JP2019034347A - Processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing apparatus capable of appropriately determining the degree of adhesion of processing chips to a wall surrounding a processing chamber. SOLUTION: A chuck table for holding a plate-shaped workpiece, a machining unit including a spindle on which a machining tool for grinding or polishing the workpiece held on the chuck table is mounted on a tip portion, and a chuck table. A dirt status display including a processing chamber that houses the tip of the spindle and is surrounded by a wall, and a dirt status display unit that indicates the degree of adhesion of work chips generated by grinding or polishing of the workpiece to the wall. The unit is a member that transmits visible light, and is provided on top of or adjacent to the transmission window and the transmission window that forms part of the wall, and the amount and transmission of work debris adhering to the transmission window. It has a color sample display unit that shows the relationship with the color of the window. [Selection diagram] Fig. 1

Description

  The present invention relates to a processing apparatus for processing a plate-shaped workpiece.

  In order to reduce the size and weight of device chips incorporated in electronic devices and the like, there are increasing opportunities to thinly process wafers, package substrates, and the like before being divided into device chips. For this processing, for example, a processing apparatus including a spindle (rotating shaft) on which a processing tool such as a grinding wheel or a polishing pad is mounted is used. The workpiece can be thinned by bringing the machining tool rotated by the spindle into contact with the workpiece such as a wafer or a package substrate.

  By the way, when a workpiece is processed by the above-described processing apparatus, a large amount of processing waste (dust) is generated and scattered around. Therefore, a method has been proposed in which a cover that covers the tip of the spindle on which the processing tool is mounted is provided in the processing apparatus, and the workpiece is processed in a processing chamber surrounded by the cover (for example, see Patent Document 1). According to this method, the generated processing waste does not scatter to the outside of the cover.

JP 2004-1118 A

  As described above, when the processing apparatus is provided with a cover that covers the tip of the spindle, the processing waste adheres to the inner wall of the cover and gradually accumulates. When the processing waste accumulated on the inner wall of the cover falls for some reason and enters the gap between the processing tool and the workpiece, the workpiece is severely damaged. Therefore, it was necessary to clean the inner wall of the cover at an appropriate timing.

  However, since the timing of this cleaning is determined based on, for example, the experience of the operator, the frequency of cleaning may become higher than necessary, and the operating rate of the processing apparatus may decrease. On the other hand, if the timing of cleaning is delayed, the machining waste falls from the inner wall of the cover and enters the gap between the machining tool and the workpiece, and the workpiece is severely damaged.

  The present invention has been made in view of such a problem, and an object of the present invention is to perform processing capable of appropriately determining the degree of processing dust adhering to a wall surrounding a processing chamber in which a tip portion of a spindle is accommodated. Is to provide a device.

  According to one aspect of the present invention, a chuck table for holding a plate-like workpiece and a spindle on which a processing tool for grinding or polishing the workpiece held on the chuck table is mounted at a tip end portion are included. A processing chamber containing the processing unit, the chuck table, and the tip of the spindle and surrounded by a wall, and the degree of adhesion of processing waste generated by grinding or polishing of the workpiece to the wall A contamination status display unit, the contamination status display unit being a member that transmits visible light, and a transmission window that forms a part of the wall, and overlaps or is adjacent to the transmission window. There is provided a processing apparatus having a color sample display section that is provided and indicates a relationship between the amount of the processing waste adhering to the transmission window and the color of the transmission window.

  A processing apparatus according to an aspect of the present invention includes a transmission window formed of a member that transmits visible light, and a color sample display unit that indicates a relationship between the amount of processing dust attached to the transmission window and the color of the transmission window. Since the dirt state display unit is provided, the degree of adhesion of the processing waste to the wall surrounding the processing chamber can be appropriately determined by visually comparing the transmission window and the color sample display section.

It is a perspective view which shows the structural example of a grinding | polishing apparatus typically. It is a top view which shows typically the structural example of a dirt condition display unit.

  Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a configuration example of a polishing apparatus (processing apparatus) 2 according to the present embodiment. As shown in FIG. 1, the polishing apparatus 2 includes a base 4 that supports each component. A wall-like support structure 6 is provided at the rear end of the base 4.

