the hole formation portion. In the laser processing method, a hole is formed on the glass substrate 5 by irradiating the laser with a laser to perform a hole forming process in a short time. In this laser method, it is preferable to use an ultrashort pulse laser having a short emission time (interval) instead of a continuous wave laser. This is because by using the ultrashort pulse laser, it is possible to minimize the change in the glass material around the opening of the glass substrate 5 and obtain a favorable opening shape. At this time, selection of the laser type, laser irradiation conditions, and the like are appropriately determined in consideration of the material, thickness, processing accuracy, and the like of the selected glass substrate 5.

  The through hole forming hole 3 formed from one surface side to the other surface side of the glass substrate 5 by the method as described above has a smaller opening diameter on the other surface side than the opening diameter on the one surface side. There is a tendency that the inner peripheral wall surface of the forming hole 3 becomes an inclined conical tapered surface. This tendency appears as a remarkable tendency, so that the glass substrate 5 is thicker. Therefore, it is preferable to use a glass plate having a thickness of 0.1 to 2.0 mm, more preferably 0.1 to 1.0 mm, as the glass substrate 5 for manufacturing the glass substrate with circuit 11. When the thickness of the glass substrate 5 is less than 0.1 mm, the strength becomes weak and handling becomes difficult, which is not preferable. On the other hand, if the thickness of the glass substrate 5 exceeds 2.0 mm, the conical tapered surface is likely to be formed, which may be an obstacle when trying to accommodate the terminal of the electronic component in the through-hole hole 4. Therefore, it is not preferable.

Formation of Conductive Metal Layer: After the through hole forming hole 3 is formed in the glass substrate 5, the conductive metal layer 6 is provided on the surface of the glass substrate 5 and the inner peripheral wall of the through hole forming hole 3. The conductive metal layer 6 at this time can use various methods such as a catalyst method using tin / palladium and a seed layer forming method using a dry process. More specifically, “After immersing a glass substrate in an aqueous tin chloride solution and sensitizing it, immersing it in an aqueous palladium chloride solution, applying a catalyst, and activating it with an aqueous solution such as sulfuric acid or hydrochloric acid or an aqueous reducing agent solution, electroless “Method of plating”, “Method of electroless plating after activation of glass substrate surface using mixed catalyst of tin and palladium”, “Metal film formation on glass substrate surface by vapor deposition or sputtering” Membrane method "and the like. Below, a specific example is shown regarding formation of the conductive metal layer 6.

  A porous ceramic film or a porous glass film is provided on the surface of the glass substrate 5 and the inner peripheral wall of the through hole forming hole 3 to form a glass substrate with a modified layer (not shown). This modified layer preferably has an uneven shape. This is because when the conductive metal layer 6 is formed on the surface of the modified layer by the plating method, the conductive metal component enters and precipitates inside the porous ceramic film or the porous glass film, thereby exhibiting an anchor effect. Further, the inner wall surface of the hole formed by drilling the glass substrate 5 is formed with irregularities having an average roughness Ra of 1 nm or more, more preferably 10 nm or more even during drilling. 6 adhesion is improved.

  The thickness of the porous ceramic film or the porous glass film is preferably 20 nm to 100 nm. When the thickness of the film is less than 20 nm, it is difficult to uniformly cover the surface of the glass substrate 5 and the inner peripheral wall of the through-hole forming hole 3, and the glass substrate 5 of the conductive metal layer 6 to be formed later. This is not preferable because the adhesion to the surface varies depending on the place. On the other hand, when the thickness of the coating exceeds 100 nm, the uneven shape required for the coating decreases, and the conductive metal layer 6 provided on the surface of the coating, the inner peripheral wall of the glass substrate 5 and the through-hole forming hole 3 This is because the tendency for the adhesiveness to decrease is remarkable.

The porous ceramic film or the porous glass film described above is preferably formed on the surface of the glass substrate 5 and the inner peripheral wall of the through-hole forming hole 3 using a sol-gel method. This is because a favorable uneven shape can be formed on the porous ceramic film or the porous glass film, and it is easy to ensure insulation as a circuit board. There is no particular limitation on the material of the porous ceramic film or the porous glass film. For example, ethyl oxalate (Si (C ₂ H ₅ O) ₄ ) or aluminum alkoxide (Al (OC ₃ ), which is a metal alkoxide, is used as a raw material for a sol-gel solution when forming a porous ceramic film or a porous glass film. H ₇ ) ₃ ), methoxyboron (B (OCH ₃ ) ₃ ), sodium alkoxide (NaOCH ₃ ), etc. can be used alone or in combination, and these sol-gel solutions contain boric acid. It is also preferable to add an inorganic compound such as sodium carbonate that can lower the glass softening point. Furthermore, inorganic particles such as mullite and aluminum nitride may be dispersed and mixed in the sol-gel solution to promote porosity, thereby promoting the formation of a favorable uneven shape.

