JP2019015676A - Testing socket for electric conduction and method for testing electric conduction - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an energization test socket and an energization test method which can be easily attached and detached before and after the test and can be applied to an energization test in which a large current flows. SOLUTION: A recess 2 into which a terminal of an element is inserted is formed on an upper surface of an outer frame 1 made of resin. The metal receiving portion 3 is formed inside the recess 2, and at least a part thereof is exposed to the outside of the outer frame 1. The solder 5 is put into the recess 2. The reed 4 is electrically connected to the solder 5 inside the recess 2 and extends to the outside of the outer frame 1. [Selection diagram] Fig. 6

Description

  The present invention relates to an energization test socket and an energization test method that can be applied to an energization test in which a large current flows in the reliability evaluation of a power semiconductor element.

  The socket for energization test has an outer frame having a concave portion and a metal receiving portion formed inside the concave portion. The semiconductor element is energized by inserting the terminal of the semiconductor element into the recess of the energization test socket and bringing it into contact with the receiving portion. At that time, a general socket has a point contact between a terminal and a receiving part, but there is a type in which a low melting point metal is provided inside a recess to make a surface contact (for example, refer to Patent Document 1). The energization test is performed on a plurality of semiconductor elements, for example, five or more simultaneously for one test item. The energization test can be performed only by attaching and removing the socket and the element terminal by preparing a board / jig on which the socket is mounted in advance.

Japanese Utility Model Publication No. 60-126990

  However, since a general socket conducts only by point contact between solid metals, contact resistance cannot be ignored. For this reason, when a large current of about 5 A is passed, the temperature of the entire socket rises and the outer frame made of resin is burned out. Therefore, since a point contact type socket cannot be used when a large current flows, it is necessary to connect the element terminals by direct soldering or the like. Therefore, it takes a lot of time to attach / remove before and after the test, and there is a problem in that the contact condition varies or the wire breaks due to manual work. Therefore, it is conceivable to use a socket (electrical interconnect device) that enables surface contact shown in FIG. 1 or FIG. However, in an energization test in reliability evaluation, it is necessary to repeatedly replace a plurality of devices under test. For this reason, the socket of Patent Document 1 that uses a built-in heater when inserting and removing terminals has a problem that it is not suitable for efficient work depending on the number of terminals or the number of elements to be tested.

  The present invention has been made to solve the above-described problems. The purpose of the present invention is to facilitate mounting and dismounting before and after the test, and an energization test socket and energization test method that can be applied to an energization test in which a large current flows. Is what you get.

  The socket for energization test according to the present invention is formed on the inner surface of the outer frame made of a resin having a concave portion into which the terminal of the element is inserted on the upper surface, and at least part of the outer frame is exposed to the outside of the outer frame. It is characterized by comprising: a metal receiving portion; a solder that is put into the concave portion; and a lead that is electrically connected to the solder inside the concave portion and extends to the outside of the outer frame.

  In the present invention, at least a part of the receiving portion is exposed outside the outer frame. For this reason, the heat of the external heating means can be efficiently transferred to the solder. This simplifies repeated use.

It is sectional drawing which shows the socket for an electricity test which concerns on embodiment of this invention. It is a three-plane figure which shows the socket for an electricity test which concerns on embodiment of this invention. It is a three-plane figure which shows the receiving part and lead which concern on embodiment of this invention. It is sectional drawing which shows the electricity test method which concerns on embodiment of this invention. It is sectional drawing which shows the electricity test method which concerns on embodiment of this invention. It is sectional drawing which shows the electricity test method which concerns on embodiment of this invention. It is sectional drawing which shows the modification of the electricity test method which concerns on embodiment of this invention.

  FIG. 1 is a cross-sectional view showing an energization test socket according to an embodiment of the present invention. FIG. 2 is a three-sided view showing an energization test socket according to an embodiment of the present invention. On the upper surface of the outer frame 1 made of resin, a recess 2 is formed in which solder is poured and a terminal of a semiconductor element is inserted. The resin of the outer frame 1 has a heat resistance specification of 250 ° C. in order to accept molten solder. Note that the heat resistance specification at 250 ° C. cannot withstand heat generation due to contact resistance, which is a problem in the prior art.

  A receiving portion 3 made of a conductive metal is formed inside the recess 2. At least a part of the receiving portion 3 extends to the upper surface of the outer frame 1 and is exposed to the outside of the outer frame 1. A plate-like lead 4 made of a conductive metal extends from the bottom surface of the recess 2 to the outside of the outer frame 1 through the lower surface of the outer frame 1.

  FIG. 3 is a three-side view showing the receiving part and the lead according to the embodiment of the present invention. The receiving part 3 is welded to the lead 4. Note that the lead 4 and the receiving portion 3 may be integrally formed. Thereby, manufacture of a socket becomes easy.

  4 to 6 are cross-sectional views showing an energization test method according to the embodiment of the present invention. First, as shown in FIG. 4, solid solder 5 is poured into the recess 2. Next, as shown in FIG. 5, the outer frame 1 is heated with a dryer to heat the solder 5 to a melting point or higher and melt it. The lead 4 is electrically connected to the solder 5 inside the recess 2.