  An opening 4 a is formed on the front side of the upper surface of the base 4, and a transport unit 8 that transports the plate-shaped workpiece 11 is disposed in the opening 4 a. The workpiece 11 is a disk-shaped wafer made of a material such as silicon (Si), for example. However, the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate made of a material such as another semiconductor, ceramics, resin, or metal can be used as the workpiece 11.

  Cassettes 10a and 10b for accommodating the workpiece 11 are placed in a region on the side of the opening 4a. A centering mechanism 12 is provided behind the area where the cassette 10a is placed. The centering mechanism 12 adjusts the center position of the workpiece 11 conveyed by the conveyance unit 8 from the cassette 10a, for example.

  Behind the centering mechanism 12, a carry-in unit 14 that holds and turns the workpiece 11 is provided. An opening 4 b is formed behind the carry-in unit 14. In this opening 4b, an X-axis moving table 16, an X-axis moving unit (not shown) for moving the X-axis moving table 16 in the X-axis direction (front-rear direction), and a dustproof and drip-proof cover 18 that covers the X-axis moving unit. Is arranged.

  The X-axis movement unit includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table 16 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 16, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 16 moves in the X-axis direction along the X-axis guide rail. A chuck table 20 for sucking and holding the workpiece 11 is provided on the upper surface of the X-axis moving table 16.

  The chuck table 20 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). Further, the chuck table 20 is moved between a front loading / unloading area where the workpiece 11 is loaded and unloaded and a rear polishing area where the workpiece 11 is polished by the X-axis moving unit. .

  The upper surface of the chuck table 20 is a holding surface that sucks and holds the workpiece 11. The holding surface is connected to a suction source (not shown) via a flow path (not shown) formed inside the chuck table 20. The workpiece 11 carried into the chuck table 20 by the carry-in unit 14 is sucked and held by the negative pressure of the suction source acting on the holding surface.

  A Z-axis moving unit 22 is provided on the front surface of the support structure 6. The Z-axis moving unit 22 includes a pair of Z-axis guide rails 24 parallel to the Z-axis direction, and a Z-axis moving plate 26 is slidably attached to the Z-axis guide rails 24. A nut portion (not shown) is provided on the rear surface side (back surface side) of the Z-axis moving plate 26, and a Z-axis ball screw 28 parallel to the Z-axis guide rail 24 is screwed into the nut portion. Yes.

  A Z-axis pulse motor 30 is connected to one end of the Z-axis ball screw 28. By rotating the Z-axis ball screw 28 by the Z-axis pulse motor 30, the Z-axis moving plate 26 moves in the Z-axis direction along the Z-axis guide rail 24.

  A polishing unit (processing unit) 32 for polishing the workpiece 11 is provided on the front surface (front surface) of the Z-axis moving plate 26. The polishing unit 32 includes a cylindrical spindle housing 34 fixed to the Z-axis moving plate 26. A spindle 36 serving as a rotation shaft is accommodated in the spindle housing 34.

  A disc-shaped mount 38 is fixed to the tip (lower end) of the spindle 36 exposed from the spindle housing 34, and a polishing pad (processing tool) having the same diameter as that of the mount 38 is fixed to the lower surface of the mount 38. 40 is installed. In the present embodiment, the polishing pad 40 for dry polishing that does not use a polishing liquid such as slurry is used, but a polishing pad 40 for wet polishing may be used.

  A rotation driving source (not shown) such as a motor is connected to the base end side (upper end side) of the spindle 36, and the polishing pad 40 is rotated by a force transmitted from the rotation driving source. Further, by lowering the polishing unit 32 by the Z-axis moving unit 22 described above, the polishing pad 40 is pressed against the upper surface (surface to be polished) of the workpiece 11 held on the chuck table 20.

  At a position adjacent to the carry-in unit 14, a carry-out unit 42 that holds and turns the workpiece 11 is provided. A cleaning unit 44 for cleaning the workpiece 11 after being polished is disposed in front of the carry-out unit 42 and behind the region where the cassette 10b is placed.

  The workpiece 11 cleaned by the cleaning unit 44 is transported by the transport unit 8 and is accommodated in, for example, the cassette 10b. An operation panel 46 for inputting polishing conditions and the like is installed in front of the opening 4a.