  These sol-gel solutions are uniformly applied to the surface of the glass substrate 5 by spin coating, spraying, dipping, or the like. Then, the inner peripheral wall of the through hole forming hole 3 is applied by passing a sol-gel solution through the through hole forming hole 3. Therefore, it is possible to use a dipping method or a spray method in which the glass substrate 5 after the through-hole forming hole 3 is provided is immersed in a sol-gel solution, so that a good coating state on the inner peripheral wall of the through-hole forming hole 3 is obtained. From the viewpoint of obtaining. Thereafter, the applied sol-gel solution is dried and baked to form a porous ceramic film or a porous glass film on the surface of the glass substrate 5 and the inner peripheral wall of the through-hole forming hole 3, and with a modified layer A glass substrate is used.

  The specific manufacturing method of the glass substrate with a modified layer described above is illustrated below. As the glass substrate 5, borosilicate glass (Tempax float, width 50 mm × length 50 mm × thickness 0.7 mm) having an average surface roughness (Ra) of 2.6 nm measured by an atomic force microscope was used. And metal complex prepared by the composition of titanium tetraisopropoxide 0.141 mol, copper acetate 0.107 mol, 1-hydroxycyclohexyl phenyl ketone 0.490 mol, methoxyacetic acid 0.222 mol, dimethylacetamide 200 ml, ethyl lactate 600 ml The solution is applied onto the glass substrate by a spin coater, dried at 120 ° C. for 10 minutes, fired in an air atmosphere at 350 ° C., and a porous ceramic film (O 2 O) having a thickness of 25 nm as a modified layer. : 64.2 at%, Ti: 19.5 at%, Cu: 9.7 at%, C: 6.6 at%) can be obtained. When the surface of the modified layer is measured with an atomic force microscope, the average surface roughness (Ra) is 3.0 nm, and the average surface roughness (Ra) is increased by about 10% from the glass substrate surface. It has been confirmed that.

  Next, as shown in FIG. 3C, a conductive metal layer 6 for forming a circuit or the like is provided on the surface of the glass substrate with a modified layer and the inner peripheral wall of the through-hole forming hole 3. The conductive metal layer 6 is made of copper, copper alloy, nickel, nickel alloy or the like. An electroless plating method is used to form the conductive metal layer 6. This is because formation of a plating layer on the inner wall of the through-hole forming hole is required, and it is preferable to employ an electroless plating method from the viewpoint of cost. The conductive metal layer 6 made of copper, copper alloy, nickel, nickel alloy or the like formed by using an electroless plating method is generally an electroless plating film having a thickness of 0.1 μm to 2.0 μm. When a thicker plating film than the electroless plating film is required, a conductive metal layer for forming a circuit by plating up to a required thickness by an electrolytic plating method (in the drawing, Regardless of the presence or absence of plating up, it is shown as the conductive metal layer 6) and through holes 4 are preferable from the viewpoint of securing good productivity.

Here, the specific manufacturing method of the glass substrate with a conductive metal layer will be exemplified. The above-mentioned glass substrate with a modified layer is subjected to reduction treatment for 2 minutes in an aqueous solution of sodium borohydride at pH = 10.5 and 2 g / L, CuSO ₄ .5H ₂ O is 3.75 g / L, EDTA4Na · 4H ₂ O is 14.0 g / L, formaldehyde solution 8 ml / L, 2,2'-bipyridyl is 10 mg / L, polyethylene glycol-1000 is 50mg / L, pH = 12.0, electroless the solution temperature 60 ° C. It was immersed in a copper plating solution for 10 minutes to form an electroless copper plating film having a thickness of 150 nm on the surface of the modified layer. When the electroless copper plating is completed, drying is performed, CuSO ₄ .5H ₂ O is 75 g / L, H ₂ SO ₄ is 150 g / L, Cl ions are 40 mg / L, and additives (CUBRITE 21 manufactured by JCU Corporation). Electrolytic copper plating using the electrolytic copper plating solution, and plating up to a thickness of 20 μm can provide a glass substrate with a conductive metal layer.