  Next, as shown in FIG. 6, the terminal 6 of the semiconductor element is inserted into the recess 2, and the molten solder 5 is naturally cooled and solidified. As a result, the terminal 6 of the semiconductor element can be attached to the current test socket and electrically connected to the outside via the solder 5 and the lead 4. In this state, an electric current test is performed by passing a current through the semiconductor element through the solder 5 and the lead 4. After the energization test, the outer frame 1 is heated by an external heating means such as a dryer to melt the solder 5, and the terminal 6 of the semiconductor element is removed from the energization test socket.

  As described above, in the present embodiment, the terminal 6 of the semiconductor element can be fixed to the socket simply by inserting the terminal 6 of the semiconductor element into the recess 2 and cooling and melting the solder 5. Further, the terminal 6 of the semiconductor element can be removed simply by melting the solder 5 by heating. Therefore, the direct connection work to the terminal of the semiconductor element as in the conventional energization test method in the case of flowing a large current is unnecessary, and attachment / removal before and after the test is easy. Moreover, since the solder 5 covers the terminal 6 of the semiconductor element and makes surface contact instead of the point contact between the solid metals as in the conventional socket, the contact resistance is reduced. As a result, it is possible to prevent the socket from being burned out due to a temperature rise, and thus it can be applied to an energization test in which a large current flows.

  Further, by providing the receiving portion 3, leakage of the molten solder 5 can be prevented. Since at least a part of the receiving portion 3 is exposed to the outside of the outer frame 1, the heat of the external heating means can be efficiently transmitted to the solder 5. This simplifies repeated use. Note that the external heating means is not limited to the above-described dryer, and for example, the soldering iron may be directly brought into contact with the receiving portion 3 exposed to the outside of the outer frame 1 and heated.

  Since it is a test application, it is necessary to repeat the attachment / detachment of the terminal 6 of the semiconductor element to the socket for energization test many times. Each time a part of the solder 5 adheres to the terminal 6 of the semiconductor element, the solder 5 inside the recess 2 decreases. Therefore, it is necessary to replenish the solder 5 into the recess 2 at regular intervals. However, since the amount of decrease of the solder 5 varies, there is a possibility that the solder 5 overflows when the solder 6 is administered in a large amount and the terminal 6 of the semiconductor element is attached. Therefore, the upper surface of the outer frame 1 is projected between two adjacent recesses 2 to prevent the solder 5 from overflowing and shorting between adjacent terminals 6.

  FIG. 7 is a cross-sectional view showing a modification of the energization test method according to the embodiment of the present invention. By connecting the lead 4 of the socket to the current-carrying test apparatus or a wiring board 7 constituting a part of the jig by solder 8, the inside of the recess 2 and the current-carrying test apparatus are electrically connected. By connecting the socket in advance to the energization test apparatus or the wiring board 7 in this manner, the energization test can be performed simply and in a short time because only the semiconductor elements are attached and detached before and after the test. However, the melting point of the solder 8 is higher than the melting point of the solder 5 put into the recess 2 of the socket. For this reason, only the solder 5 thrown into the recessed part 2 can be melted at the time of the heating by an external heating means.

  In addition, the conductive metal thrown into the recess 2 is not limited to the solder 5, but may be any bonding material that melts at a certain high temperature and becomes solid at about 100 ° C. For example, indium can be substituted. Further, in the present embodiment, the case where there are two terminals of the semiconductor element and the number of the recesses 2 and the leads 4 is given as an example. However, by increasing the number of the recesses 2 and the leads 4, the number of terminals is 2. More than two semiconductor elements can be accommodated.

1 outer frame, 2 recess, 3 receiving part, 4 lead, 5 solder, 6 terminals, 7 circuit board for current test device, 8 solder

Claims (5)

An outer frame made of resin in which a recess into which the terminal of the element is inserted is formed on the upper surface;
A metal receiving portion formed on the inside of the recess and at least a portion of which is exposed to the outside of the outer frame;
Solder to be put into the recess,
An electrical test socket, comprising: a lead electrically connected to the solder inside the recess and extending to the outside of the outer frame. A plurality of the recesses and the leads are formed,
The socket for energization testing according to claim 1, wherein the upper surface of the outer frame protrudes between the adjacent recesses.   The socket for energization testing according to claim 1, wherein the lead and the receiving portion are integrally formed. An outer frame made of a resin having a recess formed on the upper surface, a metal receiving portion formed inside the recess and exposed at least partially outside the outer frame, and connected to the recess, the outer frame Preparing a current test socket comprising a lead extending outside
Charging the first bonding material into the recess, heating the outer frame with an external heating means, and melting the first bonding material;
Inserting the terminal of the element into the recess, cooling and solidifying the melted first bonding material, and attaching the terminal of the element to the current test socket;
Conducting an energization test by passing a current through the element through the first bonding material and the lead;
And a step of heating the outer frame with a drier after the energization test to melt the first bonding material and detaching the terminal of the element from the energization test socket. . A step of joining the lead of the electricity test socket to the electricity test device with a second joining material;
In the current test, a current is passed from the current test device to the element through the first bonding material and the lead,
The energization test method according to claim 4, wherein the melting point of the second bonding material is higher than the melting point of the first bonding material.

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