  When the workpiece 11 is polished by the polishing apparatus 2, the chuck table 20 and the polishing pad 40 are rotated with each other while the workpiece 11 is sucked and held by the chuck table 20. The polishing pad 40 is pressed against the upper surface of the object 11. Thereby, the workpiece 11 can be polished. In this embodiment, a polishing liquid such as a slurry is not used, but a polishing liquid may be used.

  As described above, when the workpiece 11 is polished with the polishing pad 40, dust is likely to be scattered around the chuck table 20 and the polishing pad 40. For this reason, the polishing apparatus 2 of the present embodiment is provided with a cover 52 that covers the chuck table 20 and the tip of the spindle 36 (polishing pad 40).

  The cover 52 forms a processing chamber (polishing chamber) for polishing the workpiece 11. That is, the processing chamber is surrounded by a wall 52 a that constitutes the cover 52. Further, the processing chamber accommodates the tip end portions of the chuck table 20 and the spindle 36. There are no particular restrictions on the material, shape, etc. of the cover 52. For example, the cover 52 can be formed using a metal such as stainless steel or aluminum.

  A part of the wall 52a of the cover 52 is provided with an exhaust port (not shown) penetrating the cover 52 in and out. One end of an exhaust duct 54 disposed outside the cover 52 is connected to the exhaust port. A suction source 56 is connected to the other end of the exhaust duct 54. That is, the suction source 56 is connected to the exhaust port via the exhaust duct 54.

  The suction source 56 has a control switch 58 that controls generation of suction force. By operating the control switch 58, the suction force of the suction source 56 can be applied to the exhaust port. When the workpiece 11 is polished, the suction force of the suction source 56 is applied to the exhaust port, and the air containing the processing waste (dust) in the processing chamber is discharged to the outside of the cover 52.

  In the polishing apparatus 2 configured in this way, the processing waste generated during polishing remains in the processing chamber and does not scatter outside the cover 52. On the other hand, processing waste adheres and gradually accumulates on the inner surface of the wall 52a constituting the cover 52. If the processing waste accumulated on the wall 52a of the cover 52 falls for some reason and enters the gap between the polishing pad 40 and the workpiece 11, the workpiece 11 will be severely damaged.

  Therefore, in the polishing apparatus 2 of the present embodiment, a dirt state display unit 60 that indicates the degree of adhesion of the processing waste to the wall 52a is provided on a part of the wall 52a that constitutes the cover 52. FIG. 2 is a plan view schematically showing a configuration example of the dirt state display unit 60. As shown in FIG. 2, the dirt state display unit 60 has a transmission window 62 made of a member such as a glass plate that transmits visible light.

  The transmission window 62 is fitted into an opening that penetrates the cover 52 inward and outward, and constitutes a part of the wall 52a. In other words, in a situation where the machining waste adheres and accumulates on the inner surface of the wall 52a, the machining waste adheres and accumulates on the inner surface of the transmission window 62 as well. When processing waste adheres and accumulates on the inner surface of the transmission window 62, the transmittance of the transmission window 62 decreases. Therefore, by checking the state of the transmission window 62, it is possible to determine how much the processing waste is attached to and deposited on the wall 52a.

  At a position overlapping the transmission window 62 or a position adjacent to the transmission window 62, a color sample display section 64 showing the relationship between the amount of processing dust attached and deposited on the transmission window 62 and the color (transmittance) of the transmission window 62. Is provided. Further, next to the color sample display section 64, a comment 66 is attached according to the amount of processing dust attached and deposited on the transmission window 62. However, this comment 66 may be omitted.

  The color sample display section 64 includes a first display section 64a indicating a color corresponding to the color of the transmission window 62 in a state where the processing waste is not attached and accumulated, and the transmission window 62 in a state where the processing waste is slightly attached and accumulated. And a second display portion 64b showing a color corresponding to the color of the. Further, the third display portion 64c showing a color corresponding to the color of the transmission window 62 in a state in which a large amount of processing waste has adhered and accumulated, and the color of the transmission window 62 in a state in which a large amount of processing waste has adhered and accumulated. 4th display part 64d which shows a corresponding color is included.

  A comment 66 is attached next to each of the first display unit 64a, the second display unit 64b, the third display unit 64c, and the fourth display unit 64d. For example, a comment 66 of “OK” indicating that it is not necessary to clean yet is attached next to the first display portion 64a. Next to the second display portion 64b, there is a comment 66 "cleaning time" indicating that it is desirable to clean.