  Next, after forming the glass substrate with a conductive metal layer shown in FIG. 3C, an etching resist is provided on the conductive metal layer 6 on the surface of the glass substrate with the conductive metal layer according to a conventional method, and an etching pattern is obtained. Is exposed, developed, and etched to obtain a glass substrate 11 with a circuit having a circuit 7 and a through hole 4 as shown in FIG. More specifically, by providing a liquid resist, a dry film, etc. as an etching resist on the surface of the conductive metal layer of the glass substrate with a conductive metal layer, exposing a desired etching pattern, developing, and performing an etching process. A glass substrate with a circuit can be obtained. In addition, it was 0.2 kN / m when the 10-mm-wide linear circuit for measuring peeling strength was formed and peeling strength was measured. For the measurement of the peel strength, a condition of a tensile speed of 50 mm / min was adopted using a strograph E2-L05 manufactured by Toyo Seiki Seisakusho.

  Furthermore, it is also preferable that the glass substrate with circuit 11 is subjected to a post-baking process. As conditions for this after-baking treatment, it is preferable to employ 300 ° C. to 400 ° C. × 10 minutes to 60 minutes. If the heating condition is not satisfied, the adhesion between the circuit 7 of the glass substrate with circuit 10 and the glass substrate 5 cannot be improved. On the other hand, exceeding this heating condition is not preferable because the glass substrate 5, the porous ceramic film or the porous glass film is deteriorated and the adhesion of the circuit 7 to the glass substrate 5 tends to be lowered. The glass substrate with circuit 11 having the above-described peeling strength of 0.2 kN / m was heated to 350 ° C. for 60 minutes, and when the peeling strength was measured again, it improved to 0.4 kN / m. Therefore, it can be judged that it is preferable to provide an appropriate after-baking step after forming the circuit for the glass substrate with circuit.

<Lamination process>
In this step, as shown in FIG. 4, a glass substrate 11 with a circuit is disposed opposite to both surfaces of an insulating layer 10 with a buried through hole, and laminated, thereby providing a circuit with a glass substrate with a circuit on both surfaces of the insulating layer. A glass substrate-containing multilayer wiring board 1 is obtained. The lamination conditions at this time are determined according to the type of the constituent resin material of the insulating layer 2 of the embedded insulating layer with through-hole 10. In the stage before lamination, the insulating layer 2 contains a semi-cured resin. For example, when a thermosetting epoxy resin is included, press molding is performed under conditions of about 170 ° C. to 180 ° C. × 60 minutes. At this time, the semi-cured resin of the insulating layer 2 is reflowed, and the embedded through-hole insulating layer 10 and the circuit-attached glass substrate 11 are bonded together. There is a porous ceramic film or a porous glass film as a modified layer on the exposed surface of the glass substrate 11 with a circuit where the constituent resin of the reflowed insulating layer 2 is not provided with the circuit 7. Since this modified layer has a concavo-convex shape, the resin component reflowed by the concavo-convex shape exhibits an anchor effect, and the bonding reliability between the layers is improved. The exposed surface at this time is preferably a rough surface state having an average roughness Ra of 1 nm or more, more preferably 10 nm or more, and excellent wettability with a water contact angle of 0 ° <θ <90 °. Moreover, when it is necessary to obtain a further high multilayer board, it is also possible to laminate | stack as illustrated in FIG. That is, the glass substrate-containing multilayer wiring board 1 according to the present application has at least one layer configuration of “glass substrate with circuit 11 / insulating layer with embedded through hole 10 / glass substrate with circuit 11” in the layer configuration. Can be described as including.

B. Use aspect of glass substrate-containing multilayer wiring board with circuit The glass substrate-containing multilayer wiring board 1 with circuit obtained as described above is not particularly limited with respect to its usage, but is useful in making a substrate with a touch panel circuit. Can be used. Normally, touch panel circuits include an X-direction circuit and a Y-direction circuit that intersect each other, and it is necessary to provide a jumper line so that the mutual circuits do not come into contact with each other during a touch operation. However, if the glass substrate-containing multilayer wiring board 1 with a circuit according to the present application is provided, the touch panel circuit that does not require jumper wires can be designed. That is, by using the glass substrate-containing multilayer wiring board 1 with a circuit according to the present application, it is possible to eliminate the jumper wire from a circuit that requires a jumper wire as well as a touch panel circuit.