  Further, a comment 66 "Let's clean as soon as possible" indicating that cleaning is necessary is attached next to the third display portion 64c. Next to the fourth display portion 64d, there is a comment 66 "Let's clean immediately" indicating that there is a high possibility that a problem will occur due to the processing waste adhering to and accumulating on the wall 52a.

  Next, a method for confirming the degree of adhesion of the processing waste to the wall 52a using the dirt state display unit 60 will be described. First, the operator visually compares the transmission window 62 and the color sample display section 64 at an arbitrary timing, and the color of the transmission window 62 is changed to the first display section 64a, the second display section 64b, the third display section 64c, And which color of the fourth display portion 64d is close to.

  Thereby, the degree of adhesion of the processing waste to the wall 52a becomes clear. For example, when the color of the transmission window 62 is close to the color of the first display portion 64a, it can be understood that the processing waste hardly adheres to and accumulates on the wall 52a. In addition, for example, when the color of the transmission window 62 is close to the color of the second display portion 64b, it can be understood that a small amount of processing waste adheres and accumulates on the wall 52a.

  Further, when the color of the transmission window 62 is close to the color of the third display portion 64c or the fourth display portion 64d, it can be seen that a large amount of processing waste adheres and accumulates on the wall 52a. The operator can determine the timing for cleaning the cover 52 in consideration of the comment 66 or the like attached next to the color sample display section 64.

  As described above, the polishing apparatus (processing apparatus) 2 of the present embodiment has the transmission window 62 made of a member that transmits visible light, the relationship between the amount of processing dust attached to the transmission window 62 and the color of the transmission window 62. Since the stain state display unit 60 having the color sample display unit 64 indicating the processing sample is provided, the processing window adheres to the wall 52a surrounding the processing chamber by visually comparing the transmission window 62 and the color sample display unit 64. Can be determined appropriately.

  In addition, this invention is not restrict | limited to description of the said embodiment etc., A various change can be implemented. For example, in the above embodiment, the polishing apparatus 2 that polishes the plate-like workpiece 11 is described. However, the processing apparatus of the present invention may be a grinding apparatus that grinds the plate-like workpiece 11. In the grinding apparatus, for example, a grinding wheel (processing tool) including a grinding wheel for grinding is mounted on a disc-shaped mount fixed to the tip of the spindle.

  In the above embodiment, the color sample display unit 64 is configured by the first display unit 64a, the second display unit 64b, the third display unit 64c, and the fourth display unit 64d that show four different states. The color sample display unit of the present invention may be constituted by two, three, or five or more types of display units that indicate different states.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 Polishing equipment (processing equipment)
4 Base 4a, 4b Opening 6 Support structure 8 Transport unit 10a, 10b Cassette 12 Centering mechanism 14 Loading unit 16 X-axis moving table 18 Dust-proof drip-proof cover 20 Chuck table 22 Z-axis moving unit 24 Z-axis guide rail 26 Z-axis moving Plate 28 Z-axis ball screw 30 Z-axis pulse motor 32 Polishing unit (processing unit)
34 Spindle housing 36 Spindle 38 Mount 40 Polishing pad (processing tool)
42 Unloading unit 44 Cleaning unit 46 Operation panel 52 Cover 52a Wall 54 Exhaust duct 56 Suction source 58 Control switch 60 Dirt status display unit 62 Transmission window 64 Color sample display unit 64a First display unit 64b Second display unit 64c Third display unit 64d Fourth display section 66 Comment 11 Work piece

Claims (1)

A chuck table for holding a plate-shaped workpiece;
A processing unit including a spindle on which a processing tool for grinding or polishing the workpiece held on the chuck table is mounted at a tip portion;
A processing chamber that encloses the chuck table and the tip of the spindle and is surrounded by a wall;
A dirt status display unit that indicates the degree of adhesion of the processing waste generated by grinding or polishing of the workpiece to the wall;
The dirt status display unit
A transparent window made of a member that transmits visible light and constituting a part of the wall;
A color sample display unit that is provided on or adjacent to the transmission window and that indicates the relationship between the amount of the processing waste adhering to the transmission window and the color of the transmission window. A processing device characterized.