  The glass substrate-containing multilayer wiring board with circuit according to the present application has a simplified layer configuration of “glass substrate with circuit / insulating layer with embedded through hole / glass substrate with circuit”. In this way, while satisfying the quality required for the glass substrate, it is possible to adopt the existing laminating apparatus and laminating conditions by partially using the insulating layer constituent material used for a normal laminated plate. It is possible to use existing laminated board manufacturing equipment, and there is no loss of social capital and no increase in production costs. Moreover, the glass substrate-containing multilayer wiring board with circuit according to the present application can provide a high-performance product satisfying the product quality required for the glass substrate at a low price on the market.

DESCRIPTION OF SYMBOLS 1 Glass substrate containing circuit board containing multilayer wiring board 2 Insulating layer 3 Through-hole formation hole 4 Through-hole hole 4 'Embedded through-hole 5 Glass substrate 6 Conductive metal layer 7 Circuit 8 Conductive material embedded part 10 Embedded through-hole insulating layer 11 Glass substrate with circuit

Claims (8)

A glass substrate-containing multilayer wiring board with a circuit comprising a glass substrate with a circuit on both sides of an insulating layer with a buried through hole,
The insulating layer with a buried through hole includes a buried through hole filled with a conductive material for electrically connecting the circuits of two glass substrates with a circuit arranged via the insulating layer with a buried through hole,
The glass substrate with a circuit is provided with a predetermined circuit on the surface of the glass substrate, and has a through hole for connecting with a buried through hole provided in the insulating layer with the buried through hole. Board-containing multilayer wiring board.   The glass substrate-containing multilayer wiring board according to claim 1, wherein the glass substrate with circuit includes a predetermined circuit on both surfaces of the glass substrate. 3. The glass with circuit according to claim 1, wherein the insulating layer with an embedded through-hole is one using a thermosetting resin or a thermoplastic resin having an insulation resistance of 1 × 10 ⁶ Ω or more. Board-containing multilayer wiring board.   The glass substrate-containing multilayer wiring board with circuit according to claim 3 or 4, wherein the insulating layer with a buried through hole includes a skeleton material. The conductive material disposed in the buried through hole of the insulating layer with the buried through hole is a conductive paste such as a copper paste / silver paste showing an insulation resistance of 1 × 10 ² Ω or less, a conductive resin containing a conductive filler, The glass substrate-containing multilayer wiring board with circuit according to any one of claims 1 to 5, wherein any one of solder materials is used. It is a manufacturing method of the glass substrate containing multilayer wiring board with a circuit of any one of Claims 1-5, Comprising: The manufacturing of the glass substrate containing multilayer wiring board with a circuit characterized by including the following processes. Method.
Manufacturing process of insulating layer with embedded through hole: The through hole forming hole is formed by providing a predetermined through hole forming hole for electrically connecting the glass insulating layer circuits to the insulating layer constituting material. The hole is filled with a conductive material to form a buried through hole, and an insulating layer with a buried through hole is obtained.
Manufacturing process of glass substrate with circuit: A plate-like glass substrate is prepared, and a perforating process for providing a through hole forming hole on the glass substrate is performed, and then both surfaces of the glass substrate and an inner peripheral wall of the through hole forming hole. A conductive metal layer is provided on the glass substrate, and a glass substrate with a conductive metal layer having a through-hole hole is formed. And the glass substrate with a circuit is obtained by carrying out the etching process of the conductive metal layer in the surface of the said glass substrate with a conductive metal layer, and forming a circuit.
Lamination process: A glass substrate with a circuit on one side and the other side of the insulating layer with an embedded through hole so that the embedded through hole of the insulating layer with the embedded through hole faces the through hole of the glass substrate with the circuit. Are arranged and processed to obtain a glass substrate-containing multilayer wiring board with a circuit comprising a glass substrate with a circuit on both surfaces of an insulating layer with an embedded through hole. The glass substrate-containing multilayer wiring board with circuit according to claim 6, wherein in the manufacturing process of the glass substrate with circuit, the drilling process for providing a through-hole forming hole in the glass substrate is performed using an ultrashort pulse laser. Manufacturing method.   A glass substrate-containing multilayer wiring board with a circuit according to any one of claims 1 to 5, wherein the glass substrate with a circuit for a touch panel is obtained using a glass substrate with a circuit provided with a circuit for a touch panel. Multilayer wiring board.

